A wet etching solution composition, a wet etching method for glass, and glass patterned by the wet etching method.

Abstract

The wet etching method of the present invention includes cleaning glass, wet etching the cleaned glass to form a nano-scale pattern, and cleaning and drying the nano-patterned glass, and the wet etching solution used in the wet etching step can include hydrofluoric acid, a surfactant, and oxalic acid and acetic acid. According to the present invention, a high transmittance / low reflectance glass can be provided. The glass can be used in displays and optical devices including mobile devices.

Description

Technical Field

[0001] The present invention relates to a wet etching method for glass, which forms a nanopattern on a glass surface through wet etching to improve the light transmittance of glass and reduce the reflectance thereof.

Background Art

[0002] Etching processes can be classified into wet etching and dry etching. Wet etching is generally carried out through a chemical reaction between an etching solution having the property of corroding and dissolving a base material and the base material to be etched. Dry etching is carried out by utilizing reactions caused by gaseous plasma or activated gas.

[0003] In conventional surface treatment methods for base materials, the aforementioned dry etching is used to form a pattern having a lateral width (width, thickness) ranging from several nanometers to tens of nanometers. However, compared with wet etching, dry etching is costly, difficult in process control, and difficult for mass production. In addition, due to process characteristics, dry etching is difficult to apply to curved glass and large-area glass.

[0004] On the contrary, compared with dry etching, conventional wet etching allows easier process control and is suitable for mass production. However, patterns formed through wet etching have an average lateral width of 3 micrometers or more. Although such patterns can reduce reflectance, they have the disadvantage that transmittance is significantly reduced. As a result, the need for fine nanopatterns that can maintain transmittance and reduce reflectance has emerged. However, since it is difficult to form patterns reaching the nanoscale that can adjust the reflectance or transmittance of light by wet etching methods, it has been almost impossible to provide glass with high light transmittance and low reflectance by using wet etching in the prior art.

[0005] Based on these technical circumstances, the inventor conducted research and development and filed a Korean Patent Application No. 10-1842083, 'Protrusion Forming Method'. According to the aforementioned prior art, it was possible to obtain the effect of improved transmittance and lower reflectance. However, problems remained with the stability, reproducibility, and uniformity of the etching reaction.

[0006] The inventor continued research and development, eventually arriving at the present invention. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Registered Patent No. 10-1842083 of the Republic of Korea [Overview of the project] [Problems that the invention aims to solve]

[0008] The present invention aims to provide glass with high transmittance and low reflectivity.

[0009] The present invention aims to enable high transmittance / low reflectance treatment for various glass surfaces.

[0010] The present invention aims to provide a glass with high transmittance / low reflectivity that improves the stability, reproducibility, and uniformity of the etching reaction. [Means for solving the problem]

[0011] The wet etching method of the present invention includes washing glass, wet etching the washed glass to form a nanoscale pattern, and washing and drying the patterned glass.

[0012] The wet carving solution used in the wet carving step may contain hydrofluoric acid and a surfactant.

[0013] The aforementioned wet carving can be performed by a dipping method.

[0014] The nanoscale pattern can be formed on one or both sides of the glass.

[0015] The nanoscale pattern can have a range of 1 to 100 nanometers.

[0016] The glass may include protrusions that extend from its surface.

[0017] The surface of the glass, including the aforementioned protrusions, may have a moth-eye structure.

[0018] The nanoscale structure may include protrusions.

[0019] The aforementioned projection may have a structure in which its thickness is greater than its depth.

[0020] The thickness of the aforementioned protrusion can be 1 to 50 nanometers.

[0021] The depth of the projection can be provided in the range of 1 to 50 nanometers.

[0022] The thickness of the aforementioned protrusion may be 5-30 nanometers.

[0023] The depth of the aforementioned protrusion can be provided in the range of 5-30 nanometers.

[0024] In the wet etching step, the wet etching solution composition may be: - a composition comprising hydrofluoric acid and a surfactant, with the remainder being water; or - a composition comprising hydrofluoric acid and a surfactant, and at least one of oxalic acid and acetic acid, with the remainder being water; or - a composition comprising hydrofluoric acid and a surfactant, and at least one of oxalic acid and acetic acid, not comprising at least one of NH4F, HNO3, H3PO4, and HCl, with the remainder being water; or - a composition comprising hydrofluoric acid and a surfactant, and at least one of oxalic acid and acetic acid, not comprising all of NH4F, HNO3, H3PO4, and HCl, with the remainder being water; or a composition comprising hydrofluoric acid and a surfactant, further comprising oxalic acid and acetic acid, with the remainder being water; or a composition comprising hydrofluoric acid and a surfactant, further comprising oxalic acid and acetic acid, not comprising all of NH4F, HNO3, H3PO4, and HCl, with the remainder being water.

[0025] The hydrofluoric acid may be included in an amount of more than 0 wt% and less than 5.0 wt%.

[0026] The oxalic acid may be included in an amount of more than 0 wt% and less than 5.0 wt%.

[0027] The acetic acid may be included in an amount of more than 0 wt% and less than 10.0 wt%.

[0028] The surfactant may be included in an amount of more than 0 wt% and less than 1.0 wt%.

[0029] The temperature at which the wet etching is performed may be in the range of 30-70°C.

[0030] The time for which the wet etching is performed may be in the range of 1-7 minutes.

[0031] The glass can be used for flat panel displays including mobile devices and various optical instruments.

[0032] In other aspects, the wet etching solution composition of the present invention is a wet etching solution composition for etching glass, wherein the wet etching solution composition contains hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%, and the remaining component of the wet etching solution composition may be water.

[0033] The above composition may contain oxalic acid in an amount exceeding 0 wt% but less than 5.0 wt%.

[0034] The above composition may contain acetic acid in an amount exceeding 0 wt% and less than 10.0 wt%.

[0035] The composition may contain oxalic acid in an amount exceeding 0 wt% but less than 5.0 wt%, and acetic acid in an amount exceeding 0 wt% but less than 10.0 wt%.

[0036] The composition may contain a greater amount of acetic acid than of oxalic acid.

[0037] The aforementioned composition may not contain at least one of NH4F, HNO3, H3PO4, and HCl.

[0038] The aforementioned composition may not contain any of NH4F, HNO3, H3PO4, and HCl.

[0039] The patterned glass according to the present invention may be a patterned glass that includes a pattern having nanoscale surface protrusions provided by a wet etching method, enabling the realization of high transmittance / low reflectivity, and is applicable to flat panel display fronts, lenses or windows or protective covers of optical instruments.

[0040] The thickness of the projection can be provided to be greater than the depth of the projection.

[0041] The thickness of the aforementioned protrusion can be 1 to 50 nanometers.

[0042] The depth of the projection can be provided in the range of 1 to 50 nanometers.

[0043] The aforementioned glass may have patterns on both sides or on its cross-section. [Effects of the Invention]

[0044] The present invention provides glass with high transmittance and low reflectivity. Users can use the glass of the present invention to reduce the reduction in display visibility due to reflection of ambient light.

[0045] The present invention has the advantage of enabling high transmittance / low reflectance treatment on the surface of glass manufactured with various compositions that are kept confidential by the manufacturer. Experiments have confirmed that the present invention is particularly effective in improving visibility by realizing high transmittance / low reflectance for displays of mobile devices.

[0046] According to the present invention, it is possible to expect an improvement in the quality of mobile devices through such an improvement in the visibility of the display. [Brief explanation of the drawing]

[0047] [Figure 1] Figure 1 is a flowchart illustrating a wet etching method for glass according to an example. [Figure 2] Figure 2 is a graph showing the results of repeating the wet carving method according to the first embodiment. [Figure 3] Figure 3 is a graph showing the results of repeating the wet carving method according to the second embodiment. [Figure 4] Figure 4 is a graph showing the results of repeating the wet carving method according to the third embodiment. [Figure 5] Figure 5 is a graph showing the results of repeating the wet carving method according to the fourth embodiment. [Figure 6] Figure 6 is a graph showing the results of repeating the wet carving method according to the fifth embodiment. [Figure 7]Figure 7 is a graph showing the change in transmittance with respect to dipping time. [Figure 8] Figure 8 shows photographs of the surface (a) and a cross-section (b) of the glass after the wet etching method of the embodiment has been applied. [Figure 9] Figure 9 is a diagram illustrating the operation of a moth-like structure applied to an embodiment, showing the principle of operation of the moth-like structure. [Figure 10] Figure 10 is a diagram illustrating the effect of the moth-eye structure applied to the embodiment, and is a diagram illustrating the effect of the moth-eye structure on improving transmittance and decreasing reflectance compared to the above embodiment 4. [Figure 11] Figure 11 is a photograph illustrating the high transmittance / low reflectivity effect of glass with nanoscale patterns formed according to the examples. [Modes for carrying out the invention]

[0048] Specific embodiments of the present invention will be described in detail below with reference to the drawings. However, the spirit of the present invention is not limited to the following embodiments, and those skilled in the art who understand the spirit of the present invention can easily propose other embodiments that fall within the same spirit by adding, changing, deleting, and adding components, and these too can fall within the spirit of the present invention.

[0049] Figure 1 is a flowchart illustrating a wet etching method for glass according to an example.

[0050] Referring to Figure 1, the wet etching method for glass may include the steps of: cleaning a glass substrate (S1); forming a nanopattern on the glass substrate through wet etching (S2); and cleaning and drying the patterned glass (S3).

[0051] The cleaning step (S1) can remove foreign substances such as organic matter present on the glass substrate. The cleaning step (S1) ensures that the etching treatment with the etching solution in the pattern forming step (S2) is performed uniformly on the entire glass substrate. IPA (Isopropyl Alcohol) or ethanol can be used in the cleaning step (S1). After cleaning the glass substrate with IPA (Isopropyl Alcohol) or ethanol, it can be rinsed with water. As for the cleaning method, the glass substrate can be cleaned using ultrasound or a brush.

[0052] The patterning step (S2) can be carried out by a dipping method in which the glass substrate is immersed in a wet etching solution, or by a spray method in which the wet etching solution is sprayed onto the glass substrate. The patterning step (S2) can provide a nanopattern on the glass substrate. The dipping method can form the pattern on both sides or on the cross-section of the glass substrate. In the case of the cross-section, masking can be used.

[0053] In this case, the wet grain preparation solution composition may contain appropriate amounts of hydrofluoric acid and a surfactant. The wet grain preparation solution composition may contain appropriate amounts of at least one of oxalic acid and acetic acid. The wet grain preparation solution composition may not contain at least one of NH4F, HNO3, H3PO4, and HCl. The wet grain preparation solution composition may not contain any of NH4F, HNO3, H3PO4, and HCl. In this case, the remainder of the composition may consist of water.

[0054] According to the patterning step, a nanoscale patterned structure can be provided in which irregularities are repeatedly manifested. The patterned structure may include repeating nanoscale protrusions. The nanoscale can refer to units of 1 to 100 nanometers. The protrusions may project from the surface of the glass. The protrusions may project in a height direction perpendicular to the surface of the glass.

[0055] The patterned structure is a nanoscale moth eye structure that can reduce the reflectivity of light at the interface between glass and other media, and can significantly improve transmittance. The light can be exemplified by visible light.

[0056] The aforementioned glass can be used as a cover glass for mobile devices. In this case, the user of the mobile device can improve the visibility of the display information on the mobile device due to the high transmittance / low reflectance effect of the cover glass. Of course, the use of glass is not limited to mobile devices, but a preferred example is tempered glass for mobile devices. It is presumed that at least one of sodium and potassium is dispersed in the tempered glass.

[0057] In the step of cleaning the glass (S3), the glass can be cleaned and dried. In this step, any acidic etching solution remaining after the step of forming a pattern through wet etching (S2) can be removed.

[0058] Table 1 is a table showing the composition of the wet carving solution.

[0059] [Table 1]

[0060] Refer to Table 1 for further explanation.

[0061] The wet-processing solution composition of one embodiment may contain hydrofluoric acid in an amount exceeding 0 wt% and less than 5.0 wt%. The wet-processing solution composition of one embodiment may contain oxalic acid in an amount exceeding 0 wt% and less than 5.0 wt%. The wet-processing solution composition of one embodiment may contain acetic acid in an amount exceeding 0 wt% and less than 10.0 wt%. The wet-processing solution composition of one embodiment may contain surfactant in an amount exceeding 0 wt% and less than 1.0 wt%. Water may be included as a residual component of the prerequisite processing solution.

[0062] The wet etching solution composition of one embodiment may contain hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%. The remaining composition of the prerequisite etching solution may include water. The inventors hypothesize that sodium and potassium oxides are homogeneously dispersed in the interior and on the surface of various commercially available glasses at levels suitable for creating nanoscale irregularities. Through this, they hypothesize that nanoscale structures can be formed on the surface of glass by incorporating hydrofluoric acid.

[0063] The wet-processing solution composition of one embodiment may contain hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, oxalic acid in an amount greater than 0 wt% but less than 5.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%. The remaining composition of the prerequisite grinding solution may include water.

[0064] The wet-processing solution composition of one embodiment may contain hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, acetic acid in an amount greater than 0 wt% but less than 10.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%. The remaining composition of the prerequisite grinding solution may include water.

[0065] The wet-process food chipping solution composition of one embodiment contains hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, and can contain at least one of the following: oxalic acid in an amount greater than 0 wt% but less than 5.0 wt%, acetic acid in an amount greater than 0 wt% but less than 10.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%. The remaining composition of the prerequisite food chipping solution can contain water. In this case, if both oxalic acid and acetic acid are present, the amount of acetic acid can be even greater.

[0066] By including an appropriate amount of at least one of the aforementioned oxalic acid and acetic acid, the stability and reproducibility of the food chipping reaction can be improved. The appropriate amount of at least one of the aforementioned oxalic acid and acetic acid may be greater than 0 wt% and less than 5.0 wt%.

[0067] Preferably, the wet-processed grain grinding solution composition of one embodiment may contain hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, oxalic acid in an amount greater than 0 wt% but less than 5.0 wt%, acetic acid in an amount greater than 0 wt% but less than 10.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%. The remaining composition of the prerequisite grain grinding solution may include water.

[0068] The wet-process chipping solution compositions of the examples must contain hydrofluoric acid, and its content can be greater than 0 wt% but less than 5.0 wt%.

[0069] The aforementioned hydrofluoric acid can form nanoscale structures on glass according to chemical formulas 1, 2, and 3.

[0070] [ka]

[0071] [ka]

[0072] [ka]

[0073] Referring to the aforementioned chemical formula, the hydrofluoric acid can react with sodium and potassium oxides present in the glass to form NaF and KF. Since both NaF and KF are water-soluble, they are dissolved in the glass grinding solution.

[0074] SiO2, the main component of glass, can also react with HF to produce H2SiF6, as shown in chemical formula 3. The reaction rate of chemical formula 3 is significantly lower than that of chemical formulas 1 and 2, and it is understood that this difference in reaction rates is what forms the nanoscale uneven structure.

[0075] Since the aforementioned H2SiF6 is also water-soluble, it dissolves in the etching solution after the reaction and remains present. The formation of nanostructures due to the reaction rate difference between chemical formulas 1, 2, and 3 can be one of the features of the present invention. Here, nanoscale can refer to the thickness and depth of the irregularities.

[0076] The wet etching solution composition of the example may contain a surfactant. The surfactant can play a role in ensuring that food particles fall off the surface of the glass substrate well, in adsorbing the food particles well by forming bubbles, and in ensuring that the active components of the wet etching solution come into good contact with the fine surface of the glass substrate. Through the surfactant, nanoscale structures can be uniformly and smoothly provided to the entire surface of the glass.

[0077] The wet grain chipping solution compositions in the examples may not contain NH4F, HNO3, H3PO4, and HCl. Although it was expected that NH4F, HNO3, H3PO4, and HCl would play a significant role in the formation of nanoscale structures, it was confirmed that they caused problems in process stabilization, reproducibility, and the uniformity of nanostructures. It can be inferred that this is due to the poor reactivity of NH4F, HNO3, H3PO4, and HCl with surfactants.

[0078] The wet etching solution composition can be affected by reaction time and reaction temperature. The inventor was able to obtain a variety of examples applicable as products through countless repeated experiments. Various types of glass were used, and each glass manufacturer does not disclose the composition and processing methods of their glass. As a result, the inventor confirmed the performance of the wet etching solution composition through repeated experiments. One example of the glass used is the glass used as the front cover of a mobile device.

[0079] Example 1 of the wet food carving method

[0080] -Manufacturer A glass, dipping time for cutting food, temperature 30-40℃, cutting time 1-2 minutes

[0081] Example 2 of the wet food carving method

[0082] -Manufacturer B glass, dipping time for cutting, temperature 60-65℃, cutting time 1.5-2 minutes

[0083] Example 3 of the wet food carving method

[0084] -X manufacturer's A glass, dipping and cutting, temperature 65-70℃, cutting time 2-4 minutes

[0085] Example 4 of the wet food carving method

[0086] -Manufacturer C, glass, dipping method, temperature 65-70℃, cutting time 3-5 minutes

[0087] Example 5 of the wet food carving method

[0088] -Manufacturer's C glass, dipping time for cutting food, temperature 40-45℃, cutting time 3.5-5 minutes

[0089] The wet-process etching solution composition used at this time may contain hydrofluoric acid in an amount greater than 0 wt% but less than 5.0 wt%, oxalic acid in an amount greater than 0 wt% but less than 5.0 wt%, acetic acid in an amount greater than 0 wt% but less than 10.0 wt%, and a surfactant in an amount greater than 0 wt% but less than 1.0 wt%. The remaining composition of the prerequisite etching solution may include water.

[0090] Since it is dipped in an etching solution, the glass can be etched on both sides.

[0091] The transmittance of the glass patterned using the wet etching method described in each of the above embodiments was measured before and after patterning.

[0092] Figures 2 to 6 show the results of repeating the wet carving method according to the first to fifth embodiments, with each graph illustrating the results.

[0093] According to the examples, in Example 1 of the wet carving method shown in Figure 2, the transmittance at 550 nm improved from 92% to 97%, a 5% increase. In Example 2 of the wet carving method shown in Figure 3, the transmittance at 550 nm improved from 92% to 96%, a 4% increase. In Example 3 of the wet carving method shown in Figure 4, the transmittance at 550 nm improved from 91.5% to 95.5%, a 4% increase. In Example 4 of the wet carving method shown in Figure 5, the transmittance at 550 nm improved from 92% to 98%, a 6% increase. In Example 5 of the wet carving method shown in Figure 6, the transmittance at 550 nm improved from 91.7% to 96%, a 4.3% increase.

[0094] As seen above, it can be confirmed that the transmittance of the glass subjected to the wet etching method of the embodiment is improved in all cases. Through this, for example, improved transmittance leads to a decrease in reflectance, which can improve the visibility of information for mobile device users and reduce eye strain.

[0095] Figure 7 is a graph showing the change in transmittance with respect to dipping time in Example 5.

[0096] Referring to Figure 7, the longer the dipping time, the higher the transmittance. However, the transmittance peaks at 96% at 4 minutes. If the dipping time is insufficient, the etching reaction may be inadequate, resulting in insufficient formation of nanostructures and potentially leading to insufficient improvement in transmittance.

[0097] If the dipping time exceeds 4 minutes and becomes longer, the transmittance may decrease again. This is because, after the sodium and potassium oxides present on the glass surface are consumed by the reactions of chemical formulas 1 and 2, the SiO2 forming the protrusions is etched by the reaction of chemical formula 3. As a result, the SiO2 protrusions that form the uneven surface become smaller, and the depth of the recessed (Valley) portion decreases, which can be understood as a phenomenon that occurs. In other words, the depth of the recessed (Valley) portion decreases again because the height of the already formed protrusions decreases. To put it another way, this may be a phenomenon that occurs due to insufficient role of the protrusions as shown in Figure 9. In the examples, the wet etching temperature can be set to 60°C. Referring to Figure 7 (Example 5), it can be seen that the dipping time must be within 7 minutes.

[0098] Figure 8 shows photographs of the surface (a) and a cross-section (b) of the glass after the wet etching method of the embodiment has been applied.

[0099] Referring to Figure 8, we can see in Figure 8(a) that the thickness of the protrusions was formed to be several nanometers to tens of nanometers. In Figure 8(b), we can see that the depth of the protrusions was formed to be several nanometers to tens of nanometers.

[0100] Referring to Figure 8, the nanoscale mentioned in the examples can refer to all aspects of the thickness and depth of the irregularities. The irregularities can consist of protrusions and grooves. The thickness of the protrusions can be provided in the range of 1-50 nanometers. Preferably, the thickness of the protrusions can be provided in the range of 5-30 nanometers. When the thickness of the protrusions is 1-50 nanometers, the depth of the protrusions can be provided in the range of 1-50 nanometers. When the thickness of the protrusions is 5-30 nanometers, the depth of the protrusions can be provided in the range of 5-30 nanometers. With the above numbers, nanoscale structures in the range of tens of nanometers will exhibit high transmittance / low reflectance effects according to the principle shown in Figure 9.

[0101] The aforementioned protrusion may have a thickness (width or width) greater than its depth. Through this, repeated contact of external objects with the touch panel may not cause a decrease in reflectivity performance. For example, contact may not cause damage or collapse of the protrusion.

[0102] As a comparative example, a moth-eye structure with protrusions having a depth of several hundred nanometers (100-500 nanometers) and a thickness of several tens of nanometers (1-99 nanometers) is vulnerable to repeated external impacts. Therefore, the reflectivity of the glass changes drastically over time, and the reflectivity improvement effect decreases. In conclusion, it may be difficult to use this type of glass in environments with severe contact and exposure to the external environment.

[0103] Figures 9 and 10 are diagrams illustrating the operation of the moth-eye structure applied to the embodiment. Figure 9 shows the principle of operation of the moth-eye structure, and Figure 10 is a diagram illustrating the effect of the moth-eye structure on improving transmittance and reducing reflectance in the embodiment 4.

[0104] Light reflection occurs at the interface between different media through which light passes due to the difference in refractive index. Referring to Figure 9, there is a difference in refractive index for light incident on the glass at the interface between air and glass with nanostructures formed on its surface. In other words, the refractive index of air increases progressively from 1.0 to 1.5 in glass. As a result, the reflectivity decreases and the transmittance increases.

[0105] Referring to Figure 10, when a nanoscale pattern is formed (b), the amount of reflected light can be significantly reduced compared to when no pattern is formed (a). The nanoscale pattern can be provided on both sides of the glass. If it is only needed on the cross-section of the glass, one side can be masked to eliminate the etching reaction before dipping.

[0106] Figure 11 is a photograph illustrating the high transmittance / low reflectance effect of glass with nanoscale patterns formed according to the example.

[0107] Figure 11 is a photograph taken in sunlight. Referring to this, you can see that the image of the bottom surface of the nanopatterned area is much clearer due to the high transmittance / low reflectivity effect. You can also see that the screen of the nanopatterned area on the cover glass of a mobile device is clearly visible. In the diagram, MENS stands for Moth Eye Nano-Structure.

[0108] The glass having high transmittance / low reflectance according to the present invention can be preferably used as cover glass for mobile devices. However, it is not limited thereto and can be applied to a variety of other fields.

[0109] For example, it can be applied to the outermost cover of a flat panel display (FPD), specifically to the front panels of tablet PCs, TVs, CCTVs, monitors, kiosks, ATMs, and DIDs (Digital Information Displays). It can also be applied to automotive CIDs (Center Information Displays), navigation systems, and RSEs (Rear Seat Entertainment). Furthermore, it can be applied to lenses or windows of cameras, telescopes, and microscopes. It can also be used as an encapsulating cover for UV LEDs, OLEDs, etc. In addition, it can be applied to electronic whiteboards, display stand glass, viewports, picture frames, military optical equipment, and solar cells. [Industrial applicability]

[0110] This invention makes it possible to achieve high transmittance / low reflectivity on various types of glass using a wet etching method. This not only improves the performance of various electronic devices, including various displays and optical components, but also enhances user convenience.

[0111] According to the present invention, it is possible to obtain glass with high transmittance / low reflectivity in which the stability, reproducibility, and uniformity of the etching reaction are improved.

Claims

1. To clean glass, The process involves wet etching the cleaned glass to form nanoscale patterns, and This includes cleaning and drying the nanopatterned glass. The wet carving solution used in the aforementioned wet carving step contains hydrofluoric acid and a surfactant, NH ４ F, HNO ３ , H ３ PO ４ It does not contain either HCl or HCl. The aforementioned nanoscale pattern has a range of 1-100 nanometers. The aforementioned glass is a moth-eye structure including protrusions extending from its surface, and is applied to the front panel of a flat display, the lens or window or protective cover of an optical instrument. A nano-wet grain carving method in which the wet grain carving solution contains oxalic acid in an amount greater than 0 wt% but less than 5.0 wt%, and acetic acid in an amount greater than 0 wt% but less than 10.0 wt%, thereby improving the reproducibility of the grain carving reaction.

2. The method for nano-wet etching of glass according to claim 1, wherein the wet etching is performed by a dipping method, and the nanoscale pattern is formed on both sides or the cross-section of the glass.

3. The nano-wet etching method for glass according to claim 1, wherein the thickness of the protrusion is 1 to 50 nanometers and the depth of the protrusion is 1 to 50 nanometers.

4. The nano-wet etching method for glass according to claim 1, wherein the thickness of the protrusion is 5-30 nanometers and the depth of the protrusion is 5-30 nanometers.

5. The nano-wet etching method for glass according to claim 3 or 4, wherein the thickness of the projection is greater than the depth.

6. The method for nano-wet cutting of glass according to claim 1, wherein the wet cutting solution composition in the wet cutting step comprises water.

7. The aforementioned hydrofluoric acid is contained in an amount exceeding 0 wt% but less than 5.0 wt%, or The nano-wet etching method for glass according to claim 6, wherein the surfactant is contained in an amount greater than 0 wt% and less than 1.0 wt%.

8. A method for nano-wet etching of glass according to any one of claims 1 to 7, wherein the wet etching temperature is 30-70°C and the etching time is 1-7 minutes.

9. A wet etching solution composition for etching glass, which is a moth-eye structure with nanoscale patterns in the range of 1-100 nanometers and protrusions extending from the glass surface, applicable to the front panel of a flat display, lens or window or protective cover of an optical instrument, and which improves the reproducibility of the etching reaction. The wet-process food chipping solution composition contains hydrofluoric acid in an amount exceeding 0 wt% but less than 5.0 wt%, a surfactant in an amount exceeding 0 wt% but less than 1.0 wt%, oxalic acid in an amount exceeding 0 wt% but less than 5.0 wt%, acetic acid in an amount exceeding 0 wt% but less than 10.0 wt%, and NH ４ F, HNO ３ , H ３ PO ４ A wet-process food chipping solution composition that does not contain either HCl, and the remaining component is water.

10. The wet-process food chipping solution composition according to claim 9, wherein the composition contains even more acetic acid than oxalic acid.

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