Conductive paste for slit nozzles, cured product, and method for applying conductive paste for slit nozzles

Abstract

To provide a conductive paste for a slit nozzle in which excessive flow is suppressed after discharge.SOLUTION: A conductive paste for a slit nozzle contains silver-containing particles, and an epoxy monomer or an epoxy resin, wherein a viscosity change rate Δη0.5 represented by the following expression (1) is more than 0 and 0.20 or less. Expression (1): Δη0.5=(η0.5(T1)-η0.5(T0)) / η0.5(T0). In Expression (1), η0.5(T0) and η0.5(T1) are measured by a predetermined procedure.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a conductive paste for slit nozzles, a cured product, and a method for applying the conductive paste for slit nozzles. [Background technology]

[0002] Electronic components such as semiconductor elements are mounted on a substrate, for example, via an adhesive layer. Such adhesive layers may utilize conductive resin compositions. Examples of technologies related to conductive resin compositions include those described in Patent Document 1.

[0003] Patent Document 1 describes a resin composition comprising (A) plate-type silver fine particles, (B) silver powder having an average particle size of 0.5 to 30 μm other than component (A), and (C) a thermosetting resin, wherein when the total amount of silver fine particles of component (A) and silver powder of component (B) is 100 parts by mass, component (C) is blended in an amount of 1 to 20 parts by mass, and the resin composition is electrically conductive. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2014-194013 [Overview of the project] [Problems that the invention aims to solve]

[0005] In recent years, semiconductor packages have become even smaller and their designs have become more diverse, creating a demand for conductive pastes that can accommodate such packages. To address this situation, there has been a growing demand in recent years for conductive pastes to be applied using a slit nozzle method. However, conventional conductive pastes have not been able to adequately meet this demand.

[0006] When performing fine printing by the slit nozzle method, if the conductive paste sags after discharge (that is, if the conductive paste flows more than necessary after discharge), fine printing becomes difficult. BLT can be used as an indicator of the fluidity of a conductive paste. BLT stands for Bond Line Thickness, and the smaller the BLT, the easier the conductive paste flows; conversely, the larger the BLT, the harder the conductive paste flows. [Means for Solving the Problem]

[0007] The inventors of the present invention completed the invention provided below and solved the above problems.

[0008] [1] silver-containing particles; an epoxy compound having one or more epoxy groups in a molecule; a conductive paste for slit nozzles comprising: a viscosity change rate Δη represented by the following formula (1) 0.5 is greater than 0 and 0.20 or less, the conductive paste for slit nozzles. Δη 0.5 =(η 0.5(T1) -η 0.5(T0) ) / η 0.5(T0) (1) In formula (1), η 0.5(T0) and η 0.5(T1) are measured by the following <Procedure> <Procedure> (i) Setting the conductive paste for slit nozzles in the measurement part of a viscometer. (ii) Rotating the viscometer at 25°C at a shear rate of 0.5 rpm, measuring the viscosity 6 minutes after the start of rotation, and defining the measured viscosity as η 0.5(T0) . (iii) Subsequently, rotating the viscometer at a shear rate of 5 rpm, measuring the viscosity 2 minutes after the start of rotation, and defining the measured viscosity as η 5(T0) . (iv) Subsequently, stopping the viscometer and allowing it to stand for 5 minutes. (v) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η 0.5(T1) Let's assume that. (vi) Next, rotate the viscometer at a shear rate of 5 rpm, measure the viscosity 2 minutes after the start of rotation, and set the measured viscosity to η 5(T1) Let's assume that. [2] Silver-containing particles and Epoxy monomer or epoxy resin, A conductive paste for a slit nozzle, comprising: A conductive paste for slit nozzles, wherein the viscosity change rate Δη5, shown in the following formula (2), is greater than 0 and less than or equal to 0.20. Δη5=(η 5(T1) -η 5(T0) ) / η 5(T0) (2) In formula (2), η 5(T0) and η 5(T1) This is measured using the following procedure. <Instructions> (i) Set the conductive paste for the slit nozzle into the measuring section of the viscometer. (ii) Rotate the viscometer at a shear rate of 0.5 rpm at 25°C, measure the viscosity 6 minutes after the start of rotation, and set the measured viscosity to η 0.5(T0) Let's assume that. (iii) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is expressed as η 5(T0) Let's assume that. (iv) Next, stop the viscometer and let it stand for 5 minutes. (v) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η 0.5(T1) Let's assume that. (vi) Next, rotate the viscometer at a shear rate of 5 rpm, measure the viscosity 2 minutes after the start of rotation, and set the measured viscosity to η 5(T1) Let's assume that. [3] A conductive paste for a slit nozzle as described in [1] or [2] above, η 0.5(T0) / η 5(T0) The thixotropic index TI is shown by (T0) A conductive paste for slit nozzles, wherein the coefficient of conductivity is between 1.0 and 10.0. [4] A conductive paste for a slit nozzle as described in any of the above [1] to [3], η 0.5(T1) / η 5(T1) The thixotropic index TI is shown by (T1) A conductive paste for slit nozzles, wherein the coefficient of conductivity is between 1.0 and 10.0. [5] A conductive paste for a slit nozzle as described in any of the above [1] to [4], Volume-based median diameter D of the silver-containing particles as determined by laser diffraction scattering 50 A conductive paste for slit nozzles, having a particle size of 1.0 μm or more and 15.0 μm or less. [6] A conductive paste for a slit nozzle as described in any of the above [1] to [5], A conductive paste for slit nozzles, wherein the content of the silver-containing particles is 70 parts by mass or more and 98 parts by mass or less when the total amount of the conductive paste for slit nozzles is 100 parts by mass. [7] A conductive paste for a slit nozzle as described in any of the above [1] to [6], Furthermore, a conductive paste for slit nozzles containing (meth)acrylic monomer. [8] A cured product obtained by curing a conductive paste for a slit nozzle described in any of the above [1] to [7].

[10] A method for applying conductive paste for slit nozzles, wherein the conductive paste for slit nozzles described in any of the above [1] to [7] is applied to a surface to be adhered to by a jet dispensing method. [Effects of the Invention]

[0009] According to the present invention, a conductive paste for a slit nozzle is provided in which excessive flow after discharge is suppressed. [Brief explanation of the drawing]

[0010] [Figure 1] This is a cross-sectional view showing a semiconductor device in which an adhesive layer has been formed using the conductive paste for slit nozzles according to this embodiment. [Figure 2] These are (A) a bottom view, (B) a side view, (C) a rear view, and (D) a front view of the slit nozzle. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described below with reference to the drawings. In all drawings, similar components are denoted by the same reference numerals, and their descriptions are omitted as appropriate. Unless otherwise specified, "a~b" represents "a or greater and b or less".

[0012] [Overview of the Jet Dispensing Method] First, we will explain the general outline of the formation of the adhesive layer by the jet dispensing method using Figures 1 and 2.

[0013] Figure 1 is a cross-sectional view showing a semiconductor device 100 in which an adhesive layer has been formed using the conductive paste for the slit nozzle of this embodiment. In the jet dispensing method, the conductive paste for the slit nozzle is discharged from the slit nozzle onto the surface of the substrate 30, forming an adhesive layer 10. Then, the semiconductor element 20 is mounted via the adhesive layer 10.

[0014] Figure 2 shows an example of a slit nozzle. Figure 2(A) shows a bottom view, Figure 2(B) shows a side view, Figure 2(C) shows a rear view, and Figure 2(D) shows a front view.

[0015] [Conductive paste for slit nozzles] The conductive paste for the slit nozzle according to this embodiment is Silver-containing particles and Epoxy monomer or epoxy resin, A conductive paste for a slit nozzle, comprising: The viscosity change rate Δη is shown in the following equation (1)0.5 The value is greater than 0 and less than or equal to 0.20. Δη 0.5 =(η 0.5(T1) -η 0.5(T0) ) / η 0.5(T0) (1) In formula (1), η 0.5(T0) and η 0.5(T1) It is measured using the following procedure. <Instructions> (i) Place the conductive paste for the slit nozzle into the measuring section of the viscometer. (ii) Rotate the viscometer at a shear rate of 0.5 rpm at 25°C, measure the viscosity 6 minutes after the start of rotation, and set the measured viscosity to η 0.5(T0) Let's assume that. (iii) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is expressed as η 5(T0) Let's assume that. (iv) Next, stop the viscometer and let it stand for 5 minutes. (v) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η 0.5(T1) Let's assume that. (vi) Next, rotate the viscometer at a shear rate of 5 rpm, measure the viscosity 2 minutes after the start of rotation, and set the measured viscosity to η 5(T1) Let's assume that.

[0016] The conductive paste for the slit nozzle according to this embodiment is Silver-containing particles and Epoxy monomer or epoxy resin, A conductive paste for a slit nozzle, comprising: The viscosity change rate Δη5, shown in equation (2) below, is greater than 0 and less than or equal to 0.20. Δη5=(η 5(T1) -η 5(T0) ) / η 5(T0) (2) In formula (2), η 5(T0) and η 5(T1) It is measured using the following procedure. <Instructions> (i) Set the conductive paste for the slit nozzle into the measuring section of the viscometer. (ii) Rotate the viscometer at a shear rate of 0.5 rpm at 25°C, measure the viscosity 6 minutes after the start of rotation, and set the measured viscosity to η 0.5(T0) Let's assume that. (iii) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is expressed as η 5(T0) Let's assume that. (iv) Next, stop the viscometer and let it stand for 5 minutes. (v) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η 0.5(T1) Let's assume that. (vi) Next, rotate the viscometer at a shear rate of 5 rpm, measure the viscosity 2 minutes after the start of rotation, and set the measured viscosity to η 5(T1) Let's assume that.

[0017] The conductive paste for the slit nozzle in this embodiment suppresses the reduction of BLT. In other words, excessive flow after discharge of the conductive paste for the slit nozzle in this embodiment is suppressed.

[0018] <Rheological properties> The inventors have newly discovered that by satisfying the following requirements (I) and (II), the conductive paste for slit nozzles will have appropriate rheological properties and the reduction of BLT will be suppressed. (I) Contains silver-containing particles and epoxy monomer or epoxy resin. (II) Viscosity change rate Δη calculated by the above method 0.5 The value must be greater than 0 and less than or equal to 0.20.

[0019] Although the mechanism by which the conductive paste for slit nozzles solves the above-mentioned problems by satisfying the requirements of (I) and (II) above is not clear, it is presumed that the rheological properties of the paste are adjusted to an appropriate range through the interaction of each component blended into the paste.

[0020] Furthermore, the inventors have found that by satisfying the following requirements (III) and (IV), the conductive paste for the slit nozzle has appropriate rheological properties and suppresses the reduction of BLT. (III) Containing silver-containing particles and epoxy monomer or epoxy resin. (IV) The viscosity change rate Δη5 calculated by the above method is greater than 0 and less than or equal to 0.20.

[0021] Although the mechanism by which the conductive paste for slit nozzles solves the above-mentioned problems by satisfying the requirements of (III) and (IV) above is not clear, it is presumed that the rheological properties of the paste are adjusted to an appropriate range through the interaction of each component blended into the paste.

[0022] The rheological properties of the conductive paste according to this embodiment are described below. The conductive paste according to this embodiment preferably has the following numerical range. This allows for stable application.

[0023] The rheological properties of the conductive paste according to this embodiment are discussed based on values ​​measured by a viscometer, and as a viscometer, for example, a Brookfield DVNXHBCBG can be used.

[0024] Viscosity η measured by the method described above 0.5(T0) The pressure is preferably 10 Pa·s or higher, more preferably 20 Pa·s or higher, and even more preferably 30 Pa·s or higher.

[0025] Viscosity η measured by the method described above 0.5(T0) The pressure is preferably 450 Pa·s or less, more preferably 400 Pa·s or less, and even more preferably 350 Pa·s or less.

[0026] Viscosity η measured by the method described above 5(T0)The pressure is preferably 2.0 Pa·s or higher, more preferably 3.0 Pa·s or higher, and even more preferably 5.0 Pa·s or higher.

[0027] Viscosity η measured by the method described above 5(T0) The pressure is preferably 100 Pa·s or less, more preferably 70 Pa·s or less, and even more preferably 50 Pa·s or less.

[0028] Viscosity η measured by the method described above 0.5(T1) The pressure is preferably 20 Pa·s or higher, more preferably 30 Pa·s or higher, and even more preferably 40 Pa·s or higher.

[0029] Viscosity η measured by the method described above 0.5(T1) The pressure is preferably 500 Pa·s or less, more preferably 450 Pa·s or less, and even more preferably 400 Pa·s or less.

[0030] Viscosity η measured by the method described above 5(T1) The pressure is preferably 3.0 Pa·s or higher, more preferably 5.0 Pa·s or higher, and even more preferably 7.0 Pa·s or higher.

[0031] Viscosity η measured by the method described above 5(T1) The pressure is preferably 120 Pa·s or less, more preferably 80 Pa·s or less, and even more preferably 60 Pa·s or less.

[0032] The viscosity change rate Δη is given by the following formula (1). 0.5 Let's assume that. Δη 0.5 =(η 0.5(T1) -η 0.5(T0) ) / η 0.5(T0) (1)

[0033] Δη 0.5 It is greater than 0, preferably 0.02 or more, and more preferably 0.05 or more.

[0034] Δη 0.5If the value is above the lower limit mentioned above, excessive flow of the conductive paste dispensed onto the substrate is suppressed. This suppresses the reduction of BLT.

[0035] Δη 0.5 It is 0.20 or less, preferably 0.15 or less, and more preferably 0.10 or less.

[0036] Δη 0.5 When this value is below the upper limit mentioned above, the conductive paste dispensed onto the substrate will flow appropriately. This further improves the leveling properties of the conductive paste.

[0037] The viscosity change rate Δη5 is defined as the value shown in equation (2) below. Δη5=(η 5(T1) -η 5(T0) )η 5(T0) (2)

[0038] Δη5 is greater than 0, preferably 0.02 or greater, and more preferably 0.05 or greater.

[0039] When Δη5 is above the lower limit, excessive flow of the conductive paste dispensed onto the substrate is suppressed. This suppresses the reduction of BLT.

[0040] Δη5 is 0.20 or less, preferably 0.15 or less, and more preferably 0.10 or less.

[0041] When Δη5 is below the above upper limit, the conductive paste dispensed onto the substrate flows appropriately. This further improves the leveling properties of the conductive paste.

[0042] The proportion of silver particles in the conductive paste for the slit nozzle according to this embodiment is denoted as FC (Filler Content) (mass%). The proportion of components other than silver particles, as shown in the following formula (3), is denoted as RC (Resin Content) (mass%). RC = 100 - FC (3)

[0043] Δη 0.5 / RC is preferably greater than 0, more preferably 0.002 or greater, and even more preferably 0.005 or greater.

[0044] Δη 0.5 When / RC is above the lower limit, excessive flow of the conductive paste dispensed onto the substrate is suppressed. This suppresses the reduction of BLT.

[0045] Δη 0.5 / RC is preferably 0.010 or less, more preferably 0.008 or less, and even more preferably 0.007 or less.

[0046] Δη 0.5 When / RC is below the above upper limit, the conductive paste dispensed onto the substrate flows appropriately. This further improves the leveling properties of the conductive paste.

[0047] Δη5 / RC is preferably greater than 0, more preferably 0.002 or greater, and even more preferably 0.005 or greater. This suppresses excessive flow of the conductive paste discharged onto the substrate when Δη5 / RC is above the lower limit. As a result, the reduction of BLT is suppressed.

[0048] Δη5 / RC is preferably 0.010 or less, more preferably 0.008 or less, and even more preferably 0.007 or less. This allows the conductive paste dispensed onto the substrate to flow appropriately. This further improves the leveling properties of the conductive paste.

[0049] η 0.5(T0) / η 5(T0) TI (T0) Let's assume that. η 0.5(T0) and η 5(T0) When the difference is large, that is, when the thixotropic effect is large, TI (T0) It will get bigger.

[0050] TI (T0) This is preferably 1.0 or higher, more preferably 2.0 or higher, and even more preferably 4.0 or higher. This further improves the thixotropic effect, resulting in a higher degree of balance between suppressing liquid dripping when the jet dispenser is stationary and ensuring good dispensing performance when the jet dispenser is being dispensed.

[0051] TI (T0) This is preferably 10.0 or less, more preferably 8.0 or less, and even more preferably 7.0 or less.

[0052] η 0.5(T1) / η 5(T1) TI (T1) Let's assume that. η 0.5(T1) and η 5(T1) When the difference is large, that is, when the thixotropic effect is large, TI (T1) It will get bigger.

[0053] TI (T1) This is preferably 1.0 or higher, more preferably 2.0 or higher, and even more preferably 4.0 or higher. This further improves the thixotropic effect, resulting in a higher degree of balance between suppressing liquid dripping when the jet dispenser is stationary and ensuring good dispensing performance when the jet dispenser is being dispensed.

[0054] TI (T1) This is preferably 10.0 or less, more preferably 8.0 or less, and even more preferably 7.0 or less.

[0055] <Manufacturing characteristics> The conductive paste for slit nozzles of this embodiment can be manufactured, for example, by thoroughly mixing components other than silver-containing particles beforehand, then adding silver-containing particles, and further mixing. By manufacturing in this manner, it becomes easy to adjust the type and content of silver-containing particles. Specifically, after adjusting the components other than silver-containing particles, it becomes possible to check their rheology and then adjust the type and content of silver-containing particles.

[0056] <Each Component> Hereinafter, each component contained in the conductive paste for jet dispensing according to the present embodiment will be described.

[0057] (Silver-Containing Particles) The conductive paste for slit nozzles according to the present embodiment contains silver-containing particles.

[0058] After the adhesive layer 10 is formed from the conductive paste for jet dispensing according to the present embodiment, when the paste cures, the silver-containing particles aggregate to form a sintered structure (interconnected particle structure). This sintered structure develops electrical conductivity, thermal conductivity, and adhesiveness to substrates.

[0059] The volume-based median diameter D of the silver-containing particles measured by laser diffraction scattering method 50 is preferably 1.0 μm or more, more preferably 1.5 μm or more, and still more preferably 2.0 μm or more.? 50 When D is not less than the above lower limit, excessive increase in the specific surface area of the silver-containing particles can be suppressed, and a decrease in thermal conductivity caused by contact thermal resistance can be suppressed.

[0060] The volume-based median diameter D of the silver-containing particles measured by laser diffraction scattering method 50 is preferably 15.0 μm or less, more preferably 14.0 μm or less, and still more preferably 13.0 μm or less.? 50 When D is not more than the above upper limit, the fluidity of the paste after discharge can be made more appropriate. In addition,? 50 when D is not more than the above upper limit, the formation of the sintered structure between silver-containing particles can be promoted.

[0061] The volume-based median diameter D of the silver-containing particles measured by laser diffraction scattering method 50 can be obtained, for example, by performing wet measurement using a flow particle image analyzer FPIA (registered trademark)-3000 manufactured by Sysmex Corporation, and performing particle image measurement.

[0062] The specific surface area of the silver-containing particles is preferably 0.1 m 2 / g or more and 5.0 m 2 / g or less, more preferably 0.2 m 2 / g or more and 4.0 m 2 / g or less, still more preferably 0.3 m 2 / g or more and 3.0 m 2 / g or less.

[0063] The tap density of the silver-containing particles is preferably 1.0 g / cm 3 or more and 10.0 g / cm 3 or less, more preferably 1.5 g / cm 3 or more and 8.5 g / cm 3 or less, still more preferably 2.0 g / cm 3 or more and 7.0 g / cm 3 or less. The tap density of silver-containing particles can be measured in accordance with ISO 3953-1985(E) "Metallic powders - Determination of tap density".

[0064] When the total amount of the conductive paste for slit nozzles is taken as 100 parts by mass, the content of the silver-containing particles is preferably 70 parts by mass or more, more preferably 80 parts by mass or more, and still more preferably 90 parts by mass or more. When the content of the silver-containing particles is not less than the above lower limit, the electrical conductivity and thermal conductivity of the adhesive layer formed from the conductive paste for slit nozzles according to the present embodiment are further improved.

[0065] When the total amount of the conductive paste for slit nozzles is taken as 100 parts by mass, the content of the silver-containing particles is preferably 98 parts by mass or less, more preferably 97 parts by mass or less, and still more preferably 95 parts by mass or less. When the content of the silver-containing particles is not more than the above upper limit, the coating performance is further improved. In addition, when the content of the silver-containing particles is not more than the above upper limit, the adhesiveness of the adhesive layer formed from the conductive paste for slit nozzles according to the present embodiment to an adherend surface is further improved.

[0066] The shape of the silver-containing particles in this embodiment is not particularly limited, but examples include spherical, elliptical, flake-shaped, and flaky shapes. In this embodiment, it is preferable that the silver-containing particles include spherical particles. This improves the uniformity of aggregation of the silver-containing particles. Furthermore, from the viewpoint of reducing costs, an embodiment in which the silver-containing particles include flake-shaped particles can also be adopted. Moreover, from the viewpoint of improving the balance between cost reduction and aggregation uniformity, the silver-containing particles may include both spherical and flake-shaped particles.

[0067] The silver-containing particles may be (I) particles consisting substantially of silver only, or (II) particles consisting of silver and other components. Furthermore, (I) and (II) may be used in combination as the metal-containing particles.

[0068] (I) Examples of particles consisting substantially of only silver include silver particles.

[0069] (II) Examples of particles consisting of silver and components other than silver include silver-coated resin particles. Silver-coated resin particles are resin particles whose surface is coated with silver. Silver-coated resin particles have good thermal conductivity and are softer than particles consisting only of silver, so using silver-coated resin particles makes it easier to design the thermal conductivity and storage modulus to appropriate values.

[0070] In the case of silver-coated resin particles, it is sufficient for the silver layer to cover at least a portion of the surface of the resin particle. Of course, the entire surface of the resin particle may also be covered with silver.

[0071] Specifically, in silver-coated resin particles, the silver layer covers preferably 50% or more, more preferably 75% or more, and even more preferably 90% or more of the surface of the resin particles. Particularly preferably, in silver-coated resin particles, the silver layer covers substantially the entire surface of the resin particles. From another perspective, it is preferable that when silver-coated resin particles are cut at a certain cross-section, a silver layer is observed around the entire perimeter of that cross-section.

[0072] From another perspective, the mass ratio of resin to silver in the silver-coated resin particles is, for example, 90 / 10 to 10 / 90, preferably 80 / 20 to 20 / 80, and more preferably 70 / 30 to 30 / 70.

[0073] Examples of "resins" in silver-coated resin particles include silicone resin, (meth)acrylic resin, phenolic resin, polystyrene resin, melamine resin, polyamide resin, and polytetrafluoroethylene resin. Of course, other resins may also be used. Furthermore, only one type of resin may be used, or two or more types of resins may be used in combination. From the viewpoint of elastic properties and heat resistance, silicone resin or (meth)acrylic resin is preferred as the resin.

[0074] Furthermore, (II) of the particles consisting of silver and components other than silver, silver-coated resin particles can be obtained from, for example, Mitsubishi Materials Corporation, Sekisui Chemical Co., Ltd., Sanno Co., Ltd., etc.

[0075] The conductive paste for the slit nozzle according to this embodiment comprises an epoxy monomer or epoxy resin.

[0076] (Epoxy compound) The conductive paste for slit nozzles according to this embodiment contains an epoxy compound having one or more epoxy groups in its molecule.

[0077] Examples of monofunctional epoxy compounds having only one epoxy group in the molecule include t-butylphenylglycidyl ether, m,p-cresylglycidyl ether, and phenylglycidyl ether.

[0078] Examples of polyfunctional epoxy compounds having two or more epoxy groups in the molecule include bisphenol compounds such as bisphenol A, bisphenol F, and biphenol, or derivatives thereof that have been epoxidized; Hydrogenated bisphenol A, hydrogenated bisphenol F, hydrogenated biphenol, cyclohexanediol, cyclohexanedimethanol, cyclohexanedimethanol, and other alicyclic diols or their derivatives epoxidized; Epoxy compounds of aliphatic diols such as butanediol, hexanediol, octanediol, nonanediol, and decanediol, or their derivatives; Compounds having a trimethylolpropane skeleton, a trihydroxyphenylmethane skeleton, or an aminophenol skeleton, or derivatives thereof, epoxidized; Examples include phenol novolac resins, cresol novolac resins, phenol aralkyl resins, biphenyl aralkyl resins, naphthol aralkyl resins, or polyfunctional derivatives thereof that have been epoxidized.

[0079] For example, 1,4-bis[(oxiran-2-ylmethoxy)methyl]cyclohexane is an example of an epoxidized derivative of a diol containing cyclohexanedimethanol.

[0080] When using epoxy compounds, one type may be used alone, or two or more types may be used in combination.

[0081] The amount of epoxy compound is preferably 1 part by mass or more, more preferably 2 parts by mass or more, and even more preferably 5 parts by mass or more, when the total amount of conductive paste for the slit nozzle is 100 parts by mass.

[0082] The amount of epoxy compound is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and even more preferably 10 parts by mass or less, when the total amount of conductive paste for the slit nozzle is 100 parts by mass.

[0083] The molecular weight of the epoxy compound in this embodiment is preferably 150 or more, more preferably 160 or more, and even more preferably 180 or more.

[0084] The molecular weight of the epoxy compound in this embodiment is preferably 2000 or less, more preferably 1000 or less, and even more preferably 600 or less.

[0085] (Other ingredients) The conductive paste for the slit nozzle according to this embodiment may contain silver particles and components other than epoxy monomer or epoxy resin.

[0086] • (meth)acrylic monomer The conductive paste for slit nozzles according to this embodiment contains a (meth)acrylic monomer. In this embodiment, a (meth)acrylic monomer is a monomer having a (meth)acryloyl group.

[0087] In this embodiment, the (meth)acrylic monomer reacts with other components in the paste after the adhesive layer 10 is formed by the conductive paste for jet dispensing, through heat treatment during paste curing, etc. This further strengthens the fixation by the adhesive layer 10.

[0088] The (meth)acrylic monomer according to this embodiment may be a monofunctional (meth)acrylic monomer having one (meth)acrylic group in its structure, a bifunctional (meth)acrylic monomer having two (meth)acrylic groups in its structure, or a trifunctional or more (meth)acrylic monomer having three or more (meth)acrylic groups in its structure.

[0089] Examples of monofunctional (meth)acrylic monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, butoxyethyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, heptyl (meth)acrylate, octylheptyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate. Aliphatic (meth)acrylates such as acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, stearyl (meth)acrylate, behenyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and phenoxypolyethylene glycol (meth)acrylate; Alicyclic (meth)acrylates such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 1,4-cyclohexanedimethanol mono(meth)acrylate, cyclopentyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, 3-methyl-3-oxetanylmethyl (meth)acrylate, and 1-adamantyl (meth)acrylate; Aromatic (meth)acrylates such as phenyl(meth)acrylate, 2-phenoxyethyl(meth)acrylate, nonylphenyl(meth)acrylate, p-cumylphenyl(meth)acrylate, o-biphenyl(meth)acrylate, 1-naphthyl(meth)acrylate, 2-naphthyl(meth)acrylate, benzyl(meth)acrylate, 2-hydroxy-3-phenoxypropyl(meth)acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl(meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl(meth)acrylate, and 2-hydroxy-3-(2-naphthoxy)propyl(meth)acrylate; Heterocyclic (meth)acrylates such as 2-tetrahydrofurfuryl (meth)acrylate, N-(meth)acryloyloxyethyl hexahydrophthalimide, and 2-(meth)acryloyloxyethyl-N-carbazole These are some examples.

[0090] Examples of difunctional (meth)acrylic monomers include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, and 1,3-butanediol. Aliphatic di(meth)acrylates such as 2-methyl-1,3-propanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, hexane-1,6-diol bis(2-methyl acrylate), 2-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and glycerin di(meth)acrylate; Alicyclic di(meth)acrylates such as cyclohexanedimethanol di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, hydrogenated bisphenol A di(meth)acrylate, and hydrogenated bisphenol F di(meth)acrylate; Aromatic di(meth)acrylates such as bisphenol A di(meth)acrylate, bisphenol F di(meth)acrylate, bisphenol AF di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, and fluorene-type di(meth)acrylate; Heterocyclic di(meth)acrylates such as isocyanuric acid di(meth)acrylate These are some examples.

[0091] Examples of trifunctional or more (meth)acrylic monomers include aliphatic (meth)acrylates such as trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and ethoxylated glycerin tri(meth)acrylate; Examples include heterocyclic (meth)acrylates such as isocyanuric acid tri(meth)acrylate.

[0092] When using (meth)acrylic monomers, one type may be used alone, or two or more types may be used in combination.

[0093] The amount of (meth)acrylic monomer is preferably 1 part by mass or more, more preferably 2 parts by mass or more, and even more preferably 5 parts by mass or more, when the total amount of conductive paste for slit nozzles is 100 parts by mass. This results in a better balance of performance such as heat cycle resistance and adhesion to the adherend.

[0094] The amount of (meth)acrylic monomer is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and even more preferably 10 parts by mass or less, when the total amount of conductive paste for slit nozzles is 100 parts by mass.

[0095] The molecular weight of the (meth)acrylic monomer in this embodiment is preferably 150 or more, more preferably 160 or more, and even more preferably 180 or more.

[0096] The molecular weight of the (meth)acrylic monomer in this embodiment is preferably 1000 or less, more preferably 800 or less, and even more preferably 600 or less.

[0097] • Hardener The conductive paste according to this embodiment preferably further contains a curing agent. This allows the epoxy monomer or epoxy resin to be cured.

[0098] Examples of curing agents in this embodiment include phenolic curing agents and imidazole curing agents.

[0099] Examples of phenolic curing agents include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, bisphenol novolac resin, and phenol-biphenyl novolac resin; polyvinylphenol; polyfunctional phenolic resins such as triphenylmethane-type phenolic resin; modified phenolic resins such as terpene-modified phenolic resin and dicyclopentadiene-modified phenolic resin; phenol aralkyl-type phenolic resins such as phenol aralkyl resin having a phenylene skeleton and / or biphenylene skeleton, and naphthol aralkyl resin having a phenylene and / or biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F (dihydroxydiphenylmethane); and compounds having a biphenylene skeleton such as biphenol.

[0100] Examples of imidazole-based curing agents include 2-phenyl-1H-imidazole-4,5-dimethanol, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazole, 2-phenylimidazole, 2,4-diamino-6-[2-methylimidazolyl-(1)]-ethyl-s-triazine, 2-undecylimidazole, 2-heptadecylimidazole, 2,4-diamino-6-[2-methylimidazolyl-(1)]-ethyl-s-triazine isocyanurate adduct, 2-phenylimidazole isocyanurate adduct, 2-methylimidazole isocyanurate adduct, 1-cyanoethyl-2-phenylimidazolium trimellitate, and 1-cyanoethyl-2-undecylimidazolium trimellitate.

[0101] Other curing agents include, for example, phosphorus-containing compounds such as organophosphines, tetrasubstituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds; and nitrogen-containing compounds such as dicyandiamide, 1,8-diazabicyclo[5.4.0]undecene-7, amidines and tertiary amines such as benzyldimethylamine, and their quaternary ammonium salts.

[0102] When using a hardening agent, you may use only one type, or you may use two or more types in combination.

[0103] The amount of hardening agent is, for example, 0.05 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, when the total amount of conductive paste for the slit nozzle is 100 parts by mass.

[0104] • Radical polymerization initiator The conductive paste according to this embodiment preferably further contains a radical polymerization initiator. This allows the (meth)acrylic monomer to be cured.

[0105] Examples of radical polymerization initiators include azo compounds and peroxides. Of the above specific examples, the use of peroxides is preferred.

[0106] Examples of the above-mentioned peroxides include organic peroxides such as diacyl peroxides, dialkyl peroxides, and peroxyketals, and more specifically, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; Peroxyketals such as 1,1-di(t-butylperoxy)cyclohexane and 2,2-di(4,4-di(t-butylperoxy)cyclohexyl)propane; Hydroperoxides such as p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; Dialkyl peroxides such as bis(1-phenyl-1-methylethyl)peroxide, di(2-t-butylperoxyisopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylcumyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexine-3, and di-t-butyl peroxide; Diacyl peroxides such as dibenzoyl peroxide and di(4-methylbenzoyl) peroxide; Peroxydicarbonates such as di-n-propyl peroxydicarbonate and diisopropyl peroxydicarbonate; Examples include peroxyesters such as 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-hexylperoxybenzoate, t-butylperoxybenzoate, and t-butylperoxy2-ethylhexanoate. Furthermore, compounds having two or more peroxy groups in one molecule, such as 1,1-bis(1,1-dimethylethylperoxy)cyclohexane, can also be cited.

[0107] When using radical polymerization initiators, one type may be used alone, or two or more types may be used in combination.

[0108] The amount of radical polymerization initiator is, for example, 0.1 to 10 parts by mass, preferably 0.5 to 5 parts by mass, when the total amount of conductive paste for the slit nozzle is 100 parts by mass.

[0109] • Silane coupling agent The conductive paste according to this embodiment preferably further contains a silane coupling agent. This can improve the adhesive strength.

[0110] Examples of silane coupling agents include well-known silane coupling agents, specifically vinylsilanes such as vinyltrimethoxysilane and vinyltriethoxysilane; Epoxysilanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; Styrylsilanes such as p-styryltrimethoxysilane; Methacrylsilanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane; (Meth)acrylsilanes such as 3-(trimethoxysilyl)propyl methacrylate and 3-acryloxypropyltrimethoxysilane; Aminosilanes such as N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, and trimethoxy[3-(phenylamino)propyl]silane; Isocyanurate silane; Alkylsilane; Ureidosilanes such as 3-ureidopropyltrialkoxysilane; Mercaptosilanes such as 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, and bis[3-(triethoxysilyl)propyl]polysulfide; Examples include isocyanate silanes such as 3-isocyanatetopropyltriethoxysilane.

[0111] When using silane coupling agents, one type may be used alone, or two or more types may be used in combination.

[0112] If the conductive paste of this embodiment contains a silane coupling agent, the amount is, for example, 0.1 to 10 parts by mass, preferably 0.5 to 5 parts by mass, when the total amount of the conductive paste is 100 parts by mass.

[0113] The conductive paste according to this embodiment may optionally contain one or more components such as a solvent; a resin component such as (meth)acrylic resin, silicone resin, allyl ester resin, or polybutadiene (hereinafter sometimes referred to as "other resins"); an inorganic filler such as silica or alumina; a thixotropic modifier such as fine silica; an antioxidant; a dispersant; an antifoaming agent; a leveling agent; or a fatty acid or fatty acid ester. The proportions of these components can be appropriately set according to the application in which the conductive paste is to be used.

[0114] The conductive paste according to this embodiment can be obtained by mixing the above-mentioned components and, if necessary, other components using conventionally known methods.

[0115] <blt> The conductive paste for slit nozzles according to the present invention suppresses excessive flow after dispensing.

[0116] BLT can be used as an indicator of the flowability of conductive paste. BLT stands for Bond Line Thickness (thickness in the lamination direction of the adhesive layer), and if the BLT is smaller than the set height of the slit nozzle, it indicates that the conductive paste is flowing. In other words, if the conductive paste does not flow at all, the BLT will be equal to the set height of the slit nozzle, so if the BLT is smaller than that, it means that the conductive paste is flowing. In this embodiment, the thickness of the conductive paste dispensed from the slit nozzle onto the substrate is measured, and this value is defined as BLT.

[0117] In this embodiment, the BLT of the conductive paste is preferably 42.0 μm or more, more preferably 43.0 μm or more, and even more preferably 44.0 μm or more, when the coating thickness is set to 50.0 μm. By ensuring that the BLT (Body Line Quantity) is above the lower limit mentioned above, excessive flow of the paste after dispensing is suppressed. This allows for the creation of even finer patterns with the paste. Furthermore, by ensuring that the BLT (Body Latency Tolerance) is above the lower limit mentioned above, the stress generated between the semiconductor chip and the substrate can be further reduced. This further reduces warping in the semiconductor package.

[0118] The BLT of the adhesive layer formed from the conductive paste according to this embodiment is preferably 57.0 μm or less, more preferably 56.5 μm or less, and even more preferably 56.0 μm or less, when the coating thickness is set to 50 μm. By keeping the BLT below the above upper limit, the thermal and electrical resistance of the semiconductor package can be further reduced. Furthermore, by keeping the BLT below the above upper limit, the thickness of the semiconductor package can be made even thinner. This contributes to the miniaturization of the final product on which the semiconductor package is mounted.

[0119] <Arithmetic mean roughness Ra and maximum height Rz> The arithmetic mean roughness Ra of the surface of the cured product formed from the conductive paste of this embodiment is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1.0 μm or more.

[0120] The arithmetic mean roughness Ra of the surface of the cured product formed from the conductive paste of this embodiment is preferably 14.0 μm or less, more preferably 12.0 μm or less, and even more preferably 10.0 μm or less. By keeping Ra below the above upper limit, defects originating from surface irregularities in the cured material are further prevented.

[0121] Ra can be measured in accordance with JIS B0601 1994.

[0122] The maximum surface height Rz of the cured product formed from the conductive paste of this embodiment is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1.0 μm or more.

[0123] The maximum surface height Rz of the cured product formed from the conductive paste of this embodiment is preferably 80 μm or less, more preferably 75 μm or less, and even more preferably 70 μm or less. By keeping Rz below the above upper limit, defects originating from surface irregularities in the cured material are further prevented.

[0124] Rz can be measured in accordance with JIS B0601 1994.

[0125] <Application> The conductive paste for slit nozzles in this embodiment suppresses excessive reduction of BLT. Therefore, the conductive paste for slit nozzles in this embodiment is advantageous for forming fine printing patterns and is particularly suitable for coating by the jet dispensing method using a slit nozzle.

[0126] Figure 2 shows an example of a slit nozzle. Figure 2(A) shows a bottom view, Figure 2(B) shows a side view, Figure 2(C) shows a rear view, and Figure 2(D) shows a front view.

[0127] Generally, the nozzle width of a slit nozzle is very fine, typically 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less.

[0128] The conductive paste for slit nozzles of this embodiment is preferably used when manufacturing MAP (Mold Array Package) molded products. In MAP molded products, multiple semiconductor elements are mounted on the substrate, and the conductive paste is used to form a fine and dense pattern. Therefore, it is preferable to use the conductive paste for slit nozzles of this embodiment, which is advantageous for forming fine printed patterns.

[0129] Furthermore, the conductive paste for slit nozzles in this embodiment is preferably used when a high degree of positional control is required for printing, such as when manufacturing molded products with diverse designs that include downset.

[0130] [Cured product] The cured product according to this embodiment is obtained by curing the above-mentioned conductive paste for slit nozzles.

[0131] For example, if the conductive paste for the slit nozzle described above is applied to a substrate to form an adhesive layer, a semiconductor element is mounted on the surface of the substrate via the adhesive layer, and the adhesive layer is hardened by a sintering process or the like, the hardened adhesive layer corresponds to the cured product of this embodiment.

[0132] [Method for applying conductive paste for slit nozzles] In the method for applying conductive paste for slit nozzles according to this embodiment, the conductive paste for slit nozzles described above is applied to the surface to be adhered to by a jet dispensing method.

[0133] The embodiments of the present invention have been described above, but these are merely examples, and various other configurations can also be adopted. [Examples]

[0134] The present invention will be described below with reference to examples and comparative examples, but the present invention is not limited thereto.

[0135] [Preparation of conductive paste for slit nozzles] A conductive paste for slit nozzles was prepared by uniformly mixing each component according to the formulation shown in Table 1. The units for the content of each component in Table 1 are parts by mass.

[0136] The details of the components shown in Table 1 are as follows:

[0137] <Silver-containing particles> • Silver particles (1) (Flake-like, D 50 :5μm, specific surface area:2m 2 / g, tap density: 3g / cm³ 3 ) • Silver particles (2) (flake-like, D 50 :8.5μm, specific surface area: 0.45m 2 / g, tap density: 5g / cm³ 3 ) • Silver particles (3) (flake-like, D 50 :6.2μm, specific surface area: 0.3m 2 / g, tap density: 3.7g / cm³ 3 ) • Silver particles (4) (flake-like, D 50 :3.9μm, specific surface area: 0.75m 2 / g, tap density: 3.5g / cm³ 3 ) • Silver particles (5) (flake-like, D 50 :8μm, specific surface area: 0.27m 2 / g, tap density: 3.3g / cm³ 3 ) • Silver particles (6) (flake-like, D 50 :2.5μm, specific surface area: 1.1m 2 / g, tap density: 4.1g / cm³ 3 )

[0138] <Epoxy compounds> • Epoxy compound (1) (m,p-cresylglycidyl ether, molecular weight 165, epoxy equivalent 165) • Epoxy compound (2) (t-butylphenyl glycidyl ether, molecular weight 206, epoxy equivalent 210) • Epoxy compound (3) (bisphenol-F-diglycidyl ether, molecular weight 330, epoxy equivalent 165) • Epoxy compound (4) (bisphenol-F-diglycidyl ether, molecular weight 330, epoxy equivalent 170) • Epoxy compound (5) (Hydrogenated bisphenol A type liquid epoxy resin, molecular weight 353, epoxy equivalent 206)

[0139] <(meth)acryl monomer> • (Meth)acrylic monomer (1) (1,4-cyclohexanedimethanol monoacrylate, manufactured by Mitsubishi Chemical Holdings Corporation, product name: CHDMMA)

[0140] <Hardening agent> • Hardener (1) (Dihydroxydiphenylmethane) • Hardening agent (2) (2-phenyl-4-methyl-5-hydroxymethylimidazole) • Hardener (3) (2-phenyl-4,5-dihydroxymethylimidazole) • Hardener (4) (dicyandiamide)

[0141] <Radical polymerization initiator> • Radical polymerization initiator (1) (Bis(1-phenyl-1-methylethyl) peroxide, manufactured by Kayaku Nurion Co., Ltd., product name: PERCADOX® BC)

[0142] <Solvent> • Solvent (1) (N-butyl cellosolve acetate) • Solvent (2) (Tripropylene glycol mono-n-butyl ether)

[0143] [Viscosity measurement of conductive paste for slit nozzles] The viscosity of the obtained conductive paste for slit nozzles was measured using the following procedure. The results are shown in Table 2. The unit of viscosity shown in Table 2 is Pa·s. <Instructions> (1) The obtained conductive paste for the slit nozzle was set in the measuring section of the viscometer. A Brookfield DVNXHBCBG viscometer was used. (2) Rotate the viscometer at a shear rate of 0.5 rpm at 25°C, measure the viscosity 6 minutes after the start of rotation, and set the measured viscosity to η 0.5(T0) That's what I decided. (3) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is expressed as η 5(T0) That's what I decided. (4) Next, stop the viscometer and let it stand for 5 minutes. (5) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η 0.5(T1) That's what I decided. (6) Next, the rheometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is given by η 5(T1) That's what I decided.

[0144] Viscosity change rate Δη 0.5 The value was calculated using the following formula (1). The results are shown in Table 1. Δη 0.5 =(η 0.5(T1) -η 0.5(T0) ) / η 0.5(T0) (1)

[0145] The viscosity change rate Δη5 was calculated using the following formula (2). The results are shown in Table 1. Δη5=(η 5(T1) -η 5(T0) ) / η 5(T0) (2)

[0146] The proportion of silver particles in the conductive paste for the slit nozzle according to this embodiment was defined as FC (Filler Content) (mass%). In addition, the proportion of components other than silver particles, as shown in the following formula (3), was defined as RC (Resin Content) (mass%). RC = 100 - FC (3)

[0147] Δη 0.5 Table 1 shows the values ​​for / RC and Δη5 / RC.

[0148] η 0.5(T0) / η 5(T0) TI (T0) The results are shown in Table 1.

[0149] η 0.5(T1) / η 5(T1) TI (T1) The results are shown in Table 1.

[0150] [Application using the slit nozzle method] For each of the examples and comparative examples, the obtained conductive paste for the slit nozzle was filtered through a 150-mesh filter and filled into a syringe. Next, a slit nozzle (manufactured by Musashi Engineering Co., Ltd., nozzle width 100 μm) was attached to the syringe, and then attached to a dispenser (model name: ML-5000XII, manufactured by Musashi Engineering Co., Ltd.). The slit nozzle height (nozzle-substrate distance) was set to 50 μm, and the paste was applied to a substrate (material: Cu) at a discharge rate of 100 gf, a discharge time of 100 ms, and at room temperature.

[0151] [Measurement using a laser microscope] The Bond Line Thickness (BLT), Ra (arithmetic mean roughness), and Rz (maximum height) of the conductive paste for slit nozzles applied to the substrate were measured within one hour of application using a laser microscope (Keyence Corporation, model: VK-X1100). The results are shown in Table 1.

[0152] [Table 1]

[0153] The BLT of the conductive paste according to the example was greater than that of the conductive paste according to the comparative example. This indicates that excessive flow was suppressed after dispensing in the conductive paste for the slit nozzle according to this embodiment. [Explanation of Symbols]

[0154] 10 Adhesive layer 20 Semiconductor elements 30 circuit boards 40 Bonding Wires 50 mold resin 60 Solder Balls 100 Semiconductor Equipment< / blt>

Claims

1. Silver-containing particles and An epoxy compound having one or more epoxy groups in its molecule, A conductive paste for a slit nozzle, comprising: The viscosity change rate Δη is shown in the following equation (1). ０．５ It is greater than 0 and less than or equal to 0.

20. The silver-containing particles are flake-shaped silver particles, The volume-based median diameter D50 of the silver-containing particles determined by laser diffraction scattering is 1.0 μm or more and 15.0 μm or less. The content of the silver-containing particles is 80 parts by mass or more and 98 parts by mass or less when the total amount of the conductive paste for the slit nozzle is 100 parts by mass. A conductive paste for slit nozzles, wherein the molecular weight of the epoxy compound is 150 or more and 2000 or less. See you later. ０．５ =(the ０．５（Ｔ１） -or ０．５（Ｔ０） ) / or ０．５（Ｔ０） (1) In formula (1), η ０．５（Ｔ０） and η ０．５（Ｔ１） This is measured using the following procedure. <Instructions> (i) Place the conductive paste for the slit nozzle into the measuring section of the viscometer. (ii) At 25°C, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation. The measured viscosity is then expressed as η ０．５（Ｔ０） Let's assume that. (iii) Next, the viscometer is rotated at a shear rate of 5 rpm, the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is η ５（Ｔ０） . (iv) Next, stop the viscometer and let it stand for 5 minutes. (v) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η ０．５（Ｔ１） Let's assume that. (vi) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is expressed as η ５（Ｔ１） Let's assume that.

2. Silver-containing particles and An epoxy compound having one or more epoxy groups in its molecule, A conductive paste for a slit nozzle, comprising: The viscosity change rate Δη is shown in equation (2) below. ５ It is greater than 0 and less than or equal to 0.

20. The silver-containing particles are flake-shaped silver particles, The volume-based median diameter D50 of the silver-containing particles determined by laser diffraction scattering is 1.0 μm or more and 15.0 μm or less. The content of the silver-containing particles is 80 parts by mass or more and 98 parts by mass or less when the total amount of the conductive paste for the slit nozzle is 100 parts by mass. A conductive paste for slit nozzles, wherein the molecular weight of the epoxy compound is 150 or more and 2000 or less. See you later. ５ =(the ５（Ｔ１） -or ５（Ｔ０） ) / or ５（Ｔ０） (2) In formula (2), η ５（Ｔ０） and η ５（Ｔ１） This is measured using the following procedure. <Instructions> (i) Set the conductive paste for the slit nozzle into the measuring section of the viscometer. (ii) At 25°C, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation. The measured viscosity is then expressed as η ０．５（Ｔ０） Let's assume that. (iii) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is η ５（Ｔ０） Let's assume that. (iv) Next, stop the viscometer and let it stand for 5 minutes. (v) Next, the viscometer is rotated at a shear rate of 0.5 rpm, and the viscosity is measured 6 minutes after the start of rotation, and the measured viscosity is expressed as η ０．５（Ｔ１） Let's assume that. (vi) Next, the viscometer is rotated at a shear rate of 5 rpm, and the viscosity is measured 2 minutes after the start of rotation, and the measured viscosity is expressed as η ５（Ｔ１） Let's assume that.

3. A conductive paste for a slit nozzle according to claim 1 or 2, η ０．５（Ｔ０） / η ５（Ｔ０） The thixotropic index TI is shown by （Ｔ０） A conductive paste for slit nozzles, wherein the coefficient of the material is between 1.0 and 10.

0.

4. A conductive paste for a slit nozzle according to claim 1 or 2, η ０．５（Ｔ１） / η ５（Ｔ１） The thixotropic index TI is shown by （Ｔ１） A conductive paste for slit nozzles, wherein the coefficient of the material is between 1.0 and 10.

0.

5. A conductive paste for a slit nozzle according to claim 1 or 2, Furthermore, a conductive paste for slit nozzles containing (meth)acrylic monomer.

6. A cured product obtained by curing the conductive paste for a slit nozzle according to claim 1 or 2.

7. A method for applying a conductive paste for a slit nozzle, comprising applying the conductive paste for a slit nozzle described in claim 1 or 2 to a surface to be adhered to by a jet dispensing method.

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