Linear motion devices and electronic component mounting devices

Abstract

To provide a linear motion device that suppresses thermal deformation of a mobile object, a guide rail, and a linear guide due to heat generated from a movable element, to improve positioning accuracy of the mobile object.SOLUTION: A linear motion device 1 includes: a base 2 extending in a reference direction; a linear guide mechanism 3 having a slider 32 movable along a guide rail 31 disposed on a side of the base; a mobile object 5 fixed to the slider; a linear motor 4 having a stator 42 and a mover 41 disposed above the base; and a heat transfer body 6 coupled to the mobile object and the mover above the linear guide mechanism. The mobile object and the heat transfer body are connected via the spacer. The heat transfer body extends in a direction away from the linear guide mechanism, and the linear motor and the heat transfer body do not face the linear guide mechanism in a horizontal direction orthogonal to the reference direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a linear motion device that moves a moving body by a linear motor, and an electronic component mounting apparatus including the linear motion device.

Background Art

[0002] As a linear motion device for moving a moving body, one that uses a linear motor as a driving device is known. Since a linear motor does not have a mechanical power transmission unit, deterioration of the positioning accuracy of the moving body due to deformation, wear or the like of components constituting the linear motion device is less likely to occur, and the linear motor is suitable for high-precision positioning.

[0003] The moving body moves while being connected to a mover of the linear motor. The mover generates heat when energized, so when this heat is transferred to the moving body, the moving body undergoes thermal deformation, which deteriorates the positioning accuracy of the moving body. In view of this, Patent Document 1 discloses a linear motion device in which a ventilation path through which cooling air flows is provided between the mover and the moving body (top plate) to efficiently cool the mover, and the mover and the moving body are connected via a heat insulating material to suppress transfer of heat generated from the mover to the moving body.

Prior Art Literature

Patent Literature

[0004]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0005] In the linear motion device disclosed in Patent Document 1, a movable element is positioned between a pair of guide rails, and a moving body connected to the movable element is fixed to a linear guide (slider) supported by the guide rails, thereby enabling movement along the guide rails. In a linear motion device with such a configuration, the movable element is positioned in close proximity to each other in the space enclosed by the moving body, guide rails, and linear guide. Therefore, even if a ventilation passage or insulating material is interposed between the movable element and the moving body, it is unavoidable that the heat generated from the movable element will be transferred to the moving body, guide rails, and linear guide by thermal radiation and convection, resulting in a problem where the positioning accuracy of the moving body deteriorates due to thermal deformation of these components.

[0006] The present invention has been made in view of the above, and its main objective is to provide a linear motion device that suppresses thermal deformation of the moving body, guide rail, and linear guide due to heat generated from the movable element, and improves the positioning accuracy of the moving body. [Means for solving the problem]

[0007] The linear motion device according to the present invention is a linear motion device for moving a movable body in a reference direction, comprising: a base extending in the reference direction; a linear guide mechanism having a guide rail disposed to the side of the base and extending in the reference direction; and a slider movable along the guide rail; a movable body fixed to the slider; a linear motor having a stator disposed above the base and extending in the reference direction; and a movable element provided with a certain gap between the stator and the movable element; and a heat transfer element interposed between the movable body and the movable element above the linear guide mechanism and connected to the movable body and the movable element, wherein the movable body and the heat transfer element are connected via a spacer, the heat transfer element extends away from the linear guide mechanism, and the linear motor and the heat transfer element do not face the linear guide mechanism in a horizontal direction perpendicular to the reference direction. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a linear motion device that suppresses thermal deformation of the moving body, guide rail, and linear guide due to heat generated from the movable element, thereby improving the positioning accuracy of the moving body. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing the configuration of a linear motion device in the first embodiment of the present invention. [Figure 2] This is a cross-sectional view showing the configuration of the linear motion device in the first embodiment of the present invention. [Figure 3] (A) and (B) are diagrams showing the configuration of a conventional linear motion device. [Figure 4] (A) and (B) are diagrams showing the configuration of a linear motion device in which the movable element is positioned away from the linear guide mechanism. [Figure 5] (A) and (B) are diagrams showing the configuration of the linear motion device in the first embodiment. [Figure 6] (A) and (B) are diagrams showing the configuration of other linear motion devices in the first embodiment. [Figure 7] This is a cross-sectional view showing the configuration of the linear motion device in a modified example of the first embodiment. [Figure 8] This is a cross-sectional view showing the configuration of the linear motion device in a modified example of the first embodiment. [Figure 9] This is a cross-sectional view showing the configuration of an electronic component mounting apparatus in a second embodiment of the present invention. [Figure 10] This is a front view showing the configuration of an electronic component mounting apparatus according to a second embodiment of the present invention. [Figure 11] This is a cross-sectional view showing the configuration of a linear motion device in another embodiment of the present invention. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to the following embodiments. Furthermore, modifications can be made as appropriate without departing from the scope of achieving the effects of the present invention.

[0011] (First embodiment) Figure 1 is a perspective view schematically showing the configuration of a linear motion device according to a first embodiment of the present invention, and Figure 2 is a cross-sectional view schematically showing the configuration of the linear motion device.

[0012] In the following description, the direction in which the moving body moves (reference direction) is defined as the X direction, the horizontal direction orthogonal to the X direction is defined as the Y direction, and the vertical direction orthogonal to the X direction is defined as the Z direction.

[0013] As shown in Figure 1, the linear motion device 1 includes a base 2, a linear guide mechanism 3, a linear motor 4, a moving body 5, a heat transfer body 6, a spacer 7, a position sensor 8, a power feeding cable 9, and a control unit (not shown).

[0014] The base 2 is formed in a rectangular parallelepiped shape extending in the X direction. The linear guide mechanism 3 includes a guide rail 31 and a slider 32. The guide rail 31 extends in the X direction and is fixed to the base 2 with bolts or the like. A plurality of guide rails 31 may be provided. In the present embodiment, two guide rails 31 are provided spaced apart from each other in the Z direction.

[0015] The guide rail 31 supports the slider 32 so as to be movable in the X direction along the guide rail 31. A plurality of sliders 32 may be provided. In the present embodiment, two sliders 32 are provided for each guide rail 31, making a total of four sliders 32.

[0016] It is preferable that the engagement portion between the guide rail 31 and the slider 32 includes rolling elements. This reduces the frictional force generated between the guide rail 31 and the slider 32, and can reduce lost motion during positioning of the moving body 5, which will be described later.

[0017] As shown in Figure 2, the linear motor 4 includes a stator 42 and a mover 41. The stator 42 is composed of a series of magnet arrays 42a that are oppositely arranged at intervals in the Z direction and extend in the X direction, and a U-shaped cross-section frame 42b that holds the magnet arrays 42a. The stator 42 is fixed to the upper surface of the base 2. A support portion 43 for supporting the power feeding cable 9 is provided on the upper surface of the stator 42.

[0018] The mover 41 is formed in a rectangular parallelepiped shape and has a plurality of coils not shown inside. The mover 41 is arranged between the magnet rows 42a with a constant gap from each of the upper and lower magnet rows. The mover 41 is fixed to a heat transfer body 6, which will be described later, with bolts or the like. The plurality of coils are electrically connected to a control unit via a power supply cable 9.

[0019] When the plurality of coils are energized, magnetism is generated around the plurality of coils, and an attractive force is generated between the coils and the magnet rows 42a. Accordingly, a propulsive force in the X direction is applied to the mover 41.

[0020] In the linear motor 4, it is preferable that the mover 41 is arranged at a position above the linear guide mechanism. Since air heated in the vicinity of the mover 41 tends to flow upward, arranging the mover 41 above the linear guide mechanism 3 can suppress heat transfer caused by convection from the mover 41 to the linear guide mechanism 3 and a moving body 5 to be described later.

[0021] The moving body 5 is formed, for example, in a plate shape extending in the X direction and the Z direction. The lower side of the moving body 5 is fixed to a slider 32 with bolts or the like. The upper side of the moving body 5 is fixed to the heat transfer body 6 via a spacer 7 to be described later with bolts or the like. In FIG. 1, for the purpose of clarifying the internal structure, the moving body 5 is shown as a transparent portion by a dotted line.

[0022] The heat transfer body 6 connected to the mover 41 extends in the direction (Z direction) away from the linear guide mechanism 3. Further, the heat transfer body 6 has a bent portion 61 extending in the direction (Y direction) away from the moving body 5 at the end opposite to the linear guide mechanism 3. As described above, the heat transfer body 6 is formed such that its cross-sectional shape viewed from the X direction is L-shaped. Note that the bent portion 61 may extend while being inclined with respect to the Y direction. Further, the heat transfer body 6 may have a heat shielding portion 62 that blocks radiant heat from the mover 41 at the end on the linear guide mechanism 3 side.

[0023] The heat transfer element 6 is preferably made of a material with high thermal conductivity, such as aluminum or copper. This allows for efficient transfer of heat from the movable element 41 to the heat transfer element 6, and also allows the heat transferred from the movable element 41 to be dissipated into the atmosphere. The heat transfer element 6 may also be equipped with heat dissipation fins. This increases the heat dissipation area and improves the heat dissipation efficiency of the heat transfer element 6. In addition, a support portion may be provided on a part of the heat transfer element 6 (for example, the bent portion 61) to support one side of the power supply cable 9. The other side of the power supply cable 9 is fixed to a support portion 43 provided on the upper surface of the linear motor 4, for example.

[0024] The spacer 7 is formed, for example, in a cylindrical shape. Multiple spacers 7 are arranged between the moving body 5 and the heat transfer element 6 with gaps between them so that a ventilation passage 71 communicating in the X direction is provided. This creates an air layer between the moving body 5 and the heat transfer element 6, suppressing heat transfer between the heat transfer element 6 and the moving body 5. Furthermore, by providing the ventilation passage 71 in the direction in which the moving body 5 moves (X direction), an airflow is generated between the moving body 5 and the heat transfer element 6, which can enhance the heat dissipation effect.

[0025] Furthermore, it is preferable to provide additional ventilation passages that communicate in the Z direction between the multiple spacers 7. This makes it easier for the warmed air around the heat transfer element 6 to flow upward, thereby enhancing the heat dissipation effect of the heat transfer element 6.

[0026] The spacer 7 is preferably made of a material with low thermal conductivity, such as resin or stainless steel. This suppresses heat transfer from the heat transfer element 6 to the moving element 5.

[0027] The position sensor 8 comprises a linear scale 82 and a sensor head 81. The linear scale 82 extends in the X direction substantially parallel to the guide rail 31 and is fixed to the base 2. The sensor head 81 is fixed to the moving body 5 such that its reading section faces the linear scale 82. The reading section of the sensor head 81 acquires position information recorded on the surface of the linear scale 82, thereby obtaining the relative position of the moving body 5 in the X direction with respect to the base 2.

[0028] The control unit (not shown) acquires position information from the sensor head 81 and outputs drive signals (currents) to multiple coils based on the difference between the relative position of the mobile body 5 with respect to the base 2 and the target position of the mobile body 5. When the multiple coils are energized, thrust is applied to the movable element 41, causing the mobile body 5 to move relative to the base 2 in the X direction.

[0029] In this embodiment, the movable element 41 is positioned away from the linear guide mechanism 3. That is, the movable element 41 is positioned not constrained by the space enclosed by the moving body 5, the guide rail 31, and the slider 32. Therefore, the heat transfer body 6 connected to the movable element 41 can be positioned extending away from the linear guide mechanism 3 (in the Z direction). This allows the heat generated by the movable element 41 to be quickly dissipated through the heat transfer body 6, thereby rapidly lowering the temperature of the movable element 41. As a result, the transfer of heat generated from the movable element 41 to the moving body 5, the guide rail 31, and the slider 32 by radiant heat and convection can be significantly suppressed, preventing thermal deformation of these components and improving the positioning accuracy of the moving body.

[0030] Incidentally, in conventional linear motion devices, as shown in Figures 3(A) and (B), the movable element 41 is positioned in the middle of a pair of guide rails 31. In this case, the center of gravity P1 of the movable part, which consists of the moving body 5, the movable element 41, and the slider 32, is located near the movable element 41 in the Z direction. Therefore, the movable part receives the thrust F generated in the movable element 41 when the linear motor 4 is operating near the center of gravity P1 of the movable part, resulting in a small couple force being generated in the movable part.

[0031] On the other hand, as shown in Figures 4(A) and (B), when the movable element 41 is positioned away from the linear guide mechanism 3 (in the Z direction), the center of gravity P2 of the movable part, which consists of the moving body 5, the movable element 41, and the slider 32, is located away from the movable element 41 in the Z direction. Therefore, the movable part receives the thrust F generated in the movable element 41 when the linear motor 4 is operating at a position away from the center of gravity P1 of the movable part, resulting in a couple being generated in the movable part.

[0032] As shown in Figure 4(A), this couple force N acts on the slider 32 that supports the movable body 5 in a direction other than the direction of movement of the slider 32 (X direction) (mainly the Z direction). Therefore, this couple force N causes elastic deformation of the slider 32 and the rolling elements interposed between the slider 32 and the guide rail 31, and increases the sliding resistance between the guide rail 31 and the slider 32. Furthermore, the direction of this couple force N is reversed depending on the direction of the thrust F, that is, the direction of movement of the movable body 5. As a result, lost motion is increased in the positioning of the movable body 5.

[0033] In contrast, in this embodiment, as shown in Figures 5(A) and (B), the heat transfer body 6, which is connected to the movable element 41 positioned away from the linear guide mechanism 3, is positioned to extend in the direction away from the linear guide mechanism 3 (mainly in the Z direction). Therefore, by adjusting the configuration of the heat transfer body 6, for example, the length of the heat transfer body 6 in the Z direction, the center of gravity P3 of the movable part composed of the moving body 5, the heat transfer body 6, the movable element 41, and the slider 32 can be brought closer to the vicinity of the movable element 41 in the Z direction.

[0034] With this configuration, as shown in Figure 5(A), the thrust F generated in the movable element 41 can be received near the center of gravity P3 of the movable part, thereby reducing the couple N applied to the slider 32. As a result, the elastic deformation of the slider 32 and the rolling elements interposed between the slider 32 and the guide rail 31 is suppressed, and the sliding resistance between the guide rail 31 and the slider 32 is reduced, thereby suppressing lost motion in the positioning of the movable body 5.

[0035] Furthermore, as shown in Figures 6(A) and (B), a bent portion 61 extending in the direction away from the moving body 5 (X direction) may be provided at the end of the heat transfer element 6 opposite to the linear guide mechanism 3. This allows the center of gravity P4 of the movable part, which consists of the moving body 5, the heat transfer element 6, the movable element 41, and the slider 32, to be brought closer to the center of the movable element 41. As a result, the couple force N applied to the slider 32 becomes smaller, and lost motion in positioning the moving body 5 can be further suppressed.

[0036] Furthermore, as shown in Figure 2, when the power supply cable 9 is placed on the bent portion 61 of the heat transfer body 6, it is preferable to adjust the configuration of the heat transfer body 6, including the bent portion 61, so that the center of gravity of the movable part, including the power supply cable 9, approaches the vicinity of the movable element 41. In this case, since the mass of the power supply cable 9 received by the bent portion 61 changes depending on the position of the movable body 5, it is preferable, for example, to determine the center of gravity of the movable part, including the power supply cable 9, at an intermediate position in the stroke of the movable body 5.

[0037] (Modified version of the first embodiment) Figure 7 is a schematic cross-sectional view showing the configuration of the linear motion device 1 in a modified example of the first embodiment. In the linear motion device 1 illustrated in Figure 2, a heat shield 62 is provided at the end of the heat transfer body 6 on the linear guide mechanism 3 side to block radiant heat from the movable element 41. In this modified example, a heat shield material 63 is provided at the end of the heat transfer body 6 on the linear guide mechanism 3 side to block radiant heat from the movable element 41. This suppresses heat transfer by radiation from the movable element 41 to the moving body 5 and the linear guide mechanism 3. The heat shield material 63 is preferably made of a material with low thermal conductivity, such as resin or stainless steel. This reduces the amount of heat transferred from the heat transfer body 6 to the heat shield material 63, and prevents the air near the linear guide mechanism 3 from being heated by the heat shield material 63.

[0038] Furthermore, as shown in Figure 8, a heat shield 10 fixed to the base 2 and blocking radiant heat from the movable element 41 may be provided between the stator 42 and the linear guide mechanism 3. This reduces the amount of heat radiated from the heat transfer element 6 toward the movable body 5 and the linear guide mechanism 3, thereby suppressing heat transfer from the heat transfer element 6 toward the movable body 5 and the linear guide mechanism 3. In addition, since convection in the Z direction with the heat shield 10 as the boundary is suppressed, heat transfer by convection from the movable element 41 and the heat transfer element 6 toward the movable body 5 and the linear guide mechanism 3 is suppressed.

[0039] Furthermore, the surface of the heat transfer element 6 facing the movable element 41 may be coated with a material that absorbs radiant heat from the movable element 41. Examples of materials that promote the absorption of radiant heat include black body paint and anodized aluminum. This increases the amount of radiant heat absorbed by the heat transfer element 6, thereby improving the heat dissipation efficiency of the heat transfer element 6.

[0040] Furthermore, it is preferable that the surface of the heat transfer element 6 facing the moving body 5 be a mirror surface. This reduces the amount of heat radiated from the heat transfer element 6 toward the moving body 5 and the linear guide mechanism 3, thereby suppressing heat transfer from the heat transfer element 6 toward the moving body 5 and the linear guide mechanism 3.

[0041] (Second embodiment) Figures 9 and 10 schematically show the configuration of an electronic component mounting apparatus in a second embodiment of the present invention.

[0042] As shown in Figure 9, the electronic component mounting apparatus in this embodiment is an electronic component mounting apparatus for mounting electronic components onto a substrate, and comprises a linear motion device 1 as in the first embodiment, and a mounting head 101 fixed to the movable body 5 of the linear motion device 1 for mounting electronic components onto the substrate.

[0043] The mounting head 101 includes a suction nozzle 111 and a head drive mechanism 121. The head drive mechanism 121 is provided on the moving body 5 and supports the suction nozzle 111 so as to be movable relative to the moving body 5 in the Z direction. The suction nozzle 111 has a suction hole 112 on its lower surface. By supplying negative or positive pressure to the suction nozzle 111, the suction nozzle 111 performs suction, holding, and release of the component.

[0044] The head drive mechanism 121 consists of a servo motor, a stepping motor, or a linear motor, and moves the suction nozzle 111 relative to the component 501 placed on the component supply stage 201 (described later) and the substrate 502 placed on the substrate supply stage 301 in the Z direction.

[0045] The linear motion device 1 moves the suction nozzle 111 to a position directly above the component supply stage 201 (first position) and a position directly above the substrate supply stage 301 (second position), which will be described later, by moving the movable body 5 along the X direction.

[0046] As shown in Figure 10, the component supply stage 201 includes a stage 202 that supports the component 501 and a stage drive mechanism 203. The component supply stage 201 is positioned such that the upper surface of the stage 202 faces the suction nozzle 111 in a first position. The stage drive mechanism 203 consists of an actuator such as a servo motor, a stepping motor, or a linear motor, and moves the component 501 relative to the mounting head 101 in a rotational direction (Θ direction) with the X, Y, and Z directions as the axes of rotation.

[0047] The substrate supply stage 301 includes a stage 302 that supports the substrate 502, a stage drive mechanism 303, and a mounting position measurement sensor (not shown). The substrate supply stage 301 is positioned such that the upper surface of the stage 302 faces the suction nozzle 111 in a second position. The stage drive mechanism 303 consists of an actuator such as a servo motor, a stepping motor, or a linear motor, and moves the stage 302 relative to the mounting head 101 in the X, Y, and Θ directions.

[0048] The mounting position measurement sensor includes at least one camera or the like. The mounting position measurement sensor measures the relative position and relative angle on the horizontal plane between the component 501 held by the suction nozzle 111 and the substrate 502 placed on the upper surface of the stage 302.

[0049] The head drive mechanism 121 and the stage drive mechanism 203 described above are provided for the purpose of moving the suction nozzle 111 and the component 501 relative to each other in the Z, X, Y, and Θ directions. These relative movements may be performed by either the mounting head 101 or the component supply stage 201, or both. For example, the suction nozzle 111 may be moved relative to a fixed stage 202 in the Z, X, Y, and Θ directions.

[0050] The same applies to the head drive mechanism 121 and the stage drive mechanism 303; the relative movement of the suction nozzle 111 and the substrate 502 may be performed by either the mounting head 101, the substrate supply stage 301, or both.

[0051] Next, the mounting operation of the electronic component mounting device in this embodiment will be described.

[0052] The control unit (not shown) drives the linear motion device 1 and the stage drive mechanism 203, causing the suction nozzle 111 to move to a first position and the part 501 to move directly below the suction nozzle 111. The control unit also drives the head drive mechanism 121, causing the suction nozzle 111 to move downward. The movement of the suction nozzle 111 is stopped when the upper surface of the part 501 and the lower surface of the suction nozzle 111 are at a predetermined distance from each other, or when the upper surface of the part 501 and the lower surface of the suction nozzle 111 come into contact. By supplying negative pressure to the suction hole 112, the suction nozzle 111 holds the part 501 by suction. By driving the head drive mechanism 121, the suction nozzle 111 moves upward by a predetermined amount while holding the part 501. By driving the linear motion device 1 and the stage drive mechanism 303, the suction nozzle 111 moves to a second position while holding the part 501 by suction, and the substrate 502 moves directly below the suction nozzle 111.

[0053] Based on the relative position and relative angle between the component 501 and the substrate 502 on the horizontal plane, obtained from the mounting position measurement sensor, the stage drive mechanism 303 is driven to move the substrate 502 to a predetermined mounting position and mounting angle. By driving the head drive mechanism 121, the suction nozzle 111 moves downward while holding the component 501. When the upper surface of the substrate 502 and the lower surface of the component 501 are at a predetermined distance, or when the upper surface of the substrate 502 and the lower surface of the component 501 come into contact, the movement of the suction nozzle 111 is stopped. By supplying positive pressure to the suction hole 112, the suction nozzle 111 releases the component 501. By driving the head drive mechanism 121, the suction nozzle 111 moves upward by a predetermined amount.

[0054] Through the above operations, component 501 is positioned on the circuit board 502 at its designated mounting location and mounting angle.

[0055] The vertical movement direction of the suction nozzle 111 changes slightly with each mounting operation due to thermal deformation of the components of the linear motion device 1 and the mounting head 101, as well as lost motion of the moving body 5. The component 501 held by the suction nozzle 111 is placed on the substrate 502 by linearly moving the suction nozzle 111 downwards after the component 501 and the substrate 502 have been positioned at the mounting location. Therefore, if the inclination of the vertical movement direction of the suction nozzle 111 is large, the difference between the relative position obtained by the mounting position measurement sensor and the relative position of the component 501 placed on the substrate 502 and the substrate 502 becomes large. In other words, the mounting accuracy of the component 501 on the substrate 502 deteriorates.

[0056] The linear motion device of the present invention can reduce thermal deformation of the components of the linear motion device 1 and the mounting head 101, as well as the lost motion of the moving body 5. Therefore, it can reduce the change in the tilt of the suction nozzle 111 in the vertical movement direction for each mounting operation. Consequently, it is possible to mount components 501 onto the substrate 502 with high precision.

[0057] The present invention has been described above with reference to preferred embodiments, but this description is not limiting, and various modifications are, of course, possible. For example, in the above embodiments, the linear motion device 1 illustrated in Figures 1 and 2 is arranged with the movable element 41 extending in the Y direction (horizontal direction), and the moving body 5 and heat transfer body 6 are arranged with the moving body 5 extending in the Z direction (vertical direction), but is not limited to this, and for example, as shown in Figure 11, the movable element 41 may be arranged with the movable element 41 extending in the Z direction (vertical direction), and the moving body 5 and heat transfer body 6 may be arranged with the moving body 5 extending in the Y direction (horizontal direction). Of course, the movable element 41, moving body 5 and heat transfer body 6 may be arranged in other directions.

[0058] Furthermore, although the above embodiment shows an example of applying the linear motion device 1 to an electronic component mounting device, it is not limited to this and can be applied to any application of transporting, assembling, or positioning components. Alternatively, the linear motion device 1 may be used as a stage drive device in which the moving body 5 is configured as a stage. [Explanation of Symbols]

[0059] 1 Linear motion device 2 bases 3. Linear guide mechanism 4 Linear motor 5 Mobile Unit 6 Heat transfer element 7 Spacers 8 Position Sensor 9 Power supply cable 10 Heat shield 31 Guide rails 32 Sliders 41 Mover 42 Stator 42a Magnet array 42b frame 43 Support part 62 Heat shielding section 63 Heat shield material 71 Ventilation duct 81 Sensor Head 82 Linear Scale 101 Mounting Head 111 Suction Nozzle 112 suction holes 121 Head drive mechanism 201 Parts Supply Stage 202 stages 203 Stage drive mechanism 301 Substrate feeding stage 302 Stages 303 Stage drive mechanism 501 parts 502 circuit board

Claims

1. A linear motion device for moving a moving object in a reference direction, A base extending in the aforementioned reference direction, A linear guide mechanism having a guide rail positioned to the side of the base and extending in the reference direction, and a slider movable along the guide rail, The movable body fixed to the slider, A linear motor having a stator positioned above the base and extending in the reference direction, and a movable element provided with a certain gap between the stator and the movable element, A heat transfer element interposed between the moving body and the movable element above the linear guide mechanism and connected to the moving body and the movable element, Equipped with, The moving body and the heat transfer element are connected via a spacer. The heat transfer element extends in a direction away from the linear guide mechanism, A linear motion device in which the linear motor and the heat transfer body are not facing the linear guide mechanism in a horizontal direction perpendicular to the reference direction.

2. The linear motion device according to claim 1, wherein the movable element is arranged in a direction away from the linear guide mechanism.

3. The linear motion device according to claim 1 or 2, wherein the heat transfer element has a bent portion at the end opposite to the linear guide mechanism that extends away from the moving body.

4. The linear motion device according to any one of claims 1 to 3, wherein heat dissipation fins are provided on the surface of the heat transfer element.

5. The linear motion device according to any one of claims 1 to 4, wherein the heat transfer element has a heat shield at the end on the linear guide mechanism side that blocks radiant heat from the movable element.

6. A linear motion device according to any one of claims 1 to 5, wherein a heat shield is provided between the stator and the linear guide mechanism, fixed to the base and blocking radiant heat from the movable element.

7. The linear motion device according to any one of claims 1 to 6, wherein the surface of the heat transfer body facing the movable element is coated with a material that absorbs radiant heat from the movable element.

8. The linear motion device according to any one of claims 1 to 7, wherein the surface of the heat transfer element facing the moving body is a mirror surface.

9. The spacer consists of two parallel spacers extending in the reference direction. The linear motion device according to claim 1, wherein a ventilation passage communicating in the reference direction is provided between the spacers.

10. The linear motion device according to any one of claims 1 to 9, wherein a part of the heat transfer element has a support portion for supporting a power supply cable connected to the movable element.

11. The spacer consists of a plurality of spacers arranged at intervals from each other in the reference direction. The linear motion device according to claim 1, wherein a ventilation passage communicating in the vertical direction is provided between the spacers.

12. A linear motion device for moving a moving object in a reference direction, A base extending in the aforementioned reference direction, A linear guide mechanism having a guide rail positioned to the side of the base and extending in the reference direction, and a slider supported so as to be movable along the guide rail, The movable body fixed to the slider, A linear motor having a stator positioned above the base and extending in the reference direction, and a movable element provided with a certain gap between the stator and the movable element, A heat transfer element interposed between the moving body and the movable element above the linear guide mechanism and connected to the moving body and the movable element, Equipped with, The heat transfer element extends in a direction away from the linear guide mechanism, A linear motion device wherein a plurality of spacers are arranged between the moving body and the heat transfer body at intervals from each other, and a first ventilation passage communicating in the reference direction and a second ventilation passage communicating in a vertical direction perpendicular to the reference direction are formed between the plurality of spacers.

13. An electronic component mounting apparatus for mounting electronic components onto a circuit board, A linear motion device according to any one of claims 1 to 12, A mounting head fixed to the moving body for mounting the electronic components onto the substrate, An electronic component mounting device equipped with the following features.

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