Electronic component inspection apparatus and electronic component inspection method

Abstract

To provide an electronic component inspection device and an electronic component inspection method.SOLUTION: An electronic component inspection device is used for inspecting an electronic component and comprises a carrier frame, a heating module, and an inspection module. The carrier frame is used for mounting the electronic component, and the heating module includes a first heating source and a second heating source. The first heating source is disposed on one side of the carrier frame and irradiates one surface of the electronic component. The second heating source is disposed on the other side of the carrier frame and irradiates the other surface of the electronic component. The inspection module includes a moving mechanism and an inspection probe attached to the moving mechanism. The moving mechanism is disposed corresponding to the carrier frame and drives the inspection probe to inspect the electronic component.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an inspection apparatus used for inspecting electronic components, and in particular, to an electronic component inspection apparatus and an electronic component inspection method.

Background Art

[0002] Electronic components such as printed circuit boards (PCBs), wafers, liquid crystal panels, and IC-mounted substrates require heating and electrical inspection. They generally comprise a circuit and a plurality of circuit nodes arranged on the circuit, a plurality of electronic elements are electrically connected to the plurality of circuit nodes, and the electronic elements are electrically controlled by the circuit. The aforementioned electronic components are widely used in various electronic products.

[0003] Among such electronic components, for example, a printed circuit board may fail to conduct normally or experience poor contact when the circuit node is heated, due to insufficient thickness of the metal layer, cracking or peeling of the metal layer, or other factors. Therefore, manufacturers inspect the circuit nodes of printed circuit boards before shipment.

[0004] However, in conventional inspection of circuit nodes, a heating method in which ceramic is used to contact the printed circuit board is employed. As a result, only the portion in contact with the ceramic heater structure of the printed circuit board is heated, while other portions not in contact with the ceramic heater structure are not heated. Therefore, problems such as non-uniform heating and inaccurate yield occur during the inspection process of printed circuit boards.

[0005] In view of this, the inventor of the present invention, after conducting intensive research on the above-mentioned drawbacks of the prior art and combining the application of principles, endeavored to solve the above problems, and as a result, achieved the improvement object of the present invention.

Summary of the Invention

Problem to be Solved by the Invention

[0006] The object of the present invention is to provide an electronic component inspection apparatus and an electronic component inspection method that improve inspection accuracy and yield by achieving uniform heating of electronic components using a heating module. [Means for solving the problem]

[0007] To achieve the above objectives, the present invention provides, in embodiments, an electronic component inspection apparatus and an electronic component inspection method, which are used for inspecting electronic components. The electronic component inspection apparatus according to the present invention comprises a carrier frame for mounting the electronic component; a heating module disposed on one side of the carrier frame and comprising a first heating source that irradiates corresponding to one surface of the electronic component, and a second heating source disposed on the other side of the carrier frame and irradiating corresponding to the other surface of the electronic component; a moving mechanism disposed in accordance with the carrier frame; and an inspection probe attached to the moving mechanism, wherein the moving mechanism comprises at least one inspection module that drives the inspection probe to inspect the electronic component.

[0008] The present invention provides an electronic component inspection device and an electronic component, comprising the steps of: (A) providing the electronic component inspection device and the electronic component, wherein the electronic component inspection device further includes a translation mechanism, the carrier frame is attached to the translation mechanism and moves in accordance with the translation mechanism, and the electronic component is divided into a first region and a second region; (B) moving the first region of the electronic component to a position corresponding to the heating module using the translation mechanism and the carrier frame; (C) heating the first region of the electronic component to a preset temperature using the first heating source and the second heating source of the heating module; and moving the inspection device by the translation mechanism. The method includes: (D) driving a probe to electrically inspect the first region of the electronic component that has reached the preset temperature; (E) using the translation mechanism and the carrier frame to move the electrically inspected first region of the electronic component away from the heating module and further move the second region of the electronic component to a position corresponding to the heating module; (F) heating the second region of the electronic component to the preset temperature using the first and second heating sources of the heating module; and (G) driving the inspection probe with the movement mechanism to electrically inspect the second region of the electronic component that has reached the preset temperature. [Effects of the Invention]

[0009] From the above, the electronic component inspection apparatus according to the present invention employs a heating method that irradiates electronic components over a wide area using a heating module, compared to conventional heating methods that use ceramics to contact electronic components. The first heating source is positioned above the carrier frame and irradiates a wide area corresponding to the upper surface of the electronic component, and the second heating source is positioned below the carrier frame and irradiates a wide area corresponding to the lower surface of the electronic component. As a result, the heating module can uniformly distribute heat to the electronic component, further improving the inspection yield. Consequently, the electronic component inspection apparatus can uniformly heat electronic components and improve inspection accuracy and yield. [Brief explanation of the drawing]

[0010] [Figure 1] This is a flowchart showing the procedure for the electronic component inspection method according to the present invention. [Figure 2] This is a schematic top view of the electronic component inspection device according to the present invention. [Figure 3] This is another schematic top view of the electronic component inspection apparatus according to the present invention. [Figure 4] This is a schematic front view of the electronic component inspection apparatus according to the present invention. [Figure 5] This is a schematic diagram showing the parallel movement of the carrier frame with respect to the heating module according to the present invention. [Figure 6] This is another schematic diagram showing the parallel translation of the carrier frame relative to the heating module according to the present invention. [Figure 7] This is another schematic diagram showing the parallel movement of the carrier frame relative to the heating module according to the present invention. [Figure 8] This is yet another schematic diagram showing the parallel movement of the carrier frame with respect to the heating module according to the present invention. [Modes for carrying out the invention]

[0011] A detailed description and technical content of the present invention will be given below with reference to the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.

[0012] Referring to Figures 1 to 8, the present invention provides an electronic component inspection apparatus and an electronic component inspection method, which are used for inspecting electronic components 100. The electronic component inspection apparatus 10 mainly includes a carrier frame 1, a heating module 2, and one or more inspection modules 3.

[0013] As shown in Figures 1 to 6, the carrier frame 1 is used to mount the electronic components 100, and a transparent region is provided inside the carrier frame 1 in which two opposing surfaces of the electronic components 100 are exposed.

[0014] As shown in Figures 1 to 6, the heating module 2 comprises a first heating source 21 and a second heating source 22. The first heating source 21 is located on one side of the carrier frame 1 and irradiates one surface of the electronic component 100, while the second heating source 22 is located on the other side of the carrier frame 1 and irradiates the other surface of the electronic component 100. The first heating source 21 and the second heating source 22 are positioned opposite each other.

[0015] Furthermore, the first heating source 21 and the second heating source 22 each have a halogen heater lamp 23. Preferably, the halogen heater lamp 23 is a gold halogen heater lamp. Gold halogen heater lamps have the following features: they instantly rise to a high temperature of 500°C or higher, have high infrared radiation efficiency, have powerful heating speed, can be kept down to 1650K (Kelvin temperature scale) with a special cold coating, protect the eyes, do not feel dazzling even when viewed directly, have a main radiation wavelength of 0.8 to 1.4 microns, can be adjusted by a controller, and have low cost and long lifespan.

[0016] As shown in Figures 1 to 3, the inspection module 3 includes a moving mechanism 31 and an inspection probe 32 attached to the moving mechanism 31. The moving mechanism 31 is positioned in accordance with the carrier frame 1 and drives the inspection probe 32 to inspect the electronic component 100 to determine whether the circuit node is conducting properly or whether a contact failure is occurring.

[0017] More specifically, the moving mechanism 31 includes a translation drive group 311, a lifting drive group 312 attached to the translation drive group 311, and a fixed seat 313 attached to the lifting drive group 312. The inspection probe 32 is fixed to the fixed seat 313, which moves up and down relative to the electronic component 100 via the lifting drive group 312, and the lifting drive group 312 moves left and right in translation relative to the electronic component 100 via the translation drive group 311.

[0018] Here, the number of inspection modules 3 according to the present embodiment is four, but is not limited thereto. Among the four inspection modules 3, two inspection modules 3 are arranged on the left and right of one side of the carrier frame 1, and the remaining two inspection modules 3 are arranged on the left and right of the other side of the carrier frame 1, such that four inspection probes 32 detect both the left and right sides of the upper surface and the left and right sides of the lower surface of the electronic component 100.

[0019] As shown in FIGS. 1 to 6, the electronic component inspection apparatus 10 according to the present invention further comprises a parallel movement mechanism 4, the carrier frame 1 is attached to the parallel movement mechanism 4, and can follow the parallel movement mechanism 4 to move in parallel left and right relative to the first heating source 21 and the second heating source 22.

[0020] It should be noted that the parallel movement drive group 311, the lifting drive group 312 and the parallel movement mechanism 4 are not limited to those disclosed in the drawings of the present embodiment, and may be common linear slide rails, motor-driven push rods, or the like.

[0021] As shown in FIGS. 1 to 6, the electronic component inspection apparatus 10 according to the present invention is used in a state where the electronic component 100 is heated by using the heating module 2, the first heating source 21 is arranged above the carrier frame 1 and performs wide-range irradiation corresponding to the upper surface of the electronic component 100, and the second heating source 22 is arranged below the carrier frame 1 and can perform wide-range irradiation corresponding to the lower surface of the electronic component 100.

[0022] Thereby, compared with the conventional heating method in which ceramics contact an electronic component, the electronic component inspection apparatus 10 according to the present invention adopts a heating method in which the heating module 2 irradiates the electronic component 100 over a wide range, so that the electronic component 100 can be heated uniformly, and the inspection yield can be further improved. As a result, the electronic component inspection apparatus 10 can uniformly heat the electronic component 100 and improve inspection accuracy and yield.

[0023] Furthermore, since the first heating source 21 and the second heating source 22 each have halogen heater lamps 23, the heating module 2 has the advantages of being able to raise the temperature instantly, having a fast heating speed, high infrared radiation efficiency, low cost, and long lifespan.

[0024] The electronic component inspection method according to the present invention will be described below with reference to Figure 1. The electronic component inspection method according to the present invention includes the following steps A to G.

[0025] As shown in Figures 1, 4-5 and 7, in step A, an electronic component inspection device 10 and an electronic component 100 are provided, the electronic component inspection device 10 further includes a translation mechanism 4, the carrier frame 1 is attached to the translation mechanism 4 and moves in accordance with the translation mechanism 4, and the electronic component 100 is divided into a first region 101 and a second region 102.

[0026] As shown in Figures 1, 4-5 and 7, in step B, the translation mechanism 4 and the carrier frame 1 move the first region 101 of the electronic component 100 to a position corresponding to the heating module 2.

[0027] As shown in Figures 1, 4-5 and 7, in step C, the first region 101 of the electronic component 100 is heated to a preset temperature by the first heating source 21 and the second heating source 22 of the heating module 2.

[0028] As shown in Figures 1, 4-5 and 7, in step D, the inspection probe 32 is driven by the moving mechanism 31 to electrically inspect the first region 101 of the electronic component 100 that has reached the preset temperature.

[0029] As shown in Figures 1, 4, 6, and 8, in step E, the translation mechanism 4 and the carrier frame 1 move the first region 101 of the electrically inspected electronic component 100 away from the heating module 2, and further move the second region 102 of the electronic component 100 to a position corresponding to the heating module 2.

[0030] As shown in Figures 1, 4, 6, and 8, in step F, the first heating source 21 and the second heating source 22 of the heating module 2 heat the second region 102 of the electronic component 100 to a preset temperature.

[0031] As shown in Figures 1, 4, 6, and 8, in step G, the inspection probe 32 is driven by the moving mechanism 31 to electrically inspect the second region 102 of the electronic component 100 that has reached a preset temperature.

[0032] Here, as shown in Figures 5 and 6, the first region 101 may be located to the left of the electronic component 100, and the second region 102 may be located in the center of the electronic component 100. Alternatively, as shown in Figures 7 and 8, the first region 101 may be located in the center of the electronic component 100, and the second region 102 may be located to the right of the electronic component 100, but the embodiment is not limited to this example.

[0033] In summary, the electronic component inspection apparatus and electronic component inspection method according to the present invention are not found in similar products and are not publicly used, possess industrial applicability, novelty, and inventive step, fully meet the requirements for patent application, and will be filed under the Patent Law to guarantee the inventor's rights. [Explanation of Symbols]

[0034] 100 Electronic Components 101 First Domain 102 Second Domain 10 Electronic component inspection equipment 1. Carrier Frame 2 Heating Modules 21 1st heating source 22 Second heating source 23 Halogen heater lamp 3. Inspection Module 31 Moving mechanism 311 Parallel movement drive group 312 Lifting drive group 313 Fixed seat 32 Test probes 4. Translation mechanism

Claims

1. An electronic component inspection device for inspecting electronic components, A carrier frame for mounting the aforementioned electronic components, A heating module comprising a first heating source disposed on one side of the carrier frame and irradiating corresponding to one surface of the electronic component, and a second heating source disposed on the other side of the carrier frame and irradiating corresponding to the other surface of the electronic component, The system comprises a moving mechanism arranged in correspondence with the carrier frame, and an inspection probe attached to the moving mechanism, wherein the moving mechanism includes at least one inspection module that drives the inspection probe to inspect the electronic components, The carrier frame is attached to a parallel movement mechanism that moves the carrier frame so as to be movable in parallel with respect to the first and second heat sources, The electronic component has a plurality of circuit nodes and is divided into a first region including a circuit node to be electrically tested from among the plurality of circuit nodes, and a second region including a circuit node to be electrically tested from among the plurality of circuit nodes. The translation mechanism and the carrier frame move the first region of the electronic component to a position corresponding to the heating module. The first heating source and the second heating source of the heating module heat the first region of the electronic component to a preset temperature. The inspection probe is driven by the moving mechanism, and the first region of the electronic component that has reached the preset temperature is electrically inspected. The parallel movement mechanism and the carrier frame move the first region of the electrically inspected electronic component away from the heating module, and further move the second region of the electronic component to a position corresponding to the heating module. The first and second heating sources of the heating module heat the second region of the electronic component to a preset temperature. An electronic component inspection device configured to drive the inspection probe with the moving mechanism and electrically inspect the second region of the electronic component that has reached a preset temperature.

2. The electronic component inspection apparatus according to claim 1, wherein the first heat source and the second heat source each have halogen heater lamps.

3. The electronic component inspection apparatus according to claim 2, wherein the halogen heater lamp is a gold halogen heater lamp.

4. The electronic component inspection apparatus according to claim 1, wherein the first heating source and the second heating source are arranged facing each other.

5. The electronic component inspection apparatus according to claim 1, wherein the parallel movement mechanism is a linear slide rail or a motor-driven push rod.

6. The electronic component inspection apparatus according to claim 1, wherein the moving mechanism includes a translation drive group, a lifting drive group attached to the translation drive group, and a fixed seat attached to the lifting drive group, the inspection probe is fixed to the fixed seat, and the translation drive group and the lifting drive group are each a linear slide rail or a motor-driven push rod.

7. The electronic component inspection apparatus according to claim 1, wherein the number of at least one inspection module is four, of which two inspection modules are arranged on the left and right sides of one side of the carrier frame, and the remaining two inspection modules are arranged on the left and right sides of the other side of the carrier frame.

8. The electronic component inspection apparatus according to claim 1, wherein the carrier frame has a transparent region inside, and two opposing surfaces of the electronic component are exposed through the transparent region.

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