Antenna equipment

Abstract

[Problem] To achieve cost reduction and gain enhancement for antennas. [Solution] An antenna device of the present disclosure comprises: a substrate; a plurality of antenna elements that are disposed on a first surface of the substrate; a power-feeding circuit that is disposed on a second surface of the substrate that is the reverse side of the first surface; and a first conductor that is disposed to a position facing the power-feeding circuit. A void is formed between the power-feeding circuit and the first conductor.

Description

Technical Field

[0001] The present disclosure relates to an antenna device and a radio device. Background Art

[0002] In 5G base station devices, there is a demand for an increase in Equivalent Isotropically Radiated Power (EIRP) and a reduction in power consumption. To increase EIRP, it is necessary to increase the transmission power of a radio unit or improve the antenna gain. However, increasing the transmission power of the radio unit leads to an increase in the power consumption of the base station device. Therefore, to increase EIRP, it is desirable to improve the antenna gain. Prior Art Literature Patent Literature

[0003] Patent Literature 1 International Publication No. 2022 / 176285 Summary of Invention Problem to be Solved by Invention

[0004] In array antenna devices, which arrange a large number of antenna elements, it is important to reduce power loss in the feeding circuit in order to improve antenna gain for the same antenna area. The feeding circuit is a circuit that distributes the power supplied from the wireless circuit section to each element in an array antenna device. Patent Document 1 discloses an antenna structure equipped with a microstrip line. Generally, in a microstrip line, the feeding circuit is formed on the surface of the printed circuit board, and the ground layer is formed on the back surface of the printed circuit board. In this case, electromagnetic waves propagate through the printed circuit board, causing dielectric loss and reducing antenna gain. Therefore, in order to improve antenna gain in an antenna structure equipped with a microstrip line, it is conceivable to use a printed circuit board with low dielectric constant and low dielectric loss tangent, for example.

[0005] However, printed circuit boards with low dielectric constant and low dielectric loss tangent are generally expensive. Therefore, there is a need for a structure that can improve antenna gain at a lower cost.

[0006] The purpose of this disclosure is to provide an antenna device and a wireless device that enable improvement of antenna gain at low cost, in view of the above-mentioned problems. [Means for solving the problem]

[0007] An antenna device according to one aspect of the present invention comprises a substrate, a plurality of antenna elements arranged on a first surface of the substrate, a power supply circuit arranged on a second surface which is the back surface of the first surface of the substrate, and a first conductor arranged at a position opposite to the power supply circuit, wherein an air gap is formed between the power supply circuit and the first conductor.

[0008] An antenna device according to one aspect of the present invention comprises a substrate, a plurality of antenna elements arranged on a first surface of the substrate, a power supply circuit arranged on a second surface which is the back surface of the first surface of the substrate and distributes power to the plurality of antenna elements, and a conductor arranged opposite the power supply circuit and functions as the ground of the power supply circuit, wherein an air gap is formed between the power supply circuit and the conductor.

[0009] A wireless device according to one aspect of the present invention comprises an antenna device and a transceiver, each comprising a substrate, a plurality of antenna elements arranged on a first surface of the substrate, a power supply circuit arranged on a second surface which is the back surface of the first surface of the substrate, and a first conductor arranged opposite the power supply circuit, wherein an air gap is formed between the power supply circuit and the first conductor. [Effects of the Invention]

[0010] According to this disclosure, it is possible to provide an antenna device and a wireless device that enable improvement of antenna gain at low cost. [Brief explanation of the drawing]

[0011] [Figure 1] This is a diagram showing the configuration of the antenna device in the first embodiment. [Figure 2] This figure shows the configuration of the antenna device in the second embodiment. [Figure 3] This is a cross-sectional view of the antenna device in the second embodiment. [Figure 4] This figure shows an example of the dimensions of the antenna device in the second embodiment. [Figure 5] This figure shows an example of a wireless device having an antenna device according to the second embodiment. [Figure 6] This figure shows the configuration of the antenna device in a modified example 1 of the second embodiment. [Figure 7] This figure shows the configuration of the antenna device in a modified example 2 of the second embodiment. [Figure 8] This figure shows the configuration of the antenna device in the third embodiment. [Figure 9] It is a cross-sectional view of the antenna device according to the third embodiment. [Figure 10] It is a diagram showing arrangement example 1 of the supporting member according to the third embodiment. [Figure 11] It is a diagram showing arrangement example 2 of the supporting member according to the third embodiment. [Figure 12] It is a diagram showing an example of a radio device including the antenna device according to the third embodiment. MODE FOR CARRYING OUT THE INVENTION

[0012] Next, modes for carrying out the present invention will be described in detail with reference to the drawings. In each of the embodiments described in the drawings and the specification, components having similar functions are assigned the same reference numerals.

[0013] <First Embodiment> FIG. 1 is a diagram showing the configuration of the antenna device 1 according to the first embodiment of the present disclosure.

[0014] Referring to FIG. 1, the antenna device 1 according to the present embodiment includes a substrate 10, antenna elements 20, a feeding circuit 30, and a conductor 40.

[0015] The antenna device 1 is a device that performs transmission processing of radio frequency signals.

[0016] An electrical wiring pattern is provided on the substrate 10 of the antenna device 1, and a plurality of antenna elements 20 are arranged on a first surface that is one side of the substrate 10. The plurality of antenna elements 20 are provided along the X direction in FIG. 1 (the direction from the deep side to the near side of the drawing, or the opposite direction). The substrate 10 may also be referred to as a printed circuit board.

[0017] The antenna elements 20 of the antenna device 1 are arranged on the first surface that is one side of the substrate 10. The antenna elements 20 function as primary resonators for the transceiver of the antenna device 1 to transmit and receive signals.

[0018] The feed circuit 30 of the antenna device 1 is located on the second surface, which is the back surface of the first surface of the circuit board 10. The feed circuit 30 is a circuit that supplies power to multiple antenna elements 20.

[0019] The conductor 40 of the antenna device 1 is the first conductor and is positioned opposite the feed circuit 30. The conductor 40 functions as the ground for the feed circuit 30.

[0020] Furthermore, a gap 50 is formed between the power supply circuit 30 and the conductor 40. The gap 50 is, for example, an air layer.

[0021] As shown in Figure 1, in the antenna device 1 of this embodiment, electromagnetic waves propagate within the air gap 50 formed between the substrate 10 and the conductor 40. On the other hand, as described above, in a typical microstrip line, electromagnetic waves propagate within the printed circuit board. Here, the air present in the air gap has a lower dielectric constant compared to the printed circuit board. Therefore, the antenna device 1 of this embodiment can reduce dielectric loss during power supply compared to an antenna device with a typical microstrip line.

[0022] Furthermore, in the antenna device 1 of this embodiment, the following effects can be obtained as electromagnetic waves propagate within the air gap 50. That is, in the antenna device 1 of this embodiment, there is no need to use printed circuit boards with low dielectric constant and low dielectric loss tangent, which are generally considered to be expensive, and a highly versatile, low-cost board can be used.

[0023] As described above, the antenna device 1 in this embodiment makes it possible to improve antenna gain at a low cost.

[0024] <Second Embodiment> The antenna device 2 in the second embodiment of this disclosure will be described.

[0025] Figure 2 shows the configuration of the antenna device 2 in this embodiment.

[0026] Referring to Figure 2, the antenna device 2 in this embodiment is an array antenna device comprising a substrate 10, a plurality of antenna elements 21, a power supply circuit 30, a conductor 41, an antenna element power supply section 60, a radome 70, a radome connection section 80, an antenna element 22, and a bandpass filter 90.

[0027] Antenna device 2 is a device that processes the transmission of radio frequency signals.

[0028] The substrate 10 of the antenna device 2 is provided with an electrical wiring pattern, and a plurality of antenna elements 21 are arranged on the first surface, which is one side of the substrate 10. The plurality of antenna elements 21 are arranged along the X direction in Figure 2. The substrate 10 may also be called a printed circuit board. The substrate 10 may be, for example, a general-purpose glass epoxy substrate, but is not limited to this.

[0029] The antenna elements 21 of the antenna device 2 are arranged on the first surface, which is one side of the substrate 10. The first surface is the direction of radio wave radiation from the antenna elements 21 and may be referred to as the front surface or top surface. The second surface on the substrate 10, opposite to the first surface, may be referred to as the back surface or bottom surface. The antenna elements 21 function as primary resonators for the transceiver 100, which will be described later, to transmit and receive signals. Multiple antenna elements 21 are arranged on the first surface of the substrate 10 at predetermined separation distances. The antenna elements 21 may be, for example, patch antennas or dipole antennas, but are not limited to these.

[0030] The antenna device 2, through the dual resonance of antenna element 21 and antenna element 22 (described later), radiates radio waves from antenna element 22 in the Z direction in Figure 2 (the direction pointed to by the first surface of the substrate 10), enabling it to transmit and receive signals with communication devices in that direction.

[0031] The feed circuit 30 of the antenna device 2 is located on the second surface, which is the back surface of the first surface of the substrate 10. The feed circuit 30 is a circuit that supplies power to multiple antenna elements 21. The feed circuit 30 is arranged along the multiple antenna elements 21. The feed circuit 30 distributes power to the multiple antenna elements 21. The feed circuit 30 is electrically connected to the antenna element feed unit 60, which will be described later. The feed circuit 30 is connected to the connector 130, which will be described later. In Figure 2, the feed circuit 30 is connected to the connector 130 on the second surface side of the substrate 10, passes through the first surface side of the substrate 10, and is formed again on the second surface side of the substrate 10. However, the feed circuit 30 may be connected to the connector 130 on the second surface side of the substrate 10 and formed only on the second surface side without passing through the first surface side of the substrate 10. Specifically, the connector 130 may be a coaxial connector, but is not limited to this.

[0032] As shown in Figure 3, which will be described later, the conductor 41 of the antenna device 2 is the first conductor and is positioned opposite the feed circuit 30. The conductor 41 functions as the ground for the feed circuit 30. A portion of the conductor 41 is adjacent to the substrate 10. The material of the conductor 41 may be metal, for example, but is not limited to this. Also, the conductor 41 only needs to have a conductive surface, and may be formed in combination with an insulator. For example, the conductor 41 may be formed by covering the surface of an insulating material such as plastic or resin with a conductor such as metal plating.

[0033] Furthermore, a gap 51 is formed between the power supply circuit 30 and the conductor 41. The gap 51 is, for example, an air layer. The positional relationship between the power supply circuit 30, the conductor 41, and the gap 51 will be explained in detail using Figure 3.

[0034] Figure 3 is a cross-sectional view of the antenna device 2 of this embodiment. Specifically, Figure 3 is a cross-sectional view of the dotted line portion of (a) of the antenna device 2 of this embodiment shown in Figure 2.

[0035] The air gap 51 is formed along the power supply circuit 30. Electromagnetic waves generated from the power supply circuit 30 propagate within the air gap 51. The air gap 51 may be formed in a rectangular parallelepiped shape as shown in Figure 3, but is not limited to this. The air gap 51 is further formed to surround the substrate 10 and the conductor 41. The air gap 51 may be formed by cutting a portion of the rectangular parallelepiped conductor 41 and placing it adjacent to the substrate 10. Alternatively, the air gap 51 may be formed by placing a U-shaped cast conductor 41 adjacent to the substrate 10. However, the shape of the conductor 41 forming the air gap 51 and the method of creating that shape are not limited to the above.

[0036] The size of the air gap 51 may be determined by the characteristic impedance, but is not limited thereto. The size of the air gap 51 may be determined, for example, by the characteristic impedance of the connector 130. The characteristic impedance of the connector 130 may be 50Ω. Components that affect the characteristic impedance include the width of the power supply circuit 30 and the distance from the second surface of the substrate 10 to the surface of the conductor 41 facing the second surface of the substrate 10. In other words, components that affect the characteristic impedance include the Y-direction dimension of the power supply circuit 30 in Figure 3 and the Z-direction dimension of the air gap 51 in Figure 3. Furthermore, it is preferable to make the distance between the side surfaces of conductors 41 adjacent to the air gap 51 (the Y-direction dimension of the air gap 51), indicated by the bidirectional arrows in Figure 3, as long as possible. This is because if the distance between the side surfaces of conductors 41 adjacent to the air gap 51 is shorter than a predetermined value, it will affect the characteristic impedance.

[0037] Figure 4 shows an example of dimensions in a cross-section of the antenna device 2 of this embodiment shown in Figure 3. The example of dimensions of the antenna device 2 shown in Figure 4 is an example of a design and is not limited thereto. As shown in Figure 4, the distance from the second surface of the substrate 10 to the surface of the conductor 41 facing the second surface of the substrate 10 (the Z-direction dimension of the gap 51) may be, for example, 0.5 mm. The width of the power supply circuit 30 (the Y-direction dimension of the power supply circuit 30 in Figure 4) may be, for example, 2.0 mm. The distance between the sides of conductors 41 adjacent to the gap 51 (the Y-direction dimension of the gap 51 in Figure 4) may be, for example, 8.0 mm or more. The thickness of the substrate 10 (the Z-direction dimension of the substrate 10 in Figure 4) may be 1.0 mm. The thickness of the conductor 41 may be 1.5 mm. The distance between one end of the power supply circuit 30 and the side surface of the conductor 41 adjacent to the air gap 51 (the Y-direction dimension between one end of the power supply circuit 30 and one end of the air gap 51 in Figure 4) may be 3.0 mm.

[0038] Now, let's return to the explanation of Figure 2.

[0039] The antenna element feeding section 60 of the antenna device 2 connects the feeding circuit 30, which is located on the second surface of the substrate 10, to the antenna element 21. The antenna element feeding section 60 may be a through-hole formed in the substrate 10, but is not limited to this.

[0040] The radome 70 of the antenna device 2 is positioned opposite the first surface of the substrate 10 and covers the first surface. The radome 70 is connected to the substrate 10 via a radome connection part 80, which will be described later. The radome 70 has the function of protecting the first surface of the substrate 10 and the antenna element 21. Furthermore, the radome 70 has the function of dissipating heat generated inside the antenna device 2 or in the radio connected to the antenna device 2 to the outside. The main heat source of the heat generated inside the antenna device 2 or in the radio connected to the antenna device 2 is, for example, the transceiver 100, which will be described later. For example, as shown in Figure 5, which will be described later, the transceiver 100 is thermally connected to the conductor 41 via a bandpass filter 90, which will be described later. The heat from the transceiver 100 propagates through the conductor 41 and is transmitted to the radome 70. The heat source and the conductor 41 may be adjacent and directly connected. Alternatively, the heat source and the conductor 41 may be connected via another component, and the heat from the heat source may be transmitted to the conductor 41 via this other component. The above-mentioned other parts may, but are not limited to, metal parts. The material of the radome 70 may be, for example, resin, or a metal with high thermal conductivity such as aluminum, silver, or copper. The radome 70 may be made of the same material as the conductor 41. The radome 70 may be thermally connected to the conductor 41. However, the material of the radome 70 is not limited to the above.

[0041] The radome connection portion 80 of the antenna device 2 connects the substrate 10 and the radome 70. Therefore, the radome 70 and the radome connection portion 80 form the second conductor. The radome connection portion 80 is fixed to the conductor 41 and the substrate 10 by a fastening portion 140. The fastening portion 140 may be, for example, a screw, but is not limited to this.

[0042] The antenna elements 22 of the antenna device are arranged in the radome 70. Multiple antenna elements 22 are provided along the X direction in Figure 2. Multiple antenna elements 22 are arranged in the radome 70 at a predetermined separation distance. Antenna elements 22 are positioned opposite to antenna elements 21. Antenna elements 22 may be, for example, slot antennas, but are not limited to these. Antenna elements 22 resonate in a coupled manner with antenna elements 21.

[0043] The bandpass filter 90 of the antenna device 2 is connected to the feed circuit 30 via the connector 130. The bandpass filter 90 is also connected to the conductor 41.

[0044] The antenna device 2 of this embodiment has the structure shown in Figures 2 and 3, and thus has the same effects as the first embodiment. Furthermore, the antenna device 2 of this embodiment can adjust and maintain the dimensions of the air gap depending on the shape of the conductor 41. Therefore, compared to the antenna device 3 of the third embodiment described later, it is possible to maintain a higher dimensional accuracy of the air gap. This makes it possible to maintain a reduction in dielectric loss during power supply.

[0045] Furthermore, the antenna device 2 in this embodiment may be mounted on a wireless device. An example of a wireless device 5 having the antenna device 2 in this embodiment is shown in Figure 5. The wireless device 5 shown in Figure 5 is a wireless communication device and has the antenna device 2 in this embodiment and a transceiver 100. The transceiver 100 is a mechanism for the antenna device 2 to send and receive signals. The transceiver 100 may be arranged adjacent to the bandpass filter 90. The transceiver 100 may also be called a transceiver, an RF (Radio Frequency) circuit, or an amplifier. The radome 70 and antenna element 22 of the antenna device 2 are located on the surface of the wireless device 5. Note that, as shown in Figure 5, the radome 70 of the antenna device 2 may be extended to cover the surface of the wireless device 5.

[0046] The wireless device 5 shown in Figure 5 is, for example, a base station device. The base station device may be, for example, Node B, e-Node B, g-Node B, Home Node B, or Home e-Node B. A base station device equipped with the antenna device 2 of this embodiment can increase the equivalent isotropically radiated power compared to a base station device equipped with a conventional antenna device. The wireless device 5 equipped with the antenna device 2 of this embodiment is not limited to a base station device, but may be any other wireless device that performs wireless communication.

[0047] Furthermore, in antenna devices using general microstrip lines, the heat transfer path from the heat source to the radome includes a substrate, which worsens the heat conduction efficiency. On the other hand, in this embodiment, when the heat source is directly connected to the conductor 41, the heat transfer path from the heat source to the radome 70 is the heat source, conductor 41, fastening part 140, radome connection part 80, and radome 70. Therefore, by forming the conductor 41, fastening part 140, and radome connection part 80 from materials with high thermal conductivity, the heat dissipation effect can be enhanced. In addition, in this embodiment, compared to antenna devices using general microstrip lines, there is no need to add further metal parts to improve the heat conduction efficiency to the radome. Therefore, cost reduction and weight reduction can be achieved.

[0048] (Variation 1) In this embodiment, the conductor 41 of the antenna device 2 and the radome connection part 80 are thermally connected using the fastening part 140. Alternatively, a hole may be made in the substrate 10 and the conductor 41 and the radome connection part 80 may be directly connected.

[0049] Figure 6 is an enlarged view showing the configuration of the antenna device 2 in Modification 1 of this embodiment. Referring to Figure 6, a conductor connection portion 110 is arranged on a part of the substrate 10. The conductor connection portion 110 is located on the part of the substrate 10 that is in contact with the conductor 41 and the radome connection portion 80. Alternatively, the conductor connection portion 110 may be a projection formed on the radome connection portion 80 or the conductor 41. For example, it may be a projection provided on the surface of the radome connection portion 80 adjacent to the substrate 10. This projection may extend from the radome connection portion 80 in the opposite direction to the arrow in the Z direction in Figure 6. Alternatively, the conductor connection portion 110 may be a projection provided on the surface of the conductor 41 adjacent to the substrate 10. This projection may extend from the conductor connection portion 110 in the same direction as the arrow in the Z direction in Figure 6. The conductor 41 and the radome connection portion 80 may also be directly connected by drilling a hole in the part of the substrate 10 that is in contact with the conductor 41 and the radome connection portion 80 and fitting the projection into it. In other words, a hole may be formed in the substrate 10, and the conductor 41 or the radome connection portion 80 may be inserted into the hole, so that the conductor 41 and the radome connection portion 80 are directly connected. Preferably, the radome 70, the radome connection portion 80, and the conductor connection portion 110 are made of a material with high thermal conductivity. Specifically, the radome 70, the radome connection portion 80, and the conductor connection portion 110 may be made of a conductor such as metal.

[0050] In this modified example, when the heat source is directly connected to the conductor 41, heat is conducted from the heat source to the radome 70 via a transmission path consisting of the conductor 41, the conductor connection part 110, and the radome connection part 80. This provides the same heat dissipation effect as in the second embodiment.

[0051] (Modification 2) In this embodiment, the conductor 41 of the antenna device 2 and the radome connection portion 80 are thermally connected using the fastening portion 140. Alternatively, the conductor 41 and the radome connection portion 80 may be thermally connected by providing a through-hole 150 in a part of the substrate 10.

[0052] Figure 7 is an enlarged view showing the configuration of the antenna device 2 in a modified example 2 of this embodiment. Referring to Figure 7, a plurality of through-holes 150 are formed in the substrate 10. The through-holes 150 are formed in the portion of the substrate 10 that is in contact with the conductor 41 and the radome connection portion 80. That is, the conductor 41 and the radome connection portion 80 are connected via the through-holes 150 formed in the substrate 10. The conductor 41 and the radome connection portion 80 are connected via the through-holes 150 in the Z direction in Figure 7. Furthermore, it is preferable that the radome 70 and the radome connection portion 80 are made of a material with high thermal conductivity. Specifically, the radome 70 and the radome connection portion 80 may be made of a conductor such as metal.

[0053] In this modified example, when the heat source is directly connected to the conductor 41, heat is conducted from the heat source to the radome 70 via a transmission path consisting of the conductor 41, the through-hole 150, and the radome connection portion 80. This provides the same heat dissipation effect as in the second embodiment.

[0054] <Third Embodiment> The antenna device 3 in the third embodiment of this disclosure will now be described. In the following description, components similar to those in the second embodiment will be denoted by the same reference numerals, and their descriptions will be omitted.

[0055] Figure 8 shows the configuration of the antenna device 3 in this embodiment.

[0056] Referring to Figure 8, the antenna device 3 in this embodiment comprises a substrate 10, an antenna element 21, a power supply circuit 30, a conductor 42, a support member 120, an antenna element power supply section 60, a radome 70, a radome connection section 80, an antenna element 22, and a bandpass filter 90.

[0057] The conductor 42 of the antenna device 3 is positioned on the second surface of the substrate 10, facing the feed circuit 30. The conductor 42 functions as the ground for the feed circuit 30. The material of the conductor 42 may be metal, for example, but is not limited to this. The conductor 42 is adjacent to the support member 120, which will be described later.

[0058] The support member 120 of the antenna device 3 is positioned between the conductor 42 and the substrate 10. The support member 120 has the function of maintaining the gap 52 between the conductor 42 and the substrate 10 at a predetermined size. The material of the support member 120 may be, for example, metal, but is not limited thereto. The support member 120 may also be called a spacer. The shape of the support member 120 may be, for example, a rectangular parallelepiped, but is not limited thereto.

[0059] A gap 52 is formed between the power supply circuit 30, the conductor 42, and the support member 120. The gap 52 is, for example, an air layer. The positional relationship between the power supply circuit 30, the conductor 42, the support member 120, and the gap 52 will be explained in detail with reference to Figure 9.

[0060] Figure 9 is a cross-sectional view of the antenna device 3 of this embodiment. Figure 9 is a cross-sectional view of the antenna device 3 of this embodiment shown in Figure 8, at the dotted line portion (b).

[0061] The air gap 52 is formed along the power supply circuit 30. Electromagnetic waves generated from the power supply circuit 30 propagate within the air gap 52. The air gap 52 may be formed in a rectangular parallelepiped shape as shown in Figure 9, but is not limited to this. The air gap 52 is further formed to be surrounded by the substrate 10, the conductor 42, and the support member 120.

[0062] The size of the air gap 52 may be determined by the characteristic impedance, but is not limited thereto. The size of the air gap 52 may be determined, for example, by the characteristic impedance of the connector 130. The characteristic impedance of the connector 130 may be 50Ω. Components that affect the characteristic impedance include the width of the power supply circuit 30 and the distance from the second surface of the substrate 10 to the surface of the conductor 42 facing the second surface of the substrate 10. In other words, components that affect the characteristic impedance include the Y-direction dimension of the power supply circuit 30 in Figure 9 and the Z-direction dimension of the air gap 52 in Figure 3. The distance from the second surface of the substrate 10 to the surface of the conductor 42 facing the second surface of the substrate 10 (the Z-direction dimension of the air gap 52) may be, for example, 0.5 mm. Furthermore, it is preferable to make the distance between the sides of the support members 120 adjacent to the air gap 52 (the Y-direction dimension of the air gap 52), indicated by the bidirectional arrows in Figure 9, as long as possible. This is because if the distance between the sides of the support members 120 adjacent to the gap 52 is shorter than a predetermined value, it will affect the characteristic impedance. The distance between the sides of the support members 120 adjacent to the gap 52 may be, for example, 8.0 mm or more.

[0063] The position where the support member 120 is placed will be explained using Figures 10 and 11, which are examples of the top view of the antenna device 3 in Figure 8.

[0064] Figure 10 shows one example of the arrangement of the support members 120 in this embodiment. As shown in Figure 10, multiple support members 120 may be arranged along the outer circumference of the substrate 10. The support members 120 may be arranged at regular intervals. When the support members 120 are arranged sparsely as in Figure 10, the number of support members 120 used is small, thus reducing costs. The support members 120 may also be arranged densely along the outer circumference of the substrate 10. Similarly, Figure 11 is also one example of the arrangement of the support members 120 in this embodiment. As shown in Figure 11, multiple support members 120 may be arranged along the power supply circuit 30. When the support members 120 are arranged densely as in Figure 11, the dimensions of the air gaps 52 are more easily kept constant. When the dimensions of the air gaps 52 are kept constant, the heat dissipation efficiency is higher compared to when they are arranged sparsely. The support members 120 may also be arranged sparsely along the power supply circuit 30.

[0065] The antenna device 3 of this embodiment has the structure shown in Figures 8 to 11, and thus has the same effects as the second embodiment. Furthermore, compared to the antenna device 2 of the second embodiment, the antenna device 3 of this embodiment is easier to design to have a smaller conductor mass, thus enabling cost reduction and reduced mass. Furthermore, the antenna device 3 in this embodiment may be mounted on a wireless device, similar to the antenna device 2 in the second embodiment. An example of a wireless device 6 having the antenna device 3 in this embodiment is shown in Figure 12. The wireless device 6 shown in Figure 12 is a wireless communication device and has the antenna device 3 in this embodiment and a transceiver 100. The transceiver 100 may be the same as the transceiver in the wireless device 6 shown in Figure 5. The radome 70 and antenna element 22 of the antenna device 3 are located on the surface of the wireless device 6. Note that, as shown in Figure 12, the radome 70 of the antenna device 3 may be extended to cover the surface of the wireless device 6.

[0066] The wireless device 6 shown in Figure 12 is, for example, a base station device. The base station device may be, for example, Node B, e-Node B, g-Node B, Home Node B, or Home e-Node B. A base station device equipped with the antenna device 3 of this embodiment can increase the equivalent isotropically radiated power compared to a base station device equipped with a conventional antenna device. Furthermore, it can achieve lower costs and lower mass compared to a base station device equipped with the antenna device 2 of the second embodiment. Note that the wireless device 6 equipped with the antenna device 3 of this embodiment is not limited to a base station device, but may be any other wireless device that performs wireless communication.

[0067] This disclosure is not limited to the embodiments described above, and may be modified as appropriate without departing from its spirit. Furthermore, this disclosure may be implemented by combining the respective embodiments as appropriate.

[0068] Furthermore, some or all of the above embodiments may also be described as follows, but are not limited to the following. (Note 1) circuit board and A plurality of antenna elements arranged on the first surface of the substrate, A power supply circuit is arranged on the second surface, which is the back surface of the first surface of the substrate, It comprises a first conductor positioned opposite the power supply circuit, A gap is formed between the power supply circuit and the first conductor. Antenna device. (Note 2) The aforementioned gap is formed along the power supply circuit, The antenna device described in Appendix 1. (Note 3) A portion of the first conductor is adjacent to the substrate, The aforementioned void is formed so as to be surrounded by the substrate and the first conductor. The antenna device described in Appendix 2. (Note 4) The system further comprises a support member disposed between the first conductor and the substrate, The aforementioned void is formed by the substrate, the first conductor, and the support member. The antenna device described in Appendix 1. (Note 5) The aforementioned members are arranged in multiple quantities along the outer periphery of the substrate. The antenna device described in Appendix 4. (Note 6) The aforementioned members are arranged in multiple locations along the power supply circuit. The antenna device described in Appendix 4. (Note 7) The system includes an antenna element power supply unit that connects the plurality of antenna elements and the power supply circuit. An antenna device as described in any one of the items 1 to 6 of the appendix. (Note 8) A radome covering the first surface side of the substrate, The system further comprises a connecting portion that connects the substrate and the radome. The antenna device described in Appendix 7. (Note 9) Holes are formed in the substrate, The first conductor or the connecting part is inserted into the hole, and the first conductor and the connecting part are directly connected. The radome and the connecting portion are second conductors. The antenna device described in Appendix 8. (Note 10) The first conductor and the connection portion are connected via a through-hole formed in the substrate. The radome and the connecting portion are second conductors. The antenna device described in Appendix 8. (Note 11) The antenna element power supply section is a through-hole formed in the substrate. The antenna device described in Appendix 7. (Note 12) The plurality of antenna elements include a patch antenna. Antenna device as described in Appendix 3 or 4. (Note 13) The aforementioned plurality of antenna elements include a dipole antenna. Antenna device as described in Appendix 3 or 4. (Note 14) The aforementioned antenna device is an array antenna device. Antenna device as described in Appendix 3 or 4. (Note 15) The substrate includes a glass epoxy substrate. Antenna device as described in Appendix 3 or 4. (Note 16) The first conductor is a metal. Antenna device as described in Appendix 3 or 4. (Note 17) The second conductor is a metal. Antenna device as described in Appendix 9 or 10. (Note 18) circuit board and A plurality of antenna elements arranged on the first surface of the substrate, A power supply circuit is provided on the second surface, which is the back surface of the first surface of the substrate, for distributing power to the plurality of antenna elements. A conductor is positioned opposite the power supply circuit and functions as the ground for the power supply circuit, A gap is formed between the power supply circuit and the conductor. Antenna device. (Note 19) circuit board and A plurality of antenna elements arranged on the first surface of the substrate, A power supply circuit is arranged on the second surface, which is the back surface of the first surface of the substrate, It comprises a first conductor positioned opposite the power supply circuit, A gap is formed between the power supply circuit and the first conductor. Antenna device and Equipped with a transceiver, Radio equipment. [Explanation of Symbols]

[0069] 1, 2, 3 Antenna equipment 5, 6 Radio equipment 10 circuit boards 20, 21, 22 Antenna elements 30 Power supply circuit 40, 41, 42 Conductors 50, 51, 52 void 60 Antenna element feed section 70 Radome 80 Radome connection section 90 Bandpass Filter 100 Transmitters and Receivers 110 Conductor connection 120 Support member 130 connectors 140 Fastening part 150 Through Hole

Claims

1. circuit board and A plurality of antenna elements arranged on the first surface of the substrate, A power supply circuit is arranged on the second surface, which is the back surface of the first surface of the substrate, A first conductor positioned opposite the power supply circuit, The second surface is provided with a connector that is electrically connected to the power supply circuit, A gap is formed between the power supply circuit and the first conductor. The power supply circuit is connected to the connector on the second surface of the substrate, and is formed on the second surface of the substrate via the first surface of the substrate. Antenna device.

2. The aforementioned gap is formed along the power supply circuit, The antenna device according to claim 1.

3. A portion of the first conductor is adjacent to the substrate, The aforementioned void is formed so as to be surrounded by the substrate and the first conductor. The antenna device according to claim 2.

4. The system further comprises a support member disposed between the first conductor and the substrate, The aforementioned void is formed by the substrate, the first conductor, and the support member. The antenna device according to claim 1.

5. The support members are arranged in multiple locations along the outer circumference of the substrate. The antenna device according to claim 4.

6. The support members are arranged in multiple locations along the power supply circuit. The antenna device according to claim 4.

7. The system includes an antenna element power supply unit that connects the plurality of antenna elements and the power supply circuit. The antenna device according to any one of claims 1 to 6.

8. A radome covering the first surface side of the substrate, The system further comprises a connecting portion that connects the substrate and the radome. The antenna device according to claim 7.

9. Holes are formed in the substrate, The first conductor or the connecting portion is inserted into the hole, and the first conductor and the connecting portion are directly connected. The radome and the connecting portion are second conductors. The antenna device according to claim 8.

10. The first conductor and the connection portion are connected via a through-hole formed in the substrate. The radome and the connecting portion are second conductors. The antenna device according to claim 8.

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