Light-emitting drive element packaging apparatus, manufacturing method thereof, and bonding wafer

Abstract

To provide a light-emitting driving device package apparatus capable of preventing warping or distortion caused by the difference in thermal expansion coefficient when a sapphire wafer and a silicon wafer are bonded together, a method of manufacturing the same, and a bonding wafer.SOLUTION: The present invention relates to a light-emitting driving device package apparatus, a method of manufacturing the same, and a bonding wafer. The light-emitting driving device package apparatus includes a light-emitting device made of sapphire material and including a light-emitter for outputting light, and a driving device bonded to the light-emitting device, made of silicon material, and including a driving circuit for applying a driving signal to the light-emitter to drive the light-emitter, wherein thermal deformation prevention holes are formed in at least portions of the light-emitting device or the driving device to prevent warping or distortion caused by a difference in thermal expansion coefficient between sapphire material and silicon material.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a light-emission driving element package apparatus, a method for manufacturing the same, and a bonding wafer. More particularly, the present invention relates to a light-emission driving element package apparatus, a method for manufacturing the same, and a bonding wafer that can prevent warpage and distortion caused by a difference in thermal deformation coefficient when a sapphire wafer and a silicon wafer are bonded to each other.

Background Art

[0002] When a sapphire wafer with light-emitting elements such as micro-LEDs formed on the surface thereof and a silicon wafer with driving elements such as driving ICs formed on the surface thereof are bonded by a wafer-to-wafer process, warpage, distortion and other phenomena occur because the coefficient of thermal expansion of sapphire and that of silicon are different from each other.

[0003] Such bonding instability caused by the difference in coefficient of thermal expansion during bonding occurs more frequently as the size of the wafer increases, leading to cracks and temperature transition differences. Conventionally, this makes it impossible to bond wafers of 2 inches or larger, which poses great difficulties for application to mass production due to low process yield. Even if the wafer is divided into small sizes for bonding, the number of work steps and the required time increase significantly, resulting in problems such as a substantial decrease in production volume and the impossibility of mass production.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention is intended to solve various problems including the above-mentioned problems, and an object of the present invention is to provide a light-emission driving element package apparatus, a method for manufacturing the same, and a bonding wafer that can prevent warpage and distortion caused by a difference in thermal deformation coefficient when a sapphire wafer and a silicon wafer are bonded. However, such problems are illustrative, and do not limit the scope of the present invention.

Means for Solving the Problems

[0005] A light-emitting drive element package device according to the concept of the present invention for solving the above problems includes a light-emitting part made of sapphire material and having a light-emitting part that outputs light, and a drive element part joined to the light-emitting part and made of silicon material and having a drive circuit part that applies a drive signal to the light-emitting part to drive the light-emitting part, wherein at least a portion of the light-emitting part or the drive element part may have a thermal deformation prevention hole formed in it so as to prevent warping and distortion due to the difference in thermal expansion coefficients between the sapphire material and the silicon material.

[0006] Furthermore, according to the present invention, the thermal deformation prevention hole is formed to be elongated along one side surface in the longitudinal direction so as to accommodate lateral thermal deformation forces, and may include at least a portion of the elongated hole, with rounded inner surfaces formed at both ends to prevent stress concentration at the ends.

[0007] Furthermore, according to the present invention, the thermal deformation prevention hole portion may include a first elongated hole portion formed in the middle portion of the first side surface of the light-emitting element portion, a second elongated hole portion formed in the middle portion of the second side surface of the light-emitting element portion, a third elongated hole portion formed in the middle portion of the third side surface of the light-emitting element portion, and a fourth elongated hole portion formed in the middle portion of the fourth side surface of the light-emitting element portion.

[0008] Furthermore, according to the present invention, at least one of the first, second, third, and fourth elongated holes is an inlet into which the underfill member is injected, and at least one of the first, second, third, and fourth elongated holes is an outlet into which the underfill member or internal air is discharged.

[0009] Furthermore, according to the present invention, an alignment portion may be further included, which is formed between the light-emitting portion and the driving element portion, and which interlocks with each other to align the joining position when the light-emitting portion and the driving element portion are joined.

[0010] Furthermore, according to the present invention, the alignment portion may include a first alignment projection formed at the first corner of the light-emitting portion or the driving element portion, a second alignment projection formed at the second corner of the light-emitting portion or the driving element portion, a third alignment projection formed at the third corner of the light-emitting portion or the driving element portion, and a fourth alignment projection formed at the fourth corner of the light-emitting portion or the driving element portion.

[0011] Furthermore, according to the present invention, the first alignment projection may be L-shaped or cross-shaped.

[0012] On the other hand, a method for manufacturing a light-emitting drive element package device according to the concept of the present invention for solving the above problems includes the steps of: (a) preparing a sapphire wafer made of sapphire material and having a plurality of light-emitting parts having light-emitting parts that output light; (b) preparing a silicon wafer made of silicon material and having a plurality of drive element parts having drive circuit parts that can apply a drive signal to the light-emitting parts to drive the light-emitting parts; (c) joining the sapphire wafer and the silicon wafer; and (d) cutting the joined sapphire wafer and the silicon wafer into individual package units, wherein in step (a) or step (b), at least one thermal deformation prevention hole can be formed in at least a portion of the sapphire wafer or the silicon wafer so as to prevent warping and distortion due to the difference in thermal expansion coefficients between the sapphire material and the silicon material.

[0013] Furthermore, according to the present invention, step (c) can be performed to fill the underfill member through the thermal deformation prevention hole formed in any one of the bonded wafers.

[0014] Furthermore, according to the present invention, in step (a) or step (b), alignment portions can be formed on at least a portion of the sapphire wafer or the silicon wafer, which interlock with each other to align the bonding positions when the sapphire wafer and the silicon wafer are bonded together.

[0015] On the other hand, a bonding wafer according to the concept of the present invention for solving the above problems may include: a wafer body made of sapphire material or silicon material; a plurality of element parts formed on the wafer body, each having a light-emitting part that outputs light or a drive circuit part that applies a drive signal to the light-emitting part; thermal deformation prevention holes formed between the element parts to prevent warping and distortion phenomena due to the coefficient of thermal expansion when bonding with other wafers of different materials; and alignment parts formed between the element parts to align the bonding positions when bonding with other wafers.

[0016] Furthermore, according to the present invention, the thermal deformation prevention hole portion includes at least one elongated hole formed in a shape that penetrates the wafer body, is formed to be long in the longitudinal direction to accommodate lateral thermal deformation forces, and has rounded inner surfaces at both ends to prevent stress concentration at the ends, and the alignment portion may include alignment protrusions formed in an L-shape or cross shape. [Effects of the Invention]

[0017] According to the various embodiments of the present invention described above, the thermal deformation prevention holes can be used to prevent warping, distortion, and cracking caused by differences in thermal deformation coefficients during bonding of sapphire wafers and silicon wafers. An underfill process in which an underfill member is injected through the thermal deformation prevention holes can be performed, significantly increasing the strength and durability of the product. The alignment section allows wafers to be aligned in a fixed position for bonding, increasing the wafer diameter, thereby significantly improving yield and productivity and enabling mass production. Of course, the scope of the present invention is not limited by these effects. [Brief explanation of the drawing]

[0018] [Figure 1] This is an external perspective view showing a light-emitting drive element package device according to several embodiments of the present invention. [Figure 2]It is a cross-sectional view showing the II-II cut surface of the light-emitting driving element package apparatus of Fig. 1. [Figure 3] It is an exploded perspective view of components showing the light-emitting driving element package apparatus of Fig. 1. [Figure 4] It is a perspective view showing a sapphire wafer for manufacturing the light-emitting driving element package apparatus of Fig. 1. [Figure 5] It is a perspective view showing a silicon wafer for manufacturing the light-emitting driving element package apparatus of Fig. 1. [Figure 6] It is an enlarged perspective view showing the injection process of the underfill member of the light-emitting driving element package apparatus of Fig. 1. [Figure 7] It is a cross-sectional view stepwise showing the preparation process of the sapphire wafer of the light-emitting driving element package apparatus of Fig. 4. [Figure 8] It is a cross-sectional view stepwise showing the preparation process of the silicon wafer of the light-emitting driving element package apparatus of Fig. 5. [Figure 9] It is a cross-sectional view stepwise showing the bonding process of the sapphire wafer of Fig. 4 and the silicon wafer of Fig. 5. [Figure 10] It is a flowchart showing a method for manufacturing a light-emitting driving element package apparatus according to some embodiments of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

[0019] Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0020] Embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. The following embodiments can be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to further enrich and complete the present disclosure and fully convey the concept of the present invention to those skilled in the art. In addition, in the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of description.

[0021] The terms used herein are used to describe specific embodiments and are not intended to limit the invention. As used herein, a singular form can include multiple forms unless the context explicitly indicates otherwise. Also, as used herein, “comprise” and / or “comprising” identify the presence of the shapes, figures, stages, actions, members, elements and / or groups thereof mentioned, and do not exclude the presence or addition of one or more other shapes, figures, actions, members, elements and / or groups thereof.

[0022] Hereinafter, embodiments of the present invention will be described with reference to drawings schematically illustrating ideal embodiments of the present invention. In the drawings, deformation of the illustrated shapes may be expected, for example, due to manufacturing techniques and / or tolerances. Therefore, embodiments of the concept of the present invention should not be construed as being limited to specific shapes in the region shown herein, and should include, for example, shapes that may be induced during manufacturing.

[0023] Figure 1 is an external perspective view showing a light-emitting drive element package device 100 according to several embodiments of the present invention; Figure 2 is a cross-sectional view showing the II-II section of the light-emitting drive element package device 100 of Figure 1; and Figure 3 is an exploded perspective view showing the light-emitting drive element package device 100 of Figure 1.

[0024] First, as shown in Figures 1 to 3, the light-emitting drive element package device 100 according to some embodiments of the present invention can be broadly classified into a light-emitting element section 10 and a drive element section 20.

[0025] The light-emitting element 10 may be, for example, a part that is formed in an overall rectangular plate shape, is made of sapphire material, and has a light-emitting part 11 that emits light.

[0026] The driving element section 20 is, for example, joined to the light-emitting element section 10, is formed in an overall rectangular plate shape, is made of silicon material, and may be a section having a driving circuit section 21 that applies a driving signal to the light-emitting section 11 to drive the light-emitting section 11.

[0027] Here, the light-emitting section 11 and the drive circuit section 21 may each have connection terminals 12 and 22 such as bumps, and these connection terminals 12 and 22 may be joined to each other and electrically connected.

[0028] The light-emitting element 10 may have thermal deformation prevention holes 30 formed in at least a portion of it to prevent warping and distortion caused by the difference in thermal expansion coefficients between the sapphire material and the silicon material.

[0029] However, such thermal deformation prevention holes 30 are not limited to being formed only in the light-emitting element portion 10. For example, the thermal deformation prevention holes 30 can also be formed in the drive element portion 20, and the thermal deformation prevention holes 30 can be formed in both the light-emitting element portion 10 and the drive element portion 20.

[0030] The thermal deformation prevention hole 30 is formed to be elongated along one side surface to accommodate lateral thermal deformation forces, as shown in Figure 1, for example, and includes at least a portion of the elongated hole 30a. Rounded inner surfaces 30b may be formed at both ends to prevent stress concentration at the ends.

[0031] More specifically, as shown in Figure 1, the thermal deformation prevention hole portion 30 may include a first elongated hole portion 31 formed in the middle of the first side surface of the light-emitting element portion 10, a second elongated hole portion 32 formed in the middle of the second side surface of the light-emitting element portion 10, a third elongated hole portion 33 formed in the middle of the third side surface of the light-emitting element portion 10, and a fourth elongated hole portion 34 formed in the middle of the fourth side surface of the light-emitting element portion 10, so as to prevent thermal deformation in all directions, including the front, back, left, and right.

[0032] These thermal deformation prevention holes 30 can be used not only to prevent thermal deformation but also for injecting the underfill material 50.

[0033] In other words, at least one of the first elongated hole 31, the second elongated hole 32, the third elongated hole 33, and the fourth elongated hole 34 is an injection port 30c into which the underfill member 50 is injected, and at least one of the first elongated hole 31, the second elongated hole 32, the third elongated hole 33, and the fourth elongated hole 34 may be an outlet 30d into which the underfill member or internal air is discharged.

[0034] On the other hand, some embodiments of the present invention may further include an alignment portion 40 formed between the light-emitting portion 10 and the drive portion 20, which interlocks with each other to align the joining positions when the light-emitting portion 10 and the drive portion 20 are joined.

[0035] The alignment portion 40 is formed to engage with the alignment groove H formed in the drive element portion 20, as shown in Figure 3, for example. More specifically, the alignment portion 40 may include a first alignment projection 41 formed at the first corner of the light-emitting portion 10, a second alignment projection 42 formed at the second corner of the light-emitting portion 10, a third alignment projection 43 formed at the third corner of the light-emitting portion 10, and a fourth alignment projection 44 formed at the fourth corner of the light-emitting portion 10.

[0036] The alignment groove H may include, for example, a first alignment groove H1 formed at the first corner of the drive element portion 20 so as to mesh with these alignment portions 40, a second alignment groove H2 formed at the second corner of the drive element portion 20, a third alignment groove H3 formed at the third corner of the drive element portion 20, and a fourth alignment groove H4 formed at the fourth corner of the drive element portion 20.

[0037] The alignment projections of the alignment section 40 may be L-shaped or cross-shaped projections, and each alignment groove H may also be L-shaped or cross-shaped groove so that it can interlock with the alignment section 40.

[0038] However, the shape of the alignment section 40 and the alignment groove H are not necessarily limited to those shown in the drawings, and may be formed in a wide variety of other forms and shapes.

[0039] Figure 4 is a perspective view showing a sapphire wafer W1 for manufacturing the light-emitting drive element package apparatus 100 shown in Figure 1.

[0040] As shown in Figure 4, a bonding wafer W for manufacturing a light-emitting drive element package device 100 according to some embodiments of the present invention, the sapphire wafer W1 may include a wafer body B made of sapphire material, a plurality of element parts D formed on the wafer body B and on which light-emitting parts 11 that emit light are formed, thermal deformation prevention holes 30 formed between the element parts D to prevent warping and distortion phenomena due to the coefficient of thermal expansion when bonding with other wafers of different materials, and alignment parts 40 formed between the element parts D to align the bonding positions when bonding with other wafers.

[0041] Here, the thermal deformation prevention hole portion 30 is formed in a shape that penetrates the wafer body B, is formed to be long in the longitudinal direction to accommodate lateral thermal deformation forces, and includes at least one elongated hole 30a (see Figures 1 to 3) with rounded inner surfaces 30b (see Figures 1 to 3) at both ends to prevent stress concentration at the ends, and the alignment portion 40 may include alignment protrusions T formed in an L-shape or cross shape.

[0042] Figure 5 is a perspective view showing a silicon wafer W2 for manufacturing the light-emitting drive element package apparatus 100 shown in Figure 1.

[0043] As shown in Figure 5, a bonding wafer W for manufacturing a light-emitting drive element package device 100 according to some embodiments of the present invention, the silicon wafer W2 may include a wafer body B made of silicon material, a plurality of element sections D formed on the wafer body B and on which a drive circuit section 21 for applying a drive signal to a light-emitting section 11 is formed, and an alignment section 40 formed between the element sections D so as to be able to align the bonding positions when bonding with other wafers.

[0044] Here, the alignment section 40 may be an alignment groove H formed in an L-shape or a cross shape.

[0045] Figure 6 is an enlarged perspective view showing the injection process of the underfill member 50 of the light-emitting drive element package device 100 shown in Figure 1.

[0046] As shown in Figure 6, the thermal deformation prevention hole 30 can be used not only to prevent thermal deformation but also for injecting the underfill member 50.

[0047] Therefore, one or more of the thermal deformation prevention holes 30 are injection ports 30c into which the underfill member 50 is injected, and one or more of the other can be exhaust ports 30d into which the underfill member or internal air is discharged.

[0048] Therefore, when using such thermal deformation prevention holes 30, the durability and strength of the product can be greatly improved by removing internal voids through repeated vacuuming and injection.

[0049] Figure 7 is a stepwise cross-sectional view showing the preparation process of the sapphire wafer W1 of the light-emitting drive element packaging apparatus 100 shown in Figure 4, Figure 8 is a stepwise cross-sectional view showing the preparation process of the silicon wafer W2 of the light-emitting drive element packaging apparatus 100 shown in Figure 5, and Figure 9 is a stepwise cross-sectional view showing the bonding process between the sapphire wafer W1 of Figure 4 and the silicon wafer W2 of Figure 5.

[0050] As shown in Figures 7 to 9, the manufacturing process of a light-emitting drive element package device 100 according to some embodiments of the present invention will be explained step by step. First, as shown in Figure 7, a sapphire wafer W1 can be prepared, which is made of sapphire material and has a plurality of light-emitting parts 10 formed thereon, each having a light-emitting part 11 that emits light.

[0051] For example, as shown in (a-1), thermal deformation prevention holes 30 can be formed in a sapphire wafer W1 made of sapphire material by various methods such as etching or laser drilling, as shown in (a-2).

[0052] Next, as shown in (a-3), the upper and lower surfaces are ground, and then, as shown in (a-4), a light-emitting section 11 is formed so that it can emit light, and as shown in (a-5), connection terminals 12 such as bumps or pads can be formed on the light-emitting section 11, and then, as shown in (a-6), a protruding alignment section 40 can be formed on the upper surface or a desired portion of the connection terminal 12.

[0053] On the other hand, as shown in Figure 8, a silicon wafer W2 can be prepared in which a plurality of drive element units 20 are formed, each having a drive circuit unit 21 that can apply a drive signal to the light-emitting unit 11 to drive the light-emitting unit 11.

[0054] For example, as shown in (b-1), a silicon wafer W2 made of silicon material can be formed with a drive circuit portion 21 as shown in (b-2), and then, as shown in (b-3), an insulating member 60 can be formed on the drive circuit portion 21, and then, as shown in (b-4), the insulating member 60 can be etched so that the drive circuit portion 21 is exposed.

[0055] Next, as shown in (b-5), connection terminals 22 such as bumps or pads can be formed on the exposed drive circuit portion 21, and then, as shown in (b-6), groove-shaped alignment grooves H can be formed on the upper surface or desired portion of the connection terminals 22.

[0056] Next, as shown in Figure 9, the prepared sapphire wafer W1 and silicon wafer W2 can be joined together, and the joined sapphire wafer W1 and silicon wafer W2 can be cut into individual package units along the cutting line L.

[0057] For example, as shown in (c-1), after aligning the sapphire wafer W1 and the silicon wafer W2 so that the alignment section 40 and the alignment groove H interlock with each other, the sapphire wafer W1 and the silicon wafer W2 can be joined together as shown in (c-2).

[0058] Next, as shown in (c-3), the underfill member 50 can be filled between the bonded sapphire wafer W1 and silicon wafer W2 using the thermal deformation prevention hole 30.

[0059] Next, as shown in (c-4), the underfill member 50 is cured in a high-temperature environment such as an oven, and then, as shown in (c-5), the bonded sapphire wafer W1 and silicon wafer W2 can be cut into individual package units along the cutting line L.

[0060] Figure 10 is a flowchart illustrating a method for manufacturing a light-emitting drive element package device according to several embodiments of the present invention.

[0061] As shown in Figures 1 to 10, a method for manufacturing a light-emitting drive element package device according to some embodiments of the present invention includes the steps of: (a) preparing a sapphire wafer W1 made of sapphire material and having a plurality of light-emitting parts 10 formed thereon, each having a light-emitting part 11 that outputs light; (b) preparing a silicon wafer W2 made of silicon material and having a plurality of drive element parts 20 formed thereon, each having a drive circuit part 21 that can apply a drive signal to the light-emitting parts 11 to drive the light-emitting parts 11; (c) joining the sapphire wafer W1 and the silicon wafer W2; and (d) cutting the joined sapphire wafer W1 and silicon wafer W2 into individual package units along a cutting line L. In step (a) or step (b), at least one thermal deformation prevention hole 30 can be formed in at least a portion of the sapphire wafer W1 or the silicon wafer W2 so as to prevent warping and distortion due to the difference in thermal expansion coefficients between the sapphire material and the silicon material.

[0062] (c) Step allows the underfill member 50 to be filled through the thermal deformation prevention hole 30 formed in one of the bonded wafers.

[0063] In step (a) or step (b), an alignment portion 40 can be formed on at least a portion of the sapphire wafer W1 or silicon wafer W2, which interlocks with each other to align the bonding position when the sapphire wafer W1 and silicon wafer W2 are bonded together.

[0064] Therefore, according to the present invention, by using the thermal deformation prevention holes 30, it is possible to prevent warping, distortion, and cracking caused by the difference in thermal deformation coefficients when bonding the sapphire wafer W1 and the silicon wafer W2. An underfill process in which an underfill member 50 is injected through the thermal deformation prevention holes 30 can be performed, which greatly increases the strength and durability of the product. Furthermore, by using the alignment section 40, wafers can be aligned in a fixed position before bonding, and the diameter of the wafer can be increased, which greatly improves yield and productivity and enables mass production.

[0065] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and a person with ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention must be determined by the technical idea of ​​the appended claims. [Explanation of Symbols]

[0066] 10 Light-emitting element 11 Light-emitting part 12,22 Connection terminals 20 Driving element section 21 Drive circuit section 30 Heat deformation prevention holes 30a long hole 30b Round inner surface 30c inlet 30d outlet 31 1st long hole 32 2nd long hole 33 3rd long hole part 34 4th long hole 40 Alignment section 41 First Aligned Protrusions 42 Second Aligned Projections 43 Third Aligned Projection 44 Fourth Aligned Projection H alignment groove H1 First alignment groove H2 Second alignment groove H3 Third alignment groove H4 4th alignment groove 50 Underfill material 60 Insulating material W1 Sapphire Wafer W2 silicon wafer W bonding wafer B Wafer Body D element section T alignment protrusion L Cut line 100 Light-emitting drive element package device

Claims

1. A light-emitting part made of sapphire material and having a light-emitting part that emits light, A drive element unit is bonded to the light-emitting element unit, is made of silicon material, and has a drive circuit unit that applies a drive signal to the light-emitting element unit to drive the light-emitting element unit, Includes, The light-emitting element section or the driving element section is To prevent warping and distortion caused by the difference in thermal expansion coefficients between sapphire and silicon materials, thermal deformation prevention holes are formed in at least a portion of the material. The thermal deformation prevention hole is formed to be elongated along one side so as to accommodate lateral thermal deformation forces, and includes at least a portion of the elongated hole, with rounded inner surfaces formed at both ends to prevent stress concentration at the ends. Light-emitting drive element package device.

2. The aforementioned heat deformation prevention hole portion is A first elongated hole is formed in the intermediate portion of the first side surface of the light-emitting element, A second elongated hole is formed in the middle portion of the second side surface of the light-emitting element, A third elongated hole is formed in the middle portion of the third side surface of the light-emitting element, The light-emitting drive element package device according to claim 1, further comprising a fourth elongated hole formed in the intermediate portion of the fourth side surface of the light-emitting element.

3. The light-emitting drive element package device according to claim 2, wherein at least one of the first, second, third, and fourth elongated holes is an injection port into which an underfill member is injected, and at least one of the first, second, third, and fourth elongated holes is an outlet into which an underfill member or internal air is discharged.

4. The light-emitting drive element package device according to claim 2, further comprising an alignment portion formed between the light-emitting portion and the drive element portion, which interlocks with each other to align the joining positions when the light-emitting portion and the drive element portion are joined.

5. The alignment section is, A first alignment projection formed at the first corner of the light-emitting portion or the drive element portion, A second alignment projection formed at the second corner of the light-emitting portion or the driving element portion, A third aligned projection formed at the third corner of the light-emitting portion or the driving element portion, The light-emitting drive element package device according to claim 4, further comprising a fourth alignment projection formed at the fourth corner of the light-emitting portion or the drive element portion.

6. The light-emitting drive element package device according to claim 5, wherein the first alignment projection is L-shaped or cross-shaped.

7. (a) A step of preparing a sapphire wafer made of sapphire material and having a plurality of light-emitting parts having light-emitting parts that emit light, (b) A step of preparing a silicon wafer on which a plurality of drive element sections are formed, each having a drive circuit section that can apply a drive signal to the light-emitting section to drive the light-emitting section, (c) The step of joining the sapphire wafer and the silicon wafer, (d) The bonded sapphire wafer and silicon wafer are packaged into individual packages. The step of cutting, In step (a) or step (b), At least a portion of the sapphire wafer or the silicon wafer, To prevent warping and distortion caused by the difference in thermal expansion coefficients between sapphire and silicon materials, at least one thermal deformation prevention hole is formed. The thermal deformation prevention hole is formed to be elongated along one side so as to accommodate lateral thermal deformation forces, and includes at least a portion of the elongated hole, with rounded inner surfaces formed at both ends to prevent stress concentration at the ends. A method for manufacturing a package device for light-emitting drive elements.

8. Step (c) above is, A method for manufacturing a light-emitting drive element package device according to claim 7, wherein an underfill member is filled through the thermal deformation prevention holes formed in either the bonded sapphire wafer or the silicon wafer.

9. In step (a) or step (b), At least a portion of the sapphire wafer or the silicon wafer, A method for manufacturing a light-emitting drive element package device according to claim 7, wherein an alignment portion is formed when the sapphire wafer and the silicon wafer are joined, such that they interlock and align the joining positions.

10. A set of bonding wafers for manufacturing a light-emitting drive element package device, A sapphire wafer comprising a first wafer body made of sapphire material, and a plurality of light-emitting parts formed on the first wafer body, each of which a light-emitting part is formed to emit light, A silicon wafer is bonded to the sapphire wafer, comprising: a second wafer body made of silicon material; a plurality of drive element sections formed on the second wafer body, each having a drive circuit section that applies a drive signal to the light-emitting section; Equipped with, A thermal deformation prevention hole is formed between the plurality of light-emitting elements or between the plurality of drive elements, and is formed to prevent warping and distortion due to the thermal expansion coefficient when bonding the sapphire wafer and the silicon wafer, Alignment portions are formed between the plurality of light-emitting elements and between the plurality of drive element portions, and are formed so as to align the bonding positions when bonding the sapphire wafer and the silicon wafer, Includes, The thermal deformation prevention hole is formed in a shape that penetrates the wafer body, is formed to be elongated in the longitudinal direction to accommodate lateral thermal deformation forces, and includes at least one elongated hole with rounded inner surfaces at both ends to prevent stress concentration at the ends. A set of wafers for bonding.

11. The set of bonding wafers according to claim 10, wherein the alignment portion includes alignment protrusions formed in an L-shape or cross shape.

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