Conveying device, resin molding device, and method for manufacturing resin molded products

Abstract

To provide a conveying device capable of opening a hole in a release film fed to a mold having a positioning part, a resin molding device, and a method of manufacturing a resin molded article.SOLUTION: A conveying device 10 having a positioning part 37 for positioning a molding target Sa, and conveying the molding target Sa in a held state to a mold C while the positioning part 37 is covered with a film F, to place the molding target comprises: a molding target holding part 13 for holding the molding target Sa; a molding target pressing part 14 for pressing the molding target Sa toward the mold C when the molding target Sa that has been released from the holding by the molding target holding part 13 is placed on the mold C; and a film hole opening mechanism 16 that allows the positioning part 37 to open a hole in the film F before the molding target pressing part 14 presses the molding target Sa.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a conveying device, a resin molding apparatus, and a method for manufacturing a resin molded article. Background Art

[0002] A substrate or the like having a semiconductor chip fixed thereto is generally used as an electronic component after being encapsulated with resin. Conventionally, a resin molding apparatus for encapsulating a substrate or the like with resin that includes a molding die has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a resin molding apparatus (referred to as a resin encapsulating apparatus in Patent Document 1) including a molding die having an upper die and a lower die. Patent Document 1 discloses that after a release film (referred to as a lower die release film in Patent Document 1) is suction-held on a lower die, holes for sucking a substrate onto the release film are formed using a perforating jig provided with a perforating needle, and the substrate is suction-held on the lower die via the holes and substrate suction holes (referred to as workpiece suction holes in Patent Document 1) formed in the lower die. Prior Art Literature Patent Literature

[0004] Patent Document 1 Japanese Unexamined Patent Publication No. 2013-153146 Summary of the Invention Problem to be Solved by the Invention

[0005] However, the perforating jig in Patent Document 1 requires that the lower die be formed with holes, such as substrate suction holes, into which the perforating needle can enter, and cannot be used at locations where no such holes are formed. Furthermore, the perforating jig cannot be used even when a positioning portion such as a pin for positioning a substrate is protrudingly formed on the lower die upward from the substrate mounting surface (in the direction toward the upper die).

[0006] Therefore, there is a need for a conveying device, a resin molding device, and a method for manufacturing resin molded products that can create holes in a release film supplied to a mold having a positioning section. [Means for solving the problem]

[0007] One embodiment of the conveying device according to the present invention is a conveying device that has a positioning unit for positioning an object to be molded, and conveys and places the object to be molded while holding it onto a mold in which the positioning unit is covered with a film, and comprises an object holding unit for holding the object to be molded, an object pressing unit for pressing the object to be molded toward the mold when the object to be molded is released from being held by the object holding unit and placed onto the mold, and a film perforation mechanism for causing the positioning unit to make holes in the film before the object pressing unit presses the object to be molded.

[0008] One embodiment of the resin molding apparatus according to the present invention comprises the conveying device described above, the molding die on which the object to be molded is placed by the conveying device, and a mold clamping mechanism for clamping the molding die.

[0009] One embodiment of the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus described above, comprising: a supply step of making holes in the film with the film hole-punching mechanism, then placing the object to be molded, which has been released from being held by the object to be molded holding part, onto the mold, and pressing the object to be molded toward the mold with the object to be molded pressing part while supplying resin material; a mold-clamping step of clamping the mold with the mold-clamping mechanism; and a molding step of performing resin molding of the object to be molded. [Effects of the Invention]

[0010] According to embodiments of the present invention, it is possible to provide a conveying device, a resin molding device, and a method for manufacturing a resin molded product that can create holes in a release film supplied to a mold having a positioning section. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic plan view of a resin molding apparatus. [Figure 2] This is a schematic front view of the molding die. [Figure 3] This is a schematic front view of the loader. [Figure 4] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 5] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 6] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 7] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 8] This is a cross-sectional view showing the movement of the loader when the substrate before molding is placed on the lower mold. [Figure 9] This is a schematic side view showing a modified example of the loader. [Modes for carrying out the invention]

[0012] The following describes embodiments of the conveying apparatus, resin molding apparatus, and method for manufacturing resin molded products according to the present invention, based on the drawings. However, the present invention is not limited to the following embodiments, and various modifications are possible without departing from the spirit of the invention.

[0013] A substrate (molded object) on which semiconductor chips and the like are fixed is used as an electronic component by resin encapsulation. Techniques for resin encapsulation of molded objects include the transfer method. One transfer method involves placing the molded object on a release film supplied to the lower mold of the mold, supplying a resin tablet made of solidified powdered resin to the pot of the mold, heating and melting it, and then supplying the molten resin to the cavity to resin-molde the molded object.

[0014] A resin tablet is formed of a solid resin obtained by compacting powdered or granular resin, and melts upon heating to become a liquid molten resin. The resin tablet may be either a thermoplastic resin or a thermosetting resin. When heated, a thermosetting resin decreases in viscosity, and when further heated, it polymerizes and cures to become a cured resin. As described below, when a pre-molding substrate with a semiconductor chip fixed thereto is resin-molded and encapsulated, it is preferable to use a thermosetting resin.

[0015] [Overall Configuration] Hereinafter, a transfer-type resin molding apparatus 30 will be described as an example. FIG. 1 is a schematic plan view of the resin molding apparatus 30 according to the present embodiment. The resin molding apparatus 30 includes an accommodation module 2, a molding module 3, a supply module 4, a control unit 6, a loader 10 (an example of a conveying device), and an unloader 42. The molding module 3 is a portion that resin-encapsulates an object to be molded, and includes a molding die C that holds a pre-molding substrate Sa (an example of an object to be molded). The molding die C includes an upper die UM and a lower die LM. The resin molding apparatus 30 according to the present embodiment is an apparatus that performs resin molding on the pre-molding substrate Sa to which a semiconductor chip 48 and the like are fixed.

[0016] The supply module 4 is for supplying the pre-molding substrate Sa and a resin tablet T (an example of a resin material) to the molding module 3, and includes a substrate supply mechanism 43 and a resin supply mechanism 45. The substrate supply mechanism 43 stocks the pre-molding substrate Sa, and arranges the pre-molding substrate Sa in a state suitable for conveyance. A plurality of semiconductor chips 48 are aligned and fixed to the pre-molding substrate Sa in the vertical direction and / or the horizontal direction. In the present embodiment, four semiconductor chips 48 are fixed to one pre-molding substrate Sa in a single row. The resin supply mechanism 45 stocks the resin tablet T, and arranges the resin tablet T in a state suitable for conveyance. Note that the pre-molding substrate Sa may have one semiconductor chip 48 fixed thereto.

[0017] The loader 10 waits in the supply module 4. The loader 10 receives the pre-molding substrate Sa from the substrate supply mechanism 43 and the resin tablet T from the resin supply mechanism 45 in the supply module 4, and then moves from the supply module 4 to the molding module 3 along an unillustrated rail disposed on the back side (the upper side in Fig. 1) extending from the supply module 4 to the molding module 3. Then, the loader 10 delivers the pre-molding substrate Sa and the resin tablet T to the lower mold LM of the molding module 3. Thereafter, the loader 10 moves back along the rail to the supply module 4 again.

[0018] The molding module 3 molds a molded substrate Sb (which is an example of a resin molded product) by encapsulating the pre-molding substrate Sa with resin using a molding die C. In the present embodiment, one molding module 3 is provided, but two or more molding modules 3 may also be provided. When two or more molding modules 3 are provided, each molding module 3 can be independently attached or detached.

[0019] The storage module 2 includes a substrate storage section 46. An unloader 42 waits in the storage module 2, and moves from the storage module 2 to the molding module 3 along an unillustrated rail disposed on the back side (the upper side in Fig. 1) extending from the storage module 2 to the molding module 3 to take out the molded substrate Sb from the molding module 3, then moves back along the rail to the storage module 2 and stores the molded substrate Sb in the substrate storage section 46. In the molded substrate Sb, the semiconductor chip 48 and the like are encapsulated by a cured resin obtained by solidifying the molten resin Ta (which is an example of a resin material).

[0020] The control unit 6 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 6 controls the operation of the resin molding apparatus 30 by causing the processor to execute a control program stored in the storage device. Unless otherwise specified, the operation of the resin molding apparatus 30 described below is performed based on an operation command from the control unit 6. In the following description, descriptions of the operation command from the control unit 6 will be omitted in principle, and the operation command from the control unit 6 will be described as necessary.

[0021] The resin molding apparatus 30 of the molding module 3 will be described in detail below.

[0022] As shown in Figure 2, the resin molding apparatus 30 includes an upper mold UM in which an upper mold cavity MCa is formed into which molten resin Ta, which is heated and melted from a resin tablet T, is injected; a lower mold LM positioned opposite the upper mold UM and provided with a pot block 71 that forms a resin channel for injecting molten resin Ta into the upper mold cavity MCa; a mold clamping mechanism 5 for clamping the upper mold UM and the lower mold LM; and a release film supply mechanism 8 for supplying a release film F (an example of a film). In this embodiment, the lower mold LM has a lower mold cavity MCb into which molten resin Ta is injected from the upper mold cavity MCa through a resin flow hole (not shown) provided in the pre-molding substrate Sa. In this embodiment, the mold C is configured to place one pre-molding substrate Sa on each side of the pot block 71 of the lower mold LM, and to resin mold two pre-molding substrates Sa in one resin molding operation. However, the configuration is not limited to this, and a configuration in which one pre-molding substrate Sa is resin molded in one resin molding operation is also possible. The operation of the mold clamping mechanism 5 is controlled by the control unit 6. The unmolded substrate Sa is transported between the upper mold UM and the lower mold LM by the loader 10, and then placed on the lower mold LM. In this embodiment, the shape of the unmolded substrate Sa is rectangular, and accordingly, the planar shape of the lower mold cavity MCb is also rectangular.

[0023] The upper mold UM is held in the upper mold holder 31 via the upper mold base plate 33, and this upper mold holder 31 is fixed to the upper platen 32. The lower mold LM is held in the lower mold holder 34 via the lower mold base plate 36, and this lower mold holder 34 is fixed to a movable platen 35 that moves up and down by the mold clamping mechanism 5. In this embodiment, the mold clamping mechanism 5 can be, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod.

[0024] On the surface of the lower mold LM facing the upper mold UM, a plurality of positioning pins 37 (an example of a positioning part) are arranged facing the upper mold UM (three in this embodiment). The three positioning pins 37 are arranged on the outer circumference of the lower mold cavity MCb of the lower mold LM. More specifically, one of the three positioning pins 37 is located in the center of the outer circumference of the lower mold cavity MCb on the side closer to the pot block 71, and below the protruding portion 71e. The other two are located on the opposite side of the outer circumference of the lower mold cavity MCb from the positioning pin 37 located on the outer circumference of the lower mold cavity MCb on the side closer to the pot block 71 (hereinafter referred to as the "side further from the pot block 71"), with one pin at each end of the outer circumference of the lower mold cavity MCb. Each of the three positioning pins 37 is, for example, cylindrical in shape with a diameter of 1.5 mm and a height of 1.5 mm. Each of the three positioning pins 37 has a pin shape with a chamfered tip, and the tip is pointed. Therefore, holes can be made in the release film F without increasing the pressing force of the film pressing member 16a that presses the release film F, which will be described later. Note that the positioning pin 37 located in the center of the outer circumference of the lower mold cavity MCb on the side closer to the pot block 71 may be positioned not below the protruding portion 71e, but in a position that does not overlap with the protruding portion 71e when viewed from a direction perpendicular to the upper surface of the lower mold LM.

[0025] In the following, one positioning pin 37 located in the center of the outer circumference of the lower mold cavity MCb on the side closer to the pot block 71 will be referred to as the first positioning pin 37a (an example of a positioning part). Two positioning pins 37 located on the side further from the pot block 71 will be referred to as the second positioning pins 37b (an example of a positioning part). When the one first positioning pin 37a and the two second positioning pins 37b are not distinguished, they will simply be referred to as positioning pins 37. The three positioning pins 37 are inserted into each of the multiple (three in this embodiment) positioning holes 49 formed on the outer edge of the pre-molded substrate Sa, thereby positioning the pre-molded substrate Sa relative to the lower mold LM. In the lower mold LM, recesses 37c (see Figure 4) are formed around the locations where each of the three positioning pins 37 is located. In other words, all three positioning pins 37 are located on the bottom surface of the recesses 37c and extend toward the upper mold UM. The positioning pin may be a stepped pin that includes a thicker lower portion and a thinner upper portion. In this case, a recess may be formed by positioning the boundary between the thicker and thinner portions of the positioning pin lower than the upper surface of the lower mold LM.

[0026] The three positioning holes 49 of the unmolded substrate Sa are, when placed on the lower mold LM, positioned as follows: one in the center of the outer edge below the protruding portion 71e of the pot block 71, and two at both ends of the outer edge opposite the protruding portion 71e relative to the lower mold cavity MCb (see Figure 1). Hereinafter, the one positioning hole 49 located below the protruding portion 71e of the pot block 71 of the resin injection mechanism 7 will be referred to as the first positioning hole 49a, and the two positioning holes 49 located on the opposite side of the lower mold cavity MCb from the first positioning hole 49a will be referred to as the second positioning holes 49b. When the one first positioning hole 49a and the two second positioning holes 49b are not distinguished, they will simply be referred to as the positioning hole 49. The first positioning hole 49a is positioned to correspond to the first positioning pin 37a, and each of the two second positioning holes 49b is positioned to correspond to each of the two second positioning pins 37b.

[0027] The release film supply mechanism 8 supplies the release film F between the upper mold UM and the lower mold LM. As the material for the release film F, a resin material having properties such as heat resistance, release properties, flexibility, and extensibility is used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc. are used.

[0028] The release film supply mechanism 8 includes a dispensing mechanism (not shown) for dispensing the release film F and a recovery mechanism (not shown) for recovering the release film F. The dispensing mechanism can dispense the release film F before use between the upper mold UM and the lower mold LM, and the recovery mechanism can recover the used release film F used in resin molding. The lower mold LM is also provided with an adsorption mechanism (not shown) for adsorbing the release film F onto the mold surface using a vacuum pump or the like. The operation of the release film supply mechanism 8 is controlled by the control unit 6. The length (width) of the release film F in the direction perpendicular to the transport direction (front-back direction in Figure 2) (left-right direction in Figure 2) is such that it covers the three positioning pins 37 located on the lower mold LM. When the release film F is supplied to the lower mold LM and before the pre-molding substrate Sa is placed on it, the positioning pins 37 are covered by the release film F.

[0029] The resin injection mechanism 7 comprises a pot block 71 in which a pot 71a for containing resin tablets T is formed, and a transfer mechanism 72 having a plunger 72a provided inside the pot 71a. The pot 71a is formed, for example, from a cylindrical member 73. This cylindrical member 73 is fitted into a through hole formed in the pot block 71.

[0030] The pot block 71 is elastically supported by an elastic member 74 so that it can move up and down relative to the lower mold LM. In other words, the pot block 71 is provided so that it can move up and down relative to the lower mold LM via the elastic member 74. This elastic member 74 is provided on the underside of the pot block 71 and presses the pot block 71 in a direction away from the lower mold LM.

[0031] Furthermore, an overhang portion 71e is formed at the upper end of the pot block 71, extending onto the mold surface, which is the upper surface of the lower mold LM. This overhang portion 71e protrudes in such a way that it can press against the pot-side end of the unmolded substrate Sa when the unmolded substrate Sa is placed on the lower mold LM. In addition, a cull portion 71b, a runner 71c, and a gate 71d are formed on the upper surface of the pot block 71, which serve as resin channels for introducing the molten resin Ta injected from the pot 71a into the upper mold cavity MCa. Moreover, when the upper mold UM and lower mold LM are clamped together, the upper surface of the overhang portion 71e contacts the upper mold UM (cull block), and the lower surface sandwiches the unmolded substrate Sa between itself and the mold surface of the lower mold LM.

[0032] The transfer mechanism 72 moves the plunger 72a while the upper mold UM and lower mold LM are clamped together to inject molten resin Ta from the pot 71a into the upper mold cavity MCa. This transfer mechanism 72 includes a plunger 72a for pumping the molten resin Ta, a fixing block 72b to which the plunger 72a is fixed, and a plunger drive mechanism 72c that moves the plunger 72a via the fixing block 72b. The operation of the plunger drive mechanism 72c is controlled by the control unit 6.

[0033] The fixed block 72b has a roughly rectangular parallelepiped shape, and multiple plungers 72a are fixed in a straight line on one of its rectangular faces (top surface). The arrangement of the multiple plungers 72a corresponds to the arrangement of the multiple pots 71a, which will be described later. The multiple plungers 72a are fixed to the fixed block 72b, for example, by fixing screws. Furthermore, the fixed block 72b may be provided with an isobaric mechanism using an elastic member or the like to equalize the pressure at which each plunger 72a injects the molten resin Ta.

[0034] The plunger drive mechanism 72c moves the fixed block 72b up and down relative to the lower mold LM, thereby moving multiple plungers 72a simultaneously with the same amount of movement relative to multiple pots 71a. In this embodiment, the plunger drive mechanism 72c is provided on the lower side of the fixed block 72b. As this plunger drive mechanism 72c, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod can be used.

[0035] The upper mold UM has an upper mold cavity MCa formed therein, which houses the semiconductor chip 48 of the substrate Sa before molding and into which the molten resin Ta is injected. The upper mold UM also has a concave space 81 and a gate 82 formed therein, which connect the cal portion 71b, runner 71c, and gate 71d of the pot block 71 to the upper mold cavity MCa. In other words, between the upper mold UM and the pot block 71, there is a cal portion 71b, runner 71c, gate 71d, concave space 81, and gate 82 which serve as resin channels for the molten resin Ta to flow from the pot 71a to the upper mold cavity MCa. The upper mold UM also has an air vent (not shown) formed on the side opposite to the pot block 71. Note that the runner 71c can be omitted, and the cal portion 71b and the upper mold cavity MCa can be directly connected via gates 71d and 82. Furthermore, in this embodiment, the concave space 81 forms a space for resin accumulation before communicating from the gate 71d to the upper mold cavity MCa, and is connected to the upper mold cavity MCa via the gate 82 from this resin accumulation space, but this resin accumulation space may be omitted.

[0036] Furthermore, the upper mold UM is provided with a plurality of ejector pins 83 for releasing the molded substrate Sb from the upper mold UM. These ejector pins 83 are provided so as to penetrate the upper mold UM at required locations and be able to move up and down relative to the upper mold UM, and are fixed to an ejector plate 84 provided on the upper side of the upper mold UM. The ejector plate 84 is provided on the upper platen 32 etc. via an elastic member 85 and has return pins 86. When the mold is clamped, the return pins 86 come into contact with the area outside the mounting area of ​​the unmolded substrate Sa in the lower mold LM, causing the ejector plate 84 to rise relative to the upper mold UM. As a result, when the mold is clamped, the ejector pins 83 are retracted into the mold surface of the upper mold UM. On the other hand, when the mold is opened, as the lower mold LM descends, the ejector plate 84 descends relative to the upper mold UM by the elastic force of the elastic member 85, and the ejector pins 83 push the molded substrate Sb and release it from the upper mold UM.

[0037] When the upper mold UM and lower mold LM are clamped by the clamping mechanism 5, the resin flow path consisting of the cal portion 71b, runner 71c, gate 71d, concave space 81, and gate 82 connects the multiple pots 71a to the upper mold cavity MCa, and the upper mold cavity MCa communicates with the lower mold cavity MCb via resin flow holes (not shown) provided in the pre-molded substrate Sa. When the upper mold UM and lower mold LM are clamped, the pot-side end of the pre-molded substrate Sa is sandwiched between the lower surface of the protruding portion 71e of the pot block 71 and the upper surface of the lower mold LM. In this state, the plunger 72a is raised by the plunger drive mechanism 72c and molten resin Ta is injected into the upper mold cavity MCa and lower mold cavity MCb, thereby resin-encapsulating the semiconductor chips 48 and the like on the pre-molded substrate Sa.

[0038] [Loader configuration] Next, the specific configuration of the loader 10 in this embodiment will be described with reference to Figures 3 and 4. In Figures 3 and 4, the semiconductor chip 48 fixed to the pre-molded substrate Sa is not shown. Furthermore, Figures 3 to 9 describe the configuration of the loader 10 for one of the two pre-molded substrates Sa placed on both sides of the lower mold LM with the pot block 71 in between. As mentioned above, the mold C in this embodiment is a mold C that resin-moldes two pre-molded substrates Sa in a single resin molding operation. Therefore, the same configuration is provided for the other of the two pre-molded substrates Sa (see Figure 2) placed on both sides of the lower mold LM with the pot block 71 in between, in the portion of the base member 11 shown by the omitted line in Figures 3 to 9.

[0039] As shown in Figure 3, the loader 10 includes a base member 11 that is movable along a rail (not shown), a substrate holding part 13 provided on the base member 11 for holding a substrate Sa before molding, a pressing part 14 for pressing down on the substrate Sa placed on the lower mold LM, a lifting and lowering mechanism (not shown) for moving the pressing part 14 up and down, a film hole punching mechanism 16 for punching holes in the release film F, and a holding part moving mechanism 17 for moving the substrate holding part 13 toward the pot block 71 relative to the base member 11. The base member 11 is also provided with a resin holding part (not shown) for holding a resin tablet T.

[0040] The substrate holding section 13 includes a holding claw 13a, a drive section 13b, a lever 13c, a link 13d, and a shaft 13e.

[0041] The retaining claws 13a according to this embodiment are for holding the pre-molding substrate Sa in the loader 10 by hooking both ends of the rectangular pre-molding substrate Sa, which are two opposite sides of the substrate Sa (see Figure 4). Multiple retaining claws 13a are arranged at the pot-side end (two in this embodiment) and multiple retaining claws 13a are arranged at the end opposite to the pot-side end (four in this embodiment). The retaining claws 13a are configured to open and close by swinging around the shaft 13e. When the retaining claws 13a are closed, they hook both ends of the pre-molding substrate Sa and hold the pre-molding substrate Sa in the loader 10. When the retaining claws 13a are opened, the hooks on the pre-molding substrate Sa are released, and the pre-molding substrate Sa is released from being held. The released pre-molding substrate Sa falls from the loader 10 and is placed on the mold surface of the lower mold LM (see Figure 7).

[0042] As shown in Figure 4, the pot block 71 has a recess 71f at a location corresponding to the retaining claw 13a at the pot block side end to avoid interference with the retaining claw 13a. The drive unit 13b is, for example, an air cylinder and can move the lever 13c up and down. The lever 13c connects the drive unit 13b to the link 13d. The link 13d connects the lever 13c to the retaining claw 13a and is configured to swing relative to the lever 13c and the retaining claw 13a. The shaft 13e passes through the multiple retaining claws 13a located at the pot side end and the multiple retaining claws 13a located at the opposite end, respectively, and serves as the pivot point for the retaining claws 13a.

[0043] The pressing portion 14 is positioned to press the unmolded substrate Sa, which is placed on the lower mold LM with the positioning pin 37 formed in the lower mold LM inserted into the positioning hole 49, toward the lower mold LM by pushing the outer edge of the unmolded substrate Sa placed on the lower mold LM toward the lower mold LM. The overall pressing member 14b is connected to two connecting shafts 14a and moves up and down (up and down) together with the connecting shafts 14a (see Figure 4). In this embodiment, both connecting shafts 14a pass through the base member 11 and are connected to each other above the base member 11. The unmolded substrate Sa is held by being sandwiched between the retaining claws 13a of the substrate holding portion 13 and the pressing portion 14.

[0044] The pressing section 14 includes an overall pressing member 14b and individual pressing members 14c. The overall pressing member 14b is formed in a frame shape so that it can press the outer edge of the unmolded substrate Sa toward the lower die LM. The inside of the frame is recessed, and the semiconductor chip 48 fixed to the unmolded substrate Sa is positioned in this recess. The individual pressing members 14c are positioned as a part of the overall pressing member 14b. In a vertical view, the individual pressing members 14c are positioned to overlap with each of the two second positioning pins 37b. Therefore, the individual pressing members 14c have pin insertion holes 14d into which the second positioning pins 37b enter when the unmolded substrate Sa is pressed. In Figure 3 (and Figures 4 to 8), the lower surface 14e (the surface facing the unmolded substrate Sa) of the overall pressing member 14b and the lower surface 14f of the individual pressing member 14c are flush. However, in reality, the lower surface 14f of the individual pressing member 14c protrudes slightly (for example, 0.1 mm) downward than the lower surface 14e of the overall pressing member 14b. Therefore, when pressing the unmolded substrate Sa, the individual pressing member 14c makes contact with the unmolded substrate Sa earlier than the overall pressing member 14b.

[0045] The lifting mechanism (not shown) adjusts the height position of the retaining portion 14 relative to the base member 11. The lifting mechanism is composed of an air cylinder or the like. The lifting mechanism can change the height position of the retaining portion 14 relative to the base member 11 by moving the connecting shaft 14a up and down relative to the base member 11.

[0046] The film perforation mechanism 16 is a mechanism that causes the three positioning pins 37 to perforate the release film F supplied so as to cover the three positioning pins 37 of the lower mold LM, so that the positioning pins 37 penetrate the release film F. The release film perforation mechanism 16 is provided in the pressing section 14 and includes a film pressing member 16a and a pressing member 16b that presses the film pressing member 16a downward (towards the lower mold LM). The pressing member 16b is, for example, a compression coil spring.

[0047] The film pressing member 16a is a cylindrical rod-shaped member, and the periphery of its lower surface 16c (the surface facing the lower mold LM) has an R-shaped chamfer, so as not to tear the release film F with its edges. In Figures 3 to 8, the illustration of this R-shaped chamfer is omitted. The film pressing member 16a is positioned near the individual pressing member 14c, and outside the outer edge of the pressing portion 14 and the outer edge of the unmolded substrate Sa. That is, the film pressing member 16a is positioned on the outer circumference of the lower mold cavity MCb near the second positioning pin 37b, after the loader 10 has loaded the unmolded substrate Sa above the lower mold LM and just before the holding portion moving mechanism 17 is activated. The film pressing member 16a is held by the pressing portion 14, and the lower surface 16c of the film pressing member 16a protrudes downward from the lower surface 14f of the individual pressing member 14c of the pressing portion 14.

[0048] The holding mechanism 17 includes a drive unit 17a, a rail 17b, and a sliding member 17c. The drive unit 17a is, for example, an air cylinder, and by operating the drive unit 17a, the sliding member 17c is moved horizontally along the rail 17b. The connecting shaft 14a is configured to move in conjunction with the movement of the sliding member 17c. When the connecting shaft 14a moves horizontally, the pressing part 14 connected to the connecting shaft 14a also moves horizontally, and consequently the pre-molded substrate Sa and the holding claws 13a also move horizontally. The holding mechanism 17 moves the pre-molded substrate Sa toward the pot block 71 relative to the base member 11.

[0049] [Method for manufacturing resin molded products] Next, a method for manufacturing a resin molded product (molded substrate Sb) will be explained using Figures 1 to 8. The method for manufacturing a resin molded product (molded substrate Sb) includes a film supply step of supplying a release film F to the lower mold LM; a substrate supply step (an example of a supply step) in which, after making holes in the release film F with a film hole punching mechanism 16, the unmolded substrate Sa, released from being held by the substrate holding part 13, is placed on the lower mold LM, and the unmolded substrate Sa is pressed toward the mold surface of the lower mold LM with a pressing part 14 while supplying resin tablets T; a mold clamping step of clamping the mold C with a mold clamping mechanism 5; and a molding step of supplying molten resin Ta to the upper mold cavity MCa and the lower mold cavity MCb to perform resin molding of the unmolded substrate Sa.

[0050] The molding process is a process in which the resin molding apparatus 30 resin-moldes the substrate Sa from the time the substrate Sa is loaded into the molding module 3 until the molded substrate Sb is unloaded from the molding module 3. In the molding process in this embodiment, molten resin Ta is supplied to both sides of the substrate Sa by supplying molten resin Ta to the upper mold cavity MCa and the lower mold cavity MCb, thereby performing double-sided molding and manufacturing the molded substrate Sb. Note that in Figures 3 to 8, the semiconductor chip 48 fixed to the substrate Sa is not shown. Also, in Figures 4 to 8, only one side (the right side in Figure 2) of the lower mold LM with respect to the resin injection mechanism 7 is shown. The configuration of the unshown parts is the same as the configuration of the shown parts. Furthermore, in Figures 4 to 8, the upper mold UM is not shown.

[0051] As shown in Figure 1, the loader 10 is preheated with the resin tablet T housing space insulated, and the mold C is also heated. Then, the pre-molding substrate Sa taken from the substrate supply mechanism 43 is placed on the loader 10. The resin tablets T, aligned by the resin supply mechanism 45, are then placed in the resin tablet T housing space of the loader 10. The loader 10 then transports the pre-molding substrate Sa and resin tablets T to the molding module 3. As shown by the dashed line in Figure 2, the loader 10 is positioned between the upper mold UM and the lower mold LM of the mold C, and places the pre-molding substrate Sa on the lower mold LM. Figure 2 shows the state after the pre-molding substrate Sa has been placed on the lower mold LM.

[0052] The release film supply mechanism 8 supplies a release film F to the upper mold UM and the lower mold LM before use (film supply process). At this time, as shown in Figure 4, the release film F covers the three positioning pins 37 located on the lower mold LM, and there are no holes in the release film F. Subsequently, the release film F is adsorbed and fixed to the upper surface of the lower mold LM by a release film suction mechanism (not shown) provided on the lower mold LM. Even with this film suction, there are no holes in the release film F in the areas of the three positioning pins 37. Next, as shown in Figure 5, the control unit 6 lowers the pressing part 14, including the connecting shaft 14a, by a lifting and lowering mechanism (not shown). At this time, the substrate holding part 13, the unmolded substrate Sa, and the film hole punching mechanism 16 also descend along with the lowering of the pressing part 14. When the film hole punching mechanism 16 descends, the lower surface 16c of the film pressing member 16a, located near the individual pressing member 14c (second positioning pin 37b), comes into contact with the release film F. At this time, the pressing portion 14 is above the release film F, and the pre-molding substrate Sa held by the loader 10 is not in contact with the release film F.

[0053] As the film pressing member 16a continues to descend, pressing the release film F toward the lower die LM, the release film F is torn by the three pointed positioning pins 37, creating holes in it. Since tension is acting on the release film F due to the release film suction mechanism, when the film pressing member 16a is pressed, the release film F is attracted to the upper surface of the lower die LM, including the lower die cavity MCb, and holes are created in the release film F by the second positioning pin 37b, which is closer to the film pressing member 16a. In addition, although not explicitly shown in Figures 5 and 6, the pressing of the film pressing member 16a may also cause small holes to be created in the release film F by the first positioning pin 37a.

[0054] As shown in Figure 5, the film pressing member 16a descends while pressing the release film F until at least the portion of the release film F pressed by the film pressing member 16a contacts the lower mold LM. When the lower surface 16c of the film pressing member 16a is in contact with the mold surface of the lower mold LM, the descended pre-molding substrate Sa is located between the protruding portion 71e of the pot block 71 and the lower mold LM, and is not in contact with the release film F.

[0055] Next, the holding mechanism 17 drives the drive unit 17a to move the slide member 17c horizontally along the rail 17b toward the pot block 71. At this time, the horizontal movement of the slide member 17c also causes the connecting shaft 14a of the pressing part 14 and the lever 13c of the substrate holding part 13 to move horizontally. As a result, the overall pressing member 14b and individual pressing members 14c of the pressing part 14, as well as the holding claws 13a, levers 13c, links 13d, and shafts 13e of the substrate holding part 13, also move horizontally toward the pot block 71. The horizontal movement ends when the outer edge of the unmolded substrate Sa held by the holding claws 13a contacts the pot block 71 or just before it contacts it (see Figure 6). Along with the horizontal movement of the pressing part 14, the film pressing member 16a moves horizontally along the upper surface of the lower mold LM with its lower surface 16c in contact with the release film F. Furthermore, the film pressing member 16a provided on the pressing section 14 is positioned so that it does not enter the lower mold cavity MCb due to the horizontal movement of the pressing section 14. This allows the release film F to be pressed and leveled not only in the area pressed by the film pressing member 16a, but also in the vicinity of the second positioning pin 37b.

[0056] Next, as shown in Figure 7, the substrate holding unit 13 moves the lever 13c downward (towards the lower mold LM) by the drive unit 13b. When the lever 13c is moved downward, the end of the link 13d connected to the lever 13c moves downward. As a result, the retaining claw 13a connected to the other end of the link 13d swings around the shaft 13e and opens. When the retaining claw 13a opens, the pre-molding substrate Sa is released from its grip, and the pre-molding substrate Sa is released from being held. The released pre-molding substrate Sa falls from the loader 10 and is placed on the lower mold LM. At this time, the second positioning hole 49b formed in the pre-molding substrate Sa fits into the second positioning pin 37b located on the lower mold LM. Also, if a hole has been made in the release film F by the first positioning pin 37a, the first positioning hole 49a formed in the pre-molding substrate Sa fits into the first positioning pin 37a located on the lower mold LM. Furthermore, since the pot block 71 has a recess 71f at a location corresponding to the retaining claw 13a, the retaining claw 13a does not come into contact with or interfere with the pot block 71 even when it is open.

[0057] Next, the lifting mechanism (not shown) further lowers the pressing portion 14, including the connecting shaft 14a, as shown in Figure 8, pressing the unmolded substrate Sa placed on the lower mold LM toward the lower mold LM. In this embodiment, the pointed tip of the positioning pin 37 is used to tear the release film F and create a hole, but the portion of the release film F around the hole is stretched when the hole is made. As a result, the release film F around the positioning pin 37 is loose, and even if the unmolded substrate Sa is dropped and placed on the lower mold LM, the unmolded substrate Sa may be floating above the lower mold LM by the amount of the looseness of the release film F.

[0058] Therefore, in this embodiment, the pressing portion 14 is lowered to ensure that the unmolded substrate Sa contacts the lower mold LM. In particular, since the lower surface 14f of the individual pressing member 14c of the pressing portion 14 protrudes lower than the lower surface 14e of the overall pressing member 14b, the individual pressing member 14c contacts the unmolded substrate Sa before the overall pressing member 14b and presses the unmolded substrate Sa toward the lower mold LM. Since the individual pressing member 14c has a pin insertion hole 14d into which the second positioning pin 37b fits, the individual pressing member 14c can press against the area around the second positioning pin 37b. As a result, the release film F around the second positioning pin 37b is perforated up to the base of the second positioning pin 37b, and the release film F around the first positioning pin 37a is also perforated up to the base by the first positioning pin 37a, preventing the unmolded substrate Sa from lifting up. At this time, the stretched portion of the release film F around the positioning pin 37 fits into the recess 37c. Subsequently, the overall pressing member 14b presses the outer edge of the unmolded substrate Sa toward the lower mold LM. As a result, the unmolded substrate Sa remains in contact with the lower mold LM without lifting away from it. When the pressing part 14 presses the unmolded substrate Sa, the film pressing member 16a of the film hole punching mechanism 16 rises until its lower surface 16c is pushed toward the upper surface of the lower mold LM, so that it is flush with the lower surface 14e of the overall pressing member 14b. Therefore, the film hole punching mechanism 16 does not interfere with the above operation of the pressing part 14.

[0059] Subsequently, the loader 10, with the pressing part 14, presses the unmolded substrate Sa toward the mold surface of the lower mold LM, and then places the resin tablet T into the pot 71a of the lower mold LM (substrate supply process). By placing the resin tablet T into the pot 71a, the heater built into the lower mold LM heats the resin tablet T, turning it into molten resin Ta.

[0060] Next, the lifting mechanism raises the pressing section 14 to the state shown in Figure 7. Then, the substrate holding section 13 and the pressing section 14 are moved horizontally by the holding section moving mechanism 17 to the state shown in Figure 5, and then raised by the lifting mechanism to the state shown in Figure 4. Finally, the loader 10 moves from between the upper die UM and the lower die LM to the outside of the molding die C and returns to the supply module 4.

[0061] Next, the clamping mechanism 5, whose driving force is controlled by the control unit 6, moves the upper mold UM and the lower mold LM closer together and clamps them together. At this time, the clamping mechanism 5 raises the lower mold LM and the pot block 71, and the rise of the pot block 71 stops when the upper surface of the pot block 71 contacts the upper mold UM. Then, as the lower mold LM rises further by the clamping mechanism 5, the elastic member 74 is compressed and the pot block 71 approaches the lower mold LM, and the lower surface of the protruding portion 71e contacts the pot-side end of the unmolded substrate Sa. Also, the lower surface of the upper mold UM contacts the end of the unmolded substrate Sa that does not come into contact with the pot-side end (clamping process). The upper mold UM has recesses (not shown) into which the tips of the two second positioning pins 37b enter during clamping. Also, the surface of the protruding portion 71e of the pot block 71 that contacts the unmolded substrate Sa has recesses (not shown) into which the tip of the first positioning pin 37a enters.

[0062] Next, the molten resin Ta, formed from the resin tablet T contained in the lower mold LM, is injected into the upper mold cavity MCa and the lower mold cavity MCb by a transfer mechanism 72 whose driving force is controlled by the control unit 6. This results in the pre-molding substrate Sa being molded on both sides (molding process). After resin molding, the lower mold LM is moved downward to open the mold C. At this time, the ejector pins 83 push the molded substrate Sb and separate it from the upper mold UM. Simultaneously, the compression of the elastic member 74 is released and the pot block 71 rises. As a result, an operation (gate break operation) is performed to separate the unwanted resin formed on the cal portion 71b, runner 71c, and gate 71d of the pot block 71 from the pre-molding substrate Sa that has been molded on both sides, thus separating the molded substrate Sb from the unwanted resin.

[0063] Subsequently, the unloader 42 removes the excess resin and the molded substrate Sb from the mold C, discarding the excess resin into the excess resin storage section (not shown) and storing the molded substrate Sb in the substrate storage section 46 of the storage module 2 (see Figure 1). The package substrate (molded substrate Sb) manufactured by this resin molding apparatus 30 is then cut by a cutting device to remove any unnecessary parts of the package substrate and to separate it into individual pieces. The individual pieces undergo quality inspection and are then used as electronic components.

[0064] As described above, in the resin molding apparatus 30 of this embodiment, the loader 10 has a film hole punching mechanism 16. Therefore, even if the positioning pins 37 that position the substrate Sa before molding relative to the lower mold LM are covered with a release film F, the film pressing member 16a of the film hole punching mechanism 16 can press the release film F against the substrate Sa before molding by pressing the substrate Sa against the lower mold LM, thereby punching holes in the release film F with the positioning pins 37 and exposing the positioning pins 37 from the release film F. Therefore, compared to the case where holes are punched in the release film F by pressing the substrate Sa before molding against the release film F, there is no risk of damage to the substrate Sa before molding or displacement of its mounting position, and the substrate Sa before molding can be placed in the correct position relative to the lower mold LM.

[0065] [Another embodiment] The following describes another embodiment of the above-described embodiment. For the same components as in the above-described embodiment, the same terms and reference numerals will be used for explanation to facilitate understanding.

[0066] <1> In the embodiment described above, the positioning pins 37 were placed on the lower mold LM and covered with the release film F. However, the configuration may also be such that the positioning pins 37 are placed on the upper mold UM and covered with the release film F. Furthermore, the film perforation mechanism 16 can also be applied when the release film F is placed on both the lower mold LM and the upper mold UM.

[0067] <2> In the embodiment described above, the film-holding member 16a is provided only near the two second positioning pins 37b, but it may also be provided near the first positioning pin 37a. In this case, it is preferable to provide a recess in the pot block 71 for housing the film-holding member 16a. Furthermore, the position and number of film-holding members 16a can be appropriately set according to the pre-molded substrate Sa that will be resin-molded.

[0068] <3> In the embodiment described above, the pressing portion 14 had an overall pressing member 14b and individual pressing members 14c, but it may also be composed of only the overall pressing member 14b without the individual pressing members 14c.

[0069] <4> In the embodiment described above, the resin tablet T was placed in the pot 71a of the lower mold LM while the pressing portion 14 was pressed against the unmolded substrate Sa toward the lower mold LM, but the embodiment is not limited to this. Alternatively, the pressing portion 14 may be pressed against the lower mold LM, and the pressing portion 14 may be raised from the unmolded substrate Sa before the resin tablet T is placed in the pot 71a of the lower mold LM.

[0070] <5> In the embodiment described above, the resin injection mechanism 7 is a method in which the unmolded substrate Sa placed on the lower mold LM is clamped between the lower mold LM and the protruding portion 71e of the pot block 71 to perform resin molding, and the molten resin Ta supplied from the pot 71a is supplied to the upper mold cavity MCa without passing over the edge of the unmolded substrate Sa (sometimes called an edge gate method). However, it may also be a method in which the unmolded substrate Sa placed on the lower mold LM is clamped between the lower mold LM and the upper mold UM to perform resin molding, and the molten resin Ta supplied from the pot 71a is supplied to the upper mold cavity MCa by passing over the edge of the unmolded substrate Sa (sometimes called a side gate method). Even in the side gate method, by moving the film pressing member 16a horizontally before placing the unmolded substrate Sa loaded into the mold C by the loader 10 on the lower mold LM, not only the area pressed by the film pressing member 16a but also the release film F near the second positioning pin 37b can be pressed and smoothed. In this case, for example, a loader 10 as shown in Figure 9 can be used to move the film-holding member 16a provided on the base member 11 horizontally using a drive source 16d. At this time, the substrate holding part 13 and the substrate Sa before molding do not move horizontally. In addition, in the embodiment described above, molten resin Ta was supplied to both sides of the substrate Sa before molding to perform double-sided molding, but single-sided molding in which molten resin Ta is injected only into the upper mold cavity MCa may also be used.

[0071] <6> In the embodiment described above, the film perforation mechanism 16 was applied to a transfer-type resin molding apparatus 30, but it can also be applied to a compression-type resin molding apparatus when the substrate to be molded is placed on the lower mold.

[0072] <7> In the embodiment described above, the pre-molding substrate Sa was moved horizontally by the holding mechanism 17, but the mechanism for moving the pre-molding substrate Sa horizontally is not particularly limited and may employ, for example, the technology described in Japanese Patent Application Publication No. 2020-064919.

[0073] <8> The pre-molded substrate Sa that is resin-molded in the resin molding apparatus 30 in the above-described embodiment is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate (such as a lead frame), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0074] [Summary of the above embodiment] The following describes the general outline of the transport device (loader 10), resin molding device 30, and method for manufacturing the resin molded product (molded substrate Sb) as described in the above embodiment.

[0075] (1) The characteristic configuration of the transport device (loader 10) is that it has a positioning section (positioning pins 37, first positioning pin 37a, second positioning pin 37b) for positioning the object to be molded (substrate Sa before molding), and transports and places the object to be molded (substrate Sa before molding) into the mold C, in which the positioning section (positioning pins 37, first positioning pin 37a, second positioning pin 37b) is covered with a film (release film F), and the transport device (loader 10) has an object holding section (substrate holding) for holding the object to be molded (substrate Sa before molding), and The device includes a holding portion 13), a molded object pressing portion (pressing portion 14) that presses the molded object (pre-molding substrate Sa) toward the mold C when the molded object (pre-molding substrate Sa) is released from being held by the molded object holding portion (substrate holding portion 13) and placed on the mold C, and a film hole-punching mechanism 16 that causes holes to be made in the film (release film F) by a positioning portion (positioning pins 37, first positioning pin 37a, second positioning pin 37b) before the molded object pressing portion (pressing portion 14) presses the molded object (pre-molding substrate Sa).

[0076] The transport device (loader 10) according to this characteristic configuration has a film perforation mechanism 16. Therefore, even if the positioning parts (positioning pins 37, first positioning pin 37a, second positioning pin 37b) that position the object to be molded (substrate Sa before molding) relative to the mold C are covered with a film (release film F), the film perforation mechanism 16 presses the film (release film F) against the object to be molded (substrate Sa before molding) before it is placed on the mold C. As a result, holes are made in the film (release film F) by the positioning parts (positioning pins 37, first positioning pin 37a, second positioning pin 37b), and the positioning parts (positioning pins 37, first positioning pin 37a, second positioning pin 37b) can be exposed from the film (release film F). Therefore, compared to the case where holes are made in the film (release film F) by pressing the object to be molded (pre-molding substrate Sa) against the film (release film F), there is no risk of damage to the object to be molded (pre-molding substrate Sa) or displacement of its position, and the object to be molded (pre-molding substrate Sa) can be placed in the correct position relative to the mold C.

[0077] (2) In the transport device (loader 10) described in (1) above, the film hole punching mechanism 16 is provided on the outside of the object to be molded (substrate Sa before molding) and may have a film pressing member 16a near the positioning part (second positioning pin 37b) that presses down on the film (release film F) to punch holes in the film (release film F).

[0078] In this configuration, since there is a film pressing member 16a near the positioning part (second positioning pin 37b) that presses down on the film (release film F) to create holes in the film (release film F), an appropriate pressing force is applied to the film (release film F) to ensure that holes are reliably created.

[0079] (3) In the transport device (loader 10) described in (2) above, the film pressing member 16a may be configured to be able to move horizontally while in contact with the film (release film F) after pressing down on the film (release film F).

[0080] With this configuration, not only the area pressed by the film pressing member 16a, but also the area of ​​the film (release film F) near the positioning part (second positioning pin 37b) where the film pressing member 16a moves horizontally can be pressed. As a result, it becomes possible to smooth the area near the holes in the film (release film F).

[0081] (4) In the transport device (loader 10) described in (2) or (3) above, the molding object pressing section (pressing section 14) may have individual pressing members 14c in the vicinity of the film pressing member 16a that press the molding object (substrate Sa before molding) against it.

[0082] With this configuration, the area surrounding the positioning portion (second positioning pin 37b) of the object to be molded (substrate Sa before molding) can be reliably pressed against the mold C.

[0083] (5) In the transport device (loader 10) described in (4) above, the object to be molded pressing section (pressing section 14) has an overall pressing member 14b that presses the outer edge of the object to be molded (substrate Sa before molding) toward the molding die, and the individual pressing members 14c may protrude more than the overall pressing member 14b so as to contact the object to be molded (substrate Sa before molding) earlier than the overall pressing member 14b when pressing the object to be molded (substrate Sa before molding) toward the molding die C.

[0084] With this configuration, the area around the positioning portion (second positioning pin 37b) of the object to be molded (pre-molding substrate Sa) is securely pressed against the mold C to prevent lifting, and the outer edge of the object to be molded (pre-molding substrate Sa) can be pressed against it by the overall pressing member 14b, so that the entire object to be molded (pre-molding substrate Sa) can be securely pressed against the mold C.

[0085] (6) In the conveying device (loader 10) described in any one of (2) to (5) above, the film pressing member 16a may be in the shape of a rod with an R-shaped chamfer at its tip.

[0086] With this configuration, the film-holding member 16a is rod-shaped with a rounded chamfer at its tip, so it will not tear the film (release film F) with its edges.

[0087] (7) The characteristic configuration of the resin molding apparatus 30 described in any one of (1) to (6) above is that it comprises a mold C on which the object to be molded (substrate Sa before molding) is placed by a transport device (loader 10), and a mold clamping mechanism 5 for clamping the mold C.

[0088] With the resin molding apparatus 30 according to this characteristic configuration, after placing the object to be molded (pre-molded substrate Sa) onto the mold C using the transport device (loader 10) described in any one of (1) to (6) above, the mold C is clamped by the mold clamping mechanism 5 to manufacture a resin molded product (molded substrate Sb).

[0089] (8) The characteristics of the method for manufacturing a resin molded product (molded substrate Sb) using the resin molding apparatus 30 described in (7) above are that the method includes a supply step in which, after making holes in a film (release film F) with the film hole-punching mechanism 16, the object to be molded (substrate Sa before molding), which has been released from being held by the object to be molded holding part (substrate holding part 13), is placed on the mold C, and the object to be molded (substrate Sa before molding) is pressed toward the mold C with the object to be molded pressing part (pressing part 14) and resin material (resin tablet T, molten resin Ta) is supplied; a mold clamping step in which the mold C is clamped with the mold clamping mechanism 5; and a molding step in which the object to be molded (substrate Sa before molding) is resin molded.

[0090] In the method for manufacturing a resin molded product (molded substrate Sb) having these features, before placing the object to be molded (substrate Sa before molding) on ​​the mold C, a film hole punching mechanism 16 is used to punch holes in the film (release film F), and the object to be molded (substrate holding part 13) is released to place the object to be molded (substrate Sa before molding) on ​​the mold C. Subsequently, a supply process is performed in which the object to be molded (substrate Sa before molding) is pressed toward the mold C by the object to be molded pressing part (pressing part 14) and resin material (resin tablet T, molten resin Ta) is supplied. Next, a mold clamping process is performed in which the mold C is clamped by the mold clamping mechanism 5, and a molding process is performed in which the object to be molded (substrate Sa before molding) is resin molded to manufacture the resin molded product (molded substrate Sb). As a result, the resin molded product (molded substrate Sb) can be manufactured with the object to be molded (substrate Sa before molding) placed in the correct position relative to the mold C, and the resin molded product (molded substrate Sb) can be manufactured with high precision using the mold C. [Industrial applicability]

[0091] This invention can be used in conveying devices, resin molding devices, and methods for manufacturing resin molded products. [Explanation of symbols]

[0092] 5: Clamping mechanism 10: Loader (conveyor device) 13: Substrate holding section (molding object holding section) 14: Pressing part (part for holding the object to be molded) 14b: Overall retaining member 14c: Individual retaining member 16: Film hole punching mechanism 16a: Film retaining member 30: Resin molding equipment 37: Positioning pin (positioning part) 37a: First positioning pin (positioning part) 37b: Second positioning pin (positioning part) C: Molding mold F: Release film (film) Sa: Pre-molding substrate (object to be molded) Sb: Pre-molded substrate (resin molded product) T: Resin tablet (resin material) Ta: Molten resin (resin material)

Claims

1. A conveying device that has a positioning section for positioning an object to be molded, and that conveys and places the object to be molded into a mold in which the positioning section is covered with a film, while holding the object to be molded, A molded object holding section for holding the molded object, When the object to be molded, which has been released from being held by the object to be molded part, is placed on the mold, the object to be molded part presses the object to be molded toward the mold, The system includes a film perforation mechanism that causes the positioning unit to create holes in the film before the molding object pressing unit presses the molding object against it, The film perforation mechanism is provided in the molding object holding section and is a conveying device having a film holding member whose tip protrudes more than the molding object held in the molding object holding section.

2. The conveying device according to claim 1, wherein the film pressing member is provided on the molding object pressing portion via an elastic member.

3. The conveying device according to claim 1, wherein the film pressing member is provided on the outside of the object to be molded and is provided near the positioning portion, and presses the film to make holes in the film.

4. The conveying device according to claim 1, wherein the film pressing member is configured to be able to move horizontally while in contact with the film after pressing it down.

5. The conveying device according to claim 1, wherein the molding object pressing section has individual pressing members that press the molding object in the vicinity of the film pressing member.

6. The molding object holding portion has an overall holding member that presses the outer edge of the molding object toward the molding die, The conveying device according to claim 5, wherein the individual pressing member protrudes more than the overall pressing member so as to contact the object to be molded earlier than the overall pressing member when pressing the object to be molded toward the mold.

7. The conveying device according to any one of claims 1 to 6, wherein the film pressing member is rod-shaped with an R-shaped chamfer at its tip.

8. A conveying device according to any one of claims 1 to 6, The molding die on which the object to be molded is placed by the conveying device, A resin molding apparatus comprising a mold clamping mechanism for clamping the aforementioned molding die.

9. A method for manufacturing a resin molded product using the resin molding apparatus described in Claim 8, After the film is perforated by the film perforation mechanism, the object to be molded, which has been released from the object to be molded holder, is placed on the mold, and the object to be molded is pressed toward the mold by the object to be molded holder while supplying resin material; A mold clamping step in which the mold is clamped by the mold clamping mechanism, A method for manufacturing a resin molded product, comprising a molding step of performing resin molding of the object to be molded.

Images