Macroscopic texture of anodized and coated surfaces

Abstract

To provide improved coatings applied to a consumable part of a processing device.SOLUTION: A consumable part 210 for a plasma processing chamber includes a plasma facing side. An engineered surface 300 is formed into the plasma facing side of the consumable part. A plurality of raised features 440 defines the engineered surface, wherein features are arranged in a predefined pattern, wherein each of the plurality of raised features includes a top region having an outer edge and a sidewall. A base surface of the engineered surface is configured to surround each of the plurality of raised features, such that a corresponding sidewall of a corresponding raised feature extends up at an angle from the base surface to a corresponding top region. The consumable part is configured to be installed in the plasma processing chamber and to be exposed to a plasma and by-products of the plasma.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present embodiment relates to a semiconductor substrate processing apparatus tool, and more particularly to an improved coating applied to consumable parts of a processing apparatus. [Background Art]

[0002] In semiconductor processing systems such as plasma chambers, components coated inside the plasma chamber are generally characterized by an aluminum surface that has been grit-blasted to produce random fine features and improved adhesion. The surface is then anodized and coated with a plasma-resistant sprayed coating by plasma spraying. Surface finish is an important factor that determines the adhesion and durability of the sprayed coating. However, when the surface is made finely rough by grit blasting, sufficient adhesion cannot be provided to a subsequently deposited layer. For example, the main failure mode of a sprayed coating occurs due to delamination from the underlying anodized film. Delamination, which is caused by interruption of surface continuity, may occur more frequently near surface transition regions (e.g., corners, edges, etc.) that promote crack propagation in the sprayed coating. Once the coating starts to peel off, the damaged sprayed coating and exposed anodized aluminum cause metal contamination and particle defects on the wafer, rendering the component unusable. Generally, failed / used components must be refurbished to restore performance in the chamber. Alternatively, replacement components must be ordered, which increases operating costs of the semiconductor processing system.

[0003] Furthermore, by-products from the wafer process may adhere to the surface of the semiconductor processing system. For example, by-products may be generated during the etching process of a wafer or any other material in an etching chamber and subsequently adhere to components of the semiconductor processing system. Because the by-products do not adhere firmly to the surface of the semiconductor processing system, they may later be removed and / or knocked off by subsequent wafer processing steps and deposited on the wafer surface. In one case, the adhesion of these by-products to the wafer surface leads to contamination of at least a portion of the wafer surface. Depending on the degree of contamination, part or all of the wafer may become defective, and damage to the wafer surface may lead to defects in the chip formed by the wafer processing. In another case, by-products may adhere to an electrostatic chuck, and if the by-product is a non-conductive material, the electrostatic chuck may be unable to chuck and / or hold the wafer.

[0004] The background information provided herein is intended to provide a general overview of the contents of this disclosure. Any research by the inventors named at present, as well as any description that is not otherwise considered prior art at the time of filing, within the scope described in this background information section, shall not be recognized as prior art to this disclosure, whether express or implied.

[0005] The embodiments of this disclosure were made under these circumstances. [Overview of the project]

[0006] This embodiment relates to solving one or more problems found in related technologies, specifically, to a macroscopic texture of the plasma-facing surface of a consumable part, thereby increasing the surface area of ​​the plasma-facing surface and thereby enhancing the adhesion of an additional layer by creating additional bonding sites. Some embodiments of the invention of this disclosure are described below.

[0007] Embodiments of the present disclosure include a consumable component for a plasma processing chamber. The consumable component includes a plasma-facing surface. An engineering surface is formed on the plasma-facing surface of the consumable component. A plurality of raised features define the engineering surface. The plurality of raised features are arranged in a predetermined pattern. Each of the plurality of raised features includes an upper region having an outer edge and side walls. The base surface of the engineering surface surrounds each of the plurality of raised features, such that the corresponding side walls of the corresponding raised features extend upward at an angle from the base surface toward the corresponding upper region. The consumable component is configured to be installed inside a plasma processing chamber. The consumable component is configured to be exposed to plasma and plasma byproducts.

[0008] Other embodiments of the present disclosure include a method for constructing an engineering surface of a consumable part configured to be installed in a plasma processing chamber. The method includes masking the plasma-facing surface of the consumable part using a stencil, the stencil including a pattern of openings providing access to the plasma-facing surface. The method includes identifying and blasting the plasma-facing surface with blast media through the stencil to generate a plurality of raised features defining the engineering surface, thereby forming the engineering surface on the plasma-facing surface. The plurality of raised features are arranged in a predetermined pattern across the engineering surface. Each of the plurality of raised features includes an upper region having an outer edge and sidewalls. The base surface of the engineering surface surrounds each of the plurality of raised features, such that the corresponding sidewalls of the corresponding raised features extend upward at an angle from the base surface toward the corresponding upper region. The consumable part is configured to be exposed to plasma and plasma byproducts.

[0009] Another embodiment of the present disclosure includes a plasma processing chamber for processing a wafer, comprising a lower electrode configured to support the wafer, an upper electrode positioned above the lower electrode, and a consumable component. The consumable component includes a plasma-facing surface. An engineering surface is formed on the plasma-facing surface of the consumable component. A plurality of raised features define the engineering surface, the raised features are arranged in a predetermined pattern, and each of the raised features includes an upper region having an outer edge and sidewalls. The base surface of the engineering surface surrounds each of the raised features, and the corresponding sidewalls of the corresponding raised features are configured to extend upward at an angle from the base surface toward the corresponding upper region. The consumable component is configured to be installed within the plasma processing chamber. The consumable component is configured to be exposed to plasma and plasma byproducts.

[0010] These and other advantages will be apparent to anyone skilled in the art upon reading the entire specification and claims. [Brief explanation of the drawing]

[0011] This embodiment can be best understood by referring to the following description in conjunction with the attached drawings.

[0012] [Figure 1A] Figure 1A shows an exemplary plasma volume confinement etching chamber including at least one consumable part, which includes an engineering surface having a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface in order to improve the adhesion of additional layers and / or by-products by additional bonding sites, according to one embodiment of the present disclosure.

[0013] [Figure 1B] Figure 1B shows another example of an etching chamber including at least one consumable part, which includes an engineering surface having a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface in order to improve the adhesion of additional layers and / or by-products by additional bonding sites, according to one embodiment of the present disclosure.

[0014] [Figure 2] Figure 2 shows a cross-section of a consumable part of a plasma processing system, demonstrating that, according to one embodiment of the present disclosure, the engineering surface has a macroscopic texture designed to generate additional bonding sites in order to improve the adhesion of additional layers and / or by-products.

[0015] [Figure 3] Figure 3 is a diagram of a plasma confinement ring, which includes an engineering surface having a macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0016] [Figure 4A] Figure 4A is a cross-sectional view of the engineered surface of a consumable part having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0017] [Figure 4B] Figure 4B is a cross-section of a raised feature on an engineering surface having a macroscopic texture, designed to generate additional bonding sites to improve the adhesion of an additional layer and / or by-product, according to one embodiment of the present disclosure.

[0018] [Figure 5] Figure 5 is a flowchart illustrating a method for constructing an engineered surface of a consumable part having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0019] [Figure 6A]FIG. 6A illustrates grit blasting or bead blasting through a stencil to build an engineered surface of a consumable component having macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with an embodiment of the present disclosure.

[0020] [Figure 6B-1] FIG. 6B-1 illustrates grit blasting or bead blasting at one angle onto a plasma-facing surface of a consumable component to build an engineered surface having macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with an embodiment of the present disclosure.

[0021] [Figure 6B-2] FIG. 6B-2 illustrates grit blasting or bead blasting at a plurality of angles onto a plasma-facing surface of a consumable component to build an engineered surface having macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products, in accordance with an embodiment of the present disclosure.

[0022] [Figure 6C] FIG. 6C illustrates an engineered surface of a consumable component after grit blasting or bead processing, in accordance with an embodiment of the present disclosure, wherein the engineered surface comprises macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0023] [Figure 7A]Figure 7A shows a consumable part including an engineering surface coated with a plasma-resistant thermal spray coating having a relatively flat surface that has been anodized and exposed to plasma in a plasma processing system, according to one embodiment of the present disclosure, showing that the thermal spray coating does not conform to the engineering surface which has a macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products.

[0024] [Figure 7B] Figure 7B shows a consumable part including an engineering surface coated with a plasma-resistant thermal spray coating having a relatively flat surface that has been anodized and exposed to plasma in a plasma processing system, according to one embodiment of the present disclosure, showing that the thermal spray coating conforms to the engineering surface having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0025] [Figure 8A] Figure 8A shows a stencil and several exemplary openings configured to direct the media for a grit blast or bead blasting process onto the plasma-facing surface of a consumable part, in order to construct an engineering surface having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0026] [Figure 8B] Figure 8B shows a stencil having multiple openings arranged in a pattern to direct the media for a grit blast or bead blasting process onto the plasma-facing surface of a consumable part, in order to construct an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0027] [Figure 8C] Figure 8C shows a stencil having multiple openings arranged in a two-zone pattern to direct the media for a grit blast or bead blasting process onto the plasma-facing surface of a consumable part, in order to construct an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0028] [Figure 8D] Figure 8D shows a stencil having multiple openings arranged in a three-zone pattern to direct the media for a grid blast or bead blasting process onto the plasma-facing surface of a consumable part, in order to construct an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0029] [Figure 8E] Figure 8E shows a stencil having multiple openings arranged in a linear-scale pattern to direct the media for a grit blast or bead blasting process onto the plasma-facing surface of a consumable part, in order to construct an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0030] [Figure 9A-1] Figure 9A-1 shows a plurality of uniformly arranged raised features according to one embodiment of the present disclosure, wherein the structure and height of the features are configured to be uniform in order to construct a conformal plasma-resistant thermal spray coating, and the raised features define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0031] [Figure 9A-2] Figure 9A-2 shows a plurality of raised features uniformly arranged at a lower density than the features in Figure 9A-1, according to one embodiment of the present disclosure.

[0032] [Figure 9B-1] Figure 9B-1 shows a plurality of uniformly arranged raised features according to one embodiment of the present disclosure, the structure of the features being uniform and having a height smaller than that of Figure 9A-1, and configured to construct a relatively flat, non-conformal, plasma-resistant thermal spray coating, wherein the raised features define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0033] [Figure 9B-2] Figure 9B-2 shows a plurality of raised features uniformly arranged at a lower density than the features in Figure 9A-1, according to one embodiment of the present disclosure.

[0034] [Figure 9C-1] Figure 9C-1 shows a plurality of raised features arranged in two subpatterns according to one embodiment of the present disclosure, wherein the structure and height of the features across the subpatterns are uniform, and the raised features define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0035] [Figure 9C-2] Figure 9C-2 shows a plurality of raised features arranged in two subpatterns according to one embodiment of the present disclosure, wherein the structure and height of the features in each subpattern are uniform but may vary between the two subpatterns, and the raised features define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0036] [Figure 9D] Figure 9 shows a plurality of raised features arranged in three subpatterns according to one embodiment of the present disclosure, wherein the structure and height of the features across the subpatterns are uniform, and the raised features define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0037] [Figure 9E] Figure 9E shows, according to one embodiment of the present disclosure, a plurality of raised features arranged in a linear-scale pattern such that the feature density increases linearly, defining an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0038] [Figure 10] Figure 10 illustrates a process of applying different stencils to the plasma-facing surfaces of a consumable part to generate rounded edges on a pattern of raised features, according to one embodiment of the present disclosure.

[0039] [Figure 11] Figure 11 is an electron microscope image of a cross-section of a consumable part including an engineered surface that is anodized and coated with a plasma-resistant thermal spray coating according to one embodiment of the present disclosure, the engineered surface having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of the additional layer. [Modes for carrying out the invention]

[0040] The following detailed description includes many specific details for illustrative purposes, but those skilled in the art will understand that many variations and modifications of the following details are within the scope of this disclosure. Accordingly, the aspects of this disclosure described below are described without prejudice or limitation to the claims that follow this description.

[0041] In general, various embodiments of the present disclosure describe systems and methods that provide novel methods for forming macroscopic textures on the surface of consumable parts. In embodiments of the present disclosure, the macroscopic texture adds large-scale patterned features on or within the surface of the consumable part. In various embodiments, the consumable part may be a plain bulk material (e.g., bare ceramic, bare aluminum, etc.), may be anodized (e.g., anodized aluminum), and may or may not have a plasma-sprayed coating. In embodiments, the intended effect of the macroscopic texture of the plasma-facing surface of the consumable part includes improving the adhesion of the spray coating (or the adhesion of additional layers) and / or the adhesion of by-products. The macroscopic texture increases the surface area of ​​the surface of the consumable part and improves the adhesion of a subsequently applied layer (e.g., a plasma-resistant spray coating) by creating additional bonding sites (e.g., for improved adhesion of yttria spray coatings). One of the main causes of consumable part failure is the delamination of the thermal spray coating from the anodized surface beneath the consumable part; therefore, improving adhesion strength can extend the life of the coating (and the life of the consumable part). Since plasma-resistant thermal spray coatings account for a significant portion of the cost of consumable parts, extending the life of consumable parts can significantly reduce the ownership cost of plasma-sprayed components (e.g., consumable parts) used in the chamber body of a conductive etching chamber. This can significantly increase the life and service life of consumable parts. Additionally, the service life of consumable parts may be extended between maintenance inspections, thus reducing tool downtime for the plasma processing system. Embodiments of this disclosure realize the above advantages and further realize the additional advantage that, due to the macroscopic texture, by-products formed during the process may be captured and / or fixed, thereby reducing the likelihood of consumable parts carrying particles (e.g., by-products) over their service life, leading to improved processing performance. Embodiments of the present disclosure realize the above advantages and provide the additional advantage that macroscopic texture (e.g., roughening) improves the fracture resistance of coatings on altered surfaces of consumable parts.Further embodiments of the present disclosure realize the above advantages by further realizing that macroscopic texture reduces the occurrence of large in-plane stresses and subsequent cracking of the thermal spray coating by introducing continuous, deliberate breaks in the surface contour. That is, macroscopic texture enhances stress reduction of the film (e.g., thermal spray coating). Further embodiments of the present disclosure realize the above advantages by further realizing that macroscopic texture enhances the surface continuity of the wear part (e.g., eliminates breaks in surface continuity), particularly near surface transitions (e.g., corners, edges). By increasing surface continuity, cracks in the created surface (e.g., thermal spray coating) are prevented from occurring / propagating on the surface due to breaks in surface continuity.

[0042] Embodiments of the present disclosure provide a macroscopic surface texture (e.g., a plasma-facing surface) on a consumable component, which may be any component found within a semiconductor processing assembly (e.g., a plasma processing chamber). In some cases, the consumable component may be removablely located within the plasma processing chamber. Thus, the consumable component may be removed for repair and / or replacement. Such a method may increase the lifespan and / or service life of the plasma processing chamber. For illustrative purposes, the following list provides, but is not intended to be exhaustive, examples of consumable components found within a plasma processing chamber. Examples of consumable components include liners configured to protect the inner walls of the plasma processing chamber, one or more C-shroud portions, one or more plasma confinement ring portions, focus rings, edge rings, electrostatic semiconductor wafer clamp / chucking systems, upper electrodes, lower electrodes, and pedestals configured to support wafers. In other cases, embodiments of the present disclosure may be provided on any plasma-facing surface found within a semiconductor processing assembly, which may be located on a consumable component or a fixed component.

[0043] Embodiments of the present disclosure relate to plasma process modules. For example, such plasma process modules are used in plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, clean chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, plasma-enhanced chemical vapor deposition (PECVD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and the like. Embodiments of the present disclosure also relate to any other semiconductor processing systems related to, or potentially used in, the fabrication and / or manufacture of semiconductor wafers. Any other semiconductor processing systems include, for example, processes via electroplating, electroetching, electropolishing, electrochemical polishing, deposition, wet deposition, and through-silicon vibrator (TSV) processes. Embodiments of the Disclosure are not limited to the examples provided herein and may be implemented in different plasma processing systems employing different configurations, shapes, and plasma generation techniques (e.g., inductively coupled systems, capacitively coupled systems, electron-cyclotron resonance systems, microwave systems, etc.). Examples of plasma processing systems and plasma process modules are disclosed in the jointly owned U.S. Patents No. 8,862,855, 8,847,495, and 8,485,128, and U.S. Patent Application No. 15 / 369,110.

[0044] In conjunction with the above general understanding of various embodiments, illustrative details of the embodiments will now be described with reference to various drawings. In one or more drawings, elements and / or components that are similarly numbered are intended to generally have the same configuration and / or function. Furthermore, the drawings may not be drawn to scale, but are intended to illustrate and emphasize the concept of novelty. It will be apparent that these embodiments can be implemented without some or all of these specific details. In other examples, well-known process operations are not described in detail so as not to unnecessarily obscure these embodiments.

[0045] Figure 1A shows an exemplary plasma processing chamber 100A (e.g., a plasma volume confinement etching chamber) including at least one consumable part, which includes an engineering surface having a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface in order to improve the adhesion of additional layers and / or by-products by additional bonding sites, according to one embodiment of the present disclosure. The plasma processing chamber 100A includes an upper electrode 142 and a lower electrode 144 on which a semiconductor wafer 146 is placed. The etching chamber 100A is shown to be configured for small plasma volume confinement together with a plasma confinement ring 160 positioned to define the lateral boundary of a small plasma volume confinement region 145. The upper electrode 142 and the lower electrode 144 with the semiconductor wafer 146 placed on it define the upper and lower boundaries of the small volume plasma confinement region 145, respectively.

[0046] The configurable plasma processing chamber 100A includes an outer plasma confinement structure 162 that functions as a plasma confinement structure 162 when the plasma processing chamber 100A is configured for a large plasma volume. When the plasma processing chamber 100A is configured for a small volume, the outer plasma confinement structure 162 is located where redundant baffles must be provided through which neutral species of plasma must pass when exhausted from the etching chamber via the turbopump 202.

[0047] In one embodiment, the plasma confinement ring 160 is configured to extend between the periphery of the upper electrode 142 and the periphery of the lower electrode 146 so that the plasma generated by the ionization of a reactive gas by applied RF energy is confined within a small plasma volume confinement region 145 defined between the confinement ring 160 and electrodes 142, 144 just above the surface of the wafer 146. The plasma confinement ring 160 may define a slotted confinement shield composed of a plurality of circular rings 160. The circular rings 160 are made of a dielectric such as silica or quartz, and adjacent rings are separated by spacers 170, creating circumferential slots or passages between the circular rings 160 through which neutral species of plasma are discharged. The circumferential slots thereby form spaced parallel passages perpendicular to the flow of plasma or gas through the parallel passages.

[0048] The spacer 170 is similarly composed of a dielectric such as silica or quartz, or a conductive material such as silicon carbide or doped silicon, and the slots or passages are configured to eliminate some ionic particles remaining in the exhaust gas flowing through the confinement ring 160 and exhaust them through the chamber 100A via the turbopump 202. In one embodiment, the plasma confinement ring 160 is connected by a shaft 179. The shaft 179 may be composed of a lightweight, low-particle-generating material such as nylon and is configured to support the confinement ring 160 and the spacer 170. The spacer is configured to expand and contract between itself and the confinement ring 160 around the shaft 179, so that a desired space is formed between it and the ring to neutralize any ionic particles or electrons from the plasma that may cross the slots or passages as the plasma confinement ring 160 extends to define a small plasma volume confinement region 145.

[0049] The plasma confinement ring 160, spacer 170, and shaft 179 together form a confinement assembly 173. When the confinement assembly 173 retracts to form a large plasma volume confinement region 145, the shaft 179 is withdrawn from the confinement region 145, pulling in the spacer 170 in the adjacent ring 160, thereby causing the stack of the plasma confinement ring 160 to collapse. Specifically, the large plasma volume is generated at the boundary between the chamber liner 164, which is formed in the plasma processing chamber 100A, and the outer plasma confinement structure 162.

[0050] The plasma protection chamber liners 164, 166 may be incorporated to provide thermal stability, a suitable RF ground return path, and serviceability with minimal downtime. The chamber liners 164, 166 may also be configured to provide additional protection to the wall of the plasma processing chamber 100A, such that the liner is exposed to the plasma process instead of the wall. The upper chamber liner 164 is configured in the outer plasma confinement structure 162, and the lower chamber liner 166 is configured to run along the lower region of the wall of the plasma processing chamber from the outer plasma confinement structure 162 to the base of the exhaust for the etching chamber 200 and the turbopump 202.

[0051] Embodiments of the present disclosure may be carried out on any plasma-facing surface shown in Figure 1A. Examples of plasma-facing surfaces shown in Figure 1A include, but are not limited to, the chamber liner 164, the chamber liner 166, the upper electrode 142, the lower electrode 144, and the components of the confinement assembly 173.

[0052] Figure 1B shows another example of a plasma processing chamber 100B (e.g., an etching chamber) according to one embodiment of the present disclosure, which includes at least one consumable part, including an engineering surface having a macroscopic texture designed to increase the surface area of ​​the plasma-facing surface in order to improve the adhesion of additional layers and / or by-products by additional bonding sites. Specifically, the plasma processing chamber 100B may include an upper central electrode 106, an upper outer electrode 104, a lower central electrode 108, and a lower outer electrode 110 within a plasma processing chamber 149 surrounded by a chamber wall 150. A lower insulating ring 112 insulates the lower central electrode 108 from the lower outer electrode 110. The ring 112 may be an edge ring and / or a focus ring, or may incorporate them. Also within the plasma processing chamber 149, a substrate 146 is placed on the lower central electrode 108. The lower central electrode 108 is provided with an electrostatic chuck (ESC) for holding the substrate 146. In this embodiment, the lower outer electrode 110 and the upper outer electrode 104 have openings with a diameter larger than that of the substrate 146, and the substrate 146 is positioned within the openings.

[0053] The gas source 124 is connected to the plasma processing chamber 149 and supplies etching gas to the plasma region 140 of the plasma processing chamber 149 during a wafer process (e.g., an etching process). The RF bias source 148, the first excitation RF source 152, and the second excitation RF source 156 are electrically connected to the plasma processing chamber 149 via the controller 135 and supply power to electrodes 104, 106, 108, and 110. The RF bias source 148 generates RF bias power and supplies it to the plasma processing chamber 149. The first excitation RF source 152 generates RF power and supplies RF bias power to the plasma processing chamber 149. The second excitation RF source 156 generates another RF power in addition to the RF power generated by the first excitation RF source 152 and supplies this RF power to the plasma processing chamber 149. Different RF signals may be supplied to various combinations of the upper and lower electrodes. In this example, the upper electrode is grounded, and power is supplied only to the lower central electrode 108.

[0054] The C shroud 114 extends from the upper outer electrode 104 to the lower outer electrode 110 and provides additional plasma containment. The C shroud 114 has multiple openings 102 to allow gas and plasma to flow out of the C shroud 114. In this embodiment, the C shroud 114 is grounded.

[0055] The upper temperature controller 171 provides independent temperature control for the upper central electrode 106 and the upper outer electrode 104. The lower temperature controller 172 provides independent temperature control for the lower central electrode 108 and the lower outer electrode 110. In one embodiment, the upper outer electrode 104 and the C shroud 114 may be maintained at the same temperature by the same setting of the upper temperature controller 171.

[0056] Controller 135 is connected to the gas source 124, the RF bias source 148, the upper temperature controller 171, the lower temperature controller 172, the exhaust pump 120, the first excitation RF source 152, and the second excitation RF source 156. Controller 135 controls the flow of etching gas into the plasma processing chamber 149, the chamber pressure, and the generation of RF power from the three RF sources 148, 152, 156, electrodes 104, 106, 108, and 110, as well as the exhaust pump 120.

[0057] The upper central electrode 106 also acts as a gas distribution plate, connected to the gas source 124, and serves as a gas inlet for gas from the gas source 124. The exhaust pump 120 acts as a gas outlet, removing gas that passes through the plasma region 140 and the opening 102 from the upper central electrode 106 to the exhaust pump 120. The exhaust pump 120 may be useful for pressure control.

[0058] Embodiments of the present disclosure may be implemented on any plasma-facing surface shown in Figure 1B. Examples of plasma-facing surfaces shown in Figure 1B include, but are not limited to, the upper central electrode 106, upper outer electrode 104, lower central electrode 108, and lower outer electrode 110, the insulating ring 112, the edge ring, the focus ring, and the electrostatic semiconductor wafer clamp / chucking system (e.g., electrostatic chuck-ESC), and the C shroud 114.

[0059] Figure 2 shows a cross-sectional view of a consumable component 210 for a plasma processing chamber, showing an engineering surface 300 having a macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. Figure 2 is an explanatory diagram of the engineering surface 300 formed on the plasma-facing surface of the consumable component 210, which includes a macroscopic texture that adds patterned, large-scale features extending from the base surface 350. The consumable component 210 is configured to be installed in a plasma processing chamber. In one embodiment, the consumable component 210 is removably installed in the plasma processing chamber. More specifically, the consumable component 210 is configured to be exposed to plasma and plasma by-products during wafer processing (e.g., etching, deposition, etc.). In one embodiment, the consumable component 210 is made of a conductive material (e.g., an aluminum alloy). In another embodiment, the consumable component is made of a dielectric material (e.g., a ceramic).

[0060] As shown in the figure, the consumable part 210 includes a base surface 350 with a macroscopic texture. The base surface 350, which is textured and forms the engineering surface 300 together with any other finishing layer, may be exposed to plasma during wafer processing. Specifically, the macroscopic texture includes a plurality of raised features 440 that define the engineering surface arranged in a predetermined pattern. That is, the features of the plurality of raised features 440 are arranged in a predetermined pattern, such as on the base surface 350. In embodiments, patterning the base surface 350 of the consumable part for adhesion of the coating and / or by-products is a low-cost, easily implementable, and repeatable method. Instead of indiscriminately forming microscopic textures (e.g., microscopic surface roughness arbitrarily deposited by grit blasting) on ​​the base surface 350 of the consumable part 210 to promote adhesion, as is done in current technology, embodiments of the present disclosure form macroscopic textures on the base surface 350 of the consumable part to form an engineering surface 300, wherein macroscopic features are patterned on the base surface 350 to promote film adhesion (e.g., to the base surface and / or the anodized layer on the base surface) and / or to enhance the fixation of by-products to the consumable part during wafer processing (e.g., fixation to the base surface, fixation to the anodized base surface, and / or fixation to the thermal spray coating on or on the anodized base surface). In embodiments, macroscopic features may be formed by masking and media blasting, machining, wet chemical etching via stencil or mask, selective deposition, additive manufacturing, etc., as further described below. In various embodiments, the consumable parts may be plain bulk material (e.g., bare ceramic, bare aluminum, etc.), may be anodized (e.g., anodized aluminum), and may or may not have a plasma spray coating applied. The intended effect of the macroscopic texture of the plasma-facing surface on the consumable parts includes, in embodiments, enhancing the adhesion of the spray coating (or the adhesion of additional layers) and / or the adhesion of by-products.For example, by-products may be formed during the etching process, and the by-products may adhere to one or more components of the corresponding plasma processing chamber (e.g., plasma confinement liner). Exemplarily, the macroscopic texture forms features approximately 5 to 100 times larger in size than the features formed on the previously generated microscopic texture. In one embodiment, the size of the macroscopic features is in the range of 0.1 mm to 3.0 mm. In another embodiment, the size of the macroscopic features is in the range of 0.2 mm to 2.5 mm. In yet another embodiment, the size of the macroscopic features is in the range of 0.2 mm to 1.3 mm. In yet another embodiment, the size of the macroscopic features is in the range of 0.3 mm to 1.0 mm.

[0061] Furthermore, multiple microscopic features may be arbitrarily formed on multiple raised features. For example, multiple raised features may be roughened by processing by bead and / or grit blasting, and microscopic features may be constructed on the multiple raised features. Additional microscopic texture (e.g., roughening of macroscopic features) may result in improved fracture resistance (e.g., better adhesion) of the coating placed on the engineering surface.

[0062] In one embodiment, the base surface 350 patterned with macroscopic features is then optionally anodized to provide an anodized layer 220. That is, the engineering surface 300 is anodized. For example, in one embodiment, the consumable part is an aluminum alloy, and the engineering surface 300 is formed from the aluminum alloy. During the anodizing process, the aluminum alloy is anodized by processes such as electrolytic passivation. For example, anodizing of the metal increases the thickness of the native oxide layer on the surface. In one embodiment, the outline of the macroscopic features is exposed through the anodized layer 220 such that the shape factors of the macroscopic features are present through the anodized layer. That is, the anodized layer 220 conforms to the outlines of a plurality of raised features 440.

[0063] Specifically, the surface of the anodized layer 220 is altered by the presence and exposure of macroscopic features. In this way, the surface area of ​​the base surface 350 of the consumable part and the surface area of ​​the anodized layer 220 also increase. That is, the surface morphology of the anodized layer 220 becomes distorted. The combined effect of increased surface area and irregular surface morphology plays a role in decomposing the internal stress of the plasma-resistant thermal spray coating 230. Thus, the adhesion between the thermal spray coating 230 and the anodized layer 220 is improved. In this way, the advantages of macroscopic features exposed through the anodized layer 220 (e.g., exposure of the outline) can be utilized to provide better and enhanced adhesion to additional layers via additional bonding sites, etc.

[0064] Furthermore, in another embodiment, a plasma-resistant thermal spray coating 230 is optionally applied to the anodized layer 220. For example, the spray coating may be a yttrium-based thermal spray coating (e.g., yttrium oxide) on an anodized consumable part 210 (e.g., an anodized aluminum alloy of the consumable part). The coating 230 may be applied by a thermal spray process in which a heated material is sprayed onto the surface. In one application example, the spray coating is heated by an electrical (e.g., plasma or arc) or chemical (e.g., combustion) process. In embodiments of this disclosure, macroscopic features defining the engineering surface 300 (e.g., formed on the base surface 350) enhance the adhesion of the plasma-resistant thermal spray coating 230 to the consumable part 210, more specifically to the anodized layer 220. In other words, the macroscopic features provide better adhesion of the plasma-resistant spray coating 230 to the anodized layer 220, and similarly reduce delamination of the plasma-resistant spray coating 230 from the anodized layer 220. The improved adhesion of the spray coating 230 prevents metal contamination on the wafer caused by exposure to anodized aluminum resulting from some damaged spray coatings (e.g., delamination).

[0065] Figure 3 is an illustrative diagram of a consumable part 210', which includes an engineering surface 300' having a macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. For illustrative purposes only, the consumable part 210' may be the plasma confinement ring 160, first introduced in Figure 1A. For clarification and illustrative purposes, the plasma confinement ring 160 may be used as a substitute for the consumable part 210' located in the plasma processing chamber. For example, the consumable part 210' may be detachably located in the plasma processing chamber.

[0066] As shown in the figure, the plasma-facing surface 310 of the consumable part 210' includes an engineering surface 300' containing a plurality of raised features 440', as previously described. Each of the plurality of raised features 440' extends diagonally upward from the base surface 350'. For example, the consumable part 210' is configured in the shape of a disk (as shown, for example, in Figure 1A), and may also be a plasma confinement ring 160 including the inner diameter of a disk or an annular ring, the inner diameter defining the plasma-facing surface. Specifically, once the consumable part 210' is placed in the plasma processing chamber, the consumable part 210' is exposed to the plasma during wafer processing (e.g., etching, deposition, etc.). More specifically, the plasma-facing surface 310 may be directly exposed to the plasma in the plasma processing chamber during wafer processing. Embodiments of the present disclosure form a macroscopic texture on the plasma-facing surface 310 of a consumable part 210' to form an engineering surface 300', the macroscopic features being patterned on the surface of the plasma-facing surface 310 to promote film adhesion and / or enhance the adhesion of by-products to the surface of the consumable part during wafer processing.

[0067] Furthermore, the consumable part 210' may include an upper 169 and a lower 163, as in a substitute plasma confinement ring. In some embodiments, macroscopic texture on their surfaces may not be required because the upper 169 and / or lower 163 may not be directly exposed to the plasma. In other embodiments, macroscopic texture on the upper 169 and / or lower 163 may be implemented because this would shorten the lifespan of the consumable part 210' and / or increase the possibility of by-product capture and detachment. In those cases, macroscopic texture on the upper 169 and / or lower 163 may increase the lifespan of any additional plasma-resistant spray coating (not shown) applied to the consumable part 210' (e.g., plasma confinement ring 160) and / or provide better adhesion of by-products to their surfaces during one or more wafer processing operations, which may help prevent by-product detachment.

[0068] In one embodiment, multiple raised features may be formed to surround a void. For example, a hole (e.g., a circular hole) may be formed on the plasma-facing surface of a consumable part, and the surrounding structure around the hole may be defined as multiple raised features. For example, an inverse stencil (e.g., the negative of the stencil used to form the engineering surface in Figure 3) may be used in conjunction with media blasting (e.g., grid blasting, bead blasting, etc.) to form the hole and the raised features surrounding the hole.

[0069] In another embodiment, multiple recessed features define an engineering surface. For example, a reverse stencil (e.g., the negative of the stencil used to form the engineering surface in Figure 3) may be used in conjunction with a media blast (e.g., a grid blast, bead blast, etc.) to form multiple recessed features, and the recessed features may be voids (i.e., the opposite of a raised feature with contents). For example, contrary to Figure 3, the recessed features may extend diagonally downward from the base plane.

[0070] Figures 4A–4B show the macroscopic texture of the surface of a consumable part 210' according to embodiments of the present disclosure, including exemplary dimensions and configurations of each feature defining the macroscopic texture. For example, Figures 4A–4B may be close-ups of one or more raised features shown in Figure 3. Specifically, Figure 4A is a cross-sectional view of the engineered surface 300' of a consumable part 210' having a macroscopic texture in the form of a raised feature 440' designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. Figure 4B is a cross-section of the raised feature 440' of the engineered surface 300' having a macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. Figures 4A-4B show various controllable parameters when forming multiple raised features 440′, including center spacing, aspect ratio, feature separation (e.g., distance between features in the pattern), and edge finish (e.g., rounding).

[0071] The plasma-facing surface 310 of the consumable part 210' includes an engineering surface 300'. As previously mentioned, the consumable part 210' may be removably disposed in the plasma processing chamber. For example, the consumable part 210' may be a liner configured to protect the inner wall of the plasma processing chamber, or the inner wall of the plasma processing chamber, or one or more C-shroud portions, or one or more plasma confinement ring portions, or a focus ring, or an edge ring, or an electrostatic semiconductor wafer clamp / chucking system, or an upper electrode, or a lower electrode, or a dielectric window for inductively coupled plasma, etc. In embodiments, the plasma-facing surface 310 of the consumable part 210' may be made of a conductive material or a dielectric material.

[0072] More specifically, the multiple raised features 440' define the engineering surface 300'. The multiple raised features 440' define the macroscopic texture formed on the plasma-facing surface 310 of the consumable part 210'. The multiple raised features 440' are designed to form additional bonding sites for better adhesion of the additional layer and / or capture of by-products formed during wafer processing. The multiple raised features 440' are formed on the plasma-facing surface 310 in a predetermined pattern. As shown in the figure, the base surface 350' surrounds each of the multiple raised features 440', and the corresponding sidewalls 450 of the corresponding raised features 440 extend from the base surface 350' to the corresponding upper region 470. For example, in the cross section of Figure 4A, the multiple raised features 440' include raised feature 440A, raised feature 440B to the left of feature 440A, and other raised features. Further raised features extending within and outside the page of Figure 4A are not shown.

[0073] Raised feature 440A is defined by central axis 480A, and raised feature 440B is defined by central axis 480B. Distance "B" is defined between the two central axes 480A and 480B, and distance B defines the separation between the raised features. Depending on the selected pattern for multiple raised features formed on the plasma-facing surface 310 of the consumable part 210', additional separation may be defined between the raised features. For illustrative purposes only, distance B may be about 47 mm. In some embodiments, distance B is in the range of about 15 mm to about 75 mm or more. In some embodiments, distance B is in the range of about 10 mm to about 60 mm. In some embodiments, distance B is in the range of about 20 mm to about 50 mm.

[0074] Each raised feature includes a top region and side walls. In some embodiments, raised features may be depicted as small blocks or truncated cones. As a representation of a raised feature, raised feature 440A includes a top region 470 (e.g., a flat region). The top region 470 may have an outer edge 460. In one embodiment, the outer edge 460 has rounded corners. In another embodiment, the outer edge 460 is not rounded, i.e., it is a left acute angle. For illustrative purposes, the outer edge 460 is described throughout this specification as having rounded corners; however, it may be defined as acute, etc., by other features. Each raised feature may have a predetermined edge finish with respect to its corresponding outer edge. In one embodiment, the edge finish may include rounded corners on the outer edge, as in raised feature 440A. In another embodiment, the edge finish may be sharp and / or distinct. Other types of edge finishes are maintained and their shapes controlled by using bead blasting and / or grit blasting via a stencil on the plasma-facing surface 310. For example, edge finishes to the outer edge may include chamfered edges, an overall V-shape toward the upper region, sharp edges, etc. Distance "A" defines the distance between the rounded corners on the opposing sides of the upper region 470. For illustrative purposes only, distance A may be about 2 mm, and distance A may be the diameter of the upper region 470. In some embodiments, distance A is in the range of about 0.5 mm to about 5 mm. In other embodiments, distance A is in the range of about 1 mm to about 4 mm. In yet another embodiment, distance A is in the range of about 1.5 mm to about 3 mm.

[0075] For a typical raised feature 440A, distance "C" defines the height of the feature. For illustrative purposes only, distance C may be about 0.5 mm. In some embodiments, distance C is in the range of about 0.1 mm to about 3.0 mm. In some embodiments, distance C is in the range of about 0.2 mm to about 3 mm. In other embodiments, the size of distance C is in the range of about 0.2 mm to about 2.5 mm. In yet another embodiment, the size of the macroscopic feature is in the range of about 0.2 mm to about 1.3 mm. In yet another embodiment, the size of the macroscopic feature is in the range of about 0.3 mm to 1.0 mm.

[0076] Furthermore, a typical raised feature 440A may include a side wall 450. The raised feature 440A extends upward from the base plane 350' at a certain angle. Specifically, the side wall 450 extends upward from the base plane 350' at an angle 490A, which is defined between line 485A (extending from the side wall 450) and the central axis 480A. The configuration of the side wall 450 and the upper region 470 defines an aspect ratio (the ratio between the approximate height and approximate diameter of the raised feature 440A at the base plane 350') that can be controlled by processing by grit and / or bead blasting via a stencil on the plasma-facing surface of the consumable part. For illustrative purposes only, the angle 490A is approximately 30 degrees. In embodiments, the angle 490A is in the range of approximately 15 degrees to approximately 60 degrees. In some embodiments, angle 490A is in the range of about 0 to about 45 degrees. In other embodiments, angle 490A is in the range of about 15 to about 40 degrees. In other embodiments, angle 490A is in the range of about 20 to about 40 degrees. In yet another embodiment, angle 490A is in the range of about 25 to about 35 degrees. Also, angle 490B is defined between opposing sides indicated by lines 485A and 485B extending downward from the side wall 450. For example, angle 490B is about 60 degrees. In some embodiments, angle 490B is in the range of 0 to 90 degrees. In other embodiments, angle 490A is in the range of about 30 to about 80 degrees. In other embodiments, angle 490A is in the range of about 40 to about 80 degrees. In yet another embodiment, angle 490A is in the range of about 50 to about 70 degrees. For illustrative purposes only, angles 490A and 490B defining the side wall 450 and the upper region 470 may form a small block or a frustum of a cone.

[0077] Figure 5 is a flowchart 500 illustrating a method for constructing an engineered surface of a consumable part having a macroscopic texture in the shape of raised features designed to generate additional bonding sites for better adhesion of an additional layer, according to one embodiment of the present disclosure. Flowchart 500 may be performed to generate and / or construct any macroscopic features defining the engineered surface of the plasma-facing surface of the consumable part as described in Figures 1-4 and 6-11 of this application. Flowchart 500 shows that one method for patterning the macroscopic texture (e.g., features) defining the engineered surface of the consumable part is achieved through masking and media blasting. In other embodiments, the macroscopic texture (e.g., features) defining the engineered surface may be formed through machining (e.g., via physical or laser ablation, etc.). In yet another embodiment, the macroscopic texture (e.g., features) defining the engineered surface may be formed through chemical etching via a stencil or mask, or selective deposition, or additive manufacturing (e.g., via powder bed fusion, material extrusion, direct deposition, etc.) for depositing features to produce the desired engineered surface.

[0078] In 510, the method includes masking the plasma-facing surface of a consumable part using a stencil, the stencil including a pattern of openings providing access to the plasma-facing surface. The plasma-facing surface of the consumable part may include a conductive material (e.g., aluminum alloy, aluminum, metal, etc.) or a dielectric material (e.g., ceramic). The plasma-facing surface of the consumable part is configured to be exposed to plasma and plasma byproducts. As described above, macroscopic features are patterned on the plasma-facing surface of the consumable part to promote coating adhesion, such as enhanced adhesion of a plasma-resistant thermal spray coating. In one embodiment, the macroscopic features may be formed on a conductive material (e.g., aluminum alloy) taken out immediately after machining.

[0079] Stencils are used to control the formation of macroscopic features (e.g., multiple raised features). Specifically, the form, shape, and / or contour of each macroscopic feature is controlled by a stencil placed on the plasma-facing surface during blasting. The pattern (including subpatterns) of multiple raised features formed on the plasma-facing surface and defining the engineering surface of the plasma-facing surface is also controlled via the stencil during blasting. Control parameters defining the formation of raised features include, but are not limited to, the overall shape, center spacing, aspect ratio, feature separation (e.g., distance between features in the pattern), and edge finish (e.g., rounding).

[0080] In some embodiments, the stencil may be made of any suitable material. Specifically, the stencil can be made of any material that is unlikely to deform during media blasting. In one embodiment, the stencil is made of a material that is unlikely to deform during media blasting. In other embodiments, the stencil may be made of a material that allows for reuse. In other embodiments, the stencil is disposable.

[0081] In yet another embodiment, the stencil is made of a material capable of conforming to complex part shapes, including transitions between edges (e.g., corners) on the surface of the corresponding consumable part (e.g., a chamber liner), conductance gaps, and transitions between surfaces of the consumable part. That is, the plasma-facing surface of the consumable part includes surface transitions (e.g., edges, corners, valleys) that may contribute to the delamination of the subsequently applied coating. For example, delamination may occur more frequently at the corners of the consumable part, which are not modified in the embodiments of this disclosure. In the embodiment, the addition of macroscopic features to the plasma-facing surface increases the adhesion of the coating to the plasma-facing surface having surface transitions, resulting in stronger adhesion.

[0082] In 520, the method includes identifying and blasting a plasma-facing surface with blast media via a stencil to generate a plurality of raised features defining an engineering surface, which is formed on the plasma-facing surface. In one embodiment, macroscopic features are blasted by grid media blasting via a fabricated stencil. In another embodiment, macroscopic features are formed by photomasking and etching. The features of the plurality of raised features are arranged on the engineering surface in a predetermined pattern. In another embodiment, each of the plurality of raised features includes an upper region having an outer edge and sidewalls. In one embodiment, the outer edge is rounded. In another embodiment, the outer edge may not be rounded and may be defined to have a sharp edge or corner. The base plane of the engineering surface surrounds each of the plurality of raised features, and the corresponding sidewalls of the corresponding raised features extend upward at an angle from the base plane to the corresponding upper region.

[0083] Macroscopic patterns can be generated by, but are not limited to, the following methods: bead blasting using media, grit blasting using media, and photomasking with etching. In one embodiment, the macroscopic pattern is formed by bead blasting using beads as the blasting medium. In another embodiment, the macroscopic pattern is formed by grit blasting using grit material as the blasting medium. Control parameters during bead blasting and / or grit blasting include the type of media, the size of the media, the duration of the blast, the direction of the blast, and the number of passes. In one embodiment, the media used for bead blasting or grit blasting is formed of the same composition and / or material used to form the plasma-facing surface of a consumable part in order to reduce and / or prevent contamination of the plasma-facing surface by impregnation of the blast media onto the plasma-facing surface. In yet another embodiment, the macroscopic pattern is formed by photomasking and etching. For example, the etching process includes wet chemical etching, plasma etching, etc. In another embodiment, the patterned macroscopic features are formed by machining, selective vapor deposition, additive manufacturing, etc.

[0084] The additional finishing steps are performed on the plasma-facing surface of the consumable part, which has been macroscopically textured. In one embodiment, for example, the method may include removing the stencil and optionally blasting the plasma-facing surface with a second blast medium to roughen the raised features with microscopic features. The microscopic texture is performed on the raised features and provides increased fracture resistance of the coating placed on the engineering surface. In other embodiments, the additional finishing steps may include anodizing the engineering surface, such as constructing and / or generating an anodized layer. Alternatively, as an additional finishing step, a thermal spray coating (e.g., a plasma-resistant thermal spray coating) may be applied to the anodized engineering surface. Specifically, at least some of the raised features protrude through the anodized layer, improving the adhesion of the thermal spray coating to the anodized layer.

[0085] In one embodiment, macroscopic features (e.g., multiple raised features, multiple recessed features, etc.) may be formed by wet chemical etching via a stencil or mask. For example, covering a consumable part with adhesive tape allows for selective chemical etching of the exposed surface, resulting in the formation of planned features.

[0086] In another embodiment, macroscopic features (e.g., multiple raised features, multiple subsided features, etc.) may be formed by selective deposition. Raised features may be generated by selectively activating a target region using wet or dry chemistry such as plasma, and then depositing the desired material onto the activated region. Raised features may also be generated in the reverse manner, i.e., by passivating a region for subsided features so that subsequent deposition in the remaining region is preferable.

[0087] In yet another embodiment, the formation of macroscopic features (e.g., multiple raised features, multiple subsided features, etc.) may be carried out by additive manufacturing. The additive material may consist of the same material as the plasma-facing surface beneath the consumable part, or it may consist of a different composition. The additive material may also have the same microstructure as the plasma-facing surface beneath the consumable part, or it may have a different microstructure. For illustrative purposes, examples of additive manufacturing methods include, but are not limited to, photopolymerization, powder bed fusion, material extrusion, and direct deposition.

[0088] In yet another embodiment, multiple settled features define the engineering surface. For example, a reverse stencil or mask may be used in conjunction with media blasting (e.g., grid blasting, bead blasting, etc.) to form multiple settled features. When using a reverse stencil, settled features may be generated that are voids in the engineering surface (i.e., the opposite of raised features, which are solid). In yet another embodiment, a reverse stencil or mask may be used in conjunction with chemical etching to form multiple settled features.

[0089] Figures 6A, 6B-1, 6B-2, and 6C illustrate grit blasting or bead blasting via stencils to construct an engineered surface 300' of a consumable part 210' having macroscopic texture. Specifically, macroscopic features (e.g., raised features) are patterned onto the plasma-facing surface 310 (e.g., the surface) of the consumable part 210' to facilitate the adhesion of coatings and / or by-products.

[0090] Specifically, Figure 6A shows a grid blasting or bead blasting process via a stencil to construct an engineered surface 300' of a consumable part 210' having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure. As shown in Figure 6A, in one embodiment, a plurality of raised features are processed by grid media blasting via a fabricated stencil 610. For example, the stencil 610 includes an opening 610A through which blast media can pass and reach the plasma-facing surface 310 of the consumable part 210'. The stencil 610 also includes a closure 610B, where blast media is prevented from reaching the plasma-facing surface 310 of the consumable part 210'. In this manner, the stencil 610 controls the formation of multiple raised features on the plasma-facing surface 310 of the consumable part, and the multiple raised features define the corresponding engineering surface of the consumable part 210'.

[0091] As shown in Figure 6A, distance 615 represents the distance between the stencil 610 and the plasma-facing surface 310 (e.g., the surface of the plasma-facing surface). In some applications, distance 615 is minimized until the stencil 615 is stationary on the plasma-facing surface 310 during bead and / or grid blasting. In other embodiments, the stencil 615 is separated from the plasma-facing surface 310 during bead and / or grid blasting (e.g., distance 615 has a value).

[0092] The blaster nozzle 620 is configured to deliver blast media (e.g., grit and / or bead) through a stencil to the plasma-facing surface 310 of the consumable part 210' at one or more angles. In some embodiments, the blaster nozzle 620 moves toward the stencil in a pattern. For example, the blaster nozzle 610 may move in one or more directions in a first cycle or pass. For illustrative purposes, the blaster nozzle 610 may move toward the stencil in one direction (e.g., vertical, transverse, or diagonal) in a single cycle or pass. One or more cycles or passes may be performed during the bead and / or grit blasting process. Also, different patterns of movement of the blaster nozzle 620 may be performed when constructing multiple raised features on the plasma-facing surface 310 of the consumable part 210'.

[0093] Figure 6B-1 shows that the plasma-facing surface 310 of the consumable part 210' shown in Figure 6A is grit-blasted or bead-blasted at one angle to construct an engineering surface with a macroscopic texture in the form of raised features designed to create additional bonding sites for better adhesion of additional layers and / or by-products. Specifically, macroscopic features (e.g., raised features) are patterned on the plasma-facing surface 310 (e.g., the surface) of the consumable part 210' to facilitate adhesion of the coating and / or by-products.

[0094] As shown in Figure 6B-1, the stencil 610 is positioned relative to the plasma-facing surface 310 of the consumable part 210' during bead and / or grid media blasting. The stencil 610 includes an opening 610B, which, when blasted from the blaster nozzle 620, allows the blast media 629 to reach the plasma-facing surface 310 through the opening 610B. The stencil 610 includes a closure 610A, which restricts the blast media 629 from passing through and reaching the plasma-facing surface 310 of the consumable part 210'. As previously mentioned, the blaster nozzle 620 may move toward the stencil in a predetermined pattern or random pattern, such as a predetermined movement 625.

[0095] During bead blasting and / or grit blasting, fine particles 635 are removed from the consumable part 210'. Specifically, the blast media collides and / or impacts the plasma-facing surface 310, removing portions of the consumable part 210' (e.g., material) as fine particles 635. For example, regions 630A and 630B are removed from the consumable part 210' on the surface facing the raised feature 440A. In one embodiment, regions 630A and 630B are joined together to surround the raised feature 440A. The fine particles 635 may also include blast media 629.

[0096] The highlight 690 on the outer edge of the raised feature 440A indicates that the material is undercutting from the consumable part 210' beneath the closure 610 of the stencil 610. Specifically, as the blast media removes material from the plasma-facing surface 310 of the consumable part 210' beneath the closure 610A, in one embodiment, the highlight 690 indicates the formation of rounded corners on the outer edge of the upper region of the raised feature 440A.

[0097] Figure 6B-2 shows, according to one embodiment of the present disclosure, that the plasma-facing surface 310 of a consumable part 210' is grit-blasted or bead-blasted at multiple angles to construct an engineering surface 300' having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. Specifically, macroscopic features (e.g., raised features) are patterned on the plasma-facing surface 310 (e.g., the surface) of the consumable part 210' to facilitate adhesion of coatings and / or by-products.

[0098] As shown in Figure 6B-2, the stencil 610' is positioned against the plasma-facing side 310 of the consumable part 210' during bead and / or grid media blasting. The stencil 610' includes an opening 610B', which, when blasted from the buster nozzle 620, allows the blast media 629 to reach the plasma-facing surface 310 through the opening 610B'. The stencil 610' includes a closure 610A', which restricts the blast media 629 from passing through and reaching the plasma-facing surface 310 of the consumable part 210'. Each of the closures 610A includes at least one angled side 605. For example, the corresponding closures 610A may include angled side 605A and 605B.

[0099] As described above, the blaster nozzle 620 may move toward the stencil in predetermined or random patterns in predetermined movements 625A and / or 625B, etc. During bead blasting and / or grit blasting, particulate matter 635 is removed from the consumable part 210'. Specifically, the blast media collides and / or impacts the plasma-facing surface 310, removing portions of the consumable part 210' (e.g., material) as particulate matter 635. For example, regions 630A' and 630B' are removed from the consumable part 210' on the surface facing the raised feature 440A'. In one embodiment, regions 630A' and 630B' are joined together to surround the raised feature 440A'. The particulate matter 635 may include blast media 629.

[0100] For example, in one pass, the blaster nozzle 620 may move in one direction, and in another pass, the blaster nozzle 620 may move in the opposite direction. In another embodiment, the blaster nozzle 620 follows a predetermined movement 625A in a pattern with the nozzle at a first angle to the plasma-facing surface 310. Specifically, in one embodiment, the delivery of the blast media 629 at the first angle is aligned with the angled side surface 605A of the corresponding occlusion 610A. The blast media 629 undercuts the corresponding occlusion 610A, allowing the rounded corner of the outer edge of the upper region of the corresponding raised feature 440A to be formed. In another embodiment, the blaster nozzle 620 follows a predetermined movement 625B in a pattern with the nozzle at a second angle to the plasma-facing surface 310. Specifically, in one embodiment, the delivery of the blast media 629 at the second angle is aligned with the angled side surface 605B of the corresponding occlusion 610A. The blast media 629 undercuts the corresponding closure 610A, allowing for the formation of rounded corners on the outer edge of the upper region of the corresponding raised feature 440A.

[0101] Figure 6C shows an engineered surface 300' of a consumable part after grit blasting or bead blasting, as shown in Figures 6A, 6B-1 and / or 6B-2, according to one embodiment of the present disclosure, the engineered surface 300' includes a macroscopic texture in the form of a plurality of raised features 440A' (including raised features 440A) designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0102] Specifically, after macroscopic features are generated on the plasma-facing surface 310 of the consumable part 210', the stencil 610 is removed from the plasma-facing surface 310 to expose a plurality of raised features defining the engineering surface 300'. Specifically, the macroscopic features may be represented by the raised features 440A described above in relation to Figures 4A-4B. For example, the raised feature 440A includes an upper region 470 which may have an outer edge and a side wall which extends upward at an angle from the base surface 350' of the engineering surface 300'. Empty regions 630A and 630B may be joined so as to surround the raised region 440A. As shown in Figure 6C, in one embodiment, the outer edge 460 of the raised feature 440A is rounded. Each of the raised features may have a predetermined edge finish relative to its corresponding outer edge, as described above. In one embodiment, the edge finish may include rounded corners on the outer edge of a raised feature such as 440A. In another embodiment, the edge finish may include sharp corners on the outer edge.

[0103] In one embodiment, after macroscopic features are generated, the stencil is removed and the entire engineering surface 300' is subjected to grit blasting and / or bead blasting to optionally generate microscopic roughness. Subsequently, the engineering surface 300' of the consumable part 210' undergoes anodizing and top coating (e.g., plasma-resistant spray coating) finishing. The plasma-resistant spray coating may be applied via plasma spraying, thermal spraying, CVD, or other available techniques.

[0104] Figure 7A shows a consumable part 210-1 including an engineered surface 300-1 that is anodized (e.g., an anodized layer 220-1) and covered with a plasma-resistant thermal spray coating 230-1, according to one embodiment of the present disclosure, wherein the consumable part 210-1 does not conform to the engineered surface 300-1, which has a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0105] Specifically, multiple raised features 440-1 are formed on the plasma-facing surface 310-1 of the consumable part 210-1. The multiple raised features 440-1 define the engineering surface 300-1. The multiple raised features 440-1 may also be further blasted with a grid and / or bead medium to optionally form a microscopic texture. The engineering surface 300-1 is anodized to form an anodized layer 220-1. A plasma-resistant thermal spray coating 230-1 is also formed on the anodized layer 220-1.

[0106] Each of the multiple raised features 440-1 has an approximate height "h1". The height "h1" can define the contours of the multiple raised features 440-1. As shown in the figure, the surface 705-1 of the anodized layer 220-1 closely follows and / or conforms to the contours of the multiple raised features 240-1. Because the contours of the multiple raised features 440-1 are exposed through the anodized layer 220-1, the adhesion of the plasma-resistant thermal spray coating 230-1 to the anodized layer 220-1 is enhanced.

[0107] Furthermore, height "h1" is a specific dimension such that the surface 710 of the plasma-resistant spray coating 230-1 does not trace and / or conform to the contours of the multiple raised features 440-1. That is, height "h1" is a smaller dimension such that the spray coating 230-1 (generally 2 to 3 times the thickness of the anodized layer 220-1) fills the peaks and valleys of the contours of the multiple raised features 440-1 and spreads over the multiple raised features 440-1 so that the surface 710 is relatively flat.

[0108] Figure 7B shows a consumable part 210-2 including an engineering surface 300-2 that is anodized (e.g., an anodized layer 220-2) and covered with a plasma-resistant spray coating 230-2 according to one embodiment of the present disclosure, wherein the plasma-resistant spray coating 230-2 conforms to the engineering surface having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of additional layers and / or by-products.

[0109] Specifically, multiple raised features 440-2 are formed on the plasma-facing surface 310-2 of the consumable part 210-2. The multiple raised features 440-2 define the engineering surface 300-2. The multiple raised features 440-2 may also be further blasted with a grid and / or bead medium to optionally form a microscopic texture. The engineering surface 300-2 is anodized to form an anodized layer 420-2. A plasma-resistant spray coating 230-2 is also formed on the anodized layer 220-2. The surface 720 of the plasma-resistant spray coating 230-2 is exposed to plasma in a plasma processing system.

[0110] Each of the multiple raised features 440-2 has an approximate height "h2". The height "h2" may define the contour of the multiple raised features 440-2. As shown in the figure, the surface 705-2 of the anodized layer 220-2 closely follows and / or conforms to the contours of the multiple raised features 440-2. Because the contours of the multiple raised features 440-2 are exposed through the anodized layer 220-2, the adhesion of the plasma-resistant thermal spray coating 230-2 to the anodized layer 220-2 is enhanced.

[0111] Furthermore, height "h2" is a specific dimension such that the surface 720 of the plasma-resistant spray coating 230-2 traces and / or conforms to the contours of the multiple raised features 440-2. That is, height "h2" is a larger dimension (for example, height "h2" is greater than height "h1") such that the spray coating 230-2 traces the peaks and valleys of the contours of the multiple raised features 440-2. As shown in the figure, the surface 720 is not relatively flat and conforms to the contours of the multiple raised features 440-2.

[0112] Figure 8A shows a stencil 800A and several exemplary openings configured to direct media for a grit blast or bead blast process to construct an engineering surface having a macroscopic texture in the form of raised features designed to generate additional bonding sites for better adhesion of an additional layer, according to one embodiment of the present disclosure. Different types of openings may have different effects when forming raised features corresponding to the plasma-facing surfaces of the corresponding consumable parts. For example, the shape of the openings may include, but are not limited to, an elliptical opening 801 (e.g., a circle), a polyhedral polygonal opening 802 (e.g., octagonal), a square or rectangular opening 803, a triangular opening, a symmetrical shape, an asymmetrical shape, and the like. Although the openings of the stencil are shown as circular throughout this application, the openings can be of any type and shape.

[0113] Figure 8B shows a stencil 800B having multiple openings arranged in a pattern 810 according to one embodiment of the present disclosure. The patterned stencil 800B is configured to identify and direct the media for a grid blast or bead blast process onto the plasma-facing surface of a consumable part in order to construct an engineering surface. Specifically, the engineering surface has a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of the additional layer. In one embodiment, the openings of the pattern 810 are uniformly repeated throughout the stencil, as shown in Figure 8B. Furthermore, the shape and size of the openings are selectable as described above. The density of the openings is also selectable.

[0114] In yet another embodiment, the 800B stencil, used for illustrative purposes only, may be inverted to form a plurality of recessed features defining the engineering surface. For example, the inverted stencil or mask may be used in conjunction with media blasting (e.g., grid blasting, bead blasting, etc.) to form a plurality of recessed features, which may be voids in the engineering surface (i.e., on the opposite side of solid raised features). In yet another embodiment, the inverted stencil or mask may be used in conjunction with chemical etching to form a plurality of recessed features.

[0115] Figure 8C shows a stencil 800C for directing media for a grid blast or bead blast process onto a plasma-facing surface of a consumable part to construct an engineering surface having a patterned macroscopic texture, which has multiple openings arranged in a two-zone pattern and is designed to generate additional bonding sites for better adhesion of an additional layer. Specifically, the stencil 800C includes a defined pattern 820 which includes a first zone 820A and a second zone 820B, with a line 825 separating the two zones.

[0116] The openings in the two zones are shown to be circular or elliptical, but they can be any shape. Furthermore, the opening in the first zone 820A may be of the first type (e.g., a circle), and the opening in the second zone 820B may be of the second type (e.g., a square). Also, the sizes of the openings in the first zone 820A and the second zone 820B are uniform, but the size of the opening in the first zone 820A may be of the first size, and the size of the opening in the second zone 820B may be of the second size. The size and shape of the openings can control the size and shape of the resulting macroscopic features, respectively.

[0117] The first zone 820A contains a first set of raised features arranged in a first subpattern. The second zone 820B contains a second set of raised features arranged in a second subpattern. The subpatterns of the first zone 820A and the second zone 820B may closely resemble each other or may differ from each other. As shown in Figure 8C, the first subpattern of the first zone 820A is similar to the subpattern of the second zone 820B, and both are designed to follow uniform displacement between openings (e.g., lateral, vertical, and / or diagonal displacement). However, the density of openings in the two zones differs. Specifically, the density of openings in the first zone 820A is lower than the density of openings in the second zone 820B.

[0118] Figure 8D shows a stencil 800D for directing media for a grit blast or bead blasting process onto a plasma-facing surface of a consumable part to construct an engineering surface having a patterned macroscopic texture, having multiple openings arranged in a three-zone pattern and designed to generate additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. Specifically, the stencil 800D includes a defined pattern 830 comprising a first zone 830A, a second zone 830B, and a third zone 830C. Line 831 separates the first zone 830A from the second zone 830B, and line 832 separates the second zone 830B from the third zone 830C.

[0119] The openings of the three zones are shown to be circular or elliptical, but they can be any shape. Furthermore, the opening of the first zone 830A may be of the first type (e.g., a circle), the opening of the second zone 830B may be of the second type (e.g., a square), and the opening of the third zone 830C may be of the first or second type, or a third type (e.g., a triangle). Also, while the sizes of the openings of the three zones are shown to be uniform, the opening of the first zone 830A may be of the first size, the opening of the second zone 830B may be of the second size, and the opening of the third zone 830C may be of the third size. In other words, the sizes of the openings of each of the three zones may be the same or different. The size and shape of the openings can, respectively, control the size and shape of the resulting macroscopic features.

[0120] The first zone 830A contains a first set of raised features arranged in a first subpattern. The second zone 830B contains a second set of raised features arranged in a second subpattern. The third zone 830C contains a third set of raised features arranged in a third subpattern. The subpatterns of the three zones may closely resemble each other or may differ from each other. As shown in the figure, the subpatterns of each of the three zones are similar to each other and follow uniform displacements between openings (e.g., lateral, vertical, and / or diagonal displacements). However, the density of openings in the three zones differs. Specifically, the density of openings in the first zone 830A is the highest among the three zones, and the density of openings in the third zone 830C is the lowest among the three zones. Furthermore, the density of openings in the second zone is lower than the density of openings in the first zone 830A, but higher than the density of openings in the third zone 830C.

[0121] Figure 8E shows a stencil 800E directed over a plasma-facing surface of a consumable part to construct an engineering surface having a patterned macroscopic texture, which has multiple openings arranged in a linear-scale pattern and is designed to generate additional bonding sites for better adhesion of additional layers, according to one embodiment of the present disclosure. Specifically, plot 850 shows the density of openings in the stencil 800E as it moves across the stencil in a particular direction. For example, plot 850 includes a vertical axis 851 showing the density of openings in the stencil 800E and a horizontal axis 852 showing the distance across the stencil 800E in a particular direction. Following plot 850, the density of openings is highest on the left side of the stencil 800E. As the stencil 800E is moved from left to right, the density decreases linearly until it reaches the right edge of the stencil 800E and the density of openings is minimized (e.g., zero).

[0122] The openings in stencil 800E are shown to be circular or elliptical, but can be any shape. Furthermore, the shape of the openings may vary across stencil 800E as well as in any of its subpatterns. Also, while the size of the openings is shown to be uniform across stencil 800E, the size of the openings may vary throughout. The size and shape of the openings can, respectively, control the size and shape of the resulting macroscopic features.

[0123] Figures 9A-1, 9A-2, 9B-1, 9B-2, 9C-1, 9C-2, 9D, and 9E show different configurations and patterns of raised features placed across the corresponding engineering surface and are provided for illustrative and clarification purposes only. Features may be formed across the engineering surface in customized patterns, and the features are formed according to selectable parameters such as size, shape, and density of raised features.

[0124] Figure 9A-1 shows a plurality of raised features uniformly distributed across the entire corresponding engineering surface in pattern 910, according to one embodiment of the present disclosure. The raised features defining the engineering surface include a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. As previously stated, the structure and height of the features are configured to be uniform in order to construct a conformal plasma-resistant spray coating (not shown). That is, the spray coating has a contour that similarly conforms to the contour of the engineering surface. For example, the height of the macroscopically raised features in pattern 910 and the separation between the raised features allow the top surface of the spray coating to conform approximately to the contour of the engineering surface in pattern 910.

[0125] Figure 9A-2 shows a plurality of raised features uniformly arranged at a lower density than the features in Figure 9A-1, according to one embodiment of the present disclosure. The features in Figure 9A-2 are uniformly arranged across the corresponding engineering surface in pattern 920. The structure and height of the features in Figure 9A-2 are configured similarly to the features in Figure 9A-1 and are configured to be uniform, as previously stated, for constructing a conformal plasma-resistant thermal spray coating. However, the density of features in pattern 920 in Figure 9A-2 is lower than the density of features in pattern 910 in Figure 9A-1, to demonstrate that density is selectable. Furthermore, the size and shape of the features in patterns 910 and 920, respectively, are selectable.

[0126] Figure 9B-1 shows a plurality of raised features uniformly arranged in pattern 930 according to one embodiment of the present disclosure. The structure and height of the features in pattern 930 are uniform. Specifically, the height of the features in pattern 930 is smaller than the height of the features in pattern 910 in Figure 9A-1. The structure and height of the features in pattern 930 are configured to be uniform, as described above, in order to construct a relatively flat, non-conformal, plasma-resistant spray coating. That is, the spray coating has a contour that does not conform to the contour of the engineering surface. The raised features define an engineering surface with a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of the additional layer. For example, the height of the macroscopic raised features in pattern 930 and the separation between the raised features may prevent the top surface of the spray coating from conforming nearly to the contour of the engineering surface of pattern 930.

[0127] Figure 9B-2 shows a plurality of raised features uniformly arranged at a lower density than the features in Figure 9B-1, according to one embodiment of the present disclosure. The features in Figure 9B-2 are uniformly arranged across the corresponding engineering surface in pattern 940. The structure and height of the features in Figure 9B-2 are configured similarly to the features in Figure 9B-1 and are configured to be uniform, as previously stated, for constructing a non-conformal plasma-resistant thermal spray coating. The density of features in pattern 940 in Figure 9B-2 is lower than the density of features in pattern 930 in Figure 9B-1 to demonstrate that density is selectable. The size and shape of the features in patterns 930 and 940, respectively, are also selectable.

[0128] Figure 9C-1 shows a plurality of raised features arranged in pattern 950, further including two subpatterns 950A and 950B, according to one embodiment of the present disclosure. The raised features in the two subpatterns 950A and 950B define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. The structure and height of the features throughout each of the two subpatterns 950A and 950B are uniform, as described above, to construct a conformal plasma-resistant spray coating (not shown). That is, the spray coating has a contour that matches as well as the contour of the engineering surface. For example, the height of the macroscopic raised features in pattern 910 and the separation between the raised features allow the top surface of the spray coating to conform approximately to the contour of the engineering surface of pattern 910. Although the features are shown to be uniform throughout each of the two subpatterns 950A and 950B, the feature density in subpattern 950B (to the right) is lower than the feature density in subpattern 950A (to the left), indicating that the density of raised features in each of the subpatterns 950A and 950B is selectable. Furthermore, although the features are shown to be uniform throughout each of the two subpatterns 950A and 950B, the features may have different configurations, as further shown in Figure 9C-2.

[0129] Figure 9C-2 shows a plurality of raised features arranged in two subpatterns 960A and 960B according to one embodiment of the present disclosure, wherein the structure and height of the features in each subpattern are uniform, but may differ between the two subpatterns. The raised features in the two subpatterns 960A and 960B define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. The features across each of the two subpatterns 960A and 960B have different configurations. Specifically, the structure and height of the features in subpattern 960A are uniform, as described above, to construct a conformal plasma-resistant thermal spray coating (not shown). For example, the height of the macroscopic raised features in subpattern 960A and the separation of the raised features allow the top surface of the thermal spray coating to conform similarly and / or nearly conform to the contour of the engineering surface in subpattern 960A. On the other hand, the structure and height of the features in subpattern 960B are uniform, as described above, in order to construct a non-conformal plasma-resistant thermal spray coating. For example, the height of the macroscopic raised features in subpattern 960B and the separation between the raised features may prevent the top surface of the thermal spray coating from conforming similarly and / or nearly conforming to the contour of the engineering surface in subpattern 960B. That is, the top surface of the thermal spray coating has a contour that does not conform to the raised features in subpattern 960B. Thus, the thermal spray coating may have different contours depending on the subpattern of the raised features in the underlying layer. Although the features are shown to have the same density throughout both subpatterns 960A and 960B, the density of features may vary between the two subpatterns 960A and 960B, and the density of raised features in each of subpatterns 960A and 960B is selectable. For example, the feature density in subpattern 960B (to the right) may be less than the feature density in subpattern 960A (to the left), and vice versa.

[0130] Figure 9D shows a plurality of raised features arranged in three subpatterns (970A, 970B, and 970C) according to one embodiment of the present disclosure, where the structure and height of the features are uniform across the subpatterns. The raised features in the three subpatterns 970A, 970B, and 970C define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. The features across each of the three subpatterns may have the same configuration. For example, the structure and height of the features in the three subpatterns may be uniform to construct conformal or non-conformal plasma-resistant spray coatings (not shown), as described above. For example, the height of the macroscopic raised features in the three subpatterns and the separation between the raised features allow the top surface of the spray coating to conform similarly and / or nearly conform to the contour of the engineering surface, depending on the subpatterns in the underlying layers. Alternatively, the height of macroscopic raised features and the separation of raised features in the three subpatterns may prevent the top surface of the thermal spray coating from conforming similarly and / or nearly to the contour of the engineering surface. While the features are shown to be uniform across each of the three subpatterns, in other embodiments, the feature configuration (e.g., size and shape) in one subpattern may differ from the feature configuration in another subpattern, depending on the underlying subpattern. More specifically, the feature densities in each of the subpatterns 970A, 970B, and 970C have different densities. Specifically, the feature density is highest in subpattern 970A and lowest in subpattern 970C. Also, the feature density in subpattern 970B is higher than that in subpattern 970C and lower than that in subpattern 970A.

[0131] Figure 9E shows a plurality of raised features arranged in a linearly scaled pattern 980, according to one embodiment of the present disclosure, such that the feature density increases linearly. The raised features define an engineering surface having a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products. For illustrative purposes only, the features in pattern 980 may be formed using stencil 800E in Figure 8E. Specifically, features across the entire engineering surface may have the same configuration. For example, the structure and height of the features in pattern 980 may be uniform to construct conformal or non-conformal plasma-resistant spray coatings (not shown), as previously described. While the features are shown to be uniform across the entire engineering surface, in other embodiments, the configuration of the features (e.g., size and shape) may vary across the engineering surface. Plot 990 shows the density of raised features in pattern 980. For example, plot 990 includes a vertical axis 991 showing the density of raised features (e.g., small clumps) and a horizontal axis 992 showing the distance across the entire engineering surface in a particular direction. According to plot 990, the density of raised features is highest on the left side of pattern 980 in a particular direction. As we move towards pattern 980, which represents the engineering surface, along the particular direction, the density of raised features decreases linearly until the density of raised openings reaches a minimum (e.g., zero) on the right side of pattern 980.

[0132] Figure 10 illustrates a process of applying different stencils to the plasma-facing surface 310 of a consumable part 210' to generate the described configuration (e.g., rounded edges) in a plurality of raised features arranged in a pattern, according to one embodiment of the present disclosure. For example, bead blasting and / or grid blasting using corresponding blast media is performed in two passes. In the first pass, bead blasting and / or grid blasting is performed using stencil 1 with the first blast media. The bead and / or grid blasting may move toward stencil 1 (1010) at one or more predetermined angles (e.g., the angle of the blaster nozzle) according to a predetermined pattern. In the second pass, bead blasting and / or grid blasting is performed using stencil 2 (1020) with the second blast media. The first and second blast media may be the same or different. The bead and / or grid blast may move toward stencil 2 at one or more predetermined angles (e.g., the angle of the blaster nozzle) according to a predetermined pattern. By using different stencils 1 and 2, desired edges may be promoted on raised features defining the engineering surface. For example, the opening of stencil 2 may be larger than the opening of stencil 1, but the patterns of both openings follow substantially the same pattern. In this way, during the second pass, the blast media may reach additional areas of the plasma-facing surface 310 of the consumable part 210' to generate rounded corners on the outer edges of the upper regions of multiple raised features that are formed on the engineering surface and defining the engineering surface, as shown in Figures 4A-4B.

[0133] Figure 11 is an electron microscope image of a cross-section of a consumable part 210-3, which includes an engineering surface that is anodized (anodic oxide layer 220-3) and covered with a plasma-resistant thermal spray coating 230-3, according to one embodiment of the present disclosure. The engineering surface includes a patterned macroscopic texture designed to generate additional bonding sites for better adhesion of additional layers and / or by-products, according to one embodiment of the present disclosure.

[0134] The above descriptions of embodiments have been provided for illustrative and explanatory purposes only. They are not intended to be comprehensive or to limit the disclosure. Individual elements or features of a specific embodiment are generally interchangeable and can be used in selected embodiments, even if not specifically shown or described, but are not limited to that specific embodiment. The same elements or features can also be modified in various ways. Such modifications should not be considered deviations from the disclosure, and all such modifications are intended to be within the scope of the disclosure.

[0135] For the purpose of clarifying understanding, the embodiments described above have been explained in some detail, but it will be clear that some modifications and variations can be made within the scope of the attached claims. Therefore, these embodiments should be considered illustrative and not restrictive, and these embodiments are not limited to the details given herein, but may be modified within the scope of their scope and equivalents of the claims. This disclosure can also be realized through the following application examples. [Application Example 1] Consumable parts for plasma processing chambers, The plasma-facing surface of the aforementioned consumable part, The engineering surface formed on the plasma-facing surface of the consumable part, A plurality of raised features defining the engineering surface, wherein the features of the plurality of raised features are arranged in a predetermined pattern, and each of the plurality of raised features includes a plurality of raised features including an upper region having an outer edge and side walls. A base surface of the engineering surface surrounding each of the plurality of raised features, wherein the corresponding side wall of the corresponding raised feature extends upward from the base surface toward the corresponding upper region at a certain angle; Equipped with, The aforementioned consumable parts are configured to be installed in the plasma processing chamber, The consumable parts are configured to be exposed to the plasma and its by-products. Consumable parts. [Application Example 2] The consumable parts described in Application Example 1, The aforementioned angle is in the range of approximately 15 degrees to approximately 60 degrees, and is a consumable part. [Application Example 3] The consumable parts described in Application Example 1, A consumable part in which the features of the aforementioned multiple raised features are macroscopic, with the height of the corresponding raised feature ranging from approximately 0.2 mm to approximately 3 mm relative to the base surface. [Application Example 4] The consumable parts described in Application Example 1, An anodized layer formed on the aforementioned engineering surface, A thermal spray coating formed on the anodized layer and Furthermore, The plurality of raised features are consumable parts configured to enhance the adhesion of the thermal spray coating to the anodized layer. [Application Example 5] Consumable parts as described in Application Example 1, The aforementioned consumable parts are A liner configured to protect the inner wall of the plasma processing chamber, or One or more C-shroud sections, or One or more plasma confinement ring portions, or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system, or Upper electrode, or Dielectric window for inductively coupled plasma, or Lower electrode A consumable part that contains one of the following. [Application Example 6] Consumable parts as described in Application Example 1, Multiple microscopic features arbitrarily formed on the aforementioned multiple raised features Consumable parts that further enhance the functionality. [Application Example 7] Consumable parts as described in Application Example 1, The defined pattern includes a first zone and a second zone, The first zone includes a first set of raised features arranged in the first subpattern, The second zone is a consumable part, comprising a second set of raised features arranged in the second subpattern. [Application Example 8] The method described in Application Example 1, The method wherein the plasma-facing surface of the consumable part is made of a conductive material or a dielectric material. [Application Example 9] A method for constructing an engineered surface of a consumable part configured to be installed in a plasma processing chamber, Masking the plasma-facing surface of the consumable part using a stencil, wherein the stencil includes a pattern of openings that allow access to the plasma-facing surface, The process involves identifying and blasting the plasma-facing surface with blast media via the stencil to generate a plurality of raised features that define the engineering surface, wherein the engineering surface is formed on the plasma-facing surface. Includes, The features of the plurality of raised features are arranged in a predetermined pattern on the engineering surface. Each of the aforementioned raised features includes an upper region having an outer edge and side walls, The base surface of the engineering surface surrounds the plurality of raised features, such that the corresponding side walls of the corresponding raised features extend upward at an angle from the base surface to the corresponding upper region. A method wherein the consumable parts are exposed to plasma or by-products of the plasma. [Application Example 10] The method described in Application Example 9, The angle is in the range of approximately 15 degrees to approximately 60 degrees. [Application Example 11] The method described in Application Example 9, The features of the aforementioned multiple raised features are macroscopic, with the height of the corresponding raised feature ranging from approximately 0.2 mm to approximately 3 mm relative to the base surface. method. [Application Example 12] The method described in Application Example 9, The aforementioned consumable parts are A liner configured to protect the inner wall of the plasma processing chamber, or One or more C-shroud sections, or One or more plasma confinement ring portions, or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system, or Upper electrode, or Dielectric window for inductively coupled plasma, or Lower electrode A method that includes one of the following. [Application Example 13] The method described in Application Example 9, The process involves identifying the plasma-facing surface via the stencil and blasting it, Bead blasting the plasma-facing surface, or The plasma-facing surface is subjected to grid blasting. Includes, A method wherein the blast media is made of the same type of material as the plasma-facing surface of the consumable part. [Application Example 14] The method described in Application Example 9, The stencil includes a first zone and a second zone, The first zone includes a first subpattern of the opening, The method wherein the second zone includes a second subpattern of the opening. [Application Example 15] The method described in Application Example 9, The process involves identifying the plasma-facing surface via the stencil and blasting it, The plasma-facing surface is blasted at a first angle using the blast media via the stencil, The plasma-facing surface is blasted at a second angle using the blast media via the stencil. Methods that include... [Application Example 16] The method described in Application Example 9, Removing the aforementioned stencil, The plasma-facing surface is arbitrarily blasted with a second blast medium to roughen the multiple raised features with microscopic features. Methods that further include this. [Application Example 17] The method described in Application Example 9, The aforementioned engineering surface is anodized to produce an anodized layer, The process involves applying a thermal spray coating to the anodized layer, At least some of the aforementioned multiple raised features protrude through the anodized layer, thereby improving the adhesion of the thermal spray coating to the anodized layer. Methods that further include this. [Application Example 18] A plasma processing chamber for processing wafers, A lower electrode configured to support the wafer, An upper electrode located above the lower electrode, Consumable parts, The plasma-facing surface of the aforementioned consumable part, A consumable part including an engineered surface formed on the plasma-facing surface of the consumable part, A plurality of raised features defining the engineering surface, The features of the plurality of raised features are arranged in a predetermined pattern, and each of the plurality of raised features includes a plurality of raised features including an upper region having an outer edge and side walls, A base surface of the engineering surface surrounding each of the plurality of raised features, wherein the corresponding side wall of the corresponding raised feature extends upward from the base surface toward the corresponding upper region at a certain angle; Includes, The aforementioned consumable parts are configured to be installed within the plasma processing chamber. The consumable parts are configured to be exposed to the plasma and its by-products. Plasma processing chamber. [Application Example 19] A plasma processing chamber as described in Application Example 17, The aforementioned consumable parts are A liner configured to protect the inner wall of the plasma processing chamber, or One or more C-shroud sections, or One or more plasma confinement ring portions, or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system, or Upper electrode, or Dielectric window for inductively coupled plasma, or Lower electrode A plasma processing chamber equipped with one of the following. [Application Example 20] Consumable parts as described in Application Example 17, The aforementioned angle is in the range of approximately 15 degrees to approximately 60 degrees. The features of the aforementioned multiple raised features are macroscopic, with the height of the corresponding raised feature ranging from approximately 0.2 mm to approximately 3 mm relative to the base surface. Multiple microscopic features are arbitrarily formed on the multiple raised features, The plasma-facing surface of the consumable part is made of a conductive material or a dielectric material. Consumable parts, including the following.

Claims

1. A method for constructing an engineered surface of a consumable part configured to be installed in a plasma processing chamber, The method involves masking the plasma-facing surface of the consumable part using a stencil, wherein the stencil includes a pattern of openings that allow access to the plasma-facing surface. The process involves identifying and blasting the plasma-facing surface with blast media via the stencil to generate a plurality of raised features defining the engineering surface, wherein the engineering surface is formed on the plasma-facing surface. Forming a non-conformal coating on the aforementioned multiple raised features Includes, The features of the plurality of raised features are arranged in a predetermined pattern on the engineering surface. Each of the aforementioned raised features includes an upper region having an outer edge and side walls, The base surface of the engineering surface surrounds the plurality of raised features, such that the corresponding side walls of the corresponding raised features extend upward at an angle from the base surface to the corresponding upper region. A method wherein the consumable parts are exposed to plasma or by-products of the plasma.

2. The method according to claim 1, The features of the aforementioned multiple raised features are macroscopic, with the height of the corresponding raised feature ranging from approximately 0.2 mm to approximately 3 mm relative to the base surface. method.

3. The method according to claim 1, The aforementioned consumable parts are A liner configured to protect the inner wall of the plasma processing chamber, or One or more C-shroud sections, or One or more plasma confinement ring portions, or Focus ring, or Edge ring, or Electrostatic semiconductor wafer clamping / chucking system, or Upper electrode, or Dielectric window for inductively coupled plasma, or Lower electrode A method that includes one of the following.

4. The method according to claim 1, The process involves identifying the plasma-facing surface via the stencil and blasting it, Bead blasting the plasma-facing surface, or The plasma-facing surface is subjected to grid blasting. Includes, A method wherein the blast media is made of the same type of material as the plasma-facing surface of the consumable part.

5. The method according to claim 1, The stencil includes a first zone and a second zone, The first zone includes a first subpattern of the opening, The method wherein the second zone includes a second subpattern of the opening.

6. The method according to claim 1, The process involves identifying the plasma-facing surface via the stencil and blasting it, The plasma-facing surface is blasted at a first angle using the blast media via the stencil, The plasma-facing surface is blasted at a second angle using the blast media via the stencil. Methods that include...

7. The method according to claim 1, Removing the aforementioned stencil, The plasma-facing surface is blasted with a second blast medium to roughen the multiple raised features with microscopic features. Methods that further include this.

8. A method for constructing an engineered surface of a consumable part configured to be installed in a plasma processing chamber, The method involves masking the plasma-facing surface of the consumable part using a stencil, wherein the stencil includes a pattern of openings that allow access to the plasma-facing surface. The process involves identifying and blasting the plasma-facing surface with blast media via the stencil to generate a plurality of raised features defining the engineering surface, wherein the engineering surface is formed on the plasma-facing surface. The aforementioned engineering surface is anodized to produce an anodized layer, Applying a thermal spray coating to the anodized layer Includes, The features of the plurality of raised features are arranged in a predetermined pattern on the engineering surface. Each of the aforementioned raised features includes an upper region having an outer edge and side walls, The base surface of the engineering surface surrounds the plurality of raised features, such that the corresponding side walls of the corresponding raised features extend upward at an angle from the base surface to the corresponding upper region. The consumable parts are exposed to plasma or by-products of the plasma, At least some of the aforementioned raised features protrude through the anodized layer, thereby improving the adhesion of the thermal spray coating to the anodized layer. method.

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