Method for manufacturing molds and structures

Abstract

To provide a mold capable of forming a microstructre and performing surface treatment to a part of a surface of the structure, or a method of manufacturing a structure using the mold.SOLUTION: The present invention provides a mold for structure shaping, which has a first member that has two main surfaces and a through-hole penetrating through the main surfaces and a second member that blocks the through-hole, and in which the first member and the second member are combined such that a wall surface A, which is a part of a surface of the first member, and a wall surface B, which is a part of a surface of the second member, are made continuous to form a mold wall. There is also provided a method of manufacturing a structure using the mold.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a mold and a method for manufacturing a structure. Background Art

[0002] Various techniques for performing surface treatment on fine structures formed on a substrate have been studied. Patent Document 1 describes that in a method for producing fine particles, fine particles made of a fine particle material are formed on at least a part of concavo-convex portions formed by arranging a plurality of convex portions on one surface of a base material with the surface as a reference, and that the formation of the fine particles is performed by vacuum deposition, wherein the vacuum deposition is performed with the concavo-convex side of the base material having the concavo-convex portions formed on the surface facing the vacuum deposition direction, and the angle of the base material with respect to the vertical direction is set to 1 degree to 80 degrees. Patent Document 2 describes that in a method for manufacturing a glass substrate for a flat display device, a partition wall forming step of forming a plurality of partition walls on the glass substrate, and an electrode forming step of forming electrodes by vapor-depositing a conductive material on the glass substrate surface corresponding to the lower part of each space partitioned by the partition walls are performed in that order. Prior Art Documents Patent Documents

[0003] Patent Document 1 Japanese Unexamined Patent Application Publication No. 2010-18044 Patent Document 2 Japanese Unexamined Patent Application Publication No. 11-339649 Summary of the Invention Problem to be Solved by the Invention

[0004] Surface treatment is sometimes performed on only a part of a fine structure formed on a substrate. However, with conventional surface treatment techniques such as those applied in Patent Document 1 and Patent Document 2, it has been difficult to locally and accurately perform surface treatment only on a part of the surface of a fine structure.

[0005] This disclosure has been made in light of the circumstances described above. One embodiment of the present disclosure aims to provide a mold capable of forming a fine structure and allowing surface treatment on a portion of the surface of the structure, or a method for manufacturing a structure using the mold. [Means for solving the problem]

[0006] This disclosure includes the following aspects: [1] A mold for shaping a structure, comprising a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes, wherein the first member and the second member are combined such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a molded wall. [2] A mold for shaping a structure according to [1], wherein the wall surface A is the surface of the through hole, and the first member and the second member are combined such that the wall surface A and the wall surface B continuously form a molded wall. [3] A mold for shaping a structure according to [1], wherein the second member has a projection that penetrates and plugs the through hole of the first member and has a projection whose length in a cross-sectional view in the thickness direction is larger than the length of the through hole, the wall surface B includes the surface of the projection, and the wall surface A and the wall surface B continuously form a mold wall. [4] The mold according to [1] or [2], wherein the second member has a fitting portion that fits into the through hole of the first member, and the wall surface B includes the surface of the fitting portion. [5] The mold according to [4], wherein the through hole and the fitting portion further form a space separate from the space defined by the mold wall. [6] In a cross-sectional view in the thickness direction, when α is the angle between the wall surface B0 on ​​the separate space side of the insertion portion and a virtual straight line passing over the top of the insertion portion and parallel to the insertion portion forming surface of the second member, and β is the angle between the wall surface A0 on the separate space side of the through hole and one of the main surfaces of the first member to which the second member is combined, The mold described in [5] satisfies the relationship α > β. [7] The mold according to any one of [1] to [6], wherein the material used to form the first member and the second member is the same material. [8] The mold according to any one of [1] to [7], wherein the first member and the second member are made of materials with different elastic moduli. [9] The mold according to any one of [1] to [8], wherein the first member and the second member each include an inorganic material containing a metal and an organic material containing a resin.

[10] The mold according to any one of [1] to [9], wherein at least one of the first member and the second member comprises a magnetic material.

[11] The mold according to any one of [1] to

[10] , wherein a release layer is provided on at least a portion of the surfaces on which the first member and the second member are in contact with each other.

[12] The mold according to any one of [1] to

[11] , having a release layer on at least a portion of the wall surface B of the second member.

[13] A mold according to any one of [1] to

[12] , having a release layer in at least a portion of the surface on which the first member and the second member are not in contact.

[14] The mold according to any one of [1] to

[13] , wherein the second member includes a region that transmits light of at least some wavelengths in the range of 200 to 400 nm.

[15] The mold according to any one of [1] to

[14] , wherein the first member and the second member are fixed using magnetic force.

[16] The mold according to any one of [1] to

[15] , wherein at least one of the first member and the second member has an alignment portion for positioning relative to one another.

[17] The mold according to any one of [1] to

[16] , wherein the second member has a fitting portion that fits into the through hole of the first member, the wall surface B includes the surface of the fitting portion, the alignment portion has a convex portion in the first member and a concave portion in the second member, and in a cross-sectional view in the thickness direction, the length of the convex portion is greater than the length of the fitting portion.

[0007]

[18] The process of preparing the transfer material, A method for manufacturing a structure, comprising the steps of: forming the transfer material onto a substrate using a mold for shaping a structure, the mold having a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes, wherein the first member and the second member are combined such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall; removing the second member from the mold to expose a part of the surface of the structure formed from the transfer material; and performing a surface treatment on the exposed surface of the structure.

[19] The method for manufacturing a structure according to

[18] , wherein the surface treatment step is performed without separating the first member and the structure.

[20] The method for manufacturing a structure according to

[18] or

[19] , wherein the step of performing the surface treatment is to use the first member as a mask and treat the surface of the exposed structure.

[21] The method for manufacturing a structure according to

[18] or

[19] , wherein the surface treatment is a vacuum deposition treatment, a coating treatment, an ion irradiation treatment, an etching treatment, or a blasting treatment.

[22] The method for manufacturing a structure according to

[18] or

[19] , wherein the step of shaping the transfer material is to press the transfer material applied to the substrate using the mold.

[23] The method for manufacturing a structure according to

[18] or

[19] , wherein the step of shaping the transfer material is to fill the mold with the transfer material and then place the mold on the substrate.

[24] The method for producing a structure according to

[18] or

[19] , wherein the step of shaping the transfer material comprises filling the first member disposed on the substrate with the transfer material, disposing the second member on the first member filled with the transfer material to form the mold, and pressing the formed mold.

[25] The method for producing a structure according to any one of

[18] to

[24] , wherein the shaping of the transfer material comprises at least one selected from the group consisting of curing having a curing temperature of -65°C or higher and 300°C or lower and photocuring.

[26] The method for producing a structure according to any one of

[18] to

[25] , wherein the step of shaping the transfer material comprises fixing the first member of the mold and the substrate using magnetic force.

[27] The method for producing a structure according to any one of

[18] to

[26] , further comprising a step of washing a side of the first member facing the second member. Effects of the Invention

[0008] According to an embodiment of the present disclosure, there can be provided a mold capable of forming a fine structure and enabling surface treatment on a part of the surface of the structure, or a method for producing a structure using the mold. Brief Description of Drawings

[0009] [Figure 1] Figure 1 is a schematic cross-sectional view illustrating an example of the mold according to the present disclosure. [Figure 2A] Figure 2A is a top view illustrating an example of the first member. [Figure 2B] Figure 2B is a schematic cross-sectional view taken along line 1-1 of the first member shown in Figure 2A. [Figure 3A] Figure 3A is a top view illustrating an example of the second member. [Figure 3B] Figure 3B is a schematic cross-sectional view taken along line 2-2 of the second member shown in Figure 3A. [Figure 4] Figure 4 is a schematic cross-sectional view illustrating another example of the mold according to the present disclosure. [Figure 5]FIG. 5 is a schematic cross-sectional view showing another example of a mold according to the present disclosure. [Figure 6A] FIG. 6A is a schematic cross-sectional view showing an example of a mold in which a space separate from the space defined by the mold wall is formed. [Figure 6B] FIG. 6B is a diagram for explaining an angle α and an angle β [Figure 7] FIG. 7 is a schematic cross-sectional view showing another example of a mold according to the present disclosure. [Figure 8] FIG. 8 is a schematic cross-sectional view showing an example of a mold in which a first member and a second member are fixed using magnetic force. [Figure 9] FIG. 9 is a schematic cross-sectional view showing an example in which a release layer is formed on a second member. [Figure 10] FIG. 10 is a schematic cross-sectional view showing an example in which release layers are formed on a first member and a second member. [Figure 11] FIG. 11 is a schematic cross-sectional view showing an example in which release layers are formed on a first member and a second member [Figure 12] FIG. 12 is a schematic cross-sectional view for explaining an example of a mold in which a second member is formed using a light-transmissive material. [Figure 13] FIG. 13 is a schematic cross-sectional view showing an example of a mold having an alignment portion. [Figure 14] FIG. 14 is a diagram for explaining an example of a method for producing a structure according to the present disclosure. [Figure 15] FIG. 15 is a diagram for explaining another example of a method for producing a structure according to the present disclosure. [Figure 16] FIG. 16 is a schematic cross-sectional view showing an example of an embodiment in which an extrusion member is used to separate a substrate and a first member. DETAILED DESCRIPTION OF THE INVENTION

[0010] Embodiments of this disclosure will be described below with reference to the drawings. This disclosure is not limited to the embodiments described below and can be implemented with appropriate modifications within the scope of the purpose of this disclosure. Components indicated by the same reference numerals in each drawing are considered to be the same component. Specific components and reference numerals that are duplicated in each drawing may not be described. Dimensional ratios in the drawings do not necessarily represent actual dimensional ratios.

[0011] In this disclosure, a numerical range represented by "~" means a range that includes the numbers before and after "~" as the lower and upper limits. In numerical ranges described in stages in this disclosure, the upper or lower limit described in one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Also, in numerical ranges described in this disclosure, the upper or lower limit described in one numerical range may be replaced with the values ​​shown in the examples.

[0012] <Mold> The mold according to this disclosure is a mold for shaping structures, comprising a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes, wherein the first member and the second member are combined such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall surface.

[0013] The molds relating to this disclosure are used to form structures using transfer materials and are suitably used for forming microstructures. Here, "microstructure" in this disclosure means a structure processed to a size of the nano-order or micron-order. Examples of structures formed using the molds relating to this disclosure include structures with a maximum length of 100 nm to 1000 μm, with structures of 5 μm to 200 μm being preferred. Examples of structures include microfluidics, cell culture vessels, microlens arrays, and micromirrors.

[0014] As previously described, conventional methods such as those described in Patent Documents 1 or 2 have made it difficult to locally and accurately perform surface treatment on only a portion of the surface of a microstructure. Therefore, the inventors focused on the configuration of a mold for shaping a structure and have found that a mold, which is one embodiment of the present disclosure, can form a microstructure and perform surface treatment on a portion of the surface of the structure, having both the function of shaping a structure and the function of a mask when performing surface treatment.

[0015] In one embodiment of the present disclosure, a mold is constructed by combining a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes, and a mold wall is formed by a continuous wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member.

[0016] Herein, in this disclosure, "mold wall" means the surface of the mold that comes into contact with the transfer material and contributes to the shaping of the transfer material. In this disclosure, wall surface A means the surface of the first member that is in contact with the transfer material, and wall surface B means the surface of the second member that is in contact with the transfer material. Furthermore, in this disclosure, "wall surface A and wall surface B continuously form a molded wall" means that wall surface A and wall surface B are in contact with each other to form a single surface and thus form a molded wall. Specifically, in the manufacturing process of the structure, it is sufficient that wall surface A and wall surface B are in contact to such an extent that the transfer material shaped by the mold does not leak out from the contact area between wall surface A and wall surface B.

[0017] One embodiment of the mold according to this disclosure is a configuration in which the first member and the second member are combined such that wall surface A is the surface of a through hole in the first member, and wall surface A and wall surface B continuously form a mold wall. (Hereinafter, the mold according to this embodiment will also be referred to as "Mold A" as appropriate.)

[0018] Another embodiment of the mold according to this disclosure is a configuration in which the first and second members are combined such that the second member has a projection that penetrates and blocks the through-hole of the first member and has a length in the cross-sectional view in the thickness direction that is greater than the length of the through-hole, and the wall surface B includes the surface of the projection, and the wall surface A and wall surface B continuously form a mold wall. (Hereinafter, the mold according to this embodiment will also be referred to as "Mold B" as appropriate.)

[0019] In the following explanation, the term "mold" refers to both mold A and mold B.

[0020] After forming a structure from a transfer material using the mold according to this disclosure, the first member and the second member are separated, and when the second member is removed, a portion of the structure is exposed through the through-holes in the first member. Since the first member, after the removal of the second member, can be used as a mask when surface-treating the structure, it is possible to locally and accurately surface-treat only the surface of the structure exposed through the through-holes in the first member without using a separate mask.

[0021] The embodiments of this disclosure will be described below with reference to the drawings as appropriate.

[0022] Figure 1 is a schematic cross-sectional view showing mold 100 according to one embodiment of mold A. Figure 2A is a top view of the first member 10 of mold 100, and Figure 2B is a schematic cross-sectional view of the first member 10 shown in Figure 2A along line 1-1. Figure 3A is a top view of the second member 12 of mold 100, and Figure 3B is a schematic cross-sectional view of the second member 12 shown in Figure 3A along line 2-2.

[0023] As shown in Figure 1, the mold 100 is constructed by combining a first member 10 and a second member 12. The first member 10 is a member having two main surfaces and a through hole 14 that penetrates the two main surfaces. In the mold 100, the wall surface A of the through hole 14 in the first member 10 and the wall surface B, which is part of the surface of the second member 12, continuously form a mold wall. The mold wall formed by wall surface A and wall surface B in the mold 100 restricts the transfer material (not shown) filled in the through hole 14, thereby shaping the structure. The second member has a fitting portion 16 that fits inside the through hole 14 of the first member 10.

[0024] As shown in Figures 2A and 2B, the first member 10 is a member having two main surfaces and a through hole 14 that penetrates the two main surfaces. The two main surfaces of the first member refer to two planes that are opposite each other in the thickness direction of the first member.

[0025] In the mold 100, the region including the mold wall formed by the continuous formation of wall surface A and wall surface B constitutes the pattern section 18. The pattern section 18 defines the shape and size of the structure formed using the mold 100. In the first member 10, the through hole 14 is formed in the shape of a rectangular prism, but the shape of the through hole 14 is not limited to this and can be any desired shape such as a cylindrical shape, a barrel shape, a polygonal prism shape other than a rectangular prism, or a linear pattern.

[0026] The first member 10 has one through hole 14, but in the mold A according to this disclosure, the first member may have only one through hole or two or more. Furthermore, the penetration length of the through-hole can be appropriately determined according to the target structure. From the viewpoint of mold release properties when forming microstructures, the penetration length can be, for example, 100 nm to 1000 μm, and preferably 5 μm to 200 μm.

[0027] The aspect ratio, which is the through-hole length relative to the opening width, can be appropriately determined according to the target structure. From the viewpoint of mold release properties of the structure, the aspect ratio can be, for example, 0.5 to 50, and is preferably 1 to 20.

[0028] The second member 12 is a member that closes the through hole 14 of the first member 10, and in the mold 100, it forms one end of the structure (i.e., the ceiling portion of the structure) formed by filling the through hole 14 with a transfer material (not shown).

[0029] As shown in Figure 1, the second member 12 has an insertion portion 16 that fits into the through hole 14 of the first member 10, and the wall surface B can be configured to include the surface of the insertion portion 16. The presence of the insertion portion 16 in the second member 12 allows for the formation of a structure with an inclined surface. After separating and removing the second member 12 from the first member 10, the first member 10 can be used as a mask to perform locally precise surface treatment on the inclined surface.

[0030] In the mold 100, the fitting portion 16 is fitted into the through hole 14 such that a part of the surface of the fitting portion 16 is in contact with a part of the inner surface of the through hole 14. However, the fitting portion may be fitted into the through hole in a manner in which the surface of the fitting portion is not in contact with the inner surface of the through hole.

[0031] The second member may be configured without an insertion portion. Figure 4 is a schematic cross-sectional view showing another example of mold A, which is one embodiment of the present disclosure. The mold 110 shown in Figure 4 is a modified form configured in the same way as mold 100, except that the second member 12 is changed to a second member 12A that does not have an insertion portion. As shown in Figure 4, the second member 12A is a flat plate-shaped member that does not have an insertion portion. In mold 110, the entire surface of the through hole 14 of the first member 10 constitutes wall surface A, and the surface of the second member 12A that closes the through hole 14 constitutes wall surface B. The region including the mold wall formed by the continuous wall surface A of the first member 10 and the wall surface B of the second member 12A constitutes the pattern portion 18.

[0032] In addition to the through-hole, the first member may have one or more recesses (non-through holes) that do not penetrate one of the two main surfaces. By having non-through holes in the first member, a structure that undergoes surface treatment and a structure that does not undergo surface treatment can be formed using a single mold.

[0033] The mold 120 shown in Figure 5 is a modified example configured similarly to the mold 100, except that the first member 10 is replaced with a first member 10A that includes through holes 14 and non-through holes 15. As shown in Figure 5, the mold 120 includes a pattern portion 18 that includes through holes 14 and a pattern portion 18 that includes non-through holes 15. In the pattern portion 18 that includes through holes 14, a wall surface A, which is part of the surface of the through holes 14 of the first member 10A, and a wall surface B, which is part of the surface of the second member 12, continuously form a mold wall. In the pattern portion 18 that includes non-through holes 15, the wall surface A, which is the entire surface of the non-through holes 15 of the first member 10A, constitutes a mold wall.

[0034] In the mold A according to this disclosure, the through hole in the first member and the fitting portion in the second member may further form a space separate from the space defined by the mold wall. The formation of a space separate from the space defined by the mold wall facilitates the separation of the first member and the second member.

[0035] Figure 6A is a schematic cross-sectional view showing an example of mold A in which a space separate from the space defined by the inner wall of the mold is formed. As shown in Figure 6, the mold 200 is composed of a first member 20 having a through hole 24 and a second member 22 having a fitting portion 26, and a space 28 is formed separately from the space defined by the mold wall formed from the wall surface A of the through hole 24 and the wall surface B which is part of the surface of the fitting portion 26.

[0036] Specifically, the above-mentioned separate space can be formed when, in a cross-sectional view in the thickness direction of mold A, the angle between the wall surface B0 on ​​the separate space side of the insertion part and a virtual straight line passing through the top of the insertion part and parallel to the insertion part forming surface of the second member is α, and the angle between the wall surface A0 on the separate space side of the through hole and one of the main surfaces of the first member to which the second member is combined is β, angles α and β satisfy the relationship α > β.

[0037] The angles α and β and their relationship will be explained in detail using Figures 6A and 6B. Figure 6B is a schematic cross-sectional view of the mold 200 shown in Figure 6A, with the first member and the second member separated.

[0038] As shown in Figure 6B, angle α is the angle formed by the wall surface B0 on ​​the space 28 side of the second member 22 and a virtual straight line (the dashed line in Figure 6B) that passes through the vertex of the fitting portion 26 and is parallel to the fitting portion forming surface of the second member 22 when the first member 20 and the second member 22 are combined. Angle β is the angle formed by the wall surface A0 on the separate space 28 side of the through hole 24 and one of the main surfaces of the first member 20 into which the second member 22 is combined when the first member 20 and the second member 22 are combined.

[0039] As angles α and β satisfy the relationship α > β, a space 28 is formed when the first member 20 and the second member 22 are combined to form the mold 200, as shown in Figure 6A. Because a non-contact area exists between the first member 20 and the second member 22, when an external force is applied to separate the first member and the second member, delamination from the first member 20 and the second member 22 is more likely to occur starting from the region of space 28, thus making it easier to separate the first member and the second member.

[0040] The magnitudes of angles α and β can be appropriately determined so as to satisfy the relationship α > β, and from the viewpoint of ease of separation between the first member and the second member, it is preferable, for example, to set 1° < α - β < 30°.

[0041] Figure 7 is a schematic cross-sectional view showing a mold 130 according to one embodiment of mold B. As shown in Figure 7, the mold 130 is constructed by combining a first member 10 and a second member 12B to form a single mold.

[0042] The first member 10 is the same member as the first member 10 that constitutes the mold 100. Note that in Figure 7, the reference numeral for the through hole in the first member 10 is omitted. The second member 12B has a projection 13 whose length in a cross-sectional view in the thickness direction is larger than the length of the through hole in the first member 10, and the projection 13 blocks the through hole of the first member 10 by penetrating through it. That is, a portion of the projection 13 that blocks the through hole in the first member 10, including the tip, protrudes from the main surface of the first member 10 on the side opposite to the second member 12B.

[0043] In the mold 130, the main surface of the first member 10 opposite to the second member 12B constitutes wall surface A, and wall surface A and wall surface B, which is part of the surface of the projection 13 of the second member 12B, continuously form a mold wall. In the mold 130, the region including the mold wall formed by the continuous formation of wall surface A, which is part of the main surface opposite to the second member 12B, and wall surface B, which is part of the surface of the projection 13, constitutes the pattern portion 18.

[0044] The mold 130 can be used to shape a structure by placing a transfer material (not shown) on the side of the first member 10 opposite to the second member 12B, and restricting the transfer material with the formed mold wall. By using the mold 130, a structure having recesses (e.g., grooves) can be obtained.

[0045] Furthermore, the mold relating to this disclosure may have only the configuration of mold A or only the configuration of mold B, or it may have the configuration of both mold A and mold B.

[0046] The materials used to form the first and second members are not particularly limited as long as they are suitable for forming molds, and may be inorganic or organic materials.

[0047] Examples of inorganic materials include metallic materials, glass materials, and ceramic materials. Examples of metallic materials include nickel, copper, and alloys containing two or more of these metals. Examples of glass materials include quartz, and examples of ceramic materials include SiC (silicon carbide).

[0048] Examples of organic materials include organic materials containing resins. Examples of resins include silicone, polydimethylsiloxane (PDMS), polycarbonate, and cycloolefin polymer (COP).

[0049] The first and second members can be manufactured, for example, by lithography such as cutting or laser exposure; dry etching or wet etching; electroforming; molding using organic materials including resin; and the like.

[0050] Furthermore, the first and second members may be manufactured separately and then combined to form a mold, or the second member may be formed on top of the first member to form a mold. An example of forming the second member on top of the first member is to form the second member on top of a pre-manufactured first member using a coating method or the like.

[0051] The thicknesses of the first and second members can be set appropriately according to the purpose. For example, they can be independently set to 10 μm to 10 mm, or 100 μm to 600 μm.

[0052] The materials forming the first and second members may be the same or different. From the standpoint of manufacturability and cost, it is preferable that the first and second components are made of the same material.

[0053] The first and second members may be formed using materials with different elastic moduli. By using materials with different elastic moduli, the degree of deflection in response to the external force applied when separating the first and second members will differ, making separation easier. Examples of materials with different elastic moduli include one being an inorganic material containing a metal and the other being an organic material containing a resin.

[0054] In an embodiment of forming a mold using materials with different elastic moduli, the elastic modulus of the material constituting the first member may be greater than that of the material constituting the second member, or the elastic modulus of the material constituting the first member may be less than that of the material constituting the second member. The elastic moduli of the materials constituting the first and second members can be appropriately set according to the shape of the pattern portion of the mold, the type of transfer material used, etc.

[0055] In one embodiment, from the viewpoint of making it easier to peel the second member from the first member, it is preferable that the elastic modulus of the material constituting the first member is greater than that of the material constituting the second member. In another embodiment, from the viewpoint of the shape stability of the mold, it is preferable that the elastic modulus of the material constituting the first member is smaller than that of the material constituting the second member.

[0056] The first member and the second member may each contain a magnetic material, or both the first member and the second member may each contain a magnetic material.

[0057] Examples of magnetic materials include metals such as nickel, cobalt, and iron, as well as alloys containing two or more of these metals.

[0058] By including a magnetic material in at least one of the first and second members, the fixing of the first and second members to each other, or between the substrate on which the transfer material is placed and the mold, can be improved using an external magnetic force.

[0059] In one embodiment, the mold according to this disclosure may be a mold in which the first member and the second member are fixed using magnetic force. The magnetic force may be generated from a magnet placed outside the mold. As the magnet, for example, a permanent magnet such as a neodymium magnet and an electromagnet can be used. The magnet may be placed on either the first member side or the second member side of the mold.

[0060] Figure 8 is a schematic cross-sectional view showing an example of a mold A in which the first and second members are fixed using magnetic force. In the example shown in Figure 8, a mold 400 with transfer material T filled in the mold walls is placed on a substrate 44 which is placed on a permanent magnet 46.

[0061] In the example shown in Figure 8, by forming both the first member 40 and the second member 42 from a magnetic material (for example, nickel), the first member 40 and the second member 42 are fixed and closely adhered by magnetic force, preventing leakage of the transfer material T to the outside of the mold wall (for example, the area where the first member 40 and the second member 42 are in surface contact).

[0062] Furthermore, in the example shown in Figure 8, by forming at least the first member 40 from a magnetic material, the first member 40 and the substrate 44 are fixed and in close contact. Therefore, after the transfer material T is formed and the structure is created, when the second member 42 is removed and surface treatment is performed on the exposed surface of the structure using the first member 40 as a mask, the first member 40 does not separate from the substrate 44, and the surface treatment can be performed with high precision.

[0063] Furthermore, if the form is mold B, it is preferable to form both the first and second members from a magnetic material (for example, nickel), and to place the magnet on the side of the second member opposite to the first member.

[0064] The first and second members may each have a release layer on at least a portion of their surface. Having a release layer is preferable because it facilitates the separation of the first and second members, or the separation of the first member from the structure or substrate onto which the transfer material has been formed.

[0065] Examples of embodiments in which the first member and the second member have a release layer include the embodiments shown in (1) or (2) below, and both embodiments shown in (1) and (2) may also be present. Only one of the first member and the second member may have a release layer, or both the first member and the second member may have a release layer.

[0066] The following describes embodiments (1) and (2) in detail using drawings, with the form of mold A as an example. It goes without saying that embodiments (1) and (2) can also be applied to the form of mold B.

[0067] Embodiment (1): An embodiment in which a release layer is provided on at least a portion of the surfaces of the first member and the second member that are in contact with each other. According to Embodiment (1), the release properties at the interface between the first member and the second member are improved, and the separation of the first member and the second member becomes easier.

[0068] Figures 9 and 10 are schematic cross-sectional views showing examples in which a release layer according to embodiment (1) is provided on the first member 10 and the second member 12 of the mold 100 shown in Figure 1, respectively. In the example shown in Figure 9, a release layer X is provided on the surface of the through hole 14 of the insertion portion 16 of the second member 12 that is in contact with the wall surface. In the example shown in Figure 10, a release layer X is provided on the entire surface of the surfaces of the first member and the second member that are in contact with each other.

[0069] Embodiment (2): An embodiment having a release layer in at least a portion of the surface on which the first member and the second member are not in contact. According to Embodiment (2), the release properties between the first member and / or the second member and the structure formed from the transfer material, or between the first member and the substrate are improved, making it easier to separate the first member and / or the second member from the structure, or between the first member and the substrate.

[0070] Figure 11 is a schematic cross-sectional view showing an example in which a release layer according to embodiment (2) is provided on the first member 10 and the second member 12 of the mold 100 shown in Figure 1. In the example shown in Figure 11, a release layer X is provided on the surfaces where the first member and the second member are not in contact, i.e., the surface of the first member that is in contact with the transfer material (not shown) (i.e., wall surface A) and the surface that is in contact with the substrate (not shown), and the surface of the second member 12 that is in contact with the transfer material (i.e., wall surface B).

[0071] The release layer can be formed using a fluorine-containing release agent, such as perfluoropolyether (PFPE) or polytetrafluoroethylene (PTFE). Alternatively, a release layer formed using diamond-like carbon (DLC) is also preferred.

[0072] When a photocurable transfer material is used as the transfer material, the second member may include a region that transmits light of at least some wavelengths in the range of 200 to 400 nm. That is, the second member can be made using, for example, a material that transmits light of at least some wavelengths in the range of 200 to 400 nm (hereinafter also referred to as a light-transmitting material).

[0073] The region that transmits light of at least some wavelengths in the range of 200 to 400 nm only needs to be a region that corresponds to the location where the photocurable transfer material is placed during the manufacturing process of the structure. The second member may be made of at least a portion of a light-transmitting material, or it may be made entirely of a light-transmitting material.

[0074] Fabricating the second component using a light-transmitting material is advantageous because, when an opaque substrate is used as the base material for the structure, exposure can be performed from the mold side.

[0075] Examples of light-transmitting materials include light-transmitting resin materials (e.g., polydimethylsiloxane (PDMS), cycloolefin polymer (COP), quartz glass, etc.).

[0076] Figure 12 is a schematic cross-sectional view illustrating an example of a mold in which the second member is formed using a light-transmitting material. In this example, a mold having the form of mold A is used. In the example shown in Figure 12, a mold 500, which combines the first member 50 and the second member 52, is placed on an opaque substrate 54 with the transfer material T filled inside the mold wall. In this example, a photocurable transfer material T is used as the transfer material T.

[0077] In the example shown in Figure 12, since the second member 52 is made of a light-transmitting resin material (for example, polydimethylsiloxane (PDMS)), the transfer material T placed on the opaque substrate 54 can be cured by applying light indicated by arrow L from the second member 52 side.

[0078] In the mold according to this disclosure, it is preferable that at least one of the first member and the second member has an alignment portion for positioning relative to each other. Having an alignment portion allows the first member and the second member to be precisely positioned. In the mold according to this disclosure, the alignment portion can be present in either the form of mold A or mold B.

[0079] The alignment portion is preferably configured such that the first member and the second member fit together, and from the viewpoint of alignment accuracy, it is preferable that one of the first member and the second member has a convex portion and the other has a concave portion.

[0080] The alignment section may be one location, but from the viewpoint of improving the accuracy of the alignment, it is preferable to have two or more locations.

[0081] The alignment portion may be configured such that, for example, one of the first and second members has a convex portion and the other has a concave portion or a through portion.

[0082] In one embodiment of mold A, from the viewpoint of improving alignment accuracy and not damaging the pattern portion, it is preferable that the second member has a fitting portion that fits into the through hole of the first member, and that the alignment portion, in a cross-sectional view in the thickness direction, has a convex portion of the first member that is longer than the length of the fitting portion of the second member, and a concave portion of the second member.

[0083] Figure 13 is a schematic cross-sectional view showing an example of a mold A having an alignment portion. In the example shown in Figure 13, the mold 600 has two alignment portions 64, each consisting of a protrusion on the first member 60 and a through-portion on the second member 62 as a recess, with the length a of the protrusion being greater than the length b of the fitting portion 66.

[0084] The mold relating to this disclosure may be designed to be used only once and then discarded, or it may be designed to be reused repeatedly.

[0085] Next, we will explain the manufacturing method of the structure related to this disclosure.

[0086] <Method of manufacturing structures> The method for manufacturing the structure relating to this disclosure is: The process of preparing the transfer material (hereinafter also referred to as the transfer material preparation process), A process for forming a transfer material onto a substrate using a mold for forming a structure (hereinafter also referred to as the forming process), comprising: a first member having two main surfaces and through holes penetrating the main surfaces; and a second member that closes the through holes, wherein the first member and the second member are combined such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall; The process involves removing the second component from the mold to expose a portion of the surface of the structure formed from the transfer material (also referred to as the exposure process), The process includes a step of performing a surface treatment on the surface of the exposed structure (hereinafter also referred to as the surface treatment step).

[0087] The method for manufacturing a structure according to this disclosure is a method for manufacturing a structure using the mold according to this disclosure as described above, and is capable of forming a fine structure and performing surface treatment on a part of the surface of the structure.

[0088] Hereinafter, embodiments of the manufacturing method for the structure according to this disclosure will be described with reference to Figures 14(A) to 14(G) and Figures 15(A) to 15(G) as appropriate. Figures 14(A) to 14(G) show examples using mold A. Figures 15(A) to 15(G) show examples using mold B.

[0089] (Preparation process for transfer materials) In the transfer material preparation process, the transfer materials to be used in the manufacture of the structure are prepared. The transfer materials may be manufactured from raw materials, or commercially available products may be used.

[0090] Examples of transfer materials include radiation-curable compositions, photocurable compositions, thermosetting compositions, and thermoplastic resins, with photocurable compositions being preferred. Among photocurable compositions, ultraviolet (UV) curable compositions are preferred. Examples of UV curable compositions include PAK-01 and PAK-02 manufactured by Toyo Gosei Kogyo Co., Ltd.

[0091] (Formation process) In the forming process, a mold for forming structures is used to form a transfer material onto a substrate. The mold consists of a first member having two main surfaces and through holes penetrating the main surfaces, and a second member that closes the through holes. The first member and the second member are combined such that a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a mold wall.

[0092] The details of the mold for shaping the structure are the same as those of the mold described above in this disclosure (i.e., mold A or mold B), so a detailed explanation is omitted here.

[0093] One embodiment shown in Figure 14 is an example using mold A, and uses mold 700 which is a combination of a first member 70 and a second member 72 having an insertion portion.

[0094] One embodiment shown in Figure 15 is an example using mold B, and uses mold 800 which is a combination of a first member 80 and a second member 82 having a protrusion.

[0095] In the shaping process, the first step is to prepare the substrate. In one embodiment shown in Figure 14, a substrate 74 is prepared as shown in Figure 14(A). In one embodiment shown in Figure 15, a substrate 84 is prepared as shown in Figure 15(A).

[0096] There are no particular restrictions on the substrate material, as long as it is a substrate that can be used in the manufacture of structures using transfer materials. Examples include glass substrates, metal substrates, resin substrates, and silicon (Si) substrates.

[0097] The substrate may be a light-transmitting substrate or a non-light-transmitting substrate (i.e., an opaque substrate).

[0098] In the shaping process, one method of shaping the transfer material onto the substrate is to press the transfer material applied to the substrate using a mold.

[0099] For example, if mold A is used, as shown in Figure 14(B), the transfer material T is applied to the substrate 74, and then the transfer material T is pressed using mold 700 to achieve the configuration shown in Figure 14(C). This transfers the shape of the pattern portion of mold 700 to the transfer material T.

[0100] Furthermore, if mold B is used, as shown in Figure 15(B), the transfer material T is applied to the substrate 84, and then the transfer material T is pressed using mold 800 to achieve the configuration shown in Figure 15(C). This transfers the shape of the pattern portion of mold 800 to the transfer material T.

[0101] Examples of means for applying the transfer material in this embodiment include inkjet printers, spin coaters, and gravure coaters.

[0102] Another method for forming the transfer material onto the substrate in the forming process is to fill the mold with the transfer material and then place the mold on the substrate.

[0103] The shaping process in this embodiment is performed using mold A. Specifically, instead of applying the transfer material T onto the substrate 74 (Figure 14(B)), the transfer material T is directly filled into mold 700, and the mold 700 filled with the transfer material T is placed on the substrate 74 in the configuration shown in Figure 14(C). After placing the mold 700 filled with the transfer material T on the substrate 74, it may be pressed further. As a result, the shape of the pattern portion of mold 700 is transferred to the transfer material T.

[0104] In the forming process, other embodiments for forming the transfer material on the substrate include filling a first member placed on the substrate with the transfer material, placing a second member on the first member filled with the transfer material to form a mold, and pressing the formed mold.

[0105] The shaping process in this embodiment is performed using mold A. Specifically, instead of applying the transfer material T to the substrate 74 (Figure 14(B)), the first member 70 is placed on the substrate 74, the transfer material T is filled into the pattern portion having through holes in the first member 70, and then the second member 72 is placed on top of the first member 70 to assemble the mold 700 as shown in Figure 14(C), and then the mold 700 is pressed. As a result, the shape of the pattern portion of the mold 700 is transferred to the transfer material T.

[0106] Examples of means for applying the transfer material in this embodiment include inkjet and squeegee applications.

[0107] In the shaping process, when placing the first member on the substrate, it is also preferable to fix the first member and the substrate together using magnetic force. As a method for fixing the first component and the substrate using magnetic force, if mold A is used, a magnet can be placed on the side of the substrate 74 opposite to the first component 70, as shown in the example in Figure 8, as in Figure 14(C). If mold B is used, a magnet can be placed on the side of the second component 82 opposite to the first component 80, as shown in Figure 15(C).

[0108] In the shaping step, it is preferable to cure the transfer material. The curing method preferably includes at least one selected from the group consisting of curing with a curing temperature of -65°C to 300°C and photocuring, and more preferably includes photocuring.

[0109] For photocuring, a photocurable composition (preferably a UV-curable composition) is used as the transfer material T, and after bringing the transfer material T into contact with the mold, exposure is performed with light at a wavelength of 200 to 400 nm. The exposure conditions and exposure means can be appropriately selected depending on the photocurable composition used. Examples of photocurable compositions include PAK-01 and PAK-02 manufactured by Toyo Gosei Kogyo Co., Ltd.

[0110] When photocuring is applied to cure the transfer material, exposure may be performed from the substrate side or from the mold side. When using mold B, exposure from the substrate side is preferable. When exposure is performed from the substrate side, the substrate should be a light-transmitting substrate. When exposure is performed from the mold side, the second component may be made using a light-transmitting material. An example of a mold formed using a light-transmitting material for the second component is shown with reference to Figure 12.

[0111] In the curing process during the shaping step, it is also preferable that the curing temperature be between -65°C and 300°C. The transfer material T used in this embodiment may include a thermoplastic resin or a thermosetting resin.

[0112] When using a transfer material T containing a thermosetting resin, the transfer material T (thermosetting resin or thermosetting resin composition) is brought into contact with the mold, and then the transfer material T is heated and cured. The heating conditions and heating method can be appropriately selected depending on the transfer material T used. Examples of thermosetting resins include polydimethylsiloxane (PDMS) or epoxy resin.

[0113] If a transfer material T containing a thermoplastic resin (i.e., a thermoplastic resin or thermoplastic resin composition) is used, injection molding can be used in the shaping process. In this case, the transfer material T containing a thermoplastic resin such as polycarbonate or cycloolefin polymer (COP) can be melted, injected into a mold with a mold set in place, and then cooled and solidified to cure the transfer material T.

[0114] (Exposure process) In the exposure process, the second component is removed from the mold, exposing a portion of the surface of the structure formed from the transfer material.

[0115] If mold A is used, for example, as shown in Figure 14(D), the first member 70 and the second member 72 are separated and the second member 72 is removed, thereby exposing a portion of the surface of the structure S formed from the transfer material T after the forming process through the through-hole of the first member 70.

[0116] If mold B is used, as shown in Figure 15(D), the first member 80 and the second member 82 are separated and the second member 82 is removed, exposing a portion of the surface of the structure S formed from the transfer material T after the forming process and the substrate 84 below the through hole in the first member 80.

[0117] The means for separating the first member 70 from the second member 72 and removing the second member 72 are not particularly limited and include, for example, peeling and removal using a manual or device, dissolution and removal using a solvent, etc. The means for separating the first member 80 from the second member 82 and removing the second member 82 are similar.

[0118] (Surface treatment process) In the surface treatment process, the exposed surface of the structure is treated with a surface treatment. The surface treatment is preferably performed without separating the first member and the structure, and more preferably by using the first member as a mask and treating the exposed surface of the structure. Through the surface treatment process, a surface treatment layer is locally formed on a part of the surface of the shaped structure, or on a part of the surface of the structure and the substrate.

[0119] If mold A is used, for example, as shown in Figure 14(D), the first member 70 and the second member 72 are separated, and then, as shown in Figure 14(E), without separating the first member 70 from the structure S, the first member 70 is used as a mask to perform the surface treatment indicated by arrow G on the exposed surface of the structure S. This allows for accurate localized surface treatment even on the inclined exposed surface of the structure S. As a result of the surface treatment, a surface treatment layer F is locally formed only on a portion of the surface of the structure S.

[0120] If mold B is used, for example, as shown in Figure 15(D), the first member 80 and the second member 82 are separated, and then, as shown in Figure 15(E), without separating the first member 80 from the structure S, the first member 80 is used as a mask, and surface treatment indicated by arrow G is performed on the exposed surfaces of the structure S and the substrate 84 to form a surface treatment layer F. This allows for precise localized surface treatment only on the exposed surfaces of the structure S and the substrate 84. As a result of the surface treatment, the surface treatment layer F is locally formed only on a portion of the surface of the structure S and the substrate 84.

[0121] Examples of surface treatments include vacuum deposition, coating, ion irradiation, etching, or blasting. Vacuum deposition processes include vacuum evaporation, sputtering, chemical vapor deposition (CVD), and atomic layer deposition (ALD). Coating processes include inkjet printing and spray coating. Ion irradiation treatments include atmospheric pressure plasma treatment, oxygen plasma ashing, and UV ozone treatment. Etching processes include dry etching using gas and wet etching using chemical solutions. Blasting processes include sandblasting. The processing conditions and apparatus for each of the above processes may be appropriately selected according to the desired properties of the surface treatment layer F.

[0122] (Step to remove the first component) The method for manufacturing the structure according to this disclosure preferably further includes a step of removing the first member after the surface treatment step. By removing the first member, a structure is obtained in which a surface treatment layer is locally formed on the substrate.

[0123] If mold A is used, for example, as shown in Figures 14(F) and 14(G), the substrate 74 and the first member 70 are separated and the first member 70 is removed, exposing the entire structure S, on which a surface treatment layer F is formed on a part of the surface, onto the substrate 74.

[0124] If mold B is used, for example, as shown in Figures 15(F) and 15(G), the substrate 84 and the first member 80 are separated and the first member 80 is removed, exposing the entire structure S, on which a surface treatment layer F is formed on a part of the surface of the structure S and a part of the surface of the substrate 84.

[0125] The means for separating the substrate from the first member and removing the first member are not particularly limited and include, for example, peeling and removal using a manual or device, removal using an extrusion member, and dissolution and removal using a solvent. Figure 16 is a schematic cross-sectional view showing an example of separating the substrate from the first member using an extrusion member. In the example shown in Figure 16, the structure S on the substrate 91 after surface treatment is extruded from the first member by inserting the projection of the extrusion member 92 into the through hole in the first member 90 in the direction of arrow Y, thereby separating the substrate 91 from the first member 90.

[0126] (Washing process) The method for manufacturing a structure according to this disclosure may further include a step of cleaning the surface of the first member or the second member. In particular, when the first member is reused, surface treatment residue accumulates on the side of the first member facing the second member, so including a step of cleaning the side of the first member facing the second member is especially preferable in such cases. The cleaning method is selected appropriately depending on the surface treatment method and the materials to be attached, but examples include wet cleaning using acids, alkalis, organic solvents, etc.; dry ice cleaning; laser cleaning; sandblasting cleaning; plasma cleaning such as atmospheric pressure plasma and dry etching; etc.

[0127] (Other processes) The manufacturing method for the structure according to this disclosure may include other steps in addition to the steps described above. The other steps can be appropriately set according to the form and application of the resulting structure. Examples of other steps include processing the structure after the step of removing the first member (i.e., the structure having a surface treatment layer). Examples of processing steps include sealing the structure (e.g., a microchannel) with another member, and assembling and bonding the structure to another part. The other steps are not limited to these examples. [Industrial applicability]

[0128] The method for manufacturing molds and structures according to this disclosure allows for the formation of fine structures and enables surface treatment of a portion of the surface of the structure. Therefore, the method for manufacturing molds and structures according to this disclosure can be usefully applied to medical and bio-use applications such as microfluidics and cell culture vessels; optical applications such as microlenses and micromirrors; and the like. [Explanation of Symbols]

[0129] 100, 110, 120, 130, 200, 400, 500, 600, 700 molds 10, 10A, 20, 40, 50, 60, 70, 80, 90 First member 12, 12A, 12B, 22, 42, 52, 62, 72, 82, 92 Second member 13 Protrusion 14, 24 through holes 15 Non-through hole 16, 26, 66 Inset part 18 Pattern section 28 Space 44, 74, 80 circuit boards 46 Permanent Magnets 54 Opaque substrate 64 Alignment Section 92 Extruded member a, b lengths α angle α β angle β Wall A B Wall B A0 Wall Surface A0 B0 Wall Surface B0 F Surface treatment layer G Surface treatment L light S structure T Transfer material X release layer YY direction

Claims

1. A first member having two main surfaces and through holes penetrating the main surfaces, A second member that closes the through hole, It has, A mold for shaping a structure, wherein a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a molded wall, the wall surface A is the surface of the through hole, and the first member and the second member are combined such that the wall surface A and the wall surface B continuously form a molded wall, the second member has a fitting portion that fits into the interior of the through hole of the first member, and the wall surface B includes the surface of the fitting portion.

2. The mold according to claim 1, wherein the through hole and the fitting portion further form a space separate from the space defined by the mold wall.

3. In a cross-sectional view in the thickness direction, The wall surface B on the side of the separate space of the aforementioned fitting portion ０ And, let α be the angle between the imaginary straight line passing through the top of the insertion portion and parallel to the insertion portion forming surface of the second member, The wall surface A of the through hole on the side of the separate space ０ And, when the angle between the second member and one of the main surfaces of the first member into which the second member is assembled is β, The mold according to claim 2, satisfying the relationship α > β.

4. The mold according to claim 1, wherein the material used to form the first member and the second member is the same material.

5. The mold according to claim 1, wherein the first member and the second member are made of materials with different elastic moduli.

6. The mold according to claim 1, wherein one of the first member and the second member comprises an inorganic material containing a metal, and the other comprises an organic material containing a resin.

7. The mold according to claim 1, wherein at least one of the first member and the second member includes a magnetic material.

8. The mold according to claim 1, wherein at least a portion of the surfaces of the first member and the second member that are in contact with each other has a release layer.

9. The mold according to claim 1, wherein at least a portion of the wall surface B of the second member is provided with a release layer.

10. A release layer is applied to at least a portion of the surface where the first member and the second member are not in contact. The mold according to claim 1, having the following characteristics.

11. The mold according to claim 1, wherein the second member includes a region that transmits light of at least some wavelengths in the range of 200 to 400 nm.

12. The mold according to claim 1, wherein the first member and the second member are fixed using magnetic force.

13. The mold according to claim 1, wherein at least one of the first member and the second member has an alignment portion for positioning relative to one another.

14. The second member has a fitting portion that fits into the through hole of the first member, and the wall surface B includes the surface of the fitting portion. The alignment portion comprises the first member having a convex portion and the second member having a concave portion. The mold according to claim 13, wherein, in a cross-sectional view in the thickness direction, the length of the protrusion is greater than the length of the fitting portion.

15. The process of preparing the transfer material, A mold for shaping a structure is used to shape the transfer material onto a substrate, comprising: a first member having two main surfaces and a through hole penetrating the main surfaces; and a second member closing the through hole, wherein a wall surface A, which is part of the surface of the first member, and a wall surface B, which is part of the surface of the second member, continuously form a molded wall, and wall surface A is the surface of the through hole, and wall surface A and wall surface B continuously form a molded wall, the second member having a fitting portion that fits into the interior of the through hole of the first member, and wall surface B including the surface of the fitting portion; The steps include removing the second member from the mold to expose a portion of the surface of the structure formed from the transfer material, The process of performing a surface treatment on the exposed surface of the structure, A method for manufacturing a structure having [the specified characteristics].

16. The method for manufacturing a structure according to claim 15, wherein the surface treatment step is performed without separating the first member and the structure.

17. The method for manufacturing a structure according to claim 15 or claim 16, wherein the step of performing the surface treatment is to use the first member as a mask and treat the exposed surface of the structure.

18. The method for manufacturing a structure according to claim 15 or claim 16, wherein the surface treatment is a vacuum film deposition treatment, a coating treatment, an ion irradiation treatment, an etching treatment, or a blasting treatment.

19. The method for manufacturing a structure according to claim 15 or claim 16, wherein the step of shaping the transfer material includes pressing the transfer material applied to the substrate using the mold.

20. The method for manufacturing a structure according to claim 15 or claim 16, wherein the step of shaping the transfer material includes filling the mold with the transfer material and then placing the mold on the substrate.

21. The method for manufacturing a structure according to claim 15 or claim 16, wherein the step of shaping the transfer material includes filling the first member placed on the substrate with the transfer material, placing the second member on the first member filled with the transfer material to form the mold, and pressing the formed mold.

22. The method for manufacturing a structure according to claim 15 or claim 16, wherein the shaping of the transfer material includes at least one selected from the group consisting of curing with a curing temperature of -65°C to 300°C and photocuring.

23. The method for manufacturing a structure according to claim 15 or claim 16, wherein the step of shaping the transfer material includes fixing the first member of the mold and the substrate using magnetic force.

24. Furthermore, the method for manufacturing a structure according to claim 15 or claim 16, further comprising the step of cleaning the side of the first member facing the second member.

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