Pad surface cleaning device around the pad conditioner to allow inset pad adjustment

Abstract

The present disclosure relates to a pad surface cleaning system to be used with a conditioning module for conditioning the polishing surface of a polishing pad. The pad surface cleaning system can be used to spray a high-pressure fluid spray onto the polishing surface to loosen debris from the polishing surface. The pad surface cleaning system can also be used to remove the loosened debris. Furthermore, the pad surface cleaning system can separate the conditioning disk from the polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to an apparatus and a method for conditioning a polishing pad. More specifically, embodiments of the present disclosure relate to a pad surface cleaning system for removing debris from a polishing pad and isolating a conditioning disc from polishing fluid.

Background Art

[0002] A processing station for performing a polishing process, such as a chemical mechanical planarization (CMP) or electrochemical mechanical planarization (ECMP) process, uses a polishing pad and a polishing fluid to polish a substrate. The polishing surface of the polishing pad contacts the substrate, removes fragments of the substrate, planarizes the substrate, and smoothes the surface of the substrate. The polishing fluid may be disposed between the polishing surface and the substrate to facilitate material removal. The polishing pad may have a rough surface for contacting the substrate. Over time, the rough surface may become smoothed, and the polishing pad may no longer planarize the substrate. In addition, fragments of the substrate or abrasive particles from the polishing fluid may be embedded in or smeared onto the polishing pad, resulting in less effective planarization or contamination of subsequent substrates polished by the polishing pad.

[0003] A conditioning disc is used together with a polishing fluid to condition the polishing surface and remove embedded material. Conventional methods of conditioning a polishing pad involve conditioning the polishing pad between polishing steps in separate steps, where no other polishing action can be performed. The separate step may increase the time required for polishing the substrate and reduce the availability of the processing station. The polishing fluid may degrade or corrode the conditioning disc, or alternatively, the conditioning disc may further cause embedded materials to adhere, or may embed fragments of the conditioning disc that can be removed during conditioning.

[0004] Therefore, what is needed in the art is an apparatus and a method for solving the problems described above.

Summary of the Invention

[0005] This disclosure relates in general to apparatus and methods for preparing polishing pads. More specifically, embodiments of this disclosure relate to a pad surface cleaning system for removing debris from a polishing pad and isolating the polishing disc from the polishing fluid.

[0006] Several embodiments provide a polishing pad cleaning system for a substrate polishing process. The polishing pad cleaning system comprises an outer wash ring having an outer nozzle, configured such that the outer nozzle is coupled to a first fluid source; an inner wash ring having an inner nozzle, configured such that the inner nozzle is coupled to a second fluid source; and a vacuum ring, which forms a vacuum port configured such that the vacuum ring is fluidly coupled to a vacuum source. An adjustment disc is disposed within the polishing pad cleaning system and configured to adjust the polishing pad. The outer nozzle is configured to discharge debris from the substrate polishing process. The inner nozzle is configured to discharge debris from adjusting the polishing pad, and the vacuum ring is configured to remove the debris discharged by the outer and inner wash rings.

[0007] Another embodiment provides an adjustment system for adjusting a polishing pad. This adjustment system comprises an adjustment module having an adjustment arm and an adjustment head, wherein the adjustment head is configured to move an adjustment disc relative to the polishing pad, and a polishing pad cleaning system coupled to the adjustment arm. The polishing pad cleaning system comprises an outer wash ring having an outer nozzle configured to be coupled to a first fluid source, a vacuum ring having a vacuum port configured to be coupled to a vacuum source, and an inner wash ring having an inner nozzle configured to be coupled to a second fluid source.

[0008] Other embodiments provide a method for adjusting a polishing pad. This method includes positioning an adjustment disc on a polishing pad in a polishing pad cleaning system. The polishing pad cleaning system comprises an outer wash ring having an outer nozzle, the outer nozzle being coupled to a first fluid source; an inner wash ring having an inner nozzle, the inner nozzle being coupled to a second fluid source; and a vacuum ring, the vacuum ring forming a vacuum port fluidly coupled to a vacuum source. The method further includes flowing fluid from a first fluid source through the outer nozzle to dislodge debris from the polishing pad during a substrate polishing process and removing debris from the polishing pad during a substrate polishing process through the vacuum port by creating negative pressure using the vacuum source; flowing fluid from a second fluid source through the inner nozzle to dislodge debris from the polishing pad during a substrate polishing process and removing debris from the polishing pad during a substrate polishing process through the vacuum port by creating negative pressure using the vacuum source.

[0009] To allow for a more detailed understanding of the features described above, a more detailed description of the disclosure, which is briefly summarized above, may be made by reference to embodiments partially shown in the accompanying drawings. However, it should be noted that the accompanying drawings are illustrative embodiments only and should not be considered as limiting the scope of the disclosure, as the disclosure may allow for other equally valid embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] This is a top view of a processing station according to several embodiments. [Figure 2] This is a schematic side view of a processing station according to several embodiments. [Figure 3] This is a top view of a pad surface cleaning system according to several embodiments. [Figure 4A]Figure 3 shows a schematic side view of a pad surface cleaning system according to several embodiments. [Figure 4B-4C] Figure 4A shows a schematic side view of a pad surface cleaning system according to several embodiments. [Figure 5] This is a schematic side view of a rotatable pad surface cleaning system according to several embodiments. [Figure 6A-6B] These are top views of different pad surface cleaning systems according to several embodiments. [Figure 6C] These are top views of different pad surface cleaning systems according to several embodiments. [Figure 7] This is a schematic top view of a pad surface cleaning system that moves relative to a polishing fluid supply point, according to several embodiments. [Figure 8] This is a schematic top view of a pad surface cleaning system and a polishing fluid supply point that moves relative to the polishing pad, according to several embodiments. [Figure 9] This is a functional block diagram of a system controller for a pad surface cleaning system according to several embodiments. [Figure 10] This is a flowchart of a method for adjusting a polishing pad according to several embodiments. [Modes for carrying out the invention]

[0011] For ease of understanding, the same reference numerals are used to designate identical elements common to the figures where possible. It is intended that elements and features of one embodiment may be usefully incorporated into other embodiments without further description.

[0012] The following description includes numerous specific details to provide a more complete understanding of the disclosure. However, it will be apparent to those skilled in the art that some embodiments of the disclosure can be practiced without one or more of these specific details. In other instances, well-known features are omitted to avoid obscuring one or more embodiments of the disclosure.

[0013] This disclosure relates to a pad surface cleaning system to be used in conjunction with a conditioning module for conditioning the polishing surface of a polishing pad. The pad surface cleaning system may be used to spray a high-pressure fluid spray onto the polishing surface to remove debris from the polishing surface. The pad surface cleaning system may also be used to remove the removed debris. Furthermore, the pad surface cleaning system may separate the conditioning disc from the polishing fluid to protect the conditioning disc from reacting with the polishing fluid.

[0014] The methods and systems disclosed herein may offer features that overcome many of the drawbacks associated with conventional processing stations for carrying out the polishing processes described above.

[0015] Example of a processing station for the polishing process Figure 1 shows a top view of a processing station 100 according to several embodiments. The processing station 100 is configured to perform a polishing process, such as a chemical mechanical planarization (CMP) or electrochemical mechanical planarization (ECMP) process, and is also configured to clean the polishing surface 102 of the polishing pad 104. The processing station 100 may be a standalone unit or part of a larger processing system.

[0016] The processing station 100 includes a substrate carrier head 106 (shown in imaginary lines), a platen 108, a conditioning module 110, and a polishing fluid supply assembly such as a slurry supply assembly 112. The platen 108, the conditioning module 110, and the slurry supply assembly 112 may be attached to a base 114 of the processing station 100.

[0017] The platen 108 supports a polishing pad 104. The platen 108 is rotated by a motor (not shown), and thus the polishing pad 104 is rotated relative to a substrate 116 held in the substrate carrier head 106 during processing. Accordingly, terms such as upstream, downstream, in front, behind, incoming, outgoing, before, and after should generally be interpreted as appropriate with respect to the movement or direction of the platen 108 and the polishing pad 104 supported thereon.

[0018] The substrate carrier head 106 holds the substrate 116 and is configured to controllably move the substrate 116 against the polishing surface 102 of the polishing pad 104 during processing. The substrate carrier head 106 may also rotate the substrate 116 during processing.

[0019] The conditioning module 110 is configured to condition the polishing pad 104 by opening pores of the polishing pad 104. The conditioning module 110 includes a support assembly 136, a conditioning arm 121, a conditioning head 120, and a conditioning disc 118. The conditioning disc 118 may be a brush having bristles made of a polymer material, or may have an abrasive surface provided with abrasive particles. In some embodiments, the conditioning disc 118 is a circular disc containing abrasive particles, such as diamond. The conditioning head 120 holds the conditioning disc 118 and is configured to controllably move the conditioning disc 118 against the polishing surface 102 of the polishing pad 104 during conditioning.

[0020] The conditioning disc 118 may be coupled to the conditioning head 120 by a passive mechanism, such as a magnet or a pneumatic actuator, that utilizes the existing upward and downward movement of the conditioning arm 121. The conditioning disc 118 generally extends beyond the housing of the conditioning head 120 by between about 0.2 mm and about 1 mm to contact the polishing surface 102. The conditioning disc 118 may be made of nylon, cotton cloth, a polymer, or other soft material that does not damage the polishing surface 102. Alternatively, the conditioning disc 118 may be made of a textured polymer or stainless steel having a rough surface with diamond particles adhered or formed thereon. The diamond particles may range in size from between about 30 microns and about 100 microns. The conditioning head 120 may also rotate the conditioning disc 118 during conditioning.

[0021] The conditioning module 110 is adapted to move the conditioning head 120, and thus the conditioning disc 118, in a linear, arcing or sweeping motion from an edge of the diameter of the polishing pad 104 (e.g., the circumference of the polishing pad 104) to at least a portion of the radius of the polishing pad 104. In particular, a support assembly 136 may position the conditioning head 120. Movement of the conditioning head 120 may be configured such that the entire surface of the polishing pad is conditioned. The slurry supply assembly 112 is configured to supply a polishing medium, such as a fluid or slurry 123, to the polishing pad 104 while a substrate 116 is being polished on the polishing surface 102. As one skilled in the art will appreciate, the polishing pad 104 may include any features that will retain the slurry 123, such as pores and / or polishing pad grooves found in polishing pads. The slurry supply assembly 112 includes a polishing fluid supply arm, such as a slurry supply arm 122 that may be positioned forward or rearward of the substrate carrier head 106. The slurry supply arm 122 supplies the slurry 123 onto the polishing surface 102. The slurry supply arm 122 and the carrier head 106 may similarly move in a linear, arcing or sweeping motion.

[0022] The system controller 190 can instruct various operations of the processing station 100, such as controlling the movement of the processing station 100. For example, the system controller 190 can move and control the positions of the platen 108, the adjustment arm 121, and the slurry supply arm 122 so that the polishing pad 104 is adjusted and the substrate 116 is polished. The system controller 190 will be further described with reference to Figure 9.

[0023] In some embodiments, the slurry supply assembly 112 does not move during all or part of the operation of the processing station 100, such as during the adjustment of the polishing pad 104.

[0024] Figure 2 shows a schematic side view of the processing station 100 according to several embodiments. The polishing pad 104 is disposed on or supported on the surface of the platen 108, and the platen 108 rotates the polishing pad 104 and the polishing surface 102 during processing. The platen 108 may rotate about a first rotation axis 231. A slurry supply arm 122 distributes fluid flow to the processing station 100. For example, the slurry supply arm 122 may distribute slurry 123 to the rotating polishing pad 104 at a continuous or variable feed rate.

[0025] The adjustment module 110 further includes an adjustment base 237 mounted on the base 114. The adjustment arm 121 has a distal end coupled to the adjustment head 120 and a proximal end coupled to the adjustment base 237, for example, through a support assembly 136. The adjustment base 237 may rotate the adjustment arm 121 about a second pivot axis 233 to position the adjustment head 120, for example, to sweep the adjustment head 120 over the polishing surface 102 to adjust the polishing surface 102.

[0026] The adjustment head 120 may be used to restore the polishing performance of the polishing surface 102 by, for example, spinning the polishing pad 104 around a third rotation axis 235 of the adjustment head 120. The third rotation axis 235 may be at the center of the adjustment head 120 or at a central location of the adjustment head 120. The adjustment head 120 may also provide a controllable pressure or downforce to controllably push the adjustment head 120 toward the polishing surface 102. In one embodiment, the downforce may be in the range of, for example, between about 0.5 lbf (22.2 N) and about 14 lbf (62.3 N), for example between about 1 lbf (4.45 N) and about 10 lbf (44.5 N). The adjustment head 120 generally rotates and / or moves laterally in a sweeping motion across the polishing surface 102. In some embodiments, the adjustment head 120 may have an additional range of motion for moving the adjustment head 120 away from the platen 108 when not in use.

[0027] Example of a pad surface cleaning system Figure 3 shows a top view of a pad surface cleaning system 340 according to several embodiments.

[0028] The pad surface cleaning system 340 may be used to clean the polishing surface 102 and / or separate the polishing disc 108 from the slurry 123 (Figures 1 and 2). The pad surface cleaning system 340 includes an outer wash ring 342 having an outer nozzle 344, a vacuum ring 346 having a vacuum port 347, and an inner wash ring 348 having an inner nozzle 350. In the embodiment shown in Figure 3, the pad surface cleaning system 340 completely encloses the adjustment disc 118 and does not rotate with the adjustment disc 118. For example, the adjustment disc 118 may rotate about a third axis of rotation 235, but the pad surface cleaning system 340 does not rotate about the third axis of rotation 235. In other words, the pad surface cleaning system 340 may remain stationary or fixed relative to the third axis of rotation 235. The pad surface cleaning system 340 may be coupled to the adjustment arm 121, so that the adjustment module 110 (Figures 1 and 2) moves the pad surface cleaning system 340 together with the adjustment disc 118. The pad surface cleaning system 340 may be located downstream from the slurry supply arm 122 (Figure 1), and the substrate carrier head 106 may be located downstream from the pad surface cleaning system 340.

[0029] The outer wash ring 342 and the inner wash ring 348 spray fluid onto the polishing surface 102 to remove debris. The debris may include pieces of the substrate 116 (Figure 1) removed during the polishing process, or pieces of the polishing pad 104 or polishing disc 118 removed or discarded during the adjustment process. The outer wash ring 342 may also be used to isolate the polishing disc 108 from the slurry 123 by diluting, reducing, or eliminating the slurry 123 that comes into contact with the polishing disc 118. The vacuum ring 346 may remove or suck up the debris and slurry 123 (or diluted slurry 123) before they come into contact with the polishing disc 118. Diluting or removing the slurry 123 may reduce the acidity of the slurry 123 and prevent the slurry 123 from reacting with, corroding, or damaging the polishing disc 118, which may contain stainless steel chemically. Protecting the polishing disc 118 can extend its lifespan by reducing the amount of polishing disc 118 consumed, and consequently reducing the downtime of the polishing station 100 (Figure 1) required to replace the polishing disc 118, which can reduce operating costs. Diluting the slurry 123 can reduce its density, allowing the vacuum ring 346 to remove the diluted slurry 123 more easily than the slurry 123.

[0030] The outer nozzles 344 of the outer wash ring 342 supply a high-pressure fluid spray to the polishing surface 102 to remove debris, such as by-products from the polishing process, and to dilute or remove the slurry 123. Removing debris prevents the polishing disc 118 from moving or adhering to the debris across the polishing surface 102, which helps prevent the debris from becoming lodged or embedded in the polishing surface 102. Debris embedded in the polishing surface 102 may scratch or become embedded in the substrate 116 during the polishing process, which may result in excess processing or removal of the polished substrate 116. The outer nozzles 344 are coupled by a first fluid supply line 355 to a first fluid source 354, such as a water source or a deionized water source, and spray fluid from the first fluid source 354. In the illustrated embodiment, the outer nozzles 344 are positioned around the diameter of the outer wash ring 342. In some embodiments, the outer nozzle 344 may be positioned at different diameters or angular positions of the outer wash ring 342.

[0031] The inner nozzle 350 of the inner wash ring 348, in a similar manner to the outer nozzle 344, supplies a high-pressure fluid spray to the polishing surface 102 to remove debris, such as by-products from the conditioning process. The inner nozzle 350 is connected by a second fluid supply line 357 to a second fluid source 356, such as a water source or a deionized pure water source, and sprays fluid from the second fluid source 356. In the illustrated embodiment, the inner nozzle 350 is positioned around the diameter of the inner wash ring 348. In some embodiments, the inner nozzle 350 may be positioned at different diameters or angular positions of the inner wash ring 348. In some embodiments, the high-pressure flow rate of the water source or deionized pure water source through the outer nozzle 344 and the inner nozzle 350 may be greater than 1 liter per minute.

[0032] The vacuum port 347 of the vacuum ring 346 is connected to a vacuum source 358 through a vacuum line 359. The vacuum source 358 can be any system that can create a vacuum or draw fluid from the vacuum port 347 through the vacuum line 359, such as a Venturi system or a vacuum pump. Thus, the vacuum ring 346 can remove debris and slurry through the vacuum port 347 using the Venturi effect or negative pressure. In the illustrated embodiment, the vacuum port 347 is a cylindrical opening (e.g., a hollow cylinder or tube) formed by the vacuum ring 346 and along the radius of the vacuum ring 346. For example, the radius of the vacuum port 347 may follow the radius of the vacuum ring 346, or the center point of the vacuum port 347 may be located approximately at the same point as the center point of the vacuum ring 346.

[0033] The pad surface cleaning system 340 may operate based on two zones, A and B. Zones A and B are separated by a zone boundary line 352. In the illustrated embodiment, the zone boundary line 352 is a straight line extending between the center of the polishing pad 104 (e.g., the third axis of rotation 235) and the edge of the diameter of the polishing pad 104, and is therefore perpendicular (e.g., vertical) to the edge of the diameter of the polishing pad 104, such as 90 degrees ± 5 degrees, 90 degrees ± 2 degrees, 90 degrees ± 1 degree, 90 degrees ± 0.5 degrees, 90 degrees ± 0.25 degrees, etc. In some embodiments, the zone boundary line 352 may be perpendicular to the direction of the linear velocity of the polishing pad 104. The zone boundary line 352 may move with the pad surface cleaning system 340, such as in embodiments where the polishing disc 118 moves in linear motion, arc motion or sweeping motion. In such embodiments, the zone boundary line 352 may remain perpendicular to the edge of the polishing pad 104 diameter.

[0034] Zones A and B are configured such that Zone A includes portions of the outer wash ring 342, vacuum ring 346, and inner wash ring 348 positioned over the incoming portion of the polishing pad 104, such as the portion of the polishing pad 104 moving toward the zone boundary 352. Zone B includes portions of the outer wash ring 342, vacuum ring 346, and inner wash ring 348 positioned over the outgoing portion of the polishing pad 104, such as the portion of the polishing pad 104 moving away from the zone boundary 352.

[0035] A portion of the vacuum port 347 located in Zone A is positioned downstream from the outer nozzle 344 located in Zone A. A portion of the vacuum port 347 located in Zone B is positioned downstream from the inner nozzle 350 located in Zone B. Positioning the portion of the vacuum port 347 in Zone A downstream from the outer nozzle 344 allows the vacuum ring 346 to collect fluid from the first fluid source 354, debris from polishing the substrate 116 (Figure 1) using the carrier head 106 (Figure 1), and the slurry 123 (Figure 2) or used slurry 123. Positioning the portion of the vacuum port 347 in Zone B downstream from the inner nozzle 350 allows the vacuum ring 346 to collect fluid from the second fluid source 356, as well as debris from adjusting the polishing surface 102 using the adjustment disc 118.

[0036] The system controller 190 can control the pad surface cleaning system 340 based on its position. For example, the system controller 190 can control the supply of fluid from the first fluid source 354 and the second fluid source 356 (collectively called rinse fluid) and the fluid from the vacuum source 358 based on the position of the pad surface cleaning system 340 relative to the slurry supply arm 122. In some embodiments, the system controller 190 can stop supplying rinse fluid when a portion of the pad surface cleaning system 340 is within the radius of the polishing pad 104 occupied by the slurry supply point 123 of the slurry supply arm 122. This prevents dilution or removal of the newly added slurry 123. The control of the rinse fluid will be further described with reference to Figures 7 and 8.

[0037] The configuration of the pad surface cleaning system 340 (for example, attached to the adjustment arm 121 and interfaced with the system controller 190) allows the pad surface cleaning system 340 to operate in-site or concurrently with the processing station 100 (Figure 1). For example, the pad surface cleaning system 340 may be used together with the adjustment head 120 and adjustment disc 118 to adjust the polishing surface 102 while the carrier head 106 polishes the substrate. Simultaneously, adjustment and polishing can beneficially reduce operating costs and substrate 116 processing time.

[0038] Figures 1 to 3 show a polishing pad 104 that rotates clockwise and an adjustment disc 118 that rotates counterclockwise, but the pads 104 and 118 can rotate differently. In some embodiments, the polishing pad 104 may rotate counterclockwise and the adjustment disc 118 may rotate clockwise. In some embodiments, the pads 104 and 118 may rotate in the same direction, such as both clockwise or both counterclockwise.

[0039] In some embodiments, the pad surface cleaning system 340 is located on an arm separate from the adjustment arm 121. In some embodiments, the pad surface cleaning system 340 is located downstream of the slurry supply arm 122 and the adjustment head 120.

[0040] In some embodiments, at least one of the outer nozzles 344 and inner nozzles 350 may occupy both zone A and zone B. Such a nozzle may operate as part of zone A or zone B, or as part of both zones A and zone B.

[0041] In some embodiments, the first fluid source 354 and the second fluid source 356 contain different fluids. In some embodiments, the first fluid source 354 and the second fluid source 356 contain the same fluid. In some embodiments, the outer wash ring 342 may include an outer nozzle 344 only in zone A, and the inner wash ring 348 may include an inner nozzle 350 only in zone B.

[0042] In some embodiments, the pad surface cleaning system 340 does not use zones A and B. In such embodiments, the fluid from the first fluid source 354 may be supplied to all outer nozzles 344, and the fluid from the second fluid source 356 may be supplied to all inner nozzles 350.

[0043] In some embodiments, the vacuum port 347 may include a converging or diverging section. In some embodiments, the vacuum port 347 may include a plurality of vacuum ports disposed within or formed by the vacuum ring 346. For example, the plurality of vacuum ports may be arranged around the diameter of the vacuum ring 346.

[0044] Figure 4A shows a schematic side view of the pad surface cleaning system 340 from Figure 3, according to several embodiments. In particular, Figure 4A shows a cross-sectional view of the pad surface cleaning system 340, where the nozzle 344 of the outer nozzle 344, the nozzle 350 of the inner nozzle 350, and the vacuum port 347 are cross-sectional. The first fluid supply line 355, the second fluid supply line 357, and the vacuum line 359 are connected to the adjustment arm 121 through mounting brackets 460, such as clips, zip ties, brackets, or straps. In the illustrated embodiments, the outer nozzle 344 and the inner nozzle 350 are cylinders connected to the first fluid supply line 355 and the second fluid supply line 357 through channels in the outer wash ring 342 and the inner wash ring 348. The channels are sometimes referred to as the outer wash ring channel and the inner wash ring channel. The vacuum port 347 forms a cylindrical cutout in the vacuum ring 346 and includes a passage in the vacuum ring 346 connected to the vacuum line 359. The passage is sometimes called a vacuum ring channel.

[0045] In the embodiments shown, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 are shown as separate components and can be joined or bonded to each other, for example, by press-fitting the inner wash ring 348 onto the vacuum ring 346 and press-fitting the vacuum ring 346 onto the outer wash ring 342. Of course, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 are intended to be joined to each other using a variety of other fastening means, including, but not limited to, a variety of adhesives, a variety of mechanical fasteners, or welding. In some embodiments, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 can be formed integrally. For example, the outer wash ring 342, the vacuum ring 346, and the inner wash ring 348 can be machined from a single billet of material, formed or printed as a single piece, welded or bonded to each other, or otherwise joined to function as a single article.

[0046] Figures 4B and 4C show schematic side views of the pad surface cleaning system 340 from Figure 4A, according to several embodiments. In particular, Figure 4B shows the standoff distance from the outer nozzle 344 and vacuum port 347 to the polishing surface 102. Figure 4C shows the standoff distance from the inner nozzle 350 and vacuum port 347 to the polishing surface 102.

[0047] The outer nozzle 344 is positioned at a first standoff distance (h1) from the polishing surface 102. The vacuum port 347 is positioned at a second standoff distance (h2) from the polishing surface 102. The inner nozzle 350 is positioned at a third standoff distance (h3) from the polishing surface 102. As shown in the figure, the first standoff distance (h1) is greater than the third standoff distance (h3), and the third standoff distance (h3) is greater than the second standoff distance (h2). Having a second standoff distance (h2) as the shortest distance allows the vacuum port 347 to be positioned closer to the polishing surface 102 than the outer nozzle 344 and the inner nozzle 350, which may allow the vacuum port 347 to collect debris and slurry 123 (Figure 2) without interference from the flow paths through the vacuum port 347 from the outer wash ring 342 and the inner wash ring 348. The second standoff distance (h2) may also require less vacuum pressure from the vacuum source 358 than when the second standoff distance (h2) is greater. The first standoff distance (h1) and the third standoff distance (h3) may be based on the outer nozzle 344 and the inner nozzle 350. For example, the first standoff distance (h1) and the third standoff distance (h3) may depend on the inlet diameter, outlet diameter, or throat diameter of the nozzles 344 and 350, or on a desired impact velocity of the rinse fluid, where the velocity of the rinse fluid may depend on the distance the rinse fluid travels from the outer nozzle 344 and the inner nozzle 350. The first standoff distance (h1) and the third standoff distance (h3) may also depend on a desired cross-section of the rinse fluid at impact (e.g., the diameter of a conical spray pattern or the width of a flat fan-shaped spray pattern), where the cross-section may increase or decrease as the distance from the outer nozzle 344 and the inner nozzle 350 increases. In some embodiments, the standoff distance (h1) may be between 10 and 100 mm. In some embodiments, the standoff distance (h2) may be less than or equal to 10 mm. In some embodiments, the standoff distance (h3) may be between 10 and 100 mm.In some embodiments, any or all of the standoff distances (h1), (h2), and (h3) may be equal to another.

[0048] Although shown as cylindrical in Figures 3 to 4C, the outer nozzle 344 and inner nozzle 350 can be shrinking nozzles or shrinking-expanding nozzles. In some embodiments, the outer nozzle 344 and inner nozzle 350 can be veejet nozzles, N2 / DI mist atomizer nozzles, or a combination thereof.

[0049] Figures 1 to 4C show a circular platen 108 and a circular polishing pad 104 in a rotary polisher, but the polishing pad surface cleaning system 340 may be used in conjunction with other polishing methods and designs. In some embodiments, the polishing pad 104 may be a conveyor belt moving on rollers, and the platen 108 may remain stationary and not rotate, such as in a linear polisher. In some embodiments, the platen 108 may rotate and move in a track around a first rotation axis 231 (Figure 2), such as in a tracked polisher.

[0050] Figure 5 shows a schematic side view of a rotatable pad surface cleaning system 540 according to several embodiments.

[0051] Adjustment module 510 is similar to adjustment module 110 described with respect to Figures 1 to 4A, except as otherwise noted. Adjustment module 510 includes an adjustment arm 521 coupled to adjustment head 520 through a rotating union 562 or manifold. Adjustment head 520 spins or rotates adjustment disc 118. Rotatable pad surface cleaning system 540 is similar to pad surface cleaning system 340, except as otherwise noted. Rotatable pad surface cleaning system 540 completely encloses adjustment disc 118 and rotates with abrasive disc 118. Rotatable pad surface cleaning system 540 includes an outer wash ring 542 having an outer nozzle 544, a vacuum ring 546 having a vacuum port 547, and an inner wash ring 548 having an inner nozzle 550. The outer nozzle 544 is connected to the first fluid source 354 through the first fluid supply line 355, the inner nozzle 550 is connected to the second fluid source 356 through the second fluid supply line 357, and the vacuum port 547 is connected to the vacuum source 358 through the vacuum line 359.

[0052] The first fluid supply line 355, the second fluid supply line 357, and the vacuum line 359 pass through the rotating union 562 to fluidly couple the stationary first fluid source 354, the second fluid source 356, and the vacuum source 358 to the rotating outer wash ring 342, the inner wash ring 348, and the vacuum ring 346, respectively. The rotating union 562 rotates relative to the adjustment arm 521. The rotatable pad surface cleaning system 540 includes zones A and B and zone boundary lines 352 as described with respect to Figure 3. Zones A and B do not rotate with the rotatable pad surface cleaning system 540; instead, the zone boundary lines 352 remain perpendicular to the edges of the polishing pad 104 diameter. The system controller 190 can control which one or more nozzles 544 and 550 of the outer wash ring 542 and the inner wash ring 548 are used, based on the zone in which each nozzle 544 and 550 is located.

[0053] Additional examples of pad surface cleaning systems Figures 6A to 6C show top views of different pad surface cleaning systems 640 (e.g., 640A, 640B, and 640C) according to several embodiments. In particular, Figure 6A shows a rectangular pad surface cleaning system 640A, which is similar to the pad surface cleaning system 340 except as noted.

[0054] The rectangular pad surface cleaning system 640A includes an outer wash ring 642A having an outer nozzle 644A, a vacuum ring 646A having a vacuum port 647A, and an inner wash ring 648A having an inner nozzle 650A. The outer wash ring 642A, the vacuum ring 646A, and the inner wash ring 648A each have a rectangular shape, where the inner wash ring 648A is nested inside the vacuum ring 646A, and the vacuum ring 646A is nested inside the outer wash ring 642A. The rectangular pad surface cleaning system 640A also includes zones A and B and zone boundary lines 652A, used in a similar manner to zones A and B and zone boundary lines 352 described with respect to Figure 3.

[0055] The rectangular pad surface cleaning system 640A may be used with adjustment module 110 or 510, which may move the rectangular pad surface cleaning system 640A together with adjustment head 120 or 520 in linear motion, arc motion or sweep motion. The rectangular pad surface cleaning system 640A may completely enclose the adjustment disc 118.

[0056] In the illustrated embodiments, the two sides of the rectangular pad surface cleaning system 640A are approximately parallel to the zone boundary line 652A, such as within 5 degrees, within 3 degrees, within 1 degree, or within 0.5 degrees. In some embodiments, the sides of the rectangular pad surface cleaning system 640A may not be positioned approximately parallel to the zone boundary line 652A. In some embodiments, the two sides of the rectangular pad surface cleaning system 640A may be parallel to each other but not parallel to the zone boundary line 652A. While a rectangle is described with respect to Figure 6A, other polynomial shapes, such as squares, pentagons, and octagons, may be used for the rectangular pad surface cleaning system 640A, to give a few examples.

[0057] Figure 6B shows a semicircular pad surface cleaning system 640B, which is similar to the pad surface cleaning system 340 except as mentioned.

[0058] The semicircular pad surface cleaning system 640B includes an arc-shaped (e.g., semicircular) outer wash ring 642B having an outer nozzle 644B, and a corresponding first vacuum ring 646Ba having a vacuum port 647Ba. The semicircular pad surface cleaning system 640B also includes an arc-shaped inner wash ring 648B having an inner nozzle 650B, and a corresponding second vacuum ring 646Bb having a vacuum port 647Bb. The first vacuum ring 646Ba has a semicircular shape nested inside and downstream of the outer wash ring 642B. The second vacuum ring 646Bb has a semicircular shape nested outside and downstream of the inner wash ring 642B. The first vacuum ring 646Ba extends beyond the outer wash ring 642B to capture fluid sprayed through the outermost nozzle 644B. The second vacuum ring 646Bb extends beyond the inner wash ring 648B to capture the fluid sprayed through the outermost nozzle 644B.

[0059] The semicircular pad surface cleaning system 640B can be used with the adjustment module 110 or 510 and can move together with the adjustment head 120 or 520 in linear motion, arc motion or sweeping motion.

[0060] The semicircular pad surface cleaning system 640B includes zones A and B and zone boundary 652B, used in a similar manner to zones A and B and zone boundary 352 described with respect to Figure 3. In the illustrated embodiment, the outer wash ring 642B and the first vacuum ring 646Ba are located in zone A, and the inner wash ring 648B and the second vacuum ring 646Bb are located in zone B. In some embodiments, the outer wash ring 642B and the inner wash ring 648B may be located in both zones A and B, such as mostly in one zone and partly in the other zone.

[0061] Figure 6C shows a flat-bar pad surface cleaning system 640C, which is similar to the pad surface cleaning system 340 except as mentioned.

[0062] The flat bar-shaped pad surface cleaning system 640C includes an outer wash ring 642C having an outer nozzle 644C and a corresponding first vacuum ring 646Ca having a vacuum port 647Ca. The flat bar-shaped pad surface cleaning system 640C further includes an inner wash ring 648C having an inner nozzle 650C and a corresponding second vacuum ring 646Cb having a vacuum port 647Cb. The outer wash ring 642C and the inner wash ring 648C each have a rectangular shape and are substantially parallel to each other. The polishing disc 118 is positioned between the outer wash ring 642C and the inner wash ring 648C.

[0063] The first vacuum ring 646Ca has a rectangular shape, is located downstream of the outer wash ring 642C, and is adjacent to (e.g., coupled to) the outer wash ring 642C. The second vacuum ring 646Cb has a rectangular shape, is located downstream of the inner wash ring 648C, and is adjacent to the inner wash ring 648C.

[0064] The flat bar-shaped pad surface cleaning system 640C can be used with the adjustment module 110 or 510 and can move together with the adjustment head 120 or 520 in linear motion, arc motion or sweeping motion.

[0065] In some embodiments, the outer wash ring 642C and the inner wash ring 648C may not be substantially parallel to each other. For example, each of the outer wash ring 642C and the inner wash ring 648C may be aligned with a radial line extending from the center point of the polishing pad 104 to the edge of the diameter of the polishing pad 104.

[0066] Figure 7 shows a schematic top view of a pad surface cleaning system 740 moving relative to a polishing fluid supply point 724 according to several embodiments. In particular, Figure 7 shows how the pad surface cleaning system 740 can be controlled based on its position relative to the polishing fluid supply point 724.

[0067] The pad surface cleaning system 740 is similar to the pad surface cleaning system 340 (Figures 3-4C), except as noted. The pad surface cleaning system 740 comprises an outer wash ring and an inner wash ring (not shown), and a vacuum ring (not shown) having vacuum ports 747 (shown as vacuum port 747A in a first position and vacuum port 747B in a second position). The polishing fluid supply point 724 is the point where the polishing fluid comes into contact with the polishing surface 102 of the polishing pad 104, such as the slurry 123 described with respect to Figures 1-4C. The polishing fluid may be dispersed in the dispersion path 725 as the polishing pad 104 rotates. The vacuum port 747 may be coupled to a vacuum source (not shown) that provides negative pressure when the vacuum port 747 is not on the dispersion path 725 (as shown on this page). For example, the vacuum source may not provide negative pressure when the vacuum port 747A is in the dispersion path 725, such as when the vacuum port 747A is in the first position. The vacuum source may provide negative pressure when the vacuum port 747 is outside the dispersion path 725, such as when the vacuum port 747B is in a second position. The system controller 190 (Figure 3) may control the vacuum source using the pad surface cleaning system application 912, which is described with respect to Figure 9.

[0068] In the illustrated embodiment, the dispersion path 725 follows the radius of the polishing pad 104. In some embodiments, the dispersion path 725 may not be a radius, such as in embodiments having a linear or track polisher.

[0069] Figure 8 shows a schematic top view of a pad surface cleaning system 740 and a polishing fluid supply point 824 moving relative to the polishing pad 104, according to several embodiments. In particular, Figure 8 shows how the pad surface cleaning system 740 can be controlled based on its position relative to the polishing fluid supply point 824.

[0070] The polishing fluid may be applied at several locations on the polishing pad 104 while the polishing pad 104 rotates, such as along a path from the edge of the polishing pad 104 diameter to at least a portion of the radius of the polishing pad 104. For example, the polishing fluid may be distributed at a polishing fluid supply point 824A at an outer location, a polishing fluid supply point 824B at an inner location, or at a polishing fluid supply point at an intermediate location between the outer and inner locations. As the polishing pad 104 rotates, the polishing fluid may be distributed along a distribution path 825 (e.g., outer distribution path 825A or inner distribution path 825B).

[0071] The vacuum source may provide negative pressure when vacuum port 747 (shown as vacuum port 747C in the third position and vacuum port 747D in the fourth position) is not on the distribution path 825 (shown as the outer distribution path 825A or inner distribution path 825B, as shown on this page). For example, the vacuum source may not provide negative pressure when vacuum port 747 is within the distribution path 825, such as when vacuum port 747C is in the third position or vacuum port 747D is in the fourth position. The vacuum source may provide negative pressure when vacuum port 747 is outside the distribution path 825, such as when vacuum port 747 is midway between the third and fourth positions. Therefore, the polishing fluid supply point 824 may be coordinated with the movement of vacuum port 747 to ensure that the vacuum source provides negative pressure when vacuum port 747 is outside the outer and inner locations of the polishing pad 104.

[0072] In some embodiments, the polishing fluid is distributed from a slurry supply arm 122 (Figure 1) that moves along a path from the edge of the diameter of the polishing pad 104 to at least a portion of the radius of the polishing pad 104.

[0073] Figures 7 and 8 illustrate the vacuum source and vacuum port 747, but in some embodiments, fluid from the first fluid source and / or fluid from the second fluid source may not be provided when the outer nozzle and / or inner nozzle are on the dispersion paths 725 and 825.

[0074] Exemplary system controller for a pad surface cleaning system Figure 9 shows a functional block diagram of a system controller 190 for several embodiments of a pad surface cleaning system (for example, pad surface cleaning systems 340, 540, 640, and 740 in Figures 3 to 8).

[0075] The system controller 190 includes a processor 920 (e.g., a central processing unit (CPU)) that communicates data with the memory 910, input device 930, and output device 940. It should be understood that the functional blocks described with respect to the system controller 190, as described separately, do not necessarily have to be separate structural elements. For example, the processor 920 and the memory 910 may be embodied on a single chip. The processor 920 may be a general-purpose processor, a digital signal processor ("DSP"), an application-specific integrated circuit ("ASIC"), a field-programmable gate array ("FPGA") or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any preferred combination thereof designed to perform the functions described herein. The processor may also be implemented as a combination of computing devices, for example, a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors working in conjunction with a DSP core, or any other such configuration.

[0076] The processor 920 may be coupled via one or more buses to read information from or write information to the memory 910. The processor may include additional or alternative memory, such as processor registers. The memory 910 may include a processor cache, including a multi-level hierarchical cache with different levels having different capacities and access speeds. The memory 910 may also include random access memory (RAM), other volatile storage devices, or non-volatile storage devices. Storage may include hard drives, flash memory, etc. The memory 910 may also include a pad surface cleaning system application 912 used to control a vacuum source, a first fluid source, and a second fluid source, as described in Figures 7 and 8. The pad surface cleaning system application 912 may be code that can be executed by the processor 920. In various cases, memory is referred to as computer-readable storage medium. Computer-readable storage media are non-temporary devices capable of storing information and can be distinguished from computer-readable transmission media, such as electronic temporary signals, that can transport information from one location to another. Non-temporary computer-readable media include computer-executable instructions that, when executed by a processing system, cause the processing system to perform a method as described with respect to Figure 10, which includes: discharging fluid from a first fluid source through an outer nozzle to discharging debris from a substrate polishing process, and removing debris from a vacuum port by creating negative pressure using a vacuum source; discharging fluid from a second fluid source through an inner nozzle to discharging debris from adjusting a polishing pad, and removing debris from a vacuum port by creating negative pressure using a vacuum source. Computer-readable media as described herein may generally refer to computer-readable storage media.

[0077] The processor 920 may also be coupled to an input device 930 and an output device 940 for receiving input from the user of the system controller 190 and providing output to the user of the system controller 190, respectively. Suitable input devices include, but are not limited to, keyboards, buttons, keys, switches, pointing devices, mice, joysticks, remote controls, infrared detectors, barcode readers, scanners, video cameras (occasionally coupled with video processing software to detect, for example, hand or facial gestures), motion detectors, or microphones (occasionally coupled with audio processing software to detect, for example, voice commands). The input device 930 may include position sensors, such as encoders, for sensing the position of the pad surface cleaning systems 340, 540, 640, and 740 (Figures 3 to 8) and / or the slurry supply arm 122 (Figures 1 and 2). Suitable output devices include, but are not limited to, the adjustment base 237 (Figure 2), a motor attached to the slurry supply arm 122, a visual output device including a display and a printer, an audio output device including a speaker, headphones and earphones and an alarm, an additive manufacturing machine, and a haptic output device.

[0078] Exemplary method for adjusting a polishing pad Figure 10 shows a flowchart of Method 1000 for a method of adjusting a polishing pad according to several embodiments.

[0079] Method 1000 can be carried out using any suitable processing station, such as processing station 100 described with respect to Figures 1 and 2. Processing station 100 includes pad surface cleaning systems 340, 540, 640, or 740, as shown in Figures 3 to 6C.

[0080] In operation 1002, method 1000 includes positioning an adjustment disc relative to the polishing pad in the polishing pad cleaning system, as described above with respect to Figures 3 to 4C. In some embodiments, the polishing pad cleaning system includes an outer wash ring with an outer nozzle, an inner wash ring with an inner nozzle, and a vacuum ring. The outer nozzle is coupled to a first fluid source, the inner nozzle is coupled to a second fluid source, and the vacuum ring forms a vacuum port fluidly coupled to the vacuum source.

[0081] In operation 1004, method 1000 includes flowing fluid from a first fluid source through an outer nozzle to remove debris from the polishing pad during the substrate polishing process, as described above with respect to Figures 3 to 6C.

[0082] In operation 1006, method 1000 includes removing debris from the polishing pad during the substrate polishing process through a vacuum port by creating a negative pressure using a vacuum source, as described above with respect to Figures 3 to 8.

[0083] In operation 1008, method 1000 includes flowing fluid from a second fluid source through an inner nozzle to dislodge debris from the polishing pad during the substrate polishing process, as described above with respect to Figures 3 to 6C.

[0084] In operation 1010, method 1000 includes removing debris from the polishing pad during the substrate polishing process through a vacuum port by creating a negative pressure using a vacuum source, as described above with respect to Figures 3 to 8.

[0085] In some embodiments, debris from the substrate polishing process is generated by polishing the substrate using a polishing pad.

[0086] In some embodiments, the flow of fluid from a first fluid source, the removal of debris from the substrate polishing process, the flow of fluid from a second fluid source, and the removal of debris from adjusting the polishing pad are performed simultaneously while the substrate is being polished using the polishing pad.

[0087] Some embodiments further include rotating the polishing pad. Some embodiments further include distributing polishing fluid onto the polishing pad. Some embodiments further include moving the polishing pad cleaning system and adjustment disc across the surface of the polishing pad, wherein negative pressure is created using a vacuum source when the vacuum port is outside the distribution path of the polishing fluid. Some embodiments further include moving a polishing fluid supply arm across the polishing pad so that the polishing fluid is applied at several locations on the polishing pad.

[0088] Although the operation of Method 1000 has been described with reference to Figures 1 to 8, those skilled in the art will understand that any system configured to perform the operations of Method 1000 in any order falls within the scope of the embodiments described herein.

[0089] The foregoing applies to embodiments of the present disclosure, but other and further embodiments of the present disclosure may be devised without departing from its basic scope, the scope of which is determined by the following claims.

Claims

1. A polishing pad cleaning system for a substrate polishing process, wherein the polishing pad cleaning system is An outer wash ring having an outer nozzle, wherein the outer nozzle is configured to be coupled to a first fluid source, An inner wash ring having an inner nozzle, wherein the inner nozzle is configured to be coupled to a second fluid source, A vacuum ring disposed between the outer wash ring and the inner wash ring, wherein the vacuum ring forms a vacuum port configured to be fluidly coupled to a vacuum source, An adjustment disc is disposed inside the inner wash ring and configured to adjust the polishing pad, Equipped with, The outer nozzle is configured to release debris generated from the substrate polishing process from the polishing pad. The inner nozzle is configured to release debris generated from adjusting the polishing pad from the polishing pad. A polishing pad cleaning system wherein the vacuum ring is configured to remove the debris released by the outer wash ring and the inner wash ring.

2. The polishing pad cleaning system according to claim 1, wherein the outer nozzle, the inner nozzle, and the vacuum port are each arranged around an arc, a semicircle, or a circle.

3. The polishing pad cleaning system according to claim 1, wherein the outer wash ring, the vacuum ring, and the inner wash ring are integrally formed.

4. The polishing pad cleaning system according to claim 1, wherein the vacuum ring comprises a first vacuum ring and a second vacuum ring, the first vacuum ring being positioned downstream and adjacent to the outer wash ring, and the second vacuum ring being positioned downstream and adjacent to the inner wash ring.

5. The polishing pad cleaning system according to claim 1, wherein the vacuum port is located downstream of the outer nozzle and the inner nozzle.

6. The polishing pad cleaning system comprises a first zone, a second zone, and a boundary line separating the first zone and the second zone. The boundary line is perpendicular to the edge of the polishing pad, The outer nozzle is configured to release debris in the first zone, and the inner nozzle is configured to release debris in the second zone. The polishing pad cleaning system according to claim 1.

7. The polishing pad cleaning system according to claim 1, wherein the second fluid source is the same as the first fluid source.

8. The polishing pad cleaning system according to claim 1, wherein the polishing pad cleaning system is configured to surround the adjustment disc.

9. An adjustment system for adjusting a polishing pad, wherein the adjustment system is An adjustment module comprising an adjustment arm and an adjustment head, wherein the adjustment head is configured to move an adjustment disc relative to the polishing pad, A polishing pad cleaning system coupled to the adjustment arm, wherein the polishing pad cleaning system is An outer wash ring having an outer nozzle configured to be coupled to a first fluid source, A vacuum ring is provided, which is located inside the outer wash ring and has a vacuum port configured to be connected to a vacuum source. An inner wash ring is provided with an inner nozzle that is disposed inside the vacuum ring so as to surround the adjustment disc and is configured to be coupled to a second fluid source. A polishing pad cleaning system equipped with An adjustment system equipped with this system.

10. The adjustment system according to claim 9, wherein the adjustment head is configured to rotate the adjustment disc about the rotation axis of the adjustment head, and the polishing pad cleaning system remains stationary with respect to the rotation axis of the adjustment head.

11. The adjustment system according to claim 9, wherein the adjustment head is configured to rotate the adjustment disc and the polishing pad cleaning system about the rotation axis of the adjustment head.

12. The adjustment system according to claim 9, wherein the outer nozzle, the inner nozzle, and the vacuum port are each arranged around an arc, a semicircle, or a circle.

13. The adjustment system according to claim 9, wherein the vacuum ring comprises a first vacuum ring and a second vacuum ring, the first vacuum ring being located downstream and adjacent to the outer wash ring, and the second vacuum ring being located downstream and adjacent to the inner wash ring.

14. The adjustment system according to claim 9, wherein the vacuum port is located downstream of the outer nozzle and the inner nozzle.

15. A method for adjusting the polishing pad, The polishing pad cleaning system involves placing an adjustment disc on the polishing pad, wherein the polishing pad cleaning system is An outer wash ring having an outer nozzle, wherein the outer nozzle is coupled to a first fluid source, An inner wash ring having an inner nozzle, wherein the inner nozzle is coupled to a second fluid source, A vacuum ring disposed between the outer wash ring and the inner wash ring, wherein the vacuum ring forms a vacuum port fluidly coupled to a vacuum source. The adjustment disc disposed inside the inner wash ring, The adjustment disc is provided, In order to release debris from the polishing pad during the substrate polishing process, fluid from the first fluid source is flowed through the outer nozzle, By creating a negative pressure using the vacuum source, the debris from the polishing pad during the substrate polishing process is removed through the vacuum port. In order to release debris from the polishing pad during the substrate polishing process, fluid from the second fluid source is flowed through the inner nozzle, By creating a negative pressure using the vacuum source, the debris from the polishing pad during the substrate polishing process is removed through the vacuum port. Methods that include...

16. The method according to claim 15, wherein the debris from the substrate polishing process is generated by polishing the substrate using the polishing pad.

17. The method according to claim 16, wherein the flow of the fluid from the first fluid source, the removal of the debris from the polishing pad, the flow of the fluid from the second fluid source, and the removal of the debris from the polishing pad are performed simultaneously while polishing a substrate using the polishing pad.

18. Rotating the polishing pad, Distributing polishing fluid onto the polishing pad, Moving the polishing pad cleaning system and the adjustment disc across the surface of the polishing pad, wherein the negative pressure is created using the vacuum source when the vacuum port is outside the dispersion path of the polishing fluid, and moving the polishing pad cleaning system and the adjustment disc. The method according to claim 15, further comprising:

19. The method according to claim 18, further comprising moving a polishing fluid supply arm over the polishing pad so that the polishing fluid is applied at several locations on the polishing pad.

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