Method for manufacturing a measuring device and robot arm

Abstract

This method for manufacturing a measurement device, in which sensors contributing to force measurement are provided integrally, includes: forming a body part 11 of the measurement device on the basis of a first resin; and forming circuitry CB on a surface of the first resin integrally as a plating layer, the circuitry serving to output electric signals that change according to strains in the body part 11.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a measuring device and a robotic arm. This application claims priority to Japanese Patent Application No. 2023-189468, filed in Japan on November 6, 2023, and the entire disclosure of said application is incorporated herein by reference. [Background technology]

[0002] Conventionally, robot arms for various applications are known, including industrial use in manufacturing sites, medical use, and nursing care use. In addition, technologies related to end effectors, including robot hands and robot grippers that can be attached to the tip of a robot arm, are known. For example, Patent Document 1 discloses a method for manufacturing a force sensor that can be used attached to an end effector and has improved sensitivity compared to conventional force sensors. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-19682 [Overview of the project] [Problems that the invention aims to solve]

[0004] End effectors, which can also be used as measuring devices to contribute to force measurement, require a reduction in the number of parts, miniaturization, and weight reduction due to the payload limitations of robot arms. In addition, waterproofing and water resistance are required for end effectors so that they can be cleaned for the purpose of preventing the spread of infectious diseases and other hygiene purposes. Generally, end effectors are made of metal, are heavy, and have the problem of rusting when cleaned.

[0005] End effectors typically require sensor components to function. For example, in order for a robot arm to determine whether or not the end effector has grasped an object, sensor components such as force sensors, as described in Patent Document 1, are additionally mounted on the end effector. This has made it difficult to miniaturize and lighten the end effector.

[0006] This disclosure aims to provide a method for manufacturing a measuring device and a robot arm that can contribute to force measurement with a simpler configuration. [Means for solving the problem]

[0007] A first method for manufacturing a measuring device to solve the above problems is: A method for manufacturing a measuring device that integrally includes a sensor that contributes to the measurement of force, A first step of forming the main body of the measuring device based on a first resin, A second step involves integrally forming a circuit that outputs an electrical signal that changes according to the distortion of the main body as a plating layer on the surface of the first resin, Includes.

[0008] From a second perspective, the robotic arm is The measuring device manufactured by the above-described method for manufacturing the measuring device is provided as an end effector. [Effects of the Invention]

[0009] According to this disclosure, it is possible to provide a method for manufacturing a measuring device and a robot arm that can contribute to force measurement with a simpler configuration. [Brief explanation of the drawing]

[0010] [Figure 1] This is an external perspective view showing an example of a robotic arm according to one embodiment of the present disclosure. [Figure 2] Figure 1 is a block diagram showing an example of the configuration of a robot arm. [Figure 3]It is a first external perspective view showing an example of an end effector of the robot arm in FIG. 1. [Figure 4] It is a second external perspective view showing an example of an end effector of the robot arm in FIG. 1. [Figure 5] It is a side view showing a part of the configuration of the end effector in FIG. 3. [Figure 6] It is an enlarged cross-sectional view schematically showing an enlarged part of the cross-section taken along the line VI-VI in FIG. 5. [Figure 7] It is a flowchart explaining an example of a manufacturing method for manufacturing the end effector of FIG. 1 as a measuring device. Mode for Carrying Out the Invention

[0011] Hereinafter, one embodiment of the present disclosure will be mainly described with reference to the accompanying drawings.

[0012] FIG. 1 is an external perspective view showing an example of a robot arm 1 according to an embodiment of the present disclosure. FIG. 2 is a block diagram showing an example of the configuration of the robot arm 1 in FIG. 1. FIG. 3 is a first external perspective view showing an example of an end effector 10 of the robot arm 1 in FIG. 1. FIG. 4 is a second external perspective view showing an example of the end effector 10 of the robot arm 1 in FIG. 1. FIG. 5 is a side view showing a part of the configuration of the end effector 10 in FIG. 3. An example of the configuration of the robot arm 1 including the end effector 10 according to one embodiment as a measuring device will be mainly described with reference to FIGS. 1 to 5.

[0013] As shown in Figures 1, 3, and 4, the robot arm 1 comprises a housing 1a that constitutes the main body and an end effector 10 attached to the housing 1a at the tip of the robot arm 1. The end effector 10 corresponds to the measuring device described in the claims. The end of the end effector 10 opposite to the part for gripping the object is attached to the housing 1a, so that the end effector 10 is supported by the housing 1a. The end effector 10 is driven while supported by the housing 1a and grips the object. The end effector 10 contributes to measuring the force it receives as a reaction when gripping the object.

[0014] In this disclosure, “object” includes, but is not limited to, any other object that can be grasped by the end effector 10.

[0015] The end effector 10 is used in a robot. For example, the end effector 10 functions as part of a robot having a robot arm 1. In this disclosure, “robot” includes, for example, industrial robots, care robots, marine robots, medical robots, and mobile devices such as vehicles and drones that make autonomous decisions and move. “Industrial robot” includes, for example, collaborative robots that can work with a worker in the same space and other robots that work in isolation from the worker. The end effector 10 is configured as a robot hand or robot gripper in such a robot.

[0016] As shown in Figures 2 to 4, the end effector 10 has a main body 11. The main body 11 constitutes the entire outer shape of the end effector 10. The main body 11 has a mounting portion 11a that is attached to the housing 1a of the robot arm 1. The main body 11 has a pair of claw portions 11b that protrude from the end of the mounting portion 11a that is on the opposite side from the housing 1a. The pair of claw portions 11b grip an object by, for example, reducing the distance between them to be approximately the same as the width of the object.

[0017] The claw portion 11b has a gripping portion 11b1 and a detection portion 11b2. The gripping portion 11b1 is located at the end of the main body portion 11 opposite to the mounting portion 11a. The gripping portion 11b1 grips the object. The detection portion 11b2 is formed in the main body portion 11 such that one end of the detection portion 11b2 is attached to the mounting portion 11a and the other end is continuous with the gripping portion 11b1. The detection portion 11b2 deforms in response to the force applied to the gripping portion 11b1. The detection portion 11b2 is thinner than the gripping portion 11b1, for example, in the separation direction D1 where the pair of claw portions 11b are separated from each other.

[0018] The end effector 10 is driven while supported by the housing 1a, and grips the object by the pair of gripping parts 11b1 located at the tip of the end effector 10 by reducing the distance between them along the separation direction D1 to be approximately the same as the width of the object. The end effector 10 contributes to measuring the force received as a reaction when gripping the object, based on the strain of the detection unit 11b2 based on the gripping of the object by the gripping parts 11b1.

[0019] The main body 11 contains resin. For example, the entire main body 11, including the mounting portion 11a and the claw portion 11b, is made of resin. The detection portion 11b2, which contributes to measuring the force received as a reaction when gripping an object, also contains resin.

[0020] As described later, in this disclosure, the resin contained in the main body 11 includes, for example, a thermoplastic resin. The "thermoplastic resin" includes, for example, at least one selected from the group consisting of general-purpose plastics, engineering plastics, or super engineering plastics. The thermoplastic resin is, for example, a polyarylene sulfide resin. More specifically, the thermoplastic resin includes a polyarylene sulfide resin such as a polyphenylene sulfide resin.

[0021] As shown in Figure 2, the robot arm 1 has, in addition to the end effector 10 having a main body 11, a storage unit 20, a drive unit 30, and a control unit 40. The storage unit 20, the drive unit 30, and the control unit 40 are housed in the housing 1a of the robot arm 1.

[0022] The storage unit 20 includes, for example, semiconductor memory, magnetic memory, optical memory, or any combination thereof. The storage unit 20 functions, for example, as main memory, auxiliary memory, or cache memory. The storage unit 20 stores information used for the operation of the robot arm 1 and information obtained by the operation of the robot arm 1. For example, the storage unit 20 stores system programs, application programs, and various data obtained by any means such as communication.

[0023] The drive unit 30 includes, for example, an optional drive mechanism for driving the end effector 10. The drive mechanism includes, for example, a plurality of gears and a motor for rotating the gears. The drive unit 30 drives the end effector 10 according to a control signal from the control unit 40. The drive unit 30 drives the claw portion 11b of the main body portion 11 of the end effector 10 according to a control signal from the control unit 40 so that the claw portion 11b grips an object.

[0024] The control unit 40 includes a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. The processor is a general-purpose processor such as a CPU or GPU, or a dedicated processor specialized for a specific process. "CPU" is an abbreviation for Central Processing Unit. "GPU" is an abbreviation for Graphics Processing Unit. The programmable circuit is, for example, an FPGA. "FPGA" is an abbreviation for Field-Programmable Gate Array. The dedicated circuit is, for example, an ASIC. "ASIC" is an abbreviation for Application Specific Integrated Circuit. The control unit 40 is communicated with each component constituting the robot arm 1 and executes various processes related to the operation of the robot arm 1 while controlling each component.

[0025] As shown in Figure 5, the detection unit 11b2 is integrally formed with the resin and has a circuit CB that outputs an electrical signal that changes according to the strain of the detection unit 11b2. The circuit CB is formed, for example, on each of the inner surfaces of a pair of claws 11b in the separation direction D1 in which the pair of claws 11b are separated from each other. The inner surface of the claws 11b is the surface located on the same side as the ventral side of the claws 11b, which is the side of the claw that grips the object. The circuit CB is formed on the inner surface of the claws 11b, extending over the entire detection unit 11b2, excluding the gripping portion 11b1. The circuit CB functions as a sensor that contributes to the measurement of force. The measuring device has such a sensor integrated into it.

[0026] The circuit CB is formed, for example, by directly drawing on the surface of the resin that forms the detection unit 11b2 of the main body 11. In the circuit CB, the wiring and electrodes are formed in each region of the surface of the resin that forms the detection unit 11b2. The circuit CB is formed, for example, as a molded circuit using LDS among MIDs. "MID" is an abbreviation for Molded Interconnect Device. "LDS" is an abbreviation for Laser Direct Structuring. The circuit CB is formed by plating by directly irradiating the surface of the detection unit 11b2 as a molded product with a laser.

[0027] The circuit CB has wiring W formed on the resin surface of the detection unit 11b2. The circuit CB has input electrodes E1 and output electrodes E2 formed on the resin surface of the detection unit 11b2. The input electrodes E1 and output electrodes E2 are formed in parallel with each other. The wiring W of the circuit CB includes a plurality of straight lines connecting the input electrodes E1 and output electrodes E2, which are formed integrally with the resin.

[0028] For example, the wiring W has connecting wires W1 that extend linearly from each of the input electrode E1 and output electrode E2 and bend at a 90° angle. The wiring W has gauge wires W2 that connect the two ends of the two connecting wires W1 that are located opposite the input electrode E1 and output electrode E2, respectively. The gauge wires W2 function as strain gauges. For example, the gauge wires W2 are formed by repeatedly folding a straight line 180° at one end and then folding the folded straight line another 180° at the other end.

[0029] The line width d1 of the wiring W, for example, the gauge wire W2, is not particularly limited, but is preferably 1 mm or less, more preferably 500 μm or less, more preferably 250 μm or less, more preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The lower limit of the width d1 should not be particularly limited, but for example, it is preferably 10 μm or more, more preferably 20 μm or more, more preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more.

[0030] In the wiring W, the spacing d2 between lines of adjacent pairs of gauge lines W2 is not particularly limited, but is preferably 1 mm or less, more preferably 500 μm or less, more preferably 250 μm or less, more preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The lower limit of the spacing d2 should not be particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, more preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more.

[0031] For example, the width d1 and the spacing d2 may each be narrowed to about 50 μm.

[0032] The circuit CB formed on the surface of the detection unit 11b2 outputs an electrical signal to the control unit 40 that changes according to the electrical resistance of the wiring W itself. In this way, the detection unit 11b2 contributes to the measurement of force by the control unit 40 based on the wiring W itself. For example, the circuit CB includes a strain gauge. More specifically, the circuit CB functions as a strain gauge based on the configuration of the wiring W described above.

[0033] For example, when the detection unit 11b2 is distorted due to the gripping of an object by the gripping unit 11b1, the wiring W, which is formed as multiple straight lines connecting the input electrode E1 and the output electrode E2, also distorts, and the electrical resistance of the wiring W changes according to the degree of distortion. The amount of distortion in the detection unit 11b2 and the electrical resistance value of the wiring W are correlated with each other. As a result, the voltage between the input electrode E1 and the output electrode E2 changes according to the distortion of the detection unit 11b2. Circuit CB outputs a voltage signal corresponding to the electrical resistance of the wiring W itself, which changes according to the distortion of the detection unit 11b2, to the control unit 40 as an example of the above electrical signal.

[0034] For example, the control unit 40 of the robot arm 1 determines whether the pair of claws 11b have gripped an object based on the electrical signal output from the circuit CB of the main body 11. At this time, the control unit 40 measures the force applied to the claws 11b based on the electrical signal output from the circuit CB of the detection unit 11b2. For example, the control unit 40 calculates the magnitude of the force applied to the claws 11b based on the electrical signal. More specifically, the control unit 40 measures the magnitude of the force acting on the claws 11b of the end effector 10 by measuring the voltage change between the input electrode E1 and the output electrode E2 based on such an electrical signal. The force measurement process performed by the control unit 40 of the robot arm 1 will now be described.

[0035] First, the control unit 40 acquires measured data during a pre-calibration operation, for example, before actually gripping an object using the end effector 10 of the robot arm 1, and stores it in the storage unit 20. In this disclosure, "measured data" includes, for example, data relating the voltage value of the electrical signal output from the detection unit 11b2 to the magnitude of the force received by the gripping part 11b1 of the claw part 11b. Based on such measured data, the control unit 40 calculates an approximate formula showing the relationship between the voltage value and the magnitude of the force received by the gripping part 11b1, and stores it in the storage unit 20.

[0036] When the control unit 40 measures the magnitude of the force acting on the claw portion 11b and determines whether the pair of claw portions 11b have gripped an object, it calculates the magnitude of the force corresponding to the voltage value of the electrical signal output from the detection unit 11b2, while referring to the above-mentioned approximation formula based on past measurement data stored in advance in the memory unit 20. The control unit 40 calculates the magnitude of the force acting on the gripping portion 11b1 based on past measurement data acquired in advance through calibration work. When the pair of claw portions 11b grip an object, a force is applied to the gripping portion 11b1 as a reaction, so the control unit 40 determines, for example, that the pair of claw portions 11b have gripped an object if the calculated magnitude of the force exceeds a predetermined threshold.

[0037] Figure 6 is a schematic enlarged cross-sectional view showing a portion of the cross-section along the arrow VI-VI in Figure 5.

[0038] In the detection unit 11b2 located at the claw portion 11b of the end effector 10, the elastic modulus of the resin contained in the detection unit 11b2 is not particularly limited, but is preferably, for example, 1 GPa or more and 50 GPa or less.

[0039] In the detection unit 11b2 located at the claw portion 11b of the end effector 10, the circuit CB is integrally formed as a plating layer on the surface of the resin contained in the detection unit 11b2. In Figure 6, the gauge wire W2 of the wiring W is shown as part of the circuit CB. The configuration of the gauge wire W2 described below using Figure 6 also applies to other components of the circuit CB, such as the input electrode E1, the output electrode E2, and the connecting wire W1.

[0040] The plating layer comprises, in order from the side of the resin contained in the detection unit 11b2, a first layer W21, a second layer W22, and a third layer W23. The first layer W21 is integrally formed with the resin contained in the detection unit 11b2. The first layer W21 contains a first metal. The first metal includes, for example, a metal oxide that corresponds to the resin contained in the detection unit 11b2 when the resin is composed of a metal oxide as a filler. The first metal includes, for example, copper.

[0041] The second layer W22 is formed directly above the first layer W21. The second layer W22 contains a second metal that reduces rust on the first metal contained in the first layer W21. The second metal includes, for example, nickel. The third layer W23 is formed directly above the second layer W22. The third layer W23 contains a third metal that has the lowest electrical resistance in the plating layer. The third metal includes, for example, gold.

[0042] The overall thickness of the plating layer is not particularly limited, but is preferably, for example, 1 μm or more and 30 μm or less. Of this, the thickness of the first layer W21 is not particularly limited, but is preferably, for example, 2 μm. The thickness of the second layer W22 is not particularly limited, but is preferably, for example, 2 μm. The thickness of the third layer W23 is not particularly limited, but is preferably, for example, 0.03 μm.

[0043] In the detection unit 11b2 located at the claw portion 11b of the end effector 10, a protective layer P is further formed directly above the circuit CB. The protective layer P covers the circuit CB. For example, where the circuit CB is formed, the protective layer P is formed directly above the circuit CB, and where the circuit CB is not formed, it is formed directly above the resin contained in the detection unit 11b2, filling the gaps in the circuit CB.

[0044] The protective layer P contains a resin. In this disclosure, the resin contained in the protective layer P includes, for example, a thermosetting resin. "Thermosetting resin" is, for example, an acrylic resin and an epoxy resin. The overall thickness of the protective layer P, i.e., the height from the surface of the detection unit 11b2, is not particularly limited, but is preferably, for example, 15 μm.

[0045] Figure 7 is a flowchart illustrating an example of a manufacturing method when the end effector 10 shown in Figure 1 is manufactured as a measuring device. The flowchart shown in Figure 7 mainly focuses on the steps that are characteristic of this disclosure among all the steps of the manufacturing method of the measuring device, and provides an overview of the manufacturing method of the measuring device.

[0046] In step S101, the method for manufacturing the measuring device includes a first step of forming the main body 11 of the measuring device based on resin (first resin).

[0047] In step S102, the method for manufacturing the measuring device includes a second step of integrally forming a circuit CB, which outputs an electrical signal that changes according to the strain of the main body 11, as a plating layer on the surface of the first resin. In the second step, the circuit CB is formed as a plating layer on the surface of the detection unit 11b2 as a molded product by laser irradiation based on LDS. The second step further includes the steps of forming a first layer W21 containing a first metal, forming a second layer W22 containing a second metal, and forming a third layer W23 containing a third metal.

[0048] In step S103, the method for manufacturing the measuring device includes a third step of forming a protective layer P covering the plating layer based on a resin (second resin).

[0049] In one embodiment, a thermoplastic resin is preferred as the resin used for the main body 11 of the end effector 10. The thermoplastic resin is not particularly limited, but examples include polyolefin resins such as polypropylene, polyethylene, and polybutene; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyamide resins or aromatic polyamide resins such as nylon-6 and nylon 6,6; thermoplastic polyimide resins; polyamide-imide resins; polystyrene resins such as polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer resin or acrylonitrile-butadiene-styrene copolymer resin; polyarylene sulfide resins such as polyphenylene sulfide; polyphenylene ether resins; polyurethane resins; polylactic acid; polyether ether ketone resins; polyetherimide resins; polyketone resins; polyarylate resins such as amorphous polyarylate and liquid crystalline polyarylate; and liquid crystalline polyester resins.

[0050] Among these, the thermoplastic resin used in one embodiment is preferably a thermoplastic polyimide resin, polyamide-imide resin, polyarylene sulfide resin, polyphenylene ether resin, polyetheretherketone resin, polyetherimide resin, polyketone resin, polyarylate resin, and liquid crystalline polyester resin, which are so-called engineering plastics or super engineering plastics that have excellent heat resistance and mechanical properties. From the viewpoint of chemical resistance, heat resistance, and mechanical properties, polyarylene sulfide resin is more preferred, and among polyarylene sulfide resins (hereinafter also referred to as "PAS resin"), polyphenylene sulfide resin (hereinafter also referred to as "PPS resin") is particularly preferred.

[0051] In one embodiment, the above resin may be used alone or in the form of a polymer alloy in which multiple resins are mixed. The resin according to one embodiment may contain a filler. The resin containing a filler may contain the filler described later and the above resin, and may be in the form of a composition containing any additive components described later (colorants, antistatic agents, antioxidants, heat stabilizers, ultraviolet stabilizers, ultraviolet absorbers, foaming agents, flame retardants, flame retardant additives, rust inhibitors, coupling agents, silane coupling agents, thermoplastic elastomers, or synthetic resins) as needed.

[0052] Polyarylene sulfide resins have a resin structure in which aromatic rings and sulfur atoms are bonded together as repeating units. Specifically, they are resins in which structural units represented by the following general formula (1) and, if necessary, trifunctional structural units represented by the following general formula (2) are repeated.

[0053] [ka] In formula (1), R 1 and R 2 Each of these independently represents a hydrogen atom, an alkyl group with 1 to 4 carbon atoms, a nitro group, an amino group, a phenyl group, a methoxy group, or an ethoxy group.

[0054] [ka] The trifunctional structural site represented by formula (2) is preferably in the range of 0.001 to 3 mol%, and particularly preferably in the range of 0.01 to 1 mol%, relative to the total number of moles of the other structural sites.

[0055] Here, the structural part represented by the general formula (1) above is, in particular, R in the formula. 1 and R 2 From the viewpoint of the mechanical strength of the PAS resin, it is preferable that the atom is a hydrogen atom, and in that case, examples include those bonded at the para position represented by the following formula (3) and those bonded at the meta position represented by the following formula (4).

[0056] [ka] Among these, the bond of the sulfur atom to the aromatic ring in the repeating unit is particularly preferable in terms of the heat resistance and crystallinity of the PAS resin if it is bonded at the para position as represented by the general formula (3) above.

[0057] The above-mentioned PAS resin may contain not only the structural parts represented by the above-mentioned general formulas (1) and (2), but also structural parts represented by the following structural formulas (5) to (8) in an amount of 30 mol% or less of the total of the structural parts represented by the above-mentioned general formulas (1) and (2).

[0058] [ka] In particular, in one embodiment, it is preferable that the structural parts represented by the above general formulas (5) to (8) be 10 mol% or less, from the viewpoint of heat resistance and mechanical strength of the PAS resin. When the above PAS resin contains structural parts represented by the above general formulas (5) to (8), the bonding mode may be either a random copolymer or a block copolymer.

[0059] The above-mentioned PAS resin may have naphthyl sulfide bonds or the like in its molecular structure, but it is preferable that the amount of naphthyl sulfide bonds is 3 mol% or less, and particularly preferable that it is 1 mol% or less, relative to the total number of moles of other structural parts.

[0060] The physical properties of the PAS resin are not particularly limited as long as they do not impair the effects of one embodiment, but are as follows.

[0061] (Melting viscosity) The melt viscosity of the PAS resin is not particularly limited, but in order to achieve a good balance between fluidity and mechanical strength, the melt viscosity (V6) measured at 300°C is preferably in the range of 2 Pa·s or more, preferably in the range of 1000 Pa·s or less, more preferably in the range of 500 Pa·s or less, and even more preferably in the range of 200 Pa·s or less. However, the melt viscosity (V6) is measured using a Shimadzu flow tester, CFT-500D, with polyarylene sulfide resin at 300°C and a load of 1.96 × 10⁻⁶. 6 The measured melt viscosity was obtained after holding the mixture at Pa and L / D = 10(mm) / 1(mm) for 6 minutes.

[0062] (Non-Newtonian exponents) The non-Newton index of the PAS resin is not particularly limited, but it is preferably in the range of 0.90 or higher and 2.00 or lower. When using a linear polyarylene sulfide resin, the non-Newton index is preferably in the range of 0.90 or higher, more preferably in the range of 0.95 or higher, more preferably in the range of 1.50 or lower, and more preferably in the range of 1.20 or lower. Such polyarylene sulfide resins have excellent mechanical properties, fluidity, and abrasion resistance. However, in one embodiment, the non-Newton index (N value) is a value calculated using the following formula by measuring the shear rate (SR) and shear stress (SS) using a capillograph under conditions of melting point +20°C and orifice length (L) to orifice diameter (D), L / D = 40. The closer the non-Newton index (N value) is to 1, the closer the structure is to linear, and the higher the non-Newton index (N value), the more branched the structure is.

[0063]

Fig.

[0064] In one embodiment, the resin used for the main body 11 of the end effector 10 is blended with a metal oxide containing at least one of copper and chromium for the purpose of forming a molded circuit using LDS. When the resulting molded article is irradiated with laser, the metal oxide generates heat to melt the resin and roughen the surface of the molded article; and the metal oxide is activated by laser irradiation and has a function of selectively forming a plating layer. By setting the first metal contained in the first layer W21 to be at least one of copper and chromium, which is the same as the metal oxide, the adhesion of the interface between the first layer W21 and the resin is improved.

[0065] The metal oxide contains at least one of copper and chromium. The metal oxide may further contain other metals such as iron, aluminum, gallium, boron, molybdenum, tungsten, and selenium.

[0066] Specific examples of the metal oxide are not particularly limited, and include CuFe 0.5 2 0.5 O 2.5 , CuAl 0.5 2 0.5 O 2.5 , CuGa 0.5 2 0.5 O 2.5 , CuB2O4, CuB 0.7 O2, CuMo 0.7 O3, CuMo 0.5 O 2.5 , CuMoO4, CuWO4, CuSeO4, CuCr2O4, etc. Among these, the metal oxide is CuCr2O4, CuFe 0.5 2 0.5 O 2.5 , CuAl 0.5 2 0.5 O 2.5Preferably, CuCr2O4, CuFe 0.5 B 0.5 O 2.5 It is more preferable that these metal oxides are used individually or in combination of two or more.

[0067] The average particle size of the metal oxide is preferably in the range of 0.01 μm or more, more preferably 0.05 μm or more, more preferably 50 μm or less, and more preferably 30 μm or less. An average particle size of 0.01 μm or more is preferable because it allows for efficient and stable production. On the other hand, an average particle size of 50 μm or less is preferable because it allows for the maintenance of material strength. In this disclosure, "average particle size of the metal oxide" means the number-average particle diameter, and the value measured by electron microscopy is adopted. Specifically, the particle sizes of 100 arbitrarily selected metal oxide particles in one field of view of an electron microscope are measured, and the average value is calculated.

[0068] The Mohs hardness of the metal oxide is preferably in the range of 4.0 or higher, preferably 6.5 or lower, and more preferably 6.0 or lower.

[0069] The amount of the metal oxide blended is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 25 parts by mass or more, and preferably 90 parts by mass or less, per 100 parts by mass of the PAS resin. When the amount of the metal oxide blended per 100 parts by mass of the PAS resin is 15 parts by mass or more, it is preferable from the viewpoint that the resulting molded product can undergo a high degree of surface roughening by laser irradiation and activation of the metal oxide, and has excellent plating properties. On the other hand, when the amount of the metal oxide blended per 100 parts by mass of the PAS resin is 90 parts by mass or less, it is preferable because the material strength can be maintained.

[0070] Other fillers may be known and commonly used materials as long as they do not impair the effect of one embodiment. Examples include fillers of various shapes, such as fibrous materials and non-fibrous materials such as granular or plate-shaped materials. Specifically, fibrous fillers such as glass fibers, carbon fibers, silane glass fibers, ceramic fibers, aramid fibers, metal fibers, potassium titanate, silicon carbide, calcium silicate, wollastonite, and natural fibers can be used. Non-fibrous fillers such as glass beads, glass flakes, barium sulfate, clay, pyrophyllite, bentonite, sericite, mica, talc, kerolite, pimelite, pyrophyllite, hydrotalcite, kaolinite, attapulgite, ferrite, calcium silicate, calcium carbonate, glass beads, zeolite, milled fiber, and calcium sulfate can also be used.

[0071] In one embodiment, the filler content is not particularly limited as long as it does not impair the effects of that embodiment. The amount of filler added is preferably in the range of 1 part by mass or more, more preferably 10 parts by mass or more, preferably 600 parts by mass or less, and more preferably 200 parts by mass or less, per 100 parts by mass of resin. This range is preferable because the resin exhibits good mechanical strength and moldability.

[0072] In one embodiment, the resin used in the main body 11 of the end effector 10 may optionally contain a silane coupling agent as an optional component. The silane coupling agent is not particularly limited as long as it does not impair the effects of the embodiment, but a silane coupling agent having a functional group that reacts with a carboxyl group, such as an epoxy group, isocyanate group, amino group, or hydroxyl group, is preferred. Examples of such silane coupling agents include epoxy group-containing alkoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; isocyanato group-containing alkoxysilane compounds such as γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, and γ-isocyanatopropyltrichlorosilane; amino group-containing alkoxysilane compounds such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane; and hydroxyl group-containing alkoxysilane compounds such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. In one embodiment, the silane coupling agent is not an essential component, but if it is included, the amount added is not particularly limited as long as it does not impair the effects of the embodiment. However, it is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of resin. This range is preferable because the resin has good corona resistance and moldability, especially release properties, and the molded product exhibits excellent adhesion to epoxy resin while also improving mechanical strength.

[0073] In one embodiment, the resin used in the main body 11 of the end effector 10 may optionally contain a thermoplastic elastomer as an optional component. Examples of thermoplastic elastomers include polyolefin-based elastomers, fluorine-based elastomers, or silicone-based elastomers, of which polyolefin-based elastomers are preferred. When these elastomers are added, the amount added is not particularly limited as long as it does not impair the effects of the embodiment, but is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, preferably 10 parts by mass or less, and more preferably 5 parts by mass or less, per 100 parts by mass of resin (A). This range is preferable because it improves the impact resistance of the resulting resin.

[0074] For example, the polyolefin-based elastomers mentioned above include homopolymers of α-olefins, copolymers of two or more α-olefins, and copolymers of one or more α-olefins with a vinyl polymerizable compound having a functional group. In this case, the α-olefins include ethylene, propylene, 1-butene, and other α-olefins having 2 to 8 carbon atoms. The functional groups include carboxyl groups, acid anhydride groups (-C(=O)OC(=O)-), epoxy groups, amino groups, hydroxyl groups, mercapto groups, isocyanate groups, and oxazoline groups. Examples of vinyl polymerizable compounds having the above-mentioned functional groups include vinyl acetate; α,β-unsaturated carboxylic acids such as (meth)acrylic acid; alkyl esters of α,β-unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, and butyl acrylate; metal salts of α,β-unsaturated carboxylic acids such as ionomers (metals include alkali metals such as sodium, alkaline earth metals such as calcium, and zinc); glycidyl esters of α,β-unsaturated carboxylic acids such as glycidyl methacrylate; α,β-unsaturated dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; and derivatives of the above-mentioned α,β-unsaturated dicarboxylic acids (monoesters, diesters, acid anhydrides), one or more of these. The above-mentioned thermoplastic elastomers may be used individually or in combination of two or more types.

[0075] Furthermore, in one embodiment, the resin used in the main body 11 of the end effector 10 may, in addition to the above components, optionally contain synthetic resins (hereinafter simply referred to as synthetic resins) such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, polydifluoroethylene resin, polystyrene resin, ABS resin, phenolic resin, urethane resin, and liquid crystal polymer, depending on the application. In one embodiment, the above synthetic resins are not essential components, but when they are included, the proportion of the synthetic resin is not particularly limited as long as it does not impair the effects of the embodiment, and it will vary depending on the purpose and cannot be defined in general terms. However, as an example of the proportion of synthetic resin to be included in the resin according to one embodiment, it may be in the range of 5 parts by mass or more and 15 parts by mass or less per 100 parts by mass of resin. In other words, the ratio of resin (A) to the total of resin (A) and synthetic resin is preferably in the range of (100 / 115) or more, and more preferably in the range of (100 / 105) or more, on a mass basis.

[0076] In one embodiment, the resin used in the main body 11 of the end effector 10 may also contain, as necessary, other known and conventional additives such as colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant aids, rust inhibitors, and coupling agents as optional components. These additives are not essential components, and for example, they may be used in an amount of preferably 0.01 parts by mass or more, and preferably 1000 parts by mass or less, per 100 parts by mass of resin, adjusted appropriately according to the purpose and application so as not to impair the effects of one embodiment.

[0077] In one embodiment, a method for manufacturing the resin used in the main body 11 of the end effector 10 will be described in detail below.

[0078] In one embodiment, the resin used in the main body 11 of the end effector 10 is made by blending each essential component and other optional components as needed. In one embodiment, there is no particular limit to the method for producing the resin used in the main body 11 of the end effector 10, but it is a method of blending the essential components and optional components as needed and then melt-kneading them together, or more specifically, a method of uniformly dry-mixing them in a tumbler or Henschel mixer as needed, and then feeding them into a twin-screw extruder and melt-kneading them together.

[0079] Melt mixing can be carried out by heating the resin to a temperature range in which the resin temperature is above the melting point of the resin, preferably a temperature range in which the temperature is 10°C or higher above the melting point, more preferably 10°C or higher above the melting point, even more preferably from 20°C or higher above the melting point, preferably 100°C or lower above the melting point, and more preferably 50°C or lower below the melting point.

[0080] As the melting and mixing machine described above, a twin-screw extruder is preferred from the viewpoint of dispersibility and productivity. For example, it is preferable to melt and mix while appropriately adjusting the discharge rate of the resin component in the range of 5 to 500 kg / hr and the screw rotation speed in the range of 50 to 500 rpm, and it is even more preferable to melt and mix under conditions in which the ratio of these (discharge rate / screw rotation speed) is in the range of 0.02 to 5 kg / hr / rpm. The addition and mixing of each component to the melting and mixing machine may be done simultaneously or in stages. For example, when adding an additive from the above components, it is preferable from the viewpoint of dispersibility to introduce it into the extruder from the side feeder of the twin-screw extruder. The position of such a side feeder is preferably such that the ratio of the distance from the resin input section (top feeder) of the extruder to the total length of the screw of the twin-screw extruder is 0.1 or more, and more preferably 0.3 or more. This ratio is preferably 0.9 or less, and more preferably 0.7 or less.

[0081] The resin obtained by melt-kneading in this manner according to one embodiment is a molten mixture containing the above-mentioned essential components, optional components to be added as needed, and their derived components. After melt-kneading, it is preferable to extrude the molten resin into strands using a known method, then process it into forms such as pellets, chips, granules, or powders, and then pre-dry it at a temperature range of 100 to 150°C as needed.

[0082] The molded article of one embodiment is made by molding resin. The manufacturing method of the molded article of one embodiment includes a step of melt-molding the above-mentioned resin. This will be described in detail below.

[0083] In one embodiment, the resin used for the main body 11 of the end effector 10 is subjected to injection molding. Various molding conditions are not particularly limited and can be molded using a generally common method. For example, the resin can be melted in an injection molding machine at a temperature range above the melting point of the resin, preferably a temperature range of melting point + 10°C or higher, more preferably a temperature range of melting point + 10°C to melting point + 100°C, and even more preferably a temperature range of melting point + 20°C to melting point + 50°C, and then injected into a mold from the resin discharge port for molding. In this case, the mold temperature can also be set to a known temperature range, for example, room temperature (23°C) to 300°C, preferably 120 to 180°C.

[0084] The end effector 10, obtained by the manufacturing method according to the above embodiment, can contribute to force measurement with a simpler configuration. The end effector 10 is manufactured by a second step in which a circuit CB that outputs an electrical signal that changes according to the strain of the main body 11 is integrally formed as a plating layer on the surface of the resin. This eliminates the need to additionally mount sensor components such as strain gauges for force measurement, as in the conventional technology. For example, considering a strain gauge type force sensor as described in Patent Document 1, the force sensor exists as a separate component and needs to be attached separately to the target device. Therefore, it is necessary to provide extra space in the target device to attach the force sensor as a separate component, which can lead to an increase in the weight of the target device.

[0085] On the other hand, in one embodiment of the end effector 10, the arrangement of lead wires corresponding to strain gauges can be omitted. The end effector 10 does not require the separate arrangement of a sheet or film for sensor components and a substrate for forming an electrical circuit. The end effector 10 does not require the separate provision of joints or bonding parts for sheets, films, and substrates. The end effector 10 can contribute to force measurement with such a simpler configuration.

[0086] The end effector 10 can achieve a reduction in the number of parts, miniaturization, and weight reduction, and can also meet the payload limit of the robot arm 1. The end effector 10 can also improve the freedom of its shape design. In addition, the end effector 10 has improved waterproofing and water resistance because the main body 11 contains resin, and can be cleaned for the purpose of preventing the spread of infectious diseases and other hygiene purposes. Unlike conventional metal end effectors, the end effector 10 is lighter and rusting during cleaning can be suppressed.

[0087] The end effector 10 can be manufactured by the manufacturing method shown in Figure 7, which can shorten the manufacturing process. Therefore, the end effector 10 can be delivered as a product with a short lead time, and the costs from manufacturing to delivery can also be reduced. On the other hand, considering a strain gauge type force sensor as described in Patent Document 1, the manufacturing process of the circuit pattern involves many steps, including coating → resist application → pre-bake → exposure → development and rinsing → post-bake → etching → resist removal.

[0088] The end effector 10 is manufactured based on a third step in which a protective layer P covering the plating layer is formed using a second resin, thereby protecting the circuit CB as the plating layer. For example, the protective layer P of the end effector 10 can reduce defects such as contamination, scratches, and damage to the circuit CB.

[0089] The circuit CB has wiring W formed on the surface of the resin and outputs an electrical signal that changes according to the electrical resistance of the wiring W itself. As a result, the end effector 10 becomes an integrated molded product that contributes to force measurement by directly drawing the circuit CB on the end effector 10. Since the drawn circuit CB itself is the means of transmitting the electrical signal in the end effector 10, there is no need to provide additional wiring such as harnesses and circuit boards. The end effector 10 does not require the shape and space to accommodate wired harnesses and circuit boards, thus avoiding complexity in shape and making its configuration simpler.

[0090] The end effector 10 tends to become charged due to the resin content of its main body 11, but even in such cases, static electricity can be easily discharged by the plated wiring W in the metal circuit CB formed on its surface. The end effector 10 can effectively discharge static electricity through the path shape of the wiring W drawn directly on its surface.

[0091] The end effector 10 can form an optimal circuit pattern according to the flexibility of the detection unit 11b2, which varies depending on the thickness and material of the claw portion 11b, by having a line width d1 of wiring W that is between 10 μm and 1 mm. For example, if the resin of the detection unit 11b2 has a high elastic modulus and is formed as a hard claw portion 11b, it is desirable to narrow the width d1 in order to more easily cause a change in the electrical resistance of the wiring W itself even in the case of minute strain in the detection unit 11b2. Conversely, if the resin of the detection unit 11b2 has a low elastic modulus and is formed as a soft claw portion 11b, it is not a problem if the width d1 is larger in order to appropriately cause a change in the electrical resistance of the wiring W itself in the case of large strain in the detection unit 11b2. As described above, by setting the value of the line width d1 of wiring W to be variable, the end effector 10 can make the detection unit 11b2 function as a strain gauge with appropriate sensitivity according to the elastic modulus of the resin of the claw portion 11b.

[0092] The end effector 10 can form an optimal circuit pattern according to the flexibility of the detection unit 11b2, which varies depending on the thickness and material of the claw portion 11b, by having a line spacing d2 of wiring W of 10 μm or more and 1 mm or less. For example, if the resin of the detection unit 11b2 has a high elastic modulus and is formed as a hard claw portion 11b, it is desirable to narrow the spacing d2 in order to more easily cause a change in the electrical resistance of the wiring W itself even in the case of minute strain in the detection unit 11b2. Conversely, if the resin of the detection unit 11b2 has a low elastic modulus and is formed as a soft claw portion 11b, it is not a problem for the spacing d2 to be larger in order to appropriately cause a change in the electrical resistance of the wiring W itself in the case of large strain in the detection unit 11b2. As described above, by setting the value of the line spacing d2 of wiring W to be variable, the end effector 10 can make the detection unit 11b2 function as a strain gauge with appropriate sensitivity according to the elastic modulus of the resin of the claw portion 11b.

[0093] The end effector 10 is narrowed to approximately 50 μm in both width d1 and spacing d2, making it easier to induce changes in the electrical resistance of the wiring W itself, even in the case of minute strains in the detection unit 11b2. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or when the elastic modulus of the resin in the detection unit 11b2 is high. The end effector 10 allows the detection unit 11b2 to function as a more sensitive strain gauge.

[0094] The plating layer is formed integrally with the first resin and includes a first layer W21 containing a first metal. This improves the adhesion of the interface between the first resin, which is composed of a metal oxide containing a metal similar to the first metal, and the first layer W21. Therefore, the end effector 10 can stably form the plating layer on the surface of the resin of the detection unit 11b2. The end effector 10 can reduce rust on the first metal by having a second layer W22 containing a second metal formed directly above the first layer W21. The end effector 10 can reduce the electrical resistance experienced by electrical signals transmitted through the circuit CB by having a third layer W23 containing the third metal with the lowest electrical resistance formed directly above the second layer W22.

[0095] By having a plating layer thickness of 1 μm to 30 μm, even minute strains in the detection unit 11b2 can more easily cause changes in the electrical resistance of the wiring W itself. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or when the elastic modulus of the resin in the detection unit 11b2 is high. The end effector 10 allows the detection unit 11b2 to function as a more sensitive strain gauge.

[0096] The end effector 10, by including a strain gauge in its circuit CB, can output a voltage signal to the control unit 40 corresponding to the force applied to the gripping portion 11b1. This allows the end effector 10 to contribute to the force magnitude measurement process performed by the control unit 40. Based on the voltage signal obtained from the end effector 10, the control unit 40 can accurately calculate the magnitude of the force applied to the gripping portion 11b1.

[0097] Because the resin contains a thermoplastic resin, and the thermoplastic resin is a polyarylene sulfide resin, the end effector 10 can have improved waterproofing and water resistance. In addition, due to the excellent chemical resistance and heat resistance of the polyarylene sulfide resin, the end effector 10 can also have improved chemical resistance and heat resistance. This makes it possible for the end effector 10 to be used in chemicals and high-temperature substances. For example, the end effector 10 can also grip objects that require chemical resistance.

[0098] The end effector 10 facilitates the formation of a molded circuit using LDS by being composed of a resin containing a metal oxide that includes at least one of copper and chromium. The end effector 10 can provide functions such as generating heat when irradiated with a laser, melting the resin and roughening its surface, and being activated by laser irradiation, enabling the selective formation of a plating layer.

[0099] The end effector 10 has an elastic modulus of 1 GPa to 50 GPa, which allows the bendability of the claw portion 11b, including the detection unit 11b2, to be variably set within that range. Therefore, the end effector 10 can achieve optimal bendability for the claw portion 11b according to the circuit pattern of the strain gauge in the detection unit 11b2. The end effector 10 can optimize the elastic modulus of the first resin of the claw portion 11b so that the detection unit 11b2 contributes to force measurement.

[0100] The control unit 40 of the robot arm 1 determines whether or not it has grasped an object based on the electrical signal output from the circuit CB of the main body 11, thereby enabling the robot arm 1 to move the object. Once the robot arm 1 recognizes that it has grasped an object, it can also move the grasped object from one location to another.

[0101] The detection section 11b2 is thinner than the gripping section 11b1 at the claw section 11b, for example, as shown in Figure 3. This makes it possible for the end effector 10 to make the gripping section 11b1 that contacts the object relatively thicker and thus more robust, while also narrowing the width of the detection section 11b2, including the strain gauge portion in the circuit CB, to make it more easily deformed. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or when the elastic modulus of the resin of the detection section 11b2 is high. The end effector 10 can make the detection section 11b2 function as a more sensitive strain gauge.

[0102] The end effector 10 can more easily induce a change in the electrical resistance of the wiring W itself due to the distortion of the detection unit 11b2, for example, by having the wiring W of circuit CB have a pattern as shown in Figure 5. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is minute or when the elastic modulus of the resin of the detection unit 11b2 is high. The end effector 10 can make the detection unit 11b2 function as a more sensitive strain gauge.

[0103] It will be apparent to those skilled in the art that this disclosure can be implemented in other predetermined forms besides the embodiments described above without deviating from its spirit or essential features. Therefore, the prior description is illustrative and not limiting. The scope of the disclosure is defined not by the prior description but by the added claims. Any modifications within their equivalent scope are included therein.

[0104] For example, the shape, pattern, size, arrangement, orientation, type, and number of each component described above are not limited to those shown in the above description and drawings. The shape, pattern, size, arrangement, orientation, type, and number of each component may be configured arbitrarily as long as they can realize their function. The components of the end effector 10 and robot arm 1 shown are functional concepts, and the specific form of each component is not limited to those shown.

[0105] For example, the functions included in each step of a manufacturing process can be rearranged in a way that is not logically contradictory, and multiple steps can be combined into one or separated.

[0106] In the above embodiment, the measuring device was described as including the end effector 10, but is not limited thereto. The measuring device may include any other device. For example, the measuring device may include other devices used in the joint portion of the robot arm 1 and any other part of a robot having the robot arm 1, or it may include devices such as actuators. The measuring device is not limited to robotic devices such as the end effector 10 used in the robot arm 1, but may also include devices used in precision machinery and devices attached to the tip of a viscometer in a stirring device. The measuring device may include all devices that require the integral formation of a sensor such as a strain gauge.

[0107] In the above embodiment, the method for manufacturing the measuring device was described as including a third step of forming a protective layer P covering the plating layer based on a second resin, but it is not limited to this. The method for manufacturing the measuring device does not have to include such a third step. In this case, the protective layer P does not have to be formed directly above the circuit CB in the end effector 10. The circuit CB may be exposed without being covered by the protective layer P.

[0108] In the above embodiment, the circuit CB was described as having wiring W formed on the surface of the resin and outputting an electrical signal that changes according to the electrical resistance of the wiring W itself, but it is not limited to this. The circuit CB may also have a substrate integrally molded with the resin of the main body 11 and wiring formed on the substrate, and output an electrical signal that changes according to the electrical resistance of the wiring itself.

[0109] The circuit CB may be constructed based on a substrate that is integrally molded with resin, for example, by insert molding. In the circuit CB, wiring and electrodes may be formed on the substrate. The circuit CB may be constructed as a molded circuit using IME, for example, among MIDs. "IME" is an abbreviation for In-Mold Electronics. The circuit CB may be formed by inserting a flexible substrate or the like during injection molding. As a result, the end effector 10 becomes a single molded product that contributes to force measurement by integrally molding the substrate with resin.

[0110] In the above embodiment, it was explained that the circuit CB contributes to force measurement based on the wiring W itself, but this is not limited to this. The circuit CB may have sensor components that contribute to force measurement, which are mounted on the circuit CB by soldering or the like, in place of or in addition to the wiring W that contributes to force measurement.

[0111] In addition, the circuit CB may have control elements that are mounted on the circuit CB by soldering or other means and perform the processing necessary to realize force measurement. In this disclosure, "control elements" may include, for example, a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. This makes it possible for the end effector 10 to perform the various processing described above that is performed by the control unit 40 of the robot arm 1. The end effector 10 can also perform judgment processing, learning processing, and other arbitrary processing on its own.

[0112] In the above embodiment, the line width d1 of the wiring W was described as being between 10 μm and 1 mm, but it is not limited to this. The line width d1 of the wiring W does not have to fall within this numerical range.

[0113] In the above embodiment, the spacing d2 between the lines of the wiring W was described as being between 10 μm and 1 mm, but it is not limited to this. The spacing d2 between the lines of the wiring W does not have to fall within this numerical range.

[0114] In the above embodiment, the plating layer was described as comprising a first layer W21, a second layer W22, and a third layer W23 in that order, but is not limited thereto. The plating layer is not limited to a three-layer structure, and may include at least one layer. In the description, the plating layer was described as containing copper, nickel, and gold as the first, second, and third metals, respectively, but is not limited thereto. The plating layer may also contain a nickel alloy. In this disclosure, "nickel alloy" includes nickel-copper alloys, nickel-gold alloys, and nickel-chromium alloys, etc. This improves properties such as corrosion resistance, thermal conductivity, and oxidation resistance in the plating layer.

[0115] In the above embodiment, the thickness of the plating layer was described as being between 1 μm and 30 μm, but it is not limited to this. The thickness of the plating layer does not have to fall within this numerical range.

[0116] In the above embodiment, the circuit CB was described as including a strain gauge, but is not limited thereto. The circuit CB may include any other components that the end effector 10 can use to measure force.

[0117] In the above embodiment, the elastic modulus of the first resin was described as being between 1 GPa and 50 GPa, but it is not limited to this. The elastic modulus of the first resin does not have to fall within this numerical range.

[0118] In the above embodiment, the first resin was described as being composed of a metal oxide containing at least one of copper and chromium, but it is not limited to this. The first resin does not have to be composed of such a metal oxide. Even if the first resin does not contain a metal oxide, the formation of the plating layer by LDS is possible due to the anchoring effect. The plating catalyst flows into the holes formed by melting the resin by laser irradiation and roughening the surface of the molded product, thereby physically integrating the plating with the first resin.

[0119] In the above embodiment, the control unit 40 of the robot arm 1 was described as determining whether or not it has grasped an object based on an electrical signal output from the circuit CB of the main body 11, but it is not limited to this. The control unit 40 does not have to perform such a determination process.

[0120] In the above embodiment, the end effector 10 contributes to force measurement, and the control unit 40 of the robot arm 1 calculates the magnitude of the force applied to the claw portion 11b based on the electrical signal, but this is not limited to this. The end effector 10 may also contribute to measuring not only the magnitude of the force but also the direction of the force by appropriately arranging a plurality of strain gauges, for example. The end effector 10 may also contribute to measuring in six axial directions, i.e., in three axial directions: the X, Y, and Z axes, as well as in the rotational direction around each axis. The end effector 10 may also integrally have a force sensor as a sensor formed in the detection unit 11b2.

[0121] In the above embodiment, the detection unit 11b2 was described as being thinner than the gripping unit 11b1, but this is not limited to this. The detection unit 11b2 may be the same width as the gripping unit 11b1, or it may be thicker than the gripping unit 11b1, as long as the end effector 10 can contribute to measuring force.

[0122] In the above embodiment, it was explained that the entire main body 11 is made of resin, but this is not limited to this. It is sufficient that at least the portion of the main body 11 in which the circuit CB is formed is made of resin, and other parts of the main body 11 may be made of any material other than resin.

[0123] In the above embodiment, the end effector 10 was described as having only one pair of claw portions 11b in the main body portion 11, but it is not limited to this. The end effector 10 may have three or more claw portions 11b, or it may have only one.

[0124] In the above embodiment, the control unit 40 of the robot arm 1 was described as measuring the magnitude of the force based on past measurement data acquired in advance through calibration work, but it is not limited to this. The control unit 40 may calculate the magnitude of the force without using such past measurement data. For example, if the control unit 40 can refer to information such as a theoretical formula for calculating the magnitude of the force, which includes the voltage value of the electrical signal output from the circuit CB of the detection unit 11b2 as a parameter, it may calculate the magnitude of the force based on such a theoretical formula.

[0125] Some embodiments of the present disclosure are described below. However, it should be noted that the embodiments of the present disclosure are not limited to these. [Note 1] A method for manufacturing a measuring device that integrally includes a sensor that contributes to the measurement of force, A first step of forming the main body of the measuring device based on a first resin, A second step involves integrally forming a circuit that outputs an electrical signal that changes according to the distortion of the main body as a plating layer on the surface of the first resin, including, A method for manufacturing a measuring device. [Note 2] A method for manufacturing the measuring device described in Appendix 1, The third step further includes forming a protective layer covering the aforementioned plating layer based on a second resin. A method for manufacturing a measuring device. [Note 3] A method for manufacturing the measuring device described in Appendix 1 or 2, The circuit has wiring formed on the surface of the first resin and outputs the electrical signal which changes according to the electrical resistance of the wiring itself. A method for manufacturing a measuring device. [Note 4] A method for manufacturing the measuring device described in Appendix 3, The width of the aforementioned wiring line is 10 μm or more and 1 mm or less. A method for manufacturing a measuring device. [Note 5] A method for manufacturing the measuring device described in Appendix 3 or 4, The spacing between the lines of the aforementioned wiring is 10 μm or more and 1 mm or less. A method for manufacturing a measuring device. [Note 6] A method for manufacturing a measuring device as described in any one of the appendices 1 to 5, The plating layer is integrally formed with the first resin and includes, in order, a first layer containing a first metal, a second layer containing a second metal that reduces rust on the first metal, and a third layer containing a third metal that has the lowest electrical resistance. A method for manufacturing a measuring device. [Note 7] A method for manufacturing a measuring device as described in any one of the appendices 1 to 6, The aforementioned plating layer contains a nickel alloy. A method for manufacturing a measuring device. [Note 8] A method for manufacturing a measuring device as described in any one of Appendix 1 to 7, The thickness of the aforementioned plating layer is 1 μm or more and 30 μm or less. A method for manufacturing a measuring device. [Note 9] A method for manufacturing a measuring device as described in any one of the appendices 1 to 8, The circuit includes a strain gauge, A method for manufacturing a measuring device. [Note 10] A method for manufacturing a measuring device as described in any one of the appendices 1 to 9, The first resin includes a thermoplastic resin. A method for manufacturing a measuring device. [Note 11] A method for manufacturing the measuring device described in Appendix 10, The thermoplastic resin includes at least one selected from the group consisting of general-purpose plastics, engineering plastics, or super engineering plastics. A method for manufacturing a measuring device. [Note 12] A method for manufacturing the measuring device described in Appendix 11, The thermoplastic resin is a polyarylene sulfide resin. A method for manufacturing a measuring device. [Note 13] A method for manufacturing a measuring device as described in any one of the appendices 1 to 12, The elastic modulus of the first resin is 1 GPa or more and 50 GPa or less. A method for manufacturing a measuring device. [Note 14] A method for manufacturing a measuring device as described in any one of the appendices 1 to 13, The first resin is composed of a metal oxide containing at least one of copper and chromium. A method for manufacturing a measuring device. [Note 15] A robot arm equipped with a measuring device as an end effector, the measuring device being manufactured by the method for manufacturing a measuring device described in any one of the appendices 1 to 14. [Note 16] The robot arm described in Appendix 15, The main body includes a control unit that determines whether or not an object has been grasped based on the electrical signal output from the circuit of the main body, Robot arm. [Note 17] A robotic arm as described in Appendix 15 or 16, The main body of the measuring device is A gripping part for grasping the object, The gripping portion deforms in response to the force applied to it, and the detection unit has the circuit described above. Equipped with, The detection unit is thinner than the gripping unit. Robot arm. [Explanation of Symbols]

[0126] 1. Robot arm 1a Enclosure 10. End effector (measuring device) 11 Main body 11a Mounting part 11b Claw part 11b1 Grip part 11b2 Detection unit 20 Memory section 30 Drive unit 40 Control Unit CB circuit D1 Separation direction E1 Input electrode E2 Output electrode P protective layer W wiring W1 connection cable W2 gauge line d1 width d2 interval

Claims

1. A manufacturing method for producing a measuring device as an end effector that has an integrated sensor that contributes to force measurement, A first step of forming the main body of the end effector based on a first resin, A second step involves integrally forming a circuit that outputs an electrical signal that changes according to the distortion of the main body as a plating layer on the surface of the first resin, Includes, The first resin includes a thermoplastic resin. A method for manufacturing a measuring device.

2. A method for manufacturing the measuring device described in claim 1, The third step further includes forming a protective layer covering the aforementioned plating layer based on a second resin. A method for manufacturing a measuring device.

3. A method for manufacturing the measuring device according to claim 1 or 2, The circuit has wiring formed on the surface of the first resin and outputs the electrical signal which changes according to the electrical resistance of the wiring itself. A method for manufacturing a measuring device.

4. A method for manufacturing the measuring device according to claim 3, The width of the aforementioned wiring line is 10 μm or more and 1 mm or less. A method for manufacturing a measuring device.

5. A method for manufacturing the measuring device according to claim 3, The spacing between the lines of the aforementioned wiring is 10 μm or more and 1 mm or less. A method for manufacturing a measuring device.

6. A method for manufacturing the measuring device according to claim 1 or 2, The plating layer is integrally formed with the first resin and includes, in order, a first layer containing a first metal, a second layer containing a second metal that reduces rust on the first metal, and a third layer containing a third metal that has the lowest electrical resistance. A method for manufacturing a measuring device.

7. A method for manufacturing the measuring device according to claim 1 or 2, The aforementioned plating layer contains a nickel alloy. A method for manufacturing a measuring device.

8. A method for manufacturing the measuring device according to claim 1 or 2, The thickness of the aforementioned plating layer is 1 μm or more and 30 μm or less. A method for manufacturing a measuring device.

9. A method for manufacturing the measuring device according to claim 1 or 2, The circuit includes a strain gauge, A method for manufacturing a measuring device.

10. A method for manufacturing the measuring device according to claim 1 or 2, The thermoplastic resin is a polyarylene sulfide resin. A method for manufacturing a measuring device.

11. A method for manufacturing the measuring device according to claim 1 or 2, The elastic modulus of the first resin is 1 GPa or more and 50 GPa or less. A method for manufacturing a measuring device.

12. A method for manufacturing the measuring device according to claim 1 or 2, The first resin is composed of a metal oxide containing at least one of copper and chromium. A method for manufacturing a measuring device.

13. A robotic arm equipped with a measuring device as an end effector that has an integrated sensor contributing to force measurement, The measuring device is, A main body containing a first resin, A circuit integrally disposed on the surface of the first resin as a plating layer and outputting an electrical signal that changes according to the distortion of the main body, Equipped with, The first resin includes a thermoplastic resin. Robot arm.

14. A robot arm according to claim 13, The main body includes a control unit that determines whether or not an object has been grasped based on the electrical signal output from the circuit of the main body, Robot arm.

15. A robot arm according to claim 13, The main body of the measuring device is A gripping part for grasping the object, The gripping portion deforms in response to the force applied to it, and the detection unit has the circuit described above. Equipped with, The detection unit is thinner than the gripping unit. Robot arm.

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