Electrical connection device

Abstract

To provide a probe which can be brought into stable contact with a land, and an electrical connection device.SOLUTION: A probe disclosed herein comprises a columnar base material with a first end portion and a second end portion, having a polygonal cross-section in a direction perpendicular to an axial direction, and a contact film covering a tip end surface of the second end portion and side surfaces of the second end portion other than side surfaces facing a first direction, among multiple side surfaces connected to the tip end surface of the second end portion. An end surface of the contact film covering the tip end surface of the second end portion constitutes a plane perpendicular to the axial direction.SELECTED DRAWING: Figure 1

Description

[[Technical Field]]

[0001] The present invention relates to a connection device Electricity used for inspecting electrical characteristics of an inspection object. [[Background Art]]

[0002] In order to inspect the electrical characteristics of an inspection object such as a semiconductor integrated circuit in a wafer state, an electrical connection device including a probe is used. In an inspection using a probe, one end of the probe is brought into contact with an electrode of the inspection object, and the other end of the probe is brought into contact with a terminal (hereinafter referred to as a "land") disposed on a printed circuit board or the like. The land is electrically connected to an inspection device such as a tester. [[Prior Art Document]] [[Patent Document]]

[0003] [[Patent Document 1]] Japanese Unexamined Patent Application Publication No. 2015-118064 [[Summary of the Invention]] [[Problem to be Solved by the Invention]]

[0004] In order to accurately inspect the electrical characteristics of an inspection object, the contact between the probe and the land needs to be stable. An object of the present invention is to provide a probe-type Equipped with electrical connection device capable of stably contacting a land. [[Means for Solving the Problem]]

[0005] According to one aspect of the present invention, Electrical connection device , there is provided: The probe head has a configuration in which a first guide plate and a second guide plate, each having guide holes formed therein, are arranged at a distance from each other, and the probe is inserted into the guide holes and held by the probe head. a columnar base material having a first end and a second end, with a cross section perpendicular to the axial direction having a polygonal shape; and a contact film that covers the remaining side surface of the second end excluding the side surface facing the first direction among a plurality of side surfaces connected to the distal end surface of the second end, and the distal end surface of the second end. An end surface of the contact film covering the distal end surface of the second end is a plane perpendicular to the axial direction. For guide holes through which the same probe penetrates, the position of the guide hole in the first guide plate is offset relative to the guide hole in the second guide plate in an offset direction parallel to the main surface of the first guide plate, and the base material is held in a curved state between the first and second guide plates. The first direction is the offset direction. [Effects of the Invention]

[0006] According to the present invention, a probe capable of stable contact with the land is Equipped with We can provide electrical connection devices. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram showing the configuration of a probe according to an embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view along the II-II direction in Figure 1. [Figure 3] This is a schematic perspective view showing the configuration of the second end of a probe according to an embodiment of the present invention. [Figure 4] This is a schematic perspective view showing the configuration of the second end of a probe according to an embodiment of the present invention. [Figure 5] This is a schematic diagram showing the configuration of an electrical connection device according to an embodiment of the present invention. [Figure 6] This is a schematic diagram showing the contact state between the probe and the land in the first comparative example. [Figure 7] This is a schematic diagram showing the state in which the probe and land are in contact according to an embodiment of the present invention. [Figure 8] This is a schematic diagram showing a configuration where non-tapered probes are placed adjacent to each other. [Figure 9] This is a schematic diagram showing tapered probes arranged adjacent to each other. [Figure 10] This is a schematic perspective view showing the configuration of the second end of the probe of the second comparative example. [Modes for carrying out the invention]

[0008] Next, embodiments of the present invention will be described with reference to the drawings. In the following drawings, identical or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the ratios of the thicknesses of each part may differ from those of reality. Furthermore, it goes without saying that there are parts in the drawings where the dimensional relationships and ratios differ from those of other parts. The embodiments shown below are illustrative examples of devices and methods for realizing the technical idea of ​​this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, and manufacturing methods of the components as described below.

[0009] The probe 1 according to the embodiment shown in Figure 1 is used for inspecting the electrical characteristics of an object to be inspected. The probe 1 comprises a base material 10 having a first end 11, which is one end that contacts the object to be inspected (not shown) during inspection, and a second end 12, which is the other end, and a contact film 13 that covers a part of the second end 12 of the base material 10. The base material 10 has a columnar shape that extends along the axial direction D3. During inspection of the object to be inspected, the second end 12 contacts the land.

[0010] The base material 10 has a polygonal cross-section perpendicular to the axial direction D3 (hereinafter simply referred to as "cross-section"). Below, the case in which the cross-section of the base material 10 is rectangular will be explained as an example, as shown in Figure 2. The second end portion 12 has four sides connected to the tip surface 121. That is, the second end portion 12 has a first side S1 facing the first direction D1, a second side S2 facing the opposite direction of the first direction D1, a third side S3 facing the second direction D2 perpendicular to the first direction D1, and a fourth side S4 facing the opposite direction of the second direction D2. Hereinafter, unless specified, each of the first side S1 to the fourth side S4 will be referred to as side S.

[0011] The contact film 13 covers the remaining side surfaces of the second end portion 12 excluding the side surface facing the first direction D1 among the plurality of side surfaces connected to the distal end surface 121 of the second end portion 12, and covers the distal end surface 121 of the second end portion 12. As shown in FIG. 2, FIG. 3 and FIG. 4, the contact film 13 covers the remaining side surfaces S of the region of the second end portion 12 connected to the distal end surface 121 (hereinafter referred to as "distal end region 122"), excluding the first side surface S1 facing the first direction D1. That is, in the probe 1 having a rectangular cross-section, the contact film 13 covers the second side surface S2, the third side surface S3 and the fourth side surface S4 of the distal end region 122. Further, as shown in FIG. 1, the contact film 13 covers the distal end surface 121 of the second end portion 12. The end surface 131 of the contact film 13 that covers the distal end surface 121 of the second end portion 12 is a plane perpendicular to the axial direction D3.

[0012] As shown in FIG. 3 and FIG. 4, it is preferable that the corners of the end surface 131 of the contact film 13 are chamfered. In the contact film 13 shown in FIG. 3 and FIG. 4, the connection portion between the outer side surface and the end surface 131 as viewed from the first direction D1 is rounded.

[0013] The distal end surface 121 of the second end portion 12 is a plane perpendicular to the axial direction D3. Further, the distal end region 122 covered by the contact film 13 has a rectangular shape in a side view as viewed from the first direction D1 and the second direction D2. Therefore, the end surface 131 of the contact film 13 covering the distal end surface 121 of the second end portion 12 is a plane, and the portion of the contact film 13 covering the side surface S of the second end portion 12 is perpendicular to the end surface 131.

[0014] As will be described later for the reason, it is preferable that the region of the second end portion 12 exposed to the outside of the contact film 13 and connected to the distal end region 122 (hereinafter referred to as "connection region") has a tapered shape in which the cross-section of the base material 10 gradually narrows toward the direction of the distal end surface 121. In FIG. 3 and FIG. 4, the extended portions of the third side surface S3 and the fourth side surface S4 of the connection region 123, which is the outer side surface S as viewed from the first direction D1, intersect the distal end surface 121 at an obtuse angle. Hereinafter, the side surface S of the connection region 123 where the extended portion intersects the distal end surface 121 at an obtuse angle is also referred to as a "tapered side surface".

[0015] In order to electrically connect the electrode of the inspection object and the land, a conductive material such as a metal material is used for the base material 10 and the contact film 13. For example, the contact film 13 may be formed on the surface of the base material 10 by plating.

[0016] It is preferable to select materials for the base material 10 and the contact film 13 such that the conductivity of the base material 10 and the contact film 13 are equal, or the conductivity of the contact film 13 is higher than that of the base material 10. By selecting the materials of the base material 10 and the contact film 13 in this manner, the electrical resistance between the probe 1 and the land can be reduced. For example, nickel (Ni), nickel alloys, gold (Au), silver (Ag), copper (Cu), palladium (Pd), palladium alloys, rhodium (Rh), rhodium alloys, and other noble metals are suitably used for the base material 10. Gold (Au), silver (Ag), copper (Cu), and other noble metals are suitably used for the contact film 13.

[0017] The probe 1 is used, for example, in the electrical connection device 100 shown in FIG. 5. In the electrical connection device 100, the probe 1 is held by a probe head 20. Specifically, a plurality of probes 1 are held by the probe head 20 by being inserted into the guide holes of the first guide plate 21, the second guide plate 22, and the third guide plate 23 included in the probe head 20. Hereinafter, when each of the first guide plate 21, the second guide plate 22, and the third guide plate 23 is not limited, they are referred to as guide plates. The probe head 20 has a configuration in which the first guide plate 21, the second guide plate 22, and the third guide plate 23 are arranged spaced apart from each other in the normal direction (Z direction) of the main surface of the guide plates.

[0018] The first end 11 of the probe 1 contacts an electrode pad (not shown) of the inspection object 2 when the inspection object 2 is inspected. The contact film 13 covering the tip region 122 of the second end 12 of the probe 1 contacts the land 31 of the substrate 30. The land 31 is electrically connected to an inspection device such as an IC tester (not shown).

[0019] As shown in Figure 5, for the guide holes through which the same probe 1 passes, the position of the guide holes in the first guide plate 21 is offset in the -X direction parallel to the main surface of the second guide plate 22 relative to the guide holes in the second guide plate 22. Figure 5 is a side view taken from the Y direction, which is perpendicular to both the X and Z directions. Hereinafter, the offset arrangement of the guide holes will be referred to as the "offset arrangement." The direction in which the guide holes are offset will also be referred to as the "offset direction." In Figure 5, the offset direction is the -X direction. Due to the offset arrangement, the base material 10 of the probe 1 is curved inside the probe head 20. That is, in the hollow region 200 between the first guide plate 21 and the second guide plate 22, the base material 10 is curved due to elastic deformation. The position of the guide holes in the second guide plate 22 and the third guide plate 23 coincide when viewed from the Z direction.

[0020] Because the guide holes of the first guide plate 21 and the second guide plate 22 are offset from each other, when the first end 11 of the probe 1 comes into contact with the object to be inspected 2, the probe 1 buckles in the hollow region 200. That is, in the contact state where the probe 1 is in contact with the object to be inspected 2, the probe 1 bends further due to deflection deformation from the curved shape it had in the non-contact state where it was not in contact with the object to be inspected 2. As the probe 1 bends further, it comes into contact with the object to be inspected 2 at a predetermined pressure. Therefore, the offset arrangement allows for stable measurement of the electrical characteristics of the object to be inspected 2 using the probe 1. When the probe 1 is in a non-contact state, it has elasticity that allows it to return to the shape it was in before contacting the object to be inspected 2.

[0021] The probe 1 is mounted on the probe head 20 such that the first direction D1 is oriented in the same direction as the offset direction. In other words, the first side surface S1 of the second end 12 that is not covered by the contact film 13 is oriented in the same direction as the offset direction. Therefore, as will be explained below, it is possible to suppress the probe 1 from contacting a land other than the predetermined land to be contacted (hereinafter referred to as the "target land").

[0022] The following describes the probe of the first comparative example, in which all sides S of the second end 12 are covered with the contact film 13. As shown in Figure 6, due to the offset arrangement, the second end 12 tends to tilt obliquely with respect to the Z direction. In this case, with the probe of the first comparative example, in which all sides S of the second end 12 are covered with the contact film 13, when the land spacing of the substrate 30 is narrow, the contact film 13 covering the second end 12 approaches the target land 31A and the land adjacent in the offset direction (hereinafter also referred to as "adjacent land"). Therefore, there is a risk that the contact film 13 and the adjacent land 31B will come into contact. In particular, contact between the contact film 13 and the adjacent land 31B is likely to occur when the position of the second end 12 is shifted parallel to the X direction.

[0023] In contrast, in the probe 1, where the first side surface S1 is not covered by the contact film 13, a wider gap can be secured between the contact film 13 and the adjacent land 31B, as shown in Figure 7. Therefore, with probe 1, contact between probe 1 and the adjacent land 31B can be suppressed.

[0024] Thus, the probe 1 is prone to tilting in the offset direction relative to the Z direction due to the influence of the offset arrangement. In addition, since there is a gap (clearance) between the probe 1 and the guide hole in both the X and Y directions, the probe 1 may also tilt in a direction perpendicular to the offset direction, i.e., in the Y direction. As shown in Figure 8, when the probe 1 tilts in the Y direction, it approaches adjacent probes 1. For this reason, it is preferable to make the connection region 123 of the second end 12 tapered by making the third side surface S3 and the fourth side surface S4 facing the Y direction tapered. By making the connection region 123 of the second end 12 tapered, contact between adjacent probes 1 can be suppressed, as shown in Figure 9. Furthermore, by making the connection region 123 tapered, the contact area of ​​the end surface 131 can be made smaller than the cross-sectional area of ​​the base material 10, so the pressing force of the probe 1 pressing against the land 31 can be increased and the contact stability between the probe 1 and the land 31 can be improved.

[0025] The above example illustrates the case where the third side surface S3 and the fourth side surface S4 are tapered sides. However, it is arbitrary which side surface S of the connection region 123 is tapered. For example, all side surfaces S of the connection region 123 may be tapered. This suppresses contact between probes 1 regardless of which direction the probe 1 is tilted. Alternatively, only one side surface S facing the direction in which the probe 1 is most likely to tilt may be tapered. This shortens the manufacturing process of the probe 1. Regardless of which side surface S is tapered, by reducing the area of ​​the tip surface 121 of the second end 12, contact between adjacent probes 1 can be suppressed even if the probe 1 is misaligned.

[0026] As explained above, in probe 1, the tip region 122 of the second end 12 is covered by the contact film 13, and the end face 131 of the contact film 13 is flat. Therefore, probe 1 can stabilize the contact between the second end 12 and the land compared to the probe of the second comparative example shown in Figure 10, in which a contact member 15 that contacts the land is embedded in the second end 12. That is, in the probe of the second comparative example, the contact with the land is point contact. On the other hand, in probe 1, in which the tip region 122 of the second end 12 is covered by the contact film 13, the contact with the land is surface contact. Therefore, the contact between probe 1 and the land is stable. As a result, good current flow between the object to be inspected and the land can be achieved.

[0027] Furthermore, in the probe of the second comparative example shown in Figure 10, repeated contact with the land causes the contact member 15 to deform, shortening the overall length of the probe. As a result, a gap is created between the probe and the land, making poor contact between the probe and the land more likely. In contrast, in the electrical connection device 100, which includes a probe 1 in which the tip region 122 of the second end 12 is covered with a contact film 13, deformation of the tip region 122 can be suppressed. Therefore, poor contact between the probe 1 and the land can be prevented. In addition, in the probe 1, covering the second end 12 of the base material 10 with the contact film 13 makes it relatively easy to adjust the composition and thickness of the film, thus increasing the design freedom of the probe 1. Moreover, in the probe 1, all side surfaces S connected to the end face 131 are perpendicular to the end face 131. Therefore, for example, a plated contact film 13 is less likely to peel off from the base material 10 than a tapered shape where the cross-section of the base material widens as the side surfaces S move away from the end face 131, thus improving the durability of the probe 1. In particular, the probe 1 requires durability of the contact film 13 because the contact film 13 repeatedly comes into contact with the land. However, since all sides S are perpendicular to the end face 131, the contact film 13 is less likely to peel off, thus increasing the durability of the probe 1.

[0028] As described above, in the probe 1 according to the embodiment of the present invention, the tip region 122 of the second end portion 12 is covered with a contact film 13 whose end face 131 is flat. Therefore, the probe 1 can stably contact the second end portion 12 with the land. Furthermore, in the electrical connection device 100 including the probe 1, the contact film 13 is not placed on the first side surface S1 of the tip region 122 parallel to the offset direction of the probe 1. Therefore, the electrical connection device 100 can suppress contact between the probe 1 and adjacent lands. Moreover, in the electrical connection device 100 including the probe 1 whose connection region 123 is tapered, contact between adjacent probes 1 can be suppressed.

[0029] (Other embodiments) Although the present invention has been described above by embodiments, the descriptions and drawings that constitute part of this disclosure should not be understood as limiting the invention. Various alternative embodiments, examples, and operational techniques will become apparent to those skilled in the art from this disclosure.

[0030] For example, the above description explained the case where the cross-sectional shape of probe 1 is rectangular, but the cross-sectional shape of probe 1 may be other shapes. For example, the cross-sectional shape of probe 1 may be a polygon other than a rectangle. Regardless of the polygonal shape of the cross-sectional shape of probe 1, the offset direction of probe 1 and Same direction If the side surface is not covered with the contact film 13, contact between the probe 1 and the adjacent land can be suppressed.

[0031] In addition, although the above describes a case where the connection region 123 is connected to the tip region 122 of the probe 1 which is covered with the contact film 13, the contact film 13 does not need to cover the entire tip region 122. For example, a surface on the tip region 122 where the contact film 13 is not formed may be provided on the opposite side of the surface connected to the end face 131 where the contact film 13 is formed, and the tapered connection region 123 may be connected to the surface where the contact film 13 is not formed.

[0032] Thus, the present invention naturally includes various embodiments not described above. [Explanation of Symbols]

[0033] 1…Probe 10...Base material 11...First end 12…Second end 13...Contact membrane 20…Probe head 21…First guide plate 22...Second guide plate 23…Third guide board 30... Circuit board 31... Land 100... Electrical connection device 121...Tip surface 122...Tip area 123…Connecting Domains 131…end face S1…First side S2…Second Side S3…Third side S4…4th side

Claims

1. An electrical connection device used for testing the electrical characteristics of an object under inspection, A probe head having a configuration in which a first guide plate and a second guide plate, each having guide holes formed therein, are arranged at a distance from each other, The probe is inserted into the guide hole and held by the probe head. Equipped with, The aforementioned probe A columnar base material having a first end and a second end that come into contact with the object to be inspected in the inspection, and having a polygonal cross-section perpendicular to the axial direction, The remaining side surfaces of the second end, excluding the side surfaces facing the first direction from among the multiple side surfaces connected to the tip surface of the second end, and a contact film covering the tip surface of the second end. Equipped with, The end face covering the tip surface of the second end of the contact film is a plane perpendicular to the axial direction. With respect to the guide hole through which the same probe passes, the position of the guide hole of the first guide plate is offset relative to the guide hole of the second guide plate in an offset direction parallel to the main surface of the first guide plate, and the base material is held in a curved state between the first guide plate and the second guide plate. An electrical connection device in which the first direction is the offset direction.

2. The electrical connection device according to claim 1, wherein, when viewed from the first direction, the corners of the end face of the contact film are chamfered.

3. The electrical connection device according to claim 1, wherein the region of the second end that is exposed to the outside of the contact film and connected to the region covered by the contact film has a tapered shape in which the cross-section of the base material gradually narrows toward the direction of the tip surface.

4. The electrical connection device according to claim 1, wherein the cross-section of the base material perpendicular to the axial direction is rectangular.

5. The electrical connection device according to claim 1, wherein the conductivity of the contact film is higher than that of the base material.

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