Electronic component manufacturing apparatus and electronic component manufacturing method

Abstract

To provide a manufacturing apparatus of an electronic component, capable of reducing a lamination time.SOLUTION: A manufacturing apparatus (100) of an electronic component, comprises: a crimp head (130) having a crimp surface for transferring a ceramic green sheet (20); and a plurality of lamination tables (110a, 110b, 110c, 110d, and 110e) that laminate the ceramic green sheet (20) transferred. In the manufacturing apparatus (100), a lamination area (L) where the ceramic green sheet (20) is laminated onto the lamination table (110) is included. In the lamination area (L), the plurality of lamination tables (110a and 110b) are closely arranged.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic component manufacturing apparatus and an electronic component manufacturing method.

Background Art

[0002] There is known a method for mass-producing small electronic components at one time, in which ceramic green sheets obtained by forming an unfired ceramic material into a sheet shape are laminated, pressure-formed, and then fired and singulated.

[0003] As a method for manufacturing such an electronic component, for example, Patent Document 1 discloses a method in which a green sheet is conveyed while a ceramic sheet is held by a holding means, and an intermediate portion of the green sheet is bent along an edge of a blade member to peel the ceramic green sheet from a carrier film and laminate the ceramic green sheet on a lamination stage.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0005] In the method described in Patent Document 1, ceramic sheets are sequentially laminated onto a single lamination stage using a lamination head. Therefore, there has been room for reducing the lamination time per one lamination unit. Furthermore, in order to laminate ceramic green sheets using the method described in Patent Document 1, it is necessary to pre-arrange all the ceramic green sheets constituting the laminate on the holding means in the order in which they will be laminated. On the other hand, it is rare for two or more layers of ceramic green sheets with the same pattern to be laminated consecutively. Therefore, it is necessary to arrange ceramic green sheets with different patterns side by side on the holding means, but such ceramic green sheets are not suitable for mass production, and there was a problem in that it was difficult to reduce the time and cost required for manufacturing.

[0006] This invention was made to solve the above-mentioned problems and aims to provide an electronic component manufacturing apparatus that can shorten the lamination time. [Means for solving the problem]

[0007] The present invention relates to an electronic component manufacturing apparatus comprising a crimping head having a crimping surface for conveying ceramic green sheets, and a plurality of stacking tables for stacking the conveyed ceramic green sheets, wherein the apparatus has a stacking area for stacking ceramic green sheets on the stacking tables, and within the stacking area, the plurality of stacking tables are arranged in close proximity. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a manufacturing apparatus for electronic components that can shorten the lamination time. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic diagram illustrating an example of a manufacturing apparatus for electronic components according to the present invention. [Figure 2] Figure 2 is a magnified side view of the area near the stacking area. [Figure 3] Figure 3 is a cross-sectional view taken along the line A-A' in Figure 1. [Figure 4] Figure 4 is a schematic cross-sectional view showing another example of a stacking table. [Figure 5] Figure 5 shows an example of a method for cutting a ceramic green sheet. [Figure 6] Figure 6 is a schematic cross-sectional view showing another example of a crimping head. [Modes for carrying out the invention]

[0010] The manufacturing apparatus for electronic components of the present invention will be described below. However, the present invention is not limited to the following configuration, and can be modified and applied as appropriate without changing the essence of the invention. Furthermore, a combination of two or more of the individual desirable configurations of the present invention described below also constitutes the present invention.

[0011] In this specification, terms indicating relationships between elements (e.g., "opposite," "orthogonal," etc.) and terms indicating the shape of elements (e.g., "cuboid," etc.) do not represent only strict meanings, but also include a substantially equal range, such as differences of a few percent.

[0012] The drawings shown below are schematic representations, and their dimensions, aspect ratios, and other scales may differ from those of the actual product.

[0013] [Manufacturing equipment for electronic components] The present invention relates to an electronic component manufacturing apparatus comprising a crimping head having a crimping surface for conveying ceramic green sheets, and a plurality of stacking tables for stacking the conveyed ceramic green sheets, wherein the apparatus has a stacking area for stacking ceramic green sheets on the stacking tables, and within the stacking area, the plurality of stacking tables are arranged in close proximity.

[0014] Figure 1 is a schematic diagram illustrating an example of a manufacturing apparatus for electronic components according to the present invention. The electronic component manufacturing apparatus 100 shown in Figure 1 includes a plurality of stacking tables 110a, 110b, 110c, 110d, and 110e for stacking ceramic green sheets.

[0015] The plurality of lamination tables 110a, 110b, 110c, 110d and 110e are all arranged to move along an annular (racetrack-shaped) conveying rail 120, and move clockwise (in the direction of the arrow shown on the conveying rail 120 in FIG. 1) on a circulating conveying path including a lamination area L and an unloading area E.

[0016] The shape of the conveying rail 120 is not necessarily an annular shape. For example, it may have a shape in which the terminal end and the start end are connected to form a circulation, or the terminal end and the start end may be disconnected.

[0017] In the electronic component manufacturing apparatus 100 shown in FIG. 1, the lamination tables 110a and 110b are arranged in the lamination area L. Further, the lamination table 110c is arranged in the unloading area E. Furthermore, the lamination tables 110d and 110e are arranged in areas other than the lamination area L and the unloading area E.

[0018] However, since each of the lamination tables 110a, 110b, 110c, 110d and 110e is conveyed along the conveying rail 120, the area where each lamination table is arranged is not limited to the area shown in FIG. 1, and changes sequentially.

[0019] Each lamination table can move smoothly along the conveying rail without bearings. A method for moving each lamination table along the conveying rail will be described later.

[0020] Next, the lamination area L will be described. In the lamination area L, ceramic green sheets are laminated on the lamination table.

[0021] The ceramic green sheets may be laminated directly on the lamination table, or may be laminated on a flat jig arranged on the lamination table.

[0022] In the electronic component manufacturing apparatus 100 shown in Figure 1, the stacking table 110a and the stacking table 110b are arranged in close proximity within the stacking area L.

[0023] In a stacking area, multiple stacking tables are considered "close" to each other if the shortest distance between them is 10 mm or less (including zero). "Close" also includes "touching." Therefore, it is preferable that two stacking tables placed close together in a stacking area are touching each other.

[0024] In the lamination area L, ceramic green sheets (not shown) are laminated on lamination tables 110a and 110b. The aggregate of ceramic green sheets laminated on the lamination table is also called a laminate.

[0025] The number of ceramic green sheets stacked on the stacking table as it passes through the stacking area L is not particularly limited; one ceramic green sheet may be stacked, or multiple ceramic green sheets may be stacked.

[0026] It is not necessary to sequentially stack ceramic green sheets on multiple adjacent stacking tables. For example, if the first stacking table and the second stacking table are located close together within the stacking area, the operation may be to stack 10 ceramic green sheets on the first stacking table and then stack 10 ceramic green sheets on the second stacking table, or the process of stacking 1 ceramic green sheet on the first table and then stacking 1 ceramic green sheet on the second stacking table may be repeated 10 times in a row.

[0027] In the lamination area, ceramic green sheets are transported by a crimping head and then stacked on a lamination table. An example of this process will be explained with reference to Figure 2.

[0028] Figure 2 is an enlarged cross-sectional view of the vicinity of the stacking area in the electronic component manufacturing apparatus shown in Figure 1. The process shown in Figure 2 is an example of a process in which, in the lamination area L, the ceramic green sheet 20 is peeled off from the raw material sheet 30 by the crimping head 130 and laminated onto the lamination table 110a.

[0029] Within the stacking area L, multiple stacking tables 110a and 110b are arranged and transported in a constant direction. The lamination tables 110a and 110b are flat. Therefore, the upper surfaces of the lamination tables 110a and 110b (the surfaces on which the ceramic green sheets 20 are laminated) are flat.

[0030] The raw material sheet 30 consists of a resin film 10 that serves as a support and a ceramic green sheet 20 placed on the resin film 10.

[0031] The raw material sheet 30 is unwound by an unwinding mechanism (not shown) and, while being wound up by a winding mechanism (not shown), is transported along the surface of a peeling stage 140 located in the lamination area L shown in Figure 2.

[0032] The raw material sheet 30 is transported along the surface of the peeling stage 140 from the upper left to the lower right of the paper, and then the transport direction is changed at the tip 140a of the peeling stage 140, and the sheet is transported from the right side to the left side of the paper. At this time, the ceramic green sheet 20 is adsorbed by the crimping head 130 and peeled off from the resin film 10 that makes up the raw material sheet 30.

[0033] In the lamination area L, the ceramic green sheet 20 is laminated onto the lamination table 110a in the following procedure. A peeling stage 140 is located in the lamination area L. The raw material sheet 30, which is being transported on the peeling stage 140, is first cut by the cutting means 150. The raw material sheet 30 is a long sheet formed by laminating a long resin film 10 having a predetermined width and a ceramic green sheet 20. The lamination order of the resin film 10 and the ceramic green sheet 20 is such that the resin film 10 is on the side that contacts the peeling stage 140, and the ceramic green sheet 20 is on the side that does not contact the peeling stage 140. The cutting means 150 extends in the width direction (front-to-back direction on the paper) of the raw material sheet 30, and its length is longer than the width direction of the ceramic green sheet 20. Therefore, by inserting the cutting means 150 to a position deeper than the thickness of the ceramic green sheet 20, the ceramic green sheet 20 is completely cut in the width direction. It is preferable that the cutting means 150 does not completely cut the resin film 10 in the thickness direction. Since the cut ceramic green sheet 20 is supported by the resin film 10, it is conveyed along the surface of the peeling stage 140 even after cutting.

[0034] Next, the cut ceramic green sheet 20 is adsorbed onto the crimping surface 130a by the crimping head 130.

[0035] The method for adsorbing the ceramic green sheet 20 with the crimping surface 130a of the crimping head 130 is not particularly limited, but one example is to provide a plurality of suction holes on the surface that will be the crimping surface, and while the crimping surface is in close contact with the surface of the ceramic green sheet 20, air is drawn in through the suction holes. Using this method, while air is being sucked in, the crimping surface 130a of the crimping head 130 adheres to the ceramic green sheet 20. On the other hand, when the air is released, it does not adhere to the ceramic green sheet 20. Therefore, the adsorption and detachment of the ceramic green sheet 20 can be controlled by whether or not air is drawn in.

[0036] The ceramic green sheet 20 is adsorbed by the crimping head 130 described above, and the crimping head 130 is transported in the direction in which the ceramic green sheet 20 would have originally moved. At the same time, the transport direction of the resin film 10 supporting the ceramic green sheet 20 adsorbed by the crimping head 130 is changed at the tip 140a of the peeling stage 140, thereby peeling the ceramic green sheet 20 adsorbed on the crimping surface 130a of the crimping head 130 from the resin film 10 that constitutes the raw material sheet 30. In Figure 2, the resin film 10 is transported to the left of the paper, but the cut ceramic green sheet 20 is attracted to the crimping head 130 and transported to the lower right of the paper, so the cut ceramic green sheet 20 is peeled off from the resin film 10.

[0037] Finally, the crimping head 130, which has the ceramic green sheet 20 attached, is moved onto the lamination table 110a. After the ceramic green sheet 20 comes into contact with the lamination table 110a, the suction of the crimping head 130 is released, and the crimping head 130 is moved off the lamination table 110a.

[0038] Through the above process, the ceramic green sheet 20 can be peeled from the surface of the raw material sheet 30 using the crimping head 130 and laminated onto the lamination table 110a.

[0039] Furthermore, when laminating the ceramic green sheet 20 onto the lamination table 110a using the crimping head 130, a slight force may be applied to the ceramic green sheet 20 to crimp it onto the lamination table 110a.

[0040] A similar process can be performed on the stacking table 110b.

[0041] The ceramic green sheet 20 may be unwound by the unwinding mechanism in a pre-cut state. In this case, the cutting means shown in Figure 2 is unnecessary.

[0042] In the lamination area L, multiple lamination tables 110a and 110b are arranged in close proximity. Therefore, the distance from the peeling area to each lamination table 110a and 110b is short, and the time required for the crimping head 40 to transport and laminate the ceramic green sheets 20 onto the lamination tables 110a and 110b is reduced.

[0043] Furthermore, within the stacking area L, three or more stacking tables may be placed in close proximity to each other. For example, when stacking tables A, B, and C are arranged within a stacking area, if stacking table A and B are close together, and stacking table B and C are also close together, then these three stacking tables A through C are considered to be in close proximity to each other. Therefore, there may be cases where stacking table A and stacking table C are not directly adjacent to each other.

[0044] Within the lamination area L, it is preferable that the lamination table and the crimping head are transported in the same direction in a direction substantially parallel to the crimping surface. In the lamination area L shown in Figure 2, when the ceramic green sheet 20, which has been adsorbed onto the crimping head 130, is laminated onto the lamination table 110a or 110b, the crimping surface 130a of the crimping head 130 is approximately parallel to the upper surface of the lamination table 110a or 110b (the surface on which the ceramic green sheet is laminated). At the moment the ceramic green sheets are stacked, the transport direction of the stacking tables 110a and 110b within the stacking area is from left to right on the paper. On the other hand, the transport direction of the crimping head 130 is from left to right on the paper, and coincides with the transport direction of the stacking tables 110a and 110b. Furthermore, this direction can be said to be approximately parallel to the crimping surface 130a.

[0045] The surface on which the ceramic green sheets are laminated on the lamination table is preferably flat. Therefore, the shape of the lamination table may be flat.

[0046] The crimping surface of the crimping head does not necessarily have to be flat; for example, it may be curved.

[0047] The crimping surface of the crimping head may have a coating layer, such as DLC (diamond-like carbon), formed on it, if necessary.

[0048] The number of crimping heads positioned within the lamination area may be one or multiple.

[0049] A camera may be placed within the lamination area. For example, the camera may be placed near the crimping head to read marks on the lamination table or ceramic green sheet and be used for alignment.

[0050] In addition to the method of drawing air through the holes mentioned above, another method for adsorbing the ceramic green sheet onto the surface of the crimping head is to use an electrical method.

[0051] The laminate, which consists of a predetermined number of ceramic green sheets, is removed from the lamination table in the removal area E.

[0052] The method for removing the laminate from the removal area E is not particularly limited, but one example is to remove it using a robotic arm or the like.

[0053] In the removal area E, the stacked object may be removed along with the stacking table, or only the stacked object may be removed. Furthermore, if a plate-shaped jig or the like is placed on the stacking table and the stacked object is stacked on top of the jig, the stacked object may be removed along with the jig.

[0054] Note that the laminate formed by stacking ceramic green sheets in the stacking area L is not necessarily removed in the removal area E. For example, a camera or the like may be installed in the retrieval area to identify markers or the like provided on the ceramic green sheets that make up the laminate, and to determine whether or not to remove the laminate.

[0055] If a stacking table is determined not to require removal of the stack in the retrieval area, it is transported back out of the retrieval area along the transport rail.

[0056] The laminated material removed in the extraction area is then compressed to form a mother block, which is then broken down into smaller pieces, fired, and external electrodes are formed to create an electronic component.

[0057] Next, we will explain how to move the stacking table along the transport rails. Figure 3 is a cross-sectional view taken along the line A-A' in Figure 1. As shown in Figure 3, the stacking table 110a is positioned on the transport rail 120 via a movable element 160. By moving the movable element 160 with a linear motor 170, the stacking table 110a connected to the movable element 160 can be operated independently. Furthermore, the stacking table 110a may be subjected to a downward pressing force by the aforementioned crimping head. To prevent deformation of the stacking table 110a in such cases, a support member 180 may be placed below the stacking table 110a.

[0058] Figure 4 is a schematic cross-sectional view showing another example of a stacking table. Figure 4 also shows an example where the stacking table is suspended to the side and below the transport rail. The stacking table 110f shown in Figure 4 is connected to the transport rail 120 via a movable element 161 with a crank-shaped cross-section. Therefore, the stacking table 110f is positioned not on the transport rail 120, but to the side and below the transport rail 120.

[0059] By moving the movable element 161 with the linear motor 170, the stacking table 110f connected to the movable element 161 can be transported independently of the other stacking tables. Furthermore, the stacking table 110f may be subjected to a downward pressing force by the aforementioned crimping head. To prevent deformation of the stacking table 110f in such cases, a support member 180 may be placed below the stacking table 110f.

[0060] Furthermore, since the movable element 161 shown in Figure 4 has a crank shape, when the movable element 161, the stacking table 110f, and the support member 180 are considered as a single rigid body, its center of gravity does not coincide with the linear motor 170 and the transport rail 120. For this reason, the shape of the movable element may be changed so that when the movable element, stacking table, and support are considered as a single rigid body, its center of gravity coincides with the linear motor and the rail. For example, the shape of the movable element may be such that it spans both sides in the width direction of the rail, with the stacking table and support placed on one side, and weights placed on the other side so that the overall center of gravity coincides with the linear motor and rail. If the center of gravity of the movable element, stacking table, support member and weights, when viewed as a single rigid body, coincides with the linear motor and rail, the stability when transporting the stacking table can be improved.

[0061] In the electronic component manufacturing apparatus of the present invention, the timing for cutting the ceramic green sheet is not limited to the timing shown in Figure 2. For example, after preparing the raw material sheet, the ceramic green sheet may be cut into a predetermined shape before being unwound by the unwinding mechanism. In this case, the ceramic green sheet unwound by the unwinding mechanism is pre-cut. In this case, as shown in Figure 2, the step of cutting the ceramic green sheet 20 that constitutes the raw material sheet 30 on the peeling stage 140 becomes unnecessary. In other words, in the above case, the electronic component manufacturing apparatus of the present invention does not need to include cutting means for cutting the ceramic green sheet into a specific shape.

[0062] The method for cutting the ceramic green sheet is not limited to the cutting method shown in Figure 2. Figure 5 shows an example of a method for cutting a ceramic green sheet. In Figure 2, the ceramic green sheet 20 was cut by a single cutting means 150 whose length in the width direction is longer than the width of the ceramic green sheet. However, as shown in Figure 5, for example, two or more cutting means 151 may be combined to cut the ceramic green sheet 20 into a predetermined shape. In this case as well, it is preferable not to completely cut the resin film 10 with the cutting means 150, similar to the case shown in Figure 2. Furthermore, although Figure 5 discloses a method for cutting the ceramic green sheet 20 using two cutting means, the number of cutting means is not particularly limited. The cutting may be performed by pressing a cutting blade having an overall rectangular shape (for example, a Thomson blade) against the ceramic green sheet, or by rotating a disc-shaped blade while pressing it against the ceramic green sheet. Furthermore, although the cutting means 151 shown in Figure 5 is single-edged, the cutting means may also be double-edged.

[0063] The method for cutting the ceramic green sheet is not limited to the method using the cutting blade described above; for example, it may also be cut using a laser or the like.

[0064] The shape of the crimping head is not limited to a flat plate shape; for example, it may be cylindrical. If the crimping head is cylindrical, the ceramic green sheet can be attached to the side of the crimping head (the side of the cylinder). Furthermore, by rotating the crimping head, the ceramic green sheet attached to the side of the crimping head can be transported.

[0065] For example, a raw material sheet, on which a ceramic green sheet cut to a predetermined shape is placed, can be brought close to the crimping head so that the surface of the ceramic green sheet faces the side of the crimping head, and at the moment the surface of the ceramic green sheet comes into contact with the side of the crimping head, the ceramic green sheet can be adsorbed by the crimping surface of the suction head, thereby peeling the ceramic green sheet from the raw material sheet.

[0066] After attaching the ceramic green sheet to the side of the crimping head using the method described above, if the crimping head is continuously rotated, the ceramic green sheet can be attached and transported along the side of the crimping head.

[0067] Furthermore, by moving the lamination table so that the ceramic green sheet adsorbed to the side of the crimping head comes into contact with the lamination table, and by releasing the adsorption of the crimping head the moment the ceramic green sheet adsorbed to the side of the crimping head comes into contact with the lamination table, the ceramic green sheet that was adsorbed to the surface of the crimping head can be moved to the surface of the lamination table.

[0068] In other words, by using a cylindrical crimping head, the transport path of the adsorbed ceramic green sheet is limited to a path along the side when the crimping head is rotated, but the rotational motion of the crimping head allows for continuous peeling and lamination of the ceramic green sheet. Therefore, by using a cylindrical crimping head, the lamination time for the ceramic green sheet can be shortened. In this case, it is preferable that the stacking table and the crimping head are conveyed in the same direction on a plane substantially parallel to the crimping surface.

[0069] Figure 6 is a schematic cross-sectional view showing an example of laminating ceramic green sheets using another example of a crimping head. Figure 6 is also an example of a lamination area where a cylindrical crimping head is positioned. In the lamination area shown in Figure 6, the crimping head 135 rotates counterclockwise, and the lamination tables 110a and 110b are transported in one direction from the left side to the right side of the paper so as to contact the lower end 135b of the crimping head. In the cylindrical crimping head 135, the side of the cylinder becomes the crimping surface 135a.

[0070] However, since the point that actually contacts the ceramic green sheet 20 is the lower end 135b of the crimping head 135, when considering the direction of the crimping surface, we consider it as the direction of the crimping surface 135a at the lower end 135b of the crimping surface 135a.

[0071] At the moment the crimping surface 135a of the crimping head 135 comes into contact with the lamination table 110a or 110b at its lower end 135b, the suction of the crimping head 135 is released, causing the ceramic green sheet 20 that was adsorbed to the crimping surface 135a of the crimping head 135 to be laminated onto the lamination table 110a or 110b.

[0072] As shown in Figure 6, by rotating the cylindrical crimping head 135 and adjusting the positional relationship between the crimping head 135 and the lamination tables 110a and 110b, as well as the transport paths of the lamination tables 110a and 110b, so that the lamination tables 110a and 110b and the crimping head 135 are transported in the same direction on a plane substantially parallel to the crimping surface 135a, it is possible to use a cylindrical crimping head to laminate ceramic green sheets held on the crimping surface of the crimping head onto the lamination table.

[0073] In this case, it is preferable that the transport speed of the crimping head and the transport speed of the lamination table are the same. In other words, it is preferable that the movement of the crimping surface of the crimping head and the movement of the lamination table are synchronized at the moment the ceramic green sheet is laminated onto the lamination table.

[0074] Furthermore, when the crimping head and the lamination table come into contact, the ceramic green sheet that has moved onto the lamination table may be crimped by applying a downward force to the crimping head or an upward force to the lamination table. By crimping the ceramic green sheet, misalignment can be prevented.

[0075] A ceramic green sheet is formed, for example, by coating a slurry containing ceramic particles made of Ba and Ti, a binder, a dispersant, etc., onto a resin film and drying it.

[0076] The coating method is not particularly limited, and various coating methods such as gravure coating and die coating can be used.

[0077] The thickness of the ceramic green sheet is not particularly limited, but is generally between 0.2 μm and 3.0 μm.

[0078] An internal electrode pattern may be printed on the surface of the ceramic green sheet, if necessary. A ceramic green sheet with an internal electrode pattern printed on it is also called an internal electrode sheet.

[0079] The internal electrode pattern can be formed by printing an internal electrode paste, which is a mixture of metal particles, a binder, an organic solvent, and a dispersant, onto a ceramic green sheet.

[0080] The printing method is not particularly limited, and various printing methods such as screen printing and gravure printing can be used.

[0081] The thickness of the internal electrode pattern is not particularly limited, but is generally between 0.1 μm and 1.0 μm.

[0082] The ceramic green sheet may be handled in a state where it is laminated on a support resin film (raw material sheet) and wound into a roll.

[0083] In this case, the film is unwound by the unwinding mechanism, cut into a predetermined shape in or near the peeling area, peeled from the surface of the resin film by the crimping head, and laminated onto the lamination table.

[0084] [Manufacturing methods for electronic components] The present invention provides a method for manufacturing electronic components, characterized by laminating ceramic green sheets using the electronic component manufacturing apparatus of the present invention.

[0085] The manufacturing apparatus for electronic components of the present invention can be used to shorten the lamination time of ceramic green sheets. Therefore, the method for manufacturing electronic components of the present invention can shorten the time required to manufacture electronic components.

[0086] This specification contains the following information:

[0087] This disclosure (1) includes a crimping head having a crimping surface for conveying a ceramic green sheet, An electronic component manufacturing apparatus comprising multiple stacking tables for stacking conveyed ceramic green sheets, The stacking area has a stacking area on the stacking table for stacking ceramic green sheets. The electronic component manufacturing apparatus is characterized in that multiple stacking tables are arranged in close proximity within the aforementioned stacking area.

[0088] Disclosure (2) is an electronic component manufacturing apparatus according to Disclosure (1), wherein a plurality of the stacking tables are arranged in contact with each other within the stacking area.

[0089] Disclosure (3) is an electronic component manufacturing apparatus according to Disclosure (1) or (2), wherein the plurality of stacking tables are arranged on a circulating transport path including the stacking area.

[0090] The present disclosure (4) is an electronic component manufacturing apparatus in any combination of the present disclosures (1) to (3), wherein within the stacking area, the stacking table and the crimping head are transported in the same direction in a plane substantially parallel to the crimping surface.

[0091] Disclosure (5) is a method for manufacturing an electronic component, characterized by laminating ceramic green sheets using an electronic component manufacturing apparatus described in any of Disclosures (1) to (4). [Explanation of symbols]

[0092] 10 Resin film 20 Ceramic Green Sheets 30 Raw material sheets 100 Electronic component manufacturing equipment 110a, 110b, 110c, 110d, 110e, 110f Stacking Table 120 transport rails 130, 135 crimping head Crimping surface of 130a and 135a crimping heads 135b Lower end of crimping head 140 Peeling Stage 140a Tip 150, 151 Cutting means 160, 161 Mover 170 Linear Motor 180 Support Member E Retrieval Area L Lamination Area

Claims

1. A crimping head equipped with a crimping surface for conveying ceramic green sheets, An electronic component manufacturing apparatus comprising multiple stacking tables for stacking conveyed ceramic green sheets, The stacking area has a stacking area on the stacking table for stacking ceramic green sheets. Within the aforementioned stacking area, multiple stacking tables are arranged in close proximity. Multiple stacking tables are arranged to move independently along transport rails, and move along a circular transport path including the stacking area. The crimping head is cylindrical in shape, and its side surface is the crimping surface. A ceramic green sheet cut to a predetermined shape is adsorbed onto the aforementioned pressure surface. By rotating the crimping head, the ceramic green sheet adsorbed to the crimping surface is conveyed. An electronic component manufacturing apparatus characterized in that, within the stacking area, a plurality of stacking tables and the crimping surface at the lower end of the crimping head are transported in the same predetermined direction, thereby stacking the cut ceramic green sheets held on the crimping surface of the crimping head one by one onto the plurality of stacking tables transported in the predetermined direction.

2. The electronic component manufacturing apparatus according to claim 1, wherein a plurality of the stacking tables are arranged in contact with each other within the stacking area.

3. A method for manufacturing an electronic component, characterized by laminating ceramic green sheets using the electronic component manufacturing apparatus described in claim 1.

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