Electronic card with electronic interface

Abstract

To provide an electronic ID card or electronic card having various feature units.SOLUTION: An electronic card 200 includes: a metal substrate having a front surface 210 and a back surface, the metal substrate defining a recessed part 208 extending to the front surface; a ferromagnetic film 230 arranged along the back surface of the metal substrate; an integrated circuit 206 arranged in the recessed part 208 at least partially; and a first coating layer including a first layer 201 arranged on the metal substrate to extend to the front surface of the metal substrate and a second layer 203 extending to the first layer 201, the first layer including a polymer and a pigment dispersed in the polymer and the second layer including a transparent polymer.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] [Cross-Reference to Related Applications] This application is a non-provisional patent application claiming priority to U.S. Provisional Patent Application No. 62 / 737,528 entitled "Electronic Card Having an Electronic Interface", filed on September 27, 2018, U.S. Provisional Patent Application No. 62 / 814,779 entitled "Electronic Card Having an Electronic Interface", filed on March 6, 2019, and U.S. Provisional Patent Application No. 62 / 814,788 entitled "Electronic Card Having an Electronic Interface", filed on March 6, 2019, the entire disclosures of which are incorporated herein by reference.

[0002] [Technical Field] The embodiments described generally relate to electronic devices. More specifically, the present embodiments relate to an electronic card having an electronic interface and various features as described herein.

Background Art

[0003] Conventionally, ID cards have been used to identify a specific user or entity associated with the card. For example, an ID card may include a printed serial number, a photograph, or other information that can be used to identify a user. However, with recent developments in user identification, electronic readers can identify a user by electronically reading an ID card or other forms of ID. The cards, systems, and techniques described herein relate to an electronic card with improved features and processes for manufacturing an electronic card.

Summary of the Invention

[0004] The embodiments described herein relate to an electronic ID card or an electronic card having various features. The electronic card may include an integrated circuit and a contact plate for electrically interface with the integrated circuit. The contact plate may include an array of terminal electrodes displaced from the edges of the contact plate. The electronic card may be coated with a coating layer that at least partially covers a ferromagnetic element or a ferromagnetic film. The electronic card may further include a metal substrate having exposed chamfers that provide visual contrast with the coating layer and improve handling and use of the electronic card.

[0005] In some exemplary embodiments, the electronic ID card includes a substrate containing a metallic material. The substrate may define a first recess or stepped region formed on a first surface of the substrate and extending along the outer substrate edge of the substrate. The substrate may further define a second recess on a second surface opposite to the first surface of the substrate. The ferromagnetic film may be disposed at least partially within the first recess or stepped region, and the integrated circuit may be disposed at least partially within the second recess. The ID card also further includes a coating layer containing a polymer and a pigment dispersed within the polymer. The coating layer may be disposed on the ferromagnetic film and at least a portion of the substrate.

[0006] In some embodiments, the substrate is formed from a titanium sheet having a thickness of less than 1 mm. The substrate may also include a titanium sheet bonded to or laminated to a plastic (polymer) sheet, with the combined thickness of the titanium and plastic sheets being less than 1 mm. In some cases, the first recess is a first laser-ablated recess formed on a first surface of the substrate. The second recess may be a second laser-ablated recess formed on a second surface of the substrate. In some embodiments, the electronic ID card is a rectangle with four corners, each corner having a rounded shape. The rounded shape is a spline shape with a non-uniform radius of curvature.

[0007] In some embodiments, the coating layer comprises a first layer and a second layer. The first layer comprises a polymer and a pigment, and the second layer comprises a transparent polymer disposed on the first layer and defining at least a portion of the outer surface of the electronic ID card. In some cases, the coating layer is disposed on a first surface and at least a portion of the second surface of the substrate.

[0008] In some embodiments, the electronic ID card further includes a contact plate disposed on an integrated circuit. A portion of the outer surface defined by a transparent polymer may be a first portion, and the contact plate may define a terminal electrode array defining a second portion of the outer surface of the electronic ID card.

[0009] In some embodiments, the electronic ID card defines a first set of chamfered edges extending around a first face and a second set of chamfered edges extending around a second face. In some cases, the first set of chamfered edges extends along the outer substrate edge of the substrate. The ferromagnetic film may be attached to a backing layer, and the first chamfered edges may be defined at least partially by the ferromagnetic film and the inclined edges formed within the backing layer. In some embodiments, the first chamfered edges do not extend beyond the inclined edges of the ferromagnetic film and the backing layer.

[0010] In some embodiments, the second set of chamfered edges is at least partially defined by the chamfered portion of the substrate. The electronic ID card may further include an oxide coating formed on the chamfered portion of the substrate. The coating layer may have a first color, and the oxide coating may have a second color that is visually distinct from the first color.

[0011] In some embodiments, the electronic ID card further includes a laser-formed relief feature. The laser-formed relief feature may include at least one concave wall defining a recess extending through the coating layer. The laser-formed relief feature may further include a concave marking feature defining the bottom of the recess and being visually distinct from the adjacent portion of the coating layer.

[0012] Some exemplary embodiments relate to an electronic ID card comprising a substrate defining a recess formed on its front surface, and an integrated circuit disposed in the recess. The electronic card may further include a ferromagnetic film disposed along the back surface of the substrate opposite to the front surface. The electronic card may further include a contact plate disposed on the integrated circuit, the contact plate may include a plate substrate defining an outer edge set, and a terminal electrode array disposed on the plate substrate. Each terminal electrode of the terminal electrode array may be displaced from the outer edge set of the plate substrate.

[0013] In some embodiments, the contact plate further comprises a set of ablated regions, each ablated region positioned between the corresponding terminal electrode of the terminal electrode array and the corresponding outer edge of the outer edge set. In some cases, the contact plate further comprises a conductive periphery containing conductive material surrounding the terminal electrode array. The periphery may be separated from the terminal electrode array by one or more ablated regions.

[0014] In some embodiments, the terminal electrode array may be disposed on the front surface of the plate substrate. The contact plate may further include a back conductive layer disposed on the back surface of the plate substrate. The terminal electrode array may be electrically connected to the back conductive layer by one or more vias that penetrate the plate substrate.

[0015] In some embodiments, the plate substrate is formed from a non-conductive material. The terminal electrode array may include a first conductive layer comprising an electroless plated metal disposed on the non-conductive material of the plate substrate. The terminal electrode array may also include a second conductive layer comprising an electroplated metal disposed on the first conductive layer.

[0016] Several exemplary embodiments relate to methods for forming contact plates for electronic cards. A photoresist layer may be applied to the front surface of a plate substrate. The photoresist layer may be exposed using a light source to form a plating mask that defines a plating area array. A catalyst solution may be applied to the plating area array to form a first conductive layer along the plating areas of the plating area array. A plating solution may be applied to the first conductive layer. A second conductive layer may be formed on the first conductive layer using an electroplating process in which an electric current is applied to the first conductive layer while the plating solution is applied to the first conductive layer to define terminal electrodes that are displaced between terminal electrodes and the edge of the plate substrate.

[0017] In some embodiments, the plate substrate is formed from a non-conductive material. The first conductive layer may include a bridge portion that electrically connects the first conductive layer to the edge of the plate substrate. In some cases, the method further includes laser-ablating portions of the first and second conductive layers, at least partially located within the bridge portion, to expose a portion of the non-conductive material of the plate substrate. In some embodiments, a conductive periphery is positioned on the front surface of the plate substrate and at least partially surrounds the terminal electrodes. The bridge portion may extend between the terminal electrodes and the conductive periphery.

[0018] In some embodiments, a back conductive layer is formed along the back of the plate substrate opposite to the front. The first conductive layer may be electrically connected to the back conductive layer using one or more vias that penetrate the plate substrate. [Brief explanation of the drawing]

[0019] This disclosure will be readily understood by the following detailed description in conjunction with the attached drawings, where similar reference numerals indicate similar structural elements.

[0020] [Figure 1A] This is a front view of an example electronic card.

[0021] [Figure 1B] This is an illustrative rear view of an electronic card.

[0022] [Figure 1C] It is an exploded view of an exemplary electronic card.

[0023] [Figure 2] It is an exploded view of an exemplary electronic card.

[0024] [Figure 3A] It is a cross-sectional view of an electronic card. [Figure 3B] It is a cross-sectional view of an electronic card. [Figure 3C] It is a cross-sectional view of an electronic card.

[0025] [Figure 4] It is a cross-sectional view of an electronic card.

[0026] [Figure 5A] It is a cross-sectional view of an electronic card. [Figure 5B] It is a cross-sectional view of an electronic card. [Figure 5C] It is a cross-sectional view of an electronic card.

[0027] [Figure 6A] It is a top view of an exemplary contact plate. [Figure 6B] It is a top view of an exemplary contact plate. [Figure 6C] It is a top view of an exemplary contact plate. [Figure 6D] It is a top view of an exemplary contact plate.

[0028] [Figure 7A] It is a diagram showing various exemplary terminal electrode arrays. [Figure 7B] It is a diagram showing various exemplary terminal electrode arrays. [Figure 7C] It is a diagram showing various exemplary terminal electrode arrays. [Figure 7D] It is a diagram showing various exemplary terminal electrode arrays.

[0029] [Figure 8A] Figure 6 is an exemplary cross-sectional view of an exemplary contact plate. [Figure 8B] Figure 6 is an exemplary cross-sectional view of an exemplary contact plate.

[0030] [Figure 9A] This figure shows an exemplary connecting structure of contact plates. [Figure 9B] This figure shows an exemplary connecting structure of contact plates.

[0031] [Figure 10] This is a diagram illustrating exemplary markings on an electronic card.

[0032] [Figure 11A] This is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11B] This is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11C] This is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11D] This is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11E] This is a cross-sectional view of an exemplary marking on an electronic card. [Figure 11F] This is a cross-sectional view of an exemplary marking on an electronic card.

[0033] [Figure 12] This figure shows an exemplary laser-formed relief feature. [Figure 13] This figure shows an exemplary laser-formed relief feature. [Figure 14] This figure shows an exemplary laser-formed relief feature.

[0034] [Figure 15A] This figure shows an exemplary laser-formed relief feature. [Figure 15B] This figure shows an exemplary laser-formed relief feature.

[0035] [Figure 16A] This diagram shows an example of a chamfered edge on an electronic card. [Figure 16B] This diagram shows an example of a chamfered edge on an electronic card. [Figure 16C] This diagram shows an example of a chamfered edge on an electronic card.

[0036] [Figure 17] This is a diagram illustrating the components of an electronic card. [Modes for carrying out the invention]

[0037] Herein, representative embodiments illustrated in the attached drawings are described in detail. It should be understood that the following description is not intended to limit these embodiments to one preferred embodiment. On the contrary, the following description is intended to include alternative forms, modifications, and equivalents that may be included in the spirit and scope of the embodiments defined by the attached claims.

[0038] The embodiments described herein relate to electronic cards having various feature components. As described herein, an electronic card includes an integrated circuit and an electronic interface that can be used to communicate with an external card reader. An electronic card may be an ID card used to authenticate or identify a user. In some examples, an electronic card may be used as a security badge, employee ID card, student ID card, customer loyalty card, electronic passport, or other form of electronic ID. In some cases, an electronic card may be a state-issued ID card that functions as a driver's license, a social security card, or other government-issued ID. Electronic cards may also be used to facilitate transactions or purchases and may be used as credit cards, debit cards, prepaid debit cards, prepaid telephone cards, vending cards, parking cards, toll cards, and other similar types of cards used to facilitate transactions. In some cases, an electronic card may be configured to securely store information and / or keys or codes that can be used to access information securely stored from another source. For example, an electronic card may be used to store or access medical records or financial information. In some cases, electronic cards are configured to function as subscriber identification modules (SIMs) used in mobile phones or cellular phones. Electronic cards may also be configured as gift cards configured to store card value or to deduct card value from an account. Electronic cards may also be used to provide access to facilities, restricted areas, or restricted systems. For example, an electronic card may include one or more components configured to communicate with an external reader or device to unlock access to a restricted area, restricted region, or restricted system.

[0039] Electronic cards, also referred to herein as electronic ID cards, smart cards, chip cards, or integrated circuit cards (ICCs), typically include integrated circuits, electrical interfaces, and may further include one or more magnetizing elements, such as ferromagnetic strips or magnetic areas. Electronic cards may also comply with one or more standards, including, for example, the international standards ISO 14443, ISO 15693, ISO 7810, and / or ISO 7816. In some cases, electronic cards may comply with standards and industry standards associated with what is called a “contact card.” Contact cards typically include terminals or electrode arrays that physically contact an external card reader or other electronic device to facilitate electronic communication. Electronic cards may also comply with standards and practices that may be associated with what is called a “contactless card.” Generally, contactless cards include radio transceivers or other radio electronic devices configured to interface with external devices using radio communication protocols. Contactless cards may or may not include one or more electrical contacts or terminals in addition to the radio electronic devices. Whether an electronic card is a contact card or a contactless card, it may include a magnetic or ferromagnetic strip for use with an external card reader having magnetic swipe or similar magnetic strip reading capabilities.

[0040] Some embodiments described herein relate to electronic cards having a metal substrate coated with a two-part or multi-layer coating. The coating layer (consisting of one or more separate layers or components) may be specially formulated to give the electronic card the appearance and / or feel of a ceramic material. For example, the coating layer may have a specific formulation of additives and a surface roughness that gives it a ceramic-like feel to the touch. The coating layer may also be used to give the electronic card a uniform appearance and to conceal various functional elements of the card. For example, the coating layer may be used to conceal a ferromagnetic film, ferromagnetic strip, or ferromagnetic stack placed beneath the coating. In some cases, the ferromagnetic film, ferromagnetic strip, or ferromagnetic stack is placed in a stepped area, recess, or pocket formed on the electronic card and covered or coated with the coating layer.

[0041] Some embodiments described herein relate to electronic cards having a contact plate with a unique arrangement of electrodes. Specifically, an electronic card may have a contact plate having a terminal electrode array displaced from the edge of the contact plate. As described herein, the contact plate may have a terminal electrode array in which each terminal electrode is displaced from the corresponding edge of the contact plate. This configuration offers certain functional advantages by enabling unique terminal layouts that were not possible in the prior art. However, this configuration also presents various manufacturing challenges. Various techniques for solving these manufacturing challenges are described herein. For example, in some examples, to simplify the electroplating process, the terminal electrodes may temporarily extend to one or more edges of the contact plate, and then a portion of the terminal electrodes may be polished using a laser-based process. In other examples, the terminal electrodes are electrically connected to a copper layer located hidden or on the inner surface of the contact plate to facilitate the electroplating process.

[0042] Some embodiments described herein relate to electronic cards having markings formed at least partially on a coating layer. In some embodiments, the markings include subsurface markings formed below a first layer of the coating layer and within a second layer of the coating layer. In some embodiments, the markings include laser relief features that extend through the coating layer and expose a portion of the underlying substrate. In examples where the substrate is formed from a metallic material, the laser relief features may include one or more oxide layers that can provide a different color or visual appearance from the surrounding or adjacent portions of the coating layer.

[0043] In some examples, the electronic card includes one or more bevels or beveled edges formed around the front or back of the electronic card. In some embodiments, the bevels or beveled edges are entirely contained within the ferromagnetic film and support layer and do not extend into the underlying metal substrate. In some cases, the bevels or beveled edges extend into the metal substrate, exposing a portion of the metallic material. In such cases, the exposed portion of the metallic material may be coated with an oxide layer that provides a different color, a distinguishable color, or a specific visual appearance. In some cases, the bevels include a coating layer or oxide layer that provides a colored appearance, and the edges of the card are exposed edges of the metal substrate that are not coated or covered with the coating layer or colored oxide layer. Using these techniques makes it possible to achieve a unique visual appearance that is less susceptible to wear and degradation over time compared to conventional inks or printed markings.

[0044] These and other embodiments will be described below with reference to Figures 1A to 17. However, those skilled in the art will readily understand that the embodiments for carrying out the invention given herein with respect to these figures are for illustrative purposes only and should not be construed as limiting.

[0045] Figures 1A and 1B show exemplary electronic cards according to embodiments described herein. Figure 1A is a front view of electronic card 100. Generally, electronic card 100 may be an electronic ID card associated with a specific individual. Electronic card 100 can be used to authenticate or identify an individual or user. As previously stated, electronic card 100 may be used as a security badge, employee ID card, student ID card, customer or retail loyalty card, electronic passport, or any other form of electronic identification. Electronic cards may also be used to facilitate transactions or purchases and may, in some cases, be used as credit cards, debit cards, prepaid debit cards, prepaid telephone cards, vending cards, parking cards, toll cards, and other similar types of cards used to facilitate transactions. Electronic card 100 may comply with one or more standards, including, for example, ISO 14443, ISO 15693, ISO 7810, and / or ISO 7816 international standards.

[0046] In some cases, the electronic card 100 includes computer memory configured to securely store information and / or keys or codes that can be used to access information stored in an external device or system. For example, the electronic card 100 may be used to store or access medical records or financial information. In some cases, the electronic card 100 is configured to operate as a subscriber identification module (SIM) for use in a mobile phone or cellular telephone on a wireless or cellular network. The computer memory or computer-readable memory function of the electronic card 100 may be provided by one or more memory components, such as, for example, an electronically readable magnetic strip or magnetic strap, programmable random access memory, a solid-state memory component, and other forms of electronic information storage components. Other exemplary computer-readable memory components are described later with reference to Figure 17.

[0047] The electronic card 100 may also be called an electronic ID card, smart card, chip card, or integrated circuit card (ICC). The electronic card 100 shown in Figure 1A is configured to operate as a contact card. In some embodiments, the electronic card 100 may include wireless circuitry and be configured to operate as a contactless card. When configured as a contactless card, the electronic card 100 may include a contact plate 102, or it may omit the contact plate 102.

[0048] As shown in Figure 1A, the electronic card 100 includes several feature portions along its front surface 110. Specifically, the electronic card 100 includes a contact plate 102 which includes a terminal electrode array 104 defining at least a portion of the outer surface of the electronic card 100. The terminal electrodes 104 are formed from a conductive material and may be configured to provide a contact-based electrical interface with external devices, such as an external card reader, terminal device, point-of-service (POS) system, or other similar type of device. As shown in Figure 1A, the terminal electrode array 104 is displaced from the edge of the contact plate 102 and may have any one of a variety of shapes or configurations. Exemplary contact plates and terminal electrodes will be described later with reference to Figures 6A-9B.

[0049] Generally, the terminal electrodes 104 of the contact plate 102 remain exposed to simplify electrical contact with an external card reader or device. However, the terminal electrodes 104 may be colored, including with a conductive coating, or otherwise, to substantially match the color of the surrounding portion of the electronic card 100. In one example, the terminal electrodes 104 are coated with conductive ink or markings that substantially match the color of the coating on the electronic card 100 to camouflage or conceal the exposed terminal electrodes 104. While the contact plate 102 is shown to have a square or rectangular form factor, in other embodiments, the contact plate 102 may have a circular or round shape or form factor. In some examples, the contact plate 102 and terminal electrodes 104 formed using one of the manufacturing techniques described can be thinner than conventional contact plate assemblies or circuits.

[0050] As shown in Figure 1A, the electronic card 100 may further include one or more markings 114. The markings 114 may identify a company, institution, or entity associated with the electronic card 100. The markings 114 may optionally identify a user or individual associated with the card. In some cases, the markings 114 may include an account number, serial number, or any other identifier associated with the individual and / or the electronic card 100. In embodiments where the electronic card 100 is a credit card or other similar card issued by a financial institution, the electronic card 100 may omit a conventional signature block, expiration date, primary account number (PAN), or other traditional markings. The markings 114 may include the name and / or logo of the issuing authority, and the name of the cardholder or other unique personal information related to the cardholder. Also, unlike some conventional credit cards, the markings 114 may be flush with the outer surface of the electronic card 100, unembossed, or otherwise smooth.

[0051] In some cases, the marking 114 includes a microscale security mark. The microscale security mark may include a microscale feature formed on the coating of the electronic card 100 by etching, laser forming, machining, or other means. The microscale feature is used to verify the authenticity of the electronic card 100 by generating an authentication mark that is difficult to forge or copy. In some cases, the microscale security mark may be integrated with one or more non-microscale markings in order to camouflage or otherwise obscure the appearance of the microscale marking.

[0052] In some embodiments, the marking 114 is printed or painted onto the front surface 110 of the electronic card 100. Additionally or alternatively, the marking 114 may be formed using laser marking techniques. In one example, the marking 114 is a subsurface marking formed on one of the coating layers of the electronic card 100. In another example, the marking 114 may include a laser-formed relief feature formed on the coating or coating layer of the electronic card 100 and extending into the underlying card substrate. (See, for example, substrates 1202, 1302, and 1402 in Figures 12, 13, and 14.) Using a laser-formed relief feature as or as part of the marking 114 may provide a more durable and impressive visual feature than conventional ink or printed markings. Various exemplary markings are described later with reference to Figures 10 to 15B.

[0053] As shown in Figure 1A, the electronic card 100 may include a set of edges 116 surrounding the front surface 110. According to some embodiments described herein, one or more edges of the set of edges 116 may include a chamfered or beveled area. In some embodiments, as described herein, the set of edges 116 is a set of chamfered edges that extends around or surrounds the front surface 110. The chamfered or beveled area can improve the appearance and feel of the electronic card 100. The chamfered or beveled area also makes the electronic card 100 easier to use with certain external card readers or card reading devices.

[0054] Figure 1B is a rear view of the electronic card 100. As shown in Figure 1B, the electronic card 100 includes several feature portions along the rear surface 120. Specifically, the electronic card 100 includes a set of edges 122 that extends around or surrounds the rear surface 120. According to some embodiments described herein, one or more edges of the set of edges 122 may include a chamfered portion or a beveled area. This chamfered portion or beveled area may correspond to a chamfered portion or a beveled area of ​​a set of edges 116 surrounding the front surface 110. Specifically, the chamfered edges of the second set may extend around or surround the rear surface 120. As described herein, the chamfered edges may be coated or covered with an oxide or other coating that provides color along the chamfered edges. In some cases, the chamfered edges include an exposed portion of the metal substrate. In some cases, the chamfered edges are colored, while the edges or sidewalls of the substrate extending between the front and rear chamfered edges are exposed and not coated or colored.

[0055] As shown in Figure 1B, the electronic card 100 also includes a magnetic area 124. The magnetic area 124 may extend to the edge 122a of the electronic card 100. In some embodiments, the magnetic area 124 is larger than the conventional magnetic strip used in conventional credit cards. The magnetic area 124 may allow the reading of encoded information using an external card reader or card reading device. The entire magnetic area 124 may be encodeable, but in some embodiments, only a portion of the magnetic area 124 is actually encoded with information. For example, a sub-region within the magnetic area 124 may define an encoded strip or band corresponding to the location of a conventional magnetic strip on a conventional credit card, ID card, or other card adapted to be read using an external magnetic reader. In one example, the encoded area of ​​the magnetic area 124 is about 5-10 mm wide and is displaced about 5 mm from the edge 122a.

[0056] In Figure 1B, the magnetic region 124 is shown to extend to the edge 122 of the electronic card 100, but in other embodiments, the magnetic region 124 may be displaced from one or more edges of the electronic card 100. In addition, the orientation of the magnetic region 124 may differ from embodiment to embodiment. For example, the magnetic region 124 may be located along the short edge of the electronic card 100, or displaced from there. In another embodiment, the magnetic region 124 is located in the central region of the electronic card 100. In another embodiment, the magnetic region 124 is omitted entirely.

[0057] As will be described later with reference to Figures 3A to 3C, the magnetic region 124 may be defined by a ferromagnetic film placed beneath the coating layer. The coating layer may be thin enough to allow the passage of magnetization signals or encoded data, while being thick enough to conceal the ferromagnetic film. Although the ferromagnetic film or other ferromagnetic element may be concealed or made invisible by the coating layer, the electronic card 100 may include visual markings 126 or other marks indicating the approximate location of the ferromagnetic element or ferromagnetic film, and / or the boundary or area of ​​the magnetic region 124. The visual markings 126 may be formed using ink or printing techniques, and / or may include recessed marking features, as will be described later with reference to Figures 10 to 15B.

[0058] As shown in Figures 1A and 1B, the electronic card 100 may include four corner regions 112. In this example, the corner regions 112 have a rounded shape. In some embodiments, the corner regions 112 have a non-uniform radius of curvature. Specifically, the corner regions 112 may have a shape corresponding to a spline or a variable radius curve. Corner regions with a variable or non-uniform radius of curvature can generally be said to have a spline shape. In some embodiments, the corner regions 112 have a constant or uniform radius of curvature. Generally, the corner regions 112 include corresponding edges (of edge sets 116, 122) and may be tangent to adjacent edges along the corresponding surface. In some embodiments, each edge of each corner region 112 has a bevel or chamfer that matches the bevel or chamfer of the remaining edge surrounding the corresponding surface (110, 120).

[0059] Figure 1C is an exploded view of an exemplary electronic card 100. The electronic card 100 may be formed from a metal substrate or other substrate material. In one exemplary embodiment, the substrate is formed from titanium or stainless steel material, and the electronic card 100 has a thinner thickness than conventional credit cards. Specifically, the thickness of the electronic card 100 may be less than 0.75 mm. In addition, the flatness of the electronic card 100 is extremely high. For example, the electronic card 100 may have a flatness that varies over a region of less than 50 μm. In another example, the electronic card 100 may have a flatness that varies over a region of less than 20 μm. In yet another example, the electronic card 100 may have a flatness that varies over a region of less than 10 μm.

[0060] As shown in Figure 1C, the electronic card 100 includes a recess 108 formed on the front surface 110 of the electronic card 100. The integrated circuit 106 is at least partially located within the recess 108, and the contact plate 102 is located on the integrated circuit 106. The recess 108 is depicted as substantially square or rectangular in shape, but in alternative embodiments, the recess 108 may be circular, or may have a circular shape or outline configured to accommodate a circular or round contact plate 102.

[0061] In some embodiments, the integrated circuit 108 and the contact plate 102 are connected (e.g., coupled) together to define the chip module 105. The chip module 105 may be about 1 cm square. In alternative embodiments, the chip module 105 may have different shapes, including circular, elliptical, or round shapes or outlines. The area of ​​the chip module 105 can be determined mainly by the area of ​​the contact plate 102, which in this case is the same. The integrated circuit 106 may include one or more processors, microprocessors, computer processing units (CPUs), numerical processing units (NPUs), or other processing circuits. The integrated circuit 106 may also include one or more types of computer memory, including, for example, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), or other types of non-temporary computer storage devices. In some embodiments, the integrated circuit 106 also includes wireless circuits configured to transmit and / or receive wireless communication or signals.

[0062] As shown in Figure 1C, the electronic card 100 may also include a stepped region 128 formed on the back surface 120 of the electronic card 100. In this example, the stepped region 128 extends to the edge 122a of the electronic card 100. However, in other embodiments, the stepped region 128 may be displaced inward from the edge 122a or another edge of the electronic card 100. In some cases, the stepped region 128 is defined by two parallel walls extending along the length (or width) of the electronic card 100. As shown in Figure 1C, the stepped region 128 is defined by a single wall extending along the length of the electronic card 100.

[0063] As shown in Figure 1C, the ferromagnetic stack, including the ferromagnetic element 130 (e.g., a ferromagnetic film) and the backing layer 132, is at least partially located within a stepped region 128. The stepped region 128 may also be called a recess or pocket and may be a laser-polished region formed using a laser polishing or laser processing process. The stepped region 128 may also be formed using a machining or grinding process that removes a portion of the substrate using a mechanical cutter or grinder. As shown in Figure 1C, the stepped region 128 includes a stepped surface that is recessed, removed, or otherwise displaced from an adjacent surface of the substrate or card.

[0064] As shown in Figure 1C, the ferromagnetic stack, including the ferromagnetic element 130 and the backing layer 132, extends to the edge 122a of the electronic card 100. The stepped region 128 may have a depth corresponding to, or approximately equal to, the thickness of the ferromagnetic stack. Specifically, the stepped region 128 may have a depth corresponding to, or approximately equal to, the combined thickness of the ferromagnetic element 130 and the backing layer 132. This allows for a surface that is flush with or substantially smooth along the back surface 120 of the electronic card 100. For the purposes of this explanation, substantially smooth may be used to refer to a surface where the transition, edge, or joint between the two elements is not tactilely perceptible. According to some embodiments, part or all of the ferromagnetic element 130 may be covered or coated with a coating layer to conceal or make the ferromagnetic element 130 invisible.

[0065] In some cases, the outer surface of the ferromagnetic stack is textured to give a tactile or visual effect. For example, the ferromagnetic element 130 and the backing layer 132 may be pressed or formed to create a texture along the outer surface of the card. The texture has a surface roughness in the range of 0.3 to 1.0 μm Ra. In some cases, the thickness of the ferromagnetic stack is thinner than that of a conventional magnetic strip. In some cases, the thickness of the ferromagnetic stack is approximately 200 μm to 270 μm. In some cases, the thickness of the ferromagnetic stack is approximately 225 μm to 250 μm.

[0066] In the example shown in Figure 1C, the ferromagnetic element 130 and the backing layer 132 are located within a recess or stepped region 128. However, in other embodiments, the ferromagnetic element 130 may be located along the outer surface of the electronic card, and a coating layer or another layer may be located adjacent to the ferromagnetic element 130 to define a substantially smooth transition, edge, or bond between the layer and the ferromagnetic element 130.

[0067] Figure 2 is an exploded view of another exemplary electronic card 200. Similar to the previous example, as shown in Figures 1A to 1C, the electronic card 200 includes a recess 208 formed on the front surface 210 of the electronic card 200. A chip module 205, including an integrated circuit 206 and a contact plate 202, may be at least partially located within the recess 208. In this example, the integrated circuit 206 is at least partially located within the recess 208, and the contact plate 202 is located on the integrated circuit 206.

[0068] As shown in Figure 2, the electronic card 200 includes a laminated substrate comprising a first layer 201 and a second layer 203. In one exemplary embodiment, the first layer 201 comprises a metal or metal sheet formed from aluminum, carbon steel, stainless steel, titanium, or other types of metals or alloys. The second layer 203 is formed from a polymer sheet (e.g., a plastic sheet) and may be bonded to the first layer 201 using an adhesive or other binder. In some cases, the first layer 201 is laminated to the second layer 203 by pressing the two material sheets together and heating or increasing the temperature to form a bond between the two layers. Although only two layers are shown in this example, two or more layers may be used in other embodiments. For example, a plastic layer similar to the second layer 203 shown in Figure 2 may be attached or bonded to the opposite side (e.g., the front side) of the first layer 201. Thus, the first metal layer may be sandwiched or positioned between two or more polymer layers (plastic sheets) to form the electronic card 200.

[0069] As shown in Figure 2, a ferromagnetic stack including a backing layer 232 and a ferromagnetic element 230 (e.g., a ferromagnetic film) can be mounted on a substrate that does not have stepped regions (which is quite different from the example shown in Figure 1C). In some cases, the thickness of one or more coatings or coating layers is deposited adjacent to the ferromagnetic element 230 and the backing layer 232. If one or more coatings or coating layers have a total thickness approximately equal to the combined thickness of the ferromagnetic element 230 and the backing layer 232, the interface, transition, or junction between the ferromagnetic element 230 and the outer surface of the electronic card 200 (formed by one of the coatings or coating layers) may be substantially smooth. In some embodiments, the ferromagnetic element 230 is coated with an additional coating or coating layer extending across the entire back surface of the electronic card 200 to mask or obscure the ferromagnetic element 230.

[0070] Figures 1A-1B and 2 show exemplary configurations, and the positions of various elements may differ depending on the specific embodiment. For example, in the examples of Figures 1A-1B and 2, the ferromagnetic stack or ferromagnetic element and integrated circuit are located on opposite sides of the electronic card. However, in alternative embodiments, the recess and stepped region may be formed on the same surface (e.g., the front surface), and the integrated circuit and ferromagnetic element may be located along the same side of the electronic card. Furthermore, in Figures 1A-1B and 2, the magnetic region extends along the long side of the rectangular electronic card, but in other embodiments, the magnetic region may extend along one or both short sides of the rectangular card. In some cases, the magnetic region may extend along two or more sides of the electronic card. Also, the positions of the contact plate and its corresponding integrated circuit may differ from embodiment to embodiment. In some embodiments, the electronic card may not include a contact plate, as shown in the examples of Figures 1A, 1B, and 2.

[0071] Examples in Figures 1A-1B and 2 show electronic cards having a specific shape or form factor. However, depending on the embodiment, the length, width, and / or the aspect ratio of length to width may differ from the general shapes shown in Figures 1A, 1B, and 2. Specifically, the width of the electronic card may be greater than that of a conventional credit card. In another example, the length of the electronic card may be shorter than that of a conventional credit card. Similarly, the shape and size of various elements, including the magnetic area or magnetic elements, may be wider than the magnetic strip of a conventional credit card, or otherwise have different dimensions.

[0072] Figures 3A-3C are cross-sectional views of electronic cards 300a, 300b, and 300c, which may correspond to cross-section BB of electronic card 100 shown in Figure 1B. As shown in Figure 3A, electronic card 300a includes a substrate 302a coated with a coating or coating layers 333a, 334a. As described with reference to Figure 3A and other figures described herein, the coating layers may be referred to as coatings, masking layers, or masking. The descriptions of the coating layers 333a, 334a, substrate 302a, ferromagnetic element 330a, and backing layer 333a may also apply to other embodiments described with reference to other figures, and overlapping descriptions of these and other elements may be omitted or shortened for clarity.

[0073] Figure 3A is a cross-sectional view of a portion of an electronic card 300a having a magnetic region 324a that may correspond to the magnetic region 124 in Figure 1B. As shown in Figure 3A, a ferromagnetic stack including a ferromagnetic element 330a (e.g., a ferromagnetic film) defines at least partially the size and location of the magnetic region 324a. The ferromagnetic stack including the ferromagnetic element 330a and the backing layer 332a is positioned within a stepped region 328a and has a total thickness approximately equal to the depth of the stepped region 328a, forming a substantially flush or smooth interface along the back surface 320a of the electronic card 300a.

[0074] In this example, the stepped region 328a is formed on the substrate 302a. In some embodiments, the ferromagnetic element 330a has a thickness of about 1 to 20 μm. In some embodiments, the ferromagnetic element 330a has a thickness of about 3 to 10 μm. In some embodiments, the backing layer 332a has a thickness of about 50 to 150 μm. In some embodiments, the backing layer 332a has a thickness of about 80 to 100 μm. In some embodiments, the backing layer 332a has a thickness of about 90 μm. The thickness of the ferromagnetic stack, including the combined thickness of the ferromagnetic element 330a and the backing layer 332a, may be in the range of 200 μm to 270 μm.

[0075] The substrate 302a may be formed from a single material or from multiple materials bonded or laminated together, with respect to this example and other examples described herein. For example, the substrate 302a may be formed from a metallic material (e.g., a metal sheet) including aluminum, carbon steel, stainless steel, titanium, or other types of metals or alloys. The substrate 302a may also be formed from one or more polymers (e.g., a polymer sheet or film) including, for example, polyvinyl chloride, polyethylene polymers, PVC, polyester, acrylic, styrene, or polycarbonate. In some embodiments, the substrate 302a may be formed from a composite material that may include a filler polymer, carbon fibers, a carbon laminate, or other structures formed from two or more materials. In some cases, the substrate 302a may be formed from ceramic, glass, or other similar types of materials. The substrate 302a may be formed as a single element or a homogeneous element, or from a laminate of multiple materials or multiple layers (e.g., multiple sheets and / or films) bonded or adhered together. For example, the substrate 302a may be formed from a metal sheet (e.g., a titanium sheet) and bonded or laminated to one or more polymer sheets (e.g., plastic sheets) to form a multilayer substrate. In one example, the substrate 302a includes a metal sheet bonded to two plastic sheets, each plastic sheet bonded to the opposite surface of the metal sheet. In another example, the substrate 302a includes a single plastic sheet bonded to the surface of a metal sheet. Multiple layers may be bonded together using an adhesive or other binder.

[0076] The substrate 302a may be formed from a sheet, plate, or multiple layers having a total thickness of less than 1 mm. In some cases, the substrate 302a has a total or overall thickness of about 0.6 to 0.85 mm. In some cases, the electronic card 300a has an overall thickness of less than 1 mm. In some cases, the electronic card 300a has an overall thickness of about 0.6 to 0.85 mm. In some cases, the electronic card 300a has an overall thickness of about 0.5 to 0.75 mm.

[0077] As shown in Figure 3A, the coating or coating layer 333a may define at least a portion of the front surface 310a, and the coating layer 334a may define at least a portion of the back surface 320a. Although the coating layers 333a and 334a are indicated by different reference numerals, the coating layers 333a and 334a may include a single continuous coating layer defining at least a portion of both the front surface 310a and the back surface 320a. In some cases, the coating layers 333a and 334a may be referred to as a single layer even if the edges of the card are not coated and the single layer is not continuous. In some cases, the coating layers 333a and 334a each have a thickness of less than 100 μm. In some embodiments, the coating layers 333a and 334a each have a thickness of 50 μm to 10 μm. In some embodiments, the coating layers 333a and 334a have a thickness of approximately 60 μm.

[0078] In this example and other examples described herein, the coating layers (333a, 334a) may be resistant to scratching and / or chipping in order to provide a durable coating to the electronic card. In some cases, the coating layers may be substantially resistant to contamination and virtually unaffected by contamination or discoloration under normal use. As described herein, one or more coating layers may have a hard coating or coating layer that provides structural durability and suppresses discoloration of the electronic card due to expected use of the electronic card.

[0079] Although the coating layers 333a, 334a in Figure 3A and other figures throughout this disclosure are depicted as a single homogeneous layer or single layer, the coating layers may be formed from multiple layers or regions. For example, as shown in the detail drawings, the coating layers 333a, 334a may include a primer layer 352 disposed on the surface of the substrate 302a, a first layer 354 formed on the surface of the primer layer 352, and a second layer 356, including a hard coating or transparent layer formed on the surface of a first layer 354.

[0080] The first layer 354 may contain one or more polymer materials. Although depicted as a separate, isolated layer, in some cases the first layer 354 includes a primer layer 352 bonded to the surface of the substrate 302a. The first layer 354 may contain one or more additional urethane materials bonded or bonded to the substrate 302a via the first urethane layer or primer layer 352. The primer layer 352 may be specially formulated to bond to both a metal substrate (e.g., titanium, stainless steel) and a colored layer or the first layer 354, which may contain a considerable concentration of a specific pigment such as titanium oxide. The one or more additional urethane materials may include a dual urethane or polyurethane compound applied to the first urethane layer or primer layer 352.

[0081] In some embodiments, the first layer 354 of the coating layers 333a, 334a may be formed from a polymer material having a pigment dispersed within the polymer material. The first layer 354 may also be referred to herein as the polymer layer, the coloring layer, and / or the pigment layer. The pigment particles dispersed within the polymer layer may be inorganic pigment particles, including, but not limited to, metal oxides such as titanium dioxide (TiO2, Ti2O3), zinc oxide (ZnO), manganese dioxide (MnO2), and iron oxide (Fe3O4). In some cases, the pigment may include one or more of aluminum oxide, cobalt, copper, or other pigments suitable for use in consumer products. The particles may have a size in the range of 0.1 μm to 10 μm or 0.1 μm to 1 μm. The polymer layer may further contain other additives.

[0082] In some cases, the coating layers 333a, 334a include a second layer 356 formed on the first layer 354, such as a polymer layer, a colored layer, or a pigment layer, which may contain polymers and pigments as described above. In some cases, the second layer 356 may be transparent, translucent, and / or a transparent layer formed from a transparent polymer. The transparent polymer may have higher hardness and / or abrasion resistance than the underlying first layer. For example, the second layer 356 may contain an acrylate polymer or an epoxy polymer. The second layer 356 may contain a UV-curable material that hardens upon exposure to a UV light source and may form a cured outer surface. The second layer 356 may contain a filler material such as a nanoscale inorganic material or a diamond material. The diameter of the nanoscale filler material may be less than 100 nm or less than 50 nm. In some embodiments, the second layer 356 contains a diamond-like carbon (DLC) coating or other similar coating material. For example, the second layer 356 of the coating layers 333a and 334a may include a tetrahedral amorphous carbon material having a thickness in the range of 1 μm to 50 μm.

[0083] Coating layers 333a, 334a, including their constituent components or sublayers, may be deposited on the substrate 302a using a deposition process or a layer coating process. Examples of deposition or layer coating processes include physical vapor deposition (PVD), atomic deposition coating (ALD), spray coating, immersion coating, and other similar material deposition processes. Each layer or sublayer of coating layers 333a, 334a may be coated using a separate deposition process, depending on the type of layer or sublayer being coated.

[0084] The ferromagnetic element 330a may be formed from a film of a material capable of magnetically storing or maintaining encoded data or other information. The encoded data or other information can be read using an external card reader or card reading device. The ferromagnetic element 330a may include a film or thin layer of a metal or metallized material configured to hold or maintain a magnetic field. In some cases, the ferromagnetic element 330a may be formed from nickel, iron, ferrite, steel, cobalt, or other ferromagnetic materials. The ferromagnetic element 330a may be deposited, laminated, bonded, or attached to the backing layer 332a. In some embodiments, the ferromagnetic element 330a is deposited (e.g., by sputtering, printing, or coating) on ​​the backing layer 332a.

[0085] The backing layer 332a may be formed from one or more polymers, metals, or other suitable materials, and may contain an adhesive or binder. In one example, the backing layer 332a includes two or more polycarbonate sheets bonded together or otherwise adhered. In one embodiment, the backing layer 332a includes a first polycarbonate sheet colored white and a second polycarbonate sheet that is transparent or clear. The two or more polycarbonate sheets may be bonded to the substrate 302a by a thermosetting adhesive. In another example, the backing layer 332a may contain or include a pressure-sensitive adhesive (PSA) on one or both sides of the backing layer 332a to facilitate the adhesion of the ferromagnetic element 330a to the substrate 302a. In yet another example, the backing layer 332a is formed from one or more polymer materials (e.g., polycarbonate sheets) and contains an adhesive on one or more sides. The polymer material of the backing layer 332a can be bonded to the substrate 302a using a thermal bonding or thermal lamination process that does not use a separate adhesive layer.

[0086] A ferromagnetic stack may be processed to provide a specific texture. The texture may provide a desired appearance and / or feel corresponding to the texture of other parts of the electronic card 300a. For example, the ferromagnetic stack may be formed from two or more polycarbonate sheets bonded to a ferromagnetic film. The ferromagnetic stack may be pressed with a heated texture plate that imprints a texture onto the outer surface of the ferromagnetic stack. In some cases, the surface roughness of the imprinted texture is in the range of 0.3 to 1.0 μmRa. In one example, the imprinted texture has a surface roughness of about 0.5 μmRa or more.

[0087] Using the examples described herein, ferromagnetic stacks thinner than some conventional magnetic strips can be formed. In some embodiments, the ferromagnetic element 330a has a thickness in the range of 0.005 mm to 0.05 mm, and the backing layer 332a has a thickness in the range of 0.05 mm to 1.5 mm. The thickness of the ferromagnetic stack, including the combined thickness of the ferromagnetic element 330a and the backing layer 332a, may be in the range of 200 μm to 270 μm.

[0088] Figure 3B shows an exemplary electronic card 300b having a chamfered feature or chamfered edge. The electronic card 300b may include elements and features described herein in relation to other embodiments of electronic cards, which are omitted for clarity. As shown in Figure 3B, the electronic card 300b includes chamfered edges 310b and 312b (exemplary chamfered features) formed along the edges of the electronic card 300b. While Figure 3B shows examples of chamfered edges 310b and 312b, the electronic card 300b may include chamfered edges that extend along the entire outer edge of the card (for example, along edge set 116 in Figure 1A and edge set 122 in Figure 1B).

[0089] In this example, the chamfered edge 310b is at least partially defined by the inclined region formed within the ferromagnetic element 330b and the backing layer 332b. As shown in Figure 3B, the chamfered edge 310b does not extend beyond the inclined edges of the ferromagnetic element 330b and the backing layer 332b. Therefore, the chamfered edge 310b is at least partially defined by the inclined edges formed within the ferromagnetic element 330b and the backing layer 332b. In other words, the inclined edges of the ferromagnetic element 330b and the backing layer 332b terminate at the (vertical) sidewall 314 or edge of the substrate 302b. Generally, as shown in Figure 3B, the sidewall 314 is approximately perpendicular to the surfaces 320a and 310b.

[0090] As shown in Figure 3B, the electronic card 300b includes coating layers 333b, 334b ​​extending to at least a portion of the front 310b and back 320b of the electronic card 300b. As described above with respect to Figure 3A and other embodiments herein, the coating layers 333b, 334b ​​may be formed from multiple layers. Specifically, the coating layers 333b, 334b ​​may include a first layer containing a polymer and pigment dispersed internally, and a second outer layer formed on the first layer. The second or outer layer may include a transparent polymer and / or a diamond-like carbon (DLC) coating. As previously stated, the coating layers 333b, 334b ​​are indicated by two reference numerals in Figure 3B, but the coating layers 333b, 334b ​​may be formed from a single continuous layer or from a single coating layer.

[0091] Figure 3C shows another exemplary electronic card 300c. The electronic card 300c may include elements and features described herein in relation to other embodiments of electronic cards, which are omitted for clarity. Figure 3C shows an electronic card 300c having coating layers 333c, 334c extending over substantially all or nearly all of the front and back surfaces of the electronic card 300c. As shown in Figure 3C, the coating layer 334c extends to the back surface, which includes a ferromagnetic stack containing a ferromagnetic element 330c and a backing layer 332c. As previously mentioned, the ferromagnetic stack can define the magnetic region of the electronic card 300c (see, for example, region 124 in Figure 1B). By extending the coating layer 334c over the ferromagnetic element 330c, the ferromagnetic element 330c can be concealed from view. In some cases, the coating layer 334c can provide a continuous and / or uniform visual appearance across the transition between the magnetic region of the electronic card 300c and adjacent or surrounding regions. The coating layer 334c may conceal the transition between the ferromagnetic element 330c and the adjacent portion of the electronic card 300c, but additional markings or indices may be formed on or within the coating layer 334c to indicate the approximate location of the magnetic region or edge of the ferromagnetic element 330c, and / or the boundary of the encoded region within the magnetic region defined by the ferromagnetic element 330c.

[0092] Generally, the coating layer 334c is configured to allow magnetic signals and / or magnetically encoded information stored or encoded in the ferromagnetic element 330c to pass through. Specifically, the coating layer 334c may be formed from a dielectric or nonconductive material and is thin enough to enable reliable communication between the ferromagnetic element 330c and an external card reader or card reading device. In some cases, the thickness of the coating layer 334c is about 60 μm or less. In some cases, the thickness of the coating layer 334c is about 30 μm or less. In some cases, the thickness of the coating layer 334c is about 20 μm or less.

[0093] The coating layer 334c typically includes at least one layer or region containing a pigment dispersed within the coating layer 334c, which helps to conceal or mask the underlying substrate 302c and / or ferromagnetic element 330c. The thickness of the coating layers 333c, 334c may depend, at least partially, on the color of the pigment. For example, a darker pigment may conceal the underlying element or component with a thinner coating than a lighter or white pigment.

[0094] As described above with reference to Figure 3A, the coating layer 334c may also include an outer layer or coating that may have hardness resistant to abrasion and / or scratching. In some cases, the outer layer is a transparent polymer such as acrylic (e.g., acrylate polymer) or epoxy (e.g., epoxy polymer). In some cases, the coating layer 334c includes a UV-curable polymer. In some cases, the outer layer or coating includes a diamond-like carbon (DLC) coating. The DLC coating may have a thickness ranging from about 1 μm to 50 μm.

[0095] As shown in Figure 3C, the coating layer 334c and the ferromagnetic stack including the ferromagnetic element 330c and the backing layer 332c define at least partially the chamfered edge 310c. Similarly, the coating layer 333c and the substrate 302c define at least partially the chamfered edge 312c. As previously mentioned, the coating layers 333c and 334c are indicated by two reference numerals in Figure 3C, but the coating layers 333c and 334c may be formed from a single continuous layer or a single coating layer. The coating layers 333c and 334c may be referred to as a single layer even if the coating layer does not extend around the edge of the card and is a discontinuous layer from the front to the back of the electronic card 300c.

[0096] Figure 4 shows another exemplary electronic card 400. The electronic card 400 may include elements and features described herein in relation to other embodiments of electronic cards, which are omitted for clarity. Figure 4 shows an electronic card 400 having coating layers 433, 434 extending substantially or nearly entirely over the front and back surfaces of the electronic card 400. The cross-sectional view of Figure 4 corresponds to the configuration of Figure 2, in which the ferromagnetic element 230 and the backing layer 232 are not located in recesses or grooves. As shown in Figure 4, the coating layer 434 extends to the back surface, including the ferromagnetic element 430 in the magnetic region (see, for example, region 124 in Figure 1B). Extending the coating layer 434 over the ferromagnetic element 430 can conceal the ferromagnetic element 430 from view. As shown in Figure 4, the coating layer 434 does not have a uniform thickness to accommodate the thickness of the ferromagnetic element 430 and the backing layer 432.

[0097] Similar to the previous example, the coating layer 434 may provide a continuous and / or uniform visual appearance across the transition area between the magnetic region and the adjacent or surrounding region of the electronic card 400. The coating layer 434 may conceal the transition area between the ferromagnetic element 430 and the adjacent portion of the electronic card 400, but additional markings or indices may be formed on or within the coating layer 434 to indicate the approximate location of the magnetic region or edge of the ferromagnetic element 430 and / or the boundary of the encoded region within the magnetic region defined by the ferromagnetic element 430.

[0098] Generally, at least a portion of the coating layer 434 is configured to allow magnetic signals and / or magnetically encoded information stored or encoded in the ferromagnetic element 430 to pass through. Specifically, the coating layer 434 may be formed from a dielectric or nonconductive material and is thin enough to enable reliable communication between the ferromagnetic element 430 and an external card reader or card reading device. In some cases, the thickness of the coating layer 434 in the region extending over the ferromagnetic element 430 is about 60 μm or less. In some cases, the thickness of the corresponding region of the coating layer 434 is about 30 μm or less. In some cases, the thickness of the corresponding region of the coating layer 434 is about 20 μm or less.

[0099] Similar to the previous example, the coating layer 434 typically includes at least one layer or region containing a pigment dispersed within the coating layer 434, which helps to conceal or mask the underlying substrate 402 and / or ferromagnetic element 430. The thickness of the coating layers 433, 434 may depend at least partially on the color of the pigment. For example, a darker pigment may conceal the underlying element or component with a thinner coating than a lighter or white pigment.

[0100] As described above with reference to Figures 3A and 3C, the coating layer 434 may also include an outer layer or coating that may have hardness that resists abrasion and / or scratching. In some cases, the outer layer is a transparent polymer such as acrylic (e.g., acrylate polymer) or epoxy (e.g., epoxy polymer). In some cases, the coating layer 434 includes a UV-curable polymer. In some cases, the outer layer or coating includes a diamond-like carbon (DLC) coating. The DLC coating may have a thickness ranging from about 1 μm to 50 μm.

[0101] As shown in Figure 4, the coating layer 434, the ferromagnetic element 430, and the backing layer 432 define at least partially the chamfered edge 410. Similarly, the coating layer 433 and the substrate 402 define at least partially the chamfered edge 412. As previously mentioned, the coating layers 433 and 434 are indicated by two reference numerals in Figure 4, but the coating layers 433 and 434 may be formed from a single continuous layer or from a single coating layer.

[0102] Figure 5A is a cross-sectional view of the electronic card 500a. The cross-sectional view may correspond to cross-sectional view AA shown in Figure 1A. As shown in Figure 5A, the electronic card 500a includes an integrated circuit 506a, at least partially disposed within a recess 508a formed in the substrate 502a of the electronic card 500a. A contact plate 503a is disposed on the integrated circuit 506a and at least partially disposed within the recess 508a. The integrated circuit 506a and / or the contact plate 503a may be connected or integrated to define a chip module of about 1 cm square. The dimensions of the integrated circuit 506a and / or the contact plate 503a may vary depending on the embodiment, and they may have a linear shape with a width and length in the range of 0.5 cm to 2 cm. The length and width do not need to be equal or approximately equal. In some cases, the integrated circuit 506a and / or the contact plate 503a may have a circular or round shape or profile.

[0103] As shown in Figure 5A, the contact plate 503a includes a terminal electrode array 504a that is exposed and defines at least a portion of the outer surface of the electronic card 500a. The depth of the recess 508a and / or the thickness of the integrated circuit 506a and the contact plate 503a may be configured to provide a substantially smooth or flush surface along the front surface of the electronic card 500a. In some embodiments, the terminal electrode array 504a protrudes slightly from the front surface of the electronic card 500a to facilitate physical and electrical connection with an external card reader or card reading device. As shown in Figure 5A, the front and back surfaces of the electronic card 500a may be defined at least partially by coating layers 532a and 534a.

[0104] As shown in Figure 5A, the contact plate 503a can be attached to the substrate 502a by adhesive 548a. The adhesive 548a may include a pressure-sensitive adhesive, an epoxy adhesive, a hot-melt binder, or any other type of adhesive material or component. In this example, the contact plate 503a is attached to a shelf region formed within the recess 508a. By attaching the contact plate 503a to the shelf region, the combined thickness of the adhesive 548a and the contact plate 503a can be more easily controlled or predicted to provide a more consistent or uniform position of the terminal electrode array 504a relative to the outer surface of the electronic card 500a.

[0105] In some embodiments, the surface of the shelf region and / or contact plate 503a is textured or otherwise fabricated to facilitate adhesion to the adhesive 548a. For example, the shelf region of recess 508a may be laser-textured to form small surface features that improve the bond between the shelf region of recess 508b and the adhesive 548a. In some cases, the surface may be laser-polished to increase the bonding surface area and form micro-sized features that improve the bond strength between recess 508b and the adhesive 548a. In some embodiments, a laser-based process may be used to polish the surface of the shelf region to produce a surface roughness of about 1.0 μmRa, thereby improving the bond strength between the substrate 502a and the adhesive 548a. In some cases, a laser-based process may be used to produce a surface roughness in the range of 0.5 to 2 μmRa. In some cases, the shelf region of recess 508a is textured using a mechanical and / or chemical texturing process to produce a desired surface roughness.

[0106] The surface of the shelf area of ​​the recess 508a may also be coated with a colored layer or colorant to produce a black or dark color along the shelf area. This may be useful for the decorative appearance of the transition between the contact plate 503a and the peripheral portion of the electronic card 500a. These features and coupling techniques are described with respect to the electronic card 500a in Figure 5A, but the same techniques may be applied to other embodiments, including the electronic cards shown in Figures 5B and 5C.

[0107] The recess 508a and / or adhesive 548a may also include one or more ventilation features that allow gas or vapor to escape from the recess 508a during manufacturing or under other circumstances. For example, small grooves may be formed in the shelf area and / or adhesive 548a to allow high-temperature gas or vapor to escape from the recess 508a. In one embodiment, the shelf area defines grooves ranging from 0.5 mm to 1 mm square that allow gas or vapor to pass through. Additionally or alternatively, the adhesive 548a may include gaps ranging from 0.5 mm to 1 mm that allow gas or vapor to pass through. The ventilation features may help escape gas or vapor during a thermal bonding or lamination process in which one or more surfaces of the electronic card 500a are heated. In some cases, ventilation features defined in the adhesive and / or recess may facilitate bonding or manufacturing processes at higher temperatures. The ventilation features are described with respect to the electronic card 500a in Figure 5A, but the same technique may be applied to other embodiments, including the electronic cards shown in Figures 5B and 5C.

[0108] In the example shown in Figure 5A, the integrated circuit 506a includes a semiconductor 542a embedded in a encapsulation 544a. The semiconductor 542a may be electrically connected to one or more of the terminal electrode arrays 504a. In this example, the semiconductor 542a of the integrated circuit 506a is connected to the terminal electrode arrays 504a by one or more vias or conductive elements 546a. In some cases, the vias or conductive elements 546a are integrally formed with the contact plate 503a and define terminals to be soldered to the integrated circuit 506a. The encapsulation 544a may be formed from a dielectric material and may provide structural support and electrical insulation to the integrated circuit 506a.

[0109] A simplified example is shown in Figure 5A, but the integrated circuit 506a and / or contact plate 503a may include additional components or elements not explicitly shown in Figure 5A. For example, the electronic card 500a may also include an antenna and / or wireless communication circuit configured to facilitate wireless communication with an external device, such as a card reader with wireless functionality or capability. In some cases, the integrated circuit 506a includes an antenna and / or wireless communication circuit configured to communicate wirelessly with an external device. If the integrated circuit 506a and / or electronic card 500a are configured to communicate wirelessly with an external device, the contact plate 503a is omitted or optionally provided.

[0110] In general, the integrated circuit 506a is configured to provide electronic functions to the electronic card 500a. Specifically, the integrated circuit 506a may include a microcontroller or other type of processing unit configured to perform a particular set of functions. For example, if the electronic card 500a is configured to simplify financial transactions, the integrated circuit 506a may be configured to store and / or generate a security code used to authenticate a user or transaction. In some cases, the integrated circuit 506a may be configured to provide a unique identification number or serial number that can be associated with a user, a user's account, an advertisement, a trader, or other entity or institution. As will be described in more detail with reference to Figure 17, the integrated circuit 506a may include other elements or components, such as non-volatile computer memory, a computer processing unit (CPU), a numerical processing unit (NPU), a wireless communication circuit, or other electronic elements, components, or systems.

[0111] Figure 5A may be a cross-sectional view of a chip module having a contact plate similar to the contact plate 602a in Figure 6A, along cross-section CC. Specifically, both contact plates 503a and 602a include central electrodes (504a, 620a) electrically connected to the integrated circuit 506a by via 546a. However, in alternative configurations, one or more of the electrodes may not be electrically connected to the integrated circuit 506a and may be purely decorative.

[0112] Figure 5B shows an alternative configuration in which the central electrode 504b or the central part is not connected to the semiconductor 542b of the integrated circuit 506b. The configuration shown in Figure 5B may correspond to the contact plate 602b of Figure 6B along cross section DD. As shown in Figure 5B, the central part 504b and the peripheral part are not connected to the semiconductor 542b of the integrated circuit 506b. The left and right electrodes 504b are electrically connected to the semiconductor 542b by their respective conductors 543b, which may include wires or other conductive tubes. At least a portion of the semiconductor 542b, conductors 543b, and vias 546b may be sealed in the encapsulation portion 544b.

[0113] As shown in Figure 5B, the electronic card 500b includes coating layers 532b, 534b formed on the corresponding surfaces of the substrate 502b. Similar to the previous example, the contact plate 503b is connected to the recess 508b by adhesive 548b which can be positioned along the shelves or protrusions of the recess 508b. Various elements have been described above with reference to the previous figures and apply to the configuration in Figure 5B. Specifically, the recess 508b may include ventilation features to facilitate the release of gas or vapor, and the shelves of the recess 508b may be textured to facilitate bonding with the adhesive 548b.

[0114] Figure 5C shows another alternative configuration in which the central electrode 504c or the central part is not connected to the semiconductor 542c of the integrated circuit 506c. Furthermore, the configuration shown in Figure 5C includes a terminal electrode 507c extending around the edge of the contact plate 503c. In this example, the terminal electrode 507c is electrically connected to the semiconductor 542c by a conductive tube 543c. The semiconductor 542c, the conductive tube 543c, and at least a portion of the terminal electrode extending along the bottom surface of the contact plate 503c can be sealed in a encapsulation portion 544c. The configuration shown in Figure 5C may correspond to the contact plate 602c in Figure 6C. Specifically, the portion of the terminal electrode 507c surrounding the contact plate 503c in Figure 5C may correspond to the connector portion 656c of the terminal electrode 652c in Figure 6C.

[0115] As shown in Figure 5C, the electronic card 500c includes coating layers 532c, 534c formed on the corresponding surfaces of the substrate 502c. Similar to the previous example, the contact plate 503c is connected to the recess 508c by an adhesive 548c which can be positioned along the shelves or protrusions of the recess 508c. Various elements have been described above with reference to the previous figures and apply to the configuration in Figure 5C. Specifically, the recess 508c may include ventilation features to facilitate the release of gas or vapor, and the shelves of the recess 508c may be textured to facilitate bonding with the adhesive 548c.

[0116] Figure 6A is a top view of an exemplary contact plate 602a. Contact plate 602a may correspond to the contact plates described above with reference to Figures 1A, 1C, 1D, and 5A. Contact plate 602a includes a plate substrate 610a and terminal electrode arrays 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a arranged along the front or outer surface of the plate substrate 610a. The terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a are formed from a conductive material and each may define a portion of the outer surface of an electronic card and be exposed to simplify physical contact and electrical connection using external devices such as external card readers or card reading devices. In some cases, the terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a may be formed from copper, nickel, platinum, carbon, silver, gold, alloys, or other conductive materials.

[0117] Generally, the plate substrate 610a defines a set of outer edges that form the outer shape or perimeter of the plate substrate 610a. As shown in Figure 6A, each of the terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a is separated from or displaced from the edges (of the set of outer edges) of the plate substrate 610a. Specifically, as shown in Figure 6A, the contact plate 602a includes a peripheral portion 630a surrounding the terminal electrode arrays 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a, and the terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a are each displaced from the nearest edge by the width of the corresponding portion of the peripheral portion 630a. Although the peripheral portion 630a depicted in Figure 6A appears to have a substantially uniform width, in other embodiments the width may vary or be non-uniform. For example, the upper or lower portion of the peripheral portion 630a may be larger or smaller than the sides of the peripheral portion 630a. Similarly, the upper portion of the peripheral portion 630a may have a different width from the lower portion, etc.

[0118] In Figure 6A, terminal electrodes 612a, 614a, 616a, 618a, 620a, 622a, 624a, 626a, and 628a may each be configured to provide electrical connections for specific functions of the electronic card. For example, the first terminal electrode 612a may provide a dedicated power terminal (e.g., VCC terminal), the second terminal electrode 614a may provide a dedicated reset signal terminal (e.g., RST terminal), the third terminal electrode 616a may provide a dedicated clock signal terminal (e.g., CLK terminal), the fourth terminal electrode 618a may provide an auxiliary or programmable terminal, the fifth terminal electrode 620a may provide an auxiliary or programmable terminal, the sixth terminal electrode 622a may provide a dedicated ground terminal (e.g., GND terminal), the seventh terminal electrode 624a may provide a dedicated programming terminal (e.g., VPP terminal), and the eighth and ninth terminal electrodes 626a and 628a may provide auxiliary or programmable terminals.

[0119] Figures 6B, 6C, and 6D show alternative electrode configurations for the contact plates. Specifically, the contact plates 602b, 602c, and 602d all include peripheral portions 630b, 630c, and 630d that are at least partially coated with a conductive material. The conductive material of the peripheral portions 630b, 630c, and 630d may be the same or similar material used to form the terminal electrodes 642b, 652c, and 662d. In some cases, the peripheral portions 630b, 630c, and 630d and the terminal electrodes 642b, 652c, and 662d are formed from one or more identical layers and then separated by forming voids or grooves 644b, 654c, and 664d within one or more layers to electrically insulate the terminal electrodes 642b, 652c, and 662d from the other parts of the one or more layers forming the peripheral portions 630b, 630c, and 630d.

[0120] In Figure 6B, the terminal electrode 642b is separated from the periphery 630b by a gap or groove 644b. The gap or groove 644b electrically insulates the corresponding terminal electrode 642b from other conductive elements along the upper surface of the contact plate 602b. In some cases, the groove 644b exposes a portion of the plate substrate 610b. As in the previous example, the terminal electrode 642b is displaced from the corresponding edge of the plate substrate 610b. The contact plate 602b in Figure 6B may correspond to the cross-sectional view depicted in Figure 5B.

[0121] Similar to the previous example, in Figure 6C, the terminal electrodes 652c are separated from the periphery 630c by a gap or groove 654c. The gap or groove 654c electrically insulates each terminal electrode 652c from other conductive elements along the upper surface of the contact plate 602c. In some cases, the groove 654c exposes a portion of the plate substrate 610c. As shown in Figure 6C, each terminal electrode 652c includes a connector portion 656c that may extend around the edge of the plate substrate 610c for electrical connection to an integrated circuit or other electrical component. The contact plate 602c in Figure 6C may correspond to the cross-sectional view depicted in Figure 5B or 5C.

[0122] In Figure 6D, the terminal electrodes 662d are separated from the periphery 630d by a gap or groove 664d. The gap or groove 664d electrically insulates each terminal electrode 662d from other conductive elements along the upper surface of the contact plate 602d. In some cases, the groove 664d exposes a portion of the plate substrate 610d. As shown in Figure 6D, the contact plate 602d also includes an outer periphery 666d surrounding the periphery 630d. The outer periphery 666d does not necessarily have to be coated with a conductive coating. In some cases, the outer periphery 666d includes an exposed surface of the plate substrate 610d. The contact plate 602d in Figure 6D may correspond to the cross-sectional view depicted in Figure 5A.

[0123] Figures 7A to 7D show various exemplary terminal electrode arrays. Specifically, Figure 7A shows an exemplary contact plate 702a having a rectangular terminal electrode array 704a. As shown in Figure 7A, the terminal electrodes 704a are arranged on the outer or upper surface of the plate substrate 710a and are displaced from the edge of the plate substrate 710a by gaps or spaces. Specifically, the terminal electrode array 704a is at least partially surrounded by a peripheral region 730a. In this example, none of the electrodes of the terminal electrode array 704a extend to the edge of the contact plate 702a. However, in alternative embodiments, one or more electrodes of the terminal electrode array 704a may extend to the corresponding edge of the contact plate 702a.

[0124] Figure 7B shows an exemplary contact plate 702b having a square or rectangular terminal electrode array 704b. Similar to the previous example, the terminal electrode array 704b is disposed on the plate substrate 710b and is displaced or spaced apart from the edge of the plate substrate 710b. As shown in Figure 7B, the terminal electrode array 704b is at least partially surrounded by the peripheral region 730b of the plate substrate 710b.

[0125] Figure 7C shows an exemplary contact plate 702c having an elongated terminal electrode array 704c with rounded corners. Similar to the previous example, the terminal electrode array 704c is disposed along or on the plate substrate 710c and is displaced or spaced apart from the edge of the plate substrate 710c. As shown in Figure 7C, the terminal electrode array 704c is at least partially surrounded by the peripheral region 730c of the plate substrate 710c.

[0126] Figure 7D shows an exemplary contact plate 702d having a diamond-shaped terminal electrode array 704d. Similar to the previous example, the terminal electrode array 704d is disposed on a plate substrate 710d and is displaced or spaced apart from the edge of the plate substrate 710d. As shown in Figure 7D, the terminal electrode array 704d is at least partially surrounded by the peripheral region 730d of the plate substrate 710d.

[0127] The terminal electrode configurations shown in Figures 7A-7D are provided as examples and are not intended to be an exhaustive description of all possible configurations. For example, the electrodes in a terminal electrode array do not need to have similar or identical shapes, or to be arranged in a uniform pattern. Depending on the particular embodiment, the shape and position of the terminal electrodes within the array may differ. Furthermore, not all terminal electrodes need to be displaced or spaced apart from the edges of the contact plate or plate substrate. In some examples, one or more electrodes may extend to the corresponding edges of the contact plate or plate substrate. Moreover, each terminal electrode does not need to be electrically connected to an integrated circuit or other electrical component. For example, one or more terminal electrodes may be purely decorative or may be "dummy" terminal electrodes that do not perform any electrical function.

[0128] Figures 8A and 8B are exemplary cross-sectional views of the exemplary contact plate of Figure 6. Specifically, Figure 8A shows an exemplary contact plate 802a corresponding to contact plates 602a, 602b, 602c, and 602d of Figures 6A-6D. As shown in Figure 8A, the contact plate 802a includes terminal electrodes 818a, 820a, and 828a disposed or positioned on the upper or front surface of the plate substrate 810a. In this example, the plate substrate 810a may be formed from a non-metallic material, such as a polymer or composite material. Examples of polymer materials suitable for the plate substrate 810a include, but are not limited to, polycarbonate, phenol, polysulfone, polyethersulfone, polycetal, polyester resin (e.g., polyethylene, polyester, PVC), and other suitable polymers. Examples of composite materials suitable for the plate substrate 810a include, but are not limited to, fiber-reinforced plastics, glass fiber composites, carbon fiber composites, laminated composites, and other suitable composite materials. In some examples, the plate substrate 810a may be formed at least partially from a metallic material such as steel, stainless steel, aluminum, copper, titanium, alloy, or other metallic material. The plate substrate 810a may be formed from ceramic, glass, or other similar types of material. In some cases, the plate substrate 810a may be formed from a metal sheet punched or machined from a larger plate or sheet.

[0129] If the plate substrate 810a is formed from a metal or conductive material, the terminal electrodes 818a, 820a, and 828a may be formed along the top or outer surface of the plate substrate 810a using an electroplating process. If the plate substrate 810a is formed from a non-conductive material, the terminal electrodes 818a, 820a, and 828a may be formed using a combination of an electroless process and an electroplating process, as described later.

[0130] Regardless of whether the plate substrate 810a is formed from a conductive or non-conductive material, the pattern of the exposed area corresponding to the terminal electrode array pattern can be formed using a photoresist masking process. In an exemplary process, a photoresist layer is applied to the top or outer surface of the plate substrate 810a. Next, a photoresist mask is placed on the photoresist layer. The photoresist mask may contain either a positive or negative pattern corresponding to the pattern of the terminal electrode array to be formed (see, for example, the pattern of nine terminal electrodes shown in Figure 6). Whether the photoresist mask is a positive or negative pattern depends on the type of photoresist material used (positive or negative resist), as will be discussed later.

[0131] Next, the photoresist layer can be exposed using a light source (e.g., a UV light source or a broad-spectrum light source). Exposure using a light source can have different effects on the photoresist layer depending on the type of photoresist material used. For example, if the photoresist is a negative-type photoresist material, exposure causes crosslinking within the photoresist material, making the exposed areas insoluble in the photoresist developer. In another example, if the photoresist is a positive-type photoresist material, exposure causes non-crosslinking within the photoresist material, making the exposed areas soluble in the photoresist developer.

[0132] A selected area on the upper surface of the plate substrate 810a can be exposed by washing or immersing the photoresist material to be exposed in a solvent such as a photoresist developer. The portion of the photoresist material soluble in the solvent or photoresist developer is removed, leaving the remaining (insoluble) portion which defines the plating mask. The pattern of the plating mask can define a plating area array corresponding to the positions of the terminal electrodes 818a, 820a, and 828a.

[0133] When the plate substrate 810a is formed from a conductive material, the terminal electrodes 818a, 820a, and 828a can be formed using an electroplating process. In one example, the first layer of the terminal electrodes 819a, 821a, and 829a can be formed by immersing or dipping the plate substrate 810a in a plating solution containing metal cations. Next, an electric current is passed through the conductive material of the plate substrate 810a, resulting in the formation of a thin metal film along the exposed plating areas formed within the plating mask. In this example, the first conductive layer of the terminal electrodes 819a, 821a, and 829a is formed by a first electroplating process using a first solution. Next, a second conductive layer or outer conductive layer of the terminal electrodes 818a, 820a, and 828a can be formed using a second solution having various metal cations. The first or second conductive layer may include, but is not limited to, copper, silver, nickel, gold, tin, solder, brass, or cadmium. The materials used for the first and second layers may be different or the same. In some cases, only a single layer may be formed using a single electroplating process to form the terminal electrodes 818a, 820a, and 828a.

[0134] If the plate substrate 810a is formed from a non-conductive material, the terminal electrodes 818a, 820a, and 828a may be formed using a combination of electroless and electroplating processes. In one example, a strike or flash is applied to the plate substrate 810a to form a thin coating. For example, after a plating mask is formed on the plate substrate 810a, the exposed areas of the plate substrate 810a may be immersed in a cleaning solution / or etching solution that increases the microroughness of the exposed areas to form micropores. An exemplary etching solution may include sulfuric acid or other types of acidic solutions. After etching, a palladium solution or other catalyst solution may be applied to the exposed areas of the plate substrate 810a. The palladium solution or other catalyst solution may result in a thin layer of conductive material (e.g., about 1 μm thick) formed on the exposed areas of the plate substrate 810a. In some cases, a palladium layer 1 to 5 μm thick is formed along the surface of the plate substrate 810a to form the first conductive layer of the terminal electrodes 819a, 821a, and 829a.

[0135] After the first conductive layer of terminal electrodes 819a, 821a, and 829a is formed on the surface of the plate substrate 810a, one or more additional layers may be formed on the first layer using an electroplating process similar to the process described above. Specifically, the plate substrate 810a and terminal electrodes 819a, 821a, and 829a are immersed in a plating solution containing metal cations. An electric current is then passed through the terminal electrodes 819a, 821a, and 829a, resulting in the formation of a thin metal film on the terminal electrodes 819a, 821a, and 829a. The resulting layer may define a second conductive layer of terminal electrodes 818a, 820a, and 828a. As in the previous example, the second conductive layer may, but is not limited to, copper, silver, nickel, gold, tin, solder, brass, or cadmium. Although only two layers (a first electroless layer and a second electroplated layer) are shown in the example in Figure 8A, two or more electroplated layers can be formed by applying multiple electroplating processes to the plate substrate 810a.

[0136] As shown in Figure 8A, the contact plate 802a includes a peripheral portion 830a that at least partially surrounds the terminal electrodes 818a, 820a, and 828a. This results in a desired displacement or position that is separated or displaced from the corresponding edge of the plate substrate 810a. However, the presence of the peripheral portion 830a makes it difficult to pass current through the first layer of terminal electrodes 819a, 821a, and 829a to perform one or more electroplating processes. This is especially true when the contact plate 802a is formed from a large sheet having a contact plate array that is processed simultaneously and then cut or separated to improve manufacturing throughput and efficiency. Figures 8B, 9A, and 9B show solutions that may be used to electrically connect to the first layer of terminal electrodes 819a, 821a, and 829a to perform electroplating processes.

[0137] Figure 8B is a cross-sectional view of another exemplary contact plate 802b. Contact plate 802b may correspond to contact plate 802a in Figure 8A. As shown in Figure 8B, contact plate 802b includes terminal electrodes 818b, 820b, and 828b disposed or positioned on the upper or front surface of the plate substrate 810b. In this example, the plate substrate 810b is formed from a non-metallic material, including, for example, a polymer or composite material. Examples of polymer materials suitable for plate substrate 810a include, but are not limited to, polycarbonate, phenol, polysulfone, polyethersulfone, polycetal, polyester resin (e.g., polyethylene, polyester, PVC), and other suitable polymers. Examples of composite materials suitable for plate substrate 810b include, but are not limited to, fiber-reinforced plastics, glass fiber composites, carbon fiber composites, laminated composites, and other suitable composite materials.

[0138] As described above with reference to Figure 8A, the terminal electrodes 818b, 820b, and 828b can be formed along the non-conductive plate substrate 810b using a combination of electroless and electroplating processes. First, a plating mask can be formed on the top or outer surface of the plate substrate 810b. Similar to the example provided above with reference to Figure 8A, a photoresist material can be selectively exposed and then cleaned to create a plating mask having a region array corresponding to the patterns of the terminal electrode arrays 818b, 820b, and 828b.

[0139] Furthermore, as described above with reference to Figure 8A, the first conductive layers of the terminal electrodes 819b, 821b, and 829b may be formed by applying a strike or flash to form a thin layer of conductive material. Specifically, the exposed portions of the plate substrate 810b may be cleaned and etched before immersion in a palladium solution or other catalyst solution. The resulting electroless process yields a 1-5 μm thick palladium layer formed along the surface of the plate substrate 810b, which can form the first conductive layers of the terminal electrodes 819b, 821b, and 829b.

[0140] After performing an electroless plating process, one or more subsequent electroplating processes may be used to form the terminal electrodes 818b, 820b, and 828b. As described above, the presence of the periphery 830b may make it difficult to couple current to each of the first conductive layers of the terminal electrodes 819b, 821b, and 829b in order to perform the electroplating process. As described above, the desired periphery 830b displaces or retracts the terminal electrodes 818b, 820b, and 828b from the corresponding edges of the plate substrate 810b.

[0141] To help solve the problem of passing current through the first conductive layers of terminal electrodes 819b, 821b, and 829b, the configuration shown in Figure 8B includes a back conductive layer 831b formed along the back, bottom, or inner surface of the plate substrate 810b. The back conductive layer 831b may be formed from a conductive material including, but not limited to, copper, silver, nickel, gold, tin, solder, brass, conductive carbon, or cadmium. As shown in Figure 8B, the first conductive layers of terminal electrodes 819b, 821b, and 829b are electrically connected to the back conductive layer 831b by corresponding vias 822b, 824b, and 826b that penetrate the plate substrate 810b. The vias 822b, 824b, and 826b may be formed by drilling holes in the plate substrate 810b and then filling the holes with conductive material. In some cases, the vias 822b, 824b, and 826b are formed when the back conductive layer 831b is formed. vias 822b, 824b, 826b and the back conductive layer 831b may be formed from the same conductive material.

[0142] Using the configuration shown in Figure 8B, current can be applied to the back conductive layer 831b and flow through the corresponding vias 822b, 824b, and 826b to the terminal electrodes 818b, 820b, and 828b, respectively. Thus, terminal electrodes 818b, 820b, and 828b can be formed by applying current to the single-element back conductive layer 831b using one or more subsequent electroplating processes. In some cases, the back conductive layer 831b is part of a larger conductive layer formed along the underside or inner surface of a larger sheet. The larger sheet may result in a contact plate array that is processed simultaneously and then cut or separated to improve manufacturing throughput and efficiency.

[0143] Figures 9A and 9B show exemplary connecting structures of contact plates. Figures 9A and 9B show additional options for passing current through the conductive layer of the first conductive layer of the terminal electrode 918a in order to perform the electroplating process. As shown in Figure 9A, the underlying layer or first conductive layer of the terminal electrode 918a may be formed on the surface of the plate substrate. The underlying layer or first layer of the terminal electrode 918a may correspond to that of the terminal electrode 618 in Figure 6. In the example of Figure 9A, the terminal electrode 918a is connected to the conductive peripheral 930a by a bridge portion 950a. In this example, the peripheral 930a is formed from a conductive material or conductive layer that extends to the edge of the plate substrate to facilitate electrical connection to a current source during electroplating. By applying current to the conductive peripheral 930a, current can be passed through the bridge portion 950a to the terminal electrode 918a during the electroplating process.

[0144] After one or more electroplating processes have been performed to form an outer or upper layer of the terminal electrode 918a, the bridge portion 950a may be removed to electrically insulate the terminal electrode 918a from other conductive parts of the card, including the conductive peripheral portion 930a. The bridge portion 950a may be removed, for example, by laser polishing the bridge portion 950a using a polishing laser having a spot size smaller than the width of the bridge portion 950a. In some cases, after the bridge portion 950a has been removed, a laser polished or polished area 952a is formed, which is substantially the same area as the bridge portion 950a and can expose the (non-conductive) material of the plate substrate. The polished area 952a is substantially free of conductive material and can electrically insulate the terminal electrode 918a from the conductive peripheral portion 930a. In some cases, the polished area 952a may partially extend into the plate substrate. The bridge portion 950a may also be removed using a mechanical cutter, etching solution, or other material removal techniques to define a machined area corresponding to the polished area 952a shown in Figure 9A. In some cases, after the outer or upper layer of the terminal electrode 918a is formed using an electroplating process, the conductive peripheral portion 930a is also removed.

[0145] Figure 9B shows another exemplary configuration for passing current through the conductive layer of the first layer of the terminal electrode 918b in order to perform an electroplating process. As shown in Figure 9B, the underlying or first layer of the terminal electrode 918b may be formed on the surface of the plate substrate. The underlying or first layer of the terminal electrode 918b may correspond to that of the terminal electrode 618 in Figure 6. In the example of Figure 9B, the terminal electrode 918b is connected to a bridge portion 950b formed from a conductive material or conductive layer that extends to the edge of the plate substrate. As with the other examples above, the bridge portion 950b may simplify the electrical connection to the current source during electroplating. By applying current to the bridge portion 950b, current can be passed through the terminal electrode 918b during the electroplating process.

[0146] After one or more electroplating processes have been performed to form an outer or upper layer of the terminal electrode 918b, the bridge portion 950b may be removed to create a displacement or gap between the terminal electrode 918b and the corresponding edge of the plate substrate. As shown in Figure 9B, the contact plate includes a non-conductive peripheral portion 930b that separates the terminal electrode 918b from the edge of the plate substrate. As in the previous example, the bridge portion 950b may be removed, for example, by laser polishing the bridge portion 950b using a polishing laser having a spot size smaller than the width of the bridge portion 950b. In some cases, after the bridge portion 950b has been removed, a laser polishing or polishing area 952b is formed that is substantially the same area as the bridge portion 950b and can expose the (non-conductive) material of the plate substrate. The polishing area 952b is substantially free of conductive material and can electrically insulate the terminal electrode 918b from the conductive portion of the contact plate along its upper surface (if present). In some cases, the polishing area 952b may partially extend into the plate substrate. The bridge portion 950b may also be removed using a mechanical cutter, etching solution, or other material removal techniques to define a machined area corresponding to the polished area 952b shown in Figure 9B.

[0147] Figure 10 shows an exemplary marking on an electronic card. Specifically, Figure 10 shows a marking 1020 including a first laser-formed relief feature 1022 and a second laser-formed relief feature 1024 formed on the front surface 1010 of the electronic card 1000. As will be described in more detail with reference to Figures 11A to 15B, the laser-formed relief features 1022 and 1024 ("relief features") may extend through the coating layer of the electronic card 1000 and may, in some cases, extend at least partially into the card substrate.

[0148] The marking 1020 may include one or more printed areas in addition to the relief feature areas 1022 and 1024. The printed areas may be formed by applying ink, dye, or pigment to the front surface 1010 of the electronic card 1000. The marking 1020 may include symbols such as the logo shown in Figure 10. The marking 1020 may also include text or numerical information, such as a serial number, account number, username, facility name, telephone number, address, and other text, numerical, or symbolic information.

[0149] Figures 11A to 11E are cross-sectional views of exemplary markings. The exemplary markings shown in Figures 11A to 11E may correspond to one or more of the above markings, including, for example, marking 1020 in Figure 10 and marking 114 in Figure 1A.

[0150] Figure 11A shows an exemplary marking 1140a formed along the outer surface of coating layer 1134a. In this example, the substrate 1102a is coated on both sides, or at least partially covered, by coating layers 1132a and 1134a. Coating layers 1132a and 1134c may be formed according to other coating layers described herein, and redundant descriptions are omitted for clarity. In the example of Figure 11A, the marking 1140a includes a marking material deposited or otherwise disposed along the upper or outer surface of coating layer 1134a. The marking 1140a may include printed ink, paint, or other material that is visually distinct from the surrounding portion of coating layer 1134a. Although marking 1140a is shown exposed in Figure 11A, marking 1140a may be coated or at least partially covered by a protective film or coating, which may be translucent or transparent to allow visibility of marking 1140a.

[0151] Figure 11B shows an exemplary marking 1140b formed beneath the outer surface of the coating layer 1134b. As shown in Figure 11B, the marking 1140b may be a subsurface marking formed below the outer surface of the coating layer 1134b but above the surface of the substrate 1102b. The marking 1140b may be formed using a laser beam focused on the subsurface region of the coating layer 1134b. The marking 1140b may be visible or recognizable from the outer surface, but may be substantially permanent or protected from abrasion or wear. The marking 1140b may also be affixed after the electronic card has been formed and may include personal information, such as account number, account holder's name, account type, card issuer information, expiration date, CVC code, or other card-specific information.

[0152] In some cases, the coating layer 1134b is formed from multiple layers, as in other embodiments described herein. Specifically, the coating layer 1134b may include a first layer 1136b disposed on the surface of the substrate 1102b, which may include a primer layer and a coloring layer. The coloring layer and / or primer layer may include a pigment dispersed throughout a polymer or other type of binder, as in other embodiments described herein. The coating layer 1134b may further include a second layer 1138b disposed on the first layer 1136b. The second layer 1138b may include a transparent or translucent material with a higher hardness than the first layer 1136b. As in other examples described herein, the second layer 1138b may include an acrylate material, a UV-curable polymer, DLC, or other similar types of coatings. The coating layer 1132b may be formed from a multilayer structure similar to or the same as that of the coating layer 1134b. Similar to the previous example, the coating layers 1132b and 1134b may be a single continuous layer or may be discontinuous layers with breaks along one or more edges of the electronic card.

[0153] As shown in Figure 11B, the marking 1140b may be formed beneath the second layer 1138b and at least partially within the first layer 1136b. In one example, the marking 1140b is formed by focusing a laser through the second layer 1138b onto the first layer 1136b, thereby chemically and / or physically altering a region of the first layer 1136b. In some cases, the second layer 1138b remains substantially unchanged or intact after the marking is formed on the first layer 1136b. In some cases, the second layer 1138b is affected, but only the internal region and outer surface of the second layer 1138b remain substantially intact. As an example, a UV laser with a wavelength of 10–400 nm and an output of less than 1 watt is used to form the marking 1140b. In some cases, a UV laser with a wavelength of 300–377 nm and an output of less than 0.5 watts is used to form the marking 1140. UV lasers can have pulse widths ranging from 0.5 nanoseconds to 40 nanoseconds. UV lasers can also have frequencies ranging from approximately 225 kHz to 400 kHz.

[0154] Referring to Figure 11B, in some embodiments, a laser may be used to create a series of laser-treated spots, thereby forming dark or blackish regions along the first layer 1136b. Each spot may be created using a UV laser to alter the reflected light properties of the first layer 1136b by dispersing, removing, or otherwise modifying a pigment (e.g., titanium oxide pigment). In some cases, the laser at least partially oxidizes the treated portion of the first layer 1136b. The laser-treated spots may have diameters ranging from 5 μm to 60 μm and be arranged in a pattern of about 5000 dots to about 8000 dots per inch. In some cases, the spot density is about 6500 dots to about 7500 dots per inch. In some cases, the pitch or spacing of the spots may differ by direction. For example, the spot pitch may be about 0.5 to 1.5 μm in the first direction and about 5 μm to 10 μm in the second direction perpendicular to the first direction. The spots may be formed to define a “serpentine” or bidirectional raster laser processing pattern using multi-directional passes, or to define a “typewriter” or unidirectional raster laser processing pattern using a series of unidirectional passes. In some cases, multiple laser passes are made in a given area to form the laser marking 1140b. In some cases, the laser marking 1140b has a feature size (e.g., line width) determined by the laser spot side (e.g., 5 μm to 60 μm). In some cases, the laser marking 1140b is formed using a laser-processed spot array to form a feature over a larger area, while appearing substantially uniform to the naked eye when viewed from several inches away.

[0155] Figure 11C shows an exemplary marking 1140c etched onto a cover layer 1134c. In this example, the marking 1140c is formed by removing a portion of the cover layer 1134c to expose a portion of the substrate 1102c. The substrate 1102c may have a different color or appearance that is visually distinguishable from the surrounding portion of the cover layer 1134c in order to provide the visual quality of the marking 1140c. In some cases, the surface of the substrate 1102c is treated to provide a color that enhances the visual difference or appearance of the marking 1140c. As will be described in more detail with reference to Figures 12-14, the exposed portion of the substrate may be polished and / or reinforced with an oxide coating to provide a visually distinguishable marking.

[0156] In the example shown in Figure 11C, the marking 1140c may be formed by removing a portion of the cover layer 1134c. In some cases, the cover layer 1134c may be exposed to a laser to polish or otherwise remove a portion of the cover layer 1134c, exposing the underlying substrate 1102c. In other cases, each portion of the cover layer 1134c may be removed using a chemical etching process, a mechanical etching process, or other material removal techniques.

[0157] Figure 11D shows an exemplary marking 1140d partially etched onto the cover layer 1134d. As shown in Figure 11D, the marking 1140d is formed within the cover layer 1134d, defining or being defined by recesses or grooves that do not expose portions of the underlying substrate 1102d. In some embodiments, the cover layer 1134d is formed from multiple layers, two or more of which have different colors or visual appearances. By removing one or more upper or outer layers to expose lower or inner layers that have a different color or visual appearance from the upper or outer layers, a marking 1140d with a distinct visual appearance can be formed.

[0158] In the example shown in Figure 11D, the marking 1140d may be formed by removing a portion of the cover layer 1134d. In some cases, the cover layer 1134d may be exposed to a laser to remove a portion of it by polishing or other means, exposing a sublayer or inner sublayer of the cover layer 1134d having a different color or different visual appearance. In other cases, each portion of the cover layer 1134d may be removed using a chemical etching process, a mechanical etching process, or other material removal techniques.

[0159] Figure 11E shows an exemplary marking 1140e etched into a portion of the cover layer 1134e and the underlying substrate 1102e. As shown in Figure 11E, the marking 1140e defines, or is defined by, a recess or groove formed on the outside or top of the cover layer 1134e and the substrate 1102e. In the example of Figure 11E, the recess or groove has an inclined or angled cross-section. In particular, the recess of the marking 1140e includes two opposing angled sidewalls that can provide a desired visual effect. The substrate 1102e may have a visually different color or appearance from the surrounding portion of the cover layer 1134e in order to provide the visual quality of the marking 1140e. In some cases, the exposed portion of the substrate 1102e is treated to provide a color that enhances the visual distinction or appearance of the marking 1140e. As will be described in more detail with reference to Figures 12-14, the exposed portion of the substrate may be polished and / or reinforced with an oxide coating to provide a visually different marking.

[0160] In the example shown in Figure 11E, the marking 1140e may be formed by removing portions of the cover layer 1134e and the substrate 1102e. In some cases, the cover layer 1134e and the substrate 1102e may be exposed to a laser to polish or otherwise remove portions of the cover layer 1134e and the substrate 1102e to form grooves or recesses. In other cases, portions of the cover layer 1134e and the substrate 1102e may be removed using chemical etching processes, mechanical etching processes, or other material removal techniques.

[0161] Figure 11F shows an exemplary marking 1140f etched onto a portion of the cover layer 1134f and the underlying substrate 1102f. As shown in Figure 11F, the marking 1140f defines, or is defined by, a recess or groove formed on the outer portion of the cover layer 1134f and the substrate 1102f. In the example of Figure 11F, the recess or groove has a rectangular cross-section. The recess of the marking 1140f has a substantially flat bottom surface and may provide the desired visual effect. As in the previous example, the substrate 1102f may have a different color or visual appearance that is visually distinguishable or visually different from the surrounding portion of the cover layer 1134f in order to provide the visual quality of the marking 1140f. As in other examples, one or more exposed surfaces of the substrate 1102f may be treated to provide a color that enhances the visual distinction or appearance of the marking 1140f. As will be explained in more detail with reference to Figures 12-14, exposed areas of the substrate may be polished and / or reinforced with an oxide coating to provide visually distinguishable markings.

[0162] In the example shown in Figure 11F, the marking 1140f may be formed by removing portions of the cover layer 1134f and the substrate 1102f. In some cases, the cover layer 1134f and the substrate 1102f may be exposed to a laser to polish or otherwise remove portions of the cover layer 1134f and the substrate 1102f to form grooves or recesses. In other cases, portions of the cover layer 1134f and the substrate 1102f may be removed using chemical etching processes, mechanical etching processes, or other material removal techniques.

[0163] Figures 12-14 are cross-sectional views of exemplary markings formed on the surface of an electronic card. Specifically, Figure 12 is a cross-sectional view of a relief feature 1222. The relief feature 1222 in Figure 12 may correspond to the first laser-formed relief feature 1022 in Figure 10. Figure 12 shows an example of a fine or precision marking that can be produced using laser-based technology. In the example in Figure 12, a laser can be used to remove a portion of the coating layer 1230, exposing a portion of the substrate 1202 that may be formed from a metallic material. As shown, removing a portion of the coating layer 1230 does not cause significant distortion of the substrate 1202 adjacent to or beneath the coating layer 1230. The exposed substrate 1202 is shown to have an angled, non-planar feature, but in some embodiments, the exposed substrate 1202 may be substantially flat or planar. Furthermore, as will be described later with reference to Figure 14, a metal oxide layer can be formed on the exposed metal substrate 1202.

[0164] As shown in Figure 12, the relief feature 1222 includes a pair of concave walls 1264 defining a recess extending through the coating layer 1230. The relief feature 1222 further includes a concave marking feature 1266 defining the bottom of the recess. The concave marking feature 1266 may have a coating, texture, coloring, or appearance that visually distinguishes the concave marking feature 1266 from the adjacent portion of the coating layer 1230. The recess defined by the pair of concave walls 1264 and the marking feature 1266 has a width W which may be partially determined by the spot size diameter of the laser used to form the relief feature 1222. Although the pair of concave walls 1264 are shown to form an angle of about 90 degrees with respect to the front surface 1210, embodiments are not limited to this particular shape. In other embodiments, one or both of the pair of concave walls 1264 may be formed at a certain (non-perpendicular) angle with respect to the front surface 1210.

[0165] As shown in Figure 12, the coating layer 1230 is formed along the surface 1212 of the substrate 1202, and the recessed marking feature portion 1266 is formed on the surface 1212 of the substrate 1202 to define the marking surface 1214. The marking surface 1214 may be at the same height as the surface 1212, or it may be at a different height as shown in Figure 12. In some embodiments, the marking surface 1214 is recessed by 5 μm or less, 3 μm or less, 2 μm or less, or 1 μm or less relative to the surface 1212.

[0166] Generally, the marking surface 1214 may have a texture that gives the concave marking feature portion 1266 a visual appearance that is different from or visually distinguishable from the adjacent portion of the coating layer 1230. For example, the marking surface 1214 may have a surface finish with a roughness corresponding to the roughness of the polished surface. The roughness of the marking surface 1214 may be about 1 μm to about 5 μm. In additional examples, the roughness of the marking surface 1214 may be greater than 5 μm or greater than 10 μm. One measure of surface roughness is the parameter R, which is a measure of the amplitude of the roughness profile. a This is the arithmetic mean of roughness determined from the deviation relative to the center line. Another parameter is S, the average interval between peaks in the roughness profile. m Reflectance can also be used as a measure of surface roughness.

[0167] In some embodiments, the marking surface 1214 may include a dye, ink, or other marking element that can be used to provide a marking color to the recessed marking feature 1266. In some cases, the marking surface 1214 may include an oxide layer that can provide a marking color to the recessed marking feature 1266. The metal oxide may be a thermally grown metal oxide or may be thermally grown on a metallic material by heating the substrate using a laser. An example of an oxide layer formed within the relief feature is illustrated with reference to Figure 14.

[0168] As shown in Figure 12, the coating layer 1230 may be a multilayer coating. In this example, the coating layer 1230 includes a first layer 1234 having a thickness T1 and a second layer 1236 having a thickness T2. The thickness of the first layer 1234 may be greater than the thickness of the second layer 1236. In some embodiments, the total thickness of the coating layer is 50 μm to 500 μm or 100 μm to 300 μm. The first layer 1234 is disposed on the outer surface 1212 of the substrate 1202 and may contact the surface 1212 along the interface between the coating layer 1230 and the substrate 1202, as shown in Figure 12. The second layer 1236 is disposed on top of the first layer 1234.

[0169] The first layer 1234 may include one or more polymer materials. In one example, the first layer 1234 includes a first urethane layer (e.g., a primer layer) bonded to the surface of the substrate 1202. The first layer 1234 may include one or more additional urethane materials bonded or bonded to the substrate 1202 via the first urethane layer or primer layer. The one or more additional urethane materials may include a dual urethane or polyurethane compound applied to the first urethane layer or primer layer.

[0170] In some embodiments, the first layer 1234 comprises pigment particles dispersed within a polymer binder. As an example, the pigment particles may be inorganic pigment particles containing metal oxides, including but not limited to titanium dioxide (TiO2, Ti2O3), zinc oxide (ZnO), manganese dioxide (MnO2), and iron oxide (Fe3O4). The particles may have a size in the range of 0.1 μm to 10 μm or 0.1 μm to 1 μm. The first layer 1234 may further contain other additives or components.

[0171] In some embodiments, the second layer 1236 is transparent and may be formed from a transparent polymer. The transparent polymer of the second layer 1236 may have higher hardness and / or wear resistance than the first layer 1234. For example, the second layer 1236 may include an acrylate polymer (e.g., acrylic) or an epoxy polymer. In some cases, the coating layer 1236 may include a UV-curable polymer. In some cases, the second layer 1236 may include a diamond-like carbon (DLC) coating or other hard material that can be formed in a thin layer. The second layer 1236 may include a filler material, for example, a nanoscale inorganic material or a diamond material. The diameter of the nanoscale filler material may be less than 100 nm or less than 50 nm.

[0172] The first layer 1234 and / or the second layer 1236 may be deposited on the substrate 1202 using a deposition or layer coating process, including, for example, physical vapor deposition (PVD), atomic deposition coating (ALD), spray coating, immersion coating, and other similar material deposition processes. In some cases, the first layer 1234 is applied to a primer layer formed on the surface of the substrate 1202. The foregoing description of the first and second layers 1234, 1236 is not limited to the example in Figure 12, but more generally applies to multilayer coatings described in relation to other aspects of this disclosure.

[0173] As shown in Figure 12, the relief feature portion 1222 includes a recessed marking feature portion 1266 having a shape feature portion 1272 extending within the substrate 1202. As shown in Figure 12, the shape feature portion 1272 is a channel formed in the substrate 1202 and has a rectangular or V-shaped cross-section, generally referred to as a "channel" 1272. The channel 1272 may have a width approximately equal to the width W of the recessed marking feature portion 1266. In some cases, the width of the channel 1272 may be about 80% to 100% of the width of the recessed marking feature portion 1266. The channel 1272 may have an angle θ greater than about 45 degrees and less than 180 degrees, or about 60 degrees to about 120 degrees.

[0174] Figure 13 is a cross-sectional view of another exemplary laser-formed relief feature 1322. The relief feature 1322 in Figure 13 may correspond to the relief feature 1022 in Figure 10. As shown in Figure 13, the relief feature 1322 includes a pair of concave walls 1364 extending into the coating layer 1330 and at least partially defining the recess. In this example, the pair of concave walls 1364 extend at a non-perpendicular angle to the front surface 1310 of the electronic card. As shown in Figure 13, the relief feature 1322 further includes a concave marking feature 1366 defining the bottom of the recess. In this example, the concave marking feature 1366 includes a curved or rounded shape feature 1372 extending into the substrate 1302 and having a depth D and a width W. The shape feature 1372 can be described as a channel having angled walls extending from a rounded bottom or valley. The shape feature portion 1372 may have an angle θ greater than approximately 45 degrees and less than 180 degrees, or between approximately 60 degrees and approximately 120 degrees. In some cases, the angled wall of the shape feature portion 1372 corresponds to the angle of the concave wall 1364.

[0175] Figure 14 shows another exemplary laser-formed relief feature. The laser-formed relief feature 1422 may correspond to the relief feature 1022 described above with reference to Figure 10. Similar to the example above, the relief feature 1422 may be formed along the outer surface 1410, extending at least partially within the coating layer 1430 and the underlying metal substrate 1402, and may be formed from a metallic material. In this example, the relief feature 1422 includes a marking surface 1414 having one or more oxide layers that provide a different color, different hues, or a specific visual appearance to the relief feature. Specifically, the relief feature 1422 includes a first oxide layer 1452 having a first thickness T1 and a second oxide layer 1454 having a second thickness T2 greater than the first thickness T1.

[0176] The metal oxide layers 1452 and 1454 may include thermally grown metal oxides. For example, the metal oxide layers 1452 and 1454 may be thermally grown on the marking surface 1414 of the metal substrate 1402 by heating the substrate 1402 using a laser or other focused heat or energy source. Suitable metal materials include, but are not limited to, titanium alloys, steel, or zirconium-based, titanium-based, or iron-based bulk solidified alloy substrates. In some embodiments, the thermally grown metal oxide may have a lower porosity than that of the anodic grown porous metal oxide. In embodiments, the metal oxide may include titanium oxide, iron oxide, chromium oxide, zirconium oxide, or a combination thereof.

[0177] The thickness of the metal oxide layer can affect the color of the relief feature 1422 in several ways. For example, metal oxide layers 1452 and 1454 may display color as a result of interference of light reflected from the metal oxide and the underlying metal substrate 1402. Typically, the interference color displayed depends on the thickness of the metal oxide. Interference colors displayed on metal oxides that are too thick may appear dark. When the metal oxide is very thin (or absent), the recessed marking feature may appear bright or metallic. A variety of colors can be obtained, including but not limited to blue, purple, pink, orange, yellow, gold, brown, and green. The appropriate thickness of the metal oxide layer for obtaining color from optical interference may depend not only on the composition and crystallinity of the metal oxide layer but also on the desired color to be achieved. As an example, the thickness of the metal oxide layer for obtaining color from optical interference may be 50 nm to 500 nm.

[0178] As shown in Figure 14, the first oxide layer 1452 may have a first thickness T1 and produce a first color or appearance, and the second oxide layer 1454 may have a second thickness T2 greater than the first thickness T1 and produce a second color or appearance different from the first color or appearance. The configuration in Figure 14 can produce various visual effects. In some embodiments, the relief feature portion 1422 in Figure 14 may appear to have a first color or visual appearance when viewed from one angle and a second color or visual appearance when viewed from another different angle. In some embodiments, the first color of the first oxide layer 1452 and the second color of the second oxide layer 1454 are combined to provide a third color that is distinguishable when viewed with the naked eye (without aids) at normal or typical viewing distances.

[0179] Figures 15A and 15B show other exemplary laser-formed relief features. Specifically, Figure 15A is an enlarged view of a relief feature 1524 that may correspond to the relief feature 1024 of Figure 10. Figure 15B is a cross-sectional view of the relief feature 1524 along the cross section FF of Figure 15A. The relief feature 1524 is provided as an example of how the relief feature 1524 may be formed on an area or region of the outer surface of an electronic card. Generally, the relief feature 1524 may be visually and tactilely distinguishable from the surrounding or adjacent portions of the surface of the electronic card.

[0180] As shown in Figure 15B, the relief feature portion 1524 extends within the coating layer 1530 and at least partially within the substrate 1502 and may be formed from a metallic material. The relief feature portion 1524 includes a concave wall 1564 defining at least a portion of the recess. The relief feature portion 1524 further includes a first concave marking feature portion 1566 formed around the relief feature portion 1524. The first concave marking feature portion 1566 may include a shape feature portion, which in this example is a channel 1550 having a rounded or rounded shape and extending within the substrate 1502. The relief feature portion 1524 further includes a second concave marking feature portion 1568 at least partially surrounded by the first concave marking feature portion 1566.

[0181] The second recessed marking feature 1568 may cover a large portion of the area of ​​the relief feature 1524 and provide the main appearance or visual characteristics of the relief feature. In this example, the second recessed marking feature 1568 includes a surface texture 1552, which may provide a visual appearance that distinguishes it from the surrounding or adjacent portions of the electronic card. In some embodiments, the second recessed marking feature 1568 may include one or more oxide layers that provide one or more colors to the relief feature 1524.

[0182] Figures 16A–16C show exemplary chamfered edges of electronic cards. Electronic cards 1600a, 1600b, and 1600c in Figures 16A, 16B, and 16C may correspond to or be similar to electronic card 100 described with reference to other figures. As previously mentioned, chamfered edges can provide various functional and / or visual advantages to electronic cards. For example, chamfered edges or chamfered areas facilitate insertion of the card into a card reader or card reading device. Chamfered edges or chamfered areas can also provide a desired tactile feel or make the electronic card easier to handle. Furthermore, chamfered edges or chamfered areas provide a distinct visual appearance.

[0183] Figure 16A is a cross-sectional view of the chamfered edges 1610a, 1612a of an electronic card 1600a having exposed (chamfered) portions of the card substrate 1602. As with other embodiments described herein, the electronic card 1600a includes a substrate 1602 which may be formed from metal or a metallic material. The electronic card 1600a also includes a coating layer 1630 which may comprise multiple layers. As shown in Figure 16A, the coating layer 1630 includes a first layer 1632 which may be used to provide color or appearance to the electronic card 1600a. As previously stated, the first layer 1632 may comprise a pigment or dye dispersed in a polymer or polymer binder. The coating layer 1630 may also include a second layer 1634 which may be formed from a rigid and / or transparent material and is positioned on top of the first layer 1632. As mentioned above, the second layer 1634 may include a transparent polymer, for example, acrylic (e.g., acrylate polymer) or epoxy (e.g., epoxy polymer). In some cases, the coating layer 1632 may include a UV-curable polymer. In some cases, the second layer 1634 may include a hard coating, such as a diamond-like carbon (DLC) coating.

[0184] As shown in Figure 16A, the electronic card 1600a includes a front chamfered edge 1610a and a rear chamfered edge 1612a. The front chamfered edge 1610a may extend around or surround the front of the electronic card 1600a, and the rear chamfered edge 1612a may extend around or surround the rear of the electronic card 1600a. In this example, the chamfered edges 1610a, 1612a include exposed portions of the substrate 1602, which are also referred to herein as chamfered portions of the substrate 1602. In some cases, the exposed or chamfered portions of the substrate 1602 may be polished or otherwise treated to provide a smooth surface finish. In some cases, the exposed or chamfered portions may be brushed or etched to provide a textured surface finish.

[0185] The chamfered portions of the substrate 1602 that partially define the chamfered edges 1610a and 1612a may have a different visual appearance from the non-chamfered portions of the electronic card 1600a. In some embodiments, the exposed or chamfered portions of the substrate 1602 along the chamfered edges 1610a and 1612a may have the natural color of the metallic material forming the substrate 1602. In other embodiments, the exposed or chamfered portions of the substrate 1602 along the chamfered edges 1610a and 1612a may be anodized or oxidized to form an anodized or oxidized layer. The anodized or oxidized layer may have a natural color or may contain dyes or pigments to provide a desired appearance or color.

[0186] As shown in Figure 16A, the electronic card 1600a also defines a side wall or substrate edge extending between the front chamfered edge 1610a and the back chamfered edge 1612a. In the embodiment shown in Figure 16A, the side wall or substrate edge is coated with the same or similar coating layer 1630 as the front and back of the electronic card 1600a.

[0187] Figure 16B shows another exemplary electronic card 1600b with chamfered edges 1610b, 1612b having exposed or chamfered portions of a substrate 1602 coated with oxide layers 1640, 1642. As described above with reference to Figure 14, the oxide layers 1640, 1642 may be thermally grown oxides formed to a specific thickness to provide a desired color or appearance.

[0188] For example, oxide layers 1640 and 1642 may display color as a result of the interference of light reflected from the metal oxide and the underlying metal substrate 1602. As mentioned above, interference colors displayed on a metal oxide that is too thick may appear dark. When the metal oxide is very thin (or absent), the recessed marking features may appear bright or metallic. A variety of colors can be obtained, but are not limited to blue, purple, pink, orange, yellow, gold, brown, and green. The appropriate thickness of the oxide layers 1640 and 1642 for obtaining color from optical interference may depend not only on the composition and crystallinity of the layers but also on the desired color to be achieved. As an example, the thickness of the oxide layers 1640 and 1642 for obtaining color from optical interference may be 50 nm to 500 nm. In some embodiments, the substrate 1602 is anodized and coated with oxide layers 1640 and 1642 to provide a specific color or visual effect.

[0189] Similar to the other examples above, the electronic card 1600b in Figure 16B may include a coating layer 1630 that provides the electronic card 1600b with a visual appearance or color. Similar to the previous examples, the coating layer 1630 may include multiple layers, including sub-layers 1632 and 1634. The appearance of the coating layer 1630 may be different from and / or contrast to the color or appearance of the chamfered portions 1610b, 1612b having oxide layers 1640, 1642. As shown in Figure 16B, the electronic card 1600a also defines a sidewall or substrate edge extending between the front chamfered edge 1610a and the back chamfered edge 1612a. In the embodiment shown in Figure 16A, the sidewall or substrate edge is coated with the same or similar coating layer 1630 as on the front and back of the electronic card 1600a.

[0190] Figure 16C shows another exemplary electronic card 1600c having chamfered edges 1610c, 1612c with exposed or chamfered portions of the substrate 1602. In the example of Figure 16C, the substrate 1602 also defines an exposed sidewall or substrate edge 1650. In some cases, the exposed sidewall or substrate edge 1650 is coated with a thin and / or transparent coating so that the natural color of the substrate 1602 is visible along the edge of the electronic card 1600c, while protecting the substrate 1602. As in the other examples above, the electronic card 1600c may include a coating layer 1630 that provides the electronic card 1600c with a visual appearance or color. As in the previous examples, the coating layer 1630 may include multiple layers, including sub-layers 1632 and 1634. The appearance of the coating layer 1630 may be different from and / or contrast to the color or appearance of the chamfered portions 1610c, 1612c and / or exposed sidewalls 1650.

[0191] Figure 17 shows exemplary components of the electronic card 1700. The electronic card 1700 may correspond to any one of the embodiments of the electronic card described herein. Specifically, the electronic cards described herein may include one or more components of the electronic card 1700 as described below. However, the schematic diagram in Figure 17 is not intended to be an exhaustive or comprehensive description of the components or elements of the electronic card. Furthermore, one or more of the components or elements described below may be optional or omitted from a particular embodiment.

[0192] According to some embodiments, the electronic card 1700 may be foldable or flexible. For example, the electronic card 1700 may define one or more foldable or flexible regions configured to be repeatedly folded or bent during use. Various components described herein may be configured to facilitate the creation of a foldable card, for example, including flexible electronic components, flexible battery elements, flexible display elements, and the like.

[0193] As shown in Figure 17, the electronic card 1700 includes one or more processing units 1702. The processing units 1702 may include one or more computer processors or microcontrollers configured to perform various operations or functions. In some cases, the processing units 1702 perform various operations in accordance with computer-readable instructions or firmware. The processing units 1702 may include a central processing unit (CPU), a numerical processing unit (NPU), and other processing circuits. The processing units 1702 may also include other processors within the electronic card 1700, such as application-specific integrated circuits (ASICs) and other microcontroller devices.

[0194] In addition, the processing unit 1702 may be operably connected to the memory 1704. The processing unit 1702 may be operably connected to the memory 1704 by an electronic bus or bridge. In some cases, the processing unit 1702 may be directly connected to the memory 1704. The memory 1704 may include various types of non-temporary computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. The memory 1704 is configured to store computer-readable instructions, encoded security keys, security codes, serial numbers, identification information, financial information, medical information, or other types of data or records.

[0195] As shown in Figure 17, the electronic card 1700 may further include a radio circuit 1706. As previously mentioned, the electronic card 1700 may include a radio transceiver or other radio electronic device configured to interface with an external device using a radio communication protocol. In some embodiments, if the electronic card 1700 primarily interfaces with an external device using the radio circuit 1706, the electronic card 1700 may be called a contactless card. A contactless card does not necessarily include physical contacts or terminals. In addition, if the electronic card 1700 is a contact card, the electronic card 1700 does not necessarily include a radio circuit.

[0196] The electronic card 1700 may include an encoding magnetic component 1708. As described above with respect to some embodiments, the electronic card 1700 may include a magnetic element (e.g., a ferromagnetic film) that defines a magnetic area or region along the surface of the electronic card 1700. The encoding magnetic component 1708 stores encoded information or data, and the information or data can be read using an external card reader or card reading device. The encoding magnetic component 1708 may be configured to enable dynamic encoding that can be changed depending on the use of the electronic card 1700. For example, the information stored in the encoding magnetic component 1708 may be modified by the processing unit 1702 and / or an external encoder depending on a specific use or operation performed using the electronic card 1700. The stored information may include account balances, amounts, authentication codes, or other types of dynamic information.

[0197] As shown in Figure 17, the electronic card 1700 may include security components 1710 that can be used to authenticate the electronic card 1700. Generally, the security components 1710 include elements or functions that are difficult or difficult to copy or forge. In some cases, the security components 1710 may include stickers or visual markings having at least one feature that is difficult to copy or duplicate. For example, the security components 1710 may include stickers or markings having a holographic image, which is usually difficult to copy or duplicate without sophisticated equipment. In some cases, the security components 1710 may include embedded electronic code, electronic signatures, or other electrically detectable elements used to authenticate or identify the electronic card 1700. Generally, the security components 1710 can be used to help determine that the electronic card 1700 is genuine or not forged. In some cases, an external reader is configured to read or detect the security components 1710 and provide access to a restricted area, restricted region, or restricted system when the electronic card 1700 is presented.

[0198] The electronic card 1700 may include an antenna 1712. The antenna 1712 may work in conjunction with the radio circuit 1706 to simplify wireless communication with an external device or reader. In some cases, the antenna 1712 is passive and used to communicate a serial number or other unique identifier to an external device or reader. In some cases, the antenna 1712 includes or is configured as a radio frequency identification (RFID) antenna, a Bluetooth antenna, a near-field communication (NFC) antenna, an ultra-wideband antenna, or other similar component or device.

[0199] In some embodiments, the antenna 1712 is configured to receive and / or transmit signals from multiple external devices to determine the location of the electronic card 1700. For example, the antenna 1712 may be used to transmit a beacon signal that is detected by one or more external devices. The estimated location of the electronic card 1700 can be triangulated or calculated by utilizing the variations in the received signals from various devices. In another example, the antenna 1712 of the electronic card 1700 is a broadband antenna (e.g., an ultra-broadband antenna) configured to detect a range of signals emitted from various devices. The electronic card 1700 can use the detected signals to estimate its current location.

[0200] Antenna 1712 may further include an NFC antenna that can be used to conduct transactions with a point-of-sale (POS) device or other external device. In some embodiments, antenna 1712 may be configured to communicate with an antenna from another electronic card to authenticate or initiate a transaction between two parties. In one example, electronic card 1700 is configured to exchange cash or the value of a card when it is touched or tapped with another similarly configured electronic card. The value exchange may be simplified through a user interface displayed on electronic card 1700 (e.g., using display 1714) or displayed on another user device such as a mobile phone, tablet, or computer.

[0201] Antenna 1712 may also be used to send warnings or notifications to the user device. For example, antenna 1712 may be configured to send a signal to the user device to be received or relayed when the user device moves a certain close distance away from the electronic card 1700. This function may help prevent the electronic card 1700 from being unintentionally left in the company or elsewhere. Antenna 1712 may also be configured to receive commands from the user device. For example, antenna 1712 may be configured to receive a signal or relayed signal from the user device that contains a command to disable the electronic card 1700. The command to disable the electronic card 1700 may be received from another system or device that may be operated by the card issuer or another party.

[0202] In some embodiments, the electronic card 1700 is shipped to the user or customer in a container or package. The container or package may be configured for shipment via postal service or other delivery service. The container or package may be configured for display in a retail store or retail environment. In some cases, the container or package is not configured for shipment without individual shipping containers or packages. For example, the exterior of the container or package may have a decorative appearance that would not withstand normal shipping conditions intact or without defects.

[0203] In some embodiments, the container or package may include an antenna or electronic component readable by the user's mobile phone or other portable electronic device (such as a tablet, notebook computer, desktop computer, or portable media player). For example, the container or package may include a bag or pocket in which the electronic card 1700 can be placed at least partially inside. The bag or pocket may include a sleeve that completely encloses the electronic card 1700, or it may include a recess that partially encloses the electronic card 1700, substantially exposing its top (or bottom) surface. The package may also include one or more flaps or panels configured to fold over the bag or pocket to conceal or cover the electronic card 1700 contained therein.

[0204] The container may also include one or more antennas extending along one or more sides of the bag or pocket. The one or more antennas may include near-field communication (NFC) antennas, radio frequency identification (RFID) antennas, or other types of antennas configured for wireless communication. In one example, the container includes two elongated antennas positioned along both sides of the bag or pocket. The two elongated antennas may be displaced outward from the edges of the electronic card 1700 when the electronic card 1700 is placed in the bag or pocket of the container. In some cases, when the electronic card 1700 is held in the container, one or more antennas surround, or at least partially surround, the electronic card 1700. In some cases, when the electronic card 1700 is placed in the bag or pocket of the container, the antennas overlap one or more portions of the electronic card 1700.

[0205] In some embodiments, a user's portable electronic device can identify the electronic card 1700 and obtain its serial number or another type of unique identifier. The user's portable electronic device may obtain the ID of the electronic card 1700 by electrically communicating with one or more antennas integrated with the package. The user's portable electronic device may also be configured to communicate with external devices and / or services to register the electronic card 1700 with a registry or user account. In some cases, the electronic card 1700 is activated in response to registration using the user's portable electronic device.

[0206] In some embodiments, the electronic card 1700 includes one or more visual output devices configured to provide output to the user. For example, the electronic card 1700 may include a display 1714 that renders visual information generated by the processing unit 1702 or other forms of graphic output. The display 1714 may include liquid crystal displays (LCDs), light-emitting diodes, organic light-emitting diode (OLED) displays, active layer organic light-emitting diode (AMOLED) displays, organic electroluminescent (EL) displays, electrophoretic ink displays, and the like. If the display 1714 is a liquid crystal display or an electrophoretic ink display, the display may further include a backlight component that can be controlled to provide a variable level of display brightness. If the display 1714 is an organic light-emitting diode or organic electroluminescent display, the brightness of the display 1714 may be controlled by changing electrical signals supplied to the display elements. The display 1714 may be a foldable or flexible display configured to be bent or folded during normal operation.

[0207] In some embodiments, the display 1714 is used to provide dynamic or configurable markings on the electronic card 1700. For example, the display 1714 may be used to display the cardholder's name, account number, card issuer logo, or other similar types of markings. In some embodiments, the display 1714 may dynamically change the markings depending on the state or mode of the electronic card 1700. The display 1714 may display a mark or other marking indicating that value has been loaded onto the electronic card 1700 and / or that the electronic card 1700 is authorized to conduct monetary transactions or transfers. In some embodiments, the display 1714 may change the orientation of the markings or graphic output depending on the orientation of the electronic card 1700.

[0208] As shown in Figure 17, the electronic card 1700 may include a battery 1716 configured to supply power to the components of the electronic card 1700. The battery 1716 may include one or more energy storage cells linked together to enable internal power supply. The battery 1716 may be operably connected to a power management circuit configured to supply appropriate voltage and power levels to individual components or groups of components in the electronic card 1700. The battery 1716 may be configured to receive power from an external source, such as an external wireless charger, via the power management circuit. In one example, the battery 1716 is operably connected to a receiving coil configured to receive wireless or inductively coupled power from a wireless charging device having a transmitting coil. The battery 1716 may store the received power so that the electronic card 1700 can operate for extended periods, ranging from several hours to several days, without connection to an external power source. The battery 1716 may be flexible to accommodate the bending or flexing of the electronic card 1700. For example, the battery 1716 may be mounted on a flexible structure or on a flexible printed circuit. In some cases, the battery 1716 is formed from a flexible anode layer and a flexible cathode layer, and the battery cell itself is flexible. In some cases, the individual battery cells are not flexible, but the battery cell array is mounted on a flexible substrate or carrier so that it can be bent or folded around the foldable area of ​​the electronic card 1700.

[0209] In some embodiments, the electronic card 1700 includes one or more input devices 1718. An input device 1718 is a device configured to receive input from a user or the environment. An input device 1718 may include, for example, a touch sensor, a force sensor, or another touch-actuated sensor. A touch-actuated sensor can be used to define a touch-actuated button, a gesture input area, a capacitive slider bar, or other touch-sensitive areas on the electronic card 1700. An input device 1718 may be configured to receive gesture input, force input, or various other forms of touch input. In some embodiments, an input device 1718 may provide a dedicated or primary function, for example, a power button, a home button, or other dedicated function or operation.

[0210] As shown in Figure 17, the electronic card 1700 may include one or more output devices 1720. For example, the electronic card 1700 may include an output device 1720 configured to function as a speaker and produce sound or voice output. In another example, the output device 1720 may operate as a tactile or haptic output device and be configured to produce haptic output along the surface of the electronic card 1700. The output device 1720 may be formed from a mesh or matrix of fibers or wires configured to move or deform in response to signals from the processing unit 1702. The movement of the fiber mesh or matrix may produce tactile or haptic output along the outer surface of the electronic card 1700. Similarly, the movement of the mesh or matrix of fibers may produce sound or voice output.

[0211] In some embodiments, the electronic card 1700 includes one or more devices configured to authenticate a user. For example, the electronic card 1700 may include a biosensor configured to identify or authenticate a user by detecting some unique biocharacteristics, including fingerprints, facial patterns, eye detection, or other biodata. The biosensor may include, for example, a capacitive array configured to detect the unique characteristics of the user's fingerprints or touch. Alternatively, the biosensor may include an optical sensor configured to detect other unique characteristics of the user. The biosensor may be used to authenticate financial transactions, provide access to restricted areas, and / or unlock a device or system paired with the electronic card 1700.

[0212] The following descriptions apply to the electronic cards and electronic devices described herein to the extent that these cards or devices can be used to obtain personally identifiable information data. It should be fully understood that the use of personally identifiable information should be in accordance with generally recognized privacy policies and practices that meet or exceed industry or government requirements for maintaining user privacy. Specifically, personally identifiable information data should be managed and handled in a manner that minimizes the risk of unintentional or unauthorized access or use, and the nature of permitted use should be clearly indicated to the user.

[0213] In the preceding description, certain technical terms have been used for illustrative purposes to provide a complete understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not necessary to carry out the described embodiments. Therefore, the preceding descriptions of the specific embodiments described herein are presented for illustrative purposes only. These descriptions are not intended to exhaust all embodiments or to limit embodiments to the exact forms disclosed. In light of the above teachings, it will be apparent to those skilled in the art that many modifications and variations are possible.

[0214] For example, the mechanism implementing the function may be physically arranged in various locations, including being distributed so that some of the functions are implemented in different physical locations. Also, as used herein, including in the claims, "or" used in a list of items beginning with "at least one" indicates a separate list, for example, the list "at least one of A, B, or C" indicates A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Furthermore, the term "exemplary" does not mean that the example described is preferable or better than other examples.

Claims

1. It is an electronic card, A metal substrate, Front and The rear side opposite to the front side, The recess formed on the front surface, A metal substrate that defines the area, A chip module including a contact plate, disposed within the recess of the metal substrate, The aforementioned contact plate Plate substrate and A 2x3 terminal electrode array disposed on the first surface of the plate substrate, wherein each terminal electrode of the terminal electrode array is displaced from the edge of the plate substrate, A peripheral portion disposed on the first surface of the plate substrate and including a conductive material surrounding the terminal electrode array, the peripheral portion being electrically insulated from the terminal electrode array, An integrated circuit coupled to the second surface of the plate substrate, A chip module including, Includes, The aforementioned peripheral portion defines an array with an opening, An electronic card in which each terminal electrode of the terminal electrode array is positioned within each opening of the array of openings and is completely surrounded by each opening of the array of openings.

2. The array of openings is an array of elliptical openings. The electronic card according to claim 1.

3. The electronic card according to claim 1, wherein the peripheral portion is separated from the terminal electrode array by one or more gaps formed by removing a portion of the conductive material from the plate substrate.

4. The contact plate further includes a conductive layer disposed on the second surface of the plate substrate, The electronic card according to claim 1, wherein the terminal electrode array is electrically connected to the conductive layer by one or more vias extending through the plate substrate.

5. The aforementioned plate substrate is formed of a non-conductive material, The aforementioned terminal electrode array A first conductive layer comprising an electroless plated metal disposed on the non-conductive material of the plate substrate, A second conductive layer comprising an electroplated metal disposed on the first conductive layer, The electronic card according to claim 1, including the electronic card described in claim 1.

6. It is an electronic credit card, A substrate having a defined front surface and a back surface opposite to the front surface, and having a width dimension, a height dimension, and a thickness dimension, wherein the width dimension is greater than the height dimension, A contact plate disposed on the front surface of the substrate, Plate substrate and Displaced on the first side of the plate substrate and defining the peripheral portion, the peripheral portion is configured to define an array of openings with the first portion of the outer surface of the electronic credit card and surround a terminal electrode array, the terminal electrode array having at least two rows parallel to the height dimension and at least three rows parallel to the width dimension, the first conductive layer A second conductive layer disposed on the first side of the plate substrate, defining the first terminal electrode of the terminal electrode array, wherein the first terminal electrode is located within the first opening of the array of openings and is completely surrounded by the first opening of the array of openings, and the second conductive layer defines the second portion of the outer surface of the electronic credit card. A third conductive layer disposed on the first side of the plate substrate, defining the second terminal electrode of the terminal electrode array, wherein the second terminal electrode is located within the second opening of the array of openings and is completely surrounded by the second opening of the array of openings, and the third conductive layer defines the third portion of the outer surface of the electronic credit card. A fourth conductive layer disposed on the first side of the plate substrate, defining the third terminal electrode of the terminal electrode array, wherein the third terminal electrode is located within the third opening of the array of openings and is completely surrounded by the third opening of the array of openings, and the fourth conductive layer defines the fourth portion of the outer surface of the electronic credit card. A contact plate, which includes the peripheral portion of which is electrically insulated from the terminal electrode array, Electronic credit cards, including

7. The openings of the array of openings are elliptical in shape. The electronic credit card according to claim 6, wherein the second conductive layer, the third conductive layer, and the fourth conductive layer have an elliptical shape and are arranged within each of the openings of the array of openings.

8. The substrate defines a recess along the front surface, The electronic credit card according to claim 6, wherein the contact plate is at least partially disposed within the recess.

9. The electronic credit card according to claim 8, wherein the contact plate further includes an integrated circuit coupled to the second side of the plate substrate opposite to the first side.

10. The electronic credit card according to claim 6, wherein the substrate is a metal substrate formed from one or more materials: stainless steel, titanium, or aluminum.

11. The aforementioned electronic credit card is A first coating layer disposed on the substrate, A first layer comprising a polymer and a pigment dispersed within the polymer, A second layer extending on the first layer and containing a transparent polymer, the second layer having a higher hardness than the first layer, The electronic credit card according to claim 6, further comprising a first coating layer including the above.

12. The electronic credit card further comprises a laser-formed relief feature portion, the laser-formed relief feature portion including a concave marking feature portion that defines the bottom of a marking recess, The electronic credit card according to claim 6, wherein the bottom of the marking recess exposes a portion of the substrate.

13. A fifth conductive layer disposed on the first side of the plate substrate, defining the fourth terminal electrode of the terminal electrode array, wherein the fourth terminal electrode is located within the fourth opening of the array of openings and is completely surrounded by the fourth opening of the array of openings; A sixth conductive layer disposed on the first side of the plate substrate, defining the fifth terminal electrode of the terminal electrode array, wherein the fifth terminal electrode is located within the fifth opening of the array of openings and is completely surrounded by the fifth opening of the array of openings; The electronic credit card according to claim 6, further comprising: a seventh conductive layer disposed on the first side of the plate substrate and defining the sixth terminal electrode of the terminal electrode array, wherein the sixth terminal electrode is located within the sixth opening of the array of openings and is completely surrounded by the sixth opening of the array of openings.

14. It is an electronic card, Metal card substrate and A contact plate disposed within a recess defined in the metal card substrate, A plate substrate made of a non-conductive material, A symmetrical terminal electrode array disposed on the surface of the plate substrate, wherein each terminal electrode of the terminal electrode array is formed of a first conductive material, A conductive coating, formed of a second conductive material and disposed on the surface of the plate substrate, surrounds each terminal electrode of the terminal electrode array and is electrically insulated from the terminal electrode array, A contact plate, including Includes, The conductive coating defines the array of openings, An electronic card in which each terminal electrode of the terminal electrode array is positioned within each opening of the array of openings and is completely surrounded by each opening of the array of openings.

15. Each terminal electrode of the terminal electrode array is separated from the conductive coating by its respective gap. The electronic card according to claim 14, wherein each gap has the same uniform width.

16. The contact plate includes a set of laser polishing areas, The electronic card according to claim 14, wherein each laser polishing area of ​​the set of laser polishing areas is located within the respective gaps defined between each terminal electrode of the terminal electrode array and the conductive coating.

17. Each terminal electrode of the aforementioned terminal electrode array is A first layer formed of electroless plated metal and extending on the non-conductive material of the plate substrate, A second layer formed of electroplated metal and extending on the first layer, The electronic card according to claim 14, including the electronic card described in claim 14.

18. The aforementioned electronic card An opaque layer comprising a first polymer material disposed on the surface of the metal card substrate, A transparent layer comprising a second polymer material disposed on the opaque layer, The electronic card according to claim 14, further comprising:

19. The array of openings is an array of elliptical openings. The electronic card according to claim 14.

20. The metal card substrate has defined height, width, and thickness dimensions, wherein the width dimension is greater than the height dimension. The electronic card according to claim 14, wherein the symmetrical terminal electrode array is symmetrical about a line parallel to the height dimension.

21. The electronic card according to claim 1, wherein each of the openings in the peripheral portion has the same shape.

22. The electronic credit card according to claim 6, wherein each opening in the array of openings has the same shape.

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