Power conversion system

Abstract

This power conversion system comprises a plurality of power conversion devices (100) and at least one wiring board. Each of the plurality of power conversion devices has a cooling body (20), a core (13c), a first substrate (30), a second substrate (40), a third substrate (50), a connection member (62), a plurality of first circuit components (36), and a plurality of second circuit components (44). The cooling body has a first main surface and a second main surface opposite to the first main surface. A groove (20c) recessed toward the second main surface is formed on the first main surface. At least a part of the core is disposed in the groove. The first substrate has a metal base (31), an insulating layer (32), and a first conductor pattern (33). The insulating layer is disposed on the metal base. The first conductor pattern is disposed on the insulating layer. A slit (30a) penetrating the first substrate is formed on the first substrate.

Description

[[Technical Field]]

[0001] The present disclosure relates to a power conversion system. [[Background Art]]

[0002] For example, Japanese Unexamined Patent Publication No. 2013-172520 (Patent Document 1) describes a power conversion device. The power conversion device described in Patent Document 1 includes a metal base substrate, a semiconductor element, a transformer and a reactor, and electronic components for a control circuit. The semiconductor element, the transformer, the reactor, and the electronic components are mounted on the metal base substrate. Thereby, the heat dissipation performance of the power conversion device described in Patent Document 1 is improved. [[Prior Art Documents]] [[Patent Documents]]

[0003] [[Patent Document 1]] Japanese Unexamined Patent Publication No. 2013-172520 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0004] In the power conversion device described in Patent Document 1, since the semiconductor element, the transformer, the reactor, and the electronic components are mounted on the metal base substrate, the mounting area increases, resulting in an increase in size of the power conversion device.

[0005] The present disclosure has been made in view of the problems of the conventional technology as described above. More specifically, the present disclosure provides a power conversion system that can be reduced in size while improving heat dissipation performance. [[Means for Solving the Problem]]

[0006] The power conversion system of this disclosure comprises a plurality of power conversion devices and at least one wiring board. Each of the plurality of power conversion devices has a cooler, a core, a first substrate, a second substrate, a third substrate, a connecting member, a plurality of first circuit components, and a plurality of second circuit components. The cooler has a first main surface and a second main surface which is the opposite surface of the first main surface. A groove is formed in the first main surface that is recessed toward the second main surface. At least a portion of the core is disposed in the groove. The first substrate has a metal base, an insulating layer, and a first conductor pattern. The insulating layer is disposed on the metal base. The first conductor pattern is disposed on the insulating layer. A slit is formed in the first substrate that penetrates the first substrate. The first substrate is disposed on the cooler such that the metal base is in contact with the first main surface and the core passes through the slit. The second substrate has a base material, a second conductor pattern, and a third conductor pattern. The substrate has a third main surface and a fourth main surface which is the opposite surface to the third main surface. The second conductor pattern and the third conductor pattern are arranged on the third and fourth main surfaces, respectively. The second substrate is spaced apart from the first substrate so that the third conductor pattern is in contact with the core. The third substrate has a winding wound around the core and is positioned between the first and second substrates. A connecting member connects the first and second substrates. A plurality of first circuit components are electrically connected to the first conductor pattern. A plurality of second circuit components are electrically connected to either the second or third conductor pattern. A plurality of power converters are stacked along the direction normal to the first main surface. Each of at least one wiring board has a plurality of electrical components and a conductor pattern to which the plurality of electrical components are electrically connected and to which the plurality of power converters are connected in series or parallel. [Effects of the Invention]

[0007] According to the power conversion system disclosed herein, miniaturization is possible while improving heat dissipation. [Brief explanation of the drawing]

[0008] [Figure 1] This is the circuit diagram for the 200A power conversion system. [Figure 2] This is an exploded perspective view of the power converter 100. [Figure 3] This is a cross-sectional view of the power converter 100. [Figure 4] This is a cross-sectional view of the 200A power conversion system. [Figure 5] This is a cross-sectional view of power conversion system 200B. [Figure 6] This is a cross-sectional view of the power conversion system 200C. [Figure 7] This is a cross-sectional view of the power conversion system 200D. [Figure 8] This is a cross-sectional view of the power conversion system 200E. [Modes for carrying out the invention]

[0009] The embodiments of this disclosure will be described in detail with reference to the drawings. In the following drawings, the same or corresponding parts will be denoted by the same reference numerals, and redundant descriptions will not be repeated. The configurations described in each of the following embodiments can be combined as needed.

[0010] Embodiment 1. A power conversion system according to Embodiment 1 will be described. The power conversion system according to Embodiment 1 will be referred to as power conversion system 200A.

[0011] (Configuration of the 200A power conversion system) The configuration of the 200A power conversion system is described below.

[0012] Figure 1 is a circuit diagram of the power conversion system 200A. As shown in Figure 1, the power conversion system 200A has multiple power converters 100. In the example shown in Figure 1, the multiple power converters 100 are connected in parallel, but they may also be connected in series. Furthermore, the number of power converters 100 is not particularly limited.

[0013] The power converter 100 includes an inverter circuit unit 10, a rectifier circuit unit 11, a smoothing circuit unit 12, a transformer unit 13, and a control circuit unit 14. The inverter circuit unit 10, the rectifier circuit unit 11, and the smoothing circuit unit 12 constitute a main circuit unit of the power converter 100A. The power converter 100A constitutes, for example, a DC-DC conversion circuit (DC-DC converter).

[0014] The inverter circuit unit 10 includes a plurality of switching elements 10a and an input capacitor 10b. In the example shown in FIG. 1, the number of the switching elements 10a is four. These four switching elements 10a are referred to as a transistor 10aa, a transistor 10ab, a transistor 10ac, and a transistor 10ad, respectively.

[0015] The transistor 10aa and the transistor 10ab are connected in series. More specifically, the source of the transistor 10aa and the drain of the transistor 10ab are connected to each other. The transistor 10ac and the transistor 10ad are connected in series. More specifically, the source of the transistor 10ac and the drain of the transistor 10ad are connected to each other. The drain of the transistor 10aa and the drain of the transistor 10ac are connected to an input terminal 10c. The source of the transistor 10ab and the source of the transistor 10ad are connected to an input terminal 10d. The input capacitor 10b is connected to the input terminal 10c and the input terminal 10d.

[0016] The transistor 10aa, the transistor 10ab, the transistor 10ac, and the transistor 10ad are power semiconductor elements such as, for example, MOSFET (Metal Oxide Semiconductor Field Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), and GaN HEMT (Gallium Nitride High Electron Mobility Transistor).

[0017] The rectifier circuit unit 11 includes a plurality of rectifying elements 11a. In the example shown in FIG. 1, the number of rectifying elements 11a is four. These four rectifying elements 11a are respectively a diode 11aa, a diode 11ab, a diode 11ac and a diode 11ad. The diode 11aa and the diode 11ab are connected in series. More specifically, the anode of the diode 11aa and the cathode of the diode 11ab are connected to each other. The diode 11ac and the diode 11ad are connected in series. More specifically, the anode of the diode 11ac and the cathode of the diode 11ad are connected to each other.

[0018] The rectifying element 11a may be other than a diode. The rectifying element 11a may be, for example, a power semiconductor element such as a MOSFET, a GaN HEMT, or a thyristor.

[0019] The smoothing circuit unit 12 is connected in parallel to the rectifier circuit unit 11. The smoothing circuit unit 12 includes a smoothing reactor 12a and a smoothing capacitor 12b. The smoothing reactor 12a and the smoothing capacitor 12b are connected in series.

[0020] One end of the smoothing reactor 12a is connected to the cathode of the diode 11aa and the cathode of the diode 11ac. The other end of the smoothing reactor 12a is connected to one end of the smoothing capacitor 12b. The other end of the smoothing capacitor 12b is connected to the anode of the diode 11ab and the anode of the diode 11ad. An output terminal 12c is connected to the other end of the smoothing reactor 12a and one end of the smoothing capacitor 12b. An output terminal 12d is connected to the other end of the smoothing capacitor 12b, the anode of the diode 11ab and the anode of the diode 11ad.

[0021] The transformer section 13 is a transformer composed of winding 13a, winding 13b, and core 13c. Windings 13a and 13b are the primary and secondary windings, respectively. One end of winding 13a is connected to the source of transistor 10aa and the drain of transistor 10ab. The other end of winding 13a is connected to the source of transistor 10ac and the drain of transistor 10ad. One end of winding 13b is connected to the anode of diode 11aa and the cathode of diode 11ab. The other end of winding 13b is connected to the anode of diode 11ac and the cathode of diode 11ad. The inverter circuit section 10 and the rectifier circuit section 11 are electrically isolated from each other by the transformer that constitutes the transformer section 13.

[0022] The control circuit unit 14 includes a detection unit 14a and a control unit 14b. The detection unit 14a detects, for example, the current flowing between input terminal 10c and input terminal 10d, the voltage between input terminal 10c and input terminal 10d, the current flowing between output terminal 12c and output terminal 12d, and the voltage between output terminal 12c and output terminal 12d. The detection unit 14a also detects, for example, the temperature of the inverter circuit unit 10, the rectifier circuit unit 11, the smoothing circuit unit 12, and the circuit components that constitute them.

[0023] The control unit 14b controls the inverter circuit unit 10 based on the detection result from the detection unit 14a. More specifically, the control unit 14b switches the on / off states of transistors 10aa, 10ab, 10ac, and 10ad by outputting control signals to the gates of each of these transistors.

[0024] In the inverter circuit 10, the DC voltage applied between input terminal 10c and input terminal 10d is converted to an AC voltage by switching the on / off states of transistors 10aa, 10ab, 10ac, and 10ad. In the transformer 13, the AC voltage converted in the inverter circuit 10 is converted to an AC voltage of a desired voltage. The AC voltage obtained by the conversion in the transformer 13 is determined by the winding ratio of windings 13a and 13b. The AC voltage converted in the transformer 13 is converted back to a DC voltage in the rectifier circuit 11. The DC voltage converted in the rectifier circuit 11 is smoothed by a smoothing reactor 12a and a smoothing capacitor 12b in the smoothing circuit 12 and output from output terminals 12c and 12d.

[0025] The input terminals 10c of each of the multiple power converters 100 are connected to each other by a conductor pattern 82, and the input terminals 10d of the multiple power converters 100 are connected to each other by a conductor pattern 82. Similarly, the output terminals 12c of each of the multiple power converters 100 are connected to each other by a conductor pattern 82, and the output terminals 12d of the multiple power converters 100 are connected to each other by a conductor pattern 82. Thus, the multiple power converters 100 are connected in parallel. Electrical components 86, for example, are connected in series to the conductor pattern 82. Electrical components 86 are, for example, capacitors.

[0026] Figure 2 is an exploded perspective view of the power converter 100. Figure 3 is a cross-sectional view of the power converter 100. Note that Figure 3 shows a cross-section of the power converter 100 perpendicular to the second direction DR2. As shown in Figures 2 and 3, the power converter 100 further comprises a cooling body 20, a first substrate 30, a second substrate 40, and a third substrate 50.

[0027] The cooler body 20 has a main surface 20a and a main surface 20b. Main surface 20b is the opposite surface to main surface 20a. Viewing the power converter 100 along the direction normal to main surface 20a is called a plan view. In the plan view, the longitudinal direction of the cooler body 20 is along the first direction DR1. The direction perpendicular to the first direction DR1 in the plan view is called the second direction DR2. In the plan view, the outer shape of the cooler body 20 is rectangular, composed of sides along the first direction DR1 and sides along the second direction DR2. The direction perpendicular to the first direction DR1 and the second direction DR2 is called the third direction DR3. The third direction DR3 is along the direction normal to main surface 20a. Main surfaces 20a and 20b are the end faces of the cooler body 20 in the third direction DR3.

[0028] A groove 20c is formed in the main surface 20a. The main surface 20a is recessed toward the main surface 20b in the groove 20c. In plan view, the groove 20c is, for example, rectangular. The longitudinal direction of the groove 20c in plan view is along the second direction DR2. At least a portion of the core 13c is disposed in the groove 20c. The core 13c is divided into, for example, a first part 13ca and a second part 13cb. The first part 13ca and the second part 13cb are assembled to constitute one or more closed magnetic circuits. The first part 13ca and the second part 13cb are fixed to each other by adhesive or insulating tape. The core 13c is disposed in the groove 20c.

[0029] The first part 13ca and the second part 13cb are, for example, an E-type core and an I-type core, respectively. However, the shape of core 13c is not limited to these. Core 13c is not particularly limited as long as it is formed by appropriately combining, for example, an E-type core, a T-type core, a U-type core, a cylindrical core, etc., to form one or more loop-shaped closed magnetic circuits. Core 13c is, for example, a ferrite core such as a manganese-zinc ferrite core or a nickel-zinc ferrite core. Core 13c may also be an amorphous core or an iron dust core.

[0030] The cooler 20 is made of a material with high thermal conductivity. The constituent material of the cooler 20 is a metallic material or a resin material with high thermal conductivity. Specific examples of metallic materials that constitute the cooler 20 include copper, copper alloys, aluminum, aluminum alloys, iron, iron alloys, etc. The thermal conductivity of the constituent material of the cooler 20 is, for example, 1.0 W / (m·K) or higher. Preferably, the thermal conductivity of the constituent material of the cooler 20 is 10 W / (m·K) or higher. More preferably, the thermal conductivity of the constituent material of the cooler 20 is 100 W / (m·K) or higher.

[0031] Although not shown, the cooling body 20 may be electrically connected to other components so that it is at the same potential as the ground potential. Although not shown, a heat conductive member may be interposed between the bottom surface of the groove 20c and the core 13c (first portion 13ca). The thermal conductivity of the heat conductive member is, for example, 0.1 W / (m·K) or more, preferably 1 W / (m·K) or more, and more preferably 10 W / (m·K) or more. Suitable heat conductive members include thermal conductive grease, thermal conductive sheets, thermal conductive adhesives, etc.

[0032] Although not shown in the figures, the core 13c may be bonded to the bottom surface of the groove 20c using adhesive. The cooling body 20 may form part of the housing of the transformer unit 13, or part of the housing of the power converter 100. The cooling body 20 may be air-cooled or water-cooled on surfaces other than those facing the first part 34 and the second part 35, which will be described later.

[0033] The first substrate 30 is a metal-based substrate. In a plan view, the first substrate 30 has a rectangular shape with its longitudinal direction aligned with the first direction DR1. The first substrate 30 has a metal base 31, an insulating layer 32, and a conductor pattern 33. The metal base 31 is a plate-shaped member made of a metal material. Specific examples of the constituent material of the metal base 31 include copper, copper alloys, aluminum, aluminum alloys, iron, iron alloys, etc. The thermal conductivity of the constituent material of the metal base 31 is, for example, 1.0 W / (m·K) or more. Preferably, the thermal conductivity of the constituent material of the metal base 31 is 10 W / (m·K) or more. More preferably, the thermal conductivity of the constituent material of the metal base 31 is 100 W / (m·K) or more.

[0034] The insulating layer 32 is disposed on the metal base 31. The insulating layer 32 is formed of an electrically insulating material. Specific examples of constituent materials for the insulating layer 32 include epoxy resin, glass fiber reinforced epoxy resin, and polyimide resin. The resin material included in the constituent material of the insulating layer 32 may contain a thermal conductive filler to improve the thermal conductivity of the insulating layer 32. The thickness of the insulating layer 32 is preferably small, as long as it does not affect electrical insulation or manufacturing. The thickness of the insulating layer 32 is preferably 1 μm to 2000 μm, and preferably 1 μm to 150 μm.

[0035] The conductor pattern 33 is arranged on the insulating layer 32. The conductor pattern 33 is formed of a conductor. Specific examples of the constituent materials of the conductor pattern 33 include metal materials such as copper, copper alloys, nickel, nickel alloys, gold, gold alloys, aluminum, aluminum alloys, silver, silver alloys, tin, and tin alloys. The thickness of the conductor pattern 33 is, for example, 1 μm to 2000 μm. Input terminals 10c and 10d are provided on the conductor pattern 33 at one end in the first direction DR1, and output terminals 12c and 12d are provided on the conductor pattern 33 at the other end in the first direction DR1.

[0036] A slit 30a is formed in the first substrate 30. The slit 30a penetrates the first substrate 30 along the third direction DR3. The first substrate 30 is placed on the cooling body 20 such that the metal base 31 is in contact with the cooling body 20 (main surface 20a). With the first substrate 30 placed on the cooling body 20, the core 13c is passed through the slit 30a. The slit 30a divides the metal base 31 surrounding the slit 30a. Therefore, the metal base 31 surrounding the slit 30a does not form a winding for the core 13c.

[0037] The portion of the first substrate 30 located on one side of the first direction DR1 relative to the slit 30a (the left side in Figure 3) is sometimes referred to as the first portion 34. The portion of the first substrate 30 located on the other side of the first direction DR1 relative to the slit 30a (the right side in Figure 3) is sometimes referred to as the second portion 35. The first portion 34 and the second portion 35 may or may not be separated by the slit 30a. The metal base 31 in the first portion 34 and the metal base 31 in the second portion 35 may be in contact with the core 13c.

[0038] Multiple first circuit components 36 are electrically connected to the conductor pattern 33 to constitute the main circuit of the power converter 100. The first circuit components 36 connected to the conductor pattern 33 in the first section 34 constitute the primary side circuit of the main circuit of the power converter 100. Specifically, the first circuit components 36 connected to the conductor pattern 33 in the first section 34 are switching elements 10a and input capacitors 10b. The first circuit components 36 connected to the conductor pattern 33 in the second section 35 constitute the secondary side circuit of the main circuit of the power converter 100. Specifically, the first circuit components 36 connected to the conductor pattern 33 in the second section 35 are rectifier elements 11a, smoothing reactors 12a and smoothing capacitors 12b.

[0039] The second substrate 40 has a base material 41. The base material 41 is rectangular in shape, for example, in a plan view, with its longitudinal direction aligned with the first direction DR1. The base material 41 has a main surface 41a and a main surface 41b. The main surface 41b is the opposite surface of the main surface 41a. The main surfaces 41a and 41b are both end surfaces of the base material 41 in the third direction DR3.

[0040] The second substrate 40 further has a conductor pattern 42 and a conductor pattern 43. Conductor patterns 42 and 43 are arranged on the main surface 41a and the main surface 41b, respectively. The second substrate 40 is spaced apart from the first substrate 30 in the third direction DR3 such that the conductor pattern 43 is in contact with the core 13c (second portion 13cb). The portion of the conductor pattern 43 that is in contact with the core 13c is sometimes called the shield 43a. The shield 43a may be connected to the reference potential of the control circuit unit 14, or it may not be connected to any potential. The shield 43a may be connected to the cooler 20 by a support column 61, which will be described later.

[0041] A protective film may be provided on the surface of the conductor pattern 43 so as to cover at least a portion of the surface of the conductor pattern 43. That is, the second substrate 40 may be arranged so that the conductor pattern 43 is in thermal contact with the core 13c with the protective film in between. The protective film may be, for example, a resin resist or silk.

[0042] Each of the multiple second circuit components 44 is electrically connected to either the conductor pattern 42 or the conductor pattern 43 so as to form a control circuit section 14. The number of components in the second circuit components 44 is greater than the number of components in the first circuit components 36. On the other hand, the amount of heat generated in the second substrate 40 is less than the amount of heat generated in the first substrate 30. The second substrate 40 is, for example, a general-purpose printed circuit board. The second substrate 40 may have a wiring layer embedded in the base material 41. The second substrate 40 may be a ceramic substrate in which the base material 41 is formed of a ceramic such as aluminum oxide, aluminum nitride, or silicon carbide.

[0043] The thickness of the shield 43a (conductor pattern 43) is, for example, 10 μm or more. Preferably, the thickness of the shield 43a (conductor pattern 43) is 35 μm or more, and more preferably 105 μm or more. A plating layer may be placed on the shield 43a (conductor pattern 43). The thickness of the plating layer is preferably 10 μm or more, and more preferably 30 μm or more. The area of ​​the shield 43a in a plan view is, for example, larger than the area of ​​the core 13c (second part 13cb) in a plan view. The shield 43a may be a solid pattern.

[0044] The third substrate 50 is, for example, a printed circuit board. The printed circuit board used as the third substrate 50 may be, for example, a general-purpose printed circuit board. A through hole 51 is formed in the third substrate 50. The core 13c (first portion 13ca) is passed through the through hole 51. The second portion 13cb is assembled to the first portion 13ca after the first portion 13ca has been passed through the through hole 51. The conductor pattern on the third substrate 50 is wound around the core 13c and constitutes windings 13a and 13b.

[0045] The substrate of the third substrate 50 may be made of a ceramic such as aluminum oxide, aluminum nitride, or silicon carbide. The third substrate 50 may also be a laminated busbar. That is, the third substrate 50 may be formed by laminating an insulating film sheet and a metal conductor. The insulating film sheet may be, for example, a film made of polyethylene terephthalate (PET), polyimide (PI), or paper made using aramid (total aromatic polyamide) fibers. The insulating film sheet and the metal conductor may be bonded together using an adhesive layer or a tack layer.

[0046] The conductor pattern on the surface of the third substrate 50 facing the first substrate 30 is joined to the conductor pattern 33 in the first portion 34 and the conductor pattern 33 in the second portion 35 by a joining member 52. As a result, the windings 13a and 13b of the third substrate 50 are electrically connected to the inverter circuit section 10 of the first portion 34 and the rectifier circuit section 11 of the second portion 35, respectively. The joining member 52 can be made of, for example, brazing material, solder, conductive adhesive, etc. Although not shown, a heat conductive member may be interposed between the first substrate 30 and the third substrate 50.

[0047] The power converter 100 further comprises a plurality of support columns 61 and a plurality of connecting members 62. The support columns 61 extend along a third direction DR3. The support columns 61 are arranged on a first substrate 30. The second substrate 40 is supported on the first substrate 30 by the plurality of support columns 61, spaced apart from the first substrate 30. The connecting members 62 extend along the third direction DR3. One end of the connecting member 62 is connected to a conductor pattern 43, and the other end is connected to a conductor pattern 33. This electrically connects the first substrate 30 and the second substrate 40. More specifically, the plurality of connecting members 62 electrically connect the main circuit section and the control circuit section 14 of the power converter 100.

[0048] Figure 4 is a cross-sectional view of the power conversion system 200A. As shown in Figure 4, the multiple power converters 100 are stacked along a third direction DR3. One cooling body 20 of two adjacent power converters 100 faces, for example, the second substrate 40 of the other two adjacent power converters 100. The power conversion system 200A further has two wiring boards 70. Each of the two wiring boards 70 may be referred to as wiring board 71 and wiring board 72.

[0049] Each of the two wiring boards 70 has, for example, a base material 81, a conductor pattern 83, and a conductor pattern 84. The base material 81 has a main surface 81a and a main surface 81b. The main surfaces 81a and 81b are the end faces of the base material 81 in the thickness direction. The conductor patterns 83 and 84 are arranged on the main surface 81a and 81b, respectively. Conductor pattern 82 is sometimes referred to as the conductor pattern 82, which includes both conductor patterns 83 and 84.

[0050] The connecting member 85 electrically connects the conductor pattern 82 (for example, the conductor pattern 83) to each of the conductor patterns 33 of the multiple power converters 100 (more specifically, the input terminals 10c, 10d, output terminals 12c, and 12d). As a result, the multiple power converters 100 are connected in parallel. As described above, the multiple power converters 100 may also be connected in series.

[0051] Multiple electrical components 86 are mounted on the wiring board 70 by being connected to a conductor pattern 82 (for example, a conductor pattern 84). The multiple electrical components 86 include, for example, capacitors. These capacitors are responsible for, for example, maintaining power during a power outage and suppressing voltage fluctuations. In addition to capacitors, the multiple electrical components 86 may also include terminal blocks for connecting the overall input and output wiring, noise filters, etc. The base material 81 is formed from, for example, glass composite, glass epoxy, halogen-free materials, etc. The wiring board 70 may also be a busbar on which the multiple electrical components 86 are mounted.

[0052] (Effects of the 200A power conversion system) The following explains the effects of the 200A power conversion system.

[0053] The power conversion system 200A has multiple power conversion devices. In power conversion device 100, the heat generated in the core 13c is dissipated through the first substrate 30 and the cooler 20. In addition, in power conversion device 100, the heat generated in the core 13c is dissipated through the shield 43a (second substrate 40). Therefore, power conversion device 100 can efficiently cool the core 13c. As a result of the efficient cooling of the core 13c, it is not necessary to enlarge the core 13c for heat dissipation, making it possible to miniaturize the transformer unit 13 and, consequently, the power conversion system 200A.

[0054] Furthermore, in the power converter 100, the heat generated in the first circuit component 36 is dissipated through the first substrate 30 and the cooler 20. Similarly, the heat generated in the second substrate 40 is also dissipated through the first substrate 30 and the cooler 20. From this perspective as well, the power converter system 200A enables efficient cooling.

[0055] In the power converter 100, the second substrate 40 (shield 43a) is in contact with the core 13c, which improves heat dissipation, enhances vibration resistance by fixing the core 13c, and suppresses malfunctions of the control circuit 14 by shielding electromagnetic noise generated in the core 13c with the shield 43a. The greater the thickness of the shield 43a and the larger the pattern area of ​​the shield 43a, the better the heat dissipation of the core 13c and the better the shielding of electromagnetic noise generated in the core 13c.

[0056] In the example above, a configuration was described in which the core of the transformer unit 13 (core 13c) is placed in the groove 20c and pressed down from above by the second substrate 40. However, instead, a configuration in which the core used for the smoothing reactor 12a is placed in the groove 20c and pressed down from above by the second substrate 40 is also possible.

[0057] In the 200A power conversion system, multiple power converters 100 are connected in series or parallel using two wiring boards 70, making it possible to expand capacity and accommodate a wide range of input and output voltages. Furthermore, in the 200A power conversion system, multiple electrical components 86 are mounted on the conductor pattern 82, making it easy to add functions such as power retention during power outages, voltage fluctuation suppression, and electromagnetic noise suppression.

[0058] Embodiment 2. A power conversion system according to Embodiment 2 will be described. The power conversion system according to Embodiment 2 will be referred to as power conversion system 200B. Here, we will mainly explain the differences from power conversion system 200A, and will avoid repeating redundant explanations.

[0059] (Configuration of power conversion system 200B) The configuration of the 200B power conversion system is described below.

[0060] Figure 5 is a cross-sectional view of the power conversion system 200B. As shown in Figure 5, the power conversion system 200B has a plurality of power conversion devices 100. In this respect, the configuration of the power conversion system 200B is the same as that of the power conversion system 200A.

[0061] In the power conversion system 200B, input terminals 10c, input terminal 10d, output terminals 12c, and output terminals 12d are provided on the conductor pattern 33 at one end in the first direction DR1. The power conversion system 200B does not have two wiring boards 70, but only one wiring board 71. The conductor pattern 82 of the wiring board 71 is connected to the respective input terminals 10c, input terminal 10d, output terminals 12c, and output terminals 12d of the multiple power conversion devices 100, thereby connecting the multiple power conversion devices 100 in series or in parallel. In these respects, the configuration of the power conversion system 200B differs from the configuration of the power conversion system 200A.

[0062] (Effects of the 200B power conversion system) The power conversion system 200B allows for further miniaturization by reducing the number of wiring boards 70 from two to one.

[0063] Embodiment 3. A power conversion system according to Embodiment 3 will be described. The power conversion system according to Embodiment 3 will be referred to as power conversion system 200C. Here, we will mainly explain the differences from power conversion system 200A, and will avoid repeating redundant explanations.

[0064] (Configuration of power conversion system 200C) The configuration of the 200C power conversion system is described below.

[0065] Figure 6 is a cross-sectional view of the power conversion system 200C. As shown in Figure 6, the power conversion system 200C has a plurality of power conversion devices 100 and a plurality of wiring boards 70. In this respect, the configuration of the power conversion system 200C is the same as that of the power conversion system 200A.

[0066] The power conversion system 200C has a plurality of heat conductive members 90. Each of the plurality of heat conductive members 90 is positioned between the cooling body 20 of one of two adjacent power conversion devices 100 and the second substrate 40 of the other adjacent power conversion device 100. The thermal conductivity of the heat conductive members 90 is, for example, 0.1 W / (m·K) or more, preferably 1 W / (m·K) or more, and more preferably 10 W / (m·K) or more. As the heat conductive members 90, thermal conductive grease, thermal conductive sheets, thermal conductive adhesives, etc., can be applied. The heat conductive members 90 may be positioned in the entire space between the cooling body 20 of one of two adjacent power conversion devices 100 and the second substrate 40 of the other adjacent power conversion device 100, or they may be positioned in a part of that space.

[0067] Although not shown in the diagram, in the power conversion system 200C, the shield 43a may be thermally coupled to the portion of the conductor pattern 42 that faces the shield 43a with the substrate 41 in between, by through holes formed in the substrate 41. In these respects, the configuration of the power conversion system 200C differs from the configuration of the power conversion system 200A.

[0068] (Effects of the 200C power conversion system) The effects of the 200C power conversion system are explained below.

[0069] In the power conversion system 200C, the heat generated in the core 13c, second substrate 40, and second circuit component 44 of one power converter 100 can be efficiently transferred by the heat conductive member 90 to the cooler 20 of the adjacent power converter 100, enabling more efficient cooling. As a result, the power conversion system 200C does not require the above components to be enlarged for heat dissipation, thus enabling further miniaturization. Furthermore, if the shield 43a is thermally coupled to the portion of the conductor pattern 42 facing the shield 43a and the substrate 41 via through-holes formed in the substrate 41, it is possible to transfer the heat generated in the core 13c, second substrate 40, and second circuit component 44 of one power converter 100 to the adjacent cooler 20 of the adjacent power converter 100 even more efficiently.

[0070] Embodiment 4. A power conversion system according to Embodiment 4 will be described. The power conversion system according to Embodiment 4 will be referred to as power conversion system 200D. Here, we will mainly explain the differences from power conversion system 200A, and will avoid repeating redundant explanations.

[0071] (Configuration of power conversion system 200D) The configuration of the power conversion system 200D is described below.

[0072] Figure 7 is a cross-sectional view of the power conversion system 200D. As shown in Figure 7, the power conversion system 200D has a plurality of power conversion devices 100 and a plurality of wiring boards 70. In this respect, the configuration of the power conversion system 200D is the same as that of the power conversion system 200A.

[0073] Let one of the adjacent power converters 100 be designated as power converter 100A and power converter 100B, respectively. The cooling body 20 of power converter 100A and the cooling body 20 of power converter 100B face each other. The power converter 100 facing power converter 100A on the opposite side of power converter 100B is designated as power converter 100C. The power converter 100 facing power converter 100B on the opposite side of power converter 100A is designated as power converter 100D. The second substrate 40 of power converter 100C and the second substrate 40 of power converter 100A face each other. The second substrate 40 of power converter 100D and the second substrate 40 of power converter 100B face each other.

[0074] The power conversion system 200D has a plurality of heat conductive members 91. The thermal conductivity of the heat conductive members 91 is, for example, 0.1 W / (m·K) or more, preferably 1 W / (m·K) or more, and more preferably 10 W / (m·K) or more. As the heat conductive members 91, thermal conductive grease, thermal conductive sheets, thermal conductive adhesives, etc., can be applied. Each of the plurality of heat conductive members 91 is arranged between the second substrate 40 of power conversion device 100A and the second substrate 40 of power conversion device 100C, and between the second substrate 40 of power conversion device 100B and the second substrate 40 of power conversion device 100D. The heat conductive members 91 may be arranged in the entire space between the second substrate 40 of power conversion device 100A (power conversion device 100B) and the second substrate 40 of power conversion device 100C (power conversion device 100D), or in a part of the space.

[0075] Although not shown in the diagram, in the power conversion system 200D, the shield 43a may be thermally coupled to the portion of the conductor pattern 42 that faces the shield 43a with the substrate 41 in between, by through holes formed in the substrate 41. In these respects, the configuration of the power conversion system 200D differs from the configuration of the power conversion system 200A.

[0076] (Effects of the 200D power conversion system) The effects of the 200D power conversion system are explained below.

[0077] In the power conversion system 200D, the heat generated in the core 13c, second substrate 40, and second circuit component 44 of one power converter 100 can be efficiently transferred by the heat conductive member 91 to the cooler 20 of the adjacent power converter 100, enabling more efficient cooling. As a result, the power conversion system 200D does not require the above components to be enlarged for heat dissipation, thus enabling further miniaturization. Furthermore, if the shield 43a is thermally coupled to the portion of the conductor pattern 42 facing the shield 43a and the substrate 41 via through-holes formed in the substrate 41, it is possible to transfer the heat generated in the core 13c, second substrate 40, and second circuit component 44 of one power converter 100 to the adjacent cooler 20 of the adjacent power converter 100 even more efficiently.

[0078] Embodiment 5. A power conversion system according to Embodiment 5 will be described. The power conversion system according to Embodiment 5 will be referred to as power conversion system 200E. Here, we will mainly explain the differences from power conversion system 200A, and will avoid repeating redundant explanations.

[0079] (Configuration of Power Conversion System 200E) The configuration of the 200E power conversion system is described below.

[0080] Figure 8 is a cross-sectional view of the power conversion system 200E. As shown in Figure 8, the power conversion system 200E has a plurality of power conversion devices 100 and a plurality of wiring boards 70. In this respect, the configuration of the power conversion system 200E is the same as that of the power conversion system 200A.

[0081] Let one of the adjacent power converters 100 be designated as power converter 100A and power converter 100B, respectively. The cooling body 20 of power converter 100A and the cooling body 20 of power converter 100B face each other. The power converter 100 facing power converter 100A on the opposite side of power converter 100B is designated as power converter 100C. The power converter 100 facing power converter 100B on the opposite side of power converter 100A is designated as power converter 100D. The second substrate 40 of power converter 100C and the second substrate 40 of power converter 100A face each other. The second substrate 40 of power converter 100D and the second substrate 40 of power converter 100B face each other.

[0082] In the power conversion system 200E, one second circuit board 40 is shared between power converters 100A and 100C, and the other second circuit board 40 is shared between power converters 100B and 100D. In these respects, the configuration of the power conversion system 200E differs from the configuration of the power conversion system 200A.

[0083] (Effects of the 200E power conversion system) The effects of the 200E power conversion system are explained below.

[0084] In the power conversion system 200E, the number of second substrates 40 is reduced, enabling miniaturization and cost reduction. Although the amount of heat transferred to each second substrate 40 increases in the power conversion system 200E, the amount of heat generated in the core 13c can be reduced by increasing the thickness of the second portion 13cb and thereby increasing the magnetic path cross-sectional area in the core 13c, and the temperature rise in the second substrate 40 can be suppressed.

[0085] [Note] The various aspects of this disclosure are summarized in the appendix.

[0086] <Note 1> Multiple power converters, It comprises at least one wiring board, Each of the aforementioned multiple power conversion devices includes a cooling body, a core, a first substrate, a second substrate, a third substrate, a connecting member, a plurality of first circuit components, and a plurality of second circuit components. The cooling body has a first main surface and a second main surface which is the surface opposite to the first main surface. The first main surface has grooves formed therein that are recessed toward the second main surface. The core is positioned in the groove, at least a portion of it. The first substrate has a metal base, an insulating layer, and a first conductor pattern. The insulating layer is disposed on the metal base, The first conductor pattern is arranged on the insulating layer, The first substrate has a slit formed through it, The first substrate is arranged on the cooling body such that the metal base is in contact with the first main surface and the core passes through the slit. The aforementioned second substrate has a base material, a second conductor pattern, and a third conductor pattern. The substrate has a third main surface and a fourth main surface which is the surface opposite to the third main surface. The second conductor pattern and the third conductor pattern are arranged on the third main surface and the fourth main surface, respectively. The second substrate is positioned with a gap between it and the first substrate such that the third conductor pattern is in contact with the core. The third substrate has windings wound around the core and is positioned between the first substrate and the second substrate. The connecting member connects the first substrate and the second substrate. The plurality of first circuit components are electrically connected to the first conductor pattern. The plurality of second circuit components are electrically connected to either the second conductor pattern or the third conductor pattern. The plurality of power conversion devices are stacked along the direction normal to the first main surface, A power conversion system in which each of the at least one wiring boards has a plurality of electrical components and a conductor pattern to which the plurality of electrical components are electrically connected and the plurality of power conversion devices are connected in series or in parallel.

[0087] <Note 2> The aforementioned at least one wiring board is two wiring boards, Each of the aforementioned power converters has an input terminal and an output terminal at one end and the other end in the longitudinal direction, The conductor pattern of one of the two wiring boards is electrically connected to the input terminal of each of the plurality of power converters. The power conversion system according to Appendix 1, wherein the conductor pattern of the other of the two wiring boards is electrically connected to the output terminals of each of the plurality of power conversion devices.

[0088] <Note 3> The aforementioned at least one wiring board is one wiring board, Each of the aforementioned power converters has an input terminal and an output terminal at one end in the longitudinal direction. The power conversion system according to Appendix 1, wherein the conductor pattern of the one wiring board is electrically connected to the input terminal and the output terminal.

[0089] <Note 4> Further equipped with a heat conductive member, The power conversion system according to Appendix 2 or Appendix 3, wherein one of two adjacent cooling bodies among the plurality of power conversion devices faces the other of the two adjacent power conversion devices, with the heat conductive member in between.

[0090] <Note 5> Further equipped with a heat conductive member, The power conversion system according to Appendix 2 or Appendix 3, wherein one of two adjacent second substrates among the plurality of power conversion devices faces the other of two adjacent second substrates among the plurality of power conversion devices, with the heat conductive member interposed between them.

[0091] <Note 6> The aforementioned plurality of power converters include a first power converter, a second power converter, a third power converter, and a fourth power converter. The cooling body of the first power converter is facing the cooling body of the second power converter, The third power converter shares the second circuit board with the first power converter and is positioned opposite the first power converter on the side opposite to the second power converter. The power conversion system according to any one of Appendix 2, Appendix 3, and Appendix 5, wherein the fourth power converter shares the second circuit board with the second power converter and is positioned opposite the second power converter on the opposite side from the first power converter.

[0092] <Note 7> The aforementioned plurality of first circuit components constitute the main circuit section of the power converter. The power conversion system according to any one of the appendices 1 to 6, wherein the plurality of second circuit components constitute a control circuit that performs control over the main circuit.

[0093] <Note 8> The power conversion system according to any one of the appendices 1 to 7, wherein the third conductor pattern is in contact with the core via a protective film provided on the third conductor pattern.

[0094] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this application is indicated by the claims and not by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of symbols]

[0095] 100 Power converter, 10 Inverter circuit section, 10a Switching element, 10aa, 10ab, 10ad Transistor, 10b Input capacitor, 10c, 10d Input terminal, 11 Rectifier circuit section, 11a Rectifier element, 11aa, 11ab, 11ad Diode, 12 Smoothing circuit section, 12a Smoothing reactor, 12b Smoothing capacitor, 12c, 12d Output terminal, 13 Transformer section, 13a, 13b Winding, 13c Core, 13ca, 34 First part, 13cb, 35 Second part, 14 Control circuit section, 14a Detection section, 14b Control unit, 20 Cooling body, 20a, 20b Main surface, 20c Groove, 30 First substrate, 30a 31 Slit, 32 Metal base, 32 Insulating layer, 33 Conductor pattern, 36 First circuit component, 40 Second substrate, 41 Base material, 41a, 41b Main surface, 42, 43 Conductor pattern, 43a Shield, 44 Second circuit component, 50 Third substrate, 51 Through hole, 52 Joining member, 61 Support column, 62 Connecting member, 70, 71, 72 Wiring board, 81 Base material, 81a, 81b Main surface, 82, 83, 84 Conductor pattern, 85 Connecting member, 86 Electrical component, 90 Thermal conductive member, 91 Thermal conductive member, 100A, 100B, 100C, 100D Power converter, 200A, 200B, 200C, 200D, 200E Power conversion system, DR1 First direction, DR2 Second direction, DR3 Third direction.

Claims

1. Multiple power converters, It comprises at least one wiring board, Each of the aforementioned plurality of power conversion devices includes a cooling body, a core, a first substrate, a second substrate, a third substrate, a connecting member, a plurality of first circuit components, and a plurality of second circuit components. The cooling body has a first main surface and a second main surface which is the surface opposite to the first main surface. The first main surface has grooves formed therein that are recessed toward the second main surface. The core is positioned in the groove, at least a portion of it. The first substrate has a metal base, an insulating layer, and a first conductor pattern. The first substrate has a slit formed through it, The first substrate is arranged on the cooling body such that the metal base is in contact with the first main surface and the core passes through the slit. The second substrate comprises a base material, a second conductor pattern, and a third conductor pattern. The third substrate has windings wound around the core and is positioned between the first substrate and the second substrate. The connecting member connects the first substrate and the second substrate. The plurality of first circuit components are electrically connected to the first conductor pattern. The plurality of second circuit components are electrically connected to either the second conductor pattern or the third conductor pattern. The plurality of power conversion devices are stacked along the direction normal to the first main surface, A power conversion system in which each of the at least one wiring boards has a plurality of electrical components and a conductor pattern to which the plurality of electrical components are electrically connected and the plurality of power conversion devices are connected in series or in parallel.

2. The insulating layer is disposed on the metal base, The power conversion system according to claim 1, wherein the first conductor pattern is arranged on the insulating layer.

3. The substrate has a third main surface and a fourth main surface which is the surface opposite to the third main surface, The power conversion system according to claim 1, wherein the second conductor pattern and the third conductor pattern are arranged on the third main surface and the fourth main surface, respectively.

4. The power conversion system according to claim 1, wherein the second substrate is arranged at a distance from the first substrate such that the third conductor pattern is in contact with the core.

5. The aforementioned at least one wiring board is two wiring boards, Each of the aforementioned power converters has an input terminal and an output terminal at one end and the other end in the longitudinal direction, The conductor pattern of one of the two wiring boards is electrically connected to the input terminal of each of the plurality of power converters. The power conversion system according to claim 1, wherein the conductor pattern of the other of the two wiring boards is electrically connected to the output terminals of each of the plurality of power conversion devices.

6. The aforementioned at least one wiring board is one wiring board, Each of the aforementioned power converters has an input terminal and an output terminal at one end in the longitudinal direction. The power conversion system according to claim 1, wherein the conductor pattern of the one wiring board is electrically connected to the input terminal and the output terminal.

7. Further equipped with a heat conductive member, The power conversion system according to claim 5 or claim 6, wherein one of two adjacent cooling bodies among the plurality of power conversion devices faces the other of the two adjacent power conversion devices, with the heat conductive member in between.

8. Further equipped with a heat conductive member, The power conversion system according to claim 5 or claim 6, wherein one of two adjacent second substrates among the plurality of power conversion devices faces the other of two adjacent second substrates among the plurality of power conversion devices, with the heat conductive member interposed between them.

9. The aforementioned plurality of power converters include a first power converter, a second power converter, a third power converter, and a fourth power converter. The cooling body of the first power converter is facing the cooling body of the second power converter, The third power converter shares the second circuit board with the first power converter and is positioned opposite the first power converter on the side opposite to the second power converter. The power conversion system according to claim 5 or 6, wherein the fourth power converter shares the second circuit board with the second power converter and is positioned opposite the second power converter on the side opposite to the first power converter.

10. The aforementioned plurality of first circuit components constitute the main circuit section of the power converter. The power conversion system according to claim 5 or 6, wherein the plurality of second circuit components constitute a control circuit that performs control over the main circuit.

11. The power conversion system according to claim 5 or 6, wherein the third conductor pattern is in contact with the core via a protective film provided on the third conductor pattern.

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