Modular thermal and radiation shielding with passive heat removal

Abstract

A housing assembly configured to house a nuclear reactor is disclosed. The housing assembly includes a plurality of modular walls configured to surround the nuclear reactor and a passive temperature control system. The plurality of modular walls includes a first modular wall. The passive temperature control system is coupled to the first modular wall. The passive temperature control system is configured to transfer heat between the nuclear reactor and an area surrounding the housing assembly.

Description

[Technical Field]

[0001] (Cross-Reference to Related Applications) This application claims the benefit and priority under 35 U.S.C. § 120 from U.S. Patent Application No. 17 / 308,353, entitled "MODULAR THERMAL AND RADIATION SHIELDING WITH PASSIVE HEAT REMOVAL", filed on May 5, 2021, the entire content of which is incorporated herein by reference.

[0002] (Government Contract) This invention was made with government support under Contract DE-NE0008853 awarded by the Department of Energy. The government has certain rights in the invention. [Background Art]

[0003] The present invention relates generally to housing assemblies used for transferring heat and protecting microreactors, and more particularly to passive heat systems configured to remove heat from a microreactor. [Summary of the Invention] [Means for Solving the Problems]

[0004] In various embodiments, a housing assembly configured to accommodate a nuclear reactor is disclosed. The housing assembly includes a plurality of modular walls and a passive temperature control system. The plurality of modular walls are configured to surround the nuclear reactor. The plurality of modular walls includes a first modular wall. The passive temperature control system is coupled to the first modular wall. The passive temperature control system is configured to transfer heat between the nuclear reactor and the area surrounding the housing assembly.

[0005] In various embodiments, a kit for housing a nuclear reactor is disclosed. The kit includes a plurality of modular walls, a first passive temperature control system, and a second passive temperature control system. The plurality of modular walls are configured to be interconnected and surround the reactor. The plurality of modular walls include a first modular wall and a second modular wall configured to be detachably connected to the first modular wall. The first passive temperature control system is connected to the first modular wall. The first passive temperature control system is configured to transfer heat between the reactor and the area surrounding the interconnected modular walls. The second passive temperature control system is connected to the second modular wall. The second passive temperature control system is configured to transfer heat between the reactor and the area surrounding the interconnected modular walls.

[0006] In various embodiments, housing assemblies configured to house a nuclear reactor are disclosed. The housing assembly includes a modular sidewall assembly, a modular roof assembly, a modular base assembly, and a passive temperature control system connected to one of the modular sidewall assembly, modular roof assembly, or modular base assembly. The modular sidewall assembly includes a plurality of modular sidewalls that are detachably connected. The modular sidewall assembly, modular roof assembly, and modular base assembly are configured to connect to each other to enclose the nuclear reactor. The passive temperature control system is configured to transfer heat between the nuclear reactor and the area surrounding the housing assembly.

[0007] The various features of the embodiments described herein, along with their advantages, will be understood in accordance with the following description made in conjunction with the accompanying drawings. [Brief explanation of the drawing]

[0008] [Figure 1] This shows a micro-nuclear reactor placed inside a shipping container. [Figure 2]This diagram shows a cross-section of a micro-reactor inside a transport container, along with a conceptual design of a decay heat removal system. [Figure 3] This figure shows a housing assembly according to at least one aspect of the present disclosure, configured to house a heat source and passively remove heat therefrom. [Figure 4A] This is an external view of the modular wall of the housing assembly of Figure 3, relating to at least one aspect of the present disclosure. [Figure 4B] This is an inside view of the modular wall of Figure 4A, relating to at least one aspect of the present disclosure. [Figure 5A] This is an external view of another modular wall of the housing assembly of Figure 3, relating to at least one aspect of the present disclosure. [Figure 5B] This is an inside view of the modular wall of Figure 5A, relating to at least one aspect of the present disclosure. [Figure 6A] This figure shows a modular roof assembly connected to the housing assembly of Figure 3, relating to at least one aspect of the present disclosure. [Figure 6B] This is a side view of the modular roof assembly shown in Figure 6A, relating to at least one aspect of the present disclosure. [Figure 7] This figure shows another housing assembly according to at least one aspect of the present disclosure, configured to house a heat source and passively remove heat therefrom. [Figure 8] This figure shows another housing assembly according to at least one aspect of the present disclosure, configured to house a heat source and passively remove heat therefrom. [Figure 9] This figure shows a loop-type thermosiphon system usable with a housing assembly that passively removes heat from a heat source, according to at least one aspect of the present disclosure. [Figure 10] This figure shows a reflector configured to direct and amplify heat from a heat source toward an evaporator section of a passive temperature control system, relating to at least one aspect of the present disclosure. [Figure 11]This figure shows a method for assembling a housing assembly according to at least one aspect of the present disclosure. [Figure 12] This figure shows a kit comprising multiple modular walls of a housing assembly according to at least one aspect of the present disclosure.

[0009] In some figures, corresponding reference numerals indicate corresponding parts. The examples described herein illustrate various embodiments of the invention in some manner, and such examples should not be construed as limiting the scope of the invention in any way.

[0010] (Detailed explanation) Numerous specific details are provided to enable a full understanding of the overall structure, function, manufacture, and use of the embodiments described herein and shown in the accompanying drawings. Well-known operations, parts, and elements are not described in detail so as not to obscure the embodiments described herein. The reader will understand that the embodiments described and illustrated herein are non-limiting examples, and therefore certain structural and functional details disclosed herein may be representative and illustrative. Modifications and changes may be made without departing from the claims.

[0011] The electricity energy market can be divided into centralized and decentralized. The centralized market is based on large-scale generators (ranging in the hundreds of MWe range) and high-capacity, high-density transmission and distribution networks. The decentralized market, or off-grid market, instead relies on smaller generators (less than 15 MWe), typically connected to smaller local distribution networks or microgrids. Currently, remote arctic communities, remote mines, military bases, and island communities are examples of decentralized markets. Currently, energy for off-grid markets is primarily supplied by diesel generators. This leads to high electricity prices, reliance on fossil fuels, load limitations, complex fuel supply logistics, and aging infrastructure. The demanding requirements of the off-grid market include affordability, reliability, flexibility, resilience, sustainability (clean energy), energy security, rapid installation, and minimal maintenance. All of these requirements can be addressed by nuclear energy.

[0012] A micro-reactor is a nuclear reactor with a power generation capacity of less than 10 MWe that can be deployed in remote locations. Such micro-reactors can be housed in relatively small containers, can operate without active human intervention, and can operate for longer periods without refueling / replacement than conventional nuclear power plants. One such micro-reactor is the eVinci micro-reactor system designed by Westinghouse Electric. Other examples of micro-reactors are described in the jointly owned U.S. Provisional Application Publication No. 62 / 984,591, entitled "HIGH TEMPERATURE HYDRIDE MODERATOR ENABLING COMPACT AND HIGHER POWER DENSITY CORES IN NUCLEAR MICRO-REACTORS," and U.S. Patent Application Publication No. 14 / 773,405, entitled "MOBILE HEAT PIPE COOLED FAST REACTOR SYSTEM," both of which are incorporated herein by reference in their entirety.

[0013] Microreactors are designed to be transportable via conventional transportation methods, for example, in a CONEX ISO container. These designs typically utilize the ISO 668 shipping container shown in Figure 1.

[0014] The decay heat of a microreactor must be self-regulating, and a passive decay heat removal system is required to ensure "walkaway" safety. Decay heat removal systems can significantly impact the overall size and weight of the transport packaging for a microreactor.

[0015] Referring now to Figure 2, there is shown a cross-sectional view of a microreactor 100 disposed within a shipping container 101. The microreactor 100 includes a monolith core block 102 housed within a reactor canister 104. The monolith core block 102 may include a core 106 comprising a plurality of core blocks 108 and a plurality of reactor shutdown modules 110. The monolith core block 102 is surrounded by a plurality of control drums 112, each of the control drums comprising a neutron absorbing section 114 and a neutron reflecting section 116. The monolith core block 102 and the core 106 described above are described in further detail in commonly owned U.S. Provisional Patent Application Publication No. 62 / 984,591, which is incorporated herein by reference in its entirety.

[0016] The microreactor 100 may further include a neutron shield 118 and a gamma ray shield 120 disposed around the reactor canister 104 of the monolith core block 102. An air gap 122 may be defined between the reactor canister 104 and the neutron shield 118.

[0017] With continued reference to FIG. 2, a conceptual design of a decay heat removal system is shown. An air flow, indicated by the divided arrows, is guided by natural convection through the air gap 122 around the outer edge of the reactor canister 104. However, this decay heat removal system method requires a considerable geometric footprint. Furthermore, the small transport container 101 requires complex inlet channels, or ducts 124 that guide the air flow around the reactor canister 104 to a tall chimney, or outlet ducts 126 to generate sufficient buoyant flow.

[0018] As shown in the conceptual design of FIG. 2, the geometric constraints of a microreactor limit the available space for installing a passive air cooling system that utilizes buoyancy-driven air flow paths and natural convection. Furthermore, the design of the external chimney 126 for promoting air flow increases the target size, thereby impairing the safety of the microreactor 100 against external threats. If the chimney 126 is damaged, the air flow may be obstructed, leading to a reduction in cooling effect. These issues may potentially place the microreactor 100 in a potentially unsafe condition. For operational transients and design basis events (DBE), high heat flux, high flow rate, and large surface area are required to remove sufficient heat from the microreactor, and these cannot be obtained with the typical configurations shown in FIG. 1 and FIG. 2.

[0019] In one aspect, the dynamic response of a self-regulating nuclear reactor resulting from transients or accidents may depend on the heat capacity of the system. A passive heat removal system, if properly designed, can act to dampen the thermal response of the system. This can be achieved without requiring operator action / intervention. To support the self-regulation of a microreactor, in addition to the heat flux capability of the passive heat removal system, additional heat capacity is required to absorb heat during transients and accidents.

[0020] Due to the characteristics of high temperature, high heat flux, and small length scale of microreactors, natural convection in the passive heat removal mode is extremely poor (heat flux 2,000 W / m 2(On the order of magnitude). Natural convection is primarily characterized by the Grashof number, which is a direct function of the length scale (cubed) linked to fluid buoyancy and inversely proportional to viscosity (squared). The length scale of a micro reactor is on the order of magnitude, and since the viscosity of gases generally increases with temperature, the Grashof number is relatively low (and therefore the turbulence level is also low). The resulting heat removal is suitable for high-power micro reactors (heat flux of 50,000 W / m³). 2 We cannot support orders that may be placed in this manner.

[0021] Another passive approach involves employing evaporative cooling for microreactors using a water film applied to the shielding or containment structure of the microreactor via a gravity drain tank. While this heat removal mode can support passive heat removal for high-power microreactors, it imposes severe space and weight constraints to support the mobility and transportability of the microreactor.

[0022] Another passive approach involves employing thermal radiation cooling to the surrounding environment. This mode can support high-power micro-reactors at high temperatures (on the order of several hundred degrees Celsius). When a mobile micro-reactor is transported in a shipping container, a single layer of thermal shielding can support a sufficiently high heat flux through thermal radiation alone (only if the surface emissivity is high).

[0023] However, if a transportable micro-reactor is "housed" within another structure, for example, within another transport container, the net heat removal becomes significantly smaller (e.g., on the order of 1 / (N+1) of the source heat flux, where N is the number of thermal shielding layers). To mitigate this reduction in heat removal, it is prohibited to fully open the side walls of the other transport container, because the shielding function must be maintained for the micro-reactor.

[0024] Therefore, there is a need for a system that can increase heat removal compared to natural convection, is safe, easy to use, and has passive properties. [Modes for carrying out the invention]

[0025] Referring here to Figure 3, a housing assembly 200 according to at least one aspect of the present disclosure is presented. In various embodiments, the housing assembly 200 may include a plurality of interconnectable modular walls 202, 204 that can surround any suitable object from which heat is to be removed. In one exemplary embodiment, the plurality of modular walls 202, 204 may be interconnected to surround a heat source 206. In some embodiments, the heat source may be a reactor located in a transport container, as shown in Figures 1 and 2. In other exemplary embodiments, the plurality of modular walls 202, 204 may be interconnected to surround a heat source not located in a container. Although the housing assembly 200 is illustrated and described as being used to remove heat from a micro-reactor, it should be understood that the housing assembly 200 may be used to remove heat from any suitable object. In one embodiment, the modular walls 202, 204 may, when assembled, provide both thermal and radiative shielding from the heat source 206, and may be designed to physically separate the heat source 206 from the surrounding environment 217 surrounding the housing assembly 200.

[0026] In one embodiment, modular wall 202 may differ from modular wall 204. In one exemplary embodiment, referring to Figure 3, modular wall 202 may be longer than modular wall 204 so that when assembled, the housing assembly 200 can define a rectangle, and as a result, the housing assembly 200 can accommodate a rectangular container and heat source. In various embodiments, modular walls 202, 204 may be the same size so that the housing assembly 200 can define a square. In various embodiments, modular walls 202, 204 may be any suitable size so that the housing assembly 200 can define any suitable shape for accommodating any type of heat source in which heat needs to be removed. In various embodiments, modular walls 202, 204 may be curved so that when modular walls 202, 204 are interconnected, the housing assembly 200 can define a circle, as will be described in more detail below.

[0027] In various embodiments, each of the modular walls 202, 204 may be a wall assembly including first wall segments 208a, 208b, second wall segments 210a, 210b, and third wall segments 212a, 212b, the second wall segments 210a, 210b being positioned between the first wall segments 208a, 208b and the third wall segments 212a, 212b. The second wall segments 210a, 210b may be connected to the first wall segments 208a, 208b and the third wall segments 212a, 212b by a plurality of segment couplers 214a, 214b. Although each wall segment is illustrated to be connected by two segment couplers, in various other embodiments, more or fewer segment couplers 214a, 214b may be used. Although each of the modular walls 202, 204 is illustrated to include three wall segments, in various other embodiments, some or all of the modular walls 202, 204 may include more or fewer than three wall segments, for example, two wall segments, four wall segments, or five wall segments. In one embodiment, the wall segments may be detachably connected to a segment coupler so that the modular wall can be further disassembled into individual wall segments.

[0028] In one embodiment, each of the modular walls 202, 204 may define a first outer region 216a, 216b, a second outer region 218a, 218b, and an inner region 220a, 220b. The first outer region 216a, 216b may be defined by the area of ​​the first wall segments 208a, 208b that are exposed to the surrounding environment 217 surrounding the housing assembly 200. Similarly, the second outer region 218a, 218b may be defined by the area of ​​the third wall segments 212a, 212b that are exposed to the surrounding environment 217 surrounding the housing assembly 200. Furthermore, the inner region 220a, 220b may be defined by the area of ​​the second wall segments 210a, 210b that are exposed to a heat source 206 within the housing assembly 200 and have a direct form factor with respect to the heat source 206. In various embodiments, the first outer regions 216a, 216b and the second outer regions 218a, 218b may be substantially similar in size. In various other embodiments, the first outer regions 216a, 216b and the second outer regions 218a, 218b may be different in size. In one embodiment, the first outer regions 216a, 216b and the second outer regions 218a, 218b may be defined based on the position of the second wall segments 210a, 210b relative to the first wall segments 208a, 208b and the third wall segments 212a, 212b.

[0029] As mentioned above, the modular walls 202 and 204 are interconnectable to surround the heat source 206. In various embodiments, the modular wall 202 may include a first wall coupler 222 extending from the first wall segment 208a and the third wall segment 212a. Furthermore, the modular wall 204 may include a second wall coupler 224 extending from the first wall segment 208b and the third wall segment 212b. In one embodiment, the second wall coupler 224 may engage with the first wall coupler 222 to connect the modular walls 202 and 204 and further facilitate the assembly of the housing assembly 200. In various embodiments, the wall couplers 222 and 224 may include alignment surfaces so that the modular walls 202 and 204 are properly aligned when assembling the housing assembly 200. In various embodiments, the wall couplers 222, 224 may utilize active connections between the modular walls 202, 204 (e.g., pin alignment, nesting blocks, snap configurations, latch configurations, etc.) to enable the interconnection of the modular walls 202, 204 and the formation of the housing assembly 200. It should be understood that while the wall couplers 222, 224 can interconnect the modular walls and maintain the shape of the housing assembly 200, it is also possible to disassemble the modular walls 202, 204 into individual modular walls 202, 204. In various embodiments, the wall coupler 224 may include a flexible coupler arm that can bend to hold the modular wall 204 against the modular wall 202 and capture the wall coupler 222.

[0030] In various embodiments, each of the modular walls 202, 204 may include a passive temperature control system 230 that is detachably connected to the modular wall. The passive temperature control system 230 can transfer heat between the heat source 206 and the surrounding environment 217 surrounding the housing assembly 200, as will be described in more detail below. In some embodiments, only a selected number of the modular walls 202, 204 may include the passive temperature control system 230. In one embodiment, the passive temperature control system 230 may be a component independent of the modular walls 202, 204 and the heat source 206, so that one passive temperature control system can be removed and replaced with another passive temperature control system 230. In various embodiments, the passive temperature control system 230 may be incorporated into the modular walls 202, 204 such that the shielding material of the modular walls 202, 204 functions as a surface area for heat collection / heat distribution and provides the passive temperature control system 230 with a thermal barrier, a radiation barrier, and a protective barrier. In various embodiments, the modular walls 202, 204 may include more than one passive temperature control system 230, for example, two or more separate passive temperature control systems. In various embodiments, each wall segment of the modular wall may include its own passive temperature control system, as described elsewhere in this specification.

[0031] In one embodiment, the passive temperature control system 230 may comprise a plurality of heat pipes 232. A heat pipe is a sealed two-phase heat transfer component used to transfer heat from its primary location (evaporator section) to at least one secondary location (condenser section). The heat pipe further comprises a working fluid (e.g., water, liquid potassium, sodium, alkali metals, methane) and a wick placed therein. During operation, the working fluid can absorb heat and evaporate in the evaporator section. Saturated vapor with latent heat of vaporization flows through the adiabatic section of the heat pipe toward the condenser section. In the condenser section, the vapor condenses into a liquid reservoir, releasing latent heat. The condensed liquid is returned to the evaporator section through the wick by capillary action. The phase change process and two-phase flow circulation continue as long as the temperature gradient between the evaporator section and the condenser section is maintained. Because the heat transfer coefficients of evaporation and condensation are very high, the heat pipe is a very effective heat conductor. Exemplary heat pipes for nuclear applications are described in U.S. Patent No. 5,684,848, U.S. Patent No. 6,768,781, and U.S. Patent Publication No. 2016 / 0027536, U.S. Patent Application No. 16 / 853,270, U.S. Patent Application No. 16 / 853,345, and U.S. Provisional Patent Application No. 63 / 012,725, all of which are incorporated herein by reference in their entirety.

[0032] In one embodiment, each of the heat pipes 232 may extend from a first position on the modular walls 202, 204 to a second position on the modular walls 202, 204. In one exemplary embodiment, referring to Figure 3, each of the plurality of heat pipes 232 may be connected to the modular walls 202, 204 such that each of the heat pipes 232 extends from a first outer region 216a, 216b through segment couplers 214a, 214b and inner regions 220a, 220b to a second outer region 218a, 218b. Each of the first ends of the plurality of heat pipes 232 may be connected to first wall segments 208a, 208b at first mounting pins 234a, 234b, and the second ends of the plurality of heat pipes may be connected to second wall segments 212a, 212b at second mounting pins 236a, 236b.

[0033] In one embodiment, each of the heat pipes 232 may include a central evaporator section 238 located in the inner regions 220a, 220b, a first condenser section 240 in the first outer regions 216a, 216b, and a second condenser section 242 in the second outer regions 218a, 218b of the modular walls 202, 204. In one embodiment, the central evaporator section 238 may be on the surface of the heat source 206 and may have a direct orientation factor with respect to the heat source 206. During operation, heat released from the heat source 206 can be absorbed by the working fluid in the evaporator section 238 of the heat pipe 232 and evaporated. Saturated vapor with latent heat of vaporization may flow to either the first or second condenser sections 240, 242 of the heat pipe 232 located in the first outer regions 216a, 216b and the second outer regions 218a, 218b of the modular walls 202, 204. In condenser sections 240 and 242, vapor condenses into liquid reservoirs, releasing its latent heat into the ambient environment 217 surrounding the housing assembly 200. The condensed liquid in the heat pipes can return to the evaporator section 238 through the wick of the heat pipe 232 by capillary action. The phase change process and two-phase flow circulation continue as long as the temperature gradient between the evaporator section 238 (based on the temperature of the heat source 206 in the housing assembly 200) and the condenser sections 240 and 242 (based on the temperature of the ambient environment 217 surrounding the housing assembly 200) is maintained.

[0034] Various wicking surfaces (grooved, ribbed, extruded, meshed, etc.) may be used in the design of the heat pipe 232. As mentioned above, the evaporator section 238 of the heat pipe 232 may have a direct form factor relative to the heat source 206, thereby increasing the heat pipe 232's ability to transfer heat from the heat source 206 within the housing assembly 200 to the surrounding environment 217. In one embodiment, the heat pipe 232 may function as an inducer for removing heat from the housing assembly 200 and may be integrated with modular walls 202, 204 that provide a thermal and radiant barrier from the internal heat source 206. Depending on the cooling requirements of the system driven by natural convection, grooved, ribbed, extruded, or fitted wicks may be used in the evaporator section 238 of the heat pipe 232 to meet those cooling requirements. Furthermore, to improve the meager heat transfer due to natural convection alone, the shape factor and surface area of ​​both the evaporator section 238 and the condenser sections 240, 242 of the heat pipe 232 may be maximized to significantly increase the amount of heat flux by radiative heat transfer. In various embodiments, this can be achieved by incorporating the heat pipe 232 into the modular walls 202, 204 themselves, or by using independent collection / distribution plates mechanically connected to the heat pipe 232.

[0035] The housing assembly 200 presented above provides a passive temperature control system 230 that offers the ability to transfer large amounts of heat without the need for mechanical connection to a heat source (i.e., heat source 206). This is achieved by using radiant heat transfer, as opposed to forced flow which facilitates heat transfer. The passive nature of this system eliminates the need for active components, increasing reliability and minimizing maintenance. The continuous availability of the system improves the self-regulating aspects of micro-reactor design.

[0036] While four modular walls 202, 204 are illustrated and described, it should be understood that any number and combination of modular walls and wall segments may be used to surround and completely enclose the heat source 206. For example, with reference hereto to Figures 6A and 6B, a modular roof assembly 250 according to at least one aspect of the present disclosure is provided. In one aspect, the modular roof assembly 250 may be substantially similar to the modular walls 202, 204. In one aspect, the modular roof assembly 250 may be used together with the modular walls 202, 204 to further enclose the heat source 206 within the housing assembly 200. In one aspect, as shown in Figures 6A and 6B, the modular roof assembly 250 may be detachably connected to the modular walls 202, 204 to further enclose the heat source 206 within the housing assembly 200. In various embodiments, a modular base assembly substantially similar to the modular roof assembly 250 may be provided, which can be connected to modular walls 202, 204 on the side of the housing assembly 200 opposite to the modular roof assembly 250. In one embodiment, the modular walls 202, 204, the modular roof assembly 250, and the modular base assembly may together define the housing assembly 200, which encloses the heat source 206.

[0037] In one embodiment, each of the modular roof assembly 250 and the modular base assembly may include a wall coupler for detachably connecting the modular roof assembly 250 and the modular base assembly to the modular walls 202, 204. In one embodiment, the wall coupler may be similar to wall couplers 222, 224 and other wall couplers described elsewhere in this specification. In various other embodiments, the wall coupler may be any suitable coupler that can detachably connect the modular roof assembly 250 and the modular base assembly to the modular walls 202, 204.

[0038] In various embodiments, the modular roof assembly 250 may include a first wall segment assembly 252, a second wall segment assembly 254, and a third wall segment assembly 256, the second wall segment assembly 254 being positioned between the first wall segment assembly 252 and the third wall segment assembly 256.

[0039] In one embodiment, the first wall segment assembly 252 may include a first wall segment 252a and a second wall segment 252b connected to the first wall segment 252a by a plurality of segment couplers 252c. The first wall segment 252a may define an outer region 260 exposed to the surrounding environment 217 surrounding the housing assembly 200, and the second wall segment 252b may define an inner region 262 exposed to a heat source within the housing assembly 200. In various embodiments, the first wall segment assembly 252 may include a passive temperature control system 264 extending from the outer region 260 to the inner region 262, capable of transferring heat between a heat source 206 within the housing assembly 200 and the surrounding environment 217 surrounding the housing assembly 200. In one embodiment, the passive temperature control system 264 may be similar to other passive temperature control systems described herein, for example, passive temperature control system 230.

[0040] Similar to the first wall segment assembly 252, in one embodiment the third wall segment assembly 256 may include a first wall segment 256a and a second wall segment 256b connected to the first wall segment 256a by a plurality of segment couplers 256c. The first wall segment 256a may define an outer region 266 exposed to the surrounding environment 217 surrounding the housing assembly 200, and the second wall segment 256b may define an inner region 268 exposed to a heat source 206 within the housing assembly 200. In various embodiments, the third wall segment assembly 256 may include a passive temperature control system 270 extending from the outer region 266 to the inner region 268, which can function to transfer heat between the heat source 206 within the housing assembly 200 and the surrounding environment 217 surrounding the housing assembly 200. In one embodiment, the passive temperature control system 270 may be the same as other passive temperature control systems described herein, for example, passive temperature control systems 230, 264.

[0041] In various embodiments, the second wall segment assembly 254 may include a first wall segment 254a, a second wall segment 254b, and a third wall segment 254c, with the second wall segment 254b positioned between the first wall segment 254a and the third wall segment 254c. In one embodiment, the first wall segment 254a and the third wall segment 254c may be connected to the second wall segment 254b by a plurality of segment couplers 254d. In various embodiments, the first wall segment assembly 252 and the third wall segment assembly 256 may be connected to the second wall segment assembly 254 by a plurality of segment couplers 254e. The first wall segment 254a and the third wall segment 254c may define a first outer region 272 and a second outer region 274, respectively, that are exposed to the surrounding environment 217 surrounding the housing assembly 200, and the second wall segment 254b may define an inner region 276 that is exposed to a heat source 206 within the housing assembly 200. In various embodiments, the second wall segment assembly 254 extends from the first outer region 272 through the inner region 276 to the second outer region 274 and may include a passive temperature control system 278 that can function to transfer heat between the heat source 206 within the housing assembly 200 and the surrounding environment 217 surrounding the housing assembly 200. In one embodiment, the passive temperature control system 278 may be similar to other passive temperature control systems described herein, such as passive temperature control systems 230, 264, and 270.

[0042] As described above, each of the first, second, and third wall segment assemblies 252, 254, and 256 of the modular roof assembly 250 may include its own independent passive temperature control systems 264, 270, and 278. By using multiple passive temperature control systems in each wall segment assembly, the ability of the system to transfer heat between the heat source 206 and the surrounding environment 217 can be increased. For example, the modular roof assembly 250 may include four outer regions 260, 266, 272, and 274, so that it can provide four spaced-out, distinct locations from which heat can be distributed to the surrounding environment 217 surrounding the housing assembly 200. Although three segment assemblies having four outer regions are illustrated and described, in various other embodiments the modular roof assembly may include more or fewer segment assemblies and more or fewer than four outer regions. In one embodiment, the passive temperature control systems 264, 270, and 278 of the modular roof assembly 250 may be similar to other passive temperature control systems described elsewhere in this specification, such as passive temperature control system 230. In various embodiments, the modular base assembly may be substantially similar to the modular roof assembly 250 and the modular walls 202 and 204. In various other embodiments, the modular base assembly may not include one or more passive temperature control systems in embodiments where the modular base assembly is not exposed to the ambient environment 217.

[0043] Referring now to Figure 7, another housing assembly 300 according to at least one aspect of the present disclosure is presented. In various embodiments, the housing assembly 300 may be substantially similar to the housing assembly 200, except for differences which are described below herein (similar reference numerals are used in the figures to indicate these similarities).

[0044] Similar to the housing assembly 200, each of the modular walls 202, 204 may include a passive temperature control system 330 comprising a plurality of heat pipes 332a, 332b. The plurality of heat pipes 332a, 332b may include a first group of heat pipes 332a and a second group of heat pipes 332b. As shown in Figure 7, the first group of heat pipes 332a may be connected to first pins 334a, 334b ​​of the first wall segments 208a, 208b, extending from the first outer region 216a, 216b to the inner region 220a, 220b, and connected to the first faces of common pins 335a, 335b of the second wall segments 210a, 210b. Similarly, the second group 332b of the heat pipe may be connected to the second pins 336a, 336b of the third wall segments 212a, 212b, extending from the second outer region 218a, 218b to the inner region 220a, 220b, and connected to the second face of the common pins 335a, 335b of the second wall segments 210a, 210b.

[0045] In one embodiment, each of the heat pipes of the first group 332a and the second group 332b includes one evaporator section 338 and one condenser section 340, 342. In one embodiment, the first group 332a of heat pipes is connected to the first face of the common pins 335a, 335b and the second group 332b of heat pipes is connected to the second face of the common pins 335a, 335b such that the evaporator sections 338 of the heat pipes 332a, 332b do not overlap. In other words, the first group 332a of heat pipes is connected to the common pins 335a, 335b at a position closer to the first outer region 216a, 216b than to the second outer region 218a, 218b. Similarly, the second group 332b of the heat pipes is connected to common pins 335a and 335b at a position closer to the second outer regions 218a and 218b than to the first outer regions 216a and 216b.

[0046] During operation, the heat released from the heat source 206 can be absorbed by the working fluid and evaporated in the evaporator sections 338 of the first group 332a and the second group 332b of the heat pipes. Saturated vapor with latent heat of vaporization flows into the condenser sections 340 and 342 of the heat pipes 332a and 332b, respectively, located in the first outer regions 216a and 216b and the second outer regions 218a and 218b of the modular walls 202 and 204. In the condenser sections 340 and 342, the vapor condenses into liquid reservoirs, releasing its latent heat into the surrounding environment 217 surrounding the housing assembly 300. The condensed liquid in the heat pipes 332a and 332b can return to the evaporator sections 338 through the wicks of the heat pipes 332a and 332b by capillary action. The phase change process and two-phase flow circulation continue as long as the temperature gradient between the evaporator section 338 (based on the temperature of the heat source 206 within the housing assembly 300) and the condenser sections 340 and 342 (based on the temperature of the ambient environment 217 surrounding the housing assembly 300) is maintained.

[0047] By using independent heat pipes 332a and 332b, maintenance of modular walls 202 and 204 becomes easier when it becomes necessary to replace one of the heat pipes 332a or 332b. For example, heat pipe 332a can be replaced while heat pipe 332b remains in use, making it easier to maintain the system's thermal output. Furthermore, if one heat pipe 332a fails to function properly, the degradation of thermal performance can only occur on one side of modular walls 202 and 204. In addition, in various embodiments, the configuration presented above allows for the use of more heat pipes on one side of modular walls 202 and 204 than on the other side of modular wall 204.

[0048] Referring now to Figure 8, another housing assembly 400 according to at least one aspect of the present disclosure is presented. In various embodiments, the housing assembly 400 may be substantially similar to the housing assemblies 200, 300, except for differences which are described later herein (similar reference numerals are used in the figures to indicate these similarities).

[0049] Similar to the housing assemblies 200, 300, each of the modular walls 202, 204 may include a passive temperature control system 430 comprising a plurality of heat pipes 432a, 432b. The plurality of heat pipes 432a, 432b may include a first group of heat pipes 432a and a second group of heat pipes 432b. As shown in Figure 8, the first group of heat pipes 432a may be connected to first pins 434a, 434b of first wall segments 208a, 208b, extending from first outer regions 216a, 216b to inner regions 220a, 220b, and connected to second pins 435a, 435b of second wall segments 210a, 210b. Similarly, the second group 432b of the heat pipe may be connected to the third pins 436a, 436b of the third wall segments 212a, 212b, extending from the second outer region 218a, 218b to the inner region 220a, 220b, and connected to the fourth pins 437a, 437b of the second wall segments 210a, 210b.

[0050] Similar to the heat pipes 332a and 332b of the housing assembly 300, each of the heat pipes of the first group 432a and the second group 432b may include one evaporator section 438 and one condenser section 440, 442. In one embodiment, the first group 432a of the heat pipes is connected to the second pins 435a, 435b and the second group 432b of the heat pipes is connected to the fourth pins 437a, 437b, such that the evaporator sections 438 of the heat pipes 432a and 432b overlap. In other words, the first group 432a of the heat pipes is connected to the second pins 435a, 435b at a position closer to the second outer region 218a, 218b than to the first outer region 216a, 216b. Similarly, the second group 432b of the heat pipe is connected to the fourth pins 437a, 437b at a position closer to the first outer regions 216a, 216b than to the second outer regions 218a, 218b.

[0051] During operation, the heat released from the heat source 206 can be absorbed by the working fluid and evaporated in the evaporator sections 438 of the first group 432a and the second group 432b of the heat pipes. Saturated vapor with latent heat of vaporization flows to the condenser sections 440 and 442 of the heat pipes 432a and 432b, respectively, located in the first outer regions 216a and 216b or the second outer regions 218a and 218b of the modular walls 202 and 204. In the condenser sections 440 and 442, the vapor condenses into liquid reservoirs, releasing its latent heat into the surrounding environment 217 surrounding the housing assembly 400. The condensed liquid in the heat pipes 432a and 432b can return to the evaporator sections 438 through the wicks of the heat pipes 432a and 432b by capillary action. The phase change process and two-phase flow circulation continue as long as the temperature gradient between the evaporator section 438 (based on the temperature of the heat source 206 within the housing assembly 400) and the condenser sections 440 and 442 (based on the temperature of the ambient environment 217 surrounding the housing assembly 400) is maintained.

[0052] By using independent heat pipes 432a and 432b, maintenance of the modular walls 202 and 204 becomes easier when it becomes necessary to replace one of the heat pipes 432a or 432b. For example, heat pipe 432a can be replaced while heat pipe 432b remains in use, making it easier to maintain the system's thermal output. Furthermore, if one heat pipe 432a fails to function properly, the degradation of thermal performance can only occur on one side of the modular walls 202 and 204. In addition, in various embodiments, according to the configuration presented above, more heat pipes can be used on one side of the modular walls 202 and 204 than on the other side of the modular wall 204. Furthermore, by using overlapping evaporator sections 438, the amount of surface area that the evaporator sections 438 of heat pipes 432a and 432b can cover in the inner regions 220a and 220b increases, thereby improving the thermal performance of the passive temperature control system 430. In one embodiment, the heat pipe 432a may be connected to the second pins 435a, 435b such that the evaporator section 438 extends along the entire length of the inner regions 220a, 220b. Similarly, the heat pipe 432b may be connected to the fourth pins 437a, 437b such that the evaporator section 438 extends along the entire length of the inner regions 220a, 220b.

[0053] Referring now to Figure 9, a loop-type thermosiphon system 500 according to at least one aspect of the present disclosure is presented. In one aspect, the loop-type thermosiphon system 500 may have similar features to the loop-type thermosiphon described in U.S. Provisional Patent Application No. 63 / 018,539, which is incorporated herein by reference in its entirety.

[0054] In various embodiments, the loop-type thermosiphon system 500 may be a closed-loop system and may include an evaporator section 502, a first condenser section 504 fluidly connected to the evaporator section 502, and a second condenser section 506 fluidly connected to the evaporator section 502. The loop-type thermosiphon system 500 may further include a working fluid or medium (e.g., water, liquid potassium, sodium, alkali metals, methane) capable of transferring decay heat from the evaporator section 502 to the condenser sections 504, 506. Similar to a heat pipe, during operation, heat released from a heat source is absorbed by the working fluid in the evaporator section 502 of the loop-type thermosiphon system 500. Saturated vapor with latent heat of vaporization flows through the upper passages 508, 510 to the condenser sections 504, 506. In the condenser sections 504, 506, the vapor condenses into a liquid reservoir, releasing its latent heat into the surrounding environment. The condensed liquid in the condenser sections 504, 506 then returns to the evaporator section 502 through the lower channels 512, 514. In one embodiment, the lower channels 512, 514 may include wicks for transferring heat from the condenser sections 504, 506 to the evaporator section 502. The phase change process and two-phase flow circulation continue as long as the temperature gradient between the evaporator section 502 and the condenser sections 504, 506 is maintained. Similar to heat pipes, the loop-type thermosiphon system 500 may have a passive nature. In various embodiments, the loop-type thermosiphon system 500 can provide substantially the same advantages as those of heat pipes described elsewhere in this specification.

[0055] In various embodiments, the housing assemblies 200, 300, 400 may include a loop-type thermosiphon system 500 instead of or in addition to heat pipes. In other words, passive temperature control systems disclosed elsewhere in this specification may include a loop-type thermosiphon system 500. In one embodiment, the evaporator section 502 of the loop-type thermosiphon system 500 may be located in the inner region of the housing assembly, the first condenser section 504 may be located in the first outer region of the housing assembly, and the second condenser section 506 may be located in the second outer region of the housing assembly. The loop-type thermosiphon system 500 can function substantially similarly to a heat pipe in that heat is absorbed by the evaporator section 502 in the inner region, and the evaporated working fluid can move (through the upper passages 508, 510) to the condenser sections 504, 506 to release latent heat into the ambient environment 217. In one embodiment, the configuration of the loop-type thermosiphon system 500 may need to be installed in a specific orientation (vertical orientation) in order to function properly (so that the vaporized steam in the evaporator section 502 can flow upward and through the upper passages 508, 510). In various embodiments, the evaporator section 502 may be routed vertically toward the condenser sections 504, 506, as shown in Figure 9.

[0056] In one embodiment, heat transfer between condenser sections 504, 506 and the ambient environment 217 may be enhanced. In various embodiments, the surface area of ​​condenser sections 504, 506 may be increased to enhance heat transfer between the ambient environment 217 and condenser sections 504, 506. In various embodiments, condenser sections 504, 506 may include finned heat exchangers capable of increasing the amount of heat transferred from condenser sections 504, 506 to the ambient environment 217. In various other embodiments, to improve the effectiveness of the design, heat removal from the system may be enhanced by utilizing an inducing means of flowing air over condenser sections 504, 506 or mist evaporation.

[0057] While the loop-type thermosiphon system 500 illustrates one evaporator section 502 and two condenser sections 504, 506, various other loop-type thermosiphon systems 500 are envisioned in this disclosure. In one embodiment, the loop-type thermosiphon system 500 may include two spaced-apart, separate evaporator sections 502 in the inner region, each of which connects to an independent evaporator section in the outer region of the housing assembly. In one embodiment, for versatility, the loop-type thermosiphon system 500 may include a variation of the previously described embodiment in which the evaporator tubes are alternately arranged to face the condenser on opposite sides of the modular wall. In one embodiment, the loop-type thermosiphon system 500 may include routing of the evaporator section 502 to a single condenser section which may be located at any suitable location in the housing assembly, for example, one of the outer regions of the modular wall. In one embodiment, the loop-type thermosiphon system 500 may include an evaporator chamber instead of the individual tubes of the evaporator section 502.

[0058] Referring now to Figure 10, a modular wall 202 and a heat source 206 according to at least one aspect of the present disclosure are presented. In one aspect, the modular wall 202 and heat source 206 may be similar to other modular walls and heat sources disclosed herein. In one aspect, the amount of heat released from the heat source 206 to the evaporator section 238 of the passive temperature control system 230 may be directed and amplified. In various embodiments, a reflector may be positioned between the heat source 206 and the evaporator section 238.

[0059] In one embodiment, the reflector may comprise a parabolic reflector 600 including a reflective section 602 and an insulating section 604 on the opposite side. The parabolic reflector 600 may redirect and amplify the heat emitted from the heat source toward the evaporator section 238, thereby increasing the system's ability to remove heat from within the housing assembly via the passive temperature control system 230. In one embodiment, the reflector may comprise a plate reflector 610 including a reflective section 612 and an insulating section 614 on the opposite side. The plate reflector 610 may redirect and amplify the heat emitted from the heat source toward the evaporator section 238, thereby increasing the system's ability to remove heat from within the housing assembly via the passive temperature control system 230. By using a reflector, it is possible to increase the amount of heat emitted from the heat source 206 toward the evaporator section 238 that is outside the heat source's shape factor. The reflector can redirect heat that might not have reached the evaporator section 238 toward the evaporator section 238. In one embodiment, the heat loss caused by the reflector can be mitigated by using the heat insulating portion of the reflector.

[0060] Referring here to Figure 11, a method 700 for assembling a housing assembly according to at least one aspect of the present disclosure is presented. In one aspect, the method 700 may include preparing a heat source from which heat is to be removed, for example, a heat source 206 702. The method 700 may further include preparing a plurality of modular walls 704. In one aspect, the modular walls may be modular walls 202, 204, a modular roof assembly 250, a modular base assembly, or any other suitable modular wall or segment for defining the housing assembly around a heat source, as described elsewhere in this specification. The method 700 may further include connecting a passive temperature control system to the modular walls 706. In one embodiment, the passive temperature control system may comprise any passive temperature control system, for example, the passive temperature control systems 230, 330, 430 disclosed herein, such as heat pipes 232, 332a, 332b, 432a, 432b, or a loop-type thermosiphon system 500. Method 700 may further include interconnecting a plurality of modular walls 708 around a heat source. In one embodiment, interconnecting a plurality of modular walls may include interconnecting the modular walls using wall couplers to define a housing assembly in which a heat source is placed. Method 700 may further include passively removing heat from the heat source using a passive temperature control system 710, as described elsewhere in this specification.

[0061] The above disclosure provides an improved method for achieving a higher level of heat removal present in micro reactors utilizing thermal radiation, and a method that significantly improves upon air removal by natural convection of air. To meet the required level, increasing the heat transfer shape factor and maximizing the heat transfer surface area are essential to this design. Embodiments of the design of the evaporator and condenser regions of heat pipes and / or loop-type thermosiphons also include incorporating these regions into a shielding material. Thus, the shielding material functions as a surface area for heat collection / heat distribution, as well as providing a thermal barrier, a radioactive barrier, and a protective barrier.

[0062] While the passive temperature control systems presented above were described in the context of transferring heat from within the housing assembly to the surrounding environment, it should be understood that passive temperature control systems may also function in the reverse direction. In other words, passive temperature control systems may transfer heat from the surrounding environment to within the housing assembly. The heat flow within a passive temperature control system may depend on the temperature difference between the inside of the housing assembly and the surrounding environment. If the temperature of the surrounding environment is higher than the temperature inside the housing assembly, the condenser section of a heat pipe and a loop-type thermosiphon may function as an evaporator section, and the evaporator section of a heat pipe may function as a condenser section, resulting in heat being transferred into the housing assembly.

[0063] Although the heat pipes are shown as being positioned horizontally and extending along the modular wall, in other exemplary embodiments the heat pipes may be positioned in other orientations along the modular wall, such as oblique orientations. In other exemplary embodiments, as shown in Figures 3 to 8 as an example, in embodiments where the wall segments are positioned vertically rather than horizontally, the heat pipes may be positioned vertically. Furthermore, although the heat pipes are shown as being positioned within the installation area of ​​the modular wall, in other exemplary embodiments the heat pipes may extend beyond the installation area of ​​the modular wall and further include shape factors and surface areas from which the heat pipes can release heat from within the housing assembly to the surrounding environment.

[0064] While the present invention is not specifically for use in shipping containers, in one embodiment of the modular wall design, as shown in Figure 12, the modular wall is sized to fit inside a shipping container and is provided as a kit for easy transport and installation. As shown in Figure 12, depending on the application in which the housing assembly is used, the modular wall is provided with a different passive temperature control system. The kit illustrated in Figure 12 shows modular walls 202 and 204, but it should be understood that the kit may include any appropriate number of modular walls and wall segments necessary to define the housing assembly around a heat source. In one exemplary embodiment, the kit may include a modular side wall, a modular roof assembly, and a modular base assembly, along with the passive temperature control system for each modular wall. The kit may also include replacement parts in case of damage to modular wall components such as wall segments and wall couplers, or components of the passive temperature control system.

[0065] The above disclosure provides a greater heat removal rate compared to the heat removal rate of passive natural convection cooling paths. By utilizing natural convection with the help of heat pipes and / or loop-type thermosiphons, the effectiveness of cooling is dramatically improved. In one embodiment, the above disclosure removes part of the existing thermal barrier for passive cooling of a micro reactor to increase the shape factor to accommodate the high heat flux of the micro reactor. By implementing a modular wall with this integrated passive cooling means, protective structures, thermal barriers, and radioactive barriers are also provided. This simplifies / reduces the number of components required to provide the cooling and protection required for a micro reactor.

[0066] Passive temperature control systems are designed to achieve heat removal by mechanically connecting to the heat source. The reliability of micro-reactor designs can be enhanced not only by natural convection but also by the self-regulating heat transfer capabilities of heat pipes and / or thermosiphon systems.

[0067] Integrating the cooling method into the modular wall simplifies the operation and installation of the system. The modular wall's interlocking function allows for precise assembly of the housing assembly. As mentioned elsewhere in this specification, the above disclosure enables a housing assembly around any heat or cold source that can benefit from passively transferring heat to or from the surrounding environment. While passive temperature control systems are inherently passive, other embodiments are conceivable in which active components (e.g., fans, blowers, water mist, etc.) may improve the efficiency of the system.

[0068] Various aspects of the subject matter described herein are shown in the following examples.

[0069] Example 1 - A housing assembly configured to house a nuclear reactor, comprising a plurality of modular walls and a passive temperature control system. The plurality of modular side walls are configured to surround the reactor. The plurality of modular walls comprises a first modular wall. The passive temperature control system is connected to the first modular wall. The passive temperature control system is configured to transfer heat between the reactor and the area surrounding the housing assembly.

[0070] Example 2 - The housing assembly according to Example 1, wherein the first modular wall comprises a first outer region exposed to the area surrounding the housing assembly, a second outer region exposed to the area surrounding the housing assembly, and an inner region exposed to the reactor and located between the first outer region and the second outer region.

[0071] Example 3 - A housing assembly according to Example 1 or 2, wherein the passive temperature control system comprises multiple heat pipes.

[0072] Example 4 - The housing assembly according to Example 3, comprising a first heat pipe configured such that multiple heat pipes extend from a first outer region to a second outer region.

[0073] Example 5 - The housing assembly according to Example 3, comprising a first heat pipe configured to extend from a first outer region to a first position within an inner region, and a second heat pipe configured to extend from a second outer region to a second position within an inner region.

[0074] Example 6 - The housing assembly according to Example 5, wherein the first position is located closer to the first outer region than the second outer region, and the second position is located closer to the second outer region than the first outer region.

[0075] Example 7 - An example where the first position is located closer to the second outer region than the first outer region, and the second position is located closer to the first outer region than the second outer region. 5 The housing assembly described above.

[0076] Example 8 - A housing assembly according to any one of Examples 1 to 7, wherein the passive temperature control system comprises a loop-type thermosiphon system.

[0077] Example 9 - The housing assembly according to Example 8, wherein the loop-type thermosiphon system comprises a first outer heat exchange section located in a first outer region, a first inner heat exchange section located in an inner region and in thermal communication with the first outer heat exchange section, a second outer heat exchange section located in a second outer region, and a second inner heat exchange section located in an inner region and in thermal communication with the second outer heat exchange section.

[0078] Example 10 - The housing assembly according to Example 8, wherein the loop-type thermosiphon system comprises a first outer heat exchange section located in a first outer region, a second outer heat exchange section located in a second outer region, and a common inner heat exchange section located in an inner region and in thermal communication with the first and second outer heat exchange sections.

[0079] Example 11 - A housing assembly according to any one of Examples 2 to 10, further comprising a reflector configured to direct heat between the reactor and an inner region.

[0080] Example 12 - A housing assembly according to any one of Examples 1 to 11, further comprising a second modular wall configured to be removably connected to a first modular wall, wherein a plurality of modular walls are further connected to a first modular wall.

[0081] Example 13 - The housing assembly according to Example 12, wherein the passive temperature control system is a first passive temperature control system, and the second modular wall comprises a second passive temperature control system connected to the second modular wall, the second passive temperature control system being configured to transfer heat between the reactor and the area surrounding the housing assembly.

[0082] Example 14 - A housing assembly according to any one of Examples 1 to 13, wherein multiple modular walls are configured to provide thermal and radiation shielding.

[0083] Example 15 - A housing assembly according to any one of Examples 1 to 14, wherein a passive temperature control system is incorporated into a first modular wall.

[0084] Example 16 - A kit for housing a nuclear reactor, comprising a plurality of modular walls, a first passive temperature control system, and a second passive temperature control system. The plurality of modular walls are configured to be interconnected and surround the reactor. The plurality of modular walls comprises a first modular wall and a second modular wall configured to be detachably connected to the first modular wall. The first passive temperature control system is connected to the first modular wall. The first passive temperature control system is configured to transfer heat between the reactor and the area surrounding the interconnected modular walls. The second passive temperature control system is connected to the second modular wall. The second passive temperature control system is configured to transfer heat between the reactor and the area surrounding the interconnected modular walls.

[0085] Example 17 - The kit described in Example 16, wherein the first passive temperature control system comprises multiple heat pipes.

[0086] Example 18 - The kit according to Example 16, wherein the first passive temperature control system comprises a loop-type thermosiphon system.

[0087] Example 19 - A housing assembly configured to house a nuclear reactor, comprising a modular sidewall assembly, a modular roof assembly, a modular base assembly, and a passive temperature control system connected to one of the modular sidewall assembly, modular roof assembly, or modular base assembly. The modular sidewall assembly comprises a plurality of modular sidewalls that are detachably connected. The modular sidewall assembly, modular roof assembly, and modular base assembly are configured to be connected to each other to enclose the nuclear reactor. The passive temperature control system is configured to transfer heat between the nuclear reactor and the area surrounding the housing assembly.

[0088] Example 20 - Housing assembly according to Example 19, wherein the passive temperature control system comprises a first passive temperature control system, and the housing assembly further comprises a second passive temperature control system connected to one of a modular sidewall assembly, a modular roof assembly, or a modular base assembly, the second passive temperature control system being configured to transfer heat between the reactor and the area surrounding the housing assembly.

[0089] As is evident from the foregoing disclosures, unless otherwise stated, any use of terms such as “processing,” “calculating,” “calculating,” “determining,” and “displaying” throughout the foregoing disclosures should be understood to refer to the operation and processes of a computer system or similar electronic computing device that processes and converts data represented as physical (electronic) quantities in the registers and memory of a computer system into other data represented as physical quantities in the memory or registers of a computer system, or other information storage units, or transmission and display devices.

[0090] One or more components may be referred to herein as "configured to," "configurable to," "operable to," "adaptable to," "capable to," or "adaptable to." Those skilled in the art will recognize that, unless otherwise required by the context, "configured to" generally encompasses active and / or inactive and / or standby components.

[0091] Those skilled in the art will generally recognize that the terms used herein, and especially in the appended claims (e.g., the main body of the appended claims), are intended to be generally “open” terms (for example, the word “includes” should be interpreted as “includes but not limited to,” the word “has” should be interpreted as “has at least,” and the word “includes” should be interpreted as “includes but not limited to”). Those skilled in the art will further understand that if a particular number of claims to be introduced is intended, such intention is explicitly stated in the claim, and if such statement is not made, such intention does not exist. For example, to aid understanding, the following appended claims may use the introductory phrases “at least one” and “one or more” to introduce the claims. However, the use of such phrases should not be interpreted as meaning that the description of the claim introduced by the indefinite article "a" or "an" is intended to limit any particular claim containing such introduced description to only one claim, even if the same claim includes the introductory phrase "one or more" or "at least one" and an indefinite article such as "a" or "an" (for example, "a" and / or "an" should normally be interpreted as meaning "at least one" or "one or more"). The same applies to the definite article used to introduce the description of a claim.

[0092] Furthermore, even if a specific number of claims being introduced is explicitly stated, a person skilled in the art will recognize that such a statement should generally be interpreted as meaning at least the number stated (for example, the plain statement “two statements” without other modifiers usually means at least two, or two or more statements). Moreover, when conventions similar to “at least one of A, B, and C, etc.” are used, such constructions are generally intended to be understood by a person skilled in the art (for example, “a system having at least one of A, B, and C” includes, but is not limited to, systems having only A, only B, only C, A and B, A and C, B and C, and / or A, B and C, etc.). Where conventions similar to “at least one of A, B, or C” are used, such constructions are generally intended to be understood by those skilled in the art (for example, “a system having at least one of A, B, or C” includes, but is not limited to, systems having only A, only B, only C, A and B, A and C, B and C, and / or A, B and C, etc.). As will be further understood by those skilled in the art, disjunct words and / or disjunct phrases presenting two or more alternative words in the specification, claims, or drawings should generally be understood to imply the possibility of including one of the words, either of the words, or both of the words, unless otherwise indicated by the context. For example, the expression “A or B” is generally understood to include the possibilities of “A” or “B,” or “A and B.”

[0093] Those skilled in the art will understand that, with respect to the attached claims, the operations described herein can generally be performed in any order. Furthermore, while various operation flowcharts are shown in sequence, it should be understood that various operations may be performed in orders other than those illustrated, or simultaneously. Examples of such alternative orders include, unless otherwise indicated by the context, overlapping orders, interleaved orders, interrupted orders, reordering, incremental orders, preparatory orders, supplementary orders, simultaneous orders, reverse orders, or other variant orders. Moreover, words such as “according to,” “regarding,” or other past tense adjectives are generally not intended to exclude such variants unless otherwise indicated by the context.

[0094] It should be noted that references to "one aspect," "one example," or "one illustration" mean that a particular feature, structure, or characteristic described in relation to that aspect is included in at least one aspect. Therefore, while expressions such as "in one aspect," "in one aspect," "in one example," and "in one illustration" appear in various parts of this specification, they do not necessarily all refer to the same aspect. Furthermore, a particular feature, structure, or characteristic may be appropriately combined in one or more aspects.

[0095] Any patent applications, patents, non-patent literature, or other disclosures referenced herein and / or included in application data sheets are incorporated herein by reference only to the extent that such materials do not conflict with this Specified. To the extent necessary, disclosures expressly contained herein take precedence over any conflicting materials incorporated herein by reference. Any material or any part thereof that is to be incorporated herein by reference that conflicts with existing definitions, descriptions, or other disclosures contained herein is incorporated only to the extent that it does not create a conflict between the incorporated material and the existing disclosures.

[0096] "To have" (and any form of "to have," such as "has had" or "is having"), "to possess" (and any form of "to possess," such as "has had" or "is having"), "to include" (and any form of "to include," such as "has included" or "is including"), and "to contain" (and any form of "to contain," such as "has contained" or "is containing") are open-ended linking verbs. As a result, a system that "has," "has," "includes," or "contains" one or more elements possesses, but is not limited to possessing only, those one or more elements. Similarly, an element of a system, device, or apparatus that "has," "has," "includes," or "contains" one or more features possesses, but is not limited to possessing only, those one or more features.

[0097] As used in this disclosure, the terms “substantially,” “approximately,” or “about,” unless otherwise specified, mean an acceptable error of a particular value as determined by a person skilled in the art, which depends in part on how the value is measured or determined. In certain embodiments, the terms “substantially,” “approximately,” or “about,” mean within one, two, three, or four standard deviations. In certain embodiments, the terms “substantially,” “approximately,” or “about,” mean within 50%, 20%, 15%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, or 0.05% of a given value or range.

[0098] In summary, numerous advantages arising from adopting the concepts described herein have been described. The above descriptions of one or more forms are presented for illustrative and explanatory purposes and are not intended to be exhaustive or limited to the exact forms disclosed. Modifications or alterations are possible in light of the above teachings. One or more forms have been selected to illustrate the principle and practical application, thereby enabling those skilled in the art to utilize the various forms with various modifications to suit a particular intended use. The claims submitted herein are intended to define the overall scope.

Claims

1. A housing assembly configured to house a nuclear reactor, It is configured to surround the reactor and comprises a plurality of modular walls, each having a first modular wall, The system comprises a passive temperature control system connected to the first modular wall and configured to transfer heat between the reactor and the area surrounding the housing assembly, The first modular wall, A first outer region exposed to the area surrounding the housing assembly, A second outer region exposed to the area surrounding the housing assembly, The reactor is exposed and comprises an inner region located between the first outer region and the second outer region, Housing assembly.

2. The passive temperature control system comprises a plurality of heat pipes. The housing assembly according to claim 1.

3. The plurality of heat pipes include a first heat pipe configured to extend from the first outer region to the second outer region. The housing assembly according to claim 2.

4. The aforementioned plurality of heat pipes A first heat pipe configured to extend from the first outer region to a first position in the inner region, The system comprises a second heat pipe configured to extend from the second outer region to a second position in the inner region, The housing assembly according to claim 2.

5. The first position is located closer to the first outer region than the second outer region, The second position is located closer to the second outer region than the first outer region. The housing assembly according to claim 4.

6. The first position is located closer to the second outer region than to the first outer region. The second position is located closer to the first outer region than to the second outer region. The housing assembly according to claim 4.

7. The passive temperature control system includes a loop-type thermosiphon system. The housing assembly according to claim 1.

8. The aforementioned loop-type thermosiphon system A first outer heat exchange section is located in the first outer region, A first inner heat exchange section is located in the inner region and is in thermal communication with the first outer heat exchange section, A second outer heat exchange section is located in the second outer region, The system comprises a second inner heat exchange section located in the inner region and in thermal communication with the second outer heat exchange section, The housing assembly according to claim 7.

9. The aforementioned loop-type thermosiphon system A first outer heat exchange section is located in the first outer region, A second outer heat exchange section is located in the second outer region, The system comprises a common inner heat exchange section located in the inner region and in thermal communication with the first outer heat exchange section and the second outer heat exchange section, The housing assembly according to claim 7.

10. The system further comprises a reflector configured to direct heat between the reactor and the inner region. The housing assembly according to claim 1.

11. A housing assembly configured to house a nuclear reactor, It is configured to surround the reactor and comprises a plurality of modular walls, each having a first modular wall, The system comprises a passive temperature control system connected to the first modular wall and configured to transfer heat between the reactor and the area surrounding the housing assembly, The plurality of modular walls further comprises a second modular wall configured to be detachably connected to the first modular wall, The passive temperature control system is the first passive temperature control system, The second modular wall is equipped with a second passive temperature control system connected to the second modular wall. The second passive temperature control system is configured to transfer heat between the reactor and the area surrounding the housing assembly. Housing assembly.

12. The plurality of modular walls are configured to provide thermal and radioactive shielding. The housing assembly according to claim 1.

13. The passive temperature control system is incorporated into the first modular wall. The housing assembly according to claim 1.

14. A kit for housing a nuclear reactor, A plurality of modular walls configured to be interconnected and surround the reactor, comprising a first modular wall and a second modular wall configured to be detachably connected to the first modular wall, A first passive temperature control system connected to the first modular wall and configured to transfer heat between the reactor and the area surrounding the interconnected modular wall, The system comprises a second passive temperature control system connected to the second modular wall and configured to transfer heat between the reactor and the area surrounding the interconnected modular wall, kit.

15. The first passive temperature control system comprises a plurality of heat pipes, The kit according to claim 14.

16. The first passive temperature control system includes a loop-type thermosiphon system. The kit according to claim 14.

17. A housing assembly configured to house a nuclear reactor, A modular sidewall assembly comprising multiple modular sidewalls that can be connected in a detachable manner, Modular roof assembly and A modular base assembly wherein the modular side wall assembly, the modular roof assembly, and the modular base assembly are configured to be interconnected to surround the reactor, A passive temperature control system is connected to one of the modular sidewall assemblies, the modular roof assembly, or the modular base assembly, and is configured to transfer heat between the reactor and the area surrounding the housing assembly. Housing assembly.

18. The passive temperature control system comprises a first passive temperature control system, The housing assembly further comprises a second passive temperature control system connected to one of the modular side wall assembly, the modular roof assembly, or the modular base assembly. The second passive temperature control system is configured to transfer heat between the reactor and the area surrounding the housing assembly. The housing assembly according to claim 17.

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