IC tag molded body and method for manufacturing the same

Abstract

To prevent a deterioration in an IC tag regardless of a use environment.SOLUTION: An IC tag molding 1 includes an IC tag inlet 2, and a first resin part 10 and a second resin part 20 for sandwiching the IC tag inlet and covering its periphery, the first resin part includes a first support part, a first recessed part for surrounding the periphery of the first support part and located lower than the first support, and a second protrusion part for surrounding the periphery of the first recessed part and protruding from the first recessed part, and the second resin part includes a second resin part, a third protrusion part oppositely brought into contact with the first recessed part, and surrounding the outer periphery of the second support to protrude from the second support part, and a third recessed part oppositely brought into contact with the second protrusion part, and surrounding the periphery of the third protrusion part and located lower than the third protrusion part.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an IC tag molded article and a method for producing the same.

Background Art

[0002] In recent years, various technologies using non-contact IC tags that employ IC chips with antennas have been studied, and according to the application, processing methods for the IC tag itself but have been variously studied. For example, Patent Document 1 discloses a method of inserting an IC tag into a mold and performing in-mold molding with a resin.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] With the expansion of applications of IC tags, use of IC tags under severe conditions such as high-temperature and high-humidity environments can be expected. However, conventionally studied IC tag molded articles are not intended for use under severe conditions, and there is a possibility that deterioration of the IC tag is accelerated.

[0005] The present disclosure has been made in view of the above, and an object of the present disclosure is to provide a technology capable of preventing deterioration of an IC tag regardless of the use environment.

Means for Solving the Problem

[0006] To achieve the above objective, an IC tag molded body according to one embodiment of the present disclosure comprises an IC tag inlet, a first resin portion and a second resin portion that sandwich the IC tag inlet and cover its periphery, wherein the first resin portion comprises a first support portion that supports one main surface of the IC tag inlet, a first recess provided so as to surround the periphery of the first support portion and located lower than the first support portion, and a second protrusion provided so as to surround the periphery of the first recess and protruding from the first recess, wherein the second resin portion comprises a second support portion that supports the other main surface of the IC tag inlet, opposite to the one main surface, a third protrusion that abuts against the first recess and is provided so as to surround the outer circumference of the second support portion and protrudes from the second support portion, and a third recess that abuts against the second protrusion and is provided so as to surround the periphery of the third protrusion and is located lower than the third protrusion.

[0007] According to the above-described IC tag molded body, the pair of main surfaces of the IC tag inlet are covered by the first resin part and the second resin part, and the area around the IC tag inlet is formed with irregularities from the inside out by the first resin part and the second resin part. In this way, because the interface between the first resin part and the second resin part is formed with irregularities, it is possible to prevent foreign substances that may affect the function of the IC tag, such as water, water vapor, and gas, from entering from the outside. Therefore, according to the above-described IC tag molded body, it is possible to prevent deterioration of the IC tag regardless of the usage environment.

[0008] The IC tag inlet may include a film-like substrate, an antenna provided on the substrate, and an IC chip provided on the substrate and connected to the antenna. Using an IC tag inlet in which the antenna and IC chip are provided on a film-like substrate makes it possible to miniaturize the IC tag molded body, and the flexibility of the substrate prevents damage to the substrate from external stress.

[0009] The IC tag inlet may also have a second film that covers the antenna and the IC chip. Having the second film as described above further prevents damage to the antenna and the IC chip.

[0010] The first support portion may also have a first adhesive layer between it and the IC tag inlet. As described above, by providing a first adhesive layer between the first support portion and the IC tag inlet, the adhesion between the first resin portion and the IC tag inlet is increased, and deterioration of the IC tag can be prevented.

[0011] The configuration may also include a second adhesive layer between the second support portion and the IC tag inlet. As described above, by providing a second adhesive layer between the second support portion and the IC tag inlet, the adhesion between the second resin portion and the IC tag inlet is improved, and deterioration of the IC tag can be prevented.

[0012] The present invention may have a first convex portion provided between the first support portion and the first recess, projecting toward the first support portion, and a second recess that abuts opposite to the first convex portion and is provided between the second support portion and the third convex portion, and is located at a lower position than the second support portion. 。 As described above, by further having the first protrusion and the second recess, it is possible to further prevent the intrusion of foreign matter from the outside, thereby further preventing deterioration of the IC tag.

[0013] A method for manufacturing an IC tag molded body according to one embodiment of the present disclosure involves fixing an IC tag inlet to a first mold, introducing resin into the first mold and solidifying it to form a first molded body in which the IC tag inlet and a first resin part are integrated, the resin part having a first support part that supports one main surface of the IC tag inlet, a first recess that surrounds the periphery of the first support part and is located lower than the first support part, and a second convex part that surrounds the periphery of the first recess and protrudes from the first recess, and the first molding The method includes fixing the body to a second mold and introducing and solidifying resin into the second mold to integrate a second resin part with the first molded body, the second resin part having a second support part that supports the other main surface of the IC tag inlet in the opposite direction to the one main surface of the IC tag inlet, a third convex part that abuts against the first recess and is provided so as to surround the outer circumference of the second support part and protrudes relative to the second support part, and a third recess that abuts against the second convex part and is provided so as to surround the periphery of the third convex part and is located at a lower position than the third convex part.

[0014] According to the above-described method for manufacturing an IC tag molded body, the pair of main surfaces of the IC tag inlet are covered by the first resin part and the second resin part, and the area around the IC tag inlet is formed with irregularities from the inside out by the first resin part and the second resin part. In this way, because the interface between the first resin part and the second resin part is formed with irregularities, it is possible to prevent foreign substances such as water, water vapor, and gas that may affect the function of the IC tag from entering from the outside. Therefore, according to the above-described method for manufacturing an IC tag molded body, it is possible to manufacture an IC tag molded body in which deterioration of the IC tag is prevented regardless of the usage environment.

[0015] The IC tag inlet may be in the form of a film, and in forming the first molded body, the IC tag inlet may be fixed to the first mold by suction. With this configuration, the occurrence of wrinkles can be suppressed when integrating the film-like IC tag with the first resin part.

[0016] In this configuration, the first adhesive layer may be provided on the surface of the IC tag inlet facing the first support portion. With this configuration, since the first adhesive layer is provided between the first support portion and the IC tag inlet, the adhesion between the first resin portion and the IC tag inlet is increased, and deterioration of the IC tag can be prevented.

[0017] In this configuration, a second adhesive layer may be provided on the surface of the IC tag inlet facing the second support portion. With this configuration, a second adhesive layer is provided between the second support portion and the IC tag inlet, which increases the adhesion between the second resin portion and the IC tag inlet and prevents deterioration of the IC tag.

[0018] The IC tag molded body manufactured by the above-described manufacturing method may have a first convex portion provided between the first support portion and the first recess and projecting toward the first support portion, and a second recess that abuts opposite to the first convex portion and is provided between the second support portion and the third convex portion and is located at a lower position than the second support portion. 。 As described above, an IC tag molded body further having a first protrusion and a second recess can further prevent the intrusion of foreign matter from the outside, thus further preventing deterioration of the IC tag.

[0019] In integrating the second resin portion and the first molded body, the resin introduced into the second mold may flow in such a manner that, after filling the first recess of the first molded body, it flows over the first protrusion and covers the surface of the IC tag inlet. With such a configuration, the flow rate of the resin can be adjusted to prevent the IC tag inlet from moving due to the resin. [Effects of the Invention]

[0020] According to this disclosure, a technology is provided that can prevent the deterioration of IC tags regardless of the usage environment. [Brief explanation of the drawing]

[0021] [Figure 1] Figs. 1(a) and 1(b) are diagrams for explaining the shape of an IC tag molded article, and Fig. 1(b) corresponds to the view taken along line Ib-Ib and the view taken along line Ic-Ic in Fig. 1(a). [Figure 2] Figs. 2(a) and 2(b) are diagrams for explaining the shape of an IC tag molded article. [Figure 3] Fig. 3 is a flowchart illustrating a method for manufacturing an IC tag molded article. [Figure 4] Figs. 4(a) to 4(f) are diagrams schematically showing a method for manufacturing an IC tag molded article. [Figure 5] Figs. 5(a) to 5(f) are diagrams schematically showing a method for manufacturing an IC tag molded article. [Figure 6] Fig. 6 is a diagram for explaining the configuration of an IC tag molded article according to a modified example. [Mode for Carrying Out the Invention]

[0022] Hereinafter, modes for carrying out the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and overlapping descriptions are omitted. For the sake of description, an XYZ orthogonal coordinate system is shown in Figs. 1 and 2.

[0023] [IC Tag Molded Article] Fig. 1 is a diagram for explaining the shape of an IC tag molded article. As shown in Figs. 1(a) and 1(b), the IC tag molded article 1 is configured to include an IC tag inlet 2, a first resin portion 10, and a second resin portion 20.

[0024] IC tags are used in RFID (Radio Frequency Identification). An IC tag consists of an IC chip and an antenna. For example, when an RFID reader's antenna transmits radio waves, the IC tag's antenna receives these radio waves, activating the IC chip. The information within the IC chip is then transmitted as a signal from the antenna, and the RFID reader receives this signal, thereby transferring the information to the RFID reader. Similarly, by transmitting and receiving information via the antenna, the information held in the IC chip can be rewritten by an RFID writer. Thus, an IC tag can be used as a medium for holding information in RFID. The IC tag molded body 1 is a molded body that functions as an IC tag. The IC tag molded body 1 is a flat plate with a thickness of about 1 mm to 5 mm. In this embodiment, we will describe the case where the IC tag molded body 1 has a rectangular main surface with a longitudinal direction of 90 mm (X direction) and a transverse direction of 50 mm (Y direction). However, this shape is just an example and is not particularly limited.

[0025] The IC tag inlet 2 (IC tag inlay) has a pair of main surfaces 2a and 2b, and as shown in Figure 1(a), an antenna 2c and an IC chip 2d are connected on a film-like substrate 2e. For example, polyethylene terephthalate (PET) is used as the substrate for the IC tag inlet 2. Specifically, the antenna 2c and the IC (integrated circuit) are fixed as an IC chip 2d on the surface of the substrate 2e, and the IC tag inlet 2 is formed by connecting them. The IC tag inlet 2 is, for example, a thin film with a thickness of about 0.1 mm, and the substrate 2e may be a flexible film. In this embodiment, the case in which the pair of main surfaces 2a and 2b of the IC tag inlet 2 are rectangles with a longitudinal direction of 57 mm (X direction) and a short direction of 25 mm (Y direction) will be described. Note that the size of the IC tag inlet 2 is not particularly limited.

[0026] The first resin part 10 and the second resin part 20 are configured to sandwich the pair of main surfaces 2a and 2b of the IC tag inlet 2. The first resin part 10 is provided to cover the main surface 2a side facing upward (positive Z-axis direction) as shown in the figure, and the second resin part 20 is provided to cover the main surface 2b side facing downward (negative Z-axis direction) as shown in the figure. In other words, the first resin part 10 and the second resin part 20 are arranged facing each other with the IC tag inlet 2 in between. As shown in Figure 1(a), the IC tag inlet 2 is enclosed inside the first resin part 10 and the second resin part 20.

[0027] The first resin part 10 will be described with reference to Figures 1(b) and 2(a). Figure 2(a) shows the state after the second resin part 20 has been removed from the IC tag molded body 1. The first resin part 10 is a plate-shaped member with a rectangular main surface. Of the pair of main surfaces, the upper main surface 10a shown is a flat surface. On the other hand, the main surface opposite to the main surface 10a has a first support part 11, a first convex part 12, a first concave part 13, and a second convex part 14 formed thereon.

[0028] The first support portion 11 is provided so as to face the main surface 2a of the IC tag inlet 2. The first support portion 11 has the same shape as the main surface 2a. The first support portion 11 extends along the XY plane, similar to the main surface 10a. The XY plane corresponds to the direction of extension of the main surface 10a of the first resin portion 10 and the main surface 20a of the second resin portion 20, which are a pair of main surfaces of the IC tag molded body 1.

[0029] The first protrusion 12 is provided on the outside of the first support portion 11 and is formed in an annular shape so as to surround the entire circumference of the first support portion 11. The first protrusion 12 is positioned to project downward (in the negative Z-axis direction) relative to the first support portion 11 and spreads along the XY plane. A side wall surface 19a is formed between the first support portion 11 and the first protrusion 12.

[0030] The first recess 13 is provided on the outside of the first protrusion 12 and is formed in an annular shape so as to surround the entire circumference of the first protrusion 12. The height position of the first recess 13 is above (in the positive Z-axis direction) relative to the first protrusion 12 and the second protrusion 14 on the outer circumference, that is, a groove is formed between the first protrusion 12 and the second protrusion 14. The first recess 13, which forms the groove, extends along the XY plane. A side wall surface 19b is formed between the first protrusion 12 and the first recess 13.

[0031] The second protrusion 14 is provided on the outside of the first recess 13 and is formed in an annular shape so as to surround the entire circumference of the first recess 13. The second protrusion 14 is positioned to protrude downward (in the negative Z-axis direction) relative to the first recess 13 and spreads along the XY plane. A side wall surface 19c is formed between the first recess 13 and the second protrusion 14. The second protrusion 14 is provided on the outermost circumference of the first resin part 10, and the outer edge of the second protrusion 14 coincides with the outer edge of the first resin part 10.

[0032] As described above, the first resin portion 10 has an annular first convex portion 12, a first concave portion 13, and a second convex portion 14 arranged in this order from the inner circumference to the outer circumference, surrounding the first support portion 11 that contacts the IC tag inlet 2. The side wall surfaces 19a to 19c may extend in a direction perpendicular to the XY plane on which the first support portion 11 etc. extends, but may also be slightly inclined (for example, a few degrees to about 20 degrees) with respect to the vertical direction (Z axis direction). For example, the side wall surfaces 19a to 19c may each be formed at an inclination of 10° with respect to the XY plane.

[0033] The resins constituting the first resin part 10 and the second resin part 20 described above are not particularly limited, and general resin materials can be used. However, as described in the manufacturing method below, the IC tag molded body 1 is manufactured by insert molding in which the IC tag inlet 2 is fixed inside the mold. Therefore, a resin that can be molded at a temperature that does not damage the IC tag inlet 2 itself (for example, 260°C or below) is selected.

[0034] Furthermore, as the resins constituting the first resin part 10 and the second resin part 20 described above, it is advisable to select materials with high impact resistance, heat resistance, rigidity, etc., in order to prevent damage to the IC tag molded body 1. In addition, if the IC tag molded body 1 is installed outdoors, a material that is less susceptible to degradation due to ultraviolet rays, etc., may be selected. As an example, block polypropylene resin can be used for the first resin part 10 and the second resin part 20 of the IC tag molded body 1. The first resin part 10 and the second resin part 20 may be composed of different resin materials, but if the same type of resin material is used, it is thought that the adhesion between the first resin part 10 and the second resin part 20 will be improved.

[0035] Next, the second resin part 20 will be described with reference to Figures 1(b) and 2(b). Figure 2(b) shows the IC tag molded body 1 with the first resin part 10 removed. The second resin part 20 is a plate-shaped member with a rectangular main surface. Of the pair of main surfaces, the lower main surface 20a shown is a flat surface. On the other hand, the main surface opposite to the main surface 20a has a second support part 21, a second recess 22, a third protrusion 23, and a third recess 24 formed therein.

[0036] The second support portion 21 is located on the main surface 2 of the IC tag inlet 2. b It is provided so as to face the main surface 2a. The second support portion 21 has the same shape as the main surface 2a. In other words, the second support portion 21 and the first support portion 11 have the same shape.

[0037] The second recess 22 is provided on the outside of the second support portion 21 and is formed in an annular shape so as to surround the entire circumference of the second support portion 21. The second recess 22 is located below the second support portion 21 (in the negative Z-axis direction) and is configured to spread along the XY plane. The width of the second recess 22 is the same as that of the first protrusion 12. A side wall surface 29a is formed between the second support portion 21 and the second recess 22.

[0038] The third protrusion 23 is provided on the outside of the second recess 22 and is formed in an annular shape so as to surround the entire circumference of the second recess 22. The third protrusion 23 is configured to project upward (in the positive Z-axis direction) relative to the second recess 22. The width of the third protrusion 23 is the same as that of the first recess 13. A side wall surface 29b is formed between the second recess 22 and the third protrusion 23.

[0039] The third recess 24 is provided on the outside of the third protrusion 23 and is formed in an annular shape so as to surround the entire circumference of the third protrusion 23. The third recess 24 is located below the third protrusion 23 (in the negative Z-axis direction) and is configured to spread along the XY plane. The width of the third recess 24 is the same as that of the second protrusion 14. A side wall surface 29c is formed between the third protrusion 23 and the third recess 24. The third recess 24 is provided on the outermost periphery of the second resin part 20, and the outer edge of the third recess 24 coincides with the outer edge of the second resin part 20.

[0040] As described above, the second resin portion 20 has an annular second recess 22, a third protrusion 23, and a third recess 24 arranged in this order from the inner circumference to the outer circumference, surrounding the second support portion 21 that contacts the IC tag inlet 2. The side wall surfaces 29a to 29c are in contact with the side wall surfaces 19a to 19c in the IC tag molded body 1, and therefore have the same inclination angle as the side wall surfaces 19a to 19c.

[0041] In the IC tag molded body 1, the first resin part 10 and the second resin part 20 are integrated with the IC tag inlet 2 in between. At this time, as shown in Figure 1(b), the first convex part 12 and the second recessed part 22 are in contact, the first recessed part 13 and the third convex part 23 are in contact, and the second convex part 14 and the third recessed part 24 are in contact. As shown in Figure 1(b), the position where the first convex part 12 and the second recessed part 22 face each other is shown below the IC tag inlet 2 (negative Z-axis direction), and the position where the first recessed part 13 and the third convex part 23 face each other on the outer circumference is shown above the IC tag inlet 2 (positive Z-axis direction). Furthermore, the position where the second convex part 14 and the third recessed part 24 face each other on the outer circumference is shown below the IC tag inlet 2 (negative Z-axis direction). Thus, the height of the surface where the first resin part 10 and the second resin part 20 are in direct contact changes vertically relative to the position where the IC tag inlet 2 is held, as you move from the periphery to the outer edge of the IC tag inlet 2. Therefore, the structure makes it difficult for foreign substances such as moisture or gas to enter through the interface between the first resin part 10 and the second resin part 20.

[0042] [Method for manufacturing IC tag molded products] Next, the manufacturing method of the IC tag molded body 1 will be explained with reference to Figures 3 to 5. Figure 3 is a flowchart illustrating the manufacturing method of the IC tag molded body 1. The IC tag molded body 1 is manufactured by performing insert molding in two stages, in which the resin portion is molded while the IC tag inlet 2 is housed in the mold. Figures 4 and 5 show the state during the manufacturing process. Figures 4(a) and 4(b) show the cross-sectional view and top view of the mold at the same time. Similarly, Figures 4(c) and 4(d), 4(e) and 4(f), 5(a) and 5(b), 5(c) and 5(d), and 5(e) and 5(f) each show the same time.

[0043] In the manufacturing method shown in Figure 3, steps S01 to S03 are procedures related to the first stage of insert mold molding using the first mold. First, in step S01, the first mold 91 is prepared and the IC tag inlet 2 is fixed to the first mold 91. As shown in Figure 4(a), the first mold 91 is composed of, for example, a lower mold 92 and an upper mold 93. The lower mold 92 is 1 resin part 10 The 1 Support part 11 , the 1 convex Department 12 , the 1 concave Department 13、 And, the 2 convex Department 14 The flat portion 92a, the first groove portion 92b, the first protrusion portion 92c, and the second groove portion 92d are formed as corresponding irregularities. As shown in Figure 4(b), the shape of the first groove portion 92b, the first protrusion portion 92c, and the second groove portion 92d haso Each is formed in an annular shape. Furthermore, the lower mold 92 is positioned around the second groove 92d to correspond to the outer shape of the first resin part 10, but a part of it is cut out to form an inlet 94 for introducing resin into the interior. The inlet 94 is formed by cutting out a part of the outer circumference side of the second groove 92d, that is, a part of the side surface of the lower mold 92. Note that there may be one or more inlet 94s. If multiple inlet 94s are provided, they may be distributed around the lower mold 92, that is, distributed to surround the first resin part 10 after molding.

[0044] A suction hole 92f is provided in the flat portion 92a for suction and fixing the IC tag inlet 2. A suction device (not shown) is connected to the suction hole 92f. The suction hole 92f only needs to be positioned to stably fix the thin film IC tag inlet 2 at a predetermined position inside the first mold 91. For example, in a plan view (see Figure 4(b)), it may be positioned near the four vertices of the rectangular IC tag inlet 2. Depending on the size of the IC tag inlet 2, a configuration may be used in which multiple suction holes 92f (for example, about 2 to 5) are arranged in the longitudinal direction.

[0045] The upper mold 93 is positioned to correspond to the main surface 10a of the first resin part 10. With the IC tag inlet 2 suction-fixed to the flat part 92a, the upper mold 93 is placed above the lower mold 92, creating a space with an internal shape corresponding to the first resin part 10. Although the upper mold 93 is shown in Figure 4(a), it is omitted in subsequent drawings. Depending on the molding method, the upper mold 93 may not be used, and molding may be performed using only the lower mold 92.

[0046] As shown in Figure 4(a), with the IC tag inlet 2 positioned on the flat portion 92a, the air inside the lower mold 92 can be sucked out by the suction device, thereby suctioning and fixing the IC tag inlet 2 to the flat portion 92a. The suction fixing of the IC tag inlet 2 by the suction device is continued until molding using the first mold 91 is completed.

[0047] Next, in step S02, resin to form the first resin part 10 is introduced into the first mold 91. As shown in Figure 4(a), resin R is poured in from the inlet 94. At this time, as shown in Figure 4(b), resin R moves to fill the annular second groove 92d on the outer circumference, and after filling the recess of the second groove 92d with resin R, it spreads to go over the inner first protrusion 92c. Next, resin R spreads to fill the annular first groove 92b provided inside the annular first protrusion 92c. After that, after filling the recess of the first groove 92b, resin R spreads to fill the upper surface of the IC tag inlet 2 which is suction fixed on the flat part 92a, as shown in Figures 4(c) and 4(d). When the resin R spreads inward after filling the recess of the first groove 92b, as shown in Figure 4(d), the resin R spreads from the entire circumference of the outer edge of the IC tag inlet 2 towards the center, and finally, as shown in Figures 4(e) and 4(f), the entire upper part of the IC tag inlet 2 is covered by the resin R. In this way, by controlling the viscosity of the resin R so that it spreads evenly from the periphery of the IC tag inlet 2 toward the center of the IC tag inlet 2, the possibility of a part of the IC tag inlet 2 moving or deforming due to the movement of the resin R can be reduced.

[0048] Next, in step S03, as shown in Figures 4(e) and 4(f), the resin R introduced into the lower mold 92 fills the area corresponding to the first resin part 10, and then the resin R is cured. After that, as shown in Figure 4(f), the resin R at the introduction opening 94 and the resin R in the lower mold 92 are cut with a cutter 99 to obtain the first molded body 1' formed by the first resin part 10 and the IC tag inlet 2. The first molded body 1' has the shape of the IC tag molded body 1 with the second resin part 20 removed, as shown in Figure 2(a).

[0049] Next, a second stage of insert molding using the second mold is performed, as shown in steps S04 to S06. First, in step S04, the second mold 95 is prepared and the first molded body 1' is fixed to the second mold 95. As shown in Figure 5(a), the second mold 95 is composed of, for example, a lower mold 96 and an upper mold 97. The lower mold 96 also has a recess 96a capable of accommodating the first molded body 1'.

[0050] A suction hole 96f is provided on the bottom surface of the recess 96a for suction fixing the first molded body 1'. A suction device (not shown) is connected to the suction hole 96f. The suction hole 96f only needs to be positioned to stably fix the thin film IC tag inlet 2 of the second mold, and for example, in a plan view (see Figure 5(b)), it may be positioned near the four vertices of the first molded body 1'. This is similar to the suction hole 92f in the lower mold 92 of the first mold 91.

[0051] The upper mold 97 is positioned to correspond to the main surface 20a of the second resin part 20. With the first molded body 1' fixed by suction within the recess 96a, the upper mold 97 is positioned above the lower mold 96, creating a space with an internal shape corresponding to the second resin part 20. Although the upper mold 97 is shown in Figure 5(a), it is omitted in subsequent drawings. Depending on the molding method, the upper mold 97 may not be used, and molding may be performed using only the lower mold 96.

[0052] As shown in Figure 5(a), with the first molded body 1' housed in the recess 96a, the air inside the lower mold 96 is sucked out by the suction device, thereby fixing the first molded body 1' in the recess 96a to the recess 96a by suction. The suction fixing of the first molded body 1' by the suction device is continued until molding using the second mold 95 is completed.

[0053] Next, in step S05, resin to form the second resin part 20 is introduced into the second mold 95. As shown in Figure 5(a), resin R is poured in from the inlet 98. At this time, as shown in Figure 5(b), resin R moves over the annular second protrusion on the outer circumference of the first molded body 1' and enters the first recess 13. Resin R moves to fill the first recess 13, and after filling the first recess 13 with resin R, it moves over the inner first protrusion 12 and spreads to fill the upper surface of the IC tag inlet 2. First recess 13 When the resin R expands inward after the conditions are met, as shown in Figures 5(c) and 5(d), the resin R expands from the entire circumference of the outer edge of the IC tag inlet 2 located on the upper surface of the first molded body 1' toward the center, and finally, as shown in Figures 5(e) and 5(f), the upper surface of the first molded body 1', including the entire area above the IC tag inlet 2, is covered by the resin R. In this way, by controlling the viscosity of the resin R so that it expands evenly from the periphery of the IC tag inlet 2 toward the center of the IC tag inlet 2, the possibility of a part of the IC tag inlet 2 moving or deforming due to the movement of the resin R can be reduced.

[0054] As shown in Figures 5(e) and 5(f), the resin R is introduced into the lower mold 96, and after the region corresponding to the second resin part 20 is filled with the resin R, the resin R is cured. After that, Figure 5 As shown in (f), by cutting the resin R of the inlet 98 and the resin R in the lower mold 96 with a cutter 99, an IC tag molded body 1 is obtained in which the second resin part 20 is further integrated with the first molded body 1'.

[0055] [Effect] According to the above-described IC tag molded body 1 and its manufacturing method, the pair of main surfaces 2a and 2b of the IC tag inlet 2 are covered by the first resin part 10 and the second resin part 20. Furthermore, the periphery of the IC tag inlet 2 is formed by the first resin part 10 and the second resin part 20, creating irregularities from the inside out. In this way, because the interface between the first resin part 10 and the second resin part 20 is formed by irregularities, it is possible to prevent foreign substances that may affect the function of the IC tag, such as water, water vapor, and gas, from entering from the outside. Therefore, according to the above-described IC tag molded body, it is possible to prevent deterioration of the IC tag regardless of the usage environment.

[0056] Furthermore, the IC tag molded body 1 described in the above embodiment transmits and receives information with an external device (reader or writer) via the first resin part 10 or the second resin part 20. The IC tag molded body 1 described in this embodiment can reduce the possibility of substances that affect communication, such as metal or water, being interposed between the IC tag and the external device. Therefore, it is not limited to use in short-range communication such as in the HF band (for example, a few centimeters to tens of centimeters), but can also be used in relatively long-range communication such as in the UHF band (for example, a few centimeters to a few meters).

[0057] Furthermore, the IC tag molded body 1 can be used for a long period of time, for example, as long as the internal IC tag inlet 2 is not damaged. Also, since the IC tag inlet 2 is covered by the first resin part 10 and the second resin part 20, the possibility of the IC tag inlet 2 itself being exposed to high or low temperature environments is reduced. Therefore, the IC tag can be used even in harsher environments.

[0058] Furthermore, by using opaque materials for the first resin part 10 and the second resin part 20 of the IC tag molded body 1, it is not possible to determine from the outside whether or not the IC tag inlet 2 is installed, or where the IC tag inlet 2 is installed. Therefore, the possibility of the IC tag inlet 2 being removed by a malicious third party can be reduced. Conventional components containing IC tags often have the location of the IC tag easily identifiable, which has led to cases of IC tag theft. In contrast, the above-described IC tag molded body 1 can reduce the possibility of the IC tag inlet 2 being removed.

[0059] The IC tag inlet 2 may include a film-like substrate 2e, an antenna 2c provided on the substrate 2e, and an IC chip 2d provided on the substrate 2e and connected to the antenna 2c. By using an IC tag inlet 2 in which the antenna 2c and IC chip 2d are provided on the film-like substrate 2e, it is possible to miniaturize the IC tag molded body 1. Furthermore, since the substrate 2e is flexible, it is possible to prevent the substrate from being damaged by external stress.

[0060] Furthermore, in the manufacturing method of the IC tag molded body 1 described above, in order to form the annular protrusions and recesses, resin R is introduced from the outer circumference of the mold (first mold 91 or second mold 95) which forms the outer circumference of the IC tag molded body 1. The resin is designed to overcome the irregularities corresponding to the irregular shapes of the first resin part 10 and the second resin part 20, and reach the upper surface of the central IC tag inlet 2. Meanwhile, the IC tag inlet 2 or the first molded body 1' integrated with the IC tag inlet 2 is fixed to the mold by suction, and in this state, resin R is introduced into the mold. As a result, the fluid resin R is prevented from deforming the IC tag inlet 2, and the yield of the IC tag molded body 1 can also be improved.

[0061] [Differentiation] The IC tag molded body relating to this disclosure is not limited to the configuration described above, and various modifications can be made.

[0062] Referring to Figure 6, a modified IC tag molded body 1X will be described. The IC tag molded body 1X differs from the IC tag molded body 1 in that an adhesive layer is formed between the IC tag inlet 2 and the resin part. In the IC tag molded body 1X, a first adhesive layer 31 is provided between the first resin part 10 and the main surface 2a of the IC tag inlet 2, and a second adhesive layer 32 is provided between the second resin part 20 and the main surface 2b of the IC tag inlet. For example, adhesive layers made of unoriented polypropylene (CPP) can be used as the first adhesive layer 31 and the second adhesive layer 32. In addition, when providing the first adhesive layer 31 and the second adhesive layer 32, for example, an adhesive layer can be formed between the IC tag inlet 2 and the first resin part 10 or the second resin part 20 by pre-laminating the adhesive layer on the surface of the IC tag inlet 2. As an example, an adhesive layer can be formed on the surface of the IC tag inlet 2 by bonding an adhesive layer made of CPP to the surface of the IC tag inlet 2 using a two-component curing urethane adhesive.

[0063] Furthermore, the first adhesive layer 31 and the second adhesive layer 32 can be made of a thermoplastic resin such as an olefin resin, which can be heat-welded to the first resin part 10 or the second resin part 20. For example, an adhesive layer can be formed on the surface of the IC tag inlet 2 by preparing a coating liquid obtained by dissolving or dispersing an olefin resin, applying it to the surface of the IC tag inlet 2, and then drying it. The method for forming the first adhesive layer 31 and the second adhesive layer 32 is not limited to the above method, and examples include wet coating, extruder, hot melt coating, dry lamination, spray coating, and curtain coating.

[0064] As with the IC tag molded body 1X described above, if the structure includes a first adhesive layer 31 or a second adhesive layer 32, the adhesion between the IC tag inlet 2 and the first resin part 10, or between the IC tag inlet 2 and the second resin part 20, can be further improved. Note that either the first adhesive layer 31 or the second adhesive layer 32 may be provided, in which case it is preferable to provide the first adhesive layer 31. Furthermore, it is preferable that the adhesive strength of the first adhesive layer 31 with the IC tag inlet 2 is stronger than the adhesive strength with the first resin part 10. This makes it difficult to remove the IC tag inlet 2 while maintaining the shape of the antenna 2c and IC chip 2d, thereby preventing the unauthorized reuse of the IC tag inlet 2.

[0065] Furthermore, the IC tag inlet 2 may have a configuration different from the one described above. For example, in the above embodiment, the antenna 2c and the IC chip 2d are laminated on a film-like substrate 2e. do An example of a setup is shown, but antenna 2c and IC chip 2d are further connected to another filter. Mu The antenna 2c and IC chip 2d may be protected by being sandwiched between them. Furthermore, the arrangement of the antenna 2c and IC chip 2d can be changed as appropriate.

[0066] The shape of the irregularities formed on the first resin part 10 and the second resin part 20 of the IC tag molded body 1 can be changed as appropriate. For example, focusing on the first resin part 10, the first convex part 12, the first concave part 13, and the second convex part 14 are each formed in annular shape, but they may be shaped such that, for example, a part of the annular first convex part 12 or the second convex part 14 is cut out. Also, the first concave part 13 does not have to be at the same low position to the same depth around its entire circumference, and irregularities may be formed along the circumferential direction. In this case, the shapes of the second concave part 22, the third convex part 23, and the third concave part 24 of the opposing second resin part 20 are changed in correspondence with the shapes of the first convex part 12, the first concave part 13, and the second convex part 14 of the first resin part 10. Furthermore, the first convex part 12 and the second concave part 22 may not be provided.

[0067] As explained in the manufacturing method of the IC tag molded body 1 above, when forming the second resin part 20, the resin R moves along the irregularities of the first resin part 10. Therefore, it is considered that the yield of the IC tag molded body 1 can be improved by designing the shape of the first resin part 10 so as to prevent the IC tag inlet 2, which is integrated with the first resin part 10, from moving due to the flow of the resin R when the resin R is introduced into the second mold 95. From this perspective, by providing the first protrusion 12 and the second recess 22 so that the periphery of the IC tag inlet 2 is surrounded by the first protrusion 12, movement or deformation of the IC tag inlet 2 due to the flow of the resin R can be prevented.

[0068] Furthermore, the number of irregularities formed on the outer circumference of the IC tag inlet 2 by the first resin part 10 and the second resin part 20 of the IC tag molded body 1 may be increased. By increasing the number of irregularities formed by alternately providing recesses and protrusions, the entry of foreign matter from the outside can be further suppressed.

[0069] [Note] This disclosure includes the following components. [1] IC tag inlet and The IC tag inlet is sandwiched between a first resin part and a second resin part that surrounds it, It has, The first resin part is, A first support portion that supports one main surface of the IC tag inlet, A first recess is provided so as to surround the first support portion and is located at a lower position relative to the first support portion, A second protrusion is provided so as to surround the first recess and protrudes from the first recess, It has, The second resin part is, A second support portion supports the other main surface of the IC tag inlet, in contrast to the one main surface, A third convex portion is provided that abuts against the first recess and surrounds the outer circumference of the second support portion, and protrudes relative to the second support portion, A third recess is provided that abuts against the second protrusion and surrounds the periphery of the third protrusion, and is located at a lower position than the third protrusion, An IC tag molded body having [a certain feature]. [2] The IC tag molded body according to [1], wherein the IC tag inlet comprises a film-like substrate, an antenna provided on the substrate, and an IC chip provided on the substrate and connected to the antenna. [3] The IC tag molded body according to claim 2, wherein the IC tag inlet has a second film covering the antenna and the IC chip. [4] An IC tag molded body according to any one of [1] to [3], having a first adhesive layer between the first support portion and the IC tag inlet. [5] An IC tag molded body according to any one of [1] to [4], having a second adhesive layer between the second support portion and the IC tag inlet. [6] A first convex portion provided between the first support portion and the first recess, which protrudes from the first support portion, A second recess is provided between the second support portion and the third protrusion, and is in contact with the first protrusion and is located at a lower position than the second support portion. An IC tag molded body according to any one of [1] to [5], having the following characteristics. [7] A first molded body is formed in which the IC tag inlet and the first resin part are integrated, by fixing the IC tag inlet to a first mold and introducing and solidifying resin into the first mold, the first resin part having a first support part that supports one main surface of the IC tag inlet, a first recess provided so as to surround the first support part and located lower than the first support part, and a second protrusion provided so as to surround the first recess and protruding from the first recess, The first molded body is fixed to the second mold, and resin is introduced into the second mold and solidified to integrate the first molded body with a second resin part having a second support portion that supports the opposite main surface of the IC tag inlet to the one main surface, a third convex portion that abuts against the first recess and surrounds the outer circumference of the second support portion and protrudes relative to the second support portion, and a third recess that abuts against the second convex portion and surrounds the periphery of the third convex portion and is located at a lower position than the third convex portion. A method for manufacturing an IC tag molded body, including the following. [8] The IC tag inlet is in the form of a film, A method for manufacturing an IC tag molded body according to [7], wherein the IC tag inlet is fixed to the first mold by suction when molding the first molded body. [9] A method for manufacturing an IC tag molded body according to [7] or [8], wherein a first adhesive layer is provided on the surface of the IC tag inlet facing the first support portion.

[10] A method for manufacturing an IC tag molded body according to any one of [7] to [9], wherein a second adhesive layer is provided on the surface of the IC tag inlet facing the second support portion.

[11] The first resin portion is provided between the first support portion and the first recess and has a first convex portion that protrudes from the first support portion, A method for manufacturing an IC tag molded body according to any one of [7] to

[10] , wherein the second resin portion abuts against the first protrusion and has a second recess provided between the second support portion and the third protrusion, and is located at a lower position than the second support portion.

[12] A method for manufacturing an IC tag molded body according to

[11] , wherein, in integrating the second resin portion and the first molded body, the resin introduced into the second mold fills the first recess of the first molded body, then flows over the first protrusion to cover the surface of the IC tag inlet. [Explanation of Symbols]

[0070] 1,1X...IC tag molded body, 1'...First molded body, 2...IC tag inlet (IC tag inlay), 2c...Antenna, 2d...IC chip, 2e...Base material, 10...First resin part, 11...First support part, 12...First protrusion, 13...First recess, 14...Second protrusion, 20...Second resin part, 21...Second support part, 22...Second recess, 23...Third protrusion, 24...Third recess, 31...First adhesive layer, 32...Second adhesive layer, 91...First mold, 92,96...Lower mold, 93,97...Upper mold, 95...Second mold.

Claims

1. IC tag inlet and The first resin part and the second resin part sandwich the IC tag inlet and cover its periphery, It has, The first resin part is, A first support portion that supports one main surface of the IC tag inlet, A first recess is provided so as to surround the first support portion and is located at a lower position relative to the first support portion, A second protrusion is provided so as to surround the first recess and protrudes from the first recess, A first convex portion is provided between the first support portion and the first recess, and protrudes from the first support portion, It has, The second resin part is, A second support portion that supports the other main surface of the IC tag inlet opposite to the one main surface, A third convex portion is provided that abuts against the first recess and surrounds the periphery of the second support portion, and protrudes relative to the second support portion, A third recess is provided that abuts against the second protrusion and surrounds the periphery of the third protrusion, and is located at a lower position than the third protrusion, A second recess is provided between the second support portion and the third protrusion, and is in contact with the first protrusion and is located at a lower position than the second support portion. It has, The first and second protrusions have flat surfaces that extend along the direction of extension of the pair of main surfaces of the IC tag inlet. An IC tag molded body in which the flat surface of the first protrusion abuts against the bottom surface of the second recess, and the flat surface of the second protrusion abuts against the bottom surface of the third recess.

2. The IC tag molded body according to claim 1, wherein the IC tag inlet includes a film-like substrate, an antenna provided on the substrate, and an IC chip provided on the substrate and connected to the antenna.

3. The IC tag molded body according to claim 2, wherein the IC tag inlet has a second film covering the antenna and the IC chip.

4. The IC tag molded body according to any one of claims 1 to 3, further comprising a first adhesive layer between the first support portion and the IC tag inlet.

5. The IC tag molded body according to any one of claims 1 to 3, further comprising a second adhesive layer between the second support portion and the IC tag inlet.

6. A first molded body is formed in which the IC tag inlet and the first resin part are integrated, by fixing the IC tag inlet to a first mold and introducing and solidifying resin into the first mold, the first resin part having a first support part that supports one main surface of the IC tag inlet, a first recess provided so as to surround the first support part and located lower than the first support part, a second convex part provided so as to surround the first recess and projecting from the first recess, and a first convex part provided between the first support part and the first recess and projecting from the first support part. The first molded body is fixed to the second mold, and resin is introduced into the second mold and solidified to integrate the first molded body with a second resin part having a second support portion that supports the other main surface of the IC tag inlet opposite to the one main surface, a third convex portion that abuts against the first recess and surrounds the periphery of the second support portion and protrudes relative to the second support portion, a third recess that abuts against the second convex portion and surrounds the periphery of the third convex portion and is located at a lower position than the third convex portion, and a second recess that abuts against the first convex portion and is located between the second support portion and the third convex portion and is located at a lower position than the second support portion. Includes, The first and second protrusions have flat surfaces that extend along the direction of extension of the pair of main surfaces of the IC tag inlet. A method for manufacturing an IC tag molded body, wherein the flat surface of the first protrusion abuts against the bottom surface of the second recess, and the flat surface of the second protrusion abuts against the bottom surface of the third recess.

7. The IC tag inlet is in the form of a film, The method for manufacturing an IC tag molded body according to claim 6, wherein the IC tag inlet is fixed to the first mold by suction when molding the first molded body.

8. A method for manufacturing an IC tag molded body according to claim 6 or 7, wherein a first adhesive layer is provided on the surface of the IC tag inlet facing the first support portion.

9. A method for manufacturing an IC tag molded body according to claim 6 or 7, wherein a second adhesive layer is provided on the surface of the IC tag inlet facing the second support portion.

10. A first molded body is formed in which the IC tag inlet and the first resin part are integrated, by fixing the IC tag inlet to a first mold and introducing and solidifying resin into the first mold, the first resin part having a first support part that supports one main surface of the IC tag inlet, a first recess provided so as to surround the first support part and located lower than the first support part, and a second protrusion provided so as to surround the first recess and protruding from the first support part. The first molded body is fixed to the second mold, and resin is introduced into the second mold and solidified to integrate the first molded body with a second resin part having a second support portion that supports the other main surface of the IC tag inlet opposite to the one main surface, a third convex portion that abuts against the first recess and surrounds the periphery of the second support portion and protrudes relative to the second support portion, and a third recess that abuts against the second convex portion and surrounds the periphery of the third convex portion and is located at a lower position than the third convex portion. Includes, The first resin portion is provided between the first support portion and the first recess, and has a first protrusion that protrudes relative to the first support portion. The second resin portion abuts against the first protrusion and has a second recess provided between the second support portion and the third protrusion, which is located lower than the second support portion. A method for manufacturing an IC tag molded body, wherein, in integrating the second resin portion and the first molded body, the resin introduced into the second mold fills the first recess of the first molded body, then flows over the first protrusion to cover the surface of the IC tag inlet.

Images