Directional alignment device

JP7916839B2Active Publication Date: 2026-09-08MURATA MFG CO LTD
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Patent Information

Application Number
JP2023110820
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-07-05
Publication Date
2026-09-08
Estimated Expiration
2043-07-05

AI Technical Summary

Benefits of technology

【0007】 本発明によれば、積層体の積層方向が治具のXY面に垂直な方向になるように積層体の向きを揃えることができる方向整列装置を提供することができる。

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Abstract

To provide a direction alignment device capable of aligning directions of laminates in such a manner that a lamination direction of each laminate becomes vertical to an XY planes of a jig.SOLUTION: A direction alignment device 100 comprises: a retractable plate 110 which defines a plane including an X direction and a Y direction as a principal surface 112 and includes recesses 111 open in the principal surface 112; and a magnet 120 in which magnetic poles are disposed in a Z direction that is vertical to the X direction and the Y direction. Therein: the magnet 120 is moved to align, by a magnetic force of the magnet 120, directions of laminates 10 which are accommodated respectively in the recesses 111 of the retractable plate 110 and in each of which internal electrode layer are embedded; and the axis Z toward which polarity is directed inside of the magnet 120 is deviated from an axis in a lamination direction T of the laminate 10.SELECTED DRAWING: Figure 7
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Description

Technical Field

[0001] The present invention relates to an orientation aligning apparatus.

Background Art

[0002] Patent Document 1 describes a technique for aligning the lamination direction of a laminate in which internal electrodes are laminated. In this technique, since some processing is performed on the surface perpendicular to the lamination direction, mainly on the side surfaces, after the laminate is loaded into a jig, the direction is changed by a magnet so that the side surfaces face the Z-axis direction.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] With the technique of Patent Document 1, the orientation of the laminates can be aligned such that the lamination direction of the laminates is the same as the XY plane of the jig. However, it is not possible to align the orientation of the laminates such that the lamination direction of the laminates is perpendicular to the XY plane of the jig (the same direction as the Z-axis direction of the jig).

[0005] The present invention has been made to solve the above problem, and an object of the present invention is to provide an orientation aligning apparatus capable of aligning the orientation of laminates such that the lamination direction of the laminates is perpendicular to the XY plane of a jig.

Means for Solving the Problem

[0006] The orientation alignment device of the present invention comprises a swing plate having a plane including the X and Y directions as its main surface and a recess opening into the main surface, and a magnet with magnetic poles arranged in the Z direction perpendicular to the X and Y directions, wherein the magnet is moved and the orientation of a laminate with an embedded internal electrode layer housed in the recess of the swing plate is aligned by the magnetic force of the magnet, and the axis in which the polarity points within the magnet and the axis in the stacking direction of the laminate are misaligned. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a direction alignment device that can align the orientation of a laminate so that the stacking direction of the laminate is perpendicular to the XY plane of the jig. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic perspective view showing an example of a laminate. [Figure 2] Figure 2 is a schematic perspective view showing an example of a multilayer ceramic capacitor. [Figure 3] Figure 3 is a cross-sectional view of the multilayer ceramic capacitor shown in Figure 2, specifically the LT section (cross-sectional view along line AA). [Figure 4] Figure 4 is a cross-sectional view (cross-sectional view along line BB) of the multilayer ceramic capacitor shown in Figure 2. [Figure 5] Figure 5 is a schematic perspective view showing an example of a pivot plate that constitutes a direction alignment device. [Figure 6] Figure 6 is a schematic perspective view showing the laminated material housed in the recess. [Figure 7] Figure 7 is a schematic perspective view showing an example of a directional alignment device. [Figure 8A] Figure 8A is a schematic process diagram illustrating how the orientation of the laminate is changed by magnetic force. [Figure 8B] Figure 8B is a schematic process diagram illustrating how the orientation of the laminate is changed by magnetic force. [Figure 8C]Figure 8C is a schematic process diagram illustrating how the orientation of the laminate is changed by magnetic force. [Figure 9] Figure 9 is a schematic top view showing an example of the direction of movement of a magnet. [Figure 10] Figure 10 is a schematic plan view showing magnetic field lines directed toward the corners of the recess. [Figure 11] Figure 11 is a schematic side view illustrating the process of mounting a multilayer ceramic capacitor, which has external electrodes provided on a laminate, onto a substrate-type terminal. [Modes for carrying out the invention]

[0009] The direction alignment device of the present invention will be described below. However, the present invention is not limited to the following configurations and can be modified and applied as appropriate without altering the essence of the invention. Furthermore, combinations of two or more of the preferred configurations described below also constitute the present invention.

[0010] The laminates whose orientation is to be controlled using the orientation alignment device of the present invention are not particularly limited, but it can be suitably used to control the orientation of laminates that are chip components or electronic components. Examples of electronic components include multilayer ceramic capacitors and multilayer coils. Furthermore, since the electronic components such as the multilayer ceramic capacitors and multilayer coils described above include laminates, electronic components including laminates are also included in the laminates whose orientation is controlled using the orientation alignment device of the present invention. Before describing the orientation alignment device of the present invention, we will describe a laminate that constitutes a multilayer ceramic capacitor as an example of a laminate whose attitude is to be controlled. We will also describe a multilayer ceramic capacitor in which external electrodes are formed on the laminate.

[0011] Fig. 1 is a perspective view schematically showing an example of a laminated body, and Fig. 2 is a perspective view schematically showing an example of a multilayer ceramic capacitor. The multilayer ceramic capacitor shown in Fig. 2 is obtained by forming external electrodes on the laminated body shown in Fig. 1. The dimension in the length direction, the dimension in the width direction, and the dimension in the lamination direction of the laminated body and the multilayer ceramic capacitor are respectively indicated by double-headed arrows L, W, and T. The lamination direction T is also the thickness direction of the laminated body and the multilayer ceramic capacitor. When the dimension in the lamination direction of the laminated body or the multilayer ceramic capacitor is T, the dimension in the width direction is W, and the dimension in the length direction is L, it is preferable that T<L and W<L. W may be equal to L, or W may not be equal to L. Fig. 3 is an LT cross-sectional view (cross-sectional view taken along line A-A) of the multilayer ceramic capacitor shown in Fig. 2, and Fig. 4 is a WT cross-sectional view (cross-sectional view taken along line B-B) of the multilayer ceramic capacitor shown in Fig. 2.

[0012] The laminated body 10 shown in Fig. 1 includes a plurality of laminated dielectric layers 20 and a plurality of internal electrode layers (a first internal electrode layer 35 and a second internal electrode layer 36), and includes a first main surface 10a and a second main surface 10b opposed to each other in the lamination direction T, a first side surface 10e and a second side surface 10f opposed to each other in the width direction W orthogonal to the lamination direction T, and a first end surface 10c and a second end surface 10d opposed to each other in the length direction L orthogonal to the lamination direction T and the width direction W. It is preferable that corners and ridge portions of the laminated body are rounded. A corner is a portion where three surfaces of the laminated body intersect, and a ridge portion is a portion where two surfaces of the laminated body intersect.

[0013] As the dielectric material constituting the dielectric layers 20, for example, a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3 can be used. Further, those obtained by adding components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds, which have a lower content than the main component, to these components may also be used. The dielectric layers include an outer layer portion and an inner layer portion. The outer layer portion is a dielectric layer located on both main surface sides of the laminated body, and located between the main surface and the internal electrode layer closest to the main surface. A region sandwiched between both outer layer portions is the inner layer portion. Preferably, the thickness of the dielectric layer is not less than 0.4 μm and not more than 2.0 μm.

[0014] Preferably, the internal electrode layer contains a ferromagnetic material. Nickel (Ni) can be mentioned as the ferromagnetic material. When the internal electrode layer contains a ferromagnetic material, rotation of the laminated body by magnetic force is facilitated. The internal electrode layer may further contain dielectric particles having the same composition system as the dielectric ceramic contained in the dielectric layer. Preferably, the thickness of the internal electrode layer is not less than 0.4 μm and not more than 2.0 μm. Preferably, the number of laminated internal electrode layers in the laminated body is not less than 204 and not more than 510.

[0015] The plurality of internal electrode layers include a first internal electrode layer 35 and a second internal electrode layer 36. The first internal electrode layer 35 and the second internal electrode layer 36 each include opposing electrode portions opposing each other, and lead-out electrode portions extending from the opposing electrode portions to an end face of the laminated body. As shown in FIG. 3, the first internal electrode layer 35 is led out to the first end face 10c of the laminated body 10 and connected to the first external electrode 16. The second internal electrode layer 36 is led out to the second end face 10d of the laminated body 10 and connected to the second external electrode 17. In the present embodiment, in each opposing electrode portion, capacitance is formed by the internal electrode layers opposing each other with the dielectric layer interposed therebetween. Thereby, the structure functions as a multilayer ceramic capacitor.

[0016] The laminated body may be unsintered or may be sintered at the time when its orientation is aligned by the direction aligning apparatus. The size of the laminated body is not particularly limited, but preferably, the width (dimension in W direction) is not less than 0.33 mm and not more than 1.45 mm, the thickness (dimension in T direction) is not less than 0.33 mm and not more than 1.45 mm, and the length (dimension in L direction) is not less than 0.63 mm and not more than 2.20 mm.

[0017] In the multilayer ceramic capacitor 1, a first external electrode 16 is connected to the first end face 10c of the laminate 10, and a second external electrode 17 is connected to the second end face 10d. The first external electrode 16 and the second external electrode 17 are end-face external electrodes. The end-face external electrodes are formed on the end face of the laminate and extend from the end face to the side face and main face.

[0018] The external electrode may include a base electrode layer and a plating layer placed on the base electrode layer. The base electrode layer may include at least one layer selected from the group consisting of a baked layer, a resin layer, and a thin film layer. The baked layer is a layer containing glass and metal. The glass contains Si, and the metal preferably contains at least one selected from the group consisting of, for example, Cu, Ni, Ag, Pd, Ag-Pd alloy, and Au. The baked layer may also consist of multiple layers. The baked layer is a layer formed by applying a conductive paste containing glass and metal to the laminate and baking it, and may be baked at the same time as the internal electrode layer, or it may be a layer baked after the internal electrode layer has been baked.

[0019] The resin layer may be a resin layer containing conductive particles and a thermosetting resin. When forming the resin layer, the resin layer may be formed directly on the laminate without forming a baking layer. Furthermore, there may be multiple resin layers.

[0020] The thin film layer is a layer less than 1 μm thick in thickness, formed by a thin film formation method such as sputtering or vapor deposition, and in which metal particles are deposited.

[0021] The plating layer preferably contains at least one selected from, for example, Cu, Ni, Sn, Ag, Pd, Ag-Pd alloy, and AuNi. The plating layer may consist of multiple layers. Preferably, it is a two-layer structure consisting of a Ni plating layer and a Sn plating layer. The Ni plating layer can prevent the underlying electrode layer from being corroded by the solder used when mounting electronic components. The Sn plating layer improves the wettability of the solder used when mounting electronic components, making it easier to mount electronic components.

[0022] It should be noted that the laminate to be aligned in the orientation alignment device of the present invention is not limited to the laminates and multilayer ceramic capacitors of the form described above, but may also be, for example, a through-type laminate in which the internal electrode layer is extended to the side surface. In a multilayer ceramic capacitor including a through-type laminate, external electrodes are also formed on the side surface of the laminate.

[0023] Next, an embodiment of the direction alignment device of the present invention will be described. Figure 5 is a schematic perspective view showing an example of a pivot plate that constitutes a direction alignment device. Figure 5 shows the transfer plate 110, with the X, Y, and Z directions of the transfer plate indicated. The transfer plate 110 is provided with a recess 111. The upper surface of the transfer plate 110, with the plane including the X and Y directions as the main surface 112, the recess 111 opens to the main surface 112. The portion of the recess 111 that opens to the main surface 112 is called the opening 113. The recess 111 is a bottomed hole with the opening 113. The bottom surface of the recess 111 is part of the transfer plate 110.

[0024] Multiple recesses 111 are provided in a matrix (grid) pattern on the transfer plate 110. Preferably, the depth of the recesses is greater than the width or thickness dimension of the laminate. The opening 113 of the recess 111 is rectangular in shape to allow the laminate to rotate, and it is preferable that the length in the shorter direction is greater than the length of the diagonal formed by the edge extending in the lamination direction of the laminate and the edge extending in the width direction (the length shown by the double arrow d in Figure 4). The material of the transfer plate 110 is preferably a material that is not affected by magnets or is less affected by magnets. The material of the transfer plate 110 is preferably a non-magnetic material, and preferably a resin material.

[0025] The shaking plate 110 is set in a shaker (vibration device) or the like. Multiple stacked objects are placed on the shaking plate 110, and by applying vibration and tilting, the stacked objects are accommodated in the recesses 111 of the shaking plate 110.

[0026] Figure 6 is a schematic perspective view showing a multilayer ceramic capacitor housed in a recess as a laminate. The mounting plate is shown as a transparency view to illustrate the multilayer ceramic capacitor. The internal electrode layers are shown by passing through the external electrodes to indicate the stacking direction of the laminate. Figure 6 shows a state in which the orientations of the multilayer ceramic capacitors 1 housed in the recess 111 are not aligned, with a mixture of multilayer ceramic capacitors 1M whose stacking direction is the same as the Z direction and multilayer ceramic capacitors 1S whose stacking direction is the same as the X direction within the recess 111.

[0027] The direction alignment device of the present invention comprises a swinging plate and a magnet. Figure 7 is a schematic perspective view showing an example of a directional alignment device. The directional alignment device 100 shown in Figure 7 comprises a swinging plate 110 and a magnet 120. Figure 7 shows the state in which the multilayer ceramic capacitors 1M and 1S are housed in the recesses 111 of the mounting plate 110, and the cover 130 is placed over the recesses 111.

[0028] The magnet 120 has its magnetic poles arranged in the Z direction, which is perpendicular to the X and Y directions. With this arrangement of magnetic poles, the axis in which the polarity points within the magnet is the Z direction. The north pole 120N faces the main surface 112 of the thrust plate 110, and the south pole 120S is located on the side opposite to the thrust plate 110. The arrangement of the north and south poles may be reversed, with the south pole 120S facing the main surface 112 of the transfer plate 110 and the north pole 120N located on the opposite side from the transfer plate 110.

[0029] The shape of the magnet is not particularly limited, but it is preferable that it be circular when viewed from above in a plane that includes the X and Y directions (i.e., a disc-shaped magnet). The magnet can be a permanent magnet or an electromagnet. The material of the magnet is not particularly limited, but a neodymium magnet is preferred. Furthermore, the magnetic force of the magnet is preferably between 0.13T and 4T. The strength of the magnetic force of the magnet can be measured using a Teslameter.

[0030] By moving the magnet 120, the magnetic force of the magnet 120 can align the orientation of the multilayer ceramic capacitor 1, which is a laminated body with an embedded internal electrode layer housed in the recess 111 of the mounting plate 110. By placing magnets in an area outside the recessed area where the stacked layers whose orientation you want to align are located, and moving the magnets in the row or column direction, the orientation of the stacked layers will be aligned so that the stacking direction is perpendicular to the XY plane of the loading plate (Z direction). For stacked layers whose stacking direction is perpendicular to the XY plane of the loading plate (Z direction), that orientation will be maintained.

[0031] In the orientation alignment device of the present invention, the laminate to be aligned is a laminate whose stacking direction axis is offset from the axis (Z direction) in which the polarity is directed within the magnet. One example is a laminate whose stacking direction lies in the XY plane. The stacking direction of the laminate to be aligned may coincide with the X direction or the Y direction. Furthermore, it may not coincide with either the X or Y direction, and may be tilted at a predetermined angle with respect to either the X or Y direction.

[0032] Figures 8A, 8B, and 8C are schematic process diagrams illustrating how the orientation of a laminate is changed by magnetic force. In Figures 8A, 8B, and 8C, the direction of the magnetic field lines is indicated by arrows (X direction), and the dashed lines represent magnetic field lines. Since the magnet 120 has magnetic poles positioned in the Z direction perpendicular to the X and Y directions, the direction of the magnetic field lines in the recess near the area through which the magnet 120 passes is in the X direction (or Y direction). The magnet moves in the order shown in Figures 8A, 8B, and 8C. The direction of the magnet's movement is from the front to the back of the paper, or from the back to the front of the paper, i.e., the +Y direction or the -Y direction.

[0033] Figure 8A shows how a multilayer ceramic capacitor 1S, whose stacking direction is the same as the X direction, is positioned within the recess 111 of the mounting plate 110. The direction of the magnetic field lines within the recess 111 is from left to right (X direction). When the magnet 120 passes near the multilayer ceramic capacitor 1S accompanied by such magnetic field lines, the laminate rotates so that the orientation of the internal electrode layers is parallel to the direction of the magnetic field lines, as shown in Figures 8B and 8C. As a result, as shown in Figure 8C, the multilayer ceramic capacitor 1 within the recess 111 becomes a multilayer ceramic capacitor 1M whose stacking direction is the same as the Z direction, and the orientation of the laminate becomes aligned.

[0034] Furthermore, to prevent the laminate from being held by the magnet 120, a cover 130 is provided on the main surface 112 of the transfer plate 110 to cover the recess 111. The thickness of the cover 130 is not particularly limited, but it is preferable that it be thick enough for the magnetic force from the magnet 120 to pass through. For example, it can be 0.1 mm or more and 20 mm or less. Also, since the cover 130 may warp depending on the material, it is more preferable that it be 5 mm or more in thickness to ensure rigidity. The material of the cover 130 is preferably a resin, rather than a ferromagnetic material such as metal, in order to allow the magnetic force from the magnet 120 to pass through.

[0035] Figure 9 is a schematic top view showing an example of the direction of movement of a magnet. In Figure 9, the direction of movement of the magnet is indicated by an arrow. In this figure, magnet 120 moves in the -Y direction, then slightly in the -X direction, then in the +Y direction, then slightly in the -X direction, and then again in the - direction. In other words, it can be said that movement in the longitudinal direction (Y direction) of the rectangular shape of the recess of the mounting plate when viewed from above is alternating with movement in the transverse direction (X direction) of the same rectangle.

[0036] Here, the direction in which the magnet moves is defined as the positive direction, and the direction in which the magnet has passed is defined as the negative direction. These positive and negative directions are different concepts from the +X and -X directions of the X coordinate and the +Y and -Y directions of the Y coordinate in Figure 9, etc. For example, when magnet 120 is in the position shown in Figure 9, it moves in the -Y direction. In this case, the positive direction is the -Y direction and the negative direction is the +Y direction. When magnet 120 reaches the position at the bottom of the drawing in Figure 9 and moves in the -X direction, the positive direction is the -X direction and the negative direction is the +X direction. The magnet then moves in the positive X-direction or the positive Y-direction relative to the main surface of the mounting plate, aligning the orientation of the laminated material positioned on the negative side.

[0037] It is preferable for the magnet to scan in one direction, and it is not preferable to scan the same position back and forth multiple times. Back and forth scanning may cause the laminate to rotate at unexpected positions. Furthermore, the movement speed of the magnet is preferably between 50 mm / s and 1000 mm / s.

[0038] In the direction alignment device of the present invention, the shape of the recess when viewed from above is preferably rectangular, and the magnetic field lines generated from the magnet are preferably directed toward the corners of the rectangle. Figure 10 is a schematic plan view showing magnetic field lines directed toward the corners of the recess. In Figure 10, a multilayer ceramic capacitor 1S is housed in the recess 111 shown on the far right. The recess 111 has a rectangular shape when viewed from above. The magnet 120 shown in Figure 10 is disc-shaped, and magnetic field lines radiate from the center of the disc. These magnetic field lines are directed towards the rectangular corner 111a of the recess 111 when viewed from above. In Figure 10, the direction of the magnetic field lines from the magnet 120 is indicated by a dashed-dotted arrow. When magnetic field lines extend in this direction and act on the multilayer ceramic capacitor 1S in the recess 111, the position of the multilayer ceramic capacitor 1S within the recess 111 will tilt, causing its orientation to become unstable. This instability in the orientation of the multilayer ceramic capacitor 1S makes it easier for the multilayer ceramic capacitor 1S to rotate within the recess 111, and makes it easier for the orientation of the multilayer ceramic capacitor 1 to become aligned. Furthermore, since the position of the laminate (multilayer ceramic capacitor) can move within the recess, it is preferable that the magnetic field lines generated from the magnet are directed toward the corners that make up the rectangle on the top surface when the rectangular parallelepiped constituting the laminate is viewed from above.

[0039] The laminate, whose orientation has been aligned by a direction alignment device, is then mounted onto a substrate or other mounting target after external electrodes have been formed. The following describes an example in which a multilayer ceramic capacitor is mounted on a substrate-type terminal. Figure 11 is a schematic side view illustrating the process of mounting a multilayer ceramic capacitor, which has external electrodes provided on a laminate, onto a substrate-type terminal. Figure 11 shows a side view of the multilayer ceramic capacitor 1 as seen from the side of the second external electrode 17. Figure 11 shows the process of mounting the multilayer ceramic capacitor 1 onto the substrate-type terminal 200. Figure 11 shows a downward arrow indicating the direction in which the multilayer ceramic capacitor 1 is mounted onto the substrate-type terminal 200. The board-type terminal 200 has an insulating substrate 221, and a multilayer ceramic capacitor 1 is mounted on the second main surface 221b side of the insulating substrate 221. Solder paste is applied to the mounting electrodes 223 of the board-type terminal 200, for example, by a screen printing method. Next, the multilayer ceramic capacitor 1 is placed on the substrate-type terminal 200 and reflowed so that solder paste adheres to the first external electrode 16 (not shown in Figure 11) and the second external electrode 17 of the multilayer ceramic capacitor 1. Through reflow, the molten solder paste solidifies, and the multilayer ceramic capacitor 1 is mounted on the substrate-type terminal 200.

[0040] Figure 11 shows the orientation of the internal electrode layer in the mounted multilayer ceramic capacitor 1, indicated by a dotted line within the second external electrode 17. The stacking direction of the internal electrode layer is perpendicular to the main surface of the substrate-type terminal 200 (Z direction), and both the main surface of the substrate-type terminal 200 and the main surface of the internal electrode layer are planes that include the X and Y directions. As described above, the orientation alignment device can align the orientation of the laminate so that the stacking direction is the same as the Z direction, so that the orientation of the internal electrode layer of the mounted multilayer ceramic capacitor can be as shown in Figure 11.

[0041] The orientation of the laminated structure can be aligned using a direction alignment device so that the stacking direction is the same as the Z direction, and the multilayer ceramic capacitors can be mounted on a substrate-type terminal while maintaining that orientation.

[0042] If the main surface of the substrate-type terminal and the main surface of the internal electrode layer are both planes that include the X and Y directions and their orientations are aligned, vibrations due to the piezoelectric effect are less likely to be transmitted, and the audible sound (so-called "ringing") generated by the propagation of vibrations can be reduced.

[0043] The following is an example of the process for manufacturing multilayer ceramic capacitors as electronic components and mounting them onto substrate-type terminals. 1. A ceramic green sheet, which will serve as the dielectric layer, is molded. 2. Print the internal electrode pattern, which will form the internal electrode layer, onto the ceramic green sheet. 3. A laminate is obtained by stacking ceramic green sheets on which the internal electrode layer is printed. Typically, this results in a large laminate (mother block) with patterns for numerous electronic components printed on it. 4. The mother block is broken down into individual pieces to obtain multiple stacked structures. 5. Processes such as applying and drying conductive paste to form external electrodes on the end faces and sides of the laminate are carried out to form the external electrodes and create a multilayer ceramic capacitor. 6. Using a loading device, the multilayer ceramic capacitors are loaded and housed in the recesses of the loading plate of the direction alignment device. 7. Place a cover over the opening in the recess. 8. Place a magnet with its magnetic poles positioned in the Z direction above the cover, position the magnet in an area outside the recessed area where the multilayer ceramic capacitors to be aligned are housed, and move the magnet in the row or column direction to align the orientation of the multilayer ceramic capacitors. 9. Pick up the multilayer ceramic capacitors from the mounting plate and sequentially mount them onto the circuit board with the assembled terminals.

[0044] This specification discloses the following:

[0045] <1> A thrust plate having a plane including the X and Y directions as its main surface and a recess opening into the main surface, A magnet having magnetic poles arranged in the Z direction perpendicular to the X direction and the Y direction, The magnet is moved, and the magnetic force of the magnet aligns the orientation of the laminate, which is housed in the recess of the transfer plate and has an embedded internal electrode layer. A direction alignment device characterized in that the axis in which the polarity faces within the magnet is misaligned with the axis in the stacking direction of the laminate.

[0046] <2> The magnet moves in the positive direction of the X or Y direction relative to the main surface, aligning the orientation of the laminated material positioned on the negative side. <1> Directional alignment device as described above.

[0047] <3> The shape of the recessed area when viewed from above is rectangular. The magnetic field lines generated from the magnet are directed toward the corners of the rectangle. <1> or <2> Directional alignment device as described above.

[0048] <4> The magnet is circular in shape when viewed from above on the plane. <1> ~ <3> A directional alignment device as described in any of the following.

[0049] <5> The movement speed of the magnet is 50 mm / s or more and 1000 mm / s or less. <1> ~ <4> A directional alignment device as described in any of the following.

[0050] <6> The magnetic force of the aforementioned magnet is between 0.13T and 4T. <1> ~ <5> A directional alignment device as described in any of the following.

[0051] <7> The aforementioned laminate is a laminate that forms a multilayer ceramic capacitor, and has multiple internal electrode layers containing Ni, which is a ferromagnetic material. <1> ~ <6> A directional alignment device as described in any of the following.

[0052] Furthermore, this specification describes a method for aligning the orientation of a laminate using the orientation alignment device of the present invention. The method for aligning the orientation of a laminate as described herein is: A method for aligning the orientation of a laminate in which an internal electrode layer is embedded, using the orientation alignment device of the present invention, The process involves loading and accommodating a laminate into a recess of a loading plate, which has a plane including the X and Y directions as its main surface and recesses opening into the main surface. This is a method for aligning the orientation of a laminate, comprising the steps of: placing a magnet with magnetic poles arranged in the Z direction perpendicular to the X and Y directions in a region outside the region of the recess where the laminate to be aligned is housed; and moving the magnet to align the orientation of the laminate housed in the recess of the loading plate, whose stacking direction is offset from the Z direction, with the Z direction. [Explanation of Symbols]

[0053] 1, 1M, 1S Multilayer Ceramic Capacitor (Laminated) 10. Laminate 10a First main surface 10b Second main surface 10c 1st end face 10d 2nd end face 10e First side 10f 2nd side 16 1st external electrode 17 2nd external electrode 20 Dielectric layer 35 First internal electrode layer 36 Second internal electrode layer 100 Directional Alignment Device 110 Transfer Plate 111 recess 111a Corner of the recess 112 Main surface 113 Opening 120 magnets 120N N pole 120S S pole 130 Cover 200 board-type terminals 221 Insulating substrate 221b Second main surface of insulating substrate 223 Implemented electrodes

Claims

1. A thrust plate having a plane including the X and Y directions as its main surface and a recess opening into the main surface, A magnet having magnetic poles arranged in the Z direction perpendicular to the X direction and the Y direction, The magnet is moved in the positive direction in the X direction and the positive direction in the Y direction relative to the main surface, and the orientation of the laminate, which is housed in the recess of the thrust plate and is positioned on the negative direction side and has an embedded internal electrode layer, is aligned by the magnetic force of the magnet. A direction alignment device characterized in that the axis in which the polarity faces within the magnet is misaligned with the axis in the stacking direction of the laminate.

2. The shape of the recessed area when viewed from above is rectangular. The direction alignment device according to claim 1, wherein the magnetic field lines generated from the magnet are directed toward the corners of the rectangle.

3. The orientation alignment device according to claim 2, wherein the magnet has a circular shape when viewed in plan on the plane.

4. The direction alignment device according to claim 1, wherein the moving speed of the magnet is 50 mm / s or more and 1000 mm / s or less.

5. The orientation alignment device according to claim 1, wherein the magnetic force of the magnet is 0.13T or more and 4T or less.

6. The orientation alignment device according to claim 1, wherein the laminate is a laminate that forms a multilayer ceramic capacitor and has a plurality of internal electrode layers containing Ni, which is a ferromagnetic material.

Citation Information

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