Processing equipment

Abstract

To provide a processing device capable of acquiring highly reliable processing state information while suppressing reduction of productivity.SOLUTION: A processing device 1 comprises: a holding unit 10 which holds a workpiece 200; a laser beam irradiation unit 20 which applies laser processing to the workpiece 200 held by the holding unit 10; a moving unit 30 which relatively moves the holding unit 10 and the laser beam irradiation unit 20; a control unit 100 which controls respective components; and a processing state measurement unit 50 which measures a processing state of the workpiece 200. The control unit 100 acquires processing state information of the workpiece 200 by means of the processing state measurement unit 50, acquires vibration information relating to vibrations, which occur while the processing state information is acquired, and stores the processing state information and the vibration information acquired while associating them with each other.SELECTED DRAWING: Figure 1

Description

[[Technical Field]]

[0001] The present invention relates to a processing apparatus. [[Background Art]]

[0002] As processing methods for manufacturing semiconductor devices, various methods are known. One example is a method in which a laser beam that is absorbed by a wafer is irradiated along streets to ablate material, form processing grooves, and then perform braking along the processing grooves to cleave the wafer into individual chips.

[0003] In a processing apparatus that performs the above-described processing, the state of processing grooves is imaged by an imaging means such as a microscope or a CCD camera to check for processing abnormalities such as positional deviation of processing grooves or chipping (see, for example, Patent Document 1).

[0004] Furthermore, processing apparatuses provided with three-dimensional measuring means for obtaining more detailed information (also referred to as processing information), such as the depth and cross-sectional shape of processing grooves and the volume of debris, have also been proposed (see, for example, Patent Document 2 and Patent Document 3). [[Prior Art Documents]] [[Patent Documents]]

[0005] [[Patent Document 1]] Japanese Unexamined Patent Publication No. Hei 5-326700 [[Patent Document 2]] Japanese Unexamined Patent Publication No. 2010-271252 [[Patent Document 3]] Japanese Unexamined Patent Publication No. 2015-88515 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0006] However, when attempting to acquire the aforementioned processing status information while the processing equipment is in operation, depending on the operating conditions of the processing equipment, vibrations can affect the accuracy of the information obtained. These vibration effects become even more pronounced when performing high-magnification imaging or high-precision three-dimensional measurements.

[0007] Therefore, there was a problem in that it was not possible to determine whether the acquired processing status information was accurate, and in order to obtain accurate processing status information, it was necessary to stop other operations and perform imaging and measurement again, which led to a decrease in productivity.

[0008] This invention has been made in view of the above facts, and its purpose is to provide a processing apparatus that can acquire highly reliable processing status information while suppressing a decrease in productivity. [Means for solving the problem]

[0009] To solve the above-mentioned problems and achieve the objective, the present invention provides a processing apparatus comprising: a holding unit for holding a workpiece; a processing unit for processing the workpiece held by the holding unit; a moving unit for relatively moving the holding unit and the processing unit; and a control unit for controlling each component, further comprising a processing state measuring unit for measuring the processing state of the workpiece, the control unit acquiring processing state information of the workpiece by the processing state measuring unit, and vibration information relating to vibrations occurring while acquiring the processing state information, and storing the acquired processing state information and vibration information in association. The vibration information represents the operating status of the processing device, and the control unit determines that the acquired vibration information corresponds to a predetermined operating status, and then reacquires the processing status information. It is characterized by the following:

[0011] The present invention relates to a processing apparatus comprising: a holding unit for holding a workpiece; a processing unit for processing the workpiece held by the holding unit; a moving unit for relatively moving the holding unit and the processing unit; and a control unit for controlling each component, further comprising a processing state measuring unit for measuring the processing state of the workpiece, wherein the control unit acquires processing state information of the workpiece from the processing state measuring unit, acquires vibration information relating to vibrations occurring while acquiring the processing state information, stores the acquired processing state information and vibration information linked together, The vibration information is obtained from vibration data acquired by the vibration measurement unit. The control unit is characterized by re-acquiring processing status information if it determines from the acquired vibration information that the vibration value is above an acceptable value.

[0014] This invention processing equipment The processing apparatus comprises a holding unit for holding a workpiece, a processing unit for processing the workpiece held by the holding unit, a moving unit for moving the holding unit and the processing unit relative to each other, and a control unit for controlling each component, further comprising a processing state measuring unit for measuring the processing state of the workpiece, the control unit acquiring processing state information of the workpiece by the processing state measuring unit, acquiring vibration information related to vibrations occurring while acquiring the processing state information, and storing the acquired processing state information and vibration information in association.The control unit pre-stores the correlation between machining state information acquired under vibration-free conditions and machining state information acquired under vibration-induced conditions, and corrects newly acquired machining state information to match the machining state information acquired under vibration-free conditions based on this correlation. Characterized by .

[0015] This invention processing equipment The processing apparatus comprises a holding unit for holding a workpiece, a processing unit for processing the workpiece held by the holding unit, a moving unit for moving the holding unit and the processing unit relative to each other, and a control unit for controlling each component, further comprising a processing state measuring unit for measuring the processing state of the workpiece, the control unit acquiring processing state information of the workpiece by the processing state measuring unit, acquiring vibration information related to vibrations occurring while acquiring the processing state information, and storing the acquired processing state information and vibration information in association. The control unit is configured to be able to set a judgment criterion for determining the quality of the machining result from machining state information of the workpiece, and the judgment criterion is configured to be able to be varied according to the degree of vibration in the vibration information linked to the machining state information. It is characterized by the following. In the aforementioned processing apparatus, if the control unit determines that the operating status of the processing apparatus is a predetermined operating status, it determines the quality of the processing result based on a modified judgment criterion that is broader than the standard judgment criterion used when it is determined that the operating status is not a predetermined operating status. That's fine.

[0016] In the aforementioned processing apparatus, the processing state measurement unit may also be a three-dimensional measurement unit that measures the workpiece in three dimensions in the mutually orthogonal X-axis, Y-axis, and Z-axis directions. [Effects of the Invention]

[0017] This invention has the effect of enabling the acquisition of highly reliable processing status information while suppressing a decrease in productivity. [Brief explanation of the drawing]

[0018] [Figure 1] Figure 1 is a perspective view showing an example of the configuration of a processing apparatus according to Embodiment 1. [Figure 2] Figure 2 shows an example of workpiece processing status information acquired by the processing status measurement unit of the processing apparatus shown in Figure 1. [Figure 3] Figure 3 shows the processing state vibration information acquired by the information acquisition unit of the control unit of the processing apparatus 1 shown in Figure 1 and stored in the memory unit. [Figure 4] Figure 4 shows an example of the configuration of a processing apparatus according to a modified example of Embodiment 1. [Figure 5] Figure 5 schematically shows the vibration data acquired by the vibration measurement unit of the processing apparatus shown in Figure 4. [Figure 6] FIG. 6 is a diagram illustrating machining state vibration information acquired by an information acquisition unit of a control unit of the machining apparatus illustrated in FIG. 4 and stored in a storage unit. [Figure 7] FIG. 7 is a perspective view illustrating a configuration example of a machining apparatus according to a second embodiment. [Figure 8] FIG. 8 is a diagram illustrating a configuration example of a machining apparatus according to a modification of the second embodiment. [Figure 9] FIG. 9 is a diagram schematically illustrating another example of a correlation stored in a storage unit of a control unit of the machining apparatus illustrated in FIG. 8. [Figure 10] FIG. 10 is a perspective view illustrating a configuration example of a machining apparatus according to a third embodiment. [Figure 11] FIG. 11 is a diagram illustrating a configuration example of a machining apparatus according to a modification of the third embodiment. MODE FOR CARRYING OUT THE INVENTION

[0019] Modes (embodiments) for carrying out the present invention will be described in detail below with reference to the drawings. The present invention is not limited by the content described in the following embodiments. In addition, the constituent elements described below include those that can be easily conceived by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or modifications to the configuration can be made without departing from the gist of the present invention.

[0020] First Embodiment A machining apparatus according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view illustrating a configuration example of the machining apparatus according to the first embodiment. The machining apparatus 1 illustrated in FIG. 1 according to the first embodiment is a laser machining apparatus that irradiates a workpiece 200 with a laser beam 21.

[0021] (Workpiece) The workpiece 200 to be processed by the processing apparatus 1 according to Embodiment 1 is a disc-shaped semiconductor wafer or optical device wafer, etc., with silicon, sapphire, gallium, etc. as the substrate 201. As shown in Figure 1, the workpiece 200 has multiple intersecting division lines 203 set on its surface 202, and a device 204 is formed in the region partitioned by the division lines 203.

[0022] Device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), or a memory (semiconductor memory device).

[0023] In Embodiment 1, as shown in Figure 1, the workpiece 200 is supported within the opening of the annular frame 210 by an adhesive tape 209 attached to the back surface 205 of the front surface 202, which is disc-shaped with a diameter larger than the outer diameter of the workpiece 200 and has an annular frame 210 attached to its outer edge. The workpiece 200 is divided into individual devices 204 by irradiating a laser beam 21 onto a division line 203, for example.

[0024] The processing apparatus 1 shown in Figure 1 is a laser processing apparatus that sets the focal point of a pulsed laser beam 21 with a wavelength that is absorbed by the substrate 201 constituting the workpiece 200 to the surface 202 of the workpiece 200, irradiates the workpiece 200 along the planned division line 203, and performs ablation processing on the workpiece 200 to form a processing groove 208 (corresponding to a processing mark) shown as a dashed line in Figure 1 along the planned division line 203 of the workpiece 200.

[0025] As shown in Figure 1, the processing apparatus 1 includes a holding unit 10 for holding the workpiece 200, a laser beam irradiation unit 20, a moving unit 30, an imaging unit 40, a cassette elevator (not shown), a protective film forming and cleaning unit (not shown), a transport unit (not shown), and a control unit 100.

[0026] The holding unit 10 holds the workpiece 200 on a holding surface 11 parallel to the horizontal direction. The holding surface 11 is a disc shape formed from porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a suction path (not shown). The holding unit 10 holds the workpiece 200 placed on the holding surface 11 by suction from the vacuum suction source. Multiple clamping parts 12 are arranged around the holding unit 10 to hold an annular frame 210 that supports the workpiece 200 within the opening.

[0027] Furthermore, the holding unit 10 is rotated by the rotational movement unit 33 of the moving unit 30 around an axis that is perpendicular to the holding surface 11 and parallel to the Z-axis direction which is also parallel to the vertical direction. Together with the rotational movement unit 33, the holding unit 10 is moved in the X-axis direction parallel to the horizontal direction by the X-axis movement unit 31 of the moving unit 30, and moved in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction by the Y-axis movement unit 32. The holding unit 10 is moved by the moving unit 30 between the processing area below the laser beam irradiation unit 20 and the loading / unloading area away from below the laser beam irradiation unit 20 where the workpiece 200 is loaded and unloaded.

[0028] The moving unit 30 moves the holding unit 10 and the focal point of the laser beam 21 irradiated by the laser beam irradiation unit 20 relative to each other in the X-axis direction, Y-axis direction, Z-axis direction, and an axis parallel to the Z-axis direction. The X-axis direction and Y-axis direction are mutually orthogonal and parallel to the holding surface 11 (i.e., the horizontal direction). The Z-axis direction is perpendicular to both the X-axis direction and the Y-axis direction.

[0029] The moving unit 30 includes an X-axis moving unit 31, which is a machining feed unit that moves the holding unit 10 in the X-axis direction; a Y-axis moving unit 32, which is an indexing feed unit that moves the holding unit 10 in the Y-axis direction; a rotational moving unit 33 that rotates the holding unit 10 around an axis parallel to the Z-axis direction; and a Z-axis moving unit 34 that moves the focal point of the laser beam 21 of the laser beam irradiation unit 20 in the Z-axis direction.

[0030] The Y-axis movement unit 32 is an indexing feed unit that moves the holding unit 10 and the focusing point of the laser beam 21 of the laser beam irradiation unit 20 relative to each other in the Y-axis direction. In Embodiment 1, the Y-axis movement unit 32 is installed on the main body 2 of the processing apparatus 1. The Y-axis movement unit 32 supports the moving plate 5 that supports the X-axis movement unit 31 so as to be movable in the Y-axis direction.

[0031] The X-axis movement unit 31 is a machining feed unit that moves the holding unit 10 and the focusing point of the laser beam 21 of the laser beam irradiation unit 20 relative to each other in the X-axis direction. The X-axis movement unit 31 is installed on a movement plate 5. The X-axis movement unit 31 supports a second movement plate 6 that supports a rotational movement unit 33, which rotates the holding unit 10 around an axis parallel to the Z-axis direction, so as to be movable in the X-axis direction. The second movement plate 6 supports the rotational movement unit 33 and the holding unit 10. The rotational movement unit 33 supports the holding unit 10.

[0032] The Z-axis movement unit 34 is a feed unit that moves the holding unit 10 and the focusing point of the laser beam 21 of the laser beam irradiation unit 20 relative to each other in the Z-axis direction. The Z-axis movement unit 34 is installed on an upright wall 3 that is erected from the main body of the device 2. The Z-axis movement unit 34 supports the support column 4, which has a focusing lens and the like (described later) at its tip, so as to be movable in the Z-axis direction.

[0033] The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 34 are equipped with a well-known ball screw that is rotatably mounted around its axis and moves the moving plate 5, 6 or support column 4 in the X-axis, Y-axis, or Z-axis direction when rotated around its axis, a well-known pulse motor that rotates the ball screw around its axis, and a well-known guide rail that supports the moving plate 5, 6 or support column 4 so that it can move in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 33 is equipped with a motor that rotates the holding unit 10 around its axis.

[0034] Furthermore, the processing apparatus 1 includes an X-axis position detection unit (not shown) for detecting the position of the holding unit 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the holding unit 10 in the Y-axis direction, and a Z-axis position detection unit (not shown) for detecting the position of the support column 4 in the Z-axis direction. Each position detection unit outputs the detection result to the control unit 100.

[0035] The laser beam irradiation unit 20 is a processing unit that focuses and irradiates a workpiece 200 held on the holding surface 11 of the holding unit 10 with a pulsed laser beam 21, thereby performing laser processing (equivalent to processing) on ​​the workpiece 200. In Embodiment 1, a part of the laser beam irradiation unit 20 is positioned at the tip of a support column 4, which is supported by a Z-axis movement unit 34 installed on an upright wall 3 erected from the main body of the device 2, as shown in Figure 1.

[0036] The laser beam irradiation unit 20 includes a laser oscillator that emits a pulsed laser beam 21, and a focusing lens that focuses the laser beam 21 emitted from the laser oscillator and irradiates the workpiece 200 with it. In Embodiment 1, the laser beam irradiation unit 20 irradiates the workpiece 200, which is held in the holding unit 10, with a laser beam 21 of a wavelength absorbed by the substrate 201 of the workpiece 200, thereby performing ablation processing on the workpiece 200.

[0037] The imaging unit 40 images the workpiece 200 held by the holding unit 10. The imaging unit 40 is equipped with an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor whose objective lens is opposite in the Z-axis direction. In Embodiment 1, as shown in Figure 1, the imaging unit 40 is positioned at the tip of the support column 4, with its objective lens aligned with the focusing lens of the laser beam irradiation unit 20 along the X-axis direction.

[0038] The imaging unit 40 acquires the image captured by the image sensor and outputs the acquired image to the control unit 100. The imaging unit 40 also images the workpiece 200 held on the holding surface 11 of the holding unit 10 to acquire an image for performing alignment between the workpiece 200 and the laser beam irradiation unit 20, and outputs the acquired image to the control unit 100.

[0039] Furthermore, the processing apparatus 1 is equipped with a processing state measurement unit 50, as shown in Figure 1. Next, the processing state measurement unit 50 will be described. Figure 2 is a diagram showing an example of processing state information of a workpiece acquired by the processing state measurement unit of the processing apparatus shown in Figure 1. The processing state measurement unit 50 measures information regarding the processing groove 208, which is the processing state of the workpiece 200 held by the holding unit 10.

[0040] In Embodiment 1, the processing state measurement unit 50 is positioned next to the imaging unit 40 in the X-axis direction and is aligned with the focusing lens of the laser beam irradiation unit 20 and the objective lens of the imaging unit 40 along the X-axis direction. In Embodiment 1, the processing state measurement unit 50 is a three-dimensional measurement unit that measures the shape of the processing groove 208 of the workpiece 200 in three dimensions in the mutually orthogonal X-axis, Y-axis, and Z-axis directions (corresponding to information about the processing groove 208, i.e., processing information, hereinafter referred to as processing state information 51 as illustrated in Figure 2).

[0041] In other words, in Embodiment 1, the machining state information 51 exemplified in Figure 2, obtained by the machining state measurement unit 50 measuring the shape of the machining groove 208, is information indicating the three-dimensional shape of the workpiece 200 including the machining groove 208 and the area around the machining groove 208. In Embodiment 1, the machining state measurement unit 50 is a three-dimensional measuring unit that measures the three-dimensional shape of the workpiece 200 including the machining groove 208 and the area around the machining groove 208 as the machining state information 51. However, the present invention is not limited to this, and the machining state information 51 may also be obtained as information indicating the two-dimensional shape of the workpiece 200 including the machining groove 208 and the area around the machining groove 208, parallel to both the X-axis and Y-axis directions (i.e., a two-dimensional image).

[0042] In Embodiment 1, the processing state measurement unit 50 is composed of a well-known laser microscope or a line sensor. However, in the present invention, the processing state measurement unit 50 may be composed of a well-known microscope that acquires two-dimensional images.

[0043] Furthermore, in Embodiment 1, the machining state information 51 includes the machining groove 208 of the workpiece 200 and is information indicating the three-dimensional shape around the machining groove 208. Therefore, it includes the minimum width on the surface 202 of the machining groove 208, the maximum width on the surface 202 of the machining groove 208, the width of the bottom surface of the machining groove 208, the width at a predetermined distance from the surface 202 towards the bottom surface of the machining groove 208, the average depth of the machining groove 208, the maximum depth of the machining groove 208, the minimum depth of the machining groove 208, and the surface roughness of the bottom surface of the machining groove 208. In other words, in the present invention, the machining state information 51 only needs to include at least one of the following: the minimum width on the surface 202 of the machining groove 208, the maximum width on the surface 202 of the machining groove 208, the width of the bottom surface of the machining groove 208, the width at a predetermined distance from the surface 202 towards the bottom surface of the machining groove 208, the average depth of the machining groove 208, the maximum depth of the machining groove 208, the minimum depth of the machining groove 208, and the surface roughness of the bottom surface of the machining groove 208.

[0044] The cassette elevator is equipped with a cassette that holds multiple workpieces 200 before and after processing. The cassette elevator moves the cassette containing multiple workpieces 200 in the Z-axis direction. The protective film forming and cleaning unit applies a water-soluble resin to the surface 202 of the workpiece 200 before processing to form a protective film on the surface 202 of the workpiece 200, and cleans the surface 202 of the workpiece 200 after processing to remove the protective film from the surface 202. The water-soluble resin is composed of, for example, polyvinyl alcohol (PVA) or polyvinylpyrrolidone (PVP). The transport unit unloads the workpieces 200 before processing from the cassette and transports them sequentially to the protective film forming and cleaning unit and the holding unit 10, and also transports the processed workpieces 200 from the holding unit 10 to the protective film forming and cleaning unit, and then loads the cleaned workpieces 200 into the cassette.

[0045] The control unit 100 controls each of the above-mentioned components of the processing apparatus 1 to cause the processing apparatus 1 to perform processing operations on the workpiece 200. The control unit 100 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device with memory such as ROM (read-only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing unit of the control unit 100 performs calculations according to the computer program stored in the storage device and outputs control signals for controlling the processing apparatus 1 to the above-mentioned components of the processing apparatus 1 via the input / output interface device, thereby realizing the function of the control unit 100.

[0046] Furthermore, the processing apparatus 1 includes a display unit 110, which is a display means consisting of a liquid crystal display device that displays the status of processing operations and images, an input unit 120, which is an input means used by the operator to input processing conditions, and a notification unit (not shown). The display unit 110, the input unit 120, and the notification unit are connected to the control unit 100. The input unit 120 consists of a touch panel provided on the display unit 110. The notification unit notifies the operator by emitting at least one of sound, light, or a message on the display unit 110.

[0047] Furthermore, as shown in Figure 1, the control unit 100 includes a machining control unit 101, an information acquisition unit 102, and a storage unit 103. Figure 3 is a diagram showing the machining state vibration information acquired by the information acquisition unit of the control unit of the machining apparatus 1 shown in Figure 1 and stored in the storage unit.

[0048] The processing control unit 101 controls each of the above-mentioned components of the processing apparatus 1 to perform processing operations on the workpiece 200. The information acquisition unit 102 acquires processing state information 51 of the workpiece 200 using the processing state measurement unit 50, and also acquires vibration information related to vibrations of the processing apparatus 1 that occur while the processing state information 51 is being acquired. The acquired processing state information 51 and vibration information are linked and stored in the storage unit 103 as processing state vibration information 300 shown in Figure 3.

[0049] In Embodiment 1, the information acquisition unit 102 acquires processing state information 51 of the workpiece 200 from the processing state measurement unit 50, and also acquires the operating status 301 of the processing device 1, which is vibration information at the time the processing state measurement unit 50 started acquiring the processing state information 51, from the processing control unit 101. In Embodiment 1, the information acquisition unit 102 links the processing state information 51 acquired by the processing state measurement unit 50 and the operating status 301 of the processing device 1, which is vibration information acquired from the processing control unit 101, on a one-to-one basis, and stores them in the storage unit 103 as processing state vibration information 300, as shown in Figure 3.

[0050] Thus, in Embodiment 1, the vibration information is the operating status 301 of the processing apparatus 1. The processing state vibration information 300 shown in Figure 3 indicates the operating status 301 of the processing apparatus 1, which is the vibration information, specifically during the cleaning of the workpiece 200 by the protective film forming cleaning unit, during the formation of a protective film on the workpiece 200 by the protective film forming cleaning unit, and during the transport of the workpiece 200 by the transport unit.

[0051] Furthermore, the information acquisition unit 102 determines whether the operating status 301 of the processing apparatus 1, which is vibration information acquired from the processing control unit 101, is a predetermined operating status 302. The predetermined operating status 302 is an operating status 301 of the processing apparatus 1 in which the amplitude of vibration of the processing status measurement unit 50 is larger than that of any other operating status 301, and the reliability of the processing status information 51 acquired by the processing status measurement unit 50 is reduced. In Embodiment 1, the predetermined operating status 302 is, for example, the cleaning of the workpiece 200 by the protective film forming cleaning unit, or the formation of a protective film on the workpiece 200 by the protective film forming cleaning unit, but the present invention is not limited to these.

[0052] When the information acquisition unit 102 determines that the operating status 301 of the processing device 1, which is vibration information acquired from the processing control unit 101, is a predetermined operating status 302, it reacquires the processing status information 51 using the processing status measurement unit 50. The reacquisition of the processing status information 51 by the processing status measurement unit 50 may be performed after the operating status 301 of the processing device 1 acquired from the processing control unit 101 has become an operating status 301 other than the predetermined operating status 302, or by acquiring the processing status information 51 of a processing groove 208 adjacent to the processing groove 208 from which the processing status information 51 was acquired by the processing status measurement unit 50, or by acquiring the processing status information 51 of the same processing groove 208 as the processing groove 208 from which the processing status information 51 was acquired by the processing status measurement unit 50.

[0053] The memory unit 103 stores the processing state vibration information 300.

[0054] The functions of the processing control unit 101 and the information acquisition unit 102 are realized by the arithmetic processing unit performing calculations according to the computer program stored in the memory device. The functions of the storage unit 103 are realized by the aforementioned memory device.

[0055] Next, the processing operation of the processing apparatus 1 with the configuration described above will be explained. The processing apparatus 1 receives and registers processing conditions input by the operator via the control unit 100, and a cassette containing multiple workpieces 200 is installed in the cassette elevator. When the control unit 100 receives a processing start instruction from the operator, the processing apparatus 1 starts the processing operation. During the processing operation, the processing control unit 101 of the control unit 100 controls the transport unit to remove one workpiece 200 from the cassette, and the workpiece 200 is placed on the holding surface 11 of the holding unit 10 positioned in the loading / unloading area via adhesive tape 209.

[0056] During the machining operation, the machining control unit 101 of the control unit 100 uses adhesive tape 209 to hold the workpiece 200 to the holding surface 11 of the holding unit 10, and clamps the annular frame 210 with the clamping part 12. During the machining operation, the machining control unit 101 of the control unit 100 controls the moving unit 30 to move the holding unit 10 to the machining area, the imaging unit 40 captures an image of the workpiece 200 held by the holding unit 10, and performs alignment to align the focusing point of the laser beam irradiation unit 20 with the planned division line 203.

[0057] During the processing operation, the processing apparatus 1 controls the Z-axis movement unit 34 via the processing control unit 101 of the control unit 100 to position the focusing lens of the laser beam irradiation unit 20 at a location where the focusing point of the laser beam irradiation unit 20 is formed on the surface 202 of the workpiece 200 along the planned division line 203. During the processing operation, the processing apparatus 1 controls the movement unit 30 via the processing control unit 101 of the control unit 100 to move the holding unit 10 and the focusing point of the laser beam irradiation unit 20 relatively along the planned division line 203, while irradiating the planned division line 203 of the workpiece 200 with a pulsed laser beam 21 from the surface 202 side of the substrate 201.

[0058] In Embodiment 1, during the processing operation, the processing device 1 performs ablation processing on the planned division lines 203 of the workpiece 200, since the laser beam 21 has a wavelength that is absorbed by the substrate 201 of the workpiece 200, thereby forming concave processing grooves 208 from the surface 202. In Embodiment 1, during the processing operation, once the processing device 1 has irradiated the laser beam 21 along all the planned division lines 203, it stops irradiating the laser beam 21 and moves the holding unit 10 to the loading / unloading area. During the processing operation, the processing device 1's processing control unit 101 of the control unit 100 positions the holding unit 10 in the loading / unloading area, stops the suction holding of the workpiece 200 by the holding unit 10, releases the clamping of the annular frame 210 of the clamping unit 12, and controls the transport unit to transport the processed workpiece 200 from the holding unit 10 to the protective film forming and cleaning unit.

[0059] In Embodiment 1, during the processing operation, the processing device 1 has the processing control unit 101 of the control unit 100 transport the cleaned workpieces 200 to the transport unit and load them into the cassette. In Embodiment 1, the processing device 1 laser-processes each workpiece 200 in the cassette one by one, and terminates the processing operation when all workpieces 200 in the cassette have been laser-processed.

[0060] Furthermore, during processing, the processing device 1 temporarily suspends the irradiation of the laser beam 21 at predetermined timings and performs the following kerf check. The predetermined timing is, for example, every time a predetermined number of division lines 203 are laser-processed. In the kerf check, the processing device 1 has the processing control unit 101 of the control unit 100 control the moving unit 30 to move the holding unit 10, so that the processing groove 208 at a predetermined position determined by the processing conditions of the workpiece 200 held in the holding unit 10 is positioned below the imaging unit 40. In the kerf check, the processing device 1 has the processing control unit 101 of the control unit 100 cause the imaging unit 40 to image a predetermined position of the workpiece 200, detect the processing groove 208 from the image acquired by the imaging unit 40, and detect the width of the processing groove 208, the relative position of the processing groove 208 with respect to the division lines 203, and the number and size of chips (also called chipping) formed on both edges of the processing groove 208.

[0061] During the kerf check, the machining device 1 uses the machining control unit 100's machining control unit 101 to determine whether the width of the machining groove 208, the relative position of the machining groove 208 with respect to the planned division line 203, and the number and size of chips (also called chipping) formed on both edges of the machining groove 208 are within a predetermined tolerance range. If it determines that they are not within the tolerance range, it activates the notification unit and terminates the machining operation. In addition, during the kerf check, if the machining control unit 101 of the control unit 100 determines that the width of the machining groove 208, the relative position of the machining groove 208 with respect to the planned division line 203, and the number and size of chips (also called chipping) formed on both edges of the machining groove 208 are within a predetermined tolerance range, the machining device 1 resumes the machining operation. In the subsequent processing operation, the processing device 1 adjusts the relative position of the focusing point of the laser beam irradiation unit 20 to the division line 203 of the workpiece 200, based on the relative position of the processing groove 208 with respect to the division line 203 obtained by the processing control unit 101 of the control unit 100 in the previous kerf check, so that the processing groove 208 is formed at a predetermined position such as the center in the width direction of the division line 203.

[0062] Furthermore, in Embodiment 1, the processing device 1 acquires processing state vibration information 300 before completing the kerf check and resuming the processing operation. When acquiring the processing state vibration information 300, the processing device 1 uses the information acquisition unit 102 of the control unit 100 to control the moving unit 30 and move the holding unit 10 so that the processing groove 208 of the workpiece 200 held in the holding unit 10 at a predetermined position determined by the processing conditions is positioned below the processing state measuring unit 50. When acquiring the processing state vibration information 300, the processing device 1 uses the information acquisition unit 102 of the control unit 100 to acquire processing state information 51 of the workpiece 200 from the processing state measuring unit 50, and also acquires the operating status 301 of the processing device 1, which is vibration information related to the vibration of the processing device 1 that occurs while the processing state information 51 is being acquired. The acquired processing state information 51 and the operating status 301 of the processing device 1 are linked one-to-one and stored in the storage unit 103 as processing state vibration information 300.

[0063] Furthermore, in Embodiment 1, when the information acquisition unit 102 of the control unit 100 determines that the operating status 301 of the processing device 1, which is vibration information acquired from the processing control unit 101, is a predetermined operating status 302, the processing status measurement unit 50 reacquires processing status information 51, links the reacquired processing status information 51 and the operating status 301 of the processing device 1, which is vibration information, on a one-to-one basis, and stores it in the storage unit 103 as processing status vibration information 300.

[0064] As described above, the processing apparatus 1 according to Embodiment 1 stores the processing state information 51 and the vibration information, which is the operating status 301 of the processing apparatus 1, in a one-to-one correspondence as processing state vibration information 300 in the storage unit 103, thereby clearly indicating the reliability of the processing state information 51. Furthermore, the processing apparatus 1 according to Embodiment 1 can easily grasp the reliability of each processing state information 51 by checking the operating status of the processing apparatus 1 linked to the processing state information 51, and can adopt only the processing state information 51 with high reliability.

[0065] Furthermore, the processing apparatus 1 according to Embodiment 1 determines whether the operating status 301 of the processing apparatus 1 linked to the processing status information 51 is a predetermined operating status 302, and only reacquires the processing status information 51 when it has acquired unreliable processing status information 51, thereby contributing to improved productivity.

[0066] As a result, the processing apparatus 1 according to Embodiment 1 has the effect of being able to acquire highly reliable processing status information 51 while suppressing a decrease in productivity.

[0067] [Variation] A modified version of Embodiment 1 of the present invention will be described based on the drawings. Figure 4 is a diagram showing an example of the configuration of a modified version of Embodiment 1. Figure 5 is a diagram schematically showing vibration data acquired by the vibration measurement unit of the processing apparatus shown in Figure 4. Figure 6 is a diagram showing processing state vibration information acquired by the information acquisition unit of the control unit of the processing apparatus shown in Figure 4 and stored in the storage unit. In Figures 4 and 6, the same parts as in Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0068] A modified version of Embodiment 1, the processing apparatus 1, includes a vibration measuring unit 60, as shown in Figure 4. In Embodiment 1, the vibration measuring unit 60 is attached to the processing state measuring unit 50 to acquire vibration data 61 (shown in Figure 5), which is vibration information of the processing state measuring unit 50, and outputs the acquired vibration data 61 to the control unit 100. Thus, in this modified version of Embodiment 1, the vibration information is the vibration data 61 acquired by the vibration measuring unit 60. In this modified version of Embodiment 1, the vibration data 61 acquired by the vibration measuring unit 60 shows the change in vibration intensity (shown on the vertical axis in Figure 5) with respect to time (shown on the horizontal axis in Figure 5). The intensity on the vertical axis of the vibration data 61 shown in Figure 5 is shown in arbitrary units. The vibration measuring unit 60 is composed of, for example, an acceleration sensor (for example, a piezoelectric acceleration sensor).

[0069] In the modified version of Embodiment 1, the information acquisition unit 102 of the control unit 100 of the processing apparatus 1 acquires processing state information 51 of the workpiece 200 using the processing state measurement unit 50, and while the processing state measurement unit 50 is acquiring the processing state information 51, the vibration measurement unit 60 acquires vibration data 61, which is vibration information. In Embodiment 1, the information acquisition unit 102 calculates the maximum value 62 of the intensity of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60 (shown in Figure 5, corresponding to the vibration value, and hereinafter referred to as the maximum vibration value). The information acquisition unit 102 links the processing state information 51 acquired by the processing state measurement unit 50 and the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, on a one-to-one basis and stores it in the storage unit 103 as processing state vibration information 300-1, as shown in Figure 6.

[0070] Thus, in this modified embodiment of Embodiment 1, the vibration information is vibration data 61 acquired by the vibration measurement unit 60.

[0071] Furthermore, in a modified example of Embodiment 1, the information acquisition unit 102 determines whether the maximum vibration value 62 of the vibration data 61, which is vibration information acquired from the processing control unit 101, is greater than or equal to a predetermined tolerance value. The tolerance value is a value corresponding to the amplitude of vibration of the processing state measuring unit 50, which reduces the reliability of the processing state information 51 acquired by the processing state measuring unit 50.

[0072] When the information acquisition unit 102 determines that the maximum vibration value 62 of the vibration data 61, which is vibration information acquired from the machining control unit 101, is greater than or equal to a predetermined allowable value, it reacquires the machining state information 51 using the machining state measurement unit 50. The reacquisition of the machining state information 51 by the machining state measurement unit 50 may be performed by the machining state measurement unit 50 acquiring the machining state information 51 of a machining groove 208 adjacent to the machining groove 208 from which the machining state information 51 was acquired by the machining state measurement unit 50, as in Embodiment 1, or by the machining state measurement unit 50 acquiring the machining state information 51 of the same machining groove 208 from which the machining state information 51 was acquired by the machining state measurement unit 50.

[0073] Furthermore, in a modified version of Embodiment 1, when acquiring processing state vibration information 300, the processing apparatus 1, with the information acquisition unit 102 of the control unit 100, acquires processing state information 51 of the workpiece 200 using the processing state measurement unit 50, similar to Embodiment 1. It also acquires vibration data 61, which is vibration information related to the vibration of the processing apparatus 1 that occurs while acquiring the processing state information 51. The acquired processing state information 51 and the maximum vibration value 62 of the vibration data 61 are linked one-to-one and stored in the storage unit 103 as processing state vibration information 300-1.

[0074] Furthermore, in a modified version of Embodiment 1, when the information acquisition unit 102 of the control unit 100 determines that the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, is greater than or equal to a predetermined allowable value, the processing state measurement unit 50 reacquires the processing state information 51, links the reacquired processing state information 51 and the maximum vibration value 62 of the vibration data 61, which is vibration information, on a one-to-one basis, and stores it in the storage unit 103 as processing state vibration information 300-1.

[0075] The modified processing apparatus 1 of Embodiment 1 stores the processing state information 51 and the maximum vibration value 62 of the vibration data 61, which is vibration information, in a one-to-one correspondence as processing state vibration information 300-1 in the storage unit 103. It then determines whether the maximum vibration value 62 of the vibration data 61 linked to the processing state information 51 is above or below an acceptable value, and only reacquires the processing state information 51 when it has acquired unreliable processing state information 51 in which the maximum vibration value 62 is above or below an acceptable value. As a result, the modified processing apparatus 1 of Embodiment 1 has the effect of being able to acquire highly reliable processing state information 51 while suppressing a decrease in productivity, similar to Embodiment 1.

[0076] [Embodiment 2] A processing apparatus according to Embodiment 2 of the present invention will be described based on the drawings. Figure 7 is a perspective view showing an example of the configuration of the processing apparatus according to Embodiment 2. In Figure 7, the same reference numerals are used for parts that are the same as those in Embodiment 1, and their descriptions are omitted.

[0077] As shown in Figure 7, the processing apparatus 1 according to Embodiment 2 has a storage unit 103 that stores correlation relationships 104. The correlation relationship 104 shows the relationship between processing state information 51 acquired when the processing state measurement unit 50 is not vibrating and processing state information 51 acquired when the processing state measurement unit 50 is vibrating. The processing state information 51 acquired when the processing state measurement unit 50 is not vibrating is the processing state information 51 acquired when the processing state measurement unit 50 measures information regarding the processing groove 208 of the workpiece 200 held by the stationary holding unit 10, while the components other than the processing state measurement unit 50 and the holding unit 10 are not operating.

[0078] Furthermore, in Embodiment 2, the machining state information 51 acquired while the machining state measurement unit 50 is vibrating is the machining state information 51 acquired when the operating status 301 of the machining apparatus 1, which is vibration information, is in the predetermined operating status 302 described above, and the machining state measurement unit 50 measures and acquires information regarding the machining groove 208 of the workpiece 200 held by the holding unit 10. In Embodiment 2, the correlation 104 is the relationship between machining state information 51 that defines the depth of the machining groove 208 in the machining state information 51 acquired while the machining state measurement unit 50 is vibrating as being predeterminedly shallower than the depth of the machining groove 208 in the machining state information 51 acquired while the machining state measurement unit 50 is not vibrating.

[0079] In Embodiment 2, when acquiring processing state vibration information 300, the processing apparatus 1, in the same manner as in Embodiment 1, has an information acquisition unit 102 of the control unit 100 that acquires processing state information 51 of the workpiece 200 using a processing state measurement unit 50, and also acquires vibration information, which is the operating status 301 of the processing apparatus 1, relating to vibrations of the processing apparatus 1 that occur while acquiring the processing state information 51. The acquired processing state information 51 and the vibration information, which is the operating status 301 of the processing apparatus 1, are linked one-to-one and stored in the storage unit 103 as processing state vibration information 300.

[0080] Furthermore, in Embodiment 2, when the information acquisition unit 102 of the control unit 100 determines that the operating status 301 of the processing device 1, which is vibration information acquired from the processing control unit 101, is a predetermined operating status 302, the processing device 1 corrects the processing status information 51 acquired by the processing status measurement unit 50 to processing status information 51 acquired in a state without vibration, based on the correlation relationship 104. In Embodiment 2, the information acquisition unit 102 of the control unit 100 corrects the depth of the processing groove 208 in the processing status information 51 acquired by the processing status measurement unit 50 to a predetermined depth shallower as defined by the correlation relationship 104.

[0081] The processing apparatus 1 according to Embodiment 2 stores processing state vibration information 300 in the storage unit 103 by linking processing state information 51 and the operating status 301 of the processing apparatus 1, which is vibration information, on a one-to-one basis. It then determines whether the operating status 301 of the processing apparatus 1 linked to the processing state information 51 is a predetermined operating status 302, and corrects the unreliable processing state information 51 that is determined to be a predetermined operating status 302 to processing state information 51 obtained in a vibration-free state based on the correlation relationship 104. As a result, the processing apparatus 1 according to the embodiment has the effect of being able to obtain highly reliable processing state information 51 while suppressing a decrease in productivity.

[0082] [Variation] A processing apparatus according to a modified example of Embodiment 2 of the present invention will be described based on the drawings. Figure 8 is a diagram showing an example of the configuration of the processing apparatus according to a modified example of Embodiment 2. Figure 9 is a diagram schematically showing another example of a correlation stored in the memory unit of the control unit of the processing apparatus shown in Figure 8. In Figure 8, the same reference numerals are used for parts that are the same as those in the modified example of Embodiment 1 and Embodiment 2, and their descriptions are omitted.

[0083] As shown in Figure 8, the modified processing apparatus 1 of Embodiment 2 is equipped with a vibration measuring unit 60, similar to the modified embodiment of Embodiment 1. Also, similar to Embodiment 2, the storage unit 103 of the control unit 100 stores the correlation relationship 104.

[0084] In a modified version of Embodiment 2, when acquiring processing state vibration information 300, the processing apparatus 1, with the information acquisition unit 102 of the control unit 100, acquires processing state information 51 of the workpiece 200 using the processing state measurement unit 50, similar to the modified version of Embodiment 1. It also acquires vibration data 61, which is vibration information relating to the vibration of the processing apparatus 1 that occurs while acquiring the processing state information 51. The acquired processing state information 51 and the maximum vibration value 62 of the vibration data 61 are linked one-to-one and stored in the storage unit 103 as processing state vibration information 300-1.

[0085] Furthermore, in a modified version of Embodiment 2, when the information acquisition unit 102 of the control unit 100 determines that the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, is greater than or equal to an allowable value, the processing apparatus 1 corrects the processing state information 51 acquired by the processing state measurement unit 50 to the processing state information 51 acquired in a state without vibration, based on the correlation relationship 104. In the modified version of Embodiment 2, the information acquisition unit 102 of the control unit 100 corrects the depth of the processing groove 208 of the processing state information 51 acquired by the processing state measurement unit 50 to a predetermined depth shallower as defined by the correlation relationship 104.

[0086] The modified processing apparatus 1 of Embodiment 2 associates processing state information 51 with the maximum vibration value 62 of vibration data 61, which is vibration information, on a one-to-one basis and stores it in the storage unit 103 as processing state vibration information 300-1. It then determines whether the maximum vibration value 62 of the vibration data 61 associated with the processing state information 51 is above an acceptable value, and corrects the unreliable processing state information 51 that is determined to be above an acceptable value to processing state information 51 obtained in a vibration-free state based on the correlation relationship 104. As a result, the modified processing apparatus 1 of Embodiment 2 has the effect of being able to obtain highly reliable processing state information 51 while suppressing a decrease in productivity.

[0087] Furthermore, in the modified version of Embodiment 2, the processing apparatus 1 may, for example, have a storage unit 103 that stores the correlation relationship 104-1 shown in Figure 9, and an information acquisition unit 102 that corrects the processing state information 51 acquired by the processing state measurement unit 50 to processing state information 51 acquired in a vibration-free state based on the correlation relationship 104-1. The correlation relationship 104-1 shown in Figure 9 is the relationship between the maximum vibration value 62 of the vibration data 61 acquired by the vibration measurement unit 60 and the correction value 63 used when correcting the processing state information 51 acquired by the processing state measurement unit 50 to processing state information 51 acquired in a vibration-free state. The horizontal axis of Figure 9 is the maximum vibration value 62 of the vibration data 61 acquired by the vibration measurement unit 60, and the vertical axis of Figure 9 is the correction value 63 mentioned above. Therefore, the correlation relationship 104-1 illustrated in Figure 9 specifies that the correction value 63 should be increased as the maximum vibration value 62 of the vibration data 61 increases.

[0088] In this case, the processing apparatus 1 corrects the processing state information 51 acquired by the processing state measurement unit 50 to processing state information 51 acquired under conditions without vibration, based on the correlation relationship 104-1, without the information acquisition unit 102 of the control unit 100 determining whether the maximum vibration value 62 of the vibration data 61 is above or below an acceptable value. Specifically, in a modified example of Embodiment 2, the processing apparatus 1 corrects the depth of the processing groove 208 of the processing state information 51 acquired by the processing state measurement unit 50 by the information acquisition unit 102 of the control unit 100 to be shallower by a correction value 63 corresponding to the maximum vibration value 62 of the vibration data 61, which is vibration information, based on the correlation relationship 104-1.

[0089] In Embodiment 2 and its modified form, the depth of the machining groove 208 in the machining state information 51 acquired by the machining state measurement unit 50 is corrected based on correlations 104 and 104-1. However, in the present invention, the machining apparatus 1 may correct not only the depth of the machining groove 208, but also the minimum width on the surface 202 of the machining groove 208, the maximum width on the surface 202 of the machining groove 208, the width of the bottom surface of the machining groove 208, the width at a predetermined distance from the surface 202 of the machining groove 208, etc.

[0090] [Embodiment 3] A processing apparatus according to Embodiment 3 of the present invention will be described based on the drawings. Figure 10 is a perspective view showing an example of the configuration of the processing apparatus according to Embodiment 3. In Figure 10, the same reference numerals are used for parts that are the same as those in Embodiments 1 and 2, and their descriptions are omitted.

[0091] In the processing apparatus 1 according to Embodiment 3, as shown in Figure 10, the storage unit 103 stores a standard judgment criterion 105. The standard judgment criterion 105 is a judgment criterion that determines whether the processing result is good or bad from the processing state information 51 of the workpiece 200 when it is determined that the operating status 301 of the processing apparatus 1, which is vibration information, is not a predetermined operating status 302. In Embodiment 3, the standard judgment criterion 105 defines a lower limit and an upper limit for the depth of the processing groove 208, and determines that a processing result in which the depth of the processing groove 208 is greater than or equal to the lower limit and less than or equal to the upper limit is good, and determines that a processing result in which the depth of the processing groove 208 is less than the lower limit and greater than the upper limit is bad.

[0092] In Embodiment 3, when acquiring processing state vibration information 300, the processing apparatus 1, with the information acquisition unit 102 of the control unit 100, acquires processing state information 51 of the workpiece 200 using the processing state measurement unit 50, similar to Embodiment 1. At the same time, it acquires vibration information related to the vibration of the processing apparatus 1 that occurs while acquiring the processing state information 51, namely the operating status 301 of the processing apparatus 1. The acquired processing state information 51 and the vibration information, namely the operating status 301 of the processing apparatus 1, are linked one-to-one and stored in the storage unit 103 as processing state vibration information 300.

[0093] Furthermore, in Embodiment 3, the processing apparatus 1 uses the information acquisition unit 102 of the control unit 100 to acquire the reference judgment criterion 105 from the storage unit 103 and to determine whether the operating status 301 of the processing apparatus 1, which is vibration information acquired from the processing control unit 101, is a predetermined operating status 302. In Embodiment 3, when the processing apparatus 1 determines that the operating status 301 of the processing apparatus 1, which is vibration information acquired from the processing control unit 101 by the information acquisition unit 102 of the control unit 100, is a predetermined operating status 302, it reduces the lower limit of the reference judgment criterion 105 by a predetermined predetermined value to generate a new corrected lower limit, increases the upper limit of the reference judgment criterion 105 by a predetermined predetermined value to generate a new corrected upper limit, and sets the reference judgment criterion 105 as a corrected judgment criterion.

[0094] The correction judgment criteria are used to determine the quality of the machining result based on the machining state information 51 of the workpiece 200. A machining result in which the depth of the machining groove 208 is greater than or equal to the correction lower limit and less than or equal to the correction upper limit is judged as good, while a machining result in which the depth of the machining groove 208 is less than the correction lower limit and greater than the correction upper limit is judged as poor.

[0095] In Embodiment 3, when the information acquisition unit 102 of the control unit 100 determines that the operating status 301 of the processing device 1, which is vibration information acquired from the processing control unit 101, is a predetermined operating status 302, it determines whether the processing status information 51 acquired by the processing status measurement unit 50 is within the correction judgment criteria. In Embodiment 3, if the information acquisition unit 102 of the control unit 100 determines that it is within the correction judgment criteria, it determines that the processing result of the processing groove 208 of the workpiece 200 is good, and if it determines that it is not within the correction judgment criteria, it determines that the processing result of the processing groove 208 of the workpiece 200 is poor.

[0096] In Embodiment 3, when the information acquisition unit 102 of the control unit 100 determines that the operating status 301 of the processing device 1, which is vibration information acquired from the processing control unit 101, is not a predetermined operating status 302, it determines whether the processing status information 51 acquired by the processing status measurement unit 50 is within the standard judgment criteria 105. In Embodiment 3, if the information acquisition unit 102 of the control unit 100 determines that it is within the standard judgment criteria 105, it determines that the processing result of the processing groove 208 of the workpiece 200 is good, and if it determines that it is not within the standard judgment criteria 105, it determines that the processing result of the processing groove 208 of the workpiece 200 is poor.

[0097] In Embodiment 3, when the information acquisition unit 102 of the control unit 100 determines that the machining result of the machining groove 208 of the workpiece 200 is defective, it activates the notification unit to notify the operator. Thus, in Embodiment 3, the control unit 100 is configured to be able to set a judgment criterion for determining whether the machining result is good or bad from the machining status information 51 of the workpiece 200, and the judgment criterion is configured to be able to vary depending on the degree of vibration of the operating status 301 of the machining device 1, which is vibration information linked to the machining status information.

[0098] The processing apparatus 1 according to Embodiment 3 stores the processing state vibration information 300 in the storage unit 103 by linking the processing state information 51 and the operating status 301 of the processing apparatus 1, which is vibration information, on a one-to-one basis, and determines whether the processing result is good or bad from the processing state information 51. Furthermore, the processing apparatus 1 according to Embodiment 3 determines whether the operating status 301 of the processing apparatus 1 linked to the processing state information 51 is a predetermined operating status 302, and sets the correction judgment criterion for the processing result of the unreliable processing state information 51, which is determined to be the predetermined operating status 302, to be wider than the standard judgment criterion 105 for the processing result of the highly reliable processing state information 51, which is determined not to be the predetermined operating status 302. As a result, it is possible to prevent the notification unit from operating by mistakenly determining the processing result as defective when a good processing groove 208 is actually formed.

[0099] [Variation] A processing apparatus according to a modified example of Embodiment 3 of the present invention will be described with reference to the drawings. Figure 11 is a diagram showing an example of the configuration of a processing apparatus according to a modified example of Embodiment 3. In Figure 11, the same reference numerals are used for parts that are the same as those in the modified example of Embodiment 1 and Embodiment 3, and their descriptions are omitted.

[0100] As shown in Figure 11, the modified processing apparatus 1 of Embodiment 3 is equipped with a vibration measuring unit 60, similar to the modified embodiment of Embodiment 1. Also, similar to Embodiment 3, the storage unit 103 of the control unit 100 stores the standard judgment criteria 105.

[0101] In a modified example of Embodiment 3, when acquiring processing state vibration information 300, the processing apparatus 1, with the information acquisition unit 102 of the control unit 100, acquires processing state information 51 of the workpiece 200 using the processing state measurement unit 50, similar to the modified example of Embodiment 1. It also acquires vibration data 61, which is vibration information relating to the vibration of the processing apparatus 1 that occurs while acquiring the processing state information 51. The acquired processing state information 51 and the maximum vibration value 62 of the vibration data 61 are linked one-to-one and stored in the storage unit 103 as processing state vibration information 300-1.

[0102] Furthermore, in a modified version of Embodiment 3, the processing apparatus 1 uses the information acquisition unit 102 of the control unit 100 to acquire the standard judgment criterion 105 from the storage unit 103 and determines whether the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, is greater than or equal to an allowable value. In Embodiment 3, when the processing apparatus 1 uses the information acquisition unit 102 of the control unit 100 to acquire the standard judgment criterion 105 from the storage unit 103 and determines that the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, is greater than or equal to an allowable value, it reduces the lower limit of the standard judgment criterion 105 by a predetermined value to generate a new corrected lower limit, and increases the upper limit of the standard judgment criterion 105 by a predetermined value to generate a new corrected upper limit, thereby setting the standard judgment criterion 105 as a corrected judgment criterion.

[0103] The correction judgment criteria are used to determine the quality of the machining result based on the machining state information 51 of the workpiece 200. A machining result in which the depth of the machining groove 208 is greater than or equal to the correction lower limit and less than or equal to the correction upper limit is judged as good, while a machining result in which the depth of the machining groove 208 is less than the correction lower limit and greater than the correction upper limit is judged as poor.

[0104] In a modified version of Embodiment 3, when the information acquisition unit 102 of the control unit 100 determines that the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, is greater than or equal to an allowable value, it determines whether or not the processing state information 51 acquired by the processing state measurement unit 50 is within the correction judgment criteria. In a modified version of Embodiment 3, when the information acquisition unit 102 of the control unit 100 determines that it is within the correction judgment criteria, it determines that the processing result of the processing groove 208 of the workpiece 200 is good, and when it determines that it is not within the correction judgment criteria, it determines that the processing result of the processing groove 208 of the workpiece 200 is poor.

[0105] In a modified version of Embodiment 3, the processing apparatus 1 determines whether the processing state information 51 acquired by the processing state measurement unit 50 is within the standard judgment criteria 105 if the information acquisition unit 102 of the control unit 100 determines that the maximum vibration value 62 of the vibration data 61, which is vibration information acquired by the vibration measurement unit 60, is not above an allowable value. In a modified version of Embodiment 3, if the information acquisition unit 102 of the control unit 100 determines that it is within the standard judgment criteria 105, it determines that the processing result of the processing groove 208 of the workpiece 200 is good, and if it determines that it is not within the standard judgment criteria 105, it determines that the processing result of the processing groove 208 of the workpiece 200 is poor.

[0106] In a modified version of Embodiment 3, when the information acquisition unit 102 of the control unit 100 determines that the machining result of the machining groove 208 of the workpiece 200 is defective, it activates the notification unit to notify the operator. Thus, in this modified version of Embodiment 3, the control unit 100 is configured to set a judgment criterion for determining whether the machining result is good or bad from the machining state information of the workpiece 200, similar to Embodiment 3, and the judgment criterion is configured to be variable depending on the degree of vibration of the operating status of the machining device 1, which is vibration information linked to the machining state information.

[0107] The modified processing apparatus 1 of Embodiment 3 links the processing state information 51 and the maximum vibration value 62 of the vibration data 61, which is vibration information, on a one-to-one basis and stores it in the storage unit 103 as processing state vibration information 300-1, and determines whether the processing result of the processing state information 51 is good or bad. Furthermore, the modified processing apparatus 1 of Embodiment 3 determines whether the maximum vibration value 62 of the vibration data 61 linked to the processing state information 51 is above an allowable value, and sets the correction judgment criterion for the processing result of the unreliable processing state information 51, which is determined to be above an allowable value, to be wider than the standard judgment criterion 105 for the processing result of the highly reliable processing state information 51, which is determined to be below an allowable value. This prevents the notification unit from being activated by mistakenly determining the processing result as defective when a good processing groove 208 is actually formed. As a result, the modified processing apparatus 1 of Embodiment 3 has the effect of being able to acquire highly reliable processing state information 51 while suppressing a decrease in productivity.

[0108] In Embodiment 3 and its modified form, the processing apparatus 1 determines that the processing result of the processing groove 208 of the workpiece 200 is good if the information acquisition unit 102 of the control unit 100 determines that the depth of the processing groove 208 in the processing state information 51 is within the correction judgment criteria or within the standard judgment criteria 105. In addition, in Embodiment 3 and its modified form, the processing apparatus 1 determines that the processing result of the processing groove 208 of the workpiece 200 is poor if the information acquisition unit 102 of the control unit 100 determines that the depth of the processing groove 208 in the processing state information 51 is not within the correction judgment criteria or within the standard judgment criteria 105. However, in the present invention, the processing apparatus 1 may determine whether the processing result is good or bad by having the information acquisition unit 102 of the control unit 100 determine whether the minimum width on the surface 202 of the processing groove 208, the maximum width on the surface 202 of the processing groove 208, the width of the bottom surface of the processing groove 208, the width at a predetermined distance from the surface 202 of the processing groove 208 towards the bottom surface, etc., are within the correction judgment criteria or within the standard judgment criteria 105, not limited to the depth of the processing groove 208.

[0109] Furthermore, in Embodiment 3 and its modified form, the processing apparatus 1 generates the correction judgment criteria using the information acquisition unit 102 of the control unit 100, but in the present invention, the operator may arbitrarily set the correction judgment criteria.

[0110] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core of the present invention. In the present invention, the processing apparatus 1 may irradiate the substrate 201 of the workpiece 200 with a pulsed laser beam 21 of a transparent wavelength to form a modified layer (corresponding to a processing mark) along the planned division line 203. The modified layer refers to a region in which the density, refractive index, mechanical strength, and other physical properties are in a state different from those of the surrounding area, and examples include a melted treatment region, a crack region, a dielectric breakdown region, a refractive index change region, and a region in which these regions are mixed. In this case, the processing state measurement unit 50 may be configured with, for example, an infrared camera to acquire the two-dimensional shape (also called a planar shape) of the modified layer as processing state information 51, or the two-dimensional shape (also called a planar shape) of cracks extending from the modified layer to the surface 202 may be acquired as processing state information 51. Furthermore, the present invention may acquire vibration data 61 with a vibration measurement unit 60, as well as the operating status.

[0111] Furthermore, in the aforementioned Embodiment 1, the processing device 1 acquired processing state vibration information 300 after performing a kerf check and stored it in the storage unit 103. However, in the present invention, the timing of acquiring the processing state vibration information 300 is not limited to this. For example, in the present invention, the processing device 1 may, after performing laser processing on all planned division lines 203 of each workpiece 200, acquire processing state information 51 at predetermined positions of the workpiece 200 using the processing state measurement unit 50, acquire processing state vibration information 300, and store it in the storage unit 103. Alternatively, after the laser processing of one rod of workpiece 200 is completed, the processing state measurement unit 50 may acquire processing state information 51 at predetermined positions of the workpiece 200, acquire processing state vibration information 300, and store it in the storage unit 103. Furthermore, in this invention, when the processing state measuring unit 50 acquires processing state information 51 at a predetermined position on the workpiece 200, a protective film may or may not be formed on the surface 202 of the workpiece 200. In addition, in this invention, the predetermined position on the workpiece 200 from which the processing state information 51 is acquired may be one of several positions, such as a position where metal such as a TEG (Test Elementary Group) is present or absent on the planned division line 203. [Explanation of symbols]

[0112] 1 Processing equipment 10 Holding Units 20. Laser beam irradiation unit (processing unit) 30 Mobile Units 50. Machining state measurement unit 51 Processing status information 60 Vibration Measurement Unit 61. Vibration Data (Vibration Information) 62. Maximum vibration value (vibration value) 100 control units 104,104-1 Correlation 105 Standard Judgment Criteria (Judgment Criteria) 200 Workpiece 301 Operating Status (Vibration Information) 302 Specific operating status

Claims

1. A holding unit for holding the workpiece, A processing unit for processing a workpiece held in the holding unit, A moving unit that moves the holding unit and the processing unit relative to each other, A processing apparatus comprising a control unit for controlling each component, It is further equipped with a processing state measuring unit that measures the processing state of the workpiece, The control unit is, The processing state measurement unit acquires processing state information of the workpiece, and also acquires vibration information related to vibrations occurring while acquiring the processing state information, and stores the acquired processing state information and vibration information in association. The vibration information represents the operating status of the processing equipment. The processing apparatus is characterized in that, when the control unit determines that the acquired vibration information is in a predetermined operating state, it reacquires processing state information.

2. A holding unit for holding the workpiece, A processing unit for processing a workpiece held in the holding unit, A moving unit that moves the holding unit and the processing unit relative to each other, A processing apparatus comprising a control unit for controlling each component, It is further equipped with a processing state measuring unit that measures the processing state of the workpiece, The control unit is, The processing state measurement unit acquires processing state information of the workpiece, and also acquires vibration information related to vibrations occurring while acquiring the processing state information, and stores the acquired processing state information and vibration information in association. The vibration information is vibration data acquired by a vibration measurement unit. The processing apparatus is characterized in that, if the control unit determines from the acquired vibration information that the vibration value is above an acceptable value, it reacquires processing status information.

3. A holding unit for holding the workpiece, A processing unit for processing a workpiece held in the holding unit, A moving unit that moves the holding unit and the processing unit relative to each other, A processing apparatus comprising a control unit for controlling each component, It is further equipped with a processing state measuring unit that measures the processing state of the workpiece, The control unit is, The processing state measurement unit acquires processing state information of the workpiece, and also acquires vibration information related to vibrations occurring while acquiring the processing state information, and stores the acquired processing state information and vibration information in association. The control unit is, The correlation between machining state information acquired in a vibration-free state and machining state information acquired in a vibration-present state is stored in advance. A processing apparatus characterized by correcting newly acquired processing state information to processing state information acquired under vibration-free conditions, based on the correlation.

4. A holding unit for holding the workpiece, A processing unit for processing a workpiece held in the holding unit, A moving unit that moves the holding unit and the processing unit relative to each other, A processing apparatus comprising a control unit for controlling each component, It is further equipped with a processing state measuring unit that measures the processing state of the workpiece, The control unit is, The processing state measurement unit acquires processing state information of the workpiece, and also acquires vibration information related to vibrations occurring while acquiring the processing state information, and stores the acquired processing state information and vibration information in association. The control unit is, It is configured to allow setting of criteria for determining the quality of the processing result based on processing state information of the workpiece. The criteria for this determination are: A processing apparatus characterized by being configured to be variable according to the degree of vibration in vibration information linked to the processing state information.

5. When the control unit determines that the operating status of the processing apparatus is a predetermined operating status, The processing apparatus according to claim 4, which determines the quality of the processing result based on a modified judgment criterion that is broader than the standard judgment criterion when it is determined that the operating conditions are not predetermined.

6. The processing state measurement unit is, The processing apparatus according to any one of claims 1 to 5, characterized in that it is a three-dimensional measuring unit that measures a workpiece in three dimensions in mutually orthogonal X-axis, Y-axis, and Z-axis directions.

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