Device, heat exchange unit, connector, heat generating unit, and heat exchanger

JP7914936B2Active Publication Date: 2026-09-03NAT UNIV CORP TOKAI NAT HIGHER EDUCATION & RES SYST
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Patent Information

Application Number
JP2022026237
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-02-22
Publication Date
2026-09-03
Estimated Expiration
2042-02-22

AI Technical Summary

Benefits of technology

【0006】 本明細書に開示される技術によれば、発熱体に対する熱交換器の取り付けを容易とする装置などを提供することができる。

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Abstract

To provide a device, a heat exchange unit, a connection, a heat generating unit, and a heat exchanger that facilitate the attachment of the heat exchanger to a heat generating element.SOLUTION: In a computer 600 which is a device, a loop type heat pipe 1 is a heat exchanger that includes a heating element 500, and a heat exchanger 650 that includes an evaporator 101 that absorbs heat from the heating element 500 and evaporates a liquid-phase working fluid, and condenses the gas-phase working fluid that flows out of the evaporator 101 in a condenser 105 and then circulates the fluid back to the evaporator 101, and an evaporator connection body 200 that connects the heating element and the evaporator, and the evaporator connection body 200 has an insertion port into which the evaporator 101 is inserted, and holds the evaporator inserted into the insertion port.SELECTED DRAWING: Figure 11
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Description

Technical Field

[0001] The present invention relates to an apparatus, a heat exchange unit, a connector, a heat generating unit, and a heat exchanger. Background Art

[0002] Patent Document 1 discloses a loop-type heat pipe which is respectively provided inside an evaporation section, a condensation section, and a liquid return pipe to efficiently cool a heat-generating component regardless of an installation angle, and has a wick that generates capillary force. Prior Art Literature Patent Literature

[0003] Patent Document 1 Japanese Patent Laid-Open No.2008-215702 Summary of the Invention Problem to be Solved by the Invention

[0004] By the way, in a process of assembling, for example, an electronic device, there is a demand to simplify the step of attaching a heat exchanger to a heating element included in the apparatus. Accordingly, an object of the present invention is to provide an apparatus or the like that facilitates attachment of a heat exchanger to a heat generating body. Means for Solving the Problem

[0005] To achieve the above objectives, the following invention can be cited as a means of solving the above problems. That is, the invention described in claim 1 is a device comprising a heating element, an evaporator that absorbs heat from the heating element and evaporates a liquid-phase working fluid, a heat exchanger that condenses the gas-phase working fluid discharged from the evaporator and recirculates it to the evaporator, and a connecting body that connects the heating element and the evaporator, wherein the connecting body has an insertion port into which the evaporator is inserted, holds the evaporator inserted into the insertion port, has a gripping portion that engages with the evaporator and the connecting body as the evaporator is inserted into the insertion port, has a pressed portion that is pressed by the user, and has a movable portion that moves the gripping portion when the pressed portion is pressed, allowing the evaporator to be removed from the insertion port. The invention described in claim 2 is the apparatus according to claim 1, wherein the evaporator is formed in a flat plate shape and has a first plate surface and a second plate surface which is the plate surface opposite to the first plate surface, and the connecting body has a first support surface which is the surface that supports the first plate surface of the evaporator inserted into the insertion port and a second support surface which is the surface that supports the second plate surface of the evaporator. The invention described in claim 3 is the apparatus according to claim 2, wherein the connecting body has a surface against which the tip of the evaporator inserted into the insertion port abuts. The invention described in claim 4 is the apparatus according to any one of claims 1 to 3, wherein the evaporator is provided with an inlet for liquid-phase working fluid to flow in and an outlet for gas-phase working fluid to flow out, and the inlet and the outlet are provided at the ends of the evaporator opposite to the end that is inserted into the insertion port of the connector. The invention described in claim 5 is the apparatus according to claim 4, wherein the evaporator is formed in a flat plate shape, and the inlet and outlet are provided in the center of the thickness direction of the evaporator. The invention described in claim 6 is the apparatus according to claim 4 or 5, wherein the evaporator is provided with a suppression structure between the flow path of the liquid-phase working fluid flowing in from the inlet and the flow path of the gas-phase working fluid flowing out from the outlet, which suppresses the gas-phase working fluid from heating the liquid-phase working fluid. The invention described in claim 7 is an apparatus according to any one of claims 4 to 6, wherein a working fluid tube is connected to the evaporator and through which the working fluid flows, the working fluid tube comprising a liquid tube through which a liquid-phase working fluid flows into the inlet, a trachea through which a gas-phase working fluid flows out from the outlet, an outer tube in which the liquid tube and the trachea are arranged inside, and an insulating material provided inside the outer tube between the liquid tube and the trachea. The invention described in claim 8 is the apparatus according to any one of claims 1 to 7, wherein the evaporator comprises a housing formed in the shape of a flat plate, with one plate surface positioned toward the heating element, and an evaporator formed in the shape of a flat plate, housed inside the housing, which absorbs heat from the heating element and evaporates a liquid working fluid into a gas phase while moving it by capillary force, the housing is provided with an inlet through which the liquid working fluid flows in and an outlet through which the gas working fluid flows out, and the evaporator is positioned inside the housing on the side of the one plate surface that is closer to the center in the thickness direction of the housing, and on the side opposite to the inlet inside the housing. The invention described in claim 9 is the apparatus according to any one of claims 1 to 8, wherein the connector has a support surface that supports the plate surface of the evaporator inserted into the insertion port of the connector, and a pressing mechanism that presses the evaporator against the support surface. The invention described in claim 10 is the apparatus according to any one of claims 1 to 9, wherein the heat exchanger has a condenser that dissipates heat through a heat radiator to condense the gaseous working fluid that has flowed out of the evaporator and recirculates it to the evaporator, the apparatus has another connector that connects the heat radiator and the condenser, the other connector has another inlet into which the condenser is inserted and holds the condenser inserted into the other inlet. The invention described in claim 11 is an apparatus comprising: a heating element; an evaporator that absorbs heat from the heating element and evaporates a liquid-phase working fluid; a condenser that condenses the gaseous-phase working fluid discharged from the evaporator and recirculates it back to the evaporator; a heat dissipator that absorbs heat from the condenser and releases heat; and a condensation connector that connects the heat dissipator and the condenser, wherein the condensation connector has a condensation inlet into which the condenser is inserted, holds the condenser inserted into the condensation inlet, and the evaporator is Condensed As it is inserted into the insertion port, the evaporator and the condensing connector are provided with a gripping portion that engages with each other, and have a pressed portion that is pressed by the user, and when the pressed portion is pressed, the gripping portion moves, Condensed The device is equipped with a movable part that allows the evaporator to be removed from the insertion port. Furthermore, one aspect of this invention is, A heat exchange unit comprising: an evaporator that absorbs heat from a heating element and evaporates a liquid-phase working fluid; a heat exchanger that condenses the gaseous-phase working fluid discharged from the evaporator and recirculates it back into the evaporator; and a connector that connects the heating element and the evaporator, wherein the connector has an insertion port into which the evaporator is inserted, holds the evaporator inserted into the insertion port, has a gripping portion that engages with the evaporator and the connector as the evaporator is inserted into the insertion port, has a press-to-reach portion that is pressed by the user, and has a movable portion that moves the gripping portion when the press-to-reach portion is pressed, allowing the evaporator to be removed from the insertion port. Furthermore, one aspect of this invention is, A heat exchanger having an evaporator that absorbs heat from a heating element and evaporates a liquid-phase working fluid, and condensing the gaseous-phase working fluid that flows out of the evaporator and recirculating it to the evaporator, wherein the evaporator is connected to the heating element by a connector having an insertion port into which the evaporator is inserted, and has a gripping portion that engages with the connector when inserted into the insertion port, and has a press-to-remove portion that is pressed by the user, and has a movable portion that moves the gripping portion when the press-to-remove portion is pressed, allowing the evaporator to be removed from the insertion port. [Effects of the Invention]

[0006] The technology disclosed herein can provide devices that facilitate the attachment of heat exchangers to heating elements. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram showing a loop-type heat pipe according to this embodiment. [Figure 2] This is a disassembled perspective view of the evaporator according to this embodiment. [Figure 3] This diagram illustrates the detailed configuration of the evaporator unit. [Figure 4] (A) and (B) are diagrams illustrating the detailed configuration of the evaporator body. [Figure 5] (A) and (B) are diagrams illustrating the internal space of the evaporator body. [Figure 6] This is an exploded perspective view of the condenser according to this embodiment. [Figure 7] This diagram illustrates the detailed configuration of the condenser unit. [Figure 8] (A) and (B) are diagrams illustrating the schematic configuration of the evaporator connector and the condenser connector. [Figure 9] (A) and (B) are diagrams illustrating the detailed configuration of the evaporator connector. [Figure 10-1] (A) and (B) are diagrams showing the process of attaching the evaporator to the evaporator connector. [Figure 10-2] (C) is a diagram showing the process of attaching the evaporator to the evaporator connector. [Figure 11] (A) and (B) are diagrams illustrating a device equipped with a loop-type heat pipe. [Figure 12] (A) and (B) are diagrams illustrating variations of a loop-type heat pipe. [Figure 13] (A) and (B) are diagrams illustrating other variations of the loop-type heat pipe. [Figure 14] This diagram illustrates yet another variation of the loop-type heat pipe. Mode for Carrying Out the Invention

[0008] Hereinafter, the present embodiment will be described in detail with reference to the accompanying drawings. <Configuration of Loop Heat Pipe 1> FIG. 1 is a schematic configuration diagram showing the loop heat pipe 1 according to the present embodiment. First, the configuration of the loop heat pipe 1 to which the present embodiment is applied will be described with reference to FIG. 1. The loop heat pipe 1 to which the present embodiment is applied is an example of a cooling element, and is configured to circulate a working fluid to cool a heating element 500 such as a central processing unit (CPU) provided inside a housing of an electronic device or the like without supplying power from the outside.

[0009] To describe in detail, the loop heat pipe 1 includes an evaporator 101 that evaporates the working fluid to cool the heating element 500 by utilizing latent heat generated when the working fluid vaporizes, and a condenser 105 that dissipates heat from the working fluid vaporized in the evaporator 101 to liquefy the working fluid.

[0010] The loop heat pipe 1 further includes a vapor line 107 that delivers the working fluid vaporized in the evaporator 101 to the condenser 105, and a liquid line 109 that delivers the working fluid liquefied in the condenser 105 back to the evaporator 101. The illustrated vapor line 107 and liquid line 109 are bendable and deformable. The loop heat pipe 1 is filled with the working fluid that undergoes phase change between liquid phase and gas phase. For example, water, alcohol, ammonia or the like is used as the working fluid.

[0011] <Operation of Loop Heat Pipe 1> Next, the operation of the loop heat pipe 1 will be described with reference to FIG. 1. The heat generated in the heat-generating element 500 is transferred to the evaporator 101 (see arrow C1). In the evaporator 101, the working fluid that has absorbed the heat vaporizes and is sent to the condenser 105 through the steam pipe 107 (see arrow A1) (see arrow A2). The working fluid sent to the condenser 105 liquefies by releasing heat through the heat-dissipating element 400 (see arrow C2). The liquefied working fluid is then sent back to the evaporator 101 through the liquid pipe 109 (see arrow A3) (see arrow A4).

[0012] Here, the evaporator 101 is detachably fixed to the evaporator connector 200 provided on the heat-generating element 500. More specifically, the evaporator 101 is fixed to the evaporator connector 200 when it is inserted into the evaporator connector 200. Similarly, the condenser 105 is detachably fixed to the condenser connector 300 provided on the heat-dissipating element 400. More specifically, the condenser 105 is fixed to the condenser connector 300 when it is inserted into the condenser connector 300.

[0013] The evaporator 101 and condenser 105 in this embodiment are flat. In other words, the evaporator 101 and condenser 105 in this embodiment are small and thin, so-called card-shaped. In this embodiment, a connector structure mechanism, the evaporator connector 200 and the condenser connector 300, are used to connect the heat source, the heat generating element 500, and the heat dissipation destination, the heat dissipation element 400.

[0014] Here, the steam pipe 107 and liquid pipe 109 are made of stainless steel or resin and are designed to be bendable and deformable. In other words, the steam pipe 107 and liquid pipe 109, which are transport pipes, are configured as flexible cables. The loop-type heat pipe 1 is equipped with the flexible cables of the steam pipe 107 and liquid pipe 109, and the evaporator 101 and condenser 105, which are detachable connectors, making it easy for the user to handle heat transport, similar to how electricity is transmitted using an electrical socket.

[0015] In addition, in the illustrated example, the evaporator 101 is provided at the ends of the steam pipe 107 and the liquid pipe 109, respectively. To further explain, in the evaporator 101, the outflow and inflow of the working fluid occur on a common surface (see evaporation surface 3 118 in Figure 3, which will be described later). That is, in the evaporator 101, the working fluid flows out in the same direction as the working fluid flows in. Similarly, in the illustrated example, the condenser 105 is provided at the ends of the steam pipe 107 and the liquid pipe 109, respectively. To further explain, in the condenser 105, the outflow and inflow of the working fluid occur on a common surface (see condensation surface 1 165 in Figure 7, which will be described later). That is, in the condenser 105, the working fluid flows out in the same direction as the working fluid flows in.

[0016] In the following explanation, the direction along the longitudinal direction of the steam pipe 107 and liquid pipe 109 in Figure 1 may be simply referred to as the longitudinal direction. Also, the thickness direction of the evaporator 101 and condenser 105 in Figure 1, i.e., the vertical direction in Figure 1, may be simply referred to as the thickness direction. Furthermore, the direction intersecting the longitudinal direction and the thickness direction in Figure 1 may be simply referred to as the width direction. Note that the names of directions such as the vertical direction used here are for convenience only and do not limit the orientation in which the loop-type heat pipe 1 is installed.

[0017] <Evaporator 101> (Outline configuration of evaporator 101) Figure 2 is an exploded perspective view of the evaporator 101 according to this embodiment. Next, with reference to Figure 2, the schematic configuration of the evaporator 101 to which this embodiment is applied will be described.

[0018] As shown in Figure 2, the evaporator 101 includes an evaporator body 110, a wick 130 provided inside the evaporator body 110, a first evaporator cover 140 covering the evaporator body 110 and the wick 130, and a second evaporator cover 149 covering the evaporator body 110 from the opposite side of the first evaporator cover 140.

[0019] The evaporator body 110 in this embodiment has a generally flat shape. The evaporator body 110, the first evaporator lid 140, and the second evaporator lid 149 function as housings for the wick 130. The evaporator body 110, the first evaporator lid 140, and the second evaporator lid 149 are made of materials such as metal (copper, aluminum, etc.) or resin. The evaporator body 110 is connected to a steam pipe 107 and a liquid pipe 109. The inside of the evaporator body 110 is filled with working fluid.

[0020] The wick 130 according to this embodiment is generally flat in shape. The wick 130 is formed from a porous material such as a porous metal. This wick 130 generates capillary force in the working fluid, thereby moving the working fluid. The effective pore diameter of the wick 130 is 0.1 to 20 μm. The porosity of the wick 130 is 25 to 70%. The method for measuring the effective pore diameter and porosity is not particularly limited. For example, they may be measured by apparent density measurement using water impregnation, pore size distribution measurement using mercury intrusion, or pore observation using X-ray CT.

[0021] Furthermore, the wick 130 is not limited to the aforementioned porous metal material, but can be any material with numerous pores, or voids, formed inside, such as porous resin materials like polytetrafluoroethylene (PTFE), porous ceramic materials, porous glass materials, or porous fibers. Also, using a material with low thermal conductivity as the wick 130 can reduce heat leakage in the evaporator 101. In addition, if you want to further reduce heat leakage, it is generally preferable to use a non-metallic material with lower thermal conductivity than metal.

[0022] Here, the position of the wick 130 is fixed, for example, by laser welding the outer circumference of the plate surface of the wick 130, which is placed inside the evaporator body 110, to the evaporator body 110. In addition, the evaporator first lid 140 and the evaporator second lid 149 are fixed, for example, by laser welding or so-called brazing, to the outer circumference of the plate surfaces of the evaporator first lid 140 and the evaporator second lid 149, which are placed in positions that cover the evaporator body 110.

[0023] (Detailed configuration of the evaporator unit 110) Figure 3 is a diagram illustrating the detailed configuration of the evaporator body 110. Figures 4(A) and 4(B) illustrate the detailed configuration of the evaporator body 110. More specifically, Figure 4(A) is a perspective view of the evaporator body 110 from the evaporation second surface 117 side. Figure 4(B) is a cross-sectional view of plane IVB-IVB in Figure 3.

[0024] Next, the detailed configuration of the evaporator body 110 will be described with reference to Figures 3 and 4. As shown in Figure 3, the evaporator body 110 has a substantially flat evaporator base 111. The evaporator base 111 includes a first evaporation surface 116 and a second evaporation surface 117 (see Figure 4(A)), which are plate surfaces extending in the width direction and the longitudinal direction. The evaporator base 111 also includes a third evaporation surface 118 and a fourth evaporation surface 119, which are sides extending in the width direction and the thickness direction.

[0025] Furthermore, on both sides of the evaporator base 111 in the width direction, evaporator first grooves 112 and 114 are formed, extending longitudinally from the evaporation third surface 118 side. The formation of these evaporator first grooves 112 and 114 provides evaporator first claws 113 and 115 on both sides of the evaporator base 111 in the width direction. These evaporator first claws 113 and 115 function as so-called slit springs.

[0026] Here, the evaporator first claw portion 113 and the evaporator second claw portion 115 are provided with an evaporator first pin 121 and an evaporator second pin 123 that project in a direction away from the evaporator base portion 111 along the width direction. In the illustrated example, the evaporator first pin 121 and the evaporator second pin 123 are provided at the longitudinal center of the evaporator first claw portion 113 and the evaporator second claw portion 115. The evaporator first claw portion 113 and the evaporator second claw portion 115 are also provided with a first wide portion 126 and a second wide portion 128 that project in a direction away from the evaporator base portion 111 along the width direction. In the illustrated example, the first wide portion 126 and the second wide portion 128 are provided at the ends of the evaporator first claw portion 113 and the evaporator second claw portion 115 on the longitudinal evaporation third surface 118 side.

[0027] Here, the evaporator first pin 121 and the evaporator second pin 123 function as pins for securing the evaporator body 110 to the evaporator connector 200. In other words, by providing the evaporator first pin 121 and the evaporator second pin 123, displacement of the evaporator 101 is suppressed. The first wide section 126 and the second wide section 128 function as knobs that the user presses with their fingers (see arrows D12 and D13). As will be described in detail later, when the user presses the first wide section 126 and the second wide section 128, the fixing of the evaporator first pin 121 and the evaporator second pin 123 is released, and the evaporator body 110 can be removed from the evaporator connector 200.

[0028] Furthermore, the first evaporation surface 116 of the evaporator base 111 is provided with a liquid reservoir recess 131 and an evaporation recess 133. Each of the liquid reservoir recess 131 and the evaporation recess 133 forms a substantially rectangular opening on the first evaporation surface 116. Here, the liquid reservoir recess 131 and the evaporation recess 133 are formed side by side in the longitudinal direction. Also, the liquid reservoir recess 131 has a smaller width dimension than the evaporation recess 133. In addition, the liquid reservoir recess 131 is shallower in depth (smaller thickness dimension) than the evaporation recess 133.

[0029] The liquid reservoir recess 131 contains the liquid-phase working fluid. The working fluid is introduced into the liquid reservoir recess 131 via the charge port 139 (see Figure 4(A)) during the manufacturing stage of the loop-type heat pipe 1. The charge port 139 is then closed after the working fluid has been introduced.

[0030] The evaporation recess 133 accommodates the wick 130. The interior of the evaporation recess 133 is divided by the wick 130 into a space where the liquid phase working fluid is contained (liquid phase region R1, described later) and a space where the gas phase working fluid is contained (gas phase region R3, described later). To explain further, in the evaporation recess 133, the liquid phase working fluid vaporizes and becomes the gas phase working fluid.

[0031] Furthermore, a liquid reservoir support column 132, which is a roughly cylindrical shape projecting in the thickness direction, is formed at the bottom of the liquid reservoir recess 131. This liquid reservoir support column 132 supports the evaporator first lid 140 inside the liquid reservoir recess 131. In other words, the liquid reservoir support column 132 secures a space in which the liquid phase working fluid is contained.

[0032] At the bottom of the evaporation recess 133, a steam guide projection 135 is formed, which is a projection extending in the width direction. Multiple steam guide projections 135 are arranged in a row in the longitudinal direction at predetermined intervals. The space between these steam guide projections 135 is a steam passage 137 through which the gaseous working fluid flows. In addition, the gaseous working fluid is guided in the width direction along the steam passage 137.

[0033] The evaporator base 111 has an evaporator inlet 136 and an evaporator outlet 138, which are through holes formed on the third evaporation surface 118 and extending along the longitudinal direction. The evaporator inlet 136 connects the outside of the evaporator base 111 to the space within the liquid reservoir recess 131. Similarly, the evaporator outlet 138 connects the outside of the evaporator base 111 to the space within the evaporation recess 133.

[0034] Here, the liquid reservoir recess 131 is located on the third evaporation surface 118 side in the longitudinal direction compared to the evaporation recess 133. The liquid reservoir recess 131 is positioned in the width direction, aligned with the evaporator outlet 138. In the illustrated example, an evaporator slit 141, which is an opening, is formed in the region sandwiched between the liquid reservoir recess 131 and the evaporator outlet 138. The presence of this evaporator slit 141 suppresses the heating of the liquid phase working fluid stored inside the liquid reservoir recess 131 by the gas phase working fluid passing through the evaporator outlet 138. In other words, the evaporator slit 141 makes it difficult for heat from the evaporator outlet 138 to be transferred to the liquid reservoir recess 131, thereby improving evaporation efficiency (reducing heat leakage). In addition, on the third evaporation surface 118 side of the evaporator slit 141 in the illustrated evaporator base 111, a continuous portion 142 is formed in the width direction. The formation of this continuous section 142 ensures the strength in the width direction of the evaporator base 111.

[0035] As shown in Figure 4(A), the evaporator base 111 includes an evaporator recess 143 and a machined hole 145 formed on the second evaporation surface 117. Here, the evaporator recess 143 is a recess formed on the back surface of the liquid reservoir recess 131. The presence of this evaporator recess 143 causes the area on the back surface of the liquid reservoir recess 131 on the second evaporation surface 117 to be spaced apart from the evaporator connector 200. This suppresses the heating of the liquid phase working fluid stored in the liquid reservoir recess 131 by the evaporator connector 200. In other words, the evaporator recess 143 makes it difficult for heat to be transferred from the evaporator connector 200 to the liquid reservoir recess 131, thereby improving evaporation efficiency.

[0036] Furthermore, as shown in Figure 4(B), the processed hole 145 is an opening for forming the first steam passage 146 and the second steam passage 147 during the manufacturing stage of the loop-type heat pipe 1. This processed hole 145 is covered by the evaporator second cover 149. Here, the first steam passage 146 is a flat plate-shaped space along the longitudinal direction. The second steam passage 147 is a substantially cylindrical space along the thickness direction. The first steam passage 146 and the second steam passage 147 are provided intersecting each other. The first steam passage 146 and the second steam passage 147 are spaces that connect the evaporator outlet 138 and the evaporation recess 133.

[0037] (Internal space of the evaporator body 110) Figures 5(A) and 5(B) illustrate the internal space of the evaporator body 110. More specifically, Figure 5(A) is a conceptual diagram showing the internal space of the evaporator body 110, and Figure 5(B) is a conceptual diagram showing the arrangement of the liquid phase guide region R13 and the gas phase guide region R33 as viewed from the evaporation third surface 118 side.

[0038] Next, the internal space of the evaporator body 110 will be explained with reference to Figure 5(A). As described above, a wick 130 is arranged inside the evaporator 101. This wick 130 divides the inside of the evaporator body 110 into a liquid phase region R1 and a gas phase region R3. In the internal space of the evaporator 101, the space located on the opposite side of the wick 130 from the heating element 500 (upper side in the figure) is the liquid phase region R1 through which the liquid phase working fluid passes. Also, in the internal space of the evaporator 101, the space located on the heating element 500 side of the wick 130 (lower side in the figure) is the gas phase region R3 through which the gas phase working fluid passes.

[0039] Here, the liquid phase region R1 has a liquid phase wick opposing region R11, which is the region facing the wick 130, and a liquid phase guide region R13, which is continuous with the liquid phase wick opposing region R11 and is located on the liquid pipe 109 side of the liquid phase wick opposing region R11. Note that the liquid phase wick opposing region R11 is part of the internal space of the evaporation recess 133 (see Figure 3). The liquid phase guide region R13 is the internal space of the liquid reservoir recess 131 (see Figure 3).

[0040] Furthermore, the gas phase region R3 includes a gas phase wick opposing region R31, which is the region facing the wick 130, and a gas phase guide region R33, which is continuous with the gas phase wick opposing region R31 and is located closer to the steam pipe 107 than the gas phase wick opposing region R31. Note that the gas phase wick opposing region R31 is part of the evaporation recess 133 (see Figure 3). The gas phase guide region R33 is the internal space of the first steam passage 146, the second steam passage 147, and the evaporator outlet 138 (see Figure 4(B)).

[0041] (Operation of evaporator 101) Next, the operation of the evaporator body 110 will be explained with reference to Figures 1, 3, and 5(A). As shown in Figure 5(A), the liquid-phase working fluid (see arrow A11) that flows into the evaporator body 110 from the liquid pipe 109 passes through the liquid-phase guide region R13 and flows into the liquid-phase wick-facing region R11 (see arrow A21). The liquid-phase working fluid in the liquid-phase wick-facing region R11 then permeates the wick 130. The liquid-phase working fluid then moves within the wick 130 due to the capillary force of the wick 130 (see arrow A22) and is heated by the heat of the heating element 500 and vaporizes. This vaporized working fluid flows along the steam flow path 137 (see Figure 3) in the gas-phase wick-facing region R31 (see arrow A23). The gas-phase working fluid then changes direction as it passes through the gas-phase guide region R33 (see arrows A24, A25), flows out of the steam pipe 107 (see arrow A13), and is sent to the condenser 105 (see Figure 1).

[0042] Meanwhile, the working fluid liquefied in the condenser 105 (see Figure 1) flows into the evaporator body 110 via the liquid pipe 109 (see arrow A11). The working fluid that flows into the evaporator body 110 permeates into the wick 130 via the liquid phase guide region R13 and the liquid phase wick opposing region R11. In this way, the flow of the working fluid in the wick 130 is uninterrupted, and the above cycle is repeated. Then, the heat generated in the heat-generating element 500 is transported from the evaporator 101 to the condenser 105 (see Figure 1).

[0043] (Thickness of evaporator 101) Next, the thickness of the evaporator 101 will be explained with reference to Figures 5(A) and (B).

[0044] First, in this embodiment, in order to suppress the thickness dimension of the evaporator body 110, the wick 130 and the liquid phase region R1 are positioned offset from each other. Specifically, as shown in Figure 5(A), a liquid phase guide region R13 is formed in the longitudinal direction at a position different from the liquid phase wick opposing region R11. By making it possible to accommodate the liquid phase working fluid in this liquid phase guide region R13, which is positioned not opposite the wick 130, the thickness dimension of the liquid phase wick opposing region R11 can be suppressed.

[0045] Here, as shown in Figure 5(B), in order to secure space for the liquid-phase working fluid, the position of the wick 130 in the thickness direction is positioned closer to the steam guide protrusion 135 than the center L1 of the evaporator body 110. Due to this positioning of the wick 130, the gas-phase wick-facing region R31 is offset from the center L1 of the evaporator body 110. On the other hand, for example, in order to ensure the strength of the evaporator body 110, the position of the evaporator outlet 138 is positioned at the center L1 of the evaporator body 110 in the thickness direction. In the illustrated example, therefore, a first steam passage 146 and a second steam passage 147 are formed. By forming the first steam passage 146 and the second steam passage 147, even if the gas-phase wick-facing region R31 and the evaporator outlet 138 are offset in the thickness direction, the working fluid vaporized in the wick 130 can flow out from the evaporator outlet 138.

[0046] <Configuration of condenser 105> (Outline configuration of condenser 105) Figure 6 is an exploded perspective view of the condenser 105 according to this embodiment. Next, with reference to Figure 6, the schematic configuration of the condenser 105 to which this embodiment is applied will be described. As shown in Figure 6, the condenser connector 300 has a condenser body 150 and a condenser cover 190 that covers the condenser body 150.

[0047] The condenser body 150 in this embodiment is generally flat in shape. The condenser body 150 and the condenser cover 190 function as a housing. The condenser body 150 and the condenser cover 190 are made of a material such as copper, aluminum, or resin. The condenser body 150 is connected to a steam pipe 107 and a liquid pipe 109. The evaporator body 110 is filled with working fluid. The condenser cover 190 is fixed to the condenser body 150 by, for example, laser welding or so-called brazing of the outer circumference of the plate surface of the condenser cover 190 that is placed on the condenser body 150.

[0048] (Detailed configuration of the condenser unit 150) Figure 7 is a diagram illustrating the detailed configuration of the condenser body 150. Next, the detailed configuration of the condenser body 150 will be explained with reference to Figure 7.

[0049] As shown in Figure 7, the condenser body 150 has a substantially flat condenser base 151. The condenser base 151 includes a first condensing surface 165 and a second condensing surface 167, which are surfaces extending in the width direction and the thickness direction.

[0050] Furthermore, a first condenser groove 152 and a second condenser groove 154 are formed on both sides of the condenser base 151 in the width direction, extending longitudinally from the condensing first surface 165 side. The formation of these first and second condenser grooves provides a first condenser claw 153 and a second condenser claw 155 on both sides of the condenser base 151 in the width direction. The first and second condenser claws function as slit springs.

[0051] Here, the condenser first claw portion 153 and the condenser second claw portion 155 are provided with a condenser first pin 161 and a condenser second pin 163 that project in a direction away from the condenser base portion 151 along the width direction. In the illustrated example, the condenser first pin 161 and the condenser second pin 163 are provided at the longitudinal center of the condenser first claw portion 153 and the condenser second claw portion 155. The condenser first claw portion 153 and the condenser second claw portion 155 are also provided with a first wide portion 166 and a second wide portion 168 that project in a direction away from the evaporator base portion 111 along the width direction. In the illustrated example, the first wide portion 166 and the second wide portion 168 are provided at the ends of the condenser first claw portion 153 and the condenser second claw portion 155 on the longitudinal condensation first surface 165 side.

[0052] Here, the condenser first pin 161 and the condenser second pin 163 function as pins for securing the condenser body 150 to the condenser connector 300. In other words, by providing the condenser first pin 161 and the condenser second pin 163, displacement of the condenser 105 is suppressed. The first wide section 166 and the second wide section 168 function as knobs that the user presses with their fingers (see arrows D52 and D53). When the user presses the first wide section 166 and the second wide section 168, the fixing of the condenser first pin 161 and the condenser second pin 163 is released, and the condenser body 150 can be removed from the condenser connector 300.

[0053] Furthermore, the condenser body 150 is provided with a condensation recess 171. The condensation recess 171 forms a roughly rectangular opening in evaporation view. The bottom of the condensation recess 171 is provided with a condensation guide projection 173 that extends in the longitudinal direction. Multiple condensation guide projections 173 are provided in the width direction at predetermined intervals. The condenser base 151 also has a condenser inlet 186 and a condenser outlet 188, which are through holes formed on the first condensation surface 165 and extending along the longitudinal direction. The condenser inlet 186 and condenser outlet 188 connect the outside of the condenser body 150 to the inside of the condensation recess 171.

[0054] Here, the space between the condensation guide protrusions 173 is a condensation channel 175 through which the working fluid flows. Furthermore, the condensation guide protrusions 173 have different ends cut out in the longitudinal direction. More specifically, adjacent condensation guide protrusions 173 in the width direction have opposite ends cut out in the longitudinal direction. As a result, the working fluid changes direction at the longitudinal end of each condensation channel 175 and flows back and forth through the interior of the condensation channel 175 (see arrows A61, A63, and A65). By forming a channel that reciprocates in the longitudinal direction, it is possible to reliably condense the gaseous working fluid even when the plate surface of the condenser 105 is small.

[0055] <Evaporator connector 200 and condenser connector 300> (Outline configuration of evaporator connector 200 and condenser connector 300) Figures 8(A) and 8(B) illustrate the schematic configuration of the evaporator connector 200 and the condenser connector 300. More specifically, Figure 8(A) is an exploded perspective view of the evaporator connector 200. Figure 8(B) is an exploded perspective view of the condenser connector 300.

[0056] Next, with reference to Figures 8(A) and (B), the schematic configurations of the evaporator connector 200 and condenser connector 300 to which this embodiment is applied will be described. First, the evaporator connector 200 will be described with reference to Figure 8(A). As shown in Figure 8(A), the evaporator connector 200 has an evaporator-side base 210 and an evaporator-side cover 250. The evaporator-side base 210 and the evaporator-side cover 250 are each substantially plate-shaped members. The evaporator-side base 210 and the evaporator-side cover 250 are formed from materials such as metals like copper or aluminum, or resin.

[0057] The evaporator-side base 210 has a first surface 211 and a second surface 213, which are surfaces extending in the width direction and the longitudinal direction. On the first surface 211, a step 215 is formed and an evaporator support surface 217 is provided. On the second surface 213, support legs 232 that protrude in the thickness direction are provided. The evaporator-side base 210 is also provided with fixing holes 231 into which fasteners such as bolts are inserted.

[0058] The evaporator-side cover 250 has a first surface 251 and a second surface 253, which are surfaces extending in the width direction and the longitudinal direction. The evaporator-side cover 250 has an evaporator support portion 255, which is a recess formed in the second surface 253. This evaporator support portion 255 forms an opening 256 (see Figure 10-1(B) described later) between itself and the evaporator-side base 210.

[0059] Furthermore, the evaporator-side cover 250 is provided with fixing holes 271 into which fasteners such as bolts are inserted. Additionally, the evaporator-side cover 250 is provided with a first evaporator receiving hole 273 and a second evaporator receiving hole 275 that penetrate in the width direction from inside the evaporator receiving portion 255.

[0060] Next, the condenser connector 300 will be described with reference to Figure 8(B). As shown in Figure 8(B), the condenser connector 300 has a condenser-side base 310 and a condenser-side cover 350. The condenser-side base 310 and the condenser-side cover 350 are each substantially plate-shaped members. The condenser-side base 310 and the condenser-side cover 350 are formed from materials such as metals like copper or aluminum, or resin.

[0061] The condenser-side base 310 has a first surface 311 and a second surface 313, which are surfaces extending in the width direction and the longitudinal direction. The condenser-side base 310 is also provided with fixing holes 331 into which fasteners such as bolts are inserted.

[0062] The condenser-side cover 350 has a first surface 351 and a second surface 353, which are surfaces extending in the width direction and the longitudinal direction. The condenser-side cover 350 has a condenser receiving portion 355, which is a recess formed in the second surface 353. The condenser receiving portion 355 forms an opening with the condenser-side base 310. In the illustrated example, the condenser-side cover 350 has a guide portion 357 that guides the insertion of the condenser 105 (see Figure 1) into the condenser receiving portion 355.

[0063] Furthermore, the condenser-side cover 350 is provided with fixing holes 371 into which fasteners such as bolts are inserted. In addition, the condenser-side cover 350 is provided with a first condenser receiving hole 373 and a second condenser receiving hole 375 that penetrate in the width direction from inside the condenser receiving portion 355.

[0064] In the illustrated example, the mechanism for fixing the evaporator 101 to the evaporator connector 200 and the mechanism for fixing the condenser 105 to the condenser connector 300 have the same configuration. The mechanism for fixing the evaporator 101 to the evaporator connector 200 will be described in detail below.

[0065] (Detailed configuration of evaporator connector 200) Figures 9(A) and (B) illustrate the detailed configuration of the evaporator connector 200. Next, the detailed configuration of the evaporator connector 200 will be described with reference to Figures 9(A) and (B).

[0066] As shown in Figure 9(A), the evaporator connector 200 is fixed in a state where it is thermally connected to the heating element 500. In the illustrated example, the evaporator connector 200 is positioned to cover the heating element 500 and is pressed against the heating element 500. More specifically, the evaporator connector 200 is positioned so as to straddle the heating element 500 with support legs 232.

[0067] The evaporator 101 is inserted into the evaporator receiving portion 255 of the evaporator connector 200. The evaporator 101 inserted into the evaporator receiving portion 255 is sandwiched in the thickness direction by the thickness direction retaining surface 261 and the evaporator support surface 217 (see Figure 8(B)). In the width direction, the evaporator 101 is sandwiched by the width direction first retaining surface 263 and the width direction second retaining surface 265.

[0068] Furthermore, as the evaporator 101 is inserted into the evaporator receiving portion 255 of the evaporator connector 200, the evaporator first pin 121 and the evaporator second pin 123 of the evaporator 101 engage with the evaporator first receiving hole 273 and the evaporator second receiving hole 275. This fixes the position of the evaporator 101 in the longitudinal and thickness directions.

[0069] <Attachment / Detachment> (Installation operation of evaporator 101 and evaporator connector 200) Figures 10(A) to (C) show the operation of attaching the evaporator 101 to the evaporator connector 200. Next, the operation of attaching and detaching the evaporator 101 to the evaporator connector 200 will be explained with reference to Figures 10(A) to (C).

[0070] First, we will explain the operation of attaching the evaporator 101 to the evaporator connector 200. Here, we will explain that the evaporator 101 is inserted into the evaporator connector 200, which is located in a position that covers the heating element 500, as shown in Figures 10-1(A-1) and (B-1).

[0071] Then, as shown in Figures 10-1(A-2) and (B-2), the evaporator 101 is placed on the first surface 211 of the evaporator connector 200 and slid toward the opening 256 (see arrow D51). Here, sliding means sliding one surface toward the other surface while the surfaces of the evaporator 101 and the evaporator connector 200 are in contact with each other.

[0072] Then, as shown in Figures 10-1(A-3) and (B-3), the evaporator 101 is inserted into the opening 256 of the evaporator connector 200. At this time, as shown in Figure 10-2(C-2), the evaporator first pin 121 fits into the evaporator first receiving hole 273. Also, the evaporator second pin 123 fits into the generator second receiving hole 275. This fixes the position of the evaporator 101 in the longitudinal and thickness directions.

[0073] As described above, the evaporator 101 is attached to the evaporator connector 200 by inserting it into the opening 256 formed in the evaporator connector 200.

[0074] Here, as shown in Figure 10-2(C-1), when the evaporator 101 is mounted on the evaporator connector 200, both sides of the evaporator 101 in the width direction are sandwiched between them. More specifically, the evaporator 101 is supported by a first restraining surface 263 in the width direction and a second restraining surface 265 in the width direction that is spaced apart from the first restraining surface 263 and faces the first restraining surface 263 in the width direction. By sandwiching the evaporator 101 from both sides in the width direction, displacement in the width direction is suppressed. Also, by sandwiching the evaporator 101 from both sides in the width direction, heat transfer between the evaporator 101 and the evaporator connector 200 is promoted. Furthermore, when the evaporator 101 is mounted on the evaporator connector 200, the ends of the evaporator 101 protrude outside the opening 256. Because a portion of the evaporator 101 protrudes outside the opening 256 in this manner, it becomes easier to remove the evaporator 101.

[0075] Furthermore, as shown in Figure 10-2(C-4), when the evaporator 101 is mounted on the evaporator connector 200, both sides of the evaporator 101 in the thickness direction are sandwiched between them. More specifically, the evaporator 101 is supported by the evaporator support surface 217 and the thickness-direction restraining surface 261 which is positioned at a distance from the evaporator support surface 217 and faces the evaporator support surface 217. By sandwiching the plate surface of the evaporator 101, which is formed on a plate, from both sides, heat transfer between the evaporator 101 and the evaporator connector 200 is promoted.

[0076] Furthermore, when the evaporator 101 is attached to the evaporator connector 200, the fourth evaporation surface 119, which is the leading edge of the evaporator 101 in the insertion direction, abuts against the inner surface 267 of the evaporator connector 200. To explain further, the fourth evaporation surface 119 of the evaporator 101 is positioned with support from the inner surface 267 of the evaporator connector 200. By abutting the evaporator 101 against the inner surface 267 of the evaporator connector 200, displacement in the longitudinal direction is suppressed. In addition, by abutting the fourth evaporation surface 119 against the inner surface 267 of the evaporator connector 200, heat transfer between the evaporator 101 and the evaporator connector 200 is promoted.

[0077] In the illustrated example, as described above, the evaporator 101 is positioned covered by the evaporator connector 200. More specifically, all sides of the evaporator 101 except the opening 256 side are covered by the evaporator connector 200. In other words, the end of the inserted evaporator 101 is covered by the evaporator connector 200. This covering of the evaporator 101 by the evaporator connector 200 promotes heat transfer between the evaporator 101 and the evaporator connector 200.

[0078] (Removal operation of evaporator 101 and evaporator connector 200) Next, we will explain the procedure for removing the evaporator 101 from the evaporator connector 200. First, as shown in Figures 10-1(A-3) and (B-3), the user presses the first wide portion 126 and the second wide portion 128 of the evaporator 101, which is inserted into the evaporator connector 200, with their fingers (see arrows D12 and D13). This releases the fixing of the evaporator first pin 121 and the evaporator second pin 123.

[0079] Then, as shown in Figures 10-1(A-2) and (B-2), the evaporator 101 is slid (see arrow D52). This causes the evaporator 101 to be detached from the evaporator connector 200 (see Figures 10-1(A-1) and (B-1)).

[0080] <Other> (Comparison with CPU water cooling systems, etc.) Now, as a cooling device for the central processing unit (CPU), for example, a CPU water cooler is known. In comparison with this CPU cooler, the features of the loop-type heat pipe 1 according to this embodiment will be illustrated. First, while a CPU cooler is equipped with a pump, the loop-type heat pipe 1 is not equipped with a pump. Therefore, the loop-type heat pipe 1 does not generate pump operating noise, and the risk of failure can be reduced. In addition, the loop-type heat pipe 1 does not require an external power supply, and no electrical wiring is required. The loop-type heat pipe 1 can contribute to energy saving.

[0081] Furthermore, in the loop-type heat pipe 1, there is no pump and heat exchange is performed by phase change, so a small amount of working fluid is required. As a result, the evaporator 101 can be made smaller, which can increase the flexibility of the layout in the space above the CPU.

[0082] Furthermore, with CPU coolers, each time they are removed, it is necessary to apply, for example, thermal conductive grease between the CPU and the CPU cooler and secure it with bolts or the like. On the other hand, with the loop-type heat pipe 1, if the evaporator connector 200 and condenser connector 300 are attached, for example, with thermal conductive grease and bolts, then a part of the evaporator 101, etc., can be easily attached and detached by the user by pinching it with their fingers. In addition, with the loop-type heat pipe 1, since the transport pipes, the vapor pipe 107 and liquid pipe 109, are flexible, the degree of freedom in arranging the transport pipes within the target system can be increased. Also, by using the evaporator 101 and condenser 105 which are composed of thin card shapes, the degree of freedom in arranging the evaporator 101 and condenser 105 within the target system can be increased, and the system can be miniaturized.

[0083] Furthermore, in systems with multiple heat-generating elements, using the loop-type heat pipe 1 makes it easier to arrange heat transport, such as consolidating heat dissipation into a single heat sink. In addition, by using the evaporator 101 and condenser 105, which are detachable connectors, it is expected that energy conservation and waste heat utilization efforts will be promoted not only by businesses but also in households, for example, and as a result, it may contribute to reducing CO2 emissions.

[0084] (Device equipped with loop-type heat pipe 1) Figures 11(A) and (B) illustrate a device equipped with a loop-type heat pipe 1. Next, an apparatus equipped with the loop-type heat pipe 1 will be described with reference to Figures 11(A) and (B). The apparatus equipped with the loop-type heat pipe 1 is not particularly limited as long as it is equipped with a heat-generating element 500.

[0085] For example, as shown in Figure 11(A), the loop-type heat pipe 1 may be provided in a computer 600. The computer 600 has multiple heat-generating elements 500, each composed of a CPU heat-generating element, provided on a substrate 610. The computer 600 also has a cold plate 630, a heat exchanger 650, and a heat transport path 670 that transports heat between the cold plate 630 and the heat exchanger 650. Each heat-generating element 500 and the cold plate 630 are connected by the loop-type heat pipe 1.

[0086] In this computer 600, the heat generated by the heat-generating element 500 is transmitted to the heat exchanger 650 via the loop-type heat pipe 1, the cold plate 630, and the heat transport path 670. To further explain, the evaporator 101 and condenser 105 of the loop-type heat pipe 1 are formed in a card shape, making it possible to install the loop-type heat pipe 1 even for the heat-generating element 500, which is a heat source installed in a narrow space.

[0087] Furthermore, as shown in Figure 11(B), the loop-type heat pipe 1 may be provided on the robot 700. The robot 700 has a robot arm 710 and a heating element 730 provided at the tip of the robot arm 710. The heating element 730 and a condenser (not shown) are connected by the loop-type heat pipe 1.

[0088] In this robot 700, the robot arm 710 functions as a so-called movable part. In the loop-type heat pipe 1, since the transport pipes, the steam pipe 107 and liquid pipe 109, are flexible, the evaporator 101 and condenser 105 can be installed even in movable parts such as the robot arm.

[0089] Here, a computer 600 and a robot 700 have been described as examples of devices equipped with a loop-type heat pipe 1, but the invention is not limited to these. For example, a loop-type heat pipe 1 may be used to cool heat-generating elements in personal computers, tablet terminals, smartphones, projectors, etc. Furthermore, a loop-type heat pipe 1 may be used in applications such as waste heat utilization in factories, server cooling in data centers, power electronics cooling in offshore wind turbine nacelles, heat source transport utilization for desiccant air conditioning and absorption chillers, cooling of power electronics in automobiles, aircraft, and railways, cooling of transformers in industrial welding robots, power electronics cooling for eVTOLs, etc., and solar thermal transport utilization in houses.

[0090] <Variation> The following describes a modified version of the loop-type heat pipe 1. In the following description, the same reference numerals are used for parts that are the same as those in the above embodiment, and their detailed descriptions may be omitted. (Variation 1) Figures 12(A) and (B) illustrate modified examples of the loop-type heat pipe 1. Next, a modified example of the loop-type heat pipe 1 will be described with reference to Figures 12(A) and (B).

[0091] In the above explanation, the evaporator connector 200, which is a connector, is provided on the heat-generating element 500. When the heat-generating element 500 is a CPU, a configuration in which the evaporator connector 200 is provided on the CPU's heat spreader may be adopted. On the other hand, unlike the above example, the CPU's heat spreader and the connector may be configured as a single unit.

[0092] Specifically, the CPU 2020 may be configured as shown in Figure 12(A-1). This CPU 2020 includes a substrate 2011, a semiconductor (die) 2012 provided on the substrate 2011, a thermal conductor 2013 made of TIM (Thermal Interface Material) or solder, an electrode 2015 made of BGA (Ball Grid Array) provided on the side of the substrate 2011 opposite to the semiconductor 2012, and a connector-integrated heat spreader 2017. Then, as shown in Figures 12(A-1) to (A-3), an evaporator 1010 is inserted into the heat spreader 2017 (see arrow D53).

[0093] By forming the CPU2020, users can install the loop-type heat pipe 1000 without using thermal conductive grease or bolts. Furthermore, compared to the configuration in which the evaporator connector 200 is placed on the heat-generating element 500 as described above, the contact thermal resistance is reduced, and the CPU2020 (semiconductor 2012) can be cooled more efficiently.

[0094] Furthermore, as shown in Figures 12(B-1) and (B-2), a loop-type heat pipe 1100 may be applied to the card-type power semiconductor 5100. This card-type power semiconductor 5100 comprises a substrate 5101, electrodes 5013 connected to the substrate 5101, and a heat dissipation surface 5015. In the illustrated example, multiple card-type power semiconductors 5100 are arranged side by side. To further explain, the substrates 5101 are stacked. Then, an evaporator connector 2100 is provided between the layers of the stacked substrates 5101. That is, the evaporator connector 2100 is sandwiched between the substrates 5101. Then, an evaporator 1010 is inserted into each of the evaporator connectors 2100 (see arrow D55).

[0095] Here, by providing multiple evaporator connectors 2100 between the layers of the stacked substrates 5101, it becomes possible to dissipate the heat generated on the substrates 5101 by distributing it to multiple locations. In addition, the system including the card-type power semiconductor 5100 can be made more compact.

[0096] (Modification 2) Figures 13(A) and (B) illustrate other variations of the loop-type heat pipe 1. Next, other modifications of the loop-type heat pipe 1 will be described with reference to Figures 13(A) and (B).

[0097] In the above description, the evaporator 101 was inserted inside the evaporator connector 200. However, the method of installing the evaporator 101 is not particularly limited, as long as it is possible to place the evaporator 101 inside the evaporator connector 200. For example, the evaporator connector 2000 may be configured as shown in Figure 13(A).

[0098] The evaporator connector 2000 comprises an evaporator-side base 2010 and an evaporator-side cover 2050. The evaporator-side cover 2050 is provided with a recessed evaporator support portion 2550. A pivot shaft 2070 extending in the width direction is provided at one longitudinal end 2052 of the evaporator-side cover 2050. As a result, the evaporator-side cover 2050 is rotatable around the pivot shaft 2070 (see arrow D58).

[0099] Furthermore, the evaporator-side cover 2050 has first claws 2093 and second claws 2095 that protrude from both sides in the width direction toward the evaporator-side base 2010. The first claws 2093 and second claws 2095 are elastically deformable. The first claws 2093 and second claws 2095 also have first claw tips 2097 and second claw tips 2098, which are projections that engage with the evaporator-side base 2010. To further explain, the evaporator-side cover 2500 is fixed to the evaporator-side base 2010 by the engagement of the first claw tips 2097 and second claw tips 2098 with the evaporator-side base 2010.

[0100] As shown in Figure 13(B), the evaporator 101 is mounted on the evaporator connector 2000. To explain in more detail, first, as shown in Figure 13(B-1), the evaporator-side base 2110 and the evaporator-side cover 2500 are in an open state. At this time, the first claw tip 2097 is located on the evaporator receiving portion 2550 side of the evaporator-side base 2110.

[0101] Next, as shown in Figure 13(B-2), the evaporator 101 is inserted into the evaporator support portion 2550 (see arrow D59). In this state, as shown in Figure 13(B-3), the evaporator-side cover 2500 is pressed and rotates around the rotation axis 7010 (see arrow D60). As a result, the first claw tip 2097 is positioned on the opposite side of the evaporator support portion 2550 from the evaporator-side base 2110. The evaporator 101 is then sandwiched between the evaporator-side cover 2050 and the evaporator-side base 2010.

[0102] By providing the first claw body 2093 and the second claw body 2095, as in the evaporator connector 2000, the surface pressure between the evaporator connector 2000 and the evaporator 101 is increased. This promotes heat transfer between the evaporator connector 2000 and the evaporator 101.

[0103] (Variation 3) Figure 14 illustrates yet another modification of the loop-type heat pipe 1. Next, with reference to Figure 14, we will describe yet another modification of the loop-type heat pipe 1. In the above explanation, it was stated that the transport pipes provided in the loop-type heat pipe 1 consist of two pipes: a steam pipe 107 and a liquid pipe 109. However, the explanation is not limited to this.

[0104] As shown in Figure 14, the configuration may include a housing tube 1303 and a steam tube 1307 and a liquid tube 1309 arranged inside the housing tube 1303. The inside of the housing tube 1303 is provided with an insulating material such as glass wool (not shown) to suppress heat transfer between the steam tube 1307 and the liquid tube 1309. By bundling the steam tube 1307 and the liquid tube 1309 together into a single working fluid tube using the housing tube 1303, the workability when installing the loop-type heat pipe 1 can be improved.

[0105] (Other variations) In the explanation of the steam, it was described that the wick 130 is fixed and sealed by a laser, but this is not the only option. For example, the wick 130 may be fixed and sealed with a sealing material such as a so-called O-ring.

[0106] Furthermore, the steam pipe 107 and the liquid pipe 109 may be made of resin or the like. Here, the steam pipe 107 and the liquid pipe 109 may be made of transparent material. In devices equipped with lighting for decorative purposes, such as so-called gaming PCs, making the steam pipe 107 and the liquid pipe 109 out of transparent material can improve the decorative appearance of the device.

[0107] Furthermore, in order to increase the surface pressure between the evaporator-side base 210 (evaporator-side cover 250) and the evaporator body 110, an inclined surface such as a slope or taper may be provided on the evaporator-side base 210 (evaporator-side cover 250). As the evaporator body 110 is inserted, this inclined surface tilts in a direction that presses the evaporator body 110 against the evaporator-side cover 250 (evaporator-side base 210). By forming this inclined surface, heat transfer between the evaporator 101 and the evaporator connector 200 is promoted.

[0108] Furthermore, although the above description explains that the evaporator first pin 121 and the evaporator second pin 123 are provided on the evaporator 101, the explanation is not limited to this. As long as the evaporator 101 and the evaporator connector 200 are configured to interlock with each other, for example, the evaporator connector 200 may be provided with pins or claws instead of (or in addition to) the evaporator 101.

[0109] Furthermore, although the above description explains that the evaporator body 110 is provided with an evaporator recess 143, the configuration is not limited to this, as long as it restricts heat transfer between the liquid reservoir recess 131 and the evaporator connector 200. For example, an insulating material may be placed on the back surface of the liquid reservoir recess 131 in the evaporator body 110. Alternatively, the region in the evaporator body 110 that forms the liquid reservoir recess 131 may be made of a material with a lower thermal conductivity than the evaporation recess 133.

[0110] Furthermore, although the above description explains that the evaporator body 110 is equipped with an evaporator slit 141, the configuration is not limited to this, as long as it restricts heat transfer between the evaporator outlet 138 and the liquid reservoir recess 131. For example, an insulating material may be placed between the evaporator outlet 138 and the liquid reservoir recess 131. Alternatively, the region in the evaporator body 110 that forms the liquid reservoir recess 131 may be made of a material with a lower thermal conductivity than the evaporation recess 133.

[0111] Furthermore, although the above description states that both the evaporator 101 and the condenser 105 are small, thin, and have a so-called card-type shape, either the evaporator 101 or the condenser 105 may have a card-type shape. To elaborate further, either the evaporator 101 or the condenser 105 may be connected to an evaporator connector 200 or a condenser connector 300, which is a connector structure mechanism connected to that one.

[0112] Furthermore, the shape of the evaporator 101 and condenser 105 is not limited to a card shape, as long as the user can place them inside the evaporator connector 200 and condenser connector 300. For example, the shape of the evaporator 101 and condenser 105 may be cylindrical, rectangular, conical, pyramidal, oblong, or spherical. In addition, the evaporator 101 and condenser 105 may be elongated in one direction. If the evaporator 101 and condenser 105 are elongated in one direction, it may be easier to insert their ends into the evaporator connector 200 or condenser connector 300.

[0113] Now, although various embodiments and modifications have been described above, these embodiments and modifications can of course be combined to form a complete system. Furthermore, this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms without departing from the gist of this disclosure.

[0114] Loop-type heat pipe 1 is an example of a heat exchanger. Computer 600 is an example of a device. Evaporator connector 200 is an example of a connector. Opening 256 is an example of an inlet. Evaporation first surface 116 is an example of a first plate surface. Evaporation second surface 117 is an example of a second plate surface. Thickness direction restraining surface 261 is an example of a first support surface. Evaporator support surface 217 is an example of a second support surface and support surface. Inner surface 267 is an example of a surface to be abutted. Evaporator first pin 121 and evaporator first receiving hole 273 are examples of engagement parts. Evaporator first claw part 113 is an example of a movable part. Evaporator inlet 136 is an example of an inlet. Evaporator outlet 138 is an example of an outlet. Evaporator slit 141 is an example of a restraining structure. Housing tube 1303 is an example of an outer tube. The evaporator body 110 is an example of a housing. The wick 130 is an example of an evaporator. The first claw body 2093 is an example of a pressing mechanism. The condenser connector 300 is an example of another connector and a condensing connector. The condenser receiving portion 355 is an example of another inlet and a condensing inlet. The loop-type heat pipe 1 and the evaporator connector 200 are an example of a heat exchange unit. The evaporator connector 200 and the heating element 500 are an example of a heating unit. [Explanation of Symbols]

[0115] 100... Loop-type heat pipe, 101... Evaporator, 105... Condenser, 110... Evaporator body, 200... Evaporator connector, 256... Opening, 500... Heating element

Claims

1. Heating element and The heat exchanger includes an evaporator that absorbs heat from the heating element and evaporates the liquid-phase working fluid, and a heat exchanger that condenses the gas-phase working fluid discharged from the evaporator and recirculates it back into the evaporator, A connector that connects the heating element and the evaporator, A device equipped with, The connector has an insertion port into which the evaporator is inserted, and holds the evaporator inserted into the insertion port. As the evaporator is inserted into the inlet, a gripping portion is provided between the evaporator and the connector, A movable part is provided which has a pressable part that is pressed by the user, and which moves the engaging part when the pressable part is pressed, thereby allowing the evaporator to be removed from the insertion opening. Device.

2. The evaporator is formed in a flat plate shape and has a first plate surface and a second plate surface which is the plate surface opposite to the first plate surface. The connecting body has a first support surface which supports the first plate surface of the evaporator inserted into the insertion port, and a second support surface which supports the second plate surface of the evaporator. The apparatus according to claim 1.

3. The connecting body has a surface against which the tip of the evaporator, which is inserted into the insertion port, abuts. The apparatus according to claim 2.

4. The aforementioned evaporator is, An inlet for the liquid-phase working fluid to flow in and an outlet for the gas-phase working fluid to flow out are provided, and the inlet and outlet are located at the end opposite to the end of the evaporator that is inserted into the insertion port of the connector. The apparatus according to any one of claims 1 to 3.

5. The evaporator is formed in a flat plate shape, The inlet and outlet are located in the center of the evaporator in the thickness direction. The apparatus according to claim 4.

6. The evaporator is provided with a suppression structure between the flow path of the liquid-phase working fluid flowing in from the inlet and the flow path of the gas-phase working fluid flowing out from the outlet, which suppresses the gas-phase working fluid from heating the liquid-phase working fluid. The apparatus according to claim 4 or 5.

7. A working fluid tube is provided, connected to the evaporator, through which the working fluid flows. The working fluid tube comprises a liquid tube through which a liquid-phase working fluid flows into the inlet, a tracheal tube through which a gas-phase working fluid flows out from the outlet, an outer tube in which the liquid tube and the tracheal tube are arranged inside, and an insulating material provided inside the outer tube between the liquid tube and the tracheal tube. The apparatus according to any one of claims 4 to 6.

8. The aforementioned evaporator is, A housing formed in a flat plate shape, with one plate surface positioned toward the heating element, It is formed in a flat plate shape and is housed inside the housing, and has an evaporator that absorbs heat from the heating element and evaporates the liquid-phase working fluid into a gas phase while moving it by capillary force, The housing is provided with an inlet through which liquid-phase working fluid flows in and an outlet through which gas-phase working fluid flows out. The evaporator is positioned inside the housing on one side of the plate surface, rather than towards the center in the thickness direction of the housing, and on the side opposite to the inlet. The apparatus according to any one of claims 1 to 7.

9. The connector has a support surface that supports the plate surface of the evaporator inserted into the insertion opening of the connector, and a pressing mechanism that presses the evaporator against the support surface. The apparatus according to any one of claims 1 to 8.

10. The heat exchanger has a condenser that dissipates heat through a heat sink to condense the gaseous working fluid that has flowed out of the evaporator and recirculate it back to the evaporator. The apparatus has other connectors that connect the heat sink and the condenser. The other connector has another opening into which the condenser is inserted and holds the condenser inserted into the other opening. The apparatus according to any one of claims 1 to 9.

11. Heating element and An evaporator that absorbs heat from the aforementioned heating element and evaporates the liquid-phase working fluid, A condenser that condenses the gaseous working fluid discharged from the evaporator and recirculates it back to the evaporator, A heat radiator that absorbs heat from the condenser and releases heat, A condensing connector that connects the heat sink and the condenser, A device equipped with, The aforementioned condensation connector is It has a condensation inlet into which the condenser is inserted, The condenser inserted into the condensation inlet is held in place. As the evaporator is inserted into the condensation inlet, the evaporator and the condensation connector are provided with a portion that engages with each other. A movable part is provided which has a pressable part that is pressed by the user, and which moves the engaging part when the pressable part is pressed, thereby allowing the evaporator to be removed from the condensation inlet. Device.

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