Electronic component detection device, electronic component detection method, and electronic component detection program

Abstract

To provide an electronic component detector, an electronic component detection method, and an electronic component detection program with which the accuracy of determining the presence of an electronic component is improved.SOLUTION: An electronic component detector 1 comprises: a holding unit 30 that has an optical path 35 that is shielded when an electronic component 12 is held; a light projection unit 31 that projects sensor light to the optical path 35; a light receiving unit 41 that receives sensor light having passed through the optical path 35; a drive unit 50 that causes the relative position of the holding unit 30 to the light receiving unit 41 to change; and a determination unit 90 that determines the presence of the electronic component 12 on the basis of the received amount of light in the light receiving unit 41. The determination unit 90 stores in memory the interrelationship of a change of received amount of light corresponding to a change of the relative position when the holding unit 30 is not holding the electronic component 12, identifies a detectable range of positions where the received amount of light exceeds a threshold from among the relative positions on the basis of the interrelationship, and determines a determination timing at which the presence of the electronic component 12 is determined, from within the identified detectable range of positions.SELECTED DRAWING: Figure 1

Description

[[Technical Field]]

[0001] The present invention relates to an electronic component detection device, an electronic component detection method, and an electronic component detection program. [[Background Art]]

[0002] An apparatus for picking up electronic components such as silicon dies may be provided with an electronic component detection device that determines whether an electronic component has been normally picked up or released.

[0003] For example, Patent Document 1 discloses a die bonder including: a processing head provided with a suction tool for sucking a die; a suction flow rate detection circuit including a detection flow path provided with a flow rate sensor and a bypass flow path; an air suction means for sucking air through the suction flow rate detection circuit; and a control unit including a determination means for determining that the die is sucked by the suction tool based on the detection result of the flow rate sensor. [[Prior Art Documents]] [[Patent Documents]]

[0004] [[Patent Document 1]] Japanese Unexamined Patent Application Publication No. 2014-179556 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0005] However, in the die bonder described in Patent Document 1, as the suction tool gradually deforms with use, the flow rate of suction air changes, which may result in decreased determination accuracy.

[0006] The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component detection device, an electronic component detection method, and an electronic component detection program with improved accuracy in determining the presence or absence of an electronic component. [[Means for Solving the Problem]]

[0007] An electronic component detection device according to one aspect of the present invention comprises: a holding unit configured to hold an electronic component and having an optical path that is blocked when the electronic component is held; a light emitting unit that emits sensor light into the optical path of the holding unit; a light receiving unit that receives the sensor light that has passed through the optical path of the holding unit; a drive unit that changes the relative position of the holding unit with respect to the light receiving unit; and a determination unit that determines the presence or absence of an electronic component in the holding unit based on the amount of light received by the light receiving unit. The determination unit stores the interrelationship of the change in the amount of light received by the light receiving unit in response to the change in relative position when the holding unit does not hold an electronic component, identifies a detectable position range from among the relative positions in which the amount of light received by the light receiving unit exceeds a threshold based on the interrelationship, and determines a determination timing for determining the presence or absence of an electronic component from among the identified detectable position range.

[0008] According to this embodiment, the presence or absence of an electronic component in the holding part is determined by the change in the amount of light received when the optical path is obstructed by the electronic component. Therefore, even if the holding part deteriorates over time, such as by deformation, the amount of light received will change sufficiently as long as the electronic component is held, so the presence or absence of the electronic component in the holding part can be accurately determined. Furthermore, based on the interrelationship between the change in relative position and the change in the amount of light received, a detectable position range in which a sufficient amount of light is guaranteed is identified, and the determination timing is determined from there. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting and light-receiving parts, an appropriate determination timing can be determined, thus suppressing detection failures.

[0009] In the above embodiment, the determination unit may determine the presence or absence of an electronic component in the holding unit at the determination timing based on a comparison between the amount of light received by the light receiving unit and a threshold value.

[0010] According to this embodiment, the presence or absence of electronic components can be determined at an appropriate timing, thereby suppressing detection failures.

[0011] In the above embodiment, the determination unit may store as a first timing the relative position at which the amount of light received by the light receiving unit changes from a state below a threshold to a state above a threshold when the holding unit does not hold an electronic component, as a second timing the relative position at which the amount of light received by the light receiving unit changes from a state above a threshold to a state below a threshold when the holding unit does not hold an electronic component, and may calculate and store as a determination timing an intermediate relative position between the first timing and the second timing.

[0012] According to this embodiment, since the determination timing has a large margin of error compared to the first and second timings, even if the detectable position range changes after the determination timing is determined, the determination timing is less likely to deviate from the detectable position range. Therefore, a sufficient amount of light can be guaranteed at the determination timing, and detection failures can be suppressed.

[0013] In the above embodiment, the determination unit may store the relative position at which the amount of light received by the light receiving unit is maximum as the determination timing.

[0014] According to this embodiment, even if the detectable position range changes after the determination timing has been decided, a decrease in the amount of light received can be suppressed. Therefore, a sufficient amount of light received can be guaranteed at the determination timing, and detection failures can be suppressed.

[0015] In the above embodiment, the holding portion may have an adsorption collet, and the optical path may be the suction hole of the adsorption collet.

[0016] According to this embodiment, there is no need to provide an optical path separate from the mechanism for holding electronic components in the holding section, thus simplifying the configuration.

[0017] In the above embodiment, the holding portion may be included in a bonding head that bonds electronic components to a substrate.

[0018] In the above aspect, the determination unit may determine whether or not the electronic component is present in the holding unit during the forward path in which the holding unit conveys the electronic component to the substrate.

[0019] According to this aspect, the presence or absence of the electronic component held for bonding can be detected. For example, if it is determined at an early stage that no electronic component is held on the forward path, unnecessary operations of the bonding head can be reduced.

[0020] In the above aspect, the determination unit may store the correlation on the same path as the forward path and determine the determination timing before starting bonding.

[0021] According to this aspect, the correlation between the change in relative position and the change in the amount of received light on the same path as the actual forward path is stored, so the accuracy of determination timing can be improved.

[0022] In the above aspect, the determination unit may determine whether or not the electronic component is present in the holding unit during the return path in which the holding unit conveys the electronic component to the substrate.

[0023] According to this aspect, an electronic component that remains held by the holding unit due to a bonding failure can be detected. At this time, the bonding head may convey the held electronic component to the substrate again for bonding, or may release it into a collection box. Therefore, it is possible to suppress damage to electronic components and the like caused by contact between the electronic components when attempting to pick up the next electronic component while holding an electronic component.

[0024] In the above aspect, the determination unit may store the correlation during the return path in which the holding unit conveys the electronic component to the substrate and determine the determination timing.

[0025] According to this aspect, when performing continuous bonding, the determination timing can be corrected as appropriate. Therefore, even when the detectable position range fluctuates due to temporal changes in the mounting positions and mounting angles of the light projecting unit and the light receiving unit during continuous bonding, detection failures can be suppressed.

[0026] In the above aspect, the determination unit may determine the threshold value based on the amount of light projected from the light projecting unit.

[0027] According to this aspect, even when the amount of projected light fluctuates, an appropriate detectable position range can be specified, and appropriate determination timing can be determined.

[0028] An electronic component detection method according to another aspect of the present invention uses an electronic component detection device including: a holding portion configured to be capable of holding an electronic component and having an optical path that is blocked when the electronic component is held; a light projecting portion that projects sensor light onto the optical path of the holding portion; a light receiving portion that receives the sensor light that has passed through the optical path of the holding portion; a driving portion that changes the relative position of the holding portion with respect to the light receiving portion; and a determination portion that determines the presence or absence of an electronic component in the holding portion based on the amount of light received by the light receiving portion. The method comprises: storing a correlation of changes in the amount of light received by the light receiving unit according to changes in the relative position when the holding unit does not hold an electronic component; and specifying, based on the correlation, a detectable position range where the amount of light received by the light receiving unit exceeds a threshold from among the relative positions, and determining determination timing for determining the presence or absence of an electronic component from within the specified detectable position range.

[0029] According to this embodiment, the presence or absence of an electronic component in the holding part is determined by the change in the amount of light received when the optical path is obstructed by the electronic component. Therefore, even if the holding part deteriorates over time, such as by deformation, the amount of light received will change sufficiently as long as the electronic component is held, so the presence or absence of the electronic component in the holding part can be accurately determined. Furthermore, based on the interrelationship between the change in relative position and the change in the amount of light received, a detectable position range in which a sufficient amount of light is guaranteed is identified, and the determination timing is determined from there. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting and light-receiving parts, an appropriate determination timing can be determined, thus suppressing detection failures.

[0030] An electronic component detection program according to another aspect of the present invention is an electronic component detection program for operating an electronic component detection device comprising: a holding part configured to hold an electronic component and having an optical path that is blocked when the electronic component is held; a light emitting part that emits sensor light into the optical path of the holding part; a light receiving part that receives the sensor light that has passed through the optical path of the holding part; a drive part that changes the relative position of the holding part with respect to the light receiving part; and a determination part that determines the presence or absence of an electronic component in the holding part based on the amount of light received by the light receiving part. The program causes a computer to store the interrelationship of the change in the amount of light received by the light receiving part in response to the change in relative position when the holding part does not hold an electronic component; to identify a detectable position range from among the relative positions in which the amount of light received by the light receiving part exceeds a threshold based on the interrelationship; and to determine a determination timing for determining the presence or absence of an electronic component from among the identified detectable position range.

[0031] According to this embodiment, the presence or absence of an electronic component in the holding part is determined by the change in the amount of light received when the optical path is obstructed by the electronic component. Therefore, even if the holding part deteriorates over time, such as by deformation, the amount of light received will change sufficiently as long as the electronic component is held, so the presence or absence of the electronic component in the holding part can be accurately determined. Furthermore, based on the interrelationship between the change in relative position and the change in the amount of light received, a detectable position range in which a sufficient amount of light is guaranteed is identified, and the determination timing is determined from there. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting and light-receiving parts, an appropriate determination timing can be determined, thus suppressing detection failures. [Effects of the Invention]

[0032] According to the present invention, it is possible to provide an electronic component detection device, an electronic component detection method, and an electronic component detection program that have improved accuracy in determining the presence or absence of electronic components. [Brief explanation of the drawing]

[0033] [Figure 1] This figure shows the configuration of an electronic component detection device according to one embodiment. [Figure 2] This is an enlarged view showing the configuration of the bonding head. [Figure 3] This flowchart shows the method for determining the timing of the judgment. [Figure 4] This flowchart shows a method for determining the presence or absence of electronic components. [Figure 5] This diagram shows how the timing of the judgment is determined. [Figure 6] This diagram illustrates a method for determining the presence or absence of electronic components. [Figure 7] This diagram illustrates a method for determining the presence or absence of electronic components. [Modes for carrying out the invention]

[0034] The embodiments of the present invention will be described below with reference to the drawings. The drawings of this embodiment are illustrative, and the dimensions and shapes of each part are schematic; therefore, the technical scope of the present invention should not be interpreted as being limited to this embodiment.

[0035] <Electronic component detection device> First, the configuration of an electronic component detection device 1 according to one embodiment of the present invention will be described with reference to Figures 1 and 2. Figure 1 is a diagram showing the configuration of an electronic component detection device according to one embodiment. Figure 2 is an enlarged view showing the configuration of a bonding head.

[0036] For convenience, Figures 1 and 2 include orthogonal coordinates consisting of the X, Y, and Z axes to explain positional relationships and directions of movement. The directions parallel to the X, Y, and Z axes are defined as the X-axis direction, Y-axis direction, and Z-axis direction, respectively. The X-axis direction is perpendicular to the plane of the paper, the Y-axis direction is horizontal to horizontal, and the Z-axis direction is vertical.

[0037] The electronic component detection device 1 is installed in a mounting device, also known as a die bonder, that bonds a die (semiconductor chip) 12 to a lead frame 21. The electronic component detection device 1 detects the die 12 being transported for bonding and determines whether it is being transported normally or not. The die 12 is an example of an electronic component, and the lead frame 21 is an example of a substrate.

[0038] Furthermore, the electronic components are not limited to the die 12, but may include, for example, active elements, passive elements, or MEMS devices. The substrate is not limited to the lead frame 21, but may include, for example, an interposer substrate, a semiconductor substrate, or a carrier plate.

[0039] The electronic component detection device 1 comprises a pickup unit 10, a bonding stage 20, a bonding head 30, a light receiving unit 41, a drive unit 50, and a determination unit 90.

[0040] The pickup unit 10 transports the wafer 11, which is the substrate containing the die 12, and supplies the die 12 to the bonding head 30. The pickup unit 10 corresponds to an example of an electronic component supply unit that supplies electronic components. The electronic component supply unit may be, for example, a tray feeder, a parts feeder, or a tape feeder.

[0041] The bonding stage 20 supplies the lead frame 21. The bonding stage 20 is also a stage for bonding the die 12 to the transported lead frame 21. The bonding stage 20 may also serve as a moving stage for transporting the lead frame 21. The bonding stage 20 is provided alongside the pickup unit 10 in the Y-axis direction. The bonding stage 20 corresponds to an example of a bonding unit where bonding of electronic components to a substrate is performed. The die bonder, including the electronic component detection device 1, may be configured with components not shown, such as a substrate supply unit that supplies substrates stored in a magazine, a loader that removes substrates from the magazine and transports them to the bonding unit, an unloader that transports substrates with mounted electronic components from the bonding unit and stores them in the magazine, guide rails that slide and transport the substrates, or a substrate index that aligns the substrates.

[0042] The bonding head 30 is configured to pick up the die 12. The bonding head 30 is also configured to bond the die 12 to the lead frame 21. The bonding head 30 includes a light-emitting section 31, a suction collet 33, and an optical path 35.

[0043] The light-emitting unit 31 emits sensor light SL into the optical path 35. The light-emitting unit 31 is the sensor head of the pair of sensor heads of the fiber sensor that is optically connected to the light-emitting element. The light-emitting unit 31 is provided at the end of the bonding head 30 on the drive unit 50 side. The light-emitting unit 31 has a light-emitting lens 32. The light-emitting lens 32 faces the optical path 35 in the Z-axis direction. The light-emitting unit 31 emits sensor light SL from the light-emitting lens 32 into the optical path 35.

[0044] The light-emitting unit 31 may further include a light-emitting sensor that detects the amount of light emitted by the sensor light SL.

[0045] The suction collet 33 is a holding tool that holds the die 12 by adsorption to its tip. The suction collet 33 is located at the end of the bonding head 30 opposite to the drive unit 50. The suction collet 33 is an example of a holding part configured to hold electronic components. However, the holding part is not limited to a suction collet as long as it is capable of holding electronic components. The holding part may be, for example, an electrostatic chuck that electrically attracts electronic components, or a mechanical chuck that mechanically supports electronic components.

[0046] The optical path 35 is a through-hole in the bonding head 30 that penetrates at least the suction collet 33 in the Z-axis direction. The optical path 35 is the suction hole of the suction collet 33 and is connected to a suction tool that draws in air to create negative pressure in the optical path 35. As shown in Figure 2, when the die 12 is held by the suction collet 33, the optical path 35 is blocked. That is, when the suction collet 33 holds the die 12, the sensor light SL is not emitted from the tip of the suction collet 33, and when the suction collet 33 does not hold the die 12, the sensor light SL is emitted from the tip of the suction collet 33.

[0047] Although not shown in the diagram, the bonding head 30 may further include a suction tool for drawing air from the optical path 35, a heating tool for heating the die 12, a cooling tool for cooling the die 12, and a purge gas supply tool for supplying a purge gas that forms a non-oxidizing atmosphere.

[0048] The light-receiving unit 41 receives the sensor light SL that has passed through the optical path 35. The light-receiving unit 41 is the sensor head of the pair of sensor heads of the fiber sensor that is optically connected to the light-receiving element. The light-receiving element is a photoelectric sensor and outputs an electrical signal of an intensity corresponding to the amount of light received. The light-receiving unit 41 has a light-receiving lens 42. In the transport path of the die 12 by the bonding head 30, the light-receiving lens 42 faces the light-emitting lens 32 across the optical path 35 in the Z-axis direction. The light-receiving unit 41 receives the sensor light SL with the light-receiving lens 42.

[0049] The drive unit 50 is an orthogonal robot that moves the bonding head 30 in the X-axis, Y-axis, and Z-axis directions. The drive unit 50 has an X-axis actuator 51, a Y-axis actuator 52, and a Z-axis actuator 53. The X-axis actuator 51 moves the bonding head 30 along the X-axis direction, the Y-axis actuator 52 moves the bonding head 30 along the Y-axis direction, and the Z-axis actuator 53 moves the bonding head 30 along the Z-axis direction.

[0050] When the bonding head 30 picks up the die 12, the drive unit 50 moves the bonding head 30 along the X-axis, Y-axis, and Z-axis directions. When the bonding head 30 transports the die 12 from the pickup unit 10 to the bonding stage 20, the drive unit 50, for example, fixes the bonding head 30 in the X-axis direction and moves it along the Y-axis and Z-axis directions. At this time, the drive unit 50 moves the bonding head 30 along a uniform transport path that passes above the light receiving unit 41. When the bonding head 30 bonds the die 12 to the lead frame 21, the drive unit 50 moves the bonding head 30 along the X-axis, Y-axis, and Z-axis directions.

[0051] Furthermore, the drive unit is not limited to a Cartesian robot, but may be a robot manipulator, for example. Also, the drive unit may move the light-receiving unit, or both the light-receiving and light-emitting units, as long as it changes the relative position of the light-emitting unit with respect to the light-receiving unit.

[0052] When moving a bonding head 30 that does not hold the die 12, the determination unit 90 identifies the detectable position range in the light receiving unit 41 where the amount of light received exceeds a threshold as the position of the bonding head 30 on the Y axis. The determination unit 90 also determines a determination timing to determine the presence or absence of the die 12 from within the detectable position range. When moving a bonding head 30 that holds the die 12, the determination unit 90 determines the presence or absence of the die 12 based on a comparison between the amount of light received at the determination timing and the threshold. Specifically, the determination unit 90 determines that the die 12 is held in the bonding head 30 when the amount of light received is less than the threshold, and determines that the die 12 is not held in the bonding head 30 when the amount of light received is greater than the threshold.

[0053] The determination unit 90 comprises a head control unit 91, a light transmission / reception control unit 92, a light intensity determination unit 93, a position information storage unit 94, and a timing determination unit 95. Each part of the determination unit 90 is composed of computer hardware, software, or a combination thereof. In other words, the determination unit 90 is executed by computer hardware, software, or their cooperation. The computer comprises a CPU (Central Processing Unit) and memory. The memory stores the program of the present invention. The CPU is configured to realize the functions of the head control unit 91, the light transmission / reception control unit 92, the light intensity determination unit 93, the position information storage unit 94, and the timing determination unit 95 by executing the program stored in memory.

[0054] The head control unit 91 controls the drive unit 50 to move the bonding head 30 in the X, Y, and Z directions. The head control unit 91 may also control the suction tool, heating tool, cooling tool, and purge gas supply tool of the bonding head 30 to cause the bonding head 30 to pick up, release, and bond the die 12.

[0055] The light-emitting and light-receiving control unit 92 controls the light-emitting unit 31 and the light-receiving unit 41. For example, when the bonding head 30 is moving along the transport path of the die 12, the light-emitting and light-receiving control unit 92 turns on the light-emitting element of the light-emitting unit 31 and the light-receiving element of the light-receiving unit 41. When the bonding head 30 is moving anywhere other than the transport path of the die 12, or when the bonding head 30 is stopped, the light-emitting and light-receiving control unit 92 turns off the light-emitting element of the light-emitting unit 31 and the light-receiving element of the light-receiving unit 41. The light-emitting and light-receiving control unit 92 may keep the light-emitting element of the light-emitting unit 31 and the light-receiving element of the light-receiving unit 41 constantly turned on while the electronic component detection device 1 is powered on.

[0056] The light intensity determination unit 93 compares the amount of light received with a threshold. Specifically, the light intensity determination unit 93 determines whether the amount of light received is less than or greater than the threshold. When moving a bonding head 30 that does not hold the die 12, the light intensity determination unit 93 compares the amount of light received with the threshold over substantially the entire transport path of the die 12 by the bonding head 30. Furthermore, when moving a bonding head 30 whose holding status of the die 12 is unknown, the light intensity determination unit 93 compares the amount of light received with the threshold at a determination timing determined by the timing determination unit 95. The light intensity determination unit 93 may also determine the threshold based on the minimum, maximum, and average values ​​of the amount of light received.

[0057] The light intensity determination unit 93 may also determine the light intensity by taking into account the amount of light emitted. Specifically, it may determine whether the difference or ratio between the amount of light emitted and the amount of light received is smaller than a threshold or larger than a threshold. The light intensity determination unit 93 may also determine the threshold based on the amount of light emitted, or it may determine the threshold based on the minimum, maximum, and average values ​​of the difference or ratio between the amount of light emitted and the amount of light received. The amount of light emitted is, for example, the set value of the light-emitting element, but it may also be a detected value detected by the light-emitting sensor.

[0058] The position information storage unit 94 stores position information of the bonding head 30 in the X-axis, Y-axis, and Z-axis directions. At this time, the position information storage unit 94 stores the determination result of the light intensity determination unit 93 in association with the position information. Specifically, it stores the interrelationship of changes in the amount of light received in response to changes in the position of the bonding head 30 when the bonding head 30 does not hold the die 12.

[0059] The timing determination unit 95 identifies a detectable position range, based on the interrelationships stored in the position information storage unit 94, in which the amount of light received when the bonding head 30 without holding the die 12 is moved is greater than or equal to a threshold. The timing determination unit 95 then determines a determination timing from within the identified detectable position range. The determination timing is the position in which the presence or absence of the die 12 is determined when the bonding head 30 holding the die 12 is moved. When the bonding head 30 transports the die 12, it moves along a uniform transport path that passes above the light receiving unit 41. Therefore, the determination timing can be set to a position in which a sufficient amount of light is guaranteed when the bonding head 30 does not hold the die 12. Consequently, at this determination timing, when the bonding head 30 holds the die 12, the amount of light received is less than the threshold, and when the bonding head 30 does not hold the die 12, the amount of light received is greater than or equal to the threshold.

[0060] The determination timing is determined, for example, at the center of the detectable position range. If the bonding head 30 moves along the Y-axis above the light receiving unit 41, the determination timing is determined at an intermediate position in the Y-axis direction within the detectable position range. Specifically, the determination timing is determined at an intermediate position between the point where the amount of light received changes from below a threshold to above a threshold when the bonding head 30 is not holding the die 12, and the point where the amount of light received changes from above a threshold to below a threshold.

[0061] Furthermore, the determination timing is not limited to the intermediate position. The determination timing may be appropriately determined from within the detectable position range, for example, it may be determined to the position where the amount of light received is maximum when the bonding head 30 is not holding the die 12.

[0062] <Electronic component detection method> Next, with reference to Figures 3 to 7, a method for detecting electronic components using an electronic component detection device 1 according to one embodiment of the present invention will be described. Figure 3 is a flowchart showing a method for determining the judgment timing. Figure 4 is a flowchart showing a method for determining the presence or absence of an electronic component. Figure 5 shows the process of determining the judgment timing. Figures 6 and 7 show the process of determining the presence or absence of an electronic component. The horizontal axis of the timing chart shown at the bottom of Figures 5 to 6 indicates the position of the light-emitting unit 31 in the Y-axis direction.

[0063] First, the method for determining the judgment timing will be explained with reference to Figure 3. Initially, it is confirmed that the die 12 is not held in the bonding head 30 (S11), and the operation of the light-emitting unit 31 and the light-receiving unit 41 is started (S12). Light emission is started from the light-emitting element of the light-emitting unit 31, and the light-receiving element of the light-receiving unit 41 is made ready to receive light. Step S12 is performed by the light emission and reception control unit 92 of the judgment unit 90.

[0064] Next, the bonding head 30 is moved along the forward path during the bonding operation (S13). When the bonding head 30 bonds the die 12, the bonding head 30 moves along the forward path of the transport route while holding the die 12, releases the die 12 from the lead frame 21, and moves along the return path of the transport route in the opposite direction to the forward path without holding the die 12. In step S13, the bonding head 30 is moved along the same path as the forward path, but without holding the die 12. Step S13 is performed by the head control unit 91 of the determination unit 90.

[0065] Next, the correlation between changes in the position of the bonding head 30 and changes in the amount of received light is stored (S14). As shown in FIG. 5, when the bonding head 30 holding the die 12 moves on the forward path, the amount of received light is equal to or greater than the threshold value within the position range where the light receiving lens 42 of the light receiving unit 41 is located on the extension line of the optical path 35. The amount of received light is smaller than the threshold value before and after the position range where the light receiving lens 42 of the light receiving unit 41 is located on the extension line of the optical path 35. A position at which the amount of received light changes from a state below the threshold to a state above the threshold is stored as a first timing T1, and a position at which the amount of received light changes from a state above the threshold to a state below the threshold is stored as a second timing T2. The interval between the first timing T1 and the second timing T2 is substantially equal to the dimension of the light receiving lens 42 in the Y-axis direction. Step S14 is executed by the light amount determination unit 93 and the position information storage unit 94 of the determination unit 90.

[0066] Next, a determination timing TD is determined from the detectable position range (S15). As shown in FIG. 5, the position range from the first timing T1 to the second timing T2 is specified as a detectable position range where the amount of received light exceeds the threshold. Next, an intermediate position between the first timing T1 and the second timing T2 is calculated and stored as the determination timing TD. That is, the determination timing TD is calculated by the following formula: TD=(T1+T2) / 2. Step S15 is executed by the timing determination unit 95 of the determination unit 90.

[0067] Note that the determination timing TD is not limited to TD=(T1+T2) / 2 as long as it satisfies the relationship T1<TD<T2. It may satisfy T1<TD<(T1+T2) / 2, or may satisfy (T1+T2) / 2<TD<T2.

[0068] Next, a method for determining the presence or absence of an electronic component will be described with reference to FIG. 4. First, the die 12 is picked up from the pickup unit 10 (S21), and the die 12 is conveyed by the bonding head 30 (S22). Steps S21 and S22 are executed by the head control unit 91 of the determination unit 90.

[0069] Next, at the judgment timing TD on the forward path, the presence or absence of the die 12 is determined (S23). As shown in Figure 6, when the bonding head 30 reaches the judgment timing TD, a judgment process is executed that compares the amount of light received with a threshold. If the amount of light received in the judgment process falls below the threshold, it is determined that the die 12 is present in the bonding head 30, i.e., the pickup of the die 12 has been successfully performed, and the process proceeds to the next step. If the amount of light received in the judgment process exceeds the threshold, it is determined that the die 12 is not present in the bonding head 30, i.e., the pickup of the die 12 has not been successfully performed, and the process is restarted from step S21. At this time, the bonding head 30 is returned to the position of the pickup unit 10, and the die 12 is picked up from the pickup unit 10. Step S23 is executed by the light intensity judgment unit 93 and the head control unit 91 of the judgment unit 90.

[0070] When the bonding head 30 determines that the die 12 is present, the die 12 is bonded to the lead frame 21 (S24), and the presence or absence of the die 12 is determined at the return-path determination timing TD (S25). As shown in Figure 7, similar to step S23, a determination process is executed that compares the amount of light received with a threshold, triggered when the bonding head 30 reaches the determination timing TD. If the amount of light received exceeds the threshold in the determination process, it is determined that the die 12 is not present in the bonding head 30, i.e., the release of the die 12 was performed successfully, and the determination of the presence or absence of the electronic component is terminated. If the amount of light received falls below the threshold in the determination process, it is determined that the die 12 is present in the bonding head 30, i.e., the release of the die 12 was not performed successfully, and the process is restarted from step S24. At this time, the bonding head 30 is returned to the position of the bonding stage 20, and the die 12 is bonded to the lead frame 21. Step S24 is performed by the head control unit 91 of the determination unit 90, and step S25 is performed by the light intensity determination unit 93 and the head control unit 91 of the determination unit 90.

[0071] Furthermore, if it is determined in step S25 that the release of the die 12 has not been performed correctly, the die 12 held by the bonding head 30 may be released into a recovery box (not shown). Such a recovery box may be provided, for example, between the pickup unit 10 and the light receiving unit 41 in the transport path of the bonding head 30. This allows the die 12 to be released after the determination in step S25 without removing the bonding head 30 from the return path. Therefore, the pickup of the next die 12 can begin immediately, improving manufacturing efficiency.

[0072] As described above, an electronic component detection device 1 according to one aspect of the present invention includes a suction collet 33 having an optical path 35 that is blocked when the die 12 is held, a light emitting unit 31 that emits sensor light SL into the optical path 35, a light receiving unit 41 that receives the sensor light SL that has passed through the optical path 35, a drive unit 50 that moves the bonding head 30, and a determination unit 90 that determines the presence or absence of the die 12 based on the amount of light received. The determination unit 90 stores the interrelationship of changes in the amount of light received in response to changes in the position of the bonding head 30, identifies a detectable position range in which the amount of light received exceeds a threshold based on the interrelationship, and determines a determination timing TD from within the detectable position range.

[0073] According to this method, the presence or absence of the die 12 in the suction collet 33 is determined by the change in the amount of light received when the optical path 35 is blocked by the die 12. Therefore, even if the suction collet 33 deteriorates over time, such as through deformation, the amount of light received will change sufficiently as long as the die 12 is held, so the presence or absence of the die 12 in the suction collet 33 can be accurately determined. Furthermore, a detectable position range in which a sufficient amount of light is guaranteed is identified based on the relationship between the change in the position of the bonding head 30 and the change in the amount of light received, and the determination timing is determined from there. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting unit 31 and the light-receiving unit 41, an appropriate determination timing TD can be determined, thereby suppressing detection failures.

[0074] In one embodiment, the determination unit 90 determines the presence or absence of the die 12 in the adsorption collet 33 based on a comparison of the amount of light received and a threshold at the determination timing TD.

[0075] According to this, the presence or absence of the die 12 can be determined at the appropriate judgment timing TD, thereby suppressing detection failures.

[0076] In one embodiment, the determination unit 90 stores a first timing T1 when the amount of received light changes from a state below a threshold to a state above a threshold, and a second timing T2 when the amount of received light changes from a state above a threshold to a state below a threshold, and calculates an intermediate position between the first timing T1 and the second timing T2 and stores it as the determination timing TD.

[0077] According to this, since the determination timing TD has a large margin of error relative to the first timing T1 and the second timing T2, even if the detectable position range changes after the determination timing TD is determined, the determination timing TD is unlikely to deviate from the detectable position range. Therefore, sufficient light reception can be guaranteed at the determination timing TD, and detection failures can be suppressed.

[0078] In one embodiment, the determination unit 90 stores the position where the amount of received light is maximum as the determination timing TD.

[0079] According to this, even if the detectable position range changes after the determination timing TD is set, a decrease in the amount of light received can be suppressed. Therefore, a sufficient amount of light received can be guaranteed at the determination timing TD, and detection failures can be suppressed.

[0080] In one embodiment, the optical path 35 is the suction hole of the adsorption collet 33.

[0081] According to this, there is no need to provide an optical path 35 separately from the mechanism for holding the die 12, thus simplifying the configuration of the bonding head 30.

[0082] In one embodiment, the suction collet 33 is included in a bonding head that bonds the die 12 to the lead frame 21.

[0083] In one embodiment, the determination unit 90 determines the presence or absence of the die 12 in the suction collet 33 during the forward journey when the suction collet 33 transports the die 12 to the lead frame 21.

[0084] According to this, it is possible to detect whether or not the die 12 is held for bonding. For example, if it is determined early on that the die 12 is not held during the forward pass, unnecessary operation of the bonding head 30 can be reduced.

[0085] In one embodiment, the determination unit 90 stores the relationships along the same path as the outbound journey before starting bonding and determines the determination timing TD.

[0086] According to this, the accuracy of the determination timing TD can be improved by storing the interrelationship between the change in the position of the bonding head 30 and the change in the amount of light received along the same path as the actual outbound journey.

[0087] In one embodiment, the determination unit 90 determines the presence or absence of the die 12 in the suction collet 33 on the return path when the suction collet 33 has transported the die 12 to the lead frame 21.

[0088] According to this, it is possible to detect a die 12 that remains held in the suction collet 33 due to a bonding failure. At this time, the bonding head may transport the held die 12 to the substrate again for bonding, or it may release it into the recovery box. Therefore, it is possible to prevent damage to the dies 12, etc., by preventing them from coming into contact with each other when trying to pick up the next die 12 while still holding the previous die 12.

[0089] In one embodiment, the determination unit 90 stores the relationships on the return path when the suction collet 33 transports the die 12 to the lead frame 21, and determines the determination timing TD.

[0090] According to this, the determination timing TD can be adjusted as appropriate when bonding is performed continuously. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting unit 31 and the light-receiving unit 41 over time when bonding is performed continuously, detection failures can be suppressed.

[0091] In one embodiment, the determination unit 90 determines a threshold value based on the amount of light emitted.

[0092] According to this method, even when the amount of light emitted fluctuates, it is possible to identify an appropriate detectable position range and determine an appropriate timing for judgment.

[0093] Another embodiment of the present invention is an electronic component detection method using an electronic component detection device 1, which includes storing the interrelationship of changes in the amount of light received in response to changes in the position of a bonding head 30, identifying a detectable position range in which the amount of light received exceeds a threshold based on the interrelationship, and determining a determination timing TD from within the detectable position range.

[0094] According to this method, the presence or absence of the die 12 in the suction collet 33 is determined by the change in the amount of light received when the optical path 35 is blocked by the die 12. Therefore, even if the suction collet 33 deteriorates over time, such as through deformation, the amount of light received will change sufficiently as long as the die 12 is held, making it possible to accurately determine the presence or absence of the die 12 in the suction collet 33. Furthermore, based on the interrelationship between the change in the position of the bonding head 30 and the change in the amount of light received, a detectable position range in which a sufficient amount of light is guaranteed is identified, and the determination timing TD is determined from there. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting unit 31 and the light-receiving unit 41, an appropriate determination timing TD can be determined, thereby suppressing detection failures.

[0095] Another embodiment of the present invention is an electronic component detection program for operating an electronic component detection device 1, which causes a computer to store the interrelationship of changes in the amount of light received in response to changes in the position of the bonding head 30, to identify a detectable position range in which the amount of light received exceeds a threshold based on the interrelationship, and to determine a determination timing TD from within the detectable position range.

[0096] According to this method, the presence or absence of the die 12 in the suction collet 33 is determined by the change in the amount of light received when the optical path 35 is blocked by the die 12. Therefore, even if the suction collet 33 deteriorates over time, such as through deformation, the amount of light received will change sufficiently as long as the die 12 is held, making it possible to accurately determine the presence or absence of the die 12 in the suction collet 33. Furthermore, based on the interrelationship between the change in the position of the bonding head 30 and the change in the amount of light received, a detectable position range in which a sufficient amount of light is guaranteed is identified, and the determination timing TD is determined from there. Therefore, even if the detectable position range changes due to changes in the mounting position and mounting angle of the light-emitting unit 31 and the light-receiving unit 41, an appropriate determination timing TD can be determined, thereby suppressing detection failures.

[0097] Furthermore, the electronic component detection device, electronic component detection method, and electronic component detection program according to one aspect of the present invention may be applied to mounting devices other than die bonders, for example, to a flip-chip bonder. When the electronic component detection device is installed in a flip-chip bonder, the detection of electronic components may be performed in the pickup head that inverts the electronic components, or in the flux supply unit that transfers flux to the bump electrodes of the electronic components. Also, the detection of electronic components may be performed between the electronic component supply unit and the flux supply unit, or between the flux supply unit and the substrate supply unit. The electronic component detection device, electronic component detection method, and electronic component detection program according to one aspect of the present invention may be installed in various devices other than mounting devices, such as transport devices or resin encapsulation devices.

[0098] As described above, according to one aspect of the present invention, it is possible to provide an electronic component detection device, an electronic component detection method, and an electronic component detection program that have improved accuracy in determining the presence or absence of electronic components.

[0099] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of Symbols]

[0100] 1…Electronic component detection device 10... Pickup section 11… Wafer 12... Die 20…Bonding stage 21… Lead frame 30…Bonding head 31… Floodlight section 32... Floodlight lens 33... Adhesive Collet 35...Light path 41...Light receiving section 42…Light-receiving lens 50…Drive unit 51...X-axis actuator 52…Y-axis actuator 53...Z-axis actuator 90...Judgment section 91...Head Control Unit 92... Transmitting and Receiving Light Control Unit 93...Light amount determination section 94...Position information storage unit 95... Timing determination unit SL...Sensor light

Claims

1. A bonding head having an optical path that is blocked when an electronic component is held and a holding portion for holding the electronic component, for bonding the electronic component to a predetermined position, The bonding head includes a light-emitting unit that emits sensor light into the optical path of the holding portion, A light receiving unit that receives the sensor light that has passed through the optical path of the holding unit, A drive unit that changes the relative position of the holding unit with respect to the light receiving unit, A determination unit determines the presence or absence of the electronic component in the holding unit based on the amount of light received by the light receiving unit. Equipped with, The determination unit, When the holding part does not hold the electronic component, the interrelationship of the changes in the amount of light received by the light receiving part in response to the change in the relative position is stored. Based on the aforementioned interrelationships, a detectable position range in which the amount of light received by the light receiving unit exceeds a threshold is identified from among the relative positions, and a determination timing is determined for determining the presence or absence of the electronic component within the identified detectable position range. Electronic component detection device.

2. The determination unit determines, at the determination timing, the presence or absence of the electronic component in the holding unit based on a comparison between the amount of light received by the light receiving unit and the threshold value. The electronic component detection device according to claim 1.

3. The determination unit, When the holding part does not hold the electronic component, the relative position in the light receiving part where the amount of light received changes from below the threshold to above the threshold is stored as a first timing. When the holding part does not hold the electronic component, the relative position in the light receiving part where the amount of light received changes from a state above the threshold to a state below the threshold is stored as a second timing. The relative position between the first timing and the second timing is calculated and stored as the determination timing. The electronic component detection device according to claim 1.

4. The determination unit stores the relative position at which the amount of light received by the light receiving unit is maximum as the determination timing. The electronic component detection device according to claim 1.

5. The holding portion has an adsorption collet, The optical path is the suction hole of the adsorption collet. The electronic component detection device according to claim 1.

6. The determination unit determines the presence or absence of the electronic component in the holding unit during the forward journey in which the holding unit transports the electronic component to the substrate. The electronic component detection device according to claim 1.

7. The determination unit, before starting bonding, stores the interrelationships along the same path as the forward journey and determines the determination timing. The electronic component detection device according to claim 6.

8. The determination unit determines the presence or absence of the electronic component in the holding unit during the return journey when the holding unit has transported the electronic component to the substrate. The electronic component detection device according to claim 1.

9. The determination unit stores the interrelationships on the return journey when the holding unit transports the electronic components to the substrate, and determines the determination timing. The electronic component detection device according to claim 1.

10. The determination unit determines the threshold value based on the amount of light emitted by the light-emitting unit. The electronic component detection device according to claim 1.

11. A bonding head having an optical path that is blocked when an electronic component is held and a holding portion for holding an electronic component, for bonding the electronic component to a predetermined position, The bonding head includes a light-emitting unit that emits sensor light into the optical path of the holding portion, A light receiving unit that receives the sensor light that has passed through the optical path of the holding unit, A drive unit that changes the relative position of the holding unit with respect to the light receiving unit, A determination unit determines the presence or absence of the electronic component in the holding unit based on the amount of light received by the light receiving unit. An electronic component detection method using an electronic component detection device equipped with, The system stores the interrelationship of changes in the amount of light received by the light receiving unit in response to changes in the relative position when the holding unit does not hold the electronic component, Based on the aforementioned interrelationships, the process includes identifying a detectable position range from among the relative positions in which the amount of light received by the light receiving unit exceeds a threshold, and determining a determination timing for determining the presence or absence of the electronic component from among the identified detectable position ranges. Electronic component detection method.

12. A bonding head having an optical path that is blocked when an electronic component is held and a holding portion for holding an electronic component, for bonding the electronic component to a predetermined position, The bonding head includes a light-emitting unit that emits sensor light into the optical path of the holding portion, A light receiving unit that receives the sensor light that has passed through the optical path of the holding unit, A drive unit that changes the relative position of the holding unit with respect to the light receiving unit, A determination unit determines the presence or absence of the electronic component in the holding unit based on the amount of light received by the light receiving unit. An electronic component detection program for operating an electronic component detection device equipped with, On the computer, The system stores the interrelationship of changes in the amount of light received by the light receiving unit in response to changes in the relative position when the holding unit does not hold the electronic component, Based on the aforementioned interrelationships, the system identifies a detectable position range from among the relative positions in which the amount of light received by the light receiving unit exceeds a threshold, and determines a determination timing for determining the presence or absence of the electronic component from within the identified detectable position range. Electronic component detection program.

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