Electronic components and composite electronic components

Abstract

This electronic component has a first external electrode, a base body part, and a second external electrode that are disposed in order in a first direction. A direction opposite to the first direction is defined as a second direction. A direction orthogonal to the first direction is defined as an orthogonal direction. The first external electrode includes: a first external electrode body which is spaced apart from the base body part and disposed in a second direction relative to the second external electrode; and a first external electrode extension part extending in the first direction from an edge section of the first external electrode body. The second external electrode includes: a second external electrode body which is spaced apart from the base body part and disposed in the first direction relative to the first external electrode; and a second external electrode extension part extending in the second direction from an edge section of the second external electrode body. A portion of the first external electrode extension part and a portion of the second external electrode extension part constitute a pair of facing parts facing each other in the orthogonal direction. An insulating layer is provided between the pair of facing parts.

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component and a composite electronic component. [Background Art]

[0002] An AC coupling circuit disclosed in the following patent document includes, as an electronic component for removing a DC electrical component, a chip capacitor and a die capacitor connected in parallel. [Prior Art Literature] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Laid-Open No. 2004-241924 [Summary of the Invention] [Problems to be Solved by the Invention]

[0004] Incidentally, when securing a large capacitance with a small volume, a high dielectric constant material is selected as the dielectric of a capacitor. On the other hand, high dielectric constant materials generally do not have excellent high-frequency characteristics, and high-frequency signals are lost. Therefore, development of an electronic component capable of suppressing loss of high-frequency signals is desired. It is also desired that loss of high-frequency signals be suppressed even when the electronic component is other than a capacitor.

[0005] The present disclosure has been made in view of the foregoing, and an object of the present disclosure is to provide an electronic component in which loss of high-frequency signals is suppressed, and a composite electronic component including the electronic component. [Means for Solving the Problems]

[0006] The electronic component of this disclosure has a first external electrode, a base portion, and a second external electrode arranged in a first direction. The direction opposite to the first direction is defined as the second direction. The direction perpendicular to the first direction is defined as the orthogonal direction. The first external electrode has a first external electrode body arranged in the second direction from the second external electrode, separated by the base portion, and a first external electrode extension portion extending in the first direction from the edge of the first external electrode body. The second external electrode has a second external electrode body arranged in the first direction from the first external electrode, separated by the base portion, and a second external electrode extension portion extending in the second direction from the edge of the second external electrode body. The first external electrode has a first external electrode body arranged in the second direction from the second external electrode, separated by the base portion, and a first external electrode extension portion extending in the first direction from the edge of the first external electrode body. The second external electrode comprises a second external electrode body positioned in a first direction from the first external electrode, separated by the base portion, and a second external electrode extension portion extending in a second direction from the edge of the second external electrode body. A portion of the first external electrode extension portion and a portion of the second external electrode extension portion constitute a pair of opposing portions facing each other in the orthogonal direction. An insulating layer is provided between the pair of opposing portions.

[0007] Furthermore, the composite electronic component of this disclosure comprises the aforementioned electronic component, an annular holding portion extending circumferentially along the outer surface of the electronic component, and an annular outer conductor portion extending circumferentially along the outer surface of the holding portion. [Effects of the Invention]

[0008] According to the electronic components and composite electronic components of this disclosure, the loss of high-frequency signals is suppressed. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of the electronic component module of the first embodiment. [Figure 2] Figure 2 shows a cross-section of Figure 1 taken along line II-II, viewed from the direction of the arrow. [Figure 3]Figure 3 is a magnified view of a portion of Figure 2. [Figure 4] Figure 4 is a diagram illustrating the effects of the electronic component of the first embodiment. [Figure 5] Figure 5 is a magnified view of the electronic component of the first modified example. [Figure 6] Figure 6 is a cross-sectional view of the electronic component module of the second embodiment, cut along the centerline of the coaxial cable. [Figure 7] Figure 7 is a perspective view of the electronic components of the second embodiment. [Figure 8] Figure 8 is a cross-sectional view of the section cut along line VIII-VIII in Figure 7, viewed from the direction of the arrow. [Figure 9] Figure 9 is a cross-sectional view of the section cut along the line IX-IX in Figure 7, viewed from the direction of the arrow. [Figure 10] Figure 10 is a cross-sectional view of the section cut along line XX in Figure 7, viewed from the direction of the arrow. [Figure 11] Figure 11 is a diagram illustrating the effect of the electronic component of the second embodiment. [Figure 12] Figure 12 is a diagram illustrating the effect of the electronic component in the second modified example. [Figure 13] Figure 13 is a cross-sectional view of the section cut along line XII-XII in Figure 12, viewed from the direction of the arrow. [Figure 14] Figure 14 is a cross-sectional view showing an example in which the electronic components of Embodiment 1 are installed on a coaxial cable. [Figure 15] Figure 15 is a cross-sectional view of the electronic component of the third modified example. [Figure 16] Figure 16 is a cross-sectional view of the electronic component module of the third embodiment, cut along the centerline of the coaxial cable. [Figure 17] Figure 17 is a cross-sectional view of the section cut along line XVII-XVII in Figure 16, viewed from the direction of the arrow. [Figure 18] Figure 18 is a cross-sectional view of the composite electronic component of the fourth modified example, cut in a perpendicular direction. [Figure 19] Figure 19 is a cross-sectional view of the fifth modified example of a composite electronic component, cut in a perpendicular direction. [Figure 20] FIG. 20 is a cross-sectional view of the electronic component module according to the sixth modification, taken along the center line of a coaxial cable. MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, embodiments of the electronic component and the composite electronic component of the present disclosure will be described in detail with reference to the drawings. It should be noted that the present disclosure is not limited by these embodiments. Each embodiment is an exemplification, and it is needless to say that partial replacement or combination of configurations shown in different embodiments is allowable. In and after the first embodiment, descriptions of matters common to the second embodiment will be omitted, and only different points will be described. In particular, similar functions and effects obtained by similar configurations will not be repeatedly described for each embodiment.

[0011] (First Embodiment) FIG. 1 is a perspective view of the electronic component module according to the first embodiment. As shown in FIG. 1, the electronic component module 100 according to the first embodiment includes a substrate 101 having a mounting surface 102, an electronic component 1 disposed on the mounting surface 102, and solder 110 that fixes the electronic component 1 to the mounting surface 102.

[0012] The substrate 101 is a multilayer wiring substrate in which wiring layers and insulating layers are alternately stacked. The mounting surface 102 of the substrate 101 is formed of an insulating layer. A first land electrode 103 and a second land electrode 104 are provided on the mounting surface 102 of the substrate 101. Note that the substrate of the present disclosure is not limited to a multilayer wiring substrate.

[0013] The solder 110 includes a first solder 111 that joins the first land electrode 103 and the electronic component 1, and a second solder 112 that joins the second land electrode 104 and the electronic component 1.

[0014] Electronic component 1 has a first external electrode 10, a base portion 30, and a second external electrode 20 arranged in order in a direction parallel to the mounting surface 102. Hereinafter, the direction in which the first external electrode 10, the base portion 30, and the second external electrode 20 are arranged will be referred to as the longitudinal direction. Within the longitudinal direction, the direction in which the second external electrode 20 is arranged as viewed from the first external electrode 10 will be referred to as the first direction X1, and the direction opposite to the first direction X1 will be referred to as the second direction X2. Furthermore, the direction perpendicular to the longitudinal direction (first direction X1) will be referred to as the orthogonal direction. The overall shape of electronic component 1 is a hexahedron, and all of the edges and corners of the hexahedron are chamfered. However, this disclosure is not limited to cases where all of the edges and corners of the hexahedron are chamfered; it is sufficient if at least one of the edges and corners of the hexahedron is chamfered. Furthermore, the edges mentioned above are the parts where two faces intersect, and the corners mentioned above are the parts where three faces intersect.

[0015] Figure 2 is a cross-section of Figure 1 taken along line II-II, viewed from the direction of the arrow. As shown in Figure 2, the base portion 30 has a dielectric 31 and a plurality of first internal electrodes 35 and second internal electrodes 36 arranged alternately inside the dielectric 31. The dashed line M in Figure 2 is a virtual line passing through the center of the base portion 30 in the longitudinal direction.

[0016] The dielectric 31 is formed from a ceramic material whose main components are, for example, BaTiO3, CaTiO3, SrTiO3, SrZrO3, or CaZrO3. These main components may also contain minor components in smaller amounts than the main components, such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds. The material of the dielectric 31 in this disclosure is not limited to the high dielectric constant materials described above.

[0017] The dielectric 31 is formed in the shape of a rectangular parallelepiped and has a first end face 33 facing the second direction X2 and a second end face 34 facing the first direction X1. The outer circumferential surface of the dielectric 31 includes a first surface 32 facing the mounting surface 102. The first surface 32 is a plane parallel to the mounting surface 102. An insulating layer 40 is provided on the first surface 32. Details of the insulating layer 40 will be described later.

[0018] The first internal electrode 35 and the second internal electrode 36 are formed in a plate shape and extend in a direction parallel to the mounting surface 102. Hereinafter, the direction in which the first internal electrode 35 and the second internal electrode 36 are arranged will be referred to as the stacking direction. Of the stacking directions, the direction in which the first surface 32 is arranged as viewed from the first internal electrode 35 and the second internal electrode 36 will be referred to as the first stacking direction Y1, and the direction opposite to the first stacking direction Y1 will be referred to as the second stacking direction Y2. Furthermore, the direction perpendicular to both the length direction and the stacking direction will be referred to as the width direction Z (see Figure 1).

[0019] The first internal electrode 35 and the second internal electrode 36 contain, for example, metals such as Ni, Ag, Pd, Au, Cu, Ti, or Cr, or alloys mainly composed of the above-mentioned metals. The first internal electrode 35 and the second internal electrode 36 may also contain the same ceramic material as the dielectric ceramic contained in the dielectric 31 as a common material.

[0020] The end of the first internal electrode 35 in the second direction X2 is drawn out to the first end face 33 of the dielectric 31 and is joined to the first external electrode 10. The end of the second internal electrode 36 in the first direction X1 is drawn out to the second end face 34 of the dielectric 31 and is joined to the second external electrode 20.

[0021] The first internal electrode 35 and the second internal electrode 36 are spaced apart from each other in the stacking direction. Therefore, a dielectric 31 (dielectric layer) is interposed between the first internal electrode 35 and the second internal electrode 36. As a result, the portions of the first internal electrode 35 and the second internal electrode 36 that face each other constitute counter electrodes. Capacitance is then formed by the counter electrodes, and the electronic component 1 functions as a capacitor.

[0022] The first external electrode 10 and the second external electrode 20 are each composed of a single metal component. However, this disclosure is not particularly limited and may also describe the first external electrode 10 and the second external electrode 20 as being composed of multiple plating layers.

[0023] The first external electrode 10 includes a first external electrode body 11 positioned in a second direction X2 of the base portion 30 and a first external electrode extension 15 positioned in a first stacking direction Y1 of the base portion 30. The first external electrode body 11 includes a first opposing wall 12 facing the first end face 33 of the dielectric 31 and an annular first fitting portion 13 protruding in a first direction X1 from the edge of the first opposing wall 12. The first opposing wall 12 is formed in a plate shape and extends in the stacking direction and the width direction Z. The first opposing wall 12 is rectangular when viewed from the length direction. The first internal electrode 35 is joined to the surface of the first opposing wall 12 in the first direction X1.

[0024] The first fitting portion 13 is formed in the shape of a rectangular frame when viewed from the longitudinal direction. The end of the base portion 30 in the second direction X2 is fitted inside the first fitting portion 13. In addition, a part of the first fitting portion 13 is positioned in the first stacking direction Y1 relative to the dielectric 31 and is in contact with the first surface 32. Hereinafter, the part of the first fitting portion 13 that is in contact with the first surface 32 of the dielectric 31 will be referred to as the first mounting surface side wall portion 14.

[0025] The first external electrode body 11 is positioned in the second stacking direction Y2 of the first land electrode 103. The first solder 111 is mainly bonded to the surface of the first opposing wall 12 in the second direction X2 (see Figure 1). This electrically connects the first external electrode 10 and the first land electrode 103.

[0026] The first external electrode extension 15 extends in a first direction X1 from the edge of the first external electrode body 11. Here, the edge of the first external electrode body 11 is the edge of the first fitting portion 13 (in this embodiment, the end of the first mounting surface side wall portion 14 in the first direction X1). The first external electrode extension 15 is formed in a plate shape and extends in the length direction and the width direction Z. The first external electrode extension 15 also extends along the first surface 32 and is in contact with the first surface 32. The end 15a of the first external electrode extension 15 in the first direction X1 is positioned in the first direction X1 beyond the dashed line M.

[0027] The second external electrode 20 has a second external electrode body 21 positioned in a first direction X1 of the base portion 30 and a second external electrode extension 25 positioned in a first stacking direction Y1 of the base portion 30. The second external electrode body 21 has a second opposing wall 22 facing the second end face 34 of the dielectric 31 and an annular second fitting portion 23 protruding in a second direction X2 from the edge of the second opposing wall 22. The second opposing wall 22 is formed in a plate shape and extends in the stacking direction and the width direction Z. The second opposing wall 22 is rectangular when viewed in the length direction. The second internal electrode 36 is joined to the surface of the second opposing wall 22 in the second direction X2.

[0028] The second fitting portion 23 is formed in a rectangular frame shape when viewed from the longitudinal direction. The end of the base portion 30 in the first direction X1 is fitted inside the second fitting portion 23. In addition, a part of the second fitting portion 23 is positioned in the first stacking direction Y1 relative to the dielectric 31 and is in contact with the first surface 32. Hereinafter, the part of the second fitting portion 23 that is in contact with the first surface 32 of the dielectric 31 will be referred to as the second mounting surface side wall portion 24.

[0029] The second external electrode body 21 is positioned in the second stacking direction Y2 of the second land electrode 104. The second solder 112 is mainly bonded to the surface of the second opposing wall 22 in the first direction X1 (see Figure 1). This electrically connects the second external electrode 20 and the second land electrode 104.

[0030] The second external electrode extension 25 extends in a second direction X2 from the edge of the second external electrode body 21. Here, the edge of the second external electrode body 21 is the edge of the second fitting portion 23 (in this embodiment, the end of the second mounting surface side wall portion 24 in the second direction X2). The second external electrode extension 25 is formed in a plate shape and extends in the length direction and the width direction Z. The second external electrode extension 25 is spaced apart from the first surface 32 of the base portion 30 in the first stacking direction Y1. An insulating layer 40 is interposed between the second external electrode extension 25 and the first surface 32.

[0031] The end portion 25a of the second external electrode extension 25 in the second direction X2 is positioned in the second direction X2 relative to the dashed line M. Therefore, a portion of the first external electrode extension 15 and a portion of the second external electrode extension 25 are separated in the stacking direction and face each other in a direction perpendicular to each other. Hereinafter, the portions of the first external electrode extension 15 and the second external electrode extension 25 that face each other will be referred to as a pair of opposing portions 50, 50.

[0032] An insulating layer 40 is interposed between the pair of opposing portions 50, 50. The insulating layer 40 is also provided in the first stacking direction Y1 of the first external electrode extension portion 15. Therefore, the surface of the first external electrode extension portion 15 in the first stacking direction Y1 is not exposed. On the other hand, the insulating layer 40 is not provided in the first stacking direction Y1 of the second external electrode extension portion 25. Therefore, the surface of the second external electrode extension portion 25 in the first stacking direction Y1 is exposed. Next, the details of the pair of opposing portions 50, 50 will be described.

[0033] Figure 3 is an enlarged view of a portion of Figure 2. In Figure 3, the imaginary lines N1 and N2 represent the boundary lines when the base portion 30 is divided into three equal parts in the longitudinal direction. More specifically, imaginary line N1 is the boundary line on the second direction X2 side of the center of the base portion 30 in the longitudinal direction, and imaginary line N2 is the boundary line on the first direction X1 side of the center of the base portion 30 in the longitudinal direction.

[0034] As shown in Figure 3, the pair of opposing parts 50, 50 are arranged in the first stacking direction Y1 (orthogonal direction) with respect to the central part (the portion between the imaginary lines N1 and N2) when the base part 30 is divided into three equal parts in the longitudinal direction. Therefore, the distance L1 from the second external electrode extension 25 to the first solder 111 is relatively large. Note that the surface of the second external electrode extension 25 in the first stacking direction Y1 is exposed and there is a possibility that it will join with the first solder 111 that has dissolved between the mounting surface 102 and the base part 30. However, according to this embodiment, because the distance L1 is relatively large, the possibility of the second external electrode extension 25 and the first solder 111 joining is low.

[0035] Furthermore, the length L2 in the longitudinal direction of the pair of opposing parts 50, 50 is 1 / 20 or more of the length L3 in the longitudinal direction (first direction X1) of the base part 30.

[0036] The distance L4 between the pair of opposing parts 50, 50 is between 25 μm and 100 μm. If the distance L4 is between 25 μm and 100 μm, the pair of opposing parts 50, 50 are magnetically coupled to each other. In addition, minute irregularities of 10 μm or less may be formed on the surface of the opposing parts 50. If the distance L4 between the pair of opposing parts 50, 50 is at least 25 μm, even if a 10 μm protrusion is formed on each of the pair of opposing parts 50, 50, the insulating layer 40 is reliably interposed between the protrusions. In other words, contact between the pair of opposing parts 50, 50 is reliably avoided. Furthermore, if the distance L4 between the pair of opposing parts 50, 50 exceeds 100 μm, the loss of high-frequency signals may increase, which is undesirable.

[0037] Furthermore, the distance L5 between the first external electrode extension 15 and the internal electrode (second internal electrode 36 in Figure 3) is greater than the distance L4 between the pair of opposing parts 50, 50. This prevents magnetic coupling between the first external electrode extension 15 and the internal electrode (second internal electrode 36 in Figure 3).

[0038] Figure 4 is a diagram illustrating the effect of the electronic component of the first embodiment. Next, we will explain the case in the electronic component module 100 of the first embodiment in which a signal is supplied from the first land electrode 103 to the first external electrode 10. As shown in Figure 4, when a high-frequency signal is supplied from the first land electrode 103 to the first external electrode 10, the high-frequency signal is sent to the second external electrode 20 by passing through the pair of opposing parts 50, 50, which is the shortest path (see arrow A in Figure 4). In this embodiment, the shortest path refers to the shortest circuit among the electrical circuits connecting the first land electrode 103 and the second land electrode 104. In other words, the pair of opposing parts 50, 50 are located closer to the mounting surface than the other internal electrodes, and are the shortest path. From the above, the high-frequency signal uses the pair of opposing parts 50, 50 as its path and does not pass through the dielectric layer between the first internal electrode 35 and the second internal electrode 36. Therefore, the loss of the high-frequency signal is suppressed.

[0039] The low-frequency signal passes through the first internal electrode 35 and the second internal electrode 36 (see arrow B in Figure 4). As described above, with the electronic component 1 of this embodiment, the DC electrical component is removed, and signal loss is suppressed over a wide bandwidth from the high-frequency band to the low-frequency band.

[0040] The electronic component 1 of the first embodiment has been described above, but the disclosure is not limited thereto. The disclosure may also involve, for example, changing the longitudinal position of the pair of opposing parts 50, 50. The first modified example in which the longitudinal position of the pair of opposing parts 50, 50 is changed will be described below.

[0041] Figure 5 is an enlarged view of the electronic component of the first modified example. As shown in Figure 5, the electronic component 1A of the first modified example differs from the electronic component 1 of the first embodiment in that the end 15a of the first external electrode extension 15 in the first direction X1 is positioned in the first direction X1 relative to the virtual line N2. Furthermore, the electronic component 1A of the first modified example differs from the electronic component 1 of the first embodiment in that the end 25a of the second external electrode extension 25 in the second direction X2 is positioned in the first direction X1 relative to the virtual line N2.

[0042] In the first modified example, the pair of opposing portions 50A, 50A are positioned in the first direction X1 (closer to the second external electrode body 21) than the virtual line N2. As a result, the distance L1 between the first solder 111 and the second external electrode extension 25 is larger than in the first embodiment. This makes it extremely difficult for the second external electrode extension 25 and the first solder 111 to come into contact.

[0043] Furthermore, although the pair of opposing portions 50, 50 in the first embodiment extend only to a portion of the outer circumference of the base portion 30, the disclosure is not limited thereto. In the second embodiment, an example in which the pair of opposing portions 50, 50 are annular will be described. In the second embodiment, an example in which the components are provided on a coaxial cable instead of a substrate 101 will be described.

[0044] (Second Embodiment) Figure 6 is a cross-sectional view of the electronic component module of the second embodiment, cut along the centerline of the coaxial cable. As shown in Figure 6, the electronic component module 100B of the second embodiment comprises a coaxial cable 200 and an electronic component 1B. The coaxial cable 200 comprises an internal conductor 201, a dielectric 202, an external conductor 203, and a protective layer (not shown), arranged in order from the inner circumference side. A portion of the internal conductor 201 is cut out, providing a space for the placement of the electronic component 1B. Next, the electronic component 1B will be described, focusing on the differences from the electronic component 1 of the first embodiment.

[0045] Figure 7 is a perspective view of the electronic component of the second embodiment. Figure 8 is a cross-sectional view of the section cut along line VIII-VIII in Figure 7, viewed from the direction of the arrow. Figure 9 is a cross-sectional view of the section cut along line IX-IX in Figure 7, viewed from the direction of the arrow. Figure 10 is a cross-sectional view of the section cut along line XX in Figure 7, viewed from the direction of the arrow.

[0046] As shown in Figure 7, the electronic component 1B has an overall cylindrical shape. Therefore, as shown in Figures 8 to 10, the cross-sectional shape of the electronic component 1B in the orthogonal direction is circular. In addition, the outer circumferential surface 38 of the base portion 30B is also circular.

[0047] The base portion 30B is formed by winding a laminate in which a dielectric sheet, a first internal electrode 35B, a dielectric sheet, and a second internal electrode 36B are stacked in that order. Therefore, the dielectric 31B of the base portion 30B is composed of two dielectric sheets.

[0048] In the first external electrode 10B, the first opposing wall 12B of the first external electrode body 11B is formed in a circular shape, although not shown in the figure. As shown in Figure 8, the first fitting portion 13B is formed in a cylindrical shape. As shown in Figure 9, the first external electrode extension portion 15B extends circumferentially along the edge of the first fitting portion 13B (first external electrode body 11B). In other words, the first external electrode extension portion 15B is formed in a cylindrical (annular) shape. The first external electrode extension portion 15B is in contact with the outer circumferential surface 38 of the base portion 30B.

[0049] In the second external electrode 20B, the second opposing wall 22B of the second external electrode body 21B is formed in a circular shape, as shown in Figure 7. As shown in Figure 10, the second fitting portion 23B is formed in a cylindrical shape. As shown in Figure 9, the second external electrode extension portion 25 extends circumferentially along the edge of the second fitting portion 23B (second external electrode body 21B). Therefore, the second external electrode extension portion 25 is formed in a cylindrical (annular) shape.

[0050] As shown in Figure 9, the inner diameter of the second external electrode extension 25 is larger than the outer diameter of the first external electrode extension 15B. An insulating layer 40 is interposed between the outer circumferential surface 38 of the base portion 30B and the second external electrode extension 25. In other words, the second external electrode extension 25 does not come into contact with the outer circumferential surface 38 of the base portion 30B. Also, as shown in Figure 6, the first external electrode extension 15B and the second external electrode extension 25B have portions that face each other in orthogonal directions. In other words, the portions of the first external electrode extension 15B and the second external electrode extension 25B that face each other form a pair of opposing portions 50B, 50B.

[0051] Figure 11 is a diagram illustrating the effect of the electronic component of the second embodiment. As shown in Figure 11, according to the electronic component 1B of the second embodiment, the high-frequency signal flows along the outer periphery of the inner conductor 201 due to the skin effect. Therefore, when a high-frequency signal is supplied from the inner conductor 201 to the first external electrode 10, the signal flows to the second external electrode 20B through a pair of opposing parts 50B, 50B, which are on the outer periphery of the electronic component 1B and represent the shortest path (see arrow C in Figure 11). As a result, the high-frequency signal is not affected by the dielectric 31B, and losses are suppressed.

[0052] Furthermore, the pair of opposing parts 50B, 50B are cylindrical (annular). In other words, the high-frequency signal path is wider in the circumferential direction than the pair of opposing parts 50, 50 in the first embodiment. Therefore, according to the second embodiment, the loss of high-frequency signals is suppressed to a smaller extent than in the first embodiment. Note that low-frequency signals pass through the inner circumference side of the internal conductor 201. Therefore, when a low-frequency signal is supplied to the first external electrode 10B, it passes through the first internal electrode 35 and the second internal electrode 36 (see arrow D in Figure 11). From the above, even with the electronic component 1B of the second embodiment, signal loss is suppressed over a wide bandwidth from the high-frequency band to the low-frequency band.

[0053] Having described the second embodiment, a second modified example of the second embodiment will now be described.

[0054] Figure 12 is a diagram illustrating the effect of the electronic component of the second modified example. Figure 13 is a cross-sectional view of the cross section cut along line XII-XII in Figure 12, viewed from the direction of the arrow. As shown in Figure 12, the electronic component 1C of the second modified example is formed in a rectangular prism shape. As shown in Figure 13, the cross-sectional shape of this electronic component 1C, when cut in a perpendicular direction, is formed as a rectangle.

[0055] The first external electrode extension 15C of the first external electrode 10C is formed in the shape of a rectangular frame surrounding the outer circumference of the base portion 30C. The insulating layer 40, which is positioned on the outer circumference of the first external electrode extension 15C, is also formed in the shape of a rectangular frame. Furthermore, the second external electrode extension 25C of the second external electrode 20C, which is positioned on the outer circumference of the insulating layer 40, is also in the shape of a rectangular frame.

[0056] In the second modified electronic component 1C, the pair of opposing parts 50C, 50C are in the shape of a square frame (ring). Therefore, the pair of opposing parts 50C, 50C are more circumferentially extended than the pair of opposing parts 50, 50 of the first embodiment. As a result, the loss of high-frequency signals is suppressed to a smaller extent than in the first embodiment.

[0057] Figure 14 is a cross-sectional view showing an example of the electronic component of Embodiment 1 being mounted on a coaxial cable. In the first embodiment, the electronic component 1 is shown mounted on a substrate 101, but as shown in Figure 14, the electronic component 1 may also be mounted on a coaxial cable 200. Furthermore, the objects on which the electronic component of this disclosure is mounted are not limited to substrates or coaxial cables. Regarding the overall shape of the electronic component, in the first embodiment it is a hexahedron with chamfered edges and corners, and in the second modified example it is cylindrical, but the electronic component of this disclosure may be formed in the shape of a rectangular parallelepiped (quadrilateral prism), for example.

[0058] Figure 15 is a cross-sectional view of the electronic component of the third modified example. In addition, the base portion of each embodiment and each modified example is a capacitor with a dielectric and internal electrodes, but the base portion of the present disclosure may, as shown in Figure 15, include a resistor 300 and an insulating layer 301 that insulates the area around the resistor 300. In other words, the electronic component 1D may form a resistor. With this electronic component 1D, when a DC current flows through the first external electrode 10, the low-frequency component of the DC current flows through the resistor 300 to the second external electrode 20. The high-frequency component of the DC current flows through a pair of opposing parts 50D, 50D to the second external electrode 20. Therefore, loss of high-frequency signals is suppressed. Alternatively, the base portion of the present disclosure may be an inductor with a coil.

[0059] (Third embodiment) Figure 16 is a cross-sectional view of the electronic component module of the third embodiment, cut along the centerline of the coaxial cable. Figure 17 is a cross-sectional view of the cross section cut along line XVII-XVII in Figure 16, viewed from the direction of the arrow. As shown in Figure 16, the electronic component module 100E of the third embodiment comprises a coaxial cable 200E and a composite electronic component 400.

[0060] In the third embodiment, the coaxial cable 200E has portions of the internal conductor 201, dielectric 202, and external conductor 203 cut out to form space for arranging the composite electronic component 400. Therefore, the coaxial cable 200E of the third embodiment differs from the coaxial cable 200 of the second embodiment (see Figure 6), in which only the internal conductor 201 is cut out.

[0061] The composite electronic component 400 is positioned (mounted) in a cutout space in the coaxial cable 200E. The outer periphery of the composite electronic component 400 is covered by a protective layer (not shown) of the coaxial cable 200. The composite electronic component 400 comprises an electronic component 1E that connects to the internal conductor 201, a holding portion 410 that connects to the dielectric 202, and an external conductor portion 420 that connects to the external conductor 203.

[0062] As shown in Figure 17, the outer surface of the composite electronic component 400 is circular. In other words, the composite electronic component 400 is a cylindrical component. The center of the cylinder formed by the composite electronic component 400 will be referred to as the center O of the composite electronic component 400 below. Furthermore, electronic component 1E is located in the central part of the composite electronic component 400. In other words, electronic component 1E is not positioned radially (orthogonally) from the center O of the composite electronic component 400.

[0063] Electronic component 1E is rectangular when viewed from the length direction. In other words, electronic component 1E of the third embodiment has the same structure as electronic component 1C of the second modified example, which is formed as a rectangular prism. Therefore, the description of electronic component 1E is omitted. Also, it is given the same reference numeral as electronic component 1C in the drawings. As shown in Figure 16, the diameter of the outer surface 401 of electronic component 1E of this embodiment is smaller than the outer diameter of the inner conductor 201 of the coaxial cable 200E.

[0064] The retaining portion 410 is made of a dielectric material. As shown in Figure 17, the retaining portion 410 extends circumferentially along the outer circumferential surface 401 of the electronic component 1E and is formed in an annular shape. The cross-sectional shape of the inner circumferential surface 411 of the retaining portion 410 is rectangular, corresponding to the outer circumferential surface 401 of the electronic component 1E. The inner circumferential surface 411 of the retaining portion 410 is joined to the outer circumferential surface 401 of the electronic component 1E. The cross-sectional shape of the outer circumferential surface 412 of the retaining portion 410 is circular.

[0065] The outer conductor portion 420 is formed of a conductive material. As shown in Figure 17, the outer conductor portion 420 extends circumferentially along the outer circumferential surface 412 of the holding portion 410 and is formed in an annular shape. The cross-sectional shape of the inner circumferential surface 421 of the outer conductor portion 420 is circular, corresponding to the outer circumferential surface 412 of the holding portion 410. The inner circumferential surface 421 of the outer conductor portion 420 is joined to the outer circumferential surface 412 of the holding portion 410.

[0066] As shown in Figure 16, the inner circumferential surface 421 of the outer conductor portion 420 has a first edge portion 422, a second edge portion 423, and an intermediate portion 424. The first edge portion 422 is an annular portion located at the end of the inner circumferential surface 421 of the outer conductor portion 420 in the first direction X1. The second edge portion 423 is an annular portion located at the end of the inner circumferential surface 421 of the outer conductor portion 420 in the second direction X2. The intermediate portion 424 is an annular portion located between the first edge portion 422 and the second edge portion 423 of the inner circumferential surface 421 of the outer conductor portion 420.

[0067] The distance (radial thickness of the holding portion 410) between the inner circumferential surface 421 (intermediate portion 424) of the outer conductor portion 420 and the outer circumferential surface 401 of the electronic component 1E is such that the distance (thickness) results in a desired impedance value. Here, the desired impedance value is the impedance value between the inner conductor 201 and the outer conductor 203 in the coaxial cable 200E. Therefore, in this embodiment, impedance matching can be achieved between the coaxial cable 200E and the composite electronic component 400.

[0068] The first edge 422 and the second edge 423 are tapered. More specifically, the first edge 422 expands in diameter as it moves toward the first direction X1. Similarly, the second edge 423 expands in diameter as it moves toward the second direction X2. The diameter of the first edge 422 at the end in the first direction X1 and the diameter of the second edge 423 at the end in the second direction X2 are the same diameter as the inner surface of the outer conductor 203 of the coaxial cable 200E. For this reason, the inner surface 421 of the outer conductor portion 420 is convex, with the intermediate portion 424 protruding toward the electronic component 1E.

[0069] Next, the effects of the third embodiment will be explained. In the electronic component module 100B of the second embodiment described above, only the electronic component 1B is mounted on the coaxial cable 200. With this structure, the electronic component 1B may be radially offset from the center of the internal conductor 201. As a result, the distance between the outer surface of the electronic component 1B and the outer conductor 203 of the coaxial cable 200, in other words, the thickness of the dielectric 202, varies depending on the circumferential position. In other words, the impedance between the outer surface of the electronic component 1B and the outer conductor 203 may not be the desired value. On the other hand, the composite electronic component 400 of the third embodiment includes not only the electronic component 1E, but also a holding part 410 and an outer conductor part 420. In other words, the distance between the electronic component 1E and the outer conductor part 420 does not vary depending on the circumferential position. Therefore, the high-frequency signal transmission characteristics are improved compared to the second embodiment.

[0070] Furthermore, if the first edge portion 422 and the second edge portion 423 are not tapered, that is, if the entire inner circumferential surface 421 of the outer conductor portion 420 has the same diameter as the intermediate portion 424, a stepped surface is formed between the outer conductor portion 420 and the outer conductor 203 of the coaxial cable 200E, protruding radially inward from the inner circumferential surface of the outer conductor 203 and extending in a perpendicular direction. When this stepped surface is formed, high-frequency signals are more easily reflected. On the other hand, according to the third embodiment, since the first edge portion 422 and the second edge portion 423 are tapered, there is no stepped surface extending in a perpendicular direction, and the reflection of high-frequency signals is suppressed.

[0071] The composite electronic component 400 of the third embodiment has been described above. Next, a modified example in which a part of the composite electronic component 400 of the third embodiment is modified will be described.

[0072] Figure 18 is a cross-sectional view of the composite electronic component of the fourth modified example, cut in a perpendicular direction. As shown in Figure 18, the electronic component 1H of the composite electronic component 400H of the fourth modified example is common to the third embodiment in that it is rectangular prism-shaped. On the other hand, the electronic component 1H differs from the third embodiment in that its corners are chamfered. That is, the outer circumferential surface 401H of the electronic component 1H is rectangular when viewed from the length direction, and its corners are arc-shaped. Also, the inner circumferential surface 421H of the composite electronic component 400H of the fourth modified example differs from the third embodiment in that it is rectangular when viewed from the length direction, and its corners are arc-shaped. In other words, in the fourth modified example, the inner circumferential surface 421H of the outer conductor portion 420H and the outer circumferential surface 401H of the electronic component 1H have corresponding shapes (similar shapes). With this composite electronic component 400H, the same effects as the third embodiment can be achieved. Furthermore, the distance between the outer surface 401H of the electronic component 1H and the inner surface 421H of the outer conductor portion 420H is uniform, thus avoiding current distribution concentration. Therefore, power loss can be kept lower than in the third embodiment. Note that the inner surface of the outer conductor portion in this disclosure is not limited to the examples shown in the third embodiment and the fourth modified example, and may be circular or have other shapes.

[0073] Figure 19 is a cross-sectional view of the composite electronic component of the fifth modified example, cut in a perpendicular direction. As shown in Figure 19, the composite electronic component 400F of the fifth modified example differs from the third embodiment in that it includes a cylindrical electronic component 1F instead of a rectangular prism-shaped electronic component 1E. Electronic component 1F has the same structure as electronic component 1B described in the second embodiment. Therefore, the description of electronic component 1F is omitted. Also, in the drawings, it is given the same reference numeral as electronic component 1B. Even with such a composite electronic component 400F, the same effects as the third embodiment can be achieved.

[0074] Figure 20 is a cross-sectional view of the electronic component module of the sixth modified example, cut along the centerline of the coaxial cable. As shown in Figure 20, the composite electronic component 400G of the sixth modified example differs from that of the third embodiment in the shape of the inner circumferential surface 421G of the outer conductor portion 420G. Details will be explained below.

[0075] The distance between the intermediate portion 424G of the outer conductor portion 420G and the outer surface 401 of the electronic component 1E is larger in diameter than the inner surface of the outer conductor 203 of the coaxial cable 200E in order to obtain a desired impedance value. The first edge portion 422G decreases in diameter as it moves toward the first direction X1. The second edge portion 423G decreases in diameter as it moves toward the second direction X2. Therefore, the inner surface 421G of the outer conductor portion 420G is concave, with the intermediate portion 424G recessed toward the outer surface of the outer conductor portion 420G.

[0076] In this sixth modified example, since the first edge portion 422F and the second edge portion 423F are tapered, the reflection of high-frequency signals is suppressed.

[0077] Although variations of the composite electronic component 400 have been described above, the present disclosure does not require that the first edge 422 and the second edge 423 of the outer conductor portion 420 be tapered.

[0078] (Examples) Next, an example will be described. In this example, electronic components were mounted on a coaxial cable (see Figure 11), and the S-parameters S11 (reflection characteristics) and S21 (transmission characteristics) were determined when a high-frequency signal was supplied. The high-frequency signals were of two types: a 20 GHz signal and a 100 GHz signal.

[0079] The electronic component manufactured in the example is the rectangular prism (cuboid) electronic component 1C shown in the second modified example (see Figure 12), which has a pair of opposing parts 50D, 50D in a rectangular frame shape (see Figure 13). Three electronic components were prepared, and the distance L4 (see Figure 3) between the pair of opposing parts 50D, 50D was varied for each. The first electronic component (hereinafter referred to as Example 1) has a distance L4 of 25 μm between the pair of opposing parts 50D, 50D. The second electronic component (hereinafter referred to as Example 2) has a distance L4 of 50 μm between the pair of opposing parts 50D, 50D. The third electronic component (hereinafter referred to as Example 3) has a distance L4 of 100 μm between the pair of opposing parts 50D, 50D.

[0080] To confirm the effects of the embodiment, a comparative electronic component was prepared. The comparative electronic component is an electronic component obtained by removing the first external electrode extension 15C and the second external electrode extension 25C from the rectangular prism-side electronic component shown in the second modification. In other words, it does not have a pair of opposing rectangular frame-shaped parts 50, 50.

[0081] First, Table 1 shows the S11 (reflection characteristics) of the S-parameters for each example and comparative example.

[0082] [Table 1]

[0083] The S-parameter S11 (reflection characteristics) indicates that a smaller value means the high-frequency signal passed through the electronic component. When the signal frequency was 20 GHz, as shown in Table 1, all three examples (1 to 3) showed superior S11 (reflection characteristics) compared to the comparative example. Furthermore, when the signal frequency was 100 GHz, examples 1 and 2 showed superior S11 (reflection characteristics) compared to the comparative example. Therefore, according to the examples, the reflection of high-frequency signals was reduced. Next, Table 2 shows the S21 (transmission characteristics) of the S-parameters for each example and the comparative example.

[0084] [Table 2]

[0085] The S-parameter S21 (transmission characteristics) indicates signal loss is smaller the closer the value is to 0.1. Regardless of whether the signal frequency was 20 GHz or 100 GHz, Examples 1 to 3 showed superior S21 (transmission characteristics) compared to the comparative example, as shown in Table 2. In other words, the loss of high-frequency signals was suppressed according to these examples.

[0086] Furthermore, this disclosure may also be a combination of the following configurations. (1) It has a first external electrode, a base portion, and a second external electrode arranged sequentially in the first direction, The direction opposite to the first direction is defined as the second direction. The direction perpendicular to the first direction is defined as the orthogonal direction. The first external electrode is, A first external electrode body is positioned in the second direction from the second external electrode, separated from the base portion, A first external electrode extension extending in the first direction from the edge of the first external electrode body, It has, The second external electrode is, A second external electrode body is positioned in the first direction from the first external electrode, separated from the base portion, A second external electrode extension portion extending in the second direction from the edge of the second external electrode body, It has, A portion of the first external electrode extension and a portion of the second external electrode extension constitute a pair of opposing portions that face each other in the orthogonal direction. An insulating layer is provided between the pair of opposing parts. Electronic components. (2) The cross-section in the orthogonal direction is formed as a rectangle, and the overall shape is a rectangular parallelepiped. (1) The electronic components listed below. (3) The overall shape is a hexahedron, and at least one of the edges and corners of the hexahedron is chamfered. (1) The electronic components listed below. (4) The cross-section in the orthogonal direction is formed in a circular shape, and the overall shape is cylindrical. (1) The electronic components listed below. (5) The outer circumferential surface of the base portion has a first surface that faces the substrate on which the electronic components are mounted. The first external electrode extension and the second external electrode extension are each positioned toward the first surface when viewed from the base portion. The pair of opposing portions are arranged in a direction perpendicular to the central portion obtained when the base portion is divided into three equal parts in the first direction. An electronic component listed in any one of (1) through (4). (6) The outer circumferential surface of the base portion has a first surface facing the substrate on which the electronic components are mounted, The first external electrode extension and the second external electrode extension are each positioned toward the first surface when viewed from the base portion. The first external electrode extension is positioned closer to the first surface than the second external electrode extension. The pair of opposing portions are located closer to the second external electrode body than the central portion when the base portion is divided into three equal parts in the first direction. An electronic component listed in any one of (1) through (4). (7) In the cross-section in the orthogonal direction, the first external electrode extension is formed in an annular shape, extending circumferentially along the edge of the first external electrode body. The second external electrode extension is formed in an annular shape, extending circumferentially along the edge of the second external electrode body. The pair of opposing parts are formed in an annular shape relative to each other. An electronic component listed in any one of (1) through (6). (8) The length of the pair of opposing portions in the first direction is 1 / 20 or more of the length of the base portion in the first direction. An electronic component listed in any one of (1) through (7). (9) The base portion has a plurality of internal electrodes and forms a capacitor. It is greater than or equal to 0 and less than or equal to 2 / 10. An electronic component listed in any one of (1) through (8). (10) The aforementioned base portion has a resistor and forms a resistive component. An electronic component listed in any one of (1) through (8). (11) The distance between the pair of opposing portions is 25 μm or more and 100 μm or less. An electronic component listed in any one of (1) through (10). (12) The pair of opposing parts are magnetically coupled to each other. An electronic component listed in any one of (1) through (11). (13) (7) The electronic components described above, An annular retaining portion extending circumferentially along the outer surface of the electronic component, An annular outer conductor portion extending circumferentially along the outer surface of the holding portion, A composite electronic component equipped with the following features. (14) The inner circumferential surface of the outer conductor portion is The annular first edge portion located at the end in the first direction of the inner circumferential surface of the outer conductor portion, The annular second edge portion located at the end in the second direction of the inner circumferential surface of the outer conductor portion, The annular intermediate portion located between the first edge and the second edge of the inner circumferential surface of the outer conductor portion, It has, The first and second edges are tapered. (13) The composite electronic component described above. (15) The first edge expands in diameter as it moves in the first direction, The second edge expands in diameter as it extends in the second direction. The inner circumferential surface of the outer conductor portion is convex in shape, with the intermediate portion protruding toward the electronic component. (14) The composite electronic component described above. (16) The first edge portion decreases in diameter as it moves in the first direction, The second edge portion decreases in diameter as it moves toward the second direction. The inner circumferential surface of the outer conductor portion is concave, with the intermediate portion recessed toward the outer circumferential side of the outer conductor. (14) The composite electronic component described above. [Explanation of Symbols]

[0087] 1, 1A, 1B, 1C, 1E, 1F Electronic Components 10, 10B, 10C 1st external electrode 11, 11B 1st external electrode body 14. First mounting surface side wall 15, 15B, 15C 1st external electrode extension 20, 20B, 20C 2nd external electrode 21, 21B 2nd external electrode body 24. Second mounting surface side wall portion 25, 25B, 25C 2nd external electrode extension 30, 30B, 30C base part 31 Dielectrics 32 Page 1 35, 35B 1st internal electrode 36, 36B 2nd internal electrode 40 Insulating layer 50, 50A, 50B, 50C, 50D Opposite part 100, 100B, 100E Electronic Component Modules 101 circuit board 110 solder 200 coaxial cable 300 resistor 400 Composite Electronic Components 410 Holding part 420 Outer conductor section

Claims

1. It has a first external electrode, a base portion, and a second external electrode arranged sequentially in the first direction, The direction opposite to the first direction is defined as the second direction. The direction perpendicular to the first direction is defined as the orthogonal direction. The first external electrode is, A first external electrode body is positioned in the second direction from the second external electrode, separated from the base portion, A first external electrode extension extending in the first direction from the edge of the first external electrode body, It has, The aforementioned second external electrode is A second external electrode body is positioned in the first direction from the first external electrode, separated from the base portion, A second external electrode extension portion extending in the second direction from the edge of the second external electrode body, It has, A portion of the first external electrode extension and a portion of the second external electrode extension constitute a pair of opposing portions that face each other in the orthogonal direction. An insulating layer is provided between the pair of opposing parts. Electronic components.

2. The cross-section in the orthogonal direction is formed as a rectangle, and the overall shape is a rectangular parallelepiped. The electronic component according to claim 1.

3. The overall shape is a hexahedron, and at least one of the edges and corners of the hexahedron is chamfered. The electronic component according to claim 1.

4. The cross-section in the orthogonal direction is formed in a circular shape, and the overall shape is cylindrical. The electronic component according to claim 1.

5. The outer circumferential surface of the base portion has a first surface that faces the substrate on which the electronic components are mounted. The first external electrode extension and the second external electrode extension are each positioned toward the first surface when viewed from the base portion. The pair of opposing portions are arranged in a direction perpendicular to the central portion obtained when the base portion is divided into three equal parts in the first direction. The electronic component according to any one of claims 1 to 4.

6. The outer circumferential surface of the base portion has a first surface that faces the substrate on which the electronic components are mounted. The first external electrode extension and the second external electrode extension are each positioned toward the first surface when viewed from the base portion. The first external electrode extension is positioned closer to the base portion than the second external electrode extension. The pair of opposing portions are located closer to the second external electrode body than the central portion when the base portion is divided into three equal parts in the first direction. The electronic component according to any one of claims 1 to 4.

7. In the cross-section in the orthogonal direction, the first external electrode extension is formed in an annular shape, extending circumferentially along the edge of the first external electrode body. The second external electrode extension is formed in an annular shape, extending circumferentially along the edge of the second external electrode body. The pair of opposing parts are formed in an annular shape relative to each other. The electronic component according to any one of claims 1 to 4.

8. The length of the pair of opposing portions in the first direction is 1 / 20 or more of the length of the base portion in the first direction. The electronic component according to any one of claims 1 to 4.

9. The base portion has a plurality of internal electrodes and forms a capacitor. The electronic component according to any one of claims 1 to 4.

10. The aforementioned base portion has a resistor and forms a resistive component. The electronic component according to any one of claims 1 to 4.

11. The distance between the pair of opposing parts is 25 μm or more and 100 μm or less. The electronic component according to any one of claims 1 to 4.

12. The pair of opposing parts are magnetically coupled to each other. The electronic component according to any one of claims 1 to 4.

13. The electronic component described in claim 7, An annular retaining portion extending circumferentially along the outer surface of the electronic component, An annular outer conductor portion extending circumferentially along the outer surface of the holding portion, A composite electronic component equipped with the following features.

14. The inner circumferential surface of the outer conductor portion is The annular first edge portion located at the end in the first direction of the inner circumferential surface of the outer conductor portion, The annular second edge portion located at the end in the second direction of the inner circumferential surface of the outer conductor portion, The annular intermediate portion located between the first edge and the second edge of the inner circumferential surface of the outer conductor portion, It has, The first and second edges are tapered. The composite electronic component according to claim 13.

15. The first edge expands in diameter as it moves in the first direction, The second edge expands in diameter as it extends in the second direction. The inner circumferential surface of the outer conductor portion is convex in shape, with the intermediate portion protruding toward the electronic component. The composite electronic component according to claim 14.

16. The first edge portion decreases in diameter as it moves in the first direction, The second edge portion decreases in diameter as it moves in the second direction, The inner circumferential surface of the outer conductor portion is concave, with the intermediate portion recessed toward the outer circumferential side of the electronic component. The composite electronic component according to claim 14.

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