Dicing die bond film

Abstract

To provide a dicing die bond film suitable for exhibiting the characteristic that a die-bond layer indicates sufficiently high adhesion to an adhesive layer in an expanding process, and the characteristic that the die-bond layer indicates sufficiently low adhesion to the adhesive layer in a pick-up process.SOLUTION: A dicing die bond film according to the present invention includes a dicing tape in which an adhesive layer is laminated on a base material layer, and a die bond layer laminated on the adhesive layer of the dicing tape, and the adhesive layer and the die bonding layer contain an acrylic polymer as an organic component, a Hansen solubility parameter distance Ra calculated using the Hansen solubility parameter of an acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer is 2 or more and 7 or less, and the value of the hydrogen bond term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer is 8 or less.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a dicing die bond film. [Background technology]

[0002] Conventionally, in the manufacturing of semiconductor devices, it is known that dicing die bond films are used to obtain semiconductor chips for die bonding (for example, Patent Document 1 below). The dicing die bond film comprises a dicing tape having an adhesive layer laminated on a base layer, and a die bond layer that is peelably laminated on the adhesive layer of the dicing tape.

[0003] Furthermore, as a method for obtaining a semiconductor chip (die) for die bonding using the dicing die bond film, Patent Document 1 below describes a method comprising: a half-cut step of forming grooves in a semiconductor wafer in order to process the semiconductor wafer into a chip (die) by a cleavage process; a back-grind step of grinding the semiconductor wafer after the half-cut step to reduce its thickness; a mount step of attaching one side of the semiconductor wafer after the back-grind step (for example, the side opposite to the circuit side) to the die bond layer and fixing the semiconductor wafer to the dicing tape; an expand step of widening the spacing between the half-cut semiconductor chips; a kerf-maintaining step of maintaining the spacing between the semiconductor chips; a pick-up step of peeling the die bond layer and the adhesive layer apart to remove the semiconductor chip with the die bond layer attached; and a die-bond step of bonding the semiconductor chip with the die bond layer attached to an adherend (for example, a mounting substrate).

[0004] By the way, when obtaining a semiconductor chip for die bonding using the above method, the dicing die bond film is required to have different characteristics in the expansion process and the pickup process. Specifically, in the expanding step, the property of suppressing peeling of the die-bond layer from the pressure-sensitive adhesive layer during the step by sufficiently enhancing the adhesiveness of the die-bond layer to the pressure-sensitive adhesive layer is required, whereas in the pickup step, the property of easily recovering the semiconductor chip with the die-bond layer attached thereto by sufficiently reducing the adhesiveness of the die-bond layer to the pressure-sensitive adhesive layer is required.

[0005] In Patent Document 1 below, from the viewpoint of easily recovering a semiconductor chip having a die-bond layer attached thereto in a pickup step, as the dicing die-bond film, the contact surface of the die-bond layer with the pressure-sensitive adhesive layer and the contact surface of the pressure-sensitive adhesive layer with the die-bond layer have a surface energy of 3.5 mJ / m 2 It is described that a material capable of generating the above difference in surface free energy is adopted. That is, Patent Document 1 below describes that, in the case of obtaining a semiconductor chip for die bonding, one of the two aforementioned different properties required for the dicing die-bond film is sufficiently exhibited.

Prior Art Document

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0007] However, when obtaining a semiconductor chip for die bonding, it cannot be said that sufficient studies have been conducted on a dicing die-bond film suitable for exhibiting both of the two aforementioned different properties.

[0008] Therefore, the object of the present invention is to provide a dicing die bond film that exhibits the characteristic of the die bond layer showing sufficiently high adhesion to the adhesive layer in the expanding process, and the characteristic of the die bond layer showing sufficiently low adhesion to the adhesive layer in the pick-up process. [Means for solving the problem]

[0009] Through diligent research, the inventors have found that, in a dicing die bond film configured as described above, by including an acrylic polymer as an organic component in both the adhesive layer and the die bond layer, setting the Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer, within a predetermined numerical range, and further setting the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer within a predetermined numerical range, the dicing die bond film becomes suitable for exhibiting both of the above-mentioned different properties. And that led me to conceive of the present invention.

[0010] In other words, the dicing die bond film according to the present invention is A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises a die bond layer laminated on the adhesive layer of the dicing tape, The adhesive layer and the die bond layer contain an acrylic polymer as an organic component. The Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer, is between 2 and 7. The value of the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer is 8 or less.

[0011] With this configuration, the dicing die bond film is suitable for exhibiting the characteristic that the die bond layer exhibits sufficiently high adhesion to the adhesive layer in the expand process, and the characteristic that the die bond layer exhibits sufficiently low adhesion to the adhesive layer in the pick-up process.

[0012] In the dicing die bond film, It is preferable that the value of the polarity term of the Hansen solubility parameter of the acrylic polymer contained in the die bond layer is 5.8 or higher.

[0013] With this configuration, the dicing die bond film becomes even more suitable by exhibiting the characteristic that the die bond layer exhibits sufficiently high adhesion to the adhesive layer in the expand process, and the characteristic that the die bond layer exhibits sufficiently low adhesion to the adhesive layer in the pick-up process.

[0014] In the dicing die bond film, Preferably, the elongation at break of the die bond layer at -15°C is 0.01% or more and 30% or less.

[0015] With this configuration, the die bond layer is more likely to exhibit sufficiently high adhesion to the adhesive layer during the expansion process.

[0016] In the dicing die bond film, Preferably, the acrylic polymer contained in the die bond layer has a mass-average molecular weight of 200,000 or less.

[0017] With this configuration, the die bond layer is more likely to exhibit sufficiently high adhesion to the adhesive layer during the expansion process.

[0018] In the dicing die bond film, The acrylic polymer contained in the die bond layer preferably contains 12 mol% or more of structural units derived from acrylonitrile.

[0019] With this configuration, the die bond layer is more likely to exhibit sufficiently high adhesion to the adhesive layer during the expansion process.

[0020] In the dicing die bond film, The die bond layer contains organic components other than the acrylic polymer, In the die bond layer, it is preferable that the mass ratio of the acrylic polymer to the total organic components is 10% by mass or more.

[0021] With this configuration, the die bond layer is more likely to exhibit sufficiently low adhesion to the adhesive layer during the pickup process. [Effects of the Invention]

[0022] According to the present invention, it is possible to provide a dicing die bond film that exhibits the characteristic of the die bond layer showing sufficiently high adhesion to the adhesive layer in the expanding process, and the characteristic of the die bond layer showing sufficiently low adhesion to the adhesive layer in the picking process. [Brief explanation of the drawing]

[0023] [Figure 1] A cross-sectional view showing the structure of a dicing die bond film according to one embodiment of the present invention. [Figure 2A] A schematic cross-sectional view illustrating the half-cutting process in the manufacturing method of semiconductor integrated circuits. [Figure 2B] A schematic cross-sectional view illustrating the half-cutting process in the manufacturing method of semiconductor integrated circuits. [Figure 2C] A schematic cross-sectional view illustrating the backgrinding process in the manufacturing method of semiconductor integrated circuits. [Figure 2D]A schematic cross-sectional view illustrating the backgrinding process in the manufacturing method of semiconductor integrated circuits. [Figure 3A] A schematic cross-sectional view illustrating the mounting process in the manufacturing method of semiconductor integrated circuits. [Figure 3B] A schematic cross-sectional view illustrating the mounting process in the manufacturing method of semiconductor integrated circuits. [Figure 4A] A schematic cross-sectional view illustrating the low-temperature expansion process in the manufacturing method of semiconductor integrated circuits. [Figure 4B] A schematic cross-sectional view illustrating the low-temperature expansion process in the manufacturing method of semiconductor integrated circuits. [Figure 4C] A schematic cross-sectional view illustrating the low-temperature expansion process in the manufacturing method of semiconductor integrated circuits. [Figure 5A] A schematic cross-sectional view illustrating the expansion process at room temperature in the manufacturing method of semiconductor integrated circuits. [Figure 5B] A schematic cross-sectional view illustrating the expansion process at room temperature in the manufacturing method of semiconductor integrated circuits. [Figure 6] A schematic cross-sectional view illustrating the kerf maintenance process in the manufacturing method of semiconductor integrated circuits. [Figure 7] A schematic cross-sectional view illustrating the pickup process in the manufacturing method of semiconductor integrated circuits. [Modes for carrying out the invention]

[0024] The following describes one embodiment of the present invention.

[0025] [Dicing die bond film] As shown in Figure 1, the dicing die bond film 20 according to this embodiment comprises a dicing tape 10 in which an adhesive layer 2 is laminated on a base layer 1, and a die bond layer 3 laminated on the adhesive layer 2 of the dicing tape 10. In the dicing die bond film 20 according to this embodiment, the adhesive layer 2 and the die bond layer 3 contain an acrylic polymer as an organic component. In the dicing die bond film 20, a semiconductor wafer is attached to the die bond layer 3. In the dicing die bond film 20, the die bond layer 3 is cleaved along with the semiconductor wafer. The die bond layer 3 is cleaved into pieces corresponding to the size of multiple individual semiconductor chips. This makes it possible to obtain semiconductor chips with the die bond layer 3 attached.

[0026] In this embodiment, the dicing die bond film 20 has a Hansen solubility parameter distance Ra of 2 or more and 7 or less, calculated using the Hansen solubility parameter of the acrylic polymer (hereinafter also referred to as the first acrylic polymer) contained in the adhesive layer 2 and the Hansen solubility parameter of the acrylic polymer (hereinafter also referred to as the second acrylic polymer) contained in the die bond layer 3. In this embodiment, the dicing die bond film 20 has a value of 8 or less for the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer (first acrylic polymer) contained in the adhesive layer 2.

[0027] The Hansen solubility parameter is obtained by dividing the Hildebrand solubility parameter into three components: a dispersion term, a polarity term, and a hydrogen bonding term. These three components can be represented using three-dimensional coordinates. In the dicing die bond film 20 according to this embodiment, the Hansen solubility parameter of the first acrylic polymer is set to a three-dimensional coordinate (δ dA , δ pA , δ hA The Hansen solubility parameter of the second acrylic polymer is expressed in three-dimensional coordinates (δ). dD , δ pD , δ hD When expressed as ), the Hansen solubility parameter distance Ra is calculated using the following formula (1).

[0028]

number

[0029] Further, in the dicing die bond film 20 according to the present embodiment, when evaluating the mutual solubility (compatibility) of the first acrylic polymer and the second acrylic polymer, if the three-dimensional coordinates of the first acrylic polymer and the three-dimensional coordinates of the second acrylic polymer are in a close positional relationship, it is determined that the compatibility is high; if the three-dimensional coordinates of the first acrylic polymer and the three-dimensional coordinates of the second acrylic polymer are in a distant positional relationship, it is determined that the compatibility is low. That is, the smaller the value of the Hansen solubility parameter distance Ra calculated using the above formula (1), the higher the compatibility between the first acrylic polymer and the second acrylic polymer is determined to be, and the larger the value of Ra, the lower the compatibility between the first acrylic polymer and the second acrylic polymer is determined to be. Note that the dispersion term is a term related to van der Waals force, the polar term is a term related to dipole moment, and the hydrogen bonding term is a term related to hydrogen bonding.

[0030] In the first acrylic polymer, the dispersion term δ dA , the polar term δ pA , and the hydrogen bonding term δ hA , and in the second acrylic polymer, the dispersion term δ dD , the polar term δ pD , and the hydrogen bonding term δ hD can be derived, for example, by simulation. Derivation of each of the above parameters by simulation can be carried out as follows. (1) Create Smiles (simplified molecular weight input line entry system) notation for polymer units formed by polymerizing each monomer used in the polymerization of the first acrylic polymer and the second acrylic polymer. Here, if the polymer unit formed by polymerizing monomers is a polymer unit formed by polymerizing styrene, then according to Smiles notation, it is written as XCC(C1=CC=CC=C1)X. Note that the X's at both ends are dummy atoms. (2) Using the Windows software "HSPiP ver.4" (the main program and license file can be purchased by accessing https: / / www.hansen-solubility.com / ), the dispersion term, polarity term, and hydrogen bonding term are calculated for each polymer unit. Furthermore, the molar ratio of each polymer unit in the first acrylic polymer and the molar ratio of each polymer unit in the second acrylic polymer are calculated, respectively. (3) For the first acrylic polymer and the second acrylic polymer, the dispersion term, polar term, and hydrogen bonding term for each polymer unit are multiplied by the molar ratio of each polymer unit, and then these are added together. This yields dispersion terms, polar terms, and hydrogen bonding terms for the polymerization reaction products, namely the first acrylic polymer and the second acrylic polymer. That is, for the first acrylic polymer, the dispersion term δ dA , polar term δ pA , and the hydrogen bond term δ hA As a result, for the second acrylic polymer, the dispersion term δ dD , polar term δ pD , and the hydrogen bond term δ hD To obtain.

[0031] Furthermore, if the individual polymer units constituting the first acrylic polymer contained in the adhesive layer 2 and the second acrylic polymer contained in the die bond layer 3 are not known, the molar ratios of each polymer unit in the first acrylic polymer and the molar ratios of each polymer unit in the second acrylic polymer can be determined as follows. Specifically, a sample partially taken from the adhesive layer 2 is used as the analytical sample. After subjecting the analytical sample to high-temperature methanol decomposition treatment (hydrolysis treatment), GC / MS analysis is performed on the resulting decomposition products. In addition, the analytical sample that has not undergone decomposition treatment is subjected to either total nitrogen (TN) analysis or CHN elemental analysis to estimate each polymer unit in the first acrylic polymer. If the amount of nitrogen contained in the analytical sample is less than 0.5% by mass, the amount of nitrogen can be quantified by TN analysis. If the amount of nitrogen contained in the analytical sample is 0.5% by mass or more, the amount of nitrogen can be quantified by CHN elemental analysis. Furthermore, the decomposition products obtained from the die bond layer 3 in the same manner as described above can be subjected to GC / MS analysis, and the untreated analytical samples can be subjected to either TN analysis or CHN analysis to estimate each polymer unit in the second acrylic polymer. The above combination of GC / MS analysis and TN analysis is particularly suitable when the first acrylic polymer and the second acrylic polymer are composed of AN, AA, EA, and BA. As described above, if the first acrylic polymer contained in the adhesive layer 2 is composed of AN, AA, EA, and BA, GC / MS analysis can be performed by taking a 10 mg sample from the adhesive layer 2 as the sample for GC / MS analysis, and then performing high-temperature methanol decomposition (hydrolysis) of the GC / MS analysis sample to obtain the decomposition product using the conditions shown in Table 1 below. Furthermore, the GC / MS analysis described above quantifies the amounts of ethanol and butanol. Furthermore, TN analysis can be performed by taking several mg of the TN analysis sample from the adhesive layer 2, placing it on a ceramic board, weighing it with a microbalance, and then applying the conditions shown in Table 2 below to the TN analysis sample. Furthermore, if the nitrogen content is to be quantified by CHN elemental analysis instead of TN analysis, the CHN elemental analysis can be performed by sealing a sample of CHN elemental analysis, taken from several mg to several tens of mg from the adhesive layer 2, in tin foil, and then applying the conditions shown in Table 3 below to the CHN elemental analysis sample. Furthermore, since the analytical method differs depending on the polymer composition, it is not necessarily required to perform the analysis of the analytical sample taken from the adhesive layer 2 (hereinafter also referred to as the first analytical sample) and the analytical sample taken from the die bond layer 3 (hereinafter also referred to as the second analytical sample) using a combination of GC / MS analysis and TN analysis, or a combination of GC / MS analysis and CHN elemental analysis. 13 C-NMR analysis, 1 The first and second analytical samples can be analyzed by methods such as H-NMR analysis and FT-IR analysis.

[0032] [Table 1]

[0033] [Table 2]

[0034] [Table 3]

[0035] The dispersion term δ in the first acrylic polymer obtained as described above dA , polar term δ pA , and the hydrogen bond term δ hA , and the dispersion term δ in the second acrylic polymer. dD , polar term δ pD , and the hydrogen bond term δhD By substituting this into equation (1) above, the Hansen solubility parameter distance Ra can be calculated.

[0036] As described above, when evaluating the compatibility of the first acrylic polymer and the second acrylic polymer, a smaller value of the Hansen solubility parameter distance Ra indicates higher compatibility between the first acrylic polymer and the second acrylic polymer, while a larger value of Ra indicates lower compatibility between the first acrylic polymer and the second acrylic polymer. Therefore, when the value of the Hansen solubility parameter distance Ra calculated from the above formula (1) becomes smaller, the affinity between the adhesive layer 2 and the die bond layer 3 increases, and the adhesion of the die bond layer 3 to the adhesive layer 2 increases. Conversely, when the value of the Hansen solubility parameter distance Ra increases, the affinity between the adhesive layer 2 and the die bond layer 3 decreases, and the adhesion of the die bond layer 3 to the adhesive layer 2 decreases.

[0037] Furthermore, some adhesive bonding mechanisms involve chemical interactions, and these chemical interactions originate from covalent bonds and hydrogen bonds. Therefore, when hydrogen bonds are strongly formed in an adhesive, the adhesive adheres firmly to the object to be adhered. Here, in the dicing die bond film 20 according to this embodiment, the hydrogen bonding term δ of the first acrylic polymer hA As the value of increases, the adhesive strength derived from hydrogen bonding in the adhesive layer 2 also increases, which can lead to excessive adhesion of the adhesive layer 2 to the die bond layer 3.

[0038] In the dicing die bond film 20 according to this embodiment, the Hansen solubility parameter distance Ra calculated from the above formula (1) is set to a range of 2 to 7, and furthermore, the hydrogen bonding term δ of the Hansen solubility parameter of the first acrylic polymer (acrylic polymer contained in the adhesive layer 2) is set. hASince the value is set to a range of 8 or less, the adhesion of the die bond layer 3 to the adhesive layer 2 is appropriately controlled so that the above-mentioned problems do not occur, that is, so that the adhesion of the die bond layer 3 to the adhesive layer 2 does not become too high or too low. Therefore, the dicing die bond film 20 according to this embodiment is suitable for exhibiting the characteristic that the die bond layer 3 exhibits sufficiently high adhesion to the adhesive layer 2 in the expand process, and the characteristic that the die bond layer 3 exhibits sufficiently low adhesion to the adhesive layer 2 in the pick-up process.

[0039] As described above, the dicing die bond film 20 according to this embodiment is used by attaching a semiconductor wafer to the die bond layer 3, but the Hansen solubility parameter distance Ra before attachment to the semiconductor wafer (i.e., before the mounting process described later) may be 2 or more and 7 or less. Furthermore, the dicing die bond film 20 according to this embodiment may have a Hansen solubility parameter distance Ra of 2 or more and 7 or less after it has been attached to the semiconductor wafer and before the semiconductor chip with the die bond layer is recovered (i.e., during the mounting process, expanding process, and kerf maintenance process described later). Furthermore, if the adhesive layer 2 contains a radiation-curing adhesive described later, the dicing die bond film 20 according to this embodiment may have a Hansen solubility parameter distance Ra of 2 or more and 7 or less after being attached to the semiconductor wafer but before irradiation with radiation. Furthermore, as will be described later, if the adhesive layer 2 contains a radiation-curable adhesive, the dicing die bond film 20 according to this embodiment may have a Hansen solubility parameter distance Ra exceeding 7 after irradiation with radiation. This results in a relatively low affinity between the adhesive layer 2 and the die bond layer 3, making it easier to recover the semiconductor chip with the die bond layer 3 attached in the pickup process described later.

[0040] In the dicing die bond film 20 according to this embodiment, the polarity term δ of the Hansen solubility parameter of the acrylic polymer (second acrylic polymer) contained in the die bond layer 3 pD The value of is preferably 5.8 or higher, more preferably 6.0 or higher, and even more preferably 6.6 or higher. polarity term δ pD As the numerical range described above is maintained, the dicing die bond film 20 according to this embodiment becomes even more suitable by exhibiting the characteristic that the die bond layer 3 exhibits sufficiently high adhesion to the adhesive layer 2 in the expand process, and the characteristic that the die bond layer 3 exhibits sufficiently low adhesion to the adhesive layer 2 in the pick-up process. Furthermore, the polarity term δ of the Hansen solubility parameter of the second acrylic polymer pD The value of is preferably 10 or less, and more preferably 9 or less.

[0041] In the dicing die bond film 20 according to this embodiment, the hydrogen bonding term δ of the Hansen solubility parameter of the acrylic polymer (second acrylic polymer) contained in the die bond layer 3 is hD The value of is preferably 6.5 or less, and more preferably 5.5 or less. Hydrogen bond term δ hD By having the values ​​within the above range, the die bond layer 3 can be made to have appropriate peelability. Note that the hydrogen bond term δ hD The lower limit is usually set at 2.0.

[0042] In the dicing die bond film 20 according to this embodiment, it is preferable that the elongation at break of the die bond layer 3 at -15°C is 0.01% or more and 30% or less. This makes it easier for the die bond layer 3 to exhibit sufficiently high adhesion to the adhesive layer 2 during the expansion process. The elongation at break of the die bond layer 3 at -15°C is more preferably 0.05% or higher, and even more preferably 0.1% or higher. Furthermore, the elongation at break of the die bond layer 3 at -15°C is more preferably 10% or less, and even more preferably 3% or less.

[0043] The elongation at break at -15°C can be determined as follows. For details, a die-bond film (die-bond layer) with a length of 40 mm (measurement length, L0) and a width of 10 mm is used as the test specimen. Using a tensile testing machine (RSA-G2, manufactured by TA Instruments), the specimen is pulled in the longitudinal direction under the conditions of a temperature of -15°C, a chuck distance of 20 mm, and a tensile speed of 60 mm / min, and the length (L1) at which the specimen breaks is measured. Then, the elongation at break E at -15°C is calculated based on the following formula. Elongation at break E = (L1 - L0) / L0 × 100 The die bond film (die bond layer) can be obtained by peeling the die bond layer 3 from the dicing die bond film 20.

[0044] In the dicing die bond film 20 according to this embodiment, the adhesive layer 2 is adhesive and holds the die bond layer 3 by adhering to it. In the dicing die bond film 20 according to this embodiment, the adhesive layer 2 contains an organic component, and this organic component includes an acrylic polymer. In the dicing die bond film 20 according to this embodiment, the adhesive layer 2 may contain organic components other than the acrylic polymer. Examples of organic components other than the acrylic polymer mentioned above include photopolymerization initiators, which will be discussed later. In this specification, an acrylic polymer is a polymer containing (meth)acrylate monomer as a constituent unit. (Meth)acrylate is a concept that includes methacrylate and acrylate. In specifying the claims, The aforementioned acrylic polymer may contain monomers other than (meth)acrylate monomers as constituent units.

[0045] The adhesive layer 2 preferably contains 50% by mass or more of the acrylic polymer, more preferably 70% or more, and even more preferably 80% by mass or more. Furthermore, the adhesive layer 2 preferably contains 95% by mass or less of the acrylic polymer, and more preferably contains 90% by mass or less.

[0046] The acrylic polymer is preferably an ultraviolet-curable polymer (polymerizable acrylic polymer) having polymerizable unsaturated bonds. Examples of polymerizable polymers include polymers containing polymerizable vinyl groups or ethynyl groups at the ends of the main chain or side chains. In the following, polymerizable vinyl groups or ethynyl groups will be collectively referred to as polymerizable groups. Polymerizable acrylic polymers can be obtained by copolymerizing (meth)acrylate monomers with polymerizable monomers.

[0047] In the acrylic polymer contained in the adhesive layer 2, the above-mentioned constituent units are, 1 H-NMR, 13 This can be confirmed by NMR analysis such as 13C-NMR, pyrolysis GC / MS analysis, and infrared spectroscopy (e.g., FTIR). The molar ratio of the above-mentioned constituent units in the acrylic polymer is usually calculated from the blending amount (starting amount) when polymerizing the acrylic polymer.

[0048] In this embodiment, it is preferable that the acrylic polymer contains alkyl (meth)acrylate constituent units. The constituent units of the alkyl (meth)acrylate are derived from alkyl (meth)acrylate monomers. In other words, the structure of the alkyl (meth)acrylate monomer after polymerization is the constituent unit of the alkyl (meth)acrylate. In the constituent units of the alkyl (meth)acrylate, the alkyl may be a saturated hydrocarbon or an unsaturated hydrocarbon. For example, the alkyl group may be a linear saturated hydrocarbon, a branched saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. Preferably, the alkyl group is a linear saturated hydrocarbon or a branched saturated hydrocarbon. Furthermore, the alkyl group may contain polar groups such as oxygen or nitrogen.

[0049] Examples of constituent units for the alkyl(meth)acrylate include ethyl(meth)acrylate, butyl(meth)acrylate, hexyl(meth)acrylate, heptyl(meth)acrylate, n-octyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, isooctyl(meth)acrylate, n-nonyl(meth)acrylate, iso(sec)-nonyl(meth)acrylate, tert-nonyl(meth)acrylate, isobornyl(meth)acrylate, n-decyl(meth)acrylate, iso(sec)-decyl(meth)acrylate, tert-decyl(meth)acrylate, n-undecyl(meth)acrylate, iso(sec)-undecyl(meth)acrylate, tert-undecyl(meth)acrylate, and lauryl(meth)acrylate.

[0050] In this embodiment, the acrylic polymer preferably contains alkyl (meth)acrylate having an alkyl group having 9 or more carbon atoms as a constituent unit, and more preferably contains alkyl (meth)acrylate having an alkyl group having 12 or more carbon atoms as a constituent unit. In this embodiment, it is preferable that the acrylic polymer contains 13 mol% or more of alkyl (meth)acrylate constituent units having an alkyl group with 9 or more carbon atoms. In this embodiment, the acrylic polymer more preferably contains 30 mol% or more of alkyl (meth)acrylate constituent units having an alkyl group with 9 or more carbon atoms, and even more preferably contains 40 mol% or more. In this embodiment, the acrylic polymer preferably contains 80 mol% or less of alkyl (meth)acrylate constituent units having an alkyl group with 9 or more carbon atoms. In this embodiment, it is preferable that the acrylic polymer contains 15 mol% or more of alkyl (meth)acrylate constituent units having an alkyl group with 12 or more carbon atoms. In this embodiment, the acrylic polymer preferably contains 30 mol% or more of alkyl (meth)acrylate constituent units having an alkyl group with 12 or more carbon atoms, and more preferably 40 mol% or more. In this embodiment, the acrylic polymer preferably contains 80 mol% or less of alkyl (meth)acrylate constituent units having an alkyl group with 12 or more carbon atoms. Because the acrylic polymer is as described above, the peeling force of the adhesive layer 2 from the die bond layer 3 can be further reduced when peeling the die bond layer 3 from the adhesive layer 2. This allows the pickup process to be carried out even more smoothly. Furthermore, the upper limit for the number of carbon atoms in the constituent unit of the alkyl (meth)acrylate is 18.

[0051] In this embodiment, it is preferable that the acrylic polymer is composed of alkyl (meth)acrylate structural units and hydroxyl group-containing (meth)acrylate structural units. When the acrylic polymer is configured in this manner, it is preferable that the constituent units of the alkyl (meth)acrylate are alkyl (meth)acrylate constituent units having an alkyl group with 9 to 14 carbon atoms. In the acrylic polymer configured in this way, the constituent units of alkyl(meth)acrylate having an alkyl group with 9 to 14 carbon atoms are preferably present in an amount of 15 mol% or more, more preferably 30 mol% or more, and even more preferably 40 mol% or more. In the acrylic polymer constructed in this manner, it is preferable that the constituent units of alkyl (meth)acrylate having an alkyl group with 9 to 14 carbon atoms are present in an amount of 80 mol% or less. In the acrylic polymer constructed in this manner, it is preferable that the constituent units of hydroxyl group-containing (meth)acrylate are present in an amount of 10 mol% or more, and more preferably 20 mol% or more. Because the acrylic polymer is as described above, the peeling force of the adhesive layer 2 from the die bond layer 3 can be further reduced when peeling the die bond layer 3 from the adhesive layer 2. This allows the pickup process to be carried out even more smoothly.

[0052] In the hydroxyl group-containing (meth)acrylate constituent unit, the hydroxyl group contained in the constituent unit readily reacts with the isocyanate group. Therefore, by including in the adhesive layer 2 an acrylic polymer composed of the constituent units of alkyl (meth)acrylate and the constituent units of hydroxyl group-containing (meth)acrylate, and also including an isocyanate compound, the hydroxyl groups in the constituent units of the hydroxyl group-containing (meth)acrylate react with the isocyanate groups in the isocyanate compound, thereby allowing the adhesive layer 2 to harden appropriately.

[0053] The constituent units of the hydroxyl group-containing (meth)acrylate are derived from hydroxyl group-containing (meth)acrylate monomers. In other words, the structure of the hydroxyl group-containing (meth)acrylate monomer after polymerization is the constituent unit of the hydroxyl group-containing (meth)acrylate.

[0054] The constituent units of the hydroxyl group-containing (meth)acrylate are preferably the constituent units of a hydroxyl group-containing C2-C4 alkyl (meth)acrylate. In the constituent units of the hydroxyl group-containing C2-C4 alkyl (meth)acrylate, alkyl is usually a saturated hydrocarbon. For example, the alkyl group is a linear saturated hydrocarbon or a branched saturated hydrocarbon. Furthermore, it is preferable that the alkyl group does not contain polar groups such as oxygen or nitrogen. In the constituent units of the hydroxyl group-containing (meth)acrylate, the hydroxyl group may be bonded to any of the alkyl carbons, but it is preferable that it is bonded to the terminal carbon of the alkyl.

[0055] Examples of constituent units of the hydroxyl group-containing (meth)acrylate include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, or hydroxy-n-butyl (meth)acrylate or hydroxy-iso-butyl (meth)acrylate, such as hydroxybutyl (meth)acrylate. Among these hydroxyl group-containing (meth)acrylate constituent units, hydroxyethyl (meth)acrylate constituent units are preferred, and 2-hydroxyethyl (meth)acrylate constituent units are more preferred.

[0056] In this embodiment, it is preferable that the acrylic polymer is composed of alkyl (meth)acrylate constituent units, hydroxyl group-containing (meth)acrylate constituent units, and polymerizable group-containing (meth)acrylate constituent units. Because the acrylic polymer contains polymerizable group-containing (meth)acrylate constituent units, the adhesive layer 2 can be cured by irradiating it with active energy rays (e.g., ultraviolet light) before the pickup process. Specifically, the adhesive layer 2 can be cured by irradiating it with active energy rays (for example, ultraviolet light) to crosslink the acrylic polymers contained within the adhesive layer 2. From the viewpoint of facilitating the crosslinking reaction, it is preferable that the adhesive layer 2 contains a photopolymerization initiator. By containing a photopolymerization initiator in the adhesive layer 2, radicals are generated from the photopolymerization initiator when irradiated with active energy rays (e.g., ultraviolet light), and the action of these radicals can further promote the crosslinking reaction between the acrylic polymers. Thus, when the adhesive layer 2 is cured by irradiation with active energy rays (e.g., ultraviolet light), the adhesive strength of the adhesive layer 2 to the die bond layer 3 decreases. As a result, the semiconductor chip with the die bond layer attached can be easily picked up from the adhesive layer 2. Furthermore, before irradiation with active energy rays (e.g., ultraviolet light), the crosslinking reaction between the acrylic polymers in the adhesive layer 2 has not progressed sufficiently. Therefore, the adhesive layer 2 has sufficient tackiness and can adequately adhere to and hold the die bond layer 3.

[0057] The polymerizable group-containing (meth)acrylate structural units can be formed by bonding monomers having a functional group that can bond to a hydroxyl group and a polymerizable functional group in their molecules to the polymerizable group-containing (meth)acrylate structural units. The functional group that can bond to the hydroxyl group is preferably an isocyanate group that has relatively high reactivity with the hydroxyl group. In such cases, the constituent unit of the polymerizable group-containing (meth)acrylate is preferably one that has an isocyanate group and a polymerizable functional group at both ends of the molecule. Furthermore, the polymerizable functional group is preferably a vinyl group. In such cases, the constituent unit of the polymerizable group-containing (meth)acrylate preferably has an isocyanate group and a vinyl group at both ends of the molecule. Furthermore, the vinyl group may be part of a (meth)acryloyl group. The polymerizable group-containing (meth)acrylate constituent unit may have a molecular structure in which the isocyanate group in the polymerizable group-containing (meth)acrylate constituent unit is urethane-bonded to the hydroxyl group in the hydroxyl group-containing (meth)acrylate constituent unit. In the following, the polymerizable group-containing (meth)acrylate monomer containing an isocyanate group may be referred to as an isocyanate group-containing (meth)acrylate monomer.

[0058] If the acrylic polymer is composed of the alkyl (meth)acrylate constituent units, the hydroxyl group-containing (meth)acrylate constituent units, and the polymerizable group-containing (meth)acrylate constituent units, it can be obtained as follows. Specifically, an acrylic polymer intermediate containing alkyl (meth)acrylate units and hydroxyl group-containing (meth)acrylate units is obtained by polymerizing alkyl (meth)acrylate monomer and hydroxyl group-containing (meth)acrylate monomer. Then, the acrylic polymer is obtained by polymerizing the acrylic polymer intermediate with isocyanate group-containing (meth)acrylate monomer. In other words, the acrylic polymer can be obtained by carrying out the polymerization reaction in two stages. Furthermore, the polymerization reaction between the acrylic polymer intermediate and the isocyanate group-containing (meth)acrylate monomer can be carried out by bonding the hydroxyl group in the acrylic polymer intermediate to the isocyanate group of the isocyanate group-containing (meth)acrylate monomer using urethane bonding.

[0059] The isocyanate group-containing (meth)acrylate monomer preferably has one isocyanate group and one (meth)acryloyl group in its molecule. Examples of such isocyanate group-containing (meth)acrylate monomers include 2-isocyanatoethyl (meth)acrylate and 4-acryloylmorpholine.

[0060] The adhesive layer 2 preferably contains an isocyanate compound. The isocyanate compound may be in a state after a portion has been reacted by a urethane reaction or the like. The isocyanate compound preferably contains multiple isocyanate groups in its molecule. By containing multiple isocyanate groups, if the acrylic polymer has the hydroxyl group-containing (meth)acrylate constituent units, the crosslinking reaction between the acrylic polymers in the adhesive layer 2 can be promoted. Specifically, a crosslinking reaction can be carried out via an isocyanate compound containing multiple isocyanate groups by reacting one isocyanate group of the isocyanate compound with a hydroxyl group of one of the acrylic polymers, and reacting other isocyanate groups of the isocyanate compound with hydroxyl groups of other acrylic polymers. In other words, the isocyanate compound functions as a crosslinking agent.

[0061] The adhesive layer 2 preferably contains the isocyanate compound in an amount of 0.1 parts by mass to 5 parts by mass, more preferably 0.5 parts by mass to 3 parts by mass, and even more preferably 0.75 parts by mass to 2 parts by mass, per 100 parts by mass of the acrylic polymer.

[0062] Examples of the isocyanate compound include diisocyanates such as aliphatic diisocyanates, alicyclic diisocyanates, or aromatic diisocyanates.

[0063] Examples of the aliphatic diisocyanates include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,6-diisocyanatocaproate methyl. Examples of the aforementioned alicyclic diisocyanates include 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane, methylcyclohexane-2,4-diisocyanate, methylcyclohexane-2,6-diisocyanate, dicyclohexanemethane-4,4'-diisocyanate, 1,3-diisocyanatocyclohexane, and 1,4-diisocyanatocyclohexane. Examples of the aforementioned aromatic diisocyanates include m-phenylenediisocyanate, p-phenylenediisocyanate, diphenylmethane-4,4'-diisocyanate, 2,4-tolylenediisocyanate, 2,6-tolylenediisocyanate, 1,3'-bis(isocyanatomethyl)benzene, 1,4'-bis(isocyanatomethyl)benzene, 1,3-bis(α-isocyanatoisopropyl)benzene, and 1,4-(α-isocyanatoisopropyl)benzene.

[0064] Furthermore, triisocyanate is an example of the isocyanate compound. Examples of the aforementioned triisocyanates include triphenylmethane-4,4',4''-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, 1,3,5-tris(isocyanatomethyl)benzene, and 2,6-diisocyanatocaproate-2-isocyanatoethyl. Furthermore, examples of the isocyanate compound include polymerized polyisocyanates such as dimers and trimers of diisocyanates, and polymethylene polyphenylene polyisocyanates.

[0065] Furthermore, examples of the isocyanate compound include polyisocyanates obtained by reacting an excess amount of the above-mentioned isocyanate compound with an active hydrogen-containing compound. Examples of the active hydrogen-containing compounds include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, hexanediol, cyclohexanedimethanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbitol, sucrose, castor oil, ethylenediamine, hexamethylenediamine, diethanolamine, triethanolamine, water, ammonia, and urea. Other examples include various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, and epoxy polyols.

[0066] Furthermore, as the diisocyanate compound, allophanate-modified polyisocyanates, biuret-modified polyisocyanates, and others can also be used. The above-mentioned isocyanate compounds may be used individually or in combination of two or more.

[0067] The isocyanate compound is preferably a reaction product of the aromatic diisocyanate and the active hydrogen-containing compound. Because the reaction rate of the isocyanate group in such reactants is relatively slow, when they are included in the adhesive layer 2, it is possible to suppress excessive curing reaction in the adhesive layer 2. It is preferable to use a reactant that contains three or more isocyanate groups in its molecule.

[0068] As described above, the adhesive layer 2 preferably contains a photopolymerization initiator to facilitate the crosslinking reaction between the acrylic polymers. Examples of the photopolymerization initiators include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphorquinone, halogenated ketones, acylphosphinoxides, and acylphosphonates. Examples of α-ketol compounds include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, and 1-hydroxycyclohexylphenyl ketone. Examples of acetophenone compounds include methoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropan-1-one, and 2-hydroxy-1-(4-(4-(2-hydroxy-2methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one. Examples of benzoin ether compounds include benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether. Examples of ketal compounds include benzyldimethyl ketal compounds. Examples of aromatic sulfonyl chloride compounds include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime compounds include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime. Examples of benzophenone compounds include benzophenone, benzoin benzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. Examples of thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone. Among these, it is preferable to use 2-hydroxy-1-(4-(4-(2-hydroxy-2methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one (commercially available as Omnirad 127 from IGM Resins).

[0069] The adhesive layer 2 preferably contains the photopolymerization initiator in an amount of 0.1 parts by mass or more and 10 parts by mass or less, more preferably 0.5 parts by mass or more and 7 parts by mass or less, and even more preferably 0.75 parts by mass or more and 5 parts by mass or less, per 100 parts by mass of the acrylic polymer.

[0070] The adhesive layer 2 may contain other components besides those described above. Other components mentioned above include plasticizers, fillers, antioxidants, antioxidants, UV absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, and light release agents.

[0071] The thickness of the adhesive layer 2 is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 30 μm or less, and even more preferably 5 μm or more and 25 μm or less. The thickness of the adhesive layer 2 can be determined, for example, by measuring the thickness of five randomly selected points using a dial gauge (PEACOCK, model R-205) and taking the arithmetic mean of these thicknesses.

[0072] The adhesive layer 2 can be obtained by applying an adhesive composition containing the above-mentioned components to a surface such as a resin film using an applicator, and then drying the applied adhesive composition.

[0073] Diebond layer 3 contains organic components. The die bond layer 3 contains an acrylic polymer as the organic component. The die bond layer 3 may contain organic components other than the acrylic polymer. Examples of organic components other than the acrylic polymer include thermosetting resins such as epoxy resins and phenolic resins, which will be described later, and thermoplastic resins that function as binders. The die bond layer 3 preferably has thermosetting properties. The die bond layer 3 becomes thermosetting by using an acrylic polymer having thermosetting functional groups (hereinafter also referred to as a thermosetting functional group-containing acrylic polymer) as the acrylic polymer. The die bond layer 3 also becomes thermosetting by containing a thermosetting resin.

[0074] When the die bond layer 3 contains the thermosetting functional group-containing acrylic polymer, the acrylic polymer in the thermosetting functional group-containing acrylic polymer includes those containing monomer units derived from (meth)acrylic acid ester. In the aforementioned acrylic polymer containing thermosetting functional groups, a curing agent is selected according to the type of thermosetting functional group.

[0075] Examples of (meth)acrylic acid esters include alkyl (meth)acrylates, cycloalkyl (meth)acrylates, and aryl (meth)acrylates. In the dicing die bond film 20 according to this embodiment, the die bond layer 3 preferably contains a copolymer of ethyl acrylate, butyl acrylate, acrylic acid, and acrylonitrile as the acrylic polymer. The acrylic polymer (second acrylic polymer) contained in the die bond layer 3 preferably contains 12 mol% or more of structural units derived from acrylonitrile. This makes it easier for the die bond layer 3 to exhibit sufficiently high adhesion to the adhesive layer 2 in the expansion process described later. The second acrylic polymer more preferably contains 15 mol% or more of acrylonitrile-derived structural units. The second acrylic polymer preferably contains 40 mol% or less of acrylonitrile-derived structural units, and more preferably 35 mol% or less.

[0076] The second acrylic polymer may contain monomer units derived from other components copolymerizable with (meth)acrylic acid esters. Other components mentioned above include, for example, carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, acrylamide, acrylonitrile and other functional group-containing monomers, and various polyfunctional monomers. From the viewpoint of achieving high cohesive force in the die bond layer 3, the acrylic resin is preferably a copolymer of (meth)acrylic acid ester (especially alkyl (meth)acrylic acid ester with 4 or fewer carbon atoms in the alkyl group), carboxyl group-containing monomer, nitrogen atom-containing monomer, and polyfunctional monomer (especially polyglycidyl polyfunctional monomer).

[0077] The acrylic polymer (second acrylic polymer) contained in the die bond layer 3 preferably has a mass-average molecular weight of 200,000 or less. This makes it easier for the die bond layer 3 to exhibit sufficiently high adhesion to the adhesive layer 2 in the expansion process described later. The second acrylic polymer is more preferably 180,000 or less in mass-average molecular weight, and even more preferably 170,000 or less. Furthermore, the second acrylic polymer preferably has a mass-average molecular weight of 50,000 or more, more preferably 70,000 or more, and even more preferably 90,000 or more.

[0078] The mass-average molecular weight of the second acrylic polymer can be measured by GPC under the following conditions. • Measuring device: Waster Corporation, model "Alliance GPC 2000" • Column: Two TSkgel GMH6-HT (manufactured by Tosoh Corporation) are connected in series, and two more TSKgel GMH-HTL are connected in series downstream. • Column size: Both TSKgel GMH6-HT and TSKgel GMH-HTL have an inner diameter of 7.5 mm and a length of 300 mm. Column temperature: 140℃ ·Flow rate: 1.0mL / min • Eluent: o-dichlorobenzene • Sample preparation concentration: 0.10% by mass (dissolved in o-dichlorobenzene) • Sample injection volume: 40 μL • Detector: RI (Differential Refractometer) • Standard sample: Polystyrene

[0079] If the die bond layer 3 contains organic components other than acrylic polymers, it is preferable that the mass ratio of the acrylic polymer to the total organic components in the die bond layer 3 is 10% by mass or more. This makes it easier for the die bond layer 3 to exhibit sufficiently low adhesion to the adhesive layer 2 in the pickup process described later. In the die bond layer 3, the mass ratio of the acrylic polymer to the total organic components is more preferably 20% by mass or more, and even more preferably 30% by mass or more. Furthermore, in the die bond layer 3, the mass ratio of the acrylic polymer to the total organic components is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 60% by mass or less.

[0080] When the die bond layer 3 contains a thermosetting resin, examples of such thermosetting resins include epoxy resins, phenolic resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. Among these, epoxy resin is preferred.

[0081] Examples of epoxy resins include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, orthocresol novolac type, trishydroxyphenylmethane type, tetraphenyloleethane type, hydantoin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resins.

[0082] Examples of phenolic resins include novolac-type phenolic resins, resol-type phenolic resins, and polyoxystyrenes such as polyparaoxystyrene. Furthermore, phenolic resin functions as a curing agent for epoxy resin.

[0083] The die bond layer 3 may contain a thermosetting catalyst (curing accelerator) from the viewpoint of sufficiently advancing the curing reaction of the thermosetting group-containing acrylic polymer or thermosetting resin, or increasing the curing reaction rate. Examples of thermosetting catalysts include imidazole compounds, phosphorus compounds, amine compounds, and trihalogen borane compounds. The die bond layer 3 preferably contains the phosphorus-based compound. Examples of the phosphorus-based compounds include triphenylphosphine (TPP), tri(p-tolyl)phosphine (TPTP), tetraphenylphosphonium tetraphenylborate (TPP-K), tetrabutylphosphonium laurate (TBPLA), and tetrabutylphosphonium hydrogen hexahydronaphthalate (TBS-3S). The die bond layer 3 may contain an imidazole compound as the thermosetting catalyst. Examples of the imidazole compounds include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, and 2,4-diamino- Examples include 6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole.

[0084] The die bond layer 3 may contain a thermoplastic resin as the organic component. The thermoplastic resin functions as a binder. Examples of thermoplastic resins include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resins such as polyamide 6 and polyamide 6,6, phenoxy resin, acrylic polymer, saturated polyester resins such as PET and PBT, polyamide-imide resin, and fluororesin. Only one of the above thermoplastic resins may be used, or two or more may be used in combination. As the above thermoplastic resin, acrylic polymers are preferred because they have few ionic impurities and high heat resistance, which makes it easier to ensure the reliability of the connection by the die bond layer 3. Furthermore, acrylic polymers used as thermoplastic resins are acrylic polymers that do not have thermosetting functional groups.

[0085] The above acrylic polymer is preferably a polymer that contains monomer units derived from (meth)acrylic acid ester as the most abundant monomer unit by mass. As the (meth)acrylic acid ester, the same as those described above can be used.

[0086] The die bond layer 3 may contain one or more other components as needed. Examples of other components include flame retardants, silane coupling agents, and ion trapping agents.

[0087] The die bond layer 3 may contain a filler. By changing the amount of filler contained in the die bond layer 3, the elasticity and viscosity of the die bond layer 3 can be more easily adjusted. Furthermore, the physical properties of the die bond layer 3, such as electrical conductivity, thermal conductivity, and elastic modulus, can be adjusted. Examples of fillers include inorganic fillers and organic fillers. Inorganic fillers are preferred as fillers. Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, and silica such as crystalline silica and amorphous silica. In addition, examples of inorganic filler materials include individual metals such as aluminum, gold, silver, copper, and nickel, as well as alloys. The inorganic filler may be aluminum borate whiskers, amorphous carbon black, graphite, or the like. Among the various fillers mentioned above, silica filler is preferred. The silica filler may have its surface treated with a silane coupling agent such as epoxysilane. The filler may be in various shapes, such as spherical, needle-shaped, or flake-shaped. Among these various shapes, a spherical shape is preferred. As a filler, you may use only one of the above types, or you may use a combination of two or more of the above types.

[0088] The average particle size of the filler is preferably 0.005 μm (5 nm) or more and 10 μm (10000 nm) or less, and more preferably 0.005 μm (5 nm) or more and 1 μm (1000 nm) or less. By having an average particle size of 0.005 μm or more, the wettability and adhesion to substrates such as semiconductor wafers can be further improved. Furthermore, by having an average particle size of 10 μm or less, the properties of the included filler can be more fully exhibited, and the heat resistance of the die bond layer 3 can be further enhanced. The average particle size of the filler can be determined, for example, using a photometric particle size distribution analyzer (e.g., product name "LA-910," manufactured by Horiba, Ltd.).

[0089] If the die bond layer 3 contains filler, its content is preferably 10% to 70% by mass, more preferably 20% to 60% by mass, and even more preferably 30% to 55% by mass, based on the total mass of the die bond layer 3.

[0090] The thickness of the die bond layer 3 is not particularly limited, but for example, it is between 1 μm and 200 μm. Such a thickness may also be between 3 μm and 150 μm, or between 5 μm and 135 μm.

[0091] The die bond layer 3 can be obtained by applying an adhesive composition containing the above-mentioned components to the surface of a resin film or the like using an applicator, and then drying the applied adhesive composition. Furthermore, the attachment of the die bond layer 3 to the adhesive layer 2 can be carried out by laminating the die bond layer 3 onto the adhesive layer 2 prepared as described above.

[0092] The base layer 1 supports the adhesive layer 2. The base layer 1 is made using metal foil, fiber sheet, rubber sheet, or resin film, etc. The base layer 1 is preferably made using a resin film. The base layer 1 may have a single-layer structure or a laminated structure.

[0093] Examples of the aforementioned fiber sheet include those made of paper, woven fabric, or nonwoven fabric.

[0094] Examples of resin film materials include polyolefins such as polyethylene, polypropylene, and ethylene-propylene copolymer; ethylene copolymers such as ethylene-vinyl acetate copolymer, ionomer resin, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester random copolymer, and ethylene-(meth)acrylic acid ester alternating copolymer; polyesters such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; polyacrylate; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide; polyamides such as aliphatic polyamides and fully aromatic polyamides (aramids); polyether ether ketones; polyimides; polyetherimides; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; and fluorine-containing polymers. These may be used individually or in combination of two or more types.

[0095] If the base layer 1 is made of a resin film, the base layer 1 may be obtained by non-stretch molding or by stretch molding, but it is preferable to obtain it by stretch molding.

[0096] The surface of the base material layer 1 on which the adhesive layer 2 is laminated (hereinafter simply referred to as the surface) may be surface-treated to improve adhesion with the adhesive layer 2. Surface treatments may include oxidation treatments using chemical or physical methods such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment. Furthermore, surface treatment may be applied using coating agents such as anchor coating agents, primers, and adhesives.

[0097] The side of the base material layer 1 on which the adhesive layer 2 is not laminated (hereinafter simply referred to as the back surface) may be coated with a release agent such as silicone resin or fluororesin to improve release properties.

[0098] The thickness of the base layer 1 is preferably 55 μm to 195 μm, more preferably 55 μm to 190 μm, even more preferably 55 μm to 170 μm, and optimally 60 μm to 160 μm. By setting the thickness of the base layer 1 within the above range, the dicing tape 10 can be manufactured efficiently. Furthermore, the die bond layer 3 of the dicing die bond film 20 can be efficiently cut. The thickness of the base layer 1 can be determined, for example, by measuring the thickness of five randomly selected points using a dial gauge (PEACOCK, model R-205) and taking the arithmetic mean of these thicknesses.

[0099] The dicing die bond film 20 according to this embodiment is used, for example, as an auxiliary tool for manufacturing semiconductor integrated circuits. Specific examples of the use of the dicing die bond film 20 are described below. The following describes an example using a dicing die bond film 20 in which the base layer 1 is a single layer.

[0100] A method for manufacturing a semiconductor integrated circuit includes a half-cutting step in which grooves are formed in a semiconductor wafer in order to process it into chips (dies) by a cutting process; a back-grinding step in which the semiconductor wafer after the half-cutting step is ground to reduce its thickness; a mounting step in which one side of the semiconductor wafer after the back-grinding step (for example, the side opposite to the circuit side) is attached to a die bond layer 3 and the semiconductor wafer is fixed to a dicing tape 10; an expanding step in which the spacing between the half-cut semiconductor chips is increased; a kerf maintenance step in which the spacing between the semiconductor chips is maintained; a pick-up step in which the die bond layer 3 is peeled off from the die bond layer 3 and the adhesive layer 2 to remove the semiconductor chip (die) with the die bond layer 3 attached; and a die-bonding step in which the semiconductor chip (die) with the die bond layer 3 attached is bonded to a substrate. When carrying out these steps, the dicing tape (dicing die bond film) of this embodiment is used as a manufacturing aid.

[0101] In the half-cutting process, as shown in Figures 2A and 2B, a half-cutting process is performed to cut the semiconductor integrated circuit into small pieces (dies). Specifically, wafer processing tape T is attached to the side of the semiconductor wafer W opposite to the circuit side (see Figure 2A). A dicing ring R is also attached to the wafer processing tape T (see Figure 2A). With the wafer processing tape T attached, grooves for division are formed (see Figure 2B). In the back-grinding process, as shown in Figures 2C and 2D, the semiconductor wafer is ground to reduce its thickness. Specifically, back-grinding tape G is attached to the side with the grooves formed, while the wafer processing tape T that was initially attached is peeled off (see Figure 2C). With the back-grinding tape G attached, the semiconductor wafer W is ground until it reaches a predetermined thickness (see Figure 2D).

[0102] In the mounting process, as shown in Figures 3A and 3B, the dicing ring R is attached to the adhesive layer 2 of the dicing tape 10, and then the half-cut semiconductor wafer W is attached to the exposed die bond layer 3 (see Figure 3A). After that, the backgrind tape G is peeled off from the semiconductor wafer W (see Figure 3B).

[0103] In the expanding process, as shown in Figures 4A to 4C, the dicing ring R is fixed to the holder H of the expanding device. The dicing die bond film 20 is stretched in the planar direction by pushing it up from below using the push-up member U provided by the expanding device (see Figure 4B). This causes the half-cut semiconductor wafer W to be cleaved under specific temperature conditions. The above temperature conditions are, for example, -20 to 5°C, preferably -15 to 0°C, and more preferably -10 to -5°C. The expanded state is released by lowering the push-up member U (see Figure 4C). Furthermore, in the expanding process, as shown in Figures 5A to 5B, the dicing tape 10 is stretched to increase its area under higher temperature conditions (for example, room temperature (23°C)). This pulls the cleaved adjacent semiconductor chips apart in the planar direction of the film surface, further increasing the spacing between them.

[0104] In the kerf maintenance process, as shown in Figure 6, the dicing tape 10 is subjected to hot air (for example, 100-130°C) to cause thermal shrinkage, followed by cooling and solidification to maintain the distance (kerf) between adjacent cleaved semiconductor chips.

[0105] In the pickup process, as shown in Figure 7, the semiconductor chip with the die bond layer 3 attached is peeled off from the adhesive layer 2 of the dicing tape 10. Specifically, the pin member P is raised to push up the semiconductor chip to be picked up via the dicing tape 10. The pushed-up semiconductor chip is held by the suction jig J. Furthermore, if the adhesive layer 2 contains a radiation-curing adhesive, it is preferable to irradiate it with radiation. The intensity of the radiation to be irradiated is appropriately selected depending on the type of radiation-curing adhesive, etc. This makes it possible to relatively low the affinity between the adhesive layer 2 and the die bond layer 3, thus making it easier to recover the semiconductor chip with the die bond layer 3 attached.

[0106] As explained above, the dicing die bond film 20 according to this embodiment contains an acrylic polymer as an organic component in the adhesive layer 2 and the die bond layer 3. The Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer (first acrylic polymer) contained in the adhesive layer 2 and the Hansen solubility parameter of the acrylic polymer (second acrylic polymer) contained in the die bond layer 3, is between 2 and 7. The value of the hydrogen bonding term in the Hansen solubility parameter of the acrylic polymer (first acrylic polymer) contained in the adhesive layer 2 is 8 or less. Therefore, the die bond layer 3 exhibits sufficiently high adhesion to the adhesive layer 2 in the expansion process, and is suitable for exhibiting sufficiently low adhesion to the adhesive layer 2 in the pickup process. Therefore, the expansion process and the pickup process can be carried out smoothly.

[0107] In the die bonding process, the semiconductor chip with the die bonding layer 3 attached is bonded to the substrate.

[0108] Furthermore, the dicing die bond film according to the present invention is not limited to the embodiments described above. Also, the dicing die bond film according to the present invention is not limited by the effects described above. The dicing die bond film according to the present invention can be modified in various ways without departing from the spirit of the present invention. [Examples]

[0109] Next, the present invention will be described in more detail with reference to examples. The following examples are provided to further illustrate the present invention and do not limit its scope.

[0110] [Example 1] <Making dicing tape> In a reaction vessel equipped with a condenser, a nitrogen inlet, a thermometer, and a stirring device, 15 parts by mass of 2-hydroxyethyl acrylate (hereinafter referred to as HEA), 72 parts by mass of isooctyl acrylate (hereinafter referred to as 2EHA) and 0.2 parts by mass of azobisisobutyronitrile (hereinafter referred to as AIBN) as a thermal polymerization initiator were added. Then, butyl acetate was added as a reaction solvent so that the concentration of the monomers reached 38%. Polymerization was then carried out under a nitrogen atmosphere at 62°C for 4 hours and at 75°C for 2 hours to obtain acrylic polymer A. To this acrylic polymer A, 13 parts by mass of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as MOI) and 0.06 parts by mass of dibutyltin dilaurate were added, and the mixture was subjected to an addition reaction at 50°C for 12 hours under an air stream to obtain acrylic polymer A'. Next, to 100 parts by mass of acrylic polymer A', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and 2 parts by mass of a photopolymerization initiator (trade name "Omnirad127", manufactured by IGM Corporation) were added to prepare an adhesive solution (hereinafter sometimes referred to as adhesive solution A). Next, adhesive solution A was applied using an applicator to the silicone-release surface of a PET separator (50 μm thick) having a silicone-release surface, and dried at 120°C for 2 minutes to form an adhesive layer with a thickness of 10 μm. Then, a Gunze EVA film (product name "NED#125", 125 μm thick) as a base layer was laminated onto the adhesive layer, and stored at 50°C for 24 hours to obtain dicing tape A. Furthermore, the molar ratios of 2EHA, HEA, and MOI are shown in Table 4 below. The dicing tapes for each of the following examples were obtained in the same manner as described above. In other words, the dicing tape configuration is the same for each example. <Fabrication of the die bond layer> Adhesive composition A was prepared by adding methyl ethyl ketone to 100 parts by mass of an acrylic polymer (weight-average molecular weight 100,000) containing acrylonitrile (hereinafter referred to as AN), acrylic acid (hereinafter referred to as AA), butyl acrylate (hereinafter referred to as BA), and ethyl acrylate (hereinafter referred to as EA) in the molar ratio shown in the section for Example 1 in Table 5 below, along with 92 parts by mass of epoxy resin (product name "EPPN501HY", manufactured by Nippon Kayaku Co., Ltd.), 54 parts by mass of phenol resin (product name "Reditop LVR8210DL", manufactured by Gun-ei Chemical Industry Co., Ltd.), 167 parts by mass (calculated as silica filler) of silica filler (product name "SE2050-MCV", manufactured by Admatex Co., Ltd., spherical, average particle size 500 nm), and 4 parts by mass of a curing accelerator (product name "TPP-MK", manufactured by Hokko Chemical Industry Co., Ltd.). The solid content concentration of adhesive composition A was appropriately adjusted between 30% by mass and 50% by mass to facilitate the formation of a coating film. Next, adhesive composition A was applied to the silicone-release surface of a PET separator (50 μm thick) that had been treated with a silicone release agent using an applicator to form a coating film, and this coating film was subjected to a solvent removal treatment at 120°C for 2 minutes. As a result, a die bond layer A with an average thickness of 10 μm was fabricated on the PET separator. Furthermore, the molar ratios of AN, AA, BA, and EA, as well as their mass-average molecular weights, are shown in Table 2 below, and the breakdown (mass%) of each component in adhesive composition A is shown in Table 6 below. The mass-average molecular weight was measured by the method described above in the Embodiments section. <Preparation of dicing die bond film> A PET separator with a die-bonded layer (hereinafter referred to as a PET separator with a die-bonded layer) was punched out into a 330 mm diameter circle to obtain a PET separator with a die-bonded layer of 330 mm diameter. Next, the PET separator was removed from the dicing tape A to expose one side of the adhesive layer. Then, using a laminator, the PET separator with the die bond layer was bonded to the dicing tape A at room temperature (23±2℃) so that the exposed side of the die bond layer was in contact with the exposed side of the adhesive layer, thereby obtaining a dicing die bond film A. In other words, the dicing die bond film A according to Example 1 was constructed by laminating a polyolefin film, an adhesive layer, a die bond layer, and a PET separator in that order.

[0111] [Example 2] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> Die bond layer B was prepared in the same manner as in Example 1, except that the molar ratios of AN, AA, BA, and EA were as shown in Table 5 below. As shown in Table 5 below, the mass-average molecular weight of the acrylic polymer contained in die bond layer B was 100,000. Furthermore, the breakdown (mass%) of each component in adhesive composition B for forming the die bond layer 3 is the same as shown in Table 6 below, and the same applies to Examples 3 to Comparative Example 2 below. <Preparation of dicing die bond film> A dicing die bond film B was prepared in the same manner as in Example 1, except that die bond layer B was used.

[0112] [Example 3] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> Die bond layer C was prepared in the same manner as in Example 1, except that the molar ratios of AN, AA, BA, and EA were as shown in Table 5 below. As shown in Table 5 below, the mass-average molecular weight of the acrylic polymer contained in die bond layer C was 150,000. <Preparation of dicing die bond film> A dicing die bond film C was prepared in the same manner as in Example 1, except that a die bond layer C was used.

[0113] [Example 4] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> Die bond layer D was prepared in the same manner as in Example 1, except that the molar ratios of AN, AA, BA, and EA were as shown in Table 5 below. As shown in Table 5 below, the mass-average molecular weight of the acrylic polymer contained in the die bond layer D was 150,000. <Preparation of dicing die bond film> A dicing die bond film D was prepared in the same manner as in Example 1, except that a die bond layer D was used.

[0114] [Example 5] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> Die bond layer E was prepared in the same manner as in Example 4, except that the silica filler was changed to the product name "ST-ZL" (manufactured by Nissan Chemical Corporation, spherical, general grade, average particle size 80 nm). <Preparation of dicing die bond film> A dicing die bond film E was prepared in the same manner as in Example 4, except that a die bond layer E was used.

[0115] [Example 6] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> The die bond layer F was prepared in the same manner as in Example 4, except that the silica filler was changed to the product name "MEK-AC5140Z" (manufactured by Nissan Chemical Corporation, spherical, surface treated with epoxysilane, average particle size 80 nm). <Preparation of dicing die bond film> A dicing die bond film F was prepared in the same manner as in Example 4, except that a die bond layer F was used.

[0116] [Comparative Example 1] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> The die bond layer G was prepared in the same manner as in Example 1, except that the molar ratios of AN, AA, BA, and EA were as shown in Table 5 below. As shown in Table 5 below, the mass-average molecular weight of the acrylic polymer contained in the die bond layer G was 800,000. <Preparation of dicing die bond film> A dicing die bond film G was prepared in the same manner as in Example 1, except that a die bond layer G was used.

[0117] [Comparative Example 2] <Making dicing tape> Dicing tape A was prepared in the same manner as in Example 1. <Fabrication of the die bond layer> Die bond layer H was prepared in the same manner as in Example 1, except that methyl methacrylate (MMA) was used instead of acrylonitrile (AN), and the molar ratios of AA, BA, EA, and MMA were as shown in Table 5 below. As shown in Table 5 below, the mass-average molecular weight of the acrylic polymer contained in the die bond layer H was 100,000. <Preparation of dicing die bond film> A dicing die bond film H was prepared in the same manner as in Example 1, except that a die bond layer H was used.

[0118] [Comparative Example 3] <Making dicing tape> Dicing tape A was obtained in the same manner as in Example 1. <Fabrication of the die bond layer> Die bond layer I was prepared in the same manner as in Example 1, except that the molar ratios of AN, AA, BA, and EA were as shown in Table 5 below. As shown in Table 5 below, the mass-average molecular weight of the acrylic polymer contained in die bond layer I was 100,000. <Preparation of dicing die bond film> A dicing die bond film I was prepared in the same manner as in Example 1, except that die bond layer I was used.

[0119] [Table 4]

[0120] [Table 5]

[0121] [Table 6]

[0122] (Hansen solubility parameter) For each example of the dicing die bond film, the 3D coordinates (δ) of the acrylic polymer (first acrylic polymer) contained in the adhesive layer were determined by simulation. dA , δ pA , δ hA ) and the 3D coordinate (δ) of the acrylic polymer (second acrylic polymer) contained in the die bond layer dD , δ pD , δ hD ) was sought. The three-dimensional coordinates were derived using the method described above in the section on embodiments. The three-dimensional coordinate (δ) of the first acrylic polymer dA , δ pA , δ hA The results of deriving the second acrylic polymer are shown in Table 7 below, and the three-dimensional coordinate (δ) of the second acrylic polymer is shown. dD , δ pD , δ hD The results of deriving ) are shown in Table 8 below.

[0123] Furthermore, based on the three-dimensional coordinate values ​​of the first acrylic polymer and the second acrylic polymer, the Hansen solubility parameter distance Ra was calculated using the following formula (1).

[0124]

number

[0125] The results of the Hansen solubility parameter distance Ra, obtained as described above, are shown in Table 8 below.

[0126] [Table 7]

[0127] [Table 8]

[0128] (Peeling power before UV irradiation) For each example of the dicing die bond film, the peeling force of the die bond layer against the adhesive layer was measured before UV irradiation. The peel force of the die bond layer over the adhesive layer was measured using a T-type peel test. The T-type peel test was performed by peeling the PET separator from the die bond layer to create an exposed surface on the die bond layer, and then laminating a backing tape (product name "ELP BT315, manufactured by Nitto Denko Corporation) to this exposed surface. A sample measuring 10 mm wide x 120 mm long was cut from this dicing die bond film and tested using a tensile tester (for example, product name "ASG-X," manufactured by Shimadzu Corporation) at a temperature of 25°C and a tensile speed of 300 mm / min. The peeling force measured as described above is shown in Table 9 below. In Table 9 below, before UV irradiation, samples with a peeling force greater than 0.3 are rated as ○, and samples with a peeling force of 0.3 or less are rated as ×.

[0129] (Peeling power after UV irradiation) For each example of dicing die bond film, a UV lamp (UVL-2000RS, manufactured by Ushio Inc.) was used to irradiate it with a cumulative dose of 150 mJ / cm². 2 Except for the application of ultraviolet light, the peeling force after ultraviolet light irradiation was measured in the same manner as before ultraviolet light irradiation. The results are shown in Table 9 below. In Table 9 below, products with a peeling force of 0.06 or less after UV irradiation are rated as ○, and products with a peeling force exceeding 0.06 are rated as ×.

[0130] [Table 9]

[0131] As shown in Table 9, the peel strength evaluation result for the dicing die bond films in each example was ○ both before and after UV irradiation. In contrast, the dicing die bond films in each comparative example all showed a "fail" result in the peel strength assessment, either before or after UV irradiation. From these results, it can be seen that a dicing die bond film in which the numerical range of the Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer, is between 2 and 7, and the value of the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer is 8 or less, is suitable for exhibiting the characteristic of the die bond layer exhibiting sufficiently high adhesion to the adhesive layer in the expand process and the characteristic of the die bond layer exhibiting sufficiently low adhesion to the adhesive layer in the pick-up process. [Explanation of Symbols]

[0132] 1 Base material layer 2. Adhesive layer 3. Die Bond Layer 10 Dicing Tapes 20 Dicing die bond film G Backgrind Tape H Holder J Suction jig T Wafer Processing Tape U-shaped thrusting member W Semiconductor wafer

Claims

1. A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises a die bond layer laminated on the adhesive layer of the dicing tape, The adhesive layer and the die bond layer contain an acrylic polymer as an organic component. The Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer, is between 2 and 7. The value of the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer is 8 or less. The elongation at break of the die bond layer at -15°C is 0.01% or more and 30% or less. Dicing die bond film.

2. A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises a die bond layer laminated on the adhesive layer of the dicing tape, The adhesive layer and the die bond layer contain an acrylic polymer as an organic component. The Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer, is between 2 and 7. The value of the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer is 8 or less. The acrylic polymer contained in the die bond layer has a mass-average molecular weight of 200,000 or less. Dicing die bond film.

3. A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises a die bond layer laminated on the adhesive layer of the dicing tape, The adhesive layer and the die bond layer contain an acrylic polymer as an organic component. The Hansen solubility parameter distance Ra, calculated using the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer and the Hansen solubility parameter of the acrylic polymer contained in the die bond layer, is between 2 and 7. The value of the hydrogen bonding term of the Hansen solubility parameter of the acrylic polymer contained in the adhesive layer is 8 or less. The acrylic polymer contained in the die bond layer contains 12 mol% or more of structural units derived from acrylonitrile. Dicing die bond film.

4. The value of the polarity term of the Hansen solubility parameter of the acrylic polymer contained in the die bond layer is 5.8 or higher. A dicing die bond film according to any one of claims 1 to 3.

5. The die bond layer contains organic components other than the acrylic polymer, In the die bond layer, the mass ratio of the acrylic polymer to the total organic components is 10% by mass or more. A dicing die bond film according to any one of claims 1 to 3.

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