PCB processing equipment, PCB processing lines, PCB production systems

Abstract

To reduce tact loss by reducing a retry operation when recognizing marks on a substrate.SOLUTION: A substrate work device 11B includes an imaging unit 33 that images a mark M provided on a substrate P, an image processing unit 55 that performs image processing on an image captured by the imaging unit 33, and a control unit 52. The control unit 52 receives a recognition success condition XS for imaging of the mark M when a substrate work device 11A arranged upstream succeeds in recognizing the mark M, from the substrate work device 11A arranged upstream, and applies the recognition success condition XS to control the imaging unit 33 to image the mark M, or receives the recognition success condition XS of the image processing of the mark M when the substrate work device 11A arranged upstream succeeds in recognizing the mark M, from the substrate work device 11A arranged upstream, and applies the recognition success condition XS therefor to control the image processing unit 55 to perform the image processing on the mark M.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a substrate working apparatus, a substrate working line, and a substrate production system. [Background Art]

[0002] A substrate working apparatus recognizes, by means of a camera, marks formed on a carried-in substrate, and acquires information of the substrate to be produced, such as position information and type information. Patent Document 1 below discloses a mounting machine (substrate working apparatus) and an electronic component mounting system (substrate production system) that recognize position feature points (marks) on a substrate with a camera to perform position recognition of the substrate.

[0003] If a mark is faint or dirt adheres to the mark, recognition of the mark may fail. If the substrate working apparatus stops due to failure of mark recognition, tact loss occurs and production efficiency decreases. Accordingly, when the substrate working apparatus fails to recognize a mark, it is conceivable to automatically change recognition conditions (an image processing threshold value and an illumination level of an illumination device directed toward the mark) and perform a retry operation for mark recognition. [Prior Art Literature] [Patent Literature]

[0004] [Patent Document 1] Japanese Patent No. 4710851 [Summary of Invention] [Problem to be Solved by Invention]

[0005] In a substrate working line including a plurality of substrate working apparatuses, one substrate is sequentially conveyed from an upstream substrate working apparatus to a downstream substrate working apparatus. A mark on a substrate that has been successfully recognized after a retry operation in an upstream substrate working apparatus is highly likely to require a retry operation also in a downstream substrate working apparatus. If a retry operation is performed for each individual substrate working apparatus, production efficiency decreases due to tact loss.

[0006] The present invention aims to reduce the number of retry operations when recognizing marks in a circuit board processing device that constitutes a circuit board processing line, thereby reducing cycle loss due to retry operations. [Means for solving the problem]

[0007] A substrate processing device that constitutes part of a substrate processing line for working on substrates transported from upstream to downstream comprises an imaging unit for imaging marks provided on the substrate, an image processing unit for performing image processing on the image captured by the imaging unit, and a control unit. The control unit receives the recognition success conditions for imaging the marks from the substrate processing device located upstream of the imaging unit when the substrate processing device located upstream of the imaging unit successfully recognizes the marks, and applies these recognition success conditions to control the imaging unit to image the marks, or receives the recognition success conditions for image processing of the marks from the substrate processing device located upstream of the imaging unit when the substrate processing device located upstream of the imaging unit successfully recognizes the marks, and applies the received recognition success conditions to control the image processing unit to perform image processing on the marks. [Effects of the Invention]

[0008] According to the present invention, cycle loss can be reduced by reducing the number of retry operations. [Brief explanation of the drawing]

[0009] [Figure 1] Circuit board assembly line configuration diagram [Figure 2] Plan view of the mounting device [Figure 3] Block diagram showing the electrical configuration of the mounting device. [Figure 4] Perspective view of the lighting device [Figure 5] Figure showing the captured image and the binarized image. [Figure 6] Diagram showing the transmission and reception of recognition success conditions between circuit board handling devices. [Figure 7] Flowchart for sending and receiving recognition processing and recognition success conditions [Figure 8] Configuration diagram of the substrate production system according to Embodiment 2 [Modes for carrying out the invention]

[0010] <Embodiment 1> 1. Overall configuration of the PCB work line 10 Figure 1 shows the configuration of the PCB work line 10. The PCB work line 10 has four identical mounting machines 11A to 11D. In the following description, unless it is necessary to distinguish between the four mounting machines 11A to 11D, they will simply be referred to as mounting machine 11. Mounting machine 11 is an example of a "PCB work apparatus".

[0011] The mounting devices 11 are connected by a conveyor belt, and the completed substrates P are transported sequentially from the upstream device (left side in Figure 1) to the downstream device (right side in Figure 1). In the following explanation, the mounting devices 11 may be referred to as "upstream mounting device 11A" and "downstream mounting device 11B," but whether it is upstream or downstream refers to the relative position of the mounting devices 11 as seen from the imaging unit 33 that images the substrates P. For example, when the imaging unit 33 of mounting device 11A images the substrates P, mounting device 11B is referred to as "downstream mounting device 11B." On the other hand, when the imaging unit 33 of mounting device 11C images the substrates P, mounting device 11B is referred to as "upstream mounting device 11B."

[0012] The mounting devices 11 are connected to each other via a wired or wireless communication network 15, enabling them to communicate with one another and to send and receive data between them.

[0013] 2. Configuration of the mounting device Figure 2 is a schematic plan view of the mounting device 11, and Figure 3 is a block diagram showing the electrical configuration of the mounting device 11. Figure 2 is a diagram of a Cartesian coordinate system in which the Z-axis direction is vertical and the X-axis and Y-axis directions are horizontal.

[0014] As shown in FIG. 3, the mounting apparatus 11 includes a control unit 50 having a control unit 52, a motor control unit 53, a storage unit 54, an image processing unit 55, an external input / output unit 56, a feeder communication unit 57, and a communication unit 65. The control unit 52 is a processor constituted by a CPU, a RAM, and the like. The control unit 52 controls the motor control unit 53, the image processing unit 55, the feeder communication unit 57, and the communication unit 65 based on programs and data stored in the storage unit 54, to cause each operation described below to be performed.

[0015] The operation unit 51 is a user interface such as a keyboard, a mouse, or the like. The control unit 52 executes control in accordance with an input from the user interface. The feeder communication unit 57 is connected to the feeders 37 and controls the feeders 37 in an integrated manner. The communication unit 65 exchanges necessary data with other mounting apparatuses 11 that constitute the substrate work line 10.

[0016] As shown in FIG. 2, the mounting apparatus 11 includes a base 40, four component supply devices 41, a conveyor 42, a head unit 43, an X beam 46, a Y beam 47, a head moving unit 44, an imaging unit 33, two component cameras 30, and the like.

[0017] The substrate P is conveyed from the upstream side (the left side in FIG. 2) by the conveyor 42 and stops at the work position 48. Marks M (M1 to M4) are formed at each of the four corners on the upper surface of the substrate P. The imaging unit 33 images the mark M and transmits an image 71 of the mark M to the control unit 50. The control unit 50 acquires detailed position information of the substrate P based on the image 71 of the mark M and the position of the imaging unit 33 at the time of imaging. Based on this position information, the head unit 43 mounts the component W at a predetermined position on the substrate P. When mounting of the component W at the work position 48 is completed, the substrate P is conveyed to the downstream side (the right side in FIG. 2). Imaging of the mark M by the imaging unit 33 and recognition of the mark M by the control unit 50 will be described later.

[0018] On the upper surface of the substrate P, a substrate ID recording unit 70 that records a substrate ID unique to each individual substrate P is provided. The substrate ID recording unit 70 may be a code such as a barcode or two-dimensional code printed on the substrate P, or may be an IC chip, a magnetic tape, or the like attached to the substrate P. In the present embodiment, the substrate ID is recorded as a two-dimensional code in the substrate ID recording unit 70. When the substrate P is carried into the mounting apparatus 11, the substrate camera 34 of the imaging unit 33 images the substrate ID recording unit 70 and reads the substrate ID.

[0019] A plurality of feeders 49 are attached to the component supply apparatus 41. Each of the feeders 49 supplies a component W to be mounted on the substrate P.

[0020] Between the two component supply apparatuses 41 aligned in the X-axis direction, the component camera 30 is attached to the base 40 with its imaging side facing upward. The component camera 30 images the component W that passes above the component camera 30 while being sucked by the mounting head 45, and transmits an image 71 to the image processing unit 55.

[0021] The head unit 43 is of a so-called inline type, and five mounting heads 45 are provided aligned in the X-axis direction. The head unit 43 is provided with Z-axis linear motors 60 that individually move these mounting heads 45 up and down, and R-axis servo motors 61 that rotate these mounting heads 45 about their axes.

[0022] The X beam 46 supports the head unit 43 so as to be reciprocally movable in the X-axis direction. The Y beam 47 supports the X beam 46 so as to be reciprocally movable in the Y-axis direction.

[0023] The head moving unit 44 includes an X-axis servo motor 58 that moves the head unit 43 in the X-axis direction relative to the X beam 46, and a Y-axis servo motor 59 that moves the X beam 46 in the Y-axis direction relative to the Y beam 47.

[0024] The mounting head 45 has a suction nozzle at its lower end. Negative pressure or positive pressure is supplied from an air supply device to the suction nozzle, enabling suction and release of the component W.

[0025] The mounting device 11 mounts the component W onto the substrate P in the following manner.

[0026] The motor control unit 53 uses the X-axis servo motor 58 and the Y-axis servo motor 59 to position the suction nozzle of the mounting head 45 facing the component W supplied by the feeder 37 from above. Next, the motor control unit 53 uses the Z-axis linear motor 60 to lower the mounting head 45, bringing the nozzle into contact with the component W.

[0027] Next, the motor control unit 53 raises the mounting head 45 that has picked up the component W. Once the mounting head 45 has finished picking up the component W, the motor control unit 53 moves the mounting head 45 above the substrate P using the X-axis servo motor 58 and the Y-axis servo motor 59, and the mounting head 45 releases the component W, thereby mounting the component W onto the substrate P.

[0028] 3. About the imaging unit The imaging unit 33 is attached to the head unit 43 and is movable in the X-axis and Y-axis directions along with the head unit 43. The imaging unit 33 is a camera unit having a camera and illumination, and includes a substrate camera 34 and an illumination device 35. The substrate camera 34 is an optical camera having an image sensor, etc., and is positioned so that its optical axis points downward. The substrate camera 34 captures the mark M formed on the substrate P from above and transmits the image 71 to the image processing unit 55.

[0029] As shown in Figure 4, a light-emitting unit 36, consisting of an LED or other light-emitting element, is provided on the side surface 35A of the lighting device 35. Light emitted horizontally from the light-emitting unit 36 ​​is reflected downward by an inclined half-mirror located on the optical axis of the substrate camera 34, illuminating the substrate P.

[0030] The light-emitting section 36 has three lights: coaxial lighting 36A, inner ring lighting 36B, and outer ring lighting 36C. The lighting device 35 can individually change the lighting levels (brightness) of these three lights 36A to 36C. The lighting levels of each light 36A to 36C are designated as coaxial lighting level A, inner ring lighting level B, and outer ring lighting level C, respectively. Each lighting level A to C can be changed in 10 steps, for example, from level 0 (off) to level 9 (maximum). In the following description, the combination of lighting levels A to C set individually for each light 36A to 36C will be referred to as lighting condition L.

[0031] By individually changing the illumination level of each light source 36A to 36C, the way light hits Mark M changes, and the appearance of Mark M in the image 71 captured by the substrate camera 34 changes. The imaging unit 33 changes the illumination condition L and individually adjusts the intensity of illumination levels A to C to capture an image 71 suitable for the recognition of Mark M, which will be described later. The imaging unit 33 transmits the captured image 71 to the image processing unit 55.

[0032] 4. Image binarization process The image processing unit 55 performs a binarization process on the received image 71. Binarization is an example of "image processing". Figure 5(a) shows the image 71 of mark M captured by the substrate camera 34. Figure 5(b) shows the binarized image 72 after the image processing unit 55 has performed the binarization process on image 71. Image 71 before binarization is a 256-level monochrome image, and each pixel constituting image 71 corresponds to one of the colors from black (pixel value 0) to white (pixel value 255).

[0033] In the binarization process, the image processing unit 55 determines whether the pixel value of each pixel constituting the image 71 is greater than or equal to a threshold T. The threshold T is any integer between 0 and 255. After the determination, the image processing unit 55 colors the pixels whose pixel value is greater than or equal to the threshold T in white, and the pixels whose value is less than the threshold T in black, thereby generating a binarized image 72 consisting only of white or black pixels. The binarized image 72 is transmitted to the control unit 52, which recognizes the mark M contained in the binarized image 72. In order for the control unit 52 to successfully recognize the mark M, the threshold T must be set appropriately so that the outline of the mark M in the binarized image 72 is clear.

[0034] 5. Recognition conditions and recognition success conditions The recognition condition X includes two parameters: illumination condition L and threshold T. Illumination condition L is the recognition condition for imaging mark M. Threshold T is the recognition condition for image processing of mark M. The storage unit 54 of the implementation device 11 stores the recognition condition X0, which includes the initial condition L0 for illumination condition L and the initial value T0 for threshold T, as the initial condition.

[0035] When the substrate P is loaded into the mounting device 11, the imaging unit 33 applies the illumination condition L0 included in the initial recognition condition X0 to image the mark M and acquire image 71. The image processing unit 55 applies the threshold T0 included in the recognition condition X0 to perform binarization processing and generates a binarized image 72 from image 71. Next, the control unit 52 performs recognition processing to recognize the mark M from the binarized image 72.

[0036] In the recognition process, if the control unit 52 successfully recognizes mark M, the recognition conditions X0 (illumination conditions L0, threshold T0) at the time of success are stored in the storage unit 54 as recognition success conditions XS. Illumination conditions L0 is an example of the recognition success conditions for imaging mark M. Threshold T0 is an example of the recognition success conditions for image processing of mark M. If the control unit 52 fails to recognize mark M, the control unit 52 changes one or both of the parameters (illumination conditions L0, threshold T0) included in the recognition conditions X0. The control unit 52 applies the changed recognition conditions X1 (e.g., illumination conditions L1, threshold T1) to the imaging unit 33 and the image processing unit 55 to generate an image of mark M and a binarized image 72, and then performs the recognition process. This is the first retry operation.

[0037] If the recognition of mark M is successful on the first retry operation, the recognition conditions X1 (illumination conditions L1, threshold T1) from the first retry are stored in the storage unit 54 as the recognition success conditions XS. In this case, illumination conditions L1 are the recognition success conditions for imaging mark M, and threshold T1 is the recognition success conditions for image processing of mark M.

[0038] If the recognition of mark M fails even after the first retry, a second retry is performed, during which parameters are changed, mark M is captured, image processing is performed, and recognition processing is carried out. After n retries, if mark M is successfully recognized, the recognition condition Xn at that time becomes the recognition success condition XS.

[0039] 6. Sending and receiving recognition success conditions Referring to Figure 6, the transmission and reception of the recognition success condition XS in the mounting devices 11A to 11D that constitute the board work line 10 will be explained. The initial condition of the recognition condition X for the mounting devices 11A to 11D is defined as recognition condition X0. In the following explanation, only the case in which one of the marks M1 to M4 on the board P is recognized will be explained, and the explanation of the other marks M will be omitted.

[0040] When the implementation device 11A fails to recognize mark M under recognition condition X0 (illumination condition L0, threshold T0), it performs a retry operation and changes the parameters of recognition condition X. In Figure 6, as a result of the retry operation, the illumination condition, which is the success condition for recognition in imaging, is changed from L0 to L1, and the threshold, which is the success condition for recognition in image processing, is changed from T0 to T1.

[0041] If recognition is successful after a retry operation, the mounting device 11A sends retry execution information 16 indicating that a retry operation was performed, along with the recognition success conditions XS (illumination condition L1, threshold T1) at the time of successful recognition, linked to the board ID 17 of the board P, to the downstream mounting device 11B. If the recognition of mark M is successful, the mounting device 11A performs the mounting operation on the board P. Note that if a retry operation is performed in any of the mounting devices 11 (11A), the retry execution information 16 is sent to all mounting devices 11 (11B~11D) downstream of the mounting device 11 (11A) that performed the retry operation.

[0042] Once the mounting process is completed in the upstream mounting device 11A, the substrate P is transported to the downstream mounting device 11B. The mounting device 11B applies the recognition success conditions XS received from the upstream mounting device 11A to the same mark M formed on the same substrate P as the one successfully recognized in the upstream mounting device 11A, and performs imaging, image processing, and recognition processing of the mark M. Whether or not it is the same substrate P is determined based on the substrate ID acquired when the substrate P is brought into each mounting device 11 and the substrate ID 17 linked to the recognition success conditions XS. Whether or not it is the same mark M may also be determined based on the shape and position (coordinates) of the mark M.

[0043] In the mounting device 11B, the recognition success condition XS of the mounting device 11A is applied to capture and process the image of mark M. If the recognition process successfully recognizes mark M, the mounting device 11B transmits the recognition success condition XS that was applied at the time of successful recognition, the retry execution information 16, and the substrate ID 17 to the downstream mounting device 11C. In the same manner as between mounting devices 11A and 11B described above, the recognition success condition XS, the retry execution information 16, and the substrate ID 17 are transmitted and received between mounting devices 11B and 11C, with one being the upstream side and the other the downstream side.

[0044] 7. Flowchart The recognition of mark M in the mounting device 11 and the transmission and reception of the recognition success condition XS will be explained with reference to the flowchart in Figure 7. The following explanation is an example of the flow in which the second mounting device 11B, which constitutes the board work line 10, recognizes mark M on the board P and transmits and receives the recognition success condition XS.

[0045] Once the mounting operation on the substrate P is completed in the upstream mounting device 11A and the substrate P is moved to the working position 48 of the downstream mounting device 11B, the mounting device 11B begins recognizing the mark M.

[0046] The control unit 52 determines whether or not it has received information (retry execution information 16) from the upstream mounting device 11A indicating that a retry operation has been performed (S10). If the retry execution information 16 has not been received (S10: NO), then the upstream mounting device 11A has not performed a retry operation and has successfully recognized mark M with the initial recognition condition X0. In this case, the control unit 52 of the downstream mounting device 11B applies the initial recognition condition X0 and causes the imaging unit 33 and the image processing unit 55 to capture and process mark M (S15), and then uses the generated binarized image 72 to recognize mark M (S40).

[0047] If the retry execution information 16 has been received (S10: YES), the upstream mounting device 11A performs a retry operation and successfully recognizes mark M with the recognition success condition XS, which has been changed from the initial recognition condition X0. In this case, the recognition success condition XS of the upstream mounting device 11A is received from the mounting device 11A (S20). The control unit 52 applies the recognition success condition XS as the recognition condition X of the mounting device 11B and causes the imaging unit 33 and the image processing unit 55 to perform imaging and image processing of mark M (S30).

[0048] Next, the control unit 52 uses the binarized image 72 generated by the image processing unit 55 to recognize the mark M (S40). If the recognition of the mark M is successful (S50: YES), the recognition condition X at that time is transmitted to the downstream mounting device 11C as the recognition success condition XS of the mounting device 11B (S60), and the recognition process is successfully completed.

[0049] If recognition of mark M fails (S50: NO), it is determined whether there are any modifiable parameters among the parameters included in recognition condition X (S70). If there are modifiable parameters (S70: YES), those parameters are changed and applied as a new recognition condition X1 (S80). Then, recognition of mark M is performed again with this recognition condition X1 (S40). The loop consisting of S40, S50, S70, and S80 is repeated until recognition is successful or there are no more modifiable parameters. This loop (S40, S50, S70, S80), which performs recognition of mark M while changing recognition condition X, corresponds to the retry operation described above.

[0050] If there are no more changeable parameters in the recognition condition X (S70:NO), the recognition process terminates with an error.

[0051] Furthermore, since there is no mounting device 11 further upstream of the mounting device 11A, which is located at the furthest upstream side, mounting device 11A does not acquire information from the upstream side, and S10 is always judged as NO. In this case, the recognition of mark M in S40 is performed using the initial recognition condition X0.

[0052] Since there is no mounting device 11 further downstream from the mounting device 11D, which is located at the furthest downstream end, the process in S60 is not performed.

[0053] 8. Explanation of Effects In this embodiment, the upstream mounting device 11A transmits the recognition success conditions XS, which have been used to successfully recognize mark M in the mounting device 11A, to the downstream mounting device 11B. The downstream mounting device 11B can apply the recognition success conditions XS received from the upstream mounting device 11A from the beginning and perform imaging and image processing of mark M, making it easier to successfully recognize mark M in subsequent recognition processing. This reduces retries and cycle loss.

[0054] In this embodiment, the recognition success condition XS is linked to the substrate ID 17 of the substrate P. The mounting device 11 identifies the substrate P by referring to the substrate ID 17 of the delivered substrate P, and applies the recognition success condition XS linked to the identified substrate P to the recognition of mark M. This allows the recognition success condition XS, which has a proven track record of successfully recognizing mark M on substrate P in the upstream mounting device 11A, to be accurately applied in the downstream mounting device 11B when recognizing the same mark M on the same substrate P.

[0055] <Embodiment 2> As shown in Figure 8, the substrate production system S of Embodiment 2 is a system that adds a database (an example of a "data management unit") 12 for managing data from the mounting device 11 to the substrate work line 10 of Embodiment 1.

[0056] Database 12 is connected to the board work line 10 via a wired or wireless communication network 15. Database 12 can send and receive data to and from mounting devices 11A to 11D.

[0057] The database 12 stores the part data and production program of the part W to be mounted, as well as the recognition success conditions XS that indicate the successful recognition of mark M by the mounting devices 11A to 11D.

[0058] In the configuration of Embodiment 2, when the upstream mounting device 11A successfully recognizes mark M, it transmits the recognition success condition XS to the database 12. The recognition success condition XS is linked to the retry execution information 16 and the board ID 17 and stored in the database 12.

[0059] The downstream mounting device 11B requests the database 12 to transmit the recognition success condition XS when recognition is successful by the upstream mounting device 11A, and receives the recognition success condition XS from the database 12. The mounting device 11B applies the received recognition success condition XS to recognize the same mark M on the same substrate P.

[0060] In this embodiment, the downstream mounting device 11B receives the recognition success condition XS from the database 12. Then, it applies the recognition success condition XS to capture and process the image of the mark M and recognize the mark M.

[0061] Since the recognition success condition XS is a condition that has been successfully recognized in the mounting device 11A, applying the recognition success condition XS to the mounting device 11B makes it highly likely that recognition will be successful. As a result, recognition will be less likely to succeed in the downstream mounting device 11B, and retry operations will be less frequent, thereby reducing cycle loss.

[0062] In this embodiment, the upstream mounting device 11A transmits the recognition success condition XS, which indicates successful recognition of mark M, to the database 12. Since a large number of recognition success condition XS data, generated for each substrate P and each mark M, are stored in a single database 12, the management of the recognition success condition XS data becomes easier.

[0063] <Other Embodiments> The present invention is not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope of the present invention.

[0064] (1) Although the mounting device 11 is given as an example of a circuit board processing apparatus, various types of devices that have the function of recognizing the mark M on the circuit board P can be applied as a circuit board processing apparatus, including printing devices, inspection devices, and dispensers, in addition to the mounting device 11. Furthermore, the circuit board processing line 10 may be composed of different types of circuit board processing apparatus.

[0065] (2) In the above embodiment, an example was given in which multiple mounting devices 11 of the same model are lined up as the board work line 10, but the configuration of the board work line 10 is not limited to this. The board work line 10 may be composed of mounting devices of different models.

[0066] (3) An example of a lighting device 35 has been given in which the lighting levels of three lights, coaxial lighting level A, inner ring lighting level B, and outer ring lighting level C, can be changed independently. However, the number of lights included in the lighting device 35 may be two or fewer, or four or more. Furthermore, the lighting levels of multiple lights do not have to be changed independently; all lighting levels may be changed in conjunction with each other.

[0067] (4) In the above embodiment, an example of a successful recognition condition for imaging was shown as the illumination condition. The successful recognition condition for imaging is not limited to the illumination condition, but may be other conditions during imaging. For example, in addition to the illumination condition, it may be the magnification of the substrate camera 34 during imaging, or the angle between the optical axis of the substrate camera 34 and the surface of the substrate P, or a combination of these. Furthermore, the successful recognition condition for image processing is not limited to the threshold value of the binarization process, but may be other conditions, or a combination of the threshold value and other conditions.

[0068] (5) In the above embodiment, the case in which the same recognition success condition XS is applied to the same substrate P is illustrated by linking the recognition success condition XS to the substrate ID 17. The recognition success condition XS does not have to be linked to the substrate ID 17. Alternatively, the recognition success condition XS may be linked to the delivery order in which the substrates were delivered to the upstream mounting device 11A.

[0069] When multiple circuit boards P are sequentially loaded into an upstream mounting device 11 and components W are mounted on multiple circuit boards P consecutively, circuit boards P that are loaded into each mounting device 11 in the same order are considered the same circuit board. For example, the circuit board P loaded nth into mounting device 11A and the circuit board P loaded nth into mounting device 11B are the same circuit board. Therefore, by linking the recognition success condition XS for each circuit board P with the loading order, the same recognition success condition XS can be applied to the same circuit board P.

[0070] (6) In the above embodiment, the database 12 was given as an example of the data management unit. In addition to the database 12, other devices that store and manage data, such as servers and external storage devices, can also be given as examples of the data management unit.

[0071] (7) In Embodiment 1 above, a substrate work line 10 is illustrated in which the upstream mounting device 11A transmits both the imaging recognition success condition (illumination condition) and the image processing recognition success condition (threshold) when the mark M is successfully recognized to the downstream mounting device 11B. Furthermore, a substrate work line 10 is illustrated in which the downstream mounting device 11B receives both the imaging recognition success condition and the image processing recognition success condition from the upstream mounting device 11A. The recognition success conditions transmitted and received may be either the imaging recognition success condition or the image processing recognition success condition, rather than both. Similarly, in the substrate production system S of Embodiment 2 above, the recognition success conditions transmitted and received between the mounting device 11 and the database 12 may be either the imaging recognition success condition or the image processing recognition success condition. [Explanation of Symbols]

[0072] 10 PCB assembly lines 11, 11A~11D Mounting equipment (an example of a circuit board handling device) 33 Imaging Unit 52 Control Unit 55 Image Processing Unit S PCB Production System M mark P board XS recognition success conditions

Claims

1. A substrate processing apparatus that constitutes part of a substrate processing line for working on substrates transported from upstream to downstream, An imaging unit for imaging a mark provided on the substrate, The image processing unit performs image processing on the image captured by the imaging unit, It comprises a control unit and, The control unit, When a substrate processing device located upstream of the imaging unit successfully recognizes the mark, the recognition success condition XS for imaging the mark is received from the upstream substrate processing device, and this recognition success condition XS is applied as recognition condition X to cause the imaging unit to image the mark. If recognition of the mark fails under recognition condition X, it is determined whether there are any changeable parameters among the parameters included in recognition condition X. If there are changeable parameters, those parameters are changed and applied as a new recognition condition X1, and the recognition of the mark is performed again under recognition condition X1. If there are no more changeable parameters, control is performed to terminate the recognition process with an error, or A substrate work device located upstream of the imaging unit receives the recognition success condition XS for image processing of the mark when the substrate work device located upstream of the imaging unit successfully recognizes the mark, applies the recognition success condition XS as recognition condition X to the image processing unit to perform image processing of the mark, and if the recognition of the mark fails with recognition condition X, it determines whether there are any changeable parameters among the parameters included in recognition condition X, changes those parameters and applies them as a new recognition condition X1, performs recognition of the mark again with recognition condition X1, and controls the recognition process to terminate with an error when there are no more changeable parameters.

2. A substrate processing apparatus that constitutes part of a substrate processing line for working on substrates transported from upstream to downstream, An imaging unit for imaging a mark provided on the substrate, The image processing unit performs image processing on the image captured by the imaging unit, It comprises a control unit and, The control unit transmits the recognition success condition XS for imaging the mark, when the mark is successfully recognized, to the substrate handling device located downstream of the imaging unit. The control unit then applies the recognition success condition XS as the recognition condition X. If the recognition of the mark fails under this recognition condition X, it determines whether there are any modifiable parameters among the parameters included in the recognition condition X. If there are modifiable parameters, it modifies those parameters and applies them as a new recognition condition X1. The recognition of the mark is then performed again under this recognition condition X1. If there are no more modifiable parameters, the control unit performs control to terminate the recognition process with an error, or... A substrate work device that, upon successful recognition of the mark, transmits the recognition success condition XS for image processing of the mark to a substrate work device located downstream of the imaging unit. The substrate work device then applies the recognition success condition XS as recognition condition X, and if recognition of the mark fails under recognition condition X, it determines whether there are any changeable parameters among the parameters included in recognition condition X. If there are changeable parameters, it changes those parameters and applies them as a new recognition condition X1. It then performs recognition of the mark again under recognition condition X1, and if there are no more changeable parameters, it controls the recognition process to terminate with an error.

3. A substrate processing device that works on substrates transported from upstream to downstream and constitutes part of a substrate processing line having a data management unit, An imaging unit for imaging a mark provided on the substrate, The image processing unit performs image processing on the image captured by the imaging unit, It comprises a control unit and, The control unit, When a substrate work apparatus located upstream of the imaging unit successfully recognizes the mark, the recognition success condition XS for imaging the mark is received from the data management unit that manages the data of the substrate work apparatus. This recognition success condition XS is then applied as recognition condition X, causing the imaging unit to image the mark. If recognition of the mark fails under recognition condition X, it is determined whether there are any changeable parameters among the parameters included in recognition condition X. If there are changeable parameters, these parameters are changed and applied as a new recognition condition X1. Recognition of the mark is then performed again under recognition condition X1. If there are no more changeable parameters, the recognition process is terminated with an error. A substrate work apparatus located upstream of the imaging unit receives the recognition success condition XS for image processing of the mark when the substrate work apparatus successfully recognizes the mark, from the data management unit which manages the data of the substrate work apparatus, and applies the recognition success condition XS as recognition condition X to the image processing unit to perform image processing of the mark. If the recognition of the mark fails with recognition condition X, the apparatus determines whether there are any changeable parameters among the parameters included in recognition condition X, and if there are changeable parameters, changes those parameters and applies them as a new recognition condition X1, performs recognition of the mark again with recognition condition X1, and controls the recognition process to terminate with an error when there are no more changeable parameters.

4. A substrate processing device that works on substrates transported from upstream to downstream and constitutes part of a substrate processing line having a data management unit, An imaging unit for imaging a mark provided on the substrate, The image processing unit performs image processing on the image captured by the imaging unit, It comprises a control unit and, The control unit, When the substrate processing device successfully recognizes the mark, it transmits the recognition success condition XS for imaging the mark to the data management unit. Simultaneously, it applies the recognition success condition XS as recognition condition X. If recognition of the mark fails under recognition condition X, it determines whether there are any modifiable parameters among those included in recognition condition X. If there are modifiable parameters, it modifies those parameters and applies them as a new recognition condition X1. It then attempts to recognize the mark again under recognition condition X1. If there are no more modifiable parameters, it performs control to terminate the recognition process with an error, or... A circuit board work apparatus transmits the recognition success condition XS for image processing of the mark to the data management unit when the circuit board work apparatus successfully recognizes the mark, and applies the recognition success condition XS as recognition condition X. If the recognition of the mark fails with recognition condition X, the apparatus determines whether there are any changeable parameters among the parameters included in recognition condition X, changes those parameters if there are, applies them as a new recognition condition X1, performs recognition of the mark again with recognition condition X1, and when there are no more changeable parameters, performs control to terminate the recognition process with an error.

5. It is a circuit board assembly line, A substrate work apparatus according to claim 2, located upstream, A substrate work apparatus according to claim 1, arranged downstream, The substrate work apparatus according to claim 2 is The recognition success condition XS is transmitted to the substrate work apparatus described in claim 1. The substrate work apparatus according to claim 1 is A circuit board work line that receives the recognition success condition XS from the circuit board work apparatus described in claim 2.

6. The circuit board production system is Including the circuit board assembly line and the data management unit, The aforementioned circuit board work line is A substrate work apparatus according to claim 4, located upstream, The substrate work apparatus described in claim 3, which is located downstream, The substrate work apparatus according to claim 4 is The recognition success condition XS is transmitted to the data management unit. The substrate work apparatus according to claim 3 is A circuit board production system that receives the aforementioned recognition success condition XS from the data management unit.

7. A substrate processing apparatus according to any one of claims 1 to 4, The aforementioned recognition success condition XS is transmitted or received as information linked to the board ID of the board for each mark in a board processing device.

8. A substrate processing apparatus according to any one of claims 1 to 4, The aforementioned recognition success condition XS is transmitted or received as information linked to the order in which the boards were brought into the board processing device for each mark, by the board processing device.

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