A teaching device and teaching method for teaching the operation of a laser processing machine, and a device and method for generating an interference confirmation program.

Abstract

To address the conventional need for a technique to effectively verify the interference between a laser beam emitted by a laser processing machine and an object (e.g., jig) present in a work cell.SOLUTION: A device 90 which generates an interference confirmation program to cause a laser processing machine 12 to execute an interference confirmation operation to confirm the interference between a laser beam and an environmental object in advance, includes: an input reception unit 84 which accepts input of operational parameters for the interference confirmation operation; an operation speed setting unit 86 which sets the operation speed of the laser processing machine 12 in the interference confirmation operation to be lower than the speed of the laser processing operation on the basis of the operational parameters accepted by the input reception unit 84; and a program generation unit 88 which generates an interference confirmation program that prescribes a command of operating the laser processing machine 12 at the operation speed set by the operation speed setting unit 86 to emit the laser beam with different optical properties from the laser processing operation to a processing target spot in the interference confirmation operation.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] This disclosure relates to a teaching device and teaching method for teaching the operation of a laser processing machine, and to a device and method for generating an interference detection program. [Background technology]

[0002] A teaching device for teaching the operation of a laser processing machine is known (for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-35404 [Overview of the project] [Problems that the invention aims to solve]

[0004] Conventionally, there has been a need for technology to effectively verify the interference between the laser beam emitted by a laser processing machine and an object (e.g., a jig) present in the work cell. [Means for solving the problem]

[0005] In one embodiment of the present disclosure, a teaching device for teaching the operation of a laser processing machine that laser processes an object includes: a model data acquisition unit that acquires an object model that models the object; an input receiving unit that receives input of interference detection conditions for detecting interference between a virtual laser beam and the object model in a virtual laser processing operation in which a virtual laser beam is simulated to irradiate processing locations set in the object model; and an interference detection unit that detects interference occurring in the virtual laser processing operation based on the interference detection conditions received by the input receiving unit, wherein the interference detection conditions include the beam size of the virtual laser beam or an invalid region set for the object model to disable interference detection.

[0006] In another aspect of the present disclosure, a method for teaching the operation of a laser processing machine for laser processing an object includes a processor that acquires model data of an object model, accepts input of interference detection conditions for detecting interference between a virtual laser beam and the object model in a virtual laser processing operation in which a virtual laser beam is simulated to irradiate processing locations set in the object model, and detects interference occurring in the virtual laser processing operation based on the accepted interference detection conditions, the interference detection conditions include the beam size of the virtual laser beam or an invalid region set in the object model to disable interference detection.

[0007] In yet another embodiment of the present disclosure, a device that generates an interference confirmation program to cause a laser processing machine, which performs a laser processing operation to laser process a set processing location on a workpiece, to perform an interference confirmation operation in advance to check for interference between laser light and environmental objects, comprises: an input receiving unit that receives input of operation parameters for the interference confirmation operation; an operation speed setting unit that sets the operating speed of the laser processing machine in the interference confirmation operation to a speed lower than that of the laser processing operation based on the operation parameters received by the input receiving unit; and a program generating unit that generates an interference confirmation program that specifies a command to operate the laser processing machine at the operating speed set by the operation speed setting unit in the interference confirmation operation and to irradiate the processing location with laser light having different optical characteristics from that of the laser processing operation.

[0008] In yet another embodiment of this disclosure, a method for generating an interference confirmation program that causes a laser processing machine, which performs a laser processing operation to laser process a set processing area on a workpiece, to perform an interference confirmation operation in advance to check for interference between the laser beam and environmental objects, is to generate an interference confirmation program in which a processor receives input of operating parameters for the interference confirmation operation, determines the operating speed of the laser processing machine in the interference confirmation operation to be lower than that of the laser processing operation based on the received operating parameters, and specifies a command to operate the laser processing machine at the determined operating speed in the interference confirmation operation and irradiate the processing area with laser beam having different optical properties than that of the laser processing operation. [Effects of the Invention]

[0009] This disclosure makes it possible to effectively verify potential interference between laser light and objects. [Brief explanation of the drawing]

[0010] [Figure 1] This is a diagram of a laser processing system according to one embodiment. [Figure 2] Figure 1 is a block diagram of the laser processing system shown. [Figure 3] Figure 1 shows an example of a laser irradiation device. [Figure 4] An example of a moving mechanism is shown in Figure 1. [Figure 5] Figure 1 shows an example of a virtual space generated by the teaching device. [Figure 6] An example of a machining location set in a work model is shown. [Figure 7] Figure 6 shows an example of a processing path set for the processing location. [Figure 8] An example of input image data for entering interference detection conditions is shown. [Figure 9] This block diagram shows other functions of the laser processing system. [Figure 10] This illustrates the movement of the moving mechanism during laser scanning of a single processing area in a laser processing operation. [Figure 11] An example of input image data for inputting the operating parameters of the interference detection operation is shown. [Figure 12] This flowchart shows an example of the interference detection process. [Figure 13] This is a flowchart showing an example of the flow of step S2 in Figure 12. [Figure 14] This is a block diagram of a laser processing system according to another embodiment. [Modes for carrying out the invention]

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the various embodiments described below, the same elements will be denoted by the same reference numerals, and redundant descriptions will be omitted. First, a laser processing system 10 according to one embodiment will be described with reference to Figures 1 to 3. The laser processing system 10 comprises a laser processing machine 12, a control device 14, and a teaching device 50.

[0012] The laser processing machine 12, under the command of the control device 14, irradiates the processing area PL set on the workpiece 102 with laser light LB and performs laser processing (laser welding, laser cutting, etc.) on the processing area PL using the laser light LB. Specifically, the laser processing machine 12 is equipped with a laser oscillator 16, a laser irradiation device 18, and a moving mechanism 20.

[0013] The laser oscillator 16 is a solid-state laser oscillator (e.g., a YAG laser oscillator or a fiber laser oscillator) or a gas laser oscillator (e.g., a carbon dioxide laser oscillator), and in response to a command from the control device 14, it generates laser light LB internally by optical resonance and supplies the laser light LB to the laser irradiation device 18 through the light guide member 22. The light guide member 22 has at least one of the following: an optical fiber, a light guide path made of a hollow or transparent material, a reflector, and an optical lens, and guides the laser light LB to the laser irradiation device 18.

[0014] The laser irradiation device 18 is a laser scanner (galvanometer scanner) or a laser processing head having a nozzle that emits laser light and assist gas, which focuses the laser light LB supplied from the laser oscillator 16 and irradiates the workpiece 102. Figure 3 schematically shows the configuration of the laser irradiation device 18 as a laser scanner. The laser irradiation device 18 shown in Figure 3 has a housing 24, a light receiving unit 26, mirrors 28 and 30, mirror driving units 32 and 34, an optical lens 36, a lens driving unit 38, and a laser light emitting unit 40.

[0015] The housing 24 is hollow and defines a propagation path for the laser beam LB inside it. The light receiving unit 26 is provided in the housing 24 and receives the laser beam LB that has propagated through the light guide member 22. The mirror 28 is provided inside the housing 24 so as to be rotatable around the axis A1. The mirror 28 reflects the laser beam LB that has entered the inside of the housing 24 through the light receiving unit 26 toward the mirror 30. The mirror driving device 32 is, for example, a servo motor and rotates the mirror 28 around the axis A1 in response to a command from the control device 14.

[0016] Meanwhile, the mirror 30 is installed inside the housing 24 so as to be rotatable around axis A2. Axis A2 may be approximately perpendicular to axis A1. The mirror 30 reflects the laser light LB reflected by the mirror 28 toward the optical lens 36. The mirror drive device 34 is, for example, a servo motor, which rotates the mirror 30 around axis A2 in response to a command from the control device 14. Generally, the mirrors 28 and 30 are sometimes referred to as galvanometer mirrors, and the mirror drive devices 32 and 34 are sometimes referred to as galvanometer motors.

[0017] The optical lens 36 has a focusing lens or the like and focuses the laser beam LB. In this embodiment, the optical lens 36 is supported inside the housing 24 so that it can move in the direction of the optical axis O of the incident laser beam LB. The lens driving device 38 has a piezoelectric element, an ultrasonic transducer, or an ultrasonic motor or the like and displaces the optical lens 36 in the direction of the optical axis O in response to a command from the control device 14, thereby displacing the focal point FP of the laser beam LB irradiated onto the workpiece 102 in the direction of the optical axis O. The laser beam emission unit 40 emits the laser beam LB focused by the optical lens 36 to the outside of the housing 24.

[0018] Referring again to Figures 1 and 2, the moving mechanism 20 has, for example, a servo motor and moves the laser irradiation device 18 relative to the workpiece 102. For example, the moving mechanism 20 is an articulated robot capable of moving the laser irradiation device 18 to any position in the moving mechanism coordinate system C1. Alternatively, the moving mechanism 20 may have multiple ball screw mechanisms that move the laser irradiation device 18 along the xy plane of the moving mechanism coordinate system C1 and also move it in the z-axis direction of the moving mechanism coordinate system C1.

[0019] The moving mechanism coordinate system C1 is a coordinate system for automatically controlling the movement of the moving mechanism 20, and is set for the moving mechanism 20. On the other hand, the laser irradiation device 18 is set to the tool coordinate system C2. The tool coordinate system C2 is a coordinate system that defines the position of the laser irradiation device 18 in the moving mechanism coordinate system C1. In this paper, "position" may refer to both position and orientation.

[0020] In this embodiment, the tool coordinate system C2 is set relative to the laser irradiation device 18 such that its origin is located at the center of the laser light emission section of the laser irradiation device 18 (in the example shown in Figure 3, the laser light emission section 40), and its z-axis is parallel to (for example, coincides with) the optical axis O of the laser light LB emitted from the laser light emission section.

[0021] Figure 4 schematically shows the configuration of the mobile mechanism 20 as a vertical articulated robot. The mobile mechanism 20 shown in Figure 4 has a robot base 42, a swivel torso 44, a forearm 46, an upper arm 48, and a wrist 49. The robot base 42 is fixed on the floor of the work cell. The swivel torso 44 is provided on the robot base 42 so as to be able to swivel around a vertical axis. The forearm 46 is provided on the swivel torso 44 so as to be able to rotat around a horizontal axis, and the upper arm 48 is provided on the tip of the forearm 46 so as to be able to rotatably. The wrist 49 is provided on the tip of the upper arm 48 so as to be able to rotat around two mutually orthogonal axes.

[0022] Each component of the mobile mechanism 20 (robot base 42, swivel torso 44, forearm 46, upper arm 48, and wrist 49) is provided with a servo motor (not shown), and the servo motor rotates each movable component of the mobile mechanism 20 (swivel torso 44, forearm 46, upper arm 48, and wrist 49) around its drive axis in response to commands from the control device 14.

[0023] For the moving mechanism 20 shown in Figure 4, the moving mechanism coordinate system C1 is set such that its origin is located at the center of the robot base 42 and its z-axis coincides with the rotation axis of the rotating body 44. When the operation of the moving mechanism 20 positions the laser irradiation device 18 at an arbitrary target position in the moving mechanism coordinate system C1, the control device 14 first sets the tool coordinate system C2 in the moving mechanism coordinate system C1. Then, the control device 14 operates the moving mechanism 20 to position the laser irradiation device 18 at the position represented by the set tool coordinate system C2.

[0024] In this way, the control device 14 can position the laser irradiation device 18 at any target position in the moving mechanism coordinate system C1 by the operation of the moving mechanism 20. For convenience, in the following description, the x-axis positive direction of the moving mechanism coordinate system C1 may be referred to as the right, the y-axis positive direction as the forward direction, and the z-axis positive direction as the upward direction.

[0025] The control device 14 controls the operation of the laser processing machine 12. Specifically, the control device 14 is a computer having a processor (CPU, GPU, etc.) and memory (ROM, RAM, etc.). The control device 14 controls the laser light generation operation by the laser oscillator 16. In addition, the control device 14 changes the orientation of the mirrors 28 and 30 by operating the mirror drive devices 32 and 34 of the laser irradiation device 18, thereby allowing the laser light LB irradiated onto the workpiece 102 to move at high speed relative to the workpiece 102.

[0026] Furthermore, the control device 14 displaces the optical lens 36 by operating the lens drive device 38 of the laser irradiation device 18, thereby moving the focal point FP of the laser beam LB emitted from the laser beam emission unit 40 in the direction of the optical axis O. In addition, the control device 14 moves the laser irradiation device 18 relative to the workpiece 102 by operating the moving mechanism 20.

[0027] The teaching device 50 is for teaching the operation of the laser processing machine 12. As shown in Figure 2, the teaching device 50 is a computer having a processor 52, memory 54, and I / O interface 56. The teaching device 50 may be any type of computer, such as a desktop or tablet PC, a teaching control panel, or a teaching pendant.

[0028] The processor 52 has a CPU or GPU, and is communicated via bus 58 to the memory 54 and I / O interface 56. The processor 52 performs arithmetic processing to realize the teaching function described later while communicating with the memory 54 and I / O interface 56.

[0029] Memory 54 has RAM or ROM, and temporarily or permanently stores various data used in the arithmetic processing for the teaching function executed by processor 52, as well as various data generated during said arithmetic processing. I / O interface 56 has, for example, an Ethernet® port, a USB port, an optical fiber connector, or an HDMI® terminal, and communicates data with external devices via wired or wireless connection under the command of processor 52.

[0030] The teaching device 50 is equipped with an input device 60 and a display device 62. The input device 60 has a keyboard, mouse, or touch panel, etc., and receives data input from the operator. The display device 62 has a liquid crystal display or organic EL display, etc., and displays various data.

[0031] The input device 60 and the display device 62 are connected to the I / O interface 56 via wired or wireless communication. The input device 60 and the display device 62 may be provided separately from the housing of the teaching device 50, or they may be integrated into the housing of the teaching device 50.

[0032] The processor 52 is configured to send commands to each servo motor of the moving mechanism 20 via the control device 14 in response to input data to the input device 60, and to make the moving mechanism 20 perform a jog operation according to the commands. The operator controls the moving mechanism 20 via the control device 14 by operating the input device 60 and teaches the laser processing operation LPO of the laser processing machine 12.

[0033] Here, the work cell contains various objects 100, including the workpiece 102 described above and environmental objects 104 arranged around the workpiece 102. The environmental objects 104 include, for example, jigs for setting the workpiece 102 in the work cell, structures such as pillars placed in the work cell, and peripheral equipment arranged around the workpiece 102.

[0034] When the control device 14 operates the laser processing machine 12 to perform a laser processing operation LPO to laser process the processing area PL of the workpiece 102, it is necessary to avoid interference between the laser beam LB emitted from the laser irradiation device 18 and the surrounding objects 104. The teaching device 50 teaches the laser processing operation LPO of the laser processing machine 12 while taking into consideration such interference between the laser beam LB and the surrounding objects S.

[0035] The following describes how to teach the laser processing operation LPO using the teaching device 50. First, the operator prepares drawing data for the laser processing machine model 12M, which models the laser processing machine 12, and drawing data for the object model 100M, which models the object 100. The drawing data for the laser processing machine model 12M and the object model 100M are, for example, 3D CAD data.

[0036] In the following explanation, if the name of a component in real space is "XX", the model of that component will be referred to as the "XX model". Therefore, the laser processing machine model 12M includes a laser oscillator model 16M that models the laser oscillator 16, a laser irradiation device model 18M that models the laser irradiation device 18, and a mobile mechanism model 20M that models the mobile mechanism 20 (in the example shown in Figure 3, this includes a robot base model 42M, a rotating torso model 44M, a forearm model 46M, an upper arm model 48M, and a wrist model 49M). The object model 100M also includes a workpiece model 102M that models the workpiece 102, and an environmental object model 104M that models the environmental object 104.

[0037] For example, the operator may use a design support system (CAD / CAM system), which is a computer separate from the teaching device 50, to create a laser processing machine model 12M and an object model 100M, and then download the drawing data of the laser processing machine model 12M and the object model 100M to the teaching device 50 via the I / O interface 56.

[0038] As another example, the functions of the design support device may be implemented in the teaching device 50 as software, for example, and the operator may create the laser processing machine model 12M and the object model 100M in the teaching device 50 by operating the input device 60 while viewing the display device 62 provided in the teaching device 50.

[0039] The processor 52 acquires the drawing data of the downloaded or created laser processing machine model 12M and the object model 100M, and stores it in the memory 54 of the teaching device 50. Thus, in this embodiment, the processor 52 functions as a model data acquisition unit 64 (Figure 2) that acquires the laser processing machine model 12M and the object model 100M.

[0040] When the operator operates the input device 60 to input a teaching start command CMt, the processor 52 reads the laser processing machine model 12M and the object model 100M from the memory 54 and places them in the virtual space VS. The processor 52 may also place only the laser irradiation device model 18M and the movement mechanism model 20M from the laser processing machine model 12M into the virtual space VS.

[0041] Figure 5 shows an example of a virtual space VS in which the moving mechanism model 20M of the moving mechanism 20 shown in Figure 4, the laser irradiation device model 18M, and the object model 100M are arranged. In this embodiment, the workpiece model 102M has a plurality of surface models 106M, 108M, and 110M that are connected to each other.

[0042] The processor 52 sets the coordinate system C1 for the mobile mechanism model 20M and the laser irradiation device model 18M, which are placed in the virtual space VS, in the positional relationship shown in Figure 4, and the tool coordinate system C2. The processor 52 generates image data of the constructed virtual space VS and displays it on the display device 62.

[0043] Furthermore, processor 52 processes the machining location PL set in work model 102M. n Location data PD n Obtain the machining location PL in Figure 6. n An example is shown below. In the example shown in Figure 6, machining locations PL1 and PL2 are set in the surface model 106M of the workpiece model 102M, machining locations PL3 and PL4 are set in the surface model 108M, and machining locations PL5 and PL6 are set in the surface model 110M.

[0044] These multiple processing locations PL nFor each of (n=1 to 6), a machining path PT of a predetermined shape is set. FIG. 7 shows an example of the machining path PT. In the example shown in FIG. 7, the machining path PT is quadrangular and has a start point P1 and an end point P2. In an actual laser machining operation LPO, the laser machining machine 12 moves a laser beam LB emitted from a laser irradiation device 18 from the start point P1 to the end point P2 along the machining path PT in a clockwise direction (or a counterclockwise direction), thereby forming a machining portion PL n to be laser-machined. In the present specification, moving the laser beam LB once from the start point P1 to the end point P2 of the machining path PT is referred to as one "laser scan".

[0045] As an example, an operator operates the input device 60 to set the machining portion PL n (specifically, the machining path PT) in the moving mechanism coordinate system C1 as data in a format different from the drawing data of the workpiece model 102M (for example, a different format), whereby the machining portion PL n position data PD n is created.

[0046] Alternatively, the operator may use a design support device (CAD / CAM device), which is a computer different from the teaching device 50, to create a workpiece model 102M and set the machining portion PL n in the workpiece model 102M, whereby the position data PD n of the machining portion PL n may be created as data in the same format (or a different format) as that of the workpiece model 102M. The processor 52 acquires, as coordinates of the moving mechanism coordinate system C1, the position data PD n (of the machining path PT) of each machining portion PL n set in the moving mechanism coordinate system C1.

[0047] Next, the processor 52 processes the machining portion PL set in the workpiece model 102M in the virtual space VS nIt accepts input of operating parameters PRv for executing a virtual laser processing operation VLP (i.e., a simulation of the laser processing operation LPO) which simulates irradiating a virtual laser beam LBv onto the target.

[0048] The operating parameter PRv is, for example, the PL for each processing location in the virtual laser processing operation VLP. n The number of times the laser scans the set processing path PT is performed N v The time t is used to perform one laser scan of the processing path PT. v , scanning frequency f v (That is, the number of times the processing path PT is scanned with the laser per second), the scanning speed V at which the virtual laser beam LBv moves along the processing path PT. v Multiple processing locations n The order in which to laser scan OR v , and the movement speed U at which the moving mechanism model 20M moves the laser irradiation device model 18M. v It includes at least one of the following.

[0049] For example, the processor 52 generates input image data ID1 for inputting the operation parameter PRv and displays it on the display device 62. The operator, while viewing the input image data ID1 displayed on the display device 62, operates the input device 60 to input the operation parameter PRv (i.e., the number of times N). v , time t v , scanning frequency f v Scanning speed V v , order OR v or movement speed U v Enter ).

[0050] The processor 52 then processes the object model 100M (specifically, the workpiece model 102M and the environment object model 104M) and the laser processing machine model 12M (for example, the laser irradiation device model 18M and the movement mechanism model 20M) placed in the virtual space VS, and the position data PD mentioned above. n Based on the operating parameter PRv, the laser processing machine model 12M is simulated to operate in the virtual space VS, and the virtual laser beam LBv is directed to the processing location PL nA virtual laser processing operation (VLP) is generated to irradiate the target.

[0051] For example, the processor 52 sets the operating parameter PRv for each machining location PL n Regarding the number of times N v = 10, scanning speed V v =100 [mm / sec], and the order of machining points PL1→PL2→PL3→PL4→PL5→PL6 OR v Assume that the input has been received. In this case, the processor 52 generates a virtual laser processing operation VLP so as to simulate a series of operations in the virtual space VS as follows.

[0052] Specifically, the processor 52 simulates the operation of the moving mechanism model 20M in the virtual space VS, moving the laser irradiation device model 18M to the right along a predetermined movement path MPv in the moving mechanism coordinate system C1, and also simulates the operation of the laser irradiation device model 18M, sending virtual laser light LBv from the laser irradiation device model 18M in the order of processing locations PL1→PL2→PL3→PL4→PL5→PL6 OR v Then, we simulate the irradiation.

[0053] At this time, the processor 52 processes each machining area PL n In this process, the virtual laser beam LBv from the laser irradiation device model 18M is scanned along the processing path PT at a scanning speed V v Move at =100 [mm / sec] and each machining point PL n The number of times N v = Perform laser scanning only 10 times.

[0054] The processor 52 generates a virtual laser processing operation (VLP) including such a series of operations, using an object model 100M, a laser processing machine model 12M, and position data PD. n It is automatically generated based on the operating parameter PRv. More specifically, the processor 52 automatically determines the travel path MPv.

[0055] Note that the travel route MPv consists of multiple teaching points TP1, TP2, ...TPm (where m is a positive integer) is defined, and processor 52 controls the teaching point TP m The travel path MPv may be determined by automatically determining the travel path MPv (or teaching point TP). m ) is determined as the coordinates of the moving mechanism coordinate system C1.

[0056] Furthermore, the processor 52 processes each processing area PL in the virtual laser processing operation VLP. n The irradiation timing RTv (e.g., irradiation start time and irradiation end time) for irradiating the virtual laser beam LBv, and the direction in which the virtual laser beam LBv is emitted from the laser irradiation device model 18M at the irradiation timing RTv (or the irradiation position on the workpiece model 102M) are automatically determined.

[0057] Thus, in this embodiment, the processor 52 functions as an motion generation unit 66 (Figure 2) that generates a virtual laser processing operation VLP. The processor 52 may also display the generated virtual laser processing operation VLP as video image data on the display device 62. In this case, the operator can view the virtual laser processing operation VLP as a simulated video.

[0058] Furthermore, the processor 52 sets interference detection condition CD for detecting interference between the virtual laser beam LBv and the object model 100M in the virtual laser processing operation VLP. n Accepts input for interference detection condition CD. n For example, the beam size BS of a virtual laser beam LBv. n Alternatively, an invalid region IA to be set for object model 100M to disable interference detection. n Includes.

[0059] Processor 52 controls interference detection condition CD n The processor generates input image data ID2 for input and displays it on the display device 62. Thus, in this embodiment, the processor 52 functions as an image generation unit 68 (Figure 2) that generates input image data ID2. Figure 8 shows an example of input image data ID2.

[0060] The input image data ID2 is used to set interference detection condition CD for the operator. n A graphical user interface (GUI) for enabling input of processing location selection image area 110 and a condition setting image area 112. The processor 52 inputs position data PD to the processing location selection image area 110. n The processing location PL obtained n (n=1~6) are listed in list format.

[0061] Furthermore, a scroll bar image 114 is displayed in the processing area selection image region 110, and the operator can operate the input device 60 to slide the scroll bar image 114 up and down on the image to select the processing area PL to display. n The operator can change the multiple machining locations PL displayed in the machining location selection image area 110 by operating the input device 60. n Select one of them by clicking on it in the image. Note that the example shown in Figure 8 shows the state where the processing area PL2 is selected.

[0062] The condition setting image area 112 is the processing area PL selected in the processing area selection image area 110. n Regarding interference detection conditions CD n (Specifically, beam size BS) n and invalid area IA n This is for setting the beam size BS. Specifically, the condition setting image area 112 is for setting the beam size BS. n Numerical input image 116 for setting, and invalid area IA n Includes a numerical input image 118 for setting the parameters.

[0063] Numerical input image 116 shows the processing area PL selected in the processing area selection image area 110. n (In the example shown in Figure 8, the beam size BS of the virtual laser beam LBv irradiated onto the processing path PT of the processing area PL2) n This is for inputting the beam size BS. nFor example, the diameter (or radius) R of the virtual laser beam LBv. n (Unit: [mm]), or cross-sectional area E n (Unit: [mm] 2 It can be represented as ]). Figure 8 shows the beam size BS in numerical input image 116. n Diameter R n Enter [mm] as shown in the example.

[0064] The operator operates the input device 60 to input the beam size BS to the numerical input image 116. n The following can be input. For example, as shown in Figure 8, when the processing location PL2 is selected, if diameter R2 = 0.400 [mm] is input as the beam size BS2 in the numerical input image 116, the processor 52 will simulate irradiating the processing location PL2 with a cylindrical virtual laser beam LBv having a diameter R2 = 0.400 [mm] when executing the virtual laser processing operation VLP, and will laser scan the processing path PT.

[0065] On the other hand, the numerical input image 118 is the processing area PL selected in the processing area selection image area 110. n When irradiating with a virtual laser beam LBv, a predetermined distance d from the irradiation position on the work model 102M is used. n Within the range of invalid area IA n In order to set it as, the predetermined distance d n This is for inputting (unit: [mm]). The operator operates the input device 60 to input invalid area IA to the numerical input image 118. n The distance d that defines the point n You can enter it.

[0066] For example, as shown in Figure 8, when processing location PL2 is selected and a distance d2 = 1.000 [mm] is entered in the numerical input image 118, the processor 52 sets the area within a distance d2 = 1.000 [mm] from the irradiation position on the surface model 106M where processing location PL2 is set as the invalid area IA2 within the propagation area of ​​the virtual laser light LBv irradiated onto processing location PL2 by the virtual laser processing operation VLP. The processor 52 may also set the invalid area IA2 as a hemispherical area within a distance d2 = 1.000 [mm] from the irradiation position on the surface model 106M (i.e., a hemispherical area with radius d2 centered on the irradiation position).

[0067] In this case, depending on the format of the drawing data for the object model 100M, the processor 52 may not be able to distinguish between the work model 102M and the environment model 104M. In this case, the processor 52 recognizes the work model 102M and the environment model 104M as a single object model 100M, and when it executes the virtual laser processing operation VLP, it cannot determine whether the virtual laser beam LBv is interfering with the work model 102M or with the environment model 104M.

[0068] In such cases, the processing area PL is controlled by the virtual laser processing operation VLP. n When the virtual laser beam LBv is used for laser scanning, the virtual laser beam LBv and the work model 102M will interfere with each other computationally, and the processor 52 will detect this interference. According to this embodiment, as described above, the invalid area IA n By setting this for work model 102M, interference between the virtual laser beam LBv and work model 102M can be disabled and not detected.

[0069] As described above, the processor 52 processes multiple processing locations PL through the input image data ID 2. n Each, interference detection condition CD n (Specifically, beam size BS) n , and invalid area IA n The distance d that defines the point nrespectively accepts inputs of ). Therefore, in the present embodiment, the processor 52 stores the interference detection condition CD n functions as an input receiving unit 70 (FIG. 2) that receives an input of .

[0070] Thereafter, the operator operates the input device 60 to input a command CM1 for starting the virtual laser processing operation VLP. For example, the processor 52 may generate start button image data (not shown) for starting the virtual laser processing operation VLP and cause the display device 62 to display the same. When the processor 52 receives the command CM1 through the input device 60, the processor 52 executes the above-described virtual laser processing operation VLP in the virtual space VS.

[0071] While executing this virtual laser processing operation VLP, the processor 52 receives the interference detection condition CD received through the input image data ID2 n detects interference between the virtual laser beam LBv and the object model 100M on the basis of . Specifically, in the virtual laser processing operation VLP, the processor 52 performs processing on the processing location PL n with respect to the interference detection condition CD n the beam size BS set as n calculates a propagation region of the virtual laser beam LBv when the virtual laser beam LBv having the above is simulatedly irradiated, and detects whether there is interference between the virtual laser beam LBv and the object model 100M.

[0072] At this time, the interference detection condition CD n as the processing location PL n an invalid area IA for n is set, the processor 52 does not detect interference between the virtual laser beam LBv and the work model 102M, but detects interference between the virtual laser beam LBv and the environment object model 104M. As described above, in the present embodiment, the processor 52 detects the interference detection condition CD n functions as an interference detection unit 72 (FIG. 2) that detects interference between the virtual laser beam LBv and the object model 100M on the basis of .

[0073] When the processor 52 detects interference between the virtual laser beam LBv and the environmental object model 104M during the virtual laser processing operation VLP, it generates a notification signal NS to indicate this. This notification signal NS includes, for example, information indicating the location where the virtual laser beam LBv interfered with the environmental object model 104M (for example, image data that highlights the interference location on the environmental object model 104M).

[0074] When the operator recognizes, via the notification signal NS, that interference has occurred between the virtual laser beam LBv and the environmental object model 104M, the operator corrects the virtual laser processing motion VLP generated by the motion generation unit 66. Specifically, the operator operates the input device 60 to change the aforementioned movement path MPv (or teaching point TP) m ), movement speed U v Alternatively, a command CM2 is input to change parameters such as the irradiation timing RTv. In response to the command CM2, the processor 52 functions as an operation generation unit 66 and sets the configured movement path MPv (or teaching point TP). m ), movement speed U v Alternatively, the virtual laser processing operation (VLP) can be modified by changing parameters such as the irradiation timing (RTv).

[0075] In this way, the operator attempts a virtual laser processing operation VLP, and if interference occurs between the virtual laser beam LBv and the environmental object model 104M in the attempted virtual laser processing operation VLP, the operator repeats the process of correcting the virtual laser processing operation VLP. As a result, the processor 52 (operation generation unit 66) can generate a virtual laser processing operation VLP0 in which no interference occurs between the virtual laser beam LBv and the environmental object model 104M.

[0076] Next, the operator operates the input device 60 to input a command CM3 for generating a processing program PPG for the laser processing operation LPO that the laser processing machine 12 will perform in real space. At this time, the processor 52 may generate button image data (not shown) for generating the processing program PPG and display it on the display device 62.

[0077] When the processor 52 receives the command CM3 via the input device 60, it generates the machining program PPG based on the virtual laser machining operation VLP0 generated as described above. Specifically, the processor 52 defines the operation of the virtual laser machining operation VLP0, the machining location PL n position data PD n , movement path MPv (or teaching point TP m ), irradiation timing RTv, and operation parameters PRv (number of scanning passes N v , scanning time t v , scanning frequency f v , scanning speed V v , sequence OR v or movement speed U v ) are specified as commands CMv (e.g., codes), and automatically generates the machining program PPG. As described above, in the present embodiment, the processor 52 functions as the program generation unit 74 (FIG. 2) that generates the machining program PPG.

[0078] As described above, in the present embodiment, the input reception unit 70 receives the interference detection condition CD n as the beam size BS n and the invalid area IA n and the interference detection unit 72 detects interference occurring in the virtual laser machining operation VLP based on the received interference detection condition CD n .

[0079] Conventionally, the virtual laser beam LBv is defined as a line with a zero cross-sectional area, then the virtual laser machining operation VLP is executed, and the presence or absence of interference between the virtual laser beam LBv and the object model 100M is detected. In this case, there can be no error in the interference detection between the virtual laser beam LBv and the object model 100M.

[0080] When the laser machining operation is executed in accordance with the machining program created as a result of the virtual laser machining operation VLP based on such interference detection, the irradiation timing of the laser beam machine 12 and the machining location PL nIf there is even a slight error in the position of the workpiece 102 or the arrangement of the environmental object 104, the actual laser beam LB may interfere with the environmental object 104.

[0081] In this embodiment, interference detection condition CD n As for beam size BS n When the input is received, the virtual laser beam LBv will be set to beam size BS. n After defining a region with a corresponding cross-sectional area, a virtual laser processing operation (VLP) is performed, and interference between the virtual laser beam (LBv) and the object model (100M) is detected.

[0082] According to this configuration, hypothetically, the irradiation timing of the laser processing machine 12 and the processing location PL n Even if there are slight errors in the position of the workpiece 102 or the arrangement of the environmental object 104, it is possible to avoid interference between the laser beam LB and the environmental object 104 during the actual laser processing operation LPO.

[0083] Furthermore, conventionally, as described above, it was sometimes impossible to distinguish between the work model 102M and the environment model 104M based on the format of the drawing data of the object model 100M. In this embodiment, interference detection condition CD n Invalid area IA n If this input is accepted, it is possible to avoid detecting interference between the virtual laser beam LBv and the work model 102M in the virtual laser processing operation VLP. n or invalid area IA n Interference detection condition CD n By accepting it in this way, it becomes possible to effectively verify the potential interferences that may occur.

[0084] Furthermore, in this embodiment, the input receiving unit 70 has an invalid area IA n Interference detection condition CD for setting n As, distance d n It is accepting input. In this configuration, the operator can access the invalid area IA. nThis makes it easy to set the area to the desired size, and also allows for the invalid area IA within the virtual space VS. n The range can also be intuitively recognized.

[0085] Furthermore, in this embodiment, the input receiving unit 70 has multiple processing locations PL n Each, interference detection condition CD n It accepts input for the machining location PL. According to this configuration, the operator can input the machining location PL. n Each, interference detection condition CD n This allows for detailed configuration. For example, in virtual laser processing operation (VLP), when scanning processing locations PL1 and PL2 with a laser, the laser irradiation device model 18M can be set to a relatively fast movement speed U v1 While moving at a relatively slow speed U, when scanning the processing areas PL3 and PL4 with a laser, the laser irradiation device model 18M is moved at a relatively slow speed U v2 ( v1 It may be moved using ).

[0086] Here, the laser irradiation device model 18M is moved at a lower speed U v2 When moving the object, there is less chance of discrepancy between the interference detection result between the virtual laser beam LBv and object model 100M (specifically, environmental object model 104M) and the interference state between the laser beam LB and object 100 (specifically, environmental object 104) in the actual laser processing operation LPO. Therefore, it may be desirable to set a small clearance for interference detection in the virtual laser processing operation VLP.

[0087] On the other hand, the laser irradiation device Model 18M has a faster travel speed U v1 When moving the object, a discrepancy is likely to occur between the interference detection results between the virtual laser beam LBv and the object model 100M and the interference state between the laser beam LB and the object 100 during the actual laser processing operation LPO. Therefore, it may be desirable to set a larger clearance for interference detection in the virtual laser processing operation VLP.

[0088] According to this embodiment, the laser irradiation device model 18M is moved at a high speed U v1 ​For the processing areas PL1 and PL2, which are moved and laser scanned, relatively large beam sizes BS1 and BS2 are set, while the laser irradiation device model 18M is set to a low moving speed U v1 For the processing areas PL3 and PL4, which are moved and laser scanned, relatively small beam sizes BS3 and BS4 can be set. In this way, the operator can scan the processing area PL n For each, the optimal beam size BS n You can set it.

[0089] Furthermore, the operator sets an invalid area IA in the work model 102M according to the positional relationship between the work model 102M and the environment model 104M. n There may be cases where you want to adjust the range. According to this embodiment, the machining area PL n Each time, invalid area IA n The range can be set as appropriate. n Interference detection condition CD for each n By accepting the input, interference detection condition CD n Machining location PL n It can be optimized for each individual case.

[0090] Furthermore, in this embodiment, the image generation unit 68 uses interference detection condition CD n The system generates input image data ID2 (Figure 8) for inputting the interference detection condition CD. With this configuration, the operator can visually check the input image data ID2 and input interference detection condition CD. n Since it is possible to input interference detection conditions CD n This simplifies the setup process.

[0091] Furthermore, in this embodiment, the motion generation unit 66 generates an object model 100M and a laser processing machine model 12M, and a processing location PL. n Location data PD n Based on this, a virtual laser processing operation VLP is generated. With this configuration, the virtual laser processing operation VLP can be automatically generated by the processor 52, and the operator can check and verify the virtual laser processing operation VLP. This simplifies the work related to teaching the laser processing operation LPO.

[0092] Furthermore, in this embodiment, the program generation unit 74 generates a processing program PPG for the laser processing operation LPO based on the virtual laser processing operation VLP0 generated by the operation generation unit 66. With this configuration, the virtual laser processing operation VLP0 and the processing program PPG can be generated automatically, further simplifying the work related to teaching the laser processing operation LPO.

[0093] Furthermore, the processor 52 controls the movement speed U at which the moving mechanism model 20M moves the laser irradiation device model 18M. v Depending on the beam size BS n You may set this automatically. In this case, movement speed U v and beam size BS n A data table is pre-stored in memory 54, which stores the and related data, and the processor 52 receives the movement speed U as the operation parameter PRv. v By applying this to the data table, the beam size BS n You may set this. In this case, the input receiving unit 70 will set the beam size BS n The input is not accepted, invalid area IA n It is acceptable to accept only this input.

[0094] Furthermore, for example, if the work model 102M and the environment object model 104M can be distinguished by the format of the drawing data of the object model 100M, the interference detection unit 72 can be configured to disable interference between the virtual laser beam LBv and the work model 102M and to detect only interference between the virtual laser beam LBv and the environment object model 104M. In this case, the input receiving unit 70 will have an invalid region IA. n No input accepted, beam size BS n It is acceptable to accept only this input.

[0095] Furthermore, in the virtual laser processing operation VLP, the processor 52 receives the laser irradiation device model 18M from the processing location PL. nA cone-shaped virtual laser beam LBv, whose cross-sectional area decreases as it approaches the terminal, may be emitted from the laser irradiation device model 18M. In this case, the input receiving unit 70 sets the interference detection condition CD. n As such, beam size BS n In addition, the reduction ratio λ of the cross-sectional area is reduced. n The input for (or taper ratio) may also be accepted.

[0096] For example, suppose the input receiving unit 70 receives input of beam size BS2 = diameter R2 = 0.400 [mm] and reduction ratio λ as interference detection conditions CD2 for the processing location PL2. In this case, the processor 52 simulates emitting a conical virtual laser beam LBv in the virtual laser processing operation VLP, where the diameter R2 at the laser beam emission unit model 40M of the laser irradiation device model 18M is 0.400 [mm], and the cross-sectional area decreases by a reduction ratio λ2 as it moves from the laser beam emission unit model 40M toward the processing location PL2.

[0097] Alternatively, in the virtual laser processing operation VLP, the processor 52 simulates emitting a conical virtual laser beam LBv from the laser beam emitter model 40M toward the processing location PL2, with a reduction ratio λ2 that decreases in cross-sectional area, resulting in a diameter R2 of 0.400 [mm] at the processing location PL2. By generating such a conical virtual laser beam LBv, the virtual laser processing operation VLP can be executed with a virtual laser beam LBv that is similar to the laser beam LB in the actual laser processing operation LPO.

[0098] Furthermore, the input reception unit 70 is in the invalid area IA n Interference detection conditions for CD n As the distance d mentioned above, n Along with, invalid area IA n The system may accept input specifying the surface models 106M, 108M, and 110M to be used as a reference when setting the parameters. For example, suppose an operator has selected machining location PL2 as shown in Figure 8, and operates the input device 60 to specify surface model 106M, which is set for machining location PL2.

[0099] In this case, the processor 52 functions as an input receiving unit 70 and receives an input specifying the surface model 106M as the reference for the invalid area IA2, and sets the invalid area IA2 to be within the range of the input distance d2 (e.g., 1.000 [mm]) from the irradiation position on the surface model 106M.

[0100] At this time, the processor 52 may function as an image generation unit 68 and display an image of the work model 102M on the input image data ID 2 so that it can be seen by the operator. n This is a predetermined setting value (for example, d n It may be pre-stored in memory 54 as = 1.000 [mm]. In this case, the processor 52 will determine the distance d n Without accepting input, invalid area IA n This will require setting it up.

[0101] Furthermore, in this embodiment, we have described the case in which the motion generation unit 66 automatically generates the virtual laser processing motion VLP. However, the invention is not limited to this, and the operator may manually generate the virtual laser processing motion VLP by operating the input device 60. In this case, the motion generation unit 66 can be omitted from the teaching device 50.

[0102] Furthermore, in this embodiment, we have described the case in which the program generation unit 74 automatically generates the machining program PPG. However, the invention is not limited to this, and the operator may manually generate the machining program PPG by operating the input device 60. In this case, the program generation unit 74 can be omitted from the teaching device 50.

[0103] Furthermore, in this embodiment, if interference occurs between the virtual laser beam LBv and the environmental object model 104M during the virtual laser processing operation VLP, the operator can control the movement path MPv (teaching point TP). m ), movement speed U v This section describes the case where a command CM2 is input to change the irradiation timing RTv.

[0104] However, the processor 52 may also function as an action generation unit 66 and, based on the location of the interference that has occurred, determine a movement path MPv (teaching point TP) to avoid the interference. m ), movement speed U v Alternatively, the virtual laser processing operation (VLP) may be automatically corrected by automatically changing the irradiation timing (RTv).

[0105] Furthermore, the processing program PPG described above may include a first processing program PPG1 for operating the moving mechanism 20 and a second processing program PPG2 for operating the laser irradiation device 18. In this case, the program generation unit 74 may generate the first processing program PPG1 and the second processing program PPG2 as separate data (for example, in different data formats or formats).

[0106] The aforementioned model data acquisition unit 64, motion generation unit 66, image generation unit 68, input reception unit 70, interference detection unit 72, and program generation unit 74 are functional modules implemented by, for example, a computer program executed by the processor 52. At least one of the functions of the model data acquisition unit 64, motion generation unit 66, image generation unit 68, input reception unit 70, interference detection unit 72, and program generation unit 74 may be implemented in the control device 14. In this case, the processor of the control device 14 will perform the functions of the teaching device 50.

[0107] Next, with reference to Figure 9, other functions of the laser processing system 10 will be described. In the working cell in real space, the control device 14 generates commands to the actual laser processing machine 12 according to the processing program PPG generated by the method of the embodiment shown in Figure 2 (or by other methods), causing the laser processing machine 12 to execute the laser processing operation LPO.

[0108] In this laser processing operation LPO, the laser processing machine 12 operates the moving mechanism 20 to move the laser irradiation device 18 along the moving path MPv (i.e., teaching points TP1, TP2, ... TP m) is moved to the right along the line, and the laser irradiation device 18 is operated to emit laser light LB, and multiple processing locations PL n in order OR v Then, perform a laser scan.

[0109] Figure 10 shows one processing location PL in the laser processing operation LPO. n This shows the operation of the moving mechanism 20 while laser scanning with laser beam LB. For example, the processing program PPG has a scan count N. v If =10 is specified, the moving mechanism 20 will move the laser irradiation device 18 to the teaching point TP m From (first teaching point) to teaching point TP m+1 Move to (the second instruction point) along the movement path MPv, at a movement speed U v While moving to the right, the laser irradiation device 18 uses the emitted laser beam LB to process the PL area. n The processing path PT set to scan speed V v Then, perform 10 laser scans.

[0110] When performing such operations, interference between the laser beam LB and the environmental object 104 may occur in real space, but the movement speed U of the moving mechanism 20 in the laser processing operation LPO v and the scanning speed V of the laser irradiation device 18 v Because of its high speed, it is difficult for the operator to visually confirm interference between the laser beam LB and the environmental object 104 during the actual laser processing operation LPO.

[0111] Therefore, in this embodiment, the teaching device 50 generates an interference confirmation program IPG that performs an interference confirmation operation IVO to pre-confirm interference between the laser beam LB and the environmental object 104. Here, the interference confirmation operation IVO is an operation different from the actual laser processing operation LPO, in which the laser processing machine 12 is operated at a lower operating speed ν than the laser processing operation LPO in order to confirm interference, and the laser beam LBg with different optical characteristics from the laser processing operation LPO is directed at the processing location PL n This is an experimental irradiation procedure.

[0112] The operating speed ν of the laser processing machine 12 comprises the moving speed U of the moving mechanism 20 as it moves the laser irradiation device 18, and the scanning speed V of the laser irradiation device 18 as it moves the laser beam LBg along the processing path PL. The laser beam LBg is visible light (a so-called guide laser) having a different wavelength from the laser beam LB emitted in the laser processing operation LPO, and has a lower laser power than the laser beam LB. In this paper, the laser beam LBg emitted in the interference confirmation operation IVO is referred to as the guide laser LBg.

[0113] The following describes how to generate the interference confirmation program IPG. When the operator operates the input device 60 to input the command CM4 for generating the interference confirmation program IPG, the processor 52 generates the machining location PL n Location data PD n To obtain location data (PD). For example, location data (PD) n This may be stored in memory 54, or it may be specified in the processing program PPG.

[0114] Furthermore, the processor 52 receives the teaching point TP from the machining program PPG. m and TP m+1 Location data PD TP In this embodiment, the processor 52 obtains the teaching point TP at which the laser processing machine 12 positions the laser irradiation device 18 during the laser processing operation LPO. m Location data PD TP It functions as a position data acquisition unit 80 (Figure 9) that obtains location data.

[0115] Next, the processor 52 sets the operating parameter PRi for interference confirmation operation IVO. n Accepts input for the following: Operation parameter PRi n For example, in interference confirmation operation IVO, the scanning speed V is used to move the guide laser LBg along the processing path PL. i_n The scanning time t is the time it takes to move the guide laser LBg from the starting point P1 to the ending point P2 of the processing path PL. n , and the scanning time t n Allowable time τ nIncludes.

[0116] Processor 52 has the operating parameter PRi n An input image data ID 3 is generated for input and displayed on the display device 62. Thus, in this embodiment, the processor 52 functions as an image generation unit 82 (Figure 9) that generates the input image data ID 3. An example of the input image data ID 3 is shown in Figure 11.

[0117] The input image data ID3 is used to provide the operator with the operation parameter PRi n A GUI for enabling input, comprising a processing location selection image area 110 including the scroll bar image 114 described above, and a parameter setting image area 120. The parameter setting image area 120 contains the processing location PL selected in the processing location selection image area 110. n Regarding the operating parameter PRi n This is for setting it up.

[0118] Specifically, the parameter setting image area 120 is set to scan speed V i_n Numerical input image 122 for setting and scanning time t n Numerical input image 124 for setting and allowable time τ n It includes a numerical input image 126 for setting the processing location PL. Numerical input images 122, 124, and 126 are the processing location PL selected in the processing location selection image area 110, respectively. n (In the example shown in Figure 11, the scanning speed V is applied to the machining area PL2) i_n , scanning time t n , and allowable time τ n (In the example shown in Figure 11, the scanning speed V i_2 This is for inputting the scanning time t2 and the allowable time τ2.

[0119] In this way, the operator selects the desired machining area PL in the machining area selection image region 110. n Select the processing location PL n For each operation, the operating parameter PRi is entered through numerical input images 122, 124, and 126. n Scanning speed V i_n, scanning time t n , and allowable time τ n It is possible to input the following. Therefore, in this embodiment, the processor 52 has the operation parameter PRi n It functions as an input receiving unit 84 (Figure 9) that accepts input.

[0120] Next, the processor 52 receives the operating parameter PRi n Based on this, the operating speed ν of the laser processing machine 12 in interference confirmation operation IVO n The following is determined. For example, when the operator selects the processing location PL2 in the processing location selection image area 110 as shown in Figure 11, the operation parameter PRi2 is set to scan speed V in the parameter setting image area 120. i_2 Let's assume that =1 [mm / sec], scanning time t2 = 1 [sec], and allowable time τ2 = 5 [sec] are entered.

[0121] In this case, the processor 52 first obtains the path length L2 from the starting point P1 to the ending point P2 of the machining path PT set for machining location PL2, from the position data PD2 of machining location PL2. Then, using the path length L2, it determines the scanning speed V corresponding to the scanning time t2 and allowable time τ2 input as the operation parameters PRi2. t2 and V τ2 Find each of them.

[0122] For example, suppose the path length L2 = 40 [mm]. In this case, the processor 52 determines the scanning speed V when scanning the path length L2 with a laser at the scanning time t2. t2 V t2 =L2 / t2=40 [mm / sec] is used to calculate this. Similarly, the processor 52 calculates the scanning speed V when scanning the path length L2 with a laser over the allowable time τ2. τ2 V τ2 The calculation is performed by setting =L2 / τ2=8[mm / sec].

[0123] Then, the processor 52 receives the scan speed V as the operating parameter PRi2. i_2The scanning speed V was calculated. t2 and scanning speed V τ2 and MAX(MIN(V i_2 ,V t2 ),V τ2 Apply this to the conditional expression (I). For this conditional expression (I), MIN(V i_2 ,V t2 ) is V i_2 and V t2 This indicates selecting the smaller of the two. In other words, in this embodiment, MIN(V i_2 ,V t2 )=V i_2 (=1 [mm / sec]), and therefore MAX(MIN(V) i_2 ,V t2 ),V τ2 ) = MAX(V i_2 ,V τ2 )

[0124] On the other hand, MAX(V i_2 ,V τ2 ) is V i_2 and V τ2 This indicates selecting the larger of the two. In other words, in this embodiment, MAX(V i_2 ,V τ2 )=V τ2 (=8 [mm / sec]). Thus, the processor 52 receives the scan speed V as the operating parameter PRi2. i_2 From the scanning time t2, the allowable time τ2, and condition (I), the scanning speed V2 when laser scanning the processing area PL2 in interference confirmation operation IVO is given by V2 = V τ2 Set to =8 [mm / sec]

[0125] The technical significance of using conditional equation (I) will be explained below. Suppose the operator sets the scanning speed V as the operating parameter PRi2. i_2 Let's assume that the input speed is relatively low to facilitate visual interference detection. In this case, the input scanning speed V i_2 The scanning time t required to laser scan the path length L2. V2 This is due to a relatively long scanning time t V2 =L2 / Vi_2 This is the result.

[0126] On the other hand, suppose the operator inputs a relatively short scanning time t2 as the operating parameter PRi2, from the perspective of reducing the cycle time of the interference confirmation operation IVO. In this case, the scanning speed V corresponding to the input scanning time t2 t2 This becomes relatively high, and as a result, visual detection of interference may become difficult. In the above conditional equation (I), MIN(V i_2 ,V t2 ) by velocity V i_2 and velocity V t2 By selecting the smaller of the two, the speed V, which may make visual interference detection difficult, becomes less likely. t2 It is excluded.

[0127] However, MIN(V i_2 ,V t2 The speed V selected by ) i_2 Then, as mentioned above, the scanning time t V2 This can lead to a longer cycle time, potentially causing the interference detection operation IVO cycle time to increase excessively. Therefore, in condition (I), MAX(V i_2 ,V τ2 ) by velocity V i_2 And the velocity V corresponding to the allowable time τ2. τ2 By choosing the larger of the two, the cycle time may become excessively redundant at speed V. i_2 Excluding the allowable time τ2, the speed V corresponding to the allowable time τ2 τ2 This is defined as the scanning speed V2 when scanning the processing area PL2 with a laser during interference confirmation operation IVO.

[0128] Thus, in this embodiment, the allowable time τ2 is input as the operation parameter PRi2 in order to keep the scanning time t2 required for laser scanning the machining path PT of the machining area PL2 in the interference confirmation operation IVO within an allowable range such that the cycle time of the interference confirmation operation IVO does not become excessively redundant, and according to conditional equation (I), the speed V i_2 ,V t2 and V τ2Regardless of which option is selected, the scanning time t2 will never exceed the allowable time τ2.

[0129] Furthermore, if the operator uses an appropriate scanning speed V i_2 Alternatively, input the scanning time t2 (for example, scanning speed V) i_2 If the input is =10 [mm / sec], scanning time t2 = 5 [sec], and allowable time τ2 = 10 [sec], then the processor 52 calculates from conditional equation (I) the scanning speed V2 when laser scanning the processing area PL2 in interference confirmation operation IVO, and the scanning speed V corresponding to the scanning time t2 (=5 [sec]) t2 This will be set as (=8 [mm / sec]). The scanning speed V2 set in this way to enable visual interference confirmation is the scanning speed V in the laser processing operation LPO. v It will be set to a value lower than (for example, 100 [mm / sec]).

[0130] As described above, the processor 52 has an operating parameter PRi n Based on this, interference confirmation operation IVO is performed on the machining area PL n The operating speed ν when scanning with a laser n (Specifically, scanning speed V n ) at a lower speed (V) than the laser processing operation LPO n <V v ) is defined as follows. Therefore, in this embodiment, the processor 52 has an operating speed ν n It functions as an operating speed setting unit 86 (Figure 9) that sets the operating speed.

[0131] Note that the operating parameter PRi n Operating speed ν determined based on n However, a predetermined threshold ν th If the above conditions are met, the processor 52 may generate a warning signal AS in image or audio data format, for example, "Because the operating speed in the interference confirmation operation is high, it may be difficult to visually confirm interference," and output it through the display device 62 or a speaker (not shown). In this case, threshold ν th For example, the operating speed ν of the laser processing operation LPOv (For example, the scanning speed V specified in the machining program PPG) v or movement speed U v ) is used as the basis, ν th =αν v (α may be predetermined as a positive coefficient.)

[0132] Next, the processor 52 generates an interference confirmation program IPG which defines a command CMi that causes the laser processing machine 12 to perform the following series of operations as an interference confirmation operation IVO. That is, in the interference confirmation operation IVO, the laser processing machine 12 operates the laser oscillator 16 to generate a guide laser LBg, operates the moving mechanism 20 to move the laser irradiation device 18, and operates the laser irradiation device 18 to multiple processing locations PL n The laser is scanned sequentially in ORv using a guide laser LBg.

[0133] One machining location PL n When scanning with a laser, the laser processing machine 12 first operates the moving mechanism 20 to move the laser irradiation device 18 to the teaching point TP. m (Figure 10) The laser processing machine 12 then positions the laser irradiation device 18 at the teaching point TP. m With the device stationary, the guide laser LBg is directed to the processing area PL. n The light is irradiated, and the scanning speed V determined by the operating speed setting unit 86 is set. n Therefore, the part number of the processed area n The processing path PT is repeatedly scanned with a laser.

[0134] Next, upon receiving the interference confirmation command CM5 from the operator, the laser processing machine 12 stops the irradiation of the guide laser LBg, then operates the moving mechanism 20 to move the laser irradiation device 18 to the teaching point TP. m+1 It is then positioned at the teaching point TP. Next, the laser processing machine 12 directs the laser irradiation device 18 to the teaching point TP. m+1 With the device stationary, the guide laser LBg is directed to the processing area PL. n Irradiate the PL again, and the processed area n The processing path PT is scanned at a speed V nLaser scanning is repeatedly performed. Thus, the laser processing machine 12 causes the laser irradiation device 18 to reach the teaching point TP m and TP m+1 Laser scanning is executed every time positioning is performed sequentially to

[0135] Next, when an interference confirmation command CM6 is received from an operator, the laser processing machine 12 stops the irradiation of the guide laser LBg, and then operates the moving mechanism 20 to move the laser irradiation device 18 to the next processing position PL n+1 to the set teaching point TP m and moves to the next processing position PL n+1 The above-described series of laser scanning is executed for

[0136] By repeatedly executing the series of laser scanning as described above for a plurality of processing positions PL n in the order ORv, the laser processing machine 12 executes the interference confirmation operation IVO. The processor 52 executes the processing positions PL defined in the processing program PPG n position data PD n and teaching point TP m position data PD TP and the scanning speed V determined by the operation speed setting unit 86 n Based on the above, an interference confirmation program IPG in which a command CMi for causing the laser processing machine 12 to execute the series of interference confirmation operations IVO as described above is defined is automatically generated. As described above, in the present embodiment, the processor 52 functions as a program generation unit 88 (Fig. 9) that generates the interference confirmation program IPG.

[0137] Fig. 12 shows a flowchart illustrating an example of the interference confirmation operation IVO. The processor 52 of the teaching device 50 (or the processor of the control device 14) executes the flow shown in Fig. 12 in accordance with the interference confirmation program IPG generated by the program generation unit 88. The flow shown in Fig. 12 starts when the processor 52 receives an operation start command CM7 from an operator, a host controller, or a computer program (e.g., the interference confirmation program IPG).

[0138] In step S1, the processor 52 sets the n-th processing position PL n identification number "n" to "1". In step S2, the processor 52 performs laser scanning on the n-th processing position PL n . This step S2 will be described with reference to FIG. 13. After the start of step S2, in step S11, the processor 52 operates the moving mechanism 20 to position the laser irradiation device 18 at the first teaching point TP n set for the n-th processing position PL m .

[0139] In step S12, the processor 52 starts laser scanning. Specifically, as described above, the processor 52 operates the laser oscillator 16 to generate a guide laser LBg, and with the laser irradiation device 18 kept stationary at the first teaching point TP m , irradiates the guide laser LBg onto the n-th processing position PL n , and repeatedly performs laser scanning on the processing path PT of the n-th processing position PL n with the guide laser LBg at a scanning speed V n .

[0140] While the laser scanning for the n-th processing position PL n is being executed in this step S12, an operator can visually confirm whether there is interference between the guide laser LBg and an environmental object 104. After completing the interference confirmation, the operator operates the input device 60 to input an interference confirmation command CM5.

[0141] In step S13, the processor 52 determines whether the interference confirmation command CM5 has been received. When the processor 52 determines that the interference confirmation command CM5 has been received (that is, YES), it terminates the laser scanning started in step S12 (that is, stops the emission of the guide laser LBg) and proceeds to step S15; when the determination is NO, it proceeds to step S14.

[0142] In step S14, the processor 52 generates a confirmation signal RS. For example, the processor 52 generates a confirmation signal RS in image or audio data format that says, "Please check for interference between the guide laser and the surrounding objects. If there is no interference, proceed to the next step." The processor 52 outputs the generated confirmation signal RS through the display device 62 or a speaker (not shown) and returns to step S13.

[0143] Thus, the processor 52 loops through steps S13 and S14 until it determines YES in step S13. In step S15, the processor 52 operates the moving mechanism 20 to move the laser irradiation device 18 to the nth processing location PL n The second teaching point TP set for m+1 Position it there.

[0144] In step S16, the processor 52 starts laser scanning. Specifically, as described above, the processor 52 moves the laser irradiation device 18 to the second teaching point TP m+1 With the guide laser LBg stationary, move it to the nth processing location PL n Irradiate again, and the nth processed area PL n The processing path PT is controlled by the guide laser LBg at a scanning speed V n Then, the laser scan is repeated.

[0145] In step S16, the operator machined the nth machining point PL n While the laser scan is being performed, the presence or absence of interference between the guide laser LBg and the environmental object 104 is visually checked again. Once the interference check is complete, the operator operates the input device 60 to input the interference check command CM6.

[0146] In step S17, the processor 52 determines whether or not it has received the interference confirmation command CM6. If the processor 52 determines it is YES, it terminates the laser scan that started in step S16 and proceeds to step S3 in Figure 12. If it determines it is NO, it proceeds to step S18. In step S18, the processor 52 generates a confirmation signal RS, similar to step S14 described above, and returns to step S17. In this way, the processor 52 loops through steps S17 and S18 until it determines it is YES in step S17.

[0147] Referring again to Figure 12, in step S3, the processor 52 processes the nth machining location PL n The number "n" that identifies the item is incremented by "1" (n = n + 1). In step S4, the processor 52 determines whether the number "n" set at this point is greater than "6" (i.e., n > 6).

[0148] If processor 52 determines that n > 6 (i.e., YES), it terminates the interference confirmation operation IVO flow shown in Figure 12. However, if it determines that n ≤ 6 (i.e., NO), it returns to step S2. In this way, processor 52 repeatedly executes the loop of steps S2 to S4 until it determines YES in step S4. Processor 52 executes each step S1 to S4 shown in Figure 12 according to the interference confirmation program IPG. Therefore, the interference confirmation program IPG specifies a command CMi (e.g., code) for executing each step S1 to S4.

[0149] As described above, in this embodiment, the processor 52 functions as a position data acquisition unit 80, an image generation unit 82, an input reception unit 84, an operating speed setting unit 86, and a program generation unit 88 to generate an interference confirmation program IPG. Therefore, the position data acquisition unit 80, the image generation unit 82, the input reception unit 84, the operating speed setting unit 86, and the program generation unit 88 constitute a device 90 (Figure 9) that generates the interference confirmation program IPG. The position data acquisition unit 80, the image generation unit 82, the input reception unit 84, the operating speed setting unit 86, and the program generation unit 88 are functional modules realized, for example, by a computer program executed by the processor 52.

[0150] In this device 90, the operating speed setting unit 86 sets the operating parameter PRi received by the input receiving unit 84. n Based on this, the operating speed ν in interference detection operation IVO n (Scanning speed V n The speed of the laser processing operation LPO is set to a lower speed than the laser processing operation LPO. The program generation unit 88 sets the operating speed ν of the laser processing machine 12 in the interference confirmation operation IVO. n (Scanning speed V n ) Operate and direct the guide laser LBg to the processing area PL n An interference confirmation program IPG is generated that defines the command CMi for irradiating (steps S12 and S16 in Figure 13).

[0151] According to this device 90, the interference detection operation IVO has a lower operating speed ν than the laser processing operation LPO. n By operating the laser processing machine 12, the operator can visually check for interference between the laser beam LBg and the environmental object 104 before performing the actual laser processing operation LPO. As a result, the presence or absence of interference can be effectively verified in advance, and if interference occurs, countermeasures such as modifying the processing program PPG to avoid the interference can be taken.

[0152] Furthermore, in the device 90, the input receiving unit 84 receives the operation parameter PRi n For example, scanning speed V i_n, scanning time t n , and allowable time τ n Upon receiving the input, the operating speed setting unit 86 sets the scanning speed V i_n , the scanning time t n , and the allowable time τ n Based on this, the scanning speed V in interference confirmation operation IVO n This configuration defines the scanning speed V in the interference confirmation operation IVO. n This speed can be automatically determined as a speed at which the operator can visually confirm interference.

[0153] Furthermore, in the device 90, the position data acquisition unit 80 sets a teaching point TP that positions the laser irradiation device 18 during the laser processing operation LPO. m , TP m+1 Location data PD TP The program generation unit 88 acquires the information and, in the interference confirmation operation IVO, sets the laser irradiation device 18 to the teaching point TP. m , TP m+1 An interference confirmation program IPG is generated which defines the command CMi for positioning (steps S11 and S15 in Figure 13).

[0154] According to this configuration, the teaching point TP in the laser processing operation LPO (more specifically, as defined in the processing program PPG) m , TP m+1 This allows for the execution of interference verification (IVO). Therefore, interference that may occur during the actual laser processing operation (LPO) can be verified with high accuracy by performing the interference verification operation (IVO) in advance.

[0155] Furthermore, in the device 90, the program generation unit 88 sets the laser irradiation device 18 to the first teaching point TP during the interference confirmation operation IVO. m and the second teaching point TP m An interference confirmation program IPG is generated that defines the command CMi for performing a laser scan each time the position is changed sequentially (steps S11 and S12, steps S15 and S16 in Figure 13).

[0156] With this configuration, in the interference confirmation operation IVO, the processing location PL is determined in the actual laser processing operation LPO. n The starting point (first teaching point TP) of the movement of the laser irradiation device 18 when scanning with a laser. m ) and the endpoint (second teaching point TP) m+1 ) This will perform laser scanning using the guide laser LBg. This will allow the processing area PL to be scanned during the actual laser processing operation LPO. n This allows for more efficient verification of interference that may occur when scanning with a laser.

[0157] Furthermore, in the device 90, the input receiving unit 84 has multiple processing locations PL n Each operation parameter PRi n (Scanning speed V i_2 The operating speed setting unit 86 accepts input of scanning time t2 and allowable time τ2, and sets multiple machining locations PL n Each time, the operating speed ν in the interference detection operation IVO n (Scanning speed V n ) has been established.

[0158] With this configuration, the operator can consider the positional relationship between the workpiece 102 and the environmental object 104, and control the operating speed ν in the interference confirmation operation IVO. n The part of the processing area n This allows for detailed settings for each individual setting. As a result, it becomes easier to visually check for interference during the interference detection operation (IVO).

[0159] Furthermore, in the device 90, the image generation unit 82 controls the operation parameter PRi n This generates input image data ID3 for inputting the following parameters: n Since it is possible to input the operating parameter PRi n This simplifies the setup process.

[0160] In this embodiment, the operating speed setting unit 86 sets the operating speed ν n For example, scanning speed V nthe case of determining has been described. However, the present invention is not limited thereto, and the operation speed setting unit 86 sets the operation speed ν n as the scanning speed V n instead of (or in addition to the scanning speed V n ), the moving speed U at which the moving mechanism 20 moves the laser irradiation device 18 n may be determined. In this case, the input reception unit 84 may receive inputs for a plurality of processing locations PL n for each, as the operation parameter PRi n as the moving speed U n .

[0161] Further, the input reception unit 84, as the operation parameter PRi n as the scanning time t described above n instead of (or in addition to), the scanning frequency f i_n (=1 / t n ) may be received. In this case, the operation speed setting unit 86 obtains the scanning speed V corresponding to the input scanning frequency f i_n corresponding scanning speed V fn from V fn =f i_n ×L n formula (where L n is the path length of the processing path PT of the processing location PL n of the processing path PT), the scanning speed V fn is applied to the conditional expression (I) of MAX(MIN(V i_n ,V fn ),V τn ) to determine the scanning speed V in the interference check operation IVO n may be determined.

[0162] It should be noted that the above conditional expression (I) is not limited to the logical expression of MAX(MIN(V i_n ,V tn ),V τn ) logical expression. An operator may use any logical expression as the conditional expression (I). For example, as the conditional expression (I), a logical expression of MIN(MAX(V i_n ,V tn ),V τn ) logical expression may be used.

[0163] In this embodiment, the input receiving unit 70 receives the operation parameter PRi n For example, scanning speed V i_n , scanning time t n , and allowable time τ n The case where input is received was described. However, the input receiving unit 70 is not limited to this, and the scanning speed V i_n , scanning time t n , and allowable time τ n Only one (or two) of these may be accepted. In this case, the operating speed setting unit 86 will set the operating speed ν based on the one (or two) of these values. n To define.

[0164] Furthermore, in this embodiment, the position data acquisition unit 80 acquires the teaching point TP m Location data PD TP The program generation unit 88 acquires the information and, in interference confirmation operation IVO, sets the laser irradiation device 18 to teaching point TP. m This section describes the case where an interference confirmation program (IPG) is generated that defines a positioning command (CMi).

[0165] However, this is not the only example; the program generation unit 88 also generates position data PD. TP Without using the interference confirmation operation IVO, an interference confirmation program IPG may be generated that defines a command CMi to position the laser irradiation device 18 at an arbitrary position. This arbitrary position may be determined by the operator depending on the interference confirmation operation IVO to be executed. In other words, in this case, the position data acquisition unit 80 can be omitted from the device 90.

[0166] Furthermore, in this embodiment, the program generation unit 88 sets the laser irradiation device 18 to teaching point TP in steps S12 and S16 in Figure 13. m and TP m+1 The case described above involves generating an interference confirmation program IPG so that the laser is scanned while the device is stationary. However, the program generation unit 88 is not limited to this case, and in steps S12 and S16, the laser irradiation device 18 is directed to the teaching point TP m and TP m+1 Without stopping, the teaching point TPm and TP m+1 An interference detection program (IPG) may be generated to perform a laser scan while passing through the area.

[0167] Note that steps S13, S14, S17, and S18 may be omitted from the interference confirmation operation IVO flow shown in Figure 13. For example, in the interference confirmation operation IVO, after the start of step S12, the processor 52 determines the nth machining location PL n to a predetermined number of times N i After repeatedly scanning with the laser, the process may proceed to step S15.

[0168] Furthermore, after the start of step S16, the processor 52 processes the nth machining location PL n to a predetermined number of times N i Step S2 may be terminated after repeatedly scanning with the laser. In this case, the input receiving unit 84 receives the operating parameter PRi n For example, the part number of the processed area n Each time, N times i Further input may be accepted.

[0169] Furthermore, the functions of the device 90 (i.e., the position data acquisition unit 80, the image generation unit 82, the input reception unit 84, the operation speed setting unit 86, and the program generation unit 88) can also be implemented in the control device 14. In this case, the processor of the control device 14 functions as the device 90.

[0170] In the embodiments shown in Figures 2 and 9, the cases described are those in which the image generation units 68 and 82 generate image data ID2 (Figure 8) and ID3 (Figure 11), respectively. However, the processor 52 is not limited to these cases, and may, for example, detect interference conditions CD by operator voice without generating image data ID2 or ID3. n or operating parameter PRi n The system may accept input from the operator. In this case, the teaching device 50 is further provided with a microphone to accept voice input from the operator. That is, in this case, the image generation unit 68 or 82 can be omitted from the teaching device 50 or the device 90.

[0171] Furthermore, in the above embodiment, the workpiece 102 and workpiece model 102M have six machining locations PL n This describes the case where the setting is configured. However, it is not limited to this, and only one machining location PL1 may be set for workpiece 102 and workpiece model 102M, or any number of machining locations PL n Alternatively, the processing path PT may be set to any shape, not limited to a rectangle as shown in Figure 7, such as a triangle, a circle, or a straight line segment.

[0172] Furthermore, the control device 14 described above may include a first control device 14A that controls the operation of the laser oscillator 16 and the laser irradiation device 18, and a second control device 14B that controls the operation of the moving mechanism 20. Such a configuration is shown in Figure 14. The first control device 14A and the second control device 14B are computers, each having a processor (CPU, GPU, etc.) and memory (ROM, RAM, etc.), and are connected to each other in a manner that allows them to communicate with one another.

[0173] The first control device 14A and the second control device 14B communicate with each other and synchronize the operation of the laser oscillator 16 and the laser irradiation device 18 with the operation of the moving mechanism 20, while executing the laser processing operation LPO or interference confirmation operation IVO. The present disclosure has been described above through embodiments, but the above embodiments do not limit the invention as defined in the claims. [Explanation of Symbols]

[0174] 10 Laser Processing Systems 12 Laser processing machines 14 Control device 16. Laser Oscillator 18. Laser irradiation device 20 Moving mechanism 50 Teaching device 52 processors 64 Model Data Acquisition Unit 66 Motion generator 68,82 Image generation unit 70,84 Input reception section 72 Interference detection unit 74,88 Program generation unit 80 Location data acquisition unit 86 Operation speed setting section 90 equipment

Claims

1. A device that generates an interference confirmation program for a laser processing machine that performs a laser processing operation to laser process a set area on a workpiece, causing the machine to perform an interference confirmation operation in advance to check for interference between the laser beam and environmental objects, An input receiving unit that receives input of operating parameters for the interference confirmation operation, Based on the operation parameters received by the input receiving unit, the operation speed setting unit sets the operating speed of the laser processing machine in the interference confirmation operation to a speed lower than that of the laser processing operation. The apparatus comprises: a program generation unit that generates an interference confirmation program which specifies a command to operate the laser processing machine at the operating speed determined by the operating speed setting unit in the interference confirmation operation, and to irradiate the processing area with laser light having optical characteristics different from the laser processing operation.

2. The aforementioned operating speed has a scanning speed at which the laser processing machine moves the laser beam along the processing path set at the processing location. The input receiving unit receives at least one input as an operation parameter from among the scanning speed, the scanning time for moving the laser beam from the start point to the end point of the processing path, and the allowable time for the scanning time. The apparatus according to claim 1, wherein the operating speed setting unit determines the scanning speed in the interference confirmation operation based on at least one of the inputs received by the input receiving unit.

3. The laser processing operation further includes a position data acquisition unit that acquires position data of teaching points for which the laser processing machine positions the laser irradiation device, The apparatus according to claim 1 or 2, wherein the program generation unit generates the interference confirmation program which defines the command for positioning the laser irradiation device to the teaching point in the interference confirmation operation.

4. In the laser processing operation, the laser processing machine performs a laser scan to move the laser beam from the start to the end of the processing path set at the processing location while moving the laser irradiation device from the first teaching point to the second teaching point. The apparatus according to claim 3, wherein the program generation unit generates the interference confirmation program which defines the command to perform the laser scan each time the laser irradiation device is sequentially positioned to the first teaching point and the second teaching point in the interference confirmation operation.

5. The input receiving unit receives input of the operation parameters for each of the multiple machining locations set on the workpiece. The apparatus according to any one of claims 1 to 4, wherein the operating speed setting unit determines the operating speed in the interference confirmation operation for each of the plurality of processing locations.

6. The apparatus according to any one of claims 1 to 5, further comprising an image generation unit that generates input image data for inputting the aforementioned operating parameters.

7. A teaching device for teaching the laser processing operation, comprising the apparatus described in any one of claims 1 to 6.

8. A method for generating an interference confirmation program that causes a laser processing machine, which performs a laser processing operation to laser process a set processing area on a workpiece, to perform an interference confirmation operation in advance to check for interference between the laser beam and environmental objects, The processor The system accepts input of operating parameters for the aforementioned interference confirmation operation. Based on the received operating parameters, the operating speed of the laser processing machine in the interference confirmation operation is set to a speed lower than that of the laser processing operation. A method for generating an interference confirmation program that specifies a command to operate the laser processing machine at a predetermined operating speed and to irradiate the processing area with laser light having different optical characteristics from the laser processing operation, in the interference confirmation operation.

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