Cooling system and heat-generating device

Abstract

To reduce noise when cooling a heating element.SOLUTION: To provide a cooling system for a heating element of a heating element mounting device. The cooling system includes a structure having an internal space for housing a heating element, an air supply device arranged in the structure and supplying outside air to the internal space, and a valve body arranged in the structure. The structure is configured to form a passage for an air flow circulating around the heating element by the outside air supplied by the air supply device in a state where the heating element is accommodated in the structure. The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold while the air supply device is operating.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a cooling system and a heating element mounting apparatus. In the present disclosure, the heating element mounting apparatus refers to an apparatus that mounts a heating element as a component.

Background Art

[0002] Electronic devices such as communication apparatuses including routers have heating elements such as CPUs (Central Processing Units) inside their housings, and include a cooling device for removing heat generated by the heating element to cool the heating element.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of Invention

Problem to be Solved by the Invention

[0004] The following analysis is made by the inventor of the present invention.

[0005] The electronic device described in Patent Document 1 includes an intake mechanism (cooling fan) and an exhaust mechanism (cooling fan) attached to its housing as a cooling device for the heating element.

[0006] However, cooling fans, particularly cooling fans for forced exhaust, generate loud operating noise that becomes a source of noise. Therefore, there are cases where the installation location of an electronic device equipped with such a cooling device is limited, or cases where it is inconvenient for mobile applications.

[0007] An object of the present disclosure is to provide a cooling system and a heating element mounting apparatus that contribute to reducing noise when cooling a heating element.

Means for Solving the Problem

[0008] From the first perspective of this disclosure, a cooling system for a heat-generating device is provided. The cooling system is, A structure having an internal space to house the heating element, • An air supply device disposed in the structure and supplying outside air to the internal space, • Valve body disposed in the aforementioned structure Including, The structure is configured such that, when the heating element is housed within the structure, a passage for an airflow (hereinafter referred to as "circulating airflow") is formed by the outside air supplied by the air supply device to circulate around the heating element. The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold while the air supply device is operating. It is characterized by the following. A heating element mounting device is provided from the second perspective of this disclosure. The aforementioned heating element mounting device includes a cooling system, The heating element is housed within the structure of the cooling system. It is characterized by the following. [Effects of the Invention]

[0009] This disclosure or any of its perspectives can contribute to reducing noise during the cooling of heat-generating elements. [Brief explanation of the drawing]

[0010] [Figure 1] A schematic plan view of an example of a cooling system relating to this disclosure. [Figure 2] A schematic side view of an example of a cooling system related to this disclosure. [Figure 3] A schematic cross-sectional view of an example of a cooling system related to this disclosure. [Figure 4] A schematic plan view of another example of the cooling system relating to this disclosure. [Figure 5]A schematic cross-sectional view of a further example of the cooling system according to the present disclosure, arranged in an example of the heating element mounting apparatus according to the present disclosure. [Figure 6] A flowchart of an example of operation of the cooling system according to the present disclosure. [Figure 7] A block diagram schematically showing an example of a configuration of hardware resources. DETAILED DESCRIPTION OF EMBODIMENTS

[0011] Preferred embodiments of the present disclosure are shown below, but the present disclosure is not limited thereto. (Embodiment 1) See the first aspect of the present disclosure described above. (Embodiment 2) In the cooling system according to Embodiment 1, it is preferable that the valve body is configured to close the valve when the pressure in the internal space of the structure becomes equal to or lower than a predetermined threshold value . (Embodiment 3) In the cooling system according to Embodiment 1, it is preferable that the structure includes a rectifying wall that at least partially separates an airflow directly generated by the air supply device ("direct airflow") from the circulating airflow . (Embodiment 4) In the cooling system according to Embodiment 1, it is preferable that the structure has a slit-shaped opening into which a plate-like member provided with a heating element can be at least partially inserted . (Embodiment 5) In the cooling system according to Embodiment 4, it is preferable that the structure includes a sealing member that hermetically seals the opening in a state where the plate-like member is inserted into the internal space through the opening . (Embodiment 6) In the cooling system according to Embodiment 1, it is preferable that the valve body is a pressure valve that automatically opens when the pressure in the internal space of the structure exceeds a predetermined threshold value, and automatically closes when the pressure in the internal space of the structure becomes equal to or lower than the predetermined threshold value . (Embodiment 7) In the cooling system described in Embodiment 1, The cooling system includes an exhaust duct for airtightly connecting the exhaust section of the heating element mounting device and the valve body when the heating element is housed in the structure. It is preferable. (Embodiment 8) In the cooling system described in Embodiment 1, The cooling system includes an air supply duct for connecting the air supply section of the heating element mounting device and the air supply device when the heating element is housed in the structure. It is preferable. (Form 9) See the second perspective of the present disclosure above. (Form 10) In the cooling system described in any of Forms 1 to 6, The aforementioned structure is the housing of a device that mounts a heating element. It is preferable.

[0012] The following is an overview of this disclosure. The reference numerals in the drawings included in this overview are solely for the purpose of aiding understanding this disclosure and are not intended to limit this disclosure to the illustrated embodiments. Furthermore, the drawings themselves are merely conceptual diagrams schematically illustrating the structure or main components of the cooling system and heat-generating device.

[0013] Furthermore, in the following descriptions and drawings, elements having the same or common function are denoted by the same reference numeral.

[0014] Furthermore, in this disclosure, terms such as "greater than" and "less than or equal to" may also be replaced with terms such as "greater than or equal to" and "less than" respectively.

[0015] Furthermore, this disclosure can also be embodied as a computer-executable program, which can be recorded on a computer-readable non-transitive storage medium. That is, this disclosure can also be embodied as a computer program product. The program can be input to a computer device via an input device or an external communication interface, stored in a storage device, drive a processor according to predetermined steps or processes, and display the results of the processes step by step via a display device, including intermediate states as needed, or communicate with devices (including computers) inside or outside the device via a communication interface, whether wired or wireless. For this purpose, the computer device typically comprises, as an example, a processor, storage devices, input devices, a communication interface, and, if necessary, a display device, all of which are connected to each other by a bus.

[0016] (An example of a cooling system) Figure 1 is a schematic plan view of an example of a cooling system according to this disclosure.

[0017] The cooling system 1 includes a structure 2, an air supply device 3, and a valve body 4.

[0018] Structure 2 has an internal space 5 (see Figure 3) that houses a heat-generating element 6 of a heat-generating element mounting device (not shown). The heat-generating element 6 is an electronic component that generates heat, particularly during operation, such as a CPU, and in the illustrated example, it is disposed on a plate-shaped member 7 such as a circuit board. The heat-generating element mounting device is an electronic device such as a communication device such as a router that incorporates such a heat-generating element as a component. Structure 2, in particular, may be formed entirely of an insulating material or a material with low thermal conductivity so that the heat generated inside is not dissipated to the outside.

[0019] Structure 2 is equipped with an air supply device 3 and a valve body 4.

[0020] The air supply device 3 can be configured as any type of air supply or blowing mechanism capable of supplying outside air from the structure 2 to the internal space 5 of the structure 2, and is typically configured as a cooling fan.

[0021] The valve body 4 is configured to exhaust the gas inside the internal space 5 of the structure 2 to the outside of the structure 2.

[0022] In this example, the valve body 4 is configured as a pressure valve that automatically opens when the pressure in the internal space 5 of the structure 2 exceeds a predetermined threshold, and automatically closes when the pressure in the internal space 5 of the structure 2 is below the predetermined threshold.

[0023] Structure 2 has a slit-shaped opening 8 into which a plate-shaped member 7 on which a heating element 6 is disposed can be inserted at least partially (see Figure 2). The plate-shaped member 7 is inserted into the internal space 5 through the opening 8 so that the heating element 6 is located within the internal space 5.

[0024] The structure 2 is further provided with a sealing member 9 (see Figure 2) at the opening 8 that airtightly seals the opening 8 and thus the internal space 5 of the structure 2 when the plate-shaped member 7 is inserted into the internal space 5 through the opening 8. The sealing member 9 can be formed from a flexible, plastic material such as silicone rubber.

[0025] It should be noted that Figure 1 is merely a conceptual diagram illustrating an example of the components and arrangement of the cooling system 1, and is not intended to limit the cooling system 1 to the structure shown.

[0026] For example, in the example shown in Figure 1, the plate-shaped member 7 is formed in a substantially L-shape, but is not limited to this. It can be formed in any shape that allows the heating element 6 to be inserted into the internal space 5 through the opening 8 of the structure 2 so that it is housed within the internal space 5 of the structure 2.

[0027] Furthermore, in the example shown in Figure 1, the structure 2 is configured such that the end of the heating element portion of the L-shaped plate-like member 7 is exposed to the outside of the structure 2 when it is inserted into the internal space 5 through the opening 8. However, it is also possible to configure the structure so that the entire heating element portion is housed within the internal space 5 (i.e., its end is not exposed to the outside of the structure 2). In the illustrated case, the structure 2 also has an opening in the side wall corresponding to the end of the heating element portion of the plate-like member 7, and may have a sealing member in this opening to airtightly seal the internal space 5 of the structure 2 as needed.

[0028] Furthermore, in the example shown in Figure 1, structure 2 is configured to house only the portion of the plate-shaped member 7 where the heating element is located within the internal space 5, but it is also possible to configure it to house the entire plate-shaped member 7 within the internal space 5.

[0029] Furthermore, although structure 2 has a trapezoidal shape in the plan view in the example shown in Figure 1, it can also have other shapes.

[0030] Furthermore, in the example shown in Figure 1, the air supply device 3 and the pressure valve 4 are arranged in the structure 2 spaced apart from each other in a direction substantially parallel to the surface of the plate-shaped member 7, but it is also possible to arrange them in the structure 2 spaced apart from each other in a direction substantially perpendicular to the surface of the plate-shaped member 7. Moreover, in the illustrated state, the air supply device 3 and the pressure valve 4 can be arranged at approximately the same position (or height) or at different positions (or heights) with respect to the direction substantially perpendicular to the surface of the plate-shaped member 7. Furthermore, in the example shown in Figure 1, the air supply device 3 and the pressure valve 4 are arranged on the same wall of the structure 2, but it is also possible to arrange them on different wall sections.

[0031] Figure 2 is a schematic side view of an example of a cooling system according to this disclosure, showing an example of the opening 8 formed in the structure 2 and a sealing member 9 provided in the opening 8. However, Figure 2 shows a state in which the plate-shaped member 7 is not inserted into the opening 8.

[0032] Furthermore, if the structure 2 is configured such that the end of the heating element mounting portion of the L-shaped plate member 7 is exposed from the structure 2, as in the example in Figure 1, the structure 2 may also have an opening and, if necessary, a sealing member in the side wall corresponding to the end of the heating element mounting portion of the plate member 7, similar to the example in Figure 2.

[0033] Figure 3 is a schematic cross-sectional view of an example of a cooling system according to this disclosure, showing an example of the airflow formation state within structure 2 when the cooling system is in operation.

[0034] In Figure 3, the solid arrows indicate an example of the airflow formed within the internal space 5 of the structure 2 when the valve body 4 is closed, and the dashed arrows indicate an example of the airflow formed within the internal space 5 of the structure 2 when the valve body 4 is open. Although Figure 3 shows the valve body 4 in an open state, the valve body 4 is closed when the cooling system 1 is started.

[0035] When the valve body 4 is closed, the air supply device 3 continuously supplies outside air into the internal space 5, forming a circulating airflow that circulates around the heating element within the internal space 5 (see solid arrow). In the illustrated example, the airflow generated by the air supply device 3 flows along the heating element mounting side of the plate-shaped member 7, changes direction at one end of the plate-shaped member 7, then flows along the opposite side of the plate-shaped member 7 from the heating element mounting side (also called the "back side"), changes direction at the other end of the plate-shaped member 7, and flows again along the heating element mounting side, thus forming a circulating convection flow. Due to this convection, if a direct airflow generated directly from the air supply device 3 directly hits the heating element 6, the heat generated by the heating element 6 is transferred (at least partially) to the gas flowing into the structure 2 by this direct airflow, and as a result, the heating element 6 is cooled.

[0036] When the valve body 4 is open, the airflow within the internal space 5 is exhausted to the outside of the structure 2 via the valve body 4 without (substantially) changing direction in the area on the right side of Figure 3, from the back side of the plate-shaped member 7 to the side where the heat-generating element is mounted (see dashed arrow). As a result, the heat generated by the heat-generating element 6 is dissipated to the outside of the structure 2. In this disclosure, since the exhaust of heated gas is performed via the valve body 4, the operating noise can be significantly reduced compared to cases where a cooling fan or the like is used.

[0037] In the example shown in Figure 3, the air supply device 3 is positioned on the structure 2 so that the airflow from the air supply device 3 flows directly along the side of the plate-shaped member 7 where the heating element is mounted. However, it is also possible to position the air supply device 3 on the structure 2 in the opposite way, so that the airflow from the air supply device 3 flows along the back side of the plate-shaped member 7.

[0038] (Another example of a cooling system) Figure 4 is a schematic plan view of another example of the cooling system according to this disclosure.

[0039] The cooling system 1 shown in Figure 4 has components common to the cooling systems 1 shown in Figures 1 to 3, and further includes a flow straightening wall 10. The flow straightening wall 10 separates the direct airflow and the circulating airflow at least partially, enabling the smooth formation of convection by minimizing the mutual influence between the direct airflow and the circulating airflow.

[0040] Note that in Figure 4, the airflow along the back side of the plate-shaped member 7 is omitted.

[0041] (Another example of a cooling system) Figure 5 is a schematic cross-sectional view of a further example of a cooling system according to the disclosure, which is arranged in an example of a heating element mounting device according to the disclosure.

[0042] The cooling system 1 shown in Figure 5 has components common to the cooling system 1 shown in Figures 1 to 3, and further includes an exhaust duct 11. The exhaust duct 11 allows for airtight communication between the valve body 4 of the cooling system 1 and the exhaust section 21 of the heating element mounting device 20 when the heating element 6 of the heating element mounting device 20 is housed within the structure 2 of the cooling system 1. The exhaust duct 11 allows the heat generated by the heating element 6 to be discharged to the outside of the heating element mounting device 20 without being dissipated into the internal space of the heating element mounting device 20. In particular, if the housing 23 of the heating element mounting device 20 is made of metal or a material with high thermal conductivity, the exhaust duct 11 can prevent a rise in the temperature of the housing surface of the heating element mounting device 20, thereby preventing problems such as low-temperature burns caused by a rise in the temperature of the housing surface.

[0043] In addition, the exhaust section 21 shown in Figure 5 is formed in the housing 23 of the heat-generating device 20 and is configured as an exhaust port that is directly connected to the exhaust duct 11 of the cooling system 1. However, the exhaust section 21 of the heat-generating device 20 may also be provided with a connecting duct (not shown) that allows the exhaust port formed in its housing 23 to be in airtight communication with the exhaust duct 11 of the cooling system 1.

[0044] The cooling system 1 in this example may also be further equipped with an air supply duct 12 for connecting the air supply device 3 and the air supply section 22 of the heat supply device 20, as shown in the figure, when the heat supply element 6 of the heat supply device 20 is housed within the structure 2 of the cooling system 1. It is also possible to create an airtight connection between the air supply device 3 and the air supply section 22.

[0045] Furthermore, the air supply section 22 shown in Figure 5, like the exhaust section 21, is configured as an air inlet formed in the housing 23 of the heat-generating device 20 and directly connected to the air supply duct 12 of the cooling system 1. However, the air supply section 22 of the heat-generating device 20 may also be equipped with a connecting duct (not shown) that enables communication between the air inlet formed in its housing 23 and the air supply duct 12 of the cooling system 1.

[0046] (Example of cooling system operation) Figure 6 shows a flowchart illustrating an example of the operation of the cooling system of this disclosure.

[0047] First, with the heating element 6 of the operating heating element device housed in the internal space 5 of the structure 2 of the cooling system 1, the air supply device 3 is started (Step 1 (S1); hereafter, "step" may be abbreviated as "S"). At this time, the pressure valve 4 is closed. The operation of the air supply device 3 (adjustment of the amount of air supplied, etc.) can be electronically controlled, for example, by a computer mounted on the structure 2 of the cooling system 1 or the plate-shaped member 7 of the heating element device, or by an external computer.

[0048] When the air supply device 3 is activated, outside air (usually air) flows into the internal space 5 of the structure 2, and the pressure in the airtight internal space 5 of the structure 2 increases (S2). At this time, the heat-generating element 6 is cooled by the circulating airflow formed by the continuous airflow generated by the air supply device 3, and is also cooled by the direct airflow from the air supply device 3 if it directly hits it.

[0049] Then, when the pressure in the internal space 5 of the structure 2 exceeds a predetermined threshold (S3; YES), the pressure valve 4 automatically opens (S4). As a result, the gas that has absorbed the heat generated by the heat-generating element 6 is exhausted to the outside of the structure 2, and the temperature of the heat-generating element 6 decreases. In this disclosure, since a valve body is used for this exhaust, it is possible to significantly reduce the operating noise compared to using an exhaust cooling fan that makes a lot of noise, and it is also possible to save power on the cooling fan.

[0050] The opening of the pressure valve 4 reduces the internal pressure of the structure 2 (S5). When the pressure in the internal space 5 of the structure 2 falls below a predetermined threshold (S6; YES), the pressure valve 4 automatically closes (S7), and the process returns to S2, repeating the above operation.

[0051] If, in S3, the pressure in the internal space 5 of structure 2 is below a predetermined threshold (NO), the process returns to S2. If, in S6, the pressure in the internal space 5 of structure 2 exceeds a predetermined threshold (NO), the process returns to S5.

[0052] In the above example, if the cooling system 1 is equipped with an exhaust duct 11, in S4 to S5, the heated exhaust is not released into the internal space of the heat-generating device but is discharged to the outside of the heat-generating device, thus avoiding problems such as low-temperature burns caused by the temperature rise of the housing surface of the heat-generating device.

[0053] Furthermore, in S4, when the pressure valve 4 opens, the air supply device 3 may be stopped or its output reduced (air supply volume reduced), or in some cases, its output increased (air supply volume increased). Then, in S7, when the pressure valve 4 closes, the air supply device 3 may be restarted or its output increased (air supply volume increased), or in some cases, its output decreased (air supply volume reduced).

[0054] (Other examples of cooling system operation) In the example above, a pressure valve that automatically opens and closes according to the internal pressure of the structure 2 is used as the valve body 4, but it is also possible to use a valve body whose opening and closing can be electronically controlled. In this case, for example, a pressure sensor can be installed in the internal space 5 of the structure 2, and the opening and closing operation of the valve can be electronically controlled by a computer, for example, based on the pressure in the internal space 5 of the structure 2 measured by the pressure sensor. Furthermore, for example, by installing a temperature sensor in addition to the pressure sensor in the internal space 5 of the structure 2, it is possible to forcibly open the valve even if the pressure in the internal space 5 of the structure 2 is below a predetermined threshold, if the temperature in the internal space 5 of the structure 2 measured by the temperature sensor exceeds a predetermined threshold. When using an electronically controllable valve body, the predetermined threshold in S3 ("upper threshold" or "upper limit") and the predetermined threshold in S6 ("lower threshold" or "lower limit") can be different values.

[0055] (Another example of a cooling system) If the heat-generating device equipped with the cooling system of this disclosure has a structure capable of forming a passage for the above-mentioned circulating airflow, for example, if the heat-generating device has a thin housing and there is appropriate space on both the upper and lower sides and both ends of the plate-shaped member on which the heat-generating device is arranged, the cooling system of this disclosure can be directly applied to the heat-generating device, that is, the structure of the cooling system can be used as the housing of the heat-generating device. In this case as well, operating noise can be reduced during operation.

[0056] The servers described in each of the above examples or forms can be composed of so-called hardware resources (information processing devices, computers), and those with the configuration illustrated in Figure 7 can be used. For example, the hardware resource 1000 includes a processor 1001, memory 1002, network interface 1003, etc., which are interconnected by an internal bus 1004.

[0057] However, the configuration shown in Figure 7 is not intended to limit the hardware configuration of the hardware resource 1000. The hardware resource 1000 may include hardware not shown (e.g., input / output interfaces). Alternatively, the number of units such as processors 1001 included in the device is not limited to the example in Figure 7; for example, multiple processors 1001 may be included in the hardware resource 1000. For example, a CPU (Central Processing Unit), MPU (Micro Processor Unit), GPU (Graphics Processing Unit), etc., can be used for the processor 1001.

[0058] Memory 1002 can be, for example, RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), etc.

[0059] The network interface 1003 can use, for example, a LAN (Local Area Network) card, a network adapter, a network interface card, etc.

[0060] The functions of the hardware resource 1000 are realized by the processing module described above. This processing module is realized, for example, by the processor 1001 executing a program stored in memory 1002. Furthermore, this program can be downloaded via a network or updated using a storage medium containing the program. Moreover, the processing module may be realized by a semiconductor chip. In other words, the functions performed by the processing module can be realized by the execution of software on some hardware.

[0061] Some or all of the above embodiments may also be described as follows, but are not limited to the following: [Note 1] A cooling system for a heat-generating element in a device that incorporates a heat-generating element as a component (hereinafter referred to as "heat-generating element device"). The cooling system is, A structure having an internal space to house the heating element, • An air supply device disposed in the structure and supplying outside air to the internal space, • Valve body disposed in the aforementioned structure Includes. The structure is configured such that, when the heating element is housed within the structure, a passage for an airflow (hereinafter referred to as "circulating airflow") that circulates around the heating element by the outside air supplied (continuously) by the air supply device is formed (within the internal space). The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold while the air supply device is operating. [Note 1a] In the above cooling system, When the valve body opens, the air supply device stops operating or its output decreases, and in some cases, its output increases. [Note 2] In the above cooling system, The valve body is configured to close when the pressure in the internal space of the structure falls below a predetermined threshold. [Note 2a] In the above cooling system, When the valve body is closed, the air supply device starts operating or increases its output, and in some cases decreases its output. [Note 3] In the above cooling system, The structure has a flow-straightening wall that at least partially separates the airflow directly generated by the air supply device ("direct airflow") from the circulating airflow. [Note 4] In the above cooling system, The structure has a slit-shaped opening into which a plate-shaped member on which a heating element is disposed can be inserted at least partially. [Note 5] In the above cooling system, The structure is provided with a sealing member (in the opening) that airtightly seals the opening when the plate-shaped member is inserted into the internal space through the opening. [Note 6] In the above cooling system, The valve body is a pressure valve that automatically opens when the pressure in the internal space of the structure exceeds a predetermined threshold, and automatically closes when the pressure in the internal space of the structure falls below the predetermined threshold. [Note 6a] In the above cooling system, The valve body is a valve body whose opening and closing can be electronically controlled, particularly by a computer provided on the structure or the plate-shaped member. [Note 6a1] In the above cooling system, The cooling system includes a pressure sensor in the internal space of the structure for measuring the pressure within the internal space. [Note 6a2] In the above cooling system, The cooling system includes a temperature sensor in the internal space of the structure for measuring the temperature within the internal space. [Note 6a3] In the above cooling system, The valve body opens (forcibly) when the temperature inside the structure exceeds a predetermined threshold. [Note 6a4] In the above cooling system, The predetermined threshold pressure in the internal space of the structure when the valve body is open ("upper threshold" or "upper limit") and the predetermined threshold pressure in the internal space of the structure when the valve body is closed ("lower threshold" or "lower limit") are different values. [Note 7] In the above cooling system, The cooling system includes an exhaust duct for airtightly connecting the exhaust section of the heating element mounting device and the valve body when the heating element is housed in the structure. [Note 8] In the above cooling system, The cooling system includes an air supply duct for (airtightly) connecting the air supply section of the heating element mounting device and the air supply device when the heating element is housed in the structure. [Note 9] Device equipped with a heating element. The aforementioned heating element mounting device includes a cooling system as described in any of the appendices 1 to 8. The heating element is housed within the structure of the cooling system. [Note 9a] In the above-mentioned heating element mounted device, The housing of the heat-generating device has an exhaust section, particularly an exhaust port, that is directly connected to the exhaust duct of the cooling system. [Note 9b] In the above-mentioned heating element mounted device, The housing of the heating element mounting device has an air supply section, particularly an air supply port, which is directly connected to the air supply duct of the cooling system. [Note 10] In the above cooling system, The aforementioned structure is the housing of a device that mounts a heating element. [Note 11] A structure having an internal space for housing a heating element in a device equipped with a heating element. An air supply device provided in the said structure and for supplying air into the said structure, Valve body provided in the aforementioned structure A control program for the cooling system, including the cooling system itself. The control program is sent to the computer, • The process by which the air supply device supplies air into the structure, and, - When the pressure in the internal space of the structure exceeds a predetermined threshold, the valve body opens. Make it run. [Note 12] In the control program described above, The control program is sent to the computer, When the pressure in the internal space of the structure falls below a predetermined threshold, the valve body closes. Make it run.

[0062] Within the framework of the full disclosure of the present invention (including the claims), further modifications and adjustments to embodiments or examples are possible based on the fundamental technical concept. Furthermore, within the framework of the full disclosure of the present invention, various combinations or selections (including partial deletions) of various disclosed elements (including each element of each claim, each element of each embodiment or example, each element of each drawing, etc.) are possible. In other words, the present invention naturally includes various modifications and alterations that a person skilled in the art could make in accordance with the full disclosure, including the claims, and the technical concept. [Explanation of symbols]

[0063] 1. Cooling System 2 structure 3. Air supply system 4 Valve body 5. Interior space 6. Heating element 7 Plate-shaped member 8 openings 9 Sealing member 10 Rectification wall 11 Exhaust duct 12. Air supply duct 20 Heating element equipped device 21 Exhaust section 22 Air supply section 23 cabinets 1000 hardware resources 1001 Processor 1002 memory 1003 Network Interface 1004 Internal Bus

Claims

1. A cooling system for a heat-generating element in a device that incorporates a heat-generating element as a component (hereinafter referred to as "heat-generating element device"), The cooling system is, - A structure having an internal space for housing the heating element, - An air supply device disposed in the structure and supplying outside air to the internal space, - Valve body disposed in the above structure Including, The structure is configured such that, when the heating element is housed within the structure, a passage for an airflow (hereinafter referred to as "circulating airflow") circulating around the heating element is formed by the outside air supplied by the air supply device. The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold while the air supply device is operating. A cooling system characterized by the following features.

2. In the cooling system according to claim 1, The valve body is configured to close when the pressure in the internal space of the structure falls below a predetermined threshold. A cooling system characterized by the following features.

3. In the cooling system according to claim 1, The structure has a flow-straightening wall that at least partially separates the airflow directly generated by the air supply device from the circulating airflow. A cooling system characterized by the following features.

4. In the cooling system according to claim 1, The structure has a slit-shaped opening into which a plate-shaped member on which a heating element is disposed can be inserted at least partially. A cooling system characterized by the following features.

5. In the cooling system according to claim 4, The structure includes a sealing member that airtightly seals the opening when the plate-shaped member is inserted into the internal space through the opening. A cooling system characterized by the following features.

6. In the cooling system according to claim 1, The valve body is a pressure valve that automatically opens when the pressure in the internal space of the structure exceeds a predetermined threshold, and automatically closes when the pressure in the internal space of the structure falls below the predetermined threshold. A cooling system characterized by the following features.

7. In the cooling system according to claim 1, The cooling system includes an exhaust duct for airtightly connecting the exhaust section of the heating element mounting device and the valve body when the heating element is housed in the structure. A cooling system characterized by the following features.

8. In the cooling system according to claim 1, The cooling system includes an air supply duct for connecting the air supply section of the heating element mounting device and the air supply device when the heating element is housed in the structure. A cooling system characterized by the following features.

9. A device equipped with a heating element, The heating element mounting device includes the cooling system described in any one of claims 1 to 8. The heating element is housed within the structure of the cooling system. A device equipped with a heating element, characterized by the following features.

10. In the cooling system according to any one of claims 1 to 6, The aforementioned structure is the housing of a device that mounts a heating element. A cooling system characterized by the following features.

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