Semiconductor module

Abstract

To provide a semiconductor module that is easy to mount on a substrate.SOLUTION: A semiconductor module includes a semiconductor element, a case that houses the semiconductor element, and a plurality of control terminal units. The control terminal units each include at least one control terminal electrically connected to the semiconductor element, and a guide block constituted of a separate component from the case and fixed integrally to the at least one control terminal. The at least one control terminal each includes a terminal pin part protruding from an outer wall surface of the case. The guide block includes a guide pin part protruding from the outer wall surface of the case in the same direction as a direction in which the terminal pin part protrudes. The guide blocks of the control terminal units are constituted of separate components.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a semiconductor module. Background Art

[0002] A semiconductor module, typified by a power semiconductor module, generally includes: a semiconductor element; a laminated plate including a wiring board on which the semiconductor element is mounted; a case that accommodates the semiconductor element; and a plurality of control terminals electrically connected to the semiconductor element. For example, as disclosed in Patent Document 1, the case is provided with a plurality of terminal holes penetrating the case. Each control terminal is inserted into any one of the plurality of terminal holes and has a portion protruding from the outer wall surface of the case.

[0003] In Patent Document 1, a guide pin protruding along the protruding portion is provided on the case. The guide pin is used for positioning with respect to a board on which the semiconductor module is mounted. Prior Art Documents Patent Documents

[0004] Patent Document 1 International Publication No. 2016 / 163237 Summary of the Invention Problems to be Solved by the Invention

[0005] In Patent Document 1, while the control terminal is fixed to a base, the guide pin is fixed to the case. Therefore, assembly tolerances generated when these components are fixed affect the mutual positional tolerance between the control terminal and the guide pin. For this reason, in the semiconductor module described in Patent Document 1, it is difficult to improve the mutual positional accuracy of the control terminal and the guide pin, which may make it difficult to mount the semiconductor module on a board.

[0006] In consideration of the above circumstances, an object of one aspect of the present disclosure is to provide a semiconductor module that can be easily mounted on a board. [Means for solving the problem]

[0007] To solve the above problems, a semiconductor module according to a preferred embodiment of the present disclosure comprises a plurality of control terminal units, each having a semiconductor element, a case housing the semiconductor element, at least one control terminal electrically connected to the semiconductor element, and a guide block made of a separate component from the case and integrally fixed to the at least one control terminal, wherein each of the at least one control terminal has a terminal pin portion protruding from the outer wall surface of the case, the guide block has a guide pin portion protruding from the outer wall surface of the case in the same direction as the terminal pin portion, and the guide blocks of the plurality of control terminal units are made of separate components from each other. [Brief explanation of the drawing]

[0008] [Figure 1] This is a plan view of a semiconductor module according to the first embodiment. [Figure 2] This is a cross-sectional view along line AA in Figure 1. [Figure 3] This is a circuit diagram of a semiconductor module. [Figure 4] This is a plan view of a semiconductor module with its case removed. [Figure 5] This is a side view of the control terminal. [Figure 6] This is a perspective view of the guide block. [Figure 7] This is a diagram illustrating the mating of the control terminals and guide block. [Figure 8] This is a partially enlarged cross-sectional view of a semiconductor module according to the first embodiment. [Figure 9] This is a cross-sectional view along line BB in Figure 8. [Figure 10] This is a partially enlarged cross-sectional view of a semiconductor module according to the second embodiment. [Figure 11] This is a cross-sectional view along line BB in Figure 10. [Figure 12] This is a cross-sectional view showing an example of a semiconductor module application. [Figure 13] This is a plan view illustrating the arrangement of a semiconductor module, multiple busbars, a substrate, and a heatsink. [Modes for carrying out the invention]

[0009] Preferred embodiments of the present disclosure will be described below with reference to the attached drawings. Note that the dimensions and scale of parts in the drawings may differ from actual dimensions as appropriate, and some parts are shown schematically for ease of understanding. Furthermore, the scope of the present disclosure is not limited to these embodiments unless otherwise stated in the following description.

[0010] 1. First Embodiment 1-1. Overall configuration of the semiconductor module Figure 1 is a plan view of the semiconductor module 10 according to the first embodiment. Figure 2 is a cross-sectional view taken along line AA in Figure 1. Figure 3 is a circuit diagram of the semiconductor module 10. The semiconductor module 10 is a power module such as an IGBT (Insulated Gate Bipolar Transistor) module. The semiconductor module 10 is used for power control in devices such as inverters or rectifiers mounted on equipment such as railway vehicles, automobiles, or household electrical appliances.

[0011] As shown in Figures 1 and 2, the semiconductor module 10 comprises a plurality of semiconductor elements 30, a wiring board 20, a base 40, a case 50, a nut case 60, main terminals 70_1, 70_2, 70_3, control terminals 80_1, 80_2, 80_3, 80_4, and two guide blocks 90.

[0012] Here, the wiring substrate 20 and the base 40 together constitute the laminated plate 11. The laminated plate 11 is a plate-shaped laminate including at least the wiring substrate 20. In the present embodiment, the laminated plate 11 includes the base 40 in addition to the wiring substrate 20. Further, the control terminals 80_1 and 80_2, together with one of the two guide blocks 90, constitute the control terminal unit 12. Similarly, the control terminals 80_3 and 80_4, together with the other of the two guide blocks 90, constitute the control terminal unit 12. The control terminal unit 12 is a structure in which the control terminals 80_1, 80_2 or the control terminals 80_3, 80_4 and the guide block 90 are integrated.

[0013] In the following description, each of the main terminals 70_1, 70_2, and 70_3 may be referred to as the main terminal 70 in some cases. Each of the control terminals 80_1, 80_2, 80_3, and 80_4 may be referred to as the control terminal 80 in some cases.

[0014] Hereinafter, first, an outline of each part of the semiconductor module 10 will be sequentially described with reference to FIG. 1 to FIG. 3. For convenience, the following description appropriately uses the X-axis, Y-axis, and Z-axis that are orthogonal to each other. The Z-axis is an axis parallel to the thickness direction of the semiconductor module 10. In the following description, one direction along the X-axis is defined as the X1 direction, and the direction opposite to the X1 direction is defined as the X2 direction. One direction along the Y-axis is defined as the Y1 direction, and the direction opposite to the Y1 direction is defined as the Y2 direction. One direction along the Z-axis is defined as the Z1 direction, and the direction opposite to the Z1 direction is defined as the Z2 direction. The relationship between these directions and the vertical direction is not particularly limited and may be arbitrary. Further, in the following description, viewing in a direction along the Z-axis may be referred to as "plan view" in some cases.

[0015] The wiring substrate 20 shown in FIG. 2 is a substrate housed in a case 50, on which a plurality of semiconductor elements 30 are mounted, and forms a circuit together with the plurality of semiconductor elements 30. For example, the wiring substrate 20 is a substrate such as a DCB (Direct Copper Bonding) substrate or a DBA (Direct Bonded Aluminum) substrate.

[0016] Although not shown in the figures, the wiring substrate 20 includes an insulating substrate and two conductor layers respectively provided on both surfaces of the insulating substrate. The insulating substrate is made of, for example, ceramics such as aluminum nitride, aluminum oxide or silicon nitride. Each of the two conductor layers is made of, for example, a metal such as copper or aluminum. One of the two conductor layers is a conductor pattern that forms a circuit together with the plurality of semiconductor elements 30. The plurality of semiconductor elements 30 are bonded to the one conductor layer by solder or the like. Here, although not shown in the figures, wiring such as a bonding wire is appropriately connected to the one conductor layer. Further, the other of the two conductor layers is bonded to the base 40 by solder or the like.

[0017] Note that the other conductor layer may be bonded to the base 40 by a method other than soldering. Further, the other conductor layer may be configured to function as a heat dissipation substrate. In this case, the base 40 may be omitted. In addition, although the example shown in FIG. 1 has two wiring substrates 20 stacked on the base 40, the number is not limited to the example shown in FIG. 1, and may be one, or three or more.

[0018] In the example shown in FIG. 2, the thickness direction of the wiring substrate 20 is a direction along the Z-axis. Each of the plurality of semiconductor elements 30 is bonded to the surface of the wiring substrate 20 facing in the Z1 direction by a conductive bonding material such as solder. On the other hand, the base 40 is bonded to the surface of the wiring substrate 20 facing in the Z2 direction by a conductive bonding material such as solder.

[0019] At least one element among the plurality of semiconductor elements 30 mounted on the wiring substrate 20 is a power semiconductor chip such as an IGBT. Here, in addition to the power semiconductor chip as the semiconductor element 30, a control chip for controlling the operation of the power semiconductor chip may be mounted on the wiring substrate 20, or an element such as an FWD (Free Wheeling Diode) for commutating a load current may be mounted thereon.

[0020] Specifically, the multiple semiconductor elements 30 mounted on the wiring board 20 include, for example, two IGBT semiconductor elements 30_1 and two FWD semiconductor elements 30_2, as shown in Figure 3.

[0021] In the example shown in Figure 3, the two semiconductor elements 30_2 correspond to the two semiconductor elements 30_1. The cathode of semiconductor element 30_2 is electrically connected to the collector of the corresponding semiconductor element 30_1, while the anode of semiconductor element 30_2 is electrically connected to the emitter of the corresponding semiconductor element 30_1. In Figure 3, the upper semiconductor elements 30_1 and 30_2 are each high-potential elements, and the lower semiconductor elements 30_1 and 30_2 are each high-potential elements. The emitter of the high-potential semiconductor element 30_1 and the collector of the low-potential semiconductor element 30_1 are electrically connected to the main terminal 70_1 and the control terminal 80_3. The collector of the high-potential semiconductor element 30_1 is electrically connected to the main terminal 70_3. The gate of the high-potential semiconductor element 30_1 is electrically connected to the control terminal 80_4. The emitter of the low-potential semiconductor element 30_1 is electrically connected to the main terminal 70_2 and the control terminal 80_2. The gate of the low-potential semiconductor element 30_1 is electrically connected to the control terminal 80_1.

[0022] The base 40 shown in Figure 2 is a plate-shaped member for heat dissipation. For example, the base 40 is a metal plate made of copper, copper alloy, aluminum, or aluminum alloy. The base 40 has thermal conductivity and dissipates heat from the semiconductor element 30. The base 40 is also electrically conductive and is electrically connected to a reference potential, such as the ground potential.

[0023] In the example shown in Figure 2, the thickness direction of the base 40 is aligned with the Z-axis. The base 40 has a shape that, when viewed along the Z-axis, has a pair of long sides extending along the X-axis and a pair of short sides extending along the Y-axis. Mounting holes 41 are provided in the base 40 near each short side. The mounting holes 41 are through holes used to screw heat dissipation members, such as heat dissipation fins (not shown), to the base 40. Note that the plan view shape of the base 40 is not limited to the example shown in Figure 1 and is arbitrary. Also, the mounting holes 41 may be provided as needed and may be omitted.

[0024] The case 50 is a box-shaped member that houses a plurality of semiconductor elements 30 mounted on the wiring board 20. The case 50 is essentially an insulator and is made of a resin material such as PPS (Polyphenylene Sulfide) or PBT (Polybutylene terephthalate), and is obtained by injection molding or the like. The resin material may contain inorganic fibers such as glass fibers or inorganic fillers such as alumina or silica, from the viewpoint of improving the mechanical strength or thermal conductivity of the case 50.

[0025] The case 50 has a hole 51, two holes 52, and two mounting holes 53. Each of these holes penetrates the case 50 in a direction along the Z-axis. Here, hole 51 is for positioning the nut case 60 and for inserting the three main terminals 70. Each of the holes 52 is for inserting the control terminal unit 12. Each of the mounting holes 53 is a through hole used together with the aforementioned mounting hole 41 to screw heat dissipation members, such as heat dissipation fins (not shown), to the base 40.

[0026] In the examples shown in Figures 1 and 2, the thickness direction of the case 50 is along the Z-axis. The case 50 has an outer shape that, when viewed along the Z-axis, has a pair of long sides extending along the X-axis and a pair of short sides extending along the Y-axis. The two mounting holes 53 are located near each short side of the case 50 in a plan view, overlapping with the two mounting holes 41 mentioned above. The holes 51 are located between the two mounting holes 53 in a plan view and have a shape that extends along the X-axis. The two holes 52 are located near both ends of one of the short sides of the case 50 in a plan view, flanking one of the two mounting holes 53.

[0027] The nut case 60 is positioned in the aforementioned hole 51 and is a structure for screwing the main terminals 70_1, 70_2, and 70_3 to a busbar (not shown). Multiple nuts 61 are fixed to the nut case 60. The nut case 60 is made of a resin material such as PPS (Polyphenylene Sulfide) or PBT (Polybutylene terephthalate), similar to the case 50, and is obtained by injection molding or the like. Here, the nut case 60 may be formed by insert molding in which the multiple nuts 61 are inserted parts.

[0028] Each of the three main terminals 70 is a terminal for electrically connecting a busbar (not shown) and the semiconductor element 30 to each other. Here, each of the three main terminals 70 is electrically connected to the collector or emitter of the semiconductor element 30_1 shown in Figure 3, as described above. Each main terminal 70 is made of a metal such as copper, copper alloy, aluminum, aluminum alloy, or iron alloy, and is obtained by bending a metal plate or the like.

[0029] In the example shown in Figures 1 and 2, the main terminal 70 has an electrode portion 71 and two frame portions 72. The electrode portion 71 is the part of the main terminal 70 that is exposed to the outside of the case 50 through the aforementioned hole 51, and is plate-shaped with the direction along the Z axis as the thickness direction. A hole 73 is provided in the electrode portion 71. A screw (not shown) that is fastened to the nut case 60 is inserted into the hole 73. The electrode portion 71 is supported on the wiring board 20 via the frame portions 72. The two frame portions 72 are parts of the main terminal 70 that support the electrode portion 71, and extend toward the wiring board 20 from both ends of the electrode portion 71 in the Y1 and Y2 directions. Each frame portion 72 is joined to the wiring board 20 by solder or the like.

[0030] Each of the four control terminals 80 is a terminal for electrically connecting the semiconductor element 30 to a substrate (not shown, hereinafter also referred to as the "mounting substrate") which has a circuit for controlling the operation of the semiconductor module 10. Here, each of the four control terminals 80 is electrically connected to the gate of semiconductor element 30_1 or the anode of semiconductor element 30_2 shown in Figure 3, as described above. The multiple control terminals 80 are made of a metal such as copper, copper alloy, aluminum, aluminum alloy, or iron alloy, and are obtained by bending a metal plate or the like.

[0031] In the examples shown in Figures 1 and 2, the control terminal 80 has a terminal pin portion 81 and a frame portion 82. The terminal pin portion 81 is the rod-shaped part of the control terminal 80 that protrudes from the outer wall surface of the case 50 through the aforementioned hole 52 and extends in the direction along the Z axis. The terminal pin portion 81 is supported by the wiring board 20 via the frame portion 82. The frame portion 82 is the part of the control terminal 80 that supports the terminal pin portion 81 and extends from the end of the terminal pin portion 81 in the Z2 direction toward the wiring board 20. The frame portion 82 is joined to the wiring board 20 by solder or the like. Further details of the control terminal 80 will be explained later with reference to Figure 5, etc.

[0032] Each of the two guide blocks 90 is a separate component from the case 50 and is a member used to position the control terminals 80 and the mounting board (not shown) when connecting the control terminals 80 to the mounting board. Here, the two guide blocks 90 are made of separate components from each other. Of the two guide blocks 90, one guide block 90 is integrally fixed to the control terminals 80_1 and 80_2, and the other guide block 90 is integrally fixed to the control terminals 80_3 and 80_4. The guide blocks 90 are made of a resin material such as PPS (Polyphenylene Sulfide) or PBT (Polybutylene terephthalate), similar to the case 50, and are obtained by injection molding or the like.

[0033] "Integrated fixing" means that the relative positions and orientations of the components are fixed in a manner that allows them to be considered as a single, substantially integrated object, for example, through fitting, insert molding, or bonding. In this embodiment, a configuration in which the control terminal 80 and the guide block 90 are integrally fixed by fitting is exemplified.

[0034] In the examples shown in Figures 1 and 2, the guide block 90 has a guide pin portion 91 and a support portion 92. The guide pin portion 91 is a rod-shaped part of the guide block 90 that protrudes from the outer wall surface of the case 50 through the aforementioned hole 52 and extends in the direction along the Z axis. The support portion 92 is the part of the guide block 90 that supports the guide pin portion 91 and extends from the end of the guide pin portion 91 in the Z2 direction toward the laminate 11. The movement of the support portion 92 in the direction along the Z axis is restricted by being sandwiched between the case 50 and the laminate 11. Further details of the guide block 90 will be explained later with reference to Figure 6, etc.

[0035] In the semiconductor module 10 outlined above, the control terminal 80 is integrally fixed to the guide block 90. ​​Compared to a configuration using guide pins that are not fixed to the control terminal 80, the relative positional tolerances of the terminal pin portion 81 and the guide pin portion 91 can be reduced. Therefore, a semiconductor module 10 that is easy to mount on a mounting substrate (not shown) can be provided. The control terminal unit 12 will be described in detail below.

[0036] 1-2. Control Terminal Unit Figure 4 is a plan view of the semiconductor module 10 with the case 50 removed. As shown in Figure 4, the two control terminal units 12 are aligned along the Y-axis in a plan view, sandwiching one of the two mounting holes 41. That is, the mounting hole 41 is located between two adjacent control terminal units 12 when viewed in the thickness direction of the laminate 11.

[0037] Here, of the two control terminal units 12, one control terminal unit 12 is composed of control terminals 80_1, 80_2 and a guide block 90, and the other control terminal unit 12 is composed of control terminals 80_3, 80_4 and a guide block 90.

[0038] Each of the control terminals 80_1, 80_2, 80_3, and 80_4 extends in a direction along the X-axis in a plan view, and is positioned from a position overlapping the wiring board 20 to a position overlapping the base 40 without overlapping the wiring board 20. The guide block 90 is positioned in a location that overlaps the base 40 without overlapping the wiring board 20 in a plan view.

[0039] In the example shown in Figure 4, the two control terminal units 12 have identical configurations. Here, control terminals 80_1 and 80_3 have identical configurations. Control terminals 80_2 and 80_4 have identical configurations. Furthermore, control terminals 80_1, 80_3 and control terminals 80_2 and 80_4 have identical configurations except for the different lengths of the frame portion 82. Note that the two control terminal units 12 may have different configurations. Also, control terminals 80_1 and 80_2 may have identical configurations, or control terminals 80_3 and 80_4 may have identical configurations.

[0040] Here, in each control terminal unit 12, the distance D1 between one terminal pin portion 81 of the two control terminals 80 and the guide pin portion 91 is equal to the distance D2 between the other terminal pin portion 81 and the guide pin portion 91. That is, in each control terminal unit 12, the terminal pin portions 81 of the two control terminals 80 are arranged on the same circumference centered on the central axis of the guide pin portion 91, when viewed in the direction along the central axis of the guide pin portion 91. Note that "distances D1 and D2 are equal" includes not only cases where they are exactly equal, but also cases where there is a difference that can be considered substantially equal due to manufacturing tolerances, etc.

[0041] Figure 5 is a side view of the control terminal 80. As shown in Figure 5, the frame portion 82 of the control terminal 80 has a first portion 82a, a second portion 82b, and a third portion 82c.

[0042] The first part 82a is a portion of the frame 82 that extends from the wiring board 20 in the Z1 direction. A joint portion 82a1 is provided at the end of the first part 82a in the Z2 direction, which is joined to the wiring board 20. In the example shown in Figure 5, the portion of the first part 82a excluding the joint portion 82a1 is plate-shaped with the thickness direction along the X-axis. The joint portion 82a1 is plate-shaped with the thickness direction along the Z-axis. A first part 82a with this shape is more prone to bending deformation in the direction along the X-axis compared to other directions.

[0043] The second part 82b is the portion of the frame 82 that extends in the X1 direction from the end of the first part 82a in the Z1 direction. The second part 82b has a portion 82b1 that fits into the slit 92e of the guide block 90, which will be described later. The portion 82b1 is an example of the "first shaped part". In the example shown in Figure 5, the second part 82b is plate-shaped with the direction along the Z axis as the thickness direction. For this reason, the second part 82b is more prone to bending deformation in the direction along the Z axis compared to other directions.

[0044] The third portion 82c is a part of the frame portion 82 that extends in the Z1 direction from the end of the second portion 82b in the X1 direction. The third portion 82c has a portion 82c3 that fits into the slit 92d of the guide block 90, which will be described later. The portion 82c3 is an example of the "first shaped portion". The portion 82c3 has a projection 82c1 that protrudes in the X2 direction and a projection 82c2 that protrudes in the Y2 direction. In the example shown in Figure 5, the third portion 82c is plate-shaped with the direction along the Y axis as the thickness direction. For this reason, the third portion 82c is more prone to bending deformation in the direction along the Y axis compared to other directions.

[0045] Figure 6 is a perspective view of the guide block 90. ​​As shown in Figure 6, the support portion 92 of the guide block 90 is columnar in shape and extends in the direction along the Z axis. More specifically, the support portion 92 has a columnar portion 92a, a wide portion 92b, and a connecting portion 92c. The columnar portion 92a, the wide portion 92b, and the connecting portion 92c are arranged in this order in the Z1 direction.

[0046] The column portion 92a is the part of the support portion 92 that extends in the direction along the Z axis. In the example shown in Figure 6, the column portion 92a is roughly rectangular in shape. Here, the column portion 92a has an outer shape that, in plan view, has a pair of short sides along the X axis and a pair of long sides along the Y axis. On the face of the column portion 92a facing the Y1 direction and the face facing the Y2 direction, there are slits 92e that open in the X1 direction and the X2 direction, respectively. The slits 92e are an example of a "second shape portion" and fit into the portion 82b1 of the second portion 82b described above. These slits 92e are provided at different positions in the direction along the Z axis. Also, each slit 92e has a shape that extends in the direction perpendicular to the Z axis. Note that the shape of the column portion 92a is not limited to the example shown in Figure 6, and may be cylindrical, for example.

[0047] The wide portion 92b is located in the Z1 direction relative to the column portion 92a and is a part of the support portion 92 that is wider in the direction along the X axis compared to the column portion 92a. The wide portion 92b has a portion that protrudes from the surface of the column portion 92a facing in the X1 direction. In the example shown in Figure 6, the wide portion 92b has an outline that, in plan view, has roughly one pair of sides along the X axis and one pair of sides along the Y axis. Two slits 92d are provided on the surface of the wide portion 92b facing in the X1 direction, opening in the Z1 direction and the Z2 direction, respectively. Each slit 92d is an example of a "second shaped portion" and fits into the portion 82c3 of the third portion 82c described above. These slits 92d are provided at the same position relative to each other in the direction along the Z axis. Also, each slit 92d has a shape that spreads in the direction perpendicular to the Y axis. Furthermore, a stepped portion 92f is provided along each of the two sides parallel to the X axis on the surface of the wide portion 92b facing the Z1 direction. Note that the shape of the wide portion 92b is not limited to the example shown in Figure 6; for example, a shape without the stepped portion 92f is also possible.

[0048] The connecting portion 92c is a part of the support portion 92 that protrudes from the Z1-facing surface of the wide portion 92b and is connected to the Z2-facing end of the guide pin portion 91. In the example shown in Figure 6, the connecting portion 92c is circular in plan view. The width of the connecting portion 92c gradually decreases toward the Z1 direction, and at its end toward the Z1 direction, it matches the width of the guide pin portion 91. The shape of the connecting portion 92c is not limited to the example shown in Figure 6; for example, it may be a shape of constant width, or a shape that forms a step between it and the guide pin portion 91. The connecting portion 92c may be provided as needed or omitted.

[0049] The guide pin portion 91 is columnar in shape and protrudes from the support portion 92 in the Z1 direction. In the example shown in Figure 6, the guide pin portion 91 has a shaft portion 91a and a tapered portion 91b.

[0050] The shaft portion 91a is the part of the guide pin portion 91 that extends from the support portion 92 in the Z1 direction with a constant width. In the example shown in Figure 6, the shaft portion 91a is cylindrical. The tapered portion 91b is the part of the guide pin portion 91 that gradually decreases in width from the end to the tip in the Z1 direction of the shaft portion 91a. In the example shown in Figure 6, the tapered portion 91b is truncated cone-shaped.

[0051] Figure 7 illustrates the fitting of the control terminal 80 and the guide block 90. ​​As shown in Figure 7, a portion 82c3 of the control terminal 80 fits into the slit 92d of the guide block 90. ​​In the example shown in Figure 7, the slit 92d is provided with a recess 92d1 that corresponds to the shape of the protrusion 82c1. This restricts the movement of the control terminal 80 relative to the guide block 90 in the direction along the Z axis.

[0052] Furthermore, portion 82b1 of the control terminal 80 fits into the slit 92e of the guide block 90. ​​Therefore, in this respect as well, the movement of the control terminal 80 in the direction along the Z axis relative to the guide block 90 is restricted. In addition, by fitting the control terminal 80 to the guide block 90 at two points, it is also possible to reduce the change in the attitude of the control terminal 80 relative to the guide block 90.

[0053] Here, the boundary BD between the shaft portion 91a and the tapered portion 91b is located in a position that approximately coincides with the tip of the terminal pin portion 81 of the control terminal 80, or is located further in the Z1 direction, along the Z axis. Therefore, when mounting the semiconductor module 10 on a mounting substrate (not shown), the terminal pin portion 81 can be inserted into the hole for the terminal pin portion 81 on the mounting substrate after the positioning of the mounting substrate and the semiconductor module 10 by the guide pin portion 91 has been completed.

[0054] Figure 8 is a partially enlarged cross-sectional view of the semiconductor module 10 according to the first embodiment. Figure 9 is a cross-sectional view taken along line BB in Figure 8. As shown in Figures 8 and 9, the guide block 90 is inserted into the hole 52 of the case 50, along with the two control terminals 80.

[0055] The guide block 90 is not joined to the base 40 or the case 50. Therefore, changes in the position and orientation of the guide block 90 relative to the base 40 and the case 50, as described above, are permitted.

[0056] Here, as shown in Figure 8, a small gap d1 is provided between the inner surface of the hole 52 and the outer surface of the guide block 90 in the direction along the X axis. The size of this gap d1 is not particularly limited, but it is preferably less than or equal to the gap d2 described later. On the other hand, if the gap d1 is too large, excessive stress may be generated at the joint between the control terminal 80 and the wiring board 20 as the position or orientation of the guide block 90 changes. Conversely, if the gap d1 is too small, it becomes difficult to insert the control terminal unit 12 into the hole 52.

[0057] Furthermore, as shown in Figure 9, a small gap d2 is provided between the inner surface of the hole 52 and the outer surface of the guide block 90 in the direction along the Y axis. The size of this gap d2 is not particularly limited, but is approximately the same as the position tolerance of the holes provided for the guide pin portion 91 on the mounting substrate on which the semiconductor module 10 is mounted, for example, 0.1 mm to 1 mm. Therefore, movement of the guide block 90 in the direction along the Y axis relative to the case 50 is permitted within the range of the gap d2. On the other hand, if the gap d2 is too large, excessive stress may be generated at the joint between the control terminal 80 and the wiring board 20 due to changes in the position or orientation of the guide block 90. ​​On the other hand, if the gap d2 is too small, similar to the case 50 being integrated with the guide block 90, it tends to become difficult to mount the semiconductor module 10 on the mounting substrate depending on the position tolerance of the holes provided for the guide pin portion 91 on the mounting substrate on which the semiconductor module 10 is mounted.

[0058] Furthermore, the stepped portion 92f of the support portion 92 of the guide block 90 contacts the end of the hole 52 in the Z2 direction. As a result, the support portion 92 is sandwiched between the case 50 and the base 40. The case 50 also has a surface 54 facing the surface of the support portion 92 facing the Y1 direction, and a surface 55 facing the surface of the support portion 92 facing the Y2 direction. These surfaces 54 and 55 restrict the change in the orientation of the guide block 90 around the X axis relative to the case 50. Here, a gap of about the same size as the aforementioned gap d2 is provided between these surfaces and the support portion 92. The stepped portion 92f may be provided as needed or omitted.

[0059] As described above, the semiconductor module 10 comprises a semiconductor element 30, a case 50, and a plurality of control terminal units 12. Here, the case 50 houses the semiconductor element 30. The control terminal unit 12 has at least one control terminal 80 and a guide block 90. ​​The control terminal 80 has a terminal pin portion 81 that protrudes from the outer wall surface of the case 50 and is electrically connected to the semiconductor element 30. The guide block 90 has a guide pin portion 91 that protrudes from the outer wall surface of the case 50 in the same direction as the terminal pin portion 81, is made of a separate component from the case 50, and is integrally fixed to the at least one control terminal 80. Furthermore, the guide blocks 90 of the plurality of control terminal units 12 are made of separate components from each other.

[0060] In the semiconductor module 10 described above, the control terminal 80 is integrally fixed to the guide block 90, so the positional tolerance between the terminal pin portion 81 and the guide pin portion 91 can be reduced compared to a configuration that uses guide pins that are not fixed to the control terminal 80.

[0061] Here, since the guide block 90 is a separate component from the case 50, the control terminals 80 can be easily electrically connected to the semiconductor element 30 before fixing the case 50 to the laminate 11.

[0062] Furthermore, since the guide blocks 90 of the multiple control terminal units 12 are composed of separate parts, a configuration that allows for changes in the position or orientation of the guide blocks 90 relative to the case 50 can be adopted. Therefore, when mounting the semiconductor module 10 on a mounting substrate having two holes for inserting two guide pin portions 91, even if the distance between the two holes differs slightly from the distance between the two guide pin portions 91, the semiconductor module 10 can be easily mounted on the mounting substrate while maintaining the relative positional tolerances of the terminal pin portions 81 and the guide pin portions 91.

[0063] Furthermore, since the guide blocks 90 of multiple control terminal units 12 are composed of different parts, the guide blocks 90 or control terminal units 12 can be reused even in other semiconductor modules 10 where the distance between the two guide pin portions 91 is different. This makes it possible to reduce the cost of the semiconductor module 10. In addition, the same configuration of guide blocks 90 can be used among multiple control terminal units 12. Therefore, compared to using guide blocks 90 with different configurations among multiple control terminal units 12, it is possible to reduce the cost of the semiconductor module 10.

[0064] Furthermore, as mentioned above, each of the at least one control terminal 80 has plate-shaped portions 82b1 and 82c3, which are examples of the "first shaped portion". On the other hand, the guide block 90 has slits 92d and 92e (slit-shaped portions), which are examples of the "second shaped portion". Slit 92d fits into portion 82c3. Slit 92e fits into portion 82b1. Therefore, the control terminal 80 and the guide block 90 can be integrally fixed to each other without using adhesive. Also, since expensive molds such as those used in insert molding are not required, the semiconductor module 10 can be made less expensive compared to a configuration using insert molding. Furthermore, since the control terminal 80 to be used in the guide block 90 can be appropriately selected from multiple control terminals 80 of different types after the guide block 90 has been molded, the guide block 90 can be made common to multiple types of semiconductor modules 10. Therefore, in this respect as well, the cost of the semiconductor module 10 can be made less expensive.

[0065] Furthermore, as mentioned above, the semiconductor module 10 further comprises a laminate 11. The laminate 11 includes a wiring board 20 on which semiconductor elements 30 are mounted and housed in a case 50. Each of the at least one control terminal 80 further has a frame portion 82. The terminal pin portion 81 is supported by the wiring board 20 via the frame portion 82. This allows the control terminal 80 to be electrically connected to the semiconductor elements 30 while restricting the position and orientation of the control terminal unit 12 relative to the laminate 11 within a predetermined range. In a configuration using such a control terminal 80, it is necessary to connect the control terminal 80 to the wiring board 20 before fixing the laminate 11 to the case 50. Therefore, as mentioned above, making the guide block 90, which is integrated with the control terminal 80, a separate component from the case 50 is also useful in the assembly of the semiconductor module 10.

[0066] As described above, the frame portion 82 has a first portion 82a, a second portion 82b, and a third portion 82c. The first portion 82a is joined to the wiring board 20 and extends in a direction away from the wiring board 20. The second portion 82b extends from the first portion 82a in a direction intersecting the thickness direction of the wiring board 20. The third portion 82c extends from the second portion 82b in the thickness direction of the wiring board 20. The guide block 90 is integrally fixed to the third portion 82c. Therefore, even if the distance between the wiring board 20 and the guide pin portion 91 is large, the terminal pin portion 81 can be positioned near the guide pin portion 91.

[0067] Furthermore, as mentioned above, the second portion 82b is plate-shaped with its thickness direction aligned with the thickness direction of the wiring board 20. The third portion 82c is also plate-shaped with its thickness direction aligned with the direction in which the multiple control terminal units 12 are arranged. This allows for changes in the position and orientation of the terminal pin portion 81 and the guide pin portion 91.

[0068] Furthermore, as described above, the guide block 90 further has a support portion 92 which is integrally fixed to the third portion 82c of at least one control terminal 80. The guide pin portion 91 protrudes from the support portion 92. Therefore, compared to a configuration without the support portion 92, the guide block 90 can be easily positioned relative to the case 50.

[0069] Furthermore, as mentioned above, the third portion 82c has a projection 82c1 that protrudes in a direction intersecting the direction in which the third portion 82c extends. On the other hand, the support portion 92 has a recess 92d1 that fits into the projection 82c1. Therefore, the control terminal 80 can be easily fitted to the guide block 90 while allowing deformation in the thickness direction of the second portion 82b.

[0070] Furthermore, as mentioned above, the support portion 92 has a slit 92e that fits into the second portion 82b. Therefore, since the control terminal 80 fits into the guide block 90 at two locations, the second portion 82b and the third portion 82c, it is possible to prevent fluctuations in the relative positions and orientations of the terminal pin portion 81 and the guide pin portion 91.

[0071] Furthermore, as mentioned above, the support portion 92 is columnar. Therefore, since the entire guide block 90 is columnar, the installation space required for the guide block 90 can be reduced. As a result, it is possible to prevent the semiconductor module 10 from becoming larger.

[0072] Furthermore, as mentioned above, the support portion 92 is sandwiched between the case 50 and the laminate 11. This restricts the movement of the guide pin portion 91 in the direction along its central axis. In addition, since a configuration such as the fitting of a resin block to a resin case as described in Patent Document 1 is unnecessary, the configuration of the semiconductor module 10 can be simplified.

[0073] As mentioned above, the laminate 11 has mounting holes 41 for attaching the heat sink 130. The case 50 also has mounting holes 53 for attaching the heat sink 130. The mounting holes 41 and 53 are located between two adjacent control terminal units 12 when viewed in the thickness direction of the laminate 11. Therefore, the mounting holes 41 and 53 can be positioned in a location that is accessible even when the semiconductor module 10 is connected to the busbar 110, while miniaturizing the semiconductor module 10.

[0074] Furthermore, as mentioned above, the case 50 has a plurality of holes 52 provided for each guide block 90. ​​A guide block 90 is inserted into each of the plurality of holes 52. In addition, gaps d1 and d2 are provided between the inner circumferential surface of each of the plurality of holes 52 and the outer circumferential surface of the guide block 90. ​​This allows for changes in the position and orientation of the guide pin portion 91 relative to the case 50.

[0075] Furthermore, as mentioned above, two control terminals 80 are integrally fixed to one guide block 90. ​​The terminal pin portions 81 of the two control terminals 80 are arranged on the same circumference centered on the central axis of the guide pin portion 91 when viewed in the direction along the central axis of the guide pin portion 91. Therefore, the number of guide blocks 90 can be reduced compared to a configuration in which only one control terminal is integrated into one guide block 90. ​​As a result, the cost of the semiconductor module 10 can be reduced. In addition, because the terminal pin portions 81 of the two control terminals 80 are arranged on the same circumference centered on the central axis of the guide pin portion 91 when viewed in the direction along the central axis of the guide pin portion 91, there is an advantage in that the difference in position tolerance between the two terminal pin portions 81 can be easily reduced.

[0076] 2. Second Embodiment A second embodiment of this disclosure will be described below. For elements whose operation and function are the same as those in the above-described embodiment, the reference numerals used in the above-described embodiment will be reused, and detailed descriptions of each will be omitted as appropriate.

[0077] Figure 10 is a partially enlarged cross-sectional view of the semiconductor module 10A according to the second embodiment. Figure 11 is a cross-sectional view taken along line BB in Figure 10. The semiconductor module 10A is configured in the same way as the semiconductor module 10 of the first embodiment described above, except that it includes a control terminal unit 12A instead of the control terminal unit 12. The control terminal unit 12A is configured in the same way as the control terminal unit 12, except that it includes a guide block 90A instead of the guide block 90. ​​The guide block 90A is configured in the same way as the guide block 90, except that the control terminal 80 is integrally molded with the control terminal 80 by insert molding, with the control terminal 80 being an insert part.

[0078] Here, the guide block 90A is configured in the same way as the guide block 90, except that it has a support portion 92A instead of the support portion 92. The support portion 92A is configured in the same way as the support portion 92, except that it has two joint portions 92g and two joint portions 92h instead of two slits 92d and two slits 92e.

[0079] As shown in Figures 10 and 11, each of the two joints 92g is joined to a portion of the third portion 82c of the control terminal 80 by insert molding. Each of the two joints 92h is joined to a portion of the second portion 82b of the control terminal 80 by insert molding. In the example shown in Figures 10 and 11, the third portion 82c has a portion that is exposed from the guide block 90A. Note that the shape of the guide block 90A is not limited to the example shown in Figures 10 and 11, and may, for example, be a shape that covers the entire third portion 82c.

[0080] The semiconductor module 10A can also be easily mounted on the mounting substrate according to the second embodiment described above. In this embodiment, as mentioned above, at least one control terminal 80 and guide block 90A are integrally molded products. Therefore, the control terminal 80 and guide block 90A can be integrally fixed to each other without using adhesive. In addition, the positional tolerance of the terminal pin portion 81 and the guide pin portion 91 can be reduced compared to configurations that use mating or adhesive.

[0081] 3. Application Examples Figure 12 is a cross-sectional view showing an application example of the semiconductor module 10. Figure 12 shows the semiconductor module 10 mounted on a substrate 120 with multiple busbars 110 and a heat sink 130 attached. The following points also apply when semiconductor module 10A is used instead of semiconductor module 10.

[0082] Each of the multiple busbars 110 is a rod-shaped conductor for transmitting high current and is made of a metal such as copper or aluminum. In the example shown in Figure 12, each busbar 110 extends in the direction along the Y-axis. The multiple busbars 110 are arranged parallel to each other in the direction along the X-axis to correspond to the main terminals 70_1, 70_2, and 70_3. Each of the main terminals 70_1, 70_2, and 70_3 is connected to a corresponding busbar 110. Here, each busbar 110 is screwed to the nut case 60 using a screw SC1.

[0083] The substrate 120 is a mounting board having a circuit for controlling the operation of the semiconductor module 10. The substrate 120 is provided with four holes 121 and two holes 122. Terminal pins 81 are inserted into each hole 121. Guide pins 91 are inserted into each hole 122.

[0084] The heat sink 130 is a component for dissipating heat from the semiconductor module 10. The heat sink 130 is made of, for example, copper, aluminum, or an alloy of either of these. In the example shown in Figure 12, the heat sink 130 has a shape with multiple fins. The heat sink 130 is provided with two screw holes 131 corresponding to two mounting holes 41 or two mounting holes 53. The heat sink 130 is then attached to the semiconductor module 10 by fastening screws SC2, which are inserted into the mounting holes 41 and 53, into the screw holes 131.

[0085] Figure 13 is a plan view illustrating the arrangement of the semiconductor module 10, multiple busbars 110, substrate 120, and heat sink 130. For convenience, the busbars 110 and substrate 120 are shown as dashed lines in Figure 13. As shown in Figure 13, the mounting holes 41 and 53 do not overlap the busbars 110 in plan view. Therefore, the heat sink 130 can be attached to the semiconductor module 10 even after the semiconductor module 10 has been connected to the busbars 110.

[0086] 4. Variations This disclosure is not limited to the embodiments described above, and various modifications described below are possible. Furthermore, each embodiment and each modification may be combined as appropriate.

[0087] 4-1. Variation 1 In the aforementioned embodiments, an example configuration is shown in which each control terminal 80 is fixed to the guide block 90 or guide block 90A at two locations. However, the number of these fixing locations is not limited to this configuration; it may be one location or three or more locations. Furthermore, the number of control terminals 80 integrated into one guide block 90 or guide block 90A is not limited to two; it may be one location or three or more locations.

[0088] 4-2. Variation 2 In the first embodiment described above, the control terminal 80 and the guide block 90 only need to be integrated by fitting together, and the manner of fitting is not limited to the above-described embodiment, and may be, for example, a snap-fit.

[0089] 4-3. Variation 3 In the embodiments described above, a configuration is exemplified in which the support portion 92 or support portion 92A is sandwiched between the base 40 and the case 50. However, the configuration is not limited to this, and for example, the support portion 92 or support portion 92A may not be in contact with the base 40. In this case, for example, a configuration for restricting the movement of the support portion 92 or support portion 92A in the direction along the Z axis may be provided in the case 50. Furthermore, the support portion 92 or support portion 92A may be provided or omitted as needed.

[0090] 4-4. Variation 4 The shape of the control terminal 80 is not limited to the shape described above. For example, a part of the frame portion 82 may be meander-shaped, or it may have a shape with multiple parts of different widths, or it may have a shape with multiple branched parts. Also, the directions in which the first portion 82a, the second portion 82b, and the third portion 82c extend are not limited to the directions described above. For example, they may be in a direction inclined with respect to the directions described above.

[0091] In the embodiments described above, IGBTs were used as examples of semiconductor devices, but the type or configuration of semiconductor devices is not limited to these examples. For example, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) may be used as the semiconductor device. In the embodiment where the semiconductor device is a MOSFET, the collector is one of the source electrode and the drain electrode, and the emitter is the other of the source electrode and the drain electrode. Furthermore, an RC-IGBT (Reverse Conducting IGBT) including an IGBT and an FWD (Free Wheeling Diode) may be used as the semiconductor device. [Explanation of Symbols]

[0092] 10...Semiconductor module, 10A...Semiconductor module, 11...Laminate, 12...Control terminal unit, 12A...Control terminal unit, 20...Wiring board, 30...Semiconductor element, 30_1...Semiconductor element, 30_2...Semiconductor element, 40...Base, 41...Mounting hole, 50...Case, 51...Hole, 52...Hole, 53...Mounting hole, 54...Face, 55...Face, 60...Nut case, 61...Nut, 70...Main terminal, 70_1...Main terminal, 70_2...Main terminal, 70_3...Main terminal, 71...Electrode part, 72...Frame part, 73...Hole, 80...Control terminal, 80_1...Control terminal, 80_2...Control terminal, 80_3...Control terminal, 80_4...Control terminal, 81...Terminal pin part, 82...Frame part, 82a...First part, 82a1...Joint part, 82b... Part 2, 82b1... Part (First Shape Part), 82c... Part 3, 82c1... Protruding Part, 82c2... Protruding Part, 82c3... Part (First Shape Part), 90... Guide Block, 90A... Guide Block, 91... Guide Pin Part, 91a... Shaft Part, 91b... Tapered Part, 92... Support Part, 92A... Support Part, 92a... Column Part, 92b... Wide Part, 92c... Connecting Part, 92 d...slit (second shape part), 92d1...recess, 92e...slit (second shape part), 92f...step part, 92g...joint part, 92h...joint part, 110...bus bar, 120...substrate, 121...hole, 122...hole, 130...heat sink, 131...screw hole, BD...boundary, D1...distance, D2...distance, SC1...screw, SC2...screw, d1...gap, d2...gap.

Claims

1. Semiconductor elements and A case for housing the aforementioned semiconductor element, The device comprises a plurality of control terminal units, each having at least one control terminal electrically connected to the semiconductor element, and a guide block that is made of a separate component and is not joined to the case, and is integrally fixed to the at least one control terminal in a state where the position and orientation relationship with respect to the at least one control terminal is fixed. Each of the at least one control terminal has a terminal pin portion that protrudes from the outer wall surface of the case, The guide block has a guide pin portion that protrudes from the outer wall surface of the case in the same direction as the terminal pin portion, The guide blocks of the plurality of control terminal units are composed of separate parts from each other. Semiconductor module.

2. A semiconductor element, A case for housing the aforementioned semiconductor element, The system comprises a plurality of control terminal units, each having at least one control terminal electrically connected to the semiconductor element, and a guide block, which is a separate component from the case and integrally fixed to the at least one control terminal. Each of the at least one control terminal has a terminal pin portion that protrudes from the outer wall surface of the case, The guide block has a guide pin portion that protrudes from the outer wall surface of the case in the same direction as the terminal pin portion, The guide blocks of the plurality of control terminal units are composed of separate parts from each other. Each of the at least one control terminal has a plate-shaped first shape portion, The guide block has a second shaped portion that fits into the first shaped portion, The first shaped part is plate-shaped, The second shaped portion is slit-shaped, sandwiching the first shaped portion in the thickness direction. Semiconductor module.

3. The case further comprises a laminated board including a wiring board on which the aforementioned semiconductor element is mounted, Each of the at least one control terminals further comprises a frame portion, The terminal pin portion is supported on the wiring board via the frame portion. The semiconductor module according to claim 1 or 2.

4. The aforementioned frame portion is A first portion is bonded to the wiring board and extends in a direction away from the wiring board, A second portion extending from the first portion in a direction intersecting the thickness direction of the wiring board, It has a third portion extending from the second portion along the thickness direction of the wiring board, The guide block is integrally fixed to the third portion. The semiconductor module according to claim 3.

5. The second portion is plate-shaped with its thickness direction aligned with the thickness direction of the wiring board, The third portion is plate-shaped with its thickness in the direction along which the plurality of control terminal units are arranged. The semiconductor module according to claim 4.

6. The guide block further has a support portion which is integrally fixed to the third portion of at least one control terminal, The guide pin portion protrudes from the support portion, The semiconductor module according to claim 4 or 5.

7. The third portion has a projection that protrudes in a direction intersecting the direction in which the third portion extends, The support portion has a recess that fits into the protruding portion. The semiconductor module according to claim 6.

8. The support portion has a recess that fits into the second portion. The semiconductor module according to claim 6 or 7.

9. The support part is columnar in shape. A semiconductor module according to any one of claims 6 to 8.

10. The support portion is sandwiched between the case and the laminated plate. A semiconductor module according to any one of claims 6 to 9.

11. The laminate or case has mounting holes for attaching a heat sink. The mounting holes are located between two adjacent control terminal units among the plurality of control terminal units when viewed in the thickness direction of the laminate. A semiconductor module according to any one of claims 3 to 10.

12. The case has a plurality of holes provided for each of the guide blocks, Each of the aforementioned multiple holes has the guide block inserted into it. A gap is provided between the inner circumferential surface of each of the aforementioned multiple holes and the outer circumferential surface of the guide block. A semiconductor module according to any one of claims 1 to 11.

13. The at least one control terminal is one of two control terminals integrally fixed to the guide block. The terminal pins of the two control terminals are arranged on the same circumference centered on the central axis when viewed in the direction along the central axis of the guide pin. A semiconductor module according to any one of claims 1 to 12.

14. The at least one control terminal and the guide block are integrally molded products. The semiconductor module according to claim 1.

Images