Tool cutting device and tool cutting method

Abstract

To suppress electrification of a workpiece.SOLUTION: A cutting-tool cutting device 1 comprises: a holding table 10 which holds a workpiece 200 in a state where a surface 211 of a surface protection tape 210 of the workpiece 200 is exposed; a cutting-tool cutting unit 20 which has a cutting-tool 21 that cuts the surface 211 of the surface protection tape 210 of the workpiece 200 held by the holding table 10; and an ion jetting unit 70 which jets ionized air 71 to the surface 211 of the surface protection tape 210 of the workpiece 200 held by the holding table 10.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a bite cutting apparatus and a bite cutting method.

Background Art

[0002] In a semiconductor device manufacturing process, a method has been proposed in which after a surface protection tape is adhered to a surface of a semiconductor device wafer, the upper surface of the surface protection tape is cut with a bite to planarize the upper surface (see, for example, Patent Document 1).

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] However, as disclosed in Patent Document 1 and the like, when cutting a workpiece such as a surface protection tape with a bite, static electricity is generated, and the upper surface of the workpiece is charged. If cutting chips adhere to the upper surface of the workpiece due to charging, the workpiece is held with the cutting chips sandwiched between the workpiece and the chuck table of a grinding apparatus during subsequent back grinding, which may cause problems such as damage to the workpiece or local thin grinding of the workpiece in a region corresponding to the cutting chips. Therefore, improvement is strongly desired.

[0005] An object of the present invention is to provide a bite cutting apparatus and a bite cutting method that can suppress charging of a workpiece.

Means for Solving the Problem

[0006] To solve the above-mentioned problems and achieve the objective, the cutting device of the present invention comprises a holding table that holds a workpiece with the cutting surface of the workpiece exposed, a cutting unit having a cutting tool for cutting the cutting surface of the workpiece held by the holding table, and an ion injection unit that injects ionized air into the cutting surface of the workpiece held by the holding table. The ion injection unit comprises a cutting fluid supply nozzle for supplying cutting fluid to the cutting tool, a processing chamber that houses the cutting tool unit and the cutting fluid supply nozzle, and also houses the holding table at the processing position where the cutting tool unit processes the workpiece, and a moving unit that moves the holding table between a retracted position outside the processing chamber and the processing position, wherein the processing chamber has an entrance / exit that allows the holding table to enter and exit, and the ion injection unit injects ionized air from the entrance / exit towards the cutting tool unit within the processing chamber. It is characterized by the following:

[0009] This invention Cutting tool It comprises a holding table that holds the workpiece with the cutting surface exposed, a cutting unit having a cutting tool for cutting the cutting surface of the workpiece held by the holding table, and an ion injection unit that sprays ionized air onto the cutting surface of the workpiece held by the holding table. The cutting tool unit processes a workpiece held in the holding table in a dry manner, the ion jet unit jets ionized air onto the cutting tool while it is cutting the workpiece and also jets ionized air onto the cutting surface of the workpiece, and is equipped with a dust collection unit connected to a suction source and having a suction port formed facing the ion jet unit across the holding table.

[0010] The cutting method of the present invention comprises a holding step of holding the workpiece on a holding table to expose the cutting surface of the workpiece, and after performing the holding step, The holding table is housed in the processing room through the entrance / exit, The system comprises a cutting step of cutting the workpiece surface with a cutting tool, and during the cutting step, ionized air is sprayed onto the workpiece surface. The cutting fluid is supplied to the cutting tool, and ionized air is sprayed from the entrance / exit of the cutting chamber toward the cutting tool unit. It is characterized by the following:

[0012] This invention Tool cutting method The system comprises a holding step of holding the workpiece on a holding table to expose the cutting surface of the workpiece, and a cutting step of cutting the cutting surface with a cutting tool after performing the holding step, and processing the workpiece dry. During the cutting step of the tool Ionized air is sprayed onto the cutting surface of the workpiece. Ionized air is injected into the bit, , through the suction port of a dust collection unit, which is connected to a suction source and has a suction port formed facing an ion injection unit that sprays the ionized air across the holding table. It is characterized by the following:

[0013] In the above-mentioned cutting method, at least the cutting surface of the workpiece may be an insulator. [Effects of the Invention]

[0014] This invention has the effect of suppressing static charge on the workpiece. [Brief explanation of the drawing]

[0015] [Figure 1] FIG. 1 is a perspective view illustrating a configuration example of a bite cutting device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing a workpiece to be machined by the bite cutting device illustrated in FIG. 1. [Figure 3] FIG. 3 is a flowchart showing a flow of a bite cutting method according to the first embodiment. [Figure 4] FIG. 4 is a side view schematically illustrating, with a partial cross-section, the bite cutting step shown in FIG. 3. [Figure 5] FIG. 5 is a plan view schematically illustrating, with a partial cross-section, the bite cutting step shown in FIG. 3. [Figure 6] FIG. 6 is a perspective view illustrating a configuration example of a bite cutting device according to the second embodiment. [Figure 7] FIG. 7 is a side view schematically illustrating, with a partial cross-section, the bite cutting step of a bite cutting method according to the second embodiment. [Figure 8] FIG. 8 is a perspective view illustrating a configuration example of a bite cutting device according to the third embodiment. [Figure 9] FIG. 9 is a side view schematically illustrating, with a partial cross-section, the bite cutting step of a bite cutting method according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0016] Modes (embodiments) for carrying out the present invention will be described in detail below with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The components described below include those that can be easily conceived by a person skilled in the art and those that are substantially identical. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications to the configuration can be made without departing from the scope of the present invention.

[0017] [First Embodiment] A bite cutting apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of the bite cutting apparatus according to Embodiment 1. Fig. 2 is a perspective view showing a workpiece to be processed by the bite cutting apparatus shown in Fig. 1.

[0018] The bite cutting apparatus according to Embodiment 1 shown in Fig. 1 is an apparatus that performs bite cutting on a workpiece 200 shown in Fig. 2. As shown in Fig. 2, the workpiece 200 to be processed in the bite cutting method according to Embodiment 1 includes a wafer 201 and a surface protection tape 210. The wafer 201 is a disc-shaped semiconductor wafer using silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC) or the like as a substrate 202, an optical device wafer, or another type of wafer.

[0019] As shown in Fig. 1, in the workpiece 200, devices 205 are each formed in regions partitioned by a plurality of planned dividing lines 204 on a surface 203. The device 205 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), or various types of memories (semiconductor memory devices). Further, in Embodiment 1, the device 205 includes conductive spherical bumps (not shown) connected to electrodes or the like.

[0020] The surface protection tape 210 includes an adhesive layer formed of a resin having insulating properties, flexibility and adhesiveness, and a base material layer laminated on the adhesive layer and formed of a resin having insulating properties, flexibility and non-adhesiveness. The adhesive layer of the surface protection tape 210 is attached to the surface 203 of the wafer 201 and covers the surface 203 of the wafer 201. Note that a surface 211 of the base material layer of the surface protection tape 210 is a surface to be cut that undergoes bite cutting (hereinafter referred to as rotary cutting). For this reason, in Embodiment 1, the surface 211 that is the surface to be cut is an insulator.

[0021] The cutting device 1 shown in Figure 1 according to Embodiment 1 is a processing device that flattens the upper layer of a surface protection tape 210 attached to the surface 203 of a workpiece 200 by rotational cutting, thereby forming a flat surface 211 of the surface protection tape 210 of the workpiece 200. As shown in Figure 1, the cutting device 1 comprises a device base 2, a holding table 10, a cutting unit 20, a processing feed unit 30, a depth of cut feed unit 40, and a control unit 100.

[0022] The holding table 10 holds the workpiece 200 with its back surface 206 on the holding surface 11, thereby holding the workpiece 200 with the surface 211 of the protective tape 210 on the workpiece 200 exposed. The holding table 10 is made of a metal material such as stainless steel and comprises a disc-shaped base 12 and an annular outer ring holding portion 13 formed on the outer circumference of the base 12, with a suction recess 14 formed inside the outer ring holding portion 13. The holding table 10 also includes a plurality of cylindrical support pins (not shown) provided within the suction recess 14.

[0023] Multiple support pins provided in the suction recess 14 are arranged at equal intervals. The outer annular holding portion 13 and the multiple support pins of the holding table 10 configured in this way are made of stainless steel as the base material, and a nickel plating layer is formed on the upper surface of the outer annular holding portion 13 and the upper surface of the support pins. The upper surface of the outer annular holding portion 73 and the upper surface of the support pins constitute a holding surface 11 parallel to the horizontal direction for holding the workpiece 200.

[0024] A suction recess 14 formed in the holding table 10 is connected to a suction source (not shown), and the workpiece 200 placed on the holding surface 11 is held in place by suction from the suction source. The holding table 10 is supported by a support base (not shown) that is rotatable around an axis parallel to the Z-axis direction. The Z-axis direction is parallel to the vertical direction and perpendicular to the holding surface 11. In Embodiment 1, the holding table 10 is a so-called pin chuck table in which the holding surface 11 is formed by the upper surfaces of support pins.

[0025] The cutting unit 20 uses a cutting wheel 22, which includes a cutting tool 21 mounted on the lower end of the spindle 83, to perform a rotary cutting of the surface 211 of the base layer of the surface protection tape 210 of the workpiece 200 held on the holding table 10. The cutting unit 20 is supported by a vertical wall 3 erected on the device base 2 via a depth-of-cut feed unit 40. The cutting unit 20 includes a spindle 23, a motor 24 that rotates the spindle 23 around its axis, and a cutting wheel 22 mounted on the lower end of the spindle 23.

[0026] The axis of the spindle 23 is positioned along the Z-axis direction. The cutting wheel 22 has a wheel base 25 which is formed in the shape of a disc and mounted on the lower end of the spindle 23, and a cutting tool 21 which is convex from the lower surface of the wheel base 25 and rotates to cut the surface 211 of the surface protection tape 210 of the workpiece 200.

[0027] The machining feed unit 30 is installed on the device base 2 and moves the holding table 10 relative to the cutting unit 20 in the X-axis direction, which is the machining feed direction parallel to the holding surface 11. The machining feed unit 30 moves the holding table 10 between a retracted position 110, where the workpiece 200 is loaded and unloaded onto the holding table 10, and a machining position 111, where the workpiece 200 is rotated and cut by the cutting unit 20, by moving the support base that supports the holding table 10 in the X-axis direction. The machining feed unit 30 is a moving unit that moves the holding table 10 between the retracted position 110 and the machining position 111.

[0028] The cutting feed unit 40 is attached to a vertical wall 3 erected on the device base 2 and moves the cutting tool unit 20 in the Z-axis direction, which is the cutting feed direction perpendicular to the holding surface 11. The cutting feed unit 40 lowers the cutting tool unit 20 to bring the cutting tool 21 closer to the workpiece 200 held on the holding table 10 at the machining position 111, and raises the cutting tool unit 20 to move the cutting tool 21 away from the workpiece 200 held on the holding table 10 at the machining position 111.

[0029] The machining feed unit 30 and the depth-of-cut feed unit 40 are equipped with a well-known ball screw rotatably mounted around its axis, a well-known pulse motor for rotating the ball screw around its axis, and a well-known guide rail for supporting the holding table 10 or the cutting unit 20 so as to be movable in the Y-axis or Z-axis direction.

[0030] Furthermore, the cutting machine 1 has cassettes 4 and 5 installed on the machine base 2. The cutting machine 1 includes a positioning unit 7, a transport unit 50 which is a transport means for transporting the workpiece 200 from the cassettes 4 and 5 to the holding table 10, a cleaning unit 6 which cleans the workpiece 200 after rotary cutting, and the positioning unit 7.

[0031] Cassettes 4 and 5 are containers for holding multiple workpieces 200 and are installed at the end of the device base 2 on the retracted position 110 side. Cassettes 4 and 5 hold workpieces 200 before and after rotary cutting. In Embodiment 1, cassettes 4 and 5 hold multiple workpieces 200 with the wafer 201 positioned downwards and the surface protection tape 210 positioned upwards. The alignment unit 7 is a table on which the workpieces 200 before and after rotary cutting, which have been removed from cassettes 4 and 5, are temporarily placed and their center alignment is performed.

[0032] The transport unit 50 comprises an loading / unloading unit 51, a loading unit 52, and an unloading unit 53. The loading / unloading unit 51 is, for example, a robot pick equipped with a U-shaped hand, which uses the U-shaped hand to suction, hold, and transport the workpiece 200. Specifically, the loading / unloading unit 51 unloads the workpiece 200 from cassettes 4 and 5 to the alignment unit 7 before rotary cutting, and unloads the workpiece 200 from the cleaning unit 6 to cassettes 4 and 5 after rotary cutting.

[0033] The loading unit 52 loads the workpiece 200, which has been positioned by the unloading and positioning unit 7 from cassettes 4 and 5 and is not yet subjected to rotary cutting, onto the holding table 10 located at the retracted position 110. The unloading unit 53 unloads the workpiece 200, which has been subjected to rotary cutting and is held on the holding table 10 at the retracted position 110, from the holding table 10 and loads it into the washing unit 6.

[0034] The control unit 100 controls each of the above-mentioned components that constitute the cutting machine 1. In other words, the control unit 100 causes the cutting machine 1 to perform machining operations on the workpiece 200. The control unit 100 is a computer that has a processing unit with a microprocessor such as a CPU (central processing unit), a storage device with memory such as ROM (read-only memory) or RAM (random access memory), and an input / output interface device, and is capable of executing computer programs.

[0035] The arithmetic processing unit of the control unit 100 executes a computer program stored in ROM on RAM to generate control signals for controlling the cutting machine 1. The arithmetic processing unit of the control unit 100 outputs the generated control signals to each component of the cutting machine 1 via an input / output interface device. The control unit 100 is also connected to a display means (not shown) consisting of a liquid crystal display device that displays the status of machining operations and images, and an input means used by the operator to register machining conditions. The input means consists of at least one of a touch panel provided on the display means and a keyboard or the like.

[0036] As shown in Figure 1, the cutting machine 1 comprises a machining chamber 60, an ion injection unit 70, a machining fluid supply nozzle 80, and a dust collection unit 90. The machining chamber 60 houses the cutting machine 20, the ion injection unit 70, the machining fluid supply nozzle 80, and the dust collection unit 90, as well as the holding table 10 at the machining position 111 where the cutting machine 20 rotates to cut the workpiece 200.

[0037] In Embodiment 1, the machining chamber 60 is composed of multiple partition walls 61 (only a portion is shown in Figure 1) surrounding the holding table 10 at the machining position 111, the cutting unit 20, the ion injection unit 70, the machining fluid supply nozzle 80, and the dust collection unit 90. The machining chamber 60 does not house the holding table 10 at the retracted position 110. That is, the holding table 10 at the retracted position 110 is located outside the machining chamber 60.

[0038] Furthermore, the partition wall 61 that constitutes the processing chamber 60 has an entrance / exit 62 that allows the holding table 10 to enter and exit the processing chamber 60. The holding table 10 is moved along the X-axis direction by the processing feed unit 30 through the entrance / exit 62, between the retracted position 110 and the processing position 111.

[0039] The ion injection unit 70 injects ionized air 71 onto the cutting tool 21 while the workpiece 200 is rotating and cutting, and also injects ionized air 71 onto the surface 211 of the surface protection tape 210 of the workpiece 200 held by the holding table 10, thereby neutralizing the charge on the surface 211 of the workpiece 200 and removing static electricity from the surface 211 of the workpiece 200.

[0040] In Embodiment 1, the ion injection unit 70 is supported on the inner surface of the processing chamber 60 inside the partition wall 61 and is positioned above the entrance / exit 62. The ion injection unit 70 is positioned above the entrance / exit 62 along its entire length in the Y-axis direction, which is parallel to the horizontal direction of the entrance / exit 62 and perpendicular to the X-axis direction.

[0041] In Embodiment 1, the ion injection unit 70 extends linearly along the Y-axis direction and has injection nozzles 72 spaced apart along the Y-axis direction for injecting ionized air 71 supplied from an air supply unit (not shown). The injection nozzles 72 inject ionized air 71 toward the cutting tool 21 of the cutting tool unit 20 during rotary cutting and toward the surface 211 of the workpiece 200 held by the holding table 10. Thus, in Embodiment 1, the ion injection unit 70 injects ionized air 71 toward the cutting tool unit 20 from an inlet / outlet 62 within the machining chamber 60.

[0042] The machining fluid supply nozzle 80 supplies machining fluid 81 to the cutting tool 21 during rotary cutting. In Embodiment 1, the machining fluid supply nozzle 80 is located next to the Y-axis direction of the holding table 10 at the machining position 111. The machining fluid supply nozzle 80 extends linearly along the X-axis direction and has machining fluid nozzles 82 spaced apart along the X-axis direction that spray machining fluid 81 supplied from a machining fluid supply source (not shown). The machining fluid nozzles 82 supply machining fluid 81 to the cutting tool 21 of the cutting tool unit 20 during rotary cutting.

[0043] The dust collection unit 90 is connected to the suction source 92 via an on / off valve 91, and has a suction port 93 facing the processing fluid supply nozzle 80, with the holding table 10 sandwiched between the processing fluid supply nozzle 80 in the Y-axis direction. In Embodiment 1, the dust collection unit 90 is positioned next to the holding table 10 at the processing position 111 in the Y-axis direction, and is positioned to sandwich the holding table 10 between it and the processing fluid supply nozzle 80 along the Y-axis direction. The dust collection unit 90 extends linearly along the X-axis direction and has a suction port 93 facing the processing fluid supply nozzle 80 in the Y-axis direction. The dust collection unit 90 is sucked by the suction source 92, and sucks up cutting chips and processing fluid 81 generated during rotary cutting through the suction port 93.

[0044] Next, the cutting method according to Embodiment 1 will be described based on the drawings. Figure 3 is a flowchart showing the flow of the cutting method according to Embodiment 1. Figure 4 is a schematic side view showing the cutting step shown in Figure 3 in a partial cross-section. Figure 5 is a schematic plan view showing the cutting step shown in Figure 3 in a partial cross-section.

[0045] The cutting method according to Embodiment 1 is also a machining operation in which the cutting device 1 with the above-described configuration performs a swiveling cut on the surface 211 of the surface protection tape 210 of the workpiece 200. As shown in Figure 3, the cutting method according to Embodiment 1 comprises a holding step 1001 and a cutting step 1002.

[0046] In the cutting device 1 with the configuration described above, cassettes 4 and 5 containing the workpiece 200 before rotary cutting are installed on the device base 2 by an operator or the like, and the control unit 100 receives the machining conditions input by the operator or the like. When the control unit 100 receives the instruction to start the machining operation input by the operator, the cutting device 1 starts the machining operation, drives the motor 84 to rotate the spindle 83 and the cutting wheel 22 around their axes, injects ionized air 71 from the ion injection unit 70, supplies machining fluid 81 from the machining fluid supply nozzle 80, and starts suction through the suction port 93 of the dust collection unit 90, and performs the holding step 1001.

[0047] (Holding step) The holding step 1001 is the step of holding the workpiece 200 with the holding table 10 to expose the surface 211 of the surface protection tape 210 of the workpiece 200. In Embodiment 1, in the holding step 1001, the cutting machine 1 has a control unit 100 that controls the loading / unloading unit 51 to take out one workpiece 200 from the cassettes 4 and 5 and load it onto the alignment unit 7.

[0048] In the holding step 1001, the cutting tool 1 has a control unit 100 that controls the alignment unit 7 to center-align the workpiece 200, and a transport unit 52 that controls the workpiece 200 aligned by the alignment unit 7 to be transported onto the holding table 10 located at the retracted position 110. In the holding step 1001, the cutting tool 1 has a control unit 100 that operates a suction source to hold the back side 206 of the workpiece 200 against the holding surface 11 of the holding table 10 by suction, exposing the surface 211 of the surface protection tape 210 that is in close contact with the surface 203 upwards, and proceeds to the cutting step 1002.

[0049] (Tool cutting step) The cutting step 1002 is a step in which, after performing the holding step 1001, the surface 211 of the surface protection tape 210 of the workpiece 200 is rotated and cut with the cutting tool 21. In Embodiment 1, in the cutting step 1002, the cutting device 1 has a control unit 100 that controls the depth of cut feed unit 40 to position the tip of the cutting tool 21 at a predetermined height from the holding surface 11, and as shown in Figures 4 and 5, it controls the machining feed unit 30 to transport the holding table 10, which holds the workpiece 200 by suction, to the machining position 111. Figure 5 shows the rotational trajectory of the cutting tool 21 with a dashed line.

[0050] In the cutting step 1002, the cutting device 1 inserts the cutting tool 21 into the upper layer of the surface protection tape 210 of the workpiece 200 held on the holding table 10 at the machining position 111, and performs a swirling cut on the surface 211 of the surface protection tape 210. In the cutting step 1002, the cutting device 1 forms the surface 211 of the surface protection tape 210 of the workpiece 200 flat.

[0051] In the cutting step 1002, the cutting device 1 controls the machining feed unit 30 via the control unit 100 to transport the holding table 10, which is holding the workpiece 200 that has undergone rotary cutting, to the retracted position 110, and then stops the suction holding of the holding table 10 at the retracted position 110. In the cutting step 1002, the cutting device 1 controls the discharge unit 53 via the control unit 100 to transport the workpiece to the washing unit 6, and after washing in the washing unit 6, controls the loading / unloading unit 51 to place the workpiece 200 into cassettes 4 and 5. The cutting device 1 then sequentially performs the holding step 1001 and the cutting step 1002 on the workpieces 200 in cassettes 4 and 5, and ends the machining operation when the holding step 1001 and the cutting step 1002 have been performed on all the workpieces 200 in cassettes 4 and 5.

[0052] In Embodiment 1, when the machining operation is started, the cutting device 1 starts injecting ionized air 71 from the ion injection unit 70, supplying machining fluid 81 from the machining fluid supply nozzle 80, and sucking through the suction port 93 of the dust collection unit 90. During the machining operation, the injection of ionized air 71 from the ion injection unit 70, the supply of machining fluid 81 from the machining fluid supply nozzle 80, and the sucking through the suction port 93 of the dust collection unit 90 are continued. For this reason, in Embodiment 1, as shown in Figures 4 and 5, the cutting device 1 injects ionized air 71 onto the surface of the surface protection tape 210 of the workpiece 200 during the cutting step 1002, and supplies machining fluid 81 to the cutting tool 21 during the cutting step 1002.

[0053] As described above, the cutting device 1 and cutting method according to Embodiment 1 sprays ionized air 71 from the nozzle 72 of the ion injection unit 70 onto the surface 211 of the surface protection tape 210 of the workpiece 200 during the cutting step 1002, thereby reducing the risk of the workpiece 200 becoming charged during rotary cutting. As a result, the cutting device 1 and cutting method according to Embodiment 1 can suppress the charging of the workpiece 200 and have the effect of suppressing the adhesion of foreign matter such as cutting chips to the surface 211 of the workpiece 200.

[0054] Furthermore, the cutting device 1 and cutting method according to Embodiment 1 can suppress cutting chips from leaving the machining chamber 60 by injecting ionized air 71 from the entrance / exit 62 side of the machining chamber 60 toward the back of the machining chamber 60.

[0055] [Embodiment 2] The cutting apparatus and cutting method according to Embodiment 2 will be described based on the drawings. Figure 6 is a perspective view showing an example of the configuration of the cutting apparatus according to Embodiment 2. Figure 7 is a schematic side view showing a cutting step of the cutting method according to Embodiment 2 in a partial cross-section. Figures 6 and 7 will be described in detail using the same reference numerals as those used in Embodiment 1 for the same parts.

[0056] In Embodiment 2, the cutting machine 1-2 has the ion injection unit 70 positioned above the processing fluid supply nozzle 80, as shown in Figure 6.

[0057] In Embodiment 2, the ion injection unit 70 is positioned above the processing fluid supply nozzle 80, extending along its entire length in the X-axis direction. In Embodiment 2, as shown in Figure 7, the ion injection unit 70 extends linearly along the X-axis direction and has injection nozzles 72 that inject ionized air 71 supplied from an air supply unit (not shown) spaced apart along the X-axis direction.

[0058] In the second embodiment, the dust collection unit 90 is connected to the suction source 92, and a suction port 93 is formed facing the ion jet unit 70, with the holding table 10 in the Y-axis direction between the ion jet unit 70 and the ion jet unit 70.

[0059] In Embodiment 2 as well, when the cutting device 1-2 starts machining, it starts injecting ionized air 71 from the ion injection unit 70, supplying machining fluid 81 from the machining fluid supply nozzle 80, and suction through the suction port 93 of the dust collection unit 90. During the machining operation, it continues to inject ionized air 71 from the ion injection unit 70, supply machining fluid 81 from the machining fluid supply nozzle 80, and suction through the suction port 93 of the dust collection unit 90. In other words, in Embodiment 2 as well, the cutting method injects ionized air 71 onto the surface 211 of the surface protection tape 210 of the workpiece 200 during the cutting step 1002, and supplies machining fluid 81 to the cutting tool 21 during the cutting step 1002.

[0060] The cutting device 1-2 and cutting method according to Embodiment 2 spray ionized air 71 from the nozzle 72 of the ion injection unit 70 onto the surface 211 of the surface protection tape 210 of the workpiece 200 during the cutting step 1002. This reduces the risk of the workpiece 200 becoming charged during rotary cutting, and, similar to Embodiment 1, suppresses the charging of the workpiece 200, thereby preventing foreign matter such as cutting chips from adhering to the surface 211 of the workpiece 200.

[0061] Furthermore, the cutting device 1-2 and cutting method according to Embodiment 2 spray ionized air 71 toward the suction port 93 in the same direction as the processing fluid 81, so as not to obstruct the supply of processing fluid 81 to the workpiece 200, and as the ionized air 71 sprays cutting chips, cutting chips can be sucked through the suction port 93 without scattering them.

[0062] [Embodiment 3] A cutting apparatus and cutting method according to Embodiment 3 will be described based on the drawings. Figure 8 is a perspective view showing an example of the configuration of the cutting apparatus according to Embodiment 3. Figure 9 is a schematic side view showing a cutting step of the cutting method according to Embodiment 3 in a partial cross-section. Figures 8 and 9 will be described in detail using the same reference numerals as Embodiment 1 for the same parts.

[0063] In Embodiment 3, as shown in Figure 8, the cutting machine 1-3 has the ion injection unit 70 positioned next to the Y-axis direction of the holding table 10 at the machining position 111, and does not have a machining fluid supply nozzle 80.

[0064] In Embodiment 3, as shown in Figure 9, the ion injection unit 70 extends linearly along the X-axis direction and has injection ports 72 spaced apart along the X-axis direction for injecting ionized air 71 supplied from an air supply unit (not shown). In Embodiment 3, the dust collection unit 90 is connected to a suction source 92 and has a suction port 93 facing the ion injection unit 70, with the holding table 10 in the Y-axis direction between it and the ion injection unit 70.

[0065] In Embodiment 3, when the cutting device 1 starts the machining operation, it starts spraying ionized air 71 from the ion spraying unit 70 and sucking through the suction port 93 of the dust collection unit 90, and continues spraying ionized air 71 from the ion spraying unit 70 and sucking through the suction port 93 of the dust collection unit 90 throughout the machining operation. That is, in Embodiment 3 as well, the cutting method sprays ionized air 71 onto the surface 211 of the surface protection tape 210 of the workpiece 200 while the cutting step 1002 is being performed. Furthermore, since the cutting device 1-3 according to Embodiment 3 does not have a machining fluid supply nozzle 80, the cutting device 20 performs dry rotary cutting of the workpiece 200 held by the holding table 10 without being supplied with machining fluid 81.

[0066] The cutting device 1-3 and cutting method according to Embodiment 3 spray ionized air 71 from the nozzle 72 of the ion injection unit 70 onto the surface 211 of the surface protection tape 210 of the workpiece 200 during the cutting step 1002. This reduces the risk of the workpiece 200 becoming charged during rotary cutting, and, similar to Embodiment 1, suppresses the charging of the workpiece 200, thereby preventing foreign matter such as cutting chips from adhering to the surface 211 of the workpiece 200.

[0067] Furthermore, in the cutting device 1-3 and cutting method according to Embodiment 3, ionized air 71 can be used instead of the cutting fluid 81 to cool the cutting tool 21 during machining and to discharge cutting chips from the machining point.

[0068] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core principles of the present invention. In addition, in the present invention, the cutting surface of the workpiece 200 is not limited to the surface 211 of the surface protection tape 210. [Explanation of symbols]

[0069] 1,1-2,1-3 Cutting machine 10 Retention Table 20-byte cutting unit 21 bytes 30. Machining feed unit (moving unit) 60 Processing room 62 Entrances and Exits 70 Ion injection unit 71 Ionized air 80 Processing fluid supply nozzle 81 Processing fluid 90 Dust Collection Unit 92 Suction source 93 Suction port 110 Evacuation position 111 Processing position 200 Workpiece 211 Surface (cut surface) 1001 Holding step 1002 Cutting step

Claims

1. A holding table that holds the workpiece with the cutting surface of the workpiece exposed, A cutting unit having a cutting tool for cutting the cutting surface of a workpiece held in the holding table, An ion injection unit that sprays ionized air onto the cutting surface of a workpiece held by the holding table, A cutting fluid supply nozzle that supplies cutting fluid to the cutting tool, A machining chamber that houses the cutting tool unit and the machining fluid supply nozzle, and also houses the holding table at the machining position where the cutting tool unit processes the workpiece, The system includes a moving unit that moves the holding table between a retracted position outside the processing chamber and the processing position, The processing chamber is provided with an entrance and exit that allows the holding table to enter and exit. The ion injection unit is a cutting device that injects ionized air from the entrance / exit of the processing chamber toward the cutting unit.

2. A holding table that holds the workpiece with the cutting surface of the workpiece exposed, A cutting unit having a cutting tool for cutting the cutting surface of a workpiece held in the holding table, The system comprises an ion injection unit that injects ionized air onto the cutting surface of a workpiece held by the holding table, The cutting unit processes the workpiece held in the holding table in a dry manner. The ion injection unit injects ionized air onto the cutting tool while it is cutting the workpiece, and also injects ionized air onto the cutting surface of the workpiece. A cutting machine equipped with a dust collection unit connected to a suction source, having a suction port formed thereon facing the ion jet unit across the holding table.

3. A holding step in which the workpiece is held on a holding table to expose the cutting surface of the workpiece, The process includes a cutting step in which, after performing the holding step, the holding table is brought into the processing chamber through the entrance / exit and the surface to be cut is cut with a cutting tool, A cutting method comprising: spraying ionized air onto the workpiece surface during the cutting step; supplying a cutting fluid to the cutting tool; and spraying ionized air from the entrance / exit of the cutting chamber toward the cutting tool unit.

4. A holding step in which the workpiece is held on a holding table to expose the cutting surface of the workpiece, The system includes a cutting step in which, after performing the holding step, the cutting surface is cut with a cutting tool and the workpiece is processed dry, A cutting method for a workpiece, in which ionized air is sprayed onto the workpiece during the cutting step, ionized air is sprayed onto the cutting tool, and the ionized air is sucked through the suction port of a dust collection unit, which is connected to a suction source and has a suction port facing the ion spraying unit that sprays the ionized air across the holding table.

5. The cutting method according to claim 3 or 4, wherein at least the cutting surface of the workpiece is an insulator.

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