Semiconductor equipment

Abstract

To enhance reliability.SOLUTION: The semiconductor device comprises: a first member that includes a side wall surrounding an opening for housing an electronic component, and a receiving portion provided so as to protrude from the side wall toward the opening; and a second member that extends in a first direction, includes an engagement portion fitted to the receiving portion, and covers at least a portion of the opening. The engagement portion has an extension portion extending in the first direction, and a pair of engagement claws protruding from the extension portion to one end side and the other end side in a second direction perpendicular to the first direction at a lower end of the extension portion. Each of the engagement claws has a first engagement surface that is continuous with a side surface of the extension portion intersecting with the first direction, and is inclined with respect to the first direction. The receiving portion has a pair of protruding portions that are provided to face the first engagement surfaces respectively, and include a protruding surface inclined with respect to the first direction. The lower side of the first engagement surface and the lower side of the protruding surface are inclined so as to be higher in a third direction perpendicular to the first direction and the second direction as they approach the side wall.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] Embodiments relate to a semiconductor device.

Background Art

[0002] As a semiconductor device, a semiconductor module including a housing that accommodates electronic components therein and a cover for the housing is known. In such a semiconductor device, electronic components arranged in the housing are protected.

Prior Art Literature

Patent Literature

[0003]

Patent Literature 1

Patent Literature 2

Patent Literature 3

Patent Literature 4

Summary of the Invention

Problem to be Solved by the Invention

[0004] An object of the present invention is to improve the reliability of a semiconductor device.

Means for Solving the Problem

[0005] The semiconductor device according to the embodiment comprises a first member having a side wall surrounding an opening for housing electronic components and a receiving portion provided to project from the side wall toward the opening, and a second member extending in a first direction and having an engaging portion fitted into the receiving portion, and covering at least a portion of the opening, wherein the engaging portion has an extended portion extending in the first direction and a pair of engaging claws at the lower end of the extended portion, each projecting from the extended portion to one end and the other end in a second direction perpendicular to the first direction, each of the engaging claws having a first engaging surface that is continuous with the side surface of the extended portion intersecting the first direction and inclined with respect to the first direction, and the receiving portion has a pair of protrusions provided to face each of the first engaging surfaces and including a projection surface inclined with respect to the first direction, the lower edge of the first engaging surface and the lower edge of the projection surface are inclined in a third direction perpendicular to the first and second directions, becoming higher as they approach the side wall. [Brief explanation of the drawing]

[0006] [Figure 1] A perspective view illustrating an example of the structure of a semiconductor device according to this embodiment. [Figure 2] A perspective view illustrating an example of the structure of a semiconductor device according to this embodiment. [Figure 3] A perspective view illustrating an example of the structure of the receiving portion and engaging portion of a semiconductor device according to an embodiment. [Figure 4] A plan view showing an example of the structure of the receiving portion of the semiconductor device according to the embodiment, as seen from the X direction. [Figure 5] A plan view showing an example of the structure of a portion included in the receiving part of the semiconductor device according to the embodiment, as viewed from the Y direction. [Figure 6] A plan view showing an example of the structure of the engagement portion of the semiconductor device according to the embodiment, as seen from the X direction. [Figure 7] A plan view showing an example of the structure of the engagement portion of the semiconductor device according to the embodiment, as seen from the Y direction. [Figure 8] A perspective view illustrating an example of the structure of the receiving portion and engaging portion of a semiconductor device according to an embodiment. [Figure 9]A perspective view showing an example of the structure of the engagement portion of a semiconductor device, as seen from the X direction, according to a modified example. [Figure 10] A plan view showing an example of the structure of the engagement portion of a semiconductor device, as seen from the Y direction, according to a modified example. [Modes for carrying out the invention]

[0007] Embodiments will be described below with reference to the drawings. In the following description, components having the same function and configuration will be denoted by the same reference numeral. Also, the dimensions and proportions in the drawings are not necessarily the same as those of reality.

[0008] 1 Embodiment A semiconductor device according to an embodiment will be described.

[0009] A semiconductor device according to the embodiment is, for example, a semiconductor module comprising electronic components. More specifically, a semiconductor device according to the embodiment is, for example, a power module semiconductor device comprising power semiconductor elements.

[0010] An example of the overall structure of a semiconductor device according to this embodiment will be described with reference to Figure 1. Figure 1 is a perspective view illustrating an example of the structure of a semiconductor device according to this embodiment.

[0011] In the following explanation, the Z direction corresponds to, for example, the direction perpendicular to the surface on which the cover of the semiconductor device is provided. The X direction is parallel to the said surface. The Y direction is parallel to the said surface and perpendicular to the X direction.

[0012] The semiconductor device 1 includes a housing 10, covers 20 and 30, and terminals T1, T2, and T3. In the following description, of the semiconductor device 1, the side on which covers 20 and 30 are provided and the side covered by the housing will be referred to as the upper side. Also, of the side on which covers 20 and 30 are provided and the side covered by the housing will be referred to as the lower side.

[0013] The case 10 protects electronic components included in the semiconductor device 1, for example, on the side surfaces and the bottom surface. The case 10 contains, for example, a synthetic resin. Terminals T1 and T2 are provided on the case 10, for example. Each of the terminals T1 and T2 has, for example, a connection terminal and a screw hole into which a bus bar can be screwed. Electric power and signals for driving the semiconductor device 1 are supplied to the terminals T1 and T2 from the outside of the semiconductor device 1, for example. Although an example according to the embodiment shows an example in which two types of terminals T1 and T2 are provided on the case 10, the present invention is not limited thereto. The number of types of terminals provided on the case 10 may be 0, 1, or 3 or more. Furthermore, in the following description, among the terminals T1 and T2, the terminal T1 side is referred to as one end side in the Y direction. Further, among the terminals T1 and T2, the terminal T2 side is referred to as the other end side in the Y direction.

[0014] The covers 20 and 30 are provided so as to cover at least a part of the top surface of the case 10, for example. The covers 20 and 30 are provided so as to be aligned in the Y direction, for example. The covers 20 and 30 contain, for example, a synthetic resin.

[0015] A terminal T3 is provided on the cover 20, for example. The structure of the terminal T3 is the same as the structure of the terminals T1 and T2. Similarly to the terminals T1 and T2, electric power and signals for driving the semiconductor device 1 are supplied to the terminal T3 from the outside of the semiconductor device 1, for example. Although an example according to the embodiment shows an example in which the terminal T3 is provided on the cover 20 and no terminal is provided on the cover 30, the present invention is not limited thereto. Each of the covers 20 and 30 may or may not be provided with a terminal.

[0016] Next, an example of the overall structure of the semiconductor device according to the embodiment will be described with reference to FIG. 2. FIG. 2 is a perspective view for explaining an example of the structure of the semiconductor device according to the embodiment. In FIG. 2, the semiconductor device 1 is illustrated in a state where the covers 20 and 30 are removed.

[0017] The housing 10 further includes side walls 12. The housing 10 is provided with an opening 11 that is formed to be surrounded by the side walls 12 and has an open top. A semiconductor section 40 on which multiple semiconductor elements are mounted is housed inside the opening 11. The housing 10 further includes receiving portions 50-1 and 50-2 that are provided to protrude from the side walls 12 and are used to fix the cover 20. In the following description, when receiving portions 50-1 and 50-2 are not distinguished, they will each simply be referred to as receiving portion 50. Details of the structure of receiving portion 50 will be described later. In the following description, the side on which receiving portion 50-1 is provided will be referred to as one end in the X direction. The side on which receiving portion 50-2 is provided will be referred to as the other end in the X direction.

[0018] Furthermore, the housing 10 further includes connection parts 13 and 14. The connection parts 13 and 14 are made of a conductor, for example, a metal. Connection part 13 is provided to electrically connect the semiconductor part 40 and terminal T1. Connection part 14 is provided to electrically connect the semiconductor part 40 and terminal T2. Note that only a portion of the structure of connection parts 13 and 14 is shown in Figure 2.

[0019] The cover 20 further includes engaging portions 60-1 and 60-2. Engaging portions 60-1 and 60-2 are provided corresponding to receiving portions 50-1 and 50-2 of the housing 10, respectively. Engaging portions 60-1 and 60-2 are made of, for example, synthetic resin. The synthetic resin includes, for example, polyamide. The cover 20 is fixed to the housing 10 by fitting engaging portions 60-1 and 60-2 into the receiving portions 50-1 and 50-2, respectively. In the following description, when engaging portions 60-1 and 60-2 are not distinguished, they will each be simply referred to as engaging portion 60. Details of the structure of engaging portion 60 will be described later.

[0020] The cover 20 also further includes, for example, a connecting portion 21. The connecting portion 21 is made of, for example, a conductor containing metal. The connecting portion 21 is electrically connected to terminal T3 in an area not shown. The connecting portion 21 is provided to electrically connect the semiconductor portion 40 and terminal T3.

[0021] The cover 30 is fixed to the housing 10, for example, by an adhesive member (not shown). The cover 30 may also include engaging portions for fixing it to the housing 10, similar to the cover 20. In this case, the housing 10 further includes receiving portions corresponding to the engaging portions of the cover 30.

[0022] Next, the structure of the receiving portion 50 in the embodiment will be described. The receiving portions 50-1 and 50-2 are provided symmetrically with respect to the YZ plane, for example. For this reason, the structure of the receiving portion 50-1 will be described below using Figures 3, 4, and 5, and the description of the structure of the receiving portion 50-2 will be omitted. Figure 3 is a perspective view showing an example of the structure of the receiving portion and engaging portion of the semiconductor device according to the embodiment. Figure 4 is a plan view showing an example of the structure of the receiving portion of the semiconductor device according to the embodiment as viewed from the X direction. Figure 5 is a plan view showing an example of the structure of the portion included in the receiving portion 50 according to the embodiment as viewed from the Y direction. More specifically, Figure 4 shows the structure of the receiving portion 50 according to the embodiment when viewed from the other end to the one end in the X direction. Also, Figure 5 shows the structure of the portion included in the one end in the Y direction of the receiving portion 50 according to the embodiment when viewed from the other end to the one end in the Y direction.

[0023] The receiving portion 50 is provided so as to protrude in the X direction from the side wall 12 toward the opening 11. The side wall 12 is also provided with two guide portions 70 that protrude in the X direction from the side wall 12 toward the opening 11. The receiving portion 50 is sandwiched in the Y direction by the two guide portions 70. More specifically, the receiving portion 50 is sandwiched by the sides of the two guide portions 70, one end and the other end in the Y direction, which are opposite each other in the Y direction. In Figure 3, the guide portion 70 at the other end in the Y direction is shown by a dotted line.

[0024] The receiving portion 50 includes a wall portion 51, two protrusions 52, two first slope portions 53, and a second slope portion 54. Note that the wall portion 51 and the second slope portion 54 are not shown in Figure 5.

[0025] The wall portion 51 has, for example, a plane that aligns with the YZ plane. This plane is in contact with the side surfaces of one end and the other end of the guide portion 70 in the X direction.

[0026] One of the two projections 52, the projection 52 at one end in the Y direction, contacts, for example, the side surface of the guide portion 70 at the one end in the Y direction. The other projection 52 at the other end in the Y direction also contacts, for example, the side surface of the guide portion 70 at the other end in the Y direction. The projections 52 are provided so as to protrude from the wall portion 51, for example. The projections 52 have a thickness W1 in the X direction, as shown in Figure 5. The thickness W1 is, for example, 1 mm or more. Also, the thickness W1 is smaller than the thickness W2 of the portion of the guide portion 70 that is included at the other end in the X direction from the wall portion 51, as shown in Figure 3. The two projections 52 are provided symmetrically with respect to the XZ plane. For this reason, the following description will mainly focus on the structure of the projection 52 at one end in the Y direction, and will omit the description of the structure of the projection 52 at the other end in the Y direction.

[0027] The projection 52 has projection surfaces 52a and 52b. The projection surface 52a has, for example, a plane aligned with the YZ plane. As shown in Figure 4, the projection surface 52a has a triangular shape with, for example, a side aligned with the Y direction, a side aligned with the Z direction connected to the side surface of the guide portion 70, and a hypotenuse intersecting the Y and Z directions. On the projection surface 52a, the angle between the side aligned with the Z direction and the hypotenuse has an angle θ1, as shown in Figure 4. The angle θ1 is, for example, less than 90°. With the above configuration, the two projections 52 on the receiving portion 50 are provided such that the width of the region enclosed by the two projections 52 increases from top to bottom. The projection surface 52b has, for example, a plane inclined with respect to the Y direction. As shown in Figure 5, the projection surface 52b has a quadrilateral shape, as viewed from the Y direction, for example, with two sides along the Z direction and an upper and lower side intersecting the Z direction, and the upper and lower sides become higher from one end to the other in the X direction. More specifically, the projection surface 52b has a parallelogram shape, for example. The acute angle θ2 between the lower side of the projection surface 52b and the X direction is, for example, 5° or more and 20° or less (5≦θ2≦20). The projection surface 52b is a surface that has been roughened by mechanical polishing, chemical treatment using chemicals, and treatment of the surface portion of the inner surface of the mold corresponding to the projection surface when forming the receiving portion 50. As a result, the surface roughness (Ra) of the projection surface 52b is, for example, 10 μm (micrometers) or more. Furthermore, the projection surface 52b is rougher (has a higher surface roughness) than the other surfaces included in the receiving portion 50.

[0028] Each of the two first slope sections 53 is provided corresponding to two projections 52. Each first slope section 53 is connected to the upper end of the corresponding projection 52. One of the two first slope sections 53, on one end in the Y direction, is in contact with the side surface of the guide section 70 on the one end in the Y direction. The other of the two first slope sections 53, on the other end in the Y direction, is in contact with the side surface of the guide section 70 on the other end in the Y direction. Each of the two first slope sections 53 is provided so as to protrude from, for example, the wall section 51. The two first slope sections 53 are provided such that the area between them is separated by a distance W3 in the Y direction. The distance W3 is, for example, about 10 mm. The two first slope sections 53 are provided symmetrically with respect to the XZ plane. Therefore, the following description will mainly focus on the structure of the first slope section 53 at one end in the Y direction, and will omit the description of the structure of the first slope section 53 at the other end in the Y direction.

[0029] The first slope section 53 has slope surfaces 53a and 53b. The slope surface 53a has, for example, a rectangular shape, as shown in Figure 4. The slope surface 53a has, for example, a plane that aligns with a plane obtained by rotating the YZ plane by a predetermined angle in the Y direction, as shown in Figure 5. More specifically, the slope surface 53a is inclined from bottom to top so as to approach the side wall 12. The slope surface 53a is connected, for example, at its lower end to the upper end of the projection surface 52a. The slope surface 53a is also connected to the side surface of the guide section 70 on one end in the Y direction. The slope surface 53b has, for example, a plane that aligns with the XZ plane. The slope surface 53b has, for example, a triangular shape. The slope surface 53b is connected at its lower end to the upper end of the projection surface 52b.

[0030] The second slope section 54 has a slope surface 54a. The slope surface 54a has a plane that aligns with a plane obtained by rotating the YZ plane by a predetermined angle in the Y direction, for example. With respect to the YZ plane, the rotation angle of the slope surface 54a in the Y direction and the rotation angle of the slope surface 53a in the Y direction are, for example, equivalent. The lower end of the slope surface 54a is connected to the upper end of the slope surface 53a at one end and the other end along the Y direction. The slope surface 54a has, for example, a rectangular shape. With the above configuration, the slope surface 54a is provided integrally with the two slope surfaces 53a. The second slope section 54 is provided, for example, in the X direction, similar to the wall section 51, on one end side in the X direction of the two protrusions 52 and the two first slope sections 53. The slope surface 54a is also connected to the sides of the two guide sections 70 at one end and the other end in the Y direction.

[0031] Next, the engaging portion 60 in the embodiment will be described. Note that the engaging portions 60-1 and 60-2 are provided symmetrically with respect to the YZ plane, for example. For this reason, the structure of the engaging portion 60-1 will be described below using Figures 3, 6, and 7, and the description of the structure of the engaging portion 60-2 will be omitted. Figure 6 is a plan view showing an example of the structure of the engaging portion of the semiconductor device 1 according to the embodiment as viewed from the X direction. Figure 7 is a plan view showing an example of the structure of the engaging portion of the semiconductor device according to the embodiment as viewed from the Y direction. More specifically, Figure 6 shows the structure of the engaging portion 60-1 according to the embodiment as viewed from the other end to the one end in the X direction. Also, Figure 7 shows the structure of the engaging portion 60-1 according to the embodiment as viewed from the one end to the other end in the Y direction.

[0032] The engaging portion 60 has a plate-like structure with a plane aligned with the YZ plane. As shown in Figure 7, the engaging portion 60 has a thickness W4 in the X direction. The thickness W4 is, for example, less than or equal to the thickness W1. The thickness W4 is, for example, about 1 mm.

[0033] The engaging portion 60 includes an extended portion 61 and a pair of engaging claws 62. The structure of the engaging portion 60 is, for example, symmetrical with respect to the XZ plane.

[0034] As shown in Figure 6, the extended portion 61 has a rectangular shape when viewed from the X direction. The extended portion 61 is the area enclosed by the dotted line in Figure 6. The width W5 of the extended portion 61 in the Y direction is less than or equal to the spacing W3.

[0035] The engaging claws 62 are provided so as to protrude symmetrically from the extended portion 61 at one end and the other end in the Y direction. With this configuration, the engaging portion 60 has a spatula-like shape that is symmetrical with respect to the XZ plane. As a result, the width W6 in the Y direction of the lower edge of the engaging portion 60 in the portion including the two engaging claws 62 is wider than the spacing W3 and width W5. Due to the symmetrical structure of the engaging claws 62 described above, the structure of the engaging claw 62 on one end in the Y direction will be mainly described below, and the description of the structure of the engaging claw 62 on the other end in the Y direction will be omitted.

[0036] The engaging claw 62 has, for example, an engaging surface 62a along the YZ plane, and engaging surfaces 62b and 62c that intersect the YZ plane.

[0037] The engaging surface 62a has a trapezoidal shape including two sides along the Z direction, a side along the Y direction, and a hypotenuse that intersects the Y and Z directions. The engaging surface 62a at one end in the Y direction is provided such that its width in the Z direction narrows from the other end in the Y direction towards the one end. The angle θ3 between the hypotenuse of the engaging surface 62a and the boundary line along the Z direction of the engaging claw 62 and the extension portion 61 is equivalent to, for example, angle θ1.

[0038] The engaging surface 62b is connected to the side surface of the extension portion 61 along the XZ plane. Furthermore, as described above, due to the inclination of the hypotenuse of the engaging surface 62a, the engaging surface 62b, like the protruding surface 52b, has a plane inclined with respect to the Y direction. As shown in Figure 7, the engaging surface 62b has a quadrilateral shape, for example, having two sides along the Z direction, and an upper and lower side intersecting the Z direction, with the upper and lower sides becoming higher from the other end to the one end in the X direction. More specifically, the engaging surface 62b has a parallelogram shape, for example. The angle θ4 between the lower side of the engaging surface 62b and the X direction is greater than 0°. The angle θ4 is, for example, between 5° and 20° (5≦θ4≦20). Also, the angle θ4 is, for example, equivalent to the angle θ2. The engaging surface 62b is a surface that has been roughened by mechanical polishing, chemical treatment using chemicals, and treatment of the inner surface of the mold corresponding to the engaging surface when forming the engaging portion 60. As a result, the surface roughness (Ra) of the engaging surface 62b is, for example, 10 μm or more. Furthermore, the engaging surface 62b is rougher (has a higher surface roughness) than the other surfaces included in the engaging portion 60. In addition, as shown in Figure 7, the engaging surface 62c has a quadrilateral shape having, for example, two sides along the Z direction, a side along the X direction, and a side that intersects the X and Z directions.

[0039] Next, a structure in which the engaging portion 60 is fixed to the receiving portion 50 in the semiconductor device 1 according to the embodiment will be described with reference to Figure 8. Figure 8 is a perspective view showing an example of the structure of the receiving portion and the engaging portion of the semiconductor device according to the embodiment.

[0040] In the semiconductor device 1 according to this embodiment, the engaging portion 60 is fixed to the receiving portion 50 by sliding the engaging portion 60 downward. More specifically, as the engaging portion 60 slides downward, the engaging portion 60 deforms along the planes of the projection surface 52a, the slope surface 53a, and the second slope portion 54. Then, for example, when the engaging portion 60 is slid further downward so that the engaging claw 62 is positioned below the first slope portion 53, the engaging portion 60 returns to its original shape. At the same time, a portion of the engaging portion 60 is positioned between the two projections 52 and the two first slope portions 53.

[0041] With the configuration of the receiving portion 50 and the engaging portion 60 as described above, when the engaging portion 60 is fitted into the receiving portion 50, the engaging surface 62b can come into overall contact with the protruding surface 52a.

[0042] According to the embodiment, the reliability of the semiconductor device can be improved. The improvement in reliability by the semiconductor device 1 according to the embodiment will be described below.

[0043] The semiconductor device 1 according to this embodiment includes a housing 10 having an opening 11 for housing a semiconductor part 40 and a receiving part 50 that is provided to protrude from the inner side wall 12 of the opening 11 and into which an engaging part 60 fits, and a cover 20 having an engaging part 60 extending in the Z direction. The engaging part 60 has an extended part 61 and a pair of engaging claws 62 at the lower end of the extended part 61 that protrude from the extended part 61 in the Y direction. Each engaging claw 62 has an engaging surface 62b that is continuous with the side surface of the extended part 61 and inclined with respect to the Z direction. The receiving part 50 is provided to face the engaging surface 62b and has a projection 52 having a projection surface 52b that is inclined with respect to the Z direction. Furthermore, the lower edge of the engaging surface 62b and the lower edge of the projection surface 52b are inclined along the X direction such that they become higher as they approach the side wall. This configuration prevents the engaging portion 60 from coming loose from the receiving portion 50 due to the engaging surface 62b shifting toward the opening 11 when the engaging portion 60 is fixed to the receiving portion 50. This prevents the cover 20 of the semiconductor device 1 from coming off, thereby improving the reliability of the semiconductor device 1.

[0044] To elaborate, if the projection surface of the receiving part is rectangular in shape, including its lower edge along the X direction, as viewed from the Y direction, then the engagement surface of the engaging part that contacts this projection surface will also be rectangular in shape, including its lower edge along the X direction, as viewed from the Y direction. In such cases, the balance of forces acting on the engaging part and the receiving part may be disrupted due to the application of force to the cover, and misalignment of the receiving part and the engaging part when the engaging part is fixed to the receiving part, causing the engagement surface to shift towards the opening of the housing. This can cause the engaging part to detach from the receiving part. For this reason, the cover of the semiconductor device may come off, even if no force is applied that would physically break the engaging part.

[0045] According to the embodiment, the projection surface 52b of the receiving portion 50 and the engagement surface 62b of the engaging portion 60 each have a parallelogram shape with, for example, two sides aligned in the Z direction when viewed from the Y direction. Furthermore, the lower edges of the projection surface 52b and the engaging surface 62b are configured to rise toward the side wall 12 when viewed from the Y direction. With this configuration, when the engaging portion 60 is fixed to the receiving portion 50, for example, the balance between the supporting force of the receiving portion 50 and the tensile force of the engaging portion 60 is disrupted, which prevents the engaging portion 60 from coming out of the receiving portion 50.

[0046] Furthermore, the protruding surface 52b and the engaging surface 62b are roughened surfaces. This suppresses a decrease in the coefficient of friction of the protruding surface 52b and the engaging surface 62b, and improves the frictional force acting between the protruding surface 52b and the engaging surface 62b. As a result, the anchoring effect prevents the engaging portion 60 from coming out of the receiving portion 50.

[0047] Furthermore, the angle θ2 between the lower edge of the projection surface 52b and the X direction, and the angle θ4 between the lower edge of the engagement surface 62b and the X direction are equal to each other. This allows the engagement surface 62b to be in overall contact with the projection surface 52b. Therefore, the frictional force acting between the projection surface 52b and the engagement surface 62b can be effectively improved.

[0048] Furthermore, in the semiconductor device 1 according to this embodiment, angles θ2 and θ4 are each between 5° and 20°. If angles θ2 and θ4 are 5° or more, the disengagement of the engaging portion 60 from the receiving portion 50 is effectively suppressed. Also, if angles θ2 and θ4 are 20° or less, the destruction of the receiving portion 50 and the engaging portion 60 due to a decrease in strength or the like is effectively suppressed.

[0049] 2. Variations Next, a semiconductor device relating to a modified example will be described. In the following, the description of configurations equivalent to those in the embodiment will be omitted, and the description will mainly focus on configurations that differ from those in the embodiment.

[0050] In the above-described embodiment, the engaging claw 62 of the engaging portion 60 is shown to include one engaging surface 62b and one engaging surface 62c when viewed from the Y direction, but it is not limited to this. The engaging claw 62 of the engaging portion 60 may include two engaging surfaces 62b when viewed from the Y direction.

[0051] In the modified semiconductor device 1, the configuration of the housing 10 including the receiving portion 50, the terminal T3 and connecting portion 21 on the cover 20, and the cover 30 are the same as in the embodiment. Below, the structure of the engaging portion 60 provided in the modified semiconductor device 1 will be described using Figures 9 and 10 to show how it differs from the structure of the engaging portion 60 provided in the semiconductor device 1 according to the embodiment. Figure 9 is a perspective view showing an example of the structure of the engaging portion of the modified semiconductor device as seen from the X direction. Figure 10 is a plan view showing an example of the structure of the engaging portion of the modified semiconductor device as seen from the Y direction. More specifically, Figure 10 shows the structure of the engaging portion 60-1 of the modified device as seen from one end to the other end in the Y direction. Note that the structure of the engaging portion of the modified semiconductor device as seen from the X direction can be substantially the same as the structure of the engaging portion of the semiconductor device according to the embodiment as seen from the X direction, as explained using Figure 6, so its explanation is omitted.

[0052] The structure of the extended portion 61 of the engaging portion 60 in the modified example is substantially the same as the structure of the extended portion 61 of the engaging portion 60 in the embodiment.

[0053] In the modified example, the engaging claw 62 has engaging surfaces 62b1, 62b2, and 62c that intersect with the YZ plane. The engaging surfaces 62b1 and 62b2 are roughened surfaces achieved by mechanical polishing, chemical treatment using chemicals, and treatment of the corresponding parts of the inner surface of the mold when forming the engaging portion 60. As a result, the surface roughness (Ra) of the engaging surfaces 62b1 and 62b2 is, for example, 10 μm or more. Furthermore, the engaging surfaces 62b1 and 62b2 are rougher (have a higher surface roughness) than the other surfaces included in the engaging portion 60. The engaging surface 62b1 is provided to correspond to the projection surface 52b. As shown in Figure 10, the engaging surface 62b1 has, for example, two sides along the Z direction, and an upper and lower side that intersect with the Z direction, and has a rectangular shape in which the upper and lower sides become higher from the other end to the one end in the X direction. More specifically, the engaging surface 62b1 has, for example, a parallelogram shape. The angle between the bottom edge of the engaging surface 62b1 and the X direction is θ4. The engaging surface 62b2 is provided symmetrically to the engaging surface 62b1 with respect to the YZ plane, as shown in Figure 10. The engaging surface 62c has a pentagonal shape, for example, a side along the X direction, two sides along the Z direction, and two sides intersecting the X and Z directions, due to the configuration of the engaging surfaces 62b1 and 62b2 as described above.

[0054] The reliability of the semiconductor device 1 can also be improved by the modified configuration, similar to the embodiment.

[0055] Furthermore, in the modified version, the engaging surfaces 62b1 and 62b2 are provided symmetrically with respect to the YZ plane, thereby improving versatility. That is, for example, the cover 20 can be manufactured without distinguishing the orientation of the engaging portions 60-1 and 60-2.

[0056] 3. Others Although several embodiments have been described above, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0057] 1... Semiconductor device, 10... Housing, 20, 30... Cover, 40... Semiconductor part, 50... Receiving part, 60... Engaging part.

Claims

1. A first member having a side wall surrounding an opening for housing electronic components, and a receiving portion provided so as to protrude from the side wall toward the opening, A second member extending in a first direction and having an engaging portion that fits into the receiving portion, covering at least a portion of the opening, Equipped with, The engagement portion has an extension portion extending in the first direction, and a pair of engagement claws at the lower end of the extension portion, each protruding from the extension portion in a second direction perpendicular to the first direction, one end and the other end. Each of the engagement claws has a first engagement surface that is continuous with the side surface of the extension portion intersecting the first direction and is inclined with respect to the first direction. The receiving portion is provided so as to face each of the first engaging surfaces and has a pair of projections including a projection surface inclined with respect to the first direction, The lower edge of the first engagement surface and the lower edge of the projection surface are inclined such that they become higher closer to the side wall in a third direction perpendicular to the first and second directions. Semiconductor equipment.

2. The lower edge of the first engagement surface and the lower edge of the projection surface are inclined at an angle of 5° to 20° with respect to the third direction. The semiconductor device according to claim 1.

3. The first engagement surface and the protruding surface are roughened surfaces. The semiconductor device according to claim 1.

4. The surface roughness of the first engaging surface and the surface roughness of the protruding surface are 10 micrometers or more. The semiconductor device according to claim 3.

5. The engaging claw further has a second engaging surface that is continuous with the side surface of the extended portion and inclined with respect to the first direction, The lower edge of the second engagement surface is inclined such that it becomes higher as it moves away from the side wall with respect to the third direction. The semiconductor device according to claim 1.

6. The engaging portion is symmetrical with respect to a plane including the first and second directions. The semiconductor device according to claim 5.

7. The engaging portion is symmetrical with respect to a plane including the first and third directions. The semiconductor device according to claim 1.

8. The aforementioned electronic component is a power semiconductor. The semiconductor device according to claim 1.

9. A first member having a side wall surrounding an opening for housing electronic components, and a receiving portion provided so as to protrude from the side wall toward the opening, A second member extending in a first direction and having an engaging portion that fits into the receiving portion, covering at least a portion of the opening, Equipped with, The engagement portion has an extension portion extending in the first direction, and a pair of engagement claws at the lower end of the extension portion, each protruding from the extension portion in a second direction perpendicular to the first direction, one end and the other end. Each of the engagement claws has an engagement surface that is continuous with the side surface of the extension portion intersecting the first direction and is inclined with respect to the first direction. The receiving portion is provided so as to face each of the engaging surfaces and has a pair of protrusions, including a projection surface inclined with respect to the first direction, The engaging surface and the protruding surface are surfaces that have been roughened. Semiconductor equipment.

10. The surface roughness of the engagement surface and the surface roughness of the protruding surface are 10 micrometers or more. The semiconductor device according to claim 9.

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