Semiconductor equipment

Abstract

To provide an electronic device (semiconductor device) improved in reliability.SOLUTION: The electronic device A5 includes an electronic part 1 having electrodes, a die pad 21 having a main surface 211 (mounting surface) on which the electronic part 1 is mounted, a bond for bonding the electronic part 1 to the die pad 21, a plurality of leads 23 (terminals), a connector for electrically connecting the electrodes to any of the leads 23, and a plastic member 5. The main surface 211 includes a first area 211a in which a plurality of grooves 711 (first grooves) are formed below the electronic components 1 and a second area 211a that surrounds the first area 211b and in which a plurality of grooves 721 (second grooves) are formed. The plurality of grooves 711 have a linear shape extending in the y direction (second direction), and the plurality of grooves 711 are arranged in parallel to each other. The plurality of grooves 721 include a groove 721 that is longer than one side of the electronic component 1 as viewed in the z direction (first direction).SELECTED DRAWING: Figure 21

Description

Technical Field

[0001] The present disclosure relates to an electronic device and a method for manufacturing the electronic device. Background Art

[0002] Patent Document 1 describes a conventional electronic device. The electronic device described in Patent Document 1 includes a lead frame (a metal member), a semiconductor element (an electronic component), and a mold resin (a resin member). The semiconductor element is mounted on the lead frame by, for example, soldering. The mold resin covers a part of the lead frame and the semiconductor element. Prior Art Documents Patent Documents

[0003] Patent Document 1 Japanese Unexamined Patent Publication No. 2006-310609 Summary of the Invention Problem to be Solved by the Invention

[0004] For the aforementioned soldering, for example, a reflow method is available. In this reflow soldering, the solder temporarily becomes liquid. At this time, the liquid solder may flow out to unintended locations. Such outflow of solder causes short-circuit abnormalities, deterioration of electrical and thermal characteristics, and bonding abnormalities of semiconductor elements in electronic devices, leading to a decrease in the reliability of electronic devices.

[0005] The present disclosure has been conceived in view of the above problems, and an object of the present disclosure is to provide an electronic device with improved reliability and a method for manufacturing the electronic device. Means for Solving the Problem

[0006] An electronic device provided by a first aspect of the present disclosure comprises an electronic component, a support member having a mounting surface on which the electronic component is mounted, and a bonding material interposed between the electronic component and the support member to fix the electronic component to the support member, wherein the mounting surface has a first region in which a plurality of grooves are formed, and a second region surrounding the first region when viewed in a first direction, and the bonding material is in contact with the first region but not with the second region.

[0007] A method for manufacturing an electronic device provided by a second aspect of this disclosure comprises: a first step of preparing a support member having a mounting surface; a second step of forming a first region and a second region surrounding the first region when viewed in a first direction on the mounting surface; a third step of applying a bonding material to the first region; a fourth step of placing an electronic component on the bonding material; and a fifth step of heating and cooling the bonding material to fix the electronic component to the support member with the bonding material, wherein in the second step, the first region is formed by forming a plurality of grooves on a part of the mounting surface, and the bonding material after the fifth step is in contact with the first region but not with the second region. [Effects of the Invention]

[0008] The electronic device of this disclosure can improve reliability. Furthermore, the manufacturing method of this disclosure can produce an electronic device with improved reliability. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing an electronic device according to the first embodiment. [Figure 2] In the plan view of Figure 1, electronic components and bonding materials are shown with dashed lines, and connecting members are omitted. [Figure 3] This is a bottom view showing an electronic device according to the first embodiment. [Figure 4] This is a side view (right side view) showing an electronic device according to the first embodiment. [Figure 5] This is a cross-sectional view along the VV line in Figure 1. [Figure 6] It is a partially enlarged cross-sectional view obtained by enlarging the region VI of FIG. 5. [Figure 7] It is a partially enlarged cross-sectional view obtained by enlarging the region VII of FIG. 5. [Figure 8] It is a partially enlarged cross-sectional view showing the first region according to a modified example. [Figure 9] It is a plan view showing one step of the method for manufacturing an electronic device according to the first embodiment. [Figure 10] It is a plan view showing one step of the method for manufacturing an electronic device according to the first embodiment. [Figure 11] It is a plan view showing one step of the method for manufacturing an electronic device according to the first embodiment. [Figure 12] It is a plan view showing one step of the method for manufacturing an electronic device according to the first embodiment. [Figure 13] It is a plan view showing one step of the method for manufacturing an electronic device according to the first embodiment. [Figure 14] It is a plan view showing an electronic device according to the second embodiment. [Figure 15] It is a cross-sectional view taken along line XV-XV of FIG. 14. [Figure 16] It is a plan view showing an electronic device according to the third embodiment. [Figure 17] It is a cross-sectional view taken along line XVII-XVII of FIG. 16. [Figure 18] It is a plan view showing an electronic device according to the fourth embodiment. [Figure 19] It is a cross-sectional view taken along line XIX-XIX of FIG. 18. [Figure 20] It is a plan view showing an electronic device according to the fifth embodiment. [Figure 21] It is an enlarged view of an essential part obtained by enlarging a part of FIG. 20. [Figure 22] It is a side view (right side view) showing an electronic device according to the fifth embodiment. [Figure 23] It is a cross-sectional view taken along line XXIII-XXIII of FIG. 20. [Figure 24] It is a plan view showing the first region according to a modified example. [Figure 25]It is a plan view showing a first region according to a modification.

Mode for Carrying Out the Invention

[0010] Preferred embodiments of the electronic device of the present disclosure are described below with reference to the drawings. Constituent elements that are the same or similar are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0011] Figures 1 to 7 show an electronic device according to a first embodiment. The electronic device A1 of the first embodiment includes an electronic component 1, a lead frame 2, a bonding material 3, a connecting member 4, and a resin member 5.

[0012] Figure 1 is a plan view showing the electronic device A1, in which the resin member 5 is indicated by an imaginary line (a two-dot chain line). Figure 2 is the plan view of Figure 1, in which the bonding material 3 and the connecting member 4 are omitted, and the electronic component 1 is indicated by an imaginary line. Figure 3 is a bottom view showing the electronic device A1. Figure 4 is a side view (right side view) showing the electronic device A1. Figure 5 is a cross-sectional view taken along line V-V of Figure 1. Figure 6 is a partially enlarged cross-sectional view enlarging region VI of Figure 5. Figure 7 is a partially enlarged cross-sectional view enlarging region VII of Figure 5.

[0013] For convenience of description, three mutually orthogonal directions are defined as an x direction, a y direction, and a z direction in Figures 1 to 7. The z direction is the thickness direction of the electronic device A1. The x direction is the left-right direction in the plan view (see Figure 1) of the electronic device A1. The y direction is the up-down direction in the plan view (see Figure 1) of the electronic device A1. In the following description, one side in the z direction (upper side in the cross-sectional view shown in Figure 5) may be referred to as upper, and the other side in the z direction (lower side in the cross-sectional view shown in Figure 5) may be referred to as lower, but this does not limit the posture of the electronic device A1. The z direction corresponds to the "first direction" recited in the claims.

[0014] Electronic device A1 is a surface-mount package type. As shown in Figures 1 to 7, electronic device A1 is a package in which, in a plan view, the lead wires (terminal lead portion 23 described later) do not protrude from the resin member 5.

[0015] Electronic component 1 is the functional core of electronic device A1. Electronic component 1 is an integrated circuit (IC), such as an LSI (Large Scale Integration). However, electronic component 1 is not limited to an IC and may be a voltage control element such as an LDO (Low Dropout), an amplification element such as an operational amplifier, or a discrete component such as a transistor, diode, LED, or terahertz element. Furthermore, electronic component 1 may be a resistor, inductor, capacitor, etc.

[0016] The electronic component 1 is, for example, rectangular in plan view. The electronic component 1 is joined to a part of the lead frame 2 (the die pad portion 21 described later) by a bonding material 3. As shown in Figures 4 and 5, the electronic component 1 has a main surface 11 and a back surface 12.

[0017] The main surface 11 and the back surface 12 are spaced apart in the z-direction. The main surface 11 is the top surface of the electronic component 1, and the back surface 12 is the bottom surface of the electronic component 1. Both the main surface 11 and the back surface 12 are flat.

[0018] The electronic component 1 has multiple electrode pads 13. Each electrode pad 13 is a terminal of the electronic component 1. Each electrode pad 13 is exposed from the main surface 11.

[0019] The lead frame 2, when mounted on a circuit board of an electronic device or the like, forms an electrical path between the electronic component 1 and the circuit board. The lead frame 2 supports the electronic component 1. The lead frame 2 contains a conductive material. This conductive material is, for example, a metal containing Cu (copper). Specifically, the lead frame 2 may be a metal plate of Cu or a Cu alloy, or it may be an organic substrate with Cu formed on its surface. The surface layer of the lead frame 2 is a metal containing Cu. The lead frame 2 corresponds to the "support member" described in the claims. As shown in Figure 1, the lead frame 2 includes a die pad portion 21, a plurality of suspension lead portions 22, and a plurality of terminal lead portions 23. In electronic device A1, as shown in Figure 1, the lead frame 2 includes one die pad portion 21, two suspension lead portions 22, and eight terminal lead portions 23.

[0020] As shown in Figures 1 and 5, the die pad portion 21 has an electronic component 1 fixed to it via a bonding material 3, and the electronic component 1 is mounted on it. The die pad portion 21 is, for example, rectangular in plan view. As shown in Figure 5, the die pad portion 21 has a main surface 211 and a back surface 212.

[0021] The main surface 211 and the back surface 212 are spaced apart in the z direction. The main surface 211 is the upper surface of the die pad portion 21. The back surface 212 is the lower surface of the die pad portion 21. As shown in Figures 3 to 5, the back surface 212 is exposed from the resin member 5. The back surface 212 may be covered by the resin member 5. However, exposing the back surface 212 from the resin member 5 enhances the effect of dissipating heat from the electronic component 1. As shown in Figure 2, the main surface 211 has a first region 211a and a second region 211b. Details of these first region 211a and second region 211b will be described later. The main surface 211 corresponds to the "mounting surface" described in the claims.

[0022] Each of the multiple suspension lead portions 22 is connected to the die pad portion 21, as shown in Figures 1 and 5. In a plan view, each of the multiple suspension lead portions 22 extends in the y-direction from each y-edge of the die pad portion 21. A portion of each suspension lead portion 22 is bent in the z-direction. In the example shown in Figure 5, in the y-direction, the edge of each suspension lead portion 22 that connects to the die pad portion 21 is located lower in the z-direction than the opposite edge, but it may also be located higher in the z-direction.

[0023] Each of the multiple terminal lead portions 23 is partially exposed from the resin member 5 and serves as an external terminal of the electronic device A1. As shown in Figure 1, each terminal lead portion 23 is spaced apart from the die pad portion 21 and the suspension lead portion 22. As shown in Figures 1 to 4, each terminal lead portion 23 includes a pad portion 231 and a terminal portion 232, respectively.

[0024] One end of the connecting member 4 is joined to the pad portion 231. A portion of the terminal portion 232 is exposed from the resin member 5. In each terminal lead portion 23, the pad portion 231 and the terminal portion 232 are connected and formed integrally.

[0025] As shown in Figures 4 and 5, the bonding material 3 is interposed between the electronic component 1 and the die pad portion 21 (lead frame 2) to bond them together. The constituent material of the bonding material 3 includes a solid of the first composition. The first composition is, for example, solder. This solder may be lead-free solder or lead-containing solder. The bonding material 3 may also be a conductive bonding material other than solder. Furthermore, the bonding material 3 may be an insulating bonding material instead of a conductive bonding material. The first composition is a material that undergoes a phase transition to a liquid state when heated.

[0026] As shown in Figure 5, the bonding material 3 has a first surface 31, a second surface 32, and a third surface 33. The first surface 31 faces upward in the z direction and contacts the electronic component 1. The second surface 32 faces downward in the z direction and contacts the die pad portion 21 of the lead frame 2. In this embodiment, the second surface 32 substantially coincides with the first region 211a in a plan view. The third surface 33 connects to the first surface 31 and the second surface 32. The third surface 33 is a curved surface. In this embodiment, a part of the third surface 33 (the outer periphery in a plan view) coincides with the second region 211b in a plan view, as shown in Figure 2. Note that the third surface 33 does not necessarily have to coincide with the second region 211b in a plan view.

[0027] Each of the multiple connecting members 4 provides electrical conductivity between the electronic component 1 and the lead frame 2 (each terminal lead portion 23). Each connecting member 4 is, for example, a bonding wire. However, each connecting member 4 is not limited to a bonding wire; it may also be a bonding ribbon or a plate-shaped clip member. The constituent material of each connecting member 4 may be Cu, Au (gold), or Al (aluminum).

[0028] Each connecting member 4 has one end joined to the electrode pad 13 of the electronic component 1, and the other end joined to the pad portion 231 of each terminal lead portion 23. In this embodiment, each connecting member 4 is a bonding wire, which is joined to the electrode pad 13 by ball bonding and to the pad portion 231 by wedge bonding. Alternatively, it may be ball-bonded to the pad portion 231 and wedge-bonded to the electrode pad 13.

[0029] The resin member 5 is a encapsulant in the electronic device A1. As shown in Figures 4 and 5, the resin member 5 covers the electronic component 1, a portion of the lead frame 2, the bonding material 3, and a plurality of connecting members 4. The constituent material of the resin member 5 includes a solid of a second composition. The second composition is, for example, an epoxy resin. The resin member 5 is, for example, rectangular in plan view. As shown in Figures 1 to 5, the resin member 5 has a resin main surface 51, a resin back surface 52, and a plurality of resin side surfaces 53.

[0030] The resin main surface 51 and the resin back surface 52 are spaced apart in the z direction. The resin main surface 51 is the upper surface of the resin member 5. The resin back surface 52 is the lower surface of the resin member 5. As shown in Figure 3, a part of the lead frame 2 (the back surface 212 of the die pad portion 21 and a part of each terminal portion 232) is exposed from the resin back surface 52. Multiple resin side surfaces 53 are connected to both the resin main surface 51 and the resin back surface 52 and are sandwiched between them in the z direction. The resin member 5 has a pair of resin side surfaces 531 spaced apart in the x direction and a pair of resin side surfaces 532 spaced apart in the y direction. In this embodiment, a part of the terminal portion 232 of each terminal lead portion 23 is exposed on the resin back surface 52 and on either of the pair of resin side surfaces 531.

[0031] Next, the first region 211a and the second region 211b of the main surface 211 of the die pad portion 21 will be described.

[0032] The first region 211a is in contact with the bonding material 3, as shown in Figure 5. The first region 211a is, for example, rectangular in plan view. In plan view, the electronic component 1 overlaps this first region 211a. The first region 211a has a plurality of grooves 711, a plurality of raised portions 712, and a plurality of intervening portions 713, as shown in Figure 6.

[0033] Each of the multiple grooves 711 is recessed downward in the z direction compared to each intervening portion 713. The multiple grooves 711 can be formed, for example, by laser processing using laser light. Note that the method for forming the multiple grooves 711 is not limited to laser processing, but may also be etching, for example. The multiple grooves 711 are arranged in the following pattern. Each groove 711 extends linearly along a direction perpendicular to the z direction. In this embodiment, each groove 711 extends along the x direction as shown in Figure 2, but it may also extend along the y direction. The multiple grooves 711 are arranged parallel to each other. The width W1 of each groove 711 (see Figure 6) is, for example, about 20 to 40 μm. The depth d1 of each groove 711 (see Figure 6) is, for example, about 5 to 20 μm. The distance P1 between two adjacent grooves 711 (see Figure 6) is, for example, about 30 to 200 μm each. The interval P1 is the distance between the centers of two adjacent grooves 711 in the width direction.

[0034] Each of the multiple raised portions 712 is connected to each edge in the y-direction of a single groove 711, as shown in Figure 6. Of the two edges of each raised portion 712 in the y-direction, one is connected to the groove 711 and the other is connected to the intervening portion 713. Each raised portion 712 protrudes upward in the z-direction above each intervening portion 713.

[0035] Each of the multiple intervening portions 713 is positioned between two adjacent grooves 711, as shown in Figure 6. Each intervening portion 713 is sandwiched between two adjacent grooves 711 via a raised portion 712 in the y-direction. Each intervening portion 713 is formed because it is not irradiated with laser light when each groove 711 is formed. Depending on the width W1 and spacing P1 of the multiple grooves 711 formed by laser processing, an intervening portion 713 may not be formed, as shown in Figure 8. For example, if the spacing P1 is smaller than the width W1 of each groove 711, an intervening portion 713 will not be formed. In this case, each raised portion 712 is sandwiched between two adjacent grooves 711, as shown in Figure 8, and both of its edges in the y-direction are connected to the grooves 711.

[0036] The first region 211a is uneven due to a plurality of grooves 711, a plurality of raised portions 712, and a plurality of intervening portions 713. Therefore, the first region 211a is a rough surface. In addition, each surface of the plurality of grooves 711 and the plurality of raised portions 712 has fine irregularities due to laser processing. Therefore, each of these surfaces is a rough surface due to these fine irregularities. The surface roughness of each of these surfaces is finer than the surface roughness of the first region 211a.

[0037] The first region 211a exhibits hydrophilicity with respect to the liquid of the first composition (for example, solder). In this embodiment, the multiple grooves 711 formed in the first region 211a make the first region 211a hydrophilic with respect to the liquid of the first composition. Furthermore, the first region 211a with multiple grooves 711 formed therein exhibits higher hydrophilicity with respect to the liquid of the first composition than the first region 211a without multiple grooves 711 formed therein.

[0038] As shown in Figure 5, the second region 211b is not in contact with the bonding material 3 but is in contact with the resin member 5. The second region 211b is, for example, a rectangular annular shape in plan view. In plan view, the second region 211b surrounds the first region 211a. In plan view, the inner edge of the second region 211b is in contact with the outer edge of the first region 211a. As shown in Figure 7, the second region 211b has a plurality of grooves 721, a plurality of raised portions 722 and a plurality of intervening portions 723.

[0039] Each of the multiple grooves 721 is recessed downward in the z direction from each intervening portion 723, as shown in Figure 7. The multiple grooves 721 can be formed, for example, by laser processing. Note that the method for forming the multiple grooves 721 is not limited to laser processing, but may also be etching, for example. The multiple grooves 721 are arranged in the following pattern. Each groove 721 extends linearly along a direction perpendicular to the z direction. In this embodiment, each groove 721 extends along the x direction, as shown in Figure 2, but it may also extend along the y direction. The multiple grooves 721 are arranged parallel to each other. The width W2 of each groove 721 (see Figure 7) is, for example, about 5 to 10 μm. The depth d2 of each groove 721 (see Figure 7) is, for example, about 5 to 10 μm. The spacing P2 between two adjacent grooves 721 (see Figure 7) is, for example, about 10 to 20 μm each. The interval P2 is the distance between the centers of two adjacent grooves 721 in the width direction.

[0040] Each of the multiple raised portions 722 is connected to each edge in the y-direction of a single groove 721, as shown in Figure 7. Of the two edges of each raised portion 722 in the y-direction, one is connected to the groove 721 and the other is connected to the intervening portion 723. Each raised portion 722 protrudes upward in the z-direction above each intervening portion 723.

[0041] Each of the multiple intervening portions 723 is positioned between two adjacent grooves 721, as shown in Figure 7. Each intervening portion 723 is sandwiched between two adjacent grooves 721 via a raised portion 722 in the y-direction. Each intervening portion 723 is formed because it is not irradiated with laser light when each groove 721 is formed. Note that, similar to the intervening portion 713, an intervening portion 723 may not be formed depending on the width W2 and spacing P2 of the multiple grooves 721 formed by laser processing (see Figure 8). For example, if the spacing P2 is smaller than the width W2 of each groove 721, an intervening portion 723 will not be formed. In this case, each raised portion 722 is sandwiched between two adjacent grooves 721, and both of its edges in the y-direction are connected to the grooves 721.

[0042] The second region 211b is uneven due to a plurality of grooves 721, a plurality of raised portions 722, and a plurality of intervening portions 723. Therefore, the second region 211b is a rough surface. In addition, each surface of the plurality of grooves 721 and the plurality of raised portions 722 has fine irregularities due to laser processing. Therefore, each of these surfaces is rough due to these fine irregularities. The surface roughness of each of these surfaces is finer than the surface roughness of the second region 211b.

[0043] The second region 211b exhibits hydrophilicity with respect to the liquid of the second composition (for example, epoxy resin). In this embodiment, the second region 211b becomes hydrophilic with respect to the liquid of the second composition due to the plurality of grooves 721 formed in the second region 211b.

[0044] On the main surface 211 of the die pad portion 21, the first region 211a has higher hydrophilicity to the liquid of the first composition than the second region 211b. In this embodiment, since the first composition is solder, the first region 211a has higher solder wettability than the second region 211b. For example, by adjusting the width W1, spacing P1, and depth d1 of the grooves 711 formed in the first region 211a and the width W2, spacing P2, and depth d2 of the grooves 721 formed in the second region 211b, a difference is created between the hydrophilicity of the first composition to the liquid and the hydrophilicity of the second composition to the liquid. In the electronic device A1, for example, the width W1 of the grooves 711 is larger than the width W2 of the grooves 721, and the spacing P1 of the grooves 711 is larger than the spacing P2 of the grooves 721. This makes the hydrophilicity of the first composition in the first region 211a to the liquid higher than that of the first composition in the second region 211b to the liquid.

[0045] Next, the manufacturing method of electronic device A1 will be explained with reference to Figures 9 to 13. Figures 9 to 13 are plan views showing one step in the manufacturing method of electronic device A1.

[0046] First, as shown in Figure 9, the lead frame 2 is prepared. This step corresponds to the "first step" described in the claims. The lead frame 2 to be prepared can be formed, for example, by punching or bending a copper plate. At this point, as shown in Figure 9, the lead frame 2 includes a die pad portion 21, a plurality of suspension lead portions 22, a plurality of terminal lead portions 23, and a plurality of tie bars 25, and the die pad portion 21, the plurality of suspension lead portions 22, and the plurality of terminal lead portions 23 are connected by the plurality of tie bars 25.

[0047] Next, as shown in Figure 10, a first region 211a and a second region 211b are formed on the die pad portion 21 of the lead frame 2. This step corresponds to the "second step" described in the claims. The first region 211a is the portion on which the bonding material 3 is formed and the electronic component 1 is mounted. The second region 211b is the region on which the bonding material 3 is not formed. Specifically, a laser beam is irradiated onto the main surface 211 of the die pad portion 21 of the lead frame 2 to excavate the main surface 211 and form a plurality of grooves 711 and a plurality of grooves 721. A well-known laser irradiation device is used for irradiating with laser light. The plurality of grooves 711 are formed, for example, within a rectangular region in plan view. The region on which the plurality of grooves 711 are formed is the first region 211a. The plurality of grooves 721 are formed within a rectangular annular region in plan view that surrounds the region on which the plurality of grooves 711 are formed (first region 211a). The region on which the plurality of grooves 721 are formed is the second region 211b. The arrangement patterns of the multiple grooves 711 and the multiple grooves 721 are as described above. The first region 211a and the second region 211b may be formed first or simultaneously. Note that in the following drawings (Figures 11 to 13), the grooves 711 and 721 will be omitted.

[0048] Next, as shown in Figure 11, a paste-like bonding material 3 is applied to the region where multiple grooves 711 are formed (first region 211a), and the electronic component 1 is placed on the paste-like bonding material 3. The step of applying the paste-like bonding material 3 corresponds to the "third step" described in the claims, and the step of placing the electronic component 1 on the paste-like bonding material 3 corresponds to the "fourth step" described in the claims. The constituent material of the bonding material 3 is the first composition. This first composition is, for example, solder. Therefore, solder paste is applied to the first region 211a.

[0049] Next, a reflow process is performed. This process corresponds to the "fifth step" described in the claims. During the reflow process, the paste-like bonding material 3 becomes liquid due to the heating during the reflow process, and its fluidity increases. The liquid bonding material 3 spreads into the first region 211a. This is because the first region 211a exhibits hydrophilicity to the liquid bonding material 3 due to the multiple grooves 711. At this time, the liquid bonding material 3 spreads evenly in the first region 211a due to the hydrophilicity of the first region 211a to the liquid bonding material 3. Furthermore, the liquid bonding material 3 remains in the first region 211a and does not flow out into the second region 211b. This is because the second region 211b has lower hydrophilicity to the liquid bonding material 3 than the first region 211a, and a force acts to keep the liquid bonding material 3 in the first region 211a, suppressing outflow into the second region 211b. Subsequently, the liquid bonding material 3 solidifies due to cooling during the reflow process, becoming a solid bonding material 3. As a result, the electronic component 1 is bonded to the lead frame 2 (die pad portion 21) by the solid bonding material 3.

[0050] Next, as shown in Figure 12, the electrode pads 13 on the main surface 11 of the electronic component 1 and the pad portions 231 of the terminal lead portions 23 of the lead frame 2 are electrically connected by connecting members 4. The connecting members 4 are, for example, bonding wires, and the connecting members 4 are formed, for example, using a wire bonding apparatus equipped with a capillary.

[0051] Next, as shown in Figure 13, a resin member 5 is formed. The resin member 5 is formed, for example, by transfer molding. The constituent material of the resin member 5 includes a solid of the second composition. This second composition is, for example, an epoxy resin.

[0052] Next, the lead frame 2 and resin member 5 are cut to separate each electronic component 1 into individual pieces. This is done, for example, by blade dicing.

[0053] By following the above steps, the electronic device A1 shown in Figures 1 to 7 is formed. Note that the manufacturing method described above is just one example.

[0054] The effects of the electronic device A1 configured as described above are as follows:

[0055] In the electronic device A1, the electronic component 1 is fixed to the lead frame 2 (die pad portion 21) by a bonding material 3 (solid). The lead frame 2 (die pad portion 21) has a main surface 211 on which the electronic component 1 is mounted. The main surface 211 has a first region 211a in which a plurality of grooves 711 are formed, and a second region 211b that surrounds the first region 211a in a plan view. The bonding material 3 is in contact with the first region 211a but not with the second region 211b. With this configuration, since the bonding material 3 is not formed in the second region 211b that surrounds the first region 211a, it is possible to suppress the thinning or unevenness of the thickness of the bonding material 3 in the first region 211a. For example, if the thickness of the bonding material 3 is uneven, the electronic component 1 may be fixed in a tilted position, resulting in poor bonding of the electronic component 1 or poor bonding of the connecting member 4. On the other hand, since electronic device A1 can suppress uneven thickness of the bonding material 3, it can suppress the aforementioned bonding defects. Therefore, electronic device A1 can improve reliability.

[0056] In electronic device A1, the bonding material 3 is a solid of the first composition (for example, solder), and the first region 211a has higher hydrophilicity to the liquid of the first composition than the second region 211b. With this configuration, when the bonding material 3 becomes liquid during the manufacturing process (reflow process) of electronic device A1, the liquid bonding material 3 tends to remain in the first region 211a, where the hydrophilicity to the liquid of the first composition is relatively high, and its spread to the second region 211b, where the hydrophilicity to the liquid of the first composition is relatively low, is prevented. Therefore, in electronic device A1, the hydrophilicity to the liquid of the first composition in the first region 211a is higher than that of the first composition in the second region 211b, which can suppress the outflow of the liquid bonding material 3 into the second region 211b.

[0057] According to the electronic device A1, the first region 211a has a plurality of grooves 711 formed therein. With this configuration, the bonding material 3 is filled into the plurality of grooves 711 of the first region 211a, and the adhesive strength of the bonding material 3 to the die pad portion 21 (first region 211a) is increased by the anchoring effect. Furthermore, since the plurality of grooves 711 are formed by laser processing, the surface of the plurality of grooves 711 has fine irregularities. Therefore, the adhesive strength of the bonding material 3 to the die pad portion 21 (first region 211a) can be further improved by the anchoring effect.

[0058] According to electronic device A1, the resin member 5 is a solid of the second composition (for example, epoxy resin). The second region 211b has a plurality of grooves 721 formed therein, and the plurality of grooves 721 cause the second region 211b to be hydrophilic to the liquid of the second composition. With this configuration, the resin member 5 is filled into the plurality of grooves 721 of the second region 211b, and the adhesive strength of the resin member 5 to the die pad portion 21 (second region 211b) is increased by the anchoring effect. Furthermore, since the plurality of grooves 721 are formed by laser processing, the surface of the plurality of grooves 721 has fine irregularities. Therefore, the adhesive strength of the resin member 5 to the die pad portion 21 (second region 211b) can be further improved by the anchoring effect.

[0059] Figures 14 and 15 show an electronic device according to the second embodiment. The electronic device A2 of the second embodiment differs from the electronic device A1 in that the main surface 211 of the die pad portion 21 further includes a third region 211c. Figure 14 is a plan view showing the electronic device A2. In Figure 14, the electronic component 1, the bonding material 3, and the resin member 5 are shown by dashed lines, and the connecting member 4 is omitted. Figure 15 is a cross-sectional view along the line XV-XV in Figure 14.

[0060] The third region 211c is interposed between the first region 211a and the second region 211b in a plan view. The third region 211c is, for example, a rectangular ring in a plan view. In a plan view, the inner edge of the third region 211c is in contact with the outer edge of the first region 211a, and the outer edge is in contact with the inner edge of the second region 211b. The third region 211c is flat and has no grooves. The third region 211c is, for example, coated with Ag plating (silver plating). The third region 211c is in contact with the joining material 3, as shown in Figure 15. In this embodiment, the second surface 32 of the joining material 3 is in contact with both the first region 211a and the third region 211c, and in a plan view, the second surface 32 of the joining material 3 overlaps with the first region 211a and the third region 211c. Note that, unlike the example shown in Figure 15, the third region 211c may have a configuration in which multiple grooves 711 are formed that continue from the first region 211a, and then Ag plating is applied. The third region 211c is formed in the process of forming the first region 211a and the second region 211b in the die pad portion 21 of the lead frame 2.

[0061] The third region 211c exhibits hydrophilicity to the liquid of the first composition due to the formed Ag plating. The third region 211c is more hydrophilic to the liquid of the first composition than the first region 211a. As mentioned above, the first region 211a is more hydrophilic to the liquid of the first composition than the second region 211b, therefore the third region 211c is more hydrophilic to the liquid of the first composition than the second region 211b.

[0062] The manufacturing method for electronic device A2 differs from that for electronic device A1 in that it involves forming the third region 211c. Otherwise, it is substantially the same as the manufacturing method for electronic device A1.

[0063] In electronic device A2, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. With this configuration, as with electronic device A1, the bonding material 3 is not formed in the second region 211b that surrounds the first region 211a, so it is possible to suppress the thinning or unevenness of the bonding material 3 in the first region 211a. Therefore, as with electronic device A1, the reliability of electronic device A2 can be improved.

[0064] In the electronic device A2, a third region 211c is formed on the main surface 211 of the die pad portion 21, interposed between the first region 211a and the second region 211b in a plan view. The third region 211c has higher hydrophilicity to the liquid of the first composition than the second region 211b. With this configuration, when the bonding material 3 becomes liquid during the manufacturing process (reflow process) of the electronic device A2, the liquid bonding material 3 tends to remain in the third region 211c, where the hydrophilicity to the liquid of the first composition is relatively high, thus preventing it from spreading to the second region 211b, where the hydrophilicity to the liquid of the first composition is relatively low. Therefore, the electronic device A2 can suppress the outflow of the liquid bonding material 3 into the second region 211b because the hydrophilicity to the liquid of the first composition in the third region 211c is higher than that of the first composition in the second region 211b.

[0065] According to electronic device A2, the third region 211c has higher hydrophilicity to the liquid of the first composition than the first region 211a. With this configuration, the difference in hydrophilicity of the first composition to the liquid at the boundary between the third region 211c and the second region 211b is greater than the difference in hydrophilicity of the first composition to the liquid at the boundary between the first region 211a and the second region 211b. Therefore, electronic device A2 can more effectively suppress the outflow of the liquid bonding material 3 into the second region 211b than electronic device A1. In other words, electronic device A2 can further improve reliability compared to electronic device A1.

[0066] Electronic device A2 can achieve the same effects as electronic device A1 by using other components common to electronic device A1.

[0067] In the second embodiment, the third region 211c is plated with Ag, causing the third region 211c to exhibit hydrophilicity with respect to the liquid of the first composition (bonding material 3), and the hydrophilicity of the third region 211c is shown to be higher than that of the first region 211a. However, the embodiment is not limited to this. If the hydrophilicity of the third region 211c with respect to the liquid of the first composition is higher than that of the first region 211a with respect to the liquid of the first composition, other coating agents may be substituted for Ag plating.

[0068] Figures 16 and 17 show an electronic device according to the third embodiment. The electronic device A3 of the third embodiment differs from the electronic device A2 in that the third region 211c is recessed compared to the first region 211a and the second region 211b. Figure 16 is a plan view showing the electronic device A3. In Figure 16, the electronic component 1, the bonding material 3, and the resin member 5 are shown by dashed lines, and the connecting member 4 is omitted. Figure 17 is a cross-sectional view along the line XVII-XVII in Figure 16.

[0069] In electronic device A3, the third region 211c is recessed compared to the first region 211a and the second region 211b, as described above. The third region 211c has a groove 731 surrounding the first region 211a. In this embodiment, the third region 211c is not in contact with the bonding material 3, as shown in Figure 17. In this embodiment, the second surface 32 of the bonding material 3 is in contact with the first region 211a but not with the third region 211c. Also, in plan view, a part of the third surface 33 of the bonding material 3 (the outer periphery in plan view) does not overlap with the second region 211b but overlaps with the third region 211c. In plan view, the groove 731 is, for example, rectangular and annular, with its inner edge connected to the outer edge of the first region 211a and its outer edge connected to the inner edge of the second region 211b. The width of the groove 731 is, for example, about 50 to 200 μm, and the depth of the groove 731 is, for example, about 30 to 100 μm. The groove 731 can be formed, for example, by laser processing or etching.

[0070] The manufacturing method for electronic device A3 differs from that of electronic device A2 in the method of forming the third region 211c. Otherwise, it is substantially the same as the manufacturing method for electronic device A2.

[0071] In electronic device A3, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. With this configuration, as with electronic device A1, the bonding material 3 is not formed in the second region 211b that surrounds the first region 211a, so it is possible to suppress the thinning or unevenness of the bonding material 3 in the first region 211a. Therefore, as with electronic device A1, the reliability of electronic device A3 can be improved.

[0072] In the electronic device A3, a third region 211c is formed on the main surface 211 of the die pad portion 21, interposed between the first region 211a and the second region 211b in a plan view. A groove 731 is formed in the third region 211c, and this groove 731 causes it to be recessed downward in the z direction compared to the first region 211a and the second region 211b. With this configuration, during the manufacturing process (reflow process) of the electronic device A3, the liquid bonding material 3 remains in the first region 211a due to the surface tension at the boundary between the first region 211a and the third region 211c, and its outflow into the third region 211c is suppressed. Therefore, the bonding material 3 does not come into contact with the third region 211c. Consequently, the electronic device A3 can suppress the outflow of the liquid bonding material 3 into the second region 211b. In other words, the reliability of the electronic device A3 can be improved.

[0073] According to electronic device A3, the same effects as electronic device A1 (A2) can be achieved by using other configurations common to electronic device A1 (A2).

[0074] Figures 18 and 19 show an electronic device according to the fourth embodiment. The electronic device A4 of the fourth embodiment differs from the electronic device A2 in that the third region 211c exhibits liquid-repellent properties to the liquid of the first composition. Figure 18 is a plan view of the electronic device A4. In Figure 18, the electronic component 1, the bonding material 3, and the resin member 5 are shown by dashed lines, and the connecting member 4 is omitted. Figure 19 is a cross-sectional view along the line XIX-XIX in Figure 18.

[0075] In electronic device A4, the third region 211c is not in contact with the bonding material 3, as shown in Figure 19. In this embodiment, the second surface 32 of the bonding material 3 is in contact with the first region 211a but not with the third region 211c. Also, in a plan view, a portion of the third surface 33 of the bonding material 3 (the outer periphery in a plan view) does not overlap with the second region 211b but overlaps with the third region 211c. As mentioned above, the third region 211c exhibits liquid repellency to the liquid of the first composition. That is, since the first composition is solder, the third region 211c has low solder wettability. A groove 731 is formed in the third region 211c, and a plurality of protrusions are formed in this groove 731, projecting upward in the z direction from its bottom surface. Therefore, the third region 211c is a rough surface with multiple protrusions. The surface structure (shape) of this third region 211c is similar to that of, for example, lotus leaves or taro leaves. Due to its surface structure, the third region 211c exhibits liquid-repellent properties to the liquid of the first composition. The grooves 731 can be formed, for example, by laser processing or etching.

[0076] The manufacturing method for electronic device A4 differs from that of electronic device A2 in the method of forming the third region 211c. Otherwise, it is substantially the same as the manufacturing method for electronic device A2.

[0077] In electronic device A4, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. With this configuration, as with electronic device A1, the bonding material 3 is not formed in the second region 211b that surrounds the first region 211a, so it is possible to suppress the thinning or unevenness of the bonding material 3 in the first region 211a. Therefore, as with electronic device A1, the reliability of electronic device A4 can be improved.

[0078] In the electronic device A4, a third region 211c is formed on the main surface 211 of the die pad portion 21, interposed between the first region 211a and the second region 211b in a plan view. The third region 211c exhibits liquid-repellent properties to the liquid of the first composition. With this configuration, during the manufacturing process (reflow process) of the electronic device A4, the liquid bonding material 3 remains in the first region 211a due to the action of surface tension at the boundary between the first region 211a and the third region 211c, and its outflow into the third region 211c is suppressed. Therefore, the bonding material 3 does not come into contact with the third region 211c. Consequently, the electronic device A4 can suppress the outflow of the liquid bonding material 3 into the second region 211b. In other words, the reliability of the electronic device A4 can be improved.

[0079] According to electronic device A4, the same effects as electronic devices A1 (A2, A3) can be achieved by using other configurations common to electronic devices A1 (A2, A3).

[0080] Figures 20 to 23 show an electronic device according to the fifth embodiment. The electronic device A5 of the fifth embodiment differs from the electronic device A1 mainly in the configuration of the lead frame 2.

[0081] Figure 20 is a plan view showing electronic device A5. In Figure 20, the resin member 5 is shown with dashed lines. Figure 21 is an enlarged view of a key part of Figure 20. In Figure 20, the electronic component 1 and the resin member 5 are shown with dashed lines, and the bonding material 3 and connecting member 4 are omitted. Figure 22 is a side view (right side view) of electronic device A5. In Figure 22, the resin member 5 is shown with dashed lines. Figure 23 is a cross-sectional view along the line XXIII-XXIII in Figure 20.

[0082] Electronic device A5 is constructed using a so-called TO (Transistor Outline) package.

[0083] In electronic device A5, the electrode pad 13 of electronic component 1 includes a main surface electrode 131 and a back surface electrode 132, as shown in Figure 23. The main surface electrode 131 is exposed on the main surface 11, and the back surface electrode 132 is exposed on the back surface 12. The back surface electrode 132 is electrically connected to the die pad portion 21 (lead frame 2) via the bonding material 3. Therefore, the bonding material 3 in this embodiment is conductive.

[0084] In the lead frame 2, one of the multiple terminal lead portions 23 is connected to the die pad portion 21. In the electronic device A5, as shown in Figure 20, the terminal lead portion 23 located in the center in the x-direction is connected to the die pad portion 21. This terminal lead portion 23 connected to the die pad portion 21 does not include the pad portion 231, but includes the terminal portion 232. Also, each terminal lead portion 23 protrudes from the resin member 5.

[0085] In the lead frame 2, the main surface 211 of the die pad portion 21 has a first region 211a and a second region 211b, similar to electronic device A1. The configuration of the first region 211a and the second region 211b is the same as in electronic device A1. In electronic device A5, as shown in Figure 21, the plurality of grooves 711 formed in the first region 211a are linear in shape extending in the y direction and are arranged parallel to each other. Similarly, the plurality of grooves 721 formed in the second region 211b are linear in shape extending in the y direction and are arranged parallel to each other. The plurality of grooves 711 and the plurality of grooves 721 may also be linear in shape extending in the x direction, similar to electronic device A1.

[0086] The manufacturing method for electronic device A5 differs from that for electronic device A1 in that it requires a different lead frame 2. Otherwise, the manufacturing method is substantially the same as that for electronic device A1.

[0087] In electronic device A5, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. With this configuration, as with electronic device A1, the bonding material 3 is not formed in the second region 211b that surrounds the first region 211a, so it is possible to suppress the thinning or unevenness of the thickness of the bonding material 3 in the first region 211a. Therefore, as with electronic device A1, the reliability of electronic device A5 can be improved.

[0088] According to electronic device A5, the same effects as electronic device A1 can be achieved by using other components that are common to electronic device A1.

[0089] In the fifth embodiment, a case was shown in which a first region 211a and a second region 211b are formed on the main surface 211 of the die pad portion 21 of the lead frame 2, but the invention is not limited to this. For example, a third region 211c according to any of the second to fourth embodiments may be further formed on the main surface 211. In this case, the same effects as those of any of the second to fourth embodiments can be achieved.

[0090] In the first to fifth embodiments, the case in which the plurality of grooves 711 formed in the first region 211a are linear and arranged parallel to each other in a plan view is shown, but the invention is not limited to this. For example, the plurality of grooves 711 may be linear and arranged in a mesh pattern in a plan view. Figure 24 shows the first region 211a when the plurality of linear grooves 711 are arranged in a mesh pattern in a plan view. In this case, the hydrophilicity of the first composition to the liquid and the hydrophilicity of the second composition to the liquid can be changed by adjusting the widths W11, W12 (see Figure 24) and spacing P11, P12 (see Figure 24) of each groove 711. In this modified example, the first region 211a is hydrophilic to the liquid of the first composition. The same applies to the plurality of grooves 721 formed in the second region 211b. In other words, the plurality of grooves 721 may be linear and arranged in a mesh pattern in a plan view.

[0091] In the first to fifth embodiments, the case in which the plurality of grooves 711 formed in the first region 211a are linear in plan view is shown, but the invention is not limited to this. For example, the plurality of grooves 711 may be circular (point-shaped) in plan view and arranged in a matrix. Figure 25 shows the first region 211a when a plurality of circular grooves 711 are arranged in a matrix in plan view. In this case, the hydrophilicity of the first composition to the liquid and the hydrophilicity of the second composition to the liquid can be changed by adjusting the width W1 (diameter) (see Figure 25) and the arrangement intervals Px, Py (see Figure 25) of each groove 711. In this modified example, the first region 211a is hydrophilic to the liquid of the first composition. The same applies to the plurality of grooves 721 formed in the second region 211b. That is, the plurality of grooves 721 may be circular in plan view and arranged in a matrix.

[0092] In the first to fifth embodiments, the plurality of grooves 711 formed in the first region 211a are shown to be linear in plan view, but the invention is not limited to this. For example, each of the plurality of grooves 711 may be a wavy or crank-shaped curve in plan view. For example, when forming the grooves 711, instead of moving the laser beam linearly, moving it in a wavy or crank-shaped manner can form grooves 711 that are wavy or crank-shaped in plan view. Note that the term "crank-shaped" is not limited to cases where the bending angle of the bent portion is a right angle, but also includes cases where the angle is acute or obtuse. In this modified example as well, the first region 211a is hydrophilic to the liquid of the first composition. The same applies to the plurality of grooves 721 formed in the second region 211b. That is, the plurality of grooves 721 may be wavy or crank-shaped curves in plan view.

[0093] In the first to fifth embodiments, the arrangement patterns of the multiple grooves 711 formed in the first region 211a, the multiple grooves 721 formed in the second region 211b, and the grooves 731 formed in the third region 211c are not limited to those described above. The first region 211a, the second region 211b, and the third region 211c may each be configured to exhibit the aforementioned hydrophilicity or hydrophilicity. For example, each of the grooves 711, 721, and 731 may be arranged in a pattern that exhibits hydrophilicity or hydrophilicity based on well-known biomimetics.

[0094] In the first to fifth embodiments, a case with one electronic component 1 was shown, but a plurality of electronic components 1 may be provided. In this case, a first region 211a is formed below each electronic component 1, and each electronic component 1 is joined to the first region 211a via a bonding material 3.

[0095] In the first to fifth embodiments, a case was shown in which a plurality of grooves 721 are formed in the second region 211b, but the invention is not limited thereto. For example, the second region 211b may be flat.

[0096] The electronic device and method for manufacturing the electronic device described herein are not limited to the embodiments described above. The specific configuration of each part of the electronic device described herein, and the specific processing of each step in the method for manufacturing the electronic device described herein, can be modified in various ways.

[0097] The electronic devices and methods for manufacturing electronic devices described herein include embodiments relating to the following appendices. [Note 1] Electronic components and, A support member having a mounting surface on which the aforementioned electronic component is mounted, The system includes a bonding material interposed between the electronic component and the support member, which fixes the electronic component to the support member. The mounting surface has a first region in which a plurality of grooves are formed, and a second region that surrounds the first region when viewed in a first direction. The bonding material is in contact with the first region but not with the second region in the electronic device. [Note 2] The bonding material contains the solid of the first composition, The electronic device according to Appendix 1, wherein the first region exhibits hydrophilicity with respect to the liquid of the first composition, and its hydrophilicity with respect to the liquid of the first composition is higher than that of the second region. [Note 3] The first composition is solder, as described in Appendix 2, for the electronic device. [Note 4] The electronic device according to either Appendix 2 or Appendix 3, wherein the mounting surface further has a third region interposed between the first region and the second region when viewed in the first direction. [Note 5] The third region is the electronic device described in Appendix 4, which is in contact with the bonding material. [Note 6] The electronic device according to Appendix 5, wherein the third region has higher hydrophilicity to the liquid of the first composition than the first region. [Note 7] The third region is an electronic device as described in Appendix 5 or Appendix 6, which is plated with Ag. [Note 8] The third region is the electronic device described in Appendix 4, which is not in contact with the bonding material. [Note 9] The electronic device as described in Appendix 8, wherein the third region is recessed compared to the first and second regions. [Note 10] The third region exhibits liquid-repellent properties to the liquid of the first composition, as described in Appendix 8. [Note 11] The system further comprises the aforementioned electronic component and a resin member covering the mounting surface. The electronic device according to any one of Appendix 1 to Appendix 10, wherein the resin member contains a solid of the second composition. [Note 12] The electronic device according to Appendix 11, wherein the second region exhibits hydrophilicity with respect to the liquid of the second composition. [Note 13] The electronic device according to Appendix 11 or Appendix 12, wherein the second composition is an epoxy resin. [Note 14] The electronic device according to any one of the appendices 1 to 13, wherein the support member includes a die pad portion having the mounting surface and a terminal lead portion spaced apart from the die pad portion. [Note 15] The electronic device as described in Appendix 14, wherein the surface layer of the die pad portion is a metal containing Cu. [Note 16] The electronic device according to Appendix 14 or Appendix 15, further comprising a connecting member for electrically connecting the electronic component and the terminal lead portion. [Note 17] The aforementioned second region has multiple grooves formed therein. The plurality of grooves in the second region are different from the plurality of grooves in the first region, as described in any of Appendix 1 to Appendix 16. [Note 18] The electronic device as described in Appendix 17, wherein the width of the plurality of grooves in the first region is greater than the width of the plurality of grooves in the second region. [Note 19] The electronic device according to Appendix 17 or Appendix 18, wherein the spacing between the plurality of grooves in the first region is greater than the spacing between the plurality of grooves in the second region. [Note 20] The electronic device according to any one of the appendices 17 to 19, wherein the plurality of grooves in the first region are each linear and arranged parallel to each other. [Note 21] The electronic device according to any one of the appendices 17 to 20, wherein the plurality of grooves in the second region are each linear and arranged parallel to each other. [Note 22] The electronic device according to any one of the appendices 1 to 21, wherein the first region is rectangular when viewed in the first direction. [Note 23] The first step is to prepare a support member having a mounting surface, The second step involves forming a first region and a second region that surrounds the first region when viewed in a first direction on the mounting surface, A third step involves applying a bonding material to the first region, A fourth step involves placing an electronic component on the aforementioned bonding material, The method includes a fifth step of heating and cooling the bonding material to fix the electronic component to the support member using the bonding material, In the second step, the first region is formed by forming a plurality of grooves on a part of the mounting surface. A method for manufacturing an electronic device, wherein the bonding material after the fifth step is in contact with the first region but not with the second region.

Claims

1. A semiconductor element having electrodes on its surface, A die pad portion having a mounting surface on which the semiconductor element is mounted, A bonding material interposed between the semiconductor element and the die pad portion to fix the semiconductor element to the die pad portion, A plurality of terminals are arranged apart from the die pad portion when viewed in a first direction which is the thickness direction of the semiconductor element, A connecting member that electrically connects the electrode and any of the plurality of terminals, The resin member that seals at least a portion of the die pad portion, at least a portion of each of the plurality of terminals, the semiconductor element, and the connecting member, It is equipped with, The mounting surface has a first region in which a plurality of first grooves are formed below the semiconductor element, and a second region in which a plurality of second grooves are formed, which surrounds the first region when viewed in the first direction. The plurality of first grooves are linear in shape and extend in a second direction perpendicular to the first direction. The plurality of first grooves are arranged parallel to each other, The plurality of second grooves include a second groove that is longer than one side of the semiconductor element when viewed in the first direction. The width of the plurality of first grooves is greater than the width of the plurality of second grooves. Semiconductor equipment.

2. The plurality of second grooves have straight sections extending in the second direction. The semiconductor device according to claim 1.

3. The aforementioned bonding material contains a first composition that undergoes a phase transition from solid to liquid when heated. The first region exhibits more hydrophilicity with respect to the liquid of the first composition than the second region. The semiconductor device according to claim 2.

4. The first composition is solder. The semiconductor device according to claim 3.

5. The depth of each of the aforementioned plurality of first grooves is 5 to 20 μm. The semiconductor device according to any one of claims 1 to 4.

6. The width of each of the aforementioned plurality of first grooves is 20 to 40 μm. The semiconductor device according to any one of claims 1 to 4.

7. The spacing between the multiple first grooves is 30 to 200 μm. The semiconductor device according to any one of claims 1 to 4.

8. Each of the plurality of first grooves has a curved side surface, The semiconductor device according to any one of claims 1 to 4.

9. The die pad portion has a back surface that is separated from the mounting surface in the first direction, The aforementioned back surface is exposed from the resin member. The semiconductor device according to any one of claims 1 to 4.

10. The aforementioned joining material has a first surface, a second surface and a third surface, The first surface and the second surface are separated from each other in the first direction. The third surface is connected to the first and second surfaces. A portion of the third surface overlaps the second region when viewed in the first direction. The semiconductor device according to any one of claims 1 to 4.

11. The first region has a plurality of raised portions and a plurality of intervening portions, each of which is arranged between the plurality of first grooves. Each of the plurality of first grooves is recessed below the plurality of intervening portions. Each of the aforementioned multiple raised portions is recessed above the aforementioned multiple intervening portions. Each of the plurality of intervening portions is positioned between two adjacent first grooves among the plurality of first grooves. Each of the plurality of raised portions has two edges in the second direction, one of which connects to one of the plurality of first grooves and the other of which connects to one of the plurality of intervening portions. The semiconductor device according to any one of claims 1 to 4.

12. The mounting surface further has a third region interposed between the first region and the second region when viewed in the first direction. The semiconductor device according to either claim 3 or claim 4.

13. The third region is plated with Ag. The semiconductor device according to claim 12.

14. The third region is recessed compared to the first and second regions, and is not in contact with the bonding material. The semiconductor device according to claim 12.

15. The semiconductor device according to claim 12, wherein the third region exhibits greater liquid-repellent properties to the liquid of the first composition than the first region.

16. The resin member is an epoxy resin containing a second composition that changes from liquid to solid, and contains the solid of the second composition. The semiconductor device according to any one of claims 1 to 4.

17. The second region exhibits more hydrophilicity with respect to the liquid of the second composition than when the plurality of second grooves are not formed. The semiconductor device according to claim 16.

18. The surface layer of the die pad portion is a metal containing Cu. The semiconductor device according to any one of claims 1 to 4.

19. The spacing between the plurality of first grooves is greater than the spacing between the plurality of second grooves. The semiconductor device according to any one of claims 1 to 4.

20. A semiconductor element having electrodes on its surface, A die pad portion having a mounting surface on which the semiconductor element is mounted, A bonding material interposed between the semiconductor element and the die pad portion to fix the semiconductor element to the die pad portion, A plurality of terminals are arranged apart from the die pad portion when viewed in a first direction which is the thickness direction of the semiconductor element, A connecting member that electrically connects the electrode and any of the plurality of terminals, The resin member that seals at least a portion of the die pad portion, at least a portion of each of the plurality of terminals, the semiconductor element, and the connecting member, It is equipped with, The mounting surface has a first region in which a plurality of first grooves are formed below the semiconductor element, and a second region in which a plurality of second grooves are formed, which surrounds the first region when viewed in the first direction. The plurality of first grooves are linear in shape and extend in a second direction perpendicular to the first direction. The plurality of first grooves are arranged parallel to each other, The plurality of second grooves include a second groove that is longer than one side of the semiconductor element when viewed in the first direction. The spacing between the plurality of first grooves is greater than the spacing between the plurality of second grooves. Semiconductor equipment.

Images