Dicing substrate film

Abstract

To provide a base film for dicing, in which generation of cutting chips and generation of deformation (bank) of a side of a cut groove are well suppressed when dicing is performed.SOLUTION: A base film for dicing has a structure laminated in the order of A layer / B layer.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a dicing substrate film used for attaching to and fixing semiconductor wafers or semiconductor packages when dicing them into chip shapes. [Background technology]

[0002] One method for manufacturing semiconductor chips involves first manufacturing a large-area semiconductor wafer, then dicing (cutting and separating) the semiconductor wafer into chips, and finally picking up the diced chips.

[0003] Semiconductor packages (chip-type packages) are manufactured by sequentially applying packaging processes to a semiconductor wafer, including polyimide coating, wiring formation, post formation, resin encapsulation, resin polishing, and terminal formation, and finally cutting them into individual chips. Generally, semiconductor packages are manufactured by bonding semiconductor chips to a glass epoxy substrate or lead frame, molding them all at once with package molding resin, and then attaching and fixing the cured package to a semiconductor processing tape and dicing it with a dicing blade (Patent Documents 1 and 2). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2012-119468 [Patent Document 2] Patent No. 5053455 [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention aims to provide a dicing substrate film that effectively suppresses the generation of cutting chips and the deformation (banking) of the sides of the cutting grooves during dicing. [Means for solving the problem]

[0006] The present inventors conducted intensive studies to solve the above problem.

[0007] The present inventors have found that a specific base film for dicing can solve the above problem, and have completed the present invention.

[0008] The present invention provides the following base film for dicing.

[0009] Item 1. A base film for dicing, wherein said base film for dicing is laminated at least in the order of layer A / layer B, said layer A is on the side to be diced, and is formed of a resin composition containing methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and a polyolefin-based resin, and said layer B is formed of a resin composition containing a polyolefin-based resin and / or a vinyl aromatic hydrocarbon-based resin. A base film for dicing.

[0010] Item 2. The base film for dicing according to Item 1, wherein said layer A further contains a vinyl aromatic-based resin.

[0011] Item 3. The base film for dicing according to Item 1 or 2, wherein the layer located on the surface contains an antistatic agent.

[0012] Item 4. The base film for dicing according to any one of Items 1 to 3, which is used in a step of dicing a semiconductor package. [Effects of the Invention]

[0013] The base film for dicing of the present invention is a base film for dicing in which generation of cutting debris is effectively suppressed during dicing, and generation of side deformation (bank) of cutting grooves is effectively suppressed. DESCRIPTION OF EMBODIMENTS

[0014] The present invention relates to a base film for dicing.

[0015] The present invention further relates to a base film for dicing used in a step of dicing a semiconductor package.

[0016] (1) Dicing base film The base film for dicing of the present invention is laminated at least in the order of layer A / layer B.

[0017] In the base film for dicing of the present invention, the layer A is the side to be diced.

[0018] In the base film for dicing of the present invention, the layer A is formed of a resin composition containing methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and a polyolefin-based resin.

[0019] In the base film for dicing of the present invention, the layer A may further contain a vinyl aromatic hydrocarbon-based resin.

[0020] In the base film for dicing of the present invention, the layer B is formed of a resin composition containing a polyolefin-based resin and / or a vinyl aromatic hydrocarbon-based resin.

[0021] In the base film for dicing of the present invention, the layer located on the surface preferably contains an antistatic agent.

[0022] The base film for dicing of the present invention is preferably used in the step of dicing a semiconductor package.

[0023] Hereinafter, each layer constituting the base film for dicing of the present invention will be described in detail.

[0024] (1-1) A layer In the dicing substrate film of the present invention, layer A is made of a resin composition containing methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and polyolefin (PO) resin.

[0025] In the dicing substrate film of the present invention, layer A is the side that is diced, and when it is made into a dicing film, it is the layer that comes into contact with the adhesive layer.

[0026] In the dicing substrate film of the present invention, the A layer is made of a resin composition containing MABS resin and PO-based resin, which effectively suppresses the generation of cutting chips during dicing and prevents deformation (banking) of the sides of the diced grooves, or effectively suppresses deformation.

[0027] Methyl methacrylate acrylonitrile butadiene styrene (MABS) resin MABS (Methyl Methacrylate-Acrylonitrile-Butadiene-Styrene) resin, also known as transparent ABS resin, is a resin in which methyl methacrylate is added to regular ABS (Acrylonitrile-Butadiene-Styrene).

[0028] The transparent ABS resin described above is modified with methyl methacrylate, and transparency is achieved by a specific rubber particle size and its ratio. Examples of such transparent ABS resins include those obtained by copolymerizing methyl methacrylate monomer with acrylonitrile or styrene, and those obtained by uniformly melt-mixing a high-rubber-content ABS copolymer with an MAS copolymer (methyl methacrylate-acrylonitrile-styrene copolymer).

[0029] In the dicing substrate film of the present invention, the A layer (the resin composition constituting the layer) contains MABS resin, which effectively suppresses the generation of cutting chips during dicing and prevents deformation (banking) of the sides of the diced grooves, or effectively suppresses deformation.

[0030] In the dicing substrate film of the present invention, the MABS resin preferably consists of approximately 48% to 70% by weight of methyl methacrylate (M) units, approximately 1% to 5% by weight of acrylonitrile (A) units, approximately 2% to 20% by weight of butadiene (B) units, and approximately 25% to 50% by weight of styrene (S) units.

[0031] The density of MABS is 1,000 kg / m³. 3 ~1,200 kg / m 3 A suitable degree is 1,050 kg / m². 3 ~1,150 kg / m 3 A higher degree is preferable. The density of MABS was determined in accordance with ISO 1183-1:2004.

[0032] The melt flow rate (MFR) of MABS, measured at a temperature of 200°C and a load of 49N in accordance with ISO 1133, is preferably around 1.0 g / 10 min to 10.0 g / 10 min, and more preferably around 1.5 g / 10 min to 5.5 g / 10 min. By setting the MABS MFR within the above range, stable film formation becomes possible.

[0033] Polyolefin (PO) resin In the dicing substrate film of the present invention, the inclusion of a PO-based resin in layer A (the resin composition constituting the layer) effectively suppresses the generation of cutting chips during dicing, preventing deformation (banking) of the sides of the diced grooves, or effectively suppressing deformation. In the dicing substrate film of the present invention, the inclusion of a PO-based resin in layer A prevents chipping or breakage of chips during the dicing process without the film becoming too hard.

[0034] In the dicing substrate film of the present invention, the A layer contains a PO-based resin, which prevents chipping or breakage of semiconductor wafers and semiconductor packages (chips) during the dicing process, ensures that the dicing process is performed with high precision, and prevents cracking of semiconductor wafers and semiconductor package wafers.

[0035] Preferably, examples of PO resins include polyethylene (PE) resins such as branched low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene; polypropylene (PP) resins such as polypropylene (PP); and propylene-α-olefin copolymers. One type may be used, or two or more types may be used in appropriate combinations. Alternatively, mixtures thereof can be exemplified.

[0036] Preferably, the α-olefin has 2 or more carbon atoms (excluding 3 carbon atoms), and more preferably, examples include ethylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, etc. One of these α-olefins can be used from the above components, or two or more can be used in appropriate combinations.

[0037] The PE resin is preferably an ethylene homopolymer, a copolymer of ethylene and an olefin monomer having 3 to 8 carbon atoms, or a copolymer of ethylene and an alkyl (meth)acrylate monomer.

[0038] The PE resin can be any polymer mainly composed of polyethylene units. For example, ethylene homopolymers, copolymers of ethylene and olefin monomers having 3 to 8 carbon atoms, or copolymers of ethylene and alkyl (meth)acrylate monomers can be suitably used.

[0039] When using a copolymer as the PE resin, it is preferable that it contains 80% by weight or more polyethylene units, and more preferably 90% by weight or more.

[0040] Among PE resins, branched low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), ethylene-vinyl acetate copolymer (EVA), ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methyl methacrylate copolymer (EMMA), and ethylene-methacrylic acid copolymer (EMAA) are preferred. Of these, LDPE and LLDPE are particularly preferred. PE resins can use one of these components, or two or more components.

[0041] The density of LDPE is 915 kg / m³. 3 ~937 kg / m 3 A suitable degree is 917 kg / m 3 ~935 kg / m 3 A higher degree is preferable. The density of LDPE was determined in accordance with ISO 1183-1:2004.

[0042] The melting point of LDPE is preferably around 100°C to 130°C.

[0043] The melt flow rate (MFR) of LDPE, measured at a temperature of 190°C and a load of 21.18N in accordance with ISO 1133, is preferably around 0.3g / 10min to 20g / 10min, and more preferably around 0.5g / 10min to 10g / 10min. By setting the MFR of LDPE within the above range, stable film formation becomes possible.

[0044] Examples of PP-based resins include propylene homopolymers (homoPP) or copolymers of propylene with other α-olefins (random copolymer PP, block copolymer PP).

[0045] Examples of the α-olefin other than propylene include α-olefins having 2 to 20 carbon atoms other than propylene. Specific examples thereof include ethylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 3-methyl-1-butene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, cyclopentene, cycloheptene, norbornene, 5-ethyl-2-norbornene, tetracyclododecene, and 2-ethyl-1,4,5,8-dimethano-1,2,3,4,4a,5,8,8a-octahydronaphthalene. Among these, α-olefins having 2 to 4 carbon atoms such as ethylene and butene are preferable, and ethylene is more preferable. These α-olefins other than propylene may be used alone or in combination of two or more kinds thereof.

[0046] Specific examples of the copolymer of propylene and another α-olefin include a propylene-ethylene copolymer, a propylene-butene copolymer, and a propylene-ethylene-butene copolymer. Among these, a propylene-ethylene copolymer and a propylene-ethylene-butene copolymer are preferable, and a propylene-ethylene copolymer is more preferable.

[0047] Preferred examples of the copolymer of propylene and another α-olefin include a random copolymer PP of propylene and ethylene, and a block copolymer PP containing homopolypropylene (homo PP) and polyethylene (PE).

[0048] The density of PP is 850 Kg / m 3 to 950 Kg / cm 3 , and a range of about 860 Kg / m 3 to 920 Kg / m 3 is more preferable. The density of PP is determined in accordance with ISO 1183-1:2004.

[0049] The melting point of PP is preferably about 120°C to 160°C.

[0050] The melt flow rate (MFR) of PP, measured at a temperature of 230°C and a load of 21.18N in accordance with ISO 1133, is preferably around 1.0 g / 10 min to 15.0 g / 10 min, and more preferably around 4.0 g / 10 min to 13.0 g / 10 min. By setting the MFR of PP within the above range, stable film formation becomes possible.

[0051] Vinyl aromatic hydrocarbon resin In the dicing substrate film of the present invention, layer A (the resin composition constituting the layer) may contain a vinyl aromatic hydrocarbon resin. In the dicing substrate film of the present invention, the vinyl aromatic hydrocarbon resin functions as a compatibilizer between the MABS resin and the PO resin contained in layer A.

[0052] In the dicing substrate film of the present invention, the A layer is preferably made of a vinyl aromatic hydrocarbon resin, and as the vinyl aromatic hydrocarbon resin, it is preferable to use a hydrogenated copolymer of vinyl aromatic hydrocarbons and conjugated diene hydrocarbons, a copolymer of vinyl aromatic hydrocarbons and conjugated diene hydrocarbons, a copolymer of vinyl aromatic hydrocarbons and aliphatic unsaturated carboxylic acid esters, and it is particularly preferable to use a hydrogenated copolymer of vinyl aromatic hydrocarbons and conjugated diene hydrocarbons.

[0053] Hydrogenated copolymers of vinyl aromatic hydrocarbons and conjugated diene hydrocarbons include hydrogenated random copolymers of styrene monomers and diene monomers, and hydrogenated block copolymers of styrene monomers and diene monomers. These are also called hydrogenated random copolymers and hydrogenated block copolymers. For the dicing substrate film of the present invention, random copolymers are preferred in terms of flexibility, transparency, etc.

[0054] Hydrogenated random copolymers, specifically, are composed of styrene monomer units represented by the formula -CH(C6H5)CH2-, ethylene units represented by the formula -CH2CH2CH2CH2-, and butylene units represented by the formula -CH(C2H5)CH2-, all randomly bonded together.

[0055] Hydrogenated block copolymers include those having block segments derived from vinyl aromatic hydrocarbons at one or both ends of the copolymer, and further having block segments derived from conjugated diene hydrocarbons, or hydrogenated products of blends thereof. Specific examples of block copolymers or hydrogenated block copolymers include having a block segment at one end of the copolymer derived from a styrene monomer represented by the formula -CH(C6H5)CH2-, and a block segment in the middle containing an ethylene unit represented by the formula -CH2CH2CH2CH2- and / or a butylene unit represented by the formula -CH(C2H5)CH2-. Specific examples of block copolymers or hydrogenated block copolymers include having a segment at the other end of the copolymer containing an ethylene unit represented by the formula -CH2CH2CH2CH2-.

[0056] In the dicing substrate film of the present invention, for the A layer, it is particularly preferable to use a vinyl aromatic hydrocarbon resin, specifically a hydrogenated block copolymer of styrene-ethylenebutylene-olefin crystals (SEBC) or styrene-ethylenebutylene-styrene block copolymer (SEBS).

[0057] The density of vinyl aromatic hydrocarbon resins (such as SEBS) is 850 kg / m³. 3 ~1,100 kg / m 3 A suitable degree is 900 kg / m 3 ~1,050 kg / m 3 A more favorable degree is preferred. The density of the vinyl aromatic hydrocarbon resin was determined in accordance with ISO 1183-1:2004.

[0058] For vinyl aromatic hydrocarbon resins (such as SEBS), the melt flow rate (MFR), measured at a temperature of 230°C and a load of 21.18 N in accordance with ISO 1133, is preferably around 1.0 g / 10 min to 20.0 g / 10 min, and more preferably around 3.0 g / 10 min to 15.0 g / 10 min. By setting the MFR of the vinyl aromatic hydrocarbon resin within the above range, stable film formation becomes possible.

[0059] Antistatic agent In the dicing substrate film of the present invention, it is preferable that the layer located on the surface, such as layer A (the resin composition constituting the layer), contains an antistatic agent.

[0060] In the dicing substrate film of the present invention, the layer located on the surface contains an antistatic agent, so when a semiconductor chip is peeled off, peeling charge does not occur, and the chip's circuitry is not damaged.

[0061] In the dicing substrate film of the present invention, it is preferable to use at least one component selected from the group consisting of polyether ester amide resin (PEEA resin) and hydrophilic polyolefin resin (hydrophilic PO resin) as an antistatic agent.

[0062] The amount of antistatic agent in the layer (in the resin composition constituting the layer) is preferably about 10 to 30 parts by weight, and more preferably about 15 to 25 parts by weight, per 100 parts by weight of MABS resin and PO resin, or per 100 parts by weight of MABS resin, PO resin and vinyl aromatic hydrocarbon resin. By incorporating the antistatic agent within the above range, static electricity generated can be quickly and effectively discharged without impairing the properties of the film of the present invention.

[0063] Polyester etheramide resin (PEEA resin) Polyether ester amide resin (PEEA resin) is a polymer composed of polyether ester, which is the main unit component for imparting hydrophilicity, and polyamide units. PEEA resin can be commercially available or easily manufactured by known methods. Examples of PEEA resin include Pelestat NC6321 from Sanyo Chemical Industries, Ltd.

[0064] PEEA resin can be produced, for example, by reacting a dicarboxylic acid component with a polydiol component having an ether group in the main chain to convert it into a terminal ester, and then reacting this with an aminocarboxylic acid or lactam. In the dicing substrate film of the present invention, PEEA resin can be preferably used because it has good compatibility with acrylic resins and does not exhibit any bleeding-out phenomena.

[0065] Hydrophilic polyolefin resin (polyether / polyolefin block copolymer) In the dicing substrate film of the present invention, at least one component of the hydrophilic PO resin (polyether / polyolefin block copolymer) can preferably be hydrophilic polyethylene (hydrophilic PE), hydrophilic polypropylene (hydrophilic PP), etc.

[0066] Hydrophilic PE and hydrophilic PP resins are basically composed of polyethylene chains or polypropylene chains and polyoxyalkylene chains that are block-bonded. Hydrophilic PE and hydrophilic PP exhibit high static electricity removal properties, thus eliminating the accumulation of static electricity. The block bonding is carried out by ester groups, amide groups, ether groups, urethane groups, etc. In the dicing substrate film of the present invention, from the viewpoint of compatibility with the film resin, the block bonding is preferably ester groups or ether groups.

[0067] Examples of polyether / polyolefin block copolymers include Pelestat and Peletron from Sanyo Chemical Industries, Ltd.

[0068] Resin composition of layer A In the dicing substrate film of the present invention, the resin composition of layer A contains MABS resin, preferably containing about 5% to 70% by weight of MABS resin, more preferably about 10% to 50% by weight, and even more preferably about 15% to 30% by weight.

[0069] In the dicing substrate film of the present invention, the resin composition of layer A contains a PO-based resin, preferably containing about 95% to 30% by weight of the PO-based resin, more preferably about 90% to 50% by weight, and even more preferably about 85% to 70% by weight.

[0070] In the dicing substrate film of the present invention, by using a blending composition within the range described above for the MABS resin and PO-based resin contained in layer A, the generation of cutting chips is effectively suppressed during dicing, and the sides of the diced grooves do not deform (bank) or deformation is effectively suppressed.

[0071] In the dicing substrate film of the present invention, if the resin composition of layer A further contains a vinyl aromatic hydrocarbon resin (such as SEBS resin), it is preferable to contain approximately 5% to 70% by weight of MABS resin, 10% to 90% by weight of PO resin, and 5% to 20% by weight of vinyl aromatic hydrocarbon resin; more preferably, it contains approximately 10% to 50% by weight of MABS resin, 35% to 83% by weight of PO resin, and 7% to 15% by weight of vinyl aromatic hydrocarbon resin; and even more preferably, it contains approximately 15% to 30% by weight of MABS resin, 58% to 76% by weight of PO resin, and 9% to 12% by weight of vinyl aromatic hydrocarbon resin.

[0072] (1-2)B layer In the dicing substrate film of the present invention, layer B is made of a resin composition containing a polyolefin (PO) resin, an ionomer resin, or a vinyl aromatic hydrocarbon resin.

[0073] The above-mentioned ionomer resin is a copolymer comprising an olefin and an unsaturated carboxylic acid as constituent units. Examples of olefins include ethylene and propylene, and alkyl methacrylates such as (meth)acrylic acid, propyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, and octyl (meth)acrylate can be preferably used as the unsaturated carboxylic acid.

[0074] Ionomer resins include binary copolymers comprising ethylene and (meth)acrylic acid as constituent units, and ternary copolymers comprising ethylene, (meth)acrylic acid, and alkyl (meth)acrylate ester as constituent units. Preferably, a binary copolymer-based ionomer resin or a ternary copolymer-based ionomer resin in which at least a portion of the carboxylic acid has been neutralized with metal ions can be used as the ionomer resin.

[0075] The metal ions used here include divalent and trivalent metal ions. An example of a divalent metal ion is Mg. 2+ Ca 2+ Ba 2+ Ni 2+ Zn 2+ Fe 2+ Co 2+ Sn 2+ Pb 2+ Mn 2+ Examples include trivalent metal ions such as Al 3+ Fe 3+ , Cr 3+ These are some examples.

[0076] In the dicing substrate film of the present invention, layer B is a layer located next to layer A and is located on the chuck table side. In the dicing substrate film of the present invention, layer B adheres well to the chuck table, and the dicing substrate film exhibits the effect of not moving.

[0077] In the dicing substrate film of the present invention, when layer B is located on the surface, it is preferable to include an antistatic agent.

[0078] In the dicing substrate film of the present invention, a further layer (for example, layer C) may be provided on the opposite side of layer A, with layer B in between. Layer C is made of a resin composition that can be used for layer B.

[0079] In the dicing substrate film of the present invention, when the C layer is located on the surface, it is preferable to include an antistatic agent.

[0080] In this invention, "the layer located on the surface" refers to the outermost layer.

[0081] (1-3) Layer structure of the substrate film for dicing The dicing substrate film of the present invention is laminated in at least the order of layer A / layer B.

[0082] The overall thickness of the dicing substrate film of the present invention is preferably about 50 μm to 300 μm, more preferably about 80 μm to 250 μm, and even more preferably about 90 μm to 220 μm. By setting the overall thickness of the dicing substrate film to 50 μm or more, it becomes possible to protect the semiconductor wafer or semiconductor package from impact when dicing the semiconductor wafer or semiconductor package into chip shapes.

[0083] As a specific example of a substrate film for dicing, we will explain the case where the total thickness is approximately 100 μm to 200 μm.

[0084] The thickness of layer A is preferably about 50 μm to 100 μm, more preferably about 60 μm to 80 μm, and even more preferably about 65 μm to 75 μm.

[0085] The thickness of layer B is preferably about 10 μm to 80 μm, more preferably about 20 μm to 60 μm, and even more preferably about 30 μm to 50 μm.

[0086] (2) Dicing substrate film for semiconductor packaging The dicing substrate film of the present invention is preferably a dicing substrate film used in the process of dicing semiconductor packages.

[0087] In the semiconductor package dicing process, using conventional dicing films (such as single-layer PP films) often resulted in excessive chip generation, potentially contaminating the package. For example, dicing a semiconductor package with a dicing blade using a conventional dicing film generated a large amount of chips. Furthermore, in packages with a large amount of chips, significant deformation (banking) was observed on the sides of the grooves created by dicing the dicing film. In other words, a phenomenon of the sides of the grooves created by dicing the dicing film bulging occurred. These chips had the potential to contaminate the semiconductor package. If the semiconductor package was contaminated, it could lead to poor electrical conductivity or pick-up errors due to the chips getting stuck.

[0088] The dicing substrate film of the present invention is a substrate film that does not generate chips even when used in the process of dicing semiconductor packages. Furthermore, the dicing substrate film of the present invention is a substrate film in which the sides of the grooves diced from the dicing film do not deform (bank) or only deform slightly, resulting in less chip generation.

[0089] (3) Method for manufacturing a substrate film for dicing In the present invention, a dicing substrate film having a three-layer structure with at least layer A and layer B laminated in that order can be manufactured by multilayer co-extrusion molding of the resin compositions used in each of the A and B layers. Specifically, the resin compositions for forming each layer can be manufactured by co-extrusion molding so that they are laminated in the order of layer A and layer B.

[0090] The resins for each layer described above are supplied to a screw-type extruder in this order, extruded in a film form from a multi-layer T-die at 180-240°C, and then cooled by passing it through a cooling roll at 30-70°C, and taken up with virtually no stretching. Alternatively, the resins for each layer may be obtained as pellets first, and then extruded as described above.

[0091] The reason for essentially leaving the film unstretched at the time of pickup is that it allows for effective expansion of the film after dicing. This "essentially unstretched" means either no stretching at all, or only a slight stretch that does not negatively affect the expansion of the diced film. Typically, at the time of film pickup, a tension that does not cause slack is sufficient.

[0092] (4) Manufacturing of dicing film The dicing film of the present invention can be manufactured in accordance with well-known techniques. For example, a film with a substrate film / adhesive layer configuration can be obtained by dissolving the adhesive constituting the adhesive layer in a solvent such as an organic solvent, applying this to a dicing substrate film, and then removing the solvent. [Examples]

[0093] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0094] (1) Raw materials for dicing substrate film Table 1 shows the raw materials for the dicing substrate film.

[0095] [Table 1]

[0096] [Explanation of abbreviations] PP-1: Polyolefin resin (polypropylene resin) PP-2: Polyolefin resin (polypropylene resin) MABS: Methyl methacrylate, acrylonitrile, butadiene, styrene resin SEBS-1: Vinyl aromatic hydrocarbon resin (Styrene-ethylenebutylene-styrene block copolymer) SEBS-2: Vinyl aromatic hydrocarbon resin (Styrene-ethylenebutylene-styrene block copolymer) PE: Polyolefin resin (branched low-density polyethylene)

[0097] (2) Manufacturing of dicing substrate films for layers A, B, and C A dicing substrate film was prepared by blending resin compositions with the components and compositions shown in Table 2 to form layers A, B, and C (3 layers).

[0098] The resin compositions constituting each layer were fed into separate extruders adjusted to 220°C, extruded using a 220°C T-die in the order of layer A / layer B / layer C, laminated, and then co-extruded onto a chill roll with circulating 30°C cooling water to obtain a flat three-layer film.

[0099] [Table 2]

[0100] (3) Evaluation of the substrate film for dicing (3-1) Bank height evaluation <Evaluation Method> When a film is diced, banks form alongside the grooves that are created. The average height of these banks from the surface of the substrate layer was measured using a laser microscope (VK-X100) manufactured by Keyence Corporation, and evaluated according to the following criteria (Table 3).

[0101] <Evaluation Criteria> ○: The bank height from the surface of the substrate layer is 45 μm or less. The bank height is low, and chip generation is either absent or suppressed. ×: The bank height from the substrate layer surface exceeds 45 μm. The bank height is high, and chips are being generated.

[0102] (3-2) Chip evaluation <Evaluation Method> The film was cut using a dicing device (DAD-2H / 6) manufactured by Disco Corporation, with the following blades, to a cutting depth of 40 μm from the surface layer (cutting into layer A).

[0103] Blade: Manufactured by Disco Corporation Blade: 40,000 rpm Cutting speed: 100 mm / second Cut size: 5mm square Cutting depth: 40 μm

[0104] <Evaluation Criteria> Visual evaluation was performed using a microscope (VHX-100) manufactured by Keyence Corporation (Table 3). ○: There are no beard-like shavings. ×: There are beard-like shavings.

[0105] [Table 3]

[0106] The dicing substrate film of the present invention, having a resin composition containing MABS resin and PO-based resin in layer A, exhibits the effect of effectively suppressing the generation of cutting chips during dicing, preventing deformation (banking) of the sides of the diced grooves, or effectively suppressing deformation.

[0107] The dicing substrate film of the present invention can be evaluated as effectively suppressing the generation of cutting chips during dicing, and preventing or effectively suppressing deformation (banking) of the sides of the diced grooves.

Claims

1. Dicing substrate film, The dicing substrate film is laminated in at least the order of layer A / layer B, The aforementioned layer A is a layer located on the side to be diced, and consists of a resin composition containing methyl methacrylate acrylonitrile butadiene styrene (MABS) resin and polyolefin resin. The aforementioned layer B is a layer that is located closer to the chuck table during dicing compared to the aforementioned layer A, and is a layer that does not contain MABS resin. The average height of the bank formed alongside the groove after dicing is 40.8 μm or less. Dicing substrate film.

2. The dicing substrate film according to claim 1, wherein the resin composition constituting the A layer contains 5% to 50% by weight of MABS resin.

3. The dicing substrate film according to claim 1 or 2, wherein the A layer further comprises a vinyl aromatic resin.

4. A dicing substrate film according to any one of claims 1 to 3, wherein the layer located on the surface contains an antistatic agent.

5. A dicing substrate film according to any one of claims 1 to 4, used in the process of dicing a semiconductor package.

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