Implementation method, implementation device, and implementation program

Abstract

To reduce the number of mounting objects that are treated as defective products.SOLUTION: A mounting method includes a first imaging step (S11) of obtaining a first image D1 by imaging a die main surface 2a including an alignment mark 2M provided on a semiconductor die 2, which is a mounting object, through an NCF22, which is a covering member that covers the alignment mark 2M; a first extraction step (S12) of extracting the alignment mark 2M from the first image D1; a waiting step (S15) of waiting until a predetermined time has elapsed if extraction of the alignment mark 2M fails as a result of the first extraction step (S12); a second imaging step (S16) of obtaining a second image D2 by again imaging the die main surface 2a after the waiting step (S15); and a second extraction step (S17) of extracting the alignment mark 2M from the second image D2.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a mounting method, a mounting apparatus, and a mounting program.

Background Art

[0002] Bonding, which is one of the processes for manufacturing a semiconductor device, mounts a semiconductor die that is an object to be mounted and has been diced into a predetermined size onto a substrate that is a target object. Bonding includes an operation of detachably holding the semiconductor die, an operation of conveying the held semiconductor die to a predetermined position, and an operation of fixing the conveyed semiconductor die to the substrate.

[0003] Patent Document 1 discloses a technology related to the operation of fixing a semiconductor die to a substrate. The technology of Patent Document 1 accurately aligns the position of a semiconductor die held by a mounting tool with respect to a substrate that is a bonding target of the semiconductor die.

[0004] The semiconductor die may also be bonded to the substrate in a state where the bonding surface of the semiconductor die provided with electrodes faces the bonding surface of the substrate provided with electrodes. Such a bonding form is also referred to as flip-chip bonding. In flip-chip bonding, the electrodes of the semiconductor die are bonded to the electrodes of the substrate by solder. Patent Documents 2 and 3 disclose technologies for forming flux for solder bonding on the bonding surface of an object to be mounted.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] When fixing an object to be mounted to a target object, it is crucial to accurately determine the position of the object to be mounted relative to the target object. The object to be mounted has alignment marks to define its position. The area containing the alignment marks is captured by a camera. The position of the object to be mounted is determined using the image obtained from the capture.

[0007] However, even if alignment marks are captured in the image, it may not be possible to extract them from that image. If the extraction of alignment marks fails, it becomes impossible to accurately determine the position of the mounting object relative to the target object. Therefore, mounting objects from which alignment marks could not be extracted may be treated as defective. In other words, a good mounting object may be treated as a defective product.

[0008] This invention provides a mounting method, mounting apparatus, and mounting program that reduce the number of mounting objects that are treated as defective. [Means for solving the problem]

[0009] An implementation method according to one embodiment of the present invention includes: a first imaging step of obtaining a first image by imaging the main surface of an object, including alignment marks provided on the object, through a covering member that covers the alignment marks; a first extraction step of extracting alignment marks from the first image; a waiting step of waiting for a predetermined time to elapse if the extraction of alignment marks fails as a result of the first extraction step; a second imaging step of obtaining a second image by imaging the main surface of the object again after the waiting step; and a second extraction step of extracting alignment marks from the second image.

[0010] According to this implementation method, if the extraction of alignment marks from the first image obtained in the first imaging step fails, the system waits for a predetermined time to elapse before attempting to acquire the image and extract the alignment marks from that image again. Some factors that hinder the extraction of alignment marks resolve over time. Therefore, even if the extraction of alignment marks fails in the first extraction step, it may still be successful in the second extraction step. In this case, the number of items judged as good based on the results of the second extraction step can be reduced from those judged as defective based on the results of the first extraction step. As a result, the number of items that are good but are treated as defective can be reduced.

[0011] In the above implementation method, the object may be a semiconductor die. In the waiting step, heat may be applied to the semiconductor die. This step further increases the possibility of eliminating factors that hinder the extraction of alignment marks.

[0012] In the above implementation method, if the alignment marks are successfully extracted as a result of the first extraction step, the object may be provided to the next manufacturing process. This step allows the object from which alignment marks have been successfully extracted to be provided to the next manufacturing process.

[0013] In the above implementation method, if the second extraction step is successful in extracting alignment marks, the object is provided to the next manufacturing process; however, if the extraction of alignment marks fails, the object does not need to be provided to the next manufacturing process. This step allows for obtaining objects that can be provided to the next manufacturing process from those for which the first extraction step failed to extract alignment marks.

[0014] In the above implementation method, the object may be a substrate. In the waiting step, a time may be set to reduce the influence of the flux applied to the substrate on the second image. This process can reduce the number of substrates that are judged to be defective.

[0015] Another embodiment of the present invention is a mounting apparatus comprising: a bonding head that detachably holds a semiconductor die on which dial alignment marks are formed; a camera that images the die main surface on which dial alignment marks are formed or the substrate main surface on which substrate alignment marks are formed, via a covering member that covers the dial alignment marks or substrate alignment marks; and a controller that controls the camera and the bonding head. The controller performs a first imaging operation to obtain a first image by imaging the die main surface or the substrate main surface; a first extraction operation to extract dial alignment marks or substrate alignment marks from the first image; a waiting operation to wait for a predetermined time if the extraction of dial alignment marks or substrate alignment marks fails as a result of the first extraction operation; a second imaging operation to obtain a second image by imaging the die main surface or the substrate main surface again after the waiting operation; and a second extraction operation to extract dial alignment marks or substrate alignment marks from the second image.

[0016] A further embodiment of the present invention is a mounting program for a mounting apparatus comprising: a bonding head for detachably holding a semiconductor die on which dial alignment marks are provided; and a camera for imaging the die main surface on which dial alignment marks are formed, or the substrate main surface on which substrate alignment marks are formed, through a covering member that covers the dial alignment marks or substrate alignment marks. The mounting program causes a computer to function as a first imaging function unit that obtains a first image by imaging the die main surface or substrate main surface; a first extraction function unit that extracts dial alignment marks or substrate alignment marks from the first image; a standby function unit that waits until a predetermined time has elapsed if the extraction of dial alignment marks or substrate alignment marks fails as a result of the operation of the first extraction function unit; a second imaging function unit that obtains a second image by imaging the die main surface or substrate main surface again after the operation of the standby function unit; and a second extraction function unit that extracts dial alignment marks or substrate alignment marks from the second image.

[0017] The mounting apparatus and mounting program, similarly to the mounting method, can also reduce the number of objects that are treated as defective products despite being non-defective products.

Effects of the Invention

[0018] According to the mounting method, mounting apparatus and mounting program of the present invention, it is possible to reduce the number of objects that are treated as defective products.

Brief Description of Drawings

[0019] [Figure 1] FIG. 1 is a diagram simply showing the configuration of a mounting apparatus to which the mounting method and mounting program according to the present embodiment are applied. [Figure 2] FIG. 2 is an enlarged cross-sectional view showing a semiconductor die. [Figure 3] FIG. 3(a) is an example of a reference alignment mark. FIG. 3(b) is an example of an image in which extraction of an alignment mark has succeeded. FIG. 3(c) is an example of an image in which extraction of an alignment mark has failed. [Figure 4] FIG. 4 is a flowchart showing main steps of the mounting method according to the present embodiment. [Figure 5] FIG. 5(a) is a cross-sectional view of a semiconductor die having no foreign matter that hinders extraction of an alignment mark. FIG. 5(b) is a cross-sectional view of a semiconductor die having foreign matter that hinders extraction of an alignment mark. [Figure 6] FIG. 6 is a diagram showing the physical configuration of a controller. [Figure 7] FIG. 7 is a functional block diagram of a controller. [Figure 8] FIG. 8(a) is a cross-sectional view for explaining a case where extraction of an alignment mark fails due to flux. FIG. 8(b) is a cross-sectional view for explaining a case where extraction of an alignment mark succeeds. [Figure 9] FIG. 9 is a flowchart showing main steps of a mounting method according to a modified example.

Mode for Carrying Out the Invention

[0020] Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the attached drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant explanations are omitted.

[0021] As shown in Figure 1, the mounting apparatus 1 mounts the semiconductor die 2 (object) onto the substrate 3. The mounting apparatus 1 includes a pickup unit 11, a bonding unit 12, and a controller 13. The pickup unit 11 picks up the semiconductor die 2 from the pickup stage 11S. Next, the pickup unit 11 passes the semiconductor die 2 to the bonding unit 12. The bonding unit 12 mounts the received semiconductor die 2 onto the substrate 3 on the bonding stage 12S. The controller 13 controls the operation of the pickup unit 11 and the bonding unit 12 as described above.

[0022] The pickup unit 11 includes a guide rail 11G, a pickup stage 11S, a pickup head 11H, and a camera 11C. The guide rail 11G is a base for reciprocating the pickup head 11H in a predetermined direction. The guide rail 11G extends, for example, from the area where pickup is performed to the bonding unit 12.

[0023] The pickup stage 11S has multiple semiconductor dies 2 on which it is to be picked up. The pickup stage 11S may additionally have desired functions required for the pickup operation of the semiconductor dies 2 by the pickup head 11H. For example, the pickup stage 11S may have a function to push up the semiconductor dies 2 that are to be picked up.

[0024] The pickup head 11H is connected to the guide rail 11G. The pickup head 11H moves back and forth along the guide rail 11G. The pickup head 11H has the function of detachably holding the semiconductor die 2. The function of detachably holding the semiconductor die 2 may be realized by a known structure.

[0025] The camera 11C images a predetermined area of ​​the semiconductor die 2 selected as the pickup target. The image obtained through imaging is output to, for example, the controller 13.

[0026] The bonding unit 12 includes a guide rail 12G, a bonding stage 12S, a bonding head 12H, and a camera 12C.

[0027] The guide rail 12G is a base for moving the bonding head 12H back and forth in a predetermined direction. The guide rail 12G extends, for example, from the pickup unit 11 to the bonding stage 12S where the bonding work is performed.

[0028] The bonding stage 12S is on which the substrate 3 on which the semiconductor die 2 is mounted is placed. The bonding stage 12S may additionally have desired functions required for mounting. For example, the bonding stage 12S may have a function to hold the position of the substrate 3.

[0029] The bonding head 12H is connected to the guide rail 12G. The bonding head 12H moves back and forth along the guide rail 12G. The bonding head 12H also has the function of detachably holding the semiconductor die 2. The function of detachably holding the semiconductor die 2 may be realized by a known structure. For example, the bonding head 12H has a vacuum suction mechanism as an attachment / detachment mechanism. Furthermore, the bonding head 12H has the function of pressing the semiconductor die 2 against the substrate 3 with a predetermined force. The bonding head 12H may also have a built-in heater 121 and have the function of providing heat to the semiconductor die 2.

[0030] Camera 12C images a predetermined area of ​​the semiconductor die 2 held by the bonding head 12H. The image obtained through this imaging may be used to obtain relative positional information between the semiconductor die 2 and the substrate 3.

[0031] The controller 13 controls the operation of the bonding unit 12 and the pickup unit 11. The controller 13 will be described in detail in a later paragraph.

[0032] Now, let's focus on the semiconductor die 2. Between the time the semiconductor die 2 is picked up from the pickup stage 11S and mounted onto the substrate 3, the die main surface 2a (main surface of the object) and the die back surface 2b are reversed. We assume that the die main surface 2a has the function of being electrically connected to the substrate 3. In other words, when the semiconductor die 2 is mounted on the substrate 3, the die main surface 2a faces the substrate main surface 3a. Then, the die back surface 2b can be defined as the surface that does not face the substrate main surface 3a when the semiconductor die 2 is mounted on the substrate 3.

[0033] The semiconductor dies 2 lined up on the pickup stage 11S have their die main surface 2a facing upwards and their die back surface 2b facing the stage main surface. Therefore, the pickup unit 11 holds the die main surface 2a. Next, the pickup unit 11 rotates 180 degrees. As a result, the die back surface 2b faces upwards. Next, the bonding unit 12 holds the die back surface 2b. Then, the pickup unit 11 releases the die main surface 2a. As a result, the semiconductor die 2 is now in a state where its die main surface 2a is facing downwards. Then, the bonding unit 12 mounts the die main surface 2a of the semiconductor die 2 to the predetermined position on the substrate 3. This series of mounting operations is called the flip-chip process or flip-chip bonding.

[0034] As described above, the flip-chip process includes operations such as picking the semiconductor die 2, mounting the semiconductor die 2, and transferring the semiconductor die 2. These operations require positional information of the semiconductor die 2. For example, in the mounting operation of the semiconductor die 2, relative positional information of the semiconductor die 2 with respect to the substrate 3 is used to accurately mount the semiconductor die 2 to a predetermined position on the substrate 3.

[0035] The position information of the semiconductor die 2 is obtained using alignment marks 2M (diaalignment marks) provided on the semiconductor die 2. Specifically, the area including the alignment marks 2M is imaged by the camera 12C. The controller 13 processes the image obtained from the imaging to obtain the position information of the semiconductor die 2.

[0036] Figure 2 is a cross-sectional view showing an enlarged view of the mounting operation of the semiconductor die 2. Multiple bump electrodes 21 are provided on the die main surface 2a of the semiconductor die 2. Alignment marks 2M are also provided on the die main surface 2a. Furthermore, a non-conductive film called NCF (Non-Conductive Film) (hereinafter referred to as "NCF22") is provided on the die main surface 2a. The NCF22 (covering member) is attached to the entire die main surface 2a. Therefore, the bump electrodes 21 and alignment marks 2M are covered by the NCF22.

[0037] In this case, when imaging is performed using camera 12C, the alignment mark 2M is visible through NCF22. Ideally, there should be no foreign matter between the main film surface 22a of NCF22 and the main die surface 2a of semiconductor die 2. If no foreign matter is present, the edges of the alignment mark 2M that appear in the image are the external shape of the alignment mark 2M itself.

[0038] However, foreign matter may be present between the main film surface 22a of NCF22 and the main die surface 2a of the semiconductor die 2. Examples of foreign matter include air bubbles and fine dust. For example, if an air bubble 2B is present on the edge of the alignment mark 2M, the edge of the alignment mark 2M that appears in the image will differ from the actual external shape of the alignment mark 2M.

[0039] For example, the shape exemplified in Figure 3(a) is defined as the reference alignment mark 2D. Then, in the process of obtaining position information, a region having the same shape as this reference alignment mark 2D is searched for in the image. From the image D1 shown in Figure 3(b), a region having the same shape as the reference alignment mark 2D can be extracted. However, from the image D1 shown in Figure 3(c), it may not be possible to extract a region having the same shape as the reference alignment mark 2D. If a region having the same shape as the reference alignment mark 2D cannot be extracted, the position information of the semiconductor die 2 cannot be obtained, and therefore the semiconductor die 2 cannot be accurately mounted in the predetermined area of ​​the substrate 3. As a result, if a region having the same shape as the reference alignment mark 2D cannot be extracted, the semiconductor die 2 will be treated as a defective product.

[0040] The mounting method, mounting apparatus, and mounting program of this embodiment prevent good semiconductor dies 2 from being treated as defective products simply because alignment marks 2M cannot be extracted from the image. Furthermore, the mounting method, mounting apparatus, and mounting program of this embodiment can be applied to any process in the semiconductor device manufacturing process that images alignment marks 2M via NCF22.

[0041] <Implementation Method> The implementation method of this embodiment will be described with reference to Figure 4. The implementation method is performed by the controller 13. Specifically, the implementation method includes controlling the camera 12C by the controller 13, processing the image data provided from the camera 12C, and controlling the pickup unit 11 or the bonding unit 12 based on the processing results.

[0042] First, the controller 13 controls the camera 12C to image the die main surface 2a (S11). As a result of performing step S11, the controller 13 receives the first image D1 from the camera 12C.

[0043] Next, the controller 13 extracts the alignment mark 2M from the first image D1 (S12). As a result of executing step S12, either "successful extraction of alignment mark 2M" or "failure to extract alignment mark 2M" is obtained. Any image processing method can be used to extract the alignment mark 2M. For example, as shown in Figure 5(a), if there are no bubbles or dust between the semiconductor die 2 and the NCF22 that cross the edge of the alignment mark 2M, the controller 13 can successfully extract the alignment mark 2M from the first image D1. On the other hand, for example, as shown in Figure 5(b), if there are bubbles or dust between the semiconductor die 2 and the NCF22 that cross the edge of the alignment mark 2M, the controller 13 may fail to extract the alignment mark 2M from the first image D1.

[0044] Next, the controller 13 determines whether or not the alignment mark 2M was successfully extracted (S13). If the result of step S13 is "successful extraction of alignment mark 2M" (S13:YES), the controller 13 passes the semiconductor die 2 to the next process (S14). For example, if this mounting method is performed in the process of mounting the semiconductor die 2 onto the substrate 3 by the bonding unit 12, the next process of bonding the semiconductor die 2 to the substrate 3 may be performed. On the other hand, if the result of step S13 is "failure to extract alignment mark 2M" (S13:NO), the next step S15 is performed.

[0045] Next, the controller 13 waits until a predetermined time has elapsed (S15). As described in step S12, if there are bubbles or dust particles that straddle the edge of the alignment mark 2M, extraction of the alignment mark 2M from the first image D1 may fail. Some foreign matter that hinders the extraction of the alignment mark 2M may disappear over time. Specifically, if there is a bubble 2B between the semiconductor die 2 and NCF22 that straddles the edge of the alignment mark 2M, this bubble 2B may disappear over time.

[0046] Therefore, if the controller 13 fails to extract the alignment mark 2M, it waits for a predetermined amount of time (S15). During this waiting period, the controller 13 does not output any commands to move the bonding unit 12 or to move the field of view of the camera 12C. In other words, the controller 13 maintains the state of the camera 12C's field of view during the imaging operation in step S11. If the foreign matter is a bubble 2B, it may disappear after this waiting period has elapsed. If the foreign matter is dust, it will not disappear even after this waiting period has elapsed. As a result, among those in which the extraction of the alignment mark 2M failed in step S12, some may succeed in extracting the alignment mark 2M if imaging and extraction are performed again.

[0047] In step S15, additional operations may be performed while waiting for a predetermined time to elapse. For example, an operation to apply heat to the semiconductor die 2 may be performed as needed (S151). More specifically, heat is applied to the NCF22 via the semiconductor die 2 using the heater 121 built into the bonding head 12H. This heat may also promote the disappearance of the bubbles 2B.

[0048] Next, the controller 13 images the die main surface 2a again after a predetermined time has elapsed. In step S16, the field of view of the camera 12C is maintained during the period of time elapsed. Therefore, when the die main surface 2a is imaged again in step S16, a second image D2 is obtained that has the same field of view as the image obtained in step S11. Note that "same field of view" as used here does not require that the areas that are the die main surface 2a and the areas that are not the die main surface 2a in the image strictly match between the first image and the second image. In other words, "same field of view" as used here means that the alignment marks 2M included in the first image and the alignment marks 2M included in the second image are the same.

[0049] Next, the controller 13 extracts alignment marks 2M from the second image D2 (S17). Step S17 is the same process as step S12, except that the data used for extraction is different. Therefore, the result of executing step S17 is either "successful extraction of alignment marks 2M" or "failure to extract alignment marks 2M".

[0050] The controller 13 then determines whether or not the extraction of the alignment mark 2M was successful (S18). If the result of step S18 is "successful extraction of the alignment mark 2M" (S18:YES), the controller 13 passes the semiconductor die 2 to the next process (S14). In this case, the product that was judged to be defective as a result of the first imaging and extraction process, which failed to extract the alignment mark 2M, is provided to the next manufacturing process as a good product. On the other hand, if the result of step S18 is "failure to extract the alignment mark 2M" (S18:NO), the semiconductor die 2 is not passed to the next process (S19). For example, the controller 13 may discard the semiconductor die 2 held by the bonding head 12H as a defective product in a designated box or the like without performing bonding to the substrate 3.

[0051] <Controller and Program> Next, the controller 13 and implementation program P that execute the implementation method will be described. The controller 13 executes the implementation method shown in the flow chart of Figure 4 by executing the implementation program P.

[0052] Referring to Figure 6, the hardware configuration of the controller 13 will be described. The controller 13 is comprised of a computer 50. The computer 50 includes a processor 51 which is a CPU (Central Processing Unit), a main memory unit 52, an auxiliary memory unit 53, an external communication unit 54, an input unit 55, and an output unit 56. The controller 13 is comprised of one or more computers 50, which consist of this hardware and software such as programs.

[0053] If the controller 13 is composed of multiple computers 50, these computers 50 may be connected locally or via a communication network such as the Internet or an intranet. This connection logically constitutes a single controller 13.

[0054] The processor 51 executes the operating system and application programs. The main memory 52 consists of ROM (Read Only Memory) and RAM (Random Access Memory). The auxiliary memory 53 is a storage medium consisting of a hard disk and flash memory. The auxiliary memory 53 generally stores a larger amount of data than the main memory 52. ​​The input unit 55 consists of a keyboard, mouse, touch panel, and microphone for voice input.

[0055] The auxiliary storage unit 53 stores the implementation program P and the data necessary for processing in advance. The implementation program P causes the computer 50 to execute each functional element of the controller 13. For example, the implementation program P is read by the processor 51 or the main memory unit 52 and operates at least one of the processor 51, the main memory unit 52, the auxiliary storage unit 53, the external communication unit 54, the input unit 55, and the output unit 56. For example, the implementation program P reads and writes data to the main memory unit 52 and the auxiliary storage unit 53.

[0056] The implementation program P may be provided on a tangible recording medium such as a CD-ROM, DVD-ROM, or semiconductor memory. The implementation program P may also be provided as a data signal via a communication network.

[0057] As shown in Figure 7, the controller 13 operates as a set of functional components by having the processor 51 sequentially process the implementation program P and data loaded into the main memory 52M, which is the main memory unit 52. The controller 13 includes, as functional components, a head control unit 131, a camera control unit 132, an alignment mark extraction unit 133, an extraction result determination unit 134, and a waiting time setting unit 135.

[0058] The head control unit 131 outputs a head command C131 that controls the operation of the pickup unit 11 and the bonding unit 12. The head command C131 may include commands relating to the movement of the pickup head 11H or the bonding head 12H in a predetermined direction, commands relating to the pickup operation of the semiconductor die 2 by the pickup head 11H, commands relating to the transfer operation of the semiconductor die 2 from the pickup head 11H to the bonding head 12H, and commands relating to the bonding operation of the semiconductor die 2 to the substrate 3 by the bonding head 12H.

[0059] Furthermore, the head control unit 131 may generate and output a head command C131 using the output of the extraction result determination unit 134. For example, if the extraction result determination unit 134 determines that "the alignment mark 2M has been successfully extracted," the head control unit 131 may output a head command C131 that causes the next operation to be performed. In other words, the head control unit 131 executes step S14 in the implementation method.

[0060] The camera control unit 132 outputs camera commands C132 to control the operation of the camera 12C. The camera commands C132 may include commands for moving, zooming in and out of the camera 12C's field of view, and commands for imaging operations by the camera 12C. In other words, the camera control unit 132 performs steps S11 and S16 in the implementation method.

[0061] Furthermore, the camera control unit 132 may also generate and output a camera command C132 using the output of the extraction result determination unit 134. For example, if the extraction result determination unit 134 determines that "extraction of alignment marks 2M failed," it may output a camera command C132 to cause the camera 12C to perform imaging again after a predetermined time has elapsed.

[0062] The alignment mark extraction unit 133 reads either the first image D1 or the second image D2 from the memory 52M and performs a process to extract the alignment mark 2M from the read first image D1 or second image D2. In other words, the alignment mark extraction unit 133 performs steps S12 and S17 in the implementation method. The alignment mark extraction unit 133 may then add additional information to the first image D1 or second image D2, such as "successful extraction of alignment mark 2M" or "failed extraction of alignment mark 2M," and output it to the memory 52M. Furthermore, if the alignment mark extraction unit 133 "successfully extracts the alignment mark 2M," it may further perform a process to obtain the position information of the semiconductor die 2 and output the position information to the memory 52M.

[0063] The extraction result determination unit 134 reads the first image D1 or the second image D2 with added information from the memory 52M and determines whether the content of the added information is "successful extraction of alignment mark 2M" or "failed extraction of alignment mark 2M". In other words, the extraction result determination unit 134 executes steps S13 and S18 in the implementation method. If the content of the added information is "successful extraction of alignment mark 2M", the extraction result determination unit 134 outputs information that permits the execution of the next manufacturing process. This information is read into the head control unit 131 via the memory 52M. If the content of the added information is "failed extraction of alignment mark 2M", the extraction result determination unit 134 outputs information that prohibits the execution of the next manufacturing process. This information is read into the waiting time setting unit 135 via the memory 52M.

[0064] The standby time setting unit 135 maintains the states of the camera 12C, pickup unit 11, and bonding unit 12 based on information stored in memory 52M that prohibits the execution of the next manufacturing process. In other words, the standby time setting unit 135 executes step S15 in the mounting method.

[0065] <Effects and Effects> The implementation method includes: a first imaging step (S11) to obtain a first image D1 by imaging the die main surface 2a, which includes the alignment mark 2M provided on the semiconductor die 2, through a covering member NCF22 that covers the alignment mark 2M; a first extraction step (S12) to extract the alignment mark 2M from the first image D1; a waiting step (S15) to wait until a predetermined time has elapsed if the extraction of the alignment mark 2M fails as a result of the first extraction step (S12); a second imaging step (S16) to obtain a second image D2 by imaging the die main surface 2a again after the waiting step (S15); and a second extraction step (S17) to extract the alignment mark 2M from the second image D2.

[0066] The mounting apparatus 1 includes a bonding head 12H that detachably holds a semiconductor die 2 on which alignment marks 2M are provided, a camera 12C that images the die main surface 2a on which the alignment marks 2M are formed via an NCF 22, which is a covering member that covers the alignment marks 2M, and a controller 13 that controls the camera 12C and the bonding head 12H. The controller 13 performs a first imaging operation to obtain a first image D1 by imaging the die main surface 2a, a first extraction operation to extract the alignment marks 2M from the first image D1, a waiting operation to wait until a predetermined time has elapsed if the extraction of the alignment marks 2M fails as a result of the first extraction operation, a second imaging operation to obtain a second image D2 by imaging the die main surface 2a again after the waiting operation, and a second extraction operation to extract the alignment marks 2M from the second image D2.

[0067] The mounting program P is for a mounting apparatus 1 comprising a bonding head 12H that detachably holds a semiconductor die 2 on which alignment marks 2M are provided, and a camera 12C that images the die main surface 2a on which the alignment marks 2M are formed, via a covering member that covers the alignment marks 2M. The mounting program P causes the computer to function as a first imaging function unit that obtains a first image D1 by imaging the die main surface 2a, a first extraction function unit that extracts the alignment marks 2M from the first image D1, a standby function unit that waits until a predetermined time has elapsed if the extraction of the alignment marks 2M fails as a result of the operation of the first extraction function unit, a second imaging function unit that obtains a second image D2 by imaging the die main surface 2a again after the operation of the standby function unit, and a second extraction function unit that extracts the alignment marks 2M from the second image D2.

[0068] According to the mounting method, mounting apparatus 1, and mounting program P, if the extraction of alignment marks 2M from the first image D1 obtained in the first imaging step (S11) fails, the system waits for a predetermined time to elapse before attempting to acquire an image again and extract the alignment marks 2M from that image. Bubbles 2B, which are examples of factors that hinder the extraction of alignment marks 2M, may disappear over time. Therefore, even if the extraction of alignment marks 2M fails as a result of the first extraction step (S12), it may still be possible to successfully extract the alignment marks 2M as a result of the second extraction step (S17). In this case, a semiconductor die 2 that is judged to be a good product based on the result of the second extraction step (S17) can be obtained from a semiconductor die 2 that is judged to be a defective product based on the result of the first extraction step (S12). As a result, the number of semiconductor dies 2 that are good products but are treated as defective products can be reduced.

[0069] In the waiting step (S15), heat is applied to the semiconductor die 2. This step (S151) further increases the likelihood that bubbles 2B, which are factors that inhibit the extraction of alignment marks 2M, will disappear.

[0070] If the alignment mark 2M is successfully extracted as a result of the first extraction step (S12), the semiconductor die 2 is provided to the next manufacturing process. According to this step (S12), the semiconductor die 2 from which the alignment mark 2M has been successfully extracted can be provided to the next manufacturing process.

[0071] If the second extraction step (S17) is successful in extracting the alignment mark 2M, the semiconductor die 2 is provided to the next manufacturing process. If the extraction of the alignment mark 2M fails, the semiconductor die 2 is not provided to the next manufacturing process. This step (S17) makes it possible to obtain materials that can be provided to the next manufacturing process from those for which the alignment mark 2M failed to be extracted in the first extraction step (S12).

[0072] <Variation> The above describes examples of implementation methods, implementation devices, and implementation programs. The implementation methods, implementation devices, and implementation programs are not limited to the examples given above and may be implemented in various forms.

[0073] In this embodiment, an example is given in which the alignment mark 2M cannot be extracted from an image captured via NCF22. The mounting method, mounting apparatus, and mounting program can also be applied to other scenes in the process of manufacturing semiconductor devices. A flux 3F may be applied to the substrate electrode 31 and the area around the substrate electrode 31 provided on the main surface 3a of the substrate 3 for bonding the substrate electrode 31 to the bump electrode 21 of the semiconductor die 2. Flux 3F has a relatively high viscosity. Therefore, as shown in Figure 8(a), although the flux 3F immediately after application covers the entire surface of the alignment mark 2N (substrate alignment mark), the surface of the flux 3F becomes curved due to the surface tension of the flux 3F. In this case, there may be partial differences in the thickness of the flux 3F on the alignment mark 2N. Note that the substrate 3 is an example of the object in question.

[0074] If the alignment mark 2N is imaged by camera 12C under these conditions, extraction of the alignment mark 2N may fail. This is because differences in the thickness of flux 3F on the alignment mark 2N can lead to differences in refractive index, which can cause distortion in the image of the alignment mark 2N ultimately formed by camera 12C.

[0075] Therefore, as shown in the flowchart in Figure 9, if extraction of the alignment mark 2N fails in step S12 from the image obtained in step S11A (S13: NO), the system waits until a predetermined time has elapsed (S15). During this time, the flux 3F gradually flows over the main surface 3a of the substrate and eventually converges to cover the entire alignment mark 2N with a roughly constant thickness (see Figure 8(b)). Then, the image obtained by imaging the main surface 3a of the substrate in step S16A is likely to show a distortion-free alignment mark 2N. Performing the process of extracting the alignment mark 2N using such an image (S17) may result in successful extraction of the alignment mark 2N. The predetermined time set in step S15 may be determined experimentally based on the effect of flux 3F on the image of the main surface 3a of the substrate, or it may be set during production operation.

[0076] Even with the modified method, some substrates that failed to extract alignment mark 2N in the first imaging and extraction may succeed in extracting alignment mark 2N in the second imaging and extraction. As a result, the number of substrates 3 that are judged as defective can be reduced. [Explanation of symbols]

[0077] 1... Mounting device, 2... Semiconductor die (object), 2a... Die main surface (object main surface), 2M... Alignment mark (dia alignment mark), 2N... Alignment mark (substrate alignment mark), 3... Substrate, 3a... Substrate main surface, 11C, 12C... Camera, 12H... Bonding head, 13... Controller, 22... NCF (coating material), 50... Computer, D1... First image, D2... Second image, P... Mounting program.

Claims

1. A first imaging step involves obtaining a first image by imaging the main surface of an object, including alignment marks provided on the object, through a covering member that covers the alignment marks. A first extraction step of extracting the alignment marks from the first image, If the extraction of the alignment marks fails as a result of the first extraction step, a waiting step is performed to wait until a predetermined time has elapsed. A second imaging step is performed after the waiting step, in which a second image is obtained by imaging the main surface of the object again, An implementation method comprising: a second extraction step of extracting the alignment marks from the second image.

2. The aforementioned object is a semiconductor die, The mounting method according to claim 1, wherein heat is applied to the semiconductor die in the waiting step.

3. The mounting method according to claim 1, wherein if the alignment marks are successfully extracted as a result of the first extraction step, the object is provided to the next manufacturing step.

4. The mounting method according to claim 1, wherein if the alignment marks are successfully extracted as a result of the second extraction step, the object is provided to the next manufacturing process, and if the alignment marks are not extracted, the object is not provided to the next manufacturing process.

5. The aforementioned object is a substrate, In the aforementioned waiting step, a time is set to reduce the influence of the flux applied to the substrate on the second image. The implementation method according to claim 1.

6. A bonding head that detachably holds a semiconductor die with a dial alignment mark, A camera that images the die main surface on which the dial alignment marks are formed, or the substrate main surface of a substrate on which the substrate alignment marks are formed, through a covering member that covers the dial alignment marks or the substrate alignment marks, The system includes a controller that controls the camera and the bonding head, The aforementioned controller, A first imaging operation to obtain a first image by imaging the die main surface or the substrate main surface, A first extraction operation for extracting the dial alignment mark or the substrate alignment mark from the first image, If the extraction of the dial alignment mark or the substrate alignment mark fails as a result of the first extraction operation, a waiting operation is performed to wait until a predetermined time has elapsed. A second imaging operation is performed to obtain a second image by imaging the die main surface or the substrate main surface again after the aforementioned standby operation, A mounting apparatus that performs a second extraction operation to extract the dial alignment marks or the substrate alignment marks from the second image.

7. A mounting program for a mounting apparatus comprising: a bonding head for detachably holding a semiconductor die on which a dial alignment mark is provided; and a camera for imaging the die main surface on which the dial alignment mark is formed or the substrate main surface of a substrate on which a substrate alignment mark is formed, through a covering member that covers the dial alignment mark or the substrate alignment mark, Computers, A first imaging function unit that obtains a first image by imaging the die main surface or the substrate main surface, A first extraction function unit that extracts the dial alignment mark or the substrate alignment mark from the first image, If the extraction of the dial alignment mark or the substrate alignment mark fails as a result of the operation of the first extraction function unit, a standby function unit waits until a predetermined time has elapsed. A second imaging function unit obtains a second image by imaging the die main surface or the substrate main surface again after the operation of the standby function unit, and An implementation program that functions as a second extraction function unit for extracting the dial alignment marks or the substrate alignment marks from the second image.

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