resin composition

Abstract

To provide a resin composition capable of suppressing the dielectric loss tangent (Df) of a cured product low and suppressing occurrence of unevenness after lamination.SOLUTION: The resin composition contains (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler. The content of the component (C) is 10 mass% or more based on 100 mass% of a nonvolatile component in the resin composition, and the content of the component (D) is 60 mass% or more based on 100 mass% of the nonvolatile component in the resin composition.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition containing an epoxy resin. Furthermore, it relates to a cured product, a sheet-like laminated material, a resin sheet, a printed circuit board, and a semiconductor device obtained using the resin composition. [Background technology]

[0002] A known manufacturing technique for printed circuit boards is the build-up method, in which insulating layers and conductive layers are stacked alternately. In the build-up method, the insulating layer is generally formed by curing a resin composition. In recent years, there has been a demand to further reduce the dielectric loss tangent of the insulating layer.

[0003] It has been known that by using an epoxy resin composition containing a high proportion of active ester compounds and inorganic fillers as a resin composition for forming an insulating layer, the dielectric loss tangent of the insulating layer can be kept even lower (Patent Document 1). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-23714 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, when using epoxy resin compositions containing high concentrations of active ester compounds and inorganic fillers, unevenness after lamination was a problem (see Test Example 2 for details on unevenness after lamination).

[0006] The object of the present invention is to provide a resin composition that can keep the dielectric loss tangent (Df) of the cured product low and suppress the occurrence of unevenness after lamination. [Means for solving the problem]

[0007] In order to achieve the objectives of the present invention, the inventors conducted diligent studies and, as a result, discovered that by further using (A) a fluorine atom-containing polymer in an epoxy resin composition containing a high concentration of (C) an active ester compound and (D) an inorganic filler, at concentrations of 10% by mass or more and 60% by mass or more, respectively, it is possible to suppress the dielectric loss tangent (Df) of the cured product and to suppress the occurrence of unevenness after lamination, thus completing the present invention.

[0008] In other words, the present invention includes the following: [1] A resin composition comprising (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, (C) The content of component is 10% by mass or more, when the nonvolatile components in the resin composition are considered to be 100% by mass. A resin composition in which the content of component (D) is 60% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass. [2] The resin composition according to [1] above, wherein the number average molecular weight of component (A) is 20,000 or less. [3] The resin composition according to [1] or [2] above, wherein component (A) comprises a copolymer of a fluoroolefin and a vinyl ether. [4] Component (A) is, Formula (AF):

[0009] [ka]

[0010] [In the formula, R f1 This represents (1) a hydrogen atom, (2) a halogen atom, (3) an alkyl group which may be substituted with a substituent, or (4) an alkoxy group which may be substituted with a substituent; R f2 , R f3 and R f4each independently represents (1) a hydrogen atom, (2) a halogen atom, or (3) an alkyl group optionally substituted with a substituent; R f1 , R f2 , R f3 and R f4 at least one of which is a fluorine atom.] a repeating unit represented by, and Formula (AE):

[0011]

Chemical Formula

[0012] [In the formula, R 1 represents an alkyl group optionally substituted with a substituent; R 2 , R 3 and R 4 each independently represent (1) a hydrogen atom, or (2) an alkyl group optionally substituted with a substituent.] The resin composition according to any one of the above [1] to [3], comprising a copolymer comprising a repeating unit represented by [5] The resin composition according to any one of the above [1] to [4], wherein the component (A) has a hydroxy group. [6] The resin composition according to the above [5], wherein the hydroxyl value of the component (A) is 20 to 120 mgKOH / g. [7] The resin composition according to any one of the above [1] to [6], wherein the content of the component (A) is 0.1% by mass or more, when the non-volatile component in the resin composition is taken as 100% by mass. [8] The resin composition according to any one of the above [1] to [7], wherein the content of the component (A) is 10% by mass or less, when the non-volatile component in the resin composition is taken as 100% by mass. [9] The resin composition according to any one of the above [1] to [8], wherein the content of the component (B) is 1% by mass to 20% by mass, when the non-volatile component in the resin composition is taken as 100% by mass.

[10] The resin composition according to any one of [1] to [9] above, wherein the mass ratio of component (B) to component (A) (component (B) / component (A)) is 0.5 to 30.

[11] The resin composition according to any one of [1] to

[10] above, wherein the mass ratio of component (C) to component (A) (component (C) / component (A)) is 1 to 60.

[12] The resin composition according to any one of [1] to

[11] above, wherein the mass ratio of component (D) to component (A) (component (D) / component (A)) is 5 to 300.

[13] The resin composition according to any one of [1] to

[12] above, wherein component (D) is silica.

[14] The resin composition according to any one of [1] to

[13] above, wherein the content of component (D) is 68% by mass or more when the nonvolatile components in the resin composition are taken as 100% by mass.

[15] The resin composition according to any one of [1] to

[14] above, further comprising a curing agent selected from the group consisting of phenolic curing agents and carbodiimide curing agents.

[16] A resin composition according to any one of [1] to

[15] above, wherein the dielectric loss tangent (Df) of the cured resin composition is 0.0030 or less when measured at 5.8 GHz and 23°C.

[17] A cured product of any of the resin compositions described in [1] to

[16] above.

[18] A sheet-like laminated material containing the resin composition described in any of [1] to

[16] above.

[19] A resin sheet having a support and a resin composition layer formed from any of the resin compositions described in [1] to

[16] above, provided on the support.

[20] A printed circuit board comprising an insulating layer made of a cured resin composition described in any of [1] to

[16] above.

[21] A semiconductor device including the printed circuit board described in

[20] above. [Effects of the Invention]

[0013] According to the resin composition of the present invention, the dielectric loss tangent (Df) of the cured product can be kept low, and the occurrence of unevenness after lamination can be suppressed. [Modes for carrying out the invention]

[0014] The present invention will be described in detail below with reference to its preferred embodiments. However, the present invention is not limited to the embodiments and examples described below, and can be implemented with modifications as appropriate without departing from the scope of the claims and equivalents of the present invention.

[0015] <Resin composition> The resin composition of the present invention comprises (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, wherein the content of (C) the active ester compound is 10% by mass or more, and the content of (D) the inorganic filler is 60% by mass or more. By using such a resin composition, the dielectric loss tangent (Df) of the cured product can be kept low, and the occurrence of unevenness after lamination can be suppressed.

[0016] The resin composition of the present invention may further contain any optional components in addition to (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler. Examples of optional components include (C') other curing agents, (E) radical polymerizable compounds, (F) curing accelerators, (G) thermoplastic resins, (H) other additives, and (I) organic solvents. Each component contained in the resin composition will be described in detail below.

[0017] <(A) Fluorine atom-containing polymer> The resin composition of the present invention contains (A) a fluorine atom-containing polymer. (A) The fluorine atom-containing polymer may be used alone, or two or more may be used in any ratio.

[0018] (A) The fluorine atom-containing polymer preferably has a hydroxyl group in one embodiment. In this embodiment, the hydroxyl value of the fluorine atom-containing polymer (A) is preferably 20 to 120 mg KOH / g, more preferably 20 to 80 mg KOH / g.

[0019] (A) The fluorine atom-containing polymer may or may not have carboxyl groups, but in one embodiment, it is particularly preferable that it does not have carboxyl groups. (A) In one embodiment, the acid value of the fluorine atom-containing polymer is preferably 5 mg KOH / g or less, more preferably 1 mg KOH / g or less, even more preferably 0.1 mg KOH / g or less, and particularly preferably 0 mg KOH / g.

[0020] (A) In one embodiment, the fluorine atom-containing polymer preferably comprises a copolymer of a fluoroolefin and a vinyl ether. The vinyl ether may be, for example, an alkyl vinyl ether without functional groups such as a hydroxyl group or a carboxyl group, a hydroxyalkyl vinyl ether having a hydroxyl group, or a carboxyalkyl vinyl ether having a carboxyl group. (A) In the embodiment, the fluorine atom-containing polymer more preferably comprises a copolymer of a fluoroolefin and one or more vinyl ethers selected from hydroxyalkyl vinyl ether, carboxyalkyl vinyl ether and alkyl vinyl ether, and particularly preferably comprises an alternating copolymer of a fluoroolefin and one or more vinyl ethers selected from hydroxyalkyl vinyl ether, carboxyalkyl vinyl ether and alkyl vinyl ether. In one embodiment, the vinyl ether preferably comprises at least two types: a functional vinyl ether selected from hydroxyalkyl vinyl ether and carboxyalkyl vinyl ether and an alkyl vinyl ether, and more preferably comprises at least two types: a hydroxyalkyl vinyl ether and an alkyl vinyl ether.

[0021] Fluoroolefins refer to alkene compounds substituted with one or more fluorine atoms. Examples include alkenes substituted with one or more fluorine atoms such as fluoroethylene (vinyl fluoride), 1,1-difluoroethylene (vinylidene fluoride), trifluoroethylene, tetrafluoroethylene, pentafluoropropylene, and hexafluoropropylene; alkenes substituted with one or more fluorine atoms in addition to chlorine and / or bromine atoms such as chlorotrifluoroethylene and bromotrifluoroethylene; and alkenes substituted with one or more fluorine atoms in addition to alkoxy groups substituted with one or more fluorine atoms such as trifluoromethyltrifluorovinyl ether, pentafluoroethyltrifluorovinyl ether, and heptafluoropropyltrifluorovinyl ether.

[0022] An alkene is defined as a straight-chain or branched-chain aliphatic unsaturated hydrocarbon having at least one carbon-carbon double bond. Unless otherwise specified, alkenes are preferably those having 2 to 10 carbon atoms, more preferably those having 2 to 6 carbon atoms, and even more preferably those having 2 or 3 carbon atoms. Examples of alkenes include ethylene, propylene, 1-butene, cis-2-butene, trans-2-butene, 2-methylpropene, 1-pentene, cis-2-pentene, trans-2-pentene, 2-methyl-1-butene, 2-methyl-2-butene, and 3-methyl-1-butene.

[0023] An alkoxy (group) is a monovalent group (i.e., R) formed by a linear, branched, and / or cyclic monovalent aliphatic saturated hydrocarbon group bonded to an oxygen atom. a O-(R aalkoxy(group) refers to a group represented by a monovalent aliphatic saturated hydrocarbon group. Unless otherwise specified, alkoxy(groups) having 1 to 10 carbon atoms are preferred, alkoxy(groups) having 1 to 6 carbon atoms are more preferred, and alkoxy(groups) having 1 to 3 carbon atoms are even more preferred. Examples of alkoxy(groups) include methoxy group, ethoxy group, propyloxy group, isopropyloxy group, butyloxy group, isobutyloxy group, sec-butyloxy group, tert-butyloxy group, pentyloxy group, hexyloxy group, 2-ethylhexyloxy group, octyloxy group, cyclopentyloxy group, cyclohexyloxy group, 2-methylcyclohexyloxy group, 4-methylcyclohexyloxy group, cyclopentylmethoxy group, and cyclohexylmethoxy group.

[0024] Alkyl vinyl ethers refer to ether compounds of alkyl and vinyl, which may be substituted with non-functional groups. Examples include unsubstituted alkyl vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, isopropyl vinyl ether, butyl vinyl ether, isobutyl vinyl ether, tert-butyl vinyl ether, pentyl vinyl ether, hexyl vinyl ether, octyl vinyl ether, 2-ethylhexyl vinyl ether, cyclopentyl vinyl ether, cyclohexyl vinyl ether, and 2-methylcyclohexyl vinyl ether; alkyl vinyl ethers substituted with one or more halogen atoms such as chloromethyl vinyl ether and 1-chloroethyl vinyl ether; and alkyl vinyl ethers substituted with one or more phenyl groups such as benzyl vinyl ether and 2-phenylethyl vinyl ether.

[0025] The halogen atom is a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. Unless otherwise specified, the halogen atom is preferably a fluorine atom or a chlorine atom, and particularly preferably a fluorine atom.

[0026] Alkyl(group) refers to a linear, branched, and / or cyclic monovalent aliphatic saturated hydrocarbon group. Unless otherwise specified, alkyl(groups) having 1 to 10 carbon atoms are preferred, alkyl(groups) having 1 to 6 carbon atoms are more preferred, and alkyl(groups) having 1 to 3 carbon atoms are even more preferred. Examples of alkyl(groups) include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, hexyl group, 2-ethylhexyl group, octyl group, cyclopentyl group, cyclohexyl group, 2-methylcyclohexyl group, 4-methylcyclohexyl group, cyclopentylmethyl group, and cyclohexylmethyl group.

[0027] Hydroxyalkyl vinyl ethers refer to ether compounds of alkyl and vinyl substituted with a hydroxyl group. Examples include 2-hydroxyethyl vinyl ether, 3-hydroxypropyl vinyl ether, 2-hydroxypropyl vinyl ether, 4-hydroxybutyl vinyl ether, 3-hydroxybutyl vinyl ether, 2-hydroxy-2-methylpropyl vinyl ether, 5-hydroxypentyl vinyl ether, 6-hydroxyhexyl vinyl ether, and other hydroxyl-substituted alkyl vinyl ethers.

[0028] Carboxyalkyl vinyl ethers refer to ether compounds of alkyl and vinyl substituted with a carboxyl group. Examples include vinyl ethers of alkyl substituted with a carboxyl group, such as 2-carboxyethyl vinyl ether, 3-carboxypropyl vinyl ether, 2-carboxypropyl vinyl ether, 4-carboxybutyl vinyl ether, 3-carboxybutyl vinyl ether, 2-carboxy-2-methylpropyl vinyl ether, 5-carboxypentyl vinyl ether, and 6-carboxyhexyl vinyl ether.

[0029] (A) In one embodiment, the fluorine atom-containing polymer is preferably of formula (AF):

[0030] [ka]

[0031] [In the formula, R f1 This represents (1) a hydrogen atom, (2) a halogen atom, (3) an alkyl group which may be substituted with a substituent, or (4) an alkoxy group which may be substituted with a substituent; R f2 , R f3 and R f4 Each independently represents (1) a hydrogen atom, (2) a halogen atom, or (3) an alkyl group which may be substituted with a substituent; R f1 , R f2 , R f3 and R f4 At least one of them is a fluorine atom. The polymer contains repeating units represented by (A). The repeating units represented by formula (AF) contained in one molecule of the fluorine atom-containing polymer may be one type or two or more types.

[0032] In this specification, substituents are not particularly limited, but examples include monovalent substituents such as halogen atoms, hydroxyl groups, carboxyl groups, amino groups, cyano groups, carbamoyl groups, nitro groups, aryl groups, alkyl-substituted aryl groups (aryl groups substituted with alkyl groups), alkoxy groups, aryl-oxy groups, alkyl-carbonyl groups, aryl-carbonyl groups, alkoxy-carbonyl groups, aryl-oxy-carbonyl groups, alkyl-carbonyl-oxy groups, aryl-carbonyl-oxy groups, mono or di-alkyl-amino groups, mono or di-aryl-amino groups, mono or di(alkyl-carbonyl)amino groups, mono or di(aryl-carbonyl)amino groups, mono or di-alkyl-carbamoyl groups, and mono or di-aryl-carbamoyl groups.

[0033] An aryl group refers to a monovalent aromatic hydrocarbon group formed by removing one hydrogen atom from an aromatic carbon ring. Unless otherwise specified, aryl groups with 6 to 14 carbon atoms are preferred, and aryl groups with 6 to 10 carbon atoms are particularly preferred. Examples of aryl groups include phenyl groups, 1-naphthyl groups, and 2-naphthyl groups.

[0034] R f1 R represents (1) a hydrogen atom, (2) a halogen atom, (3) an alkyl group which may be substituted with a substituent, or (4) an alkoxy group which may be substituted with a substituent. f1 Preferably, is (1) a hydrogen atom, (2) a halogen atom, (3) an alkyl group which may be substituted with a halogen atom, or (4) an alkoxy group which may be substituted with a halogen atom; more preferably, is (1) a hydrogen atom, (2) a fluorine atom, (3) a chlorine atom, (4) an alkyl group which may be substituted with a fluorine atom and / or a chlorine atom, or (5) an alkoxy group which may be substituted with a fluorine atom and / or a chlorine atom; even more preferably, is (1) a hydrogen atom, (2) a fluorine atom, (3) a chlorine atom, or (4) an alkyl group which may be substituted with a fluorine atom and / or a chlorine atom; particularly preferably, is a fluorine atom or a chlorine atom.

[0035] R f2 , R f3 and R f4 Each independently represents (1) a hydrogen atom, (2) a halogen atom, or (3) an alkyl group which may be substituted with a substituent. f2 , R f3 and R f4 Each of these is independently preferably (1) a hydrogen atom, (2) a halogen atom, or (3) an alkyl group which may be substituted with a halogen atom; more preferably (1) a hydrogen atom, (2) a fluorine atom, (3) a chlorine atom, or (4) an alkyl group which may be substituted with a fluorine atom and / or a chlorine atom; even more preferably a fluorine atom or a chlorine atom; particularly preferably a fluorine atom.

[0036] Rf1 , R f2 , R f3 and R f4 At least one of them is a fluorine atom, preferably R f1 , R f2 , R f3 and R f4 At least two of them are fluorine atoms, and more preferably, R f1 , R f2 , R f3 and R f4 At least three of them are fluorine atoms.

[0037] (A) In this embodiment, the fluorine atom-containing polymer is more preferably a repeating unit represented by formula (AF), in addition to formula (AE):

[0038] [ka]

[0039] [In the formula, R 1 This indicates an alkyl group which may be substituted with a substituent; R 2 , R 3 and R 4 Each of these independently represents (1) a hydrogen atom or (2) an alkyl group which may be substituted with a substituent. The copolymer contains repeating units represented by (A). The repeating units represented by formula (AE) contained in one molecule of the fluorine atom-containing polymer may be one type or two or more types.

[0040] R 1 R represents an alkyl group which may be substituted with a substituent. 1 The alkyl group is preferably an alkyl group which may be substituted with a substituent selected from a halogen atom, a hydroxyl group, a carboxyl group, and a phenyl group. 2 , R 3 and R 4 Each independently represents (1) a hydrogen atom or (2) an alkyl group which may be substituted with a substituent.2 , R 3 and R 4 Preferably, each is independently (1) a hydrogen atom, or (2) an alkyl group which may be substituted with a halogen atom and / or a phenyl group.

[0041] (A) In this embodiment, it is particularly preferable that the fluorine atom-containing polymer has repeating units represented by formula (AF) and repeating units represented by formula (AE) arranged alternately.

[0042] (A) In this embodiment, the fluorine atom-containing polymer is more preferably a repeating unit represented by formula (AF), in addition to formula (AE-1):

[0043] [ka]

[0044] [In the formula, R 11 This represents (1) an alkyl group substituted with a hydroxyl group and possibly further substituted with a halogen atom, or (2) an alkyl group substituted with a carboxyl group and possibly further substituted with a halogen atom; R 12 , R 13 and R 14 Each of these independently represents (1) a hydrogen atom, or (2) an alkyl group which may be substituted with a halogen atom and / or a phenyl group. The copolymer contains repeating units represented by (A). The repeating units represented by formula (AE-1) contained in one molecule of the fluorine atom-containing polymer may be one type or two or more types.

[0045] R 11 R represents (1) an alkyl group substituted with a hydroxyl group and which may be further substituted with a halogen atom, or (2) an alkyl group substituted with a carboxyl group and which may be further substituted with a halogen atom. 11Preferably, the alkyl group is (1) an alkyl group substituted with a hydroxyl group and which may be further substituted with a fluorine atom and / or a chlorine atom, or (2) an alkyl group substituted with a carboxyl group and which may be further substituted with a fluorine atom and / or a chlorine atom; more preferably, an alkyl group substituted with a hydroxyl group and which may be further substituted with a fluorine atom and / or a chlorine atom; even more preferably, an alkyl group substituted with a hydroxyl group (particularly preferably one hydroxyl group).

[0046] R 12 , R 13 and R 14 Each independently represents (1) a hydrogen atom, or (2) an alkyl group which may be substituted with a halogen atom and / or a phenyl group. 12 , R 13 and R 14 Each is independently preferably (1) a hydrogen atom, or (2) an alkyl group which may be substituted with a fluorine atom and / or a chlorine atom; more preferably a hydrogen atom or an alkyl group; even more preferably a hydrogen atom.

[0047] (A) The fluorine atom-containing polymer is R 11 It is preferable that the repeating unit is represented by formula (AE-1) and has a hydroxyl group.

[0048] (A) In this embodiment, the fluorine atom-containing polymer is particularly preferably a repeating unit represented by formula (AF) and a repeating unit represented by formula (AE-1), in addition to formula (AE-2):

[0049] [ka]

[0050] [In the formula, R 21 This indicates an alkyl group which may be substituted with a halogen atom and / or a phenyl group; R 22 , R 23and R 24 each independently represent (1) a hydrogen atom, or (2) an alkyl group optionally substituted with a halogen atom and / or a phenyl group.] comprises a copolymer comprising a repeating unit represented by . (A) The repeating unit represented by formula (AE-2) contained in one molecule of the fluorine atom-containing polymer may be of one type or two or more types.

[0051] R 21 represents an alkyl group optionally substituted with a halogen atom and / or a phenyl group. R 21 is preferably an alkyl group optionally substituted with a substituent selected from a fluorine atom, a chlorine atom and a phenyl group; more preferably an alkyl group.

[0052] R 22 , R 23 and R 24 each independently represent (1) a hydrogen atom, or (2) an alkyl group optionally substituted with a halogen atom and / or a phenyl group. R 22 , R 23 and R 24 each independently are preferably (1) a hydrogen atom, or (2) an alkyl group optionally substituted with a fluorine atom and / or a chlorine atom; more preferably a hydrogen atom or an alkyl group; still more preferably, R 22 , R 23 and R 24 are each independently a hydrogen atom or an alkyl group, and at least two or more of R 22 , R 23 and R 24 are hydrogen atoms; particularly preferably, R 22 is a hydrogen atom or an alkyl group, and R 23 and R 24 are hydrogen atoms.

[0053] (A) In this embodiment, the fluorine atom-containing polymer has R 22 , R 23 , and R 24A repeating unit represented by formula (AE-2) where all are hydrogen atoms, and R 22 , R 23 and R 24 It is more preferable to include both a repeating unit represented by formula (AE-2) in which two of the atoms are hydrogen atoms and the remaining one is not a hydrogen atom.

[0054] (A) In this embodiment, it is particularly preferable that the fluorine atom-containing polymer has repeating units represented by formula (AF) and units selected from repeating units represented by formula (AE-1) and repeating units represented by formula (AE-2) arranged alternately.

[0055] (A) The number-average molecular weight of the fluorine atom-containing polymer is preferably 20,000 or less, and particularly preferably 16,000 or less. (A) The lower limit of the number-average molecular weight of the fluorine atom-containing polymer is not particularly limited, but is preferably 1,000 or more, and particularly preferably 5,000 or more. The number-average molecular weight of the resin can be measured as a polystyrene equivalent value by gel permeation chromatography (GPC).

[0056] (A) The fluorine atom-containing polymer may be included in the resin composition in particulate form, but (D) it is preferable that it is included in a form that is compatible with non-particulate resin components other than inorganic fillers. Therefore, (A) it is preferable that the fluorine atom-containing polymer is compatible with (B) epoxy resin and (C) active ester compound.

[0057] (A) Examples of commercially available fluorine atom-containing polymers include Lumiflon "LF200", "LF302", "LF400", "LF600", "LF600X", "LF800", "LF906N", "LF910LM", "LF916N", "LF936", and "LE9010" manufactured by Asahi Glass Co., Ltd., and one or more of these can be used.

[0058] The content of (A) fluorine atom-containing polymer in the resin composition is not particularly limited, but from the viewpoint of obtaining a higher glass transition temperature of the cured product and ensuring sufficient copper plating peel strength, it is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass. From the viewpoint of further suppressing the arithmetic mean roughness and further improving the copper plating peel strength, it is even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The lower limit of the content of (A) fluorine atom-containing polymer in the resin composition is not particularly limited, but from the viewpoint of obtaining the desired effects of the present invention more significantly, it is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.3% by mass or more, even more preferably 0.4% by mass or more, and particularly preferably 0.45% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass.

[0059] <(B) Epoxy resin> The resin composition of the present invention contains (B) epoxy resin. (B) epoxy resin is a curable resin having epoxy groups.

[0060] (B) Examples of epoxy resins include bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol novolac-type epoxy resin, phenol novolac-type epoxy resin, tert-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, cresol novolac-type epoxy resin, phenol aralkyl-type epoxy resin, biphenyl-type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro-ring-containing epoxy resin, cyclohexane-type epoxy resin, cyclohexanedimethanol-type epoxy resin, naphthylene ether-type epoxy resin, trimethylol-type epoxy resin, tetraphenylethane-type epoxy resin, isocyanurate-type epoxy resin, phenolphthaleimidine-type epoxy resin, and the like. (B) Epoxy resin may be used alone or in combination of two or more types.

[0061] The resin composition preferably contains an epoxy resin having two or more epoxy groups per molecule as (B) epoxy resin. The proportion of epoxy resin having two or more epoxy groups per molecule relative to 100% by mass of the nonvolatile component of (B) epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0062] Epoxy resins include epoxy resins that are liquid at 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition of the present invention may contain only liquid epoxy resin, or only solid epoxy resin, or a combination of liquid epoxy resin and solid epoxy resin.

[0063] As the liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferred.

[0064] Preferred liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, and epoxy resin having a butadiene structure.

[0065] Specific examples of liquid epoxy resins include: DIC Corporation's "HP4032", "HP4032D", "HP4032SS" (naphthalene-type epoxy resin); Mitsubishi Chemical Corporation's "828US", "828EL", "jER828EL", "825", "Epicote 828EL" (bisphenol A-type epoxy resin); Mitsubishi Chemical Corporation's "jER807", "1750" (bisphenol F-type epoxy resin); Mitsubishi Chemical Corporation's "jER152" (phenol novolac-type epoxy resin); Mitsubishi Chemical Corporation's "630", "630LSD", "604" (glycidylamine-type epoxy resin); ADEKA Corporation's "ED-523T" (glycyrrhizol-type epoxy resin); ADEKA Corporation's "EP-3950L", "EP-3980S" ( Examples include glycidylamine-type epoxy resins; ADEKA's "EP-4088S" (dicyclopentadiene-type epoxy resin); Nippon Steel Chemical & Material's "ZX1059" (a mixture of bisphenol A-type epoxy resin and bisphenol F-type epoxy resin); Nagase ChemteX's "EX-721" (glycidyl ester-type epoxy resin); Daicel's "Celoxide 2021P" (alicyclic epoxy resin with an ester skeleton); Daicel's "PB-3600", Nippon Soda's "JP-100" and "JP-200" (epoxy resins with a butadiene structure); and Nippon Steel Chemical & Material's "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane-type epoxy resins). These can be used individually or in combination of two or more types.

[0066] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups per molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups per molecule is more preferred.

[0067] Preferred solid epoxy resins include bixylenol-type epoxy resin, naphthalene-type epoxy resin, naphthalene-type tetrafunctional epoxy resin, naphthol novolac-type epoxy resin, cresol novolac-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol-type epoxy resin, biphenyl-type epoxy resin, naphthylene ether-type epoxy resin, anthracene-type epoxy resin, bisphenol A-type epoxy resin, bisphenol AF-type epoxy resin, phenol aralkyl-type epoxy resin, tetraphenylethane-type epoxy resin, and phenolphthaleimidine-type epoxy resin.

[0068] Specific examples of solid epoxy resins include DIC's "HP4032H" (naphthalene-type epoxy resin); DIC's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC's "N-690" (cresol novolac-type epoxy resin); DIC's "N-695" (cresol novolac-type epoxy resin); DIC's "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene-type epoxy resins); and DIC's "EXA-7311". "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V", "ESN4 100V (naphthalene-type epoxy resin); "ESN485" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", "YL7890" (bixylenol-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "Y Examples include "X7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" from Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) from Mitsubishi Chemical Corporation; "YL7800" (fluorene type epoxy resin) from Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) from Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) from Mitsubishi Chemical Corporation; and "WHR991S" (phenolphthalein type epoxy resin) from Nippon Kayaku Co., Ltd.These can be used individually or in combination of two or more types.

[0069] (B) When using a combination of liquid epoxy resin and solid epoxy resin as the epoxy resin, their mass ratio (liquid epoxy resin:solid epoxy resin) is preferably 20:1 to 1:20, more preferably 10:1 to 1:10, and particularly preferably 7:1 to 1:7.

[0070] (B) The epoxy equivalent of the epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 2,000 g / eq., even more preferably 70 g / eq. to 1,000 g / eq., and even more preferably 80 g / eq. to 500 g / eq. The epoxy equivalent is the mass of resin per equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0071] (B) The weight-average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight-average molecular weight of the resin can be measured as a polystyrene equivalent by gel permeation chromatography (GPC).

[0072] The content of epoxy resin (B) in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass, it is preferably less than 30% by mass, more preferably 25% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 10% by mass or less. The lower limit of the content of epoxy resin (B) in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass, it is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1% by mass or more, even more preferably 3% by mass or more, and particularly preferably 5% by mass or more.

[0073] The mass ratio of (B) epoxy resin to (A) fluorine atom-containing polymer in the resin composition (component (B) / component (A)) is preferably 0.1 or more, more preferably 0.3 or more, and particularly preferably 0.5 or more. The upper limit of the mass ratio of (B) epoxy resin to (A) fluorine atom-containing polymer in the resin composition (component (B) / component (A)) is preferably 50 or less, more preferably 30 or less, and particularly preferably 20 or less.

[0074] <(C) Active ester compound> The resin composition of the present invention contains (C) an active ester compound. The (C) active ester compound may be used alone or in combination of two or more in any ratio. The (C) active ester compound may function as an epoxy resin curing agent that reacts with (B) an epoxy resin to cure it.

[0075] (C) As the active ester compound, compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are generally preferred. The active ester compound is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. Particularly from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester compound obtained from a carboxylic acid compound and / or a naphthol compound is more preferred. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolac. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by the condensation of two phenol molecules with one dicyclopentadiene molecule.

[0076] Specifically, the (C) active ester compound is preferably a dicyclopentadiene-type active ester compound, a naphthalene-type active ester compound containing a naphthalene structure, an active ester compound containing an acetylated phenol novolac, or an active ester compound containing a benzoylated phenol novolac. More preferably, it is at least one selected from dicyclopentadiene-type active ester compounds and naphthalene-type active ester compounds, with dicyclopentadiene-type active ester compounds being even more preferred. The dicyclopentadiene-type active ester compound is preferably an active ester compound containing a dicyclopentadiene-type diphenol structure.

[0077] (C) Commercially available active ester compounds include, as active ester compounds containing a dicyclopentadiene-type diphenol structure, "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L", "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", "HPC-8000H-65TM" (manufactured by DIC); as active ester compounds containing a naphthalene structure, "HP-B-8151-62T", "EXB-8100L-65T", "EXB-8150-60T", "EXB-815 Examples include "0-62T", "EXB-9416-70BK", "HPC-8150-60T", "HPC-8150-62T", and "EXB-8" (manufactured by DIC Corporation); as a phosphorus-containing active ester compound, "EXB9401" (manufactured by DIC Corporation); as an active ester compound that is an acetylated phenol novolac, "DC808" (manufactured by Mitsubishi Chemical Corporation); as an active ester compound that is a benzoylated phenol novolac, "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation); and as an active ester compound containing a styryl group and a naphthalene structure, "PC1300-02-65MA" (manufactured by Air Water Corporation).

[0078] (C) The equivalent amount of the active ester group in the active ester compound is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The equivalent amount of the active ester group is the mass of the active ester compound per equivalent of the active ester group.

[0079] The content of the (C) active ester compound in the resin composition is 10% by mass or more, preferably 11% by mass or more, more preferably 12% by mass or more, even more preferably 13% by mass or more, and particularly preferably 14% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass. The upper limit of the content of the (C) active ester compound in the resin composition is not particularly limited, but preferably 50% by mass or less, more preferably 40% by mass or less, even more preferably 30% by mass or less, even more preferably 25% by mass or less, and particularly preferably 20% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass.

[0080] The mass ratio of the active ester compound (C) to the fluorine atom-containing polymer (A) in the resin composition (component (C) / component (A)) is preferably 0.2 or more, more preferably 0.5 or more, and particularly preferably 1 or more. The upper limit of the mass ratio of the active ester compound (C) to the fluorine atom-containing polymer (A) in the resin composition (component (C) / component (A)) is preferably 100 or less, more preferably 60 or less, and particularly preferably 40 or less.

[0081] <(C') Other hardeners> The resin composition of the present invention may further contain a curing agent (C') other than component (C) as an optional component. The other curing agent (C') may be used alone or in any combination of two or more types. The other curing agent (C') may function as an epoxy resin curing agent that reacts with the epoxy resin (B) and hardens, similar to the active ester compound (C).

[0082] (C') Other curing agents are not particularly limited, but include, for example, phenolic curing agents, carbodiimide curing agents, acid anhydride curing agents, amine curing agents, benzoxazine curing agents, cyanate ester curing agents, and thiol curing agents. The resin composition of the present invention is particularly preferably to contain a curing agent selected from the group consisting of phenolic curing agents and carbodiimide curing agents.

[0083] As a phenolic curing agent, a phenolic curing agent having a novolac structure is preferred from the viewpoint of heat resistance and water resistance. Furthermore, from the viewpoint of adhesion to the adherend, a nitrogen-containing phenolic curing agent is preferred, and a triazine skeleton-containing phenolic curing agent is more preferred. Among these, a triazine skeleton-containing phenol novolac resin is preferred from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion. Specific examples of phenol-based curing agents include, for example, "MEH-7700," "MEH-7810," and "MEH-7851" from Meiwa Kasei Co., Ltd., "NHN," "CBN," and "GPH" from Nippon Kayaku Co., Ltd., "SN-170," "SN-180," "SN-190," "SN-475," "SN-485," "SN-495," "SN-375," and "SN-395" from Nippon Steel Chemical & Material Co., Ltd., and "LA-7052," "LA-7054," "LA-3018," "LA-3018-50P," "LA-1356," "TD2090," and "TD-2090-60M" from DIC Corporation.

[0084] Examples of carbodiimide-based curing agents include curing agents having one or more, preferably two or more, carbodiimide structures in one molecule, such as aliphatic biscarbodiimides like tetramethylene-bis(t-butylcarbodiimide) and cyclohexanebis(methylene-t-butylcarbodiimide); biscarbodiimides like aromatic biscarbodiimides like phenylene-bis(xylylcarbodiimide); and aliphatic polycarbodiimides like polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylenebiscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide). Examples of polycarbodiimides include aromatic polycarbodiimides such as poly(phenylenecarbodiimide), poly(naphthylenecarbodiimide), poly(trylenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), and poly[methylenebis(methylphenylene)carbodiimide].

[0085] Examples of commercially available carbodiimide-based curing agents include "Carbodilite V-02B," "Carbodilite V-03," "Carbodilite V-04K," "Carbodilite V-07," and "Carbodilite V-09" from Nisshinbo Chemical Co., Ltd., and "Stabaczol P," "Stabaczol P400," and "Hycazil 510" from Rhein Chemie Corporation.

[0086] Examples of acid anhydride-based curing agents include curing agents having one or more acid anhydride groups in one molecule, and curing agents having two or more acid anhydride groups in one molecule are preferred. Specific examples of acid anhydride-based curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexen-1,2-dicarboxylic acid anhydride, trimellitic anhydride, pyromellitic anhydride, and bensophenone tetracarboxylic acid di Examples include anhydrides, biphenyltetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, oxydiphthalic acid dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic acid dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymer-type acid anhydrides such as styrene-maleic acid resin obtained by copolymerizing styrene and maleic acid. Commercially available acid anhydride-based curing agents include "HNA-100," "MH-700," "MTA-15," "DDSA," and "OSA" from Shin Nippon Rika Co., Ltd., "YH-306" and "YH-307" from Mitsubishi Chemical Corporation, "HN-2200" and "HN-5500" from Hitachi Chemical Co., Ltd., and "EF-30," "EF-40," "EF-60," and "EF-80" from Clay Valley Corporation.

[0087] Examples of amine-based curing agents include curing agents having one or more, preferably two or more, amino groups in one molecule. Examples include aliphatic amines, polyetheramines, alicyclic amines, aromatic amines, and among these, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl) Examples include propyl propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. Amine-based curing agents may be commercially available products, such as "SEIKACURE-S" from Seika Corporation, "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" from Nippon Kayaku Co., Ltd., and "Epicure W" from Mitsubishi Chemical Corporation.

[0088] Specific examples of benzoxazine-based curing agents include "JBZ-OP100D" and "ODA-BOZ" from JFE Chemical Corporation; "HFB2006M" from Showa Polymer Co., Ltd.; and "Pd" and "Fa" from Shikoku Chemicals Co., Ltd.

[0089] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate (oligo(3-methylene-1,5-phenylene cyanate)), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl) thioether, and bis(4-cyanatephenyl) ether; polyfunctional cyanate resins derived from phenol novolacs and cresol novolacs; and prepolymers in which these cyanate resins are partially triazined. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (both phenol novolac type polyfunctional cyanate ester resins) manufactured by Lonza Japan, "BA230", and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate is triazined and trimerized).

[0090] Examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), and tris(3-mercaptopropyl) isocyanurate.

[0091] (C') The reactive group equivalent of the other curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The reactive group equivalent is the mass of the curing agent per equivalent of one reactive group.

[0092] The content of (C') other curing agents in the resin composition is not particularly limited, but is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass. The lower limit of the content of (C') other curing agents in the resin composition is not particularly limited, but is, for example, 0% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 1% by mass or more, 2% by mass or more, etc., when the nonvolatile components in the resin composition are taken as 100% by mass.

[0093] The content of the (C) active ester compound in the resin composition is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, and particularly preferably 50% by mass or more, when the total of the (C) active ester compound and (C') other curing agents in the resin composition is taken as 100% by mass.

[0094] <(D) Inorganic filler> The resin composition of the present invention contains (D) an inorganic filler. (D) The inorganic filler is included in the resin composition in the form of particles.

[0095] (D) Inorganic compounds are used as the material for the inorganic filler. (D) Examples of materials for the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Spherical silica is preferred as the silica. (D) The inorganic filler may be used alone or in combination of two or more types in any ratio.

[0096] (D) Examples of commercially available inorganic fillers include "UFP-30" from Denka Chemical Industries, Ltd.; "SP60-05" and "SP507-05" from Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" from Admatex Co., Ltd.; "UFP-30" from Denka Co., Ltd.; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" from Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" from Admatex Co., Ltd.; and "DAW-03" and "FB-105FD" from Denka Co., Ltd.

[0097] The average particle diameter of the inorganic filler (D) is not particularly limited, but is preferably 10 µm or less, more preferably 5 µm or less, still more preferably 2 µm or less, even more preferably 1 µm or less, and particularly preferably 0.7 µm or less. The lower limit of the average particle diameter of the inorganic filler (D) is not particularly limited, but is preferably 0.01 µm or more, more preferably 0.05 µm or more, still more preferably 0.1 µm or more, and particularly preferably 0.2 µm or more. The average particle diameter of the inorganic filler (D) can be measured by a laser diffraction-scattering method based on Mie scattering theory. Specifically, the measurement can be performed by preparing a volume-based particle size distribution of the inorganic filler using a laser diffraction scattering particle size distribution analyzer, and taking the median diameter thereof as the average particle diameter. A measurement sample can be prepared by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial, and dispersing the mixture with ultrasonic waves for 10 minutes. The measurement sample was subjected to measurement of a volume-based particle size distribution of the inorganic filler by a flow cell method using a laser diffraction particle size distribution analyzer with blue and red light source wavelengths used, and the average particle diameter was calculated as the median diameter from the obtained particle size distribution. Examples of the laser diffraction particle size distribution analyzer include "LA-960" manufactured by Horiba, Ltd.

[0098] The specific surface area of the inorganic filler (D) is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5 m 2 / g or more, still more preferably 1 m 2 / g or more, and particularly preferably 3 m 2 / g or more. The upper limit of the specific surface area of the inorganic filler (D) is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 70 m 2 / g or less, still more preferably 50 m 2 / g or less, and particularly preferably 40 m 2 / g or less. The specific surface area of the inorganic filler can be obtained according to the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area analyzer (Macsorb HM-1210 manufactured by Mountech Co., Ltd.), and calculating the specific surface area using the BET multipoint method.

[0099] (D) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of surface treatment agents include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, titanate coupling agents, etc. Furthermore, the surface treatment agent may be used alone or in any combination of two or more types.

[0100] Examples of commercially available surface treatment agents include "KBM403" (3-glycidoxypropyltrimethoxysilane), "KBM803" (3-mercaptopropyltrimethoxysilane), "KBE903" (3-aminopropyltriethoxysilane), "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), "SZ-31" (hexamethyldisilazane), "KBM103" (phenyltrimethoxysilane), "KBM-4803" (long-chain epoxy-type silane coupling agent), and "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane), all manufactured by Shin-Etsu Chemical Co., Ltd.

[0101] From the viewpoint of improving the dispersibility of the inorganic filler, the degree of surface treatment by the surface treatment agent is preferably within a predetermined range. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2% to 5% by mass of the surface treatment agent, more preferably with 0.2% to 3% by mass, and even more preferably with 0.3% to 2% by mass.

[0102] The degree of surface treatment by a surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler should be 0.02 mg / m². 2 The above is preferred, and 0.1 mg / m²2 The above is more preferable, 0.2 mg / m² 2 The above is even more preferable. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition and the melt viscosity in sheet form, 1.0 mg / m² 2 The following is preferred: 0.8 mg / m² 2 The following is more preferable: 0.5 mg / m² 2 The following are even more preferable.

[0103] (D) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after cleaning the inorganic filler with a solvent (e.g., methyl ethyl ketone (MEK)) after surface treatment. Specifically, a sufficient amount of MEK as the solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solids, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, a Horiba "EMIA-320V" or similar can be used.

[0104] The content of (D) inorganic filler in the resin composition is 60% by mass or more, preferably 63% by mass or more, more preferably 66% by mass or more, even more preferably 68% by mass or more, and particularly preferably 70% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass. The upper limit of the content of (D) inorganic filler in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass or more, it may be preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less, and particularly preferably 75% by mass or less.

[0105] The mass ratio of (D) inorganic filler to (A) fluorine atom-containing polymer in the resin composition (component (D) / component (A)) is preferably 1 or more, more preferably 3 or more, and particularly preferably 5 or more. The upper limit of the mass ratio of (D) inorganic filler to (A) fluorine atom-containing polymer in the resin composition (component (D) / component (A)) is preferably 500 or less, more preferably 300 or less, and particularly preferably 200 or less.

[0106] <(E) Radical polymerizable compounds> The resin composition of the present invention may further contain (E) a radical polymerizable compound as an optional component. The (E) radical polymerizable compound may be used alone or in any combination of two or more types.

[0107] (E) The radical polymerizable compound is, in one embodiment, a radical polymerizable compound having an ethylenically unsaturated bond. (E) The radical polymerizable compound is not particularly limited, but may have, for example, unsaturated hydrocarbon groups such as allyl group, 3-cyclohexenyl group, 3-cyclopentenyl group, p-vinylphenyl group, m-vinylphenyl group, o-vinylphenyl group; or radical polymerizable groups such as acryloyl group, methacryloyl group, maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl group), or α,β-unsaturated carbonyl group. (E) It is preferable that the radical polymerizable compound has two or more radical polymerizable groups.

[0108] (E) Examples of radical polymerizable compounds include (meth)acrylic radical polymerizable compounds, styrene radical polymerizable compounds, allyl radical polymerizable compounds, maleimide radical polymerizable compounds, etc.

[0109] (Meth)acrylic radical polymerizable compounds are, for example, compounds having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of (meth)acrylic radical polymerizable compounds include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, and 1,9- Low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds such as nandiol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tetra(meth)acrylate; dioxaneglycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di( Examples include low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as meth)acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, and propoxylated bisphenol A di(meth)acrylate; low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl) isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl) isocyanurate tri(meth)acrylate, and ethoxylated isocyanurate tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Examples of commercially available (meth)acrylic radical polymerizable compounds include "A-DOG" (dioxane glycol diacrylate) from Shin Nakamura Chemical Industry Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) from Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) from Nippon Kayaku Co., Ltd., and "SA9000" and "SA9000-111" (methacrylic modified polyphenylene ether) from SABIC Innovative Plastics Co., Ltd.

[0110] Styrene-based radical polymerizable compounds are, for example, compounds having one or more, preferably two or more vinyl groups directly bonded to an aromatic carbon atom. Examples of styrene-based radical polymerizable compounds include low molecular weight (molecular weight less than 1000) styrene compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl) ether; and high molecular weight (molecular weight 1000 or more) styrene compounds such as vinylbenzyl-modified polyphenylene ether resins and styrene-divinylbenzene copolymers. Examples of commercially available styrene-based radical polymerizable compounds include "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymer) from Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St 1200" and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resin) from Mitsubishi Gas Chemical Co., Ltd.

[0111] Allyl radical polymerizable compounds are, for example, compounds having one or more, preferably two or more, allyl groups. Examples of allyl radical polymerizable compounds include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylic acid, and diallyl 2,3-naphthalenecarboxylic acid; isocyanuric acid allyl ester compounds such as 1,3,5-trialyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; epoxy-containing aromatic allyl compounds such as 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazine-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-trialyl etherbenzene; and allyl silane compounds such as diallyldiphenylsilane. Commercially available allyl radical polymerizable compounds include "TAIC" (1,3,5-triallyl isocyanurate) from Nippon Chemical Industries, Ltd., "DAD" (diallyl diphenate) from Nichishoku Techno Fine Chemicals Co., Ltd., "TRIAM-705" (triallyl trimellitate) from Wako Pure Chemical Industries, Ltd., "DAND" (2,3-diallyl naphthalenecarboxylate) from Nippon Distillation Industry Co., Ltd., "ALP-d" (bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazine-3-yl)phenyl]methane) from Shikoku Chemicals, Ltd., "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane) from Nippon Kayaku Co., Ltd., and "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) from Shikoku Chemicals, Ltd.

[0112] Maleimide-based radical polymerizable compounds are, for example, compounds having one or more, preferably two or more, maleimide groups. Maleimide-based radical polymerizable compounds may be aliphatic maleimide compounds containing an aliphatic amine skeleton or aromatic maleimide compounds containing an aromatic amine skeleton. Examples of commercially available products include "SLK-2600" from Shin-Etsu Chemical Co., Ltd., "BMI-1500", "BMI-1700", "BMI-3000J", "BMI-689", and "BMI-2500" (maleimide compounds containing a dimer amine structure) from Designer Molecules, "BMI-6100" (aromatic maleimide compound) from Designer Molecules, "MIR-5000-60T" and "MIR-3000-70MT" (biphenyl aralkyl type maleimide compounds) from Nippon Kayaku Co., Ltd., "BMI-70" and "BMI-80" from K.I. Chemicals Co., Ltd., and "BMI-2300" and "BMI-TMH" from Yamato Chemical Industries, Ltd. Furthermore, a maleimide resin (indane ring skeleton-containing maleimide compound) disclosed in the Japan Institute of Invention and Innovation, Technical Report No. 2020-500211, may also be used as the maleimide-based radical polymerizable compound.

[0113] (E) The ethylenically unsaturated bond equivalent of the radical polymerizable compound is preferably 20 g / eq. to 3000 g / eq., more preferably 50 g / eq. to 2500 g / eq., even more preferably 70 g / eq. to 2000 g / eq., and particularly preferably 90 g / eq. to 1500 g / eq. The ethylenically unsaturated bond equivalent is the mass of the radical polymerizable compound per ethylenically unsaturated bond equivalent.

[0114] (E) The weight-average molecular weight (Mw) of the radical polymerizable compound is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited, but may be, for example, 150 or more.

[0115] The content of the (E) radical polymerizable compound in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass, it is preferably 25% by mass or less, more preferably 15% by mass or less, even more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The lower limit of the content of the (E) radical polymerizable compound in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass, for example, it is 0% by mass or more, 0.001% by mass or more, preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and particularly preferably 0.5% by mass or more.

[0116] <(F) Curing accelerator> The resin composition of the present invention may further contain (F) a curing accelerator as an optional component. The (F) curing accelerator functions as a curing catalyst that accelerates the curing of (B) epoxy resin.

[0117] Examples of curing accelerators include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. Among these, imidazole-based curing accelerators are preferred from the viewpoint of improving crosslinkability. (F) The curing accelerator may be used alone or in combination of two or more types.

[0118] Examples of phosphorus-based curing accelerators include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium) pyromelitate, tetrabutylphosphonium hydrogen hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butyldimethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium bromide. Aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone addition products such as triphenylphosphine-p-benzoquinone addition products; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine Examples include aromatic phosphines such as tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether.

[0119] Examples of urea-based curing accelerators include aliphatic dimethylureas such as 1,1-dimethylurea, 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. Aromatic dimethylureas such as toluenebisdimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluenebisdimethylurea] are examples.

[0120] Examples of guanidine-based curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]deca-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]deca-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide.

[0121] Examples of imidazole-based curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2- Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl -(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate adduct, 2-phenylimidazole isocyanurate adduct Examples include imidazole compounds such as 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins.

[0122] Commercially available imidazole-based curing accelerators may be used, such as "1B2PZ," "2MZA-PW," and "2PHZ-PW" from Shikoku Chemicals, and "P200-H50" from Mitsubishi Chemical Corporation.

[0123] Examples of metal-based hardening accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0124] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene.

[0125] As an amine-based curing accelerator, commercially available products may be used, such as "MY-25" manufactured by Ajinomoto Fine Techno Co., Ltd.

[0126] The content of (F) curing accelerator in the resin composition is not particularly limited, but is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 1% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass. The lower limit of the content of (F) curing accelerator in the resin composition is not particularly limited, but is, for example, 0% by mass or more, 0.001% by mass or more, 0.01% by mass or more, 0.05% by mass or more, etc., when the nonvolatile components in the resin composition are taken as 100% by mass.

[0127] <(G)Thermoplastic resin> The resin composition of the present invention may further contain (G) a thermoplastic resin as an optional component. The (G) thermoplastic resin described herein is a component other than the (E) radical polymerizable compound described above.

[0128] (G) Examples of thermoplastic resins include polyimide resins, phenoxy resins, polyvinyl acetal resins, polyolefin resins, polybutadiene resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polycarbonate resins, polyetheretherketone resins, polyester resins, etc. (G) In one embodiment, the thermoplastic resin preferably includes a thermoplastic resin selected from the group consisting of polyimide resins and phenoxy resins, and more preferably includes a phenoxy resin. Furthermore, the thermoplastic resin may be used alone or in combination of two or more types.

[0129] Specific examples of polyimide resins include "SLK-6100" manufactured by Shin-Etsu Chemical Co., Ltd., and "Ricacoat SN20" and "Ricacoat PN20" manufactured by Shin-Nippon Rika Co., Ltd.

[0130] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal end of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.

[0131] Specific examples of phenoxy resins include "1256" and "4250" (both phenoxy resins containing a bisphenol A skeleton) manufactured by Mitsubishi Chemical Corporation; "YX8100" (phenoxy resin containing a bisphenol S skeleton) manufactured by Mitsubishi Chemical Corporation; "YX6954" (phenoxy resin containing a bisphenol acetophenone skeleton) manufactured by Mitsubishi Chemical Corporation; "FX280" and "FX293" manufactured by Nippon Steel & Sumitomo Metal Chemical Corporation; and "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", "YL7482", and "YL7891BH30" manufactured by Mitsubishi Chemical Corporation.

[0132] Examples of polyvinyl acetal resins include polyvinyl formal resin and polyvinyl butyral resin, with polyvinyl butyral resin being preferred. Specific examples of polyvinyl acetal resins include "Denka Butyral 4000-2", "Denka Butyral 5000-A", "Denka Butyral 6000-C", and "Denka Butyral 6000-EP" from Denki Kagaku Kogyo Co., Ltd.; and S-Rec BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, and BM series from Sekisui Chemical Co., Ltd.

[0133] Examples of polyolefin resins include ethylene-based copolymer resins such as low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin polymers such as polypropylene and ethylene-propylene block copolymer.

[0134] Examples of polybutadiene resins include hydrogenated polybutadiene skeleton-containing resins, hydroxyl group-containing polybutadiene resins, phenolic hydroxyl group-containing polybutadiene resins, carboxyl group-containing polybutadiene resins, acid anhydride group-containing polybutadiene resins, epoxy group-containing polybutadiene resins, isocyanate group-containing polybutadiene resins, urethane group-containing polybutadiene resins, and polyphenylene ether-polybutadiene resins.

[0135] Specific examples of polyamide-imide resins include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Co., Ltd. Other specific examples of polyamide-imide resins include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical Co., Ltd.

[0136] Specific examples of polyethersulfone resins include "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0137] Specific examples of polysulfone resins include Solvay Advanced Polymers' polysulfones "P1700" and "P3500".

[0138] Specific examples of polyphenylene ether resins include "NORYL SA90" manufactured by SABIC. Specific examples of polyetherimide resins include "Ultem" manufactured by GE.

[0139] Examples of polycarbonate resins include hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, and urethane group-containing carbonate resins. Specific examples of polycarbonate resins include "FPC0220" from Mitsubishi Gas Chemical Co., Ltd., "T6002" and "T6001" (polycarbonate diols) from Asahi Kasei Chemicals Corporation, and "C-1090," "C-2090," and "C-3090" (polycarbonate diols) from Kuraray Co., Ltd. Specific examples of polyether ether ketone resins include "Sumiproi K" from Sumitomo Chemical Co., Ltd.

[0140] Examples of polyester resins include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, and polycyclohexanedimethyl terephthalate resin.

[0141] (G) The weight-average molecular weight (Mw) of the thermoplastic resin is preferably 5,000 or more, more preferably 8,000 or more, even more preferably 10,000 or more, particularly preferably 20,000 or more, preferably 100,000 or less, more preferably 70,000 or less, even more preferably 60,000 or less, and particularly preferably 50,000 or less, from the viewpoint of significantly obtaining the effects of the present invention.

[0142] The content of (G) thermoplastic resin in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass, from the viewpoint of significantly obtaining the desired effects of the present invention, it is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less. The lower limit of the content of (G) thermoplastic resin in the resin composition is not particularly limited, but when the nonvolatile components in the resin composition are taken as 100% by mass, it may be, for example, 0% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 0.5% by mass or more, etc.

[0143] <(H) Other additives> The resin composition of the present invention may further contain any additives as non-volatile components. Examples of such additives include: radical polymerization initiators such as peroxide-based radical polymerization initiators and azo-based radical polymerization initiators; thermosetting resins other than epoxy resins such as epoxy acrylate resins, urethane acrylate resins, urethane resins, cyanate resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, and silicone resins; organic fillers such as rubber particles; organometallic compounds such as organocenium compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium dioxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentonite and montmorillonite; and defoaming agents such as silicone-based defoaming agents, acrylic-based defoaming agents, fluorine-based defoaming agents, and vinyl resin-based defoaming agents. Examples of materials include: UV absorbers such as benzotriazole UV absorbers; adhesion improvers such as urea silane; adhesion fertilizers such as triazole adhesion fertilizers, tetrazole adhesion fertilizers, and triazine adhesion fertilizers; antioxidants such as hindered phenol antioxidants; fluorescent whitening agents such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester dispersants, polyoxyalkylene dispersants, acetylene dispersants, silicone dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic acid anhydride-based stabilizers. (H) Other additives may be used individually or in combination of two or more in any ratio. (H) The content of other additives can be appropriately determined by a person skilled in the art.

[0144] <(I) Organic Solvents> The resin composition of the present invention may further contain any organic solvent as a volatile component in addition to the non-volatile component described above. (I) Known organic solvents can be used as appropriate, and the type is not particularly limited. (I) Examples of organic solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methoxypropionic acid Examples include ether ester solvents such as methyl; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (I) Organic solvents may be used individually or in combination of two or more in any ratio.

[0145] In one embodiment, (I) the content of the organic solvent is not particularly limited, but when the total components in the resin composition are considered to be 100% by mass, it may be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, etc.

[0146] <Method for producing resin compositions> The resin composition of the present invention can be produced, for example, by adding (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, (D) an inorganic filler, optionally (C') other curing agents, optionally (E) a radical polymerizable compound, optionally (F) a curing accelerator, optionally (G) a thermoplastic resin, optionally (H) other additives, and optionally (I) an organic solvent, in any order and / or partially or entirely simultaneously, and mixing them in any preparation container. The temperature can be set appropriately during the process of adding and mixing each component, and heating and / or cooling may be performed temporarily or throughout the process. The resin composition may also be stirred or shaken using, for example, a stirring device such as a mixer or a shaking device during or after the process of adding and mixing, to ensure uniform dispersion. Degassing may also be performed simultaneously with stirring or shaking under low-pressure conditions such as vacuum.

[0147] <Properties of resin compositions> The resin composition of the present invention comprises (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, wherein the content of (C) the active ester compound is 10% by mass or more, and the content of (D) the inorganic filler is 60% by mass or more. By using such a resin composition, the dielectric loss tangent (Df) of the cured product can be kept low, and the occurrence of unevenness after lamination can be suppressed.

[0148] The cured product of the resin composition of the present invention may have the characteristic of having a low dielectric loss tangent (Df). Therefore, in one embodiment, when measured at 5.8 GHz and 23°C as in Test Example 1 below, the dielectric loss tangent (Df) of the cured product of the resin composition may be preferably 0.0200 or less, 0.0100 or less, more preferably 0.0080 or less, 0.0070 or less, 0.0060 or less, 0.0050 or less, even more preferably 0.0040 or less, 0.0035 or less, 0.0030 or less, and particularly preferably 0.0027 or less and 0.0026 or less.

[0149] The resin composition of the present invention may have the characteristic of being able to suppress the occurrence of unevenness after lamination. Therefore, in one embodiment, when the resin composition of the present invention is laminated to an inner layer substrate as shown in Test Example 2 below, and the indentation of the resin around the inner layer substrate is observed, no indentation is observed.

[0150] In one embodiment, the cured product of the resin composition of the present invention may have the characteristic of having a low arithmetic mean roughness (Ra) of the surface after roughening treatment. Therefore, in one embodiment, the arithmetic mean roughness (Ra) of the surface of the cured product after roughening treatment, as measured as in Test Example 3 below, may be preferably 300 nm or less, more preferably 200 nm or less, even more preferably 150 nm or less, even more preferably 100 nm or less, and particularly preferably 50 nm or less. The lower limit is not particularly limited and may be, for example, 1 nm or more, 2 nm or more, etc.

[0151] In one embodiment, the cured product of the resin composition of the present invention may have the characteristic of excellent copper plating peel strength. Therefore, in one embodiment, as shown in Test Example 4 below, a copper plating conductor layer is formed on the cured product, and the copper plating peel strength calculated from the load when the copper plating conductor layer is peeled off in the vertical direction may be preferably 0.2 kgf / cm or more, more preferably 0.25 kgf / cm or more, even more preferably 0.3 kgf / cm or more, particularly preferably 0.35 kgf / cm or more, or 0.38 kgf / cm or more. There is no particular upper limit, but for example, it may be 10 kgf / cm or less.

[0152] <Uses of resin compositions> The resin composition of the present invention can be suitably used as a resin composition for insulating applications, particularly as a resin composition for forming an insulating layer. Specifically, it can be suitably used as a resin composition for forming an insulating layer (including a redistribution layer) on which a conductor layer (including a redistribution layer) is formed (a resin composition for forming an insulating layer for forming a conductor layer). Furthermore, in printed circuit boards described later, it can be suitably used as a resin composition for forming an insulating layer on a printed circuit board (a resin composition for forming an insulating layer on a printed circuit board). The resin composition of the present invention can also be used in a wide range of applications where a resin composition is required, such as sheet-like laminated materials like resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor encapsulants, hole-filling resins, and component-embedding resins.

[0153] Furthermore, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a redistribution-forming layer (resin composition for forming a redistribution-forming layer) as an insulating layer for forming a redistribution layer, and as a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). When the semiconductor chip package is manufactured, a redistribution layer may be further formed on the sealing layer. (1) A step of laminating a temporary fixing film onto the substrate, (2) A step of temporarily fixing the semiconductor chip onto a temporary fixing film, (3) A step of forming a sealing layer on a semiconductor chip, (4) Steps to peel off the substrate and temporary fixing film from the semiconductor chip, (5) A step of forming a rewiring layer as an insulating layer on the surface from which the substrate and temporary fixing film of the semiconductor chip have been peeled off, and (6) Step of forming a redistribution layer as a conductor layer on the redistribution formation layer.

[0154] Furthermore, since the resin composition of the present invention provides an insulating layer with good component embedding properties, it can be suitably used even when the printed wiring board is a circuit board with embedded components.

[0155] <Sheet-like laminated material> The resin composition of the present invention can be used by applying it in a varnish state, but industrially it is generally preferable to use it in the form of a sheet-like laminate material containing the resin composition.

[0156] As sheet-like laminated materials, the following resin sheets and prepregs are preferred.

[0157] In one embodiment, the resin sheet comprises a support and a resin composition layer provided on the support, the resin composition layer being formed from the resin composition of the present invention.

[0158] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, from the viewpoint of thinning the printed circuit board and providing a cured product with excellent insulating properties even if the cured product of the resin composition is a thin film. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more, 10 μm or more, etc.

[0159] Examples of support materials include films made of plastic materials, metal foils, and release paper, with films made of plastic materials and metal foils being preferred.

[0160] When using a film made of plastic material as a support, examples of plastic materials include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetylcellulose (TAC), polyether sulfide (PES), polyether ketones, and polyimides. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0161] When using metal foil as a support, examples of metal foil include copper foil and aluminum foil, with copper foil being preferred. As for copper foil, foil made of single-metal copper may be used, or foil made of an alloy of copper with another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0162] The support may have a matte finish, corona treatment, or antistatic treatment applied to the surface that bonds with the resin composition layer.

[0163] Furthermore, as the support, a support with a release layer may be used, which has a release layer on the surface that is bonded to the resin composition layer. Examples of release agents used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available products may be used as the support with a release layer, for example, PET films having a release layer mainly composed of an alkyd resin-based release agent, such as "SK-1", "AL-5", and "AL-7" from Lintec Corporation, "Lumirror T60" from Toray Industries, Inc., "Purex" from Teijin Corporation, and "Unipeel" from Unitika Corporation.

[0164] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When using a support with a release layer, it is preferable that the overall thickness of the support with the release layer is within the above range.

[0165] In one embodiment, the resin sheet may further include any additional layer as needed. Such an additional layer may be, for example, a protective film similar to the support, provided on the side of the resin composition layer that is not bonded to the support (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, the adhesion of dust and other debris to the surface of the resin composition layer and scratches can be suppressed.

[0166] Resin sheets can be manufactured, for example, by applying a resin varnish prepared by directly using a liquid resin composition or by dissolving the resin composition in an organic solvent, coating it onto a support using a die coater or the like, and then drying it to form a resin composition layer.

[0167] Examples of organic solvents include those similar to those described as components of the resin composition. The organic solvent may be used individually or in combination of two or more types.

[0168] Drying may be carried out by known methods such as heating or blowing hot air. The drying conditions are not particularly limited, but the resin composition layer should be dried so that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when using a resin composition or resin varnish containing 30% to 60% by mass of organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0169] The resin sheet can be stored by rolling it up. If the resin sheet has a protective film, it can be used after removing the protective film.

[0170] In one embodiment, the prepreg is formed by impregnating a sheet-like fibrous substrate with the resin composition of the present invention.

[0171] The sheet-like fibrous substrate used for the prepreg is not particularly limited, and commonly used prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning the printed circuit board, the thickness of the sheet-like fibrous substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fibrous substrate is not particularly limited, but is usually 10 μm or more.

[0172] Prepregs can be manufactured by known methods such as the hot melt method and the solvent method.

[0173] The thickness of the prepreg can be within the same range as the resin composition layer in the resin sheet described above.

[0174] The sheet-like laminated material of the present invention can be suitably used to form an insulating layer of a printed circuit board (for the insulating layer of a printed circuit board), and more suitably used to form an interlayer insulating layer of a printed circuit board (for the interlayer insulating layer of a printed circuit board).

[0175] <Printed wiring board> The printed circuit board of the present invention includes an insulating layer made of a cured product obtained by curing the resin composition of the present invention.

[0176] Printed circuit boards can be manufactured, for example, using the resin sheet described above, by a method including the following steps (I) and (II). (I) A process of laminating a resin sheet onto an inner layer substrate such that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., thermal curing) the resin composition layer to form an insulating layer.

[0177] The "internal layer substrate" used in process (I) is a material that serves as the substrate for a printed wiring board, and examples include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, thermosetting polyphenylene ether substrates, etc. The substrate may also have a conductive layer on one or both sides, and this conductive layer may be patterned. An internal layer substrate in which a conductive layer (circuit) is formed on one or both sides of the substrate is sometimes called an "internal layer circuit board." Furthermore, an intermediate product on which an insulating layer and / or a conductive layer is to be formed during the manufacturing of a printed wiring board is also included in the "internal layer substrate" as defined in this invention. If the printed wiring board is a circuit board with embedded components, an internal layer substrate with embedded components may be used.

[0178] Lamination of the inner layer substrate and the resin sheet can be performed, for example, by heating and pressing the resin sheet onto the inner layer substrate from the support side. Examples of the member used to heat and press the resin sheet onto the inner layer substrate (hereinafter also referred to as the "heat-pressing member") include a heated metal plate (such as a SUS end plate) or a metal roll (such as a SUS roll). It is preferable to press the resin sheet via an elastic material such as heat-resistant rubber, rather than directly pressing the heat-pressing member onto the resin sheet, so that the resin sheet can adequately follow the surface irregularities of the inner layer substrate.

[0179] Lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the heat-pressure temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the heat-pressure pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa, and the heat-pressure time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination may preferably be carried out under reduced pressure conditions of 26.7 hPa or less.

[0180] Lamination can be performed using a commercially available vacuum laminator. Examples of commercially available vacuum laminators include vacuum pressure laminators manufactured by Meiki Seisakusho Co., Ltd., vacuum applicators manufactured by Nikko Materials Co., Ltd., and batch-type vacuum pressure laminators.

[0181] After lamination, the laminated resin sheets may be smoothed by pressing a heat-sealing member from the support side under normal pressure (atmospheric pressure). The pressing conditions for the smoothing process can be the same as the heat-sealing conditions for lamination. The smoothing process can be performed using a commercially available laminator. Lamination and smoothing may be performed continuously using the commercially available vacuum laminator mentioned above.

[0182] The support may be removed between steps (I) and (II), or after step (II).

[0183] In step (II), the resin composition layer is cured (e.g., by thermal curing) to form an insulating layer made of the cured resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions commonly used when forming an insulating layer for printed circuit boards may be used.

[0184] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and even more preferably 170°C to 210°C. The curing time can be preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0185] Prior to thermal curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermal curing the resin composition layer, it may be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0186] In manufacturing printed circuit boards, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming the conductor layer. These steps (III) through (V) may be carried out according to various methods known to those skilled in the art that are used in the manufacture of printed circuit boards. If the support is removed after step (II), the removal of the support may be carried out between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (II) through (V) may be repeated to form a multilayer circuit board.

[0187] In other embodiments, the printed circuit board of the present invention can be manufactured using the prepreg described above. The manufacturing method is basically the same as when a resin sheet is used.

[0188] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be carried out using, for example, a drill, laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined according to the design of the printed circuit board.

[0189] Step (IV) is a process for roughening the insulating layer. Typically, smear removal is also performed in this step (IV). The procedure and conditions for the roughening process are not particularly limited, and known procedures and conditions commonly used when forming the insulating layer of a printed circuit board can be adopted. For example, the insulating layer can be roughened by performing swelling treatment with a swelling solution, roughening treatment with an oxidizing agent, and neutralization treatment with a neutralizing solution in this order.

[0190] The swelling solution used for the roughening treatment is not particularly limited, but examples include alkaline solutions and surfactant solutions, and is preferably an alkaline solution, with sodium hydroxide solution and potassium hydroxide solution being more preferred. Examples of commercially available swelling solutions include "Swelling Dip Securing P" and "Swelling Dip Securing SBU" manufactured by Atotec Japan. The swelling treatment with the swelling solution is not particularly limited, but can be carried out, for example, by immersing the insulating layer in a swelling solution at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 to 15 minutes.

[0191] The oxidizing agent used for the roughening treatment is not particularly limited, but examples include an alkaline permanganate solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigans P" manufactured by Attec Japan.

[0192] Furthermore, an acidic aqueous solution is preferred as the neutralizing solution used in the roughening treatment. A commercially available example is "Reduction Solution Securigant P" manufactured by Attec Japan.

[0193] The neutralization treatment can be carried out by immersing the treated surface, which has been roughened with an oxidizing agent, in a neutralization solution at 30°C to 80°C for 5 to 30 minutes. From the standpoint of workability, it is preferable to immerse the object, which has been roughened with an oxidizing agent, in a neutralization solution at 40°C to 70°C for 5 to 20 minutes.

[0194] In one embodiment, the root mean square roughness (Rq) of the insulating layer surface after roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. The lower limit is not particularly limited and can be, for example, 1 nm or more, 2 nm or more, etc. The root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0195] Step (V) is a step of forming a conductive layer, in which a conductive layer is formed on an insulating layer. The conductive material used for the conductive layer is not particularly limited. In a preferred embodiment, the conductive layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductive layer may be a single-metal layer or an alloy layer, and examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy). In particular, from the viewpoint of versatility in conductor layer formation, cost, and ease of patterning, single metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or alloy layers of nickel-chromium alloy, copper-nickel alloy, or copper-titanium alloy are preferred, single metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or alloy layers of nickel-chromium alloy are more preferred, and single metal layers of copper are even more preferred.

[0196] The conductive layer may be a single-layer structure, or it may be a multi-layer structure in which two or more single-metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductive layer is a multi-layer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy.

[0197] The thickness of the conductor layer depends on the desired printed circuit board design, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0198] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer using conventionally known techniques such as the semi-additive method or the fully additive method. From the viewpoint of ease of manufacture, it is preferable to form it by the semi-additive method. An example of forming the conductor layer by the semi-additive method is shown below.

[0199] First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After forming a metal layer on the exposed plating seed layer by electroplating, the mask pattern is removed. Then, the unnecessary plating seed layer can be removed by etching or other means to form a conductor layer having the desired wiring pattern.

[0200] In other embodiments, the conductor layer may be formed using metal foil. When forming the conductor layer using metal foil, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed and the metal foil is laminated onto the surface of the exposed resin composition layer. The lamination of the resin composition layer and the metal foil may be carried out by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Subsequently, the metal foil on the insulating layer can be used to form a conductor layer having a desired wiring pattern by conventional known techniques such as the subtractive method or the modified semi-additive method.

[0201] Metal foils can be manufactured by known methods such as electrolysis and rolling. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Oil & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0202] <Semiconductor device> The semiconductor device of the present invention includes the printed circuit board of the present invention. The semiconductor device of the present invention can be manufactured using the printed circuit board of the present invention.

[0203] Examples of semiconductor devices include various types of semiconductor devices used in electrical products (e.g., computers, mobile phones, digital cameras, and televisions) and vehicles (e.g., motorcycles, automobiles, trains, ships, and aircraft). [Examples]

[0204] The present invention will be described in detail below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing quantities mean "parts by mass" and "mass%", respectively, unless otherwise specified. Unless otherwise specified, the temperature and pressure conditions are room temperature (23°C) and atmospheric pressure (1 atm), respectively.

[0205] <Example 1> Fluorine-containing polymer (AGC Corporation's "LF-200") Hydroxyl value 31 mg KOH / g 1 part xylene solution (number average molecular weight approximately 15,000, non-volatile content 60%), 10 parts naphthalene-type epoxy resin (DIC Corporation "HP-4032-SS", 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent approximately 145 g / eq.), 30 parts active ester compound (DIC Corporation "HPC-8000-65T", active ester group equivalent approximately 223 g / eq., toluene solution with non-volatile content 65%), spherical silica surface-treated with silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM-573") (Admatex Corporation "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m²) 290 parts of (1 / g), 2 parts of a triazine skeleton-containing phenolic curing agent (DIC Corporation's "LA-3018-50P", active group equivalent of approximately 151 g / eq., 2-methoxypropanol solution with 50% non-volatile content), 5 parts of a carbodiimide curing agent (Nisshinbo Chemical Corporation's "V-03", active group equivalent of approximately 216 g / eq., toluene solution with 50% non-volatile content), and 0.5 parts of an imidazole curing accelerator (Shikoku Chemicals Co., Ltd.'s "1B2PZ", 1-benzyl-2-phenylimidazole) were mixed with 50 parts of MEK and uniformly dispersed in a high-speed rotary mixer to prepare a resin composition (resin varnish).

[0206] <Example 2> Instead of 1 part of the fluorine-containing polymer (AGC Corporation's "LF-200"), use 1 part of the fluorine-containing polymer (AGC Corporation's "LF-910LM") Hydroxyl value 63-73 mg KOH / g A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that 1 part of a xylene solution with a number-average molecular weight of approximately 10,000 and a non-volatile content of 65% and 1 part of phenoxy resin (Mitsubishi Chemical's "YX7553BH30", a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30%) was used, and 30 parts of an active ester compound (DIC's "HPC-8150-62T", an active ester group equivalent of approximately 220 g / eq., a toluene solution with a non-volatile content of 62% by mass) was used instead of 30 parts of the active ester compound (DIC's "HPC-8000-65T").

[0207] <Example 3> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that the amount of fluorine-containing polymer ("LF-200" manufactured by AGC Inc.) used was changed from 1 part to 4 parts, 30 parts of active ester compound ("HPC-8150-62T" manufactured by DIC Inc., with an active ester group equivalent of approximately 220 g / eq. and a toluene solution with a non-volatile component content of 62% by mass) were used instead of 30 parts of active ester compound ("HPC-8000-65T" manufactured by DIC Inc.), and the amount of imidazole-based curing accelerator ("1B2PZ" manufactured by Shikoku Chemicals, Inc.) used was changed from 0.5 parts to 0.1 parts.

[0208] <Example 4> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that the amount of spherical silica (SO-C2, manufactured by Admatex Corporation) surface-treated with a silane coupling agent (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 90 parts to 92 parts, 2 parts of biphenylaralkyl novolac type maleimide (MIR-3000-70MT, manufactured by Nippon Kayaku Co., Ltd., a MEK / toluene mixed solution with a non-volatile component content of 70%) were used, and the amount of imidazole-based curing accelerator (1B2PZ, manufactured by Shikoku Chemicals, Inc.) was changed from 0.5 parts to 0.1 parts.

[0209] <Example 5> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that the amount of spherical silica (SO-C2, manufactured by Admatex Corporation) surface-treated with a silane coupling agent (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 90 parts to 93 parts, and 1 part of a maleimide-terminated polyimide compound (BMI-1500, manufactured by DMI Corporation) was also used.

[0210] <Example 6> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that the amount of spherical silica (SO-C2, manufactured by Admatex Corporation) surface-treated with a silane coupling agent (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 90 parts to 93 parts, 2 parts of methacrylic-modified polyphenylene ether (SA9000-111, manufactured by SABIC Innovative Plastics Corporation) were used, 30 parts of an active ester compound (HPC-8150-62T, manufactured by DIC Corporation, with an active ester group equivalent of approximately 220 g / eq. and a toluene solution with a non-volatile component content of 62% by mass) were used instead of 30 parts of an active ester compound (HPC-8000-65T, manufactured by DIC Corporation), and the amount of imidazole-based curing accelerator (1B2PZ, manufactured by Shikoku Chemicals, Inc.) was changed from 0.5 parts to 0.1 parts.

[0211] <Example 7> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that the amount of spherical silica (SO-C2, manufactured by Admatex Corporation) surface-treated with a silane coupling agent (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 90 parts to 93 parts, 2 parts of vinyl benzyl-modified polyphenylene ether (OPE-2St 2200, manufactured by Mitsubishi Gas Chemical Co., Ltd., a toluene solution with 65% non-volatile content) were used, and 30 parts of an active ester compound (HPC-8150-62T, manufactured by DIC Corporation, with an active ester group equivalent of approximately 220 g / eq., a toluene solution with 62% by mass of non-volatile content) was used instead of 30 parts of the active ester compound (HPC-8000-65T, manufactured by DIC Corporation).

[0212] <Example 8> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that 20 parts of a fluorine-containing polymer (LF-910LM, manufactured by AGC, with a number average molecular weight of approximately 10,000 and a xylene solution with a non-volatile content of 65%) were used instead of 1 part of a fluorine-containing polymer (LF-200, manufactured by AGC); 30 parts of an active ester compound (HPC-8150-62T, manufactured by DIC, with an active ester group equivalent of approximately 220 g / eq. and a toluene solution with a non-volatile content of 62% by mass) were used instead of 30 parts of an active ester compound (HPC-8000-65T, manufactured by DIC); and the amount of spherical silica (SO-C2, manufactured by Admatex, Inc.) surface-treated with a silane coupling agent (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.) was changed from 90 parts to 98 parts.

[0213] <Comparative Example 1> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that two parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30," a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30%) were used instead of one part of fluorine-containing polymer (AGC's "LF-200").

[0214] <Comparative Example 2> A resin composition (resin varnish) was prepared in the same manner as in Example 1, except that 2 parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30," a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30%) were used instead of 1 part of fluorine-containing polymer (AGC Corporation's "LF-200"), and 30 parts of active ester compound (DIC Corporation's "HPC-8150-62T," a toluene solution with an active ester group equivalent of approximately 220 g / eq. and a non-volatile content of 62% by mass) were used instead of 30 parts of active ester compound (DIC Corporation's "HPC-8000-65T").

[0215] <Test Example 1: Measurement of Dielectric Loss Tangent> (1) Preparation of resin sheet A with a resin composition layer thickness of 40 μm A polyethylene terephthalate film (AL5, manufactured by Lintec Corporation, 38 μm thick) with a release layer was prepared as a support. The resin compositions obtained in the examples and comparative examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying was 40 μm. The resin composition was then dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet A including the support and the resin composition layer.

[0216] (2) Preparation of hardened product B for evaluation Resin sheet A was cured in an oven at 190°C for 90 minutes. The support was peeled off from resin sheet A after it was removed from the oven to obtain a cured resin composition layer. This cured material was cut into pieces 80 mm long and 2 mm wide and designated as cured material B for evaluation.

[0217] (3) Measurement of dielectric loss tangent For the evaluation cured material B, the dielectric loss tangent (Df value) was measured using the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C, using a cavity resonance perturbation dielectric constant measuring device "CP521" manufactured by Kanto Applied Electronics Development Co., Ltd. and an "HP8362B" manufactured by Agilent Technologies. Measurements were performed on two test specimens, and the average was calculated.

[0218] <Test Example 2: Evaluation of unevenness after lamination> (1) Preparation of inner layer substrate Both surfaces of a glass cloth base epoxy resin double-sided copper-clad laminate with an inner layer circuit formed thereon (copper foil thickness: 18 µm, substrate thickness: 0.4 mm, "R1515A" manufactured by Panasonic Corporation) were etched by 1 µm using a micro-etching agent ("CZ8101" manufactured by Mec Co., Ltd.) to perform roughening treatment on the copper surface.

[0219] (2) Lamination of resin sheet A Using a batch-type vacuum pressure laminator ("CVP700" 2-stage build-up laminator manufactured by Nikkoh Materials Co., Ltd.), resin sheet A obtained in Test Example 1 (1) was laminated on both surfaces of the inner layer substrate such that the resin composition layer was in contact with the inner layer substrate. Lamination was performed by reducing pressure for 30 seconds to adjust the atmospheric pressure to 13 hPa or less, then pressing for 30 seconds at 120°C and a pressure of 0.74 MPa. Subsequently, hot pressing was performed for 60 seconds at 100°C and a pressure of 0.5 MPa.

[0220] (3) Evaluation of unevenness after lamination After lamination, cases where resin dents were observed along the periphery of the inner layer substrate were evaluated as "present", and cases where no dents were observed were evaluated as "absent".

[0221] <Test Example 3: Measurement of arithmetic average roughness (Ra)> (1) Thermosetting of resin composition layer The inner layer substrate with resin sheet A laminated therein obtained in Test Example 2 (2) was placed in an oven at 130°C and heated for 30 minutes, then transferred to an oven at 170°C and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. Thereafter, the support was peeled off to obtain a cured substrate A having an insulating layer, an inner layer substrate, and an insulating layer in this order.

[0222] (2) Roughening treatment Desmear treatment as a roughening treatment was performed on cured substrate A. As the desmear treatment, the following wet desmear treatment was performed.

[0223] (Wet desmear treatment) The cured substrate A was immersed in a swelling solution (Atotec Japan's "Swelling Dip Securigant P," an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 5 minutes, and then immersed in an oxidizing agent solution (Atotec Japan's "Concentrate Compact CP," an aqueous solution of potassium permanganate at approximately 6% and sodium hydroxide at approximately 4%) at 80°C for 20 minutes. Next, it was immersed in a neutralizing solution (Atotec Japan's "Reduction Solution Securigant P," an aqueous sulfuric acid solution) at 40°C for 5 minutes, and then dried at 80°C for 15 minutes.

[0224] (3) Measurement of the arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment The arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment was determined using a non-contact surface roughness meter (Bruker WYKO NT3300) in VSI mode with a 50x lens, measuring a range of 121 μm × 92 μm. The average of 10 points was calculated for each measurement.

[0225] <Test Example 4: Measurement of Peel Strength> (1) Formation of the conductive layer A conductive layer was formed on the roughened surface of the insulating layer of hardened substrate A, which was roughened in Test Example 3(2), according to the semi-additive method. Specifically, the roughened substrate was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. Next, it was annealed by heating at 150°C for 30 minutes, after which an etching resist was formed and a pattern was formed by etching. After that, copper sulfate electroplating was performed to form a conductive layer with a thickness of 25 μm, and annealing was performed at 190°C for 60 minutes. The resulting substrate is referred to as "Evaluation Substrate B".

[0226] (2) Measurement of the peel strength of the plated conductor layer The peel strength of the insulating and conductive layers was measured in accordance with the Japanese Industrial Standard (JIS C6481). Specifically, a 10 mm wide, 100 mm long cut was made in the conductive layer of evaluation substrate B. One end of this cut was peeled off and grasped with a gripper. At room temperature, 35 mm was peeled off vertically at a speed of 50 mm / min, and the load (kgf / cm) was measured to determine the peel strength. A tensile testing machine (TSE Corporation "AC-50C-SL") was used for the measurement.

[0227] The amounts of raw materials used and the content of non-volatile components in the resin compositions of the examples and comparative examples, as well as the measurement results and evaluation results of the test examples, are shown in Table 1 below.

[0228] [Table 1]

[0229] As shown in Table 1, in Comparative Examples 1 and 2, which used resin compositions without (A) fluorine atom-containing polymer, unevenness occurred after lamination. In contrast, when the resin composition of the present invention containing (A) fluorine atom-containing polymer was used, not only was unevenness not observed after lamination, but the dielectric loss tangent was also lower.

Claims

1. A resin composition comprising (A) a fluorine atom-containing polymer, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, (A) The hydroxyl value of component is 20 to 120 mg KOH / g. (A) The content of component is 3% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass. (C) The content of component is 10% by mass or more, when the nonvolatile components in the resin composition are considered to be 100% by mass. A resin composition in which the content of component (D) is 60% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass.

2. The resin composition according to claim 1, wherein the number average molecular weight of component (A) is 20,000 or less.

3. The resin composition according to claim 1 or 2, wherein component (A) comprises a copolymer of a fluoroolefin and a vinyl ether.

4. (A) Component is, Formula (AF): 【Chemistry 1】 [In the formula, R ｆ１ This represents (1) a hydrogen atom, (2) a halogen atom, (3) an optionally substituted alkyl group, or (4) an optionally substituted alkoxy group; R ｆ２ , R ｆ３ and R ｆ４ Each independently represents (1) a hydrogen atom, (2) a halogen atom, or (3) an alkyl group which may be substituted with a substituent; R ｆ１ , R ｆ２ , R ｆ３ and R ｆ４ At least one of them is a fluorine atom. The repeating unit represented by, Formula (AE): 【Chemistry 2】 [In the formula, R １ represents an alkyl group optionally substituted with a substituent; R ２ , R ３ and R ４ Each independently represents (1) a hydrogen atom or (2) an alkyl group which may be substituted with a substituent. A resin composition according to any one of claims 1 to 3, comprising a copolymer containing repeating units represented by .

5. The resin composition according to any one of claims 1 to 4, wherein the content of component (A) is 0.1% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass.

6. The resin composition according to any one of claims 1 to 5, wherein the content of component (B) is 1% by mass to 20% by mass, when the nonvolatile components in the resin composition are considered to be 100% by mass.

7. The resin composition according to any one of claims 1 to 6, wherein the mass ratio of component (B) to component (A) (component (B) / component (A)) is 0.5 to 30.

8. The resin composition according to any one of claims 1 to 7, wherein the mass ratio of component (C) to component (A) (component (C) / component (A)) is 7.8 to 60.

9. The resin composition according to any one of claims 1 to 8, wherein the mass ratio of component (D) to component (A) (component (D) / component (A)) is 37.5 to 300.

10. The resin composition according to any one of claims 1 to 9, wherein component (D) is silica.

11. The resin composition according to any one of claims 1 to 10, wherein the content of component (D) is 68% by mass or more when the nonvolatile components in the resin composition are taken as 100% by mass.

12. The resin composition according to any one of claims 1 to 11, further comprising a curing agent selected from the group consisting of phenolic curing agents and carbodiimide curing agents.

13. The resin composition according to any one of claims 1 to 12, wherein the dielectric loss tangent (Df) of the cured resin composition is 0.0030 or less when measured at 5.8 GHz and 23°C.

14. A cured product of the resin composition according to any one of claims 1 to 13.

15. A sheet-like laminated material containing the resin composition according to any one of claims 1 to 13.

16. A resin sheet having a support and a resin composition layer formed from the resin composition according to any one of claims 1 to 13, provided on the support.

17. A printed circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 13.

18. A semiconductor device comprising a printed circuit board as described in claim 17.

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