Inspection lighting device

Abstract

The present invention provides an inspection lighting device that allows for the inspection of articles with a simple configuration and enables a wide range of spacing between the inspection device and the articles. [Solution] This inspection lighting device 1 comprises a housing 2 having an item-side light-passing portion 2a and a camera-side light-passing portion 2b, and a long rigid substrate 3 disposed inside the housing 2, on which a plurality of chip LEDs 30 are arranged in the longitudinal direction and soldered to the surface, and which is bent into an annular shape so that the surface faces inward. The housing 2 has a light-reflecting layer 21 between the periphery of the camera-side light-passing portion 2b and the rigid substrate 3. The surface of the rigid substrate 3 is provided with an anode-side soldering portion 34 to which the anode-side terminal of each of the plurality of chip LEDs 30 is soldered, and a cathode-side soldering portion 35 to which the cathode-side terminal of each is soldered. Each anode-side soldering portion 34 and each cathode-side soldering portion 35 extends parallel to each other in the longitudinal direction of the rigid substrate 3.

Description

[Technical Field]

[0001] The present invention relates to an inspection illumination device that irradiates an article with light from a plurality of LEDs to inspect the article. [Background Art]

[0002] Conventionally, for articles (products) produced in factories, inspection devices have been used to perform inspections (visual inspections for defects, scratches, dirt, foreign matters, etc.) by irradiating articles conveyed by a belt conveyor or the like with light from an inspection illumination device having a plurality of LEDs and photographing the articles with a camera. Various inspection illumination devices are used depending on the article to be inspected, and some of these devices irradiate the article with light from a direction nearly horizontal by making the distance (vertical distance) between the inspection illumination device and the article relatively small.

[0003] For example, Figure 3 of Patent Document 1 discloses an inspection illumination device in which a plurality of bullet-shaped LEDs (light-emitting elements) are arranged inward in an annular shape with a slight inclination toward the article side. This inspection illumination device has a light-reflecting surface inside the LEDs and on the side of the camera (illumination detection device), and irradiates the article with light that travels directly from the LED to the article and light that is reflected by the light-reflecting surface before traveling toward the article. In addition, Figure 4 of the same document discloses an inspection illumination device in which a plurality of bullet-shaped LEDs are arranged inward in an annular shape without inclination toward the article side. This inspection illumination device has no light-reflecting surface, and a diffuser with particularly high diffusion capability is arranged inside the LEDs, and irradiates the article with light traveling from the LEDs through the diffuser toward the article. The inspection illumination devices disclosed in Figure 3 and Figure 4 of the same document are configured such that a component attached to a substantially flat surface is used as the article to be inspected, and the article is irradiated with light from a direction nearly horizontal. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese National Publication of International Patent Application No. 2002-513470 [Summary of the Invention] [Problems that the invention aims to solve]

[0005] However, inspection lighting devices such as those disclosed in Figures 3 and 4 of Patent Document 1 are not simple in their configuration, as the LEDs are slightly tilted toward the object, and a diffuser with particularly high diffusion capability is positioned. Furthermore, the range of distance between the inspection lighting device and the object in which inspection of the object is possible is limited.

[0006] This invention has been made in view of the above, and its purpose is to provide an inspection lighting device that allows for inspection of articles with a simple configuration and can widen the distance between the inspection lighting device and the article. An inspection lighting device that can alleviate stress caused by bending of a rigid substrate. The objective is to provide. [Means for solving the problem]

[0007] To achieve the above objective, an inspection lighting device according to an embodiment of the present invention comprises a housing having an article-side light-passing portion and a camera-side light-passing portion, and a long rigid substrate disposed within the housing, on which a plurality of chip LEDs are arranged in the longitudinal direction and soldered to the surface, and which is bent into an annular shape so that the surface faces inward. ,before The surface of the rigid substrate is provided with an anode-side soldering portion to which the anode terminal of each of the plurality of chip LEDs is soldered, and a cathode-side soldering portion to which the cathode terminal of each of the plurality of chip LEDs is soldered, and each of the anode-side soldering portion and each of the cathode-side soldering portion extends parallel to each other in the longitudinal direction of the rigid substrate. The rigid substrate is provided with a power supply connection section where the positive power supply cord and the negative power supply cord are connected. Yes, they are.

[0008] Alternatively, an inspection lighting device according to an embodiment of the present invention comprises a housing having an article-side light-passing portion and a camera-side light-passing portion, and a long rigid substrate disposed within the housing, on which a plurality of chip LEDs are arranged in the longitudinal direction and soldered to its surface, and which is bent into an annular shape so that the surface faces inward, wherein the surface of the rigid substrate is provided with an anode-side soldering portion to which the anode-side terminal of each of the plurality of chip LEDs is soldered, and a cathode-side soldering portion to which the cathode-side terminal of each of the plurality of chip LEDs is soldered, and the anode-side soldering portion and the cathode-side soldering portion extend parallel to each other in the longitudinal direction of the rigid substrate, and the rigid substrate is provided with a resistor soldering portion to which a resistor is soldered.

[0009] Alternatively, an inspection lighting device according to an embodiment of the present invention comprises a housing having an article-side light-passing portion and a camera-side light-passing portion, and a long rigid substrate disposed within the housing, on which a plurality of chip LEDs are arranged in the longitudinal direction and soldered to its surface, and which is bent into an annular shape so that the surface faces inward, wherein the surface of the rigid substrate is provided with an anode-side soldering portion to which the anode-side terminal of each of the plurality of chip LEDs is soldered, and a cathode-side soldering portion to which the cathode-side terminal of each of the chip LEDs is soldered, and the anode-side soldering portion and the cathode-side soldering portion extend parallel to each other in the longitudinal direction of the rigid substrate, and the housing is made of a metal material or a resin material. .

[0010] The inspection lighting device may further include a heat dissipation sheet that is bent into an annular shape and in contact with the rigid substrate. [Effects of the Invention]

[0011] According to the inspection lighting device of the present invention, This allows for the mitigation of stress caused by bending of the rigid substrate. . [Brief explanation of the drawing]

[0012] [Figure 1A] This is a cross-sectional view (a cross-sectional view at the position indicated by line AA in Figure 1B) showing an inspection lighting device according to an embodiment of the present invention. [Figure 1B] This is a bottom view of the same inspection lighting device, with the housing bottom plate removed. [Figure 2] This is a circuit diagram showing an example of a circuit implemented by the rigid circuit board of the inspection lighting device described above. [Figure 3] This is an external view showing the surface of the rigid substrate before the chip LEDs of the inspection lighting device described above are soldered to it. [Figure 4] This is an explanatory diagram illustrating the light characteristics of the inspection lighting device described above, in a cross-sectional view, and shows the case where the distance between the inspection lighting device and the object is narrow. [Figure 5] This is an explanatory diagram illustrating the light characteristics of the inspection lighting device described above, in a cross-sectional view, and shows the case where there is a wide gap between the inspection lighting device and the object. [Modes for carrying out the invention]

[0013] The following describes embodiments for carrying out the present invention. An inspection lighting device 1 according to an embodiment of the present invention comprises a housing 2 and a rigid substrate 3, as shown in Figures 1A and 1B. The inspection lighting device 1 can be used with an article M to be inspected positioned below and a camera C for photographing the article M positioned above (see Figures 4 and 5 described later). The inspection lighting device 1 has a cable 1a, and the connector 1b of the cable 1a is connected to a dimmer or the like (not shown) for use.

[0014] The housing 2 supports the rigid substrate 3. The housing 2 has an article-side light passage portion 2a through which light passes toward the article M, and has a camera-side light passage portion 2b through which light passes toward the camera C. Specifically, the housing 2 may be configured to include a housing main body portion 2c and a housing bottom plate portion 2d located below the housing main body portion 2c. The article-side light passage portion 2a is formed in the housing bottom plate portion 2d. The housing 2 may be formed in a generally cylindrical shape with a low height. The housing 2 is made of a metal material such as aluminum or copper or a resin material.

[0015] The housing 2 has a light reflecting layer 21 between a peripheral edge of the camera-side light passage portion 2b and the rigid substrate 3. The light reflecting layer 21 reflects light, and is, for example, white or mirror-finished. The light reflecting layer 21 may be formed as a separate member from other portions of the housing 2 and attached thereto, or may be formed by coating the housing 2.

[0016] The rigid substrate 3 is arranged inside the housing 2. The rigid substrate 3 is an elongated member in which a plurality of chip LEDs 30 are arranged in a length direction and soldered to a surface thereof, and is bent into an annular shape such that the surface thereof faces inward (see FIG. 1B). The rigid substrate 3 is thin enough to be bent into an annular shape. As shown in FIG. 1A and FIG. 1B, an annularly bent heat dissipation sheet 4 may be provided around the rigid substrate 3. The heat dissipation sheet 4 may be in contact with the rigid substrate 3. Note that in FIG. 1A and FIG. 1B, reference numeral 30 for LEDs is only assigned to the central LED in FIG. 1A and the left and right LEDs shown in cross-section. In FIG. 1A, as the LEDs 30 are arranged further to the left or right from the center, their side surfaces (surfaces in the thickness direction) become gradually more visible.

[0017] FIG. 2 shows a specific circuit example of the rigid substrate 3. In the example of FIG. 2, the number of chip LEDs 30 soldered to the rigid substrate 3 is 36, and 12 groups of three chip LEDs 30 connected in series are connected in parallel. A resistor 31 is further connected in series to each of the groups of three chip LEDs 30 connected in series. Each group of three chip LEDs 30 connected in series and the resistor 31 is connected to power supply wiring cord connecting portions 32 and 33, to which a positive-side power supply wiring cord 1aa (more specifically, a conductor therein) and a negative-side power supply wiring cord 1ab (more specifically, a conductor therein) included in a cable 1a are respectively connected by soldering or the like. Reference numerals 34 and 35 respectively indicate an anode-side soldering portion to which the anode-side terminal of the chip LED 30 is soldered, and a cathode-side soldering portion to which the cathode-side terminal of the chip LED 30 is soldered; reference numerals 36 and 37 indicate resistor soldering portions to which the two terminals of the resistor 31 are soldered.

[0018] As the rigid substrate 3, for example, a long substrate in which a conductor pattern is formed on the front surface, back surface or the like of a substrate body such as a glass epoxy substrate or a glass composite substrate is used. In the rigid substrate 3, the portion to be soldered (soldering portion) in the conductor pattern is exposed, and portions other than the soldering portion are covered with a solder resist or the like.

[0019] FIG. 3 corresponds to FIG. 2, and shows an example of a specific appearance of the surface of the rigid substrate 3 before the chip LEDs 30 are soldered. In the example of FIG. 3, the conductor patterns on the surface are indicated by broken lines, and the soldering portions are indicated by solid lines.

[0020] On the surface of the rigid substrate 3, there are anode-side soldering areas 34 to which the anode terminal of the chip LED 30 is soldered, and cathode-side soldering areas 35 to which the cathode terminal of the chip LED 30 is soldered, each numbered by the number of chip LEDs 30 (for example, 36). As shown in Figure 3, each anode-side soldering area 34 and cathode-side soldering area 35 extends parallel to each other in the longitudinal direction of the rigid substrate 3 (the direction in which a long rigid substrate 3 extends). In the example in Figure 3, the widths (dimensions perpendicular to the longitudinal direction) of the anode-side soldering areas 34 and cathode-side soldering areas 35 are different, but they may be the same.

[0021] The resistor 31 can be soldered to resistor soldering sections 36 and 37 provided on the back surface of the rigid substrate 3. The power supply wiring cord connection sections 32 and 33 can also be provided on the back surface of the rigid substrate 3. Note that the resistor 31 is omitted in Figures 1A and 1B.

[0022] The rigid substrate 3 is bent along its length after the chip LEDs 30 and other components are soldered to it. At this time, the rigid substrate 3 is bent with a fairly large curvature, but since each of the chip LEDs 30 is soldered to the anode-side soldering portion 34 and cathode-side soldering portion 35 that extend along the length of the rigid substrate 3, the stress caused by bending can be mitigated, and as a result, it can be prevented from cracking.

[0023] The rigid circuit board 3 is ring-shaped, with both ends 3a and 3b joined together and placed inside the housing 2 (see Figure 1B). The positive power supply wiring cord 1aa (more specifically, the conductor within it) and the negative power supply wiring cord 1ab (more specifically, the conductor within it) included in the cable 1a are connected to the power supply wiring cord connection points 32 and 33 by soldering or other means. Note that the positions of the joining of both ends 3a and 3b of the rigid circuit board 3 and the positions of the power supply wiring cord connection points 32 and 33 within the housing 2 are not limited to those shown in Figure 1B.

[0024] In the inspection lighting device 1, when voltage and current are supplied through cable 1a (positive power wiring cord 1aa and negative power wiring cord 1ab), current flows through each chip LED 30, and as shown in Figures 4 and 5, light (schematically shown by dashed lines with arrows in Figures 4 and 5) is emitted from multiple LEDs 30 on the rigid substrate 3 at a predetermined directional angle (angle at which the light spreads) centered on the horizontal direction. The object M located below is illuminated by the light from the chip LEDs 30 that goes directly to the object M through the object-side light-passing section 2a and the light that is reflected by the light-reflecting layer 21 and then goes to the object M through the object-side light-passing section 2a. The reflected light from the object M (schematically shown by dashed lines with arrows in Figures 4 and 5) then passes through the object-side light-passing section 2a and the camera-side light-passing section 2b and enters the camera C located above. In this way, the object M is photographed and inspected by the camera C.

[0025] Here, the inspection lighting device 1 can be easily made highly bright by using chip LEDs 30. Furthermore, since the directional angle of the chip LEDs 30 is generally large, the distance G (see Figures 4 and 5) between the inspection lighting device 1 and the item M, where the item M can be inspected, can be widened by the light directed towards the item M and the light reflected by the light reflection layer 21 before being directed towards the item M. It is possible to make the amount of light emitted from the chip LEDs 30 that directly passes through the camera-side light-transmitting section 2b (and leaks out from there) extremely small.

[0026] Thus, the inspection lighting device 1 has a simple configuration and allows for a wide range of spacing G between the inspection lighting device 1 and the item M, enabling inspection of the item M. Furthermore, the stress on the rigid substrate 3 due to bending can be alleviated. ru.

[0027] Although an inspection lighting device according to an embodiment of the present invention has been described above, the present invention is not limited to those described in the embodiments, and various design modifications are possible within the scope of the claims. [Explanation of Symbols]

[0028] 1. Inspection lighting device 1a Cable 1aa Positive side power wiring cord 1ab Negative power supply wiring cord 1b connector 2 Housing 2a Article side light passage section 2b Camera-side light passage section 2c Housing main body 2D Housing bottom plate 21 Light reflective layer 3 Rigid substrate 30 Chip LEDs 31 Resistors 32, 33 Power wiring cord connection section 34 Anode-side soldering point 35. Cathode side soldering point 36, 37 Resistor soldering points 3a, 3b Edges of the rigid substrate 4. Heat dissipation sheet C Camera G. Distance between the inspection lighting device and the article. M Goods

Claims

1. A housing having an item-side light-passing section and a camera-side light-passing section, A long, rigid substrate is placed inside the housing, with multiple chip LEDs arranged lengthwise and soldered to its surface, and the substrate is bent into a ring shape so that the surface faces inward. Equipped with, The surface of the rigid substrate is provided with an anode-side soldering portion to which the anode terminal of each of the plurality of chip LEDs is soldered, and a cathode-side soldering portion to which the cathode terminal of each of the plurality of chip LEDs is soldered, and each of the anode-side soldering portion and each of the cathode-side soldering portion extends parallel to each other in the longitudinal direction of the rigid substrate. The rigid circuit board is provided with a power wiring cord connection section to which a positive power wiring cord and a negative power wiring cord are connected, for use as an inspection lighting device.

2. A housing having an article-side light-passing portion and a camera-side light-passing portion, A long, rigid substrate is placed inside the housing, with multiple chip LEDs arranged lengthwise and soldered to its surface, and the substrate is bent into a ring shape so that the surface faces inward. Equipped with, The surface of the rigid substrate is provided with an anode-side soldering portion to which the anode terminal of each of the plurality of chip LEDs is soldered, and a cathode-side soldering portion to which the cathode terminal of each of the plurality of chip LEDs is soldered, and each of the anode-side soldering portion and each of the cathode-side soldering portion extends parallel to each other in the longitudinal direction of the rigid substrate. An inspection lighting device having a resistive soldering section on the rigid substrate to which a resistor is soldered.

3. A housing having an article-side light-passing portion and a camera-side light-passing portion, A long, rigid substrate is placed inside the housing, with multiple chip LEDs arranged lengthwise and soldered to its surface, and the substrate is bent into a ring shape so that the surface faces inward. Equipped with, The surface of the rigid substrate is provided with an anode-side soldering portion to which the anode terminal of each of the plurality of chip LEDs is soldered, and a cathode-side soldering portion to which the cathode terminal of each of the plurality of chip LEDs is soldered, and each of the anode-side soldering portion and each of the cathode-side soldering portion extends parallel to each other in the longitudinal direction of the rigid substrate. An inspection lighting device in which metal or resin material is used for the housing.

4. In the inspection lighting device according to any one of claims 1 to 3, An inspection lighting device further comprising a heat dissipation sheet that is bent into an annular shape and in contact with the rigid substrate.

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