Wafer heating device

Abstract

To provide a wafer heating device that can obtain a detection result from a sensor depending on the temperature of a wafer holding table.SOLUTION: A wafer heating device includes a wafer holding table including an upper surface on which a wafer is placed, a lower surface disposed on the opposite side of the upper surface, and a heater disposed between the upper surface and the lower surface, and the wafer holding table includes a sensor provided on the wafer holding table and a wiring connected to the sensor, and the wiring is drawn out from the lower surface of the wafer holding table and fixed to the lower surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a wafer heating apparatus and a wiring fixing structure. [Background Art]

[0002] Patent Document 1 discloses a wafer heating apparatus that heats a wafer in, for example, a photolithography process. The wafer heating apparatus of Patent Document 1 includes a wafer holding table that heats a wafer, and a movable cooling module that cools the wafer holding table. A wafer is placed on the upper surface of the wafer holding table. The wafer holding table includes a heater containing a resistance heating element. The movable cooling module is configured to be movable up and down. The wafer holding table is cooled when the movable cooling module contacts the lower surface of the wafer holding table.

[0003] The wafer holding table includes a wiring that supplies electric power to the resistance heating element. The wiring is led out from the lower surface of the wafer holding table. Since the wiring serves as a heat transfer path, a cool spot may be formed on the wafer holding table. In order to solve this problem, in the wafer heating apparatus of Patent Document 2, a part of the wiring is fixed to the lower surface of the wafer holding table. By fixing the wiring to the wafer holding table, the wiring is warmed by the wafer holding table. As a result, it becomes difficult for cool spots to be formed on the wafer holding table. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Unexamined Patent Publication No. 2011-129577 [Patent Document 2] Japanese Unexamined Patent Publication No. 2011-187257 [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] A sensor for measuring the wafer holder's temperature is positioned on the wafer holder. Wiring extending from the sensor is also routed from the underside of the wafer holder. When the sensor's wiring is cooled by a movable cooling module, heat dissipation from the wiring is promoted, making it easy for the temperature detected by the sensor to be lower than the actual temperature of the wafer holder. In this case, the control equipment of the wafer heating device determines that the temperature of the wafer holder is lower than the desired temperature and increases the temperature of the resistance heating element. As a result, the wafer temperature may rise above the optimal temperature.

[0006] One of the objectives of this disclosure is to provide a wafer heating apparatus that can obtain sensor detection results corresponding to the temperature of the wafer holder. Another objective of this disclosure is to provide a wiring fixing structure that can fix wiring that is pulled out from the lower surface of the wafer holder. [Means for solving the problem]

[0007] The wafer heating apparatus of this disclosure is A wafer holder comprising an upper surface on which a wafer is placed, a lower surface located on the opposite side of the upper surface, and a heater located between the upper surface and the lower surface, The wafer holder is A sensor provided on the wafer holder, The sensor is connected to the wiring, The aforementioned wiring is routed from the lower surface to the outside of the wafer holder and fixed to the lower surface. [Effects of the Invention]

[0008] In the wafer heating apparatus of this disclosure, a sensor detection result corresponding to the temperature of the wafer holder can be obtained. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic cross-sectional view of the wafer heating apparatus described in Embodiment 1. [Figure 2]Figure 2 is a schematic bottom view showing the wiring fixed in the wafer heating apparatus shown in Figure 1. [Figure 3] Figure 3 is a schematic perspective view of the wiring fixing structure described in Embodiment 2, taken from a diagonal downward angle. [Figure 4] Figure 4 is a partially exploded perspective view of the wiring fixing structure shown in Figure 3. [Figure 5] Figure 5 is a schematic view of the first holder member shown in Figure 4, viewed from below. [Figure 6] Figure 6 is a cross-sectional view of the wiring fixing structure shown in Figure 3, taken at the position of the VI-VI section in Figure 5. [Figure 7] Figure 7 is a cross-sectional view of the wiring fixing structure shown in Figure 3, taken at the position of section VII-VII in Figure 5. [Figure 8] Figure 8 is a top view of the first holder member described in Embodiment 2. [Figure 9] Figure 9 is a bottom view of the first holder member described in Embodiment 2. [Figure 10] Figure 10 is a side view of the first holder member as seen from the direction indicated by arrow X in Figures 8 and 9. [Figure 11] Figure 11 is a schematic perspective view of the second holder member described in Embodiment 2, viewed from diagonally above. [Figure 12] Figure 12 is a cross-sectional view showing the wiring fixing structure described in Embodiment 3. [Figure 13] Figure 13 is an exploded perspective view of the wiring fixing structure described in Embodiment 4, viewed from a diagonal downward angle. [Figure 14] Figure 14 is a schematic view of the first holder member shown in Figure 13, viewed from below. [Figure 15] Figure 15 is a cross-sectional view of the wiring fixing structure shown in Figure 13, taken at the position of the XV-XV section in Figure 14. [Figure 16] Figure 16 is a schematic perspective view of the first holder member described in Embodiment 4, viewed from diagonally above. [Figure 17]FIG. 17 is a schematic perspective view of the second holder member described in the fourth embodiment, as viewed from diagonally below. MODE FOR CARRYING OUT THE INVENTION

[0010] [Description of Embodiments of the Present Disclosure] Hereinafter, embodiments of the present disclosure will be listed and described.

[0011] <1> A wafer heating apparatus according to an embodiment includes a wafer holding table including an upper surface on which a wafer is placed, a lower surface disposed on a side opposite to the upper surface, and a heater disposed between the upper surface and the lower surface, the wafer holding table comprises a sensor disposed on the wafer holding table, and a wiring connected to the sensor, the wiring is drawn out from the lower surface to the outside of the wafer holding table and is fixed to the lower surface.

[0012] Since a part of the wiring is fixed to the lower surface of the wafer holding table, the wiring is warmed by the wafer holding table, and a decrease in the temperature of the sensor connected to the wiring is suppressed. As a result, an appropriate detection result corresponding to the actual temperature of the wafer holding table can be obtained. For example, the temperature sensor can accurately detect the temperature of the wafer holding table. If the temperature of the wafer holding table can be detected with high accuracy, the temperature of the wafer holding table is suppressed from exceeding a desired temperature, and excessive heating of the wafer is suppressed.

[0013] <2> In the wafer heating apparatus according to <1> above, the wafer holding table includes a first hole having an opening through which the wiring is drawn out, the wiring includes a first portion fixed to the lower surface, the length of the first portion may be not less than twice the equivalent circle diameter of the opening edge of the first hole.

[0014] The equivalent diameter of the opening edge is the diameter of a circle with an area equal to the area inside the opening edge. The larger the area inside the opening edge, the easier it is for the wiring to cool. Depending on the size of the area inside the opening edge, i.e., the size of the equivalent diameter of the opening edge, it is advisable to increase the length of the first portion of the wiring fixed to the bottom surface. If the length of the first portion is more than twice the equivalent diameter of the opening edge of the first hole, the wiring will be sufficiently heated by the wafer holder. As a result, the temperature drop of the sensor will be suppressed.

[0015] <3> the above <2> In the wafer heating apparatus described above, The first portion may be fixed to the lower surface so as to surround the opening edge.

[0016] The arrangement of the first part surrounding the opening edge of the first hole facilitates the placement of wiring below the wafer holder. In a wafer heating apparatus, a movable cooling plate is positioned below the wafer holder. The wiring is routed through through holes in the cooling plate and out to the bottom of the cooling plate. If the first part is positioned to encircle the outer circumference of the first hole, it is easier to guide the wiring to the through holes in the cooling plate. Furthermore, positioning the first part in a narrow area near the first hole makes it less likely for the wiring to be pinched between the cooling plate and the wafer holder.

[0017] <4> The wiring fixing structure according to this embodiment is A wiring fixing structure for a wafer holder comprising an upper surface on which a wafer is placed, a lower surface located on the opposite side of the upper surface, and a heater located between the upper surface and the lower surface, The wafer holder is The first hole opening on the lower surface, Wiring is pulled out from the lower surface to the outside of the wafer holder through the first hole, The system includes a holder for fixing the aforementioned wiring to the lower surface, The aforementioned wiring is It comprises a first portion positioned to face the aforementioned lower surface, The aforementioned holder is, The first connecting portion connected to the first hole, A guide portion is positioned to face the lower surface of the first portion, The system includes a support portion that supports the first portion from below.

[0018] The above wiring fixing structure can secure wiring that is pulled out from the underside of the wafer holder. In this wiring fixing structure, the wiring is mechanically fixed by a holder. Fixing the wiring with a holder is simpler and quicker than fixing the wiring with adhesive. Therefore, the productivity of the wafer heating device is improved.

[0019] The first coupling portion of the holder ensures secure fixation of the holder to the wafer heating device. The guide portion allows for precise positioning of the wiring on the underside of the wafer holder. The support portion brings the first portion of the wiring closer to the underside of the wafer holder. Wiring positioned closer to the underside is more easily heated by the wafer holder. In this wiring fixing structure, the support portion may or may not be in contact with the first portion. In other words, the support portion is a component that restricts the downward movement of the first portion and holds the first portion in a position close to the underside.

[0020] <5> the above <4> In the wiring fixing structure described above, The inner circumferential surface of the first hole is provided with a recess. The first connecting portion may have claws shaped to engage with the recess.

[0021] In the above configuration, the holder is fixed to the wafer holder simply by the operator pushing the first joint of the holder into the first hole. The connection between the recess and the claw makes it difficult for the holder to come off the wafer holder.

[0022] <6> the above <4> or <5> In the wiring fixing structure described above, The holder comprises a first holder member and a second holder member that are combined with each other. The first connecting portion and the guide portion are provided on the first holder member. The support portion may be provided on the first holder member or the second holder member.

[0023] Because the holder is divided into a first holder member and a second holder member, the wiring fixing process is divided into two parts: determining the position of the wiring relative to the bottom surface and bringing the wiring closer to the bottom surface. The worker fixing the wiring can concentrate on determining the position of the wiring relative to the bottom surface by using the first holder member. After that, the worker simply attaches the second holder member to the first holder member, and the support part of the second holder member brings the wiring closer to the bottom surface.

[0024] <7> the above <6> In the wiring fixing structure described above, The first holder member comprises a first annular portion surrounding the opening edge of the first hole, and a first leg portion extending from the first annular portion into the interior of the first hole. The guide portion is formed by the outer circumferential surface of the first annular portion, The first connecting portion may be provided on the first leg portion.

[0025] The first leg facilitates the attachment of the first holder member to the wafer holder. The operator simply inserts the first leg into the first hole, and the first connecting portion of the first leg engages with the first hole. As a result, the first holder member is firmly attached to the wafer holder. Furthermore, the annular portion of the first holder member surrounds the opening edge of the first hole. Therefore, the first portion of the wiring, arranged along the outer surface of the annular portion, is less likely to be pulled towards the first hole from below.

[0026] <8> the above <7> In the wiring fixing structure described above, The first holder member is provided with a groove-shaped or slit-shaped first annular portion that connects the inner circumferential surface and the outer circumferential surface of the first annular portion, The wiring may be routed from the first hole through the complete cutout toward the guide portion.

[0027] A notch is a passage for wiring connecting the inner circumferential surface to the outer circumferential surface of the annular part. A groove-shaped notch is a groove provided on one side of the annular part. A slit-shaped notch is a slit that divides a part of the annular shape of the annular part. Wiring placed in a notch is less likely to get caught between the first holder member and the second holder member.

[0028] <9> the above <7> or <8> In the wiring fixing structure described above, The first holder member further comprises a second leg portion extending on the opposite side from the first leg portion, The second leg portion may also be provided with a second connecting portion that connects to the second holder member.

[0029] The second leg facilitates the attachment of the second holder member to the first holder member. Simply by attaching the second holder member to the first holder member, the second connecting portion of the second leg connects to the second holder member. As a result, the second holder member is fixed to the first holder member.

[0030] <10> the above <9> In the wiring fixing structure described above, The second connecting portion may have claws shaped to connect with the second holder member.

[0031] The claws on the second joint make it difficult for the second holder member to detach from the first holder member.

[0032] <11> the above <7> from <10> In the wiring fixing structure described in any of the above, The holder may further include a reinforcing portion located inside the first joint.

[0033] The first leg portion, including the first joint, is positioned within the first annular portion. Therefore, the inside of the first joint is the space on the side of the first joint that extends toward the central axis of the annular shape of the first annular portion. The reinforcing portion positioned inside the first joint supports the first joint from the inside. As a result, the first leg portion on which the first joint is provided becomes less prone to bending, and the connection between the first joint and the first hole becomes less prone to loosening.

[0034] <12> the above <11> In the wiring fixing structure described above, The reinforcing portion may be provided on the second holder member.

[0035] In the above configuration, the reinforcing portion is provided on a second holder member, which is a member independent of the first holder member having the first joint portion. Therefore, when the first holder member having the first joint portion is attached to the wafer holder, the reinforcing portion does not interfere with the connection between the first joint portion and the first hole.

[0036] <13> the above <12> In the wiring fixing structure described above, The reinforcing portion may have a cylindrical shape.

[0037] The cylindrical reinforcement section offers superior strength and is resistant to deformation. Therefore, the deformation of the first leg section is effectively suppressed by the reinforcement. The cylindrical shape also includes shapes where a portion of the circumferential surface is missing.

[0038] <14> the above <7> from <13> In the wiring fixing structure described in any of the above, The second holder member comprises a second annular portion and a rib provided along the outer peripheral edge of the second annular portion. The ribs may be arranged on the outer circumference of the wiring wrapped around the outer surface of the first annular portion.

[0039] The ribs make it difficult for the first portion of the wiring wrapped around the outer surface of the first annular section to detach from the outer surface. As a result, it is easier to maintain the state in which the first portion of the wiring faces the lower surface of the wafer holder.

[0040] <15> the above <14> In the wiring fixing structure described above, The second holder member may have a slit-shaped second notch that connects the inner and outer circumferential surfaces of the second annular portion.

[0041] The second holder member, having a second notch, is easy to attach to the wiring from the side. Therefore, the ease of assembly of the wiring fixing structure is improved.

[0042] <16> Another wafer heating apparatus according to a different embodiment is described above. <4> from <15> It has a wiring fixing structure as described in any of the above.

[0043] In the above wafer heating apparatus, the first portion of the wiring is easily fixed to the underside of the wafer holder by the holder, thus the above configuration offers excellent productivity. Furthermore, because the wiring easily reaches the same temperature as the wafer holder, the effects of heat loss from the wiring can be reduced.

[0044] [Details of the embodiments of this disclosure] Hereinafter, a wafer heating apparatus and a wiring fixing structure according to embodiments of this disclosure will be described with reference to the drawings. Identical reference numerals in the drawings indicate the same or corresponding parts. The dimensions of the components shown in each drawing are represented for illustrative purposes only and do not necessarily represent actual dimensions. The present invention is not limited to these examples and is intended to include all modifications within the meaning and scope equivalent to the claims as shown in the claims.

[0045] <Embodiment 1> ≪Overall Structure≫ The wafer heating apparatus 1 of Embodiment 1 shown in Figures 1 and 2 is used for pre-baking in the photolithography process. Pre-baking is a heat treatment that volatilizes the solvent of the photoresist solution applied to the surface of the wafer 10. The wafer heating apparatus 1 comprises a wafer holder 2, a cooling plate 3, and a cooling stage 4. The wafer holder 2 supports the wafer 10 from below and heats the wafer 10. The cooling plate 3 is configured to move up and down and cools the wafer holder 2 as needed. Figure 1 shows the cooling plate 3 separated from the wafer holder 2. The cooling stage 4 cools the cooling plate 3 to a desired temperature. The components of the wafer heating apparatus 1 according to this embodiment will be described in detail below.

[0046] Wafer holder The wafer holder 2 in this example comprises, from top to bottom, a top plate 2T, a heater 2H, and a back plate 2B. As shown in the modified example described later, the back plate 2B is not essential.

[0047] [Top plate] The top plate 2T has a flat upper surface 2U on which the wafer 10 is placed. The upper surface 2U constitutes the upper surface 2U of the wafer holder 2. In this example, the top plate 2T is a disc. The diameter of the disc only needs to be larger than the wafer 10 placed on the upper surface 2U, for example, 200 mm or more and 500 mm or less. The planar shape of the top plate 2T is not limited to a circle, and may be a polygon such as a square. The planar shape of the top plate 2T may also be a shape similar to the planar shape of the wafer 10.

[0048] The top plate 2T is made of a material that has excellent thermal conductivity and is resistant to deformation by heat. Such materials include, for example, copper, aluminum, or alloys containing these. The material of the top plate 2T may also be, for example, ceramics such as aluminum nitride, silicon carbide (SiC), aluminum oxide, or silicon nitride, or composites of these ceramics and silicon (Si). The composite is, for example, Si-SiC, which is made by impregnating a porous body of SiC with silicon. The surface of the top plate 2T may have, for example, a nickel plating layer or an anodized layer.

[0049] The top plate 2T may have protrusions, vacuum ports, and lift pin holes (not shown). The protrusions are provided on the upper surface 2U. The protrusions form a small gap between the upper surface 2U and the wafer 10. The vacuum ports and lift pin holes are holes that penetrate the upper surface 2U and the lower surface of the top plate 2T. When air is sucked through the gap between the upper surface 2U and the wafer 10 via the vacuum ports, the wafer 10 is straightened to a nearly flat state. The lift pin holes are holes through which lift pins are inserted to lift the wafer 10 from the upper surface 2U. Vacuum ports and lift pin holes are also provided on the heater 2H and back plate 2B, which will be described later.

[0050] [heater] The heater 2H is a component that heats the top plate 2T. The heated top plate 2T heat-treats the wafer 10. The heater 2H comprises a plate-shaped base material 21 made of an insulator and a circuit pattern 20 of a resistance heating element made of metal. The base material 21 constitutes the outer shape of the heater 2H. In this example, the base material 21 is a disc shape having the same outer diameter as the top plate 2T. The heater 2H in this example includes a circuit pattern 20 arranged inside the base material 21. Wiring 8 that supplies power to the circuit pattern 20 is connected to the terminals of the circuit pattern 20. The circuit pattern 20 is made of, for example, a thin metal film that generates heat when current is passed through it. The circuit pattern 20 is, for example, a circuit pattern 20 formed by partially etching a stainless steel foil. The base material 21 is made of, for example, a heat-resistant resin such as polyimide. In addition, the base material 21 is made of, for example, a mica sheet impregnated with resin or ceramics. In this example, heater 2H is composed of a circuit pattern 20 and two polyimide sheets that sandwich the circuit pattern 20.

[0051] [Backplate] The back plate 2B supports the heater 2H from below. The back plate 2B helps maintain the flatness of the top plate 2T, thereby improving the uniformity of the heat distribution of the top plate 2T. In this example, the lower surface 2D of the back plate 2B constitutes the lower surface 2D of the wafer holder 2. The lower surface 2D is the surface located on the opposite side of the upper surface 2U. The cooling plate 3 contacts the lower surface 2D of the back plate 2B when the wafer holder 2 is being cooled. The back plate 2B prevents the cooling plate 3 from directly contacting the heater 2H, thus reducing the risk of damage to the heater 2H. In this example, the back plate 2B is a disc shape with the same outer diameter as the top plate 2T. In this example, the back plate 2B, the top plate 2T, and the heater 2H are integrated by connecting screws (not shown) or the like. The back plate 2B is made of, for example, ceramics.

[0052] The backplate 2B is provided with a second hole 26 having an opening from which the wiring 8 is drawn out. The shape of the second hole 26 is not particularly limited. In this example, the second hole 26 is a round hole. The wiring 8 extending from the terminals of the circuit pattern 20 is drawn out from the lower surface 2D of the wafer holder 2 through the second hole 26. The second hole 26 may be covered with resin or the like. The wiring 8 is fixed to the lower surface 2D with adhesive 28 or the like. In Figure 1, the arrangement of the adhesive 28 is shown in a simpler manner compared to Figure 2.

[0053] ≪Sensor≫ A sensor 24 is positioned between the upper surface 2U and the lower surface 2D of the wafer holder 2. In this example, the sensor 24 is a temperature sensor. The temperature information of the top plate 2T measured by the sensor 24 is used to control the heater 2H. The sensor 24 is positioned, for example, in a counterbore hole 23 provided on the lower surface of the top plate 2T. In this example, the counterbore hole 23 has a roughly rectangular shape that conforms to the shape of the sensor 24. The sensor 24 in this example includes a temperature measuring element, for example, a platinum resistor deposited on ceramics by vapor deposition. The sensor 24 is fixed, for example, with silicone adhesive. Wiring 7 is connected to the sensor 24. The arrangement of the wiring 7 will be described later.

[0054] A cover (not shown) is fitted into the counterbore hole 23. The cover covers most of the counterbore hole 23 and prevents the sensor 24 from falling out. There is a gap between the cover and the opening of the counterbore hole 23, and the wiring 7 is pulled out through this gap.

[0055] The wafer holder 2 is provided with a first hole 25 having an opening from which wiring 7 is drawn out. The first hole 25 is connected to a counterbore 23. In this example, the first hole 25 is a through hole that penetrates the back plate 2B. The wiring 7 extending from the sensor 24 located in the counterbore 23 is drawn out from the lower surface 2D of the wafer holder 2 through the first hole 25. The shape of the first hole 25 is not particularly limited. In this example, the first hole 25 is a round hole. That is, the shape of the opening edge 25e (see Figure 2) of the first hole 25 is circular. The first hole 25 may be covered with resin or the like.

[0056] Cooling Stage The cooling stage 4 is kept at a low temperature by a refrigerant or the like. For example, a refrigerant flow path is formed inside the cooling stage 4. The cooling stage 4 has the role of cooling the cooling plate 3. The cooling stage 4 also has the role of holding the wafer holder 2 above it. Specifically, the cooling stage 4 and the wafer holder 2 are connected by a fixed shaft 40.

[0057] Cooling Plate The cooling plate 3 is configured to move up and down. For example, the cooling plate 3 is attached to the tip of the rod of an air cylinder (not shown). When the low-temperature cooling plate 3 moves upward and contacts the lower surface 2D of the wafer holder 2, the wafer holder 2 is rapidly cooled and its temperature is adjusted to the desired temperature. After the cooling of the wafer holder 2 is complete, the cooling plate 3 moves away from the lower surface 2D of the wafer holder 2 and descends to a position where it contacts the cooling stage 4. The fixed shaft 40 that supports the wafer holder 2 passes through the cooling plate 3, and the cooling plate 3 is not fixed by the fixed shaft 40.

[0058] The cooling plate 3 in this example comprises a disc-shaped body 3B and an upper layer 3C positioned on the upper surface of the body 3B. Unlike this example, the cooling plate 3 does not necessarily have to have an upper layer 3C. The body 3B is made of a material with excellent thermal conductivity, such as metal. In this example, the body 3B is made of an aluminum alloy.

[0059] The upper layer 3C has the function of improving the adhesion between the cooling plate 3 and the wafer holder 2. In this example, the upper layer 3C is a resin sheet. The material of the upper layer 3C is made of a highly flexible material mainly composed of, for example, silicone or fluorine. The highly flexible upper layer 3C improves the adhesion between the cooling plate 3 and the wafer holder 2, and improves the cooling efficiency of the wafer holder 2 by the cooling plate 3. In addition, the highly flexible upper layer 3C suppresses damage to the main body 3B of the cooling plate 3 and the wafer holder 2 when the cooling plate 3 comes into contact with the wafer holder 2.

[0060] The cooling plate 3 includes a first through hole 35 and a second through hole 36. The upper opening of the first through hole 35 is configured to connect to the first hole 25 when the cooling plate 3 is in contact with the wafer holder 2. The opening of the first through hole 35 is wider than the lower opening of the first hole 25. The upper opening of the second through hole 36 is configured to connect to the second hole 26 when the cooling plate 3 is in contact with the wafer holder 2. The opening of the second through hole 36 is wider than the lower opening of the second hole 26.

[0061] Wiring The wiring 7 connected to the sensor 24 is routed through the first hole 25 from the lower surface 2D of the wafer holder 2 to the outside of the wafer holder 2. This wiring 7 has a first portion 71 fixed to the lower surface 2D of the wafer holder 2. In this example, the wiring 7 is fixed to the lower surface 2D with adhesive 28 or the like. Figure 1 shows the arrangement of the wiring 7 and adhesive 28 in a simplified manner compared to Figure 2. The actual arrangement of adhesive 28 will be described later. The wiring 7 routed through the first hole 25 is further routed through the first through hole 35 to the bottom of the cooling plate 3 and connected to a temperature measuring device (not shown).

[0062] When the wafer holder 2 and the cooling plate 3 are in contact, the first portion 71 of the wiring 7 is positioned inside the first through-hole 35. In other words, the wiring 7 is less likely to be pinched between the wafer holder 2 and the cooling plate 3. Therefore, the problem of reduced contact area between the wafer holder 2 and the cooling plate 3, and the problem of damage to the wiring 7, are less likely to occur.

[0063] The arrangement of the first portion 71 on the lower surface 2D will be explained with reference to Figure 2. Figure 2 is a view of the vicinity of the first hole 25 on the lower surface 2D of the wafer holder 2, as seen from below the wafer holder 2. The sensor 24 is not shown in Figure 2. As shown in Figure 2, the first portion 71 of the wiring 7 is fixed to the lower surface 2D of the wafer holder 2 by adhesive 28, indicated by a dashed line. Alternatively, the first portion 71 may be fixed to the lower surface 2D by an adhesive sheet, for example. By fixing the first portion 71 of the wiring 7 to the lower surface 2D, the wiring 7 is heated by the wafer holder 2, and the temperature drop of the sensor 24 connected to the wiring 7 is suppressed. Therefore, the sensor 24 in this example can accurately detect the temperature of the wafer holder 2. If the temperature of the wafer holder 2 can be detected accurately, it is suppressed that the temperature of the wafer holder 2 rises above the desired temperature. As a result, excessive heating of the wafer 10 is suppressed.

[0064] The length of the wiring 7 fixed to the lower surface 2D, i.e., the length of the first part 71, is, for example, at least twice the circular equivalent diameter of the opening edge 25e of the first hole 25. The circular equivalent diameter of the opening edge 25e is the diameter of a circle having the same area as the area of ​​the opening edge 25e. In this example, the opening edge 25e is circular. Therefore, in this example, the diameter of the opening edge 25e is the circular equivalent diameter. If the length of the first part 71 is at least twice the circular equivalent diameter of the opening edge 25e, the wiring 7 is sufficiently heated by the wafer holder 2. As a result, the temperature of the sensor 24 does not easily decrease. The absolute value of the length of the first part 71 is, for example, 20 mm or more and 200 mm or less. The length of the first part 71 may also be 30 mm or more and 150 mm or 35 mm or more and 100 mm or less.

[0065] The first portion 71 of the wiring 7 can take on any arrangement shape relative to the lower surface 2D. In this example, the first portion 71 is fixed to the lower surface 2D so as to surround the opening edge 25e, as shown in Figure 2. If the first portion 71 is arranged to encircle the outer circumference of the opening edge 25e, it is easier to guide the wiring 7 into the first through hole 35 of the cooling plate 3. In addition, by arranging the first portion 71 in a narrow area near the first hole 25, the wiring 7 is less likely to be pinched between the cooling plate 3 and the wafer holder 2.

[0066] In this example, the first part 71 is arranged along a virtual circle that houses the first hole 25. In Figure 2, the virtual circle is shown by a dashed line. The diameter of the virtual circle is preferably more than 1 and less than or equal to 2 times the equivalent diameter of the first hole 25. The length of the first part 71 is, for example, 80% or more of the circumference of the virtual circle. The length of the first part 71 may also be 100% or more of the circumference of the virtual circle. That is, the first part 71 may be arranged in a circular shape that completes one or more turns.

[0067] As shown in Figure 1, the wafer holder 2 in this example further includes wiring 8 connected to the circuit pattern 20. The wiring 8 is led out below the wafer holder 2 through a second hole 26. After being fixed to the lower surface 2D of the wafer holder 2 by adhesive 28 or the like, the wiring 8 is led out below the cooling plate 3 through a second through hole 36. The wiring 8 is connected to a power supply (not shown). Because the wiring 8 is fixed to the lower surface 2D, the wiring 8 is heated by the wafer holder 2. Therefore, it is difficult for cool spots with locally lower temperatures to form on the wafer holder 2. The length of the first portion 81 of the wiring 8 that is fixed to the lower surface 2D is selected as appropriate.

[0068] <Variation> The wafer holder 2 does not necessarily have a back plate 2B. In that case, the lower surface of the heater 2H constitutes the lower surface 2D of the wafer holder 2.

[0069] The circuit pattern 20 may be formed on the underside of the top plate 2T by metallization. In that case, the heater 2H integrated with the top plate 2T is formed by coating the underside of the top plate 2T, including the circuit pattern 20, with an insulating resin or the like.

[0070] <Embodiment 2> In Embodiment 2, a wiring fixing structure 5 for mechanically fixing the wiring 7 to the lower surface 2D of the wafer holder 2 will be described based on Figures 3 to 11. The sensor 24 is not shown in Figure 6. Hereinafter, the wiring fixing structure 5 will simply be referred to as fixing structure 5.

[0071] As shown in Figures 3 to 5, the fixing structure 5 comprises a wafer holder 2 and a holder 6 attached to the wafer holder 2. This holder 6 mechanically fixes the wiring 7 to the lower surface 2D of the wafer holder 2. With this configuration, the wiring 7 is fixed by the holder 6, and there is no need to fix the wiring 7 with adhesive. Therefore, the fixing structure 5 of this example does not have the problem of outgassing from adhesive. The configuration of the wafer holder 2 in this example is substantially the same as that of Embodiment 1. In Embodiment 2, only the differences from the wafer holder 2 of Embodiment 1 will be explained as appropriate.

[0072] ≪Holder≫ As shown in Figures 3 and 4, the holder 6 is a member that fixes the wiring 7 to the lower surface 2D. In this example, the holder 6 comprises a first holder member 6A and a second holder member 6B that are combined with each other. As shown in Figures 6 and 7, the holder 6 comprises a first connecting portion 61, a guide portion 60, and a support portion 63. The first connecting portion 61 is the part that is connected to the first hole 25. The guide portion 60 is the part that positions the first portion 71 facing the lower surface 2D. The support portion 63 supports the first portion 71 from below. In this example, the first connecting portion 61 and the guide portion 60 are assigned to the first holder member 6A, and the support portion 63 is assigned to the second holder member 6B.

[0073] The material of holder 6 may be, for example, a heat-resistant resin or a metal. In this example, holder 6 is made of polyetheretherketone. Polyetheretherketone has excellent strength, heat resistance, and dimensional stability.

[0074] [First holder component] The first holder member 6A, as shown in Figures 8 to 10, comprises a first annular portion 65, a first leg portion 66, and a second leg portion 67. The first annular portion 65, the first leg portion 66, and the second leg portion 67 are integrally formed. In this example, the first annular portion 65 has a slit-shaped notch 65c that connects the inner circumferential surface 650 and the outer circumferential surface 651 of the first annular portion 65. The slit-shaped notch 65c has a shape as if a part of the ring has been cut out. The first annular portion 65 with the slit-shaped notch 65c is roughly C-shaped in plan view. Unlike this example, the notch 65c may also be a groove formed on the lower surface of the first annular portion 65. In this case, the first annular portion 65 is a continuous annular shape.

[0075] The thickness of the first annular portion 65 along its central axis may be the same as the thickness of the wiring 7, or it may be smaller or larger than the thickness of the wiring 7. The diameter of the through hole 65h of the first annular portion 65 is smaller than the diameter of the first hole 25 shown in Figures 6 and 7. Unlike this example, the diameter of the through hole 65h may be the same as the diameter of the first hole 25, or it may be larger.

[0076] The upper surface of the first annular portion 65 is positioned to face the lower surface 2D of the wafer holder 2. In this example, the upper surface of the first annular portion 65 is in contact with the lower surface 2D. As shown in Figure 5, the wiring 7 drawn out from the first hole 25 to the through hole 65h of the first annular portion 65 is further drawn out through the notch 65c of the first annular portion 65 away from the central axis of the first annular portion 65 and wrapped around the outer circumferential surface 651 of the first annular portion 65. The wiring 7 wrapped around the outer circumferential surface 651 of the first annular portion 65 is difficult to move. Of the wiring 7, the portion wrapped around the outer circumferential surface 651 of the first annular portion 65 is the first portion 71 positioned to face the lower surface 2D. That is, the outer circumferential surface 651 of the first annular portion 65 in this example functions as a guide portion 60 that positions the first portion 71 to face the lower surface 2D. In Figure 5, the sensor 24 and the lid 29 are omitted. The cover 29 prevents the sensor 24 from falling out and also suppresses a decrease in the temperature of the sensor 24.

[0077] In this example, the wiring 7 is wrapped once around the outer surface 651. The length of the first portion 71 is approximately equal to the length of the outer surface 651. The length of this first portion 71 is more than twice the equivalent diameter of the first hole 25. The wiring 7 may be wrapped two or more times around the outer surface 651. After being wrapped around the outer surface 651, the wiring 7 passes through the notch 65c and is positioned in the through hole 65h of the first annular portion 65.

[0078] The first leg portion 66 extends from the first annular portion 65 toward the interior of the first hole 25, as shown in Figures 6 and 7. In this example, the first leg portion 66 is a roughly L-shaped projection extending from the upper surface of the first annular portion 65 along the central axis of the first annular portion 65. In this example, there are two first leg portions 66. The two first leg portions 66, 66 are positioned symmetrically with respect to the central axis of the first annular portion 65. The two first leg portions 66, 66 may be positioned asymmetrically with respect to the central axis of the first annular portion 65. There may be three or more first leg portions 66. The first leg portion 66 is positioned in the first hole 25. A first connecting portion 61 is provided at the end of the first leg portion 66 opposite to the first annular portion 65. The first connecting portion 61 is a member that connects the holder 6 to the first hole 25. In this example, the first connecting portion 61 is a claw 61n. The claw 61n has a shape that connects to the recess 25c provided in the first hole 25. More specifically, the claw 61n has a shape that protrudes in a direction away from the central axis of the first annular portion 65. The tip of the claw 61n is rounded. Therefore, when attaching the first holder member 6A to the first hole 25, it is easy to push the first leg portion 66 into the first hole 25.

[0079] In this example, the recess 25c is provided at the upper end of the inner circumferential surface of the first hole 25. In this example, the recess 25c is formed by a portion of the inner circumferential surface of the first hole 25 increasing in the direction away from the central axis of the first hole 25 as it extends upward. The recess 25c is provided only on a portion of the inner circumferential surface of the first hole 25. The recess 25c is frustoconical in shape. The number of recesses 25c corresponds to the number of first legs 66. The recess 25c is not particularly limited as long as it has a shape that allows the claw 61n to easily catch. For example, the recess 25c may be a counterbore.

[0080] The second leg portion 67 extends on the opposite side from the first leg portion 66. In this example, the second leg portion 67 is a roughly L-shaped projection extending from the lower surface of the first annular portion 65 along the central axis of the first annular portion 65. In this example, there are two second leg portions 67. Each second leg portion 67 is located on the opposite side of each first leg portion 66, with the first annular portion 65 in between (see Figure 10). Unlike this example, the second leg portions 67 may be located offset from the first leg portions 66 around the central axis of the first annular portion 65. There may be three or more second leg portions 67. The second leg portions 67 pass through the through hole 68h of the second holder member 6B, which will be described later. The circumscribed circles that circumscribe the two second leg portions 67 are approximately the same as the inner diameter of the through hole 68h. A second connecting portion 62 is provided at the tip of the second leg portion 67. The second connecting portion 62 connects to the second holder member 6B, making it difficult to detach the second holder member 6B from the first holder member 6A. In this example, the second connecting portion 62 is a claw 62n. The claw 62n has a shape that connects to the second holder member 6B. More specifically, the claw 62n has a shape that protrudes in a direction away from the central axis of the first annular portion 65. The amount of protrusion of the claw 62n decreases towards the tip of the second leg portion 67. Therefore, when attaching the second holder member 6B to the first holder member 6A, the second leg portion 67 is easily inserted into the through hole 68h of the second holder member 6B.

[0081] [Second holder member] The second holder member 6B is a member equipped with a support portion 63. Figure 11 is a perspective view of the second holder member 6B from diagonally above. As shown in Figure 11, the second holder member 6B in this example comprises an annular second annular portion 68 and a rib 69 extending upward from the upper surface of the second annular portion 68. As shown in Figures 6 and 7, the upper surface of the second holder member 6B in this example is close to or in contact with the lower surface of the first annular portion 65 of the first holder member 6A. Unlike this example, there may be a gap between the upper surface of the second holder member 6B and the lower surface of the first annular portion 65 of the first holder member 6A.

[0082] A wiring 7 extending from the guide portion 60 of the first holder member 6A is inserted through a through hole 68h provided in the annular second annular portion 68. The inner diameter of the through hole 68h is smaller than the outer diameter of the outer peripheral surface 651 of the first holder member 6A. When the second holder member 6B is attached to the first holder member 6A, the first portion 71 of the wiring 7 is positioned between the upper surface of the second annular portion 68 and the lower surface 2D of the wafer holder 2. The upper surface of the second annular portion 68 functions as a support portion 63 that supports the first portion 71 from below.

[0083] The first part 71 may be pressed against the lower surface 2D by the upper surface of the second annular part 68. A cushioning material may be placed between the second annular part 68 and the first part 71. The cushioning material ensures that the first part 71 is firmly pressed against the lower surface 2D without excessive stress being applied to it. The cushioning material is made of a material that has excellent heat resistance and flexibility. Examples of the cushioning material include silicone, fluororesin, or polyimide foam. There may be a gap between the first part 71 and the lower surface 2D. The smaller the gap, the easier it is for the first part 71 to be heated by the lower surface 2D. The gap may be, for example, 1 mm or less, 0.5 mm or less, or 0.3 mm or less.

[0084] The rib 69 is an annular shape provided along the outer edge of the upper surface of the second holder member 6B. The rib 69 is positioned on the outer circumference of the annularly arranged first portion 71. The rib 69 restricts the movement of the first portion 71 along the plane of the lower surface 2D. The first portion 71, which is wrapped around the outer surface 651 of the first annular portion 65, is difficult to detach from the outer surface 651. Therefore, the first portion 71 is difficult to detach from the lower surface 2D of the wafer holder 2, and the state in which the first portion 71 faces the lower surface 2D is easily maintained. The distance between the outer surface 651 of the first annular portion 65 and the inner surface of the rib 69 is greater than the thickness of the first portion 71. For example, if the above distance is greater than 1.0 times and less than or equal to 1.5 times the thickness of the first portion 71, it is easier to restrict the movement of the first portion 71. The position of the first portion 71 is determined by the guide portion 60, so the rib 69 is not essential. The rib 69 also has the effect of blocking the cold air from the cooling plate 3 (see Figure 1) and suppressing the temperature drop of the first section 71.

[0085] ≪Procedure for constructing a fixed structure≫ When fixing the wiring 7 with the holder 6 in this example, as shown in Figure 4, the first holder member 6A is brought close to the wiring 7 from the side of the wiring 7 that is pulled out from the first hole 25, so that the wiring 7 is positioned inside the through hole 65h of the first annular portion 65. Next, as shown in Figure 6, the first leg portion 66 of the first holder member 6A is pushed into the first hole 25. The first leg portion 66 elastically deforms toward the central axis of the first annular portion 65. When the claw 61n of the first leg portion 66 reaches the recess 25c, the first leg portion 66 expands toward the central axis, and the claw 61n engages with the recess 25c. As a result, the first holder member 6A is fixed in the first hole 25 without easily falling out.

[0086] Once the first holder member 6A is fixed in the first hole 25, the wiring 7 inserted through the first annular portion 65 is guided to the outside of the first annular portion 65 through the notch 65c, as shown in Figure 4. Next, the wiring 7 is wrapped around the guide portion 60 formed by the outer circumferential surface 651 of the first annular portion 65.

[0087] Finally, the second holder member 6B is attached to the first holder member 6A. The wiring 7 is pre-inserted through the through hole 68h of the second holder member 6B. Unlike this example, if the second annular portion 68 of the second holder member 6B has a slit-shaped notch, the second holder member 6B can be brought closer to the wiring 7 from the side and attached to the first holder member 6A. In that case, the wiring 7 is positioned through the notch of the second holder member 6B and into the through hole 68h of the second holder member 6B. A second holder member 6B having a notch 68c (such as in Figure 13) is illustrated in Embodiment 4, which will be described later.

[0088] When the second holder member 6B is attached, the second leg portion 67 of the first holder member 6A is inserted into the through hole 68h. The second leg portion 67 elastically deforms toward the central axis of the first annular portion 65. Once the claw 62n of the second leg portion 67 passes through the through hole 68h, the second leg portion 67 expands toward the central axis. Then, the stepped portion of the claw 62n engages with the lower surface of the second holder member 6B. As a result, the second holder member 6B is fixed to the first holder member 6A without easily falling off.

[0089] As described above, the fixing structure 5 in this example allows the wiring 7 to be fixed to the lower surface 2D very easily. Furthermore, compared to a structure that fixes the wiring 7 with adhesive, the fixing structure 5 in this example requires significantly less time to fix the wiring 7. This is because the construction of the fixing structure 5 in this example does not involve any waiting time for the adhesive to harden. Note that the wiring fixed by the fixing structure 5 in this example may also be the wiring 8 in Figure 1.

[0090] <Embodiment 3> In Embodiment 3, a fixing structure 5 comprising a holder 9 made of a single component will be described with reference to Figure 12. In this example, components having the same function as those in Embodiment 2 are denoted by the same reference numerals as in Embodiment 2.

[0091] As shown in Figure 12, the holder 9 in this example is composed of a first annular portion 65 and a first leg portion 66. In this case, a part of the outer circumferential surface of the first leg portion 66 functions as a guide portion 60. Also, the upper surface of the first annular portion 65 functions as a support portion 63.

[0092] When the wiring 7 is secured by the holder 9 in this example, the wiring 7 pulled out from the first hole 25 is wrapped around the outer circumference of the first leg portion 66. The more first leg portions 66 there are, the more stable the wrapping shape of the wiring 7 becomes. For example, there are four or more first leg portions 66. The multiple first leg portions 66 only need to be arranged almost evenly around the central axis of the first annular portion 65.

[0093] Next, the first leg portion 66 is pushed into the first hole 25. When the claws 61n of the first leg portion 66 catch on the recesses 25c of the first hole 25, the holder 9 is fixed in the first hole 25. The upper surface of the first annular portion 65 functions as a support portion 63 that supports the first portion 71 of the wiring 7 from below.

[0094] According to the fixing structure 5 in this example, the wiring 7 can be fixed to the lower surface 2D with good workability. Note that the wiring fixed by the fixing structure 5 in this example may also be the wiring 8 in Figure 1.

[0095] <Embodiment 4> Embodiment 4 describes a holder 6 having a different configuration from Embodiments 2 and 3, based on Figures 13 to 17. The holder 6 of Embodiment 4 shown in Figures 13 and 15 comprises a first holder member 6A and a second holder member 6B that are combined with each other, similar to Embodiment 2. Parts that perform the same function as those in Embodiment 2 are denoted by the same reference numerals as in Embodiment 2. Embodiment 4 will be described primarily for its differences from Embodiment 2.

[0096] [First holder component] The first holder member 6A in this example comprises a first annular portion 65, a first leg portion 66 (Figure 15), and a second leg portion 67. The first annular portion 65 in this example further comprises a flange portion 65f, a bridge portion 65b, and a positioning projection 5p, as shown in Figures 14 to 16.

[0097] As shown in Figures 15 and 16, the flange portion 65f protrudes outward from the outer circumferential surface 651 of the first annular portion 65. Outward means the side away from the central axis of the first annular portion 65. The thickness of the flange portion 65f is thinner than the thickness of the first annular portion 65. As shown in Figure 15, the lower surface of the flange portion 65f is flush with the lower surface of the first annular portion 65. The upper surface of the flange portion 65f is positioned below the first portion 71 of the wiring 7. This upper surface of the flange portion 65f functions as a support portion 63 that supports the first portion 71 from below. In other words, the first holder member 6A in this example includes a support portion 63 in addition to the first coupling portion 61, the second coupling portion 62, and the guide portion 60.

[0098] As shown in Figure 16, the bridge portion 65b connects the portion of the first annular portion 65 that has been cut off. In this example, the bridge portion 65b is a curved member having an outer surface that smoothly connects to the outer surface 651 of the first annular portion 65. The radius of curvature of the outer surface of the bridge portion 65b is the same as the radius of curvature of the outer surface 651. The inner surface of the bridge portion 65b is coaxial with the through hole 65h of the first annular portion 65 and has a larger radius than the radius of the through hole 65h. Unlike this example, the bridge portion 65b may also be a straight member. The bridge portion 65b improves the mechanical strength of the first annular portion 65 and makes the first annular portion 65 less prone to deformation.

[0099] The thickness of the bridge portion 65b is thinner than the thickness of the first annular portion 65. The upper surface of the bridge portion 65b is flush with the upper surface of the first annular portion 65. Therefore, below the bridge portion 65b, a space is formed through which the wiring 7 can be pulled out from the inside to the outside of the annular shape of the first annular portion 65, as shown in Figures 13 and 14. This space functions as a notch 65c in which the wiring 7 is placed.

[0100] The positioning projection 5p protrudes from the lower surface of the flange portion 65f. In this example, the positioning projection 5p is generally prismatic in shape. The shape of the positioning projection 5p is not limited and may be cylindrical, for example. The positioning projection 5p fits into the positioning hole 5h of the second holder member 6B, which will be described later (see Figure 15). The positioning projection 5p may protrude from the lower surface of the first annular portion 65, or it may protrude from the surface including the boundary between the first annular portion 65 and the flange portion 65f.

[0101] [Second holder member] The second holder member 6B in this example comprises a second annular portion 68 and a rib 69. The second annular portion 68 in this example further comprises a slit-shaped notch 68c, a mounting hole 62h, a reinforcing portion 64, and a positioning hole 5h.

[0102] The mounting holes 62h are through holes through which the second legs 67 of the first holder member 6A pass. The number of mounting holes 62h corresponds to the number of second legs 67. In this example, the mounting holes 62h are arranged at equal intervals around the central axis of the second annular portion 68. The claws 62n of the second legs 67 that pass through the mounting holes 62h are coupled to the lower surface of the second annular portion 68, as shown in Figure 15.

[0103] The central axis of the mounting hole 62h is inclined with respect to the central axis of the second annular portion 68, such that it approaches the central axis of the second annular portion 68 as it extends downward. The inclination of the axis of the mounting hole 62h makes it easier to insert the second leg portion 67 into the mounting hole 62h when attaching the second holder member 6B from below the first holder member 6A.

[0104] In this example, the reinforcing portion 64 has a cylindrical shape that protrudes from the upper surface of the second annular portion 68. When the second annular portion 68 is viewed from above, the reinforcing portion 64 is roughly C-shaped. The opening formed on the circumferential surface of the cylindrical reinforcing portion 64 is connected to the notch 68c of the second annular portion 68. With this configuration, the second holder member 6B can be brought closer from the side of the wiring 7 and attached to the first holder member 6A. At that time, the wiring 7 is positioned in the through hole 68h of the second annular portion 68, passing through the notch 68c and the opening on the circumferential surface of the reinforcing portion 64.

[0105] The reinforcing portion 64 is positioned inside the first connecting portion 61 of the first holder member 6A, that is, inside the claw 61n. The inside of the first connecting portion 61 is the space on the side of the ring shape of the first annular portion 65 that is directed from the first connecting portion 61 toward the central axis of the annular portion 65. The reinforcing portion 64 positioned inside the first connecting portion 61 supports the first connecting portion 61 from the inside. In this example, the cylindrical reinforcing portion 64 supports almost the entire inside of the first leg portion 66 from the inside. Therefore, the reinforcing portion 64 makes it difficult for the first leg portion 66 to bend toward the central axis of the first annular portion 65. Because the first leg portion 66 is difficult to bend, the claw 61n that connects to the counterbore portion of the first hole 25 is difficult to disengage.

[0106] The reinforcing portion 64 does not need to be cylindrical. For example, the reinforcing portion 64 may be columnar in shape, individually reinforcing the first connecting portion 61. In this case, three reinforcing portions 64, corresponding one-to-one to each first connecting portion 61, are provided on the second holder member 6B.

[0107] The positioning hole 5h is a through hole into which the positioning projection 5p of the first holder member 6A is inserted. The fitting of the positioning hole 5h and the positioning projection 5p allows the positional relationship between the first holder member 6A and the second holder member 6B to be set to a desired position. For example, it is easy to align the position of the notch 65c of the first holder member 6A with the position of the notch 68c of the second holder member 6B.

[0108] <Embodiment 5> The reinforcing portion 64 shown in Embodiment 4 may be a separate component from the first holder member 6A and the second holder member 6B. For example, the reinforcing portion 64 is a cylindrical member press-fitted into the through hole 65h of the first holder member 6A. Alternatively, the reinforcing portion 64 may be, for example, a resin filling the through hole 65h. [Explanation of symbols]

[0109] 1. Wafer heating device 10 wafers 2 wafer holders 2D bottom side 2U top 2B Backplate 2H Heater 2T Top Plate 20 circuit patterns 21 Base material 23 Counterbore holes 24 sensors 25 First hole 26 Second hole 28 Adhesives 29 Lid 25c recess 25e Opening edge 3 Cooling plate 3B body 3C upper layer 35 First through hole 36 Second through hole 4 Cooling Stages 40 Fixed axis 5. Wiring fixing structure 5h positioning hole 5p Positioning protrusion 6.9 Holder 6A First holder member 6B Second holder member 60 Guide section 61 First joint 62 Second joint 63 Support part 64 Reinforcement section 65 First Ring Section 66 First leg 67 Second leg 68 Second Ring Section 69 Ribs 61n, 62n nails 62h mounting holes 65c, 68c Notch 65b Bridge section 65f flange section 65h,68h through hole 650 Inner surface 651 Outer surface 7 Wiring 71 Part 1 8 Wiring 81 Part 1

Claims

1. A wafer holder comprising an upper surface on which a wafer is placed, a lower surface located on the opposite side of the upper surface, and a heater located between the upper surface and the lower surface, The wafer holder is The first hole having an opening on the lower surface, A sensor provided on the wafer holder, The sensor is connected to the wiring, The wiring is routed out from the opening to the outside of the wafer holder and includes a first portion fixed to the lower surface so as to surround the opening edge of the first hole. The length of the first portion is at least twice the circular diameter of the opening edge of the first hole. Wafer heating device.

2. The wafer holder is The holder is provided for fixing the aforementioned wiring to the lower surface, The aforementioned holder is, The first connecting portion connected to the first hole, A guide portion is positioned to face the lower surface of the first portion, The wafer heating apparatus according to claim 1, further comprising a support portion that supports the first portion from below.

3. The inner circumferential surface of the first hole is provided with a recess. The wafer heating apparatus according to claim 2, wherein the first coupling portion has a claw shaped to engage with the recess.

4. The holder comprises a first holder member and a second holder member that are combined with each other. The first connecting portion and the guide portion are provided on the first holder member. The wafer heating apparatus according to claim 2 or 3, wherein the support portion is provided on the first holder member or the second holder member.

5. The first holder member comprises a first annular portion surrounding the opening edge of the first hole, and a first leg portion extending from the first annular portion into the interior of the first hole. The guide portion is formed by the outer circumferential surface of the first annular portion, The wafer heating apparatus according to claim 4, wherein the first coupling portion is provided on the first leg portion.

6. The first holder member is provided with a groove-shaped or slit-shaped first annular portion that connects the inner circumferential surface and the outer circumferential surface of the first annular portion, The wafer heating apparatus according to claim 5, wherein the wiring is drawn out from the first hole through the complete cutout toward the guide portion.

7. The first holder member further comprises a second leg portion extending on the opposite side from the first leg portion, The wafer heating apparatus according to claim 6, wherein the second leg portion is provided with a second connecting portion that connects to the second holder member.

8. The wafer heating apparatus according to claim 7, wherein the second coupling portion has claws shaped to connect with the second holder member.

9. The wafer heating apparatus according to claim 5, wherein the holder further comprises a reinforcing portion disposed inside the first joint portion.

10. The wafer heating apparatus according to claim 9, wherein the reinforcing portion is provided on the second holder member.

11. The wafer heating apparatus according to claim 10, wherein the reinforcing portion has a cylindrical shape.

12. The second holder member comprises a second annular portion and a rib provided along the outer peripheral edge of the second annular portion. The wafer heating apparatus according to claim 5, wherein the ribs are arranged on the outer circumference of the wiring wrapped around the outer surface of the first annular portion.

13. The wafer heating apparatus according to claim 12, wherein the second holder member is provided with a slit-shaped second notch that connects the inner and outer circumferential surfaces of the second annular portion.

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