Coil component and method for manufacturing the same

Abstract

To reduce the overall height of a coil component.SOLUTION: A coil component 1 includes a coil part 3 and a conductor post P1 embedded in a magnetic element assembly M, a post protection film 15 provided between the conductor post P1 and the magnetic element assembly M, a cover insulating film 21 that covers a mount surface 4 of the magnetic element assembly M, and a terminal electrode E1 connected to the conductor post P1 through an opening 21a provided in the cover insulating film 21. The mount surface 4 of the magnetic element assembly M includes a concave part 4a and the terminal electrode E1 is accommodated in the concave part 4a. This makes it possible to reduce the overall height and prevent the short-circuit failure.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a coil component and a method for manufacturing the same, and particularly to a coil component having a structure in which a coil pattern and a conductor post connected to the coil pattern are embedded in a magnetic element body, and a method for manufacturing the same. [Background Art]

[0002] Patent Document 1 discloses a coil component having a structure in which a coil pattern and a conductor post connected to the coil pattern are embedded in a magnetic element body. In Patent Document 1, a conductor post is exposed on a mounting surface of the magnetic element body, and a terminal electrode is provided on the mounting surface of the magnetic element body so as to be in contact with the conductor post. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Unexamined Patent Publication No. 2020-155509 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] In the coil component described in Patent Document 1, the overall height increases by the thickness of the terminal electrode.

[0005] The present disclosure describes a technique for reducing the overall height of a coil component having a structure in which a coil pattern and a conductor post are embedded in a magnetic element body and a method for manufacturing the same. [Means for Solving the Problem]

[0006] A coil component according to one aspect of the present disclosure comprises a magnetic element having a mounting surface, a coil pattern embedded in the magnetic element, a conductor post embedded in the magnetic element and one end connected to the coil pattern, a post protective film provided between the conductor post and the magnetic element, a cover insulating film covering the mounting surface of the magnetic element, and a terminal electrode provided on the cover insulating film and connected to the other end of the conductor post through an opening provided in the cover insulating film, wherein the mounting surface of the magnetic element has a recess, and the terminal electrode is housed in the recess.

[0007] A method for manufacturing a coil component according to one aspect of the present disclosure includes the steps of: embedding a coil pattern and a conductor post having one end connected to the coil pattern in a magnetic element; exposing the other end of the conductor post on the mounting surface of the magnetic element; forming a cover insulating film on the mounting surface of the magnetic element; forming an opening in the cover insulating film so as to expose the other end of the conductor post; forming a terminal electrode on the cover insulating film so as to be connected to the other end of the conductor post through the opening; and forming a recess in the portion of the mounting surface of the magnetic element that overlaps with the terminal electrode by pressing the magnetic element via the terminal electrode. [Effects of the Invention]

[0008] Thus, according to this disclosure, a technique for reducing the overall height of a coil component having a structure in which a coil pattern and conductor posts are embedded in a magnetic element, and a method for manufacturing the same, is provided. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic perspective view illustrating the appearance of a coil component 1 according to one embodiment of the present disclosure. [Figure 2] Figure 2 is a schematic cross-sectional view of coil component 1. [Figure 3] Figure 3 is a schematic plan view illustrating the pattern shape of the conductor layer C0. [Figure 4] Figure 4 is a schematic plan view illustrating the pattern shape of the conductor layer C1. [Figure 5]Figure 5 is a schematic plan view illustrating the pattern shape of the conductor layer C2. [Figure 6] Figure 6 is a schematic plan view illustrating the pattern shape of the conductor layer C3. [Figure 7] Figure 7 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 8] Figure 8 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 9] Figure 9 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 10] Figure 10 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 11] Figure 11 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 12] Figure 12 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 13] Figure 13 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 14] Figure 14 is a process diagram illustrating the manufacturing method of coil component 1. [Figure 15] Figure 15 is a process diagram illustrating the manufacturing method of coil component 1. [Modes for carrying out the invention]

[0010] The embodiments of this disclosure will be described in detail below with reference to the attached drawings.

[0011] Figure 1 is a schematic perspective view illustrating the appearance of a coil component 1 according to one embodiment of the present disclosure.

[0012] As shown in Fig. 1, the coil component 1 according to the present embodiment is a chip-type coil component having a structure in which a coil portion 3 having a coil axis extending in the Z direction is embedded in a magnetic element body M. The magnetic element body M has a mounting surface 4 and an upper surface 5 which are orthogonal to the coil axis and constitute an XY plane. The mounting surface 4 and the upper surface 5 are located on opposite sides of each other. Terminal electrodes E1 and E2 are provided on the mounting surface 4, and during mounting, the terminal electrodes E1 and E2 are soldered to a circuit board such that the mounting surface 4 faces the circuit board. That is, the vertical direction of the coil component 1 shown in Fig. 1 differs by 180° from that during mounting.

[0013] Fig. 2 is a schematic cross-sectional view of the coil component 1 according to the present embodiment.

[0014] As shown in Fig. 2, the coil component 1 according to the present embodiment includes interlayer insulating films 10 to 14 and conductor layers C0 to C3 that are alternately stacked in the coil axis direction (Z direction). The conductor layers C0 to C3 are made of Cu or the like and constitute the coil portion 3. The magnetic element body M is composed of magnetic resin layers M1 and M2. Among these, the magnetic resin layer M1 is provided in an inner diameter region of the coil portion 3, an outer region in the radial direction of the coil portion 3, and on one side of the coil portion 3 in the coil axis direction. The magnetic resin layer M2 is provided on the other side of the coil portion 3 in the coil axis direction. The magnetic resin layers M1 and M2 are made of a composite magnetic material including a magnetic filler and a binder resin. The composite magnetic material constituting the magnetic resin layer M1 and the composite magnetic material constituting the magnetic resin layer M2 may be the same material or different materials from each other. As the magnetic filler, metallic magnetic materials such as iron (Fe) and permalloy-based materials can be used. As the binder resin, an epoxy resin can be used.

[0015] Conductive posts P1 and P2 are embedded in the magnetic resin layer M1. The conductive posts P1 and P2 are pillar-shaped conductors made of Cu or the like and extending in the Z direction. Among them, the lower surface B, which is one end of the conductive post P1, is connected to one end of a coil formed by conductive layers C0 to C3, and the lower surface B, which is one end of the conductive post P2, is connected to the other end of the coil formed by conductive layers C0 to C3. On the other hand, the upper surfaces T, which are the other ends of the conductive posts P1 and P2, are exposed from the mounting surface 4 and connected to terminal electrodes E1 and E2 respectively. The side surfaces S (surfaces along the Z direction) of the conductive posts P1 and P2 are covered with post protective films 15. Accordingly, since the post protective films 15 are interposed between the conductive posts P1, P2 and the magnetic base body M, contact between the conductive posts P1, P2 and the magnetic base body M is prevented, and insulation between the two is ensured. In addition, when the coil component 1 of the present embodiment having the conductive posts P1 and P2 is mounted on a circuit board or the like, stress is relieved by the conductive posts P1 and P2, and damage to the coil portion 3 is reduced. Therefore, the mounting reliability of the coil component 1 is also improved.

[0016] Two recesses 4a and 4b are provided on the mounting surface 4 of the magnetic base body M. The terminal electrode E1 is accommodated in the recess 4a, and the terminal electrode E2 is accommodated in the recess 4b. The upper surfaces T of the conductive posts P1 and P2 form the same plane as the mounting surface 4 located on the bottom surfaces of the recesses 4a and 4b. The width of the recesses 4a and 4b is larger than the width of the conductive posts P1 and P2. As a result, the area of the bottom surfaces of the recesses 4a and 4b is larger than the area of the upper surfaces T of the conductive posts P1 and P2, making it possible to sufficiently secure the area of the terminal electrodes E1 and E2.

[0017] The mounting surface 4 and the top surface 5 of the magnetic element M are covered with cover insulating films 21 and 22, respectively. The material of the cover insulating films 21 and 22 may be an organic insulating material or an inorganic insulating material. Of the cover insulating films 21 and 22, the cover insulating film 22 covers almost the entire surface of the top surface 5, while the cover insulating film 21 has openings 21a and 21b, respectively, at positions that overlap with the conductor posts P1 and P2. As a result, the top surfaces T (XY plane) of the conductor posts P1 and P2 are exposed through the openings 21a and 21b of the cover insulating film 21 located in the recesses 4a and 4b, respectively. Terminal electrodes E1 and E2 are provided on the cover insulating film 21 located in the recesses 4a and 4b. The top surfaces of the terminal electrodes E1 and E2 are coplanar with the surface of the cover insulating film 21 formed on the portion 4c of the mounting surface 4 located outside the recesses 4a and 4b. The terminal electrodes E1 and E2 are composed of a conductive layer 31 made of a conductive resin material containing metal powder, such as Ag, and a binder resin, and a conductive layer 32 made of metal formed on the surface of the conductive layer 31. Therefore, the conductive material constituting the conductive layer 32 has a lower resistance than the conductive material constituting the conductive layer 31.

[0018] The conductive layer 32 may be a laminated film of multiple metals, for example, a laminated film of Ni and Sn. The Ni and Sn laminated film has significantly lower resistance than conductive resin materials such as silver paste, and also has high heat resistance to solder and high wettability. On the other hand, the conductive layer 31 located in the lower layer can achieve higher adhesion to the cover insulating film 21 compared to the conductive layer 32 located in the upper layer, and its reliability is enhanced because the high flexibility of the conductive resin can mitigate thermal shock and external stress.

[0019] The terminal electrodes E1 and E2 are connected to the upper surfaces T of the conductor posts P1 and P2, respectively, through openings 21a and 21b in the cover insulating film 21. By covering the mounting surface 4 of the magnetic element M with the cover insulating film 21 in this way, contact between the terminal electrodes E1 and E2 and the magnetic element M is prevented, thereby increasing the reliability of the product. Furthermore, by covering the upper surface 5 of the magnetic element M with the cover insulating film 22, the reliability of the product is increased, and it becomes possible to provide directional marks on the upper surface 5.

[0020] Furthermore, in this embodiment, recesses 4a and 4b are formed on the mounting surface 4 of the magnetic element M, and terminal electrodes E1 and E2 are housed in these recesses 4a and 4b, respectively. This not only reduces the height of the coil component 1 in the Z direction, but also makes it less likely for short-circuit defects to occur between terminal electrodes E1 and E2.

[0021] Figures 3 to 6 are schematic plan views illustrating the pattern shapes of the conductor layers C0 to C3, respectively.

[0022] As shown in Figure 3, a coil pattern 100 is provided in the conductor layer C0. The coil pattern 100 is a pattern that makes approximately one turn, and both ends are connected to the conductor layer C1 via vias 11a and 11b provided in the interlayer insulating film 11.

[0023] As shown in Figure 4, the conductor layer C1 is provided with a coil pattern 110 and a connection pattern 111. The coil pattern 110 is a pattern that makes approximately one turn, and one end of it is connected to the other end of the coil pattern 100 of the conductor layer C0 via a via 11b provided in the interlayer insulating film 11, and the other end is connected to the conductor layer C2 via a via 12b provided in the interlayer insulating film 12. The connection pattern 111 is provided in a position that overlaps with one end of the coil pattern 100 provided in the conductor layer C0, and is connected to one end of the coil pattern 100 of the conductor layer C0 via a via 11a provided in the interlayer insulating film 11, and is also connected to the conductor layer C2 via a via 12a provided in the interlayer insulating film 12.

[0024] As shown in Figure 5, the conductor layer C2 is provided with a coil pattern 120 and a connection pattern 121. The coil pattern 120 is a pattern that makes approximately one turn, and one end of it is connected to the other end of the coil pattern 110 of the conductor layer C1 via a via 12b provided in the interlayer insulating film 12, and the other end is connected to the conductor layer C3 via a via 13b provided in the interlayer insulating film 13. The connection pattern 121 is provided in a position that overlaps with the connection pattern 111 provided in the conductor layer C1, and is connected to the connection pattern 111 of the conductor layer C1 via a via 12a provided in the interlayer insulating film 12, and is also connected to the conductor layer C3 via a via 13a provided in the interlayer insulating film 13.

[0025] As shown in Figure 6, the conductor layer C3 is provided with a coil pattern 130 and a connection pattern 131. The coil pattern 130 is a pattern that circles approximately 0.5 turns, and one end is connected to the other end of the coil pattern 120 of the conductor layer C2 via a via 13b provided in the interlayer insulating film 13, and the other end is connected to the conductor post P2 via a via 14b provided in the interlayer insulating film 14. The connection pattern 131 is provided in a position that overlaps with the connection pattern 121 provided in the conductor layer C2, and is connected to the connection pattern 121 of the conductor layer C2 via a via 13a provided in the interlayer insulating film 13, and is also connected to the conductor post P1 via a via 14a provided in the interlayer insulating film 14.

[0026] As a result, coil patterns 100, 110, 120, and 130 are connected in series between terminal electrodes E1 and E2, forming a coil of approximately 3.5 turns in total. The coil component 1 according to this embodiment is an embedded type coil component having a structure in which a coil section 3, which is made up of alternately stacked interlayer insulating films 10 to 14 and conductor layers C0 to C3, is embedded in a magnetic element M. Its structure differs from that of a laminated type coil component, in which a magnetic sheet made of ceramic or the like and a coil pattern are alternately stacked. For example, in a laminated type coil component, a magnetic sheet is interposed between adjacent coil patterns in the stacking direction, but in the coil component 1 according to this embodiment, adjacent coil patterns in the stacking direction are insulated by an interlayer insulating film, and no magnetic element M is interposed between them. It also differs in structure from a sheet coil of the type in which a coil pattern is formed on a printed circuit board.

[0027] In this embodiment, the coil patterns 100, 110, 120, 130 and connection patterns 111, 121, 131 constituting the coil section 3 are insulated from the magnetic element M by interlayer insulating films 10 to 14, the conductor posts P1 and P2 are insulated from the magnetic element M by a post protective film 15, and the terminal electrodes E1 and E2 are insulated from the magnetic element M by a cover insulating film 21. As a result, all conductor patterns are insulated from the magnetic element M, making it possible to obtain high insulation characteristics.

[0028] Here, the specific materials constituting the interlayer insulating films 10-14, the post-protective film 15, and the cover insulating films 21 and 22 are not particularly limited, and the post-protective film 15 and the cover insulating films 21 and 22 may be made of different insulating materials. This is because the post-protective film 15 is embedded in the magnetic element M and in contact with the conductor posts P1 and P2, while the cover insulating films 21 and 22 constitute the outermost layer of the coil component 1, and therefore the properties required to improve the reliability of the product are different.

[0029] Specifically, for the post-protective film 15, selecting an insulating material with a low coefficient of thermal expansion containing an inorganic filler such as silica can reduce the difference in coefficient of thermal expansion between it and the Cu material of the conductor posts P1 and P2. In contrast, for the cover insulating films 21 and 22, using a photosensitive resin material with a low Young's modulus enhances the physical protection characteristics of the magnetic element M on the mounting surface 4 and the top surface 5, and facilitates the formation of openings 21a and 21b. Therefore, for the post-protective film 15, an insulating material with a lower coefficient of thermal expansion than the cover insulating films 21 and 22 should be selected, and for the cover insulating films 21 and 22, an insulating material with a Young's modulus lower than that of the post-protective film 15 should be selected. Furthermore, adding a magnetic filler to the insulating material constituting the cover insulating films 21 and 22 can further increase the inductance.

[0030] Since the interlayer insulating films 10-14 are embedded in the magnetic element M and come into contact with the coil patterns 100, 110, 120, 130 and the connection patterns 111, 121, 131, the same insulating material as the post-protective film 15 may be used for them. Using the same insulating material for the interlayer insulating films 10-14 and the post-protective film 15 makes it possible to reduce material costs.

[0031] Next, a description will be given of the method for manufacturing the coil component 1 according to this embodiment.

[0032] Figures 7 to 15 are process diagrams illustrating the manufacturing method of the coil component 1 according to this embodiment. Although only the portion corresponding to one coil component 1 is shown in Figures 7 to 15, in reality, multiple coil components 1 are manufactured simultaneously using a substrate assembly.

[0033] First, a support substrate 40 is prepared (Figure 7), and a coil portion 3 is formed by alternately forming interlayer insulating films 10-14 and conductive layers C0-C3 on its surface. Then, vias 14a and 14b are formed in the interlayer insulating film 14, and conductive posts P1 and P2 are further formed (Figure 8). The conductive layers C0-C3 and conductive posts P1 and P2 can be formed by electrolytic plating. In addition, the conductive layers C0-C3 include sacrificial patterns 41 located in the inner diameter region and the outer region of the coil portion 3.

[0034] Next, a post protective film 15 is formed to cover the entire exposed surface of the conductor posts P1 and P2 (Figure 9). The entire exposed surface of the conductor posts P1 and P2 refers to the side surface S along the Z direction and the top surface T that constitutes the XY plane. Next, the sacrificial pattern 41 is removed by wet etching in this state (Figure 10). The conductor pattern constituting the coil portion 3 is covered with interlayer insulating films 10 to 14 and is therefore not etched. Similarly, the conductor posts P1 and P2 are covered with the post protective film 15 and are therefore not etched. As a result, a space 42 is formed in the inner diameter region and the outer region of the coil portion 3.

[0035] Next, the space 42 formed by the removal of the sacrificial pattern 41 is filled with the magnetic resin layer M1 (Figure 11). Then, the surface of the magnetic resin layer M1 is polished until the conductor posts P1 and P2 are exposed (Figure 12). This process makes the mounting surface 4 of the magnetic resin layer M1 and the upper surfaces T of the conductor posts P1 and P2 on the same plane. In addition, the flatness of the magnetic resin layer M1 on the mounting surface 4 side is improved compared to before polishing.

[0036] Next, after removing the support substrate 40, a magnetic resin layer M2 is formed on the lower side of the magnetic resin layer M1 so as to cover the interlayer insulating film 10 (Figure 13). After that, the upper surface 5 may be smoothed by polishing the surface of the magnetic resin layer M2. Next, cover insulating films 21 and 22 made of organic insulating material are formed on the mounting surface 4 and the upper surface 5 of the magnetic element M, respectively, and then openings 21a and 21b are formed in the cover insulating film 21 so as to expose a part of the upper surface T of the conductor posts P1 and P2 (Figure 14). At this time, the openings 21a and 21b are formed in positions where they overlap entirely with the upper surface T of the conductor posts P1 and P2, respectively, and do not overlap with the mounting surface 4 of the magnetic element M. Therefore, the mounting surface 4 of the magnetic element M is not exposed through the openings 21a and 21b. Also, as described above, since the flatness of the magnetic resin layer M1 on the mounting surface 4 side is improved by polishing, the thickness of the cover insulating film 21 can be thin. This makes it possible to reduce the overall thickness of the coil component 1. In contrast, the post-protective film 15 functions as a resist that protects the conductor posts P1 and P2 during the removal of the sacrificial pattern 41 shown in Figure 10, and therefore requires a certain thickness. For this reason, the thickness of the post-protective film 15 may be greater than the thickness of the cover insulating film 21.

[0037] Next, terminal electrodes E1 and E2 are formed on the cover insulating film 21 so as to be connected to conductor posts P1 and P2 via openings 21a and 21b, respectively (Figure 15). Here, the conductor layer 31 can be formed by a thick film method such as screen printing, and the conductor layer 32 can be formed by a barrel plating method or the like. As described above, since the openings 21a and 21b are provided in positions that do not overlap with the mounting surface 4 of the magnetic element M, the terminal electrodes E1 and E2 do not come into direct contact with the magnetic element M.

[0038] Next, by pressing the magnetic element M via the terminal electrodes E1 and E2, recesses 4a and 4b are formed on the mounting surface 4 of the magnetic element M in the portions that overlap with the terminal electrodes E1 and E2 (Figure 2). As a result, the upper surfaces of the terminal electrodes E1 and E2 become coplanar with the surface of the cover insulating film 21 formed on the portion 4c of the mounting surface 4 located outside the recesses 4a and 4b. If an organic insulating material is used as the material for the cover insulating film 21 covering the mounting surface 4, the cover insulating film 21 will deform flexibly in accordance with the deformation of the magnetic resin layer M1 when forming the recesses 4a and 4b, making it less likely for cracks to occur in the cover insulating film 21. Also, if the area of ​​the terminal electrodes E1 and E2 is larger than the area of ​​the upper surface T of the conductor posts P1 and P2, the formation of recesses 4a and 4b by pressing becomes easier. After hardening the magnetic element M by heat treatment, the coil component 1 according to this embodiment is completed by dicing.

[0039] Thus, in this embodiment, since the magnetic element M is pressed via the terminal electrodes E1 and E2 before the magnetic element M is completely hardened, it is possible to obtain a structure in which the terminal electrodes E1 and E2 do not protrude from the magnetic element M. However, forming the recesses 4a and 4b by pressing is not essential. After performing the steps shown in Figure 11, the recesses 4a and 4b may be formed by selectively etching the surface of the magnetic resin layer M1, exposing the conductor posts P1 and P2 on their bottom surfaces, and then the cover insulating film 21 may be formed. In this case, since no deformation of the cover insulating film 21 occurs due to pressing, it is not necessary to use a highly flexible organic insulating material as the material for the cover insulating film 21, and an inorganic insulating material can also be used.

[0040] While embodiments of the technology described herein have been explained above, it goes without saying that the technology described herein is not limited to the embodiments described above, and various modifications are possible without departing from its spirit, and these modifications are also included within the scope of the technology described herein.

[0041] For example, in the above embodiment, the coil section 3 is composed of four conductor layers C0 to C3, but the number of conductor layers included in the coil section is not particularly limited. Also, in the above embodiment, the number of turns of the coil patterns 100, 110, and 120 provided in each conductor layer C0 to C2 is approximately 1 turn, but the number of turns of the coil patterns provided in each conductor layer is not particularly limited.

[0042] The technology relating to this disclosure includes, but is not limited to, the following configuration examples.

[0043] A coil component according to one aspect of this disclosure comprises a magnetic element having a mounting surface, a coil pattern embedded in the magnetic element, a conductor post embedded in the magnetic element with one end connected to the coil pattern, a post protective film provided between the conductor post and the magnetic element, a cover insulating film covering the mounting surface of the magnetic element, and a terminal electrode provided on the cover insulating film and connected to the other end of the conductor post through an opening provided in the cover insulating film, wherein the mounting surface of the magnetic element has a recess, and the terminal electrode is housed in the recess. This makes it possible to reduce the overall height and prevent short-circuit failures.

[0044] In the above coil component, the surface of the terminal electrode may be coplanar with the surface of the cover insulating film formed on the portion of the mounting surface of the magnetic element that is located outside the recess. This allows the overall height to be further reduced because the terminal electrode does not protrude from the cover insulating film located outside the recess.

[0045] In the above coil component, the area of ​​the recess may be larger than the area of ​​the other end of the conductor post. This makes it possible to secure a sufficient area for the terminal electrode.

[0046] In the above coil component, the cover insulating film may be made of an organic insulating material. This makes it less likely for cracks to occur in the cover insulating film, even when recesses are formed by pressing.

[0047] A method for manufacturing a coil component according to one aspect of this disclosure includes the steps of: embedding a coil pattern and a conductor post having one end connected to the coil pattern in a magnetic element; exposing the other end of the conductor post on the mounting surface of the magnetic element; forming a cover insulating film on the mounting surface of the magnetic element; forming an opening in the cover insulating film so as to expose the other end of the conductor post; forming a terminal electrode on the cover insulating film so as to be connected to the other end of the conductor post through the opening; and forming a recess in the mounting surface of the magnetic element that overlaps with the terminal electrode by pressing the magnetic element via the terminal electrode. This makes it possible to manufacture a coil component that is low-profile and prevents short-circuit defects. [Explanation of Symbols]

[0048] 1. Coil component 3. Coil section 4. Implementation aspects 4a,4b recess 4c The part located outside the recess 5 Top side 10-14 interlayer insulating film 11a, 11b, 12a, 12b, 13a, 13b, 14a, 14b Via 15 Post-protective film 21,22 Cover insulating film 21a,21b opening 31,32 Conductor layer 40 Support substrate 41 Sacrifice Patterns 42 Space 100, 110, 120, 130 coil patterns 111,121,131 Connection Patterns B Underside of conductor post C0~C3 Conductor Layers E1,E2 terminal electrode M magnetic element M1,M2 magnetic resin layer P1, P2 Conductor Posts S side of conductor post Top surface of the T conductor post

Claims

1. A magnetic element having a mounting surface, The coil pattern embedded in the aforementioned magnetic element, A conductor post embedded in the magnetic element, with one end connected to the coil pattern, A post protective film is provided between the conductive post and the magnetic element, A cover insulating film covering the mounting surface of the magnetic element, The device comprises a terminal electrode provided on the cover insulating film and connected to the other end of the conductor post through an opening provided in the cover insulating film, The mounting surface of the magnetic element has a recess, The terminal electrode is a coil component housed in the recess.

2. The coil component according to claim 1, wherein the surface of the terminal electrode is coplanar with the surface of the cover insulating film formed on the portion of the mounting surface of the magnetic element located outside the recess.

3. The coil component according to claim 1, wherein the area of ​​the recess is larger than the area of ​​the other end of the conductor post.

4. The coil component according to any one of claims 1 to 3, wherein the cover insulating film is made of an organic insulating material.

5. A step of embedding a coil pattern and a conductor post having one end connected to the coil pattern with a magnetic element, A step of exposing the other end of the conductor post to the mounting surface of the magnetic element, A step of forming a cover insulating film on the mounting surface of the magnetic element, A step of forming an opening in the cover insulating film so that the other end of the conductor post is exposed, A step of forming a terminal electrode on the cover insulating film so as to be connected to the other end of the conductor post through the opening, A method for manufacturing a coil component, comprising the step of forming a recess in the portion of the mounting surface of the magnetic element that overlaps with the terminal electrode by pressing the magnetic element via the terminal electrode.

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