Cutting oil composition

Abstract

The present invention relates to a cutting oil composition used in a wire-saw cutting process, which is composed of 50 to 95 wt% of a base oil represented by Chemical Formula 1, Chemical Formula 2, or Chemical Formula 3, 0.1 to 5 wt% of a chelating agent, 0.1 to 10 wt% of a thickener, 0.1 to 5 wt% of a dispersant, 1 to 20 wt% of an oiliness improver, and 1 to 10 wt% of a nonionic surfactant. The cutting oil composition is excellent in all properties, including residual metal impurity removal ability, cleaning ability, viscosity, surface tension, corrosivity, dispersibility, lubricity, wafer uniformity, and abrasion resistance, and is particularly excellent in cleaning ability and metal ion impurity removal ability.

Description

Technical Field

[0001] The present invention relates to a cutting oil composition used in a wire-saw cutting process. In particular, the present invention relates to a wire-saw cutting oil composition comprising: a chelating agent for metal removal consisting of a nitrogen-containing carboxylic acid or carboxylate compound; a highly hydrotreated hydrocarbon distillate base oil; a thickener; a dispersant; an oiliness improver; and a nonionic surfactant.

Background Art

[0002] Wire saw cutting is the main method for slicing ingots to produce thin wafers used in the integrated circuit and photovoltaic cell industries. Furthermore, this method is also commonly used in manufacturing wafers from substrates of other materials, such as sapphire, silicon carbide or ceramic substrates. A wire saw typically has a web of fine metal wires or a wireweb, wherein individual wires have a diameter of about 0.15 mm and are arranged parallel to each other at a distance of 0.1 to 1.0 mm via a series of spools, pulleys and wire guides. Cutting is achieved by bringing a workpiece such as a substrate into contact with a moving wire to which the cutting oil composition is applied. In a conventional wire saw cutting process, a composition produced by mixing abrasive particles made of a hard material such as silicon carbide particles with a cutting oil composition comprising mineral oil or synthetic oil, a thickener, a dispersant, etc., at a weight ratio of about 1:1 is used. A cutting oil composition is a liquid that provides lubrication and cooling, and holds the abrasive on the wire, thereby allowing the abrasive to come into contact with the workpiece to be cut. For cutting fluids to perform optimally, a proper balance between lubricity and viscosity is necessary. If the lubricity is too high, the fine abrasive particles will not adhere to the workpiece, causing slippage and reducing cutting ability. If the lubricity is too low, the individual fine abrasive particles will not be able to exert sufficient cutting ability. Recently, companies performing wire sawing processes have been reusing oil that has been used once. This reuse of cutting fluids and abrasive particles has the problem that the copper alloy plated on the wires will peel off during the wire sawing process, allowing copper ions to penetrate the wafer surface and increasing metal contamination of the wafer surface. Examples of cutting fluid compositions include hydrophobic substances such as mineral oil, kerosene, polyethylene glycol, polypropylene glycol, or other polyalkylene glycols, and hydrophilic substances can also be used in the wire saw cutting process. Conventional cutting fluid compositions often have drawbacks, such as the copper alloy plating on the wire peeling off during the wire sawing process, leaving or penetrating copper ions on the wafer surface and increasing contamination; reduced dispersibility of abrasive particles; reduced suspension persistence of abrasive particles; excessively low or high lubricity; excessively long wafer cleaning time after the wire sawing process; and significant wafer warping after the wire sawing process.

[0003] Cutting fluid is pre-mixed with abrasive particles in a mixer attached to the oil tank of the cutting equipment before use. To prevent the cutting fluid and abrasive particles from separating again, redispersion must be performed as needed using a small mixer. However, the separated abrasive particles can aggregate and combine, clogging the cutting fluid transfer pipe and causing circulation problems. This results in insufficient suspension persistence, lubrication, and dispersibility of the cutting fluid, leading to problems such as wire wear, wafer cutting unevenness, and shortened slurry particle lifespan, increasing manufacturing costs and reducing cleaning power in subsequent processes. Furthermore, the reuse of cutting fluid can cause the copper alloy plated on the wire to peel off during the wire sawing process. These metallic impurities can penetrate the silicon in the silicon wafer, increasing the impurity density on the silicon wafer surface. For these reasons, various attempts have been made to improve the chelating agents added to cutting fluids to prevent metals introduced during the cutting process from remaining on or penetrating the wafer surface. However, in the case of EDTA (ethylenediaminetetraacetic acid) and DTPA (diethylenetriaminepentaacetic acid), they either do not dissolve well in mineral oil or synthetic oil used as a base oil, or their effect is insufficient. In other words, in the case of conventional cutting fluid compositions, when dispersibility, cleaning power, degree of wafer warping after the wire sawing process, and concentration of metal ion impurities on the wafer surface after the wire sawing process are comprehensively evaluated, one or more of these characteristics are poor, resulting in a cutting fluid composition that is unsuitable. To improve upon these problems, the prior patent (Korean Registered Patent No. 10-2062341), invented and patented by the present inventors, exhibited good performance in various aspects such as viscosity, abrasive particle dispersibility, cleanability, wafer uniformity, and abrasion resistance, and was usefully used in cutting processes. However, the cutting fluid composition based on the prior patent still had the problem of metal ion impurities, particularly copper (Cu), nickel (Ni), manganese (Mn), chromium (Cr), and iron (Fe), remaining on or penetrating the wafer surface after the cutting process. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Korean Registered Patent Publication No. 10-2062341 [Patent Document 2] Korean Published Patent Publication No. 10-2009-48518 [Patent Document 3] Korean Published Patent Publication No. 10-2009-65847 [Patent Document 4] Korean Published Patent No. 10-2011-39725 [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention aims to solve these problems, and its objective is to provide a cutting fluid composition in which, when all properties related to residual metal impurity removal ability, cleaning ability, viscosity, surface tension, corrosiveness, dispersibility, lubricity, wafer uniformity, abrasion, etc. are evaluated, one or more properties are not poor, and all properties are overall superior to conventional cutting fluid compositions, while in particular the cleaning ability and metal ion impurity removal ability are remarkably superior. [Means for solving the problem]

[0006] To achieve the above objectives, the present invention presents a cutting oil composition containing a base oil, a chelating agent, a thickening agent, a dispersant, an oiliness enhancer, and a nonionic surfactant, which are components A to F listed below, as a means of solving the problem. Each component will be described below, and a composition which is a mixture thereof will also be described. 1. Ingredient A Component A is one or more highly hydrogenated base oils represented by the following chemical formulas: Chemical Formula 1, Chemical Formula 2, or Chemical Formula 3. [Chemical formula 1] R1-(CnH2n-4)a-R2 [Chemical formula 2] R3-(CnH2n-2)b-R4 [Chemical formula 3] R5-(CnH2n)c-R6 (In the above chemical formulas 1 to 3, n is 5 or 6, a is 3 to 7, b is 40 to 50, c is 45 to 55, and R1, R2, R3, R4, R5, and R6 are H or OH, respectively.) In the prior art, Korean Registered Patent No. 10-2062341, the base oil of component A was such that a in chemical formulas 1 to 3 was 7 to 20, b was 39 to 52, and c was 39 to 41. In contrast, the present invention, through further in-depth research, has revealed that it is preferable for the base oil of component A to be such that a in chemical formulas 1 to 3 is 3 to 7, b is 40 to 50, and c is 45 to 55. Furthermore, it has been revealed that it is most preferable for a to be 5, b to be 45, and c to be 50. Furthermore, it was revealed that the base oil of component A is preferably a mixture of chemical formulas 1 to 3 in similar amounts, and most preferably a mixture of chemical formulas 1 to 3 in equal amounts. Here, it is preferable that the base oil of component A is contained in an amount of 50 to 95% by weight relative to the whole composition.

[0007] 2. Component B Component B is a metal removal chelating agent, and the chelating agent is a nitrogen-containing carboxylic acid or carboxylate compound, such as gamma-aminobutyric acid, nitrilotriacetic acid, diaminosuccinic acid, diethylimide carbonate, β-aminobutyric acid, succinamide acid, alanine, iminodiacetic acid, ethyl 3-amino-3-ureidobutyrate, 2-aminobutanediic acid, 2-aminopentanediic acid, 2-amino-3-carbamoylpropanoic acid, 2-amino-4-carbamoyl A substance selected from the group consisting of rubatanic acid, 2-amino-5-carbamimidoylpentanoic acid, 2,4-diaminopentanedioic acid, 2,6-diaminohexanoic acid, 3-aminopentanoic acid and N-hydroxycarbamimidoylacetic acid, glutaric acid, nicotinic acid, maleic acid, malonic acid, malic acid, valeic acid, butyric acid, succinic acid, citric acid, acetic acid, acrylic acid, oxalic acid, lactic acid, formic acid, propionic acid, phthalic acid and salts thereof, or a mixture thereof. Here, the chelating agent component B is preferably contained in an amount of 0.1 to 5% by weight relative to the entire composition. 3. Component C Component C is a thickening agent selected from the group consisting of finely ground chalk powder, finely ground clay powder, a fine organic composite containing sorbitan monooleate and alpha-olefin, and bentonite, or a mixture thereof, with bentonite being the most preferred. Here, the thickening agent component C is preferably contained in an amount of 0.1 to 10% by weight relative to the entire composition. 4. Component D Component D is a dispersant selected from the group consisting of Fe2O3, Na2O, Al2O3, and Si2O, or a mixture thereof, and is more preferably Fe2O3, Na2O, or a mixture thereof. Here, the dispersant component D is preferably present in an amount of 0.1 to 6% by weight relative to the entire composition. 5. Component E Component E is an oiliness enhancer, and is preferably one or more selected from the group consisting of plant and animal fatty acid oils of chemical formula 4 and alkyl oleates of chemical formula 5, and is contained in an amount of 1 to 20% by weight relative to the total weight of the composition. [Chemical formula 4] R7-COO-R8 (In the formula, R7 is hydrogen or alkyl, R8 is a C11-C22 saturated fatty acid, unsaturated fatty acid, plant or animal fatty acid ester, and the chemical formula is an ester compound derived from trihydric-pentahydric alcohols and monobasic fatty acids.) [Chemical formula 5] R9-C(CH3)2(OCOR10) (In the formula, R9 is methyl, ethyl, propyl, or butyl, R10 is a C11-C22 alkyl, and the chemical formula is an ester compound derived from trivalent--pentavalent alcohols and monobasic fatty acids.)

[0008] 6. Component F Component F is a nonionic surfactant, one or more selected from the group consisting of the following chemical formula 6, and can be contained in an amount of 1 to 10% by weight relative to the total weight of the composition. [Chemical formula 6] R11-(AO)n-R12 (In the formula, R11 and R12 are independently a hydrogen group (-H), a hydroxyl group (-OH), a linear or branched alkyl group having 1 to 20 carbon atoms, or a linear or branched alkenyl group having 1 to 20 carbon atoms; A is an alkylene group having 2 to 4 carbon atoms; and n is a natural number from 1 to 25.) On the other hand, the cutting oil composition is characterized in that it is used for dispersing an abrasive. Silicon carbide can be used as the abrasive, which can be obtained from silica stone powder and coke powder by a thermal carbonization reduction method in an electric furnace, and is greenish or black grayish depending on temperature. In general, SiC is produced with extremely high hardness of Knoop hardness of 2700 or higher and Mohs hardness of 9.5 or higher, so it has extremely excellent grinding force, and is mainly used as an abrasive for silicon substrates for semiconductors and solar cells. As a method for dispersing these abrasive (Green-SiC) particles in oil, in addition to dispersion treatment with an ordinary stirrer, a homogenizer, an ultrasonic disperser, a ball mill, or the like can be used. In order to disperse particles having a size of micrometer or less, it is preferable to use a dispersion device such as a ball mill, a vibrating ball mill, a planetary ball mill, or a medium stirring mill. Effects of the Invention

[0009] The present invention exhibits the effect of providing a cutting oil composition in which one or more of all properties related to residual metal impurity removal power, detergency, viscosity, surface tension, corrosivity, dispersibility, lubricity, wafer uniformity, abrasion resistance, and the like are not inferior to conventional cutting oil compositions, all properties are comprehensively excellent, and in particular, detergency and metal ion impurity removal power are remarkably excellent. Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and does not limit the present invention, and the present invention is only defined by the scope of the claims described below. Hereinafter, components that can be used in the cutting oil composition of the present invention will be described in detail. 1. Component A Component A is the base oil contained in the composition. Examples of base oils for component A include paraffin or naphthenic low-viscosity base oils, which are pure lubricating oils. The paraffinic and naphthenic base oils as component A are basic substances that disperse and dissolve the additives listed below. To prevent the separation of additives due to temperature changes, it is preferable to use a base oil with a low pour point, and for environmental and workplace safety, it is preferable to use a high-purity, high-grade refined base oil. Component A is contained in the entire composition at a concentration of 50-95% by weight as base oil. A base oil containing both naphthenic and paraffinic base oils is preferred. [Chemical formula 1] R1-(CnH2n-4)a-R2 [Chemical formula 2] R3-(CnH2n-2)b-R4 [Chemical formula 3] R5-(CnH2n)c-R6 (In the above chemical formulas 1 to 3, n is 5 or 6, a is 3 to 7, b is 40 to 50, c is 45 to 55, and R1, R2, R3, R4, R5, and R6 are H or OH, respectively.) 2. Component B Component B of the composition is a metal removal chelating agent consisting of a nitrogen-containing carboxylic acid or carboxylate compound. Specific examples of Component B include nitrogen-containing carboxylic acids such as gamma-aminobutyric acid, nitrilotriacetic acid, diaminosuccinic acid, diethylimide carbonate, β-aminobutyric acid, succinamide acid, alanine, iminodiacetic acid, ethyl 3-amino-3-ureidobutyrate, 2-aminobutanediic acid, 2-aminopentanediic acid, 2-amino-3-carbamoylpropanoic acid, 2-amino-4-carbamoylbutanoic acid, 2-amino-5-carbamimidoylpentanoic acid, and 2,4-diami The carboxylic acids are nopentanediic acid, 2,6-diaminohexanoic acid, 3-aminopentanoic acid, and N-hydroxycarbamimidoylacetic acid. The carboxylic acids can be glutaric acid, nicotinic acid, maleic acid, malonic acid, malic acid, valeic acid, butyric acid, succinic acid, citric acid, acetic acid, acrylic acid, oxalic acid, lactic acid, formic acid, propionic acid, phthalic acid, and salts thereof, and can be used in an amount of 0.1 to 5% by weight, preferably 0.3 to 3% by weight, relative to the weight of the cutting fluid composition. The aforementioned metal-removing chelating agent, having a coordination number of 2 to 6, can effectively form complex compounds with metals that have 4s and 3d orbital outermost shell electrons. On the other hand, because the above-mentioned metals that have 4s and 3d orbital outermost shell electrons exist as relatively small atoms and ions, they do not readily form complex compounds with chelating compounds that have a high coordination number of 7 or more. In the case of chelating agents with a high coordination number of 7 or higher, they readily form complex compounds with metals that have their outermost electrons in the 5f orbital. Therefore, their ability to form complex compounds decreases with relatively small metals in the periodic table, such as copper (Cu), nickel (Ni), manganese (Mn), chromium (Cr), and iron (Fe). The chelating agents having a coordination number of 2 to 6 added to the cutting fluid composition of the present invention have excellent complex compound formation ability with metals such as magnesium (Mg), aluminum (Al), potassium (K), calcium (Ca), titanium (Ti), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), zinc (Zn), and lead (Pb), specifically with periodic metals such as copper (Cu), nickel (Ni), manganese (Mn), chromium (Cr), and iron (Fe). Therefore, they have excellent ability to prevent metal ions generated during the cutting process from remaining in or penetrating the wafer.

[0011] 3. Component C Component C of the composition is a composite dispersion powder containing alpha-olefin, fined chalk powder, fined clay powder, and sorbitan monooleate, or a composite dispersion powder selected from the group consisting of organic clay and organic bentonite. This component C is a fine organic composite material and is used as a thickening agent. Component C ensures that the inorganic particles contained in the slurry maintain appropriate tackiness, thereby allowing them to be uniformly dispersed on the cutting tool (wire). The bentonite component used in this composite dispersion powder is represented, for example, as NaSi(AlMg)O(OH). Component C is contained in an amount of 0.1 to 10% by weight, preferably 1 to 5% by weight, relative to the total weight of the composition. If component C is contained in an amount of less than 0.1% by weight, the slurry cannot maintain appropriate tackiness, while if component C is contained in an amount exceeding 10% by weight, the tackiness is too strong and unsuitable. 4. Component D Component D of the composition is a dispersant containing one or more substances selected from the group consisting of Fe2O3, Na2O, Al2O3, and Si2O. The powder used as component D acts as a dispersant to allow the slurry powder to disperse easily in the cutting fluid. Component D is contained in 0.1 to 5% by weight, preferably 0.5 to 3% by weight, of the total composition. If component D is contained in an amount of less than 0.1% by weight, the slurry powder will not dissolve and disperse easily in the cutting fluid. On the other hand, if component D is contained in an amount exceeding 6% by weight, it will dissolve and disperse excessively, making smooth cutting impossible. 5. Component E Component E of the composition is one or more oiliness improvers selected from the group consisting of plant and animal fatty acid oils or alkyl oleates. Here, the oiliness improver is a substance represented by the following chemical formula 4 or chemical formula 5, or a mixture thereof. [Chemical formula 4] R7-COO-R8 (In the above chemical formula, R7 is hydrogen or alkyl, R8 is a C11-C22 saturated fatty acid, unsaturated fatty acid, plant or animal fatty acid ester, and the above chemical formula is an ester compound derived from trihydric-pentahydric alcohols and monobasic fatty acids.) [Chemical formula 5] R9-C(CH3)2(OCOR10) (In the above chemical formula, R9 is methyl, ethyl, propyl, or butyl, R10 is a C11-C22 alkyl, and the above chemical formula is an ester compound derived from trivalent--pentavalent alcohols and monobasic fatty acids.) As the lubricity enhancer for component E, synthetic and natural fatty oils are used. These are high-grade synthetic esters or high-grade fatty oils used to provide appropriate lubrication for the wire sawing process and to reduce viscosity increase and oil separation due to solidification at low temperatures. This lubricity enhancer is contained in 1 to 20% by weight, preferably 5 to 10% by weight, of the total composition. If the lubricity enhancer is contained in an amount of less than 1% by weight, oil separation occurs, causing problems with storage stability. If the lubricity enhancer is contained in an amount exceeding 20% ​​by weight, viscosity decreases and lubricity increases, preventing individual fine abrasive particles from exhibiting sufficient cutting ability.

[0012] 6. Component F Component F of the composition is a nonionic surfactant, which is an auxiliary substance that plays the role of a cleaning and lubricating additive in the present invention. It is a substance represented by the following chemical formula 6, and specifically includes polyethylene glycol diester (HLB: 10.4), sorbitan ester of fatty acid (HLB: 9.6), polyethylene glycol diester (HLB: 8.4), ethoxylated propoxylated alcohols (HLB: 7.3), and polyoxyethylene lauryl ether (HLB: 6.2). The nonionic surfactant, which is component F, is contained in the composition at a concentration of 1 to 10% by weight. [Chemical formula 6] R11-(AO)n-R12 (In the above chemical formula, R11 and R12 are independently a hydrogen group (-H), a hydroxyl group (-OH), a linear or branched alkyl group having 1 to 20 carbon atoms, or a linear or branched alkenyl group having 1 to 20 carbon atoms, A is an alkylene group having 2 to 4 carbon atoms, and n is a natural number from 1 to 25.) The specific configuration of the present invention and its effects will be explained in more detail through the following examples and experimental cases.

[0013] [Examples 1-28 and Comparative Examples 1-15] The cutting oil compositions of the examples and comparative examples were added to each experimental beaker equipped with a home mixer in the composition ratios shown in [Table 1]. After sealing the top of the beaker, the mixture was stirred at a speed of 3,000 rpm at room temperature for 90 minutes to produce the compositions. The HLB (Hydrophile-Lipophile Balance) value of a nonionic surfactant is measured using the Griffin method. The HLB value indicates the degree of affinity of the surfactant to water or oil. The HLB value ranges from 0 to 20, with the closer the HLB value is to 0, the stronger the hydrophobic (lipophilic) properties of the nonionic surfactant, and the closer the HLB value is to 20, the stronger the hydrophilic properties of the nonionic surfactant. [Table 1a] [Table 1b] [Table 1c]

[0014] [Experimental Examples 1-28 and Comparative Experimental Examples 1-15] The compositions prepared according to Examples 1 to 28 and Comparative Examples 1 to 15 were used, and the results for each test item were derived by the following methods (1) to (7). (1) Viscosity Viscosity measurements were performed using a Brookfield DV-II+Pro model, with Spindle No. 61 and 62, at a spindle speed of 60 rpm. In this case, a cutting fluid composition having a viscosity of 60 to 120 mPa·s at 25°C is preferred. (2)Surface tension The cutting fluid composition was measured using a surface tension measuring instrument (model name: Tensiometer K100, manufacturer: KRUSS). (3) Abrasive particle dispersibility Dispersibility was evaluated by filling a graduated cylinder with a slurry of cutting oil and silicon carbide (SiC) powder in a 1:1 weight ratio, leaving it at room temperature for 7 days, and then measuring the amount of supernatant liquid. In this case, a cutting fluid composition that has no supernatant or contains only a small amount of supernatant is preferable. (4) Cleaning power A mixture of cutting oil and cutting residue (abrasive material, wafer chips) generated after wafer cutting was applied to a wafer, and the sample was dried at 85°C for 8 hours to produce a contaminated test specimen. Two of these contaminated test pieces were bonded together with a 0.2 mm gap between them. They were then immersed in a cleaning solution (model name: YKC-B620, manufacturer: Yongchan Chemical) and washed at 40 degrees Celsius for 10 minutes. After rinsing three times with water, the degree of contamination remaining on the wafer surface was shown as follows. <Evaluation Criteria> ◎: The source of contamination remains within 5% of the total area. ○: The source of contamination remains within 5-15% of the total area. △: The source of contamination remains within 15-25% of the total area. X: More than 25% of the total area remains contaminated. (5) Wafer flatness The measurement of wafer flatness after sawing involves measuring the degree of warping of individual wafers after cleaning is complete. 、 The evaluation was conducted using equipment. In this evaluation, cutting fluid compositions that were evaluated as having a wafer warp of 10 μm or less after sawing were considered superior. (6) Metal ion removal power To confirm the extent to which metal impurities generated during the cutting process are removed or controlled by the cutting fluid, a Cu / Ni standard solution was used to measure Cu / Ni impurities at 1.0E12 atoms / cm³ using a spin coating method. 2 After contaminating the surface of a silicon wafer with the specified concentration, the amount of metallic impurities that penetrated the wafer surface before and after immersion in cutting oil was calculated by the following experiment. In this case, a cutting fluid composition with a low residual amount of metal impurities is preferable. 1) Silicon wafers contaminated with Cu and Ni standard solutions were immersed for 5 minutes each at room temperature in cutting fluid compositions containing the respective metal removal chelating agents prepared in the examples and comparative examples. 2) The immersed wafers are washed with refined kerosene and isopropyl alcohol, dried with nitrogen gas, and then stored in a nitrogen box. 3) Next, a solution of 1 wt% hydrofluoric acid and 1 wt% hydrogen peroxide is diffused onto the surface of the wafer for 5 minutes, and then the surface of the wafer is etched for 5 minutes. 4) Next, the entire solution on the wafer was collected using a polyethylene pipette, and then analyzed using an inductively coupled plasma mass spectrometer (ICP-MS; manufacturer: Agilent, model name: 7700). (7) Wear prevention The wear resistance of the cutting fluid composition was tested according to the ASTM D2266 shell four-ball abrasion test method under the conditions of 30 minutes, 1,200±50 rpm, a cutting fluid temperature of 75±5℃, and a load of 40±0.2 kg. After the test, the balls were removed, and the diameters of the wear marks and the resulting wear marks were measured and compared. In this case, a cutting fluid composition that shows no wear marks or only minor wear marks is preferable.

[0015] [Table 2]

[0016] As shown in [Table 2] above, the wafer cutting fluid compositions of Examples 1 to 28 according to the present invention, compared with Comparative Examples 1 to 15, demonstrate superior cleaning power after the cutting process, lower residual metal ion impurity concentrations, and superior metal ion impurity removal capabilities. Furthermore, they demonstrate superior viscosity, surface tension, dispersibility, wafer uniformity, and abrasion resistance.

Claims

1. A cutting oil composition characterized by being composed of a base oil represented by the following chemical formula 1, chemical formula 2, or chemical formula 3, a chelating agent, a thickening agent, a dispersant, an oiliness enhancer, and a nonionic surfactant. [Chemical formula 1] R1-(CnH2n-4)a-R2 [Chemical formula 2] R3-(CnH2n-2)b-R4 [Chemical formula 3] R5-(CnH2n)c-R6 (In the above chemical formulas 1 to 3, n is 5 or 6, a is 3 to 7, b is 40 to 50, c is 45 to 55, and R1, R2, R3, R4, R5, and R6 are H or OH, respectively.)

2. The cutting oil composition according to claim 1, characterized in that it is composed of 50 to 95% by weight of the base oil, 0.1 to 5% by weight of a chelating agent, 0.1 to 10% by weight of a thickening agent, 0.1 to 5% by weight of a dispersant, 1 to 20% by weight of an oiliness improver, and 1 to 10% by weight of a nonionic surfactant.

3. The cutting fluid composition according to claim 2, characterized in that a in the chemical formulas 1 to 3 is 5, b is 45, and c is 50.

4. The chelating agents include gamma-aminobutyric acid, nitrilotriacetic acid, diaminosuccinic acid, diethylimide carbonate, β-aminobutyric acid, succinamide acid, alanine, iminodiacetic acid, ethyl 3-amino-3-ureidobutyrate, 2-aminobutanediic acid, 2-aminopentanediic acid, 2-amino-3-carbamoylpropanoic acid, 2-amino-4-carbamoylbutanoic acid, 2-amino-5-carbamimidoylpentanoic acid, and 2,4-diami The cutting fluid composition according to claim 3, characterized in that it is a substance selected from the group consisting of nopentanediic acid, 2,6-diaminohexanoic acid, 3-aminopentanoic acid and N-hydroxycarbamimidoylacetic acid, glutaric acid, nicotinic acid, maleic acid, malonic acid, malic acid, valeic acid, butyric acid, succinic acid, citric acid, acetic acid, acrylic acid, oxalic acid, lactic acid, formic acid, propionic acid, phthalic acid and salts thereof, or a mixture thereof.

5. The cutting fluid composition according to claim 3, characterized in that the thickening agent is a substance selected from the group consisting of finely powdered chalk powder, finely powdered clay powder, a fine organic composite substance containing sorbitan monooleate and alphaolefin, and finely powdered bentonite, or a mixture thereof.

6. The dispersant is Fe ２ O ３ Na ２ O, Al ２ O ３ and Si ２ The cutting fluid composition according to claim 3, characterized in that it is a substance selected from the group consisting of O, or a mixture thereof.

7. The dispersant is Fe ２ O ３ , Na ２ O or a mixture thereof. The cutting oil composition according to claim 6.

8. The cutting fluid composition according to claim 3, characterized in that the oiliness improver is a substance represented by the following chemical formula 4 or chemical formula 5, or a mixture thereof. [Chemical formula 4] R7-COO-R8 (In the above chemical formula, R7 is hydrogen or alkyl, R8 is a C11-C22 saturated fatty acid, unsaturated fatty acid, plant or animal fatty acid ester, and the above chemical formula is an ester compound derived from trihydric-pentahydric alcohols and monobasic fatty acids.) [Chemical formula 5] R9-C(CH3)2(OCOR10) (In the above chemical formula, R9 is methyl, ethyl, propyl, or butyl, R10 is a C11-C22 alkyl, and the above chemical formula is an ester compound derived from trivalent-to-pentavalent alcohols and monobasic fatty acids.)

9. The cutting fluid composition according to claim 3, characterized in that the nonionic surfactant is a substance represented by the following chemical formula 6. [Chemical formula 6] R11-(AO)n-R12 (In the above chemical formula, R11 and R12 are independently a hydrogen group (-H), a hydroxyl group (-OH), a linear or branched alkyl group having 1 to 20 carbon atoms, or a linear or branched alkenyl group having 1 to 20 carbon atoms; A is an alkylene group having 2 to 4 carbon atoms; and n is a natural number from 1 to 25.)

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