Semiconductor manufacturing equipment

Abstract

To provide a manufacturing device of a semiconductor device which can further efficiently suppress the unintended vibration of a table.SOLUTION: A manufacturing device 10 comprises: a base 12; a table 14 on which a semiconductor device or its raw material is placed; and a moving mechanism 16 which moves the table 14 to the base 12. The moving mechanism 16 has: a movable unit 30 which moves in a prescribed slide direction together with the table 12; a vibration control unit 20 which is connected to the base 12 so as to be movable in a direction in which a reaction force received from the movable unit 30 is eliminated; a conductor plate 52 which is attached to the base 12, and has non-magnetism and conductivity; and a magnet flux forming mechanism 70 which is attached to the vibration control unit 20, and forms a magnetic flux which penetrating the conductive plate 52. The conductive plate 52 is formed into such a shape that a magnetic flux amount which can penetrate a material of the conductive plate 52 is increased as approaching an end part of a stroke.SELECTED DRAWING: Figure 2

Description

[[Technical Field]]

[0001] The present specification discloses a semiconductor device manufacturing apparatus including a base, a table, and a moving mechanism that moves the table relative to the base. [[Background Art]]

[0002] Conventionally, there have been semiconductor device manufacturing apparatuses such as wire bonding apparatuses and die bonding apparatuses (hereinafter referred to as "manufacturing apparatuses"). Such a manufacturing apparatus generally includes a table on which a semiconductor device or a substrate is placed, and a moving mechanism that moves the table relative to a base.

[0003] The moving mechanism includes, for example, a movable unit and a vibration damping unit that moves the movable unit by electromagnetic action. The movable unit is connected to the table, and the vibration damping unit is connected to the base. Here, when the vibration damping unit is completely fixed to the base, the reaction force generated when the movable unit moves is transmitted to the base via the vibration damping unit. This may cause unintended vibration in the base and consequently in the table.

[0004] Patent Document 1 discloses an XY table for semiconductor manufacturing equipment. This XY table includes a driving body (corresponding to a movable unit) that moves together with the table, and a motor body (corresponding to a vibration damping unit) that moves the movable unit by electromagnetic action. In Patent Document 1, the motor body is allowed to move in the opposite direction to the driving body when the driving body is driven. With this configuration, the reaction force generated along with the movement of the driving body can be canceled out by the movement of the motor body. As a result, unintended vibration of the base and consequently the table can be suppressed, and the quality of the manufactured semiconductor device can be further improved. [[Prior Art Literature]] [[Patent Literature]]

[0005] [[Patent Document 1]] Patent No. 4021158 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] In order to suppress table vibrations, the damping rate of the vibration damping unit's motion should be small. However, if the damping rate at the end of the vibration damping unit's stroke is small, the vibration damping unit may collide with other components, causing a large impact. As a result, unintended vibrations of the table may not be sufficiently suppressed.

[0007] Therefore, this specification discloses a manufacturing apparatus that can more effectively suppress unintended vibrations of a table. [Means for solving the problem]

[0008] A manufacturing apparatus disclosed herein comprises a base, a table on which a semiconductor device or its material is placed, and a moving mechanism for moving the table relative to the base, wherein the moving mechanism includes a movable unit connected to the table and moving together with the table in a predetermined sliding direction, a vibration damping unit connected to the base so as to be movable in a direction that relieves the reaction force received from the movable unit, a non-magnetic and conductive conductor plate attached to either the vibration damping unit or the base, and a damper magnet attached to the other of the vibration damping unit or the base, which moves relative to the conductor plate within a predetermined stroke as the vibration damping unit moves and generates a magnetic flux that penetrates the conductor plate, wherein the conductor plate is shaped such that, when the generated magnetic flux density is uniform, the magnetic flux penetrating the material of the conductor plate is greater at its edges than in its center.

[0009] In this case, the width dimension of the end of the conductor plate may increase continuously as it approaches the end of the stroke.

[0010] Furthermore, the conductor plate may have a plurality of adjustment holes, and the area of ​​the adjustment holes at the end of the conductor plate may be smaller than that at the central portion.

[0011] Furthermore, the conductor plate may be fixed to the base, and the damper magnet may be fixed to the vibration damping unit.

[0012] Furthermore, the magnetic damper, which includes the conductor plate and the damper magnet, may be arranged on both sides of the center of gravity of the vibration damping unit.

[0013] Furthermore, the pair of damper magnets are arranged facing each other with the conductor plate in between, and an adjustment mechanism may be provided to change the relative position of the pair of damper magnets in order to change the area of ​​contact between the pair of damper magnets. [Effects of the Invention]

[0014] According to the semiconductor device manufacturing apparatus disclosed herein, the damping force of the vibration damping unit's motion can be increased towards the ends of the stroke rather than in the middle. As a result, while suppressing the damping of the vibration damping unit near the middle of the stroke, it is possible to effectively prevent the vibration damping unit from colliding with the end of the stroke. This allows for more effective suppression of unintended vibrations of the table. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic plan view of the manufacturing equipment. [Figure 2] This is a schematic side view of the moving mechanism. [Figure 3] This is a cross-sectional view AA in Figure 2. [Figure 4] This is a schematic diagram illustrating the action of a magnetic damper. [Figure 5] This figure shows an example of an adjustment mechanism. [Figure 6] This figure shows another example of the conductor plate 52. [Modes for carrying out the invention]

[0016] Hereinafter, the configuration of the manufacturing apparatus 10 will be described with reference to the drawings. FIG. 1 is a schematic plan view of the manufacturing apparatus 10. This manufacturing apparatus 10 includes a table on which a semiconductor device or a material thereof (hereinafter, both are collectively referred to as a "placed object") is placed, and a tool head that performs predetermined processing on the placed object. In FIG. 1, illustration of the tool head is omitted. Note that the material of the semiconductor device includes, for example, a substrate or a wafer. Further, the tool head performs, for example, transfer processing, wire bonding processing, die bonding processing, etc. on the placed object.

[0017] The table 14 is movable in a first axial direction Af and a second axial direction As orthogonal to the first axial direction Af. In order to move this table 14, the manufacturing apparatus 10 further includes a first moving mechanism 16f and a second moving mechanism 16s.

[0018] The second moving mechanism 16s moves the table 14 in the second axial direction As. The first moving mechanism 16f moves the table 14 in the first axial direction Af together with the movable unit 30s of the second moving mechanism 16s.

[0019] The first moving mechanism 16f is broadly divided into a movable unit 30f and a vibration damping unit 20f. The movable unit 30f is further broadly divided into a sub-table 31f and a mover 32f. The sub-table 31f is arranged below the table 14 and holds the table 14 via a movement guide 40s. The table 14 moves in the first axial direction Af together with the sub-table 31f, and is movable in the second axial direction As along the movement guide 40s.

[0020] The mover 32f is fixed to the sub-table 31f. A coil 34f is wound around the mover 32f. When a voltage is supplied to the coil 34f, the movable unit 30f moves in the first axial direction Af in accordance with the direction of the current generated by the voltage.

[0021] The vibration damping unit 20f includes a frame 23f and a permanent magnet 24f. The frame 23f is attached to the base 12 via an absorption guide 42 (not visible in FIG. 1) described later. A plurality of permanent magnets 24f forming magnetic poles are attached to the frame 23f. Due to the electromagnetic interaction between the permanent magnets 24f and the coil 34f, the movable unit 30f moves in the first axial direction Af. Here, the weight of the vibration damping unit 20f is sufficiently larger than the weight of the movable unit 30f. The reason for adopting this configuration will be described later. In the present example, the mover 32f is provided with the coil 34f, and the stator 22f is provided with the permanent magnet 24f. However, as long as the movable unit 30f can be linearly moved, the configurations of the mover 32f and the stator 22f may be appropriately changed. For example, the mover 32f may be provided with the permanent magnet 24f, and the stator 22f may be provided with the coil 34f. Further, instead of the permanent magnet 24f, an electromagnet that generates magnetic flux by passing a current through a coil may be used.

[0022] The second moving mechanism 16s has a configuration similar to that of the first moving mechanism 16f. That is, the second moving mechanism 16s is also broadly divided into a vibration damping unit 20s and a movable unit 30s. The mover 32s of the movable unit 30s is connected to the table 14, and moves the table 14 in the second axial direction As. Further, as described above, since the table 14 is connected to the movable unit 30f of the first moving mechanism 16f via the moving guide 40s, both the table 14 and the movable unit 30s move in the first axial direction Af.

[0023] The vibration damping unit 20s, like the vibration damping unit 20f, has a frame 23s and a stator 22s. The frame 23f is attached to the base 12 via an absorption guide 42 (not visible in Figure 1). The stator 22s also has a permanent magnet 24s that generates an electromagnetic effect with the coil 34s. When a voltage is supplied to the coil 34s, the movable unit 30s moves in the second axial direction As according to the direction of the current caused by that voltage. Here, in the second moving mechanism 16s as well, the weight of the vibration damping unit 20s is sufficiently greater than the weight of the movable unit 30s. The configuration of the movable element 32s and the stator 22s may also be changed as appropriate.

[0024] Here, we will explain why the weight of the vibration damping units 20f and 20s is greater than the weight of the movable units 30f and 30s. Since the basic principle is the same for the first moving mechanism 16f and the second moving mechanism 16s, the subscripts f and s will be omitted below, and it will be described simply as "moving mechanism 16". The same applies to other components.

[0025] Figure 2 is a schematic side view of the moving mechanism 16, and Figure 3 is a cross-sectional view of AA in Figure 2. As described above, the frame 23 of the vibration damping unit 20 is attached to the base 12 via an absorption guide 42. The absorption guide 42 is, for example, a slide rail, which holds the vibration damping unit 20 so that it can slide in a predetermined guide direction. This guide direction (and thus the sliding direction of the vibration damping unit 20) is parallel to the direction of movement of the movable unit 30.

[0026] Thus, in this example, the vibration damping unit 20 is made movable in a direction parallel to the direction of movement of the movable unit 30. This configuration is used to absorb the reaction force generated when the movable unit 30 moves by the sliding movement of the vibration damping unit 20. That is, when the movable unit 30 moves in a predetermined sliding direction to move the table 14, the vibration damping unit 20 receives a force of equal magnitude but in the opposite direction as a reaction to that motion. At this time, if the vibration damping unit 20 is fixed to the base 12, this opposite force is transmitted to the base 12. When the base 12 vibrates in response to this force, the vibration is also transmitted to the table 14 which is indirectly connected to the base 12, leading to a decrease in the quality of the semiconductor device, etc.

[0027] In this example, to suppress vibrations of the base 12 and, consequently, the table 14, the vibration damping unit 20 is made slidable relative to the base 12. With this configuration, when the movable unit 30 slides, the vibration damping unit 20 slides in the opposite direction to the movable unit 30. For example, in Figure 2, when the movable unit 30 moves to the right side of the page, the vibration damping unit 20 moves to the left side of the page. This suppresses the transmission of force to the base 12 and thus suppresses vibrations of the table 14.

[0028] Here, the acceleration of the vibration damping unit 20 as it slides is inversely proportional to the weight of the movable unit 30 and the weight of the vibration damping unit 20. Therefore, the greater the weight of the vibration damping unit 20 is compared to the weight of the movable unit 30, the smaller the acceleration of the vibration damping unit 20 and, consequently, the distance it travels. In this example, in order to minimize the distance the vibration damping unit 20 travels, which is necessary to suppress the recoil, the weight of the vibration damping unit 20 is made sufficiently larger than the weight of the movable unit 30.

[0029] However, there are limits to how much the vibration damping unit 20 can be increased in weight. Therefore, it is often not possible to sufficiently reduce the travel distance of the vibration damping unit 20 necessary to suppress the recoil. On the other hand, if the stroke of the vibration damping unit 20 is made excessively large, it leads to another problem: an increase in the overall size of the device. For this reason, in most cases, the stroke of the vibration damping unit 20 is limited to a certain range. However, in this case, there is a risk that the vibration damping unit 20 may collide with the end of the stroke, i.e., the stroke end, causing unnecessary impact.

[0030] Therefore, some propose placing a mechanical damper at the stroke end to mitigate the impact of collisions with the vibration damping unit 20. However, it is difficult to absorb the impact with mechanical dampers alone. In addition, a large mechanical damper is often required, leading to problems such as the size and cost of the device. Another proposal is to add sliding resistance to the absorption guide 42 to dampen the motion of the vibration damping unit 20. However, in this case, it is difficult to change the characteristics of the sliding resistance once it has been installed, making it difficult to adjust the damping force according to the position and speed of the vibration damping unit 20, the aging deterioration of the absorption guide 42, etc.

[0031] In this example, magnetic dampers 50 are provided on the vibration damping unit 20 to effectively prevent collisions with the stroke end of the vibration damping unit 20 and to effectively suppress unintended vibrations of the table 14. The magnetic dampers 50 are dampers that utilize the Lorentz force as a damping force. As shown in Figure 3, one magnetic damper 50 is provided on each side of the vibration damping unit 20. Furthermore, the magnetic dampers 50 are located at approximately the same height as the center of gravity of the vibration damping unit 20. In other words, one magnetic damper 50 is provided symmetrically on each side of the center of gravity of the vibration damping unit 20.

[0032] The magnetic damper 50 includes a conductor plate 52 and a magnetic flux forming mechanism 70. The conductor plate 52 is a flat plate made of a metal that is both non-magnetic and conductive, such as copper or aluminum. The conductor plate 52 is fixed to the base 12 in a position where its longitudinal direction is parallel to the sliding direction. In this example, a plurality of mounting posts 44 are erected from the upper surface of the base 12. Both ends of the conductor plate 52 in the longitudinal direction are fixed to these mounting posts 44.

[0033] The conductor plate 52 in this example has a shape in which the area per unit distance in the sliding direction increases as it approaches the stroke end. Specifically, the conductor plate 52 has a central portion 56 located in the middle, a transition portion 58 that gradually widens as it approaches the end from the central portion 56, and an end portion 54 that extends from the transition portion 58 toward the end. Therefore, the width of the end portion 54 is sufficiently larger than the width of the central portion 56. The reason for this shape will be explained later. The width of the conductor plate 52 refers to the dimension in a direction perpendicular to both the direction of the magnetic flux formed by the pair of damper magnets 74 and the direction of movement of the vibration damping unit 20.

[0034] The magnetic flux forming mechanism 70 forms a magnetic flux that penetrates the conductor plate 52. As shown in Figures 2 and 3, the magnetic flux forming mechanism 70 is fixed to the frame 23 of the vibration damping unit 20. Here, since the vibration damping unit 20 is slidable relative to the base 12, the magnetic flux forming mechanism 70 fixed to the vibration damping unit 20 is movable relative to the conductor plate 52 fixed to the base 12.

[0035] The magnetic flux forming mechanism 70 includes a bracket 72 and a pair of damper magnets 74. The bracket 72 is made of a non-magnetic and insulating material such as resin and is fixed to the frame 23. The bracket 72 is roughly U-shaped and has a groove portion that opens upward. A part of the conductor plate 52 is inserted into this groove portion. The bracket 72 also holds a pair of damper magnets 74. The damper magnets 74 are positioned on both sides of the groove portion, and thus the conductor plate 52. The two damper magnets 74 face each other across the conductor plate 52. The two damper magnets 74 are magnetized in the same direction. Furthermore, the vertical range of the damper magnets 74 completely includes the vertical range of the conductor plate 52. Therefore, a magnetic flux is generated between the two damper magnets 74 that penetrates the conductor plate 52. In this example, the damper magnet 74 is a permanent magnet, but the damper magnet 74 may also be an electromagnet that generates magnetic flux by passing an electric current through a coil.

[0036] Next, the operation of the magnetic damper 50 will be explained with reference to Figure 4. Figure 4 is a schematic diagram illustrating the operation of the magnetic damper 50. As repeatedly stated and as shown in Figure 4, a magnetic flux Fm is generated between the two damper magnets 74, penetrating the conductor plate 52. In Figure 4, the magnetic flux Fm of the magnets is indicated by a dashed arrow.

[0037] Consider the case where the conductor plate 52 moves in the direction of arrow B in Figure 4 as the vibration damping unit 20 slides. In this case, the conductor plate 52 moves through the magnetic flux Fm. ​​As a result, eddy currents are generated in the conductor plate 52, the magnitude of which depends on the moving speed of the vibration damping unit 20 and the amount of magnetic flux Fm passing through the conductor plate 52. Due to these eddy currents, a magnetic flux Fp1 in the opposite direction to the magnetic flux Fm is generated in the part of the conductor plate 52 that approaches the damper magnet 74, and a magnetic flux Fp2 in the same direction as the magnetic flux Fm is generated in the part of the conductor plate 52 that moves away from the damper magnet 74. These magnetic fluxes Fp1 and Fp2 create a repulsive force between the part of the conductor plate 52 that approaches the damper magnet 74 and the damper magnet 74, and an attractive force between the part of the conductor plate 52 that moves away from the damper magnet 74 and the damper magnet 74. These repulsive and attractive forces then become damping forces that reduce the sliding movement of the magnetic flux forming mechanism 70, and consequently, the vibration damping unit 20.

[0038] Here, the damping force generated by the magnetic damper 50 is greater the greater the relative speed of the conductor plate 52 with respect to the magnetic flux forming mechanism 70, and also greater the greater the amount of magnetic flux penetrating the conductor plate 52. In this example, the end portion 54 of the conductor plate 52 is wider than the central portion 56. Therefore, the amount of magnetic flux Fm penetrating the conductor plate 52 increases when the vibration damping unit 20 is closer to the stroke end than when it is located in the center of the stroke. As a result, according to this example, the damping force can be reduced when the vibration damping unit 20 is located in the center of the stroke, and increased only when it is closer to the stroke end. Furthermore, according to this example, a larger damping force can be generated when the movement speed of the vibration damping unit 20 is greater. As a result, according to this example, the reaction associated with the movement of the movable unit 30 is effectively suppressed from being transmitted to the base 12, while effectively preventing the vibration damping unit 20 from colliding with the stroke end. As a result, according to this example, unintended vibrations in the table 14 can be effectively prevented, and the manufacturing quality of the semiconductor device can be improved.

[0039] Furthermore, the magnetic damper 50 mainly consists of a conductor plate 52 and a pair of damper magnets 74 that sandwich the conductor plate 52. In this case, the magnetic damper 50 can be made significantly smaller than a mechanical damper. As a result, the overall size of the device can be reduced. In addition, the conductor plate 52 and the damper magnets 74, which are the main components of the magnetic damper 50, are not in contact with each other. Therefore, compared to a mechanical damper or an absorption guide 42 with sliding resistance, deterioration due to wear and other factors is less likely to occur. As a result, with the configuration of this example, the vibration damping performance of the table 14 can be maintained stably over the long term.

[0040] Furthermore, in this example, the magnetic dampers 50 are positioned on both sides of the center of gravity of the vibration damping unit 20. This configuration effectively prevents the vibration damping unit 20 from rotating due to damping force. In other words, if the magnetic damper 50 is positioned on only one side, or in other words, if the braking force is applied to only one point, the vibration damping unit 20 may rotate and tilt around that point as a pivot. On the other hand, as in this example, by positioning the magnetic dampers 50 on both sides of the vibration damping unit 20, the rotation of the vibration damping unit 20 can be effectively prevented.

[0041] Furthermore, in case the conductor plate 52 or damper magnet 74 deteriorates, at least one of the conductor plate 52 and damper magnet 74 may be made replaceable. For example, the conductor plate 52 may be fixed to the base 12 using detachable fastening members such as screws or clips. Also, the damper magnet 74 may be made detachable from the bracket 72, or the magnetic flux forming mechanism 70 itself may be made detachable from the vibration damping unit 20.

[0042] Furthermore, an adjustment mechanism may be provided to change the position of at least one of the two damper magnets 74 in order to change the opposing area of ​​the two damper magnets 74. That is, although the damper magnets 74 are permanent magnets, the magnetic force of such permanent magnets may decrease due to aging or other factors. In this case, the desired damping force may not be obtained. Also, the required damping force may change depending on the situation. For this reason, it may be desirable to change the amount of magnetic flux between the two damper magnets 74 as appropriate. In such cases, it is conceivable to replace the damper magnets 74 themselves, but in that case, not only will the running costs increase, but there is also the problem that it is difficult to prepare magnets with an appropriate magnetic force that can obtain the desired damping force in the first place.

[0043] Therefore, an adjustment mechanism may be provided to change the position of the damper magnets 74 so as to change the opposing area of ​​the two damper magnets 74. The adjustment mechanism is not particularly limited as long as it can change the relative positional relationship of the two damper magnets 74. Figure 5 shows an example of an adjustment mechanism. As shown in Figure 5, one of the two damper magnets 74 is housed in a guide hole 78. The guide hole 78 is a hole formed in the bracket 72 and holds the damper magnet 74 so as to be movable in a predetermined adjustment direction (left-right direction in the illustrated example). The adjustment mechanism has a positioning spring 82 that biases the damper magnet 74 to one side in the adjustment direction and a positioning screw 80 that presses it to the opposite side in the adjustment direction. By adjusting the amount of tightening of the positioning screw 80, the position of the damper magnet 74 in the adjustment direction can be changed.

[0044] Here, as shown in the upper part of Figure 4, if the centers of the two damper magnets 74 are misaligned, the amount of magnetic flux Fm generated between them decreases, and the damping force of the vibration damping unit 20 also decreases. On the other hand, as shown in the lower part of Figure 4, consider the case where the relative positions of the two damper magnets 74 are changed by an adjustment mechanism, increasing the opposing surface area. In this case, the amount of magnetic flux Fm generated between them increases by the amount of the opposing surface area, and the damping force of the vibration damping unit 20 also increases. In other words, by providing an adjustment mechanism that changes the relative positions of the two damper magnets 74, it becomes possible to fine-tune the damping force. As a result, unintended vibrations of the table 14 can be prevented more effectively. Of course, the configuration of the adjustment mechanism is not limited to the above, and other configurations are also possible.

[0045] Furthermore, the configurations described so far are merely examples, and other configurations may be modified as appropriate, as long as they meet the requirements of claim 1. For example, the conductor plate 52 may have any other shape, as long as, when the generated magnetic flux density is uniform, the magnetic flux penetrating the material of the conductor plate 52 is greater at its edges than in its center. Therefore, as shown in Figure 6, a plurality of adjustment holes 60 may be formed in the conductor plate 52, and the density of these adjustment holes 60 may decrease as it approaches the end of the stroke. In addition, a barrier member (for example, a plate made of a non-magnetic material) that prevents the penetration of the magnetic flux Fm may be attached to the central portion 56 of the conductor plate 52.

[0046] Furthermore, the arrangement and number of magnetic dampers 50 may be changed as appropriate. For example, there may be only one magnetic damper 50, or there may be three or more. Also, the magnetic dampers 50 may be attached not only to the sides of the frame 23, but also to the top or bottom. In addition, although the conductor plate 52 is fixed to the base 12 in the above description, the conductor plate 52 may be fixed to the vibration damping unit 20 and the magnetic flux forming mechanism 70 may be fixed to the base 12. [Explanation of symbols]

[0047] 10 Manufacturing equipment, 12 Base, 14 Table, 16 Moving mechanism, 16f First moving mechanism, 16s Second moving mechanism, 20 Vibration damping unit, 23 Frame, 30 Movable unit, 31f Subtable, 32 Movable element, 34 Coil, 40 Moving guide, 42 Absorbing guide, 44 Mounting column, 50 Magnetic damper, 52 Conductor plate, 54 End section, 56 Center section, 58 Transition section, 60 Adjustment hole, 70 Magnetic flux forming mechanism, 72 Bracket, 74 Magnet for damper, 78 Guide hole, 80 Positioning screw, 82 Positioning spring, Fm Magnetic flux.

Claims

1. Bass and, A table on which a semiconductor device or its material is placed, A moving mechanism for moving the table relative to the base, The moving mechanism is equipped with, A movable unit connected to the table and moving together with the table in a predetermined sliding direction, A vibration damping unit connected to the base so as to be movable in a direction that eliminates the reaction force received from the movable unit, A non-magnetic and conductive conductive plate is attached to either the vibration damping unit or the base, A damper magnet is attached to the other of the vibration damping unit or the base, and moves relative to the conductor plate within a predetermined stroke as the vibration damping unit moves, and generates a magnetic flux that penetrates the conductor plate. The conductor plate has such a shape that, when the generated magnetic flux density is uniform, the magnetic flux penetrating the material of the conductor plate is greater at its edges than at its center. A semiconductor device manufacturing apparatus characterized by the following features.

2. A semiconductor device manufacturing apparatus according to claim 1, A semiconductor device manufacturing apparatus characterized in that the width dimension of the end of the conductor plate increases continuously as it approaches the end of the stroke.

3. A semiconductor device manufacturing apparatus according to claim 1, The conductor plate has a plurality of adjustment holes formed therein. The end portion of the conductor plate has a smaller area of ​​adjustment hole than the central portion. A semiconductor device manufacturing apparatus characterized by the following features.

4. A semiconductor device manufacturing apparatus according to claim 1, The conductor plate is fixed to the base, The aforementioned damper magnet is fixed to the vibration damping unit. A semiconductor device manufacturing apparatus characterized by the following features.

5. A semiconductor device manufacturing apparatus according to claim 1, A semiconductor device manufacturing apparatus characterized in that a magnetic damper including the conductor plate and the damper magnet is arranged on both sides of the center of gravity of the vibration damping unit.

6. A semiconductor device manufacturing apparatus according to claim 1, A pair of the damper magnets are arranged opposite each other with the conductor plate in between. Furthermore, the device includes an adjustment mechanism to change the relative position of the pair of damper magnets in order to change the opposing area of ​​the pair of damper magnets. A semiconductor device manufacturing apparatus characterized by the following features.

Images