Coin-type contactless information medium and method for manufacturing the same

Abstract

To provide a coin-type non-contact information medium that is highly shock-resistant and enables accurate wireless communication even when a plurality of coin-type contactless information media are placed close to each other.SOLUTION: A coin-type non-contact information medium 10 includes a substrate 110 on which an IC chip is provided, a metal ring 120 including at least one slit portion, and a protective member 130 that covers the substrate and the metal ring. The IC chip is provided in a gap between the slits in the metal ring. The substrate may include a protrusion that fits into the slit portion, and the IC chip may be provided on the protrusion.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] One embodiment of the present invention relates to a coin-type non-contact information medium. One embodiment of the present invention also relates to a method for manufacturing a coin-type non-contact information medium. Background Art

[0002] Non-contact information media such as RFID establish communication connection with a reader / writer via wireless communication, so they do not require contact with the reader / writer and offer high convenience, which has led to increasing demand for such media. Among these, coin-type non-contact information media provided with an IC chip have high security and enable authenticity determination, so they have begun to be used as casino chips (see, for example, Patent Document 1 or Patent Document 2). Prior Art Documents Patent Documents

[0003] Patent Document 1 U.S. Patent No. 6021949 Specification Patent Document 2 U.S. Patent No. 3766452 Specification Summary of the Invention Problem to be Solved by the Invention

[0004] When a coin-type non-contact information medium is used as a casino chip, it is necessary to accurately read information from each of a plurality of coin-type non-contact information media. In addition, since a plurality of casino chips often collide with each other, it is necessary to prevent the IC chip from being damaged due to the collision. In particular, coin-type non-contact information media used as casino chips require weight to provide a high-class feel, and may include a weight member. The impact generated when coin-type non-contact information media including a weight member collide with each other is larger than the impact generated when coin-type non-contact information media not including a weight member collide with each other, so the impact transmitted to the IC chip is also larger.

[0005] One embodiment of the present invention aims to provide a coin-type contactless information medium that has high impact resistance and can perform accurate wireless communication even when multiple coin-type contactless information mediums are in close proximity, in view of the above-mentioned problems. Another embodiment of the present invention aims to provide a method for manufacturing the above-mentioned coin-type contactless information medium. [Means for solving the problem]

[0006] A coin-type contactless information medium according to one embodiment of the present invention includes a substrate on which an IC chip is provided, a metal ring including at least one slit portion, and a protective member covering the substrate and the metal ring, wherein the IC chip is provided in the gap between the slit portions.

[0007] The substrate includes a projection that engages with at least one slit, and the IC chip may be mounted on the projection.

[0008] In a side view, the top surface of the IC chip may be located below the top surface of the metal ring.

[0009] The metal ring may include a stepped portion on its inner side, and the peripheral edge of the substrate may be in contact with the stepped portion.

[0010] The circuit board may also be provided with an antenna and an inductor connected in series with the antenna.

[0011] A coin-type contactless information medium according to one embodiment of the present invention includes a substrate on which an IC chip is provided, a metal ring including at least one slit portion and a first recess recessed inward from the surface, and a protective member covering the substrate and the metal ring, wherein the first recess overlaps the substrate, and the IC chip is located in the space formed by the first recess and the substrate.

[0012] The opening surface of the first recess may be blocked by the substrate.

[0013] The substrate is further provided with an antenna and an inductor connected in series with the antenna, and the metal ring further includes a second recess recessed inward from its surface, and the inductor may be located in the space formed by the second recess and the substrate.

[0014] The substrate is further provided with a capacitor electrically connected in parallel with the IC chip, and the metal ring further includes a third recess recessed inward from its surface, and the capacitor may be located in the space formed by the third recess and the substrate.

[0015] A method for manufacturing a coin-type contactless information medium according to one embodiment of the present invention involves mounting an IC chip on a protruding portion of a substrate, arranging the substrate in a metal ring including at least one slit portion such that the protruding portion fits into at least one slit portion, and forming a protective member that covers the substrate and the metal ring using injection molding.

[0016] In a side view, the substrate may be placed on the metal ring such that the top surface of the IC chip is located below the top surface of the metal ring.

[0017] The substrate may be placed in the metal ring such that its peripheral edge is locked in place by the stepped portion on the inside of the metal ring.

[0018] The method for manufacturing a coin-type contactless information medium may further involve mounting an inductor so as to be connected in series with an antenna formed on the substrate.

[0019] A method for manufacturing a coin-type contactless information medium according to one embodiment of the present invention involves mounting an IC chip on a substrate, arranging a metal ring on the substrate that includes a first recess that is recessed from the surface inward, such that the first recess covers the IC chip, and forming a protective member that covers the substrate and the metal ring using injection molding.

[0020] A metal ring may be placed on the substrate such that the opening surface of the first recess is closed by the substrate.

[0021] In the method for manufacturing a coin-type non-contact information medium, an inductor may further be mounted so as to be connected in series to an antenna formed on a substrate, the metal ring may further include a second recess recessed inward from a surface thereof, and the metal ring may be disposed on the substrate such that the second recess covers the inductor.

[0022] In the method for manufacturing a coin-type non-contact information medium, a capacitor may further be mounted so as to be connected in parallel with an IC chip, the metal ring may further include a third recess recessed inward from a surface thereof, and the metal ring may be disposed on the substrate such that the third recess covers the inductor.

[0023] The inductor may be a chip inductor mounted on the substrate.

Effects of the Invention

[0024] The coin-type non-contact information medium according to an embodiment of the present invention has high impact resistance because it can mitigate impact transmitted to the IC chip. Further, even when a plurality of coin-type non-contact information media are brought close to each other, mutual interference between coils is suppressed, so that changes in the resonance frequency or voltage of the resonance circuit of the coin-type non-contact information medium are small, and accurate wireless communication can be performed. Furthermore, even when a plurality of coin-type non-contact information media are stacked, changes in the resonance frequency of the resonance circuit of each of the plurality of coin-type non-contact information media are small, and a decrease in voltage generated by the coin-type non-contact information medium is suppressed, so that the number of readable coin-type non-contact information media in a reader / writer is improved.

Brief Description of Drawings

[0025] [Figure 1] It is a schematic perspective view showing a coin-type non-contact information medium according to an embodiment of the present invention. [Figure 2] It is a cross-sectional view of a coin-type non-contact information medium according to an embodiment of the present invention. [Figure 3] It is a side view of a substrate and a metal ring of a coin-type non-contact information medium according to an embodiment of the present invention. [Figure 4]This is a top view of the substrate and metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 5] This is an exploded perspective view of the substrate and metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 6] This is a block diagram showing the configuration of an IC chip in a coin-type contactless information medium according to one embodiment of the present invention. [Figure 7] This is a circuit diagram of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 8] This is a flowchart showing a method for manufacturing a coin-type contactless information medium according to one embodiment of the present invention. [Figure 9] This is a side view of the substrate and metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 10] This is an exploded perspective view of the substrate and metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 11] This is a perspective view showing an outline of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 12] This is a cross-sectional view of a coin-shaped contactless information medium according to one embodiment of the present invention. [Figure 13] This is a cross-sectional view of a coin-shaped contactless information medium according to one embodiment of the present invention. [Figure 14] This is a top view of the substrate and metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 15] This is a bottom view of the metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Figure 16] This is a flowchart showing a method for manufacturing a coin-type contactless information medium according to one embodiment of the present invention. [Figure 17] This is a bottom view of the metal ring of a coin-type contactless information medium according to one embodiment of the present invention. [Modes for carrying out the invention]

[0026] The embodiments of the present invention will be described below with reference to the drawings. However, the present invention can be implemented in various forms without departing from its spirit, and is not to be construed as being limited to the embodiments described below.

[0027] While drawings may schematically represent the width, thickness, shape, etc., of each part compared to the actual embodiment in order to clarify the explanation, these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements having the same function as those described in previously shown drawings are denoted by the same reference numerals, and redundant explanations may be omitted.

[0028] In this specification and in the drawings, when referring to multiple identical or similar components collectively, the same symbol or the same symbol followed by a capital letter may be used. When referring to multiple parts of a single component separately, the same symbol may be used, along with a hyphen and a natural number.

[0029] In this specification, the letters such as "1st," "2nd," or "3rd" attached to each component are merely convenient indicators used to distinguish each component, and unless otherwise specified, they have no further meaning.

[0030] In this specification, the substrate contained in a coin-type contactless information medium is used as the reference, with the side of the substrate on which the IC chip is mounted being referred to as the "top surface" and the opposite side of the substrate being referred to as the "bottom surface." Furthermore, the surfaces intersecting the top surface and the bottom surface are referred to as "side surfaces."

[0031] In this specification, "proximity" includes not only cases where multiple coin-shaped contactless information media are close together with space between them, but also cases where multiple coin-shaped contactless information media are in direct contact. For example, "proximity" includes cases where multiple coin-shaped contactless information media are overlapping.

[0032] <First Embodiment> Referring to Figures 1 to 8, a coin-type contactless information medium 10 according to one embodiment of the present invention will be described.

[0033] [1. Overview of the coin-type contactless information medium 10] Figure 1 is a schematic perspective view of a coin-type contactless information medium 10 according to one embodiment of the present invention. As shown in Figure 1, the coin-type contactless information medium 10 includes a substrate 110, a metal ring 120, and a protective member 130. The substrate 110 and the metal ring 120 are located inside the coin-type contactless information medium 10 and are both covered by the protective member 130.

[0034] The protective member 130 forms the external shape of the coin-type contactless information medium 10 and protects the substrate 110 and the metal ring 120 from external impacts. Therefore, in the coin-type contactless information medium 10, it is preferable that the substrate 110 and the metal ring 120 are completely covered by the protective member 130. The protective member 130 is a resin, and may be a thermosetting resin or a thermoplastic resin. Examples of materials that can be used as the protective member 130 include acrylonitrile butadiene styrene, polycarbonate, polyphthalamide, polyoxymethylene, polymethyl methacrylate, polyethylene, polypropylene, polybutylene terephthalate, or vinyl chloride.

[0035] The coin-type contactless information medium 10 shown in Figure 1 is circular and flat, but the shape of the coin-type contactless information medium 10 is not limited to this. The coin-type contactless information medium 10 may be elliptical or polygonal. Furthermore, while it is preferable for the coin-type contactless information medium 10 to be flat with a thickness smaller than the diameter of its base, it may also be cylindrical with a thickness larger than the diameter of its base.

[0036] The coin-type contactless information medium 10 is, for example, a chip (coin or token) used in casinos or amusement facilities, but the uses of the coin-type contactless information medium 10 are not limited to this. The coin-type contactless information medium 10 can be used, for example, for item management. It can also be used as a tool.

[0037] [2. Configuration of the coin-type contactless information medium 10] Figure 2 is a cross-sectional view of a coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, Figure 2 is a cross-sectional view of the coin-type contactless information medium 10 cut from the top surface to the bottom surface along the line A1-A2 shown in Figure 1. Figure 3 is a side view of the substrate 110 and metal ring 120 of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, Figure 3 is a side view of the substrate 110 and metal ring 120 from direction B in the coin-type contactless information medium 10 with the protective member 130 removed. Figure 4 is a top view of the substrate 110 and metal ring 120 of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, Figure 4 is a top view of the substrate 110 and metal ring 120 in the coin-type contactless information medium 10 with the protective member 130 removed. Figure 5 is an exploded perspective view of the substrate 110 and metal ring 120 of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, Figure 5 is an exploded perspective view of the substrate 110 and metal ring 120 in the coin-type contactless information medium 10 with the protective member 130 removed.

[0038] An antenna 140, an inductor 150, a capacitor 160, and an IC chip 170 are provided on the substrate 110 (see, for example, Figure 4 or Figure 5). In other words, the substrate 110 can function as a base material that supports the antenna 140, inductor 150, capacitor 160, and IC chip 170. As the substrate 110, for example, a paper phenolic substrate, a paper epoxy substrate, a glass epoxy substrate, a composite epoxy substrate, a glass composite substrate, a glass polyimide substrate, a BT substrate, a Teflon® substrate, or a PPO substrate can be used.

[0039] Antenna 140 receives signals from or transmits signals to a reader / writer performing wireless communication. The number of turns of the antenna 140's coil is preferably 1 to 3, and particularly preferably 2. Compared to conventional antennas, the number of turns of the antenna 140's coil is significantly less. Antenna 140 is formed on a substrate 110 using a conductive material such as metal to have a predetermined shape. Antenna 140 can be formed using methods such as printing, coating, or etching. Inductor 150, capacitor 160, and IC chip 170 are mounted on the substrate 110. Therefore, inductor 150 and capacitor 160 are mountable chip inductor and chip capacitor, respectively. Inductor 150 is electrically connected in series with antenna 140 (see, for example, Figure 4 or Figure 5). Capacitor 160 and IC chip 170 are electrically connected with antenna 140 at connection points 142 and 144 (see, for example, Figure 4). Furthermore, capacitor 160 and IC chip 170 are electrically connected in parallel.

[0040] Now, with reference to Figure 6, the IC chip 170 will be described.

[0041] Figure 6 is a block diagram showing the configuration of an IC chip 170 of a coin-type contactless information medium 10 according to one embodiment of the present invention. As shown in Figure 6, the IC chip 170 includes a control unit 172, a communication unit 174, and a storage unit 176. The control unit 172 controls the processing operations of the communication unit 174 and the storage unit 176. The communication unit 174 processes signals from a reader / writer received via the antenna 140 and extracts information requested by the reader / writer from the storage unit 176. The communication unit 174 also transmits a signal corresponding to the extracted information to the reader / writer via the antenna 140. The storage unit 176 stores various information, including identification information that identifies the coin-type contactless information medium 10.

[0042] The IC chip 170 is supplied with an induced current from a resonant circuit formed by the antenna 140, inductor 150, and capacitor 160. The IC chip 170 starts operating when the voltage value corresponding to the induced current is equal to or greater than a threshold (operating voltage value).

[0043] Referring again to Figures 2 to 5, the configuration of the coin-type contactless information medium 10 will be explained.

[0044] The substrate 110 has a generally circular shape and includes a protruding portion 112 that extends outward (see, for example, Figure 5). The IC chip 170 is mounted on the protruding portion 112.

[0045] The metal ring 120 can function as a weight to add weight to the coin-type contactless information medium 10. For example, brass or aluminum can be used as the metal ring 120. The metal ring 120 is generally annular in shape and includes a slit portion 122 where a part of the metal ring 120 is cut, exposing the cross-sectional end of the metal ring 120 (see, for example, Figure 5). In other words, the metal ring 120 has a C-shape including the slit portion 122.

[0046] The inner diameter of the metal ring 120 is approximately the same as, or slightly larger than, the diameter of the substrate 110. Also, the width of the gap in the slit portion 122 of the metal ring 120 is approximately the same as, or slightly larger than, the width of the protrusion 112 of the substrate 110. Therefore, the substrate 110 can be inserted inside the metal ring 120 so that the protrusion 112 engages with the slit portion 122. In other words, the protrusion 112 is inserted into the gap in the slit portion 122. A stepped portion 124 is provided on the inside of the metal ring 120 (see, for example, Figure 5). When the protrusion 112 is inserted into the gap in the slit portion 122, the substrate 110 is locked in place by the stepped portion 124 (see, for example, Figure 2), and its position is fixed.

[0047] The IC chip 170, mounted on the protrusion 112, is located within the gap of the slit portion 122, that is, between the end faces (or cut surfaces) of the metal ring 120. In a side view, the upper surface of the IC chip 170 is located below the upper surface of the metal ring 120 (see, for example, Figure 3).

[0048] Furthermore, it is sufficient that at least one slit portion 122 is provided into which the protruding portion 112 is fitted, and the metal ring 120 may include multiple slit portions 122.

[0049] As described above, in the coin-type contactless information medium 10, the IC chip 170 is located within the gap of the slit portion 122 and is protected by the end face of the metal ring 120. Therefore, even if the coin-type contactless information medium 10 is subjected to an impact from the outside, such as when it is dropped, the impact is absorbed by the metal ring 120, thereby mitigating the impact transmitted to the IC chip 170.

[0050] [3. Electrical characteristics of the coin-type contactless information medium 10] Figure 7 is a circuit diagram of a coin-type contactless information medium 10 according to one embodiment of the present invention. As shown in Figure 7, the antenna 140 and the inductor 150 are electrically connected in series, and a closed circuit is formed by the antenna 140, the inductor 150, and the capacitor 160. The closed circuit formed by the antenna 140, the inductor 150, and the capacitor 160 is a so-called resonant circuit.

[0051] The resonant frequency fr of the resonant circuit formed by antenna 140, inductor 150, and capacitor 160 is expressed by the following equation (1).

[0052]

number

[0053] Here, La, Lb, and C in equation (1) are the inductance of antenna 140, the inductance of inductor 150, and the capacitance of capacitor 160, respectively.

[0054] When the resonant frequency fr of the resonant circuit of the coin-type contactless information medium 10 matches the frequency fc of the reader / writer, an induced current flows in the resonant circuit of the coin-type contactless information medium 10. The inductance La of the antenna 140 and the inductance Lb of the inductor 150 are set so that the resonant frequency fr of the resonant circuit of the coin-type contactless information medium 10 matches the frequency fc of the reader / writer, so that the coin-type contactless information medium 10 can receive power from the reader / writer with high efficiency.

[0055] As mentioned above, since the inductor 150 is a chip inductor, its size is sufficiently small. Therefore, the inductor 150 can also be described as a lumped-parameter inductor that can be made into a lumped-parameter inductor. In the coin-type contactless information medium 10, the number of turns in the coil of the antenna 140 is small, and the inductance La of the antenna 140 is smaller than the inductance Lb of the inductor 150. Therefore, in the coin-type contactless information medium 10, the inductance of the resonant circuit is increased by increasing the inductance Lb of the inductor 150, and the resonant frequency fr of the coin-type contactless information medium 10 is matched with the frequency fc of the reader / writer. In the coin-type contactless information medium 10, even if the inductance La of the antenna 140 is small, it is sufficient to increase the inductance Lb of the inductor 150, and there is no need to increase the capacitance C of the capacitor 160. Therefore, the capacitance C of the capacitor 160 can be approximately the same as the conventional capacitance. Thus, the coin-type contactless information medium 10 can be miniaturized without increasing the size of the capacitor 160. Furthermore, in the coin-type contactless information medium 10, the capacitance C of the capacitor 160 does not increase, and therefore the Q value (Q factor) does not decrease. As a result, the power generation efficiency does not decrease, and sufficient power can be supplied to the IC chip 170. Consequently, the coin-type contactless information medium 10 prevents malfunctions of the IC chip 170 caused by insufficient power. Therefore, the coin-type contactless information medium 10 can perform stable wireless communication with the reader / writer.

[0056] Next, we will describe wireless communication between multiple coin-type contactless information media 10 and a reader / writer.

[0057] In conventional coin-type contactless information media that do not have an inductor 150, the resonant frequency fr was adjusted by increasing the inductance of the antenna by increasing the number of turns in the antenna coil. When antennas with a large number of turns are close together, mutual interference occurs between the coils. As a result, in conventional coin-type contactless information media, the resonant frequency or voltage of the resonant circuit formed by the antenna and capacitor changes, making it impossible to perform accurate wireless communication with the reader / writer.

[0058] In contrast, the coin-type contactless information medium 10 has only one turn in the antenna 140 coil, which is significantly fewer than the number of turns in the antenna coil of conventional coin-type contactless information mediums. Therefore, even when multiple coin-type contactless information mediums 10 are in close proximity, mutual interference between the coils of the antenna 140 is unlikely to occur.

[0059] Furthermore, the shape of the coils also affects mutual interference between coils. The larger the shape of the coils, the greater the area in which the coils overlap, making mutual interference between coils more likely to occur. However, the inductors 150 included in the coin-type contactless information medium 10 are sufficiently small in size and have a small coil shape. Therefore, even when multiple coin-type contactless information mediums 10 are in close proximity, mutual interference between coils caused by the inductors 150 is unlikely to occur.

[0060] Therefore, in the coin-type contactless information medium 10, mutual interference between coils is suppressed, so even when multiple coin-type contactless information mediums 10 are in close proximity, accurate wireless communication can be performed between multiple coin-type contactless information mediums 10 and a reader / writer.

[0061] Furthermore, in the coin-type contactless information medium 10, the ratio of inductance to capacitance of the resonant circuit is almost the same as that of conventional coin-type contactless information mediums. Therefore, even when multiple coin-type contactless information mediums 10 are in close proximity, the resonance strength can be maintained above a predetermined value, allowing for efficient reception of power from the reader / writer. As a result, each of the multiple coin-type contactless information mediums 10 can start operating smoothly.

[0062] As described above, even when multiple coin-type contactless information media 10 are in close proximity, mutual interference between coils is suppressed and power is supplied efficiently, enabling accurate wireless communication.

[0063] [4. Method for manufacturing a coin-type contactless information medium 10] Figure 8 is a flowchart showing a method for manufacturing a coin-type contactless information medium 10 according to one embodiment of the present invention. The coin-type contactless information medium 10 is manufactured by steps S100 to S120. However, the method for manufacturing the coin-type contactless information medium 10 is not limited to this and may include other steps.

[0064] In step S100, an inductor 150, a capacitor 160, and an IC chip 170 are mounted on a substrate 110 on which an antenna 140 having a predetermined shape is formed. This electrically connects the antenna 140 to the inductor 150, capacitor 160, and IC chip 170. Furthermore, a closed circuit is formed by the antenna 140, inductor 150, and capacitor 160.

[0065] In step S110, the substrate 110 is inserted into the metal ring 120 so that the protrusion 112 engages with the slit 122. Since the alignment of the substrate 110 and the metal ring 120 can be achieved by the engagement of the protrusion 112 and the slit 122, there is no need to provide a separate alignment marker. Furthermore, the inserted substrate 110 is locked in place by the stepped portion 124 on the inside of the metal ring 120, and its position is fixed.

[0066] In step S120, a protective member 130 covering the substrate 110 and the metal ring 120 is molded using injection molding. Specifically, resin is injected into the substrate 110 and the metal ring 120 placed in a mold, and the protective member 130 is formed by molding the resin under predetermined temperature and pressure.

[0067] As explained above, in the coin-type contactless information medium 10, the IC chip 170 is located in the slit portion 122 of the metal ring 120 and is protected by the end face of the metal ring 120. Therefore, the coin-type contactless information medium 10 has high shock resistance. In addition, in the coin-type contactless information medium 10, mutual interference can be suppressed by the inductor 150, so the change in the resonant frequency of the resonant circuit of the coin-type contactless information medium 10 is small, and accurate wireless communication can be performed even when multiple coin-type contactless information mediums 10 are in close proximity. Furthermore, even when multiple coin-type contactless information mediums 10 are stacked, the change in the resonant frequency of the resonant circuit of each of the multiple coin-type contactless information mediums 10 is small, and the decrease in the voltage generated in the coin-type contactless information medium 10 is suppressed, so the number of coin-type contactless information mediums 10 that can be read by the reader / writer is improved. Also, when multiple coin-type contactless information mediums 10 are stacked, a cylindrical body is formed by the stacked metal rings 120, and radio waves can pass through the cylindrical body while being reflected. As a result, radio waves can reach the coin-shaped contactless information medium 10, which is located far from the reader / writer, improving the number of coin-shaped contactless information mediums 10 that the reader / writer can read.

[0068] <Modified form of the first embodiment> Referring to Figures 9 and 10, a modified example of the coin-type contactless information medium 10, the coin-type contactless information medium 10A, will be described. Note that in the following, when the configuration of the coin-type contactless information medium 10A is the same as that of the coin-type contactless information medium 10, the description of the configuration of the coin-type contactless information medium 10A may be omitted.

[0069] Figure 9 is a side view of the substrate 110A and metal ring 120A of the coin-type contactless information medium 10A according to one embodiment of the present invention. Figure 10 is an exploded perspective view of the substrate 110A and metal ring 120A of the coin-type contactless information medium 10A according to one embodiment of the present invention.

[0070] An antenna 140, an inductor 150, a capacitor 160, and an IC chip 170 are provided on the substrate 110A (see, for example, Figure 10). The metal ring 120A includes a slit portion 122A. The outer circumference of the metal ring 120A is approximately the same as the outer circumference of the substrate 110A, and the metal ring 120A is positioned on the substrate 110A (see, for example, Figure 9).

[0071] In the coin-type contactless information medium 10A, the substrate 110A does not include any protrusions, and the metal ring 120A does not include any stepped portions. However, on the substrate 110A on which the metal ring 120A is placed, the IC chip 170 is located within the gap of the slit portion 122A, that is, between the end faces of the metal ring 120A, and is protected by the end faces of the metal ring 120A. Furthermore, the upper surface of the IC chip 170 is located below the upper surface of the metal ring 120A (see, for example, Figure 9).

[0072] As explained above, in the coin-type contactless information medium 10A, the IC chip 170 is located in the slit portion 122A of the metal ring 120A and is protected by the end face of the metal ring 120A. Therefore, the coin-type contactless information medium 10A has high shock resistance. In addition, in the coin-type contactless information medium 10A, mutual interference can be suppressed by the inductor 150, so the change in the resonant frequency of the resonant circuit of the coin-type contactless information medium 10A is small, and accurate wireless communication can be performed even when multiple coin-type contactless information mediums 10A are in close proximity. Furthermore, even when multiple coin-type contactless information mediums 10A are stacked, the change in the resonant frequency of the resonant circuit of each of the multiple coin-type contactless information mediums 10A is small, and the decrease in voltage generated in the coin-type contactless information medium is suppressed, so the number of coin-type contactless information mediums 10A that can be read by the reader / writer is improved. Furthermore, when multiple coin-shaped contactless information media 10A are stacked, a cylindrical body is formed by the stacked metal rings 120A, allowing radio waves to pass through the cylindrical body while being reflected. As a result, radio waves can reach coin-shaped contactless information media 10A that are far from the reader / writer, improving the number of coin-shaped contactless information media 10A that the reader / writer can read.

[0073] <Second Embodiment> Referring to Figures 11 to 16, a coin-type contactless information medium 20 according to one embodiment of the present invention will be described. Note that in the following, if the configuration of the coin-type contactless information medium 20 is the same as that of the coin-type contactless information medium 10, the description of the configuration of the coin-type contactless information medium 20 may be omitted.

[0074] [1. Overview of the coin-type contactless information medium 20] Figure 11 is a schematic perspective view of a coin-type contactless information medium 20 according to one embodiment of the present invention. As shown in Figure 11, the coin-type contactless information medium 20 includes a substrate 210, a metal ring 220, and a protective member 230. The substrate 210 and the metal ring 220 are located inside the coin-type contactless information medium 20 and are both covered by the protective member 230.

[0075] [2. Configuration of the coin-type contactless information medium 20] Figures 12 and 13 are cross-sectional views of a coin-type contactless information medium 20 according to one embodiment of the present invention. Specifically, Figure 12 is a cross-sectional view of the coin-type contactless information medium 20 cut from the top surface to the bottom surface along the line C1-C2 shown in Figure 11, and Figure 13 is a cross-sectional view of the coin-type contactless information medium 20 cut from the top surface to the bottom surface along the line D1-D2 shown in Figure 11. Figure 14 is a top view of the substrate 210 and metal ring 220 of the coin-type contactless information medium 20 according to one embodiment of the present invention. Specifically, Figure 14 is a top view of the substrate 210 and metal ring 220 in the coin-type contactless information medium 20 from which the protective member 230 has been removed. Figure 15 is a bottom view of the metal ring 220 of the coin-type contactless information medium 20 according to one embodiment of the present invention. Specifically, Figure 15 is a bottom view of the metal ring 220 in the coin-type contactless information medium 20 from which the substrate 210 and protective member 230 have been removed.

[0076] An antenna 240, an inductor 250, a capacitor 260, and an IC chip 270 are provided on the circuit board 110 (see, for example, Figure 14). The coil of the antenna 240 has one turn. The inductor 250 and capacitor 260 are chip inductors and chip capacitors, respectively. The inductor 250 is electrically connected in series with the antenna 240. The capacitor 260 and IC chip 270 are electrically connected with the antenna 240 at connection points 242 and 244. The capacitor 260 and IC chip 270 are electrically connected in parallel.

[0077] The metal ring 220 is placed on the substrate 210 (see, for example, Figure 12 or Figure 13). The metal ring 220 includes a slit portion 222 in which a part of the metal ring 220 is cut (see, for example, Figure 14 or Figure 15). In addition, the bottom surface of the metal ring 220 (the surface facing the substrate 210) is provided with a recess 224 that is recessed inward from the bottom surface (see Figures 13, 14, or 15). The recess 224 is superimposed on the substrate 210.

[0078] The opening area of ​​the recess 224 is larger than the mounting area of ​​the IC chip 270 (see, for example, Figure 14). Also, the depth of the recess 224 is greater than the height from the surface of the substrate 210 to the top surface of the IC chip 270 (see, for example, Figure 13). Therefore, when the metal ring 220 is placed on the substrate 210, a closed space is formed by the substrate 210 and the recess 224, and the IC chip 270 is located within the formed space. It is sufficient if at least a portion of the opening surface of the recess 224 is blocked by the substrate 210, but it is preferable that the entire opening surface of the recess 224 is blocked. When the opening surface of the recess 224 is completely blocked by the substrate 210, the formed space is surrounded by the substrate 210 and the metal ring 220, so the IC chip 270 located within the space is not in contact with the protective member 230.

[0079] The opening shape of the recess 224 is not limited to a rectangle. The opening shape of the recess 224 may be circular, elliptical, polygonal, or the like.

[0080] As described above, in the coin-type contactless information medium 20, the IC chip 270 is located within a recess 224 provided in the metal ring 220 and is protected by the recess 224. Therefore, even if the coin-type contactless information medium 20 is subjected to an impact from the outside, such as by being dropped, the impact is absorbed by the metal ring 220, thereby mitigating the impact transmitted to the IC chip 270. Furthermore, even when multiple coin-type contactless information mediums 20 are in close proximity, mutual interference between coils is suppressed and power is supplied efficiently, enabling accurate wireless communication.

[0081] [3. Method for manufacturing a coin-type contactless information medium 20] Figure 16 is a flowchart showing a method for manufacturing a coin-type contactless information medium 20 according to one embodiment of the present invention. The coin-type contactless information medium 20 is manufactured by steps S200 to S220. However, the method for manufacturing the coin-type contactless information medium 20 is not limited to this and may include other steps.

[0082] In step S200, an inductor 250, a capacitor 260, and an IC chip 270 are mounted on a substrate 210 on which an antenna 240 having a predetermined sail shape is formed. This electrically connects the antenna 240 to the inductor 250, capacitor 260, and IC chip 270. A closed circuit is also formed by the antenna 240, inductor 250, and capacitor 260.

[0083] In step S210, the metal ring 220 is placed on the substrate 210 such that the recess 224 covers the IC chip 270. The alignment of the substrate 210 and the metal ring 220 may also be performed using the slit portion 222 of the metal ring 220. For example, the substrate 210 can be provided with a slit portion the same size as the slit portion 222, and the slit portion 222 of the metal ring 220 can be aligned with the slit portion of the substrate 210. Alternatively, the substrate 210 can be provided with a protrusion that fits with the slit portion 222 of the metal ring 220, and the slit portion 222 of the metal ring 220 can be fitted with the protrusion of the substrate 210, thereby aligning the substrate 210 and the metal ring 220.

[0084] In step S220, a protective member 230 covering the substrate 210 and the metal ring 220 is molded using injection molding. Specifically, resin is injected into the substrate 210 and the metal ring 220 placed in a mold, and the protective member 230 is formed by molding the resin under predetermined temperature and pressure. At this time, the IC chip 270 is protected by the recess 224 and is not in contact with the resin. Therefore, the IC chip 270 is less affected by the temperature and pressure during resin molding, and damage to the IC chip 270 during the injection molding process is reduced.

[0085] As explained above, in the coin-type contactless information medium 20, the IC chip 270 is located within a recess 224 provided in the metal ring 220 and is protected by the recess 224. Therefore, the coin-type contactless information medium 10 has high impact resistance and reduces damage to the IC chip 270 during the injection molding process. In addition, in the coin-type contactless information medium 20, mutual interference can be suppressed by the inductor 250, so the change in the resonant frequency of the resonant circuit of the coin-type contactless information medium 20 is small, and accurate wireless communication can be performed even when multiple coin-type contactless information mediums 20 are in close proximity. Furthermore, even when multiple coin-type contactless information mediums 20 are stacked, the change in the resonant frequency of each resonant circuit of the multiple coin-type contactless information mediums 20 is small, and the decrease in voltage generated by the coin-type contactless information medium is suppressed, thus improving the number of coin-type contactless information mediums 20 that can be read by the reader / writer. Furthermore, when multiple coin-shaped contactless information media 20 are stacked, the stacked metal rings 220 form a cylindrical body, allowing radio waves to pass through the cylindrical body while being reflected. As a result, radio waves can reach coin-shaped contactless information media 20 that are far from the reader / writer, improving the number of coin-shaped contactless information media 20 that the reader / writer can read.

[0086] <Modified form of the second embodiment> Referring to Figure 17, a modified example of the coin-type contactless information medium 20, namely the coin-type contactless information medium 20A, will be described. Note that in the following, if the configuration of the coin-type contactless information medium 20A is the same as that of the coin-type contactless information medium 20, the description of the configuration of the coin-type contactless information medium 20A may be omitted.

[0087] Figure 17 is a bottom view of the metal ring 220A of a coin-type contactless information medium 20A according to one embodiment of the present invention. As shown in Figure 17, the metal ring 220A includes a slit portion 222A in which a part of the metal ring 220A is cut. In addition, the bottom surface of the metal ring 220 is provided with a first recess 224A-1 that is recessed inward from the bottom surface.

[0088] Furthermore, the metal ring 220A is provided with a first projection 226A-1 and a second projection 226A-2 on the annular inner side. In addition, the first projection 226A-1 and the second projection 226A-2 are provided with a second recess 224A-2 and a third recess 224A-3 that are recessed inward from the bottom surface, respectively.

[0089] When the metal ring 220A is placed on the substrate 210, the first recess 224A-1, the second recess 224A-2, and the third recess 224A-3 can cover the IC chip 270, the inductor 250, and the capacitor 260, respectively. That is, the IC chip 270 is located in the space formed by the substrate 210 and the first recess 224A-1, the inductor 250 is located in the space formed by the substrate 210 and the second recess 224A-2, and the capacitor 260 is located in the space formed by the substrate 210 and the third recess 224A-3. Since each of these spaces is surrounded by the substrate 210 and the metal ring 220A, the IC chip 270, inductor 250, and capacitor 260 located within these spaces are not in contact with the protective member.

[0090] As explained above, in the coin-type contactless information medium 20A, the IC chip 270, inductor 250, and capacitor 260 are protected by the first recess 244A-1, the second recess 244A-2, and the third recess 244A-3, respectively. Therefore, the coin-type contactless information medium 20A has high shock resistance and reduces damage to the IC chip 270, inductor 250, and capacitor 260 during the injection molding process. In addition, since mutual interference can be suppressed by the inductor 250 in the coin-type contactless information medium 20A, the change in the resonant frequency of the resonant circuit is small, and accurate wireless communication can be performed even when multiple coin-type contactless information mediums 20A are in close proximity. Furthermore, even when multiple coin-type contactless information media 20A are stacked, the change in the resonant frequency of each resonant circuit of the multiple coin-type contactless information media 20A is small, and the decrease in voltage generated by the coin-type contactless information media is suppressed, thereby improving the number of coin-type contactless information media 20A that can be read by the reader / writer. In addition, when multiple coin-type contactless information media 20A are stacked, a cylindrical body is formed by the stacked metal rings 220A, and radio waves can pass through the cylindrical body while being reflected. As a result, radio waves can reach coin-type contactless information media 20A that are far from the reader / writer, improving the number of coin-type contactless information media 20A that can be read by the reader / writer.

[0091] The embodiments described above as examples of the present invention can be combined and implemented as appropriate, insofar as they do not contradict each other. Furthermore, any additions, deletions, or design modifications made by those skilled in the art based on these embodiments are also included within the scope of the present invention, as long as they retain the essence of the present invention.

[0092] Furthermore, any effects or benefits other than those brought about by the embodiments described above, if they are clear from the description herein or easily predictable to those skilled in the art, are naturally understood to be brought about by the present invention. [Explanation of Symbols]

[0093] 10, 10A: Coin-type contactless information medium, 110, 110A: Substrate, 112: Protrusion, 120, 120A: Metal ring, 122, 122A: Slit, 124: Step, 130: Protective member, 140: Antenna, 142, 144: Connection point, 150: Inductor, 160: Capacitor, 170: IC chip, 172: Control unit, 174: Communication unit, 176: Memory unit 20, 20A: Coin-type contactless information medium, 210: Substrate, 220, 220A: Metal ring, 222, 222A: Slit portion, 224, 224A: Recess, 226A: Protrusion, 230: Protective member, 240: Antenna, 242, 244: Connection point, 250: Inductor, 260: Capacitor, 270: IC chip

Claims

1. A circuit board on which an IC chip is installed, A metal ring including at least one slit and a first recess recessed inward from the surface, The protective member covers the substrate and the metal ring, The first recess is superimposed on the substrate, The IC chip is a coin-shaped contactless information medium located in the space formed by the first recess and the substrate.

2. The coin-type contactless information medium according to claim 1, wherein the opening surface of the first recess is closed by the substrate.

3. The substrate is further provided with an antenna and an inductor connected in series with the antenna. The metal ring further includes a second recess that is recessed from the surface into the interior, The coin-type contactless information medium according to claim 1 or 2, wherein the inductor is located in the space formed by the second recess and the substrate.

4. The substrate is further provided with a capacitor connected in parallel with the IC chip. The metal ring further includes a third recess that is recessed from the surface into the interior, The coin-type contactless information medium according to any one of claims 1 to 3, wherein the capacitor is located in the space formed by the third recess and the substrate.

5. The coin-type contactless information medium according to claim 3, wherein the inductor is a chip inductor mounted on the substrate.

6. The IC chip is mounted on the circuit board. A metal ring including a first recess that is recessed from the surface inward is placed on the substrate such that the first recess covers the IC chip. A method for manufacturing a coin-type contactless information medium, comprising forming a protective member covering the substrate and the metal ring using injection molding.

7. A method for manufacturing a coin-type contactless information medium according to claim 6, wherein the metal ring is placed on the substrate such that the opening surface of the first recess is closed by the substrate.

8. Furthermore, an inductor is mounted so as to be connected in series with the antenna formed on the substrate. The metal ring further includes a second recess that is recessed from the surface into the interior, A method for manufacturing a coin-type contactless information medium according to claim 6 or 7, wherein the metal ring is placed on the substrate such that the second recess covers the inductor.

9. Furthermore, a capacitor is mounted so as to be connected in parallel with the IC chip. The metal ring further includes a third recess that is recessed from the surface into the interior, A method for manufacturing a coin-type contactless information medium according to any one of claims 6 to 8, wherein the metal ring is placed on the substrate such that the third recess covers the capacitor.

10. The method for manufacturing a coin-type contactless information medium according to claim 8, wherein the inductor is a chip inductor.

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