Copper-ceramic bond

Abstract

To provide copper-ceramic joined bodies with high joining strength.SOLUTION: A copper ceramic bonded body 100 of the present invention comprises: a copper material 10 consisting of Cu or a Cu alloy; a ceramic material 20 consisting of nitrides of Si or Al joined to the copper material; and a joining layer 30 which is formed on the joining surface between the copper material and the ceramic material, contains Cu and Mg, and further contains at least one active metallic element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, wherein the joining layer comprises a first layer 31 which constitutes an interface with the copper material and contains a solid solution phase in which Mg is dissolved in Cu, and a second layer 32 which constitutes an interface with the ceramic material and contains nitrides of active metallic elements and is in contact with the first layer, the second layer containing MgO.SELECTED DRAWING: Figure 1