Mounting device, mounting method, and mounting control program

Abstract

To provide a mounting apparatus or the like capable of accurately and quickly aligning a mounting body such as a semiconductor chip with respect to a mounted object such as a substrate, and mounting the mounting body at a target position on the mounted object with high accuracy in a short time.SOLUTION: A mounting device comprises: a mounting tool configured to acquire and hold a mounting body; a first imaging unit and a second imaging unit each having a field of view of viewing a stage from a side of a mounting tool, in which an optical system and an imaging element are disposed so as to satisfy a Scheimpflug condition such that a plane corresponding to a stage surface of the stage is a focal plane, and which images a mounted body index and a mounting body index specified in the field of view; a calculation part that calculates a relative position between the mounted body index and the mounting body index from a first image output from the first imaging unit and a second image output from the second imaging unit; and a mounting control part that corrects a position of the mounting body based on a calculation result of the calculation part and places the mounting body on the mounted body.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mounting device, a mounting method, and a mounting control program. [Background technology]

[0002] In a conventional bonding apparatus, one example of a mounting device, the workpiece, such as a die pad, is first imaged from directly above with a camera to confirm its position. Then, after retracting the camera, the head unit supporting the mounting tool is moved directly above the workpiece, and the bonding operation is performed. Bonding apparatuses employing this configuration not only require a long working time, but also suffer from the problem of accumulating movement errors relative to the target work position. Therefore, the use of an imaging unit employing a shineproof optical system that can image the workpiece from an oblique direction has been considered (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2014-179560 [Overview of the project] [Problems that the invention aims to solve]

[0004] In bonding apparatuses using imaging units employing a shine-proof optical system, conventional methods involved separately imaging the substrate and the semiconductor chip. The positional relationship between the substrate and the semiconductor chip was then determined based on the images of the substrate and the semiconductor chip in these separate images. Consequently, the accuracy of the semiconductor chip alignment relative to the substrate was low, and this alignment process was time-consuming.

[0005] The present invention was made to solve these problems and provides a mounting apparatus, mounting method, and mounting control program that can accurately and quickly align a mounted object such as a semiconductor chip with a substrate or other object to be mounted, and mount the mounted object to a target position on the substrate with high precision and in a short time. [Means for solving the problem]

[0006] A mounting apparatus in a first aspect of the present invention includes a mounting tool for acquiring and holding a mounted object, a first imaging unit and a second imaging unit having a field of view overlooking a stage from the side of the mounting tool, with their respective optical systems and image sensors arranged to satisfy a shineproof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, and imaging an object to be mounted and a mounted object index identified within the field of view, a calculation unit for calculating the relative position between the object to be mounted and the mounted object index from a first image output from the first imaging unit and a second image output from the second imaging unit, and a mounting control unit for correcting the position of the mounted object based on the calculation result of the calculation unit and placing the mounted object on the object to be mounted.

[0007] Furthermore, a second aspect of the present invention relates to a mounting method for an object, comprising a mounting tool for acquiring and holding an object, and a mounting apparatus having a field of view that overlooks a stage from the side of the mounting tool, wherein the optical systems and image sensors are arranged to satisfy shineproof conditions such that the plane corresponding to the stage surface of the stage becomes the focal plane, and the mounting method comprises an imaging step of imaging an object to be mounted and an object to be mounted, which are specified within the field of view, using the first and second imaging units; a calculation step of calculating the relative position between the object to be mounted and the object to be mounted from a first image output from the first imaging unit and a second image output from the second imaging unit; and a mounting control step of correcting the position of the object to be mounted based on the calculation result of the calculation unit and placing the object to be mounted.

[0008] Furthermore, a third aspect of the present invention is a mounting control program that controls a mounting device comprising a mounting tool for acquiring and holding a mounted object, and a first imaging unit and a second imaging unit, the first imaging unit having a field of view overlooking a stage from the side of the mounting tool, and the optical systems and image sensors being arranged to satisfy shineproof conditions such that the plane corresponding to the stage surface of the stage becomes the focal plane, the program causing a computer to execute an imaging step of imaging a target object indicator and a mounted object indicator identified within the field of view using the first imaging unit and the second imaging unit, a calculation step of calculating the relative position between the target object indicator and the mounted object indicator from a first image output from the first imaging unit and a second image output from the second imaging unit, and a mounting control step of correcting the position of the mounted object based on the calculation result of the calculation unit and placing the mounted object on the target object. [Effects of the Invention]

[0009] The present invention provides a mounting apparatus that can accurately and quickly align a mounted object such as a semiconductor chip with a substrate or other object to be mounted, and can mount the mounted object to a target position on the substrate with high precision and in a short time. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic perspective view showing the main parts of the mounting device according to this embodiment. [Figure 2] This is a system configuration diagram of the mounting device. [Figure 3] This is an explanatory diagram for describing the Scheinproof optical system. [Figure 4] This is an explanatory diagram illustrating an example of a holding mechanism. [Figure 5] These are explanatory diagrams to illustrate the first and second images. [Figure 6] This is an explanatory diagram for explaining the principle of calculating three-dimensional coordinates. [Figure 7] This is a flowchart illustrating the processing steps of the arithmetic processing unit. [Figure 8] This is an explanatory diagram illustrating a modified example of the holding part. [Figure 9] This is an explanatory diagram illustrating a modified example of the holding part. [Figure 10] This is an explanatory diagram illustrating a modified example of the implementation index. [Figure 11] This is an explanatory diagram illustrating a modified example of the implementation index. [Modes for carrying out the invention]

[0011] The present invention will be described below through embodiments of the invention, but the invention claimed is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means to solve the problem. In each figure, if there are multiple structures having the same or similar configuration, in order to avoid complexity, some reference numerals may be assigned and others with the same reference numerals may be omitted.

[0012] Figure 1 is a schematic perspective view showing the main parts of the mounting apparatus 100 according to this embodiment. The mounting apparatus 100 is a bonding apparatus that places and bonds a semiconductor chip 310 to a bonding region 320 of a substrate 330. The substrate 330 is an example of a mounting object placed on the stage 220, and the bonding region 320 is an area corresponding to the bonding surface of the semiconductor chip 310, and has electrodes that bond to and conduct electricity to bumps formed on the bonding surface, for example. The semiconductor chip 310 is an example of a mounting object. Note that in Figure 1, the semiconductor chip 310 is separated from the bonding region 320. The substrate 330 is, for example, a lead frame. The bonding region 320 is, for example, a die pad.

[0013] The mounting device 100 mainly comprises a head unit 110, a mounting tool 120, a first imaging unit 130, and a second imaging unit 140. The head unit 110 supports the mounting tool 120, the first imaging unit 130, and the second imaging unit 140, and is movable in the height direction and the planar direction by a head drive motor 150. The height direction is the Z-axis direction, which is perpendicular to the planar direction, as shown in the figure. The planar direction is the horizontal direction defined by the X-axis direction and the Y-axis direction, as shown in the figure, and is also the direction of movement of the stage 220 mounted on the frame 210.

[0014] The mounting tool 120 has a holding portion 121 at its tip on the stage 220 side. The mounting tool 120 picks up the semiconductor chip 310 via the holding portion 121, places it on the bonding area 320 of the substrate 330 placed on the stage 220, and bonds it by applying pressure / heating. The mounting tool 120 is movable in the height direction relative to the head portion 110 by the tool drive motor 160.

[0015] The first imaging unit 130 is an imaging unit for imaging the semiconductor chip 310 and substrate 330 located below the mounting tool 120, and comprises a first optical system 131 and a first image sensor 132. Specifically, as will be described later, the first imaging unit 130 is obliquely mounted on the head unit 110 with its optical axis directed downward from the mounting tool 120. That is, the first imaging unit 130 has a field of view that overlooks the stage from the side of the mounting tool 120. The first optical system 131 and the first image sensor 132 are arranged to satisfy the Scheinproof condition such that the plane corresponding to the stage surface of the stage 220 becomes the focal plane. The plane corresponding to the stage surface of the stage 220 is, for example, a plane parallel to the stage surface of the stage 220.

[0016] The second imaging unit 140 is an imaging unit for imaging the semiconductor chip 310 and substrate 330 located below the mounting tool 120, and comprises a second optical system 141 and a second image sensor 142. Specifically, as will be described later, the second imaging unit 140 is obliquely mounted on the head unit 110 with its optical axis directed downward from the mounting tool 120, on the opposite side from the first imaging unit 130 with respect to the mounting tool 120. In other words, the second imaging unit 140 has a field of view that overlooks the stage from the side of the mounting tool 120. The second optical system 141 and the second image sensor 142 are arranged to satisfy the Scheinproof condition such that the plane corresponding to the stage surface of the stage 220 becomes the focal plane. The plane corresponding to the stage surface of the stage 220 is, for example, a plane parallel to the stage surface of the stage 220.

[0017] The semiconductor chip 310 has a mounting index 311 for identifying the position of the semiconductor chip 310. The substrate 330 also has a mounting index 331 for identifying the position on which the semiconductor chip 310 is mounted. The mounting index 311 and the mounting index 331 are reference indices that serve as reference marks. The mounting index 311 can be any object from which three-dimensional coordinates can be reliably calculated, such as a reference mark specially provided by printing or grooves, or an observable wiring pattern or edge on the mounting surface 312. The mounting index 331 can be any object from which three-dimensional coordinates can be reliably calculated, such as a reference mark specially provided by printing or engraving, or an observable wiring pattern, groove, or edge on the bonding area 320. In the first and second images described later, the mounting index 311 and the mounting index 331 are provided in different shapes to distinguish between the two indices. In this embodiment, the three-dimensional coordinates are calculated based on the XYZ coordinate system, which is a spatial coordinate system with the reference position of the head unit 110 as the origin. The mounted object index 311 and the mounted object index 331 are positioned within the field of view of the first imaging unit 130 and the second imaging unit 140 when they are imaged by the first imaging unit 130 and the second imaging unit 140.

[0018] Figure 2 is a system configuration diagram of the mounting device. The control system of the mounting device 100 mainly consists of an arithmetic processing unit 170, a storage unit 180, an input / output device 190, a first imaging unit 130, a second imaging unit 140, a head drive motor 150, and a tool drive motor 160. The arithmetic processing unit 170 is a processor (CPU: Central Processing Unit) that controls the mounting device 100 and performs program execution processing. The processor may be configured to work in conjunction with an arithmetic processing chip such as an ASIC (Application Specific Integrated Circuit) or a GPU (Graphics Processing Unit). The arithmetic processing unit 170 reads the position control program stored in the storage unit 180 and executes various processes related to position control.

[0019] The storage unit 180 is a non-volatile storage medium, and is composed of, for example, an HDD (Hard Disk Drive). In addition to programs that control and process the mounting device 100, the storage unit 180 can store various parameter values, functions, lookup tables, etc., used for control and calculations. In particular, the storage unit 180 stores a conversion table 181. The conversion table 181 is a lookup table that, as will be described in detail later, takes the coordinate values ​​of the mounting object index 311 shown in the first image and the mounting object index 311 shown in the second image as input and converts them to the three-dimensional coordinates (X1, Y1, Z1) of the mounting object index 311, and takes the coordinate values ​​of the under-mounted object index 331 shown in the first image and the under-mounted object index 331 shown in the second image as input and converts them to the three-dimensional coordinates (X2, Y2, Z2) of the under-mounted object index 331.

[0020] The input / output device 190 includes, for example, a keyboard, mouse, and display monitor, and is a device that accepts menu operations from the user and presents information to the user. For example, the arithmetic processing unit 170 may display the first image and the second image side by side on the display monitor, which is one of the input / output devices 190.

[0021] The first imaging unit 130 receives an imaging request signal from the arithmetic processing unit 170, specifically the image acquisition unit 171 (described later), performs imaging, and transmits the first image output by the first image sensor 132 as an image signal to the arithmetic processing unit 170. Similarly, the second imaging unit 140 receives an imaging request signal from the arithmetic processing unit 170, performs imaging, and transmits the second image output by the second image sensor 142 as an image signal to the image acquisition unit 171.

[0022] The head drive motor 150 receives a drive signal from the arithmetic processing unit 170, specifically the mounting control unit 173 (described later), and moves the head unit 110 in the XYZ direction. The tool drive motor 160 receives a drive signal from the mounting control unit 173 and moves the bonding tool 120 in the Z direction.

[0023] The arithmetic processing unit 170 also serves as a functional arithmetic unit that performs various calculations in accordance with the processing instructed by the position control program. The arithmetic processing unit 170 can function as an image acquisition unit 171, a calculation unit 172, and an implementation control unit 173. The image acquisition unit 171 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140, and acquires the image signals of the first image and the second image.

[0024] The calculation unit 172 calculates the relative position between the mounted object index 311 and the mounted object index 331 by referring to the mounted object index 311 and the mounted object index 331 that are shown in the first image and the second image, respectively. For example, the following method can be used to calculate the relative position. That is, the three-dimensional coordinates (X1, Y1, Z1) of the mounted object index 311 and the three-dimensional coordinates (X2, Y2, Z2) of the mounted object index 331 are calculated. Specifically, the three-dimensional coordinates (X1, Y1, Z1) and (X2, Y2, Z2) are obtained using the conversion table 181. Then, the relative position between the mounted object index 311 and the mounted object index 331 is calculated using both three-dimensional coordinates. Specifically, the relative position of the mounted object index 331 with respect to the mounted object index 311 or the relative position of the mounted object index 311 with respect to the mounted object index 331 is calculated.

[0025] Furthermore, as will be described in more detail later, the mounting index 311 is provided so that the calculation unit 172 can determine the orientation of the semiconductor chip 310 in the planar direction. The calculation unit 172 refers to the mounting index 311 shown in the first and second images, respectively, and calculates the actual orientation of the semiconductor chip 310 in the planar direction. The calculation unit 172 then calculates the angle difference between the calculated actual orientation and the desired orientation of the semiconductor chip 310.

[0026] The mounting control unit 173 generates drive signals to drive the head drive motor 150 and the tool drive motor 160, and transmits them to each motor to perform mounting-related control. For example, the calculation unit 172 calculates the three-dimensional coordinates (X1, Y1, Z1) of the mounted object index 311 and the three-dimensional coordinates (X2, Y2, Z2) of the object to be mounted index 331, and calculates the relative position between the two coordinates. Based on this relative position, it generates a drive signal to bring the semiconductor chip 310 closer to the bonding area 320 so that the three-dimensional coordinates of the mounted object index 311 approach the three-dimensional coordinates of the object to be mounted index 331, and transmits this signal to the tool drive monitor 160.

[0027] The mounting control unit 173 generates a drive signal to rotate the semiconductor chip 310 so that the three-dimensional coordinates of the mounting index 311 do not move from (X1, Y1, Z1) by the amount of the angle difference calculated by the calculation unit 172. Then, it transmits this drive signal to the tool drive monitor 160.

[0028] Figure 3 is an explanatory diagram illustrating the Scheinproof optical system. The Scheinproof optical system described in Figure 3 is used in both the first imaging unit 130 and the second imaging unit 140, but here we will describe the Scheinproof optical system of the first imaging unit 130 as a representative example.

[0029] In Figure 3, plane S1 is the planned focal plane of the bonding region 320, which is arranged parallel to the stage surface of the stage 220. The virtual plane S2 is the plane containing the main plane of the first optical system 131, which consists of the object-side lens group 131a and the image-side lens group 131b. Plane S3 is the plane containing the light-receiving surface of the first image sensor 132. In this embodiment, the Scheinproof optical system includes the first optical system 131 and the first image sensor 132, which are arranged to satisfy the Scheinproof condition. An arrangement that satisfies the Scheinproof condition is one in which plane S1, virtual plane S2, and virtual plane S3 intersect each other on a common straight line P.

[0030] Note that Figure 3 shows the object-side lens group 131a and the bonding region 320 close together in order to clearly explain the Scheinproof condition, but in reality they are spaced apart as shown in Figure 1. The mounting tool 120 can move in the Z-axis direction in the space above the bonding region 320 without interfering with the first imaging unit 130. Also, in this embodiment, as will be described later, the first imaging unit 130 images the mounted object indicator 311 and the object to be mounted indicator 331 through the holding part 121. Here, in Figure 3, the holding part 121 and the semiconductor chip 310 are omitted in order to clearly explain the Scheinproof condition. In reality, when the first imaging unit 130 images the mounted object indicator 311 and the object to be mounted indicator 331, the semiconductor chip 310 held by the holding part 121 is close to the bonding region 320.

[0031] The aperture 133 is positioned between the object-side lens group 131a and the image-side lens group 131b, and restricts the light beam that passes through. The diameter of the aperture 133 determines the depth of field D P This can be adjusted. For example, the holding part 121 that holds the semiconductor chip 310 can adjust the depth of field D P Approaching the interior, the implementation indicator 311 is at depth of field D P Upon entering the interior, the first imaging unit 130 can capture images of both the mounted object indicator 311 and the mounted object indicator 331 in a focused state.

[0032] The second imaging unit 140 has the same configuration as the first imaging unit 130 and is arranged on the head unit 110 symmetrically with respect to the YZ plane including the central axis of the mounting tool 120. Therefore, the second imaging unit 140, like the first imaging unit 130, can capture images of both the mounted object indicator 311 and the object to be mounted indicator 331 in focus.

[0033] In this embodiment, bilateral telecentricity is achieved by the object-side lens group 131a and the image-side lens group 131b. This allows the object to be imaged on the image sensor at a constant magnification, which is convenient for calculating three-dimensional coordinates. In particular, in a Scheinproof optical system, it is desirable to have object-side telecentricity so that both the object located on the side of the line P and the object located on the side farther from the line P are imaged at the same magnification.

[0034] Figure 4 is a schematic perspective view showing the main parts of the holding portion 121 according to this embodiment. The holding portion 121 has a holding surface 122, a mounted object optical path region 123a, a mounted object optical path region 123b, and a suction tube 124. In Figure 4, the semiconductor chip 310 is separated from the bonding region 320. Also, the shaded areas indicate that they are made of materials that do not transmit light.

[0035] The retaining surface 122 is located on the tip side of the retaining portion 121, on the stage 220 side. The retaining surface 122 is a plane that holds the semiconductor chip 310. The shape of the retaining surface 122 is not limited to a circle, but may be a polygon such as a square or triangle, or a shape in which part or all of the outer edge is composed of curves.

[0036] The mounted object optical path region 123a is the region in the holding unit 121 through which the subject light beam L1 from the mounted object indicator 311 passes, reaching the first image sensor 132 and the second image sensor 142, respectively. The unmounted object optical path region 123b is the region in the holding unit 121 through which the subject light beam L2 from the unmounted object indicator 331 passes, reaching the first image sensor 132 and the second image sensor 142.

[0037] The holding portion 121 is composed of a light-transmitting material, with at least the mounted object optical path region 123a and the mounted object optical path region 123b being made of a light-transmitting material. The light-transmitting material is not particularly limited, but examples include glass such as quartz glass and resin such as acrylic resin.

[0038] The type of light-transmitting material is determined according to the first image sensor 132 and the second image sensor 142 used in the first imaging unit 130 and the second imaging unit 140, respectively. If the light that the first image sensor 132 and the second image sensor 142 can detect is visible light, a material that transmits visible light is selected as the light-transmitting material. The light that the first image sensor 132 and the second image sensor 142 can detect is not limited to visible light; for example, ultraviolet light or infrared light may also be used.

[0039] Furthermore, the light-transmitting member only needs to transmit enough light so that the first imaging unit 130 and the second imaging unit, described later, can detect the subject light beams L1 and L2 from the mounted object indicator 311 and the mounted object indicator 331. It is not particularly limited, but for example, it should transmit 30% or more of the light.

[0040] The suction tube 124 is provided near the center of the holding portion 121 and penetrates the holding portion 121 in the height direction. The suction tube 124 sucks the semiconductor chip 310 so that the holding surface 122 can hold the semiconductor chip 310.

[0041] The suction tube 124 is not limited to one; multiple tubes may be provided. However, it is desirable that it be provided in a position that does not overlap with the optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted. From this viewpoint, it is preferable that both the optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted do not overlap with the suction tube 124, and that the area of ​​the holding portion 121 other than these two areas is made of a material that does not transmit light.

[0042] Furthermore, when the mounting control unit 173 moves the mounting tool 120 to hold the semiconductor chip 310 in the holding unit 121, the position of the semiconductor chip 310 in the holding unit 121 may be slightly shifted from the target position. In this case as well, it is necessary for the first imaging unit 130 and the second imaging unit 140 to be able to observe the mounting indicator 311 and the under-mount indicator 331 through the mounting optical path region 123a and the under-mount optical path region 123b. Therefore, it is preferable that the mounting optical path region 123a and the under-mount optical path region 123b be provided with a certain size to take the above-mentioned shift into consideration.

[0043] The semiconductor chip 310 is held by the holding surface 312 by adsorption to the holding surface 122. The mounting index 311 is provided on the holding surface 312. The holding surface 122 covers the entire holding surface 312 so that the holding surface 312 is parallel to the stage surface, and makes close contact with the holding surface 312.

[0044] In this embodiment, the mounting index 311 is provided so that the calculation unit 172 can determine the horizontal orientation of the semiconductor chip 310. Specifically, the mounting index 311 is a pattern provided on the holding surface 312 by printing, and the pattern has one rotational symmetry. An example of a pattern having one rotational symmetry is a cross-shaped mark where two line segments extending along the x and y axes intersect, and the lengths from the intersection point of the two line segments to the four ends of the two line segments are all different. Alternatively, if two or more mounting indexes 311 are provided, the calculation unit 172 can determine the horizontal orientation of the semiconductor chip 310.

[0045] With the mounting control unit 173 bringing the semiconductor chip 310 close to the bonding region 320, the image acquisition unit 171 causes the first imaging unit 130 and the second imaging unit 140 to image the mounting indicator 311 and the mounting indicator 331. Specifically, the mounting control unit 173 brings the semiconductor chip 310 close to the bonding region 320 so that both the semiconductor chip 310 and the bonding region 320 are within the overlapping depth of field range of the first imaging unit 130 and the second imaging unit 140.

[0046] In the mounting apparatus 100 of this embodiment, when adjusting the position of the semiconductor chip 310, the mounting control unit 173 brings the semiconductor chip 310 close to the bonding area 320. Then, both the semiconductor chip 310 and the bonding area 320 can be captured in a single image by the first imaging unit 130 and the second imaging unit 140, respectively. As a result, the number of imaging cycles by the first imaging unit 130 and the second imaging unit 140 is minimized, and the position adjustment of the semiconductor chip 310 is performed in a short time. Furthermore, the semiconductor chip 310 is adjusted after the mounting control unit 173 brings the semiconductor chip 310 close to the bonding area 320. Therefore, after this position adjustment, errors associated with the movement of the mounting tool 120 to place the semiconductor chip 310 at the target position are reduced, and the semiconductor chip 310 is placed on the bonding area 320 with high precision.

[0047] When the semiconductor chip 310 is placed on the bonding region 320, in order to minimize the error in the position in which the semiconductor chip 310 is placed, it is necessary for the semiconductor chip 310 to be stably held by the holding portion 121 so as to be horizontal with respect to the bonding region 320. From this viewpoint, when the semiconductor chip 310 is held by the holding portion 121, it is preferable that the holding surface 122 is in close contact with the surface to be held 312 so as to cover the entire surface to be held 312.

[0048] However, when the mounting control unit brings the holding surface into close contact with the surface to be held so that the holding surface covers the surface to be held of the semiconductor chip, the mounting indicator on the surface to be held is covered by the holding surface, preventing the imaging unit from observing the mounting indicator. As a result, the calculation unit cannot calculate the three-dimensional coordinates of the semiconductor chip, and the mounting control unit cannot place the semiconductor chip at the target position on the bonding region.

[0049] Therefore, when the mounting control unit brings the holding surface into close contact with the surface to be held on the semiconductor chip so that the holding surface is in contact with a portion of the surface to be held, the imaging unit can observe the mounting index on the surface to be held, and the calculation unit can calculate the three-dimensional coordinates of the semiconductor chip. However, when the mounting control unit brings the holding surface into close contact with the surface to be held on the semiconductor chip so that the holding surface is in contact with a portion of the surface to be held, the semiconductor chip may bend or tilt relative to the bonding area and cannot be held stably. As a result, when the mounting control unit places the semiconductor chip on the bonding area, the error in the position of the semiconductor chip on the bonding area becomes large.

[0050] On the other hand, in the mounting apparatus 100 of this embodiment, even if the mounting control unit 173 brings the holding surface 122 into close contact with the surface to be held 312 so that the holding surface 122 covers the entire surface to be held 312, the first imaging unit 130 and the second imaging unit 140 can still image the mounting index 311 on the surface to be held 312. In other words, the mounting apparatus 100 of this embodiment can place the semiconductor chip 310 on the bonding region 320 while the semiconductor chip 310 is stably held by the holding part 121 so that it is horizontal to the bonding region 320. Therefore, in the mounting apparatus 100 of this embodiment, the mounting control unit 173 can place the semiconductor chip 310 on the bonding region 320 with high precision.

[0051] FIG. 5 is an explanatory diagram for describing a first image and a second image. The first image output from the first imaging unit 130 and the second image output from the second imaging unit 140 are focused on the mounted body index 311 and the mounted-on body index 331. On the other hand, since the first imaging unit 130 and the second imaging unit 140 are obliquely provided to the head unit 110 with their optical axes directed downward of the mounting tool 120, the first image and the second image are distorted into a trapezoidal shape. Furthermore, the distortion of the first image and the distortion of the second image are bilaterally symmetric. Therefore, the coordinate value (x 1A , y 1A ) extracted from the mounted body index 311 captured in the first image is different from the coordinate value (x 2A , y 2A ) extracted from the mounted body index 311 captured in the second image. Furthermore, the coordinate value (x 1B , y 1B ) extracted from the mounted-on body index 331 captured in the first image is different from the coordinate value (x 2B , y 2B ) extracted from the mounted-on body index 331 captured in the second image.

[0052] FIG. 6 is an explanatory diagram for describing the calculation principle of three-dimensional coordinates. In particular, it is a diagram describing a procedure for generating the conversion table 181. First, the calculation principle of the three-dimensional coordinates (X2, Y2, Z2) of the mounted-on body index 331 will be described.

[0053] The conversion table 181 is generated as follows. First, a chart 400 having the same thickness as the substrate 330 is placed on the stage 220 directly below the mounting tool 120. Next, the mounting control unit 173 brings the head unit 110 close to the chart 400, and sets the height Z of the head unit 110 from the stage 220 to Z=h nThe head unit 110 is adjusted to the following distance. In this case, the distance between the head unit 110 and the chart 400 is such that the chart 400 falls within the overlapping depth of field range of the first imaging unit 130 and the second imaging unit 140. Next, the mounting control unit 173 brings the holding unit 121 closer to the chart 400. In this case, the distance between the holding unit 121 and the chart 400 is such that the holding surface 122 and the chart 400 fall within the overlapping depth of field range of the first imaging unit 130 and the second imaging unit 140. Next, in this state, the image acquisition unit 171 causes the first imaging unit 130 and the second imaging unit 140 to image the chart 400, and causes the first imaging unit 130 and the second imaging unit 140 to output the first chart image and the second chart image, respectively. The conversion table 181 is generated using the first chart image and the second chart image.

[0054] Multiple dots 410 are printed in a matrix pattern at set intervals on the surface of chart 400. The height Z of the head unit 110 is set as Z = h1, h2, h3…h n The height is adjusted, and imaging of Chart 400 is performed at each height to obtain a pair of first and second chart images.

[0055] Since the first imaging unit 130 and the second imaging unit 140 employ a Shineproof optical system, the resulting chart image 400' is in focus across its entire surface, but each is distorted into a trapezoidal shape in opposite directions. If the image coordinate system has the x-axis as the horizontal axis and the y-axis as the vertical axis, the coordinates of the corresponding dot images 410' in the first chart image and the second chart image are (x 1k ,y 1k ), (x 2k ,y 2k It is calculated as follows:

[0056] The holding unit 121 is visible in the first and second chart images. The first imaging unit 130 and the second imaging unit 140 detect the subject light beam of dot 410A that passes through the holding unit 121 and the subject light beam of dot 410B that passes only through the atmosphere without passing through the holding unit 121. In this embodiment, the first imaging unit 130 and the second imaging unit 140 detect the subject light beam L1 from the mounted object indicator 311 and the subject light beam L2 from the mounted object indicator 331 that pass through the holding unit 121. Therefore, a conversion table 181 is generated for dot 410A.

[0057] For each dot 410 in chart 400, what is the coordinate (X) on stage 220? k ,Y k ) is known, and the coordinate h in the height direction k = Z K Since this is adjusted during imaging, the three-dimensional coordinates (X) of each dot 410 k ,Y k ,Z K The coordinates h in the height direction are determined at the time of shooting. k The coordinates (x) of each dot image 410' of the first chart image and the second chart image captured by [the camera]. 1k ,y 1k ), (x 2k ,y 2k Since the coordinates are calculated, the coordinate correspondence between each dot 410 and its image, the dot image 410', can be obtained. That is, discretely, for each height at which imaging is performed, the three-dimensional coordinates (X k ,Y k ,Z K ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k The correspondence between the two can be obtained. The calculation unit 172 can then calculate the three-dimensional coordinates of the object to be imaged relative to the reference coordinate system of the head unit 110. This correspondence is described in the conversion table 181.

[0058] The resulting transformation table 181 is written in this way and represents the three-dimensional coordinates (X k ,Y k ,ZK ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k This is a collection of data showing the correspondence between ) and can be used as a lookup table. In other words, by referring to the transformation table 181, the coordinate values ​​(x) of the implemented object index 331 in the first image can be found. 1B ,y 1B ) and the coordinate values ​​(x) of the implemented object index 331 in the second image 2B ,y 2B The calculated (x) can be converted to the three-dimensional coordinates (X2, Y2, Z2) of the implemented object index 331. 1B ,y 1B ) and (x 2B ,y 2B If the combination of ) does not exist in the conversion table 181, interpolation can be performed using the surrounding coordinates that exist in the conversion table 181.

[0059] Furthermore, not limited to the lookup table format conversion table 181, other methods can be used to obtain the coordinate values ​​(x) of the implemented object index 331 in the first image. 1B ,y 1B ) and the coordinate values ​​(x) of the implemented object index 331 in the second image 2B ,y 2B ) may be converted to the three-dimensional coordinates (X2, Y2, Z2) of the implementation index 331. For example, the three-dimensional coordinates (X k ,Y k ,Z K ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k From the correspondence between ), we can find the polynomial approximation function, and thereby (x 1B ,y 1B ) and (x 2B ,y 2B Alternatively, the coordinates can be converted from (X2, Y2, Z2). In this way, when using lookup tables or polynomial approximation functions generated based on measured data, error factors caused by components such as lens aberrations and mounting errors of the imaging unit are absorbed into the measured data, so a more accurate calculation of three-dimensional coordinates can be expected.

[0060] On the other hand, a transformation formula can be derived arithmetically using the geometric conditions of Scheinproof or the baseline length defined between the two image sensors, rather than relying on measured data. For example, a transformation matrix can be defined that converts a trapezoidal image to a rectangular image, with physical quantities such as the tilt angle of the optical system and image sensors as parameters, and trapezoidal correction can be performed on the first and second images using this transformation matrix. Then, the two trapezoidally corrected images can be used as a stereo image, and the three-dimensional coordinates of the object of observation can be calculated from the positional displacement of the images. This method is advantageous because it eliminates the need to acquire prior measured data using charts or the like.

[0061] Up to this point, the calculation principle for the three-dimensional coordinates (X2, Y2, Z2) of the implemented object index 331 has been explained. Next, the calculation principle for the three-dimensional coordinates (X1, Y1, Z1) of the implemented object index 311 will be explained. The calculation unit 172 refers to the conversion table 181 and calculates the coordinate values ​​(x) of the implemented object index 311 in the first image. 1A ,y 1A ) and the coordinate values ​​(x) of the implementation index 311 in the second image 2A ,y 2A ) is converted to the three-dimensional coordinates (X1, Y1, Z1) of the implementation index 311.

[0062] As described above, the conversion table 181 contains discrete three-dimensional coordinates (X) for each height Z of the head unit 110 when imaging is performed. k ,Y k ,Z K ) and two-dimensional coordinates (x 1k ,y 1k ), (x 2k ,y 2k The correspondence between the two is described. Here, when the calculation unit 172 calculates the three-dimensional coordinates of the implementation index 311, the height of the head unit 110 Z = h a Referring to the above correspondence, when the calculation unit 172 calculates the three-dimensional coordinates of the mounted object index 331, the height Z = h of the head unit 110 b Let's refer to the above correspondence. Here, when the first and second images are acquired, the mounting index 311 is closer to the head portion 110 in the height direction than the mounted index 331, so ha h is the distance that is adjacent to it. b It is smaller than that.

[0063] Furthermore, the conversion table 182, which the calculation unit 172 references to calculate the three-dimensional coordinates of the mounted object index 311, may be generated separately from the conversion table 181. The conversion table 182 is generated in the same way as the conversion table 181, except that the holding surface 122 is in close contact with the chart 400. In generating the conversion table 182, the distance between the holding unit 121 and the chart 400 is the same as the distance between the holding unit 121 and the semiconductor chip 310 when the image acquisition unit 171 actually causes the first imaging unit 130 and the second imaging unit 140 to image the mounted object index 311. Therefore, by the calculation unit 172 calculating the three-dimensional coordinates of the mounted object index 311 by referring to the conversion table 182, the calculation unit 172 can calculate the three-dimensional coordinates of the mounted object index 311 with higher accuracy.

[0064] Furthermore, when generating the conversion table 181, the distance between the holding unit 121 and the chart 400 may be changed, and multiple conversion tables 181 corresponding to the distance between the holding unit 121 and the chart 400 may be prepared.

[0065] Next, a series of mounting processes performed by the mounting device 100 will be described. Figure 7 is a flowchart illustrating the processing procedure of the arithmetic processing unit. Here, the process from the state in which the mounting tool 120 has attracted the semiconductor chip 310 to the bonding area 320 and then retracting will be described.

[0066] In step s101, the mounting control unit 173 transmits a drive signal to the head drive motor 150 and the tool drive motor 160 to move the head unit 110 and the mounting tool 120 to a reference position. Here, the reference position is the position where at least a portion of the semiconductor chip 310 and the bonding region 320 are located within the overlapping depth of field range of the first imaging unit 130 and the second imaging unit 140.

[0067] When the head unit 110 and the mounting tool 120 reach the reference position, the image acquisition unit 171 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140 in step s102, and acquires the first image data and the second image data, respectively. The image acquisition unit 171 then passes the acquired first image data and second image data to the calculation unit 172. In the first image data and the second image data, at least the mounted object index 331 is in focus.

[0068] In step s103, the calculation unit 172 determines whether or not it can extract the coordinate values ​​of the mounting index 311 and the mounted object index 331 from the first image data and the second image data received from the image acquisition unit 171.

[0069] The calculation unit 172 is unable to extract at least one of the coordinate values ​​of the mounted object index 311 and the mounted object index 331 in the following cases: when the surface to be held 312 on which the mounted object index 311 is located is outside the overlapping range of the depth of field of the first imaging unit 130 and the second imaging unit 140, and the mounted object index 311 is not in focus.

[0070] If the calculation unit 172 cannot extract at least one of the coordinate values ​​of the mounted object index 311 and the mounted object index 331 from the first and second image data received from the image acquisition unit 171, the mounting control unit 173 moves at least one of the head unit 110 and the mounting tool 120 to change the focus state for the mounted object index 311. Subsequently, the mounting control unit 173 and the image acquisition unit 171 execute steps s101 and s102 again, respectively. In the second step s102, the image acquisition unit 171 sends an imaging request signal to the first imaging unit 130 and the second imaging unit 140 to acquire the other first image data and the other second image data. The image acquisition unit 171 hands over the acquired other first image data and other second image data to the calculation unit 172. In the other first image data and other second image data, at least the mounted object index 311 is in focus.

[0071] As a method for changing the focus state with respect to at least one of the mounted body index 311 and the mounted-on body index 331, a method of adjusting the focus state by moving the focus lenses of the first optical system 131 and the second optical system 141 may be used.

[0072] When the calculation unit 172 can extract the coordinate values of the mounted body index 311 and the mounted-on body index 331 from the first image data and second image data received from the image acquisition unit 171, and other first image data and other second image data as necessary, the calculation unit 172 performs the following operation in step s104. That is, the calculation unit 172 obtains the coordinate values (x 1A , y 1A ) of the mounted body index 311 in the first image and the coordinate values (x 2A , y 2A ) of the mounted body index 311 in the second image, as well as the coordinate values (x 1B , y 1B ) of the mounted-on body index 331 in the first image and the coordinate values (x 2B , y 2B ) of the mounted-on body index 331 in the second image.

[0073] In step s105, the calculation unit 172 refers to the conversion table 181 to obtain the three-dimensional coordinates (X1, Y1, Z1) of the mounted body index 311 corresponding to the pair of (x 1A , y 1A ) and (x 2A , y 2A ), and the three-dimensional coordinates (X2, Y2, Z2) of the mounted-on body index 331 corresponding to the pair of (x 1B , y 1B ) and (x 2B , y 2B ). Then, the relative position between the mounted-on body index 331 and the mounted body index 311 is obtained.

[0074] Based on the obtained relative position, the mounting control unit 173 transmits a drive signal to the head drive motor 150 in step s106 so that the relative position in the horizontal plane becomes (0,0). As a result, the mounting index 311 is moved to the target position (X2,Y2) in the horizontal plane. That is, the position of the semiconductor chip 310 is corrected so that the coordinates of the mounted object index 331 and the mounting index 311 in the horizontal plane are the same. In addition, in step s106, the calculation unit 172 calculates the actual orientation of the semiconductor chip 310 in the planar direction by referring to the mounting index 311 shown in the first image and the second image, respectively. The calculation unit 172 then calculates the angle difference between the calculated actual orientation and the desired orientation of the semiconductor chip 310. The mounting control unit 173 generates a drive signal to rotate the semiconductor chip 310 so that the three-dimensional coordinates of the mounting index 311 do not move from (X1, Y1, Z1) by the amount of the angle difference calculated by the calculation unit 172, and transmits this drive signal to the tool drive motor 160. As a result, the semiconductor chip 310 faces the desired orientation.

[0075] When placing the semiconductor chip 310 on the bonding region 320, the mounting control unit 173 may use the center coordinates of the bonding region 320 as the target position and align the center coordinates of the semiconductor chip 310 with this target position. In this case, the positional relationship between the center coordinates of the semiconductor chip 310 and the mounting index 311, and the positional relationship between the center coordinates of the bonding region 320 and the mounting index 331 are known. Based on both positional relationships and the three-dimensional coordinates of the mounting index 311 and the mounting index 331, the semiconductor chip 310 is positioned at the target position on the bonding region 320.

[0076] After step s106, the arithmetic processing unit 170 may detect the deviation of the implementation index 311 from the target position and determine whether this deviation is within the target error range. If the result of the determination is that the deviation is outside the target error range, the arithmetic processing unit 170 may repeat steps s102 to s106.

[0077] In step s107, the mounting control unit 173 moves the mounting tool 120 closer to the bonding region 320 until the semiconductor chip 310, which is held in place by the mounting tool 120, is placed on the bonding region 320.

[0078] After step s107, the mounting control unit 173 places the semiconductor chip 310 onto the bonding area 320 and performs a mounting process to bond the die chip 310 to the bonding area 320. Once the mounting process is complete, in step s109, the mounting control unit 173 raises the mounting tool 120, retracts it from the bonded die chip 310, and terminates the series of processes.

[0079] The above describes an example in which at least the mounted object index 331 is in focus in the first and second image data of the first image. On the other hand, the mounted object index 311 may be in focus in the first and second image data of the first image. In this case, at least the mounted object index 331 is in focus in the other first and second image data. Otherwise, the arithmetic processing unit 170 processes in the same manner as in the example in which at least the mounted object index 331 is in focus in the first and second image data of the first image.

[0080] In the above description, a holding part 121 made of a light-transmitting material was used, but the configuration for observing the mounting index 311 of the adsorbed semiconductor chip 310 is not limited to this. Figure 8 is an explanatory diagram for illustrating a modified version of the holding part as the first modified example. Figure 8 corresponds to Figure 4, but elements that are the same as those already described are given the same numbering and their explanation is omitted unless otherwise specified.

[0081] The holding portion 121 has an end portion 126, a support column 125 that supports the end portion 126, and a suction tube 124. The space in the holding portion 121 other than the space in which the end portion 126, the suction tube 124, and the support column 125 are located is an opening space. The optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted are located in the opening space. The four support columns 125 are connected to the end portion 126 near its four corners, and connect the end portion 126 to the base portion 127 on the head portion 110 side of the mounting tool 120. Note that the support columns 125 may be located not only near the four corners of the end portion 126, but also in multiple locations near the outer edge of the end portion 126.

[0082] The end portion 126 is provided at the tip of the holding portion 121 on the stage 220 side. The end portion 126 is made of a material that does not transmit light. The end portion 126 has a holding surface 122 on the side facing the stage 220. The end portion 126 has an aperture space 126a in the optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted. That is, the optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted are formed as an aperture space throughout. As a result, the optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted have the same refractive index as the atmosphere throughout.

[0083] As described above, in the first modified example, the optical path region 123a of the mounted object and the optical path region 123b of the object to be mounted have the same refractive index as the atmosphere throughout, so the conversion table 181 is generated using the atmosphere as the medium. Specifically, the conversion table 181 is generated as follows. First, a chart 400 having the same thickness as the substrate 330 is placed on the stage 220 directly below the mounting tool 120. Next, the mounting control unit 173 brings the head unit 110 close to the chart 400 and sets the height Z of the head unit 110 from the stage 220 to Z=h nThe head unit 110 is adjusted to the following distance. In this case, the distance between the head unit 110 and the chart 400 is such that the chart 400 falls within the overlapping depth of field range of the first imaging unit 130 and the second imaging unit 140. The mounting control unit 173 also retracts the holding unit 121 away from the chart 400. In this state, the image acquisition unit 171 causes the first imaging unit 130 and the second imaging unit 140 to image the chart 400, and outputs the first chart image and the second chart image from the first imaging unit 130 and the second imaging unit 140, respectively. The conversion table 181 is generated using the first chart image and the second chart image obtained as described above. In the first modified example, since the mounting control unit 173 retracts the holding unit 121 away from the chart 400, the holding unit 121 does not appear in the first chart image and the second chart image.

[0084] Figure 9 is an explanatory diagram illustrating a modified version of the holding part, which is a second modified example. Figure 9 corresponds to Figure 4, but elements that are the same as those already described are given the same numbering unless otherwise specified, and their explanations are omitted.

[0085] The object to be mounted indicator 331 is located near the outer edge of the bonding region 320. Therefore, the subject light beam L2 from the object to be mounted indicator 331 does not pass through the holding portion 121. In other words, the object to be mounted optical path region 123b does not exist.

[0086] As described above, the holding unit 121 is visible in the first and second chart images. The first imaging unit 130 and the second imaging unit 140 detect the subject light beam of dot 410A that passes through the holding unit 121 and the subject light beam of dot 410B that passes only through the air without passing through the holding unit 121. In the second modified example, the first imaging unit 130 and the second imaging unit 140 detect the subject light beam L1 from the mounted object index 311 that passes through the holding unit 121 and the subject light beam L2 from the mounted object index 331 that passes only through the air without passing through the holding unit 121. Thus, a conversion table 181A for dot 410A and a conversion table 181B for dot 410B are generated. When the calculation unit 172 calculates the three-dimensional coordinates of the mounted object index 311, the calculation unit 172 refers to the conversion table 181A. Furthermore, when the calculation unit 172 calculates the three-dimensional coordinates of the mounted object index 331, the calculation unit 172 refers to the conversion table 181B.

[0087] Furthermore, although the above description has described an embodiment that assumes the mounting index 311 is located on the retained surface 312 of the semiconductor chip 310, the mounting index 311 may be located in a place other than the retained surface 312.

[0088] Figures 10 and 11 are explanatory diagrams illustrating modified examples of the mounting index. Based on Figures 10 and 11, the case where the mounting index 311 is located on the holding surface 122 of the mounting tool 120 will be explained. Elements identical to those already described will be given the same numbering and their explanations will be omitted unless otherwise specified.

[0089] As shown in Figure 10, the mounting apparatus 100 has an upward-view imaging unit 500. The upward-view imaging unit 500 is installed with its optical axis facing upward. The first imaging unit 130 and the second imaging unit 140 are positioned to view the semiconductor chip 310 and the bonding region 320 from above, while the upward-view imaging unit 500 is positioned to view the semiconductor chip 310 from above. That is, the upward-view imaging unit 500 is positioned on the opposite side of the stage 220 from the first imaging unit 130 and the second imaging unit 140. The upward-view imaging unit 500 is located at a different position on the horizontal plane from the stage 220. Before the mounting control unit 173 moves the head unit 110 onto the stage 220, the image acquisition unit 171 causes the upward-view imaging unit 500 to image the holding surface 122 that holds the semiconductor chip 310.

[0090] Figure 11 schematically illustrates the holding surface 122 and semiconductor chip 310 as they appear in the upward-view image captured by the upward-view imaging unit 500 by the image acquisition unit 171. The upward-view image shows the semiconductor chip 310 and the mounting index 311. The calculation unit 172 calculates the positional relationship between the center of the semiconductor chip 310 and the mounting index 311 based on the upward-view image.

[0091] In step s105, the calculation unit 172 calculates the three-dimensional coordinates of the mounted object index 311 and the object to be mounted index 331, and then calculates the three-dimensional coordinates of the center of the semiconductor chip 310 based on the above positional relationship. Subsequently, in step s106, the mounting control unit 173 transmits a drive signal to the head drive motor 150. As a result, the center of the semiconductor chip 310 is positioned at the target position in the horizontal plane, i.e., the coordinates (X2, Y2) of the object to be mounted index 331 in the horizontal plane.

[0092] By the way, in this embodiment, the first imaging unit 130 and the second imaging unit 140 achieve telecentricity, but due to environmental constraints and other factors, there may be cases where the first imaging unit 130 and the second imaging unit 140 cannot achieve telecentricity.

[0093] In that case, the calculation unit 172 determines the three-dimensional coordinates of the mounting body by considering that the optical path length of the subject light beam L1 in the mounting body optical path region 123a changes depending on the arrival position of the subject light beam L1 from the mounting body index 311 at the respective image sensors 132 and 142 of the first imaging unit 130 and the second imaging unit 140.

[0094] Although this embodiment has been described using the mounting apparatus 100 as an example, the mounting apparatus to which the three-dimensional coordinate calculation method and configuration according to this embodiment can be applied is not limited to die bonders. For example, it can also be applied to flip-chip bonders and wire bonders. When applied to a wire bonder, the tool unit that performs work on the mounted object placed on the stage will be a capillary, etc. Furthermore, it can also be applied to dicers, etc., which cut wafers into semiconductor chips.

[0095] Furthermore, although the mounting apparatus 100 was described using the example of mounting a semiconductor chip 310 on a bonding region 320, the mounted object is not limited to a semiconductor chip 310. For example, in addition to semiconductor chips, mounted objects can include laminates in which other semiconductor chips are stacked on top of one semiconductor chip. Also, the object on which the mounted object is placed is not limited to the bonding region 320. For example, on a substrate on which a semiconductor chip has already been placed, the already placed semiconductor chip can be used as the object to be mounted, and other semiconductor chips can be placed on top of this semiconductor chip.

[0096] Furthermore, if the side of the substrate 330 on which the semiconductor chip 310 is placed is considered the front surface, the mounting target indicator 331 may be set on the front surface of the substrate 330, or on a part of the substrate 330 other than the front surface. For example, it may be set on the side of the substrate 330 opposite to the front surface. In other words, the mounting target indicator 331 may be set on the substrate 330. Alternatively, the mounting target indicator 331 may be set in a location other than the substrate 330. When the mounting target indicator 331 is set on a part of the substrate 330 other than the front surface of the substrate 330, the substrate 330 is made of, for example, a light-transmitting material. The light-transmitting material is not particularly limited, but examples include glass such as quartz glass and resin such as acrylic resin. The mounting target indicator 331 may also be an indicator that can identify the position on which the semiconductor chip 310 is placed. Alternatively, the mounting target indicator 331 may be an indicator for identifying the position on which the semiconductor chip 310 is placed.

[0097] The calculation unit 172 does not need to calculate the relative position between the object under mounting indicator 331 and the mounted object indicator 311 from the first and second images. In this case, the calculation unit 172 calculates the three-dimensional coordinates of the object under mounting indicator 331 and the mounted object indicator 311 from the first and second images, respectively. The mounting control unit 173 then sends a drive signal to the head drive motor 150, using the three-dimensional coordinates (X2, Y2, Z2) of the object under mounting indicator 331 as the approach target. As a result, the mounted object indicator 311 is moved to the target position (X2, Y2) in the horizontal plane.

[0098] In the above explanation, we have described the case where the mounting indicator 311 is on the retained surface 312 of the semiconductor chip 310, and the case where the mounting indicator 311 is located on the retaining surface 122 of the mounting tool 120 as an example of a location other than the retained surface 312. In other words, the mounting indicator 311 may be an indicator that can identify the position of the semiconductor chip 310. Alternatively, the mounting indicator 311 may be an indicator for identifying the position of the semiconductor chip 310.

[0099] <Note> Embodiments of this disclosure include the following aspects: [1] An implementation tool that acquires and stores implementations, The system has a field of view that overlooks the stage from the side of the mounting tool, and the optical systems and image sensors are arranged to satisfy the Scheinproof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, and a first imaging unit and a second imaging unit that image the mounted object indicator and the mounted object indicator specified within the field of view, A calculation unit calculates the relative position between the mounted object index and the mounted object index from the first image output from the first imaging unit and the second image output from the second imaging unit, Based on the calculation results of the calculation unit, the mounting control unit corrects the position of the mounting body and places the mounting body onto the object to be mounted. An implementation device equipped with the following features. [2] The mounting tool comprises a holding portion having a holding surface that adsorbs and holds the surface of the mounting body to be held, The holding portion has a mounting optical path region for allowing the subject light beam from the mounting index to reach the image sensor of the first imaging unit and the second imaging unit, respectively. [1] The mounting device described above. [3] The holding portion has a mounting object optical path region for allowing the subject light beam from the mounting object indicator to reach the image sensor of the first imaging unit and the second imaging unit, respectively. [2] The mounting device described above. [4] The optical path region of the mounted body is formed of a light-transmitting material. The mounting device described in [2] or [3]. [5] The aforementioned optical path region of the mounting body is formed as an aperture space through which the subject light beam passes. The mounting device described in [2] or [3]. [6] The calculation unit determines the three-dimensional coordinates of the implementation, taking into consideration that the optical path length of the subject light beam in the implementation optical path region changes depending on the arrival position of the subject light beam from the implementation indicator at the respective image sensors of the first and second imaging units. The mounting device described in any of [2] to [5]. [7] The aforementioned implementation index is set in a location other than the implementation, The calculation unit calculates the three-dimensional coordinates of the implementation based on the positional relationship between the implementation index and the implementation. The mounting device described in any of [1] to [6]. [8] If the calculation unit is unable to calculate at least one of the three-dimensional coordinates of the object to be mounted and the object based on one first image and one second image, it calculates the three-dimensional coordinates of at least one of the object to be mounted and the object based on another first image output to the first imaging unit and another second image output to the second imaging unit, by changing the focus state for at least one of the object to be mounted and the object to be mounted. The mounting device described in [1] to [7]. [9] A method for mounting an object, comprising a mounting tool for acquiring and holding an object, and a mounting apparatus having a field of view that overlooks the stage from the side of the mounting tool, wherein the optical systems and image sensors are arranged to satisfy the Scheinproof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, and the apparatus comprises a first imaging unit and a second imaging unit, wherein The imaging step involves capturing the object to be mounted and the mounted object, which are identified within the field of view, using the first imaging unit and the second imaging unit. A calculation step of calculating the relative position between the mounted object index and the mounted object index from the first image output from the first imaging unit and the second image output from the second imaging unit, A mounting control step which involves correcting the position of the mounting body based on the calculation result of the calculation unit and placing the mounting body onto the object to be mounted. THREE implementation method.

[10] A mounting control program for controlling a mounting device comprising a mounting tool for acquiring and holding a mounted object, and a mounting device having a field of view that overlooks the stage from the side of the mounting tool, wherein the optical systems and image sensors are arranged to satisfy the Scheinproof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, and the device comprises a first imaging unit and a second imaging unit. The imaging step involves capturing the object to be mounted and the mounted object, which are identified within the field of view, using the first imaging unit and the second imaging unit. A calculation step of calculating the relative position between the mounted object index and the mounted object index from the first image output from the first imaging unit and the second image output from the second imaging unit, A mounting control step which involves correcting the position of the mounting body based on the calculation result of the calculation unit and placing the mounting body onto the object to be mounted. An implementation control program that causes a computer to execute a command. [Explanation of symbols]

[0100] 100... Mounting device, 110... Head unit, 120... Mounting tool, 121... Holding unit, 122... Holding surface, 123a... Mounted object optical path region, 123b... Mounted object optical path region, 124... Suction tube, 125... Support column, 126... End, 126a... Aperture space, 127... Base unit, 130... First imaging unit, 131... First optical system, 131a... Object-side lens group, 131b... Image-side lens group, 132... First image sensor, 133... Aperture, 140... Second imaging unit, 141... Second optical system, 142... Second image sensor, 150... Head drive motor, 160... Tool drive motor, 1 70...Calculation processing unit, 171...Image acquisition unit, 172...Calculation unit, 173...Packaging control unit, 180...Storage unit, 181...Conversion table, 182...Conversion table, 190...Input / output device, 210...Stand, 220...Stage, 310...Semiconductor chip, 311...Packaging index, 312...Holding surface, 320...Bonding area, 330...Substrate, 331...Packaging index, 400...Chart, 400'...Chart image, 410...Dot, 410'...Dot image, 500...Upward viewing imaging unit, L1...Subject light beam from mounting index, L2...Subject light beam from mounting index

Claims

1. An assembly tool that acquires and holds an assembly having an assembly index and mounts it onto an object to be mounted having an object to be mounted index, The system has a field of view that overlooks the stage from the side of the mounting tool, and the optical systems and image sensors are arranged to satisfy the Scheinproof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, and a first imaging unit and a second imaging unit that image the mounted object indicator and the mounted object indicator identified within the field of view, A calculation unit calculates the relative position between the mounted object index and the mounted object index from the first image output from the first imaging unit and the second image output from the second imaging unit, Based on the calculation results of the calculation unit, the mounting control unit corrects the position of the mounting object relative to the object to be mounted, and places the mounting object onto the object to be mounted. An implementation device equipped with the following features.

2. The mounting tool comprises a holding portion having a holding surface that adsorbs and holds the surface to be held of the mounting object, The holding portion has a mounting body optical path region for allowing the subject light beam from the mounting body indicator to reach the image sensor of the first imaging unit and the second imaging unit, respectively. The mounting device according to claim 1.

3. The holding portion has a mounting object optical path region for allowing the subject light beam from the mounting object indicator to reach the image sensor of the first imaging unit and the second imaging unit, respectively. The mounting device according to claim 2.

4. The optical path region of the mounted body is formed of a light-transmitting material. The mounting device according to claim 2.

5. The aforementioned optical path region of the mounting body is formed as an aperture space through which the subject light beam passes. The mounting device according to claim 2.

6. The calculation unit determines the three-dimensional coordinates of the implementation, taking into consideration that the optical path length of the subject light beam in the implementation optical path region changes depending on the arrival position of the subject light beam from the implementation indicator at the respective image sensors of the first imaging unit and the second imaging unit, and calculates the relative position based on the three-dimensional coordinates of the implementation. The mounting device according to claim 2.

7. If the calculation unit is unable to calculate at least one of the three-dimensional coordinates of the object to be mounted and the three-dimensional coordinates of the mounted object based on one first image and one second image, it calculates the three-dimensional coordinates of at least one of the object to be mounted and the mounted object based on another first image output to the first imaging unit and another second image output to the second imaging unit, by changing the focus state for at least one of the object to be mounted and the mounted object. The mounting device according to claim 1.

8. A mounting tool for acquiring and holding a mounting object having a mounting object index and mounting it onto a mounting object having a mounting object index; and a mounting apparatus comprising a first imaging unit and a second imaging unit, wherein the apparatus has a field of view that allows the mounting tool to oversee the stage, and the optical systems and image sensors are arranged to satisfy the shine-proof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, the method for mounting the mounting object, An imaging step in which the object to be mounted and the mounted object, which are identified within the field of view, are imaged by the first imaging unit and the second imaging unit, A calculation step of calculating the relative position between the mounted object index and the mounted object index from the first image output from the first imaging unit and the second image output from the second imaging unit, A mounting control step which corrects the position of the mounting object relative to the object to be mounted based on the calculation result of the calculation step and places the mounting object onto the object to be mounted. THREE implementation method.

9. A mounting tool for acquiring and holding a mounting object having a mounting object index and mounting it onto a mounting object having a mounting object index; and a mounting control program for controlling a mounting apparatus comprising a first imaging unit and a second imaging unit, wherein the mounting tool has a field of view that overlooks the stage, and the optical system and image sensor are arranged to satisfy the shine-proof condition such that the plane corresponding to the stage surface of the stage becomes the focal plane, An imaging step in which the object to be mounted and the mounted object, which are identified within the field of view, are imaged by the first imaging unit and the second imaging unit, A calculation step of calculating the relative position between the mounted object index and the mounted object index from the first image output from the first imaging unit and the second image output from the second imaging unit, A mounting control step which corrects the position of the mounting object relative to the object to be mounted based on the calculation result of the calculation step and places the mounting object onto the object to be mounted. An implementation control program that causes a computer to execute a command.

Images