Substrate support device

Abstract

To guide a substrate to a predetermined position and support the substrate at the predetermined position even when the substrate is placed at a position deviated from the predetermined position.SOLUTION: A substrate support device 1 includes a plurality of supports 11 capable of supporting a substrate S at a predetermined substrate support position Q, and each of the supports 11 has at least one contact surface 15 capable of supporting the substrate S in contact with a side surface Sc of the substrate S. While the support body 11 rotates about the rotation axis B, the contact surface 15 reaches the support position 10a where the substrate S is supported from the upper position R1 located above the support surface R2, and the support body 11 moves from the upper position R1 to the support position R2, at least one contact surface 15 guides the substrate S to the substrate support position Q while being in contact with the substrate S placed at a position shifted from the substrate support position Q.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a substrate supporting apparatus for supporting a substrate, and particularly to a substrate supporting apparatus used in a substrate processing apparatus such as an ion implantation apparatus.

Background Art

[0002] An ion implantation apparatus used in semiconductor manufacturing processes and the like generally includes a substrate supporting apparatus that supports a substrate in a processing chamber. As an example of such a substrate supporting apparatus, there is an electrostatic chuck provided with a mechanical clamp disclosed in Patent Document 1. This electrostatic chuck electrostatically attracts a substrate placed on a clamping surface, and also holds the substrate by means of the mechanical clamp. Therefore, this electrostatic chuck can hold the substrate even when the electrostatic attraction force is insufficient.

[0003] By performing a rotating operation, this electrostatic chuck moves between a horizontal position, which is the position when a substrate is placed on the clamping surface and the clamping surface faces horizontally, and a non-horizontal position, which is the position where the substrate fixed to the clamping surface faces an ion beam. Further, this electrostatic chuck can also fix the substrate only by the mechanical clamp even when it is in the non-horizontal position.

Prior Art Literature

Patent Literature

[0004]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0005] The electrostatic chuck described in Patent Document 1 has multiple mechanical clamps arranged around the clamping surface, and each mechanical clamp rotates around a predetermined axis of rotation, holding the substrate in a predetermined position by pushing it from the outside. However, since each mechanical clamp rotates in a direction that lifts the substrate, if the substrate is placed off-center from the predetermined position on the clamping surface, it is expected that the substrate will be fixed in a lifted position by the mechanical clamp. In other words, with the electrostatic chuck of Patent Document 1, if the substrate is placed in a position shifted from a predetermined position on the clamping surface, the substrate cannot be reliably held in the predetermined position.

[0006] The present invention aims to solve the above problems and to provide a substrate support device that can guide a substrate to a predetermined position and support the substrate in that predetermined position, even when the substrate is placed in a position that is misaligned from the predetermined position. [Means for solving the problem]

[0007] The substrate support device of the present invention comprises a support stand having a support surface on which a disc-shaped substrate is placed, and which rotates to change the orientation of the support surface, thereby changing from a mounting position on which the substrate is placed to a processing position on which a predetermined processing is performed on the surface of the substrate to be processed, and a plurality of supports capable of supporting the substrate at a predetermined substrate support position on the support surface when the support stand is in the processing position, wherein each of the plurality of supports has at least one contact surface capable of contacting the side surface of the substrate to support the substrate, and each of the plurality of supports rotates around a predetermined axis of rotation, and moves from an upper position where the contact surface is located above the support surface to a support position where the contact surface faces toward the support surface to support the substrate, and while the plurality of supports move from the upper position to the support position, at least one of the contact surfaces contacts the substrate which is placed at a position offset from the substrate support position on the support surface, and guides the substrate to the substrate support position.

[0008] In this configuration, if the substrate is placed in a position deviated from a predetermined substrate support position, at least one contact surface will contact the substrate while the multiple supports move from the upper position to the support position, guiding the substrate to the predetermined substrate support position. That is, if the substrate is placed in a position deviated from a predetermined substrate support position, at least one contact surface will move from the upper side of the substrate toward the substrate, guiding the substrate to the predetermined substrate support position. Therefore, even if the substrate is placed in a position deviating from the predetermined substrate support position, the substrate support device of the present invention can reliably guide the substrate to the substrate support position without lifting it. Furthermore, the substrate support device of the present invention supports the substrate at a predetermined substrate support position even when the support base is in the processing position. In other words, even if the substrate is placed at a position offset from the substrate support position, the substrate processing device using the substrate support device of the present invention can process the substrate while it is supported at the predetermined substrate support position, because the multiple supports guide and support the substrate at the substrate support position before the support base assumes the processing position.

[0009] Furthermore, the substrate support device of the present invention may be configured such that the center of the substrate placed at the substrate support position is located within a triangular region formed by connecting the three points where each of the contact surfaces and the side surface make contact.

[0010] With this configuration, the substrate support device can guide the substrate to the substrate support position and support it in that position, regardless of the direction in which the substrate is shifted from the predetermined substrate support position on the support surface.

[0011] Furthermore, the substrate support device of the present invention may be configured such that at least one of the contact surfaces contacts the substrate in each of the four regions of the substrate, which are divided by a first straight line passing through the center of the substrate placed at the substrate support position and parallel to the horizontal direction when the support stand is in the processing position, and a second straight line passing through the center and perpendicular to the first straight line.

[0012] With this configuration, the substrate support device can guide the substrate to the substrate support position and support it in that position, regardless of the direction in which the substrate is shifted from the predetermined substrate support position on the support surface.

[0013] Furthermore, the substrate support device of the present invention may be configured such that the substrate has a notch, and in at least one of the four regions, a plurality of the contact surfaces contact the substrate.

[0014] If the substrate support position is changed, one contact surface in one of the four regions may become unable to contact the substrate depending on the position of the notch in the substrate. In contrast, with this configuration, the other contact surfaces in that region can contact the substrate S. Therefore, even if the substrate has a notch and the substrate support position is changed, the substrate placed in the substrate support position can be guided and supported in the substrate support position.

[0015] Furthermore, the substrate support device of the present invention may further include at least one restricting member positioned above the surface to be processed when the substrate is in the substrate support position, which restricts the movement of the substrate.

[0016] Furthermore, the substrate support device of the present invention may be configured such that the restricting member is positioned above the surface to be processed at the same time as the plurality of supports reach the support position, or after the plurality of supports have reached the support position.

[0017] According to this configuration, the regulating member is positioned above the surface to be processed simultaneously when or after the plurality of supports reach the support positions. That is, simultaneously when or after the substrate is positioned at a predetermined substrate support position by the support members, the regulating member is positioned above the surface to be processed. Therefore, since the regulating member does not need to be configured in consideration of the case where the substrate is arranged at a position deviated from the predetermined substrate support position, the area covering the upper part of the substrate can be reduced. Thereby, for example, when performing a process of irradiating the substrate with an ion beam, it is possible to reduce the area on the processed surface of the substrate that is not processed because the ion beam is blocked by the regulating member.

[0018] Further, in the substrate support apparatus of the present invention, the regulating member may be configured to be in contact with the surface to be processed in a state where the regulating member is positioned above the surface to be processed.

[0019] Further, in the substrate support apparatus of the present invention, the regulating member may be configured to be separated from the surface to be processed in a state where the regulating member is located at the regulating position.

[0020] Further, in the substrate support apparatus of the present invention, at least one of the regulating members may be configured to rotate integrally with at least one support member around the rotation shaft center.

[0021] Further, in the substrate support apparatus of the present invention, the support base may be configured as an electrostatic chuck that electrostatically adsorbs the substrate onto the support surface. Effects of the Invention

[0022] According to the substrate support apparatus of the present invention, even when the substrate is placed at a position deviated from the predetermined substrate support position, the substrate can be guided to the substrate support position and supported at the substrate support position. Brief Description of the Drawings

[0023] [Figure 1]Schematic diagrams of a substrate support apparatus and a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] A schematic side view of the substrate support apparatus showing a state where a support body is at an upper position in the same embodiment. [Figure 3] A schematic side view of the substrate support apparatus showing a state where the support body is at a support position in the same embodiment. [Figure 4] A front view of the substrate support apparatus showing a state where the support body is located at the upper position in the same embodiment. [Figure 5] A front view of the substrate support apparatus showing a state where the support body is located at the support position in the same embodiment. [Figure 6] A perspective view of the support body in the same embodiment. [Figure 7] A top view of the substrate support apparatus showing a state where a predetermined substrate support position is changed in the same embodiment. [Figure 8] A schematic side view of the substrate support apparatus showing a first modified example of the same embodiment. [Figure 9] A top view of the substrate support apparatus showing a second modified example of the same embodiment. [Figure 10] A top view of the substrate support apparatus showing a third modified example of the same embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0024] A substrate support apparatus 1 according to a first embodiment of the present invention and a substrate processing apparatus 100 using the substrate support apparatus 1 will be described. Note that FIGS. 1 to 10 are prepared for the purpose of facilitating understanding of the present invention, and the shapes, ratios of length dimensions, and scale ratios of respective constituent elements among the drawings are not necessarily consistent.

[0025] FIG. 1 is a schematic diagram showing the substrate support apparatus 1 and the substrate processing apparatus 100 including the substrate support apparatus 1 according to the present embodiment. As shown in Figure 1, the substrate processing apparatus 100 in this embodiment is an ion beam irradiation apparatus that irradiates a disc-shaped substrate S with an ion beam IB. The substrate S in this embodiment is a wafer having a surface to be processed Sa that is irradiated with the ion beam IB.

[0026] The ion beam irradiation apparatus shown in this embodiment is an example of a substrate processing apparatus 100 that uses a substrate support apparatus 1, and the substrate processing apparatus 100 is not limited to an ion beam irradiation apparatus. In other words, the substrate support apparatus 1 is not limited to being used in an ion beam irradiation apparatus.

[0027] Furthermore, the wafer shown in this embodiment is just one example of a substrate S, and the substrate S is not limited to a wafer. That is, the substrate processing apparatus 100 can be any type of apparatus that performs a predetermined processing on the surface Sa of the substrate S. Also, the substrate S can be any type of apparatus that has a surface Sa on which the predetermined processing is performed.

[0028] The substrate processing apparatus 100 includes an ion source 101 that generates plasma from a source gas, and a mass spectrometry magnet 102 that mass-separates the ion beam IB drawn from the ion source 101. The substrate processing apparatus 100 also includes a processing chamber 103 into which the ion beam IB is irradiated onto the substrate S. The ion beam IB that has passed through the mass spectrometry magnet 102 is guided into the processing chamber 103. A substrate support device 1 that supports the substrate S is positioned in the processing chamber 103.

[0029] The X, Y, and Z axes shown in each figure are orthogonal to each other, and the Y axis shown in each figure is parallel to the height direction of the substrate support device 1. The Z axis shown in each figure is parallel to the direction of travel of the ion beam IB guided into the processing chamber 103. The substrate S, supported by the substrate support device 1, is transported back and forth multiple times along the X axis within the processing chamber 103, crossing the ion beam IB.

[0030] The substrate support device 1 includes a support base 10 having a circular support surface 10a on which a substrate S is placed. The support base 10 is configured to be able to rotate within a predetermined range around a predetermined support base rotation axis A shown in Figure 1.

[0031] The support base 10 rotates around the support base rotation axis A so as to change the orientation of the support surface 10a, thereby changing from a mounting position P1, which is the position when the substrate S is placed on the support surface 10a, to a processing position P2, which is the position when a predetermined process is performed on the surface to be processed Sa. In this embodiment, the predetermined process performed on the surface to be processed Sa is an ion beam irradiation process, for example, an ion implantation process.

[0032] The substrate S has a circular shape on the surface to be processed Sa, and a notch Sb that gives the surface Sa a shape in which a part of the circle is cut out. In this embodiment, the notch Sb is oriental flat, but is not limited to this. The notch Sb may be, for example, a notch.

[0033] The substrate S can be any plate material with a circular shape on the surface to be processed Sa, and the overall shape can be a disc. The surface to be processed Sa may have a shape in which a part of the circle is cut out, as in this embodiment, or it may have a curved shape in the thickness direction of the substrate S.

[0034] In Figure 1, the support stand 10 is shown as a dashed line as it moves parallel to the X-axis while supporting the substrate S, crossing the ion beam IB after changing from the mounting position P1 to the processing position P2. Also in Figure 1, the support stand 10 at the position where the substrate S is placed is shown as a solid line. The operation of changing the orientation of the surface Sa to be processed by the support stand 10 changing from the mounting position P1 to the processing position P2 occurs at the position where the substrate S is placed on the support stand 10.

[0035] The substrate support device 1 includes a plurality of support bodies 11 capable of supporting the substrate S at a predetermined substrate support position Q on the support surface 10a when the support base 10 is in the processing position P2. The number of support bodies 11 is not limited to a specific number, but the substrate support device 1 of this embodiment includes two support bodies 11.

[0036] When a predetermined process is performed on the substrate S, that is, when the substrate support device 1 is in the position shown by the dashed line in Figure 1, the support base 10 is in the processing position P2, and the surface Sa of the substrate S to be processed is directed towards the ion beam IB. Even in this state, the substrate S is supported at the substrate support position Q by two supports 11.

[0037] In other words, while the surface Sa to be processed is irradiated with the ion beam IB, the substrate S is always supported at the substrate support position Q by the two supports 11. The substrate support position Q is a position relative to the support surface 10a, and in Figure 1, the substrate support position Q in this embodiment is shown by a dashed line. Hereafter, one of the two supports 11 provided by the substrate support device 1 may be referred to as the first support 11A and the other as the second support 11B.

[0038] Figure 2 is a schematic side view of the substrate support device 1 showing each support 11 in this embodiment in the upper position R1, which will be described later. Figure 4 is a schematic side view of the substrate support device 1 showing each support 11 in this embodiment in the support position R2, which will be described later.

[0039] As shown in Figures 2 and 3, each support 11 is fixed to the support base 10 outside the support surface 10a so that it can rotate within a predetermined range around the rotation axis B, which will be described later. In this embodiment, the first support 11A and the second support 11B are positioned outside the support surface 10a so as to face each other across the support surface 10a.

[0040] Each support 11 is equipped with a shaft member 16 located inside it, to which the driving force generated by a motor (not shown) is transmitted. In Figures 2 and 3, the shaft member 16 is shown by a dashed line.

[0041] Each support 11 is configured to perform rotational movement around the rotation axis B defined by the shaft member 16 within a predetermined range, by transmitting the driving force of a motor (not shown) to the shaft member 16. In Figure 1, the rotation axis B is shown by a dashed line. Furthermore, each shaft member 16 is arranged parallel to the support surface 10a. That is, the rotation axis B defined by each shaft member 16 is parallel to the support surface 10a.

[0042] Hereafter, the rotation axis B of the first support 11A may be referred to as the first rotation axis B1, and the rotation axis B of the second support 11B may be referred to as the second rotation axis B2. Also, the shaft member 16 of the first support 11A may be referred to as the first shaft member 16a, and the shaft member 16 of the second support 11B may be referred to as the second shaft member 16b.

[0043] Each support 11 moves from the upper position R1 shown in Figure 2 to the support position R2 shown in Figure 3 by rotating around the rotation axis B. Each shaft member 16, namely the first shaft member 16a and the second shaft member 16b, is positioned outside the substrate S in the radial direction of the substrate S positioned at the substrate support position Q. Therefore, each support 11 rotates within a predetermined range around the rotation axis B, which is located outside the substrate S in the radial direction of the substrate S positioned at the substrate support position Q, and moves from the upper position R1 to the support position R2.

[0044] In this embodiment, each support 11 is configured to begin rotational movement around the rotation axis B from an upper position R1. However, the position at which each support 11 begins rotational movement around the rotation axis B is not limited to the upper position R1. Each support 11 only needs to be configured to reach the support position R2 via the upper position R1.

[0045] Each support 11 has a plurality of support members 12 that support the substrate S at a predetermined substrate support position Q when each support 11 is in a support position R2. In addition, each support 11 has a plurality of restricting members 13 that are positioned above the surface Sa to be processed in the thickness direction of the substrate S and restrict the movement of the substrate S when each support 11 is in a support position R2 and the substrate S is in a substrate support position Q.

[0046] Each support 11 in this embodiment has four support members 12 and four restricting members 13, but Figures 2 and 3 schematically show one of these support members 12 and one of these restricting members 13. Note that the number of support members 12 and restricting members 13 in each support 11 is not limited to a specific number. The number of restricting members 13 and the positions in which the restricting members 13 are arranged may be changed according to the expected movement of the substrate S, and the substrate support device 1 only needs to have at least one restricting member 13.

[0047] Each support 11 has a base 14 that connects a plurality of support members 12 and a plurality of restricting members 13. In this embodiment, each support 11 is formed by integrally molding four support members 12, four restricting members 13, and a base 14. Hereafter, the base 14 of the first support 11A may be referred to as the first base 14a, and the base 14 of the second support 11B may be referred to as the second base 14b. Note that each support 11 may be constructed by assembling, for example, each support member 12, each restricting member 13, and the base 14 after they have been formed separately.

[0048] Each of the support members 12 in this embodiment is columnar in shape and has a height dimension greater than the thickness dimension of the substrate S. Furthermore, each support member 12 has a contact surface 15 that can contact the side surface Sc of the substrate S positioned at the substrate support position Q and support the substrate S when the support body 11 is positioned at the support position R2. Since each support body 11 has four support members 12, each support body 11 can be considered to have four contact surfaces 15.

[0049] The substrate S, which is brought into the processing room 103, is placed on the support surface 10a by a robot (not shown), but may be placed at a position shifted from the predetermined substrate support position Q. Figure 2 shows a state in which the substrate S is placed at a position shifted from the substrate support position Q, which is indicated by a dashed line. Note that the substrate support position Q, indicated by a dashed line in Figure 2, is slightly away from the support surface 10a, but this is to avoid overlap with the solid line representing the substrate S, and in reality, the substrate S located at the substrate support position Q is on the support surface 10a.

[0050] Even when the substrate S is placed in a position misaligned from the substrate support position Q, the substrate support device 1 guides the substrate S to the predetermined substrate support position Q as each support 11 moves from the upper position R1 to the support position R2, while at least one contact surface 15 moves in contact with the peripheral edge of the side surface Sc or back surface Sd of the substrate S.

[0051] The restricting member 13 restricts the movement of the substrate S positioned at the substrate support position Q. As shown in Figure 3, in this embodiment, each restricting member 13 is configured to contact the surface Sa of the substrate S when the support 11 is positioned at the support position R2 and above the surface Sa of the substrate S. Furthermore, in this embodiment, each restricting member 13 only contacts the surface Sa of the substrate S and is not intended to apply a pressing force that pushes the substrate S toward the support surface 10a. However, the substrate support device 1 may be configured such that at least one restricting member 13 applies such pressing force to the substrate S.

[0052] As shown in Figure 2, when each support 11 is in the upper position R1, each contact surface 15 is located above the support surface 10a. Note that the state in which the contact surface 15 is located above the support surface 10a means that the region of the contact surface 15 that comes into contact with the substrate S as the support 11 moves from the upper position R1 to the support position R2 is located above the support surface 10a. In other words, when the support 11 is in the upper position R1, it is not necessary for the entire region of the contact surface 15 to be above the support surface 10a.

[0053] Each of the two support bodies 11 rotates around a predetermined axis of rotation B, and moves from an upper position R1 where each contact surface 15 is located above the support surface 10a, so that each contact surface 15 moves toward the support surface 10a, reaching a support position R2 that supports the substrate S. As each support body 11 moves, each support member 12 also moves from the upper side of the substrate S placed on the support surface 10a toward the substrate S.

[0054] While the two supports 11 move from the upper position R1 to the support position R2, at least one contact surface 15 contacts the substrate S, which is placed at a position offset from a predetermined substrate support position Q on the support surface 10a, and guides the substrate S to the substrate support position Q.

[0055] If the support member 12 moves from below the substrate S placed on the support surface 10a towards the substrate S, and the substrate S is positioned away from the substrate support position Q, it is expected that the substrate S will be lifted by at least one contact surface 15. In this case, it is expected that the substrate S will ultimately be lifted by at least one contact surface 15, and a portion of the substrate S will be supported by the support 11 while it is separated from the support surface 10a. In other words, if the support 11 is configured such that the contact surface 15 moves from below to above the support surface 10a, it will be impossible to support the substrate S at the predetermined substrate support position Q.

[0056] In contrast, in this embodiment, as the two support bodies 11 move from the upper position R1 to the support position R2, each contact surface 15 moves from the upper side of the substrate S placed on the support surface 10a toward the substrate S. Therefore, even if the substrate S is placed in a position offset from the substrate support position Q, the substrate support device 1 can reliably guide the substrate S to the substrate support position Q without lifting it.

[0057] Furthermore, in the substrate processing apparatus 100 using the substrate support device 1, even when the support base 10 is in the processing posture P2, the multiple support bodies 11 support the substrate S at a predetermined substrate support position Q. In other words, even if the substrate S is placed at a position offset from the substrate support position Q, the substrate processing apparatus 100 can process the substrate S while it is supported at the substrate support position Q by having the multiple support bodies 11 guide and support the substrate S to the substrate support position Q before returning to the processing posture P2.

[0058] As shown in Figures 2 and 3, the substrate support device 1 is arranged inside the support base 10 and includes electrodes 10b for electrostatically adsorbing the substrate S onto the support surface 10a. In other words, the support base 10 in this embodiment is configured as an electrostatic chuck for electrostatically adsorbing the substrate S onto the support surface 10a.

[0059] As shown in Figure 1, in the substrate processing apparatus 100 of this embodiment, the substrate S is first brought into the processing chamber 103 from the outside and placed on the support surface 10a of the support base 10 in a mounting position P1 by a robot (not shown). At this time, each support 11 is located in the upper position R1 shown in Figure 2, and the substrate S is placed on the support surface 10a without contacting each support 11.

[0060] Subsequently, each support 11 rotates around a predetermined rotation axis B, moving to the support position R2 shown in Figure 3, and the substrate S is supported by the support 11 at the substrate support position Q.

[0061] When the substrate S is placed on the support surface 10a by a robot (not shown), the substrate S may be placed at a position shifted from the predetermined substrate support position Q. Even in such cases, as each support 11 moves from the upper position R1 to the support position R2, at least one contact surface 15 moves while in contact with the substrate S, guiding the substrate S to the predetermined substrate support position Q.

[0062] In other words, a substrate S placed at a position offset from a predetermined substrate support position Q moves along the support surface 10a while being pushed by at least one contact surface 15, and is guided to the substrate support position Q. More specifically, the contact surface 15 of at least one support member 12 moves in a manner that pushes the substrate S while contacting the periphery of the side surface Sc or back surface Sd of the substrate S, guiding the substrate S to the predetermined substrate support position Q.

[0063] Furthermore, since each regulating member 13 in this embodiment is integrated with the support 11, each regulating member 13 rotates around the rotation axis B as the support 11 rotates around the rotation axis B. Therefore, each regulating member 13 is positioned above the surface to be processed Sa at the same time that each support 11 reaches the support position R2.

[0064] Furthermore, the regulating member 13 does not need to be integrated with the support 11. The support 11 is configured to operate independently of the support 11, and it is sufficient that it operates so that each support 11 is positioned above the surface to be processed Sa at the same time as, or after, each support 11 reaches the support position R2.

[0065] In other words, each regulating member 13 should be configured to be positioned above the surface to be processed Sa at the same time as, or after, the two support members 11 reach the support position R2. That is, each regulating member 13 should be positioned above the surface to be processed Sa at the same time as, or after, the substrate S is positioned at a predetermined substrate support position Q.

[0066] If it is assumed that the substrate S is supported in a position offset from the substrate support position Q, the restricting member 13 needs to be configured in a relatively large shape so that it can restrict the movement of the substrate S regardless of its position.

[0067] In contrast, the restricting member 13 of this embodiment does not need to be configured to take into account that the substrate S is positioned at a location offset from a predetermined substrate support position Q. Therefore, the area over which the restricting member 13 covers the substrate S can be reduced. As a result, for example, while the substrate processing apparatus 100 is irradiating the substrate S with an ion beam IB, the area of ​​the surface to be processed Sa that is not processed due to the ion beam IB being blocked by the restricting member 13 can be reduced.

[0068] After the substrate S is supported at the substrate support position Q by the support 11, a voltage is applied to the electrode 10b, and the substrate S is electrostatically attracted to the support surface 10a. In other words, the substrate S is supported at the substrate support position Q not only by the two support 11, but also by the electrical force generated by the voltage applied to the electrode 10b.

[0069] Once the substrate S is supported at the substrate support position Q, as shown in Figure 1, the support base 10 rotates around the support base rotation axis A to assume the processing position P2, and the surface to be processed Sa is directed towards the ion beam IB. Subsequently, the substrate support device 1 supporting the substrate S moves back and forth within the processing chamber 103 so as to cross the ion beam IB, and the ion beam IB is irradiated onto the surface to be processed Sa.

[0070] The ion beam IB is irradiated over almost the entire surface Sa to be processed, and once the ion beam irradiation process on the substrate S is complete, the support stand 10 rotates around the support stand rotation axis A to return to the mounting position P1. Then, the electrostatic adsorption of the substrate S is released by releasing the voltage applied to the electrode 10b, and the pair of support supports 11 move back to the upper position R1, releasing the support of the substrate S. Subsequently, the substrate S is lifted away from the support surface 10a by a robot (not shown) and transported out of the processing chamber 103.

[0071] When the voltage applied to electrode 10b is released and the electrostatic attraction to the substrate S is released, the substrate S may move as if it is bouncing off the support surface 10a. In this case, it is conceivable that the substrate S may detach from the support surface 10a or move to a position significantly shifted from the substrate support position Q. If such a situation occurs, the robot (not shown) will not be able to lift and transport the processed substrate S, and the operation of the substrate processing device 100 will be stopped.

[0072] In contrast, the substrate support device 1 is equipped with a restricting member 13 that restricts the movement of the substrate S. Therefore, even if the substrate S attempts to move in a way that causes it to spring up from the support surface 10a as described above, the movement of the substrate S is restricted by the restricting member 13. This prevents the substrate S from falling off the support surface 10a or shifting significantly from the substrate support position Q when the voltage applied to the electrode 10b is released.

[0073] Each regulating member 13 in this embodiment can be any type that can prevent the substrate S from moving so as to bounce up from the support surface 10a, thereby preventing the substrate S from shifting significantly from a predetermined substrate support position Q. The regulating member 13 does not need to be in contact with the surface Sa of the substrate S when the support 11 is in the support position R2, and it is sufficient that it is positioned above the surface Sa of the substrate S in the thickness direction.

[0074] In this embodiment, the substrate support device 1 can support the substrate S at the substrate support position Q using only the two support bodies 11, even when the support base 10 is in the processing position P2, that is, when the surface Sa of the substrate S is directed towards the ion beam IB. More specifically, even when the surface Sa of the substrate S is directed towards the ion beam IB, the substrate S can be supported at the substrate support position Q using only the multiple support members 12 of the two support bodies 11.

[0075] In other words, even when no voltage is applied to electrode 10b, the substrate S is supported at the substrate support position Q by only the two supports 11. That is, in the substrate support device 1, it is not essential that the support base 10 be configured as an electrostatic chuck. The substrate S is held more firmly at the substrate support position Q if the support base 10 is configured as an electrostatic chuck.

[0076] If the substrate support device 1 does not have electrodes 10b, that is, if the support base 10 is not configured as an electrostatic chuck, the bouncing of the substrate S described above will not occur. Therefore, in this case, the substrate support device 1 does not need to have a restricting member 13. Also, even if the support base 10 is configured as an electrostatic chuck, if the bouncing of the substrate S described above is not expected, the substrate support device 1 does not need to have a restricting member 13.

[0077] Even if the substrate support device 1 does not have electrodes 10b, a regulating member 13 may be provided for the purpose of firmly holding the substrate S at the substrate support position Q. In this case, the regulating member 13 only needs to be configured to contact the surface Sa of the substrate S to be processed at the substrate support position Q.

[0078] Figure 4 is a plan view of the substrate support device 1 showing the state in which the two support bodies 11 are located at the upper position R1. Figure 5 is a plan view of the substrate support device 1 showing the state in which the two support bodies 11 are located at the support position R2. Both the support base 10 shown in Figures 4 and 5 are in the mounting position P1.

[0079] Figure 6 is a perspective view of the first support 11A in this embodiment. Since the second support 11B in this embodiment is symmetrical to the first support 11A, the perspective view of the second support 11B is omitted.

[0080] As shown in Figures 4 and 5, the first support 11A and the second support 11B each have four support members 12, four restricting members 13, and a base 14 that connects the support members 12 and the restricting members 13.

[0081] Hereafter, the four support members 12 of the first support 11A may be referred to as support members 12a to 12d, and the four support members 12 of the second support 11B may be referred to as support members 12e to 12h. Also, the four restricting members 13 of the first support 11A may be referred to as restricting members 13a to 13d, and the four restricting members 13 of the second support 11B may be referred to as restricting members 13e to 13h.

[0082] The first straight line L1, shown as a dashed line in Figure 5, passes through the center O of the substrate S placed at the substrate support position Q and is parallel to the horizontal direction when the support base 10 is in the processing position P2. In other words, the first straight line L1 is parallel to the support base rotation axis A and the X-axis. The second straight line L2, also shown as a dashed line in Figure 5, passes through the center O of the substrate S placed at the substrate support position Q and is perpendicular to the first straight line L1.

[0083] The substrate S is divided into four regions by a first straight line L1 and a second straight line L2. In this embodiment, when the support base 10 moves to the processing position P2, the notch Sb of the substrate S is positioned downwards. Therefore, among the regions partitioned by the first straight line L1, the upper side of the substrate S when the support base 10 is in the processing position P2, i.e., the upper side of the paper in Figure 5, is defined as the upper side of the substrate S. Also, among the regions partitioned by the first straight line L1, the lower side of the substrate S when the support base 10 is in the processing position P2, i.e., the lower side of the paper in Figure 5, is conveniently defined as the lower side of the substrate S. Furthermore, among the regions partitioned by the second straight line L2 in Figure 5, the right side of the paper is conveniently referred to as the right side of the substrate S, and the left side of the paper is conveniently referred to as the left side of the substrate S.

[0084] As shown in Figure 5, the support members 12a and 12b of the first support 11A support the side surface Sc of the substrate S in the upper and right-side region of the substrate S. In addition, the support members 12c and 12d of the first support 11A support the side surface Sc of the substrate S in the lower and right-side region of the substrate S.

[0085] Support members 12e and 12f of the second support 11B support the side surface Sc of the substrate S in the upper and left-side region of the substrate S. Support members 12g and 12h of the second support 11B support the side surface Sc of the substrate S in the lower and left-side region of the substrate S.

[0086] The restricting members 13a and 13b of the first support 11A are positioned above the surface Sa of the substrate S in the upper and right-side region of the substrate S. The restricting members 13c and 13d of the first support 11A are positioned above the surface Sa of the substrate S in the lower and right-side region of the substrate S.

[0087] The restricting members 13e and 13f of the second support 11B are positioned above the surface Sa of the substrate S in the upper and left-side region of the substrate S. The restricting members 13g and 13h of the second support 11B are positioned above the surface Sa of the substrate S in the lower and left-side region of the substrate S.

[0088] In other words, in this embodiment, two support members 12 and two restricting members 13 are positioned in each of the four regions of the substrate S that are separated by the first straight line L1 and the second straight line L2.

[0089] As shown in Figure 6, the support members 12a to 12h each have contact surfaces 15a to 15h that can contact the side surface Sc of the substrate S and support the substrate S. Each of the contact surfaces 15a to 15h forms a curved surface that bulges toward the center O of the substrate S in the state in which the substrate S is supported as shown in Figure 5. Note that the fact that the contact surfaces 15a to 15h are curved surfaces includes the fact that the contact surfaces 15a to 15h are spherical.

[0090] Because the contact surfaces 15a to 15h of the substrate support device 1 are curved, the substrate S can be smoothly guided to the predetermined substrate support position Q regardless of how the substrate S is placed in a position that is offset from the predetermined substrate support position Q on the surface Sa to be processed.

[0091] Figure 4 shows a state in which the substrate S is placed at a position shifted diagonally upward and to the right of the plane of the paper from a predetermined substrate support position Q. When the first support 11A and the second support 11B rotate from the upper position R1 toward the support position R2 from the state shown in Figure 4, first, the contact surface 15a of the support member 12a closest to the substrate S comes into contact with the peripheral edge or side surface Sc of the back surface Sd of the substrate S. Then, as the first support 11A rotates around the first rotation axis B1, the substrate S is pushed by the contact surface 15a and moves along the support surface 10a toward the lower left of the plane of the paper.

[0092] Subsequently, as the first support 11A and the second support 11B rotate, the substrate S comes into contact with the contact surface 15e and is then pushed by the contact surfaces 15a and 15e, causing it to move downwards from the plane of the paper. The substrate S is then guided by contacting any of the other contact surfaces 15b-15d and 15f-15h, and is finally positioned at a predetermined substrate support position Q.

[0093] As described above, in this embodiment, the substrate support device 1 guides the substrate S to a predetermined substrate support position Q by pressing the contact surfaces 15a to 15h of the support members 12a to 12h against the periphery of the side surface Sc or back surface Sd of the substrate S as the first support 11A and the second support 11B rotate.

[0094] In this embodiment, the first support 11A and the second support 11B each have four support members 12a to 12d and support members 12e to 12h, but the number of support members 12 in the first support 11A and the second support 11B is not limited to this. Also, the first support 11A and the second support 11B each have four restricting members 13a to 13d and restricting members 13e to 13h, but the number of restricting members 13 in the first support 11A and the second support 11B is not limited to this.

[0095] In this embodiment, the substrate support device 1 supports the substrate S by having two contact surfaces 15 in each of the four regions of the substrate S, which are divided by a first straight line L1 that passes through the center O of the substrate S placed at the substrate support position Q and is parallel to the horizontal direction when the support base 10 is in the processing position P2, and a second straight line L2 that passes through the center O of the substrate S and is perpendicular to the first straight line L1.

[0096] With this configuration, the substrate support device 1 can guide the substrate S to the substrate support position Q and support it at the substrate support position Q, regardless of the direction in which the substrate S is shifted from the predetermined substrate support position Q on the support surface 10a.

[0097] In order to guide and support the substrate S to the substrate support position Q, the substrate support device 1 is configured such that at least one contact surface 15 in each of the four regions contacts the substrate S to support it. That is, at least one support member 12 is positioned in each of the four regions.

[0098] In contrast, the substrate support device 1 of this embodiment is configured such that two contact surfaces 15 contact the substrate S in each of the four regions of the substrate S, assuming that the predetermined substrate support position Q is changed. That is, in the substrate support device 1 of this embodiment, two support members 12 are positioned in each of the four regions.

[0099] Figure 7 is a plan view of the substrate support device 1, showing an example of a state in which the predetermined substrate support position Q has been changed. In Figure 7, the substrate support position Q has been changed, and the notch Sb of the substrate S is positioned opposite the support member 12d.

[0100] In this case, the contact surface 15d of the support member 12d cannot contact the substrate S. Therefore, if the first support 11A does not have a support member 12c, the substrate S will not be guided or supported in the area to the right and below the substrate S. Furthermore, if the support base 10 rotates in this state and reaches the processing position P2, the substrate S may fall from the support base 10.

[0101] In contrast, in this embodiment, since the support member 12c is positioned in the right and lower region of the substrate S in addition to the support member 12d, even if the substrate support position Q is changed as described above, the substrate S can be reliably guided to the substrate support position Q, and the substrate S can be reliably supported even when the support base 10 is in the processing position P2.

[0102] In other words, the number and arrangement of the support members 12 of the support body 11 can be appropriately set according to the position of the notch Sb of the substrate S at the substrate support position Q. When the substrate support position Q is changed, the substrate support device 1 should be configured such that, taking into account the changed notch Sb, a plurality of contact surfaces 15 contact the substrate S in at least one of the four regions.

[0103] If the position of the substrate support position Q is not changed, the substrate support device 1 only needs to support the substrate S by having one contact surface 15 in contact with the substrate S in each of the four regions of the substrate S separated by the first straight line L1 and the second straight line L2 when the support body 11 is located at the support position R2. In other words, the substrate support device 1 only needs to be configured such that at least one support member 12 supports the substrate S in each of the four regions.

[0104] In contrast, the substrate support device 1, as in this embodiment, in each of the four regions By configuring the multiple contact surfaces 15 to contact the substrate S, the substrate S can be guided to and supported at the predetermined substrate support position Q even when the position of the substrate support position Q is changed. The substrate support device 1 only needs to be configured such that the multiple contact surfaces 15 contact the substrate S in at least one of the four regions, depending on the position of the notch Sb of the substrate S located at the changed substrate support position Q.

[0105] Figure 8 is a schematic side view of the substrate support device 1, showing a first modified example of the substrate support device 1. In this modified example, each regulating member 13 is separated from the surface to be processed Sa of the substrate S when each support 11 is located at the support position R2 and each regulating member 13 is positioned above the surface to be processed Sa.

[0106] The substrate S may spring up at the same time that the voltage applied to electrode 10b is released. Even in such a case, the restricting members 13a to 13h are located above the substrate S, restricting its movement and preventing situations such as the substrate S detaching from the support surface 10a.

[0107] Figure 9 is a plan view of the substrate support device 1, showing a second modified example of the substrate support device 1. As shown in Figure 9, the substrate support device 1 in the second modified example comprises four support bodies 11. Each support body 11 is integrally composed of a support member 12 having one contact surface 15 and a regulating member 13.

[0108] Furthermore, the substrate support device 1 in the second modified example includes two regulating members 13i and 13j that operate independently of each support 11. Both regulating members 13i and 13j are fixed to the support base 10. The two regulating members 13i and 13j each rotate around rotation axes B3 and B4 parallel to the support surface 10a.

[0109] Both regulating members 13i and 13j are configured to operate so as soon as each support 11 reaches the support position R2, or immediately after each support 11 reaches the support position R2, they are positioned above the surface Sa to be processed.

[0110] The number of supports 11 provided by the substrate support device 1 is not limited to a specific number. Similarly, the number of support members 12 provided by each support 11, i.e., the number of contact surfaces 15, is not limited to a specific number. Furthermore, the regulating member 13 does not need to be integrally formed with the support 11; it may operate independently of the support 11.

[0111] Furthermore, the substrate support device 1 is not limited to a configuration in which, when the support body 11 is located at the support position R2, at least one support member 12 is positioned in each of the four regions of the substrate S separated by the first straight line L1 and the second straight line L2.

[0112] In order to guide and support the substrate S to a predetermined substrate support position Q, the multiple contact surfaces 15 should be arranged such that the center O of the substrate S placed at the substrate support position Q is included within a triangular region formed by three points selected from multiple points where each contact surface 15 contacts the side surface Sc of the substrate S.

[0113] In other words, if the three support members 12, each having one contact surface 15, are arranged such that the center O of the substrate S is included within the triangular region formed by connecting the three points where each support member 12 contacts the side surface Sc of the substrate S, then the substrate S can be guided and supported at a predetermined substrate support position Q.

[0114] Therefore, when the substrate S is placed in a predetermined substrate support position Q, and the position of the notch Sb is fixed, that is, when the position of the notch Sb is not changed, at least three support members 12 are sufficient.

[0115] Figure 10 is a plan view of the substrate support device 1, showing a third modified example of the substrate support device 1. In the third modified example, the substrate support device 1 has the number and position of the support members 12 and regulating members 13 of the first support 11A and the second support 11B, respectively, changed.

[0116] As described above, if the position of the notch Sb of the substrate S does not change when it is positioned at a predetermined substrate support position Q, then at least three support members 12 are sufficient. Therefore, in the third modified example, the substrate support device 1 is configured such that the first support body 11A has one support member 12, and the second support body 11B has two support members 12.

[0117] As shown in Figure 10, the support member 12 of the first support 11A is in contact with the side surface Sc of the substrate S on the first straight line L1. The two support members 12 of the second support 11B are in contact with the side surface Sc of the substrate S at positions symmetrical with respect to the first straight line L1. As an example, with this arrangement, the center O of the substrate S is located within the region of the triangle T formed by connecting the points where the three support members 12 of the first support 11A and the second support 11B contact the side surface Sc of the substrate S, and the substrate S can be guided and supported at a predetermined substrate support position Q by the support members 12.

[0118] In other words, the substrate support device 1 has three or more contact surfaces 15, and the multiple contact surfaces 15 are arranged such that the center O of the substrate S is located within one of the triangular regions formed by connecting three points where each contact surface 15 contacts the side surface Sc of the substrate S.

[0119] The number and arrangement of the contact surfaces 15 that support the substrate S, and the number and arrangement of the regulating members 13 provided by the substrate support device 1, may be appropriately changed depending on the set substrate support position Q, the shape and material of the substrate S, etc.

[0120] Furthermore, it goes without saying that the present invention is not limited to the embodiments and modifications described above, and various modifications are possible without departing from the spirit of the invention. [Explanation of symbols]

[0121] 1 Board support device 10 Support stand 10a Support surface 11:Support 12: Support member 13: Regulating member 15: Contact surface L1: First straight line L2: Second straight line O: Center P1: Mounting position P2: Processing posture Q: Board support position R1:Upper position R2: Support position S: Circuit board Sa: Surface to be processed Sc:Side

Claims

1. A support stand having a support surface on which a disc-shaped substrate is placed, and which can be rotated to change the orientation of the support surface, thereby changing from a mounting position in which the substrate is placed on the support surface to a processing position in which a predetermined process is performed on the surface of the substrate to be processed, The support base comprises a plurality of supports capable of supporting the substrate at a predetermined substrate support position on the support surface when the support base is in the processing position, Each of the plurality of supports has at least one contact surface that can contact the side surface of the substrate and support the substrate, The contact surface has a curved surface that bulges toward the center of the substrate supported at the substrate support position, Each of the plurality of supports rotates around a predetermined axis of rotation, and moves from an upper position where the contact surface is located above the support surface, so that the contact surface faces toward the support surface, to reach a support position that supports the substrate. A substrate support device that guides the substrate to the substrate support position while at least one of the contact surfaces contacts the substrate, which is placed at a position offset from the substrate support position on the support surface, as the plurality of supports move from the upper position to the support position.

2. The substrate support device according to claim 1, wherein the contact surfaces are arranged such that the center of the substrate placed at the substrate support position is located within any triangular region formed by connecting the three points where each of the contact surfaces and the side surface make contact.

3. The substrate support device according to claim 1, wherein at least one of the contact surfaces contacts the substrate in each of the four regions of the substrate that are divided by a first straight line passing through the center of the substrate placed at the substrate support position and parallel to the horizontal direction when the support stand is in the processing position, and a second straight line passing through the center and perpendicular to the first straight line.

4. The substrate support device according to any one of claims 1 to 3, further comprising at least one restricting member positioned above the surface to be processed and restricting the movement of the substrate when the substrate is in the substrate support position.

5. The substrate support device according to claim 4, wherein the restricting member is positioned above the surface to be processed at the same time as the plurality of supports reach the support position, or after the plurality of supports have reached the support position.

6. The substrate support device according to claim 4, wherein the restricting member is positioned above the surface to be processed, and the restricting member is separated from the surface to be processed.

7. The substrate support device according to claim 4, wherein the support base is configured as an electrostatic chuck for electrostatically adsorbing the substrate to the support surface.

8. A support stand having a support surface on which a disc-shaped substrate is placed, and which can be rotated to change the orientation of the support surface, thereby changing from a mounting position in which the substrate is placed on the support surface to a processing position in which a predetermined process is performed on the surface of the substrate to be processed, The support base comprises a plurality of supports capable of supporting the substrate at a predetermined substrate support position on the support surface when the support base is in the processing position, Each of the plurality of supports has at least one contact surface that can contact the side surface of the substrate and support the substrate, Each of the plurality of supports rotates around a predetermined axis of rotation, and moves from an upper position where the contact surface is located above the support surface, so that the contact surface faces toward the support surface, to reach a support position that supports the substrate. While the plurality of supports move from the upper position to the support position, at least one of the contact surfaces contacts the substrate, which is positioned on the support surface at a position offset from the substrate support position, and guides the substrate to the substrate support position. The substrate has a notch, In each of the four regions of the substrate, which are divided by a first straight line passing through the center of the substrate placed at the substrate support position and parallel to the horizontal direction with respect to the state in which the support base is in the processing position, and a second straight line passing through the center and perpendicular to the first straight line, at least one of the contact surfaces is in contact with the substrate. A substrate support device in which a plurality of contact surfaces contact the substrate in at least one of the four regions.

9. A support stand having a support surface on which a disc-shaped substrate is placed, and which can be rotated to change the orientation of the support surface, thereby changing from a mounting position in which the substrate is placed on the support surface to a processing position in which a predetermined process is performed on the surface of the substrate to be processed, The support base comprises a plurality of supports capable of supporting the substrate at a predetermined substrate support position on the support surface when the support base is in the processing position, Each of the plurality of supports has at least one contact surface that can contact the side surface of the substrate and support the substrate, Each of the plurality of supports rotates around a predetermined axis of rotation, and moves from an upper position where the contact surface is located above the support surface, so that the contact surface faces toward the support surface, to reach a support position that supports the substrate. While the plurality of supports move from the upper position to the support position, at least one of the contact surfaces contacts the substrate, which is positioned on the support surface at a position offset from the substrate support position, and guides the substrate to the substrate support position. In the state in which the substrate is positioned at the substrate support position, the system further comprises at least one restricting member positioned above the surface to be processed and restricting the movement of the substrate, A substrate support device in which the restricting member is positioned above the surface to be processed, and the restricting member is separated from the surface to be processed.

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