Solid-state image sensor package and method for manufacturing a solid-state image sensor package

Abstract

To provide a solid-state imaging element package which can take a high-quality image.SOLUTION: A solid-state imaging element package 1 according to an embodiment of the present invention includes: a solid-state imaging element 20 having a functioning unit 21 for imaging and a margin unit 22 surrounding the functioning unit 21; a frame 30 arranged in the margin unit 22; a transparent substrate 40 fixed to the frame 30 to cover the functioning unit 21. Parts 31, 32, 33, and 34 of the frame 30 are formed of a resin composition with a different composition from other part 35.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a solid-state image sensor package and a method for manufacturing a solid-state image sensor package.

Background Art

[0002] A solid-state image sensor package is widely used, in which a frame-shaped frame surrounding a solid-state image sensor is adhered to a substrate on which the solid-state image sensor is mounted, and an opening of the frame is covered with a glass plate or the like (see, for example, Patent Document 1). If the relative positions of the solid-state image sensor, the frame, and the glass deviate, problems such as reflected light on the inner peripheral surface of the frame or the glass surface entering the solid-state image sensor may occur. In order to prevent such positional deviation, when performing high-precision adhesion work, it is necessary to perform manual work by hand or alignment work by image recognition, which is extremely costly. In addition, positional deviation of the frame may occur due to, for example, shrinkage during curing of an adhesive for adhering the frame to the substrate. Therefore, it is necessary to fix the adherends so that they do not move during curing of the adhesive, which takes a long time for the process.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] Demand for miniaturization and higher definition of solid-state image sensor packages is increasing day by day. Therefore, an object of the present invention is to provide a solid-state image sensor package with high image quality of captured images and a method for manufacturing the same.

Means for Solving the Problem

[0005] A solid-state image sensor package according to one aspect of the present invention comprises a solid-state image sensor having an imaging function and a margin surrounding the functional function, a frame-shaped frame disposed in the margin, and a transparent substrate fixed to the frame so as to cover the functional function, wherein a portion of the frame is formed from a resin composition having a different composition from the other portions.

[0006] In the solid-state image sensor package described above, the frame is directly bonded to the solid-state image sensor and the transparent substrate, and the composition of the surface layer of at least a portion of the surface of the frame that is in contact with the solid-state image sensor or the transparent substrate may differ from that of other portions.

[0007] In the solid-state image sensor package described above, the glass transition point of the junction of the frame in contact with the solid-state image sensor or the transparent substrate may be lower than the glass transition point of other parts.

[0008] In the solid-state image sensor package described above, the composition of the peripheral surface portion of the frame may differ from that of other parts.

[0009] In the solid-state image sensor package described above, the filler content in the peripheral portion of the frame may be higher than the content in other portions.

[0010] In the solid-state image sensor package described above, the filler may be a light-diffusing material.

[0011] A method for manufacturing a solid-state image sensor package according to one aspect of the present invention is a method for manufacturing a solid-state image sensor package comprising: a solid-state image sensor having an imaging function and a margin surrounding the functional function; a frame-shaped frame disposed in the margin; and a transparent substrate fixed to the frame so as to cover the functional function, comprising the steps of: forming the frame by laminating a resin composition onto one of the solid-state image sensor and the transparent substrate using an inkjet 3D printer; and bonding the other of the solid-state image sensor and the transparent substrate to the frame, wherein in the step of forming the frame, the composition of the injected resin composition is changed so as to partially differ the composition of the frame. [Effects of the Invention]

[0012] According to the present invention, a solid-state image sensor package with high image quality of captured images and a method for manufacturing the same can be provided. [Brief explanation of the drawing]

[0013] [Figure 1] This is a cross-sectional view of a solid-state image sensor package according to one embodiment of the present invention. [Figure 2] This is a cross-sectional view of a solid-state image sensor package according to a modified example of the present invention. [Figure 3] This flowchart shows the procedure for a solid-state image sensor package manufacturing method according to one embodiment of the present invention. [Modes for carrying out the invention]

[0014] Embodiments of the present invention will be described below with reference to the drawings. Figure 1 is a cross-sectional view of a solid-state image sensor package 1 according to one embodiment of the present invention.

[0015] The solid-state image sensor package 1 comprises a mounting substrate 10, a solid-state image sensor 20 mounted on the mounting substrate 10, a frame-shaped frame 30 arranged on the solid-state image sensor 20, a transparent substrate 40 fixed to the frame 30 so as to cover the solid-state image sensor 20 with gaps between them, and a sealing material 50 that seals the outside of the frame 30 and the transparent substrate 40 on the mounting substrate 10.

[0016] The mounting substrate 10 is a structural member that supports the solid-state image sensor 20. For this reason, the mounting substrate 10 is formed from a material having sufficient rigidity. The mounting substrate 10 may be a simple support that does not have any components that are electrically incorporated into a circuit, but it is preferable that it is a circuit board on which a circuit is formed that supplies power to the solid-state image sensor 20 and extracts signals from the solid-state image sensor 20. In this embodiment, the mounting substrate 10 is a circuit board on which a circuit including terminals 11 is formed for electrical connection with the solid-state image sensor 20.

[0017] Examples of mounting substrates 10 include organic materials such as polyimide, polyester, ceramic, epoxy, bismaleimide triazine resin, and phenolic resin; structures obtained by impregnating paper or glass fiber nonwoven fabric with the aforementioned organic materials and heat-curing them; ceramics such as alumina, aluminum nitride, beryllium oxide, and silicon nitride; and metal substrates. Among these, glass epoxy substrates, ceramic substrates, and bismaleimide triazine resin substrates are preferred. Circuits having metal wiring patterns or metal bumps can be formed on the surface or inside these insulating substrates.

[0018] The solid-state image sensor 20 includes a functional unit 21 that performs imaging, a margin unit 22 surrounding the functional unit 21, and a connection unit 23 provided further outside the margin unit 22. The solid-state image sensor 20 can be mounted on the side of the mounting substrate 10 facing the transparent substrate 40. As the functional unit 21, for example, a two-dimensional image sensor structure such as a CMOS image sensor can be formed. The margin unit 22 is a region for fixing the frame 30, and no components to be exposed are provided therein. The connection unit 23 is a region where terminals 231 for electrically connecting the solid-state image sensor 20 to the mounting substrate 10 or the like are disposed. In the present embodiment, the solid-state image sensor 20 and the mounting substrate 10 are electrically connected by wires 232.

[0019] The frame 30, together with the transparent substrate 40, forms an enclosed space that encloses the functional unit 21 on the solid-state image sensor 20, and prevents light from entering the functional unit 21 from the side. Furthermore, in order to suppress reflected light on the inner peripheral surface from entering the functional unit 21, the frame 30 is preferably formed in a reverse tapered shape in which the inner peripheral surface has a reduced diameter toward the transparent substrate 40 side. For example, the frame 30 may be formed in a stepped shape or a dome shape such that the diameter reduction rate of the inner peripheral surface on the transparent substrate 40 side is smaller.

[0020] In order to accurately determine the relative position and orientation of the frame 30 with respect to the solid-state image sensor 20 and the relative position and orientation with respect to the transparent substrate 40, the frame 30 is preferably directly bonded to both the solid-state image sensor 20 and the transparent substrate 40 without an adhesive or the like interposed therebetween.

[0021] At least a portion of the frame 30 is formed from a resin composition with a different composition from other portions. Specifically, the composition of the resin composition forming at least one of the inner circumferential surface portion 31, the outer circumferential surface portion 32, the element bonding portion 33, the surface portion in contact with the solid-state image sensor 20, and the transparent substrate bonding portion 34, the surface portion in contact with the transparent substrate, may differ from the composition of the resin composition forming the main body portion 35, which is the deep portion of the frame 30. The compositions of the resin compositions forming the inner circumferential surface portion 31, the outer circumferential surface portion 32, the element bonding portion 33, and the transparent substrate bonding portion 34 may be different from each other. Furthermore, it is sufficient that the composition of at least one of the inner circumferential surface portion 31, the outer circumferential surface portion 32, the element bonding portion 33, and the transparent substrate bonding portion 34 differs from the composition of the main body portion 35, while the composition of the remaining portions may be formed from the same resin composition as the main body portion 35. For example, as shown in the modified solid-state image sensor package 1A in Figure 2, only the element junction 33 and the transparent substrate junction 34 may be formed from a resin composition that differs in composition from the other parts of the frame 30. Alternatively, at least one of the element junction 33 and the transparent substrate junction 34 may have a different composition from the main body 35 (not shown).

[0022] As an example of varying the composition, by setting the glass transition temperature of at least one of the element junction 33 and the transparent substrate junction 34 lower than the glass transition temperature of the other parts, the adhesion of the frame 30 to the solid-state image sensor 20 and the transparent substrate 40 can be improved while suppressing a decrease in other functions. Furthermore, by setting the glass transition temperatures of the inner circumferential surface 31 and the outer circumferential surface 32 higher than the glass transition temperatures of the other parts, it is possible to prevent the entire frame 30 from being crushed and deformed when the frame 30 is thermocompressed onto the solid-state image sensor 20 and the transparent substrate 40. From this viewpoint, as shown in Figure 1, it is preferable that the inner circumferential surface 31 and the outer circumferential surface 32 extend to the outside and inside of the element junction 33 and the transparent substrate junction 34, and are set to be in contact with the solid-state image sensor 20 and the transparent substrate 40. In other words, the element junction 33 and the transparent substrate junction 34, in which the glass transition temperature is set lower, may be a part of the surface layer of the surface in contact with the solid-state image sensor 20 and the transparent substrate 40.

[0023] As another example of varying the composition, the filler content of the inner peripheral surface portion 31 and the outer peripheral surface portion 32 may be set higher than the filler content of other portions. When a light diffusing material (white pigment) or a light absorbing material (black pigment) is used as the filler, increasing the filler content of the inner peripheral surface portion 31 and the outer peripheral surface portion 32 can improve the light blocking performance of the frame 30 while ensuring adhesion to the solid-state imaging device 20 and the transparent substrate 40. In particular, by increasing the filler content of the inner peripheral surface portion 31, light incident from an oblique direction can be scattered or absorbed, thereby preventing reflected light from entering the solid-state imaging device 20 and becoming noise that degrades imaging quality. Further, in cases where the margin portion 22 easily reflects light, such as when wiring is present on the surface of the margin portion 22, forming the element bonding portion 33 from a resin composition containing a light absorbing material can suppress light noise from entering the functional portion 21 due to reflection on the surface of the margin portion 22. As the light diffusing material, fine particles of, for example, mica, kaolin, talc, silica, glass, barium sulfate, calcium carbonate, titanium dioxide or the like are used. As the light absorbing material, fine particles of, for example, carbon black, carbon nanotubes or the like are used. A filler having wavelength selectivity, that is, a coloring material, may also be used. Further, when a reinforcing material is used as the filler, increasing the filler content of the inner peripheral surface portion 31 and the outer peripheral surface portion 32 can effectively prevent deformation of the frame 30 when the frame 30 is thermocompression bonded to the solid-state imaging device 20 and the transparent substrate 40.

[0024] The transparent substrate 40 allows light to enter the solid-state imaging device 20. The transparent substrate 40 may be made of transparent ceramics such as glass or sapphire, or transparent plastics such as acrylic resin or polycarbonate, and transparent ceramics are preferred from the viewpoint of reliability. From the viewpoint of general versatility, glass is preferably used. The type of glass is not particularly limited, and examples thereof include quartz glass, borosilicate glass, and alkali-free glass. The transparent substrate 40 may be bonded to the frame 30 with an adhesive, but it is preferable that the material of the frame 30 is directly laminated on one surface of the transparent substrate 40.

[0025] The sealing material 50 seals the outside of the solid-state image sensor 20, frame 30, and transparent substrate 40 on the mounting substrate 10, preventing the frame 30 and transparent substrate 40 from being peeled away from the solid-state image sensor 20 by an external object. The sealing material 50 also protects the wire 232 and ensures the electrical connection between the mounting substrate 10 and the solid-state image sensor 20.

[0026] The sealing material 50 is preferably a thermosetting resin such as epoxy resin, acrylic resin, or silicone resin, with epoxy resin being particularly preferred from the viewpoint of toughness and heat resistance. Furthermore, the sealing material 50 is preferably formed from a resin composition containing a light diffusing material or a light absorbing material so as to prevent unintended noise light from entering the functional part 21. In addition, the sealing material 50 may contain a filler such as silica to have thixotropy before curing in order to facilitate its formation.

[0027] The solid-state image sensor package 1 described above can be manufactured by a solid-state image sensor package manufacturing method according to one embodiment of the present invention shown in Figure 3. The solid-state image sensor package manufacturing method according to this embodiment comprises the steps of mounting the solid-state image sensor 20 onto a solid-state image sensor 20 (step S1: element mounting step), forming a frame 30 on a transparent substrate 40 using a 3D printer (step S2: frame formation step), and bonding the solid-state image sensor 20 mounted on the mounting substrate 10 to the frame 30 (step S3: element bonding step).

[0028] In step S1, the element mounting process, the solid-state image sensor 20 is mounted on the mounting substrate 10. The mounting method for the solid-state image sensor 20 is not particularly limited, and well-known mounting techniques such as wire bonding and flip-chip bonding can be used.

[0029] In the frame formation process of step S2, the frame 30 is formed by layering the resin composition onto the transparent substrate 40 using an inkjet 3D printer. The inkjet 3D printer sprays a resin composition mainly composed of a photocurable resin, and repeatedly irradiates the sprayed resin composition with light to cure it, thereby forming a resin molded body of the desired shape.

[0030] In this frame formation process, the composition of the injected resin composition is changed so that the composition of the formed frame 30 is partially different. Specifically, by using an inkjet 3D printer equipped with multiple nozzles that spray different resin compositions and selecting the resin composition to spray at each location, the material of the frame 30 can be partially varied. Furthermore, by spraying multiple types of resin compositions at the same location and continuously changing the ratio of the resin compositions, a gradient-like change in composition is also possible.

[0031] As in this embodiment, when the frame 30 is formed on the transparent substrate 40 using an inkjet 3D printer, the adhesion between the frame 30 and the transparent substrate 40 is relatively high. Therefore, the transparent substrate bonding portion 34 may be formed with a resin composition having the same composition as the main body portion 35. However, it is preferable that the element bonding portion 33, which is bonded to the solid-state image sensor 20 in the next element bonding step, be formed with a resin composition that has high thermocompression bonding properties. Specifically, the element bonding portion 33 may be formed with a resin composition that has a low glass transition point after photocuring, or it may be formed with a resin composition that partially hardens by photocuring and then heat-cures. As a resin composition that heat-cures after photocuring, a composition containing a photopolymerization initiator and a thermal polymerization initiator that is not activated by light but is activated by the heat during thermocompression bonding can be prepared.

[0032] In step S3, the element bonding process, the solid-state image sensor 20 is bonded to the frame 30 on the side opposite to the transparent substrate 40. The bonding of the frame 30 and the solid-state image sensor 20 is preferably performed by welding the element bonding portion 33 to the solid-state image sensor 20 using thermocompression bonding. By not using adhesive, errors in the relative position between the solid-state image sensor 20 and the transparent substrate 40 due to variations in adhesive thickness can be prevented.

[0033] The solid-state image sensor package 1 manufactured by the above-described solid-state image sensor package manufacturing method has a frame 30 that suppresses noise light and high dimensional accuracy including bonding to the solid-state image sensor 20 and transparent substrate 40, resulting in high image quality of captured images.

[0034] Although embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications and variations are possible. In the solid-state image sensor package manufacturing method according to the present invention, a frame may be formed on one of the solid-state image sensor and the transparent substrate, and the other may be bonded to the frame, or a frame may be formed on the solid-state image sensor, and the transparent substrate may be bonded to the formed frame. [Examples]

[0035] The present invention will be described in detail below based on examples, but the present invention is not limited to the following examples.

[0036] <Photosensitive resin composition> As a frame-forming material, photosensitive resin compositions 1 to 7 were prepared by mixing 100 parts by weight of a main polymer having a cyclic polysiloxane structure in its main chain and possessing cationic polymerizable groups and alkali-soluble groups, 15 to 40 parts by weight of the alicyclic epoxy compound "Celoxide 2021P" manufactured by Daicel Corporation, 3 parts by weight of the photocationic polymerization initiator "CPI-210S" manufactured by Sunapro Corporation, 0.1 parts by weight of the antioxidant "IRGANOX1010" manufactured by BASF Corporation, and 0 or 5 parts by weight of fumed silica "R974" (specific surface area 200), "R8200" (specific surface area 200), or "R972" (specific surface area 130) manufactured by Nippon Aerosil Co., Ltd. as a filler. The alicyclic epoxy compound was added to adjust the glass transition temperature of the photosensitive resin composition.

[0037] The main polymer was prepared by the following procedure. First, to a mixture of 40 g of diallyl isocyanurate, 29 g of diallyl monomethyl isocyanurate, and 264 g of 1,4-dioxane, 124 mg of platinum vinylsiloxane complex xylene solution "Pt-VTSC-3X" manufactured by Yumicore Precious Metals Japan was added to obtain solution S1. Separately, 88 g of 1,3,5,7-tetrahydrogen-1,3,5,7-tetramethylcyclotetrasiloxane was dissolved in 176 g of toluene to obtain solution S2. Then, under a nitrogen atmosphere containing 3 volume% oxygen, solution S2 was heated to a temperature of 105°C, and solution S1 was added dropwise to solution S2 over 3 hours. After the dropwise addition was complete, the mixture was stirred for 30 minutes while maintaining the temperature at 105°C to obtain solution S3. The reaction rate of the alkenyl groups of the compounds contained in the obtained solution S3 was measured by 1H-NMR, and the reaction rate was found to be 95% or higher. In addition, 62 g of 1-vinyl-3,4-epoxycyclohexane was dissolved in 62 g of toluene to obtain solution S4. Then, under a nitrogen atmosphere containing 3 volume% oxygen, solution S3 was heated to 105°C, and solution S4 was added dropwise to solution S3 over 1 hour. After the addition was complete, the mixture was stirred for 30 minutes while maintaining the temperature at 105°C to obtain solution S5. The reaction rate of the alkenyl groups of the compounds in the obtained solution S5 was measured by 1H-NMR, and the reaction rate was found to be 95% or higher. Next, after cooling solution S5, the solvents (toluene, xylene, and 1,4-dioxane) were removed from solution S5 under reduced pressure to obtain the main polymer. The main polymer had multiple cationic polymerizable groups and multiple alkali-soluble groups in one molecule, and had a cyclic polysiloxane structure in the main chain.

[0038] The compositions and glass transition temperatures of photosensitive resin compositions 1 to 7 are summarized in Table 1. A "-" in the table indicates that the composition is not included, i.e., the amount included is zero.

[0039] [Table 1]

[0040] <Prototype of solid-state image sensor package> Using an inkjet 3D printer or dispenser, prototype solid-state image sensor packages 1 to 10 were fabricated by forming frames on transparent substrates or solid-state image sensors using the above-mentioned photosensitive resin composition under different conditions. In this process, each layer was coated and exposed to ultraviolet light, resulting in a semi-cured state during lamination. When using an inkjet 3D printer, the photosensitive resin composition was selected for use in three separate parts: the main body, the peripheral surfaces (inner and outer peripheral surfaces), and the bonding areas (element bonding areas and transparent substrate bonding areas). Prototypes were also fabricated with varying angles between the inner peripheral surface of the frame and the inner transparent substrate (hereinafter referred to as the "taper angle"). Prototype 16 is an example where the frame was formed using a conventional method and a conventional photosensitive resin composition.

[0041] Specifically, multiple frames with a rectangular tubular structure, 200 μm wide and 50 μm thick, were formed on a transparent substrate (10 cm x 10 cm, 0.4 mm thick). A dicing film was temporarily bonded to the side of the transparent substrate where no frames were present, then cut with a dicing blade, and the dicing film was peeled off to obtain individual framed transparent substrates. Next, the obtained framed transparent substrates and a mounting substrate on which a solid-state image sensor was mounted were stacked, and the solid-state image sensor and frame were thermocompressed by applying a 500 g load for 30 seconds on a hot plate at a temperature of 120 °C to obtain a prototype solid-state image sensor package. A wiring board that provides wiring for connecting the solid-state image sensor to the outside was used as the mounting substrate. After bonding the solid-state image sensor and frame, sealing resin was applied to the outer periphery of the mounting substrate to seal the solid-state image sensor, frame, and outer periphery of the transparent substrate.

[0042] <Evaluation of Solid State Image Sensor Packages> [Ghost Index] For each prototype of the solid-state image sensor package, the imaging performance was evaluated using Tsubosaka Electric's "GCS-2T" ghost and flare evaluation system. The abnormal pixel ratio (abnormal pixels / total pixels) was calculated by dividing the number of abnormal pixels (pixels exceeding 1 / 100 millionth of the light source brightness) by the total number of pixels. The abnormal pixel ratio of prototype 10, a conventional example, was set to 100%, and the ghost index was calculated by normalizing the abnormal pixel ratios of prototypes 1 to 9. A smaller ghost index indicates a higher level of ghost suppression.

[0043] [Die share strength] For each prototype of the solid-state image sensor package, a test was conducted using DAGE's "SERIES4000" die-shear tester to peel the transparent substrate from the solid-state image sensor, and the maximum peel load was defined as the die-shear strength. Specifically, the die-shear strength was measured in accordance with MIL standard 883, with a shear height of 50 μm and a shear speed of 80 μm / s. Higher die-shear strength is considered to indicate higher adhesion and greater reliability against thermal shock, etc.

[0044] [Resistance to thermal shock] For each prototype of the solid-state image sensor package, a heat shock test device "Cosmopia S" manufactured by Hitachi Johnson Controls Air Conditioning Co., Ltd. was used to perform a procedure of holding the package in a -50°C atmosphere for 30 minutes, followed by holding it in a 125°C atmosphere for 30 minutes, for a total of 500 cycles. Next, the optoelectronic device was observed from the glass substrate side using an optical microscope, and the number of cracks and delaminations in the frame were counted. Packages with a total of fewer than 5 cracks and delaminations were classified as "A", packages with a total of 5 or more but less than 10 were classified as "B", and packages with a total of 10 or more were classified as "C".

[0045] Table 2 summarizes the number of the photosensitive resin composition used in each part of the solid-state image sensor package, the taper angle, the ghosting index, the die shear strength, and the thermal shock resistance for each prototype.

[0046] [Table 2]

[0047] As is clear from the comparison between prototypes 15 and 16 and prototypes 7 and 8, using an inkjet 3D printer allows for frame formation with higher precision than using a dispenser, and reduces the ghosting index while maintaining equivalent die shear strength. Furthermore, as shown in prototypes 1 to 6, it was confirmed that the ghosting index, die shear strength, and thermal shock resistance can be further improved by independently selecting the resin composition that forms the main body, peripheral surface, and joint. In addition, as shown in prototypes 1 to 14, it was confirmed that the ghosting index can be further reduced without decreasing die shear strength and thermal shock resistance by increasing the taper angle. [Explanation of Symbols]

[0048] 1. Solid-state image sensor package 10 Mounting board 20 Solid-state image sensors 21 Functional Section 22 Margin section 23 Connection part 30 frames 31 Inner peripheral surface part 32 Outer peripheral surface part 33 Element junction 34 Transparent substrate joint 35 Main body 40 Transparent substrates 50 Sealing material

Claims

1. A solid-state image sensor having a functional part for performing imaging and a margin part surrounding the functional part, A frame-shaped frame directly joined to the margin portion, A transparent substrate is directly bonded to the frame so as to cover the functional part, A solid-state image sensor package wherein the glass transition point of the resin composition forming at least one of the element bonding portion, which is a surface layer in contact with the margin portion of the frame, and the transparent substrate bonding portion, which is a surface layer in contact with the transparent substrate, is lower than the glass transition point of the resin composition forming the main body portion, which is a deep layer portion of the frame.

2. The solid-state image sensor package according to claim 1, wherein the glass transition point of the resin composition forming the inner and outer surface portions, which are the inner and outer surface portions of the frame, is higher than the glass transition point of the resin composition forming the other parts of the frame.

3. The solid image sensor package according to claim 1, wherein the filler content of the resin composition forming the inner and outer surface portions, which are the inner and outer surface portions of the frame, is greater than the filler content of the resin composition forming the main body, and the filler is a light diffusing material or a light absorbing material.

4. A method for manufacturing a solid-state image sensor package comprising: a solid-state image sensor having an imaging function and a margin surrounding the functional function; a frame-shaped frame directly bonded to the margin; and a transparent substrate directly bonded to the frame so as to cover the functional function, The process of forming the frame by laminating a resin composition onto one of the solid-state image sensor and the transparent substrate using an inkjet 3D printer, A step of heat-pressing the other of the solid-state image sensor and the transparent substrate onto the frame, Equipped with, A method for manufacturing a solid-state image sensor package, comprising the step of forming the frame, wherein the composition of the injected resin composition is changed so that the glass transition point of the surface layer of the frame that is in contact with the solid-state image sensor and the other transparent substrate is lower than the glass transition point of the main body, which is the deep layer of the frame.

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