Apparatus for manufacturing laminated structures and method for manufacturing laminated structures

Abstract

To provide a laminated structure manufacturing device in which a filler can properly be applied to a gap between an edge part of a first substrate and an edge part of a second substrate, and a method for manufacturing a laminated structure.SOLUTION: A laminated structure manufacturing device manufactures a laminated structure by applying a filler F to a laminated substrate Ws obtained by bonding a first substrate W1 and a second substrate W2. The laminated structure manufacturing device includes: a substrate holding device 2 for holding and rotating the laminated substrate Ws; an application device 3 having a filler discharge port 21a for discharging the filler F to apply the filler F to a gap G between an edge part E1 of the first substrate W1 and an edge part E2 of the second substrate W2; a relative movement mechanism 30 for moving at least one of the application device 3 and the substrate holding device 2; a position detection device 5 for detecting position information on an application target point Tp in the gap G; and an operation control part 10 for adjusting relative positions of the filler discharge port 21a and the application target point Tp by the relative movement mechanism 30 on the basis of the detected position information.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a laminated structure manufacturing apparatus that suppresses cracking and chipping of a laminated substrate manufactured by bonding a plurality of substrates, and a method for manufacturing a laminated structure, and particularly relates to a technique for applying a filler to gaps between edge portions of a plurality of substrates constituting the laminated substrate. [Background Art]

[0002] In recent years, in order to achieve higher density and higher functionality of semiconductor devices, development of three-dimensional mounting technology for three-dimensionally integrating a plurality of stacked substrates has been progressing. In three-dimensional mounting technology, for example, the device surface of a first substrate on which integrated circuits and electrical wiring are formed is bonded to the device surface of a second substrate on which integrated circuits and electrical wiring are formed. Further, after bonding the first substrate to the second substrate, the second substrate is thinned by a polishing apparatus or a grinding apparatus. In this way, integrated circuits can be stacked in a direction perpendicular to the device surfaces of the first substrate and the second substrate.

[0003] In three-dimensional mounting technology, three or more substrates may be bonded together. For example, after thinning the second substrate bonded to the first substrate, a third substrate may be bonded to the second substrate, and then the third substrate may be thinned. In this specification, the form of a plurality of substrates bonded to each other may be referred to as a "laminated substrate".

[0004] Usually, the edge portion of a substrate is polished in advance into a rounded shape or a chamfered shape in order to prevent cracking and chipping. When grinding (thinning) a second substrate having such a shape, a sharp end portion is consequently formed on the second substrate. This sharp end portion (hereinafter referred to as a knife edge portion) is formed by the ground back surface of the second substrate and the outer peripheral surface of the second substrate. Such a knife edge portion is prone to chipping due to physical contact, and the laminated substrate itself may be damaged during conveyance of the laminated substrate. Additionally, if the bonding between the first substrate and the second substrate is insufficient, the second substrate may crack during grinding.

[0005] Therefore, to prevent cracking and chipping at the knife edge, a filler is applied to the edge of the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edge of the first substrate and the edge of the second substrate. The filler supports the knife edge formed after grinding the second substrate, preventing cracking and chipping at the knife edge. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2022-38834 [Overview of the project] [Problems that the invention aims to solve]

[0007] The application of filler to the gap between the edges of the first and second substrates is performed by rotating the laminated substrate and discharging the filler from the filler discharge port of the coating device. In order to properly apply the filler around the entire circumference of the gap in the laminated substrate, it is necessary to position the filler discharge port appropriately relative to the application target point within the gap. The position of the filler discharge port relative to the gap between the edges of the first and second substrates is adjusted by the operator's visual inspection. However, since the gap between the edges of the first and second substrates is small and requires precise adjustment, there are limitations to what can be achieved by the operator's visual inspection.

[0008] Furthermore, if the laminated substrate is eccentric with respect to the rotation center of the substrate holder that holds the laminated substrate, the position of the application target point in the radial direction of the laminated substrate may fluctuate during filler application. In addition, due to surface runout of the laminated substrate caused by rotating the laminated substrate, the position of the application target point in the thickness direction of the laminated substrate may fluctuate during filler application. In order to properly apply the filler over the entire circumference of the gap in the laminated substrate, it is necessary to adjust the position of the filler discharge port to follow the fluctuations in the position of the application target point due to surface runout and eccentricity.

[0009] Therefore, the present invention provides a laminated structure manufacturing apparatus and a method for manufacturing a laminated structure that can properly apply a filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate. [Means for solving the problem]

[0010] In one embodiment, a laminated structure manufacturing apparatus is provided, which manufactures a laminated structure by applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, the apparatus comprising: a substrate holding device for holding and rotating the laminated substrate; a coating device having a filler discharge port for dispensing the filler and for applying the filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate; a relative movement mechanism for moving at least one of the coating device and the substrate holding device; a position detection device for detecting position information of a coating target point in the gap; and an operation control unit that adjusts the relative position between the filler discharge port and the coating target point using the relative movement mechanism based on the detected position information. In one embodiment, the position detection device is configured to detect the position information, including the position of the coating target point in the radial direction of the laminated substrate and the position of the coating target point in the thickness direction of the laminated substrate.

[0011] In one embodiment, the position detection device includes an edge shape detector that detects the shape of the edge portion of the laminated substrate. In one embodiment, the position detection device includes an eccentricity detector that detects the position of the coating target point in the radial direction of the laminated substrate, and a surface runout detector that detects the position of the coating target point in the thickness direction of the laminated substrate. In one embodiment, the position detection device includes an image generation device that generates an image of the edge portion of the laminated substrate.

[0012] In one embodiment, the position detection device is configured to detect positional information of a plurality of coating target points within the gap along the circumferential direction of the laminated substrate, and the operation control unit is configured to adjust the relative position between the filler discharge port and each of the plurality of coating target points using the relative movement mechanism based on the detected positional information while the filler is being applied to the gap of the rotating laminated substrate. In one embodiment, the position detection device is configured to detect positional information of the coating target point when the coating target point is located upstream of the filler discharge port in the rotational direction of the laminated substrate.

[0013] In one embodiment, a method for manufacturing a laminated structure is provided, which involves applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, the method comprising: detecting positional information of a target application point in the gap between the edge portion of the first substrate and the edge portion of the second substrate; adjusting the relative position between a filler discharge port for dispensing the filler and the target application point based on the detected positional information; and applying the filler to the gap while rotating the laminated substrate. In one embodiment, the step of detecting the position information is a step of detecting the position information including the position of the coating target point in the radial direction of the laminated substrate and the position of the coating target point in the thickness direction of the laminated substrate.

[0014] In one embodiment, the step of detecting the position information includes detecting the shape of the edge portion of the laminated substrate using an edge shape detector. In one embodiment, the step of detecting the position information includes detecting the position of the coating target point in the radial direction of the laminated substrate using an eccentricity detector, and detecting the position of the coating target point in the thickness direction of the laminated substrate using a surface runout detector. In one embodiment, the step of detecting the position information includes generating an image of the edge portion of the laminated substrate using an image generation device.

[0015] In one embodiment, the step of detecting the position information is a step of detecting the position information of a plurality of application target points when, during the application of the filler to the gap, the plurality of application target points in the gap along the circumferential direction of the laminated substrate are located upstream of the filler discharge port in the rotational direction of the laminated substrate, and the step of adjusting the relative position is a step of adjusting the relative position between the filler discharge port and each of the plurality of application target points based on the detected position information during the application of the filler to the gap. In one embodiment, the step of detecting the position information is a step of rotating the laminated substrate before applying the filler to the gap to detect the position information of a plurality of application target points in the gap along the circumferential direction of the laminated substrate, and the step of adjusting the relative position is a step of adjusting the relative position between the filler discharge port and each of the plurality of application target points based on the detected position information while applying the filler to the gap. [Effects of the Invention]

[0016] According to the present invention, the relative position between the filler discharge port of the coating device and the coating target point can be adjusted based on the position information of the coating target point detected by the position detection device. As a result, the relative position between the filler discharge port and the coating target point can be maintained at a predetermined target relative position, and the filler can be properly applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate. [Brief explanation of the drawing]

[0017] [Figure 1] Figure 1(a) is a cross-sectional view showing an example of the edge portion of a laminated substrate to be processed, Figure 1(b) is a cross-sectional view showing an example of the edge portion of a laminated substrate coated with filler, and Figure 1(c) is a cross-sectional view showing an example of the edge portion of a laminated substrate that has been thinned after being coated with filler. [Figure 2] This is a front view showing one embodiment of a laminated structure manufacturing apparatus. [Figure 3] Figure 2 is a side view of the laminated structure manufacturing apparatus. [Figure 4]It is a schematic diagram illustrating one embodiment of a coating apparatus. [Figure 5] It is a schematic diagram illustrating how an edge shape detector detects position information of a coating target point within a gap between an edge portion of a first substrate and an edge portion of a second substrate. [Figure 6] It is a diagram illustrating the shape of an edge portion of a laminated substrate detected by the edge shape detector. [Figure 7] It is a flow chart illustrating one embodiment of a method for manufacturing a laminated structure. [Figure 8] It is a flow chart illustrating another embodiment of a method for manufacturing a laminated structure. [Figure 9] It is a front view illustrating another embodiment of an apparatus for manufacturing a laminated structure. [Figure 10] It is a side view of the apparatus for manufacturing a laminated structure shown in Fig. 9. [Figure 11] It is a front view illustrating still another embodiment of an apparatus for manufacturing a laminated structure. [Figure 12] It is a side view of the apparatus for manufacturing a laminated structure shown in Fig. 11. [Figure 13] It is a front view illustrating still another embodiment of an apparatus for manufacturing a laminated structure. [Figure 14] It is a diagram illustrating an example of an image of an edge portion of a laminated substrate generated by an image generating apparatus. [Figure 15] It is a side view illustrating one embodiment of an apparatus for manufacturing a laminated structure including a substrate holding apparatus moving mechanism. MODE FOR CARRYING OUT THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1(a) is a cross-sectional view illustrating an example of an edge portion of a laminated substrate Ws to be processed. As shown in Fig. 1(a), the laminated substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are bonded together. The first substrate W1 and the second substrate W2 used in the present embodiment are circular.

[0019] The edge portion E1 of the first substrate W1 is the outermost surface inclined with respect to the bonding surface (e.g., device surface) S1 of the first substrate W1. More specifically, the edge portion E1 of the first substrate W1 has a rounded or chamfered shape. Similarly, the edge portion E2 of the second substrate W2 is the outermost surface inclined with respect to the bonding surface (e.g., device surface) S2 of the second substrate W2. More specifically, the edge portion E2 of the second substrate W2 has a rounded or chamfered shape. The edge portions E1 and E2 are sometimes called bevels. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The edge portion of the laminated substrate Ws includes the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0020] Figure 1(b) is a cross-sectional view showing an example of the edge portion of a laminated substrate Ws coated with filler F. In this specification, a laminated substrate Ws coated with filler F may be referred to as a laminated structure. The filler F is applied to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. This gap G is formed around the entire circumference of the laminated substrate Ws and has a substantially triangular cross-section. The filler F is applied to fill this gap G.

[0021] Figure 1(c) is a cross-sectional view showing an example of the edge portion of a laminated substrate Ws that has been thinned after the application of the filler F. As a result of this thinning process, a knife edge portion Ek is formed on the edge portion E2 of the second substrate W2. Since the knife edge portion Ek is held (supported) by the filler F, cracking and chipping of the knife edge portion Ek are prevented.

[0022] Figure 2 is a front view showing one embodiment of a laminated structure manufacturing apparatus, and Figure 3 is a side view of the laminated structure manufacturing apparatus shown in Figure 2. The laminated structure manufacturing apparatus is an apparatus for manufacturing a laminated structure by applying a filler F to a laminated substrate Ws in which a first substrate W1 and a second substrate W2 are joined. The laminated structure manufacturing apparatus includes a substrate holding device 2 for holding the laminated substrate Ws in a vertical position and rotating the held laminated substrate Ws, a coating device 3 for applying the filler F, and a curing device 4 for curing the applied filler F.

[0023] The substrate holding device 2 comprises a holding stage 12 for holding the back surface of the laminated substrate Ws, a rotating shaft 13 connected to the center of the holding stage 12, and a rotating mechanism 15 for rotating the holding stage 12 and the rotating shaft 13. The holding stage 12 is configured to hold the back surface of the laminated substrate Ws by vacuum suction. As shown in Figure 3, the holding stage 12 has a holding surface 12a perpendicular to the horizontal plane. The laminated substrate Ws is held by the holding stage 12 such that the flat portion of the laminated substrate Ws is perpendicular to the horizontal plane. Therefore, the laminated substrate Ws is held in a vertical position by the substrate holding device 2.

[0024] The rotation mechanism 15 includes a motor (not shown). The rotation mechanism 15 is configured to rotate the holding stage 12 and the laminated substrate Ws held by the holding stage 12 together in the direction indicated by the arrow, about the rotation axis R of the substrate holding device 2.

[0025] In one embodiment, the substrate holding device 2 may have, instead of the holding stage 12, a plurality of (e.g., four) rollers (not shown) capable of contacting the peripheral edge of the laminated substrate Ws, and the laminated substrate Ws may be held by these rollers such that the flat portion of the laminated substrate Ws is perpendicular to the horizontal plane. In this case, the substrate holding device 2 may have, instead of the rotation axis 13 and the rotation mechanism 15, a roller rotation mechanism (not shown) that rotates each roller in the same direction and at the same speed around its axis. By rotating the plurality of rollers using the roller rotation mechanism, the laminated substrate Ws is rotated around the rotation center of the substrate holding device 2.

[0026] The coating device 3 is located radially outside the laminated substrate Ws held by the substrate holder 2, and is positioned above the laminated substrate Ws, facing the gap G between the laminated substrate Ws. The coating device 3 is configured to apply a filler F to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the laminated substrate Ws. The application of the filler F by the coating device 3 is performed while the laminated substrate Ws is rotated by the substrate holder 2. Depending on the total amount of filler F to be applied, the filler F may be applied during multiple rotations of the laminated substrate Ws.

[0027] Figure 4 is a schematic diagram showing one embodiment of the coating apparatus 3. The coating apparatus 3 comprises a syringe 21 for dispensing a filler F and a piston 22 that can reciprocate within the syringe 21. The syringe 21 has a hollow structure and is configured to be filled with the filler F. The piston 22 is located inside the syringe 21. The syringe 21 has a filler discharge port 21a at its tip for dispensing the filler F. The tip of the syringe 21, including the filler discharge port 21a, may be detachable. An appropriate shape of the filler discharge port 21a is selected based on the physical properties (e.g., viscosity) of the filler F to be applied.

[0028] The coating device 3 is connected to a gas supply source via a gas supply line 25. When gas (e.g., dry air or nitrogen gas) is supplied from the gas supply source to the syringe 21, the piston 22 moves forward within the syringe 21. The forward movement of the piston 22 causes the filler F in the syringe 21 to be discharged from the filler discharge port 21a. A pressure regulator 26 is located in the gas supply line 25. The pressure regulator 26 can adjust the amount of filler F discharged from the filler discharge port 21a per unit time by adjusting the pressure of the gas supplied from the gas supply source to the coating device 3. When the coating device 3 discharges the filler F, the filler F falls toward the gaps G in the laminated substrate Ws, thereby allowing the filler F to be applied to the gaps G in the laminated substrate Ws.

[0029] In one embodiment, the coating device 3 may be equipped with a screw feeder instead of the combination of syringe 21 and piston 22.

[0030] The filler discharge port 21a is positioned to face the coating target point Tp in the gap G of the laminated substrate Ws by a relative movement mechanism for adjusting the relative position between the filler discharge port 21a and the coating target point Tp, which will be described in detail later. The coating target point Tp is the target point to which the filler F discharged from the filler discharge port 21a falls. The position of the coating target point Tp is predetermined based on the shape of the laminated substrate Ws (shapes of the first substrate W1 and the second substrate W2) and the properties of the filler F. The coating target point Tp is continuously located within the gap G along the circumferential direction of the rotating laminated substrate Ws. In this embodiment, the coating target point Tp is the deepest part of the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. In one embodiment, if the thickness of the first substrate W1 and the second substrate W2 are the same, the coating target point Tp may be located at the midpoint in the thickness direction of the laminated substrate Ws.

[0031] As shown in Figure 2, the curing device 4 is located radially outside the laminated substrate Ws held by the substrate holding device 2, and is positioned opposite the gap G in the laminated substrate Ws. The curing device 4 is positioned downstream of the coating device 3 in the rotational direction of the laminated substrate Ws. The curing device 4 is configured to cure the filler F applied to the laminated substrate Ws by the coating device 3. The curing of the filler F by the curing device 4 is performed while the laminated substrate Ws is rotated by the substrate holding device 2. In this embodiment, the filler F is a thermosetting filler. An example of such a filler is a thermosetting resin.

[0032] Filler F includes a binder, solvent, and particles. The particles are dispersed in the binder dissolved in the solvent. For example, the composition of filler F includes the type of binder, the amount of solvent, the amount of particles, and the particle size. Examples of binders include inorganic binders containing alkali metal silicates, organic binders composed of silicone or epoxy resins, and inorganic-organic hybrid binders. The particles are, for example, silica or alumina. Particles are added to the binder to increase the volume of filler F and to adjust its viscosity. Particles may also be omitted from filler F to reduce its viscosity.

[0033] The curing apparatus 4 in this embodiment is an air heater, configured to blow hot air onto the filler F applied to the laminated substrate Ws. The filler F, heated by the hot air, hardens through a crosslinking reaction. If the filler F contains a solvent, the solvent is evaporated by heating. The curing apparatus 4 is not limited to an air heater; it may also be a lamp heater or other configuration as long as it can heat and harden the filler F.

[0034] In this embodiment, the filler F is a thermosetting filler, but in one embodiment, the filler F may be an ultraviolet-curable filler. In this case, the curing device 4 may be a UV irradiation device that cures the filler F by irradiating it with ultraviolet light. If the filler F contains a solvent, the filler F may be heated using an air heater or the like to volatilize the solvent.

[0035] The laminated structure manufacturing apparatus includes a relative movement mechanism for moving at least one of the coating apparatus 3 and the substrate holding apparatus 2. In this embodiment, the laminated structure manufacturing apparatus includes a coating apparatus movement mechanism 30 as the relative movement mechanism for moving the coating apparatus 3. As shown in Figure 3, the coating apparatus movement mechanism 30 includes a first coating apparatus movement mechanism 31 for moving the coating apparatus 3 in the radial direction of the laminated substrate Ws, and a second coating apparatus movement mechanism 32 for moving the laminated substrate Ws in the thickness direction. The first coating apparatus movement mechanism 31 and the second coating apparatus movement mechanism 32 are connected to the coating apparatus 3.

[0036] The first coating device moving mechanism 31 is configured to move the coating device 3 in a direction perpendicular to the rotation axis R of the substrate holding device 2. The second coating device moving mechanism 32 is configured to move the coating device 3 parallel to the rotation axis R of the substrate holding device 2. Examples of the first coating device moving mechanism 31 and the second coating device moving mechanism 32 include combinations of linear motion mechanisms (ball screw mechanism, cylinder mechanism, etc.) and motors (servo motor, stepping motor, etc.) or linear motor actuators (linear motor, etc.).

[0037] The first coating apparatus moving mechanism 31 of this embodiment includes a first linear motion mechanism 34 connected to the coating apparatus 3 and a first motor 35 connected to the first linear motion mechanism 34. The first motor 35 and the first linear motion mechanism 34 are configured to move the coating apparatus 3 in the radial direction of the laminated substrate Ws. More specifically, the first motor 35 is configured to operate the first linear motion mechanism 34 to move the filler discharge port 21a of the coating apparatus 3 closer to or further away from the gap G of the laminated substrate Ws. The second coating apparatus moving mechanism 32 of this embodiment includes a second linear motion mechanism 37 connected to the coating apparatus 3 and a second motor 38 connected to the second linear motion mechanism 37. The second motor 38 and the second linear motion mechanism 37 are configured to move the coating apparatus 3 in the thickness direction of the laminated substrate Ws. More specifically, the second motor 38 is configured to move the filler discharge port 21a of the coating device 3 in the thickness direction of the laminated substrate Ws by operating the second linear motion mechanism 37.

[0038] The laminated structure manufacturing apparatus further includes an operation control unit 10 that controls the operation of a substrate holding device 2, a curing device 4, a pressure adjusting device 26, and a coating device moving mechanism 30 (a first coating device moving mechanism 31 and a second coating device moving mechanism 32). The substrate holding device 2, the curing device 4, the pressure adjusting device 26, and the coating device moving mechanism 30 (a first coating device moving mechanism 31 and a second coating device moving mechanism 32) are electrically connected to the operation control unit 10.

[0039] The operation control unit 10 consists of at least one computer. The operation control unit 10 includes a storage device 10a where a program is stored, and a processing unit 10b that performs calculations according to the instructions contained in the program. The storage device 10a includes main memory such as random access memory (RAM) and auxiliary storage such as a hard disk drive (HDD) or solid state drive (SSD). Examples of processing units 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 10 is not limited to these examples.

[0040] During the application of filler F to the gaps in the laminated substrate Ws, it is necessary to adjust the position of the filler discharge port 21a of the coating apparatus 3 to track fluctuations in the position of the application target point Tp due to surface runout and eccentricity of the laminated substrate Ws. Therefore, the laminated structure manufacturing apparatus further includes a position detection device 5 that detects the position information of the application target point Tp in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The position detection device 5 is configured to detect position information including the position of the application target point Tp in the radial direction of the laminated substrate Ws and the position of the application target point Tp in the thickness direction of the laminated substrate Ws. The position detection device 5 in this embodiment includes an edge shape detector 40 that detects the shape of the edge portion of the laminated substrate Ws.

[0041] As shown in Figure 2, the edge shape detector 40 is located radially outward of the laminated substrate Ws held by the substrate holding device 2, and is positioned opposite the gap G of the laminated substrate Ws. The edge shape detector 40 is positioned upstream of the coating device 3 in the rotational direction of the laminated substrate Ws. The position of the edge shape detector 40 is fixed. The position detection device 5 (edge ​​shape detector 40) is configured to detect the position information of the coating target point Tp when the coating target point Tp is located upstream of the filler discharge port 21a of the coating device 3 in the rotational direction of the laminated substrate Ws.

[0042] Figure 5 is a schematic diagram showing how the edge shape detector 40 detects the position information of the coating target point Tp within the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. As shown in Figure 5, the edge shape detector 40 is configured to detect the shape of the edge portion of the laminated substrate Ws, that is, the shape of the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. An example of the edge shape detector 40 is a non-contact type laser displacement sensor, which is a two-dimensional profile measuring instrument (line sensor).

[0043] The edge shape detector 40 has a light source (not shown) and a light receiving unit (not shown). The edge shape detector 40 irradiates the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 with line light (line-shaped laser light) from the light source, and receives the reflected light from the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 with the light receiving unit. The width of the line light is along the thickness direction of the laminated substrate Ws. Based on the reflected light, the edge shape detector 40 measures the surface height of the edge portion of the laminated substrate Ws along the thickness direction of the laminated substrate Ws and detects the shape of the edge portion of the laminated substrate Ws along the thickness direction of the laminated substrate Ws.

[0044] Figure 6 shows the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 40. The detected shape of the edge portion of the laminated substrate Ws includes the shape of a valley indicating the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. Therefore, information on the position of the coating target point Tp in the radial direction of the laminated substrate Ws and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws is included in the detected shape of the edge portion of the laminated substrate Ws. In this way, the edge shape detector 40 detects the position information of the coating target point Tp (the position of the coating target point Tp in the radial direction of the laminated substrate Ws and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws). In this embodiment, the deepest part of the gap G appearing in the shape of the edge portion of the laminated substrate Ws is the coating target point Tp, but in one embodiment, the coating target point Tp may be the midpoint in the thickness direction of the laminated substrate Ws that appears in the shape of the edge portion of the laminated substrate Ws.

[0045] The position detection device 5 (in this embodiment, the edge shape detector 40) is electrically connected to the operation control unit 10. The position information of the coating target point Tp detected by the edge shape detector 40 (the position of the coating target point Tp in the radial direction of the laminated substrate Ws, which is included in the shape of the edge portion of the laminated substrate Ws, and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws) is sent to the operation control unit 10. Based on the detected position information of the coating target point Tp, the operation control unit 10 is configured to adjust the relative position between the filler discharge port 21a of the coating device 3 and the coating target point Tp using the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) so that the relative position between the filler discharge port 21a and the coating target point Tp coincides with a predetermined target relative position.

[0046] More specifically, the operation control unit 10 is configured to determine the current position of the coating target point Tp based on the position information of the coating target point Tp detected by the position detection device 5 (edge ​​shape detector 40 in this embodiment), and to calculate the distance and direction (vector) from the reference position of the coating target point Tp to the current position of the coating target point Tp. Furthermore, the operation control unit 10 is configured to determine the target position of the coating device 3, where the relative position of the filler discharge port 21a and the coating target point Tp coincides with a predetermined target relative position, based on the calculated distance and direction, and to issue a command to the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) to move the coating device 3 to the target position. Through this operation, the relative position of the filler discharge port 21a and the coating target point Tp is maintained at a predetermined target relative position. The target relative position is the relative position in which the filler F is appropriately applied from the filler discharge port 21a to the gap G of the laminated substrate Ws, and is predetermined based on experimental results, etc.

[0047] In this embodiment, just before the coating target point Tp is positioned directly below the filler discharge port 21a of the coating device 3, the operation control unit 10 issues a command to the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) to move the coating device 3. The operation control unit 10 is configured to determine (calculate) the timing for the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) to move the coating device 3 based on the rotation speed of the laminated substrate Ws by the substrate holding device 2 and the detected position of the coating target point Tp.

[0048] The position detection device 5 (in this embodiment, the edge shape detector 40) is configured to detect position information of multiple coating target points Tp along the circumferential direction of the rotating laminated substrate Ws. The edge shape detector 40 detects the shape of the edge portion of the rotating laminated substrate Ws at predetermined time intervals and detects multiple shapes of the edge portion of the laminated substrate Ws along the circumferential direction of the laminated substrate Ws. Through this operation, the edge shape detector 40 detects position information of multiple coating target points Tp along the circumferential direction of the laminated substrate Ws.

[0049] Figure 7 is a flowchart showing one embodiment of a method for manufacturing a laminated structure. In step S101, the position detection device 5 detects the position information of the application target point Tp before starting to apply the filler F to the gap G of the laminated substrate Ws. In this embodiment, the edge shape detector 40 detects the position information of the application target point Tp by detecting the shape of the edge portion of the laminated substrate Ws. The position information of the application target point Tp detected by the position detection device 5 is sent to the operation control unit 10.

[0050] In step S102, a command is issued to the coating device moving mechanism 30 to adjust the relative position between the filler discharge port 21a and the coating target point Tp, based on the position information of the coating target point Tp detected by the position detection device 5 (edge ​​shape detector 40 in this embodiment), so that the relative position of the filler discharge port 21a and the coating target point Tp of the coating device 3 coincides with the target relative position. This allows the coating device 3 to be positioned at the appropriate coating start position. In step S103, the operation control unit 10 issues a command to the substrate holding device 2 to rotate the laminated substrate Ws, and also issues a command to the pressure adjustment device 26 to discharge the filler F from the filler discharge port 21a of the coating device 3, thereby starting the application of the filler F to the gaps G in the laminated substrate Ws.

[0051] In step S104, the position detection device 5 detects the position information of multiple application target points Tp within the gaps G of the laminated substrate Ws along the circumferential direction of the laminated substrate Ws while applying the filler F to the gaps G of the laminated substrate Ws. In this embodiment, the edge shape detector 40 detects the position information of multiple application target points Tp by detecting the shapes of multiple edges of the laminated substrate Ws along the circumferential direction of the laminated substrate Ws while applying the filler F to the gaps G of the laminated substrate Ws. The position information of the multiple application target points Tp detected by the position detection device 5 is sent to the operation control unit 10.

[0052] In step S105, the operation control unit 10, while applying the filler F to the gaps G of the laminated substrate Ws, issues commands to the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) based on the position information of a plurality of coating target points Tp detected by the position detection device 5 (edge ​​shape detector 40 in this embodiment) to adjust the relative position between the filler discharge port 21a and each of the plurality of coating target points Tp so that the relative position between the filler discharge port 21a and each of the plurality of coating target points Tp coincides with the target relative position. Based on the rotation speed of the laminated substrate Ws by the substrate holding device 2 and the detected position of the coating target points Tp, the operation control unit 10 determines (calculates) the timing for moving the coating device 3 by the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32).

[0053] During the application of filler F to the gaps G of the laminated substrate Ws, steps S104, i.e., detection of the position information of the application target point Tp, and step S105, i.e., adjustment of the relative position between the filler discharge port 21a and the application target point Tp, are performed in parallel. Based on the position information of the application target point Tp that is detected sequentially, the operation control unit 10 sequentially adjusts the relative position between the filler discharge port 21a and the application target point Tp using the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32). As a result, during the application of filler F to the gaps G of the laminated substrate Ws, the relative position between the filler discharge port 21a and each of the multiple application target points Tp is maintained at the target relative position, and the position of the filler discharge port 21a can be made to follow the multiple application target points Tp.

[0054] In step S106, the operation control unit 10 issues a command to the pressure regulating device 26 to stop the application of the filler F to the gap G by the coating device 3. In step S107, the operation control unit 10 issues a command to the curing device 4 to cure the filler F applied to the gap G of the laminated substrate Ws. In one embodiment, the curing of the filler F by the curing device 4 may be performed while the filler F is being applied by the coating device 3.

[0055] According to this embodiment, the relative position between the filler discharge port 21a of the coating device 3 and the coating target point Tp is adjusted based on the position information of the coating target point Tp detected by the position detection device 5. As a result, the relative position between the filler discharge port 21a and the coating target point Tp is maintained at a predetermined target relative position, and the filler F can be properly applied to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0056] Figure 8 is a flowchart showing another embodiment of the method for manufacturing a laminated structure. In step S201, the operation control unit 10 issues a command to the substrate holding device 2 to rotate the laminated substrate Ws. While the laminated substrate Ws is rotating, the position detection device 5 detects the position information of multiple coating target points Tp within the gap G along the circumferential direction of the laminated substrate Ws. In this embodiment, the edge shape detector 40 detects the position information of multiple coating target points Tp by detecting multiple shapes of the edge portion of the laminated substrate Ws. The position information of the multiple coating target points Tp detected by the position detection device 5 is sent to the operation control unit 10. In step S202, the operation control unit 10 issues a command to the pressure regulating device 26 to discharge the filler F from the filler discharge port 21a of the coating device 3, and starts applying the filler F to the gaps G of the laminated substrate Ws.

[0057] In step S203, while the filler F is being applied to the gaps G in the laminated substrate Ws, the operation control unit 10 issues commands to the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) based on the position information of the multiple coating target points Tp detected by the position detection device 5 (edge ​​shape detector 40) in step S201, causing the relative position of the filler discharge port 21a and each of the multiple coating target points Tp to be adjusted so that the relative position of the filler discharge port 21a and each of the multiple coating target points Tp coincides with the target relative position. The operation control unit 10 controls the timing for moving the coating device 3 by the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) based on the rotation speed of the laminated substrate Ws by the substrate holding device 2 and the detected position of the coating target points Tp.

[0058] As a result, during the application of the filler F to the gaps G in the laminated substrate Ws, the relative position between the filler discharge port 21a and each of the multiple application target points Tp is maintained at the target relative position, and the position of the filler discharge port 21a can be made to follow the multiple application target points Tp.

[0059] In step S204, the operation control unit 10 issues a command to the pressure regulating device 26 to stop the application of the filler F to the gap G by the coating device 3. In step S205, the operation control unit 10 issues a command to the curing device 4 to cure the filler F applied to the gap G of the laminated substrate Ws. In one embodiment, the curing of the filler F by the curing device 4 may be performed while the filler F is being applied by the coating device 3.

[0060] Figure 9 is a front view showing another embodiment of the laminated structure manufacturing apparatus, and Figure 10 is a side view of the laminated structure manufacturing apparatus shown in Figure 9. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiments described above, so their redundant explanations are omitted. The position detection device 5 of this embodiment includes an eccentricity detector 42 that detects the position of the coating target point Tp in the radial direction of the laminated substrate Ws, and a surface runout detector 43 that detects the position of the coating target point Tp in the thickness direction of the laminated substrate Ws, instead of the edge shape detector 40.

[0061] As shown in Figure 9, the eccentricity detector 42 and the surface runout detector 43 are positioned upstream of the coating apparatus 3 in the rotational direction of the laminated substrate Ws. The positions of the eccentricity detector 42 and the surface runout detector 43 are fixed. The eccentricity detector 42 and the surface runout detector 43 are configured to detect the position information of the coating target point Tp when the coating target point Tp is located upstream of the filler discharge port 21a of the coating apparatus 3 in the rotational direction of the laminated substrate Ws.

[0062] As shown in Figure 10, the eccentricity detector 42 has a light-emitting unit 42a and a light-receiving unit 42b arranged symmetrically with respect to the edge portion of the laminated substrate Ws, and a signal processing unit 42c connected to the light-receiving unit 42b. Light emitted from the light-emitting unit 42a is received by the light-receiving unit 42b. Since a portion of the light emitted from the light-emitting unit 42a is blocked by the edge portion of the laminated substrate Ws, the amount of light received by the light-receiving unit 42b changes depending on the radial position of the laminated substrate Ws. The signal processing unit 42c determines (calculates) the position of the edge portion of the laminated substrate Ws in the radial direction based on the amount of light received by the light-receiving unit 42b. Since the relative position of the coating target point Tp with respect to the edge portion of the laminated substrate Ws is fixed, the eccentricity detector 42 can detect the position of the coating target point Tp in the radial direction of the laminated substrate Ws from the position of the edge portion of the laminated substrate Ws.

[0063] The surface runout detector 43 is positioned opposite the back surface of the laminated substrate Ws (the non-bonding surface of the first substrate W1). The surface runout detector 43 has a light source (not shown) and a light receiving unit (not shown). The surface runout detector 43 irradiates the back surface of the laminated substrate Ws with light from the light source and receives the reflected light from the back surface of the laminated substrate Ws with the light receiving unit. Based on the reflected light, the surface runout detector 43 determines (calculates) the position of the back surface of the laminated substrate Ws. Since the relative position of the coating target point Tp with respect to the back surface of the laminated substrate Ws is fixed, the surface runout detector 43 can detect the position of the coating target point Tp in the thickness direction of the laminated substrate Ws from the position of the back surface of the laminated substrate Ws. Examples of the surface runout detector 43 include a displacement sensor, a position sensor, and a distance sensor. In one embodiment, the surface runout detector 43 may be positioned opposite the surface of the laminated substrate Ws (the non-bonding surface of the second substrate W2), and the position of the coating target point Tp may be detected from the position of the surface of the laminated substrate Ws.

[0064] The eccentricity detector 42 and the surface runout detector 43 are electrically connected to the operation control unit 10. The position of the coating target point Tp in the radial direction of the laminated substrate Ws detected by the eccentricity detector 42 and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws detected by the surface runout detector 43 are sent to the operation control unit 10. Based on the detected position information of the coating target point Tp, the operation control unit 10 adjusts the relative position between the filler discharge port 21a and the coating target point Tp using the coating device moving mechanism 30 (in this embodiment, the first coating device moving mechanism 31 and the second coating device moving mechanism 32) so that the relative position between the filler discharge port 21a and the coating target point Tp coincides with a predetermined target relative position.

[0065] In this embodiment, the operation control unit 10 issues a command to the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) to move the coating device 3 based on the position information of the coating target point Tp detected by the eccentricity detector 42 and the surface runout detector 43, just before the coating target point Tp is located directly below the filler discharge port 21a of the coating device 3. The operation control unit 10 determines (calculates) the timing for the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32) to move the coating device 3 based on the rotation speed of the laminated substrate Ws by the substrate holding device 2 and the detected position of the coating target point Tp.

[0066] The position detection device 5 (in this embodiment, an eccentricity detector 42 and a surface runout detector 43) is configured to detect position information of a plurality of coating target points Tp along the circumferential direction of the rotating laminated substrate Ws. The eccentricity detector 42 detects the position of the coating target points Tp in the radial direction of the rotating laminated substrate Ws at predetermined time intervals and detects the positions of the plurality of coating target points Tp along the circumferential direction of the laminated substrate Ws in the radial direction of the laminated substrate Ws. The surface runout detector 43 detects the position of the coating target points Tp in the thickness direction of the rotating laminated substrate Ws at predetermined time intervals and detects the positions of the plurality of coating target points Tp along the circumferential direction of the laminated substrate Ws in the thickness direction of the laminated substrate Ws.

[0067] The embodiments described with reference to Figures 9 and 10 can be applied to the manufacturing method of the laminated structure shown in Figures 7 and 8.

[0068] Figure 11 is a side view showing yet another embodiment of the laminated structure manufacturing apparatus, and Figure 12 is a front view of the laminated structure manufacturing apparatus shown in Figure 11. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to Figures 9 and 10, so redundant descriptions are omitted. The position detection device 5 of this embodiment further includes an edge shape detector 40 in addition to the eccentricity detector 42 and the surface runout detector 43.

[0069] As shown in Figure 11, the edge shape detector 40 is positioned adjacent to the coating apparatus 3 and above the laminated substrate Ws. The eccentricity detector 42 and the surface runout detector 43 are positioned upstream of the coating apparatus 3 in the rotational direction of the laminated substrate Ws. The positions of the edge shape detector 40, the eccentricity detector 42, and the surface runout detector 43 are fixed. The edge shape detector 40 is configured to detect the position information of the coating target point Tp when the coating target point Tp is at the same position as the filler discharge port 21a of the coating apparatus 3 in the rotational direction of the laminated substrate Ws (when the coating target point Tp is located near the filler discharge port 21a of the coating apparatus 3). The eccentricity detector 42 and the surface runout detector 43 are configured to detect the position information of the coating target point Tp when the coating target point Tp is located upstream of the filler discharge port 21a of the coating apparatus 3 in the rotational direction of the laminated substrate Ws.

[0070] The laminated structure manufacturing apparatus of this embodiment can be applied to the method for manufacturing a laminated structure shown in Figure 7. Step S101 shown in Figure 7, that is, the step of detecting the position information of the coating target point Tp before starting to coat the filler F, is performed by the edge shape detector 40. The edge shape detector 40 detects the position information of the coating target point Tp when the coating target point Tp is at the same position as the filler discharge port 21a of the coating apparatus 3 (when the coating target point Tp is located near the filler discharge port 21a of the coating apparatus 3). Step S104, that is, the step of detecting the position information of multiple coating target points Tp in the gaps G along the circumferential direction of the laminated substrate Ws during the coating of the filler F into the gaps G of the laminated substrate Ws, is performed by the eccentricity detector 42 and the surface runout detector 43.

[0071] Figure 13 is a front view showing yet another embodiment of the laminated structure manufacturing apparatus. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to Figures 2 and 3, so redundant descriptions are omitted. The position detection device 5 of this embodiment includes an image generation device 45 that generates an image of the edge portion of the laminated substrate Ws, instead of an edge shape detector 40.

[0072] As shown in Figure 13, the image generation device 45 is located upstream of the coating device 3 in the rotational direction of the laminated substrate Ws and is positioned to the side of the laminated substrate Ws. The image generation device 45 is configured to generate images of the edges of the laminated substrate Ws. The image generation device 45 includes an image sensor (e.g., a CMOS sensor or a CCD sensor) which is not shown.

[0073] Figure 14 shows an example of an image of the edge portion of a laminated substrate Ws generated by the image generation device 45. As shown in Figure 14, the image of the edge portion of the laminated substrate Ws includes an image of a valley showing the gap G between the edge portion E1 of the first substrate Ws and the edge portion E2 of the second substrate W2. Therefore, information on the position of the coating target point Tp in the radial direction of the laminated substrate Ws and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws is included in the generated image of the edge portion of the laminated substrate Ws. In this way, the image generation device 45 detects the position information of the coating target point Tp (the position of the coating target point Tp in the radial direction of the laminated substrate Ws and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws). In this embodiment, the deepest part of the gap G appearing in the image of the edge portion of the laminated substrate Ws is the coating target point Tp, but in one embodiment, the coating target point Tp may be the midpoint in the thickness direction of the laminated substrate Ws that appears in the image of the edge portion of the laminated substrate Ws.

[0074] As shown in Figure 13, the image generation device 45 is electrically connected to the operation control unit 10. The position information of the coating target point Tp detected by the image generation device 45 (the position of the coating target point Tp in the radial direction of the laminated substrate Ws and the position of the coating target point Tp in the thickness direction of the laminated substrate Ws, which are included in the image of the edge portion of the laminated substrate Ws) is sent to the operation control unit 10. Based on the detected position information of the coating target point Tp, the operation control unit 10 adjusts the relative position between the filler discharge port 21a of the coating device 3 and the coating target point Tp using the coating device moving mechanism 30 so that the relative position between the filler discharge port 21a and the coating target point Tp coincides with a predetermined target relative position.

[0075] As shown in Figure 14, the image generation device 45 may be configured to generate an image showing both the edge portion of the laminated substrate Ws and the filler discharge port 21a of the coating device 3, and to detect the position information of the filler discharge port 21a along with the position information of the coating target point Tp. The position information of the coating target point Tp and the position information of the filler discharge port 21a detected by the image generation device 45 are sent to the operation control unit 10. The operation control unit 10 may be configured to adjust the relative position between the filler discharge port 21a and the coating target point Tp using the coating device moving mechanism 30, based on the position information of the coating target point Tp and the position information of the filler discharge port 21a sent from the image generation device 45, until the relative position between the filler discharge port 21a and the coating target point Tp matches a predetermined target relative position.

[0076] The image generation device 45 may detect the position information of the coating target point Tp when the coating target point Tp is at the same position as the filler discharge port 21a of the coating device 3 in the rotation direction of the laminated substrate Ws (when the coating target point Tp is located near the filler discharge port 21a of the coating device 3). Alternatively, the image generation device 45 may detect the position information of the coating target point Tp when the coating target point Tp is located upstream of the filler discharge port 21a of the coating device 3 in the rotation direction of the laminated substrate Ws (indicated by the symbol Tp' in Figure 14). The operation control unit 10 determines (calculates) the timing for moving the coating device 3 with the coating device moving mechanism 30 based on the rotation speed of the laminated substrate Ws by the substrate holding device 2 and the detected position of the coating target point Tp.

[0077] The position detection device 5 (in this embodiment, the image generation device 45) is configured to detect position information of multiple coating target points Tp along the circumferential direction of the rotating laminated substrate Ws. The image generation device 45 generates images of the edge portion of the rotating laminated substrate Ws at predetermined time intervals, and generates multiple images of the edge portion of the laminated substrate Ws along the circumferential direction of the laminated substrate Ws. As a result, the image generation device 45 detects position information of multiple coating target points Tp along the circumferential direction of the laminated substrate Ws.

[0078] In one embodiment, the laminated structure manufacturing apparatus includes an input device (not shown) such as a keyboard or mouse, and a display device (not shown) such as a display that shows an image of the edge portion of the laminated substrate Ws generated by the image generation device 45. The operator may select any location on the image displayed on the display device as the coating target point Tp and input it using the input device. The input device and the display device are electrically connected to the operation control unit 10. Based on the input position information of the coating target point Tp, the operation control unit 10 may use the coating device moving mechanism 30 to adjust the relative position between the filler discharge port 21a of the coating device 3 and the coating target point Tp so that the relative position between the filler discharge port 21a and the coating target point Tp coincides with a predetermined target relative position.

[0079] The embodiments described with reference to Figures 13 and 14 can be applied to the manufacturing method of the laminated structure shown in Figures 7 and 8.

[0080] In one embodiment, the image generation device 45 may be configured to generate an image of the filler F being discharged (falling) from the filler discharge port 21a while the filler F is being applied to the gap G of the laminated substrate Ws. In this case, the operation control unit 10 may be configured to determine the discharge state of the filler F based on the image of the filler F being discharged (falling) from the filler discharge port 21a generated by the image generation device 45.

[0081] Specifically, the operation control unit 10 may be configured to determine that the discharge state of the filler F is normal when the image shows the filler F being discharged (falling) from the filler discharge port 21a toward the application target point Tp, and to determine that the discharge state of the filler F is abnormal when the image does not show the filler F being discharged from the filler discharge port 21a toward the application target point Tp (for example, when the image shows the filler F being discharged at an angle from the filler discharge port 21a). Furthermore, the operation control unit 10 may be configured to stop the application of the filler F by the application device 3 when it determines that the discharge state of the filler F is abnormal.

[0082] The laminated structure manufacturing apparatus described so far includes a coating apparatus moving mechanism 30 for moving the coating apparatus 3 as a relative movement mechanism. However, in one embodiment, the laminated structure manufacturing apparatus may also include a substrate moving mechanism 50 for moving the laminated substrate Ws held in the substrate holding device 2 as a relative movement mechanism. Figure 15 is a side view showing one embodiment of a laminated structure manufacturing apparatus equipped with a substrate moving mechanism 50. The substrate moving mechanism 50 includes a first substrate moving mechanism 51 for moving the laminated substrate Ws in its radial direction and a second substrate moving mechanism 52 for moving the laminated substrate Ws in its thickness direction. The first substrate moving mechanism 51 and the second substrate moving mechanism 52 are connected to the substrate holding device 2.

[0083] The first substrate moving mechanism 51 is configured to move the substrate holder 2 in a direction perpendicular to its rotation axis R. The second substrate moving mechanism 52 is configured to move the substrate holder 2 parallel to its rotation axis R. Examples of the first substrate moving mechanism 51 and the second substrate moving mechanism 52 include combinations of linear motion mechanisms (ball screw mechanisms, cylinder mechanisms, etc.) and motors (servo motors, stepping motors, etc.) or linear motor actuators (linear motors, etc.).

[0084] The first substrate moving mechanism 51 of this embodiment includes a first linear motion mechanism 54 connected to the substrate holding device 2 and a first motor 55 connected to the first linear motion mechanism 54. The first motor 55 and the first linear motion mechanism 54 are configured to move the entire substrate holding device 2 in the radial direction of the laminated substrate Ws, thereby moving the laminated substrate Ws held in the substrate holding device 2 in its radial direction. More specifically, the first motor 55 is configured to operate the first linear motion mechanism 54 to move the gap G of the laminated substrate Ws closer to or further away from the filler discharge port 21a of the coating device 3. The second substrate moving mechanism 52 of this embodiment includes a second motor 57 connected to the rotation axis 13 of the substrate holding device 2. The second motor 57 is configured to move the holding stage 12 in the thickness direction of the laminated substrate Ws via the rotation axis 13, thereby moving the laminated substrate Ws held in the substrate holding device 2 in its thickness direction.

[0085] The substrate moving mechanism 50 (first substrate moving mechanism 51 and second substrate moving mechanism 52) is electrically connected to the operation control unit 10. The operation of the substrate moving mechanism 50 (first substrate moving mechanism 51 and second substrate moving mechanism 52) is controlled by the operation control unit 10. In this embodiment, the first substrate moving mechanism 51 is connected to the substrate holding device 2 via the second substrate moving mechanism 52, but in one embodiment, the second substrate moving mechanism 52 may be connected to the substrate holding device 2 via the first substrate moving mechanism 51.

[0086] The operation control unit 10 is configured to adjust the relative position between the filler discharge port 21a of the coating device 3 and the coating target point Tp using the substrate moving mechanism 50 (first substrate moving mechanism 51 and second substrate moving mechanism 52) based on the position information of the coating target point Tp detected by the position detection device 5, so that the relative position between the filler discharge port 21a and the coating target point Tp coincides with a predetermined target relative position.

[0087] More specifically, the motion control unit 10 is configured to determine the current position of the coating target point Tp based on the position information of the coating target point Tp detected by the position detection device 5, and to calculate the distance and direction (vector) from the current position of the coating target point Tp to the reference position of the coating target point Tp. Furthermore, the motion control unit 10 is configured to issue commands to the substrate moving mechanism 50 (first substrate moving mechanism 51 and second substrate moving mechanism 52) to move the laminated substrate Ws held by the substrate holding device 2 by the calculated distance in the calculated direction. Through this operation, the relative position between the filler discharge port 21a and the coating target point Tp is maintained at a predetermined target relative position. The target relative position is the relative position at which the filler F is appropriately applied from the filler discharge port 21a to the gap G of the laminated substrate Ws, and is predetermined based on experimental results, etc.

[0088] The adjustment of the relative position between the filler discharge port 21a and the coating target point Tp by the substrate moving mechanism 50 (first substrate moving mechanism 51 and second substrate moving mechanism 52) can be applied to each of the embodiments described above, instead of the adjustment of the relative position between the filler discharge port 21a and the coating target point Tp by the coating device moving mechanism 30 (first coating device moving mechanism 31 and second coating device moving mechanism 32).

[0089] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of Symbols]

[0090] 2 Substrate holding device 3. Coating device 4 Curing equipment 5. Position detection device 10 Operation Control Unit 10a storage device 10b Processing Unit 12 Holding Stage 12a Holding surface 13 Rotation axis 15 Rotation mechanism 21 Syringe 21a Filling material discharge port 22 pistons 25 Gas supply line 26 Pressure Regulator 30. Coating device movement mechanism (relative movement mechanism) 31. First coating device transfer mechanism 32. Second coating device transfer mechanism 34. First Linear Motion Mechanism 35 First Motor 37. Second Linear Motion Mechanism 38. Second motor 40 Edge shape detector 42 Eccentric Detectors 42a Light-emitting section 42b Light receiving part 42c Signal Processing Unit 43. Surface runout detector 45 Image generation device 50. Substrate moving mechanism (relative moving mechanism) 51 First substrate moving mechanism 52 Second substrate moving mechanism 54 First Linear Motion Mechanism 55 First Motor 57 Second Motor E1, E2 edge section F Filler G Gap Tp application target point W1 First Circuit Board W2 Second Board Ws Multilayer Substrate

Claims

1. A laminated structure manufacturing apparatus for manufacturing a laminated structure by applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, A substrate holding device for holding and rotating the laminated substrate, A coating apparatus having a filler discharge port for dispensing the filler, and for applying the filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, A relative movement mechanism for moving at least one of the coating apparatus and the substrate holding apparatus, A position detection device for detecting positional information of the coating target point within the gap, A laminated structure manufacturing apparatus comprising an operation control unit that adjusts the relative position between the filler discharge port and the coating target point using the relative movement mechanism based on the detected position information.

2. The laminated structure manufacturing apparatus according to claim 1, wherein the position detection device is configured to detect the position information including the position of the coating target point in the radial direction of the laminated substrate and the position of the coating target point in the thickness direction of the laminated substrate.

3. The laminated structure manufacturing apparatus according to claim 2, wherein the position detection device includes an edge shape detector for detecting the shape of the edge portion of the laminated substrate.

4. The laminated structure manufacturing apparatus according to claim 2, wherein the position detection device includes an eccentricity detector for detecting the position of the coating target point in the radial direction of the laminated substrate and a surface runout detector for detecting the position of the coating target point in the thickness direction of the laminated substrate.

5. The laminated structure manufacturing apparatus according to claim 2, wherein the position detection device includes an image generation device that generates an image of the edge portion of the laminated substrate.

6. The position detection device is configured to detect positional information of a plurality of coating target points within the gap along the circumferential direction of the laminated substrate. The laminated structure manufacturing apparatus according to claim 1, wherein the operation control unit is configured to adjust the relative position between the filler discharge port and each of the plurality of application target points using the relative movement mechanism, based on the detected position information, while the filler is being applied to the gaps of the rotating laminated substrate.

7. The laminated structure manufacturing apparatus according to claim 1, wherein the position detection device is configured to detect position information of the coating target point when the coating target point is located upstream of the filler discharge port in the rotation direction of the laminated substrate.

8. A method for manufacturing a laminated structure, comprising applying a filler to a laminated substrate in which a first substrate and a second substrate are joined, A step of detecting positional information of a coating target point within the gap between the edge portion of the first substrate and the edge portion of the second substrate, A step of adjusting the relative position between the filler discharge port for dispensing the filler and the application target point based on the detected position information, A method for manufacturing a laminated structure, comprising the step of applying the filler to the gap while rotating the laminated substrate.

9. The method for manufacturing a laminated structure according to claim 8, wherein the step of detecting the position information is a step of detecting the position information including the position of the coating target point in the radial direction of the laminated substrate and the position of the coating target point in the thickness direction of the laminated substrate.

10. The method for manufacturing a laminated structure according to claim 9, wherein the step of detecting the position information includes detecting the shape of the edge portion of the laminated substrate using an edge shape detector.

11. The method for manufacturing a laminated structure according to claim 9, wherein the step of detecting the position information includes detecting the position of the coating target point in the radial direction of the laminated substrate using an eccentricity detector, and detecting the position of the coating target point in the thickness direction of the laminated substrate using a surface runout detector.

12. The method for manufacturing a laminated structure according to claim 9, wherein the step of detecting the position information includes generating an image of the edge portion of the laminated substrate using an image generation device.

13. The step of detecting the position information is a step of detecting the position information of the plurality of application target points when, during the application of the filler to the gap, the plurality of application target points in the gap along the circumferential direction of the laminated substrate are located upstream of the filler discharge port in the rotational direction of the laminated substrate. The method for manufacturing a laminated structure according to claim 8, wherein the step of adjusting the relative positions is a step of adjusting the relative position between the filler discharge port and each of the plurality of application target points based on the detected position information while applying the filler to the gap.

14. The step of detecting the position information involves rotating the laminated substrate before applying the filler to the gap, and detecting the position information of a plurality of application target points within the gap along the circumferential direction of the laminated substrate. The method for manufacturing a laminated structure according to claim 8, wherein the step of adjusting the relative positions is a step of adjusting the relative position between the filler discharge port and each of the plurality of application target points based on the detected position information while applying the filler to the gap.

Images