PCB processing system

Abstract

To reduce the footprint of a substrate processing system.SOLUTION: A substrate processing system includes one or more process modules and a vacuum transfer module. At least one process module and the vacuum transfer module are arranged such that at least part of the process module and at least part of the vacuum transfer module overlap when viewed from above.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] Various aspects and embodiments of the present disclosure relate to substrate processing systems. Background Art

[0002] Patent Document 1 describes that "each processing tool 200 comprises an improved equipment front end module (EFEM) 204 configured to accommodate at least a portion of a load lock 208". Patent Document 1 further describes that "the load lock 208 extends inside the EFEM 204 instead of being located outside the EFEM 204 in the gap between the EFEM 204 and a vacuum transfer module (VTM) 212". Prior Art Documents Patent Documents

[0003] [Patent Document 1] Japanese Unexamined Patent Publication No. 2020-510310 Summary of Invention Problem to be Solved by Invention

[0004] The present disclosure provides a substrate processing system capable of reducing the installation footprint of the substrate processing system. Means for Solving Problem

[0005] One aspect of the present disclosure is a substrate processing system, comprising one or more process modules and a vacuum transfer module. The at least one process module and the vacuum transfer module are arranged such that at least a portion of the process module and at least a portion of the vacuum transfer module overlap in a top view. Effect of Invention

[0006] According to various aspects and embodiments of the present disclosure, the installation footprint of the substrate processing system can be reduced. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a plan view showing an example of a substrate processing system in one embodiment. [Figure 2] Figure 2 is a side view showing an example of a substrate processing system as seen from the direction of arrow C in Figure 1. [Figure 3] Figure 3 is a side view showing an example of a substrate processing system as seen from the direction of arrow D in Figure 1. [Figure 4] Figure 4 is a side view showing an example of a substrate processing system as seen from the direction of arrow E in Figure 1. [Figure 5] Figure 5 shows an example of the back surface of the substrate processing system shown in Figure 1. [Figure 6] Figure 6 is a schematic cross-sectional view showing an example of an AA cross-section of the substrate processing system illustrated in Figures 1 and 5. [Figure 7] Figure 7 is a schematic cross-sectional view showing an example of a BB cross-section of the substrate processing system illustrated in Figures 1 and 5. [Figure 8] Figure 8 is a schematic cross-sectional view showing an example of PM. [Figure 9] Figure 9 shows an example of the substrate transport process. [Figure 10] Figure 10 shows an example of the substrate transport process. [Figure 11] Figure 11 shows an example of the process of transferring substrates. [Figure 12] Figure 12 shows an example of the substrate transport process. [Figure 13] Figure 13 shows an example of the process of transferring substrates. [Figure 14] Figure 14 shows an example of the positional relationship between the mounting section and the arm section. [Figure 15] Figure 15 shows an example of the substrate transport process. [Figure 16] Figure 16 shows an example of the process of transferring substrates. [Figure 17]FIG. 17 is a diagram illustrating an example of a substrate transfer process. [Figure 18] FIG. 18 is a diagram illustrating an example of a substrate transfer process. [Figure 19] FIG. 19 is a diagram illustrating an example of a substrate transfer process. [Figure 20] FIG. 20 is a diagram illustrating an example of a substrate transfer process. [Figure 21] FIG. 21 is a diagram illustrating an example of a substrate transfer process. [Figure 22] FIG. 22 is a diagram illustrating an example of a substrate transfer process. [Figure 23] FIG. 23 is a schematic cross-sectional view illustrating another example of a substrate processing system. [Figure 24] FIG. 24 is a schematic cross-sectional view illustrating another example of a substrate processing system. [Figure 25] FIG. 25 is a schematic cross-sectional view illustrating another example of a substrate processing system. [Figure 26] FIG. 26 is a schematic cross-sectional view illustrating another example of a substrate processing system. [Figure 27] FIG. 27 is a schematic cross-sectional view illustrating another example of a substrate processing system. [Figure 28] FIG. 28 is a schematic cross-sectional view illustrating another example of a substrate processing system. MODE FOR CARRYING OUT THE INVENTION

[0008] Hereinafter, embodiments of a substrate processing system will be described in detail with reference to the drawings. The disclosed substrate processing system is not limited to the following embodiments.

[0009] Incidentally, in order to increase the number of substrates that can be processed per unit time, one option is to increase the number of processing modules that perform processing on the substrates. However, increasing the number of processing modules leads to a larger substrate processing system, which includes multiple processing modules, vacuum transport modules, load lock modules, and atmospheric transport modules. As the substrate processing system becomes larger, the footprint of the substrate processing system within facilities such as clean rooms increases, making it difficult to arrange multiple substrate processing systems. Therefore, there is a need to reduce the footprint of the substrate processing system.

[0010] Therefore, this disclosure provides a technology that can reduce the installation area of ​​a substrate processing system.

[0011] [Configuration of the substrate processing system 10] Figure 1 is a plan view showing an example of a substrate processing system 10 in one embodiment. Figure 2 is a side view showing an example of a substrate processing system 10 viewed from the direction of arrow C in Figure 1. Figure 3 is a side view showing an example of a substrate processing system 10 viewed from the direction of arrow D in Figure 1. Figure 4 is a side view showing an example of a substrate processing system 10 viewed from the direction of arrow E in Figure 1. Figure 5 is a diagram showing an example of the back surface of the substrate processing system 10 shown in Figure 1. In Figure 1, a control device 12 that controls the entire substrate processing system 10 is illustrated together with the substrate processing system 10.

[0012] The substrate processing system 10 comprises a VTM (Vacuum transfer module) 20, multiple PMs (Process Modules) 30, an LLM (Load Lock Module) 40, an EFEM (Equipment Front End Module) 50, and multiple LPs (load ports) 60.

[0013] The VTM20 is configured to transport the substrate W in a vacuum atmosphere. In this specification, "vacuum" means a pressure lower than atmospheric pressure. The VTM20 is configured to transport the substrate W between the PM30 and the LLM40, or between multiple PM30s, in a vacuum atmosphere. In this embodiment, at least one PM30 and the VTM20 are arranged such that, in a top view, at least a portion of the PM30 and at least a portion of the VTM20 overlap. In this embodiment, a top view means viewing the top surface from a vertical direction. In the examples of Figures 1 to 5, in a top view, the VTM20 is positioned on at least one PM30. In the examples of Figures 1 to 5, the substrate processing system 10 includes one VTM20, but the disclosed technology is not limited to this, and the number of VTM20s included in the substrate processing system 10 may be more than one.

[0014] Each PM30 performs a process on the substrate W, such as etching or film deposition (e.g., plasma treatment). Each PM30 may perform the same process or different processes within the manufacturing process. In the examples shown in Figures 1 to 5, the substrate processing system 10 is equipped with eight VTM20s, but the disclosed technology is not limited to this, and the number of PM30s in the substrate processing system 10 may be less than or more than eight.

[0015] In the examples shown in Figures 1 to 5, the shape of each PM30 in top view is a square, but the disclosed technology is not limited to this. The shape of each PM30 in top view may be, for example, a polygon (including triangles, quadrilaterals (rectangles, rhombuses, trapezoids, etc.), pentagons, hexagons, octagons), a circle, or an ellipse.

[0016] The LLM40 can switch its internal pressure between a vacuum atmosphere and an atmospheric pressure atmosphere. The LLM40 and at least one PM30 are arranged such that, in a top view, at least a portion of the PM30 and at least a portion of the LLM40 overlap. In this embodiment, at least a portion of the VTM20 is arranged between at least one PM30 and the LLM40. In this embodiment, the VTM20, at least one PM30, and LLM40 are arranged such that, in a top view, at least a portion of the VTM20, at least a portion of the PM30, and at least a portion of the LLM40 overlap. In the examples of Figures 1 to 5, the LLM40 is arranged on top of the VTM20. In the examples of Figures 1 to 5, the substrate processing system 10 includes one LLM40, but the disclosed technology is not limited to this, and the number of LLM40s included in the substrate processing system 10 may be more than one.

[0017] The EFEM50 is configured to transport substrates W in an atmospheric pressure environment. The EFEM50 is an example of an atmospheric transport module. Multiple LP60s are provided on the side wall of the EFEM50. A gate valve 51 is provided on the side wall of the EFEM50 corresponding to each LP60, for example, as shown in Figure 4. The EFEM50 is configured to transport substrates W between the FOUP (Front Opening Unified Pod) installed in each LP60 and the LLM40 in an atmospheric pressure environment. In the examples of Figures 1 to 5, the substrate processing system 10 is equipped with one EFEM50, but the disclosed technology is not limited to this, and the number of EFEM50s equipped in the substrate processing system 10 may be more than one. Also, in the examples of Figures 1 to 5, the substrate processing system 10 is equipped with three LP60s, but the disclosed technology is not limited to this, and the number of LP60s equipped in the substrate processing system 10 may be less than three or more than three.

[0018] The substrate processing system 10 may also be provided with an alignment module for adjusting the position and orientation of the substrate W. The apparatus in which the alignment module is provided is not particularly limited, but the alignment module may be provided, for example, within the VTM20, EFEM50, or LLM40.

[0019] The control device 12 processes computer-executable instructions that cause the substrate processing system 10 to perform the various processes described herein. The control device 12 may be configured to control each element of the substrate processing system 10 to perform the various processes described herein. In one embodiment, some or all of the control device 12 may be included in the substrate processing system 10. The control device 12 is implemented by a computer 12a, which includes, for example, a processing unit 12a1, a storage unit 12a2, and a communication interface 12a3. The processing unit 12a1 may be configured to perform various control operations by reading a program from the storage unit 12a2 and executing the read program. This program may be stored in the storage unit 12a2 in advance, or it may be retrieved via a medium when needed. The retrieved program is stored in the storage unit 12a2 and read from the storage unit 12a1 and executed by the processing unit 12a1. The medium may be various storage media readable by the computer 12a, or it may be a communication line connected to the communication interface 12a3. The processing unit 12a1 may be a CPU (Central Processing Unit). The storage unit 12a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 12a3 may communicate with the board processing system 10 via a communication line such as a LAN (Local Area Network).

[0020] Figure 6 is a schematic cross-sectional view showing an example of the AA cross-section of the substrate processing system 10 illustrated in Figures 1 and 5. Figure 7 is a schematic cross-sectional view showing an example of the BB cross-section of the substrate processing system 10 illustrated in Figures 1 and 5.

[0021] A transport robot 52 is provided inside the EFEM 50. The transport robot 52 transports the substrate W between the FOUP installed on the LP60 and the LLM40. The transport robot 52 is movable within the EFEM 50, for example, in the direction of arrow C in Figure 1. The transport robot 52 has a mounting section 520 on which the substrate W is placed, and an arm section 521 that moves the mounting section 520. The arm section 521 has a cylindrical body 521a and a cylindrical body 521b. The cylindrical body 521a is positioned inside the EFEM 50 so that its axis is vertical. The cylindrical body 521b can be housed inside the cylindrical body 521a and is positioned inside the EFEM 50 so that it is coaxial with the cylindrical body 521a. The arm section 521 extends and retracts vertically along the axis of the cylindrical body 521a by sliding the cylindrical body 521b relative to the cylindrical body 521a, thereby moving the mounting section 520 vertically. This makes it possible to reduce the footprint of the transport robot 52.

[0022] A gate valve 42 is provided between EFEM50 and LLM40. A gate valve 43 is also provided between LLM40 and VTM20. A transport robot 41 is provided inside LLM40. The transport robot 41 has a mounting section 410 on which the substrate W is placed.

[0023] Within the VTM20, a transport robot 21 is provided above the PM30. The transport robot 21 has a mounting section 210 on which the substrate W is placed. Transport robots 22 and 23 are positioned in the portion of the VTM20 sandwiched between adjacent PM30s. Transport robot 22 has a mounting section 220 on which the substrate W is placed. Transport robot 23 has a mounting section 230 on which the substrate W is placed. Between the VTM20 and the PM30, a gate valve 31 is provided, for example, as shown in Figure 7.

[0024] [PM30 Configuration] Figure 8 is a schematic cross-sectional view showing an example of PM30. In this embodiment, PM30 is, for example, a capacitively coupled plasma processing apparatus. PM30 includes a plasma processing chamber 310, a gas supply unit 320, a power supply 330, and an exhaust system 340. PM30 also includes a substrate support unit 311 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 310. The gas introduction unit includes a shower head 313. The substrate support unit 311 is located inside the plasma processing chamber 310. The shower head 313 is located above the substrate support unit 311. In one embodiment, the shower head 313 constitutes at least a portion of the ceiling of the plasma processing chamber 310. The plasma processing chamber 310 has a plasma processing space 310s defined by the shower head 313, the side walls 310a of the plasma processing chamber 310, and the substrate support unit 311. The plasma processing chamber 310 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 310s, and at least one gas outlet for discharging gas from the plasma processing space 310s. The plasma processing chamber 310 is grounded. The shower head 313 and the substrate support portion 311 are electrically insulated from the housing of the plasma processing chamber 310. An opening 32 is formed in the side wall 310a of the plasma processing chamber 310 for loading and unloading the substrate W. The opening 32 is opened and closed by a gate valve 31.

[0025] The substrate support portion 311 includes a main body portion 3111 and a ring assembly 3112. The main body portion 3111 has a central region 3111a for supporting the substrate W and an annular region 3111b for supporting the ring assembly 3112. A wafer is an example of a substrate W. The annular region 3111b of the main body portion 3111 surrounds the central region 3111a of the main body portion 3111 in a plan view. The substrate W is placed on the central region 3111a of the main body portion 3111, and the ring assembly 3112 is placed on the annular region 3111b of the main body portion 3111 so as to surround the substrate W on the central region 3111a of the main body portion 3111. The central region 3111a is also called the substrate support surface for supporting the substrate W, and the annular region 3111b is also called the ring support surface for supporting the ring assembly 3112.

[0026] In one embodiment, the main body 3111 includes a base 31110 and an electrostatic chuck 31111. The base 31110 includes a conductive member. The conductive member of the base 31110 can function as a lower electrode. The electrostatic chuck 31111 is positioned on the base 31110. The electrostatic chuck 31111 includes a ceramic member 31111a and an electrostatic electrode 31111b positioned within the ceramic member 31111a. The ceramic member 31111a has a central region 3111a. In one embodiment, the ceramic member 31111a also has an annular region 3111b. Note that other members surrounding the electrostatic chuck 31111, such as an annular electrostatic chuck or an annular insulating member, may also have an annular region 3111b. In this case, the ring assembly 3112 may be positioned on the annular electrostatic chuck or the annular insulating member, or on both the electrostatic chuck 31111 and the annular insulating member. Furthermore, at least one RF / DC electrode, coupled to the RF (Radio Frequency) power supply 331 and / or DC (Direct Current) power supply 332 described later, may be placed within the ceramic member 31111a. In this case, at least one RF / DC electrode functions as a lower electrode. When a bias RF signal and / or DC signal, described later, is supplied to at least one RF / DC electrode, the RF / DC electrode is also called a bias electrode. Note that the conductive member of the base 31110 and at least one RF / DC electrode may function as multiple lower electrodes. Also, the electrostatic electrode 31111b may function as a lower electrode. The substrate support portion 311 includes at least one lower electrode.

[0027] The ring assembly 3112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one covering ring. The edge rings are formed of a conductive or insulating material, and the covering rings are formed of an insulating material.

[0028] The substrate support portion 311 may also include a temperature control module configured to adjust at least one of the electrostatic chuck 31111, the ring assembly 3112, and the substrate W to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 31110a, or a combination thereof. A heat transfer fluid, such as brine or gas, flows through the flow path 31110a. In one embodiment, the flow path 31110a is formed within the base 31110, and one or more heaters are arranged within the ceramic member 31111a of the electrostatic chuck 31111. The substrate support portion 311 may also include a heat transfer gas supply portion configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 3111a.

[0029] The shower head 313 is configured to introduce at least one processing gas from the gas supply unit 320 into the plasma processing space 310s. The shower head 313 has at least one gas supply port 313a, at least one gas diffusion chamber 313b, and a plurality of gas inlet ports 313c. The processing gas supplied to the gas supply port 313a passes through the gas diffusion chamber 313b and is introduced into the plasma processing space 310s through the plurality of gas inlet ports 313c. The shower head 313 also includes at least one upper electrode. In addition to the shower head 313, the gas introduction unit may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 310a.

[0030] The gas supply unit 320 may include at least one gas source 321 and at least one flow controller 322. In one embodiment, the gas supply unit 320 is configured to supply at least one processing gas to the shower head 313 from a corresponding gas source 321 via a corresponding flow controller 322. Each flow controller 322 may include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 320 may include one or more flow modulation devices that modulate or pulse the flow rate of at least one processing gas.

[0031] The power supply 330 includes an RF power supply 331 coupled to the plasma processing chamber 310 via at least one impedance matching circuit. The RF power supply 331 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This causes plasma to be formed from at least one processing gas supplied to the plasma processing space 310s. Thus, the RF power supply 331 can function as at least part of a plasma generation unit configured to generate plasma from one or more processing gases in the plasma processing chamber 310. Additionally, by supplying a bias RF signal to at least one lower electrode, a bias potential is generated on the substrate W, which can draw ionic components in the formed plasma into the substrate W.

[0032] In one embodiment, the RF power supply 331 includes a first RF generation unit 331a and a second RF generation unit 331b. The first RF generation unit 331a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generation unit 331a may be configured to generate a plurality of source RF signals having different frequencies. One or more generated source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0033] The second RF generation unit 331b is coupled to at least one lower electrode via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a lower frequency than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 331b may be configured to generate a plurality of bias RF signals having different frequencies. One or more generated bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0034] The power supply 330 may also include a DC power supply 332 coupled to the plasma processing chamber 310. The DC power supply 332 includes a first DC generation unit 332a and a second DC generation unit 332b. In one embodiment, the first DC generation unit 332a is connected to at least one lower electrode and configured to generate a first DC signal. The generated first bias DC signal is applied to at least one lower electrode. In one embodiment, the second DC generation unit 332b is connected to at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to at least one upper electrode.

[0035] In various embodiments, at least one of the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a rectangular, trapezoidal, triangular, or a combination thereof pulse waveform. In one embodiment, a waveform generation unit for generating a sequence of voltage pulses from a DC signal is connected between the first DC generation unit 332a and at least one lower electrode. Thus, the first DC generation unit 332a and the waveform generation unit constitute a voltage pulse generation unit. When the second DC generation unit 332b and the waveform generation unit constitute a voltage pulse generation unit, the voltage pulse generation unit is connected to at least one upper electrode. The voltage pulses may have positive or negative polarity. The sequence of voltage pulses may also include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. The first DC generation unit 332a and the second DC generation unit 332b may be provided in addition to the RF power supply 331, and the first DC generation unit 332a may be provided in place of the second RF generation unit 331b.

[0036] The exhaust system 340 may be connected to a gas outlet 310e located at the bottom of the plasma processing chamber 310, for example. The exhaust system 340 may also include a pressure regulating valve and a vacuum pump. The pressure regulating valve regulates the pressure within the plasma processing space 310s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0037] [Transportation procedure for substrate W] The following describes an example of the substrate W transport procedure in the substrate processing system 10, with reference to Figures 9 to 22.

[0038] First, the FOUP 61 containing the substrate W is placed on the LP 60, and the gate valve 51 is opened. Then, the mounting section 520 of the transport robot 52 is inserted into the FOUP 61, and the substrate W is placed on the mounting section 520. Then, as shown in Figure 9, for example, the substrate W is unloaded from the FOUP 61.

[0039] Next, as shown in Figure 10, for example, the arm portion 521 extends so that the height of the substrate W placed on the mounting portion 520 is at the position of the gate valve 42. Then, with the LLM 40 in an atmospheric pressure state, the gate valve 42 is opened. Then, as shown in Figure 10, for example, the mounting portion 520 on which the substrate W is placed is inserted into the LLM 40, and the substrate W is transferred from the mounting portion 520 of the transport robot 52 to the mounting portion 410 of the transport robot 41.

[0040] When the substrate W is transferred, the mounting section 410 of the transport robot 41 and the mounting section 520 of the transport robot 52 are in a positional relationship as shown in Figure 11, for example. Figure 11 is a diagram showing an example of the process of transferring the substrate W. As a result, the mounting section 410 of the transport robot 41 and the mounting section 520 of the transport robot 52 can transfer the substrate W without interfering with each other.

[0041] Next, as shown in Figure 12, for example, the mounting section 520 of the transport robot 52 retracts from inside the LLM 40, and the gate valve 42 closes. The pressure inside the LLM 40 is then reduced from atmospheric pressure to a vacuum. The mounting section 410 on which the substrate W is placed moves above the gate valve 43, and the gate valve 43 opens. Then, as shown in Figure 12, for example, the transport robot 22 positioned below the gate valve 43 extends, and the mounting section 220 of the transport robot 22 is inserted into the LLM 40. The mounting section 220 of the transport robot 22 lifts the substrate W on the mounting section 410 of the transport robot 41, and the mounting section 410 of the transport robot 41 retracts from above the gate valve 43. As a result, the substrate W is transferred from the mounting section 410 of the transport robot 41 to the mounting section 220 of the transport robot 22.

[0042] In this embodiment, the transport robot 22 has a mounting section 220 on which the substrate W is placed, and an arm section 221 that moves the mounting section 220 in the vertical direction. The arm section 221 has a cylindrical body 221a and a cylindrical body 221b. The cylindrical body 221a is arranged in the VTM 20 such that its axis is in the vertical direction. The cylindrical body 221b is housed inside the cylindrical body 221a and is arranged in the VTM 20 coaxially with the cylindrical body 221a. The arm section 221 extends and retracts vertically along the axis of the cylindrical body 221a by sliding the cylindrical body 221b relative to the cylindrical body 221a, thereby moving the mounting section 220 in the vertical direction. This makes it possible to reduce the installation area of ​​the transport robot 22. The cylindrical body 221a is an example of a first cylindrical body, and the cylindrical body 221b is an example of a second cylindrical body.

[0043] Here, when the substrate W is transferred, the mounting section 410 of the transport robot 41 and the mounting section 220 of the transport robot 22 are in a positional relationship as shown in Figure 13, for example. Figure 13 is a diagram showing an example of the process of transferring the substrate W. As a result, the mounting section 410 of the transport robot 41 and the mounting section 220 of the transport robot 22 can transfer the substrate W without interfering with each other. When the substrate W is transferred from the mounting section 410 of the transport robot 41 to the mounting section 220 of the transport robot 22, the cylindrical body 221a of the arm section 221 passes between the mounting section 230 of the transport robot 23, for example, as shown in Figure 14. Therefore, the cylindrical body 221a of the arm section 221 and the mounting section 230 of the transport robot 23 do not interfere with each other.

[0044] Next, the arm portion 221 of the transport robot 22 retracts, and the substrate W is transferred from the mounting portion 220 of the transport robot 22 to the mounting portion 230 of the transport robot 23, for example, as shown in Figure 15. The positional relationship between the mounting portion 220 of the transport robot 22 and the mounting portion 230 of the transport robot 23 at this time is as shown in Figure 16, for example. This allows the mounting portion 220 of the transport robot 22 and the mounting portion 230 of the transport robot 23 to transfer the substrate W without interfering with each other. Then, the gate valve 31 of the PM30 is opened, and the mounting portion 230 on which the substrate W is placed is inserted into the PM30, for example, as shown in Figure 17, and the substrate W is transported into the PM30.

[0045] When the substrate W is to be removed from PM30, the substrate W inside PM30 is placed on the mounting section 230 of the transport robot 23 and removed from PM30. Then, the substrate W is transferred from the mounting section 230 of the transport robot 23 to the mounting section 220 of the transport robot 22, and the gate valve 43 is opened. Then, the arm section 221 of the transport robot 22 extends, and the mounting section 220 on which the substrate W is placed is inserted into LLM40. Then, the mounting section 410 of the transport robot 41 is inserted below the mounting section 220 of the transport robot 22. Then, as the arm section 221 of the transport robot 22 retracts, the substrate W is transferred from the mounting section 220 of the transport robot 22 to the mounting section 410 of the transport robot 41. Then, the gate valve 43 is closed, and the pressure inside LLM40 is raised from a vacuum atmosphere to an atmospheric pressure atmosphere. Then, the gate valve 42 is opened, the mounting section 520 of the transport robot 52 is inserted into the LLM 40, and the substrate W is transferred from the mounting section 410 of the transport robot 41 to the mounting section 520 of the transport robot 52. Then, the arm section 521 of the transport robot 52 retracts, and the mounting section 520 on which the substrate W is placed is inserted into the FOUP 61, and the substrate W is housed inside the FOUP 61.

[0046] When substrates W are loaded into another PM30, the substrates W that have been unloaded from the LLM40 by the transport robot 22 are handed over to the mounting section 210 of the transport robot 21, for example, as shown in Figure 18. The positional relationship between the mounting section 220 of the transport robot 22 and the mounting section 210 of the transport robot 21 at this time is as shown in Figure 19, for example. This allows the mounting section 220 of the transport robot 22 and the mounting section 210 of the transport robot 21 to hand over the substrates W without interfering with each other.

[0047] Next, the transport robot 21 moves the substrate W above the transport robot 22, which is positioned near the other PM 30. Then, as shown in Figure 20, for example, the arm 221 of the transport robot 22 positioned near the other PM 30 extends, and the substrate W is lifted from the mounting section 210 of the transport robot 21 by the arm 220 of the transport robot 22. As a result, the substrate W is transferred from the mounting section 210 of the transport robot 21 to the mounting section 220 of the transport robot 22. Then, the mounting section 210 of the transport robot 21 retracts from below the mounting section 220 of the transport robot 22.

[0048] Next, the arm portion 221 of the transport robot 22 retracts, and the substrate W is transferred from the mounting portion 220 of the transport robot 22 to the mounting portion 230 of the transport robot 23, for example, as shown in Figure 21. Then, the gate valve 31 of the PM30 is opened, and the mounting portion 230 on which the substrate W is placed is inserted into the PM30, for example, as shown in Figure 22, and the substrate W is transported into the PM30.

[0049] One embodiment has been described above. As described above, the substrate processing system 10 in this embodiment comprises one or more PM30s and a VTM20. At least one PM30 and the VTM20 are arranged such that, in a top view, at least a portion of the PM30 and at least a portion of the VTM20 overlap. This makes it possible to reduce the installation area of ​​the substrate processing system 10.

[0050] Here, the economic value provided by the substrate processing system 10 can be evaluated using an indicator such as WPPS (Wafer price per space). WPPS is calculated, for example, by the following formula (1). WPPS = (WPD × Operating Rate × Yield) / Installation Area × Equipment Price ... (1) In equation (1) above, WPD (Wafer Per day) represents the number of wafers W that can be processed in one day.

[0051] In this embodiment, the "installation area" included in formula (1) above can be reduced, thereby increasing the WPPS value and enhancing the economic value of the substrate processing system 10.

[0052] Furthermore, in the embodiment described above, the VTM20 is placed on at least one PM30. This allows for easy configuration of the substrate processing system 10.

[0053] Furthermore, in the above-described embodiment, the substrate processing system 10 further includes an LLM40 connected to the VTM20. In addition, at least one PM30 and LLM40 are arranged such that, when viewed from above, at least a portion of the PM30 and at least a portion of the LLM40 overlap. This reduces the installation area of ​​the substrate processing system 10.

[0054] Furthermore, in the embodiment described above, at least a portion of the VTM20 is positioned between at least one PM30 and LLM40. Also, the at least one PM30, VTM20, and LLM40 are positioned such that, when viewed from above, at least a portion of the PM30, at least a portion of the VTM20, and at least a portion of the LLM40 overlap. This reduces the installation area of ​​the substrate processing system 10.

[0055] Furthermore, in the embodiment described above, the LLM40 is placed on top of the VTM20. This allows for easy configuration of the substrate processing system 10.

[0056] Furthermore, in the above-described embodiment, the substrate processing system 10 includes a transport robot 22 provided within the VTM 20 for transporting the substrate W between the VTM 20 and the PM 30. The transport robot 22 has a mounting section 220 on which the substrate W is placed, and an arm section 221 for moving the mounting section 220 in the vertical direction. The arm section 221 includes a cylindrical body 221a arranged so that its axis is in the vertical direction, and a cylindrical body 221b that can be housed inside the cylindrical body 221a and is arranged so as to be coaxial with the cylindrical body 221a. The arm section 221 extends and retracts along the axis of the cylindrical body 221a by sliding the cylindrical body 221b relative to the cylindrical body 221a, thereby moving the mounting section 220 in the vertical direction. This reduces the installation area of ​​the transport robot 22.

[0057] [others] Furthermore, the technology disclosed in this application is not limited to the embodiments described above, and numerous modifications are possible within the scope of its essence.

[0058] For example, in the embodiment described above, the LLM40 is positioned on top of the VTM20, but the disclosed technology is not limited to this. In other forms, the LLM40 may be positioned next to the VTM20. Even in this case, at least one PM30 and the VTM20 are positioned such that, in a top view, at least a portion of the PM30 and at least a portion of the VTM20 overlap. Therefore, the installation area of ​​the substrate processing system 10 can be reduced compared to the case where the VTM20, PM30, LLM40, and EFEM50 are all positioned side by side.

[0059] Furthermore, even when the LLM40 is positioned next to the VTM20, it is preferable that at least a portion of the PM30 and at least a portion of the LLM40 overlap, as shown in Figure 23, for example. Figure 23 is a schematic cross-sectional view showing another example of the substrate processing system 10. By arranging the VTM20, PM30, and LLM40 in this manner, the installation area of ​​the substrate processing system 10 can also be reduced.

[0060] Furthermore, in the embodiments described above, a portion of the VTM20 is placed on the PM30 and the LLM40 is placed on the VTM20, but the disclosed technology is not limited thereto. In other embodiments, for example, as shown in Figure 24, the VTM20 may be placed on the LLM40 and the PM30 may be placed on a portion of the VTM20. Figure 24 is a schematic cross-sectional view showing another example of the substrate processing system 10. In the example of Figure 24, the arm portion 221 of the transport robot 22 in the VTM20 moves the mounting portion 220 by extending and retracting vertically from above the VTM20. Even in such embodiments of the substrate processing system 10, the installation area of ​​the substrate processing system 10 can be reduced.

[0061] Furthermore, in the embodiments described above, multiple PM30s are arranged side by side, but the disclosed technology is not limited to this. In other forms, multiple PM30s may be arranged vertically, for example, as shown in Figure 25. Figure 25 is a schematic cross-sectional view showing another example of the substrate processing system 10. In the example of Figure 25, multiple PM30s are arranged two to each other vertically. Also, in the example of Figure 25, the arm portion 231 of the transport robot 23 is extendable and retractable in the vertical direction, enabling loading and unloading of substrates W to the upper PM30 and to the lower PM30. This makes it possible to reduce the installation area of ​​the substrate processing system 10 even in a substrate processing system 10 equipped with a large number of PM30s. Note that in the example of Figure 25, there are two PM30s arranged vertically, but there may be more than two PM30s arranged vertically.

[0062] Furthermore, in the embodiments described above, the EFEM 50 is positioned to the side of the VTM 20, but the disclosed technology is not limited thereto. In other embodiments, the EFEM 50 may be positioned such that, in a top view, at least a portion of the EFEM 50 overlaps with at least a portion of the VTM 20. Also, at least one LP 60 may be positioned such that, in a top view, at least a portion of the LP 60 overlaps with at least a portion of the LLM 40. Figure 26 is a schematic cross-sectional view showing another example of the substrate processing system 10. In the example of Figure 26, the EFEM 50 is positioned on the VTM 20, and multiple LP 60s are positioned on the LLM 40. Also in the example of Figure 26, the arm portion 521 of the transport robot 52 inside the EFEM 50 extends and retracts vertically from above the EFEM 50, thereby moving the mounting portion 520 vertically. Even in such embodiments of the substrate processing system 10, the installation area of ​​the substrate processing system 10 can be reduced.

[0063] Furthermore, in the substrate processing system 10 illustrated in Figure 26, multiple LLMs 40 are arranged next to the EFEM 50, but the disclosed technology is not limited to this. In yet another embodiment, the LLMs 40 may be arranged below the EFEM 50, for example, as shown in Figure 27. Figure 27 is a schematic cross-sectional view showing another example of the substrate processing system 10. In the example of Figure 27, the substrate W, which has been handed over to the transfer robot 41 in the LLM 40, is handed over to the mounting section 220 of the transfer robot 22 via the gate valve 43. Therefore, in the example of Figure 27, the transfer robot 21 is not provided in the VTM 20. Although two transfer robots 41 are provided in the LLM 40 in the example of Figure 27, the number of transfer robots 41 provided in the LLM 40 may be one.

[0064] Furthermore, in the substrate processing system 10 illustrated in Figure 26, multiple PM30s are arranged side by side, but the disclosed technology is not limited to this. In yet another form, multiple PM30s may be arranged vertically, for example, as shown in Figure 28. Figure 28 is a schematic cross-sectional view showing another example of the substrate processing system 10. In the example of Figure 28, there are two PM30s arranged vertically, but there may be more than two PM30s arranged vertically. This makes it possible to reduce the installation area of ​​the substrate processing system 10 even when it has a large number of PM30s.

[0065] Furthermore, in the embodiments described above, PM30, which processes using capacitively coupled plasma (CCP), was explained as an example of a plasma source, but the plasma source is not limited to this. Examples of plasma sources other than capacitively coupled plasma include inductively coupled plasma (ICP), microwave-excited surface wave plasma (SWP), electron cyclotron resonance plasma (ECP), and helicon wave-excited plasma (HWP).

[0066] Furthermore, while the PM30 in the above-described embodiment uses plasma to process the substrate W, the disclosed technology is not limited to this. The PM30 may be any apparatus that processes the substrate W, such as heat treatment or CVD (Chemical Vapor Deposition), which does not use plasma.

[0067] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of Symbols]

[0068] W board 10. Substrate Processing System 12 Control device 12a Computer 12a1 Processing Unit 12a2 Storage section 12a3 communication interface 20 VTM 21 Transport robots 210 Mounting section 22 Transport robots 220 Mounting section 221 Arm section 221a Cylindrical body 221b Cylinder 23 Transport robots 230 Mounting section 231 Arm section 30 PM 31 Gate valve 32 openings 310 Plasma Processing Chamber 310a side wall 310e Gas outlet 310s Plasma Processing Space 311 Substrate support section 3111 Main body 31110 Base 31111 Electrostatic Chuck 3112 Ring Assembly 313 Shower Head 320 Gas Supply Department 321 Gas Source 322 Flow controller 330 Power supply 331 RF power supply 332 DC power supply 340 Exhaust System 40 LLM 41 Transport robots 410 Mounting section 42 Gate valve 43 Gate valve 50 EFEM 51 Gate valve 52 Transport robots 520 Mounting section 521 Arm section 521a cylinder 521b cylinder 60 LP 61 FOUP

Claims

1. A vacuum transport module, Multiple process modules connected to the vacuum transport module, A load lock module is placed on top of the vacuum transport module, Atmospheric transport module, A first transport unit is located within the aforementioned atmospheric transport module, Load port and, Equipped with, The first transport unit is, It is configured to transport a substrate between a first height and a second height that is smaller than the first height. The substrate is configured to be transported between the atmospheric transport module and the load lock module at the first height, A substrate processing system configured to transport substrates between the atmospheric transport module and a container on the load port at the second height.

2. The substrate processing system according to claim 1, wherein the atmospheric transport module is located next to the vacuum transport module and the load lock module.

3. The substrate processing system according to claim 2, wherein the load port is located on the opposite side of the vacuum transport module and the load lock module.

4. The substrate processing system according to any one of claims 1 to 3, wherein the vacuum transport module is arranged to overlap with the plurality of process modules when viewed from above.

5. The substrate processing system according to claim 1, further comprising a second transport unit disposed within the vacuum transport module and configured to transport the substrate vertically through the upper opening of the vacuum transport module and the lower opening of the load lock module.

6. The substrate processing system according to claim 5, further comprising a third transport unit disposed within the load lock module and configured to transport substrates in a horizontal direction.

7. The substrate processing system according to claim 6, further comprising at least one fourth transport unit disposed within the vacuum transport module and configured to transport substrates in a horizontal direction.

8. A vacuum transport module, Multiple process modules connected to the vacuum transport module, A load lock module is placed on top of the vacuum transport module, Atmospheric transport module, A first transport unit is located within the atmospheric transport module, Load port and, Equipped with, The first transport unit is, It is configured to transport a substrate between a first height and a second height that is greater than the first height. The substrate is configured to be transported between the atmospheric transport module and the load lock module at the first height, A substrate processing system configured to transport substrates between the atmospheric transport module and a container on the load port at the second height.

9. The substrate processing system according to claim 8, wherein the atmospheric transport module is disposed on top of the vacuum transport module.

10. The substrate processing system according to claim 9, wherein the load port is located on the load lock module.

11. The substrate processing system according to claim 8, wherein the plurality of process modules include a first process module and a second process module arranged vertically on top of each other.

12. The substrate processing system according to any one of claims 8 to 11, wherein the vacuum transport module is arranged to overlap with the plurality of process modules in a top view.

13. The substrate processing system according to claim 8, further comprising a second transport unit disposed within the vacuum transport module and configured to transport the substrate vertically through the upper opening of the vacuum transport module and the lower opening of the load lock module.

14. The substrate processing system according to claim 13, further comprising a third transport unit disposed within the load lock module and configured to transport substrates in a horizontal direction.

15. The substrate processing system according to claim 14, further comprising at least one fourth transport unit disposed within the vacuum transport module and configured to transport substrates in a horizontal direction.

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