Economical manufacturing methods for lightweight components

JP7919722B2Active Publication Date: 2026-09-14INNOMAQ 21 SL
View PDF 10 Cites 0 Cited by

Patent Information

Application Number
JP2024191595
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2017-07-19
Filing Date
2024-10-31
Publication Date
2026-09-14
Estimated Expiration
2038-02-26

AI Technical Summary

Benefits of technology

を驚くべきことに発見した。一実施形態において微細な分率は純元素を備える。異なる実施形態において純元素は鉄、チタン、およびさらにマグネシウム、その他である。異なる実施形態において異なる純元素の組み合わせが使用されてよい。異なる実施形態において、微細な分率(最小限のD50を有する粉末分率)は、低合金Fe基合金、低合金Ti基合金、およびさらに低合金Mg基合金その他を備える。いくつかの応用において微細な分率(最小限のD50を有する粉末分率)は、異なる実施形態において粗い分率(最も高いD50を有する粉末分率)の機械的強度(UTS)よりも少なくとも11%低い、少なくとも16%低い、少なくとも21%低い、41%低い、およびさらに少なくとも82%低い機械的強度(UTS)を有し、各粉末分率の機械的強度(UTS)は、粉末の分率の融解温度の0.80倍である温度で200MPaの圧力で4時間アルゴン(Ar)雰囲気内で熱間等方加圧(HIP)によって本体を得るために粉末分率が使用される方法によって計測され、そのような本体の機械的強度(UTS)は米国材料試験協会E8/E8M‐16aに従い室温(23℃)で計測される。一代替実施形態において、粉末の各分率の機械的強度(UTS)は、粉末のそのような分率が本体を得るために完全密度まで焼結される方法によって計測され、そのような本体の機械的強度(UTS)は米国材料試験協会E8/E8M‐16aに従い室温(23℃)で計測される。一代替実施形態において粉末の各分率の機械的強度(UTS)は、米国材料試験協会E21‐09に従い高温(300℃)で本体中で計測される。一代替実施形態において、微細な分率は最も低いD50/D10比率を有する粉末分率をさす。一代替実施形態において、粗い分率は最も高いD50/D10比率を有する粉末分率をさす。代替実施形態において上で開示されたD50およびD10の値はそれぞれD50mおよびD10mによって置き換えられることができる。 一実施形態において、発明者は、分率のD10および直近のより小さい分率のD90の間、一実施形態において分率のD5および直近のより小さい分率のD95の間、一実施形態において分率のD3および直近のより小さい分率のD97の間にてある程度の関係は配慮されるべきであることを発見した。異なる実施形態において、ある程度の関係は7.1倍以上、8.1倍以上、9.1倍以上、およびさらに10.6倍以上である。各々の分率の分布の狭さに関して言えば、発明者はパラメータND=(D90‐D10)/D50の制御を使用するのが良い制御方法であることを発見した。異なる実施形態においてNDは0.8より小さく、0.58より小さく、0.48より小さく、0.18より小さく、0.08より小さく、0.038より小さくあるべきである。一実施形態において、NDの定義内でD90はD97によって置き換えられ、D10はD3によって置き換えられる。非常に驚くべき観察結果は、最も小さいサイズを有する分率が狭い通常の分布ではなく通常の分布のカットテール(cut tail)であるために目的のD50を中心とせず、望ましいD50よりもちょうど小さい場合に、達成可能な相対密度が高くなるということである(例として、分率1:600+/‐25マイクロメートルおよび分率2:<45マイクロメートルの混合は、分率1:600+/‐25マイクロメートルおよび分率2:45+/‐5マイクロメートルの混合よりも高い相対密度に到達することができる)。従って、このような場合において、NDの制御が最も微細な分率以外の全ての分率に対して実行され、D97の基準が適用されるがNDの基準は適用されず、むしろNDS=(D97‐D50)/(D50‐D3)が適用される。異なる実施形態において、NDSは0.9より小さく、0.8より小さく、0.68より小さく、0.49より小さくあるべきである。ここで説明されたことは、高い相対密度が有利となる本文書における微粒子状の粉末または材料の全ての混合へ拡大される。驚くべきことに、いくつかの材料に対して、最も微細な分率が非常に微細な粒子を有する場合、充填物の密度は急に減少する。従っていくつかの応用に対して、最も微細な分率は最も微細な粒子サイズを制限するべきである。異なる実施形態において、最も微細な分率のD5は0.6マイクロメートルを超える、1.2マイクロメートルを超える、3.2マイクロメートルを超える、5.3マイクロメートルを超える、8.1マイクロメートルを超える、11マイクロメートルを超える、16マイクロメートルを超える、およびさらに21マイクロメートルを超えるべきである。一実施形態において、上の文のD5はD10に取って代わられるべきであり、一実施形態においてはD3に取って代わられるべきである。一つ以上の粉末を混合して粉末混合を作るとき、いくつかの実施形態において粉末混合の粒子サイズに対して参照が作られる。一実施形態において、ND、NDS、D3、D5、D50、D95、またはD97への任意の上記の参照は粉末混合のサイズへさらに適用することができる。代替実施形態において上で開示されたD3、D5、D10、D50、D95およびD97の値はそれぞれD3m、D5m、D10m、D50m、D95m、およびD97mによって置き換えられることができる。 いくつかの応用において、粉末はきわめて球状で、粒子サイズ分布はきわめて狭くあるべきである。粉末の真球度は、粒子として同じ体積を有する球体の表面積と粒子の表面積の間の比率として定義される無次元パラメータである。真球度は動画像解析により特定されてもよい。異なる実施形態において、粉末の真球度は0.53より大きい、0.76より大きい、0.86より大きい、およびさらに0.92より大きいことが好ましい。金属微粒子の高い圧縮が望まれる場合、高い真球度の金属粉末がしばしば望ましい。異なる実施形態において、0.92より大きい、0.94より大きい、0.98より大きい、およびさらに1である。一実施形態において、金属粉末は球状である。一実施形態において、粒子サイズ(D3、D5、D10、D50、D85、D90、D95、D97、D98、NDまたはNDSの値)のいずれかを有する球状の粉末が上で開示されている。 真球度について言及すると、いくつかの応用に対して、最も球状の粒子の平均真球度に関して粉末の大多数だけに対して評価されることができる。異なる実施形態において、平均を計算するために、粉末の体積の60%以上、78%以上、83%以上、およびさらに96%以上が考慮されるべきである。いくつかの応用に対して、易焼結性を妨げることやその他により過度の真球度は不利であり、異なる実施形態において0.94未満、0.88%未満、0.68%未満およびさらに0.48未満。一実施形態において、金属粉末は不揃いである。一実施形態において、粉末は上で開示された粒子サイズ(D3、D5、D10、D50、D85、D90、D95、D97、D98、NDまたはNDSの値)のいずれかを有する不揃いな粉末である。一実施形態において、一つ以上の粉末を混合して粉末混合を作るとき、粉末混合の粒子サイズに対して参照が作られる。 いくつかの実施形態において、粒子サイズと同じくらい重要でも、制御されるべきは粉末の冷却速度であるべきだということが発見されている。異なる実施形態において、製造中の粉末の冷却速度は11K/s以上、110K/s以上、1100K/s以上、11000K/s以上、110000K/s以上、およびさらに1100000K/s以上に設定されるべきである。 いくつかの実施形態において、特に要素の製造に使用される微粒子状の材料の特質により、および特にこの材料が粉末状で積層造形(AM)された型または任意の他の種類の型、または容器へ充填される場合、この材料が露出される雰囲気の特質は大いに関連性があることがある。いくつかの実施形態において、圧密されるまで材料が酸素へ全く露出されないことが重要である。いくつかの実施形態において、冷間等方圧加圧(CIP)ステップが完結するまで材料が酸素へ全く露出されないことが重要である。いくつかの実施形態において、積層造形(AM)型、容器、または非常に柔らかい型の中で密封したら材料が酸素へ露出されないことが重要である。一実施形態において、積層造形(AM)型、容器、または非常に柔らかい型の中で密封したら材料が窒素雰囲気下にあることが重要である。異なる実施形態において、バリゴン(varigon)雰囲気、アルゴン雰囲気、水素を有する窒素雰囲気、およびさらに材料雰囲気に対する還元性。一実施形態において、積層造形(AM)型または容器の中で密封したら、一般的なやり方または特に材料のタイプのために、材料が本文書に記載された雰囲気の一つの下にあることが重要である。いくつかの実施形態において、熱間等方加圧(HIP)、焼結、または他の圧密プロセス(緻密化)の間に材料が酸素へ露出されないことが重要である。一実施形態において、熱間等方加圧(HIP)、焼結、または他の圧密プロセス(緻密化)の間に材料が窒素雰囲気下にあることが重要であり、一実施形態においてバリゴン(varigon)雰囲気下、一実施形態においてアルゴン雰囲気下、一実施形態において水素を有する窒素雰囲気下、一実施形態において材料雰囲気に対する還元性下にある。いくつかの実施形態において、熱間等方加圧(HIP)、焼結、または他の圧密プロセス(緻密化)の間に一般的なやり方または特に材料のタイプのために、材料が本文書に記載された雰囲気の一つの下にあることが重要である。 いくつかの実施形態において、型は微粒子状の材料で部分的に充填され、上で開示されたように金属相を少なくとも一つ備える。加えて、いくつかの実施形態において、少なくとも一つの金属相、金属、合金、金属要素を備える本文書を通して開示された任意の材料は、型を充填するために使用されてよく、それらが非互換性でない限り、制約なしで任意の他の実施形態と組み合わせることができる。型について前述したことは、いくつかの実施形態において容器へ応用可能である。 いくつかの実施形態において、適切な粒子サイズ分布とともに振動を使用して微粒子状の材料の高充填密度を得る。他の実施形態において、適切な粒子分布を増進し微粒子状の材料の充填を改良する任意の他の方法は、方法の範囲内において組み合わせに適している。一実施形態において少なくとも部分的に充填された型は振動される。 発明者は本態様の異なる実施形態で有益な観察を行った。多くの形状、特に入り組んだ内部特徴を有する形状は、本態様の異なる方法を使用して適切に作りにくいが、驚くべきことにそのいくつかは型への粉末充填が十分に高ければ可能となる。異なる実施形態において、型の充填は62%以上、67%以上、72%以上、76%以上、82%以上、86%以上、およびさらに92%以上の相対密度を有するべきである。相対密度はパーセントで表されたタップ密度と容積密度の比率として定義され(相対密度=[タップ密度/理論密度]*100)、タップ密度は米国材料試験協会B527‐15に従って計測され、理論密度は米国材料試験協会B962‐08に従って計測される。 一実施形態において、材料の非有機的な部分の充填物に備えられた粉末混合は、52%以上、62%以上、67%以上、72%以上、76%以上、82%以上、86%以上、およびさらに92%以上の見掛け比重を有するべきである。見掛け比重はパーセントで表された見掛け密度と容積密度の比率として定義され(見掛け比重=[見掛け密度/理論密度]*100)、見掛け密度(20℃および1気圧で)は米国材料試験協会B329-06に従って計測され、理論密度(20℃および1気圧で)は米国材料試験協会B962‐08に従って計測される。 振動(任意の周波数および振幅で)、テーピング、または内部パンチング、相対密度を増加させるための全ての手段が歓迎される。樹脂または非有機的な部分を有する高い充填の有機的材料に関連する本文書の他の箇所に記載された高密度充填のための一般的な規則はここでも適用される(高い充填がこの場合のように予期されるまたは予期されない有益な効果を有することが発見される本文書の全ての態様へこれらが適用されることから明らかなように)。いくつかの実施形態において、問題となるのは体積によるパーセントである(粉末で充填される型の内部体積に関して金属粉末の体積によるパーセント)。異なる実施形態において、型の金属粉末充填は体積で52%以上、62%以上、67%以上、72%以上、76%以上、82%以上、86%以上、およびさらに92%以上の充填を有するべきである。型について前述したことは、いくつかの実施形態において型の部分、非常に柔らかい型(非常に柔らかい材料で製造された型)、モデル、またはモデルの部分または容器へ応用可能である。 本文書において、冷間等方圧加圧(CIP)ステップがドライバッグ(dry bag)、ウェットバッグ(wet bag)、温間等方圧加圧(WIP)、または任意の他の類似する方法(液体熱間等方加圧(LHIP)および圧力を適用するシステム、温度を適用するシステム、圧力をかける流体、または何らかのやり方で異なる他の任意の詳細の場合に提供される多くの他の名前)かどうかは、実際の応用、主として使用される微粒子材料の特質、形状および利用可能性その他による。いくつかの実施形態において、ドライバッグ(dry bag)が好ましい。いくつかの実施形態において、ウェットバッグ(wet bag)が好ましい。いくつかの実施形態において、冷間等方圧加圧(CIP)の代わりに、異なる実施形態において62℃以上、82℃以上、160℃以上、220℃以上、およびさらに450℃以上の温度での温間等方圧加圧(WIP)が好ましい。 この文書の全体において、従ってこの態様も例外とはならずに、圧力適用に関する異なる戦略は異なる実施形態に対する冷間等方圧加圧(CIP)に対して使用されてもよい。同様のことが温間等方圧加圧(WIP)の場合の温度および圧力の適用に対しても述べることができる。二つの戦略は特に意外である。一つは温間等方圧加圧(WIP)プロセスにおける長時間の温度の適用に関してであり、もう一方は圧力の維持または圧力サイクル(一定または不定)を有することに関してである。文献に記載された温間等方圧加圧(WIP)プロセスは常に数分であり、異なる実施形態でこの点において発明者は25分以上の時間が用いられる場合にかなり良好な機械的特性が提供されることを発見した。異なる実施形態において、温間等方圧加圧(WIP)で用いられる時間は35分以上、48分以上、65分以上、105分以上、130分以上、250分以上、およびさらに520分以上である。これらの時間は本文書中の他の箇所に表されたものへ補完するものである。異なる実施形態において、冷間等方圧加圧(CIP)サイクルの間の最大圧力は、110MPa以上、210MPa以上、310MPa以上、410MPa以上、510MPa以上、710MPa以上、810MPa以上、およびさらに1010MPa以上である(本文書において前に開示したように、冷間等方圧加圧(CIP)は温間等方圧加圧(WIP)および任意の他の類似のシステムを本文書の全体において含み、従ってここでも明らかである)。いくつかの他の組の実施形態において、全体のプロセス時間はやや短いが、特に最大圧力での時間は非常に短い。異なる実施形態において、4分未満、55秒未満、35秒未満、4秒未満、およびさらに0.9秒未満である。一実施形態において、冷間等方圧加圧(CIP)/温間等方圧加圧(WIP)容器における適用された圧力の時間発展は制御される。一実施形態において、冷間等方圧加圧(CIP)/温間等方圧加圧(WIP)容器における適用された圧力の時間発展は加圧段階の間制御される。 要素を等方圧加圧方法へさらした後、いくつかの実施形態において熱的脱バインダを使用して型は除去される。いくつかの実施形態において、熱プロセスを使用して型は除去される。発明者は、いくつかの実施形態において、熱プロセスを使用して型の少なくとも部分が除去される場合、得られた要素の寸法公差は、他の熱によらない方法を使用して得た要素またはさらに要素が任意の他の方法で除去される場合およびさらに熱プロセスを使用して型の少なくとも部分を除去する場合と比べて減少し、いくつかの応用において要素の損傷は回避されることを驚くべきことに発見した。いくつかの実施形態において型は160℃および710℃の間の熱プロセスを使用して少なくとも部分的に除去される。異なる実施形態において、型は、160℃を超える、210℃を超える、260℃を超える、285℃を超える、310℃を超える、410℃を超える、510℃を超える、610℃を超える、およびさらに710℃を超える温度での熱プロセスを使用して少なくとも部分的に除去される。いくつかの実施形態において、発明者は、型の少なくとも部分的な除去に対してより関連性があるのは温度の選択であることを発見し、異なる実施形態において790℃未満、690℃未満、590℃未満、490℃未満、390℃未満、290℃未満、およびさらに190℃未満である。いくつかの実施形態において、型は全て除去される。型について前述したことは、いくつかの実施形態において容器へ応用可能である。そうであっても、型が化学的脱バインダを使用して少なくとも部分的に除去される他の実施形態が存在する。一実施形態において、脱バインダは非熱プロセスである。一実施形態において、脱バインダは触媒脱バインダ(catalytic debinding)である。異なる実施形態において、脱バインダはウィッキング、乾燥、超臨界抽出、有機溶媒抽出による実施形態、水性溶媒抽出、凍結乾燥法その他によって行われる。一実施形態において型は上で開示された任意の方法を使用して全て除去される。型について前述したことは、いくつかの実施形態において容器へ応用可能である。 型の少なくとも部分的な除去の後、得られた要素は緻密化プロセスへさらされる。いくつかの実施形態において緻密化プロセスは焼結である。他の実施形態において、緻密化プロセスは熱間等方加圧(HIP)であり、他の実施形態において緻密化プロセスは十分に高い温度を伴うプロセスである。型について前述したことは、いくつかの実施形態において型、非常に柔らかい型(非常に柔らかい材料で製造された型)、モデル、またはモデルの部分または容器へ応用可能である。 いくつかの実施形態において、緻密化ステップのための十分に高い温度は、0.52*Tmより高い温度をさし、Tmは型の充填に使用される最も低い融点を有する微粒子材料の融解温度である。異なる実施形態において、緻密化ステップのための十分に高い温度は、0.62*Tmより高い温度をさし、Tmは0.72*Tmより高く0.82*Tmより高い最低の融点を有する微粒子材料の融解温度である。異なる実施形態において、緻密化ステップのための十分に高い温度は、0.52*Tmより高い温度をさし、Tmは62*Tmより高い、72*Tmより高い、およびさらに0.82*Tmより高い最高の体積分率を有する微粒子材料の融解温度である。異なる実施形態において、緻密化ステップのための十分に高い温度は、0.52*Tmより高い温度をさし、Tmは0.62*Tmより高い、0.72*Tmより高い、0.82*Tmより高い最高の重量分率を有する微粒子材料の融解温度である。緻密化ステップのための十分に高い温度は、異なる実施形態において980℃より高い、1055℃より高い、1120℃より高い、1160℃より高い、およびさらに1210℃より高い温度をさす。検査条件は本文書の最後の部分で見ることができる。 いくつかの実施形態において、熱処理は部分的にまたは完全に緻密化ステップと組み合わせられてもよい。いくつかの実施形態において、型の少なくとも部分的な除去は緻密化ステップの間に行われる。 方法は記載され、以下のものは、型、型の部分、モデルまたはモデルの部分、または容器が有機的な部分の関連する分率を備える積層造形プロセスを有する型または型の部分、モデルまたはモデルの部分、または容器の製造を備え、この型、型の部分または容器は金属または金属合金を備えるいくつかの微粒子材料で充填され、充填されたシステムが高い圧力へさらされる場合(冷間等方圧加圧(CIP)または温間等方圧加圧(WIP)プロセスのように)、特に充填の微粒子材料が高い係数および高い降伏力を有する金属を備える場合、実現不可能と考えられていた。このことは、出来上がった部品がいくつかの入り組んだ形状を有する場合なおさらあてはまることであり、内部特徴(空洞、冷却/加熱または流体誘導回路その他)を含む場合はなおさらそうである。コアまたは他の内部特徴または空洞の材料のために、高い降伏力(従って押し出しに対する耐性)が必要と考えられていた。要素の製造のために積層造形を使おうとする場合でも、明らかに、金属のような材料の押し出しに対する高い耐性を伴う方法は考慮されている(US20160279708A1の場合のように)。また、異なる要素に対して必須条件は異なり、高い降伏力の粉末を有する大型の断面要素に対し機能することは特に困難で驚くべきことである。本文書の異なる段落において、この態様が機能するためにカギとなる態様が提供される。一実施形態において、平面を有する全てのセクションから、方法は大型の要素の製造を可能にする。一実施形態において、大型の要素は大型の断面を有する要素である。異なる実施形態において、大型の断面要素は、要素の中の最も大きい断面が(交差する点の最大の領域を提供する断面)120mm以上、220mm以上、420mm以上、520mm以上、720mm以上、820mm以上、1020mm以上、1220mm以上、2220mm以上、およびさらに5220mm以上の等価直径(選択された断面と同じ領域の円の直径)を有する部品である。一実施形態において大型の要素は大型の断面を有する要素である。 いくつかの応用において、高い係数は異なる実施形態において132GPa以上、112GPa以上、162GPa以上、182GPa以上、232GPa以上およびさらに332GPa以上の弾性係数をさし、粉末の弾性係数は、そのような粉末が粉末の融解温度の0.80倍である温度で200MPaの圧力で4時間アルゴン(Ar)雰囲気内で熱間等方加圧(HIP)にさらされて本体を得る方法によって得られ、弾性係数は室温(23℃)で米国材料試験協会E8/E8M-16aに従い本体の中で計測される。一代替実施形態において本体は完全密度まで粉末を焼結することで得られる。一代替実施形態において、上で開示された弾性係数の値は米国材料試験協会E21‐09に従い高温(300℃)で本体中で計測された値である。一代替実施形態において、高い係数は0.2%永久変形耐力をさす。高い降伏力は異なる実施形態において320MPa以上、620MPa以上、830MPa以上、1020MPa以上、1420MPa以上、1620MPa以上、1820MPa以上、およびさらに2020MPa以上をさし、粉末の降伏力はそのような粉末が粉末の融解温度の0.80倍である温度で200MPaの圧力で4時間アルゴン(Ar)雰囲気内で熱間等方加圧(HIP)にさらされて本体を得る方法によって得られ、降伏力は室温(23℃)で米国材料試験協会E8/E8M-16aに従い本体の中で計測される。一代替実施形態において本体は完全密度まで粉末を焼結することで得られる。一代替実施形態において、上で開示された降伏力の値は米国材料試験協会E21‐09に従い高温(300℃)で本体中で計測された降伏力の値である。一実施形態において、降伏力は機械的強度(UTS)に置き換えられるべきであり、というのも高い機械的強度(UTS)を有する材料について述べられた方法で特定の形状を得られる可能性は驚くほどだからである。異なる実施形態において、高い機械的強度(UTS)は320MPa以上、520MPa以上、820MPa以上、1220MPa以上、1620MPa以上、1820MPa以上、およびさらに2120MPa以上をさし、粉末の機械的強度(UTS)はそのような粉末が粉末の融解温度の0.80倍である温度で200MPaの圧力で4時間アルゴン(Ar)雰囲気内で熱間等方加圧(HIP)にさらされて本体を得る方法によって得られ、機械的強度(UTS)は室温(23℃)で米国材料試験協会E8/E8M-16aに従い本体の中で計測される。一代替実施形態において本体は完全密度まで粉末を焼結することで得られる。一代替実施形態において、上で開示された機械的強度(UTS)の値は米国材料試験協会E21‐09に従い高温(300℃)で本体中で計測された機械的強度の値である。検査条件は本文書の最後の部分で見ることができる。 一実施形態において、型は圧力(適用された力)の下で過度に変形しない材料を備える。異なる実施形態においてこの圧力は11MPa、16MPa、21MPa、26MPa、31MPa、およびさらに41MPaである。これらの圧力の値に対して塑性変形は低くあるべきである。異なる実施形態において、米国材料試験協会D395‐16e1の検査条件に従い49%よりも低く、29%よりも低く、19%よりも低く、14%よりも低く、9%よりも低く、4%よりも低く、2%よりも低く、およびさらに0.9%よりも低い。型について前述したことは、いくつかの実施形態において型の部分、モデル、またはモデルの部分または容器へ応用可能である。 いくつかの応用において、型は圧力の下で過度に変形しない材料を備え、異なる実施形態において材料は、米国材料試験協会D395‐16e1(方法A、タイプ1見本において)に従い室温(23℃)で計測された49%よりも低い、29%よりも低い、19%よりも低い、一実施形態において14%よりも低い、9%よりも低い、4%よりも低い、2%よりも低い、およびさらに0.9%よりも低い圧縮設定A値(compression set A value)(CA)を有する。型について前述したことは、いくつかの実施形態において型の部分、モデル、またはモデルの部分または容器へ応用可能である。 いくつかの応用に対して、きわめて重要なのは型そのものの剛性であり、特にこの型全体の可変性である。力がかかることに応じて材料が変形しにくいことの度合いのことである。このことなどは、型のさまざまな厚さを有する構造を通じて達成可能である。一実施形態において、粉末と接触する形成型の十分な高さの部分は、剛性の変動の狭い範囲内で保たれる。異なる実施形態において、型の十分な高さの部分は、型の体積の30%以上、62%以上、82%以上、およびさらに96%以上を意味する。異なる実施形態において、剛性の変動の狭い範囲は、199%未満、149%未満、99%未満、49%未満、およびさらに9%未満を意味する。型について前述したことは、いくつかの実施形態において型の部分、モデル、またはモデルの部分または容器へ応用可能である。一実施形態において、剛性とは硬さであり、室温(23℃)で型の中で計測される弾性係数の変動を通じて評価される。検査条件は本文書の最後の部分で詳述する。 発明者は、異なる実施形態において型の剛性の変動性を考慮する場合、十分な高さの部分は粉末と接触する型の少なくとも30%、少なくとも40%、少なくとも51%、少なくとも63%、少なくとも72%、少なくとも86%、少なくとも93%をさし、およびさらに型全体をさす。型について前述したことは、いくつかの実施形態において型の部分、モデル、またはモデルの部分または容器へ応用可能である。 型の剛性は有限要素解析によって、材料のタイプ、かけられた荷重および解析されたモデルの抑制によって査定される。一実施形態において、査定により等価ひずみ単位(equivalent strain units)(ESTRN)をパーセントで得ることが可能になる。異なる実施形態において、最高の等価ひずみ単位(equivalent strain units)(ESTRN)(%)および最低の等価ひずみ単位の間の差は201%未満、121%未満、91%未満、52%未満、34%未満、およびさらに24%未満である。 本文書の全体に影響をあたえる一般的なコメントであるが、冷間等方圧加圧(CIP)、温間等方圧加圧(WIP)または類似のプロセスを経て作られる全ての型または容器は空にすることが可能である。方法は記載され、本文書の以下のものは、型が微粒子材料または粉末で少なくとも部分的に充填される積層造形プロセスを有する型または型の部分または容器の製造を備え、いくつかの応用に対して冷間等方圧加圧(CIP)または温間等方圧加圧(WIP)サイクルの前に型において真空が実行されることが有利であることが発見されており、真空の適用は多孔性の減少と関係しない。むしろ、発明者は驚くべきことに、いくつかの応用において、特に複雑な形状を有する要素において、真空が適用される場合、製造された要素の内部亀裂は劇的に減少することを発見した。さらに驚くべきことに、発明者は内部亀裂減少の効果は大型の形状よりも小型の形状に多く、厚い壁よりも薄い壁に多いことを発見した。異なる実施形態において、真空レベルは400mbar以下、40mbar以下、4mbar以下、0.4mbar以下、0.04mbar以下およびさらに0.0009mbar以下であるべきである。発明者は、いくつかの実施形態において空にすることは不十分であり、適切な真の真空がおこなわれるべきであることを発見した。一実施形態において、エラストマー材料コーティング、袋、または高分子包装は十分に高い真空維持能力を有するはずである。異なる実施形態において、コーティングを通しての真空損失は90mbar/min以下、9mbar/min以下、4mbar/min以下、0.9mbar/min以下、およびさらに0.009mbar/min以下であるべきである。一実施形態において、いくつかの真空サイクルは冷間等方圧加圧(CIP)/温間等方圧加圧(WIP)の最大圧力よりも低い圧力での型の加圧の後に行われるべきである。異なる実施形態において、少なくとも2真空サイクル、少なくとも4真空サイクル、およびさらに少なくとも6真空サイクルが中間に加圧サイクルとともに行われるべきである。異なる実施形態において、中間の加圧サイクルは2.2barsを超える、11barsを超える、110barsを超える、およびさらに600barsを超える圧力を備えるべきである。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。 本発明のいくつかの実施形態に対して、発明者は、内部亀裂が不注意に表れることがあり、安定した要素が得られるまでの修理または再設計の必要によりプロセスにかなりコストが集中することを発見した。発明者は、問題が、表面に近い内部特徴を有する厚い要素もまた含めて、厚い要素よりも薄い要素に倍加し、要素が厚くても薄い要素と同様に問題のある部分に作用することに気がついた。よって、問題は明らかに充填後の残りの細孔と関連せず、なぜならもしそうであったなら効果は大型の要素により多く表れるであろうゆえに、本来は内部細孔と関連する何かを行う動機付けは存在しなかったからである。冷間等方圧加圧(CIP)設備の機能停止により充填の後に要素へ真空が実施され、プレスされずに充填された10の型の粉末をより良好に保全しようと試みる。全ての10の型のうち、予想通り9つは前の全ての結果(内部亀裂の問題もふくめて)に対し全ての点において何ら改善は見られなかったが、1つは内部亀裂に関して改善を示したと見られる。綿密な検査の後で、このような改善の考え得る20の原因が長い時間をかけた適正試験で研究された。結論は、いくつかの変形、時として単独の変形だが特に組み合わせでの変形が内部亀裂の問題の減少を助けることができ、このことは粉末間の多孔性よりもむしろ型(特に積層造形によって製造されている場合)および粉末の特質に関連するということである。特定された変形は、気密真空、冷間等方圧加圧(CIP)の間の加圧、熱間等方加圧(HIP)の間の温度および粉末の特質に適合された型の剛性の変形である。単独の変形のいずれも内部亀裂への強力な効果をあげないと見られたが、二つ以上の組み合わせは効果をあげたと見られる。用いられる粉末が硬いほど高い真空レベルであるはずである。一実施形態において、粉末の硬度が160Hv10を超える場合、冷間等方圧加圧(CIP)を実行する時点での真空レベル(型を空にする時点での真空レベルではない)はミリバールでなくてはならず、100/Hv10でありHv10はビッカース10gの硬度である。いくつかの応用に対して、非常にきめ細かな特徴を有すれば、真空はさらに高くあるべきである。一実施形態において、冷間等方圧加圧(CIP)の時点でのミリバールでの真空レベルは50/Hv10であるべきである。一実施形態において、冷間等方圧加圧(CIP)の時点でのミリバールでの真空レベルは10/Hv10であるべきである。一実施形態において、冷間等方圧加圧(CIP)の時点でのミリバールでの真空レベルは1/Hv10であるべきである。厚い要素に対しては、他の態様が観測されるならば、真空レベルはあまり高くある必要はない。一実施形態において、冷間等方圧加圧(CIP)の時点でのミリバールでの真空レベルは1000/Hv10であるべきである。いくつかの応用において、発明者は、有益に機能するために高い真空レベルの使用は、型の剛性および同様に十分に高い冷間等方圧加圧(CIP)圧力における小さい変形へ結合されるべきであることを発見した。ビッカース10gの硬度(Hv10)は室温(23℃)でE384‐11に従って計測される。 いくつかの応用に対して、発明者は複雑な形状に対して、高い圧力が用いられると積層によって亀裂が形成される傾向があることを発見した。そのような応用において、型を充填するために細分化された状態から使用される粉末の降伏力を減らすことに役立つことが発見されている。一実施形態において、粉末の降伏力は細分化された状態での粉末の降伏力に関して型への充填の前に55MPa以上減少する。異なる実施形態において、降伏力は105MPa、155MPa、およびさらに255MPa減少する。一実施形態において、細分化された状態および降伏力を減らすために処理へさらされた後の粉末の降伏力は、そのような粉末が本体を得るために完全密度まで焼結される方法によって計測され、得られた本体の降伏力は米国材料試験協会E8/E8M‐16aに従い室温(23℃)で計測される。一実施形態において降伏力は米国材料試験協会E21‐09に従い高温(300℃)で本体中で計測される。一実施形態において、本体はそのような粉末が200MPaの圧力で4時間アルゴン(Ar)雰囲気において粉末の融解温度の0.80倍である温度で熱間等方加圧(HIP)にさらされる方法によって得られる。いくつかの応用において、積層の亀裂効果を減らすことができるのは粉末表面の炭素含有量の減少である。一実施形態において、制御された脱炭処理が粉末へ適用される。一実施形態において炭素含有量は粉末表面において10%減らされる。いくつかの応用において、粉末の他の表面化学修飾は有利である。一実施形態において、粉末は表面的に窒化される。一実施形態において、粉末は表面的にホウ素化(borurized)される。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。検査条件は本文書の最後の部分で詳述する。 発明者は、不可能と見なされない硬度を有する粉末を使用して良好な機械的特性を有する要素を製造することが可能であることを発見した。異なる実施形態において、微粒子材料は、160Hv10を超える、205Hv10を超える、255Hv10を超える、310Hv10を超える、およびさらに410Hv10を超える室温(23℃)で計測されたビッカース10gの硬度(Hv10)での硬度を有する。このことは内部に複雑な形状を有する要素に対し特に驚くべきことである。ビッカース10gの硬度(Hv10)は室温(23℃)でE384‐11に従って計測される。 全ての文献では、大型の断面要素に対してそのような要素の製造中に4000barsを超える圧力を使用することは推薦されないことを示しているように見受けられる。発明者はそのような大きい断面への高い圧力の使用に対していかなる参照も見出すことはできず、それは、そのような高い圧力へさらされた場合にそのような大きな断面が内部亀裂を被ると考えられているからなどの理由であるが、発明者はこのように手順を進めれば、それらの高い圧力は冷間等方圧加圧(CIP)の間上回ることがあることを発見し、驚くべきことに要素を得るたけでなく疲労特性もまた増進される。異なる実施形態において、大型の断面要素に対して4020barsを超える、5020barsを超える、6020barsを超える、6520barsを超える、7020barsを超える、8020barsを超える、10020を超えるbars、およびさらに12020barsを超える圧力が使用される。 いくつかの応用に対し、特に脆弱な特徴を有する大型の要素に対し、外部特徴の制約の下で脱バインダステップを行うことは便利である。一実施形態において、脱バインダプロセスで部品は液体化したベッドに配置される。一実施形態において、部品は耐熱粒子集団で覆われる。一実施形態において、製造された部品は箱の中に配置され、箱は前述の粒子で充填される。一実施形態において、粒子は非有機的なものである。一実施形態において、粒子は砂、白墨、しっくい、または類似のものである。いくつかの応用において、このステップは非常に悪影響を及ぼすものであり回避されるべきである。 いくつかの応用に対して、特に製造された要素から熱を取り除く必要のある製造の応用に対して(例えばダイカストおよびプラスチック射出の場合のように)、本文書で開示された方法により、生産性を深刻に妥協せず複雑な形状の充填を積極的に助ける工具を製造することができる。 水が高速で加速されうるシステムの使用によるものである。水は充填の間は静止または層流のままであり、その後乱流または少なくとも高速で熱を取り除くのに十分な乱流へと非常に速く切り替えられる。遷移の瞬間はダイスまたは要素の異なる領域において調節され、充填および凝固の経路が制御される。一実施形態において、要素、工具またはダイスは、表面に近接する十分に高い熱伝導率の材料を有する少なくとも部分および十分に高い密度の冷却路を有する作業面の少なくとも一つの領域、および冷却路内で作業サイクル時間における特定の瞬間での十分に異なるレイノルズ数を有する少なくとも二つのそのような領域で製造される。一実施形態において、要素、工具またはダイスは、表面に近接する十分に高い熱伝導率の材料を有する少なくとも部分および十分に高い密度の冷却路を有する作業面の少なくとも一つの領域、および冷却路内で作業サイクル時間における二つの特殊な瞬間での十分に異なるレイノルズ数を有するこの領域で製造される。一実施形態において、工具はプラスチック形成工具またはダイスである。一実施形態において、工具はプラスチック射出工具またはダイスである。一実施形態において、工具はダイカスト金型である。異なる実施形態において、表面に近接する十分高い密度を有する冷却路の部分は作業面領域の少なくとも0.001%、少なくとも0.1%、少なくとも2%、少なくとも11%、少なくとも51%、およびさらに作業面の少なくとも91%に相当する。異なる実施形態において、表面に近接するとは14mm以下、8mm以下、6mm以下、4mm以下、2mm以下、およびさらに1mm以下を意味する。異なる実施形態において、十分高い密度の冷却路は、冷媒経路となる冷却路を有する作業面下の領域の少なくとも3%、少なくとも6%、少なくとも11%、少なくとも21%、少なくとも51%、少なくとも61%、およびさらに少なくとも81%を意味する。異なる実施形態において、十分に高い熱伝導率は、米国材料試験協会E1461‐13に従って室温(23℃)で計測された12W/mK以上、24W/mK以上、36W/mK以上、42W/mK以上、46W/mK以上、およびさらに52W/mK以上を意味する。異なる実施形態において、レイノルズ数の十分な差異は少なくとも600、少なくとも1200、少なくとも2400、少なくとも5500、少なくとも11000、少なくとも26000、およびさらに少なくとも60000を意味する。非円形冷却路についても説明するため、水力直径を使用してレイノルズ数(ReD)を算出する。いくつかの実施形態において、関連性があるのはレイノルズ数の差異よりもむしろレイノルズ数の最大(十分に高くあるべき)および最小(十分に低くあるべき)である。異なる実施形態において、レイノルズ数の最大は1100を超える、2200を超える、6000、11000を超える、32000を超える、110000を超えるべきである。異なる実施形態において、レイノルズ数の最小は9000未満、1900未満、900未満、400未満、およびさらに90未満であるべきである。一実施形態において、レイノルズ数はヌッセルト数に取って代わられるべきであり、ヌッセルト数はレイノルズ数を12で割って提供された値から算出される。 ダイカスト応用に対する非常に有益な観察が行われている。ダイカスト金型の良好な耐久性のために、平衡温度は150℃より高い、好ましくは200℃より高くある必要があり、このような温度もまた解除剤の適切な応用に必要とされるものであるということが知られているが、発明者は、本文書で開示された方法は、特別な注意をはらい、本応用で「冷却ダイカスト」と命名されようプロセスから派生するダイカスト応用に対し驚くほどうまく応用することができることを発見した。方法が適切に機能するために、従来のダイカスト方法とは全く正反対で、特別な注意をはらって残りのダイスの表面が十分冷たいことを確保すべきである。プロセス全体を通じてダイス表面の最大温度が十分に低いままであるよう、特別な注意がはらわれるべきである。残念ながら、ダイス表面の最大温度は通常ではダイス内の溶融の加圧中および溶融物冷却の第一ステージにて生じるため、直接に計測することは難しい。幸いにも発明者は、適切な補正が考慮されるならば、ダイス表面から1mmにおける温度を制御することで十分であることを発見し、選択的に熱流束密度の時間発展が分かり反転法を適用して得られるダイス表面推定値もまた十分正確である。要素の形状、鋳造合金、超加熱合金(alloy super‐heating)、鋳造合金の熱伝導率、比熱、および凝固の潜熱その他に応じて、全ての鋳造プロセスを通してダイス表面温度を十分に低く維持する難易度は異なる。第一の手法として、ダイスまたは工具材料、冷却戦略、鋳造プロセスパラメータおよびダイス表面の状態の正しい組み合わせは、本文書の開示をうまく実行するために適切に組み合わされるべきである。実行の成功は製造または鋳造要素のコストに関して計測され、従って例示のため、工具が十分冷たく機能し、およびさらに製造された部分の品質やサイクル時間に関して本態様の利点を有し、生産性およびプロセス安定性があってもダイス耐久性に欠ける場合は成功した実行とは見なされない。 いくつかの応用に対して、発明者は重層設計された材料を有することが便利であることを発見した。そのような応用に対して、方法へ追加のステップを加えることは有益であり、つまり、 追加のステップ:表面コーティングを適用する。 一実施形態において、コーティングは異なる材料を有する層を備える。一実施形態において、コーティングは化学蒸着(CVD)コーティングである。一実施形態においてコーティングは、ある時点で710℃を超える、基板表面の少なくともいくつかの領域にて化学修飾を被る基板温度にて適用される。一実施形態において、コーティングは物理的蒸着(PVD)コーティングである。発明者は、いくつかの応用に対してダイスへのアルミニウムの固定具を最小化することは重要であり、そのために物理的蒸着(PVD)コーティングの非常に特定のタイプはかなり良好な結果をもたらすことを発見した。一実施形態において、高出力インパルスマグネトロンスパッタリング(HIPIMS)が好ましい。一実施形態において、高エネルギーアークプラズマ加速堆積(High energy Arc Plasma Acceleration deposition)が好ましい。一実施形態において、コーティング適用中の基板の温度が680℃を決して超えないのは、低い温度の化学蒸着(CVD)コーティングである。一実施形態において、コーティングは基板が化学修飾を被ることのない堆積コーティングであり、一実施形態においては溶射コーティングであり、一実施形態においてはコールドスプレーコーティングであり、一実施形態においてはゾルゲルコーティングであり、一実施形態においてはダイス表面の少なくとも部分上へ吹き付けられる懸濁液である。 冷却ダイカストの場合において、いくつかの応用に対してダイス/工具/型の最大温度制御を助けることができるゆえにコーティングは関心外であり、いくつかの応用に対して従来の吹き付けステップを有さないがための効果の軽減を助けることができる。いくつかの応用において、離型剤または潤滑剤が完全に除去されるため「乾燥した」冷却ダイカストプロセスを有することが最大の驚きをもって発見されている。発明者は、この目的のために、アルミニウム、ジルコニウム、ランタン、カルシウム、および他の白色酸化物などのいくつかの酸化物コーティングが良好に機能することを発見した。また、例えばチタンなどの暗色酸化物もいくつかの応用に対して良好に機能する。いくつかの非酸化物コーティングが優れて機能することが見られているのは非常に驚くべきことである。窒化物およびさらにホウ化物コーティングは、ダイカスト応用におけるはんだ付けの問題を減少するために中度に良好に機能するために知られており、それはこれらの存在は正常で有益である一方で離型剤または潤滑剤を完全に除去することが可能ではないことが知られていることを意味する。純粋な油に基づく潤滑システムまたは微小吹き付けシステムへと移行することはさらに困難なことである。従って、発明者は特殊な酸化物に基づくコーティングに対しわずかな希望を持っており、本文書で開示された方法に対していくつかの特殊な酸化物のコーティングが驚くべきことに極めて良好に機能することを発見した。AlTiNまたはAlCrNなど、ダイカストに通常用いられる従来のコーティングが常に十分機能するわけではないことから考えて、発明者は他のコーティングにわずかな希望を持っていたが、驚くべきことに一つのタイプのコーティングは、試した全ての例においてかなり良好に機能し、コーティングはバリウムまたはチタン酸ストロンチウムなどのチタン酸塩に基づくものである。一実施形態において、ダイカスト金型の作業面の少なくとも部分はチタン酸バリウムで覆われているべきである。一実施形態において、ダイカスト金型の作業面の少なくとも部分はチタン酸ストロンチウムで覆われているべきである。一実施形態において、ダイカスト金型の作業面の少なくとも部分はチタン酸バリウム‐ストロンチウム(化学量論上のBaおよびストロンチウムの混合または準化学量論上のチタン酸塩)で覆われているべきである。よって、発明者は酸化物に基づくコーティングに対しわずかな希望を持っており、本文書で開示された方法に対していくつかの酸化物のコーティングが驚くべきことに極めて良好に機能することを発見した。そのようなコーティングの一つは、例えばバリウムまたはチタン酸ストロンチウムなどのチタン酸塩に基づくコーティングである。任意の形態学上で類似するコーティングもまた良好に機能するはずである。任意の機能上で類似するコーティング材料は良好に機能するはずである。一実施形態において、機能上で類似する材料は、コーティングの以下の特性つまり、弾性係数、破壊靱性、工具材料が150℃に保たれ鋳造合金がその融解温度の50℃を超える温度で保たれる選択された工具材料へ適用されたコーティング上の鋳造合金の湿潤性角度および電気抵抗率のうちの少なくとも二つの特性である材料であり、異なる実施形態においてチタン酸バリウムに対し得られた値の+/‐45%の範囲内、+/‐28%の範囲内、+/‐18%の範囲内、+/‐8%の範囲内、およびさらに+/‐4%の範囲内に保たれている。一実施形態において、少なくとも三つの特性である。一実施形態において、四つ全ての特性である。一実施形態において、特性はチタン酸バリウムではなくチタン酸ストロンチウムへの類似が保たれる。 一つの態様において発明者は、本文書で開示された方法は、冷却ダイカストプロセスと名付けられたこの物へ適用されることができ、ダイカスト方法は以下のステップを備える。 本文書で開示された方法の一つを使用して、表面の十分近くに十分に高い熱伝導率および高い機械的強度(UTS)を用いて、冷却路の十分に高い密度の冷却路のよく分布したネットワークを表面のごく近くに有するダイスまたは中間ダイスまたは部分ダイスを製造する。 プロセスのパラメータを選択して、ダイス表面下1mmである任意の点での温度が鋳造プロセスのいかなる時も440℃の温度を超えないことを確実にする。 一実施形態において上で開示された方法は型を製造するために使用される。いくつかの実施形態において、上で開示された方法を使用して製造された型はプラスチック射出型である。 表面に十分近い冷却路の十分高い密度および十分に高い熱伝導率に対する値は前に開示した通りである。本文書において他の指示がない限り、高い機械的強度(UTS)は、異なる実施形態において室温(23℃)で米国材料試験協会E8/E8M‐16aに従って計測される320MPa以上、520MPa以上、820MPa以上、1220MPa以上、1620MPa以上、1820MPa以上およびさらに2120MPa以上をさす。一実施形態において、上で開示された高い機械的強度(UTS)に対する値は、米国材料試験協会E21‐09に従い計測された高温(300℃)での機械的強度(UTS)をさす。 異なる実施形態において、ダイス表面下1mmである任意の点での温度は鋳造プロセスのいかなる瞬間も380℃、340℃、280℃、240℃、およびさらに180℃の温度を超えない。一実施形態において、考慮されるべきはダイス表面で計算された温度である。異なる実施形態において、ダイス表面下1mmである任意の点での温度は、ダイス空洞へ液体金属が入り始める瞬間に180℃、140℃、118℃、98℃、78℃、58℃、およびさらに48℃の温度を超えない。 いくつかの応用に対して、発明者は、冷却鋳造方法(およびその任意の変形、乾燥冷却鋳造方法など)が原則としては同じ目標を対象とするがゆえに有益な効果を追加することが期待されてはいないがいくつかの場合においてやや追加的に有効な効果を驚くべきことに生じる他の方法と組み合わされる場合、製造された要素の品質は内部の欠点に関して悪名高く増大することがある。一実施形態において、本文書で開示された方法は、空洞充填の間および/または凝固ステージの間に真空の適用を伴う鋳造システムに応用される。いくつかの場合において、プロセスウィンドウがやや狭いゆえに実行することがかなり困難ないくつかの技術が、本文書で開示された方法を使用する場合に驚くべきことにさらに応用可能となる(この場合、望ましく達成されるためにはそのような方法が充填に対しかなり厳格なダイス表面制御を必要とし、低い表面温度は望ましくないという考えから、小さな驚きが起こる)。一実施形態において、本文書で開示された方法は、ダイス空洞へ入る瞬間に半固体の状態である合金へ適用される。一実施形態において、鋳込材料は不均一な凝固を促進するために外因性粒子の分布を有する。一実施形態において、外因性粒子は気泡である。一実施形態において、US6645323B2(本文書において言及することにより組み込まれており、同様にUS20010037868における方法もまた言及することにより組み込まれている)に記載されている方法は、本文書で開示された方法へ連動して応用される。一実施形態において、US6645323B2に記載されている方法は、充填および/または凝固中の真空排気および本態様の方法の一つとともに応用される。 本文書で開示された方法は、特に冷却戦略が非常に複雑な形状のものである場合の冷却の内燃機関モーターの製造に示されている。本文書で開示された方法は、特に冷却戦略が非常に複雑な形状のものである場合の冷却の電動機の製造に示されている。本文書で開示された方法は、特にブレーキパッド(breaking pads)の製造に示されている。本文書で開示された方法は、特にピストンヘッドの製造に示されている。本文書で開示された方法が、非常に大型のモーターおよびアクチュエータの要素の製造にふさわしいことは、非常な驚きである。より適合された形状および重量の減少により向上した性能を有して機械的特性および耐久性を保ちながらも、本文書で開示された方法を使用して空洞が製造されうるさらに軽いクランク軸について特別に言及する必要がある。この点において、管状の形状はクランク軸に対して使用されてよく、およびさらにウェブおよびつり合おもりの部分は空洞が作られてもよい。ピンおよびソケットもまた管状に作られてもよい。いくつかの応用に対して、管状および空洞部分が個別の内部強化物を有することは有益である。同様に、エンジンブロックにも言及する。同様に、発電機のローターおよび電動機およびさらに固定子にも言及する。 少数の応用に対して、発明者は、型材料の弾性回復がいくらかの複雑な形状の完璧な構造を損ない、このような場合に型を充填し目的の部品を得るため使用される粉末材料の係数に近い係数の型材料を使用することは有益であることを発見した。一実施形態において、型材料の係数は粉末材料の係数の値の1/3未満であってはならない。一実施形態において、型材料の係数は粉末材料の係数の値の1/2未満であってはならない。一実施形態において、型材料の係数は粉末材料の係数の値より39%未満低くあってはならない。一実施形態において、型材料の係数は粉末材料の係数の値より19%未満低くあってはならず、係数は弾性係数をさし、型材料に対し室温(23℃)で計測され、そのような粉末が完全密度まで焼結される方法によって粉末内で計測され、得られた本体の弾性係数は米国材料試験協会E8/E8M‐16aに従い室温(23℃)で計測される。一代替実施形態において、弾性係数は上で開示された方法を使用して得られた本体中で米国材料試験協会E21‐09に従い高温(300℃)で計測される。一実施形態において、粉末の弾性係数は、本体を得るためにそのような粉末が200MPaの圧力で4時間アルゴン(Ar)雰囲気において粉末の融解温度の0.80倍である温度で熱間等方加圧(HIP)にさらされる方法によって計測され、得られた本体の弾性係数は室温(23℃)で米国材料試験協会E8/E8M-16aに従い計測される。一代替実施形態において、弾性係数は上で開示された方法を使用して得られた本体中で米国材料試験協会E21‐09に従い高温(300℃)で計測される。検査条件は本文書の最後の部分で詳述する。 一実施形態において、型または型部分は可溶性塩を使用し高い融点および係数で印刷される。一実施形態において、塩は可溶性セラミックに取って代わられる。一実施形態において、塩はフッ化物である。一実施形態において、塩は塩化物である。一実施形態において、塩は臭化物である。一実施形態において、塩は希土類を備える。一実施形態において、塩は少なくとも二つの希土類元素を備える。一実施形態において、塩は希土類臭化物である。一実施形態において、塩はセリウムを添加した臭化ランタンである。異なる実施形態において、塩(または後にセラミック)の高い融点は、420℃以上、620℃以上、820℃以上、920℃以上、1020℃以上、およびさらに1120℃以上である。一実施形態において、型が可溶性塩(後に可溶性セラミック)で印刷される場合、冷間等方圧加圧(CIP)/温間等方圧加圧(WIP)ステップは省かれ、粉末の圧密は高温圧密方法(緻密化)を使用し直に行われる。一実施形態において、高温圧密方法は高い温度および圧力を適用する熱間等方加圧(HIP)または関連した方法である。いくつかの実施形態において、型について前述したことは型の部分または容器へ応用可能である。検査条件は本文書の最後の部分で見ることができる。 型において十分に高い係数を有する別のやり方は、砂または他の硬い粒子(セラミック、さらに金属間化合物または金属)を用い局所的に配置された結合剤で作ることである。積層造形プロセスでは、結合剤の作用を通じて望ましい形を形成する硬い粒子を用いて型または型の部分を得ることができる。この場合(型は粉末に対し類似する弾性係数を有する、または差異が大きい場合型は高い弾性係数を有する)、型は目的の部品の製造のための目的の材料の粉末で充填される。そして本文書で開示された方法が応用され、型のみを除去するために結合材が化学的にまたは熱的に崩れる必要があり、それから砂または他の硬い粒子は緩みを生じ容易に除去できるようになる。いくつかの実施形態において、型について前述したことは型の部分または容器へ応用可能である。 いくつかの応用に対して、型に対して極めて高温でエラストマー材料を使用することはさらに意味があることである。もつれたナノチューブに基づく材料を用いて高温でこの方法において要求される粘弾性のような動作を有することが可能である。異なる実施形態において、もつれたナノチューブの粘弾性材料で420℃を超える、820℃を超える、920℃を超える、1020℃を超える、およびさらに1120℃を超える劣化温度で型が作られる。劣化温度を評価するとき、そのような値が最高にある環境が選択される。一実施形態において、型が高い劣化温度の粘弾性材料で印刷される場合、冷間等方圧加圧(CIP)/温間等方圧加圧(WIP)ステップは省かれ、粉末の圧密は高温圧密方法(緻密化)を使用し直に行われる。一実施形態において、高温圧密方法は高い温度および圧力を適用する熱間等方加圧(HIP)または関連した方法である。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。検査条件は本文書の最後の部分で開示する。代替実施形態において、劣化温度は選択的に重量で10%、20%、25%、45%、65%、およびさらに65%を超える質量損失に相当する米国材料試験協会E1131‐08の検査条件に従って得られた温度をさすことがある。 本文書で開示された全ての方法および態様において、いくつかの応用に対して有機的な結合剤またはさらに非有機的な結合剤を使用して、方法の中間ステップにおいてまたはさらにいくつかの応用に対しては最終生産物において一時的に力を増加させることは便利であることがある。一実施形態において、本文書で開示された方法は、有機的な結合剤が充填の粉末と混合されて優れた生強度を提供する箇所で使用され、この結合剤は後に脱バインダプロセス内でまたはこの目的のために特に設計されたプロセスで除去される。一実施形態において、型が粉末で充填され、粉末が有機的な結合剤と混合され、結合剤が決して除去されないステップを有する本文書で開示された方法。一実施形態において、型が粉末で充填され、粉末が非有機的な結合剤と混合されるステップを有する本文書で開示された方法。一実施形態において、型が粉末で充填され、粉末が有機的な結合剤と混合され、結合剤がさらなるステップにおいて除去されるステップを有する本文書で開示された方法。一実施形態において、型が粉末で充填され、粉末が有機的な結合剤と混合され、結合剤が後のステップで熱的作用によって除去されるステップを有する本文書で開示された方法。一実施形態において、型が粉末で充填され、粉末が有機的な結合剤と混合され、結合剤が後のステップで化学的作用によって除去されるステップを有する本文書で開示された方法。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。 全ての方法において、型が温間等方圧加圧(WIP)または同等のプロセス中に柔らかくなるように、十分に低いガラス転移点(Tg)を有する型の製造における材料の使用により興味深い実現が行われうる。方法は、温間等方圧加圧(WIP)または同等のプロセスにおいて到達する最大温度よりも低い温度である型の製造のための材料のガラス転移点(Tg)を特定する。一つの組の実施形態において、型を製造することならびに本文書における他の箇所で表現された用語においてこの型が完全に除去されるまたはさらに残る、および十分に高い圧力(本文書において関連する実施形態に対して示される最小MPa値に関して)と型の製造で用いられる主な材料のガラス転移点(Tg)を超える温度をもたらす製造ステップを含むことに用いられる材料のガラス転移点(Tg)を示すことはより便利である。異なる実施形態において、ガラス転移点(Tg)は330℃未満、270℃未満、218℃未満、168℃未満、118℃未満、およびさらに78℃未満であるべきである。一実施形態において型は、まず加圧され次に温度は徐々に上げられる。一実施形態において型は、熱い流体によって加圧される。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。いくつかの実施形態において、型の製造に使用される材料に対しガラス転移点(Tg)最小値が好ましい。異なる実施形態において15℃を超える、45℃を超える、84℃を超える、117℃を超える、178℃を超える、231℃を超える、およびさらに303℃を超える。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。検査条件は本文書の最後の部分で開示する。 主な材料または要素は、異なる実施形態において体積で少なくとも6%以上、11%以上、16%以上、22%以上、26%以上、およびさらに36%以上である材料または要素をさす。一代替実施形態において上で開示された割合は体積による。 積層造形ステップはモデルまたは型または容器の製造で構成されてよい。一実施形態において、モデルは積層造形プロセスを使用して製造され、モデルはその後に通常は非常に柔らかい材料(ゴム[ラテックス、シリコーン、天然ゴムなどを含む]、プラスチゾル、ネオプレン、任意の他のエラストマーなど)を用いて型を製造するために使用され、この場合に積層造形をもたらす方法の第一のステップが少なくともモデルの部分を製造するために用いられ、次に方法は第一のステップと第二のステップとの間に追加のステップを備える。結果として得られた方法は以下のステップを備える。 モデルを製造するために積層造形プロセスを使用する。 このモデルを他の部分へ取り付ける(ことも含まれることがある)。 前のステップのモデルを使用して非常に柔らかい材料で型を製造し、少なくとも型の部分へ成形を提供する。 少なくとも一つの金属相を備える微粒子材料で、型の少なくとも部分を充填する。 冷間等方圧加圧(CIP)ステップを使用する。 型を除去する。 および焼結、熱間等方加圧(HIP)、または任意の他の十分に高い温度を伴うものでありうる緻密化ステップ。 この方法では以下のステップも任意である。 ‐要素の金属部分の熱処理(部分的にまたは完全に緻密化ステップと組み合わせられてもよい)。 ‐要素の最終機械加工。 いくつかの実施形態において、積層造形によって製造されるモデルは、後に微粒子材料で充填される少なくとも型の部分へ成形を提供するために使用されるモデルを得るために他の部分へ取り付けられてもよいモデルの一部であり、一実施形態において、積層造形によって製造されるモデルは、後に微粒子材料で充填される少なくとも型の部分へ成形を提供するために使用されるモデルを得るために他の部分へ取り付けられてもよい。 一実施形態において型はモデルを使用せず直に製造される。これらの場合において、いくつかの実施形態において型は少なくとも一つの金属相を備える微粒子材料で充填される型を得るために他の部分へ組み立てられてもよい型の部分であってもよい。 本文書の全体に影響をあたえる一般的なコメント。本文書においてゴムという用語は、文献で一貫してゴムとして分類されていない場合でもゴムと分類されうる任意の材料を包含する。一実施形態において、非常に柔らかい材料はゴムを備え、一実施形態において天然ゴムを備え、一実施形態においてラテックスを備え、一実施形態においてシリコーンタイプのゴムを備える。いくつかの実施形態において、非常に柔らかい材料はゴムである。いくつかの実施形態において、ゴムは熱硬化された(加硫処理された)ポリマーを形成するさまざまなモノマー単位からなるエラストマー化合物をさす。いくつかの実施形態において、ゴムはパラゴムノキ属の木の樹液から産出される天然ゴム状物質をさし、一実施形態においてゴムは「ゴムのような」エラストマー特性を有する任意の材料として記載される。 本態様の一実施形態において、型は上記のガラス転移点であるために非常に柔らかい材料をもたらす浸漬、鋳込、または任意の他の手段の応用で製造され、そのような場合に、発明者は高温耐熱ポリマーを使用して積層造形ステップのモデルを製造することが有益であることを発見した。いくつかの実施形態において、発明者は最も重要なのはガラス転移点であることを発見し、異なる実施形態において、モデルを製造するために使用される材料のガラス転移点(Tg)は、85℃より高い、122℃より高い、162℃より高い、202℃より高い、252℃より高い、292℃より高い、およびさらに362℃より高くあるべきである。いくつかの実施形態において、発明者は考慮されるべきは熱たわみ温度であることを発見した。異なる実施形態において、米国材料試験協会D648‐07に従い0.46MPa[66psi]の荷重で計測され125℃より高い、152℃より高い、182℃より高い、232℃より高い、262℃より高い、282℃より高い、およびさらに342℃より高くあるべきである。発明者は、45MPaまたは0.46MPaの荷重の使用は十分に類似する結果を提供するため、区別なく使用されてよいことを発見した。一代替実施形態において上で開示されたたわみ温度の値は0.45MPaの荷重でのISO75‐1:2013方法Bテストに従って計測される。いくつかの応用において、異なる実施形態におけるたわみ温度は、米国材料試験協会D648‐07に従い1.82MPaの荷重で計測される場合、83℃より高い、101℃より高い、121℃より高い、156℃より高い、176℃より高い、188℃より高い、およびさらに228℃より高い。代替実施形態において、42℃より高い、51℃より高い、61℃より高い、77℃より高い、87℃より高い、94℃より高い、およびさらに114℃より高いたわみ温度は、5.0MPaの荷重で米国材料試験協会D648‐07の検査条件、8.0MPaの荷重で米国材料試験協会D648‐07の検査条件、およびさらに1.8MPaの荷重でISO75‐1:2013方法Aテストのいずれかに従うことにより得られる。いくつかの実施形態において、モデルについて前述したことは型または型の部分、型または容器へ応用可能である。本文書の全体において、他の指示がない限り、いくつかの応用に対して異なる実施形態に対して示された異なる特性は組み合わせが可能であり、この場合例えばいくつかの応用は十分に高いガラス転移点および0.46MPa[66psi]の荷重で米国材料試験協会D648‐07に従って計測される十分に高い熱たわみ温度を有するポリマーで製造されたモデルを必要とすることがある。本文書の他の態様にて言及されている有機的な材料もまた、いくつかの実施形態に対する候補である。モデル構築のための可能なポリマーの少数の例に言及すると、ポリ(ヒドロキシブチル)メタクリル酸およびポリ(ヒドロキシエチル)メタクリル酸、ポリイミド、ポリベンゾイミダゾール芳香族派生物などがある。いくつかの実施形態において、モデルについて前述したことは型または型の部分、型または容器へ応用可能である。検査条件は本文書の最後の部分で開示する。 本態様の一実施形態において、型は、二つ以上の要素の混合の後に硬化プロセスを経る多重要素の非常に柔らかい材料をもたらす浸漬、鋳込、または任意の他の手段の応用で製造され、この実施形態においてほぼ任意の種類の材料がモデルの製造に使用されてよく、非常に弾力性のある材料の二つ以上の要素の任意が型の製造に使用されてよく(例えば二液型ネオプレン)、一実施形態において、先行の実施形態のように同じプロセスに従うが低い温度の(異なる実施形態において140℃未満、109℃未満、98℃未満、74℃未満、およびさらに40℃未満の流体)一つの要素の流体が溶液または乳濁液の状態で使用される。例として、ラテックス溶液を室温(23℃)においてすら使用することができ、これはブラシや類似の方法で異なる層を堆積することまたは吹き付けることまたは任意の他の手段によって応用されてもよい。いくつかの実施形態において、非常に柔らかい材料はラテックスを備える溶液である。いくつかの実施形態において、非常に柔らかい材料はラテックスを備える乳濁液である。一実施形態において、ラテックスは液体中のポリマー粒子のコロイド分散と定義される。一実施形態において、ラテックスは乳濁液、ミニエマルション、マイクロエマルション、または分散重合の産物と定義される。いくつかの応用に対して、発明者は適用された非常に柔らかい材料のいくつかの層を有することが非常に重要であることを発見した。異なる実施形態において、少なくとも2層、少なくとも4層、少なくとも6層、少なくとも8層、少なくとも12層、およびさらに少なくとも16層である。異なる実施形態において、層の厚さは1.3mm以下、0.8mm以下、0.4mm以下、およびさらに0.2mm以下である。一実施形態において、厚さは層の平均厚さをさす。 一実施形態において、型は非常に柔らかい材料を建材として使用しながら積層造形を用いて直接製造され、そして微粒子材料で充填した後に蓋の型で覆われる。方法は以下のステップを備える。 非常に柔らかい材料を備える材料を有する型を製造するために積層造形プロセスを使用する。 このモデルを他の部分へ取り付ける(ことも含まれることがある)。 少なくとも一つの金属相を備える微粒子材料で、型の少なくとも部分を充填する。 前のステップで得られた型を非常に柔らかい材料で製造された蓋の型で覆う。 冷間等方圧加圧(CIP)ステップを使用する。 型を除去する。 および焼結、熱間等方加圧(HIP)、または任意の他の十分に高い温度を伴うものでありうる緻密化ステップ。 この方法では以下のステップも任意である。 ‐要素の金属部分の熱処理(部分的にまたは完全に緻密化ステップと組み合わせられてもよい)。 ‐要素の最終機械加工。 いくつかの実施形態において、積層造形によって製造された型は微粒子材料で後に充填される型を得るために他の部分へ組み立てられてもよいモデルの部分である。 一実施形態において型はモデルを使用せず直に製造される。これらの場合において、いくつかの実施形態において型は少なくとも一つの金属相を備える微粒子材料で充填される型を得るために他の部分へ組み立てられてもよい型の部分であってもよい。 本態様において、十分に高い破壊時の伸長を有する材料は「非常に柔らかい材料」として理解される。異なる実施形態において、室温(23℃)で計測され55%より高い、76%より高い、92%より高い、110%より高い、160%より高い、210%より高い、360%より高い、およびさらに576%より高い。いくつかの応用に対する同じラインにおいて過度の伸長は好ましくないことがある。異なる実施形態において、室温(23℃)で計測され390%以下、290%以下、190%以下、140%以下、およびさらに98%以下である。検査条件は本文書の最後の部分で詳述する。いくつかの応用に対して、特に適切な寸法が望ましい場合、および同様に複雑な内部冷却または類似のネットワークが望ましい場合、発明者は最小硬度レベルを有する型がしばしば望ましいことを発見し、異なる実施形態において、72ショアAより高い、81ショアAより高い、91ショアAより高い、102ショアAより高い、122ショアAより高い、およびさらに181ショアAより高い。いくつかの応用に対して、硬度は78および105ショアAの間であることが望ましい。硬度ショアAは米国材料試験協会D2240‐00に従うショアA硬度検査を使用して室温(23℃)で計測される。言及した特性の組み合わせを必要とする実施形態がある(例として、81ショアAより高い硬度を有し、76%より高いが140%より低い破壊時の伸長。任意の他の組み合わせは他の応用に対して適切なものであろう)。異なる実施形態において、発明者は、望ましい硬度レベルは、米国材料試験協会D2240‐00に従うショアB硬度検査を使用して室温(23℃)で計測される99ショアBより低い、91ショアBより低い、81ショアBより低い、71ショアBより低い、61ショアBより低い、51ショアBより低い、41ショアBより低い、31ショアBより低いことを発見した。言及した特性の組み合わせを必要とする実施形態がある(例として、99ショアBより低い硬度を有し、76%より高いが140%より低い破壊時の伸長。任意の他の組み合わせは他の応用に対して適切なものであろう)。異なる実施形態において、発明者は、望ましい硬度レベルは、米国材料試験協会D2240‐00に従うショアD硬度検査を使用して室温(23℃)で計測される99ショアdより低い、99ショアDより低い、91ショアDより低い、81ショアDより低い、71ショアDより低い、61ショアDより低い、51ショアBより低い、41ショアDより低い、およびさらに31ショアDより低いことを発見した。言及した特性の組み合わせを必要とする実施形態がある(例として、91ショアDより低い硬度を有し、76%より高いが140%より低い破壊時の伸長。任意の他の組み合わせは他の応用に対して適切なものであろう)。異なる実施形態において、発明者は、米国材料試験協会D785‐08(2015)およびロックウェル硬度(HRk度数)に従い室温(23℃)で計測される望ましい硬度レベルは、39HRkよりも低い、29HRkよりも低い、18HRkよりも低い、9HRkよりも低い、4HRkよりも低いおよびさらに1HRkよりも低いことを発見した。同じラインにおいて、言及した特性の組み合わせを必要とする実施形態がある(例として、39HRkよりも低い硬度を有し、76%より高いが140%より低い破壊時の伸長。任意の他の組み合わせは他の応用に対して適切なものであろう)。発明者は、ある程度低い値の硬度レベルを有する型がしばしば望ましいことを発見し、異なる実施形態において、298Hvより低い、238Hvより低い、198Hvより低い、およびさらに9Hvより低い。一実施形態においてビッカース硬度は米国材料試験協会E92‐82(2003)に従って計測される。言及した特性の組み合わせを必要とする実施形態がある(例として、298Hvより硬度を有し、76%より高いが140%より低い破壊時の伸長。任意の他の組み合わせは他の応用に対して適切なものであろう)。いくつかの実施形態において、型について前述したことは型の部分または容器へ応用可能である。 本態様の実施形態の非常に重要な組は、複雑な経路の内部構造または任意の他の種類の空洞(最終的には異なる材料で充填されることもある)(数例を挙げると、冷却路ネットワーク、構造を軽量化する空洞、加熱のための銅のネットワーク、動力伝達、または信号伝達など)を有する要素の製造に関連し、よく知られているように、収容されたまたは密閉された空洞は冷間等方圧加圧(CIP)または熱間等方加圧(HIP)プロセスのいずれにおいても扱うことが非常に難しく、通常は金属のコアまたは簡易な形状のマンドレルが必要となる。発明者は、非常に驚くべきことに、ポリマー材料を使用して最も有益な内部空洞形状をいくつか作ることが可能であることを発見した。 他の材料で充填される複雑な冷却路および経路はこのようなやり方で非常に正確に作られることができる。冷却路の場合においては、コンフォーマル冷却戦略が適用されてもよい。 著者は、二つの有益な事実を観察し、一つは、内部回路を有するダイスを作る場合、型または型の部分または容器の製造のために充填されたポリマーを使用することの驚くべき利益である。内部回路を有する工具の製造のための積層造形された型、型の部分または容器は、特に大きい工具に対しては細かい非常に入り組んだ内部形状をしばしば備え、充填されたポリマーの関連脆性は大きな欠点となることがありそのような入り組んだ細部の頻繁な破損につながると考えられうるが、驚くべきことに発明者はそのような破損は実際起こるものの機能性に悪影響を与えないようそれらを管理することが可能であり、およびさらに多くの例においてそのような回路の機能性は驚くほど改良されることを発見した。異なる実施形態において、充填物は粉のような粒子を有し、金属、セラミック、金属マトリックス複合材料、セラミックを基とする複合材料、およびさらにポリマーを基とする複合材料を備える。異なる実施形態において、型の充填物は体積で6%を超える、12%を超える、16%を超える、22%を超える、26%を超える、46%を超える、56%を超える、およびさらに66%を超える。いくつかの実施形態において、型について前述したことは型の部分または容器へ応用可能である。 一実施形態において、ポリマー内の固形の粒子が高い密度を得るために以下の戦略に従うことができる。最も微細な分率がポリマー(樹脂、ポリマーの混合または有機的な要素/相)の少なくとも部分と個別に混合される。他方では、最も粗い分率が型または容器へと入れられ、できる限り多くの見掛け密度を得るために振動される。一実施形態において、最も粗い分率は最大限のD90を有する粉末分率をさし、一実施形態においては最も高いD90/D50比率を有する粉末分率をさす。そして粒子サイズ分率の残りはサイズが小さくなる順に一度に加えられ、適切に混合されるまで同様に振動される。固形の粒子が適切に混合されると、最も微細な分率を含む分離したポリマーが加えられる。一実施形態において、この戦略は型の充填中に直に行われてもよい。一実施形態において、この戦略は容器において使用され、混合は注入される、または型へと充填される。一実施形態において、ポリマーは充填中に粒子がその相対的な位置を失わないようにしようとする。一実施形態において、最も微細な分率は最小限のD50を有する粉末分率をさし、一代替実施形態においては最も低いD50/D10比率を有する粉末分率をさす。一実施形態において、最も粗い分率は最大限のD90を有する粉末分率をさし、一実施形態においては最も高いD90/D50比率を有する粉末分率をさす。 いくつかの実施形態において、特に内部特徴が存在する要素を製造する場合、およびさらに内部特徴が大きい場合はなおさらに、冷間等方圧加圧(CIP)/温間等方圧加圧(WIP)または類似のプロセス中に充填された型へ圧力をかけることはしばしば問題となる。発明者は、そのような困難を克服するやり方は、金属粉末自身を通じ逆圧を作ることで型への圧力を中和させることであることを発見した。このことは、粉末内で型のポリマー材料を密閉して型の内部特徴から外壁へ通じるセクションを最小化することで達成される。いくつかの実施例を図1および図2に見ることができる。異なる実施形態において、積層造形(AM)で製造された型の内部特徴から外壁へ通じる各セクションは、290mm2以下、190mm2以下、90mm2以下、40mm2以下18mm2以下、およびさらに8mm2以下である。型について前述したことは、いくつかの実施形態において型の部分または容器へ応用可能である。 一実施形態において、積層造形ステップは、型または型の部分を製造するために応用される。この型は少なくとも一つの金属相を備える微粒子材料で充填され、それから先行の実施形態においてこの効果のために記載された任意のやり方で非常に弾力性のある材料で製造された蓋の型で覆われる(ガラス転移点以上の非常に弾力性のある材料、低い温度で適用された多成分の非常に弾力性のある材料、単一成分の低い温度の乳濁液など)。この後に少なくとも冷間等方圧加圧(CIP)または類似のステップおよび少なくとも一つの十分に高い温度の圧密ステップ(緻密化)が続く。一実施形態において、積層造形された型は、要素の大部分の冷却路または他の内部特徴を組み込む型である。明らかに、微粒子材料が型へと充填されるゆえに、微粒子材料の圧密(緻密化)の後に達成される形状のネガティブと類似する形状を有する。型の縮小、非常に弾力性のある材料で製造された型、微粒子材料の圧密(緻密化)などはしばしば考慮され設計段階において修正される。本態様の一実施形態において、内部特徴は圧密(緻密化ステップ)の後に最低限度の機械加工を有する、またはさらに機械加工を有さない。 この態様において、内部形状および外部形状を有する型が使用される場合、内部特徴と外部特徴を区別することはしばしば有益である。この意味において、内部特徴は充填時に微粒子材料で完全に囲まれている内部特徴であるために、冷間等方圧加圧(CIP)ステップの間に直接に流体からまたは直接に蓋の型によって圧力を受けないが、常に取り囲む微粒子材料によって圧力を受ける。対照して、外部特徴は壁の一方に微粒子材料のみを有し、壁の反対側は、先行の実施形態においてこの効果のために記載された任意のやり方で非常に弾力性のある材料で製造された非常に柔らかい材料で製造された蓋の型を介して、ドライバッグ(dry bag)、冷間等方圧加圧(CIP)の流体、または類似のものに直に接している外部特徴である。 この実施形態は図1において図式化されている。方法は以下のステップを備える。 型を製造するために積層造形プロセスを使用する。 モデルを他の部分へ取り付ける(ことも含まれることがある)。 少なくとも一つの金属相を備える微粒子材料で、前のステップで得られた型の少なくとも部分を充填する。 前のステップの充填された型を非常に柔らかい材料で製造された蓋の型で覆う。 冷間等方圧加圧(CIP)を使用する。 および焼結、熱間等方加圧(HIP)、または任意の他の十分に高い温度を伴うものでありうる緻密化ステップ。 この方法では以下のステップも任意である。 ‐要素の金属部分の熱処理(部分的にまたは完全に緻密化ステップと組み合わせられてもよい)。 ‐要素の最終機械加工。 いくつかの実施形態において、積層造形によって製造された型は微粒子材料で後に充填される型を得るために他の部分へ組み立てられてもよい型の部分である。 そうであるように、本態様の方法の全ての異なる実施形態において、いくつかの他のステップはいくつかの実施形態に対して必要となることがある。いくつかの実施形態は製造された要素の熱処理を必要とする。いくつかの実施形態は製造された要素の最終機械加工を必要とする。 異なる実施形態において、外部特徴に対する型の平均厚さは1.8mm以下、1.3mm以下、0.8mm以下、0.4mm以下およびさらに0.2mm以下である。本文書において他の表明がなければ、厚さはISO4593:2010に従って計測される。 充填された型(封止)を非常に柔らかい材料で製造された蓋の型で覆うことは、前に説明したやり方で(浸し塗り、ブラシがけもしくはピンセル(pinzel)、吹き付けまたは任意の他の応用方法)、本文書の他の箇所に記載されている非常に柔らかい材料を使用して行われる。この場合、いくつかの実施形態に対する非常に柔らかい材料は、型表面の複製を促進するために真空が適用されるバッグまたはフィルムとして適用されることも可能である。製造の任意の他の手段はいくつかの実施形態に対して応用されることも可能である。 述べてあるように、いくつかの実施形態は積層造形プロセスにおいて充填された材料の使用から驚くほど利益を得、この態様において、本文書全体にわたって記載されている有機的な材料を使用する場合はまた特にそうである。同様に、充填時(前に本文書で開示されたような)の高い相対密度の組みあわせは、驚くべきことにいくつかの入り組んだ形状を可能にすることが発見されている。いくつかの実施形態に対して、望ましい充填物の量は少々異なる。異なる実施形態において、積層造形において使用される材料は体積で31%以上、41%以上、61%以上、およびさらに71%以上の硬い充填物を有する。一代替実施形態において、上で開示された割合は重量による。一代替実施形態において、硬い充填物は材料中の硬い粒子の含有量をさす。一代替実施形態において、上で開示された割合は重量による。前述したことは、いくつかの実施形態において型、型の部分または容器の製造に使用される材料へ応用可能である。 異なる実施形態において、積層造形プロセスにおいて使用される材料は室温(23℃)で計測される1.1GPa以上、2.1GPa以上、3.1GPa以上、3.6GPa以上、およびさらに4.1GPa以上の体積弾性率を有する。異なる実施形態において、積層造形プロセスにおいて使用される材料は室温(23℃)で計測される45MPa以上、55MPa以上、65MPa以上、75MPa以上およびさらに85MPa以上の弾性強度よって特徴づけられる。検査条件は本文書の最後の部分で詳述する。前述したことは、いくつかの実施形態において型、型の部分または容器の製造に使用される材料へ応用可能である。 いくつかの実施形態において、若干長めの戦略が取られる。型または型の部分または容器が製造されて後に少なくとも一つの金属相を備える微粒子材料で充填される先行の段落に記載された方法の任意は、一実施形態において次々に微粒子材料で充填される硬化性の有機的な材料で充填することができる。混合の有機的な部分はいくつかの実施形態において脱バインダプロセス(熱的、化学的、または本文書で開示された任意の他の方法)によって後に除去されてもよい。 異なる実施形態において、この方法で得られる要素の密度は、理論密度の89.3%を超える、92.7%を超える、95.5%を超える、97.6%を超える、98.9%を超える密度およびさらにこれらの方法で直接得られる要素の完全密度であり、得られた要素の密度(20℃および1気圧で)は米国材料試験協会B962‐08に従いアルキメデスの原理によって計測される。 一実施形態において、本文書で開示された方法に対して、型もしくは型の部分、モデルもしくはモデルの部分または容器は積層造形の代わりに粒子射出成形(PIM)(粒子射出成形であり、粒子Pは金属M、セラミックC、金属間化合物またはその他任意のものであることがある)を使用して製造されてもよい。 一実施形態において方法はホットスタンプ用金型を製造するために使用され、一実施形態において内部冷却を有するホットスタンプ用金型を製造するために使用され、一実施形態において表面に近接したコンフォーマル冷却(後の段落に記載される)を有するホットスタンプ用金型を製造するために使用される。異なる実施形態において、ダイス表面温度がサイクル全体を通じて140℃未満、79℃未満、49℃未満、29℃未満、19℃未満、およびさらに14℃未満に保たれる表面に近接したコンフォーマル冷却を有するホットスタンプ用金型。異なる実施形態において、方法は表面に近接したコンフォーマル冷却を有するホットスタンプ用金型を製造するために使用され、ダイス表面温度は‐10℃を超える、‐9℃を超える、‐4℃を超える、0.5℃を超える、6℃を超える、およびさらに11℃を超える温度に保たれる。一実施形態において、方法は表面に近接したコンフォーマル冷却を有するホットスタンプ用金型を製造するために使用され、ダイス表面は各サイクルにおいて熱いシートを配置する前に均一の水膜で覆われる。一実施形態において方法は表面に近接したコンフォーマル冷却を有するホットスタンプ用金型を製造するために使用され、ダイス表面は各サイクルにおいて熱いシートを配置する前に水または水溶液で均一にスプレーされ、一実施形態において空気と水の混合または水溶液でスプレーされ、一実施形態において各サイクルにおいて熱いシートを配置する前に流体または溶液でスプレーされる。一実施形態において方法は表面に近接したコンフォーマル冷却を有するホットスタンプ用金型を製造するために使用され、ダイス表面はノズルのシステムで均一にスプレーされ、一実施形態において任意の機械的システムでスプレーされ、一実施形態においてノズルのシステムまたは固定の機械的システムでスプレーされ、一実施形態においてノズルのシステムまたは各サイクルにおいて引っ込む任意の他の機械的システムでスプレーされる。 一実施形態において本文書を通して開示されている方法はダイカスト金型を製造するために使用され、一実施形態において内部冷却を有するダイカスト金型を製造するために使用され、一実施形態において表面に近接したコンフォーマル冷却(前の段落に記載されているような)を有するダイカスト金型を製造するために使用され、一実施形態において表面に近接したコンフォーマル冷却および同様に温度勾配を減少させる内部加熱を有するダイカスト金型を製造するために使用される。 一実施形態において方法は鍛造金型を製造するために使用され、別の実施形態において内部冷却を有する鍛造金型を製造するために使用され、一実施形態において表面に近接したコンフォーマル冷却(前の段落に記載されているような)を有する鍛造金型を製造するために使用され、一実施形態において表面に近接したコンフォーマル冷却および同様に温度勾配を減少させる内部加熱を有する鍛造金型を製造するために使用される。 一実施形態において方法はプラスチック射出金型を製造するために使用され、一実施形態において内部冷却を有するプラスチック射出金型を製造するために使用され、一実施形態において表面に近接したコンフォーマル冷却(前の段落に記載されているような)を有するプラスチック射出金型を製造するために使用され、一実施形態において方法は表面に近接したコンフォーマル冷却および同様に温度勾配を減少させる内部加熱を有するプラスチック射出金型を製造するために使用される。 金属材料の積層造形は、やや小型の要素の製造のための技術としてのみ見なされる。大型の要素の場合、代替製造の手段はさらに悪くなるために製造が極度に困難な要素のみが問題となる。異なる態様は非常に大型の要素の製造に対して驚くほど適している。一実施形態において、本文書で開示された方法は大型のプラスチック射出型の製造に適しており、一実施形態において大型のプラスチック射出型の製造に適しており、一実施形態において大型のアルミニウムのダイカスト金型の製造に適しており、一実施形態においてダイスを形成する大型のシートの製造に適しており、一実施形態において大型の構造部品の製造に適しており、一実施形態において大型のローラー(例えば圧延機のローラー)の製造に適しており、一実施形態において大電力の変換装置軸の製造に適しており、一実施形態において近接ダイス鍛造金型の製造に適しており、一実施形態において大型エンジンの大型エンジン要素の製造に適している。一実施形態において、本文書で開示された方法は要素に属する二つの点の最大距離が異なる実施形態において0.78m以上、1.1m以上、2.1m以上、3.1m以上、4.1m以上、およびさらに8.1m以上である要素の製造に適している。一実施形態において、上で開示された要素に属する二つの点の最大距離の値の任意を有する要素は大型の要素と見なされる。異なる実施形態において、本文書で開示された方法は、要素の重量が1.2メートルトン以上、2.2メートルトン以上、5.2メートルトン以上、10.2メートルトン以上、22メートルトン以上、52メートルトン以上、およびさらに102メートルトン以上である要素の製造に適している。 いくつかの場合において、本文書で開示された方法を使用する場合、製造された要素の重量を意図的に減らすことは有利であることが発見されている。これは特に大型のローラー、軸、モーターの要素およびダイスに対する場合である。これは、機械的な観点からの限界の硬さ(critical stiffness)および性能に影響がでないように注意深く要素内の意図的な空洞を残すことで行われる。実行を評価する手段は、本文書で開示された方法に従いこのようなやり方で製造される要素の重量と従来のやり方(従って内部空洞はない)で製造されている要素の重量とを比較することである。異なる実施形態において、本文書で開示された方法に従って製造される要素の重量は、従来の重量の78%以下、48%以下、28%以下、18%以下、およびさらに8%以下である。 一実施形態において、開示された方法は内部加熱を有するホットスタンプのためのソフトゾーン(soft zone)金型の製造に使用され、一実施形態においてカートリッジを介する内部加熱を有するホットスタンプのためのソフトゾーン(soft zone)金型の製造に使用され、一実施形態において組み込まれたジュール効果回路を介する内部加熱を有するホットスタンプのためのソフトゾーン(soft zone)金型の製造に使用され、一実施形態において組み込まれた渦電流システムを介する内部加熱を有するホットスタンプのためのソフトゾーン(soft zone)金型の製造に使用される。 発明者は適切な選択が行われれば積層造形でダイスを製造することが可能であることを発見した。一実施形態は積層造形を使用して製造されるダイスを対象としている。いくつかの実施形態に対して、発明者は少なくとも製造中の任意のステップにおいて積層造形方法の使用は有益であるが、必ずしも積層造形でダイス全体を製造する必要はないことを発見した。一実施形態は製造中に任意のステップにおいて行われる積層造形を使用して製造されるダイスを対象としている。発明者は、さらにいくつかの実施形態において、ダイスを製造するために他のプロセスは組み合わされるべきであることを発見した。一実施形態は積層造形を使用して製造されるダイスを対象としており、積層造形はそのようなダイスの製造に使用される唯一のプロセスではない。 前に開示されたように、積層造形を備える本文書で開示された方法の任意は、ダイスの製造に適することがあり、例えば本文書を通して開示される少なくとも一つの金属相を備える微粒子材料を成形するために積層造形で少なくとも部分的に製造される型の使用を含む方法などである。いくつかの実施形態において、ダイスは圧力が適用されるステップをさらに備える製造方法を使用して得られる。発明者は、異なる実施形態において、適用される圧力は55MPaを超える、105MPaを超える、210MPaを超える、310MPaを超える、420MPaを超える、455MPaを超える、510MPaを超える、610MPaを超える、660MPaを超える、810MPaを超える、およびさらに1050MPaを超える圧力である。いくつかの実施形態において、この圧力は冷間等方圧加圧(CIP)および緻密化ステップの間に適用される。いくつかの実施形態において、この圧力は冷間等方圧加圧(CIP)の前に適用される。発明者は、金属相とともに有機的な要素をさらに備える材料を使用しながら、いくつかの実施形態においてダイスは付加増加するために材料の堆積を直接備える積層造形方法を用いて直接得られてもよいことを発見した。一実施形態は金属相とともに有機的な要素を備える材料を使用して製造されるダイスを対象としている。一実施形態において有機的な要素はポリマーであり、一実施形態において感光性樹脂であり、一実施形態において熱硬化性重合体である。いくつかの実施形態において、ダイスは大型のダイスである。発明者は、いくつかの実施形態において積層造形を使用して大型のダイスを製造することは可能であり、大型のダイスは大型の要素を言及する際に本文書で使用される値に従い大型の要素と見なすことができることを発見した。いくつかの実施形態において、ダイスは高い係数を有する。いくつかの実施形態において、ダイスは高い降伏力を有する。発明者は驚くべきことに機械的強度(UTS)を用いて要求される形状が達成可能であることを発見した。いくつかの実施形態において、ダイスは高い機械的強度(UTS)を有し、そのような特性の値は本文書を通して開示される任意の値である。いくつかの実施形態において、ダイスは冷却路を有する。いくつかの実施形態において、ダイスはそのような冷却路の定義された密度を有し、そのような冷却路の密度は本文書で開示される密度の任意のものである。いくつかの実施形態において、ダイスに備えられる冷却路の流体はレイノルズ数における十分な差異を有する。いくつかの実施形態において、冷却路の流体のレイノルズ数における十分な差異は本文書で開示されるそれらの値の任意のものである。いくつかの実施形態において、ダイスは表面から定義された距離にある冷却路を有する。いくつかの実施形態において、表面へのそのような冷却路の距離は本文書で開示されるそれらの値の任意のものである。いくつかの実施形態において、ダイスは定義された熱伝導率を有する。いくつかの実施形態において、熱伝導率の値は本文書で開示されるそれらの値の任意のものである。いくつかの実施形態において、ダイスは定義された平衡温度を有する。発明者は、いくつかの実施形態において平衡温度の正しい選択はダイスの耐久性を高めることを発見した。いくつかの実施形態において、平衡温度の値は本文書で開示されるそれらの値の任意のものである。いくつかの実施形態において、平衡温度は本文書で開示されたそれらの値の任意に従い表面へ十分近接して計測される。 本文書で開示されたいくつかの材料に対して、材料が低温のダイスまたはフォームへと流れるように作られおよび圧力が適用されおよび同様に充填された材料と接するフォーム(またはダイス)の表面の少なくとも部分において温度が上げられる方法を使用することは、非常に有益であることが発見されている。一実施形態において、有機的な部分の少なくとも関連する要素は、ダイス内での加熱中に重合を開始する熱開始剤または触媒を備える。一実施形態において、有機的な部分の少なくとも関連する要素は、圧力下での粒子間拡散を経て、材料を充填した後にフォームまたはダイスにおいて温度条件が適用される。異なる応用に対して、型の表面または少なくともその部分が、有機的な部分の少なくとも一つの関連する要素の重合または硬化の間よりも低い温度を材料の充填の間に有するべきという事実は、異なる手段において解決することができる。異なる問題解決のうち、二つが指摘され、なぜならこれらはいくつかの具体的な応用に対して特に有益であるからであり、そのことはこのリストが網羅的である最低限の口実を持たないことを意味する。一実施形態において、型は冷却システムと加熱システムを有し、冷却システムは冷却(または温度調節)経路または流体が循環する回路を備え、冷却システムは硬化ステージ中に層流フラックスを受け、ダイスの冷却中および材料の充填中にレイノルズ数を乱流フラックスへと劇的に変化させる。一実施形態において、充填ステージおよび硬化または硬くなるステージの間に低温の流体と高温の流体の間の高速の切り替えとともに温度調節回路の少なくとも部分が共有される。 異なる実施形態における有機的な部分の関連する要素は、有機的な部分に関して重量で少なくとも0.06%、少なくとも0.6%、少なくとも1.2%、少なくとも2.6%、少なくとも6%、少なくとも11%、少なくとも21%、およびさらに36%をさす。一代替実施形態において、上で開示された重量割合は材料の重量に関してである。代替実施形態において、上で開示された割合は体積による。 一つの組の実施形態において、本文書で記載された方法の一つは、それぞれの融解温度(Tm)の間の十分に大きい差を有する少なくとも二つの異なる金属合金を備える材料を用いて使用される。一実施形態において、記載された二つの中でより高い融点を有する金属合金はPCT/EP2016/076895の応用の合金である。一実施形態において、記載された二つの中でより低い融点を有する金属合金はPCT/EP2016/076895の応用の合金である。一実施形態において、記載された金属合金の両方はPCT/EP2016/076895の応用の合金である。一実施形態において、両方の合金は粒子状である。一実施形態において、両方の合金は粉末状である。一実施形態において、より高い融点の合金はより低い融点を有する合金よりも大きいD50を有する。異なる実施形態において、D50の差は5倍以上、6倍以上、7倍以上、態様8倍以上、11倍以上である。異なる実施形態において、二つの金属合金の融解温度の十分に大きい差とは、20℃以上、55℃以上、82℃以上、105℃以上、155℃以上、205℃以上、255℃以上、310℃以上、410℃以上、610℃以上、820℃以上、およびさらに1050℃以上である。検査条件は本文書の最後の部分で開示する。 一実施形態において、型、型の部分、モデルもしくはモデルの部分、または容器は、モデルが層ごとに作られ材料の層が光を用いて硬化するまたは硬くなるまで凝固させる作り上げられた表面プラットフォームの上へと材料(ポリマーおよびワックス)を噴射する2次元インクジェットプリンタのプロセスに類似する材料噴射を使用して製造される。 発明者は、材料成形のためのいくつかの実施形態において、およびさらに本文書で開示された任意の方法を実行する場合に、型もしくは型の部分、モデルもしくはモデルの部分または容器の製造に対する非常に有益なプロセスはレーザー焼結であることを発見した。レーザー焼結/溶融プロセスは、金属の3次元印刷に対し主流で最も広く研究された技術であり、そこで原料は主に粉末状で存在するがいくつかのシステムでは金属線が使用される。他の積層造形システムのように、レーザー焼結/溶融は3次元CADモデルから形状情報を得る。異なるプロセスの変形は、含まれうる他の材料(例えば多成分金属ポリマー粉末混合など)および後続の後処理に基づく。粉末原料を使用するプロセスは、隣接する金属粒子の層ごとの部分溶融によって望ましい成形まで実行される。これは間接または直接の形で行われる。直接の形は、ポリマーのプロセス技術を使用して金属粉末がポリマーで覆われている金属部分を製造する。金属材料に関してポリマーコーティングの比較的低い溶解は、凝固後の金属粒子の接続を助ける。直接レーザープロセスは特別な多成分粉末システムの使用を含む。選択的レーザー溶解(SLM)は、直接の選択的レーザー焼結の増進であり、焼結プロセスは緻密化を得るために後で高い温度で適用される。 一実施形態において、型、型の部分、モデルもしくはモデルの部分、または容器は、集中されたエネルギー(電子ビームまたはレーザービーム)が粉体層(金属、ポリマーまたはセラミック)を選択的に溶解または焼結するために使用される全ての技術を包含する粉体層融合(Powder bed fusion)を用いて製造される。従って、現在いくつかの技術が存在し、直接金属レーザー焼結(DMLS)、選択的レーザー溶解(SLM)、電子ビーム溶解(EBM)、選択的レーザー焼結(SLS)である。 一実施形態において、発明者は、プロセスにおいてレーザーを伴うプロセスが選択される場合に、粉末混合の適切なサイズ分布を使用する際に得られる高い充填密度により、非常に有利な応用が生じることを発見し、それらのプロセスは集中されたエネルギー(通常はレーザービームを使用する)を使用して材料を含む粉体層を選択的に溶解または焼結する。一実施形態において、方法は型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するプロセスでレーザーを伴うプロセスの使用を備え、例えばレーザーを使用して(通常は直接エネルギー堆積)材料を堆積するこれらのプロセス、および集中されたエネルギー(通常はレーザービームを使用する)を使用して材料を含む粉体層を選択的に溶解または焼結するときのそれらのプロセスが選択されるがこれらに限定されない。 一実施形態において、成形プロセスにレーザーを伴うプロセスが例えば選択されるが、集中されたエネルギー(通常はレーザービーム)を使用して粉体層を選択的に溶解または焼結するときのそれらのプロセスに限定されない場合、要素内の粉末混合のより高い充填密度ならびに同様により低い熱応力および/または残留応力(時にそれらの両方)により、プロセスはまた低いエネルギーをもたらす従来技術の既知の方法と比較してより低い温度入力を成形プロセスの間に伴う。多くの場合において、この要素は望ましい最終要素が得られるまで後処理を必要とする。その一方で別の場合においては最終要素はこのプロセスの直後に得られる。 一実施形態において、各応用に対して選択される粉末混合(時に積層造形(AM)微粒子)の粒子サイズ分布に応じて、粉体層の高い充填密度に到達する。一実施形態において、適切な粒子サイズ分布とともに振動を使用して粉体層の高い充填密度を得る。他の実施形態において、適切な粒子分布を増進し粉体層の充填を改良する任意の他の方法は、本文書で開示された方法との組み合わせに適している。 一実施形態において、型、型の部分、モデルもしくはモデルの部分、または容器は、集中されたエネルギーがレーザー(レーザー蒸着およびレーザー圧密)、アークまたはEビーム熱源(金属直接蒸着および電子ビーム直接溶融)を用いて原料(粉末またはワイヤー材料)が堆積する溶融プールを生成する全ての技術を含む直接エネルギー蒸着技術を使用して製造される。 一実施形態において、型、型の部分、モデルもしくはモデルの部分、または容器は、加熱され層ごとに堆積するノズルを介しての材料調剤によって物体が生成される材料押し出しによって製造される。ノズルおよびプラットフォームは、最も一般的な材料押し出しプロセスである熱溶解積層法(FDM)のように、毎回新しい層が堆積する後に水平および垂直にそれぞれ動かされることができる。 一実施形態において、型、型の部分、モデルもしくはモデルの部分、または容器は、3次元物体を形成するために2次元部分にスライスされた精密切断金属板の積み重ねを使用するシート積層を使用して製造される。それは超音波圧密および積層物体の製造を含む。前者はソノトロードを用いてシート接合のために超音波接合を使用する一方、後者は接合の代わりに材料および接着剤として紙を使用する。 放射(光造形法(SLA)、デジタル光処理(DLP)、二光子重合、液晶など)による重合、押し出しに基づくプロセス(熱溶解積層法(FDM、FFF)など)、粉末に基づくプロセス、任意のマスキングプロセス、結合剤を使用するプロセス、促進剤、活性剤または定義されたパターン(3次元印刷(3DP)、選択的熱焼結(SHS)、選択的レーザー焼結(SLS)、など)において適用されてもされなくてもよい他の添加物、シートの製造(ラミネートオブジェクト製造(LOM)として)に基づくプロセス、および任意の他のプロセスなどに基づくプロセスのような感光性材料に基づく技術を含む技術を使用して型、型の部分、モデルもしくはモデルの部分、または容器を製造するために最も一般的に有利である技術の中で、任意の積層造形(AM)プロセスは特定の応用に対し有利でありうる。前に言及したように、いくつかの実施形態において型は、非有機的な化合物を用いて全体を作られることもあるが、有機的な材料で作られるまたは少なくとも部分的に有機的な材料で作られ、プラスチック(熱可塑性物質、熱硬化性物質など)の他に、多くの材料(しっくい、泥、ゴム、粘土、紙、他のセルロース誘導体、炭水化物など)を使用することができ、それらは任意の他の材料(有機物、セラミック、金属、金属間化合物、ナノチューブ、任意のタイプの繊維など)と混合されてもよい。 一実施形態において、型、型の部分、モデルもしくはモデルの部分、または容器は、液状の感光性樹脂の入ったバットを使用しそこから硬化剤として電磁放射を用い層ごとに3次元モデルが組み立てられて多くの場合で感光性樹脂が使用される動的プラットフォームの助けでモデルを作るために断面層が逐次的におよび選択的に硬化されるバット重合を使用して製造される。主な技術は、感光性樹脂を硬化するためにレーザーではなくプロジェクターの光が使われる光造形法(SLA)およびデジタル光処理(DLP)である。 発明者は、いくつかの実施形態において型もしくは型の部分、モデルもしくはモデルの部分または容器を製造する場合、およびさらに本文書で開示された方法の任意を実行する場合、非常に有益なプロセスは光造形法(SLA)であることを発見した。いくつかの実施形態において、使用される積層造形プロセスは光造形法(SLA)である。 いくつかの実施形態において、材料は本文書で開示された方法の中で、セラミック、有機物、金属、およびそれらの任意の組みあわせなどだがこれらに限定されない材料で充填されている樹脂を備える型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するために使用される。 一実施形態において樹脂は感光性樹脂をさす。一実施形態において、感光性樹脂は、望ましい物理的な特性を達成するために多機能のモノマーおよびオリゴマーの混合を備え、従って外部または内部のいずれかの開始により光の存在で重合可能な幅広く多様なモノマーおよびオリゴマーが発展している。感光性樹脂は硬化と呼ばれるプロセスを経て、そこでオリゴマーは光への露出時に架橋結合し、網状重合体として知られるものを形成する。光硬化の結果、ポリマーの熱硬化性網状組織が形成される。光硬化の利点の一つは、レーザーまたはダイオードその他などの高エネルギー光源を使用して選択的に行うことができることだが、ほとんどのシステムは光で容易に活性化せず、この場合光開始剤が必要となる。光開始剤は、光の放射時に反応種へと分解することで活性化され、モノマーの特定の官能基の重合を活性化する化合物である。一実施形態において、感光性樹脂は、しばしば電磁スペクトルの紫外線または可視領域である光への露出時に特性を変えるポリマーである。これらの変化は構造の上で現れ、例えば、材料の硬化は光への露出時の架橋結合によって生じる。モノマー、オリゴマー、および硬化と呼ばれるプロセスを通じて硬くなったポリマー材料へと同調する光開始剤の混合を描く例が下に示される。 一実施形態において、感光性樹脂は、望ましい物理的な特性を達成するために多機能のモノマーおよびオリゴマーの混合からなり、従って外部または内部のいずれかの開始により光の存在で重合可能な幅広く多様なモノマーおよびオリゴマーが発展している。感光性樹脂は硬化と呼ばれるプロセスを経て、そこでオリゴマーは光への露出時に架橋結合し、網状重合体として知られるものを形成する。光硬化の結果、ポリマーの熱硬化性網状組織が形成される。 異なる実施形態において、型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するために使用される材料を硬化するための光源は、用いられる材料を硬化できるスペクトルでの1100ルーメン以上、2200ルーメン以上、4200以上、およびさらに11000以上である。 一実施形態において、光硬化性組成物は型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するために使用される。異なる実施形態において、光硬化性組成の材料は460nmを超える、560nmを超える、760nmを超える、860nmを超える、940nmを超える、1060nmを超える、およびさらに1210nmを超える波長で光硬化する粒子で充填される樹脂を備える。 いくつかの積層造形(AM)プロセスは、露出によって硬化樹脂または他のポリマーを組み込んでいるが、しばしばある程度の放射に限局される。これらのプロセスのいくつかは、複雑な形状の部分の経済的生産および高いレベルの細部が可能となる段階まで発展している。このプロセスの例は、樹脂表面(光造形法(SLA))の表面または樹脂の体積(連続の液界面製造(CLIP)‐光造形法(SLA))にわたりマスクした放射を使用し、いくつかの他の例は、防止剤または増進剤を使用することで望ましい形状が生成されて放射は全表面へ適用される(ポリジェットシステムなど)。 一実施形態において、積層造形(AM)プロセスはインクジェットシステムからなる。異なる実施形態において、使用されるインクジェットシステムは熱硬化性重合体の1マイクロメートルの層を硬化するのに2秒未満、0.8秒未満、0.4秒未満、およびさらに0.1秒未満を要する。 異なる実施形態において、使用される熱硬化性重合体は、ポリエステルファイバーグラスシステム、シート成形コンパウンド、バルク成形コンパウンド、ポリウレタン、断熱材、マットレス、コーティング、接着剤、車の部分、印刷ローラー、靴底、床材、合成繊維、ポリウレタンポリマー、加硫ゴム、ベークライト、電気絶縁体およびプラスチック製品に使用されるフェノールホルムアルデヒド樹脂、デュロプラスト、ベニヤ板、パーティクルボードおよび中質繊維板に使用される尿素フォルムアルデヒド発泡樹脂、メラミン樹脂、フタル酸ジアリル(DAP)、エポキシ樹脂、ポリイミド、シアン酸エステル、ポリシアヌレート、型または型ランナー、および/またはポリエステル樹脂その他である。 発明者はいくつかの応用において、特に粒子含有量がとりわけ高い場合、粒子分散のための任意の媒体の使用が望ましくてもよく、その点においてより適切な媒体の使用はもっぱら使用される粒子および樹脂のタイプによる。異なる実施形態において、材料はさらにpH調整剤、エレクトロステリック(electro‐steric)分散剤、疎水性ポリマー、およびさらに陽イオンコロイド分散剤を備える。 発明者はいくつかの応用に対して充填した樹脂システムの粘度が大いに重要であることを発見した。しばしば、過度に高い粘度は選択的な硬化中の無制御な多孔性および他の形状上の欠点の形成をまねく。加圧ガスまたは機械的に活性化されたシステムを使用するシステムなどの高い粘度の樹脂で、およびさらに特に樹脂のガスが抜けた場合に樹脂を広げるためのアームを有するシステムで作業するよう特に準備されたシステムを用いることでそれは調整可能である。いずれの場合も粘度を低下させるために希釈剤を使用することは有益である。多くの潜在的な希釈剤が存在し、それらの任意は特定の応用に適することがある。例えば、スチレンなどのリン酸エステルモノマー。 いくつかの実施形態に対して、型もしくは型の部分、モデルもしくはモデルの部分または容器の製造は使用しながら製造され、遮断マスク、マスク活性剤、化学活性剤、および/または熱的なものなどを有するシステムなどの直接放射露出のシステムとは異なるシステムにより選択的に硬化されうる樹脂またはポリマーでさらに可能である。 本文書で開示された方法にてしばしば用いられる緻密化機構に起因して、いくつかの応用に対して硬い粒子または強化繊維を使用して、型もしくは型の部分、モデルもしくはモデルの部分または容器の特定のトライボロジー動作を与えることおよび/または機械的特性を増加させることは有益である。この意味において、いくつかの応用は硬い粒子の使用から利益を得、材料の体積に関して硬い粒子の体積は異なる実施形態において体積で2%以上、5.5%以上、11%以上およびさらに22%以上である。一代替実施形態において、上で開示された割合は重量によるものであり、材料の重量に関して硬い粒子の重量割合をさす。これらの硬い粒子は必ずしも別々に取り入れられるのではなく、別の段階で組み込まれるまたはプロセスの間に合成されることもある。代表的な強化粒子は、ダイアモンド、立方晶窒化ホウ素(cBN)、酸化物(アルミニウム、ジルコニウム、鉄など)、窒化物(チタン、バナジウム、クロム、モリブデンなど)、炭化物(チタン、バナジウム、タングステン、鉄など)、ホウ化物(チタン、バナジウムなど)、それらの混合などの高い硬度を有するものであり、通常では任意の粒子は異なる実施形態において11GPa以上、21GPa以上、26GPa以上、およびさらに36GPa以上の硬度を有する。他方では、主として増加した機械的特性から利益を得る応用において、これらは硬い粒子として使用することができ、強化繊維(ガラス、炭素繊維など)、ウィスカー、ナノチューブなどの機械的特性の有効な効果を有しうる既知の任意の粒子を使用することができる。 発明者は、いくつかの実施形態において型もしくは型の部分、モデルもしくはモデルの部分または容器を製造する場合、およびさらに本文書で開示された方法の任意を実行する場合、型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するために非常に有益なプロセスは直接光処理であることを発見した。第一に、積層造形(AM)プロセスの光硬化の群において、平面同時硬化によって平面を得るために、速度は平面における光パターンの投射を通じて容易に得られる。よって、各ステップにおいて全体の光パターン(または選択された樹脂に対する他の関連する波長)はまさにその瞬間に成形されるために表面に適用され、まさにその瞬間に処理されている層において意図される全体の成形の同時硬化を達成する。このことは、その時点で製造された層の意図される「ピクセル」上に適切な波長を照らすDLP(直接光処理)プロジェクターに似たシステムの使用その他などを通じて達成される。同様に、得られる形状の複雑さに対しさらなる柔軟性を追加するため補足の技術が用いられてもよい。一つの例は、硬化反応が、硬化のための適切な波長に露出する場合でも硬化反応がいくつかの手段すなわち酸素存在により妨げられうる感光性樹脂の使用でありうる。そのような例において、きわめて複雑な形状が非常に速いやり方で達成されうる。金属構成要素はしばしば樹脂槽において浮遊状態である。領域全体が一度に硬化される「プロジェクタータイプ」システムの場合において、発明者はいくつかの例に対して多数のピクセルを有するシステムを使用することが有利であることを発見し、そのような例では異なる実施形態において0.9M(Mは百万を表す)ピクセル以上、2M以上、8M以上およびさらに10M以上を有することが望ましい。発明者は、いくつかの大型の要素に対しては、解像度はさほど高くある必要はなく、従って硬化が起きる表面ではかなり大きいピクセルサイズも容認可能であることに気がついた。そのような場合に対し異なる実施形態において、12平方マイクロメートル以上、55平方マイクロメートル以上、120平方マイクロメートル以上、およびさらに510平方マイクロメートル以上のピクセルサイズ。他方では、いくつかの要素はより高い解像度を必要とし、従って異なる実施形態において、195マイクロメートル以下、95マイクロメートル以下、45マイクロメートル以下、およびさらに8マイクロメートル以下のピクセルサイズを目指す。発明者は、大型の要素または非常に高い解像度が望まれる要素に対し、より広域に及ぶようにそのような投射システムのマトリックスまたは、マトリックスの異なる点へ連続して動く単一のプロジェクターを有して製造された層ごとにいくつかの露出を行うことは有利であることを発見した。光源(可視でも不可視でも、つまり選択される波長がいずれであれ)は、連続印刷または硬化表面のいくつかの点での少なくとも同時硬化ができる限りは、デジタル光処理(DLP)プロジェクター以外であってもよい。発明者は、速度その他のために、いくつかの応用に対して樹脂表面に到達する適した光子の高い密度を有することは有利であることを発見した。この意味において、いくつかの応用に対して高いルーメンの光源を有することが賢明である。異なる実施形態において、用いられる樹脂を硬化できるスペクトルでの1100ルーメン以上、2200ルーメン以上、4200以上、およびさらに11000以上が望ましくてもよい。コスト最適化のために、用いられる樹脂を硬化するポテンシャルのある波長での大部分の放射光を有する光源を有することが推薦されてよく、いくつかの応用に対して異なる実施形態において27%以上、52%以上、78%以上、およびさらに96%以上が望ましい。発明者は、いくつかの応用に対して、望ましくは異なる実施形態において3000以上、8400以上、12000以上、23000以上およびさらに110000以上の全体の光子増加を有する光子増強器を用いることもまた有益であることを発見した。発明者は、このような場合において、異なる実施形態において12%以上、22%以上、32%以上、43%以上、およびさらに52%以上の量子効率(効率は、使用される樹脂を効率的なやり方で硬化できる波長の範囲内の最大効率である)を有する光電陰極を使用することはしばしば有益であることを発見した。いくつかの応用に対して、ガリウム砒素およびさらにガリウム砒素リンに基づく光電陰極は特に有利である。発明者はそこで、硬化の早い樹脂がこの態様に使用され得、そのような応用に対して異なる実施形態において硬化時間が0.8秒以下、0.4秒以下、0.08秒以下、およびさらに0.008秒以下が望ましくありうることを発見した。そのような光子密度および/または硬化の早い樹脂が使用される場合、高フレームレートのプロジェクターまたはさらに一般的なやり方で、異なる実施形態においてパターン切換はしばしば望ましい。32fps以上、64fps以上、102fps以上およびさらに220fps以上。発明者は、本段落で述べた手法もまた、有機的な材料またはいくつかの材料上で金属相含有の必要なしに使用される場合非常に有益であり、製造された要素がある程度の温度への露出を伴う後処理を有しても有さなくてもよいことを発見した。 特に高速の硬化が用いられる場合でも、通常同様に本文書で開示された方法のいくつかの応用に対して、製造中の材料のベッドが流れるのを助けることは時に有利である。このことは特に、高い粘度を有する流体(例として、金属微粒子添加を有する光硬化性樹脂など)を使用する場合にもあてはまる。いくつかの技術はしかるべき場所へと材料が流れるために用いられてもよい(層が完成し、製造された要素が移動され、空洞を充填するために製造されている材料が流れなくてはならない場合と同様に)。このような場合、発明者はベッドまたは槽の吸引または加圧に基づく技術が非常に有利であることを発見した。加圧は、自重またはアクチュエータなどを有する気体またはプレートを用いて行われてもよい。吸引は、真空システムおよび選択膜などを用いて実行されてもよい。 硬化可能な樹脂に対して、通常では、樹脂に含まれるモノマーまたは複数のモノマー(異なるモノマーおよびさらにオリゴマーの混合であってもよい)は適用される波長内で重合されるであろうことが必要である。通常では、本応用において硬化は異なる波長範囲で行われる。異なる実施形態において520‐2760nmの範囲であり、580‐2340nmの範囲であり、630‐2120nm、710‐1930nmの範囲であり、およびさらに940‐1210nmの範囲であり、ゆえにこれらの波長範囲において硬化する樹脂はいくつかの実施形態において本応用において使用される。 発明者は特定の応用は、型、モデル、またはモデルの部分または容器を製造するための近赤外線(NIR)での波長放射に反応しやすい材料の使用であることを発見した。一実施形態において、波長に反応しやすい材料は、そのような波長にて硬化または重合されうる材料をさす。通常では、異なる実施形態において740‐870nm、740‐980nmの範囲、780‐1240nmおよびさらに780‐1420nmの範囲である。いくつかの応用に対して、材料を硬化するために使用する波長は、異なる実施形態において、710nmを超える、830nmを超える、880nmを超える、およびさらに920nmを超えるが、下に開示するようなさらに高い波長の使用も否定しない。むしろ、材料を硬化させるために使用する波長はある程度の値未満であることが好ましい他の応用が存在し、よっていくつかの応用に対して波長は異なる実施形態において1390nm未満、1030nm未満、990nm未満、およびさらに810nm未満が好ましい。 通常、より長い波長はより大きな浸透能力を示し、これらの応用において異なる実施形態において時に970nmを超える、1090nmを超える、1130nmを超える、およびさらに1270nmを超える高い波長が型、モデル、またはモデルの部分または容器を製造するために使用される材料を硬化するために使用される。いくつかの応用に対して、作られた形状に高い柔軟性があることは有益である。この意味において、発明者は、異なる箇所で異なる露出レベルを有するために放射システムの局所変調に基づくシステムが非常に有利でありうることを発見した(しばしば層ごとの生産システムにおける露出のレベルは電荷結合素子(Charge Coupled Device CCD)またはデジタル光処理(DLP)など)。光が変調されると、特定の応用(しばしばレンズを用いる)に対して要求される定義に従って、変換され(発光性の材料を有するシステム)、迂回され(鏡または他によって)、回折され、集中され、または分散され、または便宜上放射を修正するための光学または電子のシステムを使用して行われうる任意の他の作用が可能である。従って、変調の生成は、硬化で使用する波長とは異なる波長で行われてもよい。最も重要なのは、選択した波長において硬化する材料を有することとなる。いくつかの場合、本応用において異なる実施形態において1390nm未満、1030nm未満、990nm未満およびさらに810nm未満の波長で硬化する材料が望ましい。 光硬化の利点の一つは、例えばレーザーなどの高エネルギー光源を使用して選択的に行うことができることだが、ほとんどのシステムは光で容易に活性化せず、この場合光開始剤が必要となる。 異なる実施形態において、光開始剤は、型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するために使用される材料の総重量%に基づき重量で0.1から1.5%、0.1から1.3%、0.1から0.9%、0.1から0.6%およびさらに0.1から0.4%加えられる。一代替実施形態において上で開示された割合は体積による。 別の態様は前に開示したように光開始剤の使用をさす。いくつかの応用において、硬化は材料に含まれる光開始剤の活性化によって開始される。一実施形態において、型もしくは型の部分、モデルもしくはモデルの部分または容器を製造するために使用される材料は樹脂および光開始剤を備える。そのような光開始剤の活性化は、異なる実施形態において690から1390nmを超える、730から1240nm、760および1130nmの間、およびさらに780および940nmの間の範囲の波長でいくつかの応用において行われてもよい。一実施形態は、異なる実施形態において700nmを超える、760nmを超える、840nmを超える、960nmを超える、1180nmを超えるおよびさらに1330nmを超える波長で光開始剤の活性化が行われることを特徴とする光開始剤を備える材料をさし、一方他の応用において光開始剤の活性化に使用される波長は異なる実施形態において1375nm未満、1120nm未満、940nm未満およびさらに830nm未満である。いくつかの実施形態において、材料はさらに光開始剤を備え、材料は上で開示された波長で光硬化可能である。 いくつかの応用において、樹脂はさらに、多くの場合に金属および/またはセラミック粒子を含む粒子懸濁などの他の粒子で充填されてもよいが、同様にナノチューブ、グラフェン、セルロース、グラスファイバーまたは炭素、その他の要素などの他の機能性粒子で充填されてもよい。充填された樹脂を備えるこれらの材料に対し、硬化に使用される波長は先行の段落で開示された値および範囲の内である。従って、波長は異なる実施形態において705nmを超える、710nmを超える、830nmを超える、880nmを超える、およびさらに920nmを超えるのが望ましいが、異なる実施形態において970nmを超える、1090nmを超える、1130nmを超える、およびさらに1270nmを超えるさらに高い波長の使用も否定しない。むしろいくつかの応用に対して発明者は、硬化が異なる実施形態において1390nm未満、1030nm未満、990nm未満より低い、およびさらに810nm未満の波長で行われてもよいことを発見した。 本文書において、他の指示がない限り、以下の検査方法および条件が使用される。 機械的強度(UTS)、破壊時の伸長、および弾性係数などの機械的特性は(他の指示がない限り)、引張の機械的特性である。一実施形態において検査される材料が配向された繊維を備える場合、特性は繊維の配向の方向において計測される(引張強度0°)。一実施形態において検査される材料が配向された繊維および配向されたナノ強化物を備える場合、特性は繊維の配向の方向において計測される。一実施形態において検査される材料が配向されない繊維および配向されたナノ強化物を備える場合、特性はナノ強化物の配向の方向において計測される。 室温は23℃をさす。 温度はセ氏である。 計測は1気圧にてである。 他の指示がない限り計測は室温で行われる。 密度値は20℃および1気圧にて定められる。 室温での機械的強度(UTS)は、金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 成形された材料の室温での機械的強度(UTS)は、成形された材料を厳密に金属と見なすことが不可能であっても金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 本体の室温での機械的強度(UTS)は、金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 参照本体の室温での機械的強度(UTS)は、参照本体を厳密に金属と見なすことが不可能であっても金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 高温での機械的強度(UTS)は、金属材料の高温引張検査ための米国材料試験協会E21‐09標準試験方法に従い300℃で計測される。 成形された材料の高温での機械的強度(UTS)は、成形された材料を厳密に金属と見なすことが不可能であっても金属材料の高温引張検査のための米国材料試験協会E21‐09標準試験方法に従い300℃で計測される。 本体の高温での機械的強度(UTS)は、金属材料の高温引張検査のための米国材料試験協会E21‐09標準試験方法に従い300℃で計測される。 参照本体の高温での機械的強度(UTS)は、参照本体を厳密に金属と見なすことが不可能であっても金属材料の高温引張検査のための米国材料試験協会E21‐09標準試験方法に従い300℃で計測される。 正規化された機械的強度(UTS)は、室温での機械的強度(UTS)および20°で1気圧での密度の間の比率をさす。 成形された材料の正規化された機械的強度(UTS)は、成形された材料の室温での機械的強度(UTS)および20°で1気圧での密度の間の比率をさす。 室温での弾性係数(Eまたはヤング係数とも言及される)は、金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 成形された材料の室温での弾性係数は、成形された材料を厳密に金属と見なすことが不可能であっても金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 本体の室温での弾性係数は、金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 正規化された弾性係数は、室温での弾性係数および20℃で1気圧での密度の間の比率をさす。 成形された材料の正規化された弾性係数は、成形された材料の室温での弾性係数および20℃で1気圧での密度の間の比率をさす。 室温での破壊時の伸長は、米国材料試験協会E8/8M‐16aに従い金属材料の引張検査のための標準試験方法に従って23℃で計測される。 成形された材料の室温での破壊時の伸長は、成形された材料を厳密に金属と見なすことが不可能であっても金属材料の引張検査のための米国材料試験協会E8/8M‐16a標準試験方法に従い23℃で計測される。 融解温度は、溶解のための米国材料試験協会E794‐06(2012)標準試験方法に従い計測され、結晶化温度は熱解析による。 粘度は、ISO3219:1993プラスチック‐液状または乳濁液または分散としてのポリマー/樹脂‐定義されたせん断速度を有する回転式粘度計を用いた粘度の特定、に従い23℃で計測された室温での粘度をさす。 室温での比熱は、示差走査熱量測定による比熱容量特定のための米国材料試験協会E1269‐2011標準試験方法に従い23℃で計測される。 室温での熱拡散率は、フラッシュ法による熱拡散率のための米国材料試験協会E1461‐13標準試験方法に従い23℃で計測される。 室温での熱伝導率は、フラッシュ法による熱拡散率のための米国材料試験協会E1461‐13標準試験方法に従い23℃で計測される。 室温での電気伝導性は、中程度伝導性材料のD‐C抵抗または伝導性のための米国材料試験協会D4496‐13標準試験方法に従い23℃および湿度(RH=50%)で計測される。 ガラス転移点(Tg)は示差走査熱量測定(DSC)により米国材料試験協会D3418‐12に従い計測される。サンプルの重量は10mgである。セラミック容器中。アルゴンを使用し流量25ml/minの清浄気体(99.9%)。加熱/冷却速度10℃/min。液状のポリマーまたは樹脂に対して、粉砕後にサンプルは下に開示する成形方法AからCに従い重合されて検査見本を得、サンプルは粉砕される。見本が一つ以上の成形方法(AからC)によって得られることがある場合、それぞれの方法で得られた見本は検査され、得られた最高値はガラス転移点の選択された値である。 劣化温度(Td)は米国材料試験協会E1131‐08に従い熱重量測定により計測される。サンプルの重量は10mgである。セラミックのるつぼ中。窒素を使用し流量はそれぞれ100ml/minおよび20ml/minの清浄および不活性気体(99.9%)。使用される反応性の空気は流量80ml/minの空気(99.9%)である。加熱速度10℃/minから1000℃。液状のポリマーまたは樹脂に対して、サンプルは下に開示する成形方法AからCに従い重合されてサンプルを得る。見本が一つ以上の成形方法(AからC)によって得られることがある場合、それぞれの方法で得られた見本は検査され、得られた最高値は劣化温度の選択された値である。 除去温度(Te)は米国材料試験協会E1131‐08に従い熱重量測定により計測される。サンプルの重量は10mgである。セラミックのるつぼ中。窒素を使用し流量はそれぞれ100ml/minおよび20ml/minの清浄および不活性気体(99.9%)。使用される反応性の空気は流量80ml/minの空気(99.9%)である。加熱速度0.5℃/minから1000℃。液状のポリマーまたは樹脂に対して、サンプルは下に開示する成形方法AからCに従い準備される。見本が一つ以上の成形方法(AからC)によって得られることがある場合、それぞれの方法で得られた見本は検査され、得られた最高値は除去温度の選択された値である。 ビカー軟化温度は、自動化された装置を使用して測定され、250℃までは液状シリコン熱伝導媒体を用い、それ以上の温度に対しては黒鉛粉末が熱伝導媒体として用いられる(そして温度測定には温度計ではなく米国材料試験協会E2846‐14に従い目盛りが付けられた熱電対が使用される)。幅3mmおよび面積10×10mmの三つの見本は、米国材料試験協会D1225‐00に従い荷重2(50N)および速度A(50℃/h)で検査される。解析の前に検査見本は、25℃および湿度(RH=50%)で48時間にわたり平衡される。初期開始温度25℃。検査見本は下に開示する成形方法AからCに従い得られる。見本が一つ以上の成形方法(AからC)によって得られることがある場合、それぞれの方法で得られた見本は検査され、得られた最高値はビカー軟化温度の選択された値である。 熱たわみ温度は、自動化された装置で測定され、250℃まではシリコンオイルを液体熱伝導媒体として用い、それ以上の温度に対しては黒鉛粉末が熱伝導媒体として用いられ(そして温度測定には温度計ではなく米国材料試験協会E2846‐14に従い目盛りが付けられた熱電対が使用される)、3mm幅の三つの見本は米国材料試験協会D648‐07方法Aに従い0.46Mpa[0.66psi]または1.82MPa[264psi]の荷重で使用され、用いられる荷重はそれぞれの計測に対して示される。解析の前に検査見本および槽は、30℃で平衡され、加熱速度は2℃/minである。検査見本は下に開示する成形方法AからCに従い得られる。見本が一つ以上の成形方法(AからC)によって得られることがある場合、それぞれの方法で得られた見本は検査され、得られた最高値は熱たわみ温度の選択された値である。 代替方法における熱たわみ温度は上で開示された方法に従い計測されるが、5.0MPa、8.0MPaの荷重で測定され、これらの場合に使用される荷重は熱たわみ温度値を用いて示される。 配向されない繊維を有するプラスチックおよび複合材料の弾性係数は、米国材料試験協会D638‐02に従い23℃および50%RHで、B‐1クラスの伸縮計(米国材料試験協会E83‐96に従う)を用いて5mm/minで3.5mm厚さの亜鈴型の見本において計測され、タイプIは硬質のプラスチックまたは複合材料用でタイプIVは軟質のプラスチックまたは複合材料用である。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 配向された繊維を有する複合材料の弾性係数は、米国材料試験協会D3039/3039M‐00に従い23℃および50%RHで、B‐1クラスの伸縮計(米国材料試験協会E83‐96に従う)を用いてひずみ速度0.01min‐1で0°の繊維配向(幅15mm、長さ250mm、厚さ1mm)を有する亜鈴型の見本において、長さ56mm、厚さ1.5mmおよび角度45°のタブを用いて計測される。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 加硫ゴムの弾性係数は、米国材料試験協会D1415-06に従い23℃および50%RHで厚さ9mmおよび横寸法25×25mmの三つの標準見本において計測される。見本は、柔らかい型の製造に使用されたのと同じ積層造形プロセスを使用して製造される。 配向されない繊維を有するプラスチックおよび複合材料の破壊時の伸長は、米国材料試験協会D638‐02に従い23℃および50%RHで、B‐1クラスの伸縮計(米国材料試験協会E83‐96に従う)を用いて5mm/minで3.5mm厚さの亜鈴型の見本において計測され、タイプIは硬質のプラスチックまたは複合材料用でタイプIVは軟質のプラスチックまたは複合材料用である。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 加硫ゴムの破壊時の伸長は、米国材料試験協会D412‐98aに従い23℃および50%RHで500mm/minで厚さ2.5mmの七つの亜鈴型のダイスC見本において計測される。見本は、柔らかい型の製造に使用されたのと同じ積層造形プロセスを使用して製造される。 配向されない繊維を有するプラスチックおよび複合材料の弾性強度は、米国材料試験協会D638‐02に従い23℃および50%RHで、B‐1クラスの伸縮計(米国材料試験協会E83‐96に従う)を用いて5mm/minで3.5mm厚さの亜鈴型の見本において計測され、タイプIは硬質のプラスチックまたは複合材料用でタイプIVは軟質のプラスチックまたは複合材料用である。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 配向された繊維を有する複合材料の弾性強度は、米国材料試験協会D3039/3039M‐00に従い23℃および50%RHで、B‐1クラスの伸縮計(米国材料試験協会E83‐96に従う)を用いてひずみ速度0.01min‐1で0°の繊維配向(幅15mm、長さ250mm、厚さ1mm)を有する亜鈴型の見本において、長さ56mm、厚さ1.5mmおよび角度45°のタブを用いて計測される。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 加硫ゴムの弾性強度は、米国材料試験協会D412‐98aに従い23℃および50%RHで500mm/minで厚さ2.5mmの七つの亜鈴型のダイスC見本において計測される。見本は、柔らかい型の製造に使用されたのと同じ積層造形プロセスを使用して製造される。 配向されない繊維を有するプラスチックおよび複合材料の体積弾性率は、米国材料試験協会D D695‐15に従い23℃および50%RHで、B‐2クラスの伸縮計(米国材料試験協会E83‐96に従う)を用いて1.3mm/minで3mm厚さの亜鈴型の見本において計測される。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 配向された繊維を有する複合材料の体積弾性率は、米国材料試験協会D3410/3410M‐03に従い23℃および50%RHで、0°の単向性の繊維配向(幅10mm、長さ20mm、厚さ2mm)において、長さ65mm、全体の長さ150mmおよびタブ厚さ1.5mmのタブを用いて計測される。七つの見本は各サンプルに対して検査される。見本は、型またはモデルの製造に使用されたのと同じ積層造形プロセスを使用して製造される。 検査見本の準備 熱たわみ温度に対する検査見本を得るために使用される型は、長さ127mm、奥行13mmおよび幅3mmである。この型はまたガラス転移点、除去温度、および劣化温度に対する検査見本に対しても使用されてよい。 弾性係数に対する検査見本を得るために使用される型は、長さ25mm、奥行13mmおよび幅3mmである。 ビカー軟化温度に対する検査見本を得るために使用される型は、面積10×10mmで厚さ3mmである。 成形方法 成形方法A。光開始剤を使用して光重合を行う。光開始剤(タイプ、割合)は供給元の勧めに従い選択される。提供されない場合、使用される光開始剤は過酸化ベンゾイルで、重量で2%である。必要とする見本を機能させる必要な寸法を有する型は、樹脂および光開始剤の均一な混合で充填される。混合は、供給元が提供する硬化条件(波長および露出時間)に従い重合され、提供されない場合は、材料は紫外線ランプ(365nm、6W)の下で2時間にわたり硬化される。この後、見本は型から除去され、下部も上部と同じ条件で硬化される。硬化は、閉じられた光絶縁の箱の中で行われ、光源から10cm離れている見本内でランプの放射のみが入射する。 成形方法B。従来の熱成形機械において熱成形が行われ、厚さ3mmを得るために必要な量の材料は型のフレームに積み込まれる。加熱領域において材料シートが確保されると、供給元の勧めに従い選択される成形温度まで加熱され、提供されない場合は、ガラス転移点より20℃低い温度が選択される。見本が型に入ると、25℃まで冷却される。必要な見本を得るために余った材料は除去される。 成形方法C。従来の射出成形機械において射出成形が行われる。入手可能な場合は、プラスチックペレットが原材料として選択され、そうでない場合は、異なる化学要素が円筒へ注入される。材料は、供給元が勧める温度へ、供給元が勧める時間の間加熱され、提供されない場合は、材料はその融解温度より10℃高い温度まで加熱され5分維持される(材料の劣化点が融解温度よりも50℃以上高い場合)、または材料のガラス転移点より20℃高い温度まで加熱される(劣化点が融解温度よりも50℃以下高い場合)。材料が回転スクリューによって融液溜めへと流されると、少なくとも空洞入口が固まるまで充填圧が適用される。適用する圧力を特定するためにフローリー‐オーウォル‐フライ(Flory‐Orwoll‐Vrij)方程式が用いられる。最後に、型は開けられ見本は除去される。 本文書で開示された任意の実施形態は、提供された任意の組み合わせで任意の他の実施形態と組み合わせることができ、互いに排他的ではない。 例 例1以下の組成の合金をすべて重量比で調製した。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007919722000009
    Figure 0007919722000009
  • Figure 0007919722000010
    Figure 0007919722000010
  • Figure 0007919722000011
    Figure 0007919722000011
Patent Text Reader

Abstract

To provide a method for economic production of light structural components with high flexibility in the geometry attainable.SOLUTION: The present invention provides a magnesium-containing alloy of a specific composition, and a material comprising the magnesium-containing alloy.SELECTED DRAWING: Figure 3
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] This invention relates to an economical method for manufacturing light metal substrate components. Because this method can produce lightweight components with high mechanical properties even at high temperatures, it is particularly suitable for manufacturing structural components. These components can also be manufactured with high environmental resistance and flame resistance. Furthermore, intermetallic compounds may also be suitable in certain embodiments of this invention. [Overview of the project]

[0002] Material properties are undoubtedly one of the main limitations on engineering advancements. Often, materials with high mechanical resistance, along with other properties, are preferred. In the case of metals, their alloys, and metal matrix composites, advancements in manufacturing methods are mostly achieved by improving the understanding of the effects of alloying. Microstructures can also be achieved through thermomechanical treatment, and have recently been further improved by advancements in manufacturing processes. In moving structural components, it is often desirable to be as lightweight as possible. Often, the properties required for a particular application are somewhat contradictory; that is, both properties are required at a high level, but an increase in one leads to a decrease in the other. In such cases, finding a suitable compromise is crucial. One well-known example of this is the conflict between properties more or less related to mechanical resistance (wear resistance, penetration resistance, etc.) and toughness-related properties (fracture toughness, elongation, elasticity, etc.). A better compromise between these properties can be achieved, in particular, through the strategies described above. When it comes to the ductility and damage resistance of metals or other properties related to metal substrates, it is desirable to combine lightweight construction, optimization of the structural design of components, and material engineering in material design. Many designs that are feasible or economically viable are limited by the flexibility of available manufacturing methods. When a light metal substrate is desired, titanium, aluminum, magnesium, lithium, and even alloys of very high-strength steel are often used. In some applications, it is recommended to optimize the ratio of a dominant mechanical property to density, but only if it is balanced with other mechanical properties. Examples of structural components include yield strength / density, modulus / density, modulus / density squared, and fatigue strength / density. Surprisingly, very high-density materials can sometimes achieve the optimal ratio, and weight savings through thinning of components are not uncommon. In some applications, particularly when the flexibility of molding techniques such as additive manufacturing (AM) and metal-in-metal manufacturing (MIM) can be utilized, excessive thinning is of little use. In such cases, and when lightweight structures are required, the density of the material used becomes even more important. In fact, AM technology encompasses a wide variety of techniques, including i) binder injection, ii) directed energy application, iii) material extrusion, iv) material injection, v) powder bed fusion, vi) sheet lamination, and vii) vat photopolymerization. This classification summarizes a wide range of technologies, including but not limited to 3D printing, inkjet, S-print, M-print technology, techniques where concentrated energy generates a molten pool for depositing raw materials (powder or wire materials) using lasers (laser deposition and laser solidification), arc or electron beam heat sources (direct metal deposition and electron beam direct melting), fused deposition modeling (FDM), material injection, direct metal laser sintering (DMLS), selective laser melting (SLM), electron beam melting (EBM), selective laser sintering (SLS), stereolithography, and digital photoprocessing (DLP). To construct extremely lightweight structures, such as microlattice materials, it is sometimes necessary to construct extremely thin walls in increments of tens of nanometers. Currently, this is limited to a limited number of electrodepositable metallic materials. Lightweight structures are often more expensive, which can be an obstacle to wider implementation. Conversely, cost is often a strong driving force for the implementation of certain technologies. For some lightweight components, not only mechanical properties but also environmental resistance must be considered. Most light alloys are highly reactive to oxygen (often even more so at high temperatures) and many other chemicals. This is often a significant drawback in the applications of those light alloys. Furthermore, the flammability of light metal alloys when exposed to flames can be a major obstacle to their applications. Lithium, magnesium, and their alloys are among the lightest metal alloys with highly useful mechanical properties, but unfortunately, their strong reactions with oxygen and nitrogen at very low temperatures make their applications difficult. For structural components or other types of components that require good creep resistance, high modulus of elasticity even at high temperatures, and environmental resistance, certain intermetallic compounds (such as gTiAl) can be very suitable candidates. However, they also exhibit low-temperature brittleness, making them very difficult to mold into complex shapes. Furthermore, some intermetallic compounds exhibit particularly slow impurity diffusion rates, and therefore, diffusion related to component joining is also somewhat difficult for some intermetallic components. In applications requiring high rigidity, mechanical strength, and energy absorption during impacts, reinforced polymers often offer an excellent technical solution. Some of the obstacles relate to cost, anisotropy, reliability (e.g., degradation of properties due to long-term environmental conditions), electrical and thermal conductivity, and sometimes compression and fatigue performance (depending on the load mode). As described, there are different load scenarios for the main loads on structural components. Many components benefit from high performance and weight reduction, and these can benefit from the applications of the present invention. The following are just a few examples, but properties that can be relevant to different applications include mechanical strength, modulus of elasticity, yield strength, environmental resistance, oxidation resistance at high temperatures, creep resistance, compressive resistance, yield under compression, fatigue strength, energy absorption capacity during impact, electrical conductivity, dielectric properties, and thermal conductivity. It is rarely possible to maximize all of these at once, and therefore an optimal compromise is recommended. In application design, this invention may contribute to improving the weight-to-performance ratio. Furthermore, combining substrates with different properties can be beneficial. This invention enables the inexpensive manufacture of components with an excellent weight-to-performance ratio. Furthermore, it allows for more effective utilization of the properties of different materials, particularly when at least one metal or intermetallic compound is included. Current Technical Status The manufacture of metal components has always been a challenge for additive manufacturing technologies, with a lack of mechanical properties and high costs consistently cited as the main obstacles to their development. Bampton et al. published an invention (US5745834) relating to the free-form manufacturing of metal components using selective laser bonding by transient liquid sintering of mixed powders. The mixed powders used in this invention consist of a base metal or base metal alloy (75-85%), a low-melting-point metal alloy (5-15%), and a polymer binder (5-15%). Base metals considered include metallic elements such as nickel, iron, cobalt, copper, tungsten, molybdenum, rhenium, titanium, and aluminum. As for the low-melting-point metal alloys, this can be selected from base metals containing a melting point depressant (boron, silicon, carbon, or phosphorus) to lower the melting point of the base alloy by about 300-400°C. The SLS method and other powder-based AM techniques considered in this invention are highly dependent on the powder properties. Similar to the invention reported by Pfeifer & Shen in U.S. Patent Application Publication 2006 / 0251535 A1, plastic, metal, or ceramic particles can be coated with a particulate material that is adhesive and sinterable, or forms glass. In that patent application, the particulate material (submicrometer or nanoparticles of plastic, metal, or ceramic) is coated with an organic or organometallic polymer compound that has low hydrophilicity and takes into account the temperature difference when the powder material is 100°C. In the case of metal powder material, the particulate material is preferably formed from a metal or alloy consisting of the elements Cu, Sn, Zn, Al, Bi, Fe, or Pb. Activation of the adhesive can occur by laser irradiation designed to cause sintering, or at least sintering or partial melting by sintering or the formation of glass bridges between adjacent powder particles. If the heat treatment is performed below the glass formation temperature or sintering temperature of the powder material, substantially no sintering shrinkage of the whole or compacted material occurs. As seen in Walter Lengauer's study DE102013004182 on print coatings for direct FDM printing, the green component can also be obtained by other 3D printing techniques.Print coatings are composed of one or more polymer organic binder components and inorganic powder components consisting of metal, a hard material containing a binder metal, or a ceramic material. The formed compacts can then be subjected to a sintering process for manufacturing the final parts. Other 3D printing variations, such as FDM processes and direct metal fabrication, are limited in the resolution and size of the components. In this embodiment, Canzona et al. presented a direct metal fabrication method (US2005 / 0191200 A) for forming metal parts with a relative density of at least 96%. The powder mixture presented in that study consists of a base alloy, a powdered low-melting-point alloy, and two organic polymer binders (thermoplastic and thermosetting organic polymers). This powder blend can be used in other powder layer-related methods, such as selective laser sintering where ultrasolidus-liquid-phase sintering is performed. As in the study published by Bampton, low-melting-point alloys are produced by introducing small amounts of boron into the alloy as a eutectic-forming element. Scandium is also considered as a eutectic-forming element. In additive manufacturing of ceramic parts by polymerization of ceramic particle-filled resin using laser photopolymerization, large parts are particularly prone to cracking, making it only possible to manufacture small parts. Thermosetting polymer binders harden before thermoplastic binders remelt. This provides crucial support for the compact's shape while heating it to a temperature that increases the compact's strength by initiating metal-to-metal powder sintering (neck formation at powder contact points). Details of the invention Combining the properties of different materials is often very interesting in order to achieve the extremely lightweight structures desired for many applications at an economical price, and combinations involving metals are very often optimal. In some applications, single-metal structures may also be worth considering if the alloying system is appropriate. Furthermore, greater design freedom increases the potential for weight optimization. However, conventionally, design freedom often comes at the expense of cost. Additive manufacturing (AM) has evolved dramatically in recent years and become relatively inexpensive over the decades. However, the most advanced and cost-effective AM molding techniques enable the use of polymers. Materials that combine the properties of both metals and polymers, such as reinforced polymer composites, are also worth considering. Manufacturing methods for metal alloys, which offer high design flexibility, are generally incompatible with the low decomposition temperatures of polymers. For this reason, the development of manufacturing methods for complex shapes using metal alloys is considered important in some areas, but even then, the temperatures are much lower than their melting points. Among all light metal alloys relevant to engineering or potential applications, the inventors discovered that a very interesting combination of properties can be achieved with magnesium alloys. At first glance, this seems impossible due to its extremely high melting point compared to the decomposition temperatures of most polymers. Magnesium and most of its known alloys react very violently with oxygen and also react with numerous working agents. This corrosion tendency is a hindrance in various applications. Furthermore, they tend to burn with fairly high heat, which is also a very detrimental property in many applications. In addition, many magnesium alloys are extremely difficult to weld, which is a hindrance in many structural applications compared to others. Therefore, despite their low density and relatively high abundance, the applications in which magnesium alloys are used are quite limited. Lithium is much lighter than magnesium, but its significantly lower coefficient of reactivity is a major obstacle to its use as a structural component. Furthermore, it is more reactive with oxygen than magnesium. Magnesium-lithium alloys are lighter than magnesium alloys. Surprisingly, when the alloying is properly selected, it is possible to achieve appropriate modulus values ​​in the order of structural magnesium and aluminum alloys. Unfortunately, lithium further exacerbates some of the significant drawbacks of magnesium alloys, particularly in terms of corrosion, oxidation, flammability, and weldability. Magnesium alloys containing large amounts of lithium may have lower melting points, but their modulus, mechanical strength, and especially creep resistance values ​​are clearly too low for structural applications, or almost all types of applications. In particular, when normalized values ​​(values ​​of properties divided by the alloy density) are considered, it was found that magnesium alloys can be processed at sufficiently low temperatures even when the balance of mechanical properties such as high modulus of elasticity, mechanical strength, and creep resistance is well-maintained, thereby enabling shape retention by polymers. Even more surprisingly, this alloy exhibits good environmental resistance and resistance to combustion. When alloys with a considerably high magnesium content are properly alloyed and processed with lithium, it is also possible to achieve such remarkable behavior while exhibiting very low densities. This system makes it possible to solidify fine particles at a temperature much lower than the melting point of magnesium. In certain embodiments, it has been found that it is worth considering the presence of at least two types of particulate magnesium alloys. In certain embodiments, it is worth considering the presence of at least one lithium-containing particulate magnesium alloy. In other embodiments, it is recommended that at least one lithium-containing particulate magnesium alloy contains more than 36% by weight, or more than 42% by weight, more than 52% by weight, more than 62% by weight, more than 72% by weight, or more than 81% by weight of lithium. Furthermore, in certain embodiments, it has been found that it is worth considering the presence of at least one particulate magnesium alloy having a sufficiently low melting point (in this specification, the melting point is defined as the temperature at which liquefaction begins, unless otherwise specified). In different embodiments, at least one of the particulate magnesium alloys has a melting point of less than 390°C, less than 340°C, 290°C, less than 240°C, and even less than 190°C. The test conditions are shown at the end of this specification. The melting point was measured according to ASTM E794-06 (2012). Alternatively, a technical expert reproducing this disclosure may, at their discretion, obtain the melting point using thermogravimetric methods or any other characterization technique. Since the typical deviation in determining this temperature is not significant, the temperature determined by the solidus line of the corresponding phase diagram is a sufficiently good approximation, as is the temperature determined by CALPHAD-type software, which incorporates Thermo-Calc (Thermo-Calc 2016b, released in November 2016), the latest version of the software available as of January 27, 2017. Alternatively, a technical expert reproducing this invention may, at their discretion, obtain the melting point using thermogravimetric methods or other characterization techniques, or experimentally determine this temperature by a very simple method using DSC, DTA, or DTA with STA. One embodiment refers to the following magnesium alloy compositions, expressed as weight percentages. %Si:0‐15; %Cu:0‐30; %Mn:0‐15; %Be:0‐15; %Zn:0‐15; %Li:0.6‐70; %Sc:0‐20; %Fe<30; %Pb:0‐10; %Zr:0‐10; %Cr:0‐15; %V:0‐10; %Ti:0‐20; %Bi:0‐20; %Ga:0‐20; %N:0‐2; %B:0‐5; %Al:0‐60; %Ni:0‐40; %Mo:0‐15; %W:0‐30; %Ta:0‐5; %Hf:0‐5; %Nb:0‐10; %Co:0‐30; %Ce:0‐15; %Ge:0‐20; %Ca:0‐15; %In:0‐20; %Cd:0‐20; %Sn:0‐40; %Cs:0‐20; %Se:0‐10; %Te:0‐10; %As:0‐10; %Sb:0‐20; %Rb:0‐20; %La:0‐15; %C:0‐5; %O:0‐15; %Y:0‐30; %Nd:0‐30; %Tm:0‐15; %Tb:0‐15; Gd: 0-20; Dy: 0-15; Yb: 0-15; Er: 0-15; Sm: 0-15; Pr: 0-15; Ho: 0-25; Lu: 0-15; Th: 0-15; In the above formula, %Gd + %Nd + %Sm + %Y + %Pr + %Sc + %Pm + %Eu + %Tb + %Dy + %Ho + %Er + %Tm + %Yb + %Lu + %Th = 0.002-34, and %Zr + %Zn + %Mn + %Y + %Ce + %La + %Ca + %Sc = 0.002-34 The remainder is composed of magnesium and trace elements, with %Mg > 12%. Needless to say, the composition can only add up to 100%, which is an obvious condition and therefore not included as a condition. Accordingly, compositions whose total exceeds 100% are automatically excluded (in one embodiment, the condition is, for example, as follows. For applications where elements with atomic number exceeding 103 have little significance in the disclosed alloy, in the above formula, %H + %He + %Li + "...." + %Md + %No + %Lr ≤ 100%, where "...." represents the sum of elements in the periodic table with atomic numbers from 4 to 100) (in one embodiment, the above condition can also be stated as follows: it is characterized in that the sum of all elements with atomic number no more than 118 is equal to 100%). Needless to say, an element whose range starts with 0, or an element whose composition range is expressed as less than (%Element < XX.X) is optional, which means that such element is not included under general circumstances. For example, when the composition range is %Cu = 0-30% and Fe by weight < 30 wt%, there are many embodiments where neither %Fe nor %Cu is present, and many embodiments where neither is intentionally added (therefore, this reference composition indicates 0% or the absence of the element. However, they can be present as trace elements depending on the purity of scrap, alloying elements, contamination of the dissolved recipient, and other possible sources of contamination during alloy manufacturing). There will also be many embodiments where only one is absent or undesirable, while the other is not. The example illustrated with %Fe and %Cu is applicable to any other element. The standard compositions as expressed herein may refer to the general final composition of particles or alloys having higher volume fractions. In the presence of immiscible particles such as ceramic reinforcements (especially particles, fibers, whiskers, etc.), graphene, nanotubes (often carbon nanotubes), and fibers (SiC, SiN, carbon, aramid, basalt, glass, etc.), these are not included in the standard compositions. In embodiments and models where high diffusivity or low melting point particles are used, selection within this compositional range may be possible for some embodiments worth considering, although this is often not the case, as will be discussed later in this specification. As will be discussed later in this specification, some components are manufactured using materials that include molded organic and inorganic parts. In some embodiments, the above compositions, with potential limitations described in the following paragraph, refer to the overall general composition of the metallic phases contained in the inorganic part of the material. The above compositions, with potential limitations described in the following paragraph, refer to the overall general composition of all metallic phases contained in the inorganic part of the material. There may also be embodiments where the weight ratios are %Mg > 12%, %Mg > 22%, and %Mg > 62%. In another embodiment, the above composition, subject to the potential limitations described in the following paragraph, refers to metal phase particles that have the highest volume fraction at the moment the polymer (the organic portion of the material containing the polymer) is filled with the metal phase. In one embodiment, the above composition, subject to the potential limitations described in the following paragraph, refers primarily to metal particles that have the highest volume fraction at the moment the organic portion of the material is filled with different particles and reinforcing materials. Unless otherwise specified, trace elements refer to several elements. However, unless the context is particularly clear, include, but are not limited to, H, He, Xe, F, Ne, Na, P, S, Cl, Ar, K, Br, Kr, Sr, Tc, Ru, Rh, Pd, Ag, I, Ba, Pm, Eu, Re, Os, Ir, Pt, Au, Hg, Tl, Po, At, Rn, Fr, Ra, Ac, Pa, U, Np, Pu, Am, Cm, Bk, Cf, Es, Fm, Md, No, Lr, Rf, Db, Sg, Bh, Hs, and Mt. In some applications, it has been found important to limit the content of trace elements individually or in composition to less than 1.8%, less than 0.8%, less than 0.1%, and even less than 0.03% by weight. In some embodiments, elements present as undesirable impurities are trace elements. Trace elements may be intentionally added to alloys to achieve specific functions, such as reducing the production cost of the alloy. Alternatively, their presence may be unintentional and primarily related to the presence of alloying elements used in the alloy's manufacture and impurities in the scrap. In some applications, the presence of trace elements is detrimental to the overall properties of magnesium-based alloys. In other embodiments, the total content of all trace elements is preferably less than 2.0%, 1.4%, 0.8%, 0.2%, 0.1%, and even less than 0.06% by weight. There are also embodiments for certain applications where the absence of trace elements in the magnesium alloy is desirable (in this specification, even if magnesium is not the primary alloying element, it is generally referred to as a magnesium alloy). Depending on the application, the presence of alkali or halogen elements may adversely affect the mechanical properties. In another embodiment, the content of %F, %Cl, %Br, or %At, individually or in total, is preferably less than 210 ppm by weight, less than 140 ppm by weight, less than 110 ppm by weight, less than 90 ppm by weight, less than 40 ppm by weight, or absent. In another embodiment, the content of %Na, %K, %Rb, or %Cs, individually or in total, is preferably less than 180 ppm by weight, less than 74 ppm by weight, less than 36 ppm by weight, less than 12 ppm by weight, less than 8 ppm by weight, less than 2.8 ppm by weight, less than 0.7 ppm by weight, less than 0.4 ppm by weight, less than 0.009 ppm by weight, less than 0.001 ppm by weight, or absent. While magnesium alloys benefit from a high magnesium (%Mg) content, magnesium is not necessarily the primary component of the alloy to balance the mechanical properties. In other embodiments, it is recommended that the %Mg content be greater than 12 wt%, 21 wt%, 33 wt%, 42 wt%, 52 wt%, 69 wt%, 78 wt%, and even greater than 87 wt%. In some embodiments, it is necessary to control that the total amount of %Mg is not excessive. It has been found that if the total amount of %Mg is excessive, undesirable compromises between corrosion resistance and mechanical properties may occur. In other embodiments, it is recommended that the %Mg content be less than 94 wt%, 88 wt%, 79 wt%, 68 wt%, 48 wt%, 41 wt%, 38 wt%, 24 wt%, and even less than 18 wt%. Magnesium alloys can benefit from their high lithium (%Li) content in some applications. In some embodiments, %Li helps improve certain mechanical properties of the alloy. In particular, when properly combined with other alloying elements, surprisingly, %Li contributes to an increase in the ratio of (modulus of elasticity * elongation at fracture / density). Even more surprisingly, this is a simultaneous increase in both modulus of elasticity and elongation at fracture. As will be discussed later, this ultimately determines whether the embodiment is properly implemented. In some embodiments, %Li can be the dominant element of the alloy. Therefore, it may be argued that such an alloy should ultimately be strictly considered a lithium alloy, rather than a magnesium alloy or magnesium-lithium alloy. As will be discussed later, typically, %Li content exceeding 10 wt% is used only to improve formability, at least partially cubicizing the alloy. Therefore, as the powder metallurgy process is near net-shape, it is generally not worthwhile to produce powders with such high %Li content. However, as will be discussed later, surprisingly, there are embodiments where producing particulate magnesium alloys with high %Li content makes perfect sense. In other embodiments, it is recommended that %Li be greater than 0.6 wt%, 1.2 wt%, 2.3 wt%, 4.2 wt%, 5.2 wt%, 6.9 wt%, 7.8 wt%, and even greater than 8.7 wt%. Higher %Li content is recommended in some embodiments to further emphasize the aforementioned properties and in some applications where special attention is paid to further minimizing corrosion. In other embodiments, it is recommended that %Li be greater than 9.6 wt%, 10.2 wt%, 11.2 wt%, 12.2 wt%, 14.2 wt%, 16 wt%, 18 wt%, and even greater than 26 wt%. As already mentioned, there are embodiments in which %Li can be the majority element of the alloy. In other embodiments, it is recommended that %Li be greater than 36 wt%, 42 wt%, 52 wt%, and even greater than 62 wt%. There are also embodiments in which it is necessary to control that the total amount of %Li is not excessive. We discovered that an excessive total amount of %Li can lead to an undesirable compromise between corrosion resistance and mechanical properties.In another embodiment, it is recommended that %Li be less than 44 wt%, less than 18 wt%, less than 14.8 wt%, less than 11.9 wt%, less than 9.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.8 wt%, and even less than 0.9 wt%. In one embodiment, when optimizing the properties of the alloy when %Li is between 6.9 wt% and 25.1 wt%, it was found that it is recommended that at least one of %Ca, %Zr, %Al, or %Zn be present in the alloy. In another embodiment, when optimizing the mechanical properties of the alloy when %Li is between 4.9 wt% and 16.1 wt%, it was found that it is recommended that at least one of %Al, %Zr, %Zn, or %Ca be present in the alloy. In some embodiments, when %Li is less than 5.1 wt%, it is recommended that at least one of %Ca or %Zr be present in the alloy when optimizing the mechanical properties of the alloy. In embodiments for optimizing the mechanical properties of an alloy when %Li is between 10.4 wt% and 16.1 wt%, it has been found that the presence of at least one of %Zr, %Zn, or %Ca in the alloy is recommended. In some embodiments for optimizing the mechanical properties of an alloy when %Li is between 1.9 wt% and 20.1 wt%, it is recommended that at least one of %Al or %Zr be present in the alloy, or that the %REE be greater than 600 wtppm. In some embodiments for optimizing the mechanical properties of an alloy when %Li is less than 12.1 wt%, it is recommended that at least one of %Al, %Zr, or %Ca be present in the composition. In some embodiments for optimizing the mechanical properties of an alloy when %Li is less than 7.1 wt%, it is recommended that at least one of %Ca or %Zr be present in the composition. In embodiments where an optimal compromise in the mechanical properties of an alloy is sought when %Li is less than 10.1% by weight, it is recommended that at least one of %Ca, %Zr, %Al, %Zn, or %REE be present in the alloy.Furthermore, in other applications, it has been found that when %Li is less than 55.6 wt%, it is recommended that at least one of %Y or %Sc be included as a compositional element of the alloy in separate embodiments, individually or in total, exceeding 0.006 wt%, 0.01 wt%, 0.3 wt%, and even 1.1 wt%. In embodiments relating to mechanical properties when %Li is less than 30.6 wt%, it is recommended that at least one of %Y, %Sc, or %Zr be present in the alloy. In another embodiment, it is recommended that they individually or in total exceed 0.08 wt%, 0.6 wt%, and even 1.1 wt%. In yet another embodiment, when %Li is less than 26.6 wt%, the above values ​​of %Y, %Sc, or %Zr are preferred. In embodiments relating to mechanical properties when %Li is less than 26.6 wt%, it is recommended that at least one of %Ca, %Y, or %Sc be present in the alloy. In another embodiment, it is recommended that they be greater than 0.01% by weight, 0.1% by weight, 0.6% by weight, or even 1.2% by weight individually or in total. Rare earth elements (%REE) refer to the 17 chemical elements, 15 lanthanides, and the set of scandium and yttrium from the periodic table. In one embodiment, it has been found that the presence of %REE in the alloy is desirable. In another embodiment, it is desirable to have more than 600 ppm by weight, more than 0.01% by weight, and even more than 0.1% by weight. In yet another embodiment, it is desirable to have %REE in the alloy when %Li is less than 5.1% by weight. It is also desirable to have %REE in the alloy when %Li is less than 30.6% by weight, or less than 26.6% by weight. In yet another embodiment, it is desirable to have at least 10 ppm by weight, at least 100 ppm by weight, at least 0.01% by weight, at least 0.16% by weight, and even more than 0.6% by weight. In some embodiments, it has been found that the presence of at least one of %Ce, %La, and %Y in the %REE is desirable to improve the mechanical properties. We have found that in some embodiments, it is desirable to have at least one of %Nd or %Gd in %REE to improve the mechanical properties. In embodiments where %Li is between 6.9% and 25.1%, it is recommended that at least one of %REE be present in the alloy to improve the mechanical properties. In some embodiments, at least one of %Gd, %Nd, or %Y is included in %REE. In other embodiments, at least %Gd, or at least %Y, or at least %Nd is included in %REE. There are applications where magnesium alloys benefit from a high aluminum (%Al) content. In some embodiments, %Al helps to improve the cost-effectiveness of the alloy. Also in some embodiments, %Al helps to improve the mechanical properties of the alloy. In some embodiments, particularly when appropriately composed with elements present in other alloys, %Al contributes to improved creep resistance. In some embodiments, particularly when appropriately composed with elements present in other alloys, %Al contributes to improved corrosion resistance. %Al can contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Al becomes the dominant element of the alloy. This may lead to the alloy ultimately being considered strictly an aluminum alloy or an aluminum-lithium alloy. In other embodiments, it is recommended that the %Al content be greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In some embodiments to further emphasize the aforementioned properties, higher %Al content is recommended. In other embodiments, it is recommended that %Al be greater than 11.2 wt%, 12.2 wt%, 14.2 wt%, 15.2 wt%, 16 wt%, 18 wt%, and even greater than 26 wt%. As mentioned above, in some embodiments, %Al can be the main element of the alloy. In other embodiments, it is recommended that %Al be greater than 36 wt%, 42 wt%, and even greater than 52 wt%. In some embodiments, it is necessary to control that the total amount of %Al is not excessive. We have found that if the total amount of %Al is excessive, undesirable compromises in corrosion resistance and mechanical properties may occur. In other embodiments, it is recommended that %Al be less than 44 wt%, less than 18 wt%, less than 14.8 wt%, less than 11.9 wt%, less than 9.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.2 wt%, and even less than 0.8 wt%. In some embodiments, %Al is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high lanthanum (%La) content. %La helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. For this reason, alloys containing %La in particulate form, which generally do not make much sense, make sense in certain embodiments. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %La, they can be found in solid solutions more readily than in bulk alloys of the same composition. This is a major obstacle for many applications, but it is very beneficial for some applications of magnesium alloys. Magnesium-based alloys containing %La are manufactured in particulate form. In another embodiment, the solid solution contains 5 wt% more %La than the equilibrium solid solubility of %La in the alloy at room temperature (23°C and 1 atm) (for example, if the maximum equilibrium solid solubility of %La in a magnesium alloy at room temperature, 23°C, and 1 atm is 0.01 wt%, then the particulate alloy will have at least 0.0105 wt% %La in the solid solution). Alternatively, it may contain 12% or more by weight, 26% or more by weight, 36% or more by weight, 56% or more by weight, 116% or more by weight, or 216% or more by weight (a suitable method for producing granular alloys to achieve higher values ​​of alloying elements in the solid solution is described in this specification). In some alloys, it is more appropriate to control the %La of the solid solution with a constant term in some applications. In other embodiments, the %La content in the solid solution of alloys produced in granular form is 0.001% or more by weight, 0.006% or more by weight, 0.015% or more by weight, and even 0.03% or more by weight. In some embodiments, %La contributes to the improvement of several mechanical properties. In some embodiments, particularly when appropriately combined with other alloying elements, %La contributes to improved mechanical resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %La contributes to improved corrosion resistance in some applications. %La may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %La has a beneficial effect on %Li.In another embodiment, %La includes amounts greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In a different embodiment to further emphasize the aforementioned properties, even higher %La content is recommended. In another embodiment, %La includes amounts greater than 11.2 wt%, greater than 12.2 wt%, and even greater than 13.2 wt%. There are also embodiments where it is necessary to control that the total amount of %La is not excessive. It has been found that if the total amount of %La is excessive, undesirable compromises in corrosion resistance and mechanical properties may occur. In another embodiment, it is recommended that %La be less than 11.9 wt%, less than 9.8 wt%, less than 8.8 wt%, less than 6.9 wt%, less than 5.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.2 wt%, and even less than 0.8 wt%. There are also embodiments where %La is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high scandium (%Sc) content. %Sc helps facilitate the strengthening of the alloy. This result is surprising, especially since this is also true for some alloys containing %Y. Therefore, alloys containing %Sc in particulate form, which generally don't make much sense, do make sense in certain embodiments. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Sc, it is possible to find it in solid solutions more often than in bulk alloys of the same composition. While this is a major obstacle for many applications, it is very beneficial for some applications of magnesium alloys. Magnesium-based alloys containing %Sc are manufactured in particulate form. In another embodiment, the solid solution contains 5% or more by weight of %Sc than the equilibrium solid solubility of %Sc in the alloy at room temperature, 23°C, and 1 atm, or 12% or more by weight, 26% or more by weight, 56% or more by weight, 116% or more by weight, or 216% or more by weight. In some alloys, there are applications where it is more appropriate to control the %Sc of the solid solution with a constant term. In other embodiments, the %Sc content in solid solutions of alloys manufactured in particulate form is 12.2% by weight or more, 12.6% by weight or more, 14.4% by weight or more, and even 17.5% by weight or more. In some embodiments, %Sc contributes to the improvement of several mechanical properties. In some embodiments, %Sc contributes to the improvement of mechanical resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Sc contributes to improved creep resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Sc contributes to improved corrosion resistance in certain applications. %Sc may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Sc has a positive effect on %Li. In other embodiments, %Sc includes over 0.06% by weight, over 0.6% by weight, over 1.2% by weight, over 2.2% by weight, over 3.2% by weight, over 5.3% by weight, over 7.8% by weight, and even over 10.1% by weight. In different embodiments to further emphasize the aforementioned properties, even higher %Sc content is recommended. In another embodiment, %Sc includes more than 11.2% by weight, more than 12.2% by weight, more than 13.2% by weight, more than 15.2% by weight, and more than 17.2% by weight.In some embodiments, it is necessary to control the total amount of %Sc to ensure it is not excessive. We have found that if the total amount of %Sc is excessive, it may result in undesirable compromises in corrosion resistance and mechanical properties. The use of %Sc when it may be possible to achieve very desirable mechanical properties is just one example of many other high-cost alloying elements (in some embodiments, this is considered high-cost according to the following examples: >$23 / Kg, >$102 / Kg, >$252 / Kg, >$520 / Kg, and even >$1020 / Kg). However, this cost must be considered from an economic standpoint to use the amount required for the desired application. In other embodiments, it is recommended that %Sc be less than 14.8 wt%, less than 11.9 wt%, less than 9.8 wt%, less than 8.8 wt%, less than 6.9 wt%, less than 5.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.2 wt%, and even less than 0.8 wt%. There are also embodiments in which %Sc is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from high lanthanum and scandium (%La+%Sc) content. %La+%Sc helps facilitate strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. For this reason, alloys containing %La+%Sc in particulate form, which generally does not make much sense, make sense in certain embodiments. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %La+%Sc, they can be found in solid solutions more readily than in bulk alloys of the same composition. %La+%Sc contributes to improvements in several mechanical properties. In some embodiments, %La+%Sc contributes to improved creep resistance, especially when properly composed with elements present in other alloys. In some embodiments, %La+%Sc contributes to improved corrosion resistance, especially when properly composed with elements present in other alloys. %La+%Sc may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %La+%Sc has a positive effect on %Li. In another embodiment, %La+%Sc includes amounts greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In a different embodiment to further emphasize the aforementioned properties, even higher %La+%Sc content is recommended. In another embodiment, %La+%Sc includes amounts greater than 11.2 wt%, greater than 16.2 wt%, greater than 21.2 wt%, greater than 25.2 wt%, and even greater than 31.2 wt%. There are also embodiments where it is necessary to control that the total amount of %La+%Sc is not excessive. We have found that if the total amount of %La+%Sc is excessive, it may result in undesirable compromises in corrosion resistance and mechanical properties. In other embodiments, it is recommended that %La+%Sc be less than 28.8% by weight, less than 18.9% by weight, less than 9.8% by weight, less than 8.8% by weight, less than 6.9% by weight, less than 5.8% by weight, less than 4.1% by weight, less than 2.8% by weight, less than 1.2% by weight, and even less than 0.8% by weight. There are also embodiments in which %La+%Sc is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high calcium (%Ca) content. In some embodiments, %Ca contributes to improved mechanical properties. In some embodiments, %Ca contributes to improved creep resistance, especially when appropriately composed with elements present in other alloys. In some embodiments, %Ca contributes to improved corrosion resistance, especially when appropriately composed with elements present in other alloys. %Ca may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Ca has a positive effect on %Li. In other embodiments, %Ca includes over 0.06 wt%, over 0.1 wt%, over 0.6 wt%, over 1.2 wt%, over 2.2 wt%, over 3.2 wt%, over 5.3 wt%, over 7.8 wt%, and even over 10.1 wt%. In different embodiments to further emphasize the aforementioned properties, even higher %Ca content is recommended. In other embodiments, %Ca includes over 11.2 wt%, over 12.2 wt%, and even over 13.2 wt%. In some embodiments, it is necessary to control that the total amount of %Ca is not excessive. We have found that if the total amount of %Ca is excessive, undesirable compromises in corrosion resistance and mechanical properties may occur. In other embodiments, it is recommended that %Ca be less than 11.9 wt%, less than 9.8 wt%, less than 8.8 wt%, less than 6.9 wt%, less than 5.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.2 wt%, and even less than 0.8 wt%. In some embodiments, we have found that the presence of at least one of %Ca, %Zr, %Al, or %Zn in the alloy is recommended for improved mechanical properties. When %Li is less than 56.6 wt, in another embodiment, it is recommended that the presence of %Ca be greater than 0.01 wt%, greater than 0.2 wt%, and even greater than 0.9 wt%. When %Li is less than 30.6 wt%, it is recommended that the presence of %Ca be greater than 100 wt ppm, greater than 0.16 wt%, and even greater than 0.8 wt%. Furthermore, there are embodiments in which %Ca is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high beryllium (%Be) content. %Be helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. Therefore, alloys containing %Be in particulate form, which generally do not make much sense, do make sense in certain embodiments. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Be, they can be found in solid solutions more readily than in bulk alloys of the same composition. This is a major obstacle for many applications, but it is very beneficial for some applications of magnesium alloys. Magnesium-based alloys containing %Be are manufactured in particulate form. In another embodiment, the solid solution contains 5% or more by weight of %Be than the equilibrium solid solubility of %Be in the alloy at room temperature, 23°C, and 1 atm, or 12% or more by weight, 26% or more by weight, 56% or more by weight, 116% or more by weight, or 216% or more by weight. In some alloys, there are applications where it is more appropriate to control the %Be of the solid solution with a constant term. In some embodiments, %Be contributes to the improvement of several mechanical properties. In some embodiments, particularly when appropriately combined with other alloying elements, %Sc contributes to improved creep resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Be also contributes to improved corrosion resistance. %Be may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Be has a positive effect on %Li. In other embodiments, %Be includes over 0.06 wt%, over 0.6 wt%, over 1.2 wt%, over 2.2 wt%, over 3.2 wt%, over 5.3 wt%, over 7.8 wt%, and even over 10.1 wt%. In different embodiments to further emphasize the aforementioned properties, even higher %Be content is recommended. In other embodiments, %Be includes over 11.2 wt%, over 12.2 wt%, and even over 13.2 wt%. In some embodiments, it is necessary to control that the total amount of %Be is not excessive. We have found that when the total amount of %Be is excessive, undesirable compromises between corrosion resistance and mechanical properties may occur.In other embodiments, it is recommended that %Be be less than 11.9% by weight, less than 9.8% by weight, less than 8.8% by weight, less than 6.9% by weight, less than 5.8% by weight, less than 4.1% by weight, less than 2.8% by weight, less than 1.2% by weight, and even less than 0.8% by weight. There are also embodiments in which %Be is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high yttrium (%Y) content. In some embodiments, %Y contributes to improvements in several mechanical properties. In some applications, %Y contributes to improved corrosion resistance, especially when appropriately combined with other alloying elements. %Y may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Y has a positive effect on %Li. In other embodiments, %Y includes over 0.06 wt%, over 0.6 wt%, over 1.2 wt%, over 2.2 wt%, over 3.2 wt%, over 5.3 wt%, over 7.8 wt%, and even over 10.1 wt%. In different embodiments to further emphasize the aforementioned properties, even higher %Y content is recommended. In other embodiments, %Y includes over 11.2 wt%, over 16.2 wt%, over 21.2 wt%, and even over 25.2 wt%. In some embodiments, it is necessary to control that the total amount of %Y is not excessive. We found that when the total amount of %Y is excessive, undesirable compromises in corrosion resistance and mechanical properties can occur. In another embodiment, it is recommended that %Y be less than 28.8 wt%, less than 18.8 wt%, less than 14.9 wt%, less than 9.8 wt%, less than 8.8 wt%, less than 6.9 wt%, less than 5.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.2 wt%, and even less than 0.8 wt%. When manufacturing particulate magnesium alloys containing %Y, we found that if the particles are metal powder and properly manufactured, it is possible to find a higher percentage of %Y in solid solutions than in bulk alloys of the same composition. This is a major obstacle for many applications, but is very beneficial for some applications of magnesium alloys. Magnesium-based alloys containing %Y are manufactured in particulate form. In another embodiment, the solid solution contains 5% by weight or more of %Y than the equilibrium solid solubility of %Y in the alloy at room temperature, 23°C, and 1 atm, or contains 12% by weight or more, 26% by weight or more, 56% by weight or more, 116% by weight or more, or 216% by weight or more. In some alloys, there are applications where it is more appropriate to control the %Y of the solid solution with a constant term.In another embodiment, the %Y content in the solid solution of the alloy manufactured in particulate form is 1.8% by weight or more, 2.1% by weight or more, 2.6% by weight or more, 3.2% by weight or more, 4.6% by weight or more, 6.1% by weight or more, and even 8.1% by weight or more. There are also embodiments in which %Y is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from high lanthanum, calcium, beryllium, yttrium, and scandium (%Y+%Ca+%Be+%La+%Sc) content. %Y+%Ca+%Be+%La+%Sc helps facilitate strengthening of the alloy. In some embodiments, %Y+%Ca+%Be+%La+%Sc contributes to improved mechanical properties. In some embodiments, especially when properly composed with elements present in other alloys, %Y+%Ca+%Be+%La+%Sc contributes to improved creep resistance. In some embodiments, especially when properly composed with elements present in other alloys, %Y+%Ca+%Be+%La+%Sc contributes to improved corrosion resistance. %Y+%Ca+%Be+%La+%Sc may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, the total amount of %Y+%Ca+%Be+%La+%Sc has a positive effect on %Li. In another embodiment, %Y+%Ca+%Be+%La+%Sc includes amounts greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In a different embodiment to further emphasize the aforementioned properties, even higher %Y+%Ca+%Be+%La+%Sc content is recommended. In another embodiment, %Y+%Ca+%Be+%La+%Sc includes amounts greater than 11.2 wt%, greater than 16.2 wt%, greater than 21.2 wt%, greater than 25.2 wt%, and even greater than 31.2 wt%. There are also embodiments where it is necessary to control that the total amount of %Y+%Ca+%Be+%La+%Sc is not excessive. We have found that when the total amount of %Y+%Ca+%Be+%La+%Sc is excessive, undesirable compromises in corrosion resistance and mechanical properties may occur. In other embodiments, it is recommended that %Y+%Ca+%Be+%La+%Sc be less than 28.8% by weight, less than 18.9% by weight, less than 9.8% by weight, less than 8.8% by weight, less than 6.9% by weight, less than 5.8% by weight, less than 4.1% by weight, less than 2.8% by weight, less than 1.2% by weight, and even less than 0.8% by weight. There are also embodiments in which %Y+%Ca+%Be+%La+%Sc is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high ytterbium (%Yb) content. %Yb helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Yb, it can be found in more solid solutions, as shown in the case of %Sc, which is also applicable in the case of %Yb. In some alloys, there are applications where it is more appropriate to control the %Yb of the solid solution with a constant term. In another embodiment, the %Yb content in the solid solution of alloys manufactured in particle form is 0.01% by weight or more, 0.1% by weight or more, 0.4% by weight or more, 1.1% by weight or more, 1.6% by weight or more, 2.1% by weight or more, and even 3.1% by weight or more. There are also embodiments where %Yb contributes to the improvement of several mechanical properties. In some embodiments, %Yb contributes to improved mechanical resistance. In some embodiments, %Yb contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, particularly when appropriately combined with other alloying elements, %Yb contributes to improved corrosion resistance in certain applications. %Yb may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Yb has a beneficial effect on %Li. The weight percentages of %Be disclosed above can also be applied to the %Yb content. Furthermore, there are embodiments in which %Yb is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high dysprosium (%Dy) content. %Dy helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Dy, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Dy. In some alloys, there are applications where it is more appropriate to control the %Dy of the solid solution with a constant term. In another embodiment, the %Dy content in the solid solution of alloys manufactured in particle form is 5.6% by weight or more, 6.6% by weight or more, 8.6% by weight or more, 12.6% by weight or more, 16% by weight or more, and even 22% by weight or more. In some embodiments, %Dy contributes to the improvement of several mechanical properties. In some embodiments, %Dy contributes to improved mechanical resistance. In some embodiments, %Dy contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, %Dy may also contribute to improved corrosion resistance. %Dy may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Dy has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to the %Dy content. Furthermore, there are embodiments in which %Dy is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high thorium (%Th) content. %Th helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Th, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Th. In some alloys, there are applications where it is more appropriate to control the %Th of the solid solution with a constant term. There are also embodiments where %Th contributes to the improvement of several mechanical properties. There are also embodiments where %Th contributes to improved mechanical resistance. In some embodiments, %Th contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, %Th may also contribute to improved corrosion resistance. %Th may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Th has a positive effect on %Li. The weight percentages of %La disclosed above can also be applied to %Th content. There are also embodiments where %Th is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high total content of ytterbium, dysprosium, and thorium (%Yb+%Dy+%Th). %Yb+%Dy+%Th helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. Therefore, alloys containing %Yb+%Dy+%Th in particle form, which generally does not make much sense, make sense in certain embodiments. In some embodiments, %Yb+%Dy+%Th contributes to improved mechanical properties. In some embodiments, %Yb+%Dy+%Th contributes to improved creep resistance, especially when properly composed with elements in other alloys. In some embodiments, %Yb+%Dy+%Th contributes to improved corrosion resistance, especially when properly composed with elements in other alloys. %Yb+%Dy+%Th may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, the total amount of %Yb+%Dy+%Th has a positive effect on %Li. In another embodiment, %Yb+%Dy+%Th includes amounts greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In a different embodiment to further emphasize the aforementioned properties, even higher %Yb+%Dy+%Th content is recommended. In another embodiment, %Yb+%Dy+%Th includes amounts greater than 11.2 wt%, greater than 16.2 wt%, greater than 21.2 wt%, greater than 25.2 wt%, and even greater than 31.2 wt%. There are also embodiments where it is necessary to control that the total amount of %Yb+%Dy+%Th is not excessive. We have found that when the total amount of %Yb+%Dy+%Th is excessive, undesirable compromises in corrosion resistance and mechanical properties may occur. In other embodiments, it is recommended that %Yb+%Dy+%Th be less than 28.8% by weight, less than 18.9% by weight, less than 9.8% by weight, less than 8.8% by weight, less than 6.9% by weight, less than 5.8% by weight, less than 4.1% by weight, less than 2.8% by weight, less than 1.2% by weight, and even less than 0.8% by weight. There are also embodiments in which %Yb+%Dy+%Th is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high total content of ytterbium, beryllium, dysprosium, and thorium (%Yb+%Be+%Dy+%Th). %Yb+%Be+%Dy+%Th helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. Therefore, alloys containing %Yb+%Be+%Dy+%Th in particle form, which generally does not make much sense, make sense in certain embodiments. In some embodiments, %Yb+%Be+%Dy+%Th contributes to improved mechanical properties. In some embodiments, especially when properly composed with elements present in other alloys, %Yb+%Be+%Dy+%Th contributes to improved creep resistance. In some embodiments, especially when properly composed with elements present in other alloys, %Yb+%Be+%Dy+%Th contributes to improved corrosion resistance. %Yb+%Be+%Dy+%Th may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In one embodiment, the total amount of %Yb+%Be+%Dy+%Th has a positive effect on %Li. In another embodiment, %Yb+%Be+%Dy+%Th includes amounts greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In a different embodiment to further emphasize the aforementioned properties, even higher %Yb+%Be+%Dy+%Th content is recommended. In another embodiment, %Yb+%Be+%Dy+%Th includes amounts greater than 11.2 wt%, greater than 16.2 wt%, greater than 21.2 wt%, greater than 25.2 wt%, and even greater than 31.2 wt%. In some embodiments, it is necessary to control that the total amount of %Yb+%Be+%Dy+%Th is not excessive. We found that when the total amount of %Yb+%Be+%Dy+%Th is excessive, an undesirable compromise between corrosion resistance and mechanical properties may occur. In another embodiment, it is recommended that %Yb+%Be+%Dy+%Th be less than 28.8 wt%, less than 18.9 wt%, less than 9.8 wt%, less than 8.8 wt%, less than 6.9 wt%, less than 5.8 wt%, less than 4.1 wt%, less than 2.8 wt%, less than 1.2 wt%, and even less than 0.8 wt%.Furthermore, there are embodiments in which %Yb+%Be+%Dy+%Th are either absent or present as undesirable impurities. There are applications in which magnesium alloys benefit from a high total content of ytterbium, beryllium, dysprosium, calcium, yttrium, lanthanum, scandium, and thorium (%Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc). %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc helps facilitate strengthening of the alloy. In some embodiments, %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc contributes to improved mechanical properties. In some embodiments, particularly when properly composed with elements present in other alloys, %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc contributes to improved creep resistance. In some embodiments, particularly when properly composed with elements present in other alloys, %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc contributes to improved corrosion resistance. %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In one embodiment, the total amount of %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc has a positive effect on %Li. In another embodiment, %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc may be present in amounts greater than 0.06 wt%, greater than 0.6 wt%, greater than 1.2 wt%, greater than 2.2 wt%, greater than 3.2 wt%, greater than 5.3 wt%, greater than 7.8 wt%, and even greater than 10.1 wt%. In different embodiments to further emphasize the aforementioned properties, even higher %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc content is recommended. In another embodiment, %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc includes amounts greater than 11.2% by weight, greater than 16.2% by weight, greater than 21.2% by weight, greater than 25.2% by weight, and even greater than 31.2% by weight. In some embodiments, it is necessary to control that the total amount of %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc is not excessive. We have found that when the total amount of %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc is excessive, undesirable compromises in corrosion resistance and mechanical properties may occur.In other embodiments, it is recommended that %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc be present in amounts less than 28.8% by weight, less than 18.9% by weight, less than 9.8% by weight, less than 8.8% by weight, less than 6.9% by weight, less than 5.8% by weight, less than 4.1% by weight, less than 2.8% by weight, less than 1.2% by weight, and even less than 0.8% by weight. In some embodiments, %Yb+%Be+%Dy+%Th+%Ca+%Y+%La+%Sc may be absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high gadolinium (%Gd) content. %Gd helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Gd, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Gd. In some alloys, there are applications where it is more appropriate to control the %Gd of the solid solution with a constant term. In another embodiment, the %Gd content in the solid solution of alloys manufactured in particle form is 0.01% by weight or more, 0.05% by weight or more, 0.1% by weight or more, 1.1% by weight or more, 3.1% by weight or more, 5.1% by weight or more, 10.5% by weight or more, and even 14% by weight or more. In some embodiments, %Gd contributes to the improvement of several mechanical properties. In some embodiments, %Gd contributes to improved mechanical resistance. In some embodiments, %Gd contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, particularly when appropriately combined with other alloying elements, %Gd contributes to improved corrosion resistance in certain applications. %Gd may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Gd has a beneficial effect on %Li. The weight percentages of %Sc disclosed above can also be applied to the %Gd content. Furthermore, there are embodiments in which %Gd is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high neodymium (%Nd) content. %Nd helps facilitate strengthening of the alloy. This result is surprising, especially since this is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Nd, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Nd. In some alloys, there are applications where it is more appropriate to control the %Nd of the solid solution with a constant term. In another embodiment, the %Nd content in the solid solution of alloys manufactured in particle form is 0.001% by weight or more, 0.01% by weight or more, 0.055% by weight or more, 0.12% by weight or more, 0.22% by weight or more, 0.6% by weight or more, 1.1% by weight or more, and even 2.1% by weight or more. There are also embodiments where %Nd contributes to the improvement of several mechanical properties. There are also embodiments where %Nd contributes to the improvement of mechanical resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Nd contributes to improved creep resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Nd also contributes to improved corrosion resistance in certain applications. %Nd may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Nd has a beneficial effect on %Li. The weight percentages of %Sc disclosed above can also be applied to the %Nd content. There are also embodiments in which %Nd is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high samarium (%Sm) content. %Sm helps facilitate strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Sm, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Sm. In some alloys, there are applications where it is more appropriate to control the %Sm of the solid solution with a constant term. In another embodiment, the %Sm content in the solid solution of alloys manufactured in particle form is 0.001% by weight or more, 0.01% by weight or more, 0.055% by weight or more, 0.12% by weight or more, 0.22% by weight or more, 0.6% by weight or more, 1.1% by weight or more, and even 2.1% by weight or more. There are also embodiments where %Sm contributes to the improvement of several mechanical properties. There are also embodiments where %Sm contributes to the improvement of mechanical resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Sm contributes to improved creep resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Sm also contributes to improved corrosion resistance in certain applications. %Sm may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Sm has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to the %Sm content. There are also embodiments in which %Sm is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high praseodymium (%Pr) content. %Pr helps facilitate strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Pr, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Pr. In some alloys, there are applications where it is more appropriate to control the %Pr of the solid solution with a constant term. In another embodiment, the %Pr content in the solid solution of alloys manufactured in particle form is 0.001% by weight or more, 0.005% by weight or more, 0.01% by weight or more, 0.055% by weight or more, 0.12% by weight or more, 0.22% by weight or more, 0.42% by weight or more, and even 0.6% by weight or more. In some embodiments, %Pr contributes to the improvement of several mechanical properties. In some embodiments, %Pr contributes to improved mechanical resistance. In some embodiments, %Pr contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, particularly when appropriately combined with other alloying elements, %Pr contributes to improved corrosion resistance in certain applications. %Pr may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Pr has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to %Pr content. Furthermore, there are embodiments where %Pr is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high holmium (%Ho) content. %Ho helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Ho, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Ho. In some alloys, there are applications where it is more appropriate to control the %Ho of the solid solution with a constant term. In another embodiment, the %Ho content in the solid solution of alloys manufactured in particle form is 10.6% by weight or more, 12.2% by weight or more, 14% by weight or more, 16% by weight or more, 18% by weight or more, 20.5% by weight or more, 21.1% by weight or more, and even 22.1% by weight or more. There are also embodiments where %Ho contributes to the improvement of several mechanical properties. In some embodiments, %Ho contributes to improved mechanical resistance. In some embodiments, %Ho contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, particularly when appropriately combined with other alloying elements, %Ho contributes to improved corrosion resistance in certain applications. %Ho may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Ho has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to the %Ho content. Furthermore, there are embodiments where %Ho is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high terbium (%Tb) content. %Tb helps facilitate the strengthening of the alloy. This result is surprising, especially since this is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Tb, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Tb. In some alloys, there are applications where it is more appropriate to control the %Tb of the solid solution with a constant term. In another embodiment, the %Tb content in the solid solution of alloys manufactured in particle form is 2.1% by weight or more, 2.6% by weight or more, 3.2% by weight or more, 5.2% by weight or more, 8.2% by weight or more, 10.6% by weight or more, 11.1% by weight or more, and even 13.1% by weight or more. There are also embodiments where %Tb contributes to the improvement of several mechanical properties. There are also embodiments where %Tb contributes to the improvement of mechanical resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Tb contributes to improved creep resistance. In some embodiments, particularly when appropriately combined with other alloying elements, %Tb also contributes to improved corrosion resistance in certain applications. %Tb may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Tb has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to the %Tb content. There are also embodiments in which %Tb is absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high thulium (%Tm) content. %Tm helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powder and have a high proportion of properly manufactured %Tm, it can be found in more solid solutions, as shown in the case of %La, which is also applicable in the case of %Tm. In some alloys, there are applications where it is more appropriate to control the %Tm of the solid solution with a constant term. In another embodiment, the %Tm content in the solid solution of alloys manufactured in particle form is 10.6% by weight or more, 12.2% by weight or more, 14% by weight or more, 16% by weight or more, 18% by weight or more, 20.5% by weight or more, 21.1% by weight or more, and even 22.1% by weight or more. There are also embodiments where %Tm contributes to the improvement of several mechanical properties. There are also embodiments where %Tm contributes to improved mechanical resistance. In some embodiments, %Tm contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, particularly when appropriately combined with other alloying elements, %Tm contributes to improved corrosion resistance in certain applications. %Tm may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Tm has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to the %Tm content. Furthermore, there are embodiments in which %Tm is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high erbium (%Er) content. %Er helps facilitate strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powders and have a high proportion of properly manufactured %Er, it can be found in more solid solutions, as shown in the case of %La, which is also applicable to %Er. In some alloys, there are applications where it is more appropriate to control the %Er of the solid solution in a constant term, at the same level as disclosed above for %Ho, which is also applicable to the content of %Er. There are also embodiments where %Er contributes to the improvement of several mechanical properties. There are also embodiments where %Er contributes to improved mechanical resistance. In some embodiments, %Er contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, %Er contributes to improved corrosion resistance, especially when properly combined with other alloying elements. %Er may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Er has a positive effect on %Li. The weight percentage of %La disclosed above can also be applied to the %Er content. Furthermore, there are embodiments in which %Er is either absent or present as an undesirable impurity. There are applications where magnesium alloys benefit from a high lutetium (%Lu) content. %Lu helps facilitate the strengthening of the alloy. This result is surprising, especially since it is also true for some alloys containing %Y. In fact, we have found that when the particles are metal powders and have a high proportion of properly manufactured %Lu, it can be found in more solid solutions, as shown in the case of %La, which is also applicable to %Lu. In some alloys, there are applications where it is more appropriate to control the %Lu of the solid solution in a constant term, at the same level as disclosed above for %Ho, which is also applicable to the content of %Lu. There are also embodiments where %Lu contributes to the improvement of several mechanical properties. There are also embodiments where %Lu contributes to improved mechanical resistance. In some embodiments, %Lu contributes to improved creep resistance, especially when properly combined with other alloying elements. In some embodiments, %Lu contributes to improved corrosion resistance, especially when properly combined with other alloying elements. %Lu may also contribute as a three-dimensional element to many of the properties described for other alloying elements. In some embodiments, %Lu has a beneficial effect on %Li. The weight percentages of %La disclosed above can also be applied to the %Lu content. Furthermore, there are embodiments in which %Lu is either absent or present as an undesirable impurity. In some embodiments, lutetium (%Lu) can be partially or completely replaced with europium (%Eu). Also, in some embodiments, lutetium (%Lu) can be partially or completely replaced with promethium (%Pr). We discovered that the relationships between specific alloying elements are important when considering the maximization of structural resistance under combustion and cost-effectiveness. We found that there are embodiments where it is important to establish a relationship between %Ca and %Li. We also found that there are embodiments where it is important to establish relationships between %Ca, %Al, and %Li. In other applications of alloy manufacturing, the alloy contains more than 1.2 wt%, or more than 2.2 wt%, more than 3.2 wt%, more than 5.3 wt%, or more than 7.8 wt% of %Ca. In other applications of alloy manufacturing, the alloy contains less than 11.9 wt%, less than 9.8 wt%, less than 8.8 wt%, and even less than 6.9 wt% of %Ca. This is another embodiment where %Li is contained in amounts greater than 2.3 wt%, or greater than 4.2 wt%, 5.2 wt%, 6.9 wt%, 7.8 wt%, 10.2 wt%, 11.2 wt%, 12.2 wt%, 14.2 wt%, 16 wt%, 18 wt%, or 26 wt%. In another embodiment for balancing different mechanical properties, it is recommended that %Ca / (%Li+%Al) be greater than 0.15, greater than 0.28, greater than 0.56, greater than 0.62, greater than 0.66, greater than 0.76, and greater than 1.1 (wherein %Ca, %Li, and %Al are the atomic weights of calcium, lithium, and aluminum). In yet another embodiment, it is recommended that %Ca / (%Li+%Al) be less than 1.9, less than 1.4, less than 0.98, less than 0.88, less than 0.74, and less than 0.68. In another embodiment, %Ca / %Li must be greater than 0.07, greater than 0.22, greater than 0.52, greater than 0.62, greater than 0.66, greater than 0.76, and even greater than 1.1. In yet another embodiment, it is recommended that %Ca / %Li be less than 1.4, less than 0.98, less than 0.74, less than 0.68, less than 0.58, and even less than 0.48. It has been found that there are also applications where the sum of %Nd and %Gd must not be zero (there must be at least one, and obviously the general proportions described in the previous paragraph apply).Furthermore, it has been discovered that there are applications in which %Y must be present (this applies throughout this specification, but where a specific weight or atomic percentage is not specified, as in the precise proportion description in the previous paragraph, the more general form of description applies. Also, not all proportions of the alloying elements listed are ultimately essential. That is, in this embodiment, %Y must be present and therefore the alloy cannot be used without %Y, but in the aforementioned embodiment, it may be beneficial to include %Sc. That is, embodiments optimized for applications in which %Sc is effective include %Sc, but embodiments without %Sc are also possible in this embodiment). It has also been discovered that there are embodiments in which %Zr must be present. In some embodiments, the inclusion of %Zr is effective in achieving the necessary mechanical properties, and in other embodiments, the %Zr content is greater than 0.06 wt%, greater than 0.1 wt%, greater than 0.31 wt%, or greater than 0.41 wt%. When %Li is greater than 11.1 wt%, the inclusion of %Zr in the alloy is recommended to balance the mechanical properties. While the inclusion of zinc (%Zn) in magnesium alloys is recommended in some applications, it has been found that in other applications it can actually be an impurity. In another embodiment, a %Zn content of 0.1% by weight or more, 0.6% by weight or more, 1.2% by weight or more, 4.2% by weight or more, 6.2% by weight or more, 8.2% by weight or more, or 11% by weight or more is recommended. Conversely, there are applications where %Zn content is extremely harmful. In another embodiment, a content of less than 12.8% by weight, less than 9.6% by weight, less than 9.4% by weight, less than 6.3% by weight, less than 4.2% by weight, less than 2.3% by weight, less than 1.8% by weight, less than 0.2% by weight, less than 0.08% by weight, and even less than 0.02% by weight is recommended. To achieve the desired mechanical properties, in another embodiment, a %Zn content of more than 0.04% by weight, more than 0.18% by weight, more than 0.36% by weight, or more than 0.43% by weight is recommended. Clearly, it can be applied to all elements in a particular application, but there may be cases where the nominal value of the content of a particular element is required to be 0%. In certain applications, the use of alloys containing %Ga, %Bi, %Rb, %Cd, %Cs, %Sn, %Pb, %Zn, or %In is particularly noteworthy. Among these, the use of these low-melting-point-promoting elements is especially important. In other embodiments, these elements are used in conjunction with %Ga content exceeding 0.8 wt%, 2.2 wt%, 5.2 wt%, 12 wt%, 21 wt%, or 54 wt%. In some embodiments, the %Ga content in the alloy is exceeding 32 wt ppm, 0.0001 wt%, 0.015 wt%, or 0.1 wt%. Depending on the desired properties of the magnesium alloy, in other embodiments, it is recommended that the %Ga content be less than 30 wt%, 29 wt%, 22 wt%, 16 wt%, 9 wt%, 6.4 wt%, 4.1 wt%, 3.2 wt%, 2.4 wt%, or even less than 1.2 wt%. In some embodiments of any application, %Ga may be harmful or suboptimal for any reason. In such applications, it is recommended that the magnesium alloy be free of %Ga. In some applications, it has been found that all or part of %Ga can be substituted for %Ga+%Bi in the amounts of %Bi specified in this specification. In some applications, total substitution, i.e., the absence of %Ga, is effective. In some applications, it has been found worthwhile to consider partially replacing %Ga or %Bi with %Cd, %Cs, %Sn, %Pb, %Zn, %Rb, or %In in the amounts described above. In some applications, it may be worthwhile to consider the absence of any of the above elements, in which case it can be considered as %Ga+%Bi+%Cd+%Cs+%Sn+%Pb+%Zn+%Rb+%In (i.e., this sum matches the given value, but a particular element may not be present, and the nominal content may be 0%. This is effective in certain applications where the element in question is harmful or suboptimal for any reason). These elements do not necessarily need to be composed in a pure state. Given that the melting points of the alloys in question are sufficiently low, the use of alloys of these elements is often economical. In some applications, it is more effective to use alloys containing these elements directly, rather than composing them separately. There are also applications where the use of particles primarily composed of these elements is worth considering. In such cases, the sum of %Ga+%Bi+%Cd+%Cs+%Sn+%Pb+%Zn+%Rb+%In is, in other embodiments, greater than 52 wt%, or greater than 76 wt%, greater than 86 wt%, or greater than 98 wt%. The final content of these elements in the component depends on the volume fraction used, but is variable within the above range in some applications. A typical example is when liquid-phase sintering is performed at low temperatures using %Sn and %Ga alloys, where there is a high probability of breaking down an oxide film that may contain other particles (usually many particles). The %Sn and %Ga content is adjusted with reference to the equilibrium phase diagram to control the required liquid-phase volume content and the volume proportion of particles in this alloy at various post-processing temperatures. In certain applications, %Sn or %Ga can be partially or completely substituted by other elements in this list (i.e., the alloy may not contain %Sn or %Ga). This is also possible in the case of significant presences of other elements not included in this list, such as %Mg. Furthermore, this applies to recommended alloying elements for a desired alloy in a specific application. It has been found that while manganese (%Mn) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Mn content of 0.1% by weight or more, 0.6% by weight or more, 1.2% by weight or more, 4.2% by weight or more, 6.2% by weight or more, 8.2% by weight or more, or 11% by weight or more is recommended. Conversely, there are applications where %Mn content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 12.8% by weight, less than 9.6% by weight, less than 9.4% by weight, less than 6.3% by weight, less than 4.2% by weight, less than 2.3% by weight, less than 1.8% by weight, less than 0.2% by weight, less than 0.08% by weight, and even less than 0.02% by weight is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while zirconium (%Zr) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Zr content of 0.02 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, or 6.2 wt% or more is recommended. Conversely, there are applications where %Zr content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 7.8 wt% or less, less than 6.3 wt% or less, less than 4.2 wt% or less, less than 1.8 wt% or less, less than 0.8 wt% or less, less than 0.48 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in specific applications, but there are cases where the nominal content of a particular element is required to be 0%. It has been found that while boron (%B) is considered an impurity in some applications, its presence is also required in others. Furthermore, it has been discovered that the presence of %B affects the melting point and mechanical properties of alloys. In another embodiment, it is recommended that the %B content be 12 ppm by weight or more, over 37 ppm by weight, 73 ppm by weight or more, and even 130 ppm by weight or more. In yet another embodiment, it is recommended that the %B content be 0.002% by weight or more, 0.01% by weight or more, 0.1% by weight or more, 0.26% by weight or more, 0.3% by weight or more, 0.6% by weight or more, 1.2% by weight or more, 2.2% by weight or more, or 4.2% by weight or more. Conversely, there are applications where the presence of %B is extremely harmful. In another embodiment for balancing mechanical properties, content of less than 3.8 wt%, less than 2.8 wt%, less than 1.8 wt%, less than 0.8 wt%, less than 0.48 wt%, less than 0.18 wt%, less than 0.08 wt%, less than 0.02 wt%, and even less than 0.002 wt% is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal value of the content of a particular element is required to be 0%. The inclusion of at least one of %Al, %Zr, %Zn, %Cd, and %Ca contributes to improved mechanical properties, and in other embodiments, it is recommended to include more than 0.01% by weight, more than 0.1% by weight, or more than 0.7% by weight individually or in total. Magnesium alloys contain at least one of %Ca, %Zr, or %Al, and it is recommended to include more than 0.01% by weight, more than 0.1% by weight, or more than 0.7% by weight in concentrations in other embodiments. These are individual or total values. In other embodiments, the alloy contains at least one of %Ca or %Zr, and it is recommended to include more than 0.01% by weight, more than 0.1% by weight, or more than 0.7% by weight in concentrations in other embodiments. These are individual or total values. It has been found that while copper (%Cu) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Cu content of 0.1% or more, 0.6% or more, 1.2% or more, 4.2% or more, 6.2% or more, 8.2% or more, 11% or more, 16.2% or more, or 21.2% or more is recommended. Conversely, there are applications where %Cu content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8% or more, less than 14.6% or more, less than 9.4% or more, less than 6.3% or more, less than 4.2% or more, less than 2.3% or more, less than 1.8% or more, less than 0.2% or more, less than 0.08% or even less than 0.02% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal content of a particular element is required to be 0%. It has been found that while tantalum (%Ta) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Ta content of 0.02 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 2.2 wt% or more, or 4.2 wt% or more is recommended. Conversely, there are applications where %Ta content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 3.8 wt% or more, less than 2.8 wt% or more, less than 1.8 wt% or more, less than 0.8 wt% or less, less than 0.48 wt% or less, less than 0.18 wt% or less, less than 0.08 wt% or less, less than 0.02 wt% or even less. Clearly, this can be applied to all arbitrary elements in specific applications, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while vanadium (%V) is considered an impurity in some applications, its presence is also required in others. For improved mechanical properties, %V levels of 0.02 wt% or higher, 0.1 wt% or higher, 0.26 wt% or higher, 0.6 wt% or higher, 1.2 wt% or higher, 4.2 wt% or higher, or 6.2 wt% or higher are recommended. Conversely, there are applications where %V content is highly detrimental. In another embodiment for balancing mechanical properties, levels of less than 7.8 wt% or lower, less than 6.3 wt% or lower, less than 4.2 wt% or lower, less than 1.8 wt% or lower, less than 0.8 wt% or lower, less than 0.48 wt% or lower, less than 0.2 wt% or lower, less than 0.08 wt% or lower, and even less than 0.02 wt% are recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal value of a particular element's content is required to be 0%. Nitrogen (%N) is considered an impurity in some applications, while its presence is required in others. For improved mechanical properties, %N content of 0.002 wt% or higher, 0.01 wt% or higher, 0.1 wt% or higher, 0.26 wt% or higher, 0.6 wt% or higher, or 1.2 wt% or higher is recommended. Conversely, there are applications where %N content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 3.8 wt% or lower, less than 2.8 wt% or lower, less than 1.8 wt% or lower, less than 0.8 wt% or lower, less than 0.48 wt% or lower, less than 0.18 wt% or lower, less than 0.08 wt% or lower, and even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in specific applications, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while silicon (%Si) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Si content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, and even 11 wt% or more is recommended. Conversely, there are applications where %Si content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 12.8 wt% or more, less than 9.6 wt% or more, less than 9.4 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or less, less than 2.3 wt% or less, less than 1.8 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal content of a particular element is required to be 0%. It has been found that while iron (%Fe) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Fe content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, 11 wt% or more, 16.2 wt% or more, or 21.2 wt% or more is recommended. Conversely, there are applications where %Fe content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8 wt% or more, less than 14.6 wt% or more, less than 9.4 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or more, less than 2.3 wt% or less, less than 1.8 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal value of the content of a particular element is required to be 0%. It has been found that while nickel (%Ni) is considered an impurity in some applications, its content is also required in others. To improve mechanical properties, it is recommended that %Ni content be 0.1% or more by weight, 0.6% or more by weight, 1.2% or more by weight, 4.2% or more by weight, 6.2% or more by weight, 8.2% or more by weight, 11% or more by weight, 16.2% or more by weight, 21.2% or more by weight, or 31.2% or more by weight. Conversely, there are applications where %Ni content is extremely detrimental. In another embodiment to balance mechanical properties, it is recommended that content be less than 28.8% by weight, less than 18.8% by weight, less than 14.6% by weight, less than 9.4% by weight, less than 6.3% by weight, less than 4.2% by weight, less than 2.3% by weight, less than 1.8% by weight, less than 0.2% by weight, less than 0.08% by weight, and even less than 0.02% by weight. Clearly, it can be applied to all arbitrary elements in a particular application, but there may be cases where the nominal value of the content of a particular element is required to be 0%. It has been found that while chromium (%Cr) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Cr content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, and even 11 wt% or more is recommended. Conversely, there are applications where %Cr content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 12.8 wt% or more, less than 9.6 wt% or more, less than 9.4 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or less, less than 2.3 wt% or less, less than 1.8 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal content of a particular element is required to be 0%. It has been found that while titanium (%Ti) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Ti content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, 11 wt% or more, and even 16.2 wt% or more is recommended. Conversely, there are applications where %Ti content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8 wt% or more, less than 14.6 wt% or more, less than 9.4 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or less, less than 2.3 wt% or less, less than 1.8 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal content of a particular element is required to be 0%. Niobium (%Nb) is considered an impurity in some applications, while its presence is also required in others. For improved mechanical properties, %Nb content of 0.02 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, or 6.2 wt% or more is recommended. Conversely, there are applications where %Nb content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 7.8 wt% or less, less than 6.3 wt% or less, less than 4.2 wt% or less, less than 1.8 wt% or less, less than 0.8 wt% or less, less than 0.48 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while cobalt (%Co) is considered an impurity in some applications, its presence is also required in others. For improved mechanical properties, %Co content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, 11 wt% or more, 16.2 wt% or more, or 21.2 wt% or more is recommended. Conversely, there are applications where %Co content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8 wt%, less than 14.6 wt%, less than 9.4 wt%, less than 6.3 wt%, less than 4.2 wt%, less than 2.3 wt%, less than 1.8 wt%, less than 0.2 wt%, less than 0.08 wt%, and even less than 0.02 wt% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal value of a particular element's content is required to be 0%. It has been found that while molybdenum (%Mo) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Mo content of 0.1% by weight or more, 0.6% by weight or more, 1.2% by weight or more, 4.2% by weight or more, 6.2% by weight or more, 8.2% by weight or more, and even 11% by weight or more is recommended. Conversely, there are applications where %Mo content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 12.8% by weight, less than 9.6% by weight, less than 9.4% by weight, less than 6.3% by weight, less than 4.2% by weight, less than 2.3% by weight, less than 1.8% by weight, less than 0.2% by weight, less than 0.08% by weight, and even less than 0.02% by weight is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while tungsten (%W) is considered an impurity in some applications, its presence is also required in others. For improved mechanical properties, %W content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, 11 wt% or more, 16.2 wt% or more, 21.2 wt% or more, or 31.2 wt% or more is recommended. Conversely, there are applications where %W content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8 wt% or more, less than 14.6 wt% or more, less than 9.4 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or more, less than 2.3 wt% or more, less than 1.8 wt% or more, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, while applicable to all arbitrary elements in specific applications, there are cases where the nominal value of the content of a particular element is required to be 0%. Hafnium (%Hf) is considered an impurity in some applications, while it has been found that hafnium content is required in magnesium alloy applications. For improved mechanical properties, %Hf content of 0.02 wt% or higher, 0.1 wt% or higher, 0.26 wt% or higher, 0.6 wt% or higher, 1.2 wt% or higher, 2.2 wt% or higher, or 4.2 wt% or higher is recommended. Conversely, there are applications where %Hf content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 3.8 wt%, less than 2.8 wt%, less than 1.8 wt%, less than 0.8 wt%, less than 0.48 wt%, less than 0.18 wt%, less than 0.08 wt%, less than 0.02 wt%, and even less than 0.002 wt% is recommended. Clearly, this can be applied to all arbitrary elements in specific applications, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while germanium (%Ge) is considered an impurity in some applications, its presence is also required in others. For improved mechanical properties, %Ge content of 0.1 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, 6.2 wt% or more, 8.2 wt% or more, 11 wt% or more, and even 16.2 wt% or more is recommended. Conversely, there are applications where %Ge content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8 wt% or more, less than 14.6 wt% or more, less than 9.4 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or less, less than 2.3 wt% or less, less than 1.8 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in specific applications, but there are cases where the nominal content of a particular element is required to be 0%. It has been found that while cerium (%Ce) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Ce content of 0.1% by weight, 0.6% by weight, 1.2% by weight, 4.2% by weight, 6.2% by weight, 8.2% by weight, and even 11% by weight is recommended. Conversely, there are applications where %Ce content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 12.8% by weight, less than 9.6% by weight, less than 9.4% by weight, less than 6.3% by weight, less than 4.2% by weight, less than 2.3% by weight, less than 1.8% by weight, less than 0.2% by weight, less than 0.08% by weight, and even less than 0.02% by weight is recommended. Clearly, this can be applied to all arbitrary elements in specific applications, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while selenium (%Se) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %Se content of 0.02 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, or 6.2 wt% or more is recommended. Conversely, there are applications where %Se content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 7.8 wt% or more, less than 6.3 wt% or more, less than 4.2 wt% or more, less than 1.8 wt% or more, less than 0.8 wt% or less, less than 0.48 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, but there are cases where the nominal content of a particular element is required to be 0%. It has been found that while tellurium (%Te) is considered an impurity in some applications, selenium content is required in others. For improved mechanical properties, %Te content of 0.02 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, or 6.2 wt% or more is recommended. Conversely, there are applications where %Te content is highly detrimental. In another embodiment for balancing mechanical properties, content of less than 7.8 wt% or less, less than 6.3 wt% or less, less than 4.2 wt% or less, less than 1.8 wt% or less, less than 0.8 wt% or less, less than 0.48 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in specific applications, but there are cases where the nominal content of a particular element is required to be 0%. It has been found that while arsenic (%As) is considered an impurity in some applications, its content is also required in others. For improved mechanical properties, %As content of 0.02 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 4.2 wt% or more, or 6.2 wt% or more is recommended. Conversely, there are applications where %As content is extremely harmful. In another embodiment, content of less than 7.8 wt% or less, less than 6.3 wt% or less, less than 4.2 wt% or less, less than 1.8 wt% or less, less than 0.8 wt% or less, less than 0.48 wt% or less, less than 0.2 wt% or less, less than 0.08 wt% or even less than 0.02 wt% is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while antimony (%Sb) is considered an impurity in some applications, its presence is also required in others. For improved mechanical properties, %Sb content of 0.1% by weight or more, 0.6% by weight or more, 1.2% by weight or more, 4.2% by weight or more, 6.2% by weight or more, 8.2% by weight or more, 11% by weight or more, and even 16.2% by weight or more is recommended. Conversely, there are applications where %Sb content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 18.8% by weight, less than 14.6% by weight, less than 9.4% by weight, less than 6.3% by weight, less than 4.2% by weight, less than 2.3% by weight, less than 1.8% by weight, less than 0.2% by weight, less than 0.08% by weight, and even less than 0.02% by weight is recommended. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while oxygen (%O) is considered an impurity in some applications, its content is also required in others. Recommended %O levels are 0.002 wt%, 0.1 wt%, 0.6 wt%, 1.2 wt%, 4.2 wt%, 6.2 wt%, 8.2 wt%, and even 11 wt% or more. Conversely, there are applications where %O content is extremely harmful. In another embodiment for balancing mechanical properties, recommended levels are less than 12.8 wt%, 9.6 wt%, 9.4 wt%, 6.3 wt%, 4.2 wt%, 2.3 wt%, 1.8 wt%, 0.2 wt%, 0.08 wt%, and even less than 0.02 wt%. Clearly, this can be applied to all arbitrary elements in specific applications, although there may be cases where the nominal content of a particular element is required to be 0%. It has been found that while carbon (%C) is considered an impurity in some applications, there are also magnesium alloy applications where carbon content is required. For improved mechanical properties, %C content of 0.002 wt% or more, 0.01 wt% or more, 0.1 wt% or more, 0.26 wt% or more, 0.6 wt% or more, 1.2 wt% or more, 2.2 wt% or more, or 4.2 wt% or more is recommended. Conversely, there are applications where %C content is extremely detrimental. In another embodiment for balancing mechanical properties, content of less than 3.8 wt% or more, less than 2.8 wt% or more, less than 1.8 wt% or more, less than 0.8 wt% or more, less than 0.48 wt% or less, less than 0.18 wt% or less, less than 0.08 wt% or less, less than 0.02 wt% or even less. Clearly, this can be applied to all arbitrary elements in a particular application, although there may be cases where the nominal value of the content of a particular element is required to be 0%. We have discovered that there are embodiments in which the microstructure of the alloy is important. In some embodiments of magnesium alloys, the microstructure includes a beta phase. In one embodiment, the microstructure consists of a beta phase and HPC (hexagonal close-packed structure). In other embodiments, the microstructure is mainly beta phase. The microstructure of the alloy contains 52 volume% or more of beta phase. In another embodiment of magnesium alloy, the phase containing HPC microstructure is less than 48 volume%, less than 37 volume%, less than 28 volume%, less than 16 volume%, or less than 8 volume%. In some cases, the microstructure is beta phase. The magnesium alloys disclosed above can be used in the manufacture of lightweight components. The use of the magnesium alloys disclosed above has been found, in some embodiments, to enable the manufacture of structural components with high environmental resistance and high resistance to combustion. In some embodiments, the magnesium alloys disclosed herein are characterized by high structural resistance under combustion. Another embodiment of the magnesium alloy disclosed above is described in detail below. In one set of embodiments, a lightweight structure can be obtained using a magnesium alloy having the following composition, where all proportions are by weight: %Mg > 12%. %Li:1.1-29; %Ca+%Y+%Al=0.5-24; %Be+%Sc=0-2.5; %Zr+%Hf+%Ti=0-2.5; %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb=0‐12; %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta=0‐10; %B+%N+%O+%C=0-2.5; %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb=0‐9; %Se+%Te+%As+%Sb=0-2.4; %Nd+%Gd+%La=0-9; %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th=0‐9; The remainder consists of %Mg and trace elements. In one embodiment, when the magnesium alloy disclosed above is used for a lightweight structure, the composition of the disclosed above describes the overall composition of the inorganic portion of the material. This also applies when different phases or powders are present in different compositions. In some embodiments, only the composition of powders of a type that can ultimately be mixed with other powders to form a powder mixture is described. In other embodiments, only the phases of the material are described. In some applications to balance mechanical properties, the sum of %Ca+%Y+%Al may be important, and different levels are recommended in different embodiments. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %Ca+%Y+%Al be 0.5 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, 11 wt% or more, or 16 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can negatively affect the overall properties. In another embodiment, it is recommended that %Ca+%Y+%Al be 44% by weight or less, 34% by weight or less, 24% by weight or less, 18% by weight or less, 14% by weight or less, 9% by weight or less, or 4% by weight or less. In some applications, the sum of %Be+%Sc may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of elements should be considered. In other embodiments, it is recommended that %Be+%Sc be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 1.2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In other embodiments, it is recommended that %Be+%Sc be 8 wt% or less, 4 wt% or less, 2.5 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, or 0.4 wt% or less. In some applications, the sum of %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb may be important, and different levels are recommended in different embodiments of mechanical property improvement. The above values ​​for each individual element should always be respected, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, the same applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb be 29% by weight or less, 19% by weight or less, 2% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In different embodiments, the sum of %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta may be important, and different levels are recommended. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of elements should be considered. In other embodiments, it is recommended that %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, and in some applications, excessively large sums of these elements may have adverse effects. In another embodiment, it is recommended that %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta be 29% by weight or less, 19% by weight or less, 14% by weight or less, 10% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In some applications, the sum of %Zr+%Hf+%Ti may be important, and different levels are recommended in different embodiments. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %Zr+%Hf+%Ti be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 1.2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Zr+%Hf+%Ti be 8 wt% or less, 4 wt% or less, 2.5 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, or 0.4 wt% or less. In some applications, the sum of %B+%N+%O+%C may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %B+%N+%O+%C be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 1.2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %B+%N+%O+%C be 8 wt% or less, 4 wt% or less, 2.5 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, or 0.4 wt% or less. In some applications, the sum of %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​for each individual element should always be respected, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb be 0.05 wt% or greater, 0.6 wt% or greater, 1.1 wt% or greater, 2.2 wt% or greater, 5.2 wt% or greater, 8.2 wt% or greater, or 11 wt% or greater. As expected, the same applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb be 29% by weight or less, 19% by weight or less, 14% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In some applications, the sum of %Se+%Te+%As+%Sb may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %Se+%Te+%As+%Sb be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 1.2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Se+%Te+%As+%Sb be 8 wt% or less, 4 wt% or less, 2.4 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, or 0.4 wt% or less. In some embodiments, the sum of %Nd+%Gd+%La may be important, and different levels are recommended in different embodiments to balance the mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Nd+%Gd+%La be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In other embodiments, it is recommended that %Nd+%Gd+%La be 29 wt% or less, 19 wt% or less, 14 wt% or less, 9 wt% or less, 4 wt% or less, 2 wt% or less, or 0.4 wt% or less. In some embodiments, the sum of %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th may be important, and different levels are recommended in different embodiments. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of elements should be considered. In other embodiments, it is recommended that %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements may have adverse effects. In another embodiment, it is recommended that %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th be 29% by weight or less, 19% by weight or less, 14% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. Another embodiment of the magnesium alloy disclosed above is described in detail below. In one set of embodiments, a lightweight structure can be obtained using a magnesium alloy having the following composition, where all proportions are by weight: %Li:2.2-29 %Ca+%Al=0-14; %Nd+%Gd+%La+%Y+%Be+%Sc=2.1‐19; %Zr+%Hf+%Ti=0-3.5; %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb=0‐9; %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta=0‐9; %B+%N+%O+%C=0-1.5; %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb=0‐12; %Se+%Te+%As+%Sb=0-1.5; %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th=0‐14; The remainder consists of %Mg and trace elements. In some embodiments, this composition describes the overall composition of the material. It also applies when different phases or powders are present in different compositions. In some embodiments, only the composition of a type of powder that is ultimately mixed with other powders is described. Furthermore, in some embodiments, only the phases of the material are described. In some applications, the sum of %Ca+%Al may be important, and different levels are recommended in different embodiments to balance the mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Ca+%Al be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In other embodiments, it is recommended that %Ca+%Al be 29 wt% or less, 19 wt% or less, 14 wt% or less, 9 wt% or less, 4 wt% or less, 2 wt% or less, or 0.4 wt% or less. In some applications where balancing mechanical properties is required, the sum of %Nd+%Gd+%La+%Y+%Be+%Sc may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %Nd+%Gd+%La+%Y+%Be+%Sc be 0.5 wt% or more, 1.1 wt% or more, 2.1 wt% or more, 5.2 wt% or more, 8.2 wt% or more, 11 wt% or more, or 16 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Nd+%Gd+%La+%Y+%Be+%Sc be 44 wt% or less, 34 wt% or less, 24 wt% or less, 19 wt% or less, 14 wt% or less, 9 wt% or less, or 4 wt% or less. In some applications, the sum of %Zr+%Hf+%Ti may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %Zr+%Hf+%Ti be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 1.2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Zr+%Hf+%Ti be 8 wt% or less, 3.5 wt% or less, 2.5 wt% or less, 1.9 wt% or less, 1.4 wt% or less, 0.9 wt% or less, or 0.4 wt% or less. In some embodiments, the sum of %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb may be important, and different levels are recommended in different embodiments. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of elements should be considered. In other embodiments, it is recommended that %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements may have adverse effects. In another embodiment, it is recommended that %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb be 29% by weight or less, 19% by weight or less, 14% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In some embodiments, the sum of %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​for each individual element should always be respected, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements may have adverse effects. In another embodiment, it is recommended that %Ge+%Ce+%Fe+%Pb+%V+%Mo+%W+%Ta be 29% by weight or less, 19% by weight or less, 14% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In some applications, the sum of %B+%N+%O+%C may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In another embodiment, it is recommended that %B+%N+%O+%C be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 1.2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %B+%N+%O+%C be 8 wt% or less, 4 wt% or less, 2.5 wt% or less, 1.5 wt% or less, 0.9 wt% or less, 0.4 wt% or less, or 0.09 wt% or less. In some applications, the sum of %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb may be important, and different levels are recommended to balance the mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb be 0.05 wt% or greater, 0.6 wt% or greater, 1.1 wt% or greater, 2.2 wt% or greater, 5.2 wt% or greater, 8.2 wt% or greater, or 11 wt% or greater. As expected, the same applies to each individual element, and in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb be 29% by weight or less, 19% by weight or less, 12% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In some applications, the sum of %Se+%Te+%As+%Sb may be important, and different levels are recommended in different embodiments for balancing mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Se+%Te+%As+%Sb be 0.005 wt% or more, 0.05 wt% or more, 0.2 wt% or more, 2 wt% or more, or 1.4 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In other embodiments, it is recommended that %Se+%Te+%As+%Sb be 8 wt% or less, 4 wt% or less, 2.5 wt% or less, 1.5 wt% or less, 0.9 wt% or less, 0.4 wt% or less, or 0.09 wt% or less. In some applications where balancing mechanical properties is required, the sum of %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th may be important, and different levels are recommended in different embodiments. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, the same applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In another embodiment, it is recommended that %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th be 29% by weight or less, 19% by weight or less, 14% by weight or less, 9% by weight or less, 4% by weight or less, 2% by weight or less, or 0.4% by weight or less. In some embodiments, the sum of %Ca+%Al+%Ti may be important, and different levels are recommended for different applications to balance mechanical properties. The above values ​​should always be respected for each individual element, and in some embodiments, the sum of the elements should be considered. In other embodiments, it is recommended that %Ca+%Al+%Ti be 0.05 wt% or more, 0.6 wt% or more, 1.1 wt% or more, 2.2 wt% or more, 5.2 wt% or more, 8.2 wt% or more, or 11 wt% or more. As expected, this also applies to each individual element, so in some applications, excessively large sums of these elements can have adverse effects. In other embodiments, it is recommended that %Ca+%Al+%Ti be 29 wt% or less, 19 wt% or less, 14 wt% or less, 9 wt% or less, 4 wt% or less, 2 wt% or less, or 0.4 wt% or less. In some applications, a specific type of corrosion resistance has been found to be required. This is because magnesium alloys containing or lacking certain elements such as %Fe, %Ni, and %Cu at nominal values ​​of 0% are insufficient. However, special measures must be taken to ensure that the content of these trace elements is sufficiently low. Unfortunately, even magnesium alloys that do not intentionally contain %Cu, %Fe, or %Ni still exhibit residual levels of these elements. While this is not a problem for many applications, in some applications it can have surprisingly adverse effects, requiring costly measures to prevent excessive levels. On the other hand, excessive removal of these elements can impair the alloy's functionality for the application, so care must be taken. In one embodiment, %Fe is recommended to be between 0.00001% by weight and 0.005% by weight. In another embodiment, %Fe is recommended to be less than 0.19% by weight, less than 0.09% by weight, less than 0.009% by weight, less than 0.004% by weight, less than 0.0009% by weight, and even less than 0.0004% by weight. In another embodiment, it is recommended that %Fe be greater than 0.0000012 wt%, or greater than 0.000006 wt%, greater than 0.00001 wt%, greater than 0.00006 wt%, greater than 0.00012 wt%, greater than 0.0012 wt%, or greater than 0.012 wt%. In one embodiment, it is recommended that %Ni be between 0.00001 wt% and 0.005 wt%. In one embodiment, it is recommended that %Ni be less than 0.19 wt%, less than 0.09 wt%, less than 0.009 wt%, less than 0.004 wt%, less than 0.0009 wt%, and even less than 0.0004 wt%. In another embodiment, it is recommended that %Ni be greater than 0.0000012 wt%, or greater than 0.000006 wt%, greater than 0.00001 wt%, greater than 0.00006 wt%, greater than 0.00012 wt%, greater than 0.0012 wt%, or greater than 0.012 wt%. In one embodiment, it is recommended that %Cu be between 0.00001 wt% and 0.005 wt%.In one embodiment, %Cu is recommended to be less than 0.19 wt%, less than 0.09 wt%, less than 0.009 wt%, less than 0.004 wt%, less than 0.0009 wt%, and even less than 0.0004 wt%. In another embodiment, %Cu is recommended to be greater than 0.0000012 wt%, or greater than 0.000006 wt%, greater than 0.00001 wt%, greater than 0.00006 wt%, greater than 0.00012 wt%, greater than 0.0012 wt%, or greater than 0.012 wt%. In one embodiment, %Fe+%Cu+%Ni is recommended to be between 0.00001 wt% and 0.005 wt%. In one embodiment, it is recommended that %Fe+%Cu+%Ni be less than 0.19 wt%, less than 0.09 wt%, less than 0.009 wt%, less than 0.004 wt%, less than 0.0009 wt%, and even less than 0.0004 wt%. In another embodiment, it is recommended that %Fe+%Cu+%Ni be greater than 0.0000012 wt%, or greater than 0.000006 wt%, greater than 0.00001 wt%, greater than 0.00006 wt%, greater than 0.00012 wt%, greater than 0.0012 wt%, or greater than 0.012 wt%. Another embodiment of the magnesium alloy disclosed above is described in detail below. In one set of embodiments, a lightweight structure can be obtained using a magnesium alloy having the following composition, where all proportions are by weight: %Li:1.3-16 %Ca+%Y+%Al=2.5-19; %Be+%Sc:0‐0.5; %Zr+%Hf+%Ti=0-1.5; %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb=0‐6; %Ge+%Ce+%Ni+%Pb+%V+%Mo+%W+%Ta=0‐3; %B+%N+%O+%C=0-1.5; %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb=0‐8; %Se+%Te+%As+%Sb=0-1.4; %Nd+%Gd+%La=0-4; %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th=0‐3; The remainder consists of %Mg and trace elements. In some embodiments, this composition describes the overall composition of the material. It also applies when different phases or powders are present in different compositions. In some embodiments, only the composition of a type of powder that is ultimately mixed with other powders is described. Furthermore, in some embodiments, only the phases of the material are described. Another embodiment of the magnesium alloy disclosed above is described in detail below. In one set of embodiments, a lightweight structure can be obtained using a magnesium alloy having the following composition, where all proportions are by weight: %Li:4-20 %Ca+%Y+%Al=2-15; %Be+%Sc:0‐0.3; %Zr+%Hf+%Ti=0-1.2; %Cu+%Ni+%Co+%Zn+%Mn+%Si+%Cr+%Nb=0‐5; %Ge+%Ce+%Ni+%Pb+%V+%Mo+%W+%Ta=0‐2; %B+%N+%O+%C=0-1.1; %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb=0‐6; %Se+%Te+%As+%Sb=0-1.1; %Nd+%Gd+%La=0-3; %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th=0‐2.5; The remainder consists of %Mg and trace elements. In some embodiments, this composition describes the overall composition of the material. It also applies when different phases or powders are present in different compositions. In some embodiments, only the composition of a type of powder that is ultimately mixed with other powders is described. Furthermore, in some embodiments, only the phases of the material are described. Another embodiment of the magnesium alloy disclosed above is described in detail below. In this case, the alloy can be considered an aluminum-lithium alloy. In one set of embodiments, a lightweight structure can be obtained using a magnesium alloy having the following composition, where all proportions are by weight. %Li:2.3-28 %Ca+%Y+%Mg+%Zn+%Cu=4.5-25; %Be+%Sc:0‐0.5; %Zr+%Hf+%Ti=0-1.5; %Ni+%Co+%Mn+%Si+%Cr+%Nb=0‐6; %Ge+%Ce+%Ni+%Pb+%V+%Mo+%W+%Ta=0‐3; %B+%N+%O+%C=0-1.5; %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb=0‐8; %Se+%Te+%As+%Sb=0-1.4; %Nd+%Gd+%La=0-4; %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th=0‐3; The remainder consists of %Al and trace elements. In some embodiments, this composition describes the overall composition of the material. It also applies when different phases or powders are present in different compositions. In some embodiments, only the composition of a type of powder that is ultimately mixed with other powders is described. Furthermore, in some embodiments, only the phases of the material are described. Another embodiment of the magnesium alloy disclosed above is described in detail below. In this case, the alloy can be considered an aluminum-lithium alloy. In one set of embodiments, a lightweight structure can be obtained using a magnesium alloy having the following composition, where all proportions are by weight. %Li:5.5-30 %Ca+%Y+%Mg+%Zn+%Cu=4.0-28; %Be+%Sc:0‐0.3; %Zr+%Hf+%Ti=0-1.2; %Ni+%Co+%Mn+%Si+%Cr+%Nb=0‐5; %Ge+%Ce+%Ni+%Pb+%V+%Mo+%W+%Ta=0‐2; %B+%N+%O+%C=0-1.1; %Bi+%Ga+%Cd+%In+%Sn+%Cs+%Rb=0‐6; %Se+%Te+%As+%Sb=0-1.1; %Nd+%Gd+%La=0-3; %Tm+%Tb+%Dy+%Yb+%Er+%Sm+%Pr+%Ho+%Lu+%Th=0‐2.5; The remainder consists of %Al and trace elements. In some embodiments, this composition describes the overall composition of the material. It also applies when different phases or powders are present in different compositions. In some embodiments, only the composition of a type of powder that is ultimately mixed with other powders is described. Furthermore, in some embodiments, only the phases of the material are described. Any embodiment of the magnesium alloy described above can be combined in any combination with any other embodiment described herein, to the extent that their respective features are compatible. Regarding the use of terms such as "less than," "greater than," "greater than or equal to," "less than or equal to," "from," "up to," "at least," "greater than," and "less than," these terms include the listed numbers and represent a range that can be divided into subranges. One embodiment refers to the use of a magnesium alloy for manufacturing a metal part or at least partially a metal part. The alloy is also used in particulate form. In another embodiment, the alloys disclosed herein are microstructurally defined by particle sizes of 400 micrometers or less, 190 micrometers or less, 90 micrometers or less, 40 micrometers or less, 18 micrometers or less, 8 micrometers or less, 4 micrometers or less, 0.9 micrometers or less, or 0.4 micrometers or less. These values ​​are measured according to ASTME112-13. In another embodiment, the alloys disclosed herein are microstructurally defined as having at least 11 volume%, at least 28 volume%, at least 42 volume%, at least 52 volume%, at least 72 volume%, at least 82 volume%, or at least 96 volume% of a cubic structure. In another embodiment, the percentage of the cubic structure disclosed above is by weight. In another embodiment, the alloys disclosed herein are microstructurally defined by having a reinforcing phase. The reinforcing phase consists of particles whose hardness is greater than the macrohardness of the alloy, taking into account the matrix reinforcing phase and all other components. Furthermore, these reinforcing phase particles are harder than the matrix, precipitates, intermetallic compounds, secondary phases, and even the Laves phase. In another embodiment, the equivalent diameter of the reinforcing phase is at least 400 micrometers or less, 190 micrometers or less, 90 micrometers or less, 40 micrometers or less, 18 micrometers or less, 8 micrometers or less, 4 micrometers or less, 1.9 micrometers or less, 900 nm or less, 400 nm or less, 190 nm or less, and 90 nm or less. In this specification, unless otherwise specified, the equivalent diameter is the diameter of the particle that imparts the same geometric, optical, electrical, or aerodynamic behavior to the spherical particle under test. Some embodiments of the material are characterized by high structural resistance during combustion. This affects all types of materials in this application, and therefore, even single metal alloys. Existing magnesium alloys with refractory properties are characterized by having a higher density than pure magnesium at certain temperatures. In fact, the density of magnesium is 1.74 g / cm³ at 20°C and 1 atm. 3, whereas the density of existing improved refractory magnesium alloys is 1.8 g / cm at this temperature 3 or higher. It was previously believed that this was the only possible approach. This is because fire resistance was only associated with increased oxidation resistance at high temperatures due to reduced reactivity, and in the case of magnesium, reduced reactivity implied an increase in density relative to pure magnesium. One way to parameterize the novelty of some of the alloys disclosed herein is by density. In another embodiment, the density of the alloys disclosed herein (at 20°C and 1 atm) is 1.79 g / cm 3 or less, 1.74 g / cm 3 or less, 1.72 g / cm 3 or less, 1.68 g / cm 3 or less, 1.62 g / cm 3 or less, 1.58 g / cm 3 or less, 1.52 g / cm 3 or less, or 1.44 g / cm 3 or less. In some embodiments, any of the alloys disclosed above having any of the densities disclosed in this paragraph is an alloy that exhibits good fire resistance. What is understood as excellent fire resistance varies depending on the application. In one group of embodiments, significant resistance to combustion is 10.5 Btu / ft as described in FAR 25.853 Part 25 Appendix F Part 2 2This is thought to be for combustion at 1900F with a heat flux of / sec. In one embodiment, the results of the verification run were that the alloy did not burn when it melted, and in another embodiment, the alloy self-extinguished. In another embodiment, the verification results showed that the ignition temperature was above 582°C, above 592°C, above 602°C, above 622°C, above 652°C, above 682°C, above 692°C, above 702°C, above 712°C, above 752°C, above 782°C, or above 802°C. The alloy disclosed herein achieves excellent ignition temperatures despite its very low density. In another embodiment, the verification results showed that the ignition temperature was above 852°C, above 912°C, above 952°C, above 1012°C, above 1122°C, or above 1222°C. In one embodiment, the results of the flammability test described in IGC 04.24.106, corresponding to US FAA, CS25 / JAR 25 / FAR 25§25-853, are considered to indicate good fire resistance. In one embodiment, the alloys disclosed herein pass all tests. The challenge of achieving a highly fire-resistant structure can be solved by the correct composition and microstructure. It appears that a fire-resistant structure can be achieved if the relevant components possess excellent thermal shock resistance. This is because structural components are often subjected to high thermal shock when heated or during fire extinguishing. Since exposure to thermal shock is inversely proportional to thermal conductivity (1 - Poisson's coefficient) and directly proportional to the coefficient of thermal expansion and Young's modulus (also called the modulus of elasticity in this specification), thermal shock resistance can be expressed as follows when comparing materials. [Brief explanation of the drawing]

[0003] [Figure 1] This is one embodiment of reality. [Figure 2] This is one embodiment of reality. [Figure 3] This is a 1:2 scale model of the B-pillar, featuring four main tubular components.

[0004]

number

[0005]

number

[0006] Another embodiment refers to a material comprising organic and non-organic parts, in which elements may be manufactured using molding techniques such as any method disclosed later in this document. The inventors have found that in some embodiments, it is possible to mold a mixture of organic and non-organic elements, provided that certain characteristic temperatures are appropriately selected. In one embodiment, the glass transition temperature, removal temperature, or degradation temperature is appropriately selected, as disclosed later in this document, in particular, in the case of the relationship between the melting point of at least one element of the non-organic part and the characteristic temperature of at least one element of the organic part, such as the thermal deflection temperature. In one embodiment, the material is a moldable material. In one embodiment, the material is a material to be molded. In some embodiments, the organic parts are merely transient until the desired shape is reached and are further removed at least partially. In some embodiments, the organic parts are functional in the molded material and are therefore retained at least partially. The organic portion of the material to be molded may comprise one or more phases and / or elements. In one embodiment, the organic portion comprises an organic phase. In a different embodiment, the organic portion of the material comprises at least one element, at least two elements, at least one related element, and at least two further related elements. In one embodiment, the organic phase comprises at least a polymer. In a different embodiment, the polymer is a photosensitive resin, a thermosetting polymer, a thermoplastic polymer, and further an elastomer polymer. The inventors have found that in some embodiments, the polymer must not be a crystalline polymer in order to obtain the required mechanical properties of the molded material. In one embodiment, the molding method comprises at least one step of additively fabricating an organic portion of a material comprising an element that "cures" when exposed to "appropriate radiation" as later disclosed herein. Furthermore, in a different embodiment, the "cures" material may further comprise a reaction accelerator, a photochromic compound that can be sensitized when exposed to "appropriate radiation" (such as azobenzene, spiropyran, stilbene, fulgites, diarylethenes, etc.), a chromophore that can generate heat when exposed to "appropriate radiation," and further a thermal initiator. In some embodiments, such as when several elements are manufactured in which the organic portion is at least partially retained, and in another example in some elements in which the metal phase with the lowest melting point among the associated phases has a metal phase with a slightly higher melting point, the inventors found it to be extremely important to select organic phases having deflection temperatures above 120°C, above 185°C, above 230°C, above 260°C, above 282°C, above 305°C, above 355°C, above 410°C, above 430°C, and even above 505°C, as measured according to American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi]. In one alternative embodiment, the deflection temperature values ​​disclosed above are measured according to ISO 75-1, 2013 Method B test at a load of 0.45 MPa. The inventors found that in some applications, it is extremely important to select organic phases comprising elements having deflection temperatures exceeding 81°C, 123°C, 153°C, 173°C, 188°C, 203°C, 237°C, 273°C, 287°C, and even 320°C, as measured in different embodiments according to the American Society for Testing and Materials D648-07 at a load of 1.82 MPa. In one alternative embodiment, the organic phase has deflection temperatures above 40°C, above 61°C, above 76°C, above 94°C, above 102°C, above 118°C, above 137°C, above 143°C, and further above 168°C, obtained by any of the following: under a load of 1.82 MPa according to the test conditions of the American Society for Testing and Materials D648-07, under a load of 5.0 MPa according to the test conditions of the American Society for Testing and Materials D648-07, under a load of 8.0 MPa according to the test conditions of the American Society for Testing and Materials D648-07, or further by the ISO 75-1:2013 Method A test under a load of 1.8 MPa. In several applications, the inventors discovered that it is extremely important to select organic phases comprising elements having Vicker softening temperatures exceeding 120°C, 185°C, 230°C, 260°C, 282°C, 305°C, 355°C, 410°C, 430°C, and even 505°C.The inspection conditions for deflection temperature and Vicar softening temperature are disclosed in the final section of this document. In some materials, certain elements or phases may be present in very small amounts within the organic portion of the material. In some cases, their presence is unintended and therefore irrelevant, while in other cases, their presence has a clear functionality and is therefore relevant to some properties but irrelevant to others. In some embodiments, it is possible to define the relevance of a phase or element in an organic portion with respect to the amount of such a type within that organic portion. The relevant element or phase in the organic portion of the material is, in different embodiments, an element or phase that constitutes at least 0.06%, at least 0.6%, at least 1.2%, at least 2.6%, at least 6%, at least 11%, at least 21%, and further 36% by weight with respect to the organic portion of the material. In alternative embodiments, the percentages disclosed above refer to weight percentages with respect to the weight of the material. In alternative embodiments, the percentages disclosed above refer to volume. In some embodiments, the above is a product of several elements, and after the material is formed, the organic portion of the material is retained at least partially. Also, as another example, in some manufactured elements having metallic phases in the non-organic portion of the material, the metallic phase with the lowest melting point among the relevant phases has a slightly higher melting point compared to other relevant metallic phases. The inventors have found in some applications that it is extremely important to select organic phases for relevant elements having deflection temperatures (HDT) in different embodiments, measured according to the American Society for Testing and Materials D648-07 method at a load of 0.46 MPa [66 psi], above 120°C, above 185°C, above 230°C, above 260°C, above 282°C, above 305°C, above 355°C, above 410°C, above 430°C, and even above 505°C. The test conditions for determining the deflection temperature are disclosed in the last part of this document. In one alternative embodiment, the deflection temperature values ​​disclosed above are measured according to the ISO 75-1:2013 Method B test at a load of 0.45 MPa. The inventors found it extremely important in some applications to select organic phases comprising relevant elements having deflection temperatures exceeding 81°C, 123°C, 153°C, 173°C, 188°C, 203°C, 237°C, 273°C, 287°C, and even 320°C, as measured in accordance with American Society for Testing and Materials D648-07 at a load of 1.82 MPa. The test conditions for determining the deflection temperature are disclosed in the final part of this document. In alternative embodiments, an organic phase is preferred comprising relevant elements having deflection temperatures exceeding 40°C, exceeding 61°C, exceeding 76°C, exceeding 94°C, exceeding 102°C, exceeding 118°C, exceeding 137°C, exceeding 143°C, and further exceeding 168°C, obtained by any of the following: following the test conditions of the American Society for Testing and Materials D648-07 at a load of 1.82 MPa, following the test conditions of the American Society for Testing and Materials D648-07 at a load of 5.0 MPa, following the test conditions of the American Society for Testing and Materials D648-07 at a load of 8.0 MPa, or further by the ISO 75-1:2013 Method A test at a load of 1.8 MPa.The inventors have found that in several applications and different embodiments, polyphenylene sulfone (PPS), aromatic polyimide (PI), polyethersulfone (PES), polyetherimide (PEI), polyetherketone (PEK), polyetherketoneketone (PEKK), ethylene propylene diene monomer (EPDM), polysulfone (PSU), polyacrylamide (PAM), polycarbonate (PC), polyetheretherketone (PEEK), polytetrafluoroethylene (PTFE), polyimide (PI), polyethylene naphthalate (PEN), ABS resin (ABS), polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyethylene terephthalate (PET), and polybutylene are used. The inventors have found it extremely important to select an organic phase comprising relevant elements such as butylene terephthalate (PBT), polyamides (PA66, PA610, PA6, PA12), polypropylene (PP), phenol-formaldehyde resin (PF), epoxy resin (EP), polyurethane (PUR), polyester resin (UP), polymethylsiloxane (PDMS), polybenzimidazole (PBI), polybenzimidazole aromatic derivatives, methacrylic acid with polyhydroxy groups, and poly(hydroxybutyl)methacrylic acid. In different embodiments, the inventors have found it beneficial to select an organic phase comprising cyclic butylene terephthalate (CBT) and further anionic polyamide (APA-6). In some applications, particularly when manufacturing wind turbine blades and other large elements, it is beneficial to use polymer materials such as thermosetting polymers (e.g., epoxy resins) or powdered thermoplastic polymers. In the manufacture of large elements, the inventors have discovered that, when using thermoplastic polymers that can be joined by ultrasound, resistance, induction, or other means, and when using molded materials obtained according to the disclosures in this document, it is possible to achieve continuity, including continuous bonding between metal phases at the joint.These include polyhydroxyethyl methacrylate (PHEMA), phthalonitrile, benzoxazine, bismaleimide, cyanate esters, polyester fiberglass systems, molded compounds, bulk molded compounds, polyurethane, insulation materials, mattresses, coatings, adhesives, printing rollers, shoe soles, flooring materials, synthetic fibers, polyurethane polymers, vulcanized rubber, bakelite, phenol formaldehyde resins used in electrical insulators and plastic products, duroplast, plywood, particleboard and medium-density fiberboard, melamine resin, diallyl phthalate (DAP), epoxy resins, polyimides, polycyanurates, molds or mold runners, and further polyester resins. For manufacturing purposes, the inventors found it extremely important to select organic phases comprising relevant elements having degradation temperatures in different embodiments exceeding 120°C, 185°C, 230°C, 260°C, 282°C, 305°C, 355°C, 410°C, 430°C, and even 505°C in several applications. The test conditions for determining the degradation temperature are disclosed in the last part of this document. In alternative embodiments, the degradation temperature may refer to temperatures obtained according to the test conditions of the American Society for Testing and Materials E1131-08, which correspond to mass losses of 10%, 20%, 25%, 45%, 65%, and even more than 65% by weight. The inventors found it extremely important in some applications to select organic phases comprising relevant elements having removal temperatures in different embodiments exceeding 120°C, 185°C, 230°C, 260°C, 282°C, 305°C, 355°C, 410°C, 430°C, and even 505°C. The test conditions for determining the removal temperature are disclosed in the last part of this document. In alternative embodiments, the removal temperature may selectively refer to the temperature obtained at a heating / cooling rate of 0.5°C / min, but according to the test conditions of the American Society for Testing and Materials E1131-08, with the weight of the remaining organic phase in different embodiments being less than 49%, less than 34%, less than 24%, less than 14%, less than 9%, less than 4%, less than 2%, and even less than 0.4% by weight with respect to the initial weight.In one alternative embodiment, the proportions disclosed above are by volume and refer to volume loss in the organic phase. The inventors have found that in several applications, in different embodiments, it is crucial to select an organic phase comprising the relevant element having a deflection temperature well above 0.45 times the melting point (temperature is in Celsius at 0.45*Tm) of the relevant element / phase having the lowest melting point among the relevant elements / phases in the non-organic portion of the material, well above 0.65*Tm, well above 0.75*Tm, well above 0.85*Tm, and further well above Tm (where Tm is the absolute temperature at which the first liquid is formed under equilibrium conditions, and in the remainder of this document, equilibrium conditions are similarly applied unless otherwise indicated or made clear). The deflection temperature is measured according to American Society for Testing and Materials D648-07 under a load of 0.46 MPa [66 psi]. The inventors found that in some applications it is extremely important to select an organic phase comprising relevant elements having glass transition temperatures above 42°C, above 86°C, above 106°C, above 128°C, above 164°C, above 192°C, above 221°C, above 260°C, above 292°C, and even above 320°C in different embodiments. The inventors found that in some applications it is extremely important to select an organic phase comprising relevant elements that are thermoplastic polymers having melting points above 165°C, above 196°C, above 218°C, above 236°C, above 254°C, above 286°C, above 319°C, above 354°C, above 386°C, and even above 410°C in different embodiments. In several applications, the inventors found it extremely important to select organic phases comprising relevant elements having Vicar softening temperatures exceeding 120°C, 185°C, 230°C, 260°C, 282°C, 305°C, 355°C, 410°C, 430°C, and even 505°C. Test conditions for determining Vicar softening temperatures are disclosed in the final part of this document. In some embodiments, the inventors found that the above-mentioned aspects of the phase can also be applied to parts.More embodiments of organic phases / elements that can be present in the material are disclosed later in this document. Testing conditions are disclosed in the final part of this document. A person will determine the type of molding technique to use for a given type of plastic or polymer system, depending on the elements to be manufactured and, likewise, the number of such elements and other economically relevant issues, which will also relate to the shape of the elements, other economic aspects and several other conditions, and likewise to the functionality and dimensional tolerances of the parts he needs, and in this scenario, it is clear to him that he will have one or more possible molding techniques, and if these are clear to him, he will have one or more possible molding techniques, and within this range he will have one or more molding techniques, and several possible polymers can be used, and so when he knows which temperature is relevant to the polymer in order to give it shape through the molding technique he has chosen, and together with all other conditions he understands, he will know the type of molding technique to use and which is relevant to the degradation of the polymer, and therefore he will know without a doubt which temperature is relevant, and when he has decided that, he will know in accordance with this disclosure the type of temperature relationship to be sought in the material by the means described herein. In some embodiments, it is very important that the organic portion of the material is not in excess. In different embodiments, the organic portion should be 68% or less, 48% or less, 38% or less, 34% or less, 28% or less, 24% or less, 18% or less, 14% or less, and further 8% or less by weight with respect to the weight of the material. In other embodiments, there should be a sufficient amount of organic portion of the material to ensure functionality after molding, and this should be especially true in applications where a high proportion of organic portion remains in the molded material. In different embodiments, the organic portion of the material should be 12% or more, 16% or more, 22% or more, 26% or more, 32% or more, 42% or more, 52% or more, 62% or more, 72% or more, 82% or more, and further 92% or more by weight with respect to the weight of the material. In alternative embodiments, volume fraction is relevant. In some embodiments, it is very important that the organic portion of the material is not in excess. In different embodiments, the organic portion should be 68% or less by volume, 48% or less, 38% or less, 34% or less, 28% or less, 24% or less, 18% or less, 14% or less, and 8% or less with respect to the volume of the material. In different embodiments, the organic portion of the material should be 12% or more by volume, 16% or more, 22% or more, 26% or more, 32% or more, 42% or more, 52% or more, 62% or more, 72% or more, 82% or more, and furthermore 92% or more. The non-organic portion of the material may comprise one or more phases and / or elements, and in some embodiments the material may comprise only the non-organic portion. In different embodiments, the non-organic portion of the material comprises at least one element, at least two elements, at least one related element, and at least two further related elements. In different embodiments, the non-organic portion comprises metals, metallic alloys, at least one intermetallic phase, any magnesium-based alloys and other alloys disclosed herein, any magnesium-lithium alloys and / or any aluminum-lithium alloys, and / or any low-melting-point magnesium-lithium alloys and / or any low-melting-point aluminum-lithium alloys previously disclosed herein, ceramics, particles, hard particles, and further reinforcing fibers. In different embodiments, the majority of the non-organic portion is metal, the majority is any magnesium-based alloys and other alloys disclosed herein, and / or any magnesium-lithium alloys and / or any aluminum-lithium alloys and / or any low-melting-point magnesium-lithium alloys and / or any low-melting-point aluminum-lithium alloys previously disclosed herein, and further majority is ceramic. In different embodiments, the non-organic portion of the material is a metal matrix composite, an intermetallic compound, and further an intermetallic compound matrix composite. Any embodiment of the magnesium alloys and / or low-melting-point magnesium-lithium alloys disclosed herein can be combined with any embodiment referring to the non-organic portion of any combination of materials provided, and they are not mutually exclusive. In this document, unless otherwise indicated, the term “majority” refers to the main component of the described portion (e.g., organic portion, non-organic portion, metallic portion, ceramic portion, etc.; for example, a material may consist of 90% organic portion and 10% non-organic portion, with the non-organic portion having 25% ceramic, 25% intermetallic compounds, 30% metallic alloys of any alloy disclosed in this document, such as any magnesium-based alloy and / or any low-melting-point magnesium-lithium alloy previously disclosed in this document, and 20% other metallic elements, such as materials, which may be described in some embodiments as having a non-organic portion having a majority of alloys disclosed in this document, such as any magnesium-based alloy and / or low-melting-point magnesium-lithium alloy previously disclosed in this document, however even if the total number of such metals in the material amounts to only 3%, they are the main component within the non-organic portion). In different embodiments, while insufficient to constitute the principal component of the described part, it must be represented in a minimum of 35%, 46%, 52%, 62%, 77%, 86%, and a further minimum of 96% by volume. In one alternative embodiment, the percentages disclosed above are by weight. The relevant elements or phases among the non-organic parts of the material are, in different embodiments, elements or phases that are at least 0.06%, 0.6%, 1.2%, 2.6%, 6%, 11%, 21%, and a further 36% by weight with respect to the non-organic parts of the material. In one alternative embodiment, the percentages disclosed above refer to percentages by weight with respect to the weight of the material. In one alternative embodiment, the percentages disclosed above refer to percentages by volume. The inventors have found that in some embodiments, the non-organic portion of the material comprises at least one of the magnesium alloys disclosed herein, in one embodiment, one of the magnesium-lithium alloys disclosed herein, in one embodiment, any aluminum-lithium alloy disclosed herein, in one embodiment, a low-melting-point aluminum-lithium alloy disclosed herein, and in one embodiment, at least one of the low-melting-point magnesium-lithium alloys disclosed herein. In one embodiment, the magnesium alloy is particulate. In one embodiment, particulate means powder. In one embodiment, the low-melting-point lithium-magnesium alloy is particulate. In one embodiment, particulate means powder. In one particular embodiment, the inventors have found that the non-organic portion of the material comprises at least two different magnesium alloys. In different embodiments, at least one of the magnesium alloys has a lithium content of more than 21%, more than 36%, more than 42%, more than 52%, more than 62%, more than 72%, and more than 81% by weight. In one alternative embodiment, the percentages disclosed above are by volume. In some embodiments, particularly when the non-organic portion of the material comprises metal powders with low melting points, the inventors have found that some relationship between melting temperature and density should be satisfied in at least one of the metal powders in the non-organic portion of the material. In different embodiments, the (g / cm³) of those metal powders 3 The melting temperatures (on the Kelvin scale) of metal powders multiplied by their density (at 20°C and 1 atm) are less than 2790, less than 2490, less than 1900, less than 1400, less than 900, and even less than 400 [K*(g / cm³] 3 ) in which the inspection conditions are disclosed in the last part of this document. Other different alloys can also be used in the non-organic portion of the material. The inventors have found it beneficial in several embodiments for the non-organic portion of the material to comprise any of the alloys disclosed in PCT / EP2016 / 076895, which is incorporated in this document by reference. In one embodiment, the non-organic portion of the material comprises one of the aluminum alloys disclosed in PCT / EP2016 / 076895. In one embodiment, the non-organic portion of the material comprises one of the aluminum alloys disclosed in PCT / EP2016 / 076895, but the %Li content relative to the magnesium alloy is specified in this application. In one embodiment, the non-organic portion of the material comprises one of the aluminum alloys disclosed in PCT / EP2016 / 076895 and at least one of the low-melting-point magnesium-lithium alloys disclosed in this document. In one embodiment, the non-organic portion of the material comprises one of the aluminum alloys disclosed in PCT / EP2016 / 076895, having the %Li content disclosed in this application relative to a magnesium alloy, and at least one low-melting-point magnesium-lithium alloy disclosed in this document. In one embodiment, the non-organic portion of the material comprises one of the titanium alloys disclosed in PCT / EP2016 / 076895. In one embodiment, the non-organic portion of the material comprises one of the titanium alloys of PCT / EP2016 / 076895, but the %Li content relative to a magnesium alloy is disclosed in this application. In one embodiment, the non-organic portion of the material comprises at least one of the titanium alloys disclosed in PCT / EP2016 / 076895 and at least one low-melting-point magnesium-lithium alloy disclosed in this document. In one embodiment, the non-organic portion of the material comprises one of the titanium alloys disclosed in PCT / EP2016 / 076895, but having the %Li content disclosed herein relative to a magnesium alloy, and at least one low-melting-point magnesium-lithium alloy described herein.In one embodiment, the non-organic portion of the material comprises one of the titanium alloys disclosed in PCT / EP2016 / 076895, having a high %Li content and a melting temperature of the low-melting-point magnesium-lithium alloy disclosed herein, as a low-melting-point alloy. Quite surprisingly, in some embodiments, it has been found that even a low %Li content can be used when using a titanium-lithium alloy as the low-melting-point alloy, as long as a somewhat higher pressure (at the levels described herein) is subsequently used in cold-pressure-intensive (CIP), warm-pressure-intensive (WIP), or equivalent processes applied during forming. In one embodiment, the non-organic portion of the material comprises at least two different metal alloys with a sufficiently large difference between their melting temperatures. A sufficiently large difference between their melting temperatures is, in different embodiments, 20°C or higher, 55°C or higher, 82°C or higher, 105°C or higher, 155°C or higher, 205°C or higher, 255°C or higher, 310°C or higher, 410°C or higher, 610°C or higher, 820°C or higher, and even 1050°C or higher. In one embodiment, any magnesium-based alloy and / or any low-melting-point magnesium-lithium alloy previously disclosed in this document has the highest melting point among the different metal alloys of the non-organic portion. In one embodiment, the two different metal alloys with a sufficiently large difference between their melting temperatures are the alloys disclosed in this document. In one embodiment, a metal alloy such as any alloy disclosed in PCT / EP2016 / 076895 has the highest melting point among the different metal alloys of the non-organic portion. In one embodiment, a metal alloy, such as any alloy disclosed in PCT / EP2016 / 076895, has the lowest melting point among different metal alloys of its non-organic portion. In one embodiment, two different metal alloys with a sufficiently large difference between their melting temperatures are the alloys disclosed in PCT / EP2016 / 076895. In one embodiment, both alloys are particulate. In one embodiment, two different metal alloys with a sufficiently large difference between their melting temperatures are powdery. In one embodiment, the alloy with the higher melting point has a greater D50 than the alloy with the lower melting point. In different embodiments, the difference in D50 between two different metal alloys with a sufficiently large difference between their melting temperatures is 5 times or more, 6 times or more, 7 times or more, 8 times or more, and even 11 times or more. The inspection conditions are disclosed in the last part of this document. The inventors have found that in several applications, particularly when the powder is a magnesium-lithium alloy and / or aluminum-lithium alloy, at least one powder in the non-organic portion of the material comprises a beta phase, which has made it easier to mold the material while dramatically reducing the time required in molding. In one embodiment, the non-organic portion of the material comprises at least one metal powder comprising magnesium and / or lithium having at least a beta phase portion, and in a different embodiment, the non-organic portion of the material comprises a metal powder comprising lithium having at least 22%, at least 42%, at least 52%, at least 62%, and furthermore all of the present beta phase by volume. In one embodiment, volume refers to the volume of the metal powder, etc. In a different embodiment, the non-organic portion of the material comprises a metal powder comprising magnesium having at least 22% beta phase by volume, at least 52%, at least 52%, at least 62%, and furthermore all of the present beta phase. In one embodiment, volume refers to the volume of the metal powder, etc. Considering all the metal particles in the non-organic portion of the material, in a different embodiment, all the metal particles contain at least 42% beta phase by volume of such particles, at least 52%, at least 62%, at least 72%, and furthermore all of the particles contain beta phase. In different embodiments, the metal particles comprise at least 0.6%, at least 2.2%, at least 6%, at least 11%, and further at least 21% beta phase by volume. In this embodiment for some embodiments, it is very important that the material is not sosoloid, because mixing during the process before formability is confirmed would significantly reduce formability. In different embodiments, what has been previously disclosed occurs even when the low lithium content is more than 35%, more than 52%, and further more than 62% by volume of the metal particles, and in different embodiments, if the lithium-containing alloy is a magnesium-based alloy, the low lithium content refers to less than 19%, less than 14%, less than 9%, less than 6%, and further less than 3% by weight with respect to the weight of such particles.In the case of aluminum alloys containing lithium, as previously disclosed in one embodiment, a low lithium content of more than 35%, more than 52%, and even more than 62% by volume of the metal particles occurs even when the lithium content is low, and in different embodiments, a low lithium content refers to less than 49%, less than 39%, less than 19%, less than 14%, less than 8%, and even less than 3% by weight with respect to the weight of such particles. In some applications, the powder is more moldable when the non-organic portion of the material in different embodiments comprises an alloy in which the weight of the alloy contains more than 16%, more than 18%, more than 32%, more than 38%, more than 46%, more than 54%, or more than 67% %Li by weight. The alloy may further comprise at least 0.12% by weight of an element selected from %As, %Sc, %Y, %La, %Th, %Ce, and %Ca. In different embodiments, the alloy may further comprise more than 0.28%, more than 0.56%, or more than 0.78% by weight of %Gd+%Nd+%Sm+%Y+%Pr+%Sc+%Pm+%Eu+%Tb+%Dy+%Ho+%Er+%Tm+%Yb+%Lu+%Th by weight of the alloy. In one embodiment, the alloy may further comprise at least two elements selected from %Ca, %Y, %Al, %Be, %Sc, %Zr, %Hf, %Ti, %La, %Ce, %As and / or %Y, having a total content of at least 0.52%, at least 1.1%, at least 1.64%, and further at least 2.18% by weight of the alloy in different embodiments. In different embodiments, the alloy may further comprise at least 12%, at least 16%, at least 22%, at least 26%, and further at least 62% by weight of %Mg in the alloy. In some embodiments, this alloy is a relevant element among the non-organic parts of the material. In some applications, the powder is more moldable if the non-organic portion of the material in different embodiments comprises a powder mixture having more than 12% by weight of %Mg and less than 18% by weight of lithium. Furthermore, the powder mixture may further comprise one element selected from %As, %Sc, %Y, %La, %Th, %Ce and / or %Ca in different embodiments, in amounts of at least 0.12%, 0.28%, 1.12%, and further 2.2% by weight of the powder mixture. In one embodiment, at least two of these elements are present in the powder mixture. In one embodiment, the powder mixture further comprises, in different embodiments, %Gd+%Nd+%Sm+%Y+%Pr+%Sc+%Pm+%Eu+%Tb+%Dy+%Ho+%Er+%Tm+%Yb+%Lu+%Th in different embodiments, in amounts of weight of the powder mixture. In some embodiments, this powder mixture is a relevant element among the non-organic parts of the material. In some applications, the powder is more moldable when the non-organic portion of the material comprises, in different embodiments, a metallic phase having more than 32%, more than 39%, more than 49%, more than 56%, and even more than 71% by weight with respect to the weight of such alloy. In other applications, the metallic phase further comprises, in different embodiments, at least 12%, at least 16%, and even more than 24% by weight of %Mg, and in one embodiment, the metallic phase further comprises at least two elements selected by total weight from %Ca, %Al, %Be, %Sc, %Zr, %Hf, %Ti, %La, %Ce, %As, and / or %Y. In some embodiments, this metallic phase is the relevant phase in the non-organic portion of the material. In some applications, the powder is more moldable if the non-organic portion of the material comprises, in different embodiments, a metallic phase having at least 12%, at least 16%, at least 22%, at least 26%, at least 27%, at least 32%, and even at least 62% %Mg by weight with respect to the weight of such metallic phase. In some embodiments, this metallic phase is the relevant phase within the non-organic portion of the material. In some applications, the powder is more moldable if the non-organic portion of the material comprises, in different embodiments, a metallic phase having at least 1.6%, at least 2.8%, at least 3.6%, at least 4.2%, at least 6.3%, at least 18.6%, and even at least 32.1% %Al by weight with respect to the weight of such a metallic phase. In some embodiments, this metallic phase is the relevant phase within the non-organic portion of the material. In some applications, when the non-organic portion of the material comprises a metallic phase having at least 32% %Li by weight in different embodiments, the powder is easier to mold, and when all metallic phases present in the non-organic portion of the material are totaled, %Li is less than 18% by weight and %Mg is greater than 12% by weight with respect to the total weight of all metallic phases. In some embodiments, this metallic phase is the relevant phase in the non-organic portion of the material. In some applications, the powder is more moldable if the non-organic portion of the material comprises, in different embodiments, a metallic phase having at least 6%, at least 8%, at least 12%, and even at least 16% %Ga by weight with respect to the weight of such metallic phase. In some embodiments, this metallic phase is the relevant phase within the non-organic portion of the material. In some applications, the powder is more moldable if the non-organic portion of the material comprises, in different embodiments, a metallic phase having at least 12%, at least 16%, at least 19%, and even at least 23% by weight of such metallic phase. In some applications, powders are more moldable if the non-organic portion of the material comprises a metallic phase in which the sum of %Ga+%Bi+%Rb+%Cd+%Cs+%Sn+%Pb+%Zn+%In by weight, in different embodiments, is at least 12%, at least 16%, at least 19%, and even more than 23%. In some embodiments, this metallic phase is the relevant phase within the non-organic portion of the material. In some applications, the performance of the powder is improved when the non-organic portion of the material comprises, in different embodiments, a mixture of metal phases in which %Li is less than 18%, less than 16%, and less than 12% by weight with respect to the total weight of such metal phases. In different embodiments, the mixture of metal phases further comprises %Mg exceeding 12%, more than 16%, more than 24%, and even more than 31% by weight with respect to the total weight of such metal phases. In different embodiments, the mixture of metal phases further comprises %Ca at least 1.2%, at least 1.6%, at least 2.1%, and even more than 3.6% by weight with respect to the total weight of such metal phases. In some embodiments, this metal phase is the relevant phase within the non-organic portion of the material. The inventors have found that in several applications, it is preferable that the non-organic portion of the material comprises at least one particulate magnesium-lithium alloy having a low melting point. For several applications, it is disclosed in this document that at least one of the low-melting-point magnesium-lithium alloys is particulate having melting temperatures of less than 390°C, less than 340°C, less than 290°C, less than 240°C, and further less than 190°C in different embodiments. In different embodiments, the non-organic portion of the material comprises relevant elements having melting temperatures of 645°C or less, 580°C or less, 495°C or less, 445°C or less, 395°C or less, 345°C or less, 285°C or less, 245°C or less, 195°C or less, 145°C or less, and further less than 95°C. Testing conditions are disclosed in the last part of this document. In some embodiments, having a very high percentage of non-organic material is beneficial. For some embodiments, this is often true when the organic phase is largely, predominantly, or completely removed within the molded material. When the organic phase is largely or completely retained, in some embodiments a slightly lower content of non-organic material is preferable, and in some embodiments a slightly higher content of non-organic material is beneficial. In different embodiments, the powder mixture provided in the non-organic portion filler of the material should have a relative density of 52% or more, 62% or more, 67% or more, 72% or more, 76% or more, 82% or more, 86% or more, and furthermore 92% or more. Relative density is defined as the ratio of tap density to volume density expressed as a percentage (relative density = [tap density / theoretical density] * 100), where tap density is measured according to the American Society for Testing and Materials B527-15 and theoretical density is measured according to the American Society for Testing and Materials B962-08. In one embodiment, the powder mixture provided in the filler of the non-organic portion of the material should have an apparent density of 52% or more, 62% or more, 67% or more, 72% or more, 76% or more, 82% or more, 86% or more, and furthermore, 92% or more. Apparent density is defined as the ratio of apparent density to volume density expressed as a percentage (apparent density = [apparent density / theoretical density] * 100), where apparent density (at 20°C and 1 atm) is measured according to American Society for Testing and Materials B329-06, and theoretical density (at 20°C and 1 atm) is measured according to American Society for Testing and Materials B962-08. In some embodiments, the percentage in question is by volume (percentage by volume of the non-organic portion relative to the volume of the material). In different embodiments, the non-organic portion of the material should constitute 52%, 62%, 67%, 72%, 76%, 82%, 86%, and 92% or more by volume. In one embodiment, the percentages disclosed above are by weight and refer to the percentage by weight of the non-organic portion relative to the weight of the material. In one embodiment, the non-organic portion of the material comprises a powdered metal, and in another embodiment, it comprises a powder mixture (in this document, a powder mixture means a powder made by mixing two or more powders of different chemical components, particle size distributions, particle shape, or combinations thereof, in accordance with American Society for Testing and Materials B243-16a). In this document, when referring to powders, D3 refers to the particle size of 3% of the volume of the sample consisting of smaller particles in the cumulative particle size distribution, D5 refers to the particle size of 5% of the volume of the sample consisting of smaller particles in the cumulative particle size distribution, D10 refers to the particle size of 10% of the volume of the sample consisting of smaller particles in the cumulative particle size distribution, D50 refers to the particle size of 50% of the volume of the sample consisting of smaller particles in the cumulative particle size distribution, and D85 refers to the particle size of D90 refers to the particle size that accounts for 85% of the volume of the sample consisting of the smallest particles in the cumulative distribution of particle sizes, D95 refers to the particle size that accounts for 95% of the volume of the sample consisting of the smallest particles in the cumulative distribution of particle sizes, D97 refers to the particle size that accounts for 97% of the volume of the sample consisting of the smallest particles in the cumulative distribution of particle sizes, and D98 refers to the particle size that accounts for 98% of the volume of the sample consisting of the smallest particles in the cumulative distribution of particle sizes. The values ​​D3, D5, D10, D50, D95, D97, and D98 are obtained by laser diffraction according to ISO 13320-2009. In alternative embodiments, the percentages disclosed above are by mass and are denoted as D3m, D5m, D10m, D50m, D85m, D95m, D97m, and D98m. In this document, the particle size of metal powder refers to D50 unless otherwise specified. For some applications, fine powder is preferred. In different embodiments, the powder should have a D50 of 78 micrometers or less, 48 ​​micrometers or less, 28 micrometers or less, 18 micrometers or less, or 8 micrometers or less. For some applications, slightly coarser powder is acceptable or advantageous.In different embodiments, the powder should have D50 of 1900 micrometers or less, 800 micrometers or less, 780 micrometers or less, 380 micrometers or less, 210 micrometers or less, 200 micrometers or less, 190 micrometers or less, 180 micrometers or less, 120 micrometers or less, 90 micrometers or less, and further 45 micrometers or less. In some applications, fine powder is even disadvantageous. In different embodiments, the powder should have D50 of 2 micrometers or more, 6 micrometers or more, 8 micrometers or more, 12 micrometers or more, 22 micrometers or more, 42 micrometers or more, 72 micrometers or more, 122 micrometers or more, 222 micrometers or more, and 312 micrometers or more. In different embodiments, the provisions of this paragraph apply, but D50 is replaced by D90, D95, D97, D98, D10, D5, and further D3. When mixing one or more powders to make a powder mixture, references are made to the particle size of the powder mixture in some embodiments (wherein this document, when one or more powders are mixed, particle size refers to the particle size of a homogeneous mixture of such powders that is considered as a single powder). In one embodiment, any of the above references to D3, D5, D10, D50, D90, D95, D97, or D98 can be further applied to the size of the powder mixture. Even more surprisingly, in some cases it is beneficial to have a mixture of small and large particles, and it is sufficient to ensure that the overall D98 of all the particles used together is sufficiently large. In different embodiments, these are 210 micrometers or larger, 310 micrometers or larger, 410 micrometers or larger, 510 micrometers or larger, 610 micrometers or larger, 810 micrometers or larger, and 1010 micrometers or larger. In different embodiments, what is stated for D98 should be applied to D95, D85, and further to D50. When mixing one or more powders to make a powder mixture, in some embodiments, the particle size values ​​D5, D10, D50, D90, D95, D97, or D98 disclosed above refer to the size of the powder mixture.In the alternative embodiment, the values ​​D5, D10, D50, D90, D95, D97, and D98 disclosed above can be replaced by D5m, D10m, D50m, D95m, D97m, and D98m, respectively. In this document, when a high packing density is desired, a special mixing of non-organic parts or powders is performed. This works remarkably well for surprisingly high values ​​of fillers, even those containing organic parts. In one embodiment, powder mixing having two or more modes is preferred, in another embodiment, powder mixing having three or more modes is preferred, and in another embodiment, powder mixing having four or more modes is preferred. A mode refers to the size value that occurs most frequently. In powder mixing, a mode is defined as the size value that occurs most frequently in a uniform test sample made by mixing powders each having its own mode. In the case of a two-mode mixture, the coarsest fraction has volume fractions (considering only non-organic parts) between 60% and 85%, between 65% and 78%, between 70% and 75%, and further between 71.5% and 73% in different embodiments. In one embodiment, the coarsest fraction refers to the powder fraction having the maximum D90, and in another embodiment, it refers to the powder fraction having the highest D90 / D50 ratio. In the case of the three modes of mixing, the coarsest fraction has volume fractions (considering only the non-organic portion) between 50% and 80%, between 55% and 72%, between 60% and 68%, and between 63.5% and 66% in different embodiments. In one embodiment, the coarsest fraction refers to the powder fraction having the maximum D90, and in one alternative embodiment, it refers to the powder fraction having the highest D90 / D50 ratio. The finest fraction has volume fractions (considering only the non-organic portion) between 2% and 25%, between 5% and 20%, between 7% and 15%, and between 10% and 12% in different embodiments. In one embodiment, the finest fraction refers to the powder fraction having the minimum D50, and in one alternative embodiment, it refers to the powder fraction having the lowest D50 / D10 ratio. In the case of the four modes of mixing, the coarsest fractions, in different embodiments, have volume fractions between 45% and 75%, between 50% and 70%, between 60% and 68%, and further between 58.5% and 63% (considering only the non-organic portion).In one embodiment, the coarsest fraction refers to the powder fraction having the maximum D90, in one alternative embodiment it refers to the powder fraction having the highest D90 / D50 ratio, and the second finest fraction has volume fractions between 2% and 25%, between 5% and 20%, between 6% and 14%, and further between 9% and 11% (considering only the non-organic portion) in different embodiments. In one embodiment, the second finest fraction refers to the powder fraction having the second smallest D50, in one alternative embodiment it refers to the powder fraction having the second lowest D50 / D10 ratio, and the finest fraction has volume fractions between 12% and 0.5%, between 9% and 3%, between 7% and 5%, and between 6.5% and 5.5% (considering only the non-organic portion) in different embodiments. In one embodiment, the finest fraction refers to the powder fraction having the minimum D50, and in one alternative embodiment it refers to the powder fraction having the lowest D50 / D10 ratio. In one embodiment, the inventors found that some degree of relationship should be considered between fraction D10 and the nearest smaller fraction D90. In one embodiment, the inventors found that some degree of relationship should be considered between fraction D5 and the nearest smaller fraction D95. In one embodiment, the inventors found that some degree of relationship should be considered between fraction D3 and the nearest smaller fraction D97. In different embodiments, the relationships must be 7.1 times or more, 8.1 times or more, 9.1 times or more, and 10.6 times or more. With regard to the narrowness of the distribution of each fraction, the inventors found that using the control parameter ND = (D90 - D10) / D50 is a good control method. In different embodiments, ND should be less than 0.8, less than 0.58, less than 0.4, less than 0.18, less than 0.08, and even less than 0.038. In one embodiment, within the definition of ND, D90 is replaced by D97 and D10 is replaced by D3.A very surprising observation is that when the fraction with the smallest size is not centered on the target D50 but is just smaller than the desired D50 because it is a cut tail of the normal distribution rather than a narrow normal distribution, the achievable relative density is higher (for example, a mixture of fraction 1: 600+ / -25 micrometers and fraction 2: <45 micrometers can reach a higher relative density than a mixture of fraction 1: 600+ / -25 micrometers and fraction 2: 45+ / -5 micrometers). Therefore, in such cases, ND control is performed for all fractions except the finest fraction, the D97 criterion is applied but the ND criterion is not applied, and rather NDS = (D97 - D50) / (D50 - D3) is applied. In different embodiments, NDS should be less than 0.9, less than 0.8, less than 0.68, and even less than 0.49. What is described here extends to all mixtures of particulate powders or materials in this document where a high relative density is advantageous. Surprisingly, for some materials, if the finest fraction has very fine particles, the density of the filler decreases sharply. Therefore, for some applications, the finest fraction should limit the finest particle size. In different embodiments, the D5 of the finest fraction should be greater than 0.6 micrometers, greater than 1.2 micrometers, greater than 3.2 micrometers, greater than 5.3 micrometers, greater than 8.1 micrometers, greater than 11 micrometers, greater than 16 micrometers, and even greater than 21 micrometers. In different embodiments, D5 in the above statement should be replaced by D10, and in other embodiments by D3. In one embodiment, the finest fraction refers to the powder fraction having the minimum D50, and in one alternative embodiment, it refers to the powder fraction having the lowest D50 / D10 ratio. When mixing one or more powders to make a powder mixture, in some embodiments the particle size values ​​ND, NDS, D3, D5, D10, D50, D95, and D97 disclosed above refer to the size of the powder mixture.In alternative embodiments, the values ​​D3, D5, D10, D50, D95, and D97 disclosed above can be replaced by D3m, D5m, D10m, D50m, D95m, and D97m, respectively. In some applications, the powder should be extremely spherical and the particle size distribution should be very narrow. The sphericity of the powder is a dimensionless parameter defined as the ratio of the surface area of ​​the particle to the surface area of ​​a sphere having the same volume as the particle. Sphericity is determined by dynamic image analysis. In different embodiments, it is desirable for the powder to have a sphericity greater than 0.53, greater than 0.76, greater than 0.86, and even greater than 0.92. When high compression of metal nanoparticles is desired, in different embodiments, metal powders with high sphericity greater than 0.92, greater than 0.94, greater than 0.98, and even greater than 1 are often desirable. With regard to sphericity, for some applications, it can be evaluated for the majority of the powder with respect to the average sphericity of the most spherical particles, and in different embodiments, 60%, 78%, 83%, and even 96% or more of the volume of powder used should be considered the average to be calculated. In one embodiment, the metal powder is spherical. In one embodiment, a spherical powder having any of the particle size values ​​(D3, D5, D10, D50, D85, D90, D95, D97, D98, ND, or NDS) of this paragraph is disclosed above. In some embodiments, the values ​​disclosed above refer to sphericity and particle size of the powder mixture. For some applications, excessive sphericity is disadvantageous due to interference with sinterability or other reasons. In different embodiments, preferred sphericities of less than 0.94%, less than 0.88%, less than 0.68%, and even less than 0.48% may be advantageous. In one embodiment, the particles are irregular. In one embodiment, the metal powder is irregular (the term irregular means any particles having corners, sharp edges, and angular protrusions). In one embodiment, the powder is irregular and has one of the particle size values ​​disclosed above in this paragraph (D3, D5, D10, D50, D85, D90, D95, D97, D98, ND, or NDS). In some embodiments, the values ​​disclosed above refer to the size of the irregularly shaped powder mixture. In some embodiments, it has been found that the cooling rate of the powder should be controlled, although it is just as important as the particle size. In different embodiments, the cooling rate of the powder during manufacturing should be set to 11K / s or higher, 110K / s or higher, 1100K / s or higher, 11000K / s or higher, 1100000K / s or higher, or 1100000K / s or higher. In this document, there are several embodiments comprising organic and particulate non-organic parts, and in some embodiments, special attention must be paid to the fraction of one of the components. In most embodiments, volume fractions are used, but in some embodiments, weight fractions are used. For these embodiments to which references to weight fractions are made, there are automatically parallel embodiments to which the expressed fractions should be interpreted as volume fractions, even if the same restrictions apply. This is especially true for different embodiments to which the density of the particulate material or powder to which the restrictions apply is 1.4 times, 2.2 times, 3.2 times, 5.2 times, and even 6.4 times higher than the density of the organic part when considered as a whole. There are several applications that benefit from lightweight construction. Well-known examples include structural elements or parts that are damaged by certain types of movement, such as moving parts of transport vehicles or machinery. Furthermore, stationary structural elements can also benefit from lightweight construction. Among the many elements that benefit from lightweight construction, the list of performance specifications is quite diverse. While most elements share the requirement of not failing under applied loads, given the highly diverse characteristics of those loads, the concept of not failing can vary considerably for different elements, such as being unbulky, strain-limited, and crack-free, all of which are combined with the lowest possible associated weight. Beyond this largely shared requirement, all applications have a list of many additional requirements or specifications. Some require specific electrical or magnetic operation, others have several temperature requirements relating to heat transport, temperature requirements (high or low), temperature distribution requirements, etc., and many have appearance requirements such as roughness and color, and the list continues to grow. The inventors have found that by observing certain rules and constraints, as described in this document, the advantages of molded lightweight construction described in this document can be obtained. The rules and restrictions set forth in this document restrict a certain degree of freedom for designers who use the invention to manufacture specific elements for specific applications, but leave a certain degree of freedom for designers / users of the invention, providing the remaining requirements for a given application in the best possible compromise. A certain degree of freedom is provided to meet other relevant requirements through some flexibility in specific choices such as the organic and non-organic parts of the material and the manufacturing method, but this is always provided within the guidelines of this document in order to obtain the relevant benefits. Some embodiments are as follows: In one embodiment, the non-organic portion of the material comprises any magnesium-based alloys previously disclosed herein and / or any low-melting-point magnesium-lithium alloys previously disclosed herein having more than 32% powdered %Li by weight and a D50 of 800 micrometers or less. In one embodiment, the non-organic portion of the material comprises any magnesium-based alloy and / or low-melting-point magnesium-lithium alloy previously disclosed herein, such as any low-melting-point magnesium-lithium alloy previously disclosed herein, having more than 32% %Li by weight with respect to the weight of any magnesium-based alloy and / or low-melting-point magnesium-lithium alloy previously disclosed herein, and not lacking %Mg, and having a D50 of 120 micrometers or less. In one embodiment, the non-organic portion of the material comprises a powder mixture having a D50 of 800 micrometers or less, comprising an alloy having at least 32% %Li by weight with respect to the weight of the alloy, wherein the powder mixture has less than 18% %Li and more than 12% %Mg by weight with respect to the weight of the powder mixture. In one embodiment, the non-organic portion of the material comprises a powder mixture having a D50 of 800 micrometers or less, comprising an alloy having at least 32% %Li by weight with respect to the weight of the alloy, wherein the powder mixture has less than 18% %Li and more than 12% %Mg by weight with respect to the weight of the powder mixture, and within the powder mixture there is one powder type having a D50 at least three times greater than the D50 of another powder type. Due to the densification mechanisms often used during molding, the inventors have found that for several applications, it is beneficial to use materials containing hard particles or reinforcing fibers to impart specific tribological behavior and / or increase mechanical properties. In this sense, several applications benefit from the use of materials containing hard particles or reinforcing fibers, where the volume of hard particles relative to the volume of the material is 2% or more, 5.5% or more, 11% or more, and even 22% or more by volume in different embodiments. These hard particles are not necessarily incorporated separately, but may be incorporated at a different stage or synthesized during the process. Typical hard particles are those of high hardness. In different embodiments, the hard particles used are diamond, cubic boron nitride (cBN), oxides (aluminum, zirconium, iron, etc.), nitrides (titanium, vanadium, chromium, molybdenum, etc.), carbides (titanium, vanadium, tungsten, iron, etc.), borides (titanium, vanadium, etc.), and mixtures thereof, and typically any particle has hardnesses of 11 GPa or more, 21 GPa or more, 26 GPa or more, and even 36 GPa or more in different embodiments. The inventors have found that the use of whiskers and other ceramic fibers in the material may also be beneficial for some applications of the molded materials disclosed herein. For some applications, recycled shredded carbon fiber reinforced plastic (usually with a polyurethane matrix) may also be advantageously used instead of fibers in one embodiment. In some embodiments comprising powders, the inventors have found that some powders behave very differently depending on whether they are exposed to oxygen or not. In some embodiments, the difference is due to a different gas. In one embodiment, the powder is exposed to an oxidizing atmosphere. In one embodiment, the organic part also has the functionality to prevent the powder surface from coming into direct contact with air. In one embodiment, the organic part also has the functionality to prevent the powder surface from coming into direct contact with oxygen. In one embodiment, upon heating, the organic part releases a gas that reacts at least partially with at least one of the incorporated powder surfaces. In one embodiment, during debinding, the organic part reacts at least partially with at least one of the incorporated powder surfaces. In one embodiment, upon decomposition, the organic part releases a gas that reduces at least partially with at least one of the incorporated powder surfaces. In one embodiment, at least one of the powder species is deformed before mixing with the organic part. In one embodiment, at least one of the powder species is reduced before mixing with the organic part. In one embodiment, the protective or protected atmosphere has a noble gas or a mixture thereof as its main element. In one embodiment, the protective or protected atmosphere has nitrogen as its main element. In one embodiment, the protective or protected atmosphere has gaseous hydrocarbons as its main element. In one embodiment, the protective or protected atmosphere has carbon dioxide as its main element. In one embodiment, the protective or protected atmosphere has a gas with carbon bridges as its main element. In one embodiment, the protective or protected atmosphere has hydrogen as its main element. In one embodiment, the protective or protected atmosphere has a gas containing halogens as its main element. In different embodiments, the halogens include fluorine, chlorine, and bromine, and in one embodiment, the halogen-containing gas is FS6. In one embodiment, the protective or protected atmosphere has a gas containing sulfur as its main element, and in one embodiment, it has a gas containing phosphorus. In different embodiments, the protective or protected atmosphere includes nitrogen, gaseous hydrocarbons, carbon dioxide, gas with carbon bridges, hydrogen, and a gas containing halogens.In different embodiments, halogens include fluorine, chlorine, and bromine. In one embodiment, the halogen-containing gas is FS6. In different embodiments, the protective or protected atmosphere includes a sulfur-containing gas and a phosphorus-containing gas. In different embodiments, the reducing atmosphere includes, as its main elements, nitrogen, gaseous hydrocarbons, carbon dioxide, carbon bridged gases, hydrogen, and halogen-containing gases. In different embodiments, halogens include fluorine, chlorine, and bromine. In one embodiment, the halogen-containing gas is FS6. In different embodiments, the reducing atmosphere includes, as its main elements, a sulfur-containing gas, a phosphorus-containing gas, nitrogen, gaseous hydrocarbons, carbon dioxide, carbon bridged gases, and hydrogen, and in one embodiment, a halogen-containing gas. In different embodiments, halogens include fluorine, chlorine, and bromine, and in one embodiment, the halogen-containing gas is FS6. In one embodiment, the reducing atmosphere includes a sulfur-containing gas, and in one embodiment, a phosphorus-containing gas. The main elements refer to elements that, in some embodiments, constitute at least 6%, 11%, 16%, 22%, 26%, and further 36% by volume with respect to the total volume of the gas. In alternative embodiments, the percentages disclosed above are by weight. More embodiments of non-organic phases / elements that can be present in the material will be disclosed later in this document. Some of the materials described in this application are based on the inventor's best knowledge, which is not known in the art, and are therefore novel in themselves. These are the result of combinations of different embodiments. Some examples are given. The material comprises an organic portion and a non-organic portion, the organic portion having a relevant element having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 185°C, and the non-organic portion comprising a metallic phase having at least 16% %Li by weight with respect to the weight of the metallic phase and a metallic phase having at least 12% %Mg by weight with respect to the weight of the metallic phase. The material having non-organic components comprises a metallic phase containing at least 32% by weight of %Li, and when all present metallic phases (including intermetallic phases) are added together, %Li is less than 18% by weight of the total weight of the metallic phase, %Mg is greater than 12% by weight of the total weight of the metallic phase, and %Ca is greater than 1.2% by weight of the total weight of the metallic phase. The material comprises an organic portion and a non-organic portion, the organic portion having relevant elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 185°C, and the non-organic portion comprising a powder mixture having a D50 of 800 micrometers or less. The material comprises an organic portion and a non-organic portion, the organic portion having relevant elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 230°C, the non-organic portion comprising a powder mixture having D50 of 120 micrometers or less and at least one metallic interphase, and the material further comprises fiber reinforcement. Organic materials containing the relevant elements have a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [0.66 psi] at at least 185°C, and a one-time radiation dose of at least 0.26 J / cm² at frequencies above 0.12 THz. 2 When exposed to radiation, polymerization can be achieved with a conversion factor of 12% or more. The material comprises an organic portion and a non-organic portion, the organic portion having relevant elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 185°C, the non-organic portion comprising a powder mixture having a D50 of 1900 micrometers or less, and the material further comprising carbon nanotubes stretched by mechanical action. The material comprises an organic portion and a non-organic portion, the organic portion having relevant elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 185°C, the non-organic portion comprising a powder mixture having a D50 of 1900 micrometers or less, and the material further comprising fiber reinforcement. The material has organic and non-organic parts, with the non-organic part accounting for more than 52% by volume. The non-organic part comprises a powder mixture having a D50 of 1900 micrometers or less, and the non-organic part comprises gallium. The material is further reinforced with fibers. The material comprises an organic portion and a non-organic portion, the organic portion having relevant elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 185°C, the non-organic portion comprising a powder mixture having a D50 of 1900 micrometers or less, the material further comprising fiber reinforcement, and the non-organic portion having 0.6% or more %Ga by weight relative to the weight of the non-organic portion. The material comprises an organic portion and a non-organic portion, the organic portion having relevant elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 230°C, the non-organic portion comprising a powder mixture having a D50 of 1900 micrometers or less, and the material further comprising fiber reinforcement comprising carbon nanotubes stretched during the manufacturing process of the molded material. The material comprises an organic portion and a non-organic portion, the organic portion having a relevant element having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 185°C, and the non-organic portion comprising a metallic phase having a melting temperature of 580°C or less. In alternative embodiments, in the materials disclosed above, the thermal deflection temperature of the relevant element of the organic portion of the material can be replaced by either the glass transition temperature, or the degradation temperature, or the melting temperature of such relevant element of the organic phase. The test conditions for thermal deflection temperature are disclosed in the final part of this document. Other embodiments are as follows: The material comprises an organic portion and a non-organic portion, the organic portion comprising elements having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] which is 0.45 times higher than the melting temperature (0.45 * Tm) of at least one element in the non-organic portion of the material. A material in which the relevant elements constitute at least 0.6% by weight of the material is disclosed above. A material in which the relevant elements constitute at least 11% by weight of such portion of the material is disclosed above. A material in which the non-organic portion of the material constitutes at least 52% by weight of the material is disclosed above. The material disclosed above comprises a metallic phase having a deflection temperature of at least 185°C and a non-organic portion having a melting temperature of less than 590°C. In the material disclosed above, the non-organic portion of the material comprises a metallic phase having at least 16% by weight of %Li with respect to the weight of the metallic phase. In the materials disclosed above, the non-organic portion of the material comprises one or more metallic phases, the non-organic portion comprises a metallic phase having at least 32% by weight of %Li, and when all metallic phases in the non-organic portion of the material are added together in the non-organic portion of the material, %Li is less than 18% by weight with respect to the weight of the non-organic portion, and %Mg is greater than 12% by weight with respect to the weight of the non-organic portion. In the materials disclosed above, the non-organic portion of the material comprises a metallic phase having at least 12% by weight of %Ga+%Bi with respect to the weight of the non-organic portion. In the materials disclosed above, the non-organic portion of the material comprises a powder mixture having a D50 of 1900 micrometers or less. In the materials disclosed above, the non-organic portion of the material comprises a mixture of at least two powders in which one powder has a D50 at least three times greater than the D50 of the other powder in the mixture. In the materials disclosed above, the material further comprises fiber reinforcement comprising carbon nanotubes stretched during the manufacturing process of the material. In the material disclosed above, the non-organic portion of the material comprises organic elements whose glass transition temperature (Tg) increases by 55°C or more when subjected to a transformation treatment. In the material disclosed above, the material comprises at least 11% particles by volume.In the materials disclosed above, the organic material comprises non-organic particles that are susceptible to polymerization when exposed to radiation at frequencies between 0.32 THz and 19 THz. The materials disclosed above have a conversion of more than 12% at a depth of 2560 micrometers or more below the surface of the material when exposed to radiation above 0.82 THz. In alternative embodiments, in the materials disclosed above, the thermal deflection temperature of the relevant elements of the organic portion of the material can be replaced in different embodiments by either the glass transition temperature, or the degradation temperature, or the melting temperature of such relevant elements of the organic phase. Any material disclosed herein is particularly suitable in some embodiments for use in the methods disclosed herein to produce molded materials having excellent weight and to achieve ratios in an economical manner, especially for lightweight structures. The inventors have found that it is possible to mold the material using additive manufacturing or any other similar method and to expose this molded material to pressure and temperature. In some embodiments, the molded material is further subjected to debinding and / or compaction before obtaining the desired molded material. There are yet another embodiment in which the molded material undergoes further steps such as thermomechanical treatment or machining before obtaining the desired molded material. This method involves the following steps: Step 1. Take the ingredients. Step 2. Shape the material using molding technology. Step 3. The molded material obtained in Step 2 is subjected to a process involving a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. and optionally Step 4. The molded material obtained in Step 3 undergoes a binder removal process. Step 5. The molded material obtained in Step 3 or 4 undergoes a compaction process. The methods should be considered as different embodiments for all materials disclosed and taken in this document. In one set of embodiments, the material taken in step 1 comprises the material described in PCT / EP2016 / 076895. In one set of embodiments, the material taken in step 1 is the material described in this document, with at least a portion of the non-organic portion replaced by the non-organic material as described in PCT / EP2016 / 076895. In one set of embodiments, the material in step 1 comprises at least one of the alloys disclosed in PCT / EP2016 / 076895, which are incorporated in this document by full reference. In some embodiments, the material comprising the organic and non-organic parts provided in step 1 is any material disclosed herein. In some embodiments, the material comprises at least one magnesium alloy disclosed herein. In some embodiments, the material comprises at least one low-melting-point magnesium-lithium alloy disclosed herein. Thus, any embodiment relating to the materials disclosed herein is usable within this method and can be combined with any embodiment of this method in any combination, provided they are not mutually exclusive. As previously disclosed, the inventors have found that the same method described herein can be applied to materials described in PCT / EP2016 / 076895, which constitute a particular embodiment. In one embodiment, at least one of the metal alloys of PCT / EP2016 / 076895 is used as an organic element of the organic portion of the material. In one embodiment, one of the aluminum alloys of PCT / EP2016 / 07689. Considering the remaining percentage relative to the original amount, as described, in different embodiments, the remaining organic portion should be less than 49%, less than 34%, less than 24%, less than 14%, less than 9%, less than 4%, less than 2%, and even less than 0.4% by volume. In one alternative embodiment, the percentages disclosed above are by weight. In one embodiment, the organic portion is left only to a trace level. In one embodiment, the organic portion is completely removed. In some embodiments, there should be enough organic portion to ensure functionality. In some embodiments, it is beneficial to reduce the organic portion to as little as possible. In different embodiments, at least 35%, at least 45%, at least 56%, at least 66%, at least 76%, and even at least 82% by weight of the organic portion should be left. In some embodiments, even slight degradation of the organic portion should be prevented. In different embodiments, at least 86%, at least 92%, at least 96%, at least 97%, and even at least 99% by weight of the organic portion should be left. In some embodiments, volume percentages are more relevant. In different embodiments, at least 35%, at least 45%, at least 56%, at least 66%, at least 76%, and even at least 82% of the organic portion by volume should be left. In some embodiments, even slight degradation of the organic portion should be prevented. In different embodiments, at least 86%, at least 92%, at least 96%, at least 97%, and even at least 99% of the organic portion by volume should be left. In some embodiments, the organic portion is largely or completely removed in the resulting molded material. In some embodiments, the organic portion is largely or completely retained. In one embodiment, the percentage of the portion to be left is calculated as the remaining fraction of the portion, i.e., the amount of the portion is divided by the original amount of the portion and expressed as a percentage. In one embodiment, this is done by measuring the kilograms of the portion per cubic meter of the element.As a helpful example, suppose an element is manufactured from a material having 400 kg of organic matter per cubic meter of material. After the relevant process, only 10 kg of organic matter remains per cubic meter of the element (weight and volume are often measured and converted in different units), thus leaving 2.5% of the organic matter. The volume control does not have to be 1 m³. In different embodiments, the volume control can be liters, cubic centimeters, cubic inches, or cubic millimeters. In one embodiment, the remaining portion is calculated as the volume of such portion of the total volume of the material, and the process is continued in the same manner (dividing the final amount by the original amount and expressing the result as a percentage). In one embodiment, a method comprising the step of particle injection molding (PIM) being a molding technique (particles P may be metal M, ceramic C, intermetallic compounds, or any other), and a step comprising cold isostatic pressing (CIP), warm isostatic pressing (WIP), or a similar method, can be combined into one by using at least one relevant element having a metal alloy, such as any metal alloy disclosed herein, having a sufficiently low melting temperature (at the level described herein), ultimately slightly increasing the process time of the molding method, thereby omitting cold isostatic pressing, warm isostatic pressing, or a similar method. In different embodiments, the molding technique is an additive manufacturing (AM) molding technique such as, but is not limited to, 3D printing, inkjet methods, S-print, M-print techniques, techniques in which concentrated energy is used to generate a molten pool in which raw materials (powder or wire materials) are stored using a laser (laser deposition and laser compaction), arc or E-beam heat sources (metal direct deposition and electron beam direct melting), fused deposition modeling (FDM) material jetting, direct metal laser sintering (DMLS), selective laser melting (SLM), electron beam melting (EBM), selective laser sintering (SLS), stereolithography (SLA), and digital photolithography (DLP), and other or any other advanced additive manufacturing techniques. In some embodiments, additive manufacturing includes techniques capable of printing protruding features without the need for auxiliary materials. In different embodiments, the molding technique is polymer molding, metal injection molding (MIM), particle injection molding (PIM), injection molding, compression molding, thermoforming, or any other similar technique. In one embodiment, any method described in this document as applicable to PIM molding technology (particle injection molding) can be applied to any molded material manufactured by a similar process and may be any manufacturing method involving a molding die or tool and a method of applying pressure to the material manufactured in the die or tool (by injection, by compression, by extrusion, etc.). In different embodiments, the molding technique used in step 2 is an additive manufacturing (AM) molding technique using wire, rod, filament or any extrudeable shape, which may be conceptually described as fused deposition modeling (FDM). In one embodiment, the materials in steps 1 and 2 are liquid (suspension, mixture, etc.). In one embodiment, the materials in steps 1 and 2 are liquid and polymerizable or curable under exposure to one of the wavelengths described herein. In different embodiments, the molding techniques used in step 2 include additive manufacturing (AM) molding techniques using activators to promote binding, additive manufacturing (AM) molding techniques using masking materials to delay or hinder binding, additive manufacturing (AM) molding techniques in which several fluids are ejected onto a base material through a small opening, additive manufacturing (AM) molding techniques in which several fluids are ejected onto a powder-like base material through a small opening, additive manufacturing (AM) molding techniques in which several fluids are ejected onto an assembled molded material through a small opening, additive manufacturing (AM) molding techniques based on polymerization or curing by exposure to radiation of a certain wavelength or a combination of wavelengths, additive manufacturing (AM) molding techniques based on stereolithography (SLA), additive manufacturing (AM) molding techniques based on the principle of two-photon stereolithography, additive manufacturing (AM) molding techniques based on micro-stereolithography, any additive manufacturing (AM) molding techniques, and additive manufacturing (AM) molding techniques having the ability to print protruding features without the need for auxiliary materials. In one embodiment, the material in steps 1 and 2 comprises a polymer that can be injected. In different embodiments, the methods used in step 2 are manufacturing methods based on polymer injection comprising the material, manufacturing methods based on PIM (particle injection molding), and manufacturing methods based on MIM (metal injection molding). In one embodiment, any other method similar to additive manufacturing (AM), particle injection molding (PIM), or metal injection molding (MIM) may be used to shape the material. Several embodiments of the molding technique, including additive manufacturing (AM), are disclosed in more detail later in this document.Accordingly, any embodiment of any additive manufacturing (AM) technique disclosed throughout this document may be used in this method and may be combined with any embodiment of this method without restriction, provided that they are not incompatible. In one embodiment, the material in steps 1 and 2 is a wire, rod, filament, or any extrudeable shape. In one embodiment, the material in steps 1 and 2 is a wire, rod, filament, or any extrudeable shape, which is mechanically stretched during manufacturing and / or before it is incorporated into the manufactured molded material. The molded material obtained in step 2 is subjected to a process involving pressure and temperature. In different embodiments, the molded material is subjected to a process in step 3 involving temperatures exceeding 0.35*Tm, 0.45*Tm, 0.52*Tm, 0.61*Tm, 0.69*Tm, 0.74*Tm, and further exceeding 0.86*Tm, where Tm refers to the melting temperature of the relevant phase or element having the lowest melting temperature in the non-organic portion of the material. The inventors have found that in different embodiments, the material comprises a metallic phase and / or element having a solidification temperature range (where liquid and solid coexist), the molded material is subjected to temperatures exceeding Tm (melting temperature) of the relevant phase or element having the lowest melting temperature in the non-organic portion of the material, and further exceeding 1.1*Tm. In some applications, when the material comprises a powder having a liquid phase, even without a solidification range, the temperatures used in some embodiments are above 1.2*Tm and further exceeding 1.5*Tm. The testing conditions are disclosed in the final section of this document. A highly beneficial process for Step 3 is the application of WIP (Warm Isostatic Pressing). Warm isostatic pressing (WIP) is generally only meaningful if the pressure is applied for several minutes, as is the case with cold isostatic pressing (CIP). Applying pressure (or temperature in the case of warm isostatic pressing (WIP)) for longer periods often degrades the properties, and in most cases the competitiveness of the molded material becomes less than that of others. In some embodiments, longer process times have been found to be surprisingly beneficial, and in some embodiments even essential. In different embodiments, the process times for warm isostatic pressing (WIP) are 36 minutes or longer, 66 minutes or longer, 106 minutes or longer, 226 minutes or longer, 246 minutes or longer, and even 506 minutes or longer. In one embodiment, the pressure is not applied continuously, but rather in cycles of high pressure. In one embodiment, the pressure is not applied continuously, but rather in a set of pulses. In one embodiment, the pressure is not held continuously. In one embodiment, the temperature is applied through temperature control of a fluid acting as a pressure transmitter. In one embodiment, pressure is applied first, and once a certain level is reached, then temperature is applied. In another embodiment, once a certain temperature is reached, then pressure is applied first. In one set of embodiments, what is stated for warm isostatic pressurization (WIP) is extendable to cold isostatic pressurization (CIP) or any other process that applies pressure. In one embodiment, manufacturing step 3 comprises a process in which temperature and pressure are simultaneous at some point in time. In another embodiment, the maximum temperature and the maximum pressure applied in manufacturing step 3 do not coincide over time. In some embodiments, the molded material obtained in step 3 is subjected to a process in which the organic portion is removed at least partially. In some embodiments, the organic portion is completely removed. In one embodiment, a debinding agent is used to remove the organic portion at least partially. In one embodiment, the debinding agent is a thermal debinding agent. In some embodiments, the organic portion is removed at least partially using a thermal process. In different embodiments, the debinding agent is a non-thermal process selected from non-thermal debinding agents, chemical debinding agents, catalysts, wicking, drying, supercritical extraction, organic solvent extraction, aqueous solvent extraction or freeze-drying, and others. In different embodiments, at least the organic portion is removed using a thermal process at temperatures above 0.3*Tm, above 0.45*Tm, above 0.55*Tm, and further above 0.7*Tm, where Tm refers to the melting temperature of the relevant element or phase having the lowest melting temperature in the non-organic portion of the material. The inspection conditions are disclosed in the last part of this document. In one embodiment, the consolidation step comprises sintering. In one embodiment, the consolidation step comprises hot isotropic pressing (HIP). In one embodiment, the consolidation step comprises some form of plastic deformation. In one embodiment, steps 4 and 5 are performed simultaneously. In one embodiment, the method further comprises a step of performing several additional forming steps involving removal of material at a certain location (e.g., trimming, drilling, machining, polishing, etc.). In one embodiment, the method further comprises a step of performing several additional forming steps involving material stacking (thermal spraying or cold spraying, metal coating, building welding or direct energy deposition (AM) or other). In one embodiment, the method further comprises a step of heat treating the formed material. In one embodiment, the method further comprises a step of locally heat treating the formed material. In one embodiment, the method further comprises a step of applying a surface heat treatment at least locally to the formed material. In one embodiment, the method further comprises a step of applying a coating at least locally to the formed material. In one embodiment, the method further comprises a step of applying paint at least locally to the formed material. In one embodiment, the method further comprises a step of joining the formed material to another element, structure, component, part or any other. In one embodiment, the method further comprises any other method steps described herein. In one embodiment, the method further comprises a washing or rinsing step. In one embodiment, the method further comprises a shot peening, blasting or similar step. With respect to the weight of the organic portion in the material, considering the weight-based proportion of the organic portion in the resulting molded material, in one embodiment, at least 35% of the organic portion by weight should remain. In different embodiments, less than 49%, less than 34%, less than 24%, less than 14%, less than 9%, less than 4%, less than 2%, and less than 0.4% of the organic portion by weight should remain, and furthermore, no remaining organic portion may be found. In alternative embodiments, the proportions disclosed above are by volume, referring to the volume of the organic portion in the resulting molded material with respect to the volume of the organic portion in the material. In some other embodiments after compaction, with respect to the volume of organic parts in the material, considering the volume of organic parts in the resulting molded material, in one embodiment, at least 35% of the volume of organic parts should remain. In different embodiments, less than 49%, less than 34%, less than 24%, less than 14%, less than 9%, less than 4%, less than 2%, and less than 0.4% of the volume of organic parts should remain, and furthermore, no organic parts remain. In alternative embodiments, the percentages disclosed above are by weight, and refer to the weight of organic parts in the resulting molded material with respect to the weight of organic parts in the material. In some cases, the density of the molded material obtained by this method exceeds 96%, 98%, and even 99% of the theoretical density in different embodiments. The density of the obtained element is measured by Archimedes' principle in accordance with the American Society for Testing and Materials B962-08. All embodiments of this method are combinable, provided they are not mutually exclusive. Any embodiment disclosed herein can be combined with this method in any combination provided, and they are not mutually exclusive. Methods 1 to 7 disclosed below are some examples of combinations of embodiments of the methods described in the last paragraph. Thus, any embodiment for any disclosed method step can be combined with any method 1 to 7 in any combination provided and are not mutually exclusive. Furthermore, any other embodiments disclosed herein can be combined with any method 1 to 7 in any combination provided and are not mutually exclusive. Method 1 The method consists of the following steps. Step 1: Take the ingredients Step 2: Shape the material using molding technology. Step 3: The molded material obtained in Step 2 is subjected to a process involving a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Step 4: The molded material obtained in Step 3 undergoes a debindering process, in which at least a portion of the organic parts are removed. Step 5: The molded material obtained in Step 4 undergoes a compaction process. Therefore, the resulting molded material has a remaining organic portion that accounts for less than 49% by weight of the organic portion in the material. Furthermore, the resulting molded material has a density exceeding 96% of the theoretical density. Method 2 The method consists of the following steps. Step 1: Take a material comprising an organic part and a non-organic part, wherein the organic part comprises relevant elements whose deflection temperature, measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi], is at least 22°C higher than the 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases in the non-organic part of the material, and the non-organic part comprises metallic phases having at least 30% by weight of %Ga or %Li with respect to the weight of such metallic phases, and if all metallic phases (including intermetallic compounds) are considered, %Li and %Ga are less than 18% by weight with respect to the total weight of the metallic phases. Step 2: Shape the material using polymer molding technology. and optionally Step 3: The molded material obtained in Step 2 is subjected to a process involving a pressure exceeding 0.6 MPa and a temperature exceeding 0.46*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Step 4: The molded material obtained in Step 2 or 3 undergoes a compaction process. Therefore, the resulting molded material has a remaining organic portion that accounts for less than 49% by weight with respect to the weight of the organic portion in the material. Method 3 The method consists of the following steps. Step 1: Take a material comprising an organic part and a non-organic part, wherein the organic part comprises a relevant element whose deflection temperature, measured according to the American Society for Testing and Materials D648-07 under a load of 0.46 MPa [66 psi], is at least 22°C higher than the phase or element having the lowest melting temperature among the relevant elements / phases in the non-organic part of the material, or 0.45*Tm of that element, and the non-organic part comprises a metallic phase having at least 56% %Li by weight with respect to such metallic phase, and %Li is less than 18% by weight with respect to the total weight of the metallic phase when all present metallic phases (including intermetallic compounds) are added together. Step 2: The material is formed by an additive manufacturing process based on polymerization or curing by exposure to radiation at wavelengths of 460 nm or higher. Step 3: The molded material obtained in Step 2 is subjected to a process involving a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Step 4: The molded material obtained in Step 3 undergoes a debindering process, in which at least a portion of the organic parts are removed. Step 5: The molded material obtained in Step 4 undergoes a compaction process. Therefore, the resulting molded material has a remaining organic portion that accounts for less than 49% by weight of the organic portion in the material. Furthermore, the resulting molded material has a density exceeding 96% of the theoretical density. Method 4 The method consists of the following steps. Step 1: Take a material comprising an organic portion and a non-organic portion, wherein the organic portion comprises relevant elements whose deflection temperature, measured according to the American Society for Testing and Materials D648-07 under a load of 0.46 MPa [66 psi], is at least 22°C higher than the 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases in the non-organic portion of the material, and the non-organic portion comprises one of the materials described in PCT / EP2016 / 076895. Step 2: The material is formed by an additive manufacturing process based on polymerization or curing by exposure to radiation at wavelengths of 460 nm or higher. Step 3: The molded material produced in Step 2 is subjected to a process involving a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Step 4: The molded material obtained in Step 3 undergoes a debindering process, in which at least a portion of the organic parts are removed. Step 5: The molded material obtained in Step 4 undergoes a compaction process. Therefore, the resulting molded material has a remaining organic portion that accounts for less than 49% by weight with respect to the weight of the organic portion in the material. Method 5 The method consists of the following steps. Step 1: Take the materials disclosed in this document. Step 2: Molding the material using additive manufacturing, PIM (particle injection molding), or a similar process. Step 3: The material formed in Step 2 is subjected to a process involving a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. The inspection conditions for thermal deflection temperature are disclosed in the final section of this document. In one embodiment of Methods 1 to 5, the weight ratio of the remaining organic portion in the resulting molded material is considered in relation to the weight of the organic portion in the material. In a different embodiment, at least 35%, at least 45%, at least 56%, at least 66%, at least 76%, and at least 82% of the organic portion by weight should be left. In some embodiments, even slight degradation of the organic portion should be prevented. In a different embodiment, at least 86% of the organic portion by weight should be left, and at least 92%, at least 96%, at least 97%, and even more than 99% of the organic portion should be left. In some other embodiments after compaction in Methods 1 to 5, the volume of organic parts in the material is considered in relation to the volume of organic parts in the resulting molded material. In different embodiments, at least 35%, at least 45%, at least 56%, at least 66%, at least 76%, and even more than 82% of the organic parts by volume should be left. In some embodiments, even slight degradation of the organic parts should be prevented. In different embodiments, at least 86%, at least 92%, at least 96%, at least 97%, and even more than 99% of the organic parts by volume should be left. The density of the molded material obtained by this method exceeds 96%, 98%, and even 99% of the theoretical density in different embodiments, and the density of the resulting elements is measured by Archimedes' principle in accordance with the American Society for Testing and Materials B962-08. In alternative embodiments of Methods 2 to 5, the thermal deflection temperature of the relevant element in the organic part of the material can be replaced in different embodiments by either the glass transition temperature, or the degradation temperature, or the melting temperature of such relevant element in the organic phase, and the same relationship should be satisfied with respect to the melting temperature of the phase or element having the lowest melting temperature among the relevant element / phase in the non-organic part of the material. The inspection conditions are disclosed in the last part of this document. In Method 2, in a different embodiment, the organic portion has relevant elements whose deflection temperature, measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi], is at least 22°C above 0.52 times the melting temperature of the relevant element / phase having the lowest melting temperature among the relevant elements / phases in the non-organic portion of the material (at least 22°C above 0.52*Tm), at least 22°C above 0.76*Tm, and further at least 22°C above 0.82*Tm. If Step 3 is optional, the pressure applied in Step 3 is, in a different embodiment, 1.1 MPa or greater, 2.1 MPa or greater, 11 MPa or greater, and / or 26 MPa or greater. In this method, after step 2, the elements are formed, or in embodiments where step 3 is also applied, after step 3, the melting temperature of the non-organic portion in the formed material is at least 20%, at least 34%, at least 48%, at least 61%, and further at least 66% higher than the melting temperature of this metallic phase of the material in different embodiments. In different embodiments, the molding technique used in step 2 is polymer molding technique, metal injection molding (MIM), particle injection molding (PIM), injection molding, compression molding, thermoforming, or any other similar technique. In one embodiment, the metallic phase contains 56% %Li by weight with respect to the weight of such metallic phase. The inventors have found that in some embodiments, the correct selection of particle size is very important. In different embodiments, particles having a D50 of less than 50 micrometers, less than 20 micrometers, and further less than 20 micrometers are desirable. Moreover, in alternative embodiments, any other particle sizes disclosed herein can be combined in this method, provided they are not incompatible.In some embodiments, when this method 2 is performed, the inventors have surprisingly found that, if step 3 or step 4 is applied, after step 2 or after step 3 or step 4, the melting temperature of the non-organic portion of the molded material (the obtained molded material) rises compared to the melting temperature of the non-organic portion of the material (the non-organic portion of the material taken in step 1 before molding), and the melting temperature of the non-organic portion of the obtained molded material is 1.2 times, 1.4 times, 1.8 times, and even 2.1 times higher than the melting temperature of the non-organic portion of the material in different embodiments. In some embodiments, when this method 2 is performed, the inventors have surprisingly found that, if step 3 or step 4 is applied, after step 2 or after step 3 or step 4, the melting temperature of the metal portion of the formed material (the metal portion of the material taken in step 1 before forming) rises compared to the melting temperature of the metal portion of the material (the metal portion of the material taken in step 1 before forming), and the melting temperature of the metal portion of the formed material is 1.2 times, 1.4 times, 1.8 times, and even 2.1 times higher than the melting temperature of the metal portion of the material in different embodiments. In methods 3 and 4, materials that cure at wavelengths of 460 nm or higher refer to materials that react well to such wavelengths. All embodiments of this method are combinable, provided they are not mutually exclusive. Some other examples of combinations of method embodiments can be found in the following paragraphs. Method 6 The method comprises the following steps. Step 1: Take a material comprising an organic portion and a non-organic portion, wherein the organic portion has a corresponding element having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 120°C, and the non-organic portion comprises a metallic phase having a Tm lower than 495°C. Step 2: Shape the material using molding technology. Step 3: The molded material produced in Step 2 is subjected to a process that simultaneously involves a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Method 7 The method comprises the following steps. Step 1: Take a material comprising an organic portion and a non-organic portion, wherein the organic portion has a relevant element having a deflection temperature measured according to American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 120°C, and the non-organic portion comprises a metallic phase as described in PCT / EP2016 / 076895. Step 2: Shape the material using molding technology. Step 3: The molded material obtained in Step 2 is subjected to a process that simultaneously involves a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Method 8 The method consists of the following steps. Step 1: Take a material comprising an organic part and a non-organic part, wherein the organic part has a relevant element having a deflection temperature measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi] at at least 120°C, and the non-organic part comprises a metallic phase having at least 16% %Li by weight with respect to the weight of such metallic phase. Step 2: Shape the material using molding technology. Step 3: The molded material obtained in Step 2 is subjected to a process involving a pressure exceeding 55 MPa and a temperature exceeding 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. Method 9 The method comprises the following steps. Step 1: Take a material comprising an organic part and a non-organic part, wherein the organic part comprises relevant elements whose deflection temperature, measured according to the American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi], is at least 22°C higher than the 0.45*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases in the non-organic part of the material, and the non-organic part comprises a metallic phase having at least 30% by weight of %Ga or %Li with respect to the weight of such metallic phase, and if all metallic phases (including intermetallic compounds) present in the non-organic part are taken into consideration, %Li and %Ga are less than 18% by weight with respect to the total weight of the metallic phase. Step 2: Shape the material using polymer molding technology. and optionally Step 3: The molded material obtained in Step 2 is subjected to a process involving a pressure exceeding 0.6 MPa and a temperature exceeding 0.46*Tm of the phase or element having the lowest melting temperature among the relevant elements / phases of the non-organic portion of the material. The inspection conditions for thermal deflection temperature are disclosed in the final section of this document. In methods 6, 7, 8, and 9, the weight-based percentage of the remaining organic portion in the molded material is considered with respect to the weight of the organic portion in the material. In different embodiments, at least 35%, at least 45%, at least 56%, at least 66%, at least 76%, and even at least 82% of the organic portion by weight should be left. In some embodiments, even a slight degradation of the organic portion should be prevented. In different embodiments, at least 86%, at least 92%, at least 96%, at least 97%, and even at least 99% of the organic portion by weight should be left. In alternative embodiments, the percentages disclosed above are by volume and refer to the volume of the organic portion in the resulting molded material with respect to the volume of the organic portion in the material. In some other embodiments of Methods 6, 7, 8, and 9, after compaction, the volume of the organic portion in the resulting molded material is taken into consideration with respect to the volume of the material. In different embodiments, at least 35%, at least 45%, at least 56%, at least 66%, at least 76%, and even more than 82% of the organic portion by volume should be left. In some embodiments, even slight degradation of the organic portion should be prevented. In different embodiments, at least 86%, at least 92%, at least 96%, at least 97%, and even more than 99% of the organic portion by volume should be left. In alternative embodiments, the percentages disclosed above are by weight and refer to the weight of the organic portion in the resulting molded material with respect to the weight of the organic portion in the material. In alternative embodiments of methods 6 to 8, the thermal deflection temperature of the relevant element of the material can be replaced in different embodiments by either the glass transition temperature, or the degradation temperature, or the melting temperature of such relevant element of the organic phase. In Method 9, in a different embodiment, the organic portion has relevant elements whose deflection temperature, measured according to American Society for Testing and Materials D648-07 at a load of 0.46 MPa [66 psi], is at least 22°C above 0.52 times the melting temperature of the relevant element / phase having the lowest melting temperature among the relevant elements / phases in the non-organic portion of the material (at least 22°C above 0.52*Tm), at least 22°C above 0.76*Tm, and further at least 22°C above 0.82*Tm. If Step 3 is optional, the pressure applied in Step 3 is at least 1.1 MPa, at least 2.1 MPa, at least 11 MPa and / or at least 26 MPa in a different embodiment. In this method, after step 2, the elements are formed, or in embodiments in which step 3 is also applied, after step 3, the melting temperature of the non-organic portion in the formed material is at least 20%, at least 34%, at least 48%, at least 61%, and further at least 66% higher than the melting temperature of this metallic phase of the material in different embodiments. In different embodiments, the molding technique used in step 2 is polymer molding, metal injection molding (MIM), particle injection molding (PIM), injection molding, compression molding, thermoforming, or any other similar technique. In one embodiment, the metallic phase contains 56% %Li by weight with respect to the weight of such metallic phase. The inventors have found that in some embodiments, the correct selection of particle size is very important. In different embodiments, particles having a D50 of less than 50 micrometers, less than 20 micrometers, and even less than 20 micrometers are desirable. Moreover, in alternative embodiments, any other particle sizes disclosed herein can be combined in this method, provided they are not incompatible. In some embodiments, when performing this method 9, the inventors have surprisingly found that, if step 3 is applied, after step 2 or after step 3, the melting temperature of the non-organic portion of the molded material (the obtained molded material) rises compared to the melting temperature of the non-organic portion of the material (the non-organic portion of the material taken in step 1 before molding), and the melting temperature of the non-organic portion of the obtained molded material is 1.2 times, 1.4 times, 1.8 times, and even 2.1 times higher than the melting temperature of the non-organic portion of the material in different embodiments. In some embodiments, when performing this method 9, the inventors have surprisingly found that, if step 3 is applied, after step 2 or after step 3, the melting temperature of the metal portion of the molded material (the obtained molded material) rises compared to the melting temperature of the metal portion of the material (the metal portion of the material taken in step 1 before molding), and the melting temperature of the metal portion of the obtained molded material is 1.2 times, 1.4 times, 1.8 times, and even 2.1 times higher than the melting temperature of the metal portion of the material in different embodiments. In alternative embodiments of method 9, the thermal deflection temperature of the relevant element of the material can be replaced in different embodiments by either the glass transition temperature, or the degradation temperature, or the melting temperature of such relevant element of the organic phase, and the same relationship should be satisfied with respect to the melting temperature of the phase or element having the lowest melting temperature among the relevant elements / phases in the non-organic portion of the material. Some types of lattice structures achieve good mechanical strength, deformability, compliance, or any other relevant functional mechanical properties in particularly normalized terms (properties divided by the density of the lattice). Metallic lattices achieve these highly normalized mechanical property values, partly because the arrangement of the metals is highly optimized, resulting in a very high air content in the overall volume occupied by the material. Since air has a very low density, it strongly reduces the overall density. The authors found that most organic materials used have a density much higher than that of air, but the inventors found that functionality can be greatly improved, and despite the increase in weight, the solution is surprisingly advantageous. In one embodiment, this is applied to the structure of elements using a lattice made of a material comprising organic parts and non-organic parts comprising at least one metal or one metal alloy. In one embodiment, the lattice is a so-called superlattice. In one embodiment, the lattice is a three-dimensional repeat of the unit cell found in nature. In one embodiment, the lattice is any structure that can be increased by repeating the basic unit cell. In one embodiment, the lattice is a structure that can be increased to more than 85% by repeating a basic unit cell. In one embodiment, the lattice is any structure that achieves superior normalized mechanical properties compared to bulkier materials having the same alloying and microstructure (normalized mechanical properties mean mechanical properties divided by the density of the structure, where volume is not considered as voids within the material). In some embodiments, the material comprises an organic portion and a non-organic portion comprising a metallic alloy compacted in a manner that involves at least partial exposure to a certain temperature, but it is unique that at least the relevant fraction of the organic portion does not deteriorate significantly (the meanings of temperature, relevant fraction, and significant deterioration can be found elsewhere in this document in the same terms or equivalent expressions). In many applications, it is beneficial in this embodiment that the material can be in at least two states. One state is one that is easily molded by additive manufacturing (AM) or conventional polymer material molding methods. In one second state, the material exhibits high mechanical properties in some embodiments and high resistance to high temperatures and other factors in some embodiments. In the group of embodiments, one difference between the two states is the degree of aggregation or compaction of the non-organic phase. In one embodiment, at least some of the non-organic phase are individual particles in the original state, and at least some of these particles are aggregated or compacted in the later state. In one embodiment, particle aggregation / compactment involves the diffusion of atoms from one particle to another particle, and in one embodiment, involves diffusion bonding. In one embodiment, involves the formation of a particle network by diffusion. In one embodiment, particle aggregation / compactment is so strong that when the organic portion is removed and the aggregated / compacted particles are measured, in different embodiments, the equivalent average diameter is at least 12 times larger, at least 110 times larger, at least 1100 times larger, and even more than 110,000 times larger than the D50 of the original particles. In one alternative embodiment, D50 can be replaced with D50m. In the group of embodiments, one difference between the two states is the glass transition temperature (Tg) of at least one organic phase. In different embodiments, at least one of the organic elements is selected from a group of organic elements whose glass transition temperature (Tg) can be raised by 55°C, 105°C, 155°C, and 205°C or more when subjected to a transformation treatment (such as heat treatment, exposure to radiation, or chemical treatment). In one embodiment, the increase in glass transition temperature refers to the difference between the glass transition temperature of the organic element in the initial state and the glass transition temperature of the same organic material after being subjected to a transformation treatment, such as any method and / or molding technique disclosed herein or any other treatment applicable to the organic element, such as the application of pressure and / or temperature. The test conditions for identifying the glass transition temperature can be found in the last part of this document. For the group of embodiments, having rod-shaped materials (filaments, wound wires, or other filaments) is beneficial, and filament-based additive manufacturing (AM) processes can benefit from such types. This can be adapted to very large robotic structures for forming extremely large elements. In different embodiments, the filament has a non-organic phase with a length-to-equivalent diameter ratio greater than 6, greater than 11, greater than 16, greater than 26, greater than 106, and even greater than 1060. In one embodiment, the filament or rod-shaped material is stretched by mechanical action to facilitate the alignment of the non-organic phase with a high length-to-equivalent diameter ratio. In one embodiment, the filament or rod-shaped material is stretched by mechanical action to facilitate the elongation of the non-organic phase with a high length-to-equivalent diameter ratio. In one embodiment, the mechanically stretched filament or rod-shaped material comprises carbon nanotubes with a high length-to-equivalent diameter ratio. In one embodiment, the filament or rod-shaped material comprises fibers other than those already described (and therefore by reasonable definition) in this document. The materials described in this embodiment are highly beneficial for the production of elements via conventional manufacturing routes, especially when the majority of the organic portion is retained and the non-organic particles have a high ratio of length to equivalent diameter, and especially when the material comprises non-organic portions that are present from the beginning as particles but undergo an aggregation / consolidation process. In one embodiment, the material is formed by particle injection molding (PIM) (metal injection molding (MIM) or ceramic injection molding (CIM)), and in one embodiment, by known polymer material molding techniques. In one embodiment, the organic portion is largely retained in the manner defined above. One embodiment refers to a method by which a material previously disclosed in this document is formed by additive manufacturing (defined in this document as a technique that applies the principle of additive manufacturing, and thus assembles a physical three-dimensional shape by the continuous addition of material according to American Society for Testing and Materials 52900-15), and specifically the method disclosed below is applied to a material that can harden when exposed to radiation, and the molding technique comprises exposing at least a portion of the material to such radiation. The method for shaping the material comprises the following steps. Step 1: Provide a material that "hardens" when exposed to "appropriate radiation". Step 2: Molding the material provided in Step 1 using an additive manufacturing method that involves exposing at least a portion of the material to "appropriate radiation". Step 3: Separate the hardened or partially hardened material from the unhardened material. In one embodiment, “appropriate radiation” refers to the appropriate radiation for producing such hardening, and the values ​​of such radiation in different embodiments are disclosed later in this document. Any embodiment relating to materials previously disclosed herein can be combined with any embodiment of this method, provided they are not incompatible. In one embodiment, the “curing” material is a curable material. In one embodiment, the “curing” material is a resin. In one embodiment, the resin is polymerizable by exposure to interesting radiation (often called a photopolymerizable resin). In one embodiment, the “curing” material is a polymeric liquid comprising monomers or mixtures of monomers and a photoinitiator readily reactive to “appropriate radiation”. In one embodiment, the “curing” material is a polymeric liquid comprising monomers or mixtures of monomers and a dye readily reactive to “appropriate radiation”. In different embodiments, the “curing” material further comprises a reaction accelerator, a photochromic compound that can be sensitized when exposed to “appropriate radiation” (some examples include azobenzene, spiropyran, stilbene, fulgites, diarylethenes), a chromophore that can generate heat when exposed to “appropriate radiation”, and a thermal initiator. In one embodiment, the “curing” material further comprises elements that affect the viscosity of the mixture. In one embodiment, the “curing” material further comprises a small amount of elements that reduce the viscosity of the mixture. In one embodiment, the reduced viscosity is mechanical viscosity. In one embodiment, the reduced viscosity is cinematic viscosity. In one embodiment, the reduced viscosity is absolute viscosity. In a different embodiment, small amounts of the viscosity-reducing element are 19% or less, 14% or less, 9% or less, 4% or less, 1.8% or less, 0.9% or less, and further 0.4% or less by volume with respect to the volume of the organic part of the material. In an alternative embodiment, the percentages disclosed above refer to the volume of the material. In an alternative embodiment, the percentages disclosed above are by weight. Whether it is one element or more that reduces the viscosity, it must be indicated as small amounts. In a different embodiment, these are 0.1% or more, 0.6% or more, 1.1% or more, 2.1% or more, and further 5% or more by volume with respect to the volume of the organic part of the material. In an alternative embodiment, the percentages disclosed above are with respect to the volume of the material. In an alternative embodiment, the percentages disclosed above are by weight.Reducing the viscosity of a mixture means that the mixture of all elements except those assigned to viscosity reduction (and these elements are thought to have numerous functionalities in addition to reducing the viscosity of the mixture, such as particulate load dispersion and coloration) has a higher viscosity than the same mixture when the viscosity-reducing elements are added. In different embodiments, the viscosity is reduced by at least 2%, at least 6%, at least 11%, at least 16%, at least 22%, at least 42%, at least 52%, and further at least 72%. Viscosity is measured according to ISO 3219:1993 (at room temperature of 23°C and 1 atm). In one embodiment, the “curing” material is a resin. In another embodiment, it is a polymerizable resin upon exposure to “appropriate radiation” of interest. In a different embodiment, conversions of 12% or more, 16% or more, 22% or more, 36% or more, 42% or more, 52% or more, 62% or more, and 82% or more are achieved in the “curing” material with sufficient addition, and the conversions are measured using differential scanning calorimetry (DSC) of differences. In a different embodiment, the above values ​​of conversions are measured using differential scanning calorimetry (DSC) selectively, with proper adjustment according to the monomer and / or oligomer used, according to the method disclosed in DOI:10.1007 / s10853-005-5689-y, or further, with proper adjustment using Fourier transform infrared spectroscopy, according to DOI:10.1007 / s10965-011-9811-3, with proper adjustment according to the monomer and / or oligomer used, with proper adjustment according to the method disclosed in DOI:10.1007 / s10853-005-5689-y, or further, with proper adjustment using Fourier transform infrared spectroscopy. In a different embodiment, sufficient addition is 0.26 J / cm³ 2 More than 0.42J / cm 2 More than 0.94J / cm 2 Above, 1.72J / cm 2 Above, 3.6J / cm 2 Above, 5.2J / cm 2 Above, 16J / cm 2 Above, 26J / cm 2 The above, and furthermore 56 J / cm 2 That's all. In this embodiment and the following related embodiments, “suitable radiation” means radiation having wavelengths within a defined range, whether repeated or not in this paragraph. For some embodiments, a similarly specified power density may also be included. The range that defines “suitable radiation” depends on the selected application or embodiment. For some embodiments, a sufficient range of high and low frequencies is very important. In different embodiments, “suitable radiation” has frequencies of 120 THz or less, 89 THz or less, 69 THz or less, 49 THz or less, 19 THz or less, 9 THz or less, 2.1 THz or less, and further 0.8 THz or less. In some embodiments, the frequency of “suitable radiation” should not be too low. In different embodiments, “suitable radiation” has frequencies of 0.2 THz or higher, 1.1 THz or higher, 11 THz or higher, 21 THz or higher, 56 THz or higher, and further 102 THz or higher. The use of this precise radiation (upper and lower limits) allows for unexpectedly fast curing, even in opaque suspensions. In one set of embodiments, “appropriate radiation” is non-ionizing radiation. This simplifies the construction of the setting considerably if the potential harmfulness of the radiation is very low. In one embodiment, “appropriate radiation” is coherent radiation, which in one embodiment remains coherent after penetration into the material, and in one embodiment remains coherent after 0.1 mm penetration into the material (usually the brightest point of the penetration distance is used as a reference, and the remaining coherence is often interpreted as a related phase, with a difference of at least 20% of the ratio value between the phases being maintained). In one embodiment, “appropriate radiation” is free-propagating radiation, which in one embodiment consists of one or more discrete wavelengths, in one embodiment consists of one discrete wavelength, and in one embodiment consists of more than 1 but less than 9 discrete wavelengths. The inventors have found that this embodiment is also very beneficial for materials such as any materials previously disclosed in this document, particularly for materials containing a high volume of particles within the material, and that for some applications, the arrangement of particles within the material has a very adverse effect on the proper operation of the molding process. In different embodiments, the material comprises particles at a rate of 6% or more, 31% or more, 41% or more, 52% or more, 61% or more, 71% or more, and even 81% or more, relative to the volume of the material. In one alternative embodiment, the percentages disclosed above are by weight. In some applications, the volume content of particles should be controlled so that the desired transformation can be achieved, and in different embodiments, the volume of particles is 89% or less, 84% or less, 79% or less, 69% or less, 59% or less, and even 39% or less, relative to the volume of the material. In one alternative embodiment, the percentages disclosed above are by weight. In some embodiments, these particles refer to the non-organic portion of the material. In some embodiments, the relevant size of the cavities between particles is important. In different embodiments, the relevant sizes of interparticle cavities are 980 micrometers or less, 480 micrometers ...

Claims

1. A method for shaping a material, (1) A step of obtaining a material, wherein the material comprises an organic portion having at least one component or phase, and an inorganic portion having at least one component or phase, (2) A step of molding the material using molding technology, (3) A step of subjecting the material formed in step (2) to a process including a pressure exceeding 55 MPa and a temperature exceeding 0.45 × Tm, wherein Tm (°C) is the melting point of the phase or component having the lowest melting point among the components or phases in the inorganic portion of the material, and the component or phase in the inorganic portion is at least 1.2% by volume relative to the volume of the inorganic portion. It has, Furthermore, if necessary, (4) A step of subjecting the molded material obtained in step (3) to a binder removal process, and / or (5) A step of subjecting the molded material obtained in step (3) or (4) to a solidification process, A method having

2. The method according to claim 1, wherein the molding technique is selected from polymer molding techniques, injection molding, compression molding, thermoforming, or additive manufacturing.

3. The method according to claim 1 or 2, wherein the material taken in step (1) comprises an element in an amount of at least 1.2% of the weight of the material, and the element has a melting point of less than 580°C.

4. The method according to any one of claims 1 to 3, wherein the material obtained in step (1) comprises an organic portion comprising at least one component and an inorganic portion comprising at least one component.

5. The method according to any one of claims 1 to 4, wherein the deflection temperature (°C) of the organic component, as measured according to the ASTMD648-07 test at a load of 0.46 MPa (66 psi), is more than 0.45 times higher than the melting point of the inorganic component of the material, and the component or phase in the inorganic portion is at least 0.06% by volume relative to the volume of the inorganic portion.

6. The method according to any one of claims 1 to 5, wherein the inorganic portion of the material is at least 52% by weight relative to the weight of the material.

7. The method according to any one of claims 1 to 6, wherein, after applying the method, the volume of the organic portion remaining in the material is less than 24%.

8. The method according to any one of claims 1 to 7, wherein the density of the molded material obtained exceeds 96% of the theoretical density.

Citation Information

Patent Citations

  • Low rare earth high strength magnesium lithium alloy and preparation method thereof

    CN101787471A

  • Compressor bearing seat of gas turbine

    CN104451305A

  • Rapidly degradable magnesium alloy material as well as manufacturing method and application thereof

    CN104651691A

  • High-performance alkenyl magnesium alloy material and preparation method thereof

    CN106319310A

  • Lightweight high-strength magnesium alloy

    JP1994025788A