Air conditioning controller and circuit board holding structure

Abstract

To suppress generation of noise caused by vibration of a substrate in a simple structure.SOLUTION: An air conditioning controller 12, which controls an air conditioner, comprises: a housing 22 which constitutes a contour of the air conditioning controller 12; and a substrate 23 and a speaker 25 built in the housing 22. The housing 22 is configured by combining a base 41 and a cover 51 in a longitudinal direction and a holding section 45, which is capable of holding the substrate 23 in a standing state, is provided in a lower part of the base 41. The holding section 45 includes: a bottom plate part 43 of the base 41; a front-side abutment part 46 formed in the bottom plate part 43 and abutted to an element mounting face 31 of the substrate 23; and a deep-side abutment part 47 similarly formed in the bottom plate part 43, positioned at both the sides of the front-side abutment part 46 in a view in a thickness direction of the substrate 23 and abutted to a rear face 32 of the substrate 23. The substrate 23 which is formed planar is held in a warped state by the holding section 45.SELECTED DRAWING: Figure 3

Description

[[Technical Field]]

[0001] The present invention relates to an air conditioning controller and a substrate holding structure. [[Background Art]]

[0002] For example, some air conditioning apparatuses include an air conditioning controller (terminal) on which a user performs operations such as changing a set temperature, and an air conditioner that performs air conditioning based on instructions from the terminal. Some terminals of this type are provided with a display that displays control information such as operation modes and set temperatures, and environmental information such as room temperature and humidity. In recent years, terminals that notify various kinds of information via a built-in speaker have been proposed. For example, Patent Document 1 discloses a configuration in which when the terminal determines that a situation is likely to cause heat stroke based on indoor temperature or the like, the fact is notified by a speaker built into the terminal. (see, for example, Patent Document 1) [[Prior Art Documents]] [[Patent Documents]]

[0003] [[Patent Document 1]] Japanese Unexamined Patent Application Publication No. 2012-207867 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0004] A substrate used for various types of control and the like is housed in the housing of the above-described terminal. Here, if a configuration is adopted in which the substrate is easily held by, for example, a claw portion formed on the housing, fixing tools such as screws can be eliminated or the number of fixing tools used can be reduced. This is preferable for improving workability when assembling the terminal and reducing the number of parts related to the terminal. However, in such a holding structure, rattling is more likely to occur in the substrate compared to a case where the substrate is completely fixed using a large number of fixing tools, due to the presence of gaps (including gaps caused by manufacturing errors and the like) generated between the substrate and peripheral components such as the claw portions.

[0005] In terminals with a built-in speaker and a circuit board that is simply held in place, the following may occur: When sound is output from the speaker, the speaker's vibrations are transmitted to the circuit board via the casing, causing the circuit board to vibrate. This vibration can then cause the circuit board to collide with its surrounding components, resulting in the generation of abnormal noises in the terminal. Such abnormal noises from the terminal, especially when sound is being output from the speaker, are a cause for concern as they may cause discomfort or confusion to the user.

[0006] As mentioned above, one of the causes of such abnormal noises is the gap between the circuit board and its surrounding components. Therefore, it is possible to eliminate these noises by adding cushioning material such as nonwoven fabric between the circuit board and the surrounding components. However, such measures would diminish the benefits of improved workability and reduced component count that come from easily holding the circuit board.

[0007] This invention has been made in view of the problems exemplified above, and its main purpose is to suppress the generation of abnormal noise caused by vibration of the substrate with a simple structure. [Means for solving the problem]

[0008] The following describes the means to solve the above problems.

[0009] The first means: An air conditioning controller (air conditioning controller 12) comprising a housing (housing 22) containing a circuit board (circuit board 23), capable of controlling an air conditioner (air conditioner 11) based on user operation, The housing is provided with a holding portion (holding portion 45) for holding the substrate, The holding portion is configured to hold the flat substrate in a curved state.

[0010] By bending a flat circuit board, a force (elastic force) is generated in the board that tries to restore it to its original state. By holding the circuit board in a bent state within the housing's holding section, the held circuit board remains pressed against the contact point with the circuit board within the holding section due to this force. In other words, the gap between the circuit board and the contact point with the holding section can be eliminated. As a result, even if vibrations are transmitted to the circuit board from a vibration source such as a speaker built into the housing, the vibration of the circuit board can be suppressed. In addition, the friction generated between the circuit board and the holding section by pressing the circuit board against it suppresses displacement of the circuit board. Therefore, the opportunity for collision between the circuit board and other surrounding components other than the holding section can be reduced. For these reasons, the generation of abnormal noise caused by circuit board vibration can be suppressed. With this configuration, the circuit board can be properly fixed without using fasteners such as screws. This contributes to increased efficiency in the assembly of the air conditioning controller and a reduction in the number of parts.

[0011] A second means: An air conditioning controller (air conditioning controller 12) comprising a housing (housing 22) containing a circuit board (circuit board 23), which is capable of controlling an air conditioner (air conditioner 11) based on user operation, The housing is provided with a holding portion (holding portion 45) for holding the substrate, The aforementioned retaining part is A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. The distance between the first contact portion and the second contact portion in the thickness direction of the substrate is smaller than the thickness dimension of the substrate.

[0012] As shown in the present invention 2, in a configuration in which a substrate is sandwiched in its thickness direction between a first contact portion and second contact portions on both sides of it (for example, both left and right sides or both top and bottom sides), the first contact portion is positioned on the same side of the substrate that is in contact with the second contact portion with respect to a virtual straight line connecting the second contact portions, and the distance between the first contact portion and the second contact portion in the thickness direction of the substrate is made smaller than the thickness of the substrate, thereby enabling the flat substrate to be held in a curved state. As a result, even if vibration is transmitted to the substrate from a vibration source such as a speaker built into the housing, the vibration of the substrate can be suppressed. Therefore, the generation of abnormal noise caused by the vibration of the substrate can be suppressed.

[0013] Furthermore, the statement, "The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to the virtual straight line (virtual straight line FL1) connecting the two second contact portions," indicates that, for example, if we assume a configuration in which the substrate is in contact with the second contact portion from the front, the first contact portion is located in front of the virtual straight line (in front of the virtual straight line). In other words, when viewing the contact point between the substrate and the second contact portion from the front, the first contact portion is located in front of the virtual straight line.

[0014] A third means: A holding structure for a substrate (substrate 23) housed in a housing (housing 22), The housing is provided with a holding portion (holding portion 45) for holding the substrate, The holding part holds the flat substrate in a curved state.

[0015] By holding a flat circuit board in a curved position, vibrations transmitted to the board from a vibration source, such as a speaker built into the enclosure, can be suppressed. This reduces the generation of abnormal noises caused by circuit board vibrations. With this configuration, the circuit board can be properly secured without necessarily using fasteners such as screws. This contributes to improving the efficiency of the circuit board assembly process into the enclosure and reducing the number of parts involved in the assembly.

[0016] A fourth means: A holding structure for a substrate (substrate 23) housed in a housing (housing 22), The housing is provided with a holding portion (holding portion 45) for holding the substrate, The aforementioned retaining part is A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. The distance between the first contact portion and the second contact portion in the thickness direction of the substrate is smaller than the thickness dimension of the substrate.

[0017] As shown in this feature, in a configuration in which a substrate is sandwiched in its thickness direction between a first contact portion and second contact portions on both sides (for example, both left and right sides or both top and bottom sides), the first contact portion is positioned on the same side of the substrate as the side that the substrate is in contact with the second contact portion, with respect to a virtual straight line connecting the second contact portions, and the distance between the first and second contact portions in the thickness direction of the substrate is made smaller than the thickness of the substrate, thereby enabling the flat substrate to be held in a curved state. As a result, even if vibrations are transmitted to the substrate from a vibration source such as a speaker built into the housing, the vibration of the substrate can be suppressed, and the generation of abnormal noise caused by the vibration of the substrate can be suppressed. With such a configuration, the substrate can be properly fixed without using fasteners such as screws. This contributes to improving the efficiency of the substrate assembly work into the housing and reducing the number of parts involved in assembly.

[0018] It should be noted that the description that "the first contact portion is located on the same side (front side) as the side (front side) on which the substrate abuts against the second contact portion, with respect to an imaginary straight line (imaginary straight line FL1) connecting the two second contact portions" indicates that, for example, assuming a configuration in which the substrate abuts against the second contact portion from the front side, the first contact portion is located on the front side with respect to the imaginary straight line (on the front side of the imaginary straight line). In other words, when viewing the contact portion between the second contact portion and the substrate from the front, the first contact portion is located on the near side relative to the imaginary straight line. [BRIEF DESCRIPTION OF THE DRAWINGS]

[0019] [Figure 1] A block diagram showing the air conditioner according to the first embodiment. [Figure 2] A perspective view of the air conditioning controller viewed from the front side. [Figure 3] A longitudinal sectional view of the air conditioning controller. [Figure 4] A transverse partial sectional view of the air conditioning controller. [Figure 5] A schematic diagram showing a substrate and its peripheral configuration. [Figure 6] (a) A schematic diagram showing a comparative example of a substrate holding structure, (b) a schematic diagram showing the substrate holding structure according to the first embodiment. [Figure 7] (a) A schematic diagram showing a substrate holding structure according to the second embodiment, (b) a schematic diagram showing a modified example of the holding structure. [Figure 8] A schematic diagram showing a modified example of the holding structure. [Figure 9] A schematic diagram showing a modified example of the holding structure. [MODE FOR CARRYING OUT THE INVENTION]

[0020] <First Embodiment> Hereinafter, the first embodiment will be described with reference to the drawings. The present embodiment is embodied in an air conditioner applied to a building such as a house.

[0021] As shown in Figure 1, the air conditioning system 10 includes an air conditioner 11 (air conditioner) that has cooling, heating, and dehumidifying functions, and an air conditioning controller 12 which is a controller for the air conditioner 11. The air conditioning controller 12 can perform various operations on the air conditioner 11, such as switching the operating mode (cooling mode, heating mode, dehumidifying mode, fan mode), setting the temperature, and setting the airflow volume and direction. When a setting is changed by such an operation, the air conditioning controller 12 sends a command to the air conditioner 11 indicating this. The air conditioner 11 switches the operating mode, etc., based on the received command.

[0022] The air conditioning controller 12 comprises a touch panel display 21 and a housing 22 that houses the display 21 in an exposed manner, and is fixed to the wall W of the living room with the display 21 facing forward (see Figure 2).

[0023] Furthermore, the enclosure 22 houses a circuit board 23. The circuit board 23 is a so-called single-sided circuit board, and one side of the board (the side on which the elements are mounted) is equipped with a microcontroller 34 that performs the main control of the air conditioning controller 12, a graphic IC 36 that controls the display 21 based on commands from the microcontroller 34, a touch IC 54 that detects changes in current (changes in capacitance) at the point where the user's finger touches when the touch panel of the display 21 is operated and transmits the detected information to the microcontroller 34, an audio output circuit 37 that drives a speaker 25 built into the enclosure 22 based on commands from the microcontroller 34, a temperature and humidity sensor 57 that detects the temperature and humidity of the room, and a power supply circuit 39 that supplies power from an external power source to the microcontroller 34, etc.

[0024] The display 21 of the air conditioning controller 12 shows various information such as the current room temperature and humidity, operating mode, set temperature and humidity, as well as buttons for switching operating modes, setting temperature and humidity, and adjusting the volume. In this embodiment, the room temperature and humidity are monitored by the air conditioning controller 12, and if the air conditioning controller 12 determines that there is a high risk of heatstroke or other problems, a warning message is displayed on the display 21. This message is also output from the speaker 25, which helps to prevent the warning from being overlooked.

[0025] As described above, the air conditioning controller 12 has been made more multifunctional, and consequently, the number of components constituting the air conditioning controller 12 has also increased. Therefore, in order to reduce manufacturing costs and improve the efficiency of manufacturing work, the configuration related to the assembly of various components has been devised. In this embodiment, the holding structure of the circuit board 23 is particularly distinctive. Below, with reference to Figures 3 to 5, the basic structure of the housing 22 will be explained in detail, and then the holding structure will be described. Figure 3 is a cross-sectional view along line AA of Figure 2 (vertical cross-section), Figure 4 is a cross-sectional view along line BB of Figure 2 (horizontal cross-section), and Figure 5 is a schematic diagram showing the relationship between the circuit board 23 and the holding structure. Note that, for convenience, some components of the air conditioning controller 12 are omitted from the illustrations in the cross-sectional views of Figures 3 and 4.

[0026] As shown in Figure 3, the housing 22 consists of a box-shaped base 41 that is open at the front and a box-shaped cover 51 that is open at the rear, which are combined front to back. The speaker 25 described above is placed on the back plate portion 42 of the base 41, and multiple slits 55 are formed on the front portion 52 of the cover 51 that faces the speaker 25. Sound from the speaker 25 is output to the front side of the air conditioning controller 12 through the slits 55.

[0027] A circuit board 23 is positioned below the speaker 25. The circuit board 23 rests on the bottom plate 43 of the base 41 in an upright position, with its back surface 32 facing the back plate 42 of the base 41. The bottom plate 43 has a front contact portion 46 that rises from the bottom plate 43 and contacts the element mounting surface 31 of the circuit board 23, and a rear contact portion 47 that also rises from the bottom plate 43 and contacts the back surface 32 of the circuit board 23. In this embodiment, the front contact portion 46, the rear contact portion 47, and the bottom plate 43 constitute a holding portion 45 that holds the circuit board 23. The front contact portion 46 corresponds to the "first contact portion," and the rear contact portion 47 corresponds to the "second contact portion."

[0028] As shown in Figure 4, the front contact portion 46 is positioned in front of the rear contact portion 47, specifically in front of the virtual straight line FL1 that passes through the two rear contact portions 47 (more precisely, the contact points). In other words, in this embodiment, the substrate 23 contacts the rear contact portion 47 from the front, and the front contact portion 46 is also located in front of the virtual straight line FL1, that is, on the same side (front) as the side (front) where the substrate 23 contacts the rear contact portion 47. Another way to look at it is that when the contact points between the substrate 23 and the rear contact portion 47 are viewed from the front, the front contact portion 46 is located in front of the virtual straight line FL1.

[0029] Furthermore, the forward displacement of the substrate 23 is restricted by the front contact portion 46, and the backward displacement of the substrate 23 is restricted by the rear contact portion 47. The two rear contact portions 47 function as stoppers, ensuring a gap for heat dissipation between the substrate 23 and the rear plate portion 42.

[0030] Positioning ribs 48 are provided on both the left and right sides of the substrate 23 to define its left-right position. The positioning ribs 48 are planar in shape, facing the left and right ends of the substrate 23, and are connected to the back plate portion 42 and the bottom plate portion 43. The left and right ends of the substrate 23 are in contact with these positioning ribs 48, and the lateral displacement of the substrate 23 is restricted by these positioning ribs 48. Note that the positioning ribs 48 and the substrate 23 do not necessarily need to be in contact; a gap may be provided between them.

[0031] As shown in Figure 5, the substrate 23 has a horizontally elongated rectangular shape, and the front contact portion 46 and the rear contact portion 47 are positioned along its lower end (the lower long side). The front contact portion 46 is positioned to contact the central part of the lower end of the substrate 23, and when the substrate 23 is viewed in the thickness direction, the rear contact portions 47 are positioned on both the left and right sides of the front contact portion 46. In other words, when the substrate 23 is viewed in the thickness direction, the front contact portion 46 and the rear contact portion 47 are located on a virtual straight line FL2 extending from left to right. The left and right rear contact portions 47 are positioned near the left and right ends of the substrate 23, and the distance from the front contact portion 46 to each rear contact portion 47 is the same.

[0032] Here, the element mounting surface 31 of the substrate 23 is divided into a central area CE and an outer peripheral area OE surrounding the central area CE. Various electronic components (elements) such as the microcontroller 34 and solder are arranged in the central area CE, while the outer peripheral area OE is an area where elements and solder are not placed. The front contact portion 46 is located below the central area CE, and the object it contacts is the part corresponding to the outer peripheral area OE. The rear contact portion 47 is also located below the central area CE when viewed from the thickness direction of the substrate 23. When assembling the substrate 23, the substrate 23 is placed on the bottom plate portion 43 from above, but because the positional relationship of each contact portion 46, 47 is defined so that they are below the central area CE, contact between these contact portions 46, 47 and elements on the substrate 23 is suppressed.

[0033] As described in detail above, the substrate 23 shown in this embodiment is held by the contact portions 46, 47 and the bottom plate portion 43. By devising a way to easily assemble it to the housing 22 without using fasteners such as screws, the efficiency of the assembly work is improved.

[0034] Next, with reference to Figure 6, the relationship between the contact portions 46 and 47 and the planar substrate 23 will be explained in more detail. Figure 6(a) is a schematic diagram showing the proportional relationship.

[0035] In the proportional relationship shown in Figure 6(a), assuming that the distance dimension DX between the front contact portion 46X and the rear contact portion 47X, viewed from the thickness direction of the substrate 23, is the same as the thickness dimension T of the substrate 23, when the front contact portion 46X is in contact with the element mounting surface 31 of the substrate 23 and each rear contact portion 47X is in contact with the back surface 32 of the substrate 23, the substrate 23 remains planar. In this state, no stress is generated in the substrate 23, and virtually no force is applied between the contact portions 46X and 47X. Therefore, if the thickness dimension T is slightly smaller or the distance dimension DX is slightly larger due to manufacturing tolerances, a gap will be created between the contact portions 46X and 47X and the substrate 23. When sound is output from the speaker 25 under these conditions where a minute gap exists, the vibration of the speaker 25 is transmitted to the substrate 23 via the housing, etc., causing the substrate 23 to vibrate. When the circuit board 23 and the contact parts 46X and 47X collide due to this vibration, an abnormal noise will be generated at the point of collision. It is a concern that such an abnormal noise occurring while sound is being output from the speaker 25 may cause discomfort or confusion to the user. Furthermore, if the user increases the volume to make the sound easier to hear, the above abnormal noise may become even louder. In other words, while a configuration in which the contact parts 46X and 47X simply come into contact with the circuit board 23 offers benefits such as easier assembly of the circuit board 23, it is difficult to eliminate the new concern caused by the generation of abnormal noise.

[0036] In contrast, in the holding structure shown in this embodiment, as shown in Figure 6(b), the distance D between the front contact portion 46 and the rear contact portion 47 when viewed from the thickness direction of the substrate 23 is smaller than the thickness dimension T of the substrate 23. Therefore, when the element mounting surface 31 of the substrate 23 is in contact with the front contact portion 46 and the back surface 32 is in contact with the rear contact portion 47, the substrate 23 will be gently bent (curved or flexed). In other words, the substrate 23 will experience stress (elastic force) that tries to return to its original state due to the bending of the flat substrate 23. However, since the deformation of the substrate 23 is restricted by the respective contact portions 46 and 47, the substrate 23 will not return to its original state. In other words, the substrate 23 will be maintained in a state pressed against the respective contact portions 46 and 47. This configuration suppresses the formation of gaps between the substrate 23 and the respective contact portions 46 and 47. With this configuration, even if the manufacturing errors described above occur, the circuit board 23 will not become loose as a result. Therefore, even if vibrations from the speaker 25 are transmitted to the circuit board 23, vibrations of the circuit board 23 can be suppressed. This is preferable in suppressing the generation of the above-mentioned abnormal noise.

[0037] Furthermore, as the substrate 23 is pressed against each contact portion 46, 47, the friction generated between the substrate 23 and the contact portions 46, 47 suppresses displacement of the substrate 23. Therefore, the opportunity for collision between the substrate 23 and other peripheral components other than the holding portion 45 can be reduced. For these reasons, the generation of abnormal noise caused by vibration of the substrate 23 can be suppressed even more effectively.

[0038] With the above configuration, the circuit board 23 can be properly secured without using fasteners such as screws. This contributes to improving the efficiency of the assembly work of the air conditioning controller 12 and reducing the number of parts.

[0039] As shown in this embodiment, by arranging the contact portions 46 and 47 along the long side of the rectangular substrate 23, it becomes easier to increase the distance between the front contact portion 46 and the rear contact portion 47 when viewing the substrate 23 from the front, compared to a configuration in which the contact portions 46 and 47 are arranged along the short side of the substrate 23. This is preferable in suppressing localized warping of the substrate 23 and thereby preventing damage to the elements and cracks in the solder.

[0040] If the substrate 23 is configured such that the front contact portion 46 and the rear contact portion 47 are aligned on a virtual straight line FL2 when viewed from the front, the elastic force generated by bending the substrate 23 can be suppressed from acting to rotate the substrate 23. In other words, the elastic force can be efficiently used to suppress vibrations.

[0041] As shown in this embodiment, the configuration in which the substrate 23 is curved so that the element mounting surface 31 is concave is advantageous in suppressing damage to the elements and cracks in the solder, compared to the configuration in which the substrate 23 is curved so that the element mounting surface 31 is convex.

[0042] The configuration in which the front contact portion 46 is positioned in the center of the longitudinal direction of the substrate 23 and the rear contact portions 47 are positioned closer to each of the short sides of the substrate 23 is advantageous in suppressing localized large warping of the substrate 23, thereby preventing damage to the components and cracks in the solder.

[0043] <Second Embodiment> In the first embodiment described above, the front contact portion 46 is positioned in the center of the long side of the substrate 23, and the rear contact portions 47 are positioned closer to each short side, thereby creating a configuration in which almost the entire substrate 23 is gently curved. This is preferable in suppressing the generation of large localized stresses on the substrate 23. On the other hand, when determining the layout of elements and solder on the element mounting surface 31, by deliberately providing areas with less curvature on the substrate 23, it is possible to concentrate components with lower strength and durability compared to other elements in such areas, or to concentrate elements as much as possible in areas with less curvature. This makes it possible to enjoy the various benefits of curving the substrate 23 while suppressing the decrease in reliability of the substrate 23 caused by curvature. One of the features of this embodiment is that an ingenious method has been employed to provide areas on the substrate 23 where curvature is suppressed compared to other parts. The innovations in this embodiment will now be explained, focusing on the differences from the first embodiment, with reference to Figure 7(a).

[0044] In this embodiment, the first front contact portion 46A abuts against the element mounting surface 31 of the substrate 23, and the rear contact portion 47A abuts against the back surface 32 of the substrate 23. The rear contact portion 47A is positioned on both the left and right sides relative to the first front contact portion 46A, similar to the front contact portion 46 and rear contact portion 47 shown in the first embodiment. However, in this embodiment, the rear contact portion 47 is positioned closer to the center in the longitudinal direction of the substrate 23, and the distance dimension D1A between the first front contact portion 46A and the rear contact portion 47A in the thickness direction of the substrate 23 is the same as the thickness dimension T of the substrate 23, which is a difference in configuration from the first embodiment.

[0045] Here, a second front contact portion 48A is added to the portion of the substrate 23 that is closer to the edge (short side) than the rear contact portion 47A, and which contacts the element mounting surface 31. The distance dimension D2A between these second front contact portions 48A and the rear contact portion 47A in the thickness direction of the substrate 23 is smaller than the thickness dimension T of the substrate 23.

[0046] With this configuration, the area between the rear contact portion 47A becomes a suppressed area EA where the warping of the substrate 23 is suppressed. In this suppressed area EA, warping is suppressed more than in other areas, so it is an area where the placement of components and solder should be prioritized. In this implementation, many components and solder are concentrated in this suppressed area EA.

[0047] By intentionally creating a section of the substrate where warping is suppressed (suppression range EA), the stress generated in the substrate can be reduced, at least within that suppression range EA. Intentionally creating a section where warping is suppressed (a predetermined section) is preferable when designing an air conditioning controller, as it allows for an appropriate layout that takes into account the durability and strength of the elements.

[0048] <Example 1> In the second embodiment described above, the suppression range EA is formed by one first front contact portion 46A and two rear contact portions 47A. This can also be modified as follows. In the modified example shown in Figure 7(b), the front contact portion 46B abuts against the element mounting surface 31 of the substrate 23, and the two first rear contact portions 47B abut against the back surface 32 of the substrate 23. Here, the front contact portion 46B is a rib that extends along the long side of the substrate 23, and a second rear contact portion 49B is provided at a position on the opposite side of the substrate 23 from the front contact portion 46B and between the two first rear contact portions 47B. The second rear contact portion 49B, like the front contact portion 46B, is a rib that extends along the long side of the substrate 23. The two ribs, consisting of the front contact portion 46B and the second rear contact portion 49B, form a groove into which the long side (lower end) of the substrate 23 is inserted. The groove width dimension DB1 is the same as the thickness dimension T of the substrate 23, suppressing warping within the groove. In other words, this groove forms a suppression range EB in which warping is suppressed. In contrast, the distance dimension D2B between the first rear contact portion 47B and the front contact portion 46B in the thickness direction of the substrate 23 is smaller than the thickness dimension T of the substrate 23, and outside the suppression range EB, warping is more likely than within the suppression range EB.

[0049] <Modification 2> In the second embodiment described above, the suppression range EA was formed near the center of the longer side of the substrate 23. This modified example differs from the second embodiment in that the suppression range is formed to include an area closer to the shorter side of the substrate 23. This modified example will be described below with reference to Figure 8(a).

[0050] In this modified example, the substrate 23 is provided with a front contact portion 46C that abuts against the element mounting surface 31 and left and right rear contact portions 47C that abut against the back surface 32 of the substrate 23. Here, the distance dimension D1C between the front contact portion 46C and one of the rear contact portions 47C in the thickness direction of the substrate 23 is the same as the thickness dimension T of the substrate 23. In contrast, the distance dimension D2C between the front contact portion 46C and the other rear contact portion 47C in the thickness direction of the substrate 23 is smaller than the thickness dimension T of the substrate 23. By providing such a difference, a suppression range EC is formed between one of the rear contact portions 47C and the front contact portion 46C, which suppresses warping of the substrate 23 compared to other parts.

[0051] <Variation 3> In this modified example, the contact portion group 45D is formed by one front contact portion 46C and two rear contact portions 47C as shown in Modified Example 2 above, and the contact portion group 45D is positioned near both ends of the long side of the substrate 23. More specifically, the contact portion group 45D is arranged symmetrically. This creates a suppression range ED between the two contact portion groups 45D that suppresses warping of the substrate 23 compared to other parts.

[0052] <Other Embodiments> Furthermore, the implementation is not limited to the descriptions of each embodiment above, and may be carried out as follows, for example. Incidentally, each of the following configurations may be applied individually to each of the above embodiments, or some or all of them may be applied to each of the above embodiments in combination. In addition, it is possible to arbitrarily combine all or some of the various configurations shown in each of the above embodiments. In this case, it is preferable that the technical significance (effects exhibited) of each configuration to be combined is ensured. Each of the following configurations may be applied individually to a new configuration consisting of a combination of embodiments, or some or all of them may be applied in combination.

[0053] In the embodiments described above, the contact portions 46 and 47 are mounted on the base 41 side, but the invention is not limited to this. When the substrate 23 is mounted on the cover 51 side, it is preferable to arrange the contact portions 46 and 47 on the cover 51 side. It is also possible to arrange the contact portions 46 and 47 separately on the base 41 side and the cover 51 side, but in such a configuration, it becomes difficult to control the warping of the substrate 23. Therefore, in order to achieve the above-mentioned noise suppression effect due to warping, it is preferable to arrange the contact portions 46 and 47 together on either the base 41 or the cover 51.

[0054] • In the embodiments described above, a fixed-type air conditioning controller 12 fixed to the wall surface W was used as an example, but the invention is not limited to this. The air conditioning controller 12 may also be a portable type.

[0055] • In the above embodiments, the substrate 23 holding structures are illustrated with examples of configurations that do not use fasteners such as screws. However, a certain effect can be expected if the number of fasteners used on the substrate 23 can be reduced. In other words, this does not negate the use of fasteners such as screws. For example, one of the left and right contact groups 45D shown in Figure 8(b) may be changed to a fastener-based fixation.

[0056] In each of the above embodiments, the distance between the front contact portion 46 and the rear contact portion 47 in the thickness direction (front-to-back direction) of the substrate 23 is made smaller than the thickness dimension T of the substrate 23. When viewed from above, it is also possible to configure the contact portions 46 and 47 to be aligned on a virtual line 1, that is, to configure the above distance dimension to be 0. Furthermore, the positional relationship between the front contact portion 46 and the rear contact portion 47 in the thickness direction may be swapped front to back. That is, the front contact portion 46 may be configured to be located further back than the rear contact portion 47. However, if the warp is large, the stress generated in the substrate 23 will also be large. This can be a factor that shortens the lifespan of the substrate 23. Therefore, as described above, it is preferable that the amount of warp of the substrate 23 be such that the front contact portion 46 is on the front side and the rear contact portion 47 is on the back side, and the distance between the contact portions 46 and 47 in the thickness direction is smaller than the thickness dimension T of the substrate 23.

[0057] In the first embodiment described above, one front contact portion 46 abuts against the element mounting surface 31, and two rear contact portions 47 abut against the back surface 32. In other words, the number of contact portions that abut against the element mounting surface 31 is less than the number of contact portions that abut against the back surface 32. This can be changed, and the number of contact portions that abut against the element mounting surface 31 may be greater than the number of contact portions that abut against the back surface 32. For example, there may be one contact portion that abuts against the back surface and two contact portions that abut against the element mounting surface.

[0058] In each of the above embodiments, the front contact portion 46 and the rear contact portion 47 are arranged side by side on a virtual straight line FL2 when viewed in the thickness direction of the substrate 23, but the invention is not limited to this. The front contact portion 46 and the rear contact portion 47 may be arranged with a vertical offset. For example, in the example shown in Figure 9, the rear contact portion 47E is formed on the positioning rib 48E, so that it is positioned at a distance from the bottom plate portion 43 of the base 41. Accordingly, multiple front contact portions 46E are provided, and these front contact portions 46E are positioned at the upper and lower ends of the substrate 23, respectively. With such a configuration, rotation of the substrate 23 around the straight line connecting the left and right rear contact portions 47E can be suitably suppressed. It is preferable that the upper front contact portion 46E be provided on a component other than the base 41. For example, as shown in Figure 9, the upper front contact portion 46E may be provided on the inner cover 61E for the substrate 23.

[0059] In each of the above embodiments, the holding structure for the circuit board 23 built into the air conditioning controller 12 has been described. However, if the air conditioning controller 12 has a built-in display control board for the display 21, the holding structure may be applied to the display control board. Also, if there is a built-in relay board connecting the display control board and the air conditioning control board, the holding structure may be applied to the relay board.

[0060] • In the above embodiments, the case in which the speaker 25 is the source of vibration was described. However, if a ventilation fan is installed in the air conditioning controller for purposes such as improving the accuracy of temperature and humidity detection, the fan may become a source of vibration. Even in such cases, by applying the holding structure shown in the above embodiments, it is possible to reduce the likelihood of problems such as the circuit board vibrating and generating abnormal noise when the fan is operating. Furthermore, even if other components that may become sources of vibration (for example, a vibrator) are built in, applying the same holding structure can contribute to suppressing abnormal noise.

[0061] In the above embodiments, the substrate 23 is curved so that the element mounting surface 31 side is concave (inward curve or valley side), but the substrate 23 may also be curved so that the element mounting surface 31 side is convex (outward curve or mountain side). Furthermore, when changing the single-sided substrate 23 to a double-sided substrate where both sides are element mounting surfaces, it is preferable to curve the substrate so that the side with a high density of mounted elements is concave (inward curve or valley side).

[0062] The substrate holding structure for the substrate 23 shown in each of the above embodiments may also be applied to other terminals, such as a hot water controller for a hot water supply system or a robot controller for a robot system.

[0063] In the air conditioning controller 12 shown in each of the above embodiments, the front contact portion 46 and the rear contact portion 47 are arranged along the lower edge of the circuit board 23, but the design is not limited to this. Instead, the front contact portion 46 and the rear contact portion 47 may be arranged along the upper edge, left edge, or right edge. Also, instead of arranging the contact portions 46 and 47 along the long side of the rectangular circuit board 23, the contact portions 46 and 47 may be arranged along the short side of the circuit board 23.

[0064] • In the embodiments described above, examples were given of configurations in which the substrate 23 is held in an upright position. However, abnormal noise due to substrate vibration can also occur in configurations in which the substrate is held in a horizontal position. Therefore, even when the substrate is placed in a horizontal position, it is preferable to apply a holding structure that holds the substrate in a curved position to suppress the generation of abnormal noise.

[0065] <Regarding the group of inventions extracted from the above embodiments> The following describes the features of the group of inventions extracted from the above embodiments, showing their effects and other aspects as necessary. For ease of understanding, corresponding configurations in the above embodiments will be indicated in parentheses as appropriate, but the invention is not limited to these specific configurations.

[0066] Feature 1. An air conditioning controller (air conditioning controller 12) comprising a circuit board (circuit board 23) housed in a housing (housing 22), capable of controlling an air conditioner (air conditioner 11) based on user operation, The housing is provided with a holding portion (holding portion 45) for holding the substrate, The aforementioned holding part is configured to hold the flat substrate in a curved state in the air conditioning controller.

[0067] By bending a flat substrate, a force (elastic force) is generated in the substrate that tries to restore it to its original state. By holding the substrate in a bent state within the housing's holding section, the held substrate remains pressed against the contact point with the substrate in the holding section due to this force. In other words, the gap between the substrate and the contact point of the holding section can be eliminated. As a result, even if vibrations are transmitted to the substrate from a vibration source such as a speaker built into the housing, the vibration of the substrate can be suppressed. In addition, the friction generated between the substrate and the holding section by pressing the substrate against it suppresses displacement of the substrate. Therefore, the opportunity for collision between the substrate and other surrounding components other than the holding section can be reduced. For these reasons, the generation of abnormal noise caused by substrate vibration can be suppressed. With this configuration, the substrate can be properly fixed without necessarily using fasteners such as screws. This contributes to increased efficiency in the assembly work of the air conditioning controller and a reduction in the number of parts.

[0068] Feature 2. A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The air conditioning controller according to feature 1, wherein the holding portion holds the substrate in a curved state such that one plate surface in contact with the first contact portion is concave and the other plate surface in contact with the second contact portion is convex.

[0069] As shown in this feature, if the substrate is sandwiched in the thickness direction between the first contact portion and the second contact portions on both sides (for example, both left and right sides or both top and bottom sides), and the substrate is bent so that the plate surface in contact with the first contact portion is concave and the plate surface in contact with the second contact portions is convex, then the first and second contact portions can suppress displacement of the substrate in the direction in which the contact portions are aligned. In other words, when vibration is transmitted to the substrate, the position of the substrate can be prevented from shifting in the direction in which the contact portions are aligned, thus preventing collision between the substrate and other surrounding components other than the holding portion. Furthermore, if the degree of warping of the substrate is defined by the first and second contact portions, the first and second contact portions can prevent the held substrate from warping beyond that point, so the warping will not increase after the substrate is assembled. This is preferable in suppressing damage to elements mounted on the substrate and cracks in the solder.

[0070] Feature 3. A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. The distance between the first contact portion and the second contact portion in the thickness direction of the substrate is smaller than the thickness dimension of the substrate. The air conditioning controller according to feature 1, wherein the holding portion holds the substrate in a curved state such that one plate surface in contact with the first contact portion is concave and the other plate surface in contact with the second contact portion is convex.

[0071] As the warping of the substrate increases, the load (strain) on the substrate increases. Therefore, if the warping becomes excessive, there is a concern that the elements mounted on the substrate may fail or cracks may occur in the solder. As shown in this feature, positioning the first contact portion on the same side of the substrate as the side that the substrate is in contact with the second contact portion, with respect to a virtual straight line connecting the two second contact portions, and making the distance between the first and second contact portions in the thickness direction of the substrate smaller than the thickness dimension of the substrate is preferable in order to avoid excessive warping of the substrate and suppress the occurrence of the above-mentioned problems.

[0072] Note that the "thickness dimension" of the substrate refers to the thickness of the plate-like portion of the substrate and does not include the height of elements, etc. Furthermore, the "distance dimension" refers to the distance in the thickness direction of the substrate between the surface facing the substrate at the first contact point (specifically, the contact point) and the surface facing the substrate at the second contact point (specifically, the contact point).

[0073] Incidentally, the statement, "The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to the virtual straight line (virtual straight line FL1) connecting the two second contact portions," means that, for example, if we assume a configuration in which the substrate is in contact with the second contact portion from the front, the first contact portion is located in front of the virtual straight line (in front of the virtual straight line). In other words, when viewing the contact point between the substrate and the second contact portion from the front, the first contact portion is located in front of the virtual straight line. This is also true for feature 4 below.

[0074] Feature 4. An air conditioning controller (air conditioning controller 12) comprising a circuit board (circuit board 23) housed in a housing (housing 22), capable of controlling an air conditioner (air conditioner 11) based on user operation, The housing is provided with a holding portion (holding portion 45) for holding the substrate, The aforementioned retaining part is A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. An air conditioning controller in which the distance between the first contact portion and the second contact portion in the thickness direction of the substrate is smaller than the thickness dimension of the substrate.

[0075] As shown in this feature, in a configuration in which a substrate is sandwiched in its thickness direction between a first contact portion and second contact portions on both sides (for example, both left and right sides or both top and bottom sides), by positioning the first contact portion on the same side of the substrate that is in contact with the second contact portion with respect to a virtual straight line connecting the second contact portions, and by making the distance between the first and second contact portions in the thickness direction of the substrate smaller than the thickness dimension of the substrate, a flat substrate can be held in a curved state. By curving a flat substrate, a force (elastic force) is generated in the substrate that tries to restore it to its original state. By holding the substrate in a curved state in the housing's holding portion, the held substrate remains pressed against the contact points with the substrate in the holding portion due to that force. In other words, the gap between the substrate and the contact points of the holding portion can be eliminated. As a result, even if vibration is transmitted to the substrate from a vibration source such as a speaker built into the housing, the vibration of the substrate can be suppressed. In addition, the friction generated between the substrate and the holding portion by pressing the substrate against it suppresses displacement of the substrate. This reduces the chances of collision between the circuit board and other surrounding components besides the holding part. For these reasons, it can suppress the generation of abnormal noise caused by vibration of the circuit board. With this configuration, the circuit board can be properly secured without necessarily using fasteners such as screws. This contributes to improving the efficiency of the air conditioning controller assembly work and reducing the number of parts.

[0076] Feature 5. The substrate has a rectangular shape, The air conditioning controller according to any one of features 2 to 4, wherein the first contact portion and the second contact portion are arranged along the long side of the substrate.

[0077] As shown in this feature, by arranging each contact portion along the long side of the rectangular substrate, it becomes easier to increase the distance between the first contact portion and each second contact portion when viewing the substrate from the front, compared to a configuration in which each contact portion is arranged along the short side of the substrate. This is preferable in suppressing localized increases in substrate warping and in preventing damage to components and cracks in the solder.

[0078] Feature 6. The air conditioning controller according to any one of Feature 2 to Feature 5, wherein the first contact portion and the second contact portion are aligned on a virtual straight line when viewed in the thickness direction of the substrate.

[0079] If the first and second contact points are aligned on a virtual straight line when viewed in the thickness direction of the substrate, the elastic force generated by bending the substrate can be suppressed from acting to rotate the substrate. In other words, the elastic force can be efficiently used for vibration suppression.

[0080] Feature 7. The substrate is a single-sided substrate, One of the aforementioned board surfaces is the element mounting surface (element mounting surface 31), An air conditioning controller according to any one of features 2 to 6, wherein in the aforementioned curved state, one of the plate surfaces is concave and the other plate surface is convex.

[0081] As shown in this feature, a configuration in which the substrate 23 is curved so that the element mounting surface is concave is advantageous in suppressing damage to the elements and cracks in the solder, compared to a configuration in which the plate surface is curved so that the element mounting surface is convex.

[0082] Feature 8. The air conditioning controller according to any one of Feature 2 to Feature 7, wherein the substrate is rectangular in shape, the first contact portion is located in the center of the substrate in the longitudinal direction, and each of the second contact portions is located closer to the short side of the substrate.

[0083] As shown in this feature, by arranging the first and second contact portions, it is possible to suppress localized increases in substrate warping, thereby preventing damage to components and cracks in the solder.

[0084] Feature 9. The substrate is a rectangular single-sided substrate. One of the aforementioned board surfaces is the element mounting surface (element mounting surface 31), In the aforementioned curved state, one of the plate surfaces becomes convex, and the other plate surface becomes concave. The air conditioning controller according to any one of features 2 to 6, wherein each of the second contact portions is positioned closer to the short side of the substrate.

[0085] On the element mounting surface, the position of the contact portion closer to the center raises the following concerns. For example, the placement of elements may be restricted due to the need to coexist with the contact portion, and the contact portion may be more likely to come into contact with the substrate during the substrate assembly process. In this regard, as shown in this feature, the above inconveniences can be suitably resolved by arranging the second contact portion so that it is positioned closer to the short side of the element mounting surface. Furthermore, even when arranging them closer to a pair of sides, arranging the second contact portion closer to each short side allows for greater flexibility in the placement of the second contact portion while ensuring a certain degree of curvature, compared to arranging the second contact portion closer to each long side. This is preferable in avoiding interference between the element and the second contact portion.

[0086] Feature 10. The substrate has a rectangular shape, The air conditioning controller according to any one of features 2 to 7, wherein the group of contact parts consisting of the first contact part and the second contact part is arranged at positions on each of the short sides of the substrate.

[0087] As shown in this feature, by arranging the group of contact parts, which consists of a first contact part and a second contact part, towards each short side, a portion between these contact parts, i.e., in the center of the substrate, can be secured where warping is less likely to occur. This is preferable for ensuring the coexistence of elements, solder, etc., with the contact parts. Also, when using many contact parts in combination, the distance between each contact part tends to become small. Arranging the groups of contact parts on each short side is preferable for ensuring the distance between the contact parts.

[0088] Feature 11. The air conditioning controller according to any one of Feature 2 to Feature 10, wherein the holding portion holds the substrate such that the degree of warping of a predetermined portion (e.g., the central portion) of the substrate is smaller than the degree of warping of other portions of the substrate.

[0089] As shown in this feature, by suppressing warping in a predetermined portion of the substrate, the stress generated in that portion of the substrate can be reduced. Intentionally providing a portion where warping is suppressed (a predetermined portion) is preferable when designing an air conditioning controller, as it allows for an appropriate layout that takes into account the durability and strength of the elements.

[0090] Feature 12. The holding part is, Three first contact portions (front contact portions 46) that contact one side of the substrate (element mounting surface 31), Two second contact portions (rear contact portions 47) are provided between each of the first contact portions when viewed in the thickness direction of the substrate and contact the other surface (back surface 32) of the substrate. It has, Each of the first contact portions is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. The distance between the central first contact portion and the second contact portion in the thickness direction of the substrate is the same as the thickness dimension of the substrate. The air conditioning controller according to feature 1, wherein the distance between the first contact portion and the second contact portion on both sides in the thickness direction of the substrate is smaller than the thickness dimension of the substrate.

[0091] According to the configuration described in this feature, warping of the substrate can be suppressed between the second contact points (for example, in the central part of the substrate), thereby reducing the stress generated in the substrate. Deliberately providing a portion where warping is suppressed (a predetermined portion) is preferable when designing an air conditioning controller in order to achieve an appropriate layout that takes into account the durability and strength of the elements.

[0092] Feature 13. The holding part is, A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. The distance between the first contact portion and one of the second contact portions in the thickness direction of the substrate is the same as the thickness dimension of the substrate. The air conditioning controller according to feature 1, wherein the distance between the first contact portion and the other second contact portion in the thickness direction of the substrate is smaller than the thickness dimension of the substrate.

[0093] According to the configuration described in this feature, a difference in the warping of the substrate occurs between the portion on one side of the second contact portion and the portion on the other side of the second contact portion relative to the first contact portion. Deliberately providing a portion with reduced warping is preferable when designing an air conditioning controller in order to achieve an appropriate layout that takes into account the durability and strength of the elements.

[0094] Furthermore, the configuration shown in this feature can also be described as "the air conditioning controller according to Feature 1, wherein the holding portion has a first contact portion (front contact portion 46) that abuts against one surface (element mounting surface 31) of the substrate, and second contact portions (back contact portion 47) provided on both sides of the first contact portion when viewed in the thickness direction of the substrate and abutting against the other surface (back surface 32) of the substrate, the first contact portion is located on the same side of the substrate as the side that the substrate abuts against the second contact portion with respect to a virtual straight line connecting the two second contact portions, the distance dimension between the first contact portion and one of the second contact portions in the thickness direction of the substrate is the same as the thickness dimension of the substrate, and the position of the other second contact portion in the thickness direction of the substrate is different from the position of the one second contact portion in the thickness direction."

[0095] Feature 14. The air conditioning controller according to any one of Feature 1 to Feature 13, wherein the housing incorporates at least one of a speaker, a fan, and a vibrator together with the circuit board.

[0096] As shown in this feature, for air conditioning controllers in which at least one of the speakers, fans, or vibrators that can act as vibration sources is built into the enclosure, the following effects can be expected by applying the technical concepts shown in Feature 1, etc. That is, even if vibrations from these vibration sources are transmitted to the circuit board, the generation of abnormal noise can be suppressed. In other words, the circuit board and vibration sources can be suitably allowed to coexist in the air conditioning controller.

[0097] Feature 15. A holding structure for a circuit board (circuit board 23) housed in a housing (housing 22), The housing is provided with a holding portion (holding portion 45) for holding the substrate, The holding portion is a substrate holding structure that holds the flat substrate in a curved state.

[0098] By bending a flat substrate, a force (elastic force) is generated in the substrate that tries to restore it to its original state. By holding the substrate in a bent state within the housing's holding section, the held substrate remains pressed against the contact point with the substrate in the holding section due to this force. In other words, the gap between the substrate and the contact point of the holding section can be eliminated. As a result, even if vibrations are transmitted to the substrate from a vibration source such as a speaker built into the housing, the vibration of the substrate can be suppressed. In addition, the friction generated between the substrate and the holding section by pressing the substrate against it suppresses displacement of the substrate. This reduces the chance of collision between the substrate and other surrounding components other than the holding section. For these reasons, the generation of abnormal noise caused by substrate vibration can be suppressed. With this configuration, the substrate can be properly fixed without necessarily using fasteners such as screws. This contributes to the efficiency of the substrate assembly work into the housing and the reduction of the number of parts involved in assembly.

[0099] Feature 16. A holding structure for a circuit board (circuit board 23) housed in a housing (housing 22), The housing is provided with a holding portion (holding portion 45) for holding the substrate, The aforementioned retaining part is A first contact portion (front contact portion 46) that contacts one of the board surfaces (element mounting surface 31) of the substrate, The following are provided on both sides of the first contact portion when viewed in the thickness direction of the substrate, and a second contact portion (rear contact portion 47) that contacts the other surface (back surface 32) of the substrate. It has, The first contact portion is located on the same side (front side) as the side (front side) on which the substrate is in contact with the second contact portion, with respect to a virtual straight line (virtual straight line FL1) connecting the two second contact portions. A substrate holding structure wherein the distance between the first contact portion and the second contact portion in the thickness direction of the substrate is smaller than the thickness dimension of the substrate.

[0100] As shown in this feature, in a configuration in which a substrate is sandwiched in its thickness direction between a first contact portion and second contact portions on both sides (for example, both left and right sides or both top and bottom sides), by positioning the first contact portion on the same side of the substrate that is in contact with the second contact portion with respect to a virtual straight line connecting the second contact portions, and by making the distance between the first and second contact portions in the thickness direction of the substrate smaller than the thickness dimension of the substrate, a flat substrate can be held in a curved state. By curving a flat substrate, a force (elastic force) is generated in the substrate that tries to restore it to its original state. By holding the substrate in a curved state in the housing's holding portion, the held substrate remains pressed against the contact points with the substrate in the holding portion due to that force. In other words, the gap between the substrate and the contact points of the holding portion can be eliminated. As a result, even if vibration is transmitted to the substrate from a vibration source such as a speaker built into the housing, the vibration of the substrate can be suppressed. In addition, the friction generated between the substrate and the holding portion by pressing the substrate against it suppresses displacement of the substrate. This reduces the chances of collision between the circuit board and other surrounding components besides the holding part. For these reasons, it is possible to suppress the generation of abnormal noise caused by vibration of the circuit board. With this configuration, the circuit board can be properly secured without necessarily using fasteners such as screws. This contributes to improving the efficiency of the circuit board assembly work into the housing and reducing the number of parts involved in assembly.

[0101] Furthermore, the technical concepts described in Features 1 through 14 may also be applied to Features 15 and 16. [Explanation of Symbols]

[0102] 10...Air conditioning unit, 12...Air conditioning controller, 22...Housing, 23...Control board, 25...Speaker, 31...Element mounting surface, 45...Holding part, 46...Front contact part, 47...Rear contact part, FL1...Virtual straight line.

Claims

[Claim 1] A holding structure for a substrate housed in a housing, The housing is provided with a holding portion for holding the substrate, The aforementioned retaining part is Three first contact portions are arranged to abut one surface of the substrate and along one side of the substrate, Two second contact portions are provided between the first contact portions when viewed in the thickness direction of the substrate, and contact the other surface of the substrate. It has, Each of the first contact portions is located on the same side as the side on which the substrate is in contact with the second contact portion, with respect to a virtual straight line connecting the two second contact portions. A substrate holding structure in which the distance dimension in the thickness direction of the substrate between the two first contact portions and the second contact portion of the three first contact portions arranged side by side is smaller than the thickness dimension of the substrate.

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