Wire-attached connecting member and wire connection structure

Abstract

To provide a connecting member with an electric wire that can stably connect an electric wire to a substrate or the like.SOLUTION: A connecting member with an electric wire includes an electric wire having a central conductor, an insulating layer covering the central conductor, and a metallic shielding layer covering the insulating layer, and an insulating substrate having a through hole into which a portion of the electric wire where the shielding layer is exposed is inserted, the central conductor is exposed from one open surface of the through hole, and the insulating substrate has a metal plating layer which is continuous with an inner surface of the through hole and at least one of surfaces on which the through hole is open, and the shielding layer is electrically conductive with the metal plating layer.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a connection member with an electric wire and an electric wire connection structure. [Background Art]

[0002] In the terminal connection portion described in Patent Document 1, a configuration is disclosed in which, in order to connect a plurality of conductive wires to a substrate on which a circuit pattern is formed, terminal portions of the conductive wires are stripped, and the conductive wires are soldered to the substrate. [Prior Art Literature] [Patent Literature]

[0003] [Patent Document 1] Japanese Unexamined Patent Publication No. 2003-178826 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] By the way, in recent years, with the miniaturization of electronic components, further reduction in the diameter of cables is desired. However, it is difficult to solder a reduced-diameter conductive wire, and in the case of a coaxial electric wire, it is necessary to further strip the small-diameter electric wire and solder the conductive wire that transmits a signal and the shield layer covering the conductive wire respectively, so soldering becomes more difficult. In addition, during soldering, heat is transferred to the insulator covering the outside of the conductive wire and the shield, and there is a risk that the insulator and the jacket, which is the outermost coating, may melt. Accordingly, an object of the present disclosure is to provide a connection member with an electric wire that can stably connect an electric wire to a substrate or the like.

[0005] An object of the present disclosure is to provide a connection member with an electric wire and an electric wire connection structure that can stably connect an electric wire to a substrate or the like. [Means for Solving the Problem]

[0006] A connection member with an electric wire according to one aspect of the present disclosure is A wire having a central conductor, an insulating layer covering the central conductor, and a metal shielding layer covering the insulating layer, The insulating substrate has a through hole into which the portion of the electric wire in which the shield layer is exposed is inserted, The central conductor is exposed from one of the open surfaces of the through hole. The insulating substrate has a continuous metal plating layer on the inner circumferential surface of the through hole and on at least one of the surfaces through which the through hole is open. The shield layer is electrically connected to the metal plating layer.

[0007] A wire connection structure relating to one aspect of this disclosure is: The present disclosure comprises a wired connecting member and an electrical circuit board, The aforementioned electrical circuit board has a signal circuit pattern and a ground circuit pattern. The central conductor is connected to the signal circuit pattern, and the metal plating layer is connected to the ground circuit pattern. [Effects of the Invention]

[0008] According to the above, the wires can be stably connected to the circuit board and other components. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic perspective view showing an example of a connecting member with an electric wire according to this disclosure. [Figure 2] Figure 2 is a cross-sectional view of the wired connecting member shown in Figure 1. [Figure 3] Figure 3 is a schematic perspective view showing an example of a wire connection structure related to this disclosure. [Figure 4] Figure 4 is a cross-sectional view showing the connection configuration of the wire connection structure shown in Figure 3. [Figure 5] Figure 5 is a schematic perspective view showing another example of the wire connection structure according to this disclosure. [Modes for carrying out the invention]

[0010] [Description of Embodiments in this Disclosure] First, embodiments of this disclosure will be listed and described. An optical fiber manufacturing apparatus according to one aspect of this disclosure is: (1) A wire having a central conductor, an insulating layer covering the central conductor, and a metallic shield layer covering the insulating layer, and an insulating substrate having a through hole into which the portion of the wire in which the shield layer is exposed is inserted, wherein the central conductor is exposed from one of the open surfaces of the through hole, and the insulating substrate has a continuous metal plating layer on the inner circumferential surface of the through hole and at least one of the surfaces in which the through hole is open, and the shield layer is electrically connected to the metal plating layer. With this configuration, the side of the insulating substrate with the metal plating layer can be soldered to the connection target, such as an electrical circuit board, thus reducing heat transfer to the wire inserted through the through hole. This makes it possible to stably connect the wire to the connection target.

[0011] (2) In (1) above, the shield layer may be fixed to the insulating substrate in the through hole. In this configuration, the conductor is fixed in a through-hole in the insulating substrate so as to be electrically connected to the insulating substrate. This allows the conductor to be connected to the insulating substrate so that the potential of the shielding layer and the potential of the insulating substrate are the same.

[0012] (3) A wire connection structure may be provided comprising the wire-attached connecting member described in (1) or (2) above, and an electrical circuit board, wherein the electrical circuit board has a signal circuit pattern and a ground circuit pattern, the central conductor is connected to the signal circuit pattern, and the metal plating layer is connected to the ground circuit pattern. With this configuration, since the wire-attached connecting members described in (1) and (2) are used, it is possible to stably connect the wire to an electrical circuit board, even if the target of the wire connection is an electrical circuit board.

[0013] (4) In (3) above, the central conductor and the metal plating layer may be connected to the electrical substrate by an anisotropic conductive sheet. According to this configuration, the center conductor and the electric substrate, as well as the metal plating layer and the electric substrate, are butted against each other with the anisotropic conductive sheet interposed therebetween and connected to the electric substrate. Therefore, the connection between the center conductor and the signal circuit pattern, and the connection between the metal plating layer and the ground circuit pattern can be performed more stably.

[0014] (5) In the above (3) or (4), the insulating substrate has a metal plating layer on the entire outer surface thereof, and may be connected to the electric substrate by soldering. According to this configuration, since the entire outer surface of the insulating substrate is plated with metal, the insulating substrate can be connected to the electric substrate by soldering. Compared with a case where a thin center conductor is directly soldered to the electric substrate, this allows the insulating substrate and the electric substrate to be connected stably by a simpler method, so that the conductor can be stably connected to the electric substrate.

[0015] (6) In any one of the above (1) to (5), the insulating substrate may have an optical connection through-hole separate from the through-hole, and an optical fiber may be inserted into the optical connection through-hole. According to this configuration, the configuration of the present disclosure can also be used when the member is used as a photoelectric composite connecting member for transmitting an electric signal and an optical signal by both an electric wire and an optical fiber.

[0016] [Details of Embodiments of the Present Disclosure] Specific examples of the connecting member with electric wire and the electric wire connecting structure according to embodiments of the present disclosure will be described below with reference to the drawings. It should be noted that the present disclosure is not limited to these exemplifications, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0017] FIG. 1 is a diagram showing an example of the connecting member with electric wire 1 according to the present disclosure. The connecting member with electric wire 1 according to the present embodiment can be used, for example, for connecting an electric wire to a substrate.

[0018] As shown in Figure 1, the wired connecting member 1 according to this embodiment includes an insulating substrate 10, a coaxial wire 20, and an optical fiber 50. The insulating substrate 10 may be a glass substrate made of, for example, glass. In this embodiment, a coaxial wire 20 is used as the wire in the wired connecting member 1, but the disclosure is not limited thereto. For example, the wire may be a cable having multiple conductors or a shielded flat cable having multiple conductors.

[0019] The insulating substrate 10 has a plurality of through holes 11 (see Figure 2). In this embodiment, the plurality of through holes 11 are arranged in two rows and eight columns on the insulating substrate 10. The through holes 11 are configured to allow insertion of coaxial cables 20 that transmit electrical signals and optical fibers 50 that transmit optical signals. In the example shown in Figure 1, optical fibers 50 are inserted into the first row, first column, first row, eighth column, second row, first column, and second row, eighth column of the through-holes 11, while coaxial cables 20 are inserted into the other through-holes 11. Note that the number, arrangement, and shape of the through-holes 11 provided in the insulating substrate 10 are not limited to the example shown in Figure 1.

[0020] Next, using Figure 2, the configuration in which the coaxial wire 20 is inserted into the through hole 11 of the insulating substrate 10 in this embodiment will be described in detail. Figure 2 is a cross-sectional view of the wire-attached connecting member shown in Figure 1. As shown in Figure 2, a continuous metal plating layer 12 is provided on the inner circumferential surface of the through hole 11 and at least one of the surfaces on which the through hole is open. In this embodiment, of the surfaces on which the through hole is open in the insulating substrate 10, the surface on which the metal plating layer 12 is not provided is the front surface 10a, and the surface on which the metal plating layer 12 is provided is the back surface 10b.

[0021] In this embodiment, the optical fiber 50 inserted into the through-hole 11 of the insulating substrate 10 may have a configuration such as a core, a cladding covering the core, and a coating layer. For example, the optical fiber 50 may have its coating layer removed at its tip, be inserted into the through-hole 11, and then fixed inside the through-hole 11 with an adhesive.

[0022] In this embodiment, the coaxial cable 20 inserted into the through-hole 11 of the insulating substrate 10 has a central conductor 21, an insulating layer (not shown in Figure 2) covering the central conductor 21, a metal shielding layer 23 covering the insulating layer, and a jacket 24 covering the shielding layer 23. The central conductor 21 is a single wire or a stranded wire made of multiple thin wires twisted together, composed of a conductive metal such as a copper alloy. The insulating layer is made of insulating resin and protects the central conductor 21, as well as electrically insulating the central conductor 21 from its surroundings. The shielding layer 23 is made of metal braiding or metal plating and suppresses leakage of signals flowing to the central conductor 21 and prevents external radio waves from entering the central conductor 21. The jacket 24 is made of insulating resin and electrically insulates the shielding layer 23 from the outside and suppresses damage to the shielding layer 23. The coaxial cable 20 that can be used in this disclosure is not limited to the form described above. For example, a metal-plated shielded cable may be used in which the shield layer 23 is made of metal plating and does not have a jacket 24.

[0023] The coaxial cable 20 is inserted into the through-hole 11 with the shield layer 23 exposed. In other words, the jacket 24 at the tip of the coaxial cable 20 that is inserted into the through-hole 11 is cut off and inserted into the through-hole 11. Also, the central conductor 21 is exposed to the outside at the tip of the inserted coaxial cable 20. In this case, the central conductor 21 may protrude from the back surface 10b in a cross-sectional view, or the tip of the central conductor 21 and the back surface 10b may be arranged on the same plane.

[0024] With the coaxial cable 20 inserted into the through-hole 11, the coaxial cable 20 is fixed such that the shield layer 23 can electrically conduct to the metal plating layer 12. In this embodiment, the coaxial cable 20 and the through-hole 11 are fixed by bonding the outer surface of the shield layer 23 and the inner surface of the through-hole 11 with a conductive adhesive. However, the fixing of the coaxial cable 20 and the through-hole 11 is not limited to the above embodiment. For example, the shield layer 23 and the metal plating layer 12 of the coaxial cable 20 may be connected with a conductive adhesive at the opening of the through-hole 11. Alternatively, the diameter of the through-hole 11 may be set to such an extent that the shield layer 23 and the inner surface of the through-hole 11 can be in constant contact, and the coaxial cable 20 may be press-fitted into the through-hole 11. In any of the above-described fixing configurations, the shield layer 23 is fixed in a manner that allows it to conduct electricity with the metal plating layer 12. This makes it possible to set the potential of the shield layer 23 to be the same as the potential of the metal plating layer 12 of the insulating substrate 10.

[0025] Next, a wire connection structure using the wire-attached connecting member 1 described above will be described in detail with reference to Figure 3. Figure 3 is a diagram showing an example of a wire connection structure according to this disclosure. In this embodiment, the wire-attached connecting member 1 described above is connected to an electrical circuit board 30. The electrical circuit board 30 is a resin circuit board on which a circuit pattern is printed. Although not shown in Figure 3, the electrical circuit board 30 has a ground circuit pattern 31 (see Figure 4) that can be connected to the insulating substrate 10 and a signal circuit pattern 32 (see Figure 4) that can be connected to the central conductor 21 printed on each surface of the electrical circuit board 30, specifically on surface 30a that is connected to the wired connecting member 1. Furthermore, surface 30a is provided with other optical waveguides such as optical fibers that can be connected to the optical fiber 50, or with photodetectors, light-emitting elements, etc.

[0026] Next, the connection structure between the wired connecting member 1 and the electrical circuit board 30 will be described in detail using Figure 4. Figure 4 is a cross-sectional view showing the connection configuration of the wired connecting structure shown in Figure 3. As shown in Figure 4, the surface 30a of the electrical circuit board 30 is positioned opposite the back surface 10b of the wired connecting member 1, and the back surface 10b and the surface 30a are connected so that they contact each other at a predetermined relative position. As a result, the metal plating layer 12 provided on the back surface 10b of the insulating circuit board 10 is connected to the ground circuit pattern 31 on the electrical circuit board 30, and the central conductor 21 of the coaxial wire 20 is electrically connected to the signal circuit pattern 32 on the electrical circuit board 30.

[0027] In this embodiment, the connection between the wired connector 1 and the electrical substrate 30 is made by an anisotropic conductive sheet 40. The anisotropic conductive sheet 40 is made by mixing fine metal particles into a thermoplastic resin. When connecting the wired connector 1 and the electrical substrate 30, the anisotropic conductive sheet 40 is placed between them, and the thermoplastic resin is softened by pressing and heating the wired connector 1 and the electrical substrate 30 together. After pressing and heating, the resin cools and hardens, bonding the wired connector 1 and the electrical substrate 30 together by the thermoplastic resin. After bonding, the anisotropic conductive sheet 40 is electrically conductive only in the thickness direction and not in the surface direction. That is, electrical conductivity between the metal plating layer 12 and the ground circuit pattern 31, and electrical conductivity between the central conductor 21 and the signal circuit pattern 32 are ensured by the fine metal particles in the anisotropic conductive sheet 40. In addition, the ground circuit pattern 31 and the signal circuit pattern 32 are insulated from each other. The connection between the wired connecting member 1 and the electrical circuit board 30 may be made by soldering or the like.

[0028] When the optical fiber 50 in the wired connector 1 is connected to the electrical substrate 30, the optical fiber 50 inserted into the through hole 11 can be connected to other optical fibers on the electrical substrate 30. In other words, the wired connector 1 can be used as an optical-electrical composite connector for transmitting electrical and optical signals using both the coaxial cable 20 and the optical fiber 50.

[0029] Conventionally, when connecting coaxial cables and electrical circuit boards by soldering, it was common practice to solder the central conductor of the coaxial cable to the signal circuit pattern, and to solder the shield layer of the coaxial cable to the ground circuit pattern. However, when soldering the shield layer to the ground circuit pattern, the insulating layer covering the shield layer would sometimes melt due to the heat generated during soldering, making the connection difficult. According to the wire connection structure of this disclosure, the metal plating layer 12 provided on the insulating substrate 10 is directly connected to the ground circuit pattern 31, and the shield layer 23 is electrically conductive to the ground circuit pattern 31 via the metal plating layer 12. As a result, when connecting the wire-attached connection member 1 to the electrical substrate 30, heat is not easily transferred to the shield layer 23, and therefore the shield layer 23 is less susceptible to heat. Therefore, the coaxial wire can be stably connected to the substrate.

[0030] Furthermore, when conventionally connecting coaxial cables and electrical circuit boards with solder, it was necessary to cut the jacket covering the shield layer in order to connect the shield layer to the electrical circuit board, and to cut the insulating layer and shield layer covering the central conductor in order to connect the central conductor to the electrical circuit board. This made the connection process complicated, and because it was necessary to expose the insulating layer and central conductor from the shield layer in multiple coaxial cables, there was a possibility of impedance mismatch occurring at the exposed parts.

[0031] According to the wire connection structure of this disclosure, since it is not necessary to cut the shield layer 23 and insulating layer (not shown) covering the central conductor 21 during connection, the connection process can be simplified. Furthermore, since the length of the shield layer 23 and the length of the central conductor 21 can be made substantially the same for multiple coaxial wires, it becomes easy to match the impedance of the input side and the output side. As a result, it is possible to provide a wire connection structure suitable for high-speed transmission.

[0032] In the embodiments described above, an example was explained in which the connection between the wire-attached connecting member 1 and the electrical substrate 30 is made by an anisotropic conductive sheet 40. However, the wire connection structure according to this disclosure is not limited to this. Another form of connection between the wire-attached connecting member 1 and the electrical substrate 30 is shown in Figure 5. Figure 5 is a diagram showing another example of the wire connection structure according to this disclosure.

[0033] In the example shown in Figure 5, the insulating substrate 10 has a metal plating layer 12 over its entire surface, and the connection between the metal plating layer 12 of the wired connecting member 1 and the ground circuit pattern 31 of the electrical substrate 30 is made by soldering (solder part 60) between the insulating substrate 10 and the electrical substrate 30. At this time, the connection between the central conductor 21 and the signal circuit pattern 32 is made by pressing the central conductor 21 and the signal circuit pattern 32 against each other. Note that the connection between the central conductor 21 and the signal circuit pattern 32 may also be made by an anisotropic conductive sheet or soldering.

[0034] In the embodiment described above, the connection between the wire-attached connecting member 1 and the electrical circuit board 30 is made by soldering the insulating substrate 10 and the electrical circuit board 30, and the electrical connection between the metal plating layer 12 and the ground circuit pattern 31 is made by pressing them together, so that the heat transferred to the shielding layer 23 is further reduced. As a result, the coaxial wire can be stably connected to the circuit board.

[0035] While embodiments of this disclosure have been described above, it goes without saying that the technical scope of this disclosure should not be interpreted restrictively by the description of these embodiments. These embodiments are merely examples, and it will be understood by those skilled in the art that various modifications to the embodiments are possible within the scope of the invention described in the claims. The technical scope of this disclosure should be determined based on the scope of the invention described in the claims and the scope of its equivalents. [Explanation of Symbols]

[0036] 1. Connecting member 10 Insulating substrate 10a surface 10b back side 11 Through hole 12 Metal Plating Layer 20 coaxial wire 21 Central conductor 23 Shield layer 24 Jackets 30 Electrical circuit boards 30a side 31 Ground Circuit Pattern 32 Signal Circuit Patterns 40 Anisotropic conductive sheets 50 optical fibers 60 soldering section

Claims

1. A wire having a central conductor, an insulating layer covering the central conductor, and a metal shielding layer covering the insulating layer, The insulating substrate has a through hole into which the portion of the electric wire in which the shield layer is exposed is inserted, The central conductor is exposed from one of the open surfaces of the through hole. The insulating substrate has a continuous metal plating layer on the inner circumferential surface of the through hole and on at least one of the surfaces through which the through hole is open. A connecting member with an electric wire, wherein the shield layer is electrically conductive with the metal plating layer.

2. The wired connecting member according to claim 1, wherein the shield layer is fixed to the insulating substrate in the through hole.

3. The device comprises a connecting member with an electric wire as described in claim 1 or claim 2, and an electrical circuit board, The aforementioned electrical circuit board has a signal circuit pattern and a ground circuit pattern. A wire connection structure in which the central conductor is connected to the signal circuit pattern and the metal plating layer is connected to the ground circuit pattern.

4. The wire connection structure according to claim 3, wherein the central conductor and the metal plating layer are connected to the electrical substrate by an anisotropic conductive sheet.

5. The wire connection structure according to claim 3, wherein the insulating substrate has a metal plating layer over its entire outer surface and is connected to the electrical substrate by soldering.

6. The insulating substrate has a through-hole for optical connection, separate from the through-hole. An optical fiber is inserted into the aforementioned optical connection through-hole. A connecting member with an electric wire according to claim 1 or claim 2.

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