Cooling module for rear power supply system

Abstract

To provide a cooling module for a back power supply system capable of radiating heat generated on the back side of a substrate.SOLUTION: In the cooling module for a back power supply system, the back power supply system includes a substrate and an electronic component, the electronic component is provided on the back side of the substrate, the cooling module includes at least one cooling component provided on the electronic component, and the electronic component includes a power supply component.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cooling module, and in particular, to a cooling module for cooling a backside power supply system. [Background Art]

[0002] With the rapid development of Artificial Intelligence, the demand for computers has increased dramatically. At the same time, along with the evolution of Moore's Law, the size of transistors has gradually decreased, the integration density has gradually increased, and the number of stacked layers has also increased.

[0003] Furthermore, conventional power supply technologies typically supply power from above (upper side, front side) of a chip, but in order to supply power and data signals to transistors located below the chip (lower side, backside), it may be necessary to pass through 10 to 20 stacked circuit layers.

[0004] As a result, data signal patterns and power supply lines coexist in the circuit layers in each layer, resulting in the formation of more complex circuits.

[0005] Furthermore, IR drop may occur while electrons are transmitted downward, which may cause power loss.

[0006] However, advances in backside power supply technology have provided an effective solution to the above problems. The so-called backside power delivery network (BSPDN) technology moves power supply lines from the front side of an original chip or circuit board to the backside thereof. [Summary of the Invention] [Problem to be Solved by the Invention]

[0007] However, ConventionalThe main technical problem is that if the pattern circuits are manufactured too thinly, the power supply lines and data signal lines will interfere with each other. Therefore, it is necessary to separate the power supply lines and data signal lines to prevent them from interfering with each other by moving the layout of the power supply lines to the back side of the chip or board.

[0008] To further explain, the back-loaded power supply (BSPDN) technology was first proposed in 2019 by the Belgian Microelectronics Research Centre (IMEC).

[0009] This technology uses nanosilicon through-hole (nTSV) structures to connect front-side components of a wafer to a buried power rail (BPR), where nanosilicon vias (nTSVs) are high-aspect-ratio silicon vias that enable connections between the front and back of the wafer.

[0010] Furthermore, small fin field-effect transistors (FinFETs) can be interconnected by utilizing these embedded power rails (BPRs).

[0011] In current technological advancements, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)'s A16 chip manufacturing technology employs the Super Power Rail architecture. This technology moves the power supply lines that provide power to the transistors to the underside of the transistors. This is called rear-side power supply, and this technology contributes to more efficient chip manufacturing.

[0012] Here, the power supplied to the source and drain of each transistor uses a special contact method to simultaneously reduce resistance, thereby achieving maximum performance and power efficiency.

[0013] Furthermore, Taiwan Semiconductor Manufacturing Company (TSMC) has also developed a back-side power supply technology called "Buried Power Grid" (BPG). This technology uses a metal mesh to connect power supply lines to the structure of the front layer of the wafer.

[0014] According to Taiwan Semiconductor Manufacturing Co., Ltd., the "embedded power grid" technology can reduce the area occupied by power supply lines by 60%, potentially improving wiring efficiency and reducing power consumption.

[0015] Meanwhile, Intel has developed a back-side power supply technology called "Power Via." This technology uses high-aspect-ratio through-silicon vias to connect power supply lines to the structure of the back-side layer of the wafer.

[0016] Intel claims that its "Power Via" technology can reduce the area occupied by power supply lines by 50%, improving wiring efficiency and reducing power consumption.

[0017] Furthermore, Intel has incorporated this rear power supply technology into the manufacturing process of its "Intel 20A" chips, which not only simplifies power distribution but also allows for a more compact chip circuitry. The goal is to incorporate more transistors into the processor to improve computing power.

[0018] Initial testing revealed that the rear power supply method increased the CPU operating frequency by approximately 6% and reduced voltage drop (IR drop) by approximately 30%.

[0019] However, after the power supply lines are placed on the back side of the circuit board, some power supply components (voltage regulation module, VRM, etc.) are also placed on the surface of the back side of the circuit board, so heat dissipation is also necessary on the back side of the circuit board at this time.

[0020] Specifically, if the conversion efficiency of power supply components (such as VRMs) is 90%, 10% of the total energy is consumed as thermal energy. More specifically, the thermal energy that needs to be dissipated on the back side of the circuit board will be at least 50W to 120W. Therefore, the development of technology to dissipate the heat generated on the back side of the circuit board is considered urgent. [Means for Solving the Problem]

[0021] In view of the above problems, the present invention has the following configuration. A cooling module for a rear power supply system, wherein the rear power supply system comprises a substrate and an electronic component, and the electronic component is provided on a rear side of the substrate, the cooling module comprises at least one cooling component provided on the electronic component, and the electronic component comprises a power supply component.

[0022] Another aspect of the present invention provides a cooling module for a rear power supply system, wherein the rear power supply system comprises a substrate and a plurality of electronic components, the plurality of electronic components are respectively provided on a front side and a rear side of the substrate, the cooling module comprises a plurality of cooling components, the plurality of cooling components are respectively fixed to the front side and the rear side of the substrate and respectively provided on the plurality of electronic components, and the plurality of electronic components provided on the rear side of the substrate comprise a power supply component.

[0023] Another aspect of the present invention provides a cooling module for a rear power supply system, wherein the rear power supply system comprises a substrate and a plurality of electronic components, the plurality of electronic components are respectively provided on a front side and a rear side of the substrate, and the substrate comprises a plurality of through holes, the cooling module comprises a first cooling component, a second cooling component and a plurality of fasteners, the first cooling component and the second cooling component are respectively provided on the plurality of electronic components, the first cooling component comprises a plurality of through holes, and the second cooling component comprises a plurality of perforations, and the plurality of fasteners respectively pass through the plurality of perforations of the second cooling component, the plurality of through holes of the substrate, and the plurality of through holes of the first cooling component, The first cooling component and the second cooling component are respectively fixed to the front side and the back side of the substrate, The plurality of electronic components provided on the back side of the substrate include a power supply component.

[0024] Also, in a cooling module for a back power supply system, The back power supply system includes a substrate and at least one electronic component, The cooling module includes at least one cooling component, and the at least one cooling component is provided on the at least one electronic component, The substrate includes a socket, a chip carrier, and a main circuit board, The socket is provided on the main circuit board, the chip carrier is accommodated in the socket, the at least one electronic component includes an integrated voltage regulator and is provided on the back side of the chip carrier, The main circuit board includes an opening groove, the socket includes a through groove, and the at least one cooling component corresponds to the through groove and the opening groove.

[0025] Also, in a cooling module for a back power supply system, The back power supply system includes a substrate and at least one electronic component, The cooling module includes at least one cooling component, and the at least one cooling component is provided on the at least one electronic component, The substrate includes a main circuit board, an interposer substrate, a mezzanine connector, and a package substrate, The interposer substrate is provided on the front side of the package substrate, and the at least one electronic component is provided on the back side of the package substrate, The mezzanine connector is provided between the back side of the package substrate and the main circuit board, and electrically connects the package substrate to the main circuit board. [Effects of the Invention]

[0026] According to the present invention, the rear power supply system includes a substrate and electronic components, the electronic components being provided on the rear side of the substrate, and the cooling module includes at least one cooling component provided on the electronic components, the electronic components including a power supply component. Therefore, a cooling module for a rear power supply system can be provided that can dissipate the heat generated by the power supply component on the rear side of the substrate. [Brief explanation of the drawing]

[0027] [Figure 1A] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 1B] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 1C] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 1D] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 2A] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 2B] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 2C] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 2D] This is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 3] This is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 4] This is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 5]This is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 6] This is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Modes for carrying out the invention]

[0028] The following describes various embodiments to illustrate the invention in detail, but these embodiments are merely illustrative and are not intended to limit the technical scope of the present invention to those shown in the embodiments. Furthermore, in the following embodiments of the present invention, some components may be omitted from the drawings in order to clearly illustrate the technical features of the present invention. Also, identical components are denoted by the same reference numeral. Furthermore, technically related components are denoted by related reference numerals, for example, by differing in the last digit. In addition, the drawings are provided for illustrative purposes only and are not necessarily drawn to a fixed scale, and not all details of the cooling module for the rear power supply system utilizing the present invention are illustrated.

[0029] Embodiments of the present invention will be described with reference to Figure 1A. Here, Figure 1A is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0030] As shown in Figure 1A, in this embodiment, the rear power supply system (not indicated) includes a circuit board 2, a first electronic component C1, and a second electronic component C2, with the first electronic component C1 and the second electronic component C2 being provided on opposite sides of the circuit board 2, respectively. That is, the first electronic component C1 and the second electronic component C2 are provided on the front side 201 located above and the rear side 202 located below, respectively, from the viewpoint of Figure 1A. The second electronic component C2 includes a power supply component (not indicated).

[0031] The cooling module (not indicated) comprises a first cooling component 3 provided on a first electronic component C1 and a second cooling component 4 provided on a second electronic component C2.

[0032] To further explain, in one embodiment, the substrate 2 is a printed circuit board 21 (see, for example, Figure 2A described later), and its power supply circuit (not shown) is located near the rear side 202 of the substrate 2. Therefore, the second electronic component C2 located on the rear side 202 of the substrate 2 is a power supply component such as a voltage regulator module (VRM), although it is not limited to the following.

[0033] Furthermore, the first electronic component C1 provided on the front side 201 of the substrate 2 can be any electronic component. For example, it may be, but is not limited to, a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a graphics processing unit (GPU), a central processing unit (CPU), a tensor processing unit (TPU), or a network processing unit (NPU).

[0034] Furthermore, in the embodiment shown in Figure 1A, the first electronic component C1 and the second electronic component C2 are directly mounted to the front side 201 and the back side 202 of the substrate 2 by surface-mount soldering technology (SMT).

[0035] Furthermore, as shown in Figure 1A, in this embodiment, the first cooling component 3 and the second cooling component 4 may be water-cooled plates 31 and 41, respectively, that can be connected to Cooling Distribution Units (not shown). Then, fluid is forcibly circulated to these water-cooled plates 31 and 41 via the Cooling Distribution Units, and the temperatures of the first cooling component 3 and the second cooling component 4 are adjusted.

[0036] From the above, it can be seen that in this embodiment, the first cooling component 3 can exchange heat with the first electronic component C1, the second cooling component 4 can exchange heat with the second electronic component C2, and the cooling fluid in the first cooling component 3 and the second cooling component 4 can flow continuously and forcibly.

[0037] This allows the heat generated by the first electronic component C1 and the second electronic component C2 to be removed, thereby maintaining or even lowering the temperature of the first electronic component C1 and the second electronic component C2, and thus keeping the entire rear power supply system in good working order.

[0038] Next, we will explain with reference to Figures 1A and 3. Here, Figure 3 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0039] In this embodiment, the first cooling component 3 and the second cooling component 4 are fixed to the substrate 2. More specifically, the cooling module may further include a plurality of fasteners 5, for example, four fasteners 5 as shown in Figure 1. The fasteners 5 are preferably made of a metal with high thermal conductivity, such as copper.

[0040] Furthermore, as shown in Figure 3, the first cooling component 3 has multiple through holes 51, for example, four through holes 51. The second cooling component 4 also has a corresponding number of perforations 52, and the substrate 2 also has a corresponding number of through holes 211. Fixing devices 5 are inserted into the perforations 52, through holes 211, and through holes 51, respectively.

[0041] As shown in Figures 1A and 3, the cooling module may further include multiple locking devices 55, the number of which can correspond to the number of fasteners 5, for example, four.

[0042] In this embodiment, the locking device 55 may be an independent component such as a nut. Alternatively, the locking device 55 may be a threaded hole formed in the first cooling component 3 or the second cooling component 4.

[0043] Furthermore, one end of each fixing device 5 can be screwed to the locking device 55 by passing through the perforation 52, through hole 211, and through hole 51 in that order. In this way, the first cooling component 3 and the second cooling component 4 can be securely attached to the corresponding front side 201 and back side 202 surfaces of the substrate 2, thereby allowing the first electronic component C1 and the second electronic component C2 to make stable contact, enabling heat exchange and heat dissipation.

[0044] Furthermore, in this embodiment, in order to ensure the integrity of contact between the two contact interfaces, a thermal interface material (not shown) may be additionally provided not only between the first electronic component C1 and the first cooling component 3, but also between the second electronic component C2 and the second cooling component 4.

[0045] Furthermore, as shown in Figure 3, each fastener 5 can be provided with a (compression) spring 56. For example, a buffer function can be provided between the substrate 2 and the first cooling component 3, preventing excessive force from being applied to the fastener 5 when locked, thus preventing damage to the first electronic component C1 or the substrate 2.

[0046] In this embodiment, the cooling module may further include a support pad 6 located on the same side of the substrate 2 as the second electronic component C2.

[0047] The support pad 6 can be made of a hard, non-conductive material such as bakelite, and its main purpose is to improve the strength of the substrate 2 and reduce the stress on the second electronic component C2.

[0048] Next, we will explain with reference to Figure 4. Here, Figure 4 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. Figure 4 also shows a fixing method for the first cooling component 3 and the second cooling component 4, which differs from the embodiment shown in Figure 3.

[0049] In this embodiment, the cooling module includes a plurality of first fasteners 53 and a plurality of second fasteners 54, for example, four of each (however, those located towards the back in the depth direction in Figure 4 are not shown due to their angle. The same applies to the first perforations 521 and second perforations 522 described later). Furthermore, the first cooling component 3 is provided with four through holes 51, the second cooling component 4 has four first perforations 521 and four second perforations 522, and the substrate 2 has eight through holes 211. Here, the second perforations 522 described above are formed inside the second cooling component compared to the first perforations 521.

[0050] Of these, the four first fasteners 53 each pass through the four through holes 51, the four through holes 211, and the four first perforations 521, respectively. The four second fasteners 54 each pass through the four second perforations 522 and the four through holes 211.

[0051] Therefore, in the embodiment shown in Figure 4, the second cooling component 4 can be more firmly connected to the substrate 2 via a plurality of first fasteners 53 and second fasteners 54.

[0052] Furthermore, the first fixing device 53 and the second fixing device 54 may be columns made of copper, which has excellent thermal conductivity. This allows at least a portion of the heat on the substrate 2 to be transferred to the first cooling component 3 and the second cooling component 4.

[0053] In other words, the first cooling component 3 and the second cooling component 4 can not only dissipate heat from the first electronic component C1 and the second electronic component C2, but also control the temperature of the substrate 2.

[0054] Next, embodiments of the present invention will be described with reference to Figure 1B. Here, Figure 1B is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0055] In the embodiment shown in Figure 1B, a heat dissipation fin 42 can also be used for the second cooling component 4 provided on the second electronic component C2. This can be applied to electronic components with relatively low thermal design power (TDP).

[0056] Furthermore, the heat dissipation fins 42 may be provided for each second electronic component C2, or a pair of heat dissipation fins 42 may be shared by multiple second electronic components located close together.

[0057] Next, embodiments of the present invention will be described with reference to Figure 1C. Here, Figure 1C is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0058] The second cooling component 4, which is placed on the second electronic component C2, may include a plurality of heat dissipation fins 42 and a plurality of heat pipes 43.

[0059] In the embodiment shown in Figure 1C, two pairs of heat dissipation fins 42 correspond to a second electronic component C2 arranged in two rows spaced apart along the short direction perpendicular to the longitudinal direction of the substrate 2, and a plurality of heat pipes 43 are connected between the two heat dissipation fins 42 located closer to the center in the longitudinal direction of the substrate 2.

[0060] In other embodiments, a vapor chamber (not shown) may be used instead of the heat pipe 43, or even both the heat pipe 43 and the vapor chamber may be used as thermal conductive components.

[0061] Thus, due to the properties of the heat pipe 43, which can conduct heat quickly, the uniformity of the temperature of the multiple heat dissipation fins 42 can be maintained, and the second electronic component C2, which has different heat dissipation design capabilities, can be adjusted to maintain better overall heat dissipation efficiency.

[0062] Next, embodiments of the present invention will be described with reference to Figure 1D. Here, Figure 1D is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. In this embodiment, the second cooling component 4 may include a plurality of heat dissipation fins 42 and a plurality of thermally conductive sheets 44.

[0063] However, the thermally conductive sheet 44 is generally formed of silicon combined with thermally conductive powders that can achieve better thermal conductivity, insulation, compressibility, etc.

[0064] In the embodiment shown in Figure 1D, each heat dissipation fin 42 is provided with a thermal conductive sheet 44, and the thermal conductive sheet 44 is interposed between the heat dissipation fin 42 and the second electronic component C2.

[0065] The thermally conductive sheet 44 is a type of thermal interface material (TIM) and is used to fill the thermal interface gap formed between the upper surface of the heat dissipation fin 42 and the lower surface of the second electronic component C2 during the heat conduction process. This reduces contact thermal resistance and improves heat transfer efficiency.

[0066] Next, we will explain with reference to Figures 2A to 2D. Figures 2A to 2D are exploded perspective views of the cooling module used in the rear power supply system according to an embodiment of the present invention.

[0067] To explain further, the differences between the embodiments shown in Figures 2A to 2D and those shown in Figures 1A to 1D are as follows. Specifically, in Figures 2A to 2D, a socket 9 for housing the first electronic component C1 is provided on the front side 201 of the substrate 2, which is different from the embodiments in Figures 1A to 1D.

[0068] In this embodiment, the socket 9 may be an electronic component fixing device that integrates an independent loading mechanism (ILM) and a socket. The fastener is generally made of metal and is characterized by its high strength and durability. This allows for a better fixing effect between the first cooling component 3 and the second cooling component 4.

[0069] To further explain, in the embodiment shown in Figure 2A, the first cooling component 3 and the second cooling component 4 are water cooling plates 31 and 41, respectively.

[0070] In the embodiment shown in Figure 2B, the first cooling component 3 can be a water cooling plate 31, and the second cooling component 4 can be a heat dissipation fin 42.

[0071] In the embodiment shown in Figure 2C, the first cooling component 3 is similarly a water-cooled plate 31, and the second cooling component 4 may include heat dissipation fins 42 and heat pipes 43.

[0072] In the embodiment shown in Figure 2D, the first cooling component 3 is similarly a water-cooled plate 31, and the second cooling component 4 may include a heat dissipation fin 42 and a thermally conductive sheet 44.

[0073] Furthermore, in this embodiment, the socket 9 includes a metal fastener, and the fixing device 5 also uses a column made of copper; therefore, both the metal fastener and the copper column have excellent thermal conductivity properties.

[0074] Therefore, when the temperature of the substrate 2 rises, the metal fasteners and the copper columns can adequately transfer heat from the substrate 2 to the first cooling component 3 and the second cooling component 4. This heat is then dissipated through the first cooling component 3 and the second cooling component 4, thereby lowering the temperature of the substrate 2.

[0075] Next, we will explain with reference to Figure 5. Here, Figure 5 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0076] In the embodiment shown in Figure 5, the substrate 2 includes a chip carrier 22 and a main circuit board 23, and the chip carrier 22 may further include an interposer substrate 221 and a package substrate 222.

[0077] The first electronic component C1 is located on the front side 201 of the interposer substrate 221, and the second electronic component C2 is located on the back side 202 of the interposer substrate 221.

[0078] Furthermore, the first cooling component 3 is located on the first electronic component C1, specifically on the side opposite to the interposer substrate 221. The second cooling component 4 is located on the second electronic component C2. The second electronic component C2 is located on the side of the interposer substrate 221 opposite to the side on which the first electronic component C1 is located.

[0079] In this embodiment, the first electronic component C1 may be a field-programmable gate array, an application-specific integrated circuit, a graphics processing unit, a central processing unit, a tensor processing unit, or a network processing unit, and the second electronic component C2 may include an integrated voltage regulator.

[0080] As shown in Figure 5, the interposer substrate 221 is electrically connected to the main circuit board 23 via the package substrate 222.

[0081] In this embodiment, a socket 9 is provided on the main circuit board 23, and the entire chip carrier 22 is housed within the socket 9. The package board 222 is electrically connected to the main circuit board 23 via a land grid array (LGA) (not shown) within the socket 9.

[0082] In other embodiments, the package substrate 222 can also be electrically connected to the main circuit board 23 via a pin grid array (PGA) package or a ball grid array (BGA) package.

[0083] Furthermore, the main circuit board 23 includes an opening groove 231, and the socket 9 includes a through groove 91. Since the second cooling component 4 corresponds to the opening groove 231 and the through groove 91, the second cooling component 4 can be housed inside the opening groove 231 and the through groove 91.

[0084] On the other hand, the second cooling component 4 can extend to the outside of the main circuit board 23 via the opening groove 231 and the through groove 91. For example, the second cooling component 4 may take the form of a heat pipe, a vapor chamber, or a heat conductive sheet combined with a heat dissipation fin or water cooling plate (none of which are shown).

[0085] Here, the heat sink fins and water cooling plate are arranged on or around the main circuit board 23, with one end of the heat pipe, vapor chamber, or thermal conductive sheet being able to contact the second electronic component C2, and the other end being able to connect to the heat sink fins and water cooling plate.

[0086] Next, we will explain with reference to Figure 6. Here, Figure 6 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0087] In the embodiment shown in Figure 6, the substrate 2 includes a chip carrier 22 and a main circuit board 23. The chip carrier 22 further includes an interposer substrate 221 and a package substrate 222.

[0088] Here, the first electronic component C1 and the second electronic component C2 are each provided on two opposing sides of the chip carrier 22.

[0089] To explain further, the first electronic component C1 is located on the front side of the interposer substrate 221, and the second electronic component C2 is located on the back side of the package substrate 222.

[0090] Furthermore, the interposer substrate 221 is electrically connected to the main circuit board 23 via the package substrate 222.

[0091] Furthermore, in the embodiment shown in Figure 6, the chip carrier 22 is electrically connected to the main circuit board 23 via a mezzanine connector 8. In this way, the chip carrier 22 and the main circuit board 23 are separated by a predetermined distance D.

[0092] In other embodiments, the chip carrier 22 may be electrically connected to the main circuit board 23 in other ways, and the chip carrier 22 and the main circuit board 23 may be separated by a predetermined distance D by other means such as insulating support pillars.

[0093] In this embodiment, the second electronic component C2 and the second cooling component 4 can be accommodated using this predetermined distance D.

[0094] As described above, embodiments of the present invention have been explained, but these embodiments are not intended to limit the present invention. Furthermore, those skilled in the art may modify or change the present invention without departing from the spirit and scope of the invention, but the technical scope of the present invention is defined by the claims. [Explanation of Symbols]

[0095] 2 circuit boards 3. First cooling component 4. Second cooling component 5 Fixtures 6 support pads 8 Mezzanine Connectors 9 sockets 21 Printed circuit boards 22 Chip carriers 23 Main circuit board 31, 41 Water cooling plate 42 heat dissipation fins 43 Heat pipes 44 Thermally conductive sheets 51 Through hole 52 perforation 53 First fastener 54 Second fastening device 55 locking tools 56 springs 91 Through groove 201 Front view 202 Rear side 211 Through hole 221 Interposer substrate 222 Package Substrates 231 Opening groove 521 First perforation 522 Second perforation C1 First electronic component C2 Second electronic component D predetermined distance

Claims

1. In a cooling module for a rear power supply system, The rear power supply system includes a circuit board and electronic components, the electronic components being provided on the rear side of the circuit board. The cooling module includes at least one cooling component provided on the electronic component, The aforementioned electronic component includes a power supply component. A cooling module for a rear power supply system, characterized by the following features.

2. In a cooling module for a rear power supply system, The rear power supply system includes a circuit board and a plurality of electronic components, the plurality of electronic components being provided on the front and rear sides of the circuit board, respectively. The cooling module includes a plurality of cooling components, the plurality of cooling components being fixed to the front and rear sides of the substrate, respectively, and being provided on the plurality of electronic components, The plurality of electronic components provided on the back side of the substrate include a power supply component. A cooling module for a rear power supply system, characterized by the following features.

3. In a cooling module for a rear power supply system, The rear power supply system includes a circuit board and a plurality of electronic components, the plurality of electronic components being provided on the front and rear sides of the circuit board, and the circuit board includes a plurality of through holes. The cooling module includes a first cooling component, a second cooling component, and a plurality of fasteners. The first cooling component and the second cooling component are provided on the plurality of electronic components, the first cooling component includes a plurality of through holes, and the second cooling component includes a plurality of perforations. The plurality of fasteners penetrate the plurality of perforations in the second cooling component, the plurality of through holes in the substrate, and the plurality of through holes in the first cooling component, respectively. The first cooling component and the second cooling component are fixed to the front and rear sides of the substrate, respectively. The plurality of electronic components provided on the back side of the substrate include a power supply component. A cooling module for a rear power supply system, characterized by the following features.

4. In a cooling module for a rear power supply system, The aforementioned rear power supply system comprises a circuit board and at least one electronic component. The cooling module comprises at least one cooling component, and the at least one cooling component is provided on the at least one electronic component. The aforementioned substrate includes a socket, a chip carrier, and a main circuit board. The socket is provided on the main circuit board, the chip carrier is housed in the socket, and the at least one electronic component includes an integrated voltage regulator and is provided on the back side of the chip carrier. The main circuit board includes an opening groove, the socket includes a through groove, and the at least one cooling component corresponds to the through groove and the opening groove. A cooling module for a rear power supply system, characterized by the following features.

5. In a cooling module for a rear power supply system, The aforementioned rear power supply system includes a circuit board and at least one electronic component. The cooling module includes at least one cooling component, the at least one cooling component is provided on the at least one electronic component, The aforementioned substrate includes a main circuit board, an interposer board, a mezzanine connector, and a package board. The interposer substrate is provided on the front side of the package substrate, and the at least one electronic component is provided on the back side of the package substrate. The mezzanine connector is provided between the rear side of the package substrate and the main circuit board, and electrically connects the package substrate to the main circuit board. A cooling module for a rear power supply system, characterized by the following features.

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