Light-emitting module

Abstract

To achieve a light-emitting module in which a plurality of light-emitting devices are mounted.SOLUTION: A light-emitting module includes: a wiring board; a first base substance which has a first mounting surface and is electrically connected to the wiring board; a second base substance which has a second mounting surface and is electrically connected to the wiring board; three or more first sub-mounts which are arranged side by side on the first mounting surface; four or more second sub-mounts which are arranged side by side on the second mounting surface; three or more first light-emitting elements which are arranged in the first sub-mount; and four or more second light-emitting elements which are arranged in the second sub-mount. The length of the first sub-mount in a first direction in which the first sub-mounts are aligned on the first mounting surface is longer than the length of the second sub-mount in a second direction in which the second sub-mounts are aligned on the second mounting surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light emitting module. [Background Art]

[0002] Patent Document 1 discloses a light emitting module in which a first light emitting device and a second light emitting device, in which different numbers of laser elements are mounted in packages of the same shape, are mounted on a single wiring board. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Laid-Open No. 2020-95939 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] There is room for improvement in the mounting mode of the plurality of light emitting elements mounted on the first light emitting device and the mounting mode of the plurality of light emitting elements mounted on the second light emitting device in accordance with the mode of light emitted from the light emitting module. [Means for Solving the Problem]

[0005] The light-emitting module disclosed in the embodiment comprises: a wiring board having a first connection pattern and a second connection pattern on its upper surface; a first base having a first mounting surface, bonded to the first wiring pattern of the wiring board and electrically connected to the wiring board; a second base having a second mounting surface, bonded to the second connection pattern and electrically connected to the wiring board; a plurality of first submounts arranged side by side on the first mounting surface; a plurality of second submounts arranged side by side on the second mounting surface; a plurality of first light-emitting elements, each of which is positioned on the first submount; and a plurality of second light-emitting elements, each of which is positioned on the second submount. The first submount includes three or more of the first submounts, the plurality of second submounts includes one or more second submounts than the number of first submounts arranged on the first mounting surface, the plurality of first light-emitting elements includes three or more of the first light-emitting elements, the plurality of second light-emitting elements includes one or more second light-emitting elements than the number of first light-emitting elements arranged on the first mounting surface, and the length of the first submount in the first direction, which is the direction in which the first submounts are aligned on the first mounting surface, is greater than the length of the second submount in the second direction, which is the direction in which the second submounts are aligned on the second mounting surface.

[0006] In at least one of the one or more inventions disclosed by the embodiments, it is expected that a light-emitting module that efficiently emits light can be realized. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a perspective view of a light-emitting module according to the first to fourth embodiments. [Figure 2] Figure 2 is a top view of the light-emitting module according to the first to fourth embodiments. [Figure 3] Figure 3 is a cross-sectional view taken along the line III-III in Figure 2. [Figure 4] Figure 4 is a top view of a wiring board according to the first to fourth embodiments. [Figure 5] Figure 5 is a top view illustrating the components arranged inside the first light-emitting device and the second light-emitting device in the light-emitting module according to the first embodiment. [Figure 6] Figure 6 is a perspective view of the first light-emitting device according to each embodiment. [Figure 7] Figure 7 is a top view of the first light-emitting device according to each embodiment. [Figure 8] Figure 8 is a cross-sectional view of the first to third embodiments and the first light-emitting device according to the fifth embodiment, along the cross-sectional line VIII-VIII in Figure 7. [Figure 9] Figure 9 is a top view illustrating the components arranged inside the first light-emitting device according to the first to third embodiments and the fifth embodiment. [Figure 10] Figure 10 is a perspective view of the second light-emitting device according to each embodiment. [Figure 11] Figure 11 is a top view of the second light-emitting device according to each embodiment. [Figure 12] Figure 12 is a cross-sectional view of the second light-emitting device according to the first embodiment, taken along the cross-sectional line XII-XII in Figure 11. [Figure 13] Figure 13 is a top view illustrating the various components arranged inside the first light-emitting device according to the first embodiment. [Figure 14] Figure 14 is a top view illustrating the components arranged inside the first light-emitting device and the second light-emitting device in the light-emitting module according to the second embodiment. [Figure 15] Figure 15 is a cross-sectional view of the second light-emitting device according to the second embodiment, taken along the XV-XV section line in Figure 11. [Figure 16] Figure 16 is a top view illustrating the various components arranged inside the second light-emitting device according to the second embodiment. [Figure 17] Figure 17 is a top view illustrating the components arranged inside the first light-emitting device and the second light-emitting device in the light-emitting module according to the third embodiment. [Figure 18]FIG. 18 is a cross-sectional view of the second light-emitting device according to the third embodiment taken along line XVIII-XVIII of FIG. 11. [Figure 19] FIG. 19 is a top view for explaining each constituent element arranged inside the second light-emitting device according to the third embodiment. [Figure 20] FIG. 20 is a top view for explaining each constituent element arranged inside the first light-emitting device according to the fourth embodiment. [Figure 21] FIG. 21 is a top view of a light-emitting module according to the fifth embodiment. [Figure 22] FIG. 22 is a top view of a wiring board according to the fifth embodiment. MODES FOR CARRYING OUT THE INVENTION

[0008] In the present specification or the claims, with respect to polygons such as triangles and quadrangles, shapes obtained by performing processing such as corner rounding, chamfering, beveling or radius cutting on corners of a polygon shall also be referred to as polygons. In addition, not only shapes having processing applied to corners (ends of sides), but also shapes having processing applied to intermediate portions of sides shall similarly be referred to as polygons. That is, shapes that retain a polygon as a base while having partial processing applied are included in the interpretation of "polygon" described in the present specification and the claims.

[0009] This also applies not only to polygons, but also to terms representing specific shapes such as trapezoids, circles and irregularities. The same also applies when handling each side forming the shape. That is, even if processing is applied to a corner or an intermediate portion of a side, the processed portion is also included in the interpretation of "side". Note that when distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strict" shall be added, for example, described as "strict quadrangle".

[0010] In addition, in the present specification or the claims, descriptions of up and down, left and right, front and back, front and rear, and near and far merely describe relative relationships of position, orientation and direction, and do not need to match the relationship during use.

[0011] Furthermore, directions such as the X, Y, and Z directions may be indicated in the drawings using arrows. The direction of these arrows is consistent across multiple drawings representing the same embodiment.

[0012] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. "Component" refers to an object that is treated as a single physical unit. An object that is treated as a single physical unit can also be an object that is treated as a single part in the manufacturing process. On the other hand, "part" refers to an object that does not necessarily have to be treated as a single physical unit. For example, "part" is used when referring to a part of a single component.

[0013] Furthermore, the distinction between "component" and "part" as described above does not indicate an intention to consciously limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this alone does not mean that the applicant recognizes that treating this component as a physical unit is indispensable for the application of the present invention.

[0014] Furthermore, in this specification or the claims, when there are multiple components and each is to be expressed separately, the components may be distinguished by adding "1st," "2nd," etc., to their names. Also, the objects being distinguished may differ between this specification and the claims. Therefore, even if a component with the same prefix as in this specification is described in the claims, the objects identified by this component may not be the same in this specification and the claims.

[0015] For example, if there are components designated as “First,” “Second,” and “Third” in this specification to distinguish them, and these components are described in the claims as “First” and “Third” in this specification, then for readability, the components may be distinguished in the claims as “First” and “Second.” In this case, the components designated as “First” and “Second” in the claims refer to the components designated as “First” and “Third” in this specification, respectively. This rule is not limited to components, but can be applied to other subjects in a reasonable and flexible manner.

[0016] The following describes embodiments for carrying out the present invention. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only forms in which the present invention is realized. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for the sake of ease of understanding.

[0017] <First Embodiment> A light-emitting module 100 according to the first embodiment will be described. Figures 1 to 13 are drawings illustrating an exemplary form of the light-emitting module 100. Figure 1 is a perspective view of the light-emitting module 100. Figure 2 is a top view of the light-emitting module 100. Figure 3 is a cross-sectional view taken along the line III-III in Figure 2. Figure 4 is a top view of the wiring board 9 in the light-emitting module 100. Figure 5 is a perspective view illustrating the components arranged inside the first light-emitting device 1A and the second light-emitting device 1B in the light-emitting module 100. Figure 6 is a perspective view of the first light-emitting device 1A. Figure 7 is a top view of the first light-emitting device 1A. Figure 8 is a cross-sectional view taken along the line VIII-VIII in Figure 7. Figure 9 is a top view showing the components mounted on the first substrate 10A of the first light-emitting device 1A. Figure 10 is a perspective view of the second light-emitting device 1B. Figure 11 is a top view of the second light-emitting device 1B. Figure 12 is a cross-sectional view taken along the line XII-XII in Figure 11. Figure 13 is a top view showing the configuration of each component mounted on the second substrate 10B of the second light-emitting device 1B.

[0018] The light-emitting module 100 comprises multiple components. These components include multiple light-emitting devices 1 and a wiring board 9. The multiple light-emitting devices 1 include a first light-emitting device 1A and a second light-emitting device 1B. The light-emitting module 100 may also include other components. For example, it may include connectors and thermistors.

[0019] The individual components of the light-emitting module 100 will be described below.

[0020] (Light-emitting device 1) The light-emitting device 1 comprises multiple components. These components include a base 10, multiple light-emitting elements 20, multiple submounts 30, one or more reflective members 40, multiple protective elements 50, multiple wiring 60, a cover member 70, and an optical member 80.

[0021] Furthermore, the light-emitting device 1 may have other components. For example, the light-emitting device 1 may have additional light-emitting elements in addition to the multiple light-emitting elements 20. Also, the light-emitting device 1 may not have some of the components listed here.

[0022] The components of the light-emitting device 1 will now be described.

[0023] (Base 10) The base body 10 has an upper surface 11A, a lower surface 11B, and one or more outer surfaces 11C. In a top view, the outer edge shape of the base body 10 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated base body 10, the direction of the long side of this rectangle is the same as the X direction, and the direction of the short side is the same as the Y direction. Note that the outer edge shape of the base body 10 in a top view does not have to be rectangular.

[0024] A concave shape is formed in the base body 10. A concave shape is formed that is recessed below the upper surface 11A. The recess is defined by the concave shape of the base body 10. This recess is surrounded by the upper surface 11A when viewed from above.

[0025] The inner edge of the upper surface 11A defines the outer edge of the recess. In a top view, the outer edge shape of the recess is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated base 10, the direction of the long side of this rectangle is the same as the X direction, and the direction of the short side is the same as the Y direction. Note that the outer edge shape of this recess does not have to be rectangular.

[0026] The substrate 10 has a mounting surface 11D. The substrate 10 also has one or more inner surfaces 11E. The mounting surface 11D is located below the upper surface 11A and above the lower surface 11B. The mounting surface 11D is the upper surface. The mounting surface 11D can be said to be a different upper surface from the upper surface 11A. One or more inner surfaces 11E are located above the mounting surface 11D. One or more inner surfaces 11E intersect with the upper surface 11A. The mounting surface 11D and one or more inner surfaces 11E are included in the multiple surfaces that define the recess of the substrate 10.

[0027] One or more inner surfaces 11E are provided perpendicular to the mounting surface 11D. Here, perpendicularity allows for a difference of ±3 degrees. However, the inner surfaces 11E do not necessarily have to be perpendicular to the mounting surface 11D.

[0028] The base body 10 has one or more stepped portions 12C. Each stepped portion 12C has an upper surface and an inner surface that intersects with the upper surface and extends downward from the upper surface. The upper surface of the stepped portion 12C intersects with the inner surface 11E. The inner surface of the stepped portion 12C intersects with the mounting surface 11D.

[0029] The stepped portion 12C is formed along part or all of the inner surface 11E when viewed from above. One or more stepped portions 12C are formed on the inside of the top surface 11A when viewed from above. One or more stepped portions 12C are formed on the inside of one or more inner surfaces 11E when viewed from above.

[0030] The base body 10 may have a plurality of stepped portions 12C. The plurality of stepped portions 12C include stepped portions 12C formed along the inner surface 11E when viewed from above. The plurality of stepped portions 12C include stepped portions 12C formed along the entire inner surface 11E when viewed from above.

[0031] The multiple stepped portions 12C include, in a top view, stepped portions 12C (hereinafter referred to as the first stepped portion) formed along a certain inner surface 11E (hereinafter referred to as the first inner surface) and stepped portions 12C (hereinafter referred to as the second stepped portion) formed along another inner surface 11E (hereinafter referred to as the second inner surface).

[0032] The first inner surface 11E and the second inner surface 11E face each other. The first stepped portion 12C may be formed along only the first inner surface 11E. The second stepped portion 12C may be formed along only the second inner surface 11E. In a top view, no stepped portion 12C is provided between the stepped portions 12C formed along each of the opposing inner surfaces 11E.

[0033] When viewed from above, the base 10 has no stepped portions other than the multiple stepped portions 12C on the inside of the upper surface 11A, and the multiple stepped portions 12C can consist of only two stepped portions 12C. The multiple stepped portions 12C can consist of only a first stepped portion 12C and a second stepped portion 12C.

[0034] The multiple stepped portions 12C include stepped portions 12C formed along the inner surface 11E with a length of 50% to 100% of the length of the inner surface 11E in a direction parallel to the mounting surface 11D.

[0035] One or more wiring patterns 13 are provided on the upper surface of the stepped portion 12C. The wiring patterns 13 are electrically connected to other wiring patterns via wiring that runs through the inside of the base body 10. The other wiring patterns are provided, for example, on the lower surface of the base body 10. Note that the wiring patterns 13 may also be electrically connected to wiring patterns provided on the upper surface 11A or the outer surface 11C.

[0036] Multiple wiring patterns 13 are provided on the upper surface of one or more stepped portions 12C. Each of the multiple stepped portions 12C may be provided with one or more wiring patterns 13. The base body 10 may have stepped portions 12C on which multiple wiring patterns 13 are provided on the upper surface. By providing wiring patterns 13 on the upper surface of the stepped portions 12C, wiring can be connected at a position higher than the mounting surface 11D. This can make the wiring connection process easier.

[0037] In the base 10, the location where the wiring pattern 13 is provided is not limited to the stepped portion 12C. The base 10 can be said to have a wiring section provided for electrical connection, and in the base 10 shown, the stepped portion 12C is also a wiring section.

[0038] The base body 10 can be formed using ceramic as the main material. Alternatively, the base body 10 may be formed by joining a bottom member having a mounting surface 11D, which is made using metal or a composite material containing metal as the main material, and a frame member having a wiring pattern 13, which is made using ceramic as the main material.

[0039] Here, the main material refers to the material that accounts for the largest proportion in mass or volume of the object in question. If the object is formed from a single material, that material is the main material. In other words, for a material to be the main material includes the possibility of that material accounting for 100% of the total material.

[0040] Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. Examples of metals include copper, aluminum, and iron. Alternatively, composite materials containing metals such as copper-molybdenum, copper-diamond composites, and copper-tungsten can be used.

[0041] (Light-emitting element 20) The light-emitting element 20 has a light-emitting surface from which light is emitted. The light-emitting element 20 has a top surface, a bottom surface, and multiple sides. The top surface or side of the light-emitting element 20 becomes the light-emitting surface. The light-emitting element 20 has one or more light-emitting surfaces.

[0042] The top surface of the light-emitting element 20 is rectangular, having a long side and a short side. However, the top surface of the light-emitting element 20 does not have to be rectangular. A semiconductor laser element can be used for the light-emitting element 20. However, the light-emitting element 20 is not limited to a semiconductor laser element; a light-emitting diode or the like may also be used.

[0043] The light-emitting element 20 can be a single-emitter semiconductor laser element. Alternatively, the light-emitting element 20 can be a multi-emitter semiconductor laser element with multiple emitters.

[0044] The light-emitting element 20 can, for example, be a light-emitting element that emits blue light, a light-emitting element that emits green light, or a light-emitting element that emits red light. The semiconductor laser element 20 may also be a light-emitting element that emits light of other colors or wavelengths.

[0045] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0046] Here, we will describe a semiconductor laser element, which is an example of a light-emitting element 20. When viewed from above, the semiconductor laser element has a rectangular shape with one opposite side being the longer side and the other opposite side being the shorter side. The light (laser light) emitted from the semiconductor laser element has a broadened shape. In addition, divergent light is emitted from the emission end face of the semiconductor laser element. The emission end face of the semiconductor laser element can be called the light emission surface of the light-emitting element 20.

[0047] Light emitted from a semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emission end face. FFP refers to the shape and light intensity distribution of the emitted light at a position away from the emission end face.

[0048] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the FFP's light intensity distribution, is referred to as the light traveling along the optical axis, or the light passing through the optical axis. Furthermore, in the FFP's light intensity distribution, 1 / e is applied to the peak intensity value. 2 Light with the above intensity will be referred to as the main part of the light.

[0049] The shape of the fast-flow plane (FFP) of light emitted from a semiconductor laser element is an ellipse, with the length in the stacking direction being longer than the length in the direction perpendicular to the stacking direction, on a plane parallel to the light emission end face. The stacking direction refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the plane direction of the semiconductor layer. Furthermore, the major axis direction of the elliptical shape of the FFP can be called the speed axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction of the semiconductor laser element.

[0050] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2The angle at which light of a certain light intensity spreads is defined as the light divergence angle of a semiconductor laser element. The light divergence angle is 1 / e of the peak light intensity. 2 In addition to the light intensity, it can also be determined from, for example, the light intensity at half the peak light intensity. In this specification, when we simply refer to the "angle of light divergence," we mean 1 / e of the peak light intensity. 2 This refers to the angle of light divergence at a given light intensity. It should be noted that the angle of divergence in the fast axis direction is greater than the angle of divergence in the slow axis direction.

[0051] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN-based semiconductors such as GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those containing InAlGaP-based, GaInP-based, GaAs-based, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0052] (Submount 30) The submount 30 has a top surface 31, a bottom surface, and one or more sides 32. When viewed from above, the submount 30 has an external shape in which the length in one direction is greater than the length in the direction perpendicular thereto. The top surface 31 is rectangular in shape. The top surface 31 may be a rectangle with a short side and a long side. The top surface 31 may also be square in shape.

[0053] The submount 30 is constructed in the shape of a rectangular parallelepiped. The distance between the top surface 31 and the bottom surface of the submount 30 is smaller than the distance between any other two opposing surfaces. This distance between the top surface 31 and the bottom surface is referred to as the thickness of the submount 30. Note that the shape of the submount 30 is not limited to a rectangular parallelepiped.

[0054] The length of the short side on the top surface 31 is between 500 μm and 1500 μm. The length of the long side on the top surface 31 is between 1000 μm and 3000 μm. The thickness of the submount 30 is between 200 μm and 500 μm. The length of the long side of the top surface 31 is between 120% and 300% of the length of the short side.

[0055] The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. The submount 30 is also provided with a metal film for bonding to other components.

[0056] (Reflective member 40) The reflective member 40 has a light-reflecting surface that reflects light. Furthermore, the light-reflecting surface is inclined with respect to the lower surface. In other words, the arrangement of the light-reflecting surface, as viewed from below, is neither perpendicular nor parallel. A straight line connecting the lower and upper ends of the light-reflecting surface is inclined with respect to the lower surface of the reflective member 40. The angle of the light-reflecting surface with respect to the lower surface, or the angle of the straight line connecting the lower and upper ends of the light-reflecting surface with respect to the lower surface, is referred to as the inclination angle of the light-reflecting surface.

[0057] In the illustrated reflective member 40, the light-reflecting surface is flat and forms a 45-degree inclination angle with respect to the lower surface of the reflective member 40. The light-reflecting surface does not have to be flat; for example, it may be curved. Furthermore, the inclination angle of the light-reflecting surface does not have to be 45 degrees.

[0058] The reflective member 40 can use glass or metal as its main material. The main material should preferably be a heat-resistant material, such as quartz or BK7 (borosilicate glass), or a metal such as aluminum. The reflective member 40 can also be formed using Si as the main material. If the main material is a reflective material, a light-reflecting surface can be formed from the main material. If a light-reflecting surface is formed separately from the main material, the light-reflecting surface can be formed using, for example, metals such as Ag or Al, or dielectric multilayer films such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0059] On a light-reflecting surface, the reflectance with respect to the peak wavelength of light irradiated onto the surface is 90% or higher. This reflectance may also be 95% or higher. Furthermore, this reflectance may be 99% or higher. The light reflectance is 100% or less, or less than 100%.

[0060] (Protection element 50) The protective element 50 is designed to prevent excessive current from flowing through a specific element (such as a semiconductor laser element) and causing it to be damaged. An example of the protective element 50 is a Zener diode. Furthermore, a Zener diode made of silicon can be used.

[0061] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become connection points with other components. The wiring 60 is, for example, a metal wire. The metal can be, for example, gold, aluminum, silver, copper, etc.

[0062] (Lid member 70) The lid member 70 has a bottom surface and a top surface and is composed of a rectangular parallelepiped flat plate shape. However, it does not have to be a rectangular parallelepiped. The lid member 70 is translucent, meaning that it transmits light. Here, translucency means that the transmittance to light is 80% or more. However, it does not have to have a transmittance of 80% or more for light of all wavelengths. The lid member 70 may have a non-translucent region (a region that does not have translucency) in part.

[0063] The lid member 70 is formed using glass as the main material. The main material used to form the lid member 70 is a material with high light transmittance. The lid member 70 is not limited to glass; for example, it may also be formed using sapphire as the main material.

[0064] (Optical component 80) The optical element 80 has an upper surface, a lower surface, and side surfaces. The optical element 80 performs optical effects on incident light, such as reflection, transmission, and refraction, as well as optical effects such as focusing, diffusion, and collimation.

[0065] The optical member 80 can be a lens member having one or more lens surfaces. The one or more lens surfaces are provided on the upper side of the optical member 80. Alternatively, they may be provided on the lower side of the optical member 80. The upper and lower surfaces are flat. The one or more lens surfaces intersect with the upper surface. The one or more lens surfaces are surrounded by the upper surface when viewed from above. When viewed from above, the optical member 80 has a rectangular outline. The lower surface of the optical member 80 is rectangular.

[0066] The portion of the optical member 80 that overlaps with one or more lens surfaces when viewed from above is defined as the lens portion. The portion of the optical member 80 that overlaps with the top surface when viewed from above is defined as the non-lens portion. When the lens portion is divided in half by a virtual plane including the top surface, the lens surface side is defined as the lens-shaped portion, and the bottom surface side is defined as the flat plate-shaped portion. The bottom surface of the lens portion is a part of the bottom surface. In the optical member 80, the bottom surface is composed of the bottom surface of the lens portion and the bottom surface of the non-lens portion.

[0067] The illustrated optical element 80 has multiple lens surfaces. Furthermore, these multiple lens surfaces are formed in a continuous line in one direction. The optical element 80 has five lens surfaces, and the vertices of these five lens surfaces are aligned in a straight line. This straight line is in the same direction as the X-direction.

[0068] Here, the direction in which multiple lens surfaces are aligned when viewed from above is called the connection direction. When viewed from above, the length of the multiple lens surfaces in the connection direction is greater than the length in the direction perpendicular to this direction. In the illustrated optical member 80, the connection direction is the same direction as the X direction.

[0069] The optical component 80 has high light transmittance. The optical component 80 has high light transmittance in both the lens portion and the non-lens portion. Furthermore, the optical component 80 as a whole has high light transmittance. The optical component 80 can be formed using, for example, glass such as BK7.

[0070] Next, we will describe the light-emitting device 1 equipped with the components described above. In the following description of the light-emitting device 1, the description of a single component will also apply to each of the multiple identical components, insofar as it is consistent with the drawings relating to the light-emitting device 1. In other words, if there are multiple identical components in the drawings, and the description of a single component also applies to each of the multiple identical components from the drawings, then this description will also be valid for each of the multiple identical components.

[0071] (Light-emitting device 1) In the light-emitting device 1, the light-emitting element 20 is mounted on a submount 30. The light-emitting element 20 is positioned on the upper surface 31 of the submount 30. In the illustrated light-emitting device 1, a semiconductor laser element is used as the light-emitting element 20.

[0072] Multiple light-emitting elements 20 are arranged on different submounts 30. Note that additional light-emitting elements may be arranged on the same submount 30 where the light-emitting elements 20 are located. Considering heat dissipation and other factors, it may be preferable that no other light-emitting elements are placed on a single submount 30 besides the single light-emitting element 20.

[0073] The light-emitting element 20 is positioned such that its light-emitting surface is located near a side surface 32 of the submount 30. Here, the side surface 32 located near the light-emitting surface is referred to as the first side surface 32A. The side surface 32 of the submount 30 opposite to the first side surface 32A is referred to as the second side surface 32B. The first side surface 32A is the side surface 32 that intersects with the short side of the top surface 31. The second side surface 32B is the side surface 32 that intersects with the short side that is opposite to the short side where the first side surface 32A and the top surface 31 intersect. The light-emitting element 20 is positioned on the submount 30 such that its light-emitting surface is closer to the first side surface 32A than to the second side surface 32B.

[0074] In the light-emitting device 1, the protective element 50 is mounted on a submount 30. The protective element 50 is positioned on the upper surface 31 of the submount 30. The protective element 50 is positioned on the submount 30 on which the semiconductor laser element 20 is positioned. Multiple protective elements 50 are positioned on different submounts 30 from each other.

[0075] In the light-emitting device 1, the submount 30 is mounted on the base body 10. The submount 30 is placed on the mounting surface 11D of the base body 10. Multiple submounts 30 are arranged side by side on the mounting surface 11D. Multiple submounts 30 are arranged side by side in the longitudinal direction of the base body 10. Multiple submounts 30 are arranged side by side in the long side direction of the base body 10.

[0076] Here, the direction in which the multiple submounts 30 are aligned when viewed from above will be referred to as the first direction. In the light-emitting device 1, the multiple light-emitting elements 20 are arranged in the first direction. In the illustrated light-emitting device 1, the first direction is the same direction as the X direction. Also, when viewed from above, the direction parallel to the light-emitting surface of the light-emitting elements 20 arranged on the submounts 30 is the same direction as the X direction.

[0077] Multiple submounts 30 are arranged so that their first side surfaces 32A are aligned in the first direction. Multiple light-emitting elements 20 are arranged so that their light-emitting surfaces are aligned in the first direction. When viewed from above, the length of the submount 30 in the direction perpendicular to the first direction (hereinafter referred to as the second direction) is greater than the length in the first direction.

[0078] In the light-emitting device 1, the light-emitting surface of the light-emitting element 20 faces sideways. The light-emitting surfaces of multiple light-emitting elements 20 each face the same direction. Light is emitted from the light-emitting surface of the light-emitting element 20, traveling sideways. In the illustrated light-emitting device, FFP light is emitted from the light-emitting surface of the light-emitting element 20, which is a semiconductor laser element, with the direction perpendicular to the mounting surface 11D as the fast axis direction. For each light-emitting element 20, the divergence angle in the slow axis direction is 20 degrees or less. Note that the divergence angle is greater than 0 degrees.

[0079] In the light-emitting device 1, one or more reflective members 40 are arranged on the base body 10. The reflective members 40 are arranged on the mounting surface 11D. The reflective members 40 have light-reflecting surfaces. Light emitted from multiple light-emitting elements 20 is reflected by one or more light-reflecting surfaces. The light-reflecting surfaces are inclined at a 45-degree angle with respect to the direction of light propagation through the optical axis. The light reflected by the light-reflecting surfaces travels upward. In the illustrated light-emitting device 1, light from one or more main parts is irradiated onto the light-reflecting surfaces of the reflective members 40.

[0080] The reflective members 40 can be provided in a one-to-one ratio with the light-emitting elements 20. In other words, the same number of reflective members 40 as there are light-emitting elements 20 are arranged. Multiple reflective members 40 are arranged in a line in the first direction when viewed from above. All reflective members 40 are the same in size and shape. In the illustrated light-emitting device 1, the light-reflecting surface of the reflective member 40 reflects 90% or more of the light of the main illuminated portion. Note that one reflective member 40 may be provided for multiple light-emitting elements 20. Alternatively, one reflective member 40 may be provided for all light-emitting elements 20. Or, the light-emitting device 1 may not have any reflective members 40 at all.

[0081] In the light-emitting device 1, the wiring 60 is connected to the wiring pattern 13. The light-emitting device 1 includes a plurality of wirings 60. The plurality of wirings 60 electrically connect one or more light-emitting elements 20 to the base 10.

[0082] In the light-emitting device 1, the lid member 70 is joined to the base body 10. The lid member 70 is positioned on the upper surface of the base body 10. The lid member 70 is also positioned above the stepped portion 12C. The joining of the lid member 70 creates a closed space defined by the base body 10 and the lid member 70. This space is where the light-emitting element 20 is positioned.

[0083] By joining the lid member 70 to the base body 10 under a predetermined atmosphere, a hermetically sealed closed space (sealed space) is created. When a semiconductor laser element is used for the light-emitting element 20, hermetically sealing the space in which the semiconductor laser element is arranged can suppress quality degradation due to dust collection. The lid member 70 is translucent to light emitted from the light-emitting element 20. In the illustrated light-emitting device 1, more than 90% of the main portion of light emitted from the light-emitting element 20 passes through the lid member 70 and is emitted to the outside.

[0084] The optical element 80 is positioned above the lid member 70. The optical element 80 is joined to the lid member 70. Multiple beams of light emitted from the lid member 70 are incident on the incident surface of the optical element 80. The light incident on the incident surface of the optical element 80 is emitted from the lens surface.

[0085] The lens portion of the optical element 80 is positioned close to one of the two outer surfaces 11C of the base body 10 that are located on opposite sides, in a direction perpendicular to the connecting direction. The lens portion of the optical element 80 is positioned at a distance equal to the distance from each of the outer surfaces 11C of the base body 10 that are located on opposite sides, in the connecting direction.

[0086] The optical element 80 is positioned such that, in a top view, its lens surface overlaps with the reflective element 40. The optical element 80 is positioned such that, in a top view, its lens surface overlaps with the light-emitting element 20. In a top view, each of the multiple lens surfaces is positioned so that it overlaps with a different light-emitting element 20. Light emitted from each of the one or more lens surfaces is emitted from each of the different light-emitting elements 20. In the illustrated light-emitting device 1, the light-emitting elements 20 are semiconductor laser elements, and from each of the one or more lens surfaces, light from the main portion emitted from each of the different light-emitting elements 20 is emitted. One light-emitting element 20 corresponds to one lens surface, and light from the corresponding light-emitting element 20 is emitted from each lens surface.

[0087] (Wiring board 9) The wiring board 9 has a top surface, a bottom surface, and side surfaces. Multiple connection patterns 9A are provided on the top surface of the wiring board 9. The multiple connection patterns 9A include a first connection pattern 9A1 and a second connection pattern 9A2. Multiple wiring areas 9B are provided on the top surface of the wiring board 9.

[0088] Other components are bonded to the connection pattern 9A of the wiring board 9. The connection pattern 9A is divided into multiple connection areas on the upper surface of the wiring board 9. These connection areas include connection areas that are electrically connected to the wiring area 9B. These connection areas also include connection areas that are not electrically connected to the wiring area 9B.

[0089] Each of the multiple connection patterns 9A forms the same or similar connection pattern when viewed from above. Here, "same or similar" means that they form the same containing rectangle. The containing rectangle is defined as the smallest rectangle that encloses the connection patterns 9A. It can be said that the multiple connection patterns 9A have the same containing rectangle. In Figure 4, the containing rectangles are indicated by dashed lines, with the containing rectangle related to the first connection pattern 9A1 indicated by symbol H1 and the containing rectangle related to the second connection pattern 9A2 indicated by symbol H2.

[0090] The first connection pattern 9A1 and the second connection pattern 9A2 are connection patterns 9A with different shapes. The first connection pattern 9A1 has fewer connection areas. In a top view, the enclosing rectangle of the first connection pattern 9A1 and the enclosing rectangle of the second connection pattern 9A2 are the same size and shape.

[0091] The first connection pattern 9A1 and the second connection pattern 9A2 are placed side by side. The first connection pattern 9A1 and the second connection pattern 9A2 are placed close together. The distance between the first connection pattern 9A1 and the second connection pattern 9A2 is between 300 μm and 1000 μm.

[0092] (Light-emitting module 100) The light-emitting module 100 comprises a plurality of light-emitting devices 1, including a first light-emitting device 1A and a second light-emitting device 1B. The first light-emitting device 1A is connected to one of the two connection patterns 9A of the wiring board 9, and the second light-emitting device 1B is connected to the other. In the illustrated light-emitting module 100, the first light-emitting device 1A is joined to the first connection pattern 9A1, and the second light-emitting device 1B is joined to the second connection pattern 9A2.

[0093] The first light-emitting device 1A and the second light-emitting device 1B are both positioned on the wiring board 9 in the same orientation. The first light-emitting device 1A and the second light-emitting device 1B are both positioned side by side so that the lens portions of the optical element 80 are aligned in the same direction. For example, in the light-emitting module 100, the orientation of the electrodes can be changed by rotating the first light-emitting device 1A and the second light-emitting device 1B by 180 degrees and mounting them on the wiring board 9. By mounting the first light-emitting device 1A and the second light-emitting device 1B in the same orientation, such flexible adjustments can be made without changing the distance between the light emitted from the first light-emitting device 1A and the light emitted from the second light-emitting device 1B.

[0094] Here, the base 10 provided in the first light-emitting device 1A is referred to as the first base 10A, and the base 10 provided in the second light-emitting device 1B is referred to as the second base 10B for distinction. Also, the light-emitting element 20 provided in the first light-emitting device 1A is referred to as the first light-emitting element 20A, and the light-emitting element 20 provided in the second light-emitting device 1B is referred to as the second light-emitting element 20B for distinction. Also, the submount 30 provided in the first light-emitting device 1A is referred to as the first submount 30A, and the submount 30 provided in the second light-emitting device 1B is referred to as the second submount 30B for distinction. Also, the protective element 50 provided in the first light-emitting device 1A is referred to as the first protective element 50A, and the protective element 50 provided in the second light-emitting device 1B is referred to as the second protective element 50B for distinction.

[0095] The length of the first base 10A in the long side direction is 90% to 105% of the length of the second base 10B in the long side direction. The length of the first base 10A in the short side direction is 90% to 105% of the length of the second base 10B in the short side direction. In the illustrated light-emitting device 1, the first base 10A and the second base 10B are the same length in both the long side direction and the short side direction. Also, the first base 10A and the second base 10B are the same size and shape. By making the size of the surface of the first light-emitting device 1A involved in bonding with the wiring board 9 similar to the size of the surface of the second light-emitting device 1B involved in bonding with the wiring board 9, it is possible to flexibly select the light-emitting device 1 to be bonded to the wiring board 9 and manufacture the light-emitting module 100.

[0096] The length of the first substrate 10A in the first direction based on the first light-emitting device 1A is 90% to 105% of the length of the second substrate 10B in the first direction based on the second light-emitting device 1B. In the illustrated light-emitting module 100, the first direction based on the first light-emitting device 1A and the first direction based on the second light-emitting device 1B are parallel (the same direction). Note that parallelism here includes a difference of ±3 degrees.

[0097] Depending on the orientation in which the first light-emitting device 1A and the second light-emitting device 1B are arranged on the wiring board 9, the first direction based on the first light-emitting device 1A and the first direction based on the second light-emitting device 20B may not be parallel. Hereinafter, the direction in which multiple first light-emitting devices 20A are aligned will be referred to as the third direction, and the direction in which the second light-emitting devices 20B are aligned will be referred to as the fourth direction. In the illustrated light-emitting module 100, the first direction and the third direction based on the first light-emitting device 20A are the same direction, and the first direction and the fourth direction based on the second light-emitting device 20B are the same direction.

[0098] The length of the mounting surface 11D of the first substrate 10A (hereinafter referred to as the first mounting surface) in the third direction is 90% to 105% of the length of the mounting surface 11D of the second substrate 10B (hereinafter referred to as the second mounting surface) in the fourth direction. The length of the first mounting surface 11D in the long side direction is 90% to 105% of the length of the second mounting surface 11D in the long side direction. The length of the first mounting surface 11D in the short side direction is 90% to 105% of the length of the second mounting surface 11D in the short side direction. In the illustrated light-emitting device 1, the first mounting surface 11D and the second mounting surface 11D are the same length, size, and shape in both the long side direction and the short side direction.

[0099] The first substrate 10A has at least two wiring patterns 13, and the second substrate 10B has at least three wiring patterns 13. In the illustrated second light-emitting device 1B, four wiring patterns 13 are provided in the second substrate 10B.

[0100] The first light-emitting device 1A may have three or more first light-emitting elements 20A. In other words, the first light-emitting device 1A may have three or more first light-emitting elements 20A. The number of first light-emitting elements 20A provided by the first light-emitting device 1A can be seven or less.

[0101] The second light-emitting device 1B may include one or more second light-emitting elements 20B than the number of first light-emitting elements 20A provided by the first light-emitting device 1A. The number of second light-emitting elements 20B in the second light-emitting device 1B may include one or more second light-emitting elements 20B than the number of first light-emitting elements 20A arranged on the first mounting surface. The number of second light-emitting elements 20B provided by the second light-emitting device 1B can be less than or equal to the number of first light-emitting elements 20A provided by the first light-emitting device 1A plus two. In this way, by providing the first light-emitting device 1A and the second light-emitting device 1B with different numbers of mounted light-emitting elements 20, the number and type of light-emitting elements 20 to be mounted on the light-emitting module 100 can be flexibly determined in the mounting configuration in which these are mounted on the wiring board 9.

[0102] The first light-emitting element 20A emits light of a first color, and the second light-emitting element 20B emits light of a different color from the first color. The second light-emitting element 20B emits light of a second color different from the first color. A plurality of second light-emitting elements 20B may include a second light-emitting element 20B that emits light of a second color, and a second light-emitting element 20B that emits light of a third color different from the first and second colors. Hereinafter, the second light-emitting element 20B that emits light of a second color will be referred to as the second light-emitting element 20B1, and the second light-emitting element 20B that emits light of a third color will be referred to as the second light-emitting element 20B2, and so on, to distinguish them.

[0103] In the light-emitting module 100, among the plurality of first light-emitting elements 20A and plurality of second light-emitting elements 20B, there are light-emitting elements 20 that emit red light, light-emitting elements 20 that emit green light, and light-emitting elements 20 that emit blue light. For example, in the light-emitting module 100, the first color can be red, the second color can be green, and the third color can be blue.

[0104] In the light-emitting module 100, the number of first light-emitting elements 20A is greater than the number of second light-emitting elements 20B1, and the number of second light-emitting elements 20B1 is greater than the number of second light-emitting elements 20B2. In the illustrated light-emitting module 100, a light-emitting element 20 with a first luminous efficiency can be used for the first light-emitting element 20A, a light-emitting element 20 with a second luminous efficiency can be used for the second light-emitting element 20B1, and a light-emitting element 20 with a third luminous efficiency can be used for the second light-emitting element 20B2.

[0105] In the light-emitting module 100, semiconductor laser elements containing GaAs-based semiconductors can be used for multiple first light-emitting elements 20A, and semiconductor laser elements containing GaN-based semiconductors can be used for multiple second light-emitting elements 20B. By mounting light-emitting elements 20 of different material systems on separate light-emitting devices in this manner, the stability or ease of manufacturing the light-emitting devices can be improved, and the productivity of the light-emitting module 100 can be increased.

[0106] The length of the first light-emitting element 20A in the direction parallel to the light-emitting surface is greater than the length of the second light-emitting element 20B in the direction parallel to the light-emitting surface. The difference between the two lengths is between 100 μm and 400 μm.

[0107] The length of the first light-emitting element 20A in the third direction is greater than the length of the second light-emitting element 20B in the fourth direction. The difference between the two lengths is between 100 μm and 400 μm. When viewed from above, the length of the first light-emitting element 20A in the direction perpendicular to the third direction is greater than the length of the second light-emitting element 20B in the direction perpendicular to the fourth direction. The difference between the two lengths is between 100 μm and 900 μm.

[0108] The first light-emitting device 1A may have three or more first submounts 30A. In other words, the first light-emitting device 1A may have three or more first submounts 30A. The number of first submounts 30A provided by the first light-emitting device 1A can be seven or less.

[0109] The second light-emitting device 1B may include a number of second submounts 30B that is one or more greater than the number of first submounts 30A that the first light-emitting device 1A has. The number of second submounts 30B of the second light-emitting device 1B may include a number of second submounts 30B that is one or more greater than the number of first submounts 30A that are arranged on the first mounting surface. The number of second submounts 30B that the second light-emitting device 1B has may be less than or equal to the number of first submounts 30A that the first light-emitting device 1A has plus two.

[0110] The length of the first submount 30A in the third direction is greater than the length of the second submount 30B in the fourth direction. The difference between the lengths of the former and the latter is between 100 μm and 400 μm. The length of the former is between 101% and 150% of the length of the latter. By setting the sizes of the first submount 30A and the second submount 30B according to the sizes of the first light-emitting element 20A and the second light-emitting element 20B, it is possible to take into account factors that affect optical properties such as heat dissipation, and to manufacture a light-emitting module 100 that emits light efficiently.

[0111] The length of the second submount 30B in the direction perpendicular to the fourth direction is greater than the length of the first submount 30A in the direction perpendicular to the third direction. The difference between the two lengths is between 70 μm and 300 μm. The length of the former is between 101% and 130% of the length of the latter.

[0112] The first light-emitting element 20A is positioned such that, when viewed from above, a hypothetical straight line passes through one of the three points that divide the short side of the top surface 31 of the first submount 30A into four equal parts, and is parallel to the long side of the top surface 31, and passes through both the light-emitting surface and the side opposite to the light-emitting surface of the first light-emitting element 20A. Hereinafter, this hypothetical straight line will be referred to as the "hypothetical line".

[0113] The first protective element 50A is positioned in a top view at a location where a virtual line parallel to the third direction and passing through the first light-emitting element 20A passes. Furthermore, the first protective element 50A is positioned in a top view at a location where a virtual line passing through the other end of one of the three points that divide the short side of the top surface 31 of the first submount 30A into four equal parts, and parallel to the long side of the top surface 31, also passes through the same location.

[0114] The second light-emitting element 20B is positioned such that, when viewed from above, a virtual line passing through the center of the short side of the upper surface 31 of the second submount 30B and parallel to the long side passes through both the light-emitting surface and the side opposite to the light-emitting surface of the second light-emitting element 20B.

[0115] The second protective element 50B is positioned in a location where, in a top view, it is parallel to the fourth direction and no imaginary line passing through the second light-emitting element 20B passes through it. In other words, the second protective element 50B is positioned such that, in a top view, no straight line parallel to the fourth direction and passing through the second protective element 50B passes through the second light-emitting element 20B.

[0116] For example, when viewed from above, with the light-emitting surface of the light-emitting element 20 facing forward and the opposite side facing backward, the first protective element 50A is positioned to the side of the first light-emitting element 20A, and the second protective element 50B is positioned behind the second light-emitting element 20B. By using this embodiment, which involves different positions for the protective elements 50, the mounting space of the submount 30 can be effectively utilized, enabling the realization of a compact light-emitting module 100.

[0117] The second protection element 50B is positioned on the second submount 30B such that the distance from the second protection element 50B to the second side surface 32B is shorter than the distance from the second light-emitting element 20B to the second side surface 32B. The longest distance from the second side surface 32B to the second protection element 50B is shorter than the shortest distance from the second side surface 32B to the second light-emitting element 20B. The second protection element 50B is positioned in the vicinity of the second side surface 32B.

[0118] The second protective element 50B is positioned such that, when viewed from above, it passes through the center of the length parallel to the light-emitting surface of the second light-emitting element 20B, and no imaginary line perpendicular to the light-emitting surface passes through it. By positioning the second protective element 50B in this manner, it is possible to reduce the influence of light leaking from the side opposite the light-emitting surface.

[0119] With respect to the second submount 30B and the second light-emitting element 20B positioned on the second submount 30B, in a top view, the length of the long side of the top surface 31 is 105% to 150% of the length in the direction perpendicular to the light-emitting surface of the second light-emitting element 20B. Alternatively, in a top view, the length of the second submount 30B in the second direction is 105% to 150% of the length of the second light-emitting element 20B in the second direction.

[0120] With respect to the second submount 30B, the second light-emitting element 20B and the protective element 50 arranged on the second submount 30B, in a top view, the length of the second submount 30B in the second direction is greater than the sum of the length of the second light-emitting element 20B in the second direction and the length of the protective element 50 in the second direction by a range of 200 μm to 500 μm. This reduces the size of the submount 30 in the second direction, allowing the light-emitting device 1 to be manufactured in a smaller size in the second direction.

[0121] The lid member 70 joined to the first base 10A and the lid member 70 joined to the second base 10B are the same size and shape. However, the size and shape of these lid members 70 may be different. By using the same lid member 70, production efficiency can be improved.

[0122] The optical element 80 of the first light-emitting device 1A and the optical element 80 of the second light-emitting device 1B have different shapes. However, the external dimensions of these optical elements 80 when viewed from above are the same size and shape. In the illustrated light-emitting module 100, the optical element 80 is a lens element, and the lens element of the first light-emitting device 1A and the lens element of the second light-emitting device 1B have different lens shapes. The lens element of the second light-emitting device 1B has more lens surfaces than the lens element of the first light-emitting device 1A.

[0123] Let G1 be the difference between the minimum length of the lens surfaces in the connecting direction of the multiple lens surfaces of the optical element 80 of the first light-emitting device 1A and the minimum length of the lens surfaces in the connecting direction of the multiple lens surfaces of the optical element 80 of the second light-emitting device 1B. Also, let G2 be the difference between the spacing between the first submounts 30A in the first light-emitting device 1A and the spacing between the second submounts 30B in the second light-emitting device 1B. In the light-emitting module 100, G2 is smaller than G1. Also, G2 is between 0 μm and 100 μm. This allows the size of the submount 30 to be adjusted to correspond to the size of the lens.

[0124] The length of the second light-emitting element 20B2 in the direction parallel to the light-emitting surface is 95% to 105% of the length of the second light-emitting element 20B1 in the direction parallel to the light-emitting surface. Multiple second light-emitting elements 20B are arranged so that their lengths in the direction parallel to the light-emitting surface are approximately the same.

[0125] Multiple second light-emitting elements 20B1 are arranged in a line in the fourth direction. Multiple second light-emitting elements 20B2 are arranged in a line in the fourth direction. In a top view, on the second mounting surface 11D, the second light-emitting elements 20B1 are arranged in one of the regions divided by a virtual line perpendicular to the fourth direction, and the second light-emitting elements 20B2 are arranged in the other. In this case, the second light-emitting elements 20B2 are not arranged in one region, and the second light-emitting elements 20B1 are not arranged in the other region.

[0126] The second substrate 10B has two wiring sections that, when viewed from above, face each other in the fourth direction and have a plurality of second light-emitting elements 20B arranged between them. In one of the two wiring sections, two wiring patterns 13 are provided for electrically connecting the second light-emitting elements 20B1, and in the other section, two wiring patterns 13 are provided for electrically connecting the second light-emitting elements 20B2.

[0127] The multiple wirings 60 include multiple first wirings 60A for electrically connecting multiple second light-emitting elements 20B1 and multiple second wirings 60B for electrically connecting multiple second light-emitting elements 20B2. In the second light-emitting device 1B, the multiple second light-emitting elements 20B1 are electrically connected in series, and the multiple second light-emitting elements 20B2 are electrically connected in series.

[0128] The multiple first wirings 60A include a first wiring 60A that is joined to the first stepped portion 12C of the second substrate 10B and the second light-emitting element 20B1 closest to the first stepped portion 12C or the second submount 30B on which this second light-emitting element 20B1 is located. The multiple first wirings 60A also include a first wiring 60A that is joined to the first stepped portion 12C of the second substrate 10B and the second light-emitting element 20B1 furthest from the first stepped portion 12C or the second submount 30B on which this second light-emitting element 20B1 is located. Of these two first wirings 60A, one first wiring 60A is joined to a wiring pattern 13 in one of the regions that, in a top view, are divided by an imaginary line parallel to the fourth direction passing through the side of the second light-emitting element 20B1 opposite to the light-emitting surface, while the other first wiring 60A is joined to another wiring pattern 13 in the other region.

[0129] The multiple second wirings 60B include a second wiring 60B that is joined to the second stepped portion 12C of the second substrate 10B and the second light-emitting element 20B2 closest to the second stepped portion 12C or the second submount 30B on which this second light-emitting element 20B2 is located. The multiple second wirings 60B also include a second wiring 60B that is joined to the second stepped portion 12C of the second substrate 10B and the second light-emitting element 20B1 furthest from the second stepped portion 12C or the submount 30 on which this second light-emitting element 20B1 is located. One of these two second wirings 60B is joined to the wiring pattern 13 in one of the regions that, in a top view, are divided by an imaginary line passing through the side opposite to the light-emitting surface of the second light-emitting element 20B1 and parallel to the fourth direction, while the other second wiring 60B is joined to the other wiring pattern 13 in the other region.

[0130] <Second Embodiment> A light-emitting module 200 according to the second embodiment will be described. Figures 1 to 4, 6 to 11, and 14 to 16 are drawings illustrating an exemplary form of the light-emitting module 200. Figure 1 is a perspective view of the light-emitting module 200. Figure 2 is a top view of the light-emitting module 200. Figure 3 is a cross-sectional view taken along the line III-III in Figure 2. Figure 4 is a top view of the wiring board 9 in the light-emitting module 200. Figure 6 is a perspective view of the first light-emitting device 1A. Figure 7 is a top view of the first light-emitting device 1A. Figure 8 is a cross-sectional view taken along the line VIII-VIII in Figure 7. Figure 9 is a top view showing the configuration of each component mounted on the first substrate 10A of the first light-emitting device 1A. Figure 10 is a perspective view of the second light-emitting device 1C. Figure 11 is a top view of the second light-emitting device 1C. Figure 14 is a perspective view illustrating each component arranged inside the first light-emitting device 1A and the second light-emitting device 1C in the light-emitting module 200. Figure 15 is a cross-sectional view taken along the XV-XV section of Figure 11. Figure 16 is a top view showing the configuration of each component mounted on the second substrate 10B of the second light-emitting device 1C.

[0131] The light-emitting module 200 differs from the light-emitting module 100 in that the second light-emitting device 1B of the light-emitting module 100 is replaced by the second light-emitting device 1C, but is otherwise similar. Therefore, the differences between the second light-emitting device 1C and the second light-emitting device 1B will be explained below.

[0132] The second light-emitting device 1C comprises multiple components. These components include a second substrate 10B, multiple second light-emitting elements 20B, multiple second submounts 30B, one or more reflective members 40, multiple second protective elements 50B, multiple wiring 60, a cover member 70, and an optical member 80. In addition, the multiple second light-emitting elements 20B in the second light-emitting device 1C include second light-emitting elements 20B1 and second light-emitting elements 20B2. The second light-emitting device 1C may also comprise other components.

[0133] The second base body 10B (base body 10), the second light-emitting element 20B (light-emitting element 20), the second submount 30B (submount 30), the reflective member 40, the second protective element 50B (protective element 50), the wiring 60, the cover member 70, and the optical member 80 are the same as in the first embodiment, and therefore, the description of each component is as described in the first embodiment.

[0134] The second light-emitting device 1C has different features from the second light-emitting device 1B of the first embodiment, but there are also common parts. Any information described for the second light-emitting device 1B in the first embodiment that does not cause inconsistencies based on Figures 1 to 4, 6 to 11, and 14 to 16 also applies to the second light-emitting device 1C.

[0135] In the second submount 30B where the second light-emitting element 20B1 furthest from the first stepped portion 12C is positioned, the second protective element 50B is positioned further from the first stepped portion 12C than the first wiring 60A which is connected to the first stepped portion 12C and the second submount 30B.

[0136] In the second submount 30B where the second light-emitting element 20B2 furthest from the second stepped portion 12C is positioned, the second protective element 50B is positioned further from the second stepped portion 12C than the second wiring 60B that is connected to the second stepped portion 12C and the second submount 30B. This allows the length of the wiring 60 to be reduced, thereby improving stability.

[0137] In each of the second submounts 30B on which multiple second light-emitting elements 20B1 are arranged, the second protection element 50B is positioned at the same location on the second submount 30B when viewed from above. In each of the second submounts 30B on which multiple second light-emitting elements 20B2 are arranged, the second protection element 50B is positioned at the same location on the second submount 30B.

[0138] <Third Embodiment> A light-emitting module 300 according to a third embodiment will be described. Figures 1 to 4, 6 to 11, and 17 to 19 are drawings illustrating an exemplary form of the light-emitting module 300. Figure 1 is a perspective view of the light-emitting module 300. Figure 2 is a top view of the light-emitting module 300. Figure 3 is a cross-sectional view taken along the line III-III in Figure 2. Figure 4 is a top view of the wiring board 9 in the light-emitting module 300. Figure 6 is a perspective view of the first light-emitting device 1A. Figure 7 is a top view of the first light-emitting device 1A. Figure 8 is a cross-sectional view taken along the line VIII-VIII in Figure 7. Figure 9 is a top view showing the configuration of each component mounted on the first substrate 10A of the first light-emitting device 1A. Figure 10 is a perspective view of the second light-emitting device 1D. Figure 11 is a top view of the second light-emitting device 1D. Figure 17 is a perspective view illustrating each component arranged inside the first light-emitting device 1A and the second light-emitting device 1D in the light-emitting module 300. Figure 18 is a cross-sectional view taken along the XVIII-XVIII section of Figure 11. Figure 19 is a top view showing the configuration of each component mounted on the second substrate 10C of the second light-emitting device 1D.

[0139] Light-emitting module 300 differs from light-emitting module 100 in that the second light-emitting device 1B of light-emitting module 100 is replaced by the second light-emitting device 1D, but is otherwise similar. Similarly, light-emitting module 300 differs from light-emitting module 200 in that the second light-emitting device 1C of light-emitting module 200 is replaced by the second light-emitting device 1D, but is otherwise similar. Therefore, the differences between the second light-emitting device 1D and the second light-emitting devices 1B and 1C will be explained below.

[0140] The second light-emitting device 1D comprises multiple components. These components include a second substrate 10C, multiple second light-emitting elements 20B, multiple second submounts 30B, multiple third submounts 30C, one or more reflective members 40, multiple second protective elements 50B, multiple wiring 60, a cover member 70, and an optical member 80. The second light-emitting device 1D may also comprise other components.

[0141] The second light-emitting element 20B (light-emitting element 20), the second submount 30B (submount 30), the reflective member 40, the second protective element 50B (protective element 50), the wiring 60, the cover member 70, and the optical member 80 are the same as in the first embodiment, and therefore, the description of each component is as described in the first embodiment.

[0142] The second substrate 10C has different characteristics from the second substrate 10B of the first embodiment, but there are also common parts. Any information described for the second substrate 10B in the first embodiment that does not cause inconsistencies based on Figures 1 to 4, 6 to 11, and 17 to 19 also applies to the second substrate 10C. The different characteristics of the second substrate 10C will be described below.

[0143] (2nd base 10C) In the second base body 10C, the second stepped portion 12C is formed along a part or all of the second inner surface 11E and a part of the inner surface 11E that intersects with the second inner surface 11E (hereinafter referred to as the third inner surface). The second stepped portion 12C can be described as a stepped portion 12C that is integrally formed along the adjacent second inner surface 11E and the third inner surface 11E, respectively.

[0144] The second stepped portion 12C is formed along the entire inner surface 11E that extends in the direction of the shorter side of the rectangular outer edge of the second base body 10C, and a portion of the inner surface 11E that extends in the direction of the longer side of this outer edge. The second stepped portion 12C is formed along the inner surface 11E with a length of 10% or more but less than 50% of the inner surface 11E that extends in the direction of the longer side.

[0145] In the illustrated second light-emitting device 1D, the second inner surface 11E extends in the direction of the shorter side of the rectangular outer edge of the second base body 10C, and the third inner surface 11E extends in the direction of the longer side. Furthermore, the second base body 10C does not have a stepped portion 12C formed along the inner surface 11E facing the third inner surface 11E.

[0146] In the second stepped portion 12C, a wiring pattern 13 is provided in both the portion formed along the inner surface 11E extending in the short-side direction of the rectangular outer edge of the second base body 10C and the portion formed along the inner surface 11E extending in the long-side direction.

[0147] The second light-emitting device 1D will now be described. The second light-emitting device 1D has different features from the second light-emitting device 1B of the first embodiment and the second light-emitting device 1C of the second embodiment, but there are also common parts. The contents described for the second light-emitting device 1B in the first embodiment and the contents described for the second light-emitting device 1C in the second embodiment that do not cause inconsistencies based on Figures 1 to 4, Figures 6 to 11, and Figures 17 to 19 also apply to the second light-emitting device 1D.

[0148] (Second light-emitting device 1D) In the second light-emitting device 1D, the length of the upper surface 31 of the third submount 30C in the direction of the long side is smaller than the length of the upper surface 31 of the second submount 30B in the direction of the long side. The length of the upper surface 31 of the third submount 30C in the direction of the short side may be the same as the length of the upper surface 31 of the second submount 30B in the direction of the short side.

[0149] The third submount 30C does not have a second protective element 50B. By not having a second protective element 50B, the length of the upper surface 31 in the long side direction can be made shorter than that of the second submount 30B.

[0150] With respect to the length in the longer side direction, the second submount 30B is larger than the third submount 30C by a range of 100 μm to 600 μm. This ensures that the area for arranging the second protective element 50B in the second submount 30B is secured while suppressing an increase in the size of the substrate 10.

[0151] In the second light-emitting device 1D, one of the second light-emitting element 20B1 and the second light-emitting element 20B2 is placed on the second submount 30B, and the other is placed on the third submount 30C. In the illustrated second light-emitting device 1D, the second light-emitting element 20B1 is placed on the second submount 30B, and the second light-emitting element 20B2 is placed on the third submount 30C.

[0152] The second submount 30B is positioned on the side of the first stepped section 12C, and the third submount 30C is positioned on the side of the second stepped section 12C.

[0153] In relation to the portion formed along the third inner surface 11E of the second stepped portion 12C, the third submount 30C is perpendicular to the third inner surface 11E in a top view and is positioned where a virtual line passing through this portion of the second stepped portion 12C passes. The second submount 30B is parallel to the third inner surface 11E in a top view and is positioned where a virtual line passing through this portion of the second stepped portion 12C passes. The second light-emitting element 20B1 located on the second submount 30B is not positioned where this virtual line passes. The second protection element 50B located on the second submount 30B is positioned where this virtual line passes.

[0154] The second protective element 50B that protects the second light-emitting element 20B2, which is located on the third submount 30C, is located on the second stepped portion 12C. One second protective element 50B that protects multiple second light-emitting elements 20B2, each located on the third submount 30C, is located on the second stepped portion 12C. There is one second protective element 50B located on the second stepped portion 12C. This reduces the number of protective elements 50 used compared to placing a protective element 50 on each individual light-emitting element 20.

[0155] The plurality of wirings 60 joined to the second stepped portion 12C include wirings 60 joined to the third submount 30C located closest to the second inner surface 11E or to the second light-emitting element 20B2 located on this third submount 30C, and wirings 60 joined to the third submount 30C located furthest from the second inner surface 11E or to the second light-emitting element 20B2 located on this third submount 30C. In the second stepped portion 12C, the second protective element 50B is positioned between these two wirings 60. The former wirings 60 are joined to the wiring pattern 13 in the portion formed along the second inner surface 11E of the second stepped portion 12C, and the latter wirings 60 are joined to the wiring pattern 13 in the portion formed along the third inner surface 11E of the second stepped portion 12C.

[0156] In the second light-emitting device 1D, the number of second submounts 30B arranged on the second mounting surface 11D is greater than the number of third submounts 30C arranged on the second mounting surface 11D. The number of second submounts 30B arranged on the second mounting surface 11D is 3 or more.

[0157] When a protective element 50 is provided on the light-emitting element 20 in a one-to-one ratio, if the protective element 50 is placed on the stepped portion 12C, the connection of the wiring 60 with the submount 30 becomes complicated. However, by using a second submount 30B, the semiconductor laser element 20 and the protective element 50 can be placed on the submount 30, making the connection of the wiring 60 easier.

[0158] The more light-emitting elements 20 connected in series there are, the more important it is to protect each individual light-emitting element 20. On the other hand, if the number of light-emitting elements 20 connected in series is not that large, there is also the idea of ​​protecting them all together with a single protection element 50. According to this idea, it can be said that it is preferable for the number of third submounts 30C arranged on the second mounting surface 11D to be two or less.

[0159] The distance from the second inner surface 11E to the point furthest from the second inner surface 11E in the portion of the second stepped portion 12C that is partially provided on the third inner surface 11E is shorter than the distance from the second inner surface 11E to the second submount 30B which is positioned closest to the second inner surface 11E. This allows the second submount 30B to be positioned without contacting the second stepped portion 12C.

[0160] In the second light-emitting device 1D, the difference between the length of the second submount 30B in the long side direction and the length of the third submount 30C in the long side direction is smaller than the length perpendicular to the third inner surface 11E in the portion of the second stepped portion 12C formed along the third inner surface 11E. This difference in length is preferably 30% to 90% of the length perpendicular to the third inner surface 11E in the portion of the second stepped portion 12C formed along the third inner surface 11E. This can make the effect of partially providing the stepped portion 12C more pronounced.

[0161] <Fourth Embodiment> A light-emitting module 400 according to the fourth embodiment will now be described. Figures 1 to 4, 6, 7, 10 to 13, and 20 are drawings illustrating an exemplary form of the light-emitting module 400. Figure 1 is a perspective view of the light-emitting module 400. Figure 2 is a top view of the light-emitting module 400. Figure 3 is a cross-sectional view taken along the line III-III in Figure 2. Figure 4 is a top view of the wiring board 9 in the light-emitting module 400. Figure 6 is a perspective view of the first light-emitting device 1E. Figure 7 is a top view of the first light-emitting device 1E. Figure 10 is a perspective view of the second light-emitting device 1B. Figure 11 is a top view of the second light-emitting device 1B. Figure 12 is a cross-sectional view taken along the line XII-XII in Figure 11. Figure 13 is a top view showing the configuration of each component mounted on the second substrate 10B of the second light-emitting device 1B. Figure 20 is a top view showing the configuration of each component mounted on the first substrate 10A of the first light-emitting device 1E.

[0162] The light-emitting module 400 differs from the light-emitting module 100 in that the first light-emitting device 1A of the light-emitting module 100 is replaced by the first light-emitting device 1E, but otherwise they are the same. Furthermore, the light-emitting module 400 may also include a second light-emitting device 1C or a second light-emitting device 1D instead of the second light-emitting device 1B. Therefore, the differences between the first light-emitting device 1E and the first light-emitting device 1A will be explained below.

[0163] (First light-emitting device 1E) The first light-emitting device 1E has different features from the first light-emitting device 1A of the first to third embodiments, but there are also common parts. Any information described for the first light-emitting device 1A in the first to third embodiments that does not cause inconsistencies based on Figure 20 also applies to the first light-emitting device 1E.

[0164] In the first light-emitting device 1E, the first protective element 50A is positioned on the wiring portion of the first base body 10A. The first protective element 50A is positioned on the upper surface of the stepped portion 12C of the first base body 10A. In the first light-emitting device 1E, the first protective element 50A is not positioned on the first submount 30A.

[0165] <Fifth Embodiment> A light-emitting module 500 according to the fifth embodiment will now be described. Figures 6 to 13, 21, and 22 are drawings illustrating an exemplary embodiment of the light-emitting module 500. Figure 21 is a top view of the light-emitting module 500. Figure 22 is a top view of the wiring board 99 in the light-emitting module 500. Figure 6 is a perspective view of the first light-emitting device 1A. Figure 7 is a top view of the first light-emitting device 1A. Figure 8 is a cross-sectional view taken along the VIII-VIII section of Figure 7. Figure 9 is a top view showing the configuration of each component mounted on the first substrate 10A of the first light-emitting device 1A. Figure 10 is a perspective view of the second light-emitting device 1B. Figure 11 is a top view of the second light-emitting device 1B. Figure 12 is a cross-sectional view taken along the XII-XII section of Figure 11. Figure 13 is a top view showing the configuration of each component mounted on the second substrate 10B of the second light-emitting device 1B. In Figure 22, the inclusion rectangles are indicated by dashed lines, with the inclusion rectangle related to the first connection pattern 9A1 indicated by symbol H1 and the inclusion rectangle related to the second connection pattern 9A2 indicated by symbol H2. Also, the dashed line L1 is a virtual line parallel to the Y direction.

[0166] The light-emitting module 500 differs from the light-emitting module 100 in that the wiring board 9 of the light-emitting module 100 is replaced with the wiring board 99, and the orientation of the first light-emitting device 1A and the second light-emitting device 1B is different, but is otherwise similar. Furthermore, in the light-emitting module 500, the first light-emitting device 1E of the fourth embodiment can be used instead of the first light-emitting device 1A of the first embodiment. Also, in the light-emitting module 500, the second light-emitting device 1C of the second embodiment or the second light-emitting device 1D of the third embodiment can be used instead of the second light-emitting device 1B of the first embodiment. In other words, the light-emitting module 500 differs from the light-emitting modules 200, 300, and 400 in similar respects, but is otherwise similar. Figures 15 and 16, or 18 and 19, can also optionally serve as diagrams illustrating the light-emitting module 500 according to the fifth embodiment.

[0167] The following describes the wiring board 99 in the light-emitting module 500. The wiring board 99 has different features from the wiring board 9 of the first to third embodiments, but there are also common parts. Of the contents described for the wiring board 9 in the first to third embodiments, those that do not cause inconsistencies based on Figures 21 and 22 also apply to the wiring board 99.

[0168] (Wiring board 99) In the wiring board 99, the first connection pattern 9A1 and the second connection pattern 9A2 are connection patterns 9A of the same shape. However, they do not have to be connection patterns of the same shape. The rectangle encompassing the first connection pattern 9A1 and the second connection pattern 9A2 is a rectangle with a long side and a short side.

[0169] The first connection pattern 9A1 and the second connection pattern 9A2 are arranged side by side with their orientations reversed. On the wiring board 99, the first connection pattern 9A1 has an enclosing rectangle of the same size and shape as the second connection pattern 9A2, but its orientation is 90 degrees different from that of the enclosing rectangle of the second connection pattern 9A2.

[0170] In a top view, the imaginary line connecting the center point P1 of the inclusion rectangle of the first connection pattern 9A1 and the center point P2 of the inclusion rectangle of the second connection pattern 9A2 is not parallel to the Y direction. In other words, this imaginary line is inclined with respect to the Y direction. The angle of inclination of this imaginary line with respect to the Y direction (hereinafter referred to as the first angle) is greater than 0 degrees and less than 45 degrees. The first angle can be 20 degrees or less.

[0171] Next, the light-emitting module 500 will be described. The light-emitting module 500 has different features from the light-emitting modules of the first to fourth embodiments, but there are also common parts. Of the contents described for the light-emitting modules in the first to fourth embodiments, those that do not cause inconsistencies based on Figures 6 to 13, 15, 16, and 18 to 22 also apply to the light-emitting module 500.

[0172] (Light-emitting module 500) In the light-emitting module 500, the first light-emitting device 1A and the second light-emitting device 1B are arranged on the wiring board 99 in different orientations. In a top view, the orientation in which the first light-emitting device 1A is arranged is rotated 90 degrees relative to the orientation in which the second light-emitting device 1B is arranged. In the light-emitting module 500, the third and fourth directions are orthogonal.

[0173] The polarization direction of the light emitted from the first light-emitting element 20A is different from the polarization direction of the light emitted from the second light-emitting element 20B. The polarization direction of the light emitted from the first light-emitting element 20A may be p-polarized, and the polarization direction of the light emitted from the second light-emitting element 20B may be s-polarized. Alternatively, the polarization direction of the light emitted from the first light-emitting element 20A may be s-polarized, and the polarization direction of the light emitted from the second light-emitting element 20B may be p-polarized.

[0174] The polarization direction of the light emitted from the first light-emitting device 1A is the same as the polarization direction of the light emitted from the second light-emitting device 1B. The velocity axis direction of the FFP of the light emitted from the first light-emitting device 1A after passing through the optical member 80 of the first light-emitting device 1A is in the X direction, and the velocity axis direction of the FFP of the light emitted from the first light-emitting device 1A after passing through the optical member 80 of the second light-emitting device 1B is in the Y direction.

[0175] The angle of inclination of the imaginary line L2, which connects the points where the optical axes of the light emitted from each of the multiple first light-emitting elements 20A exit the first light-emitting device 1A, with respect to the Y direction (hereinafter referred to as the second angle), is smaller than the first angle. The second angle is between 0 degrees and less than 20 degrees. The second angle of the illustrated light-emitting module 500 is 0 degrees. In other words, the optical axes of the light emitted from each of the multiple first light-emitting elements 20A are aligned parallel to the Y direction at the point where they exit the first light-emitting device 1A.

[0176] The angle of inclination of the imaginary line with respect to the Y direction (hereinafter referred to as the third angle) connecting the midpoint P3 of the line segment connecting the points where the optical axes of light emitted from each of the two first light-emitting elements 20A located at both ends of the multiple first light-emitting elements 20A arranged in the third direction are emitted from the first light-emitting device 1A, and the midpoint P4 of the line segment connecting the points where the optical axes of light emitted from each of the two second light-emitting elements 20B located at both ends of the multiple second light-emitting elements 20B arranged in the fourth direction are emitted from the second light-emitting device 1B, is smaller than the first angle. The third angle is between 0 degrees and 10 degrees. The third angle of the illustrated light-emitting module 500 is 0 degrees. The positions of the two connection patterns 9A on the wiring board 99 are adjusted so that the third angle is 0 degrees, and as a result the first angle becomes greater than 0 degrees.

[0177] Although various embodiments of the present invention have been described above, the light-emitting module according to the present invention is not strictly limited to the light-emitting module of each embodiment. In other words, the present invention is not limited to the external shape and structure of the light-emitting module disclosed in each embodiment. The present invention can be applied without requiring all components to be present in sufficient quantities. For example, if some of the components of the light-emitting module disclosed in the embodiment are not described in the claims, a degree of design freedom for those skilled in the art is permitted for those components, such as substitution, omission, modification of shape, or change of material, and the invention described in the claims is then specified to be applicable. [Industrial applicability]

[0178] The light-emitting modules described in each embodiment can be used in projectors, in-vehicle headlights, head-mounted displays, lighting, displays, and the like. [Explanation of symbols]

[0179] 100, 200, 300, 400, 500 light-emitting modules 1. Light-emitting device 1A, 1E First light-emitting device 1B, 1C, 1D Second light-emitting device 10 Base 10A 1st base 10B, 10C 2nd base 11A Top 11B Bottom side 11C External surface 11D Implementation side 11E Inside surface 12C Step section 13 Wiring Patterns 20 Light-emitting elements 20A First light-emitting element 20B, 20B1, 20B2 Second light-emitting element 30 Submount 31 Top side 32 Side view 32A 1st side 32B 2nd side 30A First Submount 30B Second Submount 30C Third Submount 40 Reflective material 50 protective elements 50A First protective element 50B Second protective element 60 Wiring 60A First Wiring 60B 2nd wiring 70 Lid member 80 Optical components 9.99 Wiring board 9A Connection Pattern 9A1 First Connection Pattern 9A2 Second Connection Pattern 9B Wiring area

Claims

1. A wiring board having a first connection pattern and a second connection pattern on its upper surface, A first light-emitting device comprising: a plurality of first semiconductor laser elements that emit red light; a first substrate having a first mounting surface on which the plurality of first semiconductor laser elements are arranged, bonded to the first connection pattern of the wiring substrate, and electrically connected to the plurality of first semiconductor laser elements and the wiring substrate; A second light-emitting device comprising: a plurality of second semiconductor laser elements emitting green light; one or more third semiconductor laser elements emitting blue light; a second substrate having a second mounting surface on which the plurality of second semiconductor laser elements and one or more third semiconductor laser elements are arranged; a second substrate bonded to the wiring board in the second connection pattern; and electrically connected to the plurality of second semiconductor laser elements, the one or more third semiconductor laser elements, and the wiring board; Equipped with, A light-emitting module in which the number of the plurality of first semiconductor laser elements is greater than the number of the plurality of second semiconductor laser elements, and the number of the plurality of second semiconductor laser elements is greater than the number of one or more third semiconductor laser elements.

2. The plurality of first semiconductor laser elements are arranged in a line in the first direction, The plurality of second semiconductor laser elements and one or more third semiconductor laser elements are arranged in a line in the second direction. The light-emitting module according to claim 1, wherein the length of the first substrate in the first direction is 90% or more and 105% or less of the length of the second substrate in the second direction.

3. The light-emitting module according to claim 1 or 2, wherein the first substrate and the second substrate are of the same size and shape.

4. The first substrate has a first inner surface and a second inner surface facing each other, a first stepped portion formed along the first inner surface and having a wiring pattern on its upper surface, and a second stepped portion formed along the second inner surface and having a wiring pattern on its upper surface, The second base body has a first inner surface and a second inner surface facing each other, a first stepped portion formed along the first inner surface of the second base body and having a plurality of wiring patterns on its upper surface, and a second stepped portion formed along the second inner surface of the second base body and having a plurality of wiring patterns on its upper surface, The plurality of first semiconductor laser elements are electrically connected to the wiring pattern provided on the upper surface of the first stepped portion of the first substrate and to the wiring pattern provided on the upper surface of the second stepped portion of the first substrate. The plurality of second semiconductor laser elements are electrically connected to the plurality of wiring patterns provided on the upper surface of the first stepped portion of the second substrate. The light-emitting module according to any one of claims 1 to 3, wherein the one or more third semiconductor laser elements are electrically connected to the plurality of wiring patterns provided on the upper surface of the second stepped portion of the second substrate.

5. The light-emitting module according to any one of claims 1 to 4, wherein the number of the plurality of first semiconductor laser elements is less than the number of the plurality of second semiconductor laser elements and one or more third semiconductor laser elements.

6. Each of the first light-emitting devices further has a plurality of first submounts on which the first semiconductor laser element is arranged. The second light-emitting device further has a plurality of second submounts on which the second semiconductor laser element or the third semiconductor laser element is arranged, The aforementioned plurality of first submounts are each submount of the same size and shape. The light-emitting module according to any one of claims 1 to 5, wherein each of the plurality of second submounts is a submount of the same size and shape.

7. The light-emitting module according to claim 6, wherein the first submount and the second submount differ in size and shape from each other.

8. The first light-emitting device further comprises a plurality of first reflective members, each of which reflects light emitted from the first semiconductor laser element. The second light-emitting device further comprises a plurality of second reflective members, each of which reflects light emitted from the second semiconductor laser element or the third semiconductor laser element. The aforementioned plurality of first reflective members are all reflective members of the same size and shape. The aforementioned plurality of second reflective members are all reflective members of the same size and shape. The light-emitting module according to claim 6 or 7, wherein the first reflective member and the second reflective member are of the same size and shape.

9. The first light-emitting device further comprises a first lid member joined to the first substrate, The second light-emitting device further comprises a second cover member joined to the second substrate, Equipped with, The plurality of first semiconductor laser elements are arranged in a sealing space defined by the first substrate and the first lid member. The plurality of second semiconductor laser elements and one or more third semiconductor laser elements are arranged in a sealing space defined by the second substrate and the second lid member. The light-emitting module according to any one of claims 1 to 8, wherein the first lid member and the second lid member are of the same size and shape.

10. No blue or green light is emitted from the first light-emitting device. The light-emitting module according to any one of claims 1 to 9, wherein no red light is emitted from the second light-emitting device.

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